Light-emitting device

Abstract

To secure safety of a light-emitting device without using any external detection circuit.SOLUTION: A light-emitting device comprises: a base part which has a mount surface; a light-emitting element which is arranged on the mount surface and emits light from an emission end surface; and a wavelength conversion member which is arranged on the mount surface in a direction where the light emitted from the light-emitting element travels, and has an arrangement region as a part of a current path of the light-emitting element.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] Patent Document 1 discloses a light-emitting device that reflects light emitted from a plurality of semiconductor laser elements with a light reflecting member and makes it incident on a wavelength conversion unit, and converts the light incident on the wavelength conversion unit into light of a different wavelength by the wavelength conversion unit and emits it outside. Although there is a risk of blindness if laser light is directly irradiated to the eyes, the light emitted from the wavelength conversion unit is safe light without such a risk.

[0003] In addition, in this light-emitting device, in consideration of safety, measures are taken when an abnormality such as cracking occurs in the wavelength conversion unit. Specifically, a conductive film is arranged around the wavelength conversion unit, and an abnormality can be detected from a change in the resistance value of this conductive film. Further, a current path for detecting an abnormality and a current path for supplying power to the semiconductor laser element are provided in parallel.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the light-emitting device as described above, it is possible to indirectly control such as checking the presence or absence of an abnormality in an optical conversion unit such as a wavelength conversion unit that converts laser light into safe light, and stopping the power supply to the semiconductor laser element when an abnormality is detected. However, a mechanism in which the power supply to the semiconductor laser element is directly cut off due to an abnormality occurring in the optical conversion unit is not disclosed.

[0006] The objective is to provide a light-emitting device that directly cuts off the power supply to the light-emitting element when an abnormality occurs in the light conversion unit. [Means for solving the problem]

[0007] A light-emitting device according to one embodiment of the present disclosure comprises a base having a mounting surface, a light-emitting element disposed on the mounting surface and emitting light from an output end face, and a wavelength conversion member disposed on the mounting surface in the direction in which the light emitted from the light-emitting element travels and having a wiring region that becomes part of the current path of the light-emitting element. The wavelength conversion member comprises a wavelength conversion section having an incident side surface into which light emitted from the light-emitting element is incident, and an upper surface from which light is emitted, and a surrounding section provided around the wavelength conversion section, in which the wiring area is provided. ru. Furthermore, an embodiment of the present disclosure of a light-emitting device comprises a base having a mounting surface, a light-emitting element disposed on the mounting surface and emitting light from an output end surface, and a wavelength conversion member disposed on the mounting surface in the direction in which the light emitted from the light-emitting element travels and having a wiring region that becomes part of the current path of the light-emitting element, wherein the side surface of the wavelength conversion member has a recess, and a part of the recess is a wavelength conversion section.

[0008] Furthermore, a light-emitting device according to one embodiment of the present disclosure includes a base having a mounting surface, a light-emitting element disposed on the mounting surface and emitting light from an output end face, and a wiring region on the mounting surface that is arranged in the direction in which the light emitted from the light-emitting element travels and becomes part of the current path of the light-emitting element. Wavelength conversion component and equipped The base consists of a bottom portion and a frame portion, and the wavelength conversion member and the light-emitting element are arranged inside the frame portion in a top view and have a first stepped portion having an upper surface located above the upper surface of the bottom portion and below the upper surface of the frame portion, a third conductive film is provided on the upper surface of the first stepped portion, the third conductive film is electrically connected to the wiring region via a first wiring, and the current path includes the third conductive film, the first wiring, and the wiring region. [Effects of the Invention]

[0009] According to one embodiment of the present disclosure, a light-emitting device is provided in which, if an abnormality occurs in the wavelength conversion unit, the current path of the light-emitting element is interrupted, thereby directly stopping the power supply to the light-emitting element. [Brief explanation of the drawing]

[0010] [Figure 1] This is a perspective view illustrating a light-emitting device according to the first or second embodiment. [Figure 2] This is a perspective view of the light-emitting device according to the first embodiment with the lid removed. [Figure 3] Figure 2 is a top view of the light-emitting device. [Figure 4] This is a cross-sectional view of the light-emitting device according to the first embodiment, taken along the IV-IV section in Figure 1. [Figure 5] This is a perspective view showing an example of the structure of the wavelength conversion unit related to this disclosure. [Figure 6] It is a perspective view showing a structural example of a wavelength conversion member according to the present disclosure. [Figure 7] It is a cross-sectional view of the wavelength conversion member taken along the VII-VII cross-sectional line of FIG. 6. [Figure 8] It is a top view for explaining the current path of the light-emitting element in the light-emitting device according to the first embodiment. [Figure 9] It is a top view of the state where the lid part is removed from the light-emitting device according to the second embodiment. [Figure 10] It is a cross-sectional view of the light-emitting device taken along the X-X cross-sectional line of FIG. 9. [Figure 11] It is a top view of the state where the members and each wiring mounted on the mounting surface of the base are removed from the light-emitting device shown in FIG. 9. [Figure 12] It is a perspective view illustrating the light-emitting device according to the third embodiment. [Figure 13] It is a perspective view of the state where the frame part and the lid part are removed from the light-emitting device shown in FIG. 12. [Figure 14] It is a top view of the light-emitting device in the state shown in FIG. 13. [Figure 15] It is a cross-sectional view of the light-emitting device taken along the XV-XV cross-sectional line of FIG. 12.

