Parts processing method

JP7878944B2Active Publication Date: 2026-06-23NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2022-06-16
Publication Date
2026-06-23

AI Technical Summary

Benefits of technology

【0019】 本発明の部材加工方法は、粘着シートに外部刺激を与えることにより、本発明の変色成分が変色して、任意の位置に、任意の工程で、アライメントマークを作成することができる。このため、支持板上に部材を仮固定する全ての加工技術に適用可能であり、汎用性が非常に高く、生産効率を格段に向上させると共に、支持板にアライメントマークを設ける必要がないので、コストを大幅に低減することができる。

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Abstract

To provide a versatile method for processing a member temporarily fixed on a support plate by which an alignment mark can be created at any position in any process.SOLUTION: A method of processing a member temporarily fixed on a support plate 21 includes the step of preparing an adhesive sheet 1B containing a discoloration component capable of discoloring due to external stimulation, fixing an adhesive sheet 1B on the support plate 21, applying external stimulation to a predetermined position of the adhesive sheet 1B fixed on the support plate 21 to cause discoloration of the adhesive sheet, thereby forming an alignment mark 23 on the adhesive sheet 1B, and temporarily fixing the member onto the adhesive sheet 1B fixed on the support plate 21.SELECTED DRAWING: Figure 5
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Claims

1. A method for processing a member temporarily fixed on a support plate, A step of preparing a double-sided adhesive sheet having adhesive layers on both sides of a substrate, wherein at least one of the adhesive layers contains a discoloration component that can change color in response to external stimuli, The process of attaching one adhesive surface of the double-sided adhesive sheet to the support plate and fixing it in place, The process involves applying the external stimulus to a predetermined position on the double-sided adhesive sheet fixed to the support plate to cause discoloration and form an alignment mark on the double-sided adhesive sheet. The steps include: temporarily fixing the member to the other adhesive surface of the double-sided adhesive sheet fixed on the support plate; A method for processing the member, including the member.

2. The processing method according to claim 1, wherein in the step of temporarily fixing the member onto the double-sided adhesive sheet, the member is temporarily fixed using the alignment marks formed on the double-sided adhesive sheet as an indicator.

3. Furthermore, the processing method according to claim 1, further comprising the following steps. A process of performing processing other than the temporary fixing on the member that has been temporarily fixed on the double-sided adhesive sheet.

4. Furthermore, the processing method according to claim 2, further comprising the following steps. A process of performing processing other than the temporary fixing on the member that has been temporarily fixed on the double-sided adhesive sheet.

5. The processing method according to claim 3, wherein the processing is performed using the alignment marks formed on the double-sided adhesive sheet as indicators.

6. The processing method according to claim 4, wherein the processing is performed using the alignment marks formed on the double-sided adhesive sheet as indicators.

7. Furthermore, the processing method according to any one of claims 1 to 6, further comprising the following steps. Steps to peel the member from the double-sided adhesive sheet.

8. The processing method according to any one of claims 1 to 6, wherein the member is a semiconductor wafer or a semiconductor chip.

9. The processing method according to any one of claims 1 to 6, wherein the external stimulus is irradiation with active energy rays.