MODE FOR CARRYING OUT THE INVENTION

[0011] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the following description, terms indicating a specific direction or position (for example, "up", "down", and other terms including those terms) are used as necessary. Since those terms explain the relative positional relationship for facilitating the understanding of the invention with reference to the drawings, if the relative positional relationship is the same, it belongs to the technical scope of the present invention. Also, parts denoted by the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members.

[0012] In the present disclosure, with respect to polygons such as triangles and quadrilaterals, those having been processed with rounding, chamfering, corner chamfering, rounding, etc. at the corners of the polygon are also referred to as polygons. Further, not limited to the corners (ends of the sides), those having been processed at the middle part of the sides are also referred to as polygons. That is, shapes with partial processing while leaving the polygon as a base are included in the interpretation of "polygon" described in the present disclosure.

[0013] Moreover, not limited to polygons, the same applies to terms representing specific shapes such as trapezoids, circles, concavities and convexities, etc. Also, the same applies when handling each side forming the shape. That is, even if a side has been processed at the corner or the middle part, the processed part is included in the interpretation of "side". When distinguishing a "polygon" or a "side" without partial processing from the processed shape, "strict" is attached, for example, described as "strict quadrilateral", etc.

[0014] Furthermore, the embodiments shown below exemplify a light-emitting device, etc. for embodying the technical idea of the present invention, and do not limit the present invention below. Also, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only to those, but are intended to be exemplary unless otherwise specifically described. Also, the content described in one embodiment is applicable to other embodiments and modifications. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid excessive complexity of the drawings, schematic diagrams with some elements omitted, cross-sectional views, or end views may be used.

[0015] <First Embodiment> The light-emitting device of the first embodiment includes a base, a light-emitting element, and a wavelength conversion member. Referring to FIGS. 1 to 7, a structural example of the light-emitting device 200 according to the first embodiment will be described.

[0016] Figure 1 is a perspective view illustrating a light-emitting device 200 according to the first embodiment. Figure 2 is a perspective view of the light-emitting device 200 shown in Figure 1 with the cover portion 213 removed. Figure 3 is a top view of the light-emitting device 200 in the state shown in Figure 2. Figure 4 is a cross-sectional view of the light-emitting device 200 along the cross-sectional line IV-IV in Figure 1. Figure 5 is a perspective view showing an example of the structure of the wavelength conversion unit 241 according to this disclosure. Figure 6 is a perspective view showing an example of the structure of the wavelength conversion member 240 according to this disclosure. Figure 7 is a cross-sectional view of the wavelength conversion member along the cross-sectional line VII-VII in Figure 6.

[0017] The light-emitting device 200 according to this embodiment comprises a base portion 210, one or more light-emitting elements 220, and a wavelength conversion member 240. In the illustrated example, the light-emitting device 200 further comprises a cover portion 213, submounts 230 and 235, a protective element 250, and first to fifth wirings 271 to 275. Note that the light-emitting device 200 does not necessarily have to include all of these components.

[0018] The components of the light-emitting device 200 will now be described.

[0019] (base 210) The base 210 has a bottom 211 and a frame 212. The base 210 has a mounting surface 211a. The bottom 211 has a mounting surface 211a and a lower surface 211b. The bottom 211 also has one or more sides that connect to the mounting surface 211a and the lower surface 211b. One or more sides connect the outer edge of the mounting surface 211a and the outer edge of the lower surface 211b. As defined above, the base 210 has a mounting surface 211a and a lower surface 211b.

[0020] The base 211 is, for example, a rectangular parallelepiped or a cube. In this case, both the mounting surface 211a and the bottom surface 211b of the base 211 are rectangular, and the base 211 has four rectangular sides. Note that the outer shape of the base 211 in top view does not have to be rectangular. Unless otherwise specified, a square may be included in the definition of a rectangle. Here, top view refers to viewing the object from the direction normal to the mounting surface 211a of the base 211.

[0021] The bottom portion 211 can be formed using, for example, metal or ceramics as the main material. For example, the main material can be aluminum, gold, silver, copper, tungsten, iron, nickel, cobalt, or alloys thereof, or ceramics such as aluminum oxide, aluminum nitride, silicon nitride, or silicon carbide, or diamond, copper-diamond composite materials, etc.

[0022] The frame portion 212 has an upper surface 212a, a lower surface 212b, one or more inner surfaces 212c, and one or more outer surfaces 212d. The frame portion 212 is, for example, a rectangular annular shape when viewed from above. One or more inner surfaces 212c of the frame portion 212 are in contact with the mounting surface 211a and extend downward from the mounting surface 211a. One or more outer surfaces 212d of the frame portion 212 are connected to the upper surface 212a and the lower surface 212b of the frame portion 212.

[0023] The frame portion 212 may further have a first stepped portion 214 having an upper surface 214a located above the mounting surface 211a of the bottom portion 211 and below the upper surface 212a of the frame portion 212. The frame portion 212 may further have a second stepped portion 215 having an upper surface 215a located above the mounting surface 211a of the bottom portion 211 and below the upper surface 212a of the frame portion 212. The first stepped portion 214 and the second stepped portion 215 are provided on the inside of the frame portion 212. The first stepped portion 214 is provided, for example, along the entire length of one side of the inner edge shape of the upper surface 212a of the frame portion 212. The second stepped portion 215 is provided, for example, along the entire length of one side of the inner edge shape of the upper surface 212a of the frame portion 212 that is opposite to the side on which the first stepped portion 214 is provided.

[0024] The first stepped portion 214 is composed of, for example, an upper surface 214a and an inner surface that connects to the upper surface 214a and extends downward. The upper surface 214a of the first stepped portion 214 is connected to one or more inner surfaces 212c of the frame portion 212. The upper surface 214a may be parallel to the mounting surface 211a of the bottom portion 211. The inner surface of the first stepped portion 214 is in contact with, for example, the mounting surface 211a of the bottom portion 211. The second stepped portion 215 is composed of, for example, an upper surface 215a and an inner surface that connects to the upper surface 215a and extends downward. The upper surface 215a of the second stepped portion 215 is connected to one or more inner surfaces 212c of the frame portion 212. The upper surface 215a may be parallel to the mounting surface 211a of the bottom portion 211. The inner surface of the second stepped portion 215 is in contact with, for example, the mounting surface 211a of the bottom portion 211. One or more conductive films may be provided on the upper surface 214a of the first stepped portion 214 and / or the upper surface 215a of the second stepped portion 215.

[0025] The first stepped portion 214 may further have a lower surface 214b that connects to the inner surface of the first stepped portion 214. The lower surface 214b is located below the upper surface 214a. The lower surface 214b may be a plane parallel to the upper surface 214a. The lower surface 214b is located above the lower surface 212b of the frame portion 212. The first stepped portion 214 may be provided such that the lower surface 214b is in direct contact with the mounting surface 211a of the bottom portion 211, or it may be provided such that it is indirectly in contact via a connecting member. In the illustrated example, the frame portion 212 further has a side surface that connects to the lower surface 214b and extends downward. This side surface connects to the lower surface 212b of the frame portion 212.

[0026] The second stepped portion 215 may further have a lower surface 215b that connects to the inner surface of the second stepped portion 215. The lower surface 215b is located below the upper surface 215a. The lower surface 215b may be a plane parallel to the upper surface 215a. The lower surface 215b is located above the lower surface 212b of the frame portion 212. The second stepped portion 215 may be provided such that the lower surface 215b is in direct contact with the mounting surface 211a of the bottom portion 211, or it may be provided such that it is indirectly in contact via a connecting member. In the illustrated example, the frame portion 212 further has a side surface that connects to the lower surface 215b and extends downward. This side surface connects to the lower surface 212b of the frame portion 212.

[0027] Furthermore, the frame portion 212 has one or more conductive films. One or more conductive films (such as the third conductive film 263, fourth conductive film 264, and / or fifth conductive film 265 described later) can be provided on the upper surface 214a of the first stepped portion 214 and / or the upper surface 215a of the second stepped portion 215 of the frame portion 212. Also, one or more conductive films (such as the first external connection electrode 291 and / or second external connection electrode 292 described later) can be provided on the lower surface 212b of the frame portion 212. One or more conductive films may also be provided on the upper surface 212a of the frame portion 212. The one or more conductive films provided on the upper surface 214a of the first stepped portion 214 and / or the upper surface 215a of the second stepped portion 215 may include conductive films that are electrically connected to the conductive films provided on the upper surface 212a.

[0028] The base portion 210, consisting of a bottom portion 211 and a frame portion 212, forms a concave shape that is recessed from the upper surface 212a of the frame portion 212 toward the mounting surface 211a of the bottom portion 211. The concave shape is formed on the inside of the frame portion 212 when viewed from above. When viewed from above, the mounting surface 211a of the bottom portion 211 is surrounded by a frame formed by one or more inner surfaces 212c of the frame portion 212, and / or the inner surfaces of the first stepped portion 214 and the second stepped portion 215. The outer shape of this frame is, for example, a rectangle with a long side and a short side. In the illustrated example, the base portion 210 is formed by separately forming the bottom portion 211 and the frame portion 212 and joining them together. The base portion 210 may also be formed as a single unit.

[0029] The frame portion 212 can be formed using a different material as its main material, for example, than the bottom portion 211. Examples of main materials for forming the frame portion 212 include ceramics. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as ceramics. Other examples of main materials for forming the frame portion 212 include iron, nickel, cobalt, or alloys thereof, or glass.

[0030] (Lid part 213) The lid 213 has an upper surface 213a and a lower surface 213b. The lid 213 also has one or more side surfaces 213c that are in contact with the upper surface 213a and the lower surface 213b. The one or more side surfaces 213c connect the outer edge of the upper surface 213a and the outer edge of the lower surface 213b. The lid 213 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper surface 213a and the lower surface 213b of the lid 213 are rectangular, and the lid 213 has four rectangular side surfaces 213c.

[0031] However, the lid 213 is not limited to a rectangular prism or a cube. In other words, the lid 213 is not limited to a rectangle when viewed from above, and can be any shape such as a circle, ellipse, or polygon.

[0032] The lid portion 213 is supported by the frame portion 212. The lid portion 213 is positioned above the mounting surface 211a of the bottom portion 211. The outer periphery of the lower surface 213b of the lid portion 213 is joined, for example, to the upper surface 212a of the frame portion 212. By joining the lid portion 213 to the frame portion 212, a sealed space is formed surrounded by the bottom portion 211, the frame portion 212, and the lid portion 213.

[0033] The lid portion 213 may have a light-transmitting region that transmits light of a predetermined wavelength. The light-transmitting region constitutes at least a part of the upper surface 213a and the lower surface 213b of the lid portion 213. The light-transmitting region of the lid portion 213 can be formed using, for example, sapphire as the main material. Sapphire is a material with relatively high transmittance and relatively high strength. In addition to sapphire, other translucent materials such as quartz, silicon carbide, or glass may be used as the main material for the light-transmitting region of the lid portion 213. The portion of the lid portion 213 other than the light-transmitting region may be formed of a light-shielding member, or it may be formed integrally with the light-transmitting region using the same material as the light-transmitting region.

[0034] (Light-emitting element 220) In the illustrated example of the light-emitting device 200, one light-emitting element 220 is mounted. The light-emitting device 200 may be equipped with multiple light-emitting elements. The light-emitting element 220 is, for example, a semiconductor laser element. The light-emitting element 220 is not limited to a semiconductor laser element, but may also be, for example, a light-emitting diode (LED) or an organic light-emitting diode (OLED). In the light-emitting device 200 illustrated exemplarily in Figures 1 to 4, a semiconductor laser element is used as the light-emitting element 220.

[0035] The light-emitting element 220 has, for example, a rectangular shape when viewed from above. The side that connects to one of the two shorter sides of the rectangle becomes the light-emitting end face from which light is emitted. The top and bottom surfaces of the light-emitting element 220 have a larger area than the light-emitting end face.

[0036] The light emitted from the light-emitting element 220 is preferably used after its state has been transformed. For example, when a semiconductor laser element is used and the light emitted from the light-emitting device is used to irradiate a human body, it may be preferable to diffuse the laser light before emission. In this case, it is preferable to use a diffusing member or the like to transform the state of the light emitted from the light-emitting element 220 before the light is emitted outside the light-emitting device. Not limited to such examples, it is preferable to use the light emitted from a light-emitting element after transforming it into a desired state, depending on its properties and the final form of use.

[0037] As the light-emitting element 220, a light-emitting element that emits blue light can be used. "Light-emitting element that emits blue light" refers to one whose emitted light peak wavelength is in the range of 405 nm to 494 nm. Furthermore, it is preferable to use a light-emitting element 220 whose emitted light peak wavelength is 430 nm to 480 nm. Examples of such light-emitting elements 220 include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, or AlGaN.

[0038] The emission peak of the light emitted from the light-emitting element 220 is not limited to this. For example, the light emitted from the light-emitting element 220 may be blue light, as well as visible light including green light and red light having wavelengths outside the aforementioned wavelength range, ultraviolet light, and infrared light.

[0039] Here, we will explain the case where the light-emitting element 220 is a semiconductor laser element. The light (laser light) emitted from the light-emitting element 220 has a broadened shape and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the exit end face. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the exit end face.

[0040] Based on the fast flash point (FFP) of the elliptical light emitted from the light-emitting element 220, the direction passing through the major axis of the ellipse is defined as the fast axis direction of the FFP, and the direction passing through the minor axis of the ellipse is defined as the slow axis direction of the FFP. The fast axis direction of the FFP in the light-emitting element 220 may coincide with the stacking direction in which the multiple semiconductor layers, including the active layer of the light-emitting element 220, are stacked.

[0041] Furthermore, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, will be referred to as light traveling along the optical axis, or light passing through the optical axis. The optical path of the light traveling through the center of the elliptical shape of the FFP will also be referred to as the optical axis of that light.

[0042] (Submount 230) The submount 230 is, for example, constructed in the shape of a rectangular parallelepiped and has a bottom surface, a top surface, and one or more sides. Furthermore, when viewed from above, the width of the submount 230 in the direction perpendicular to the plane of the paper is smaller than the width in the direction along the optical axis and in the direction perpendicular to the optical axis. Note that the shape is not limited to a rectangular parallelepiped. The submount 230 is formed using, for example, aluminum nitride or silicon carbide, but silicon nitride, diamond, copper, aluminum oxide, etc., may be used, or a combination of these materials may be used. Additionally, a conductive film is provided on the top surface of the submount 230.

[0043] (Submount 235) The submount 235 can be made from the same material as the submount 230, for example. However, the submount 235 may be made from a different material than the submount 230.

[0044] (Wavelength conversion member 240) The wavelength conversion member 240 has a wavelength conversion section 241 and a surrounding section 242. The side surface of the wavelength conversion member 240 has a recess 240x. Part of the recess 240x is the wavelength conversion section 241, and the other part of the recess 240x is the surrounding section 242.

[0045] The wavelength conversion unit 241 has an upper surface 241a, a lower surface 241b which is the opposite surface to the upper surface 241a, and one or more sides. The lower surface 241b of the wavelength conversion unit 241 faces the mounting surface 211a at the bottom. In the example of Figure 5, the wavelength conversion unit 241 has multiple sides, including an incident side 241i, a first side 241c, a second side 241d, a third side 241e, and a fourth side 241f.

[0046] The first side 241c, the second side 241d, the third side 241e, and the fourth side 241f are connected to the outer edge of the upper surface 241a and the outer edge of the lower surface 241b. The third side 241e is connected to the first side 241c and the fourth side 241f, respectively. The fourth side 241f is connected to the second side 241d and the third side 241e, respectively. The first side 241c and the fourth side 241f are not connected. The second side 241d and the third side 241e are not connected.

[0047] The first side surface 241c and the second side surface 241d are connected to each other on the upper side, and each is connected to the incident side surface 241i on the lower side. The lower side of the incident side surface 241i is connected to the outer edge of the lower surface 241b. The lower side of the incident side surface 241i is recessed from the connection point between the first side surface 241c and the second side surface 241d toward the connection point between the third side surface 241e and the fourth side surface 241f.

[0048] In a top view, the first side 241c and the fourth side 241f may be parallel. Also, in a top view, the second side 241d and the third side 241e may be parallel. Furthermore, in a top view, the first side 241c and the second side 241d, the first side 241c and the third side 241e, the third side 241e and the fourth side 241f, and the fourth side 241f and the second side 241d may each be perpendicular.

[0049] Since the wavelength conversion unit 241 is irradiated with light, it is preferable that the base material of the wavelength conversion unit 241 be formed using an inorganic material that is not easily decomposed by light irradiation as the main material. The main material is, for example, ceramics. When the main material of the wavelength conversion unit 241 is ceramics, examples of ceramics include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, or magnesium oxide. For the main ceramic material, it is preferable to select a material with a melting point of 1300°C to 2500°C so that the wavelength conversion unit 241 does not undergo deterioration such as deformation or discoloration due to heat. Here, the "main material" of a particular component is the material that accounts for the largest proportion by weight or volume in its constituent elements. Furthermore, the "main material" may also include cases where no other materials are included, that is, the constituent elements are formed only of the main material. Note that the wavelength conversion unit 241 may be formed using a material other than ceramics as the main material.

[0050] The wavelength conversion section 241 contains a phosphor. The wavelength conversion section 241 can be formed, for example, by sintering a phosphor with aluminum oxide or the like. Alternatively, the wavelength conversion section 241 may use ceramics that consist substantially only of phosphor, for example, by sintering phosphor powder. The phosphor content can be 0.05% to 100% by volume relative to the total volume of the ceramics. The wavelength conversion section 241 may also be formed from a single crystal of phosphor.

[0051] Examples of phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium-activated silicate ((Sr,Ba)2SiO4), α-sialon phosphors, and β-sialon phosphors. Among these, YAG phosphors exhibit good heat resistance.

[0052] The surrounding portion 242 has an upper surface 242a, a lower surface 242b which is the opposite surface of the upper surface 242a, one or more inner surfaces connecting the inner edge of the upper surface 242a and the inner edge of the lower surface 242b, and one or more outer surfaces connecting the outer edge of the upper surface 242a and the outer edge of the lower surface 242b. The surrounding portion 242 preferably has a reflectance to light of 80% or more and 100% or less on one or more of its inner surfaces, and more preferably 90% or more and 100% or less.

[0053] The surrounding portion 242 is provided around the wavelength conversion portion 241. The upper surface 242a of the surrounding portion 242 surrounds the upper surface 241a of the wavelength conversion portion 241 when viewed from above. One or more inner surfaces of the surrounding portion 242 cover the first side 241c, second side 241d, third side 241e, and fourth side 241f of the wavelength conversion portion 241. The surrounding portion 242 does not cover the incident side 241i, and the incident side 241i is exposed from the surrounding portion 242.

[0054] The upper surface 242a of the surrounding portion 242 lies on the same plane as the upper surface 241a of the wavelength conversion portion 241. Similarly, the lower surface 242b of the surrounding portion 242 lies on the same plane as the lower surface 241b of the wavelength conversion portion 241. However, the upper surface 242a of the surrounding portion 242 does not necessarily have to lie on the same plane as the upper surface 241a of the wavelength conversion portion 241. Similarly, the lower surface 242b of the surrounding portion 242 does not necessarily have to lie on the same plane as the lower surface 241b of the wavelength conversion portion 241. In the illustrated example, in a top view, the four sides connecting the four outer surfaces of the surrounding portion 242 to the upper surface 242a may all be non-parallel to the four sides connecting the upper surface 241a of the wavelength conversion portion 241a.

[0055] The surrounding portion 242 further includes a protruding portion 242t. In this specification, the portion of the surrounding portion 242 that is located above the incident side 241i and protrudes from the incident side 241i in the direction in which the light-emitting element 220 is located is referred to as the "protruding portion 242t".

[0056] The protruding portion 242t is composed of at least a part of the upper surface 242a of the encircling portion 242, an end surface 242e which is one of the outer surfaces of the encircling portion 242, the lower surface 242c, and at least a part of the outer surface 242d of the encircling portion 242. The lower surface 242b of the encircling portion 242 does not constitute the protruding portion 242t.

[0057] The surrounding portion 242 is, for example, a sintered body formed primarily from ceramics. Examples of ceramics that can be used as the main material include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, and magnesium oxide. The reflectivity can be improved by lowering the sintering density of the main material. It is more preferable that the surrounding portion 242 be constructed primarily from ceramics with high reflectivity. Here, "having high reflectivity" means that the reflectivity of light with a specific peak wavelength is 80% or more. Aluminum oxide is an example of ceramics with high reflectivity. However, the surrounding portion 242 does not have to be primarily from ceramics. The surrounding portion 242 may be formed using, for example, a conductive material such as metal, a composite of ceramics and metal, or a resin.

[0058] In the wavelength conversion member 240, the wavelength conversion portion 241 and the surrounding portion 242 can be formed integrally. Alternatively, the wavelength conversion portion 241 and the surrounding portion 242 may be formed separately and then joined together to form the wavelength conversion member 240. The wavelength conversion portion 241 and the surrounding portion 242 are, for example, a single sintered body. In the wavelength conversion member 240, the surface of the recess 240x is composed of the incident side surface 241i of the wavelength conversion portion 241, the outer surface 242d of the surrounding portion 242, and the lower surface 242c of the protruding portion 242t.

[0059] The wavelength conversion member 240 may have an anti-reflective coating on its upper surface. The anti-reflective coating can be provided on the upper surface 241a of the wavelength conversion section 241 and / or the upper surface 242a of the surrounding section 242. The wavelength conversion member 240 may also have a reflective coating on the lower surface 241b of the wavelength conversion section 241 and / or the lower surface 242b of the surrounding section 242. The wavelength conversion member 240 may also have a reflective coating on the incident side surface 241i.

[0060] (Protection element 250) The protective element 250 is a component for protecting a specific element, such as a semiconductor laser element. For example, the protective element 250 is a component for preventing excessive current from flowing through and damaging a specific element, such as a semiconductor laser element. As the protective element 250, for example, a Zener diode made of Si can be used. Alternatively, for example, the protective element 250 may be a component for measuring temperature to prevent the specific element from failing due to the temperature environment. A thermistor can be used as such a temperature measuring element. The temperature measuring element is preferably placed near the emission end face 220a of the light-emitting element 220.

[0061] (1st wiring 271~5th wiring 275) The first wiring 271, the second wiring 272, the third wiring 273, the fourth wiring 274, and the fifth wiring 275 are composed of conductors having a linear shape with joints at both ends. In other words, the first wiring 271 to the fifth wiring 275 have joints at both ends of the linear portion for joining with other components. The first wiring 271 to the fifth wiring 275 are used for electrical connection between two components. For example, metal wires can be used as the first wiring 271 to the fifth wiring 275. Examples of metals include gold, aluminum, silver, copper, and tungsten.

[0062] (Light-emitting device 200) Next, the light-emitting device 200 will be described.

[0063] One or more light-emitting elements 220 are arranged on the mounting surface 211a of the bottom portion 211. The light-emitting elements 220 are arranged inside the frame portion 212 when viewed from above. In the illustrated example, one light-emitting element 220 is arranged on the mounting surface 211a. The light-emitting element 220 is further surrounded by the frame portion 212. The light-emitting element 220 emits light that travels laterally from its emission end face. The light emitted from the light-emitting element 220 is, for example, blue light. However, the light emitted from the light-emitting element 220 is not limited to blue light. Also, in the illustrated example, the light-emitting element 220 is a semiconductor laser element.

[0064] The light-emitting element 220 is mounted, for example, on a submount 230 placed on the mounting surface 211a of the bottom 211. The submount 230 is bonded, for example, to a metal film 269 provided on the mounting surface 211a of the bottom 211 via a metal adhesive. Examples of the metal film 269 include Ni / Au (metal films stacked in the order of Ni and Au) and Ti / Pt / Au (metal films stacked in the order of Ti, Pt, and Au). An example of the metal adhesive is AuSn. By mounting the light-emitting element 220 on the submount 230, the heat generated by the operation of the light-emitting element 220 can be effectively cooled. Alternatively, the light-emitting element 220 may be mounted directly on the mounting surface 211a of the bottom 211 instead of on the submount 230.

[0065] The light-emitting element 220 is positioned such that its exit end face 220a faces the incident side face 241i of the wavelength conversion section 241. The exit end face 220a of the light-emitting element 220 may be parallel or perpendicular to, for example, one inner surface 212c or one outer surface 212d of the frame section 212.

[0066] The wavelength conversion member 240 is positioned on the mounting surface 211a of the bottom portion 211. The wavelength conversion member 240 is positioned inside the frame portion 212 when viewed from above. The lower surface 241b of the wavelength conversion portion 241 and the lower surface 242b of the surrounding portion 242 face the mounting surface 211a of the bottom portion 211. The wavelength conversion member 240 is positioned in the direction in which the light emitted from the light-emitting element 220 travels. More specifically, the wavelength conversion member 240 is positioned where light emitted from the light-emitting element 220 and traveling laterally is incident.

[0067] Furthermore, the wavelength conversion member 240 is positioned on the optical axis OA of the light emitted laterally from the light-emitting element 220. In the illustrated example, the direction of propagation of the light emitted from the light-emitting element 220 and traveling along the optical axis OA is constant until it enters the wavelength conversion section 241 of the wavelength conversion member 240. In the illustrated example, there are no other components in the optical path from the light emitted from the light-emitting element 220 and traveling along the optical axis OA until it enters the incident side surface 241i of the wavelength conversion section 241. This makes it possible to miniaturize the light-emitting device 200. Note that other components such as a collimating lens may be placed between the light-emitting element 220 and the wavelength conversion section 241.

[0068] The wavelength conversion member 240 is placed, for example, on a submount 235 located on the mounting surface 211a of the bottom 211. The submount 235 is bonded, for example, together with the submount 230, to a metal film 269 provided on the mounting surface 211a of the bottom 211 via a metal adhesive. Preferably, the height of the upper surface of the submount 235 on which the wavelength conversion member 240 is placed is lower than the height of the upper surface of the submount 230 on which the light-emitting element 220 is placed. This allows light emitted from the light-emitting element 220 that travels below the optical axis OA to be efficiently taken into the wavelength conversion unit 241 from the incident side 241i. By placing the wavelength conversion member 240 on the submount 235, the heat generated from the wavelength conversion member 240 can be effectively cooled. The wavelength conversion member 240 may also be placed on the submount 230 on which the light-emitting element 220 is placed, or it may be placed directly on the mounting surface 211a of the bottom 211.

[0069] The wavelength conversion section 241 of the wavelength conversion member 240 has an incident side surface into which light emitted from the emission end face 220a of the light-emitting element 220 and traveling laterally is incident, and an emission surface into which the wavelength-converted light is emitted. In the illustrated example, the incident side surface 241i and the upper surface 241a of the wavelength conversion section 241 are the incident side surface and the emission surface, respectively. The upper surface 241a of the wavelength conversion section 241 emits the wavelength-converted light upward. The surrounding section 242 of the wavelength conversion member 240 is provided around the wavelength conversion section 241. The emission surface from which light is emitted may also be provided on the side surface of the wavelength conversion member 240.

[0070] Within the plane containing the lower surface 241b of the wavelength conversion unit 241, the extensions of the first side surface 241c and the second side surface 241d of the wavelength conversion unit 241 are in contact on the side of the light-emitting element 220 that is closer to the incident side surface 241i. Also, in a view from below, the third side surface 241e and the fourth side surface 241f of the wavelength conversion unit 241 are connected on the side opposite to the incident side surface 241i that is away from the light-emitting element 220.

[0071] The protruding portion 242t of the surrounding portion 242 of the wavelength conversion member 240 protrudes above the light-emitting element 220 and toward the light-emitting element 220 beyond the incident side surface 241i. Furthermore, the protruding portion 242t protrudes toward the light-emitting element 220 beyond the end of the lower surface of the wavelength conversion member 240 toward the light-emitting element 220. In a top view, the protruding portion 242t overlaps with the emission end face 220a of the light-emitting element 220. In a top view, the emission end face 220a of the light-emitting element 220 is located directly below the recess 240x. In a top view, the emission end face 220a of the light-emitting element 220 is located directly below the lower surface 242c.

[0072] It is preferable that the protrusion 242t is positioned so as to overlap the entire output end face 220a of the light-emitting element 220 when viewed from above. This arrangement suppresses stray light from the light-emitting element 220 that does not enter the wavelength conversion unit 241. Furthermore, this arrangement allows the distance between the light-emitting element 220 and the wavelength conversion member 240 to be reduced, thereby miniaturizing the size of the light-emitting device 200. When the light-emitting device 200 comprises multiple light-emitting elements 220, it is preferable that the output end faces 220a of all light-emitting elements 220 and the protrusion 242t overlap when viewed from above. This suppresses stray light that travels above the optical axis OA of all light-emitting elements 220.

[0073] The wavelength conversion unit 241 is positioned, for example, in a top view, at a location through which the optical axis OA of the light emitted from the light-emitting element 220 passes. In a top view, the shape of the upper surface 241a of the wavelength conversion unit 241 may be symmetrical with respect to the optical axis OA. Similarly, in a top view, the shape of the upper surface of the surrounding unit 242 may be symmetrical with respect to the optical axis OA.

[0074] Light emitted from the light-emitting element 220 travels toward the wavelength conversion member 240 and enters the incident side surface 241i of the wavelength conversion unit 241, which is exposed from the surrounding portion 242. At least a portion of the incident side surface 241i of the wavelength conversion unit 241 is located below the optical axis OA. This allows the light emitted from the light-emitting element 220 that travels below the optical axis OA to be efficiently captured by the wavelength conversion unit 241 from the incident side surface 241i. Based on the light incident on the incident side surface 241i, light is emitted from the upper surface 241a of the wavelength conversion unit 241. Here, the light emitted based on the incident light is, for example, the incident light, and also, for example, the light whose wavelength has been converted based on the incident light.

[0075] The light whose wavelength has been converted by the wavelength conversion member 240 is safer than laser light, as it causes less damage when viewed directly. Furthermore, even if the light emitted from the light-emitting device 200 is laser light, the light that passes through the wavelength conversion member 240 and is emitted from the wavelength conversion member 240 is safer, as it causes less damage when viewed directly. This is because the laser light is diffused when it passes through the wavelength conversion member 240.

[0076] Light emitted from the light-emitting element and / or light whose wavelength has been converted by the wavelength conversion unit 241 is reflected by the surrounding unit 242 and travels toward the upper surface 241a of the wavelength conversion unit 241, and is emitted from the upper surface 241a of the wavelength conversion unit 241. This allows light to be emitted from the upper surface 241a efficiently.

[0077] One of the two sides of the light-emitting element 220 connected to the exit end face 220a faces the side of the first stepped portion 214. The other of the two sides of the light-emitting element 220 connected to the exit end face 220a is, for example, parallel to the side of the first stepped portion 214. The other of the two sides of the light-emitting element 220 connected to the exit end face 220a faces the side of the second stepped portion 215. The other of the two sides of the light-emitting element 220 connected to the exit end face 220a is, for example, parallel to the side of the second stepped portion 215. The upper surfaces 214a of the first stepped portion 214 and 215a of the second stepped portion 215 are, for example, lower than the height of the upper surface 241a of the wavelength conversion portion 241, with reference to the mounting surface 211a of the bottom portion 211. By setting the height in this manner, light emitted upward from the upper surface 241a is not directly irradiated onto the first stepped section 214 and the second stepped section 215. This prevents light shielding and absorption by the stepped sections, thereby suppressing the loss of light emitted from the wavelength conversion section.

[0078] The upper surfaces 214a of the first stepped portion 214 and 215a of the second stepped portion 215 are, for example, higher than the height of the upper surface of the light-emitting element 220, with reference to the mounting surface 211a of the bottom portion 211.

[0079] In the light-emitting device 200, the light-emitting element 220 is electrically connected to the conductive film provided on the bottom portion 211 and the frame portion 212 by the first wiring 271, the second wiring 272, the third wiring 273, and the fourth wiring 274. In other words, in the light-emitting device 200, the light-emitting element 220 is electrically connected to the conductive film provided on the base portion 210 by the first wiring 271, the second wiring 272, the third wiring 273, and the fourth wiring 274. Alternatively, by arranging the fifth wiring 275, the protection element 250 may be connected in parallel with the light-emitting element 220. The illustrated light-emitting device 200 is an example in which the protection element 250 is a Zener diode, but if the protection element 250 is a temperature measuring element, the wiring connections may differ from those shown in the figure. The electrical connections between the first wiring 271, second wiring 272, third wiring 273, fourth wiring 274, and fifth wiring 275 and the light-emitting element 220 and the protective element 250 will be described later.

[0080] The lid portion 213 is positioned on the upper surface 212a of the frame portion 212. The lid portion 213 is supported by the upper surface 212a of the frame portion 212 and is positioned above the light-emitting element 220 surrounded by the frame portion 212. The outer periphery of the lower surface of the lid portion 213 is joined to, for example, the upper surface 212a of the frame portion 212. For example, a metal film provided on the outer periphery of the lower surface of the lid portion 213 and a metal film provided on the upper surface 212a of the frame portion 212 are joined via AuSn or the like.

[0081] The lid portion 213 is joined to the upper surface 212a of the frame portion 212, forming a sealed space in which the light-emitting element 220 and the wavelength conversion member 240 are arranged. This sealed space may also be formed in an hermetically sealed state. By keeping this sealed space sealed, it is possible to suppress the accumulation of organic matter and other particles on the emission end surface 220a of the light-emitting element 220.

[0082] The cover portion 213 may have a light-transmitting region that allows light emitted from the upper surface 241a of the wavelength conversion unit 241 to pass through and exit to the outside. In other words, light emitted from the upper surface 241a of the wavelength conversion unit 241 towards the cover portion 213 may pass through the light-transmitting region of the cover portion 213 and exit to the outside of the light-emitting device 200. The entire cover portion 213 may be a light-transmitting region. The light-transmitting region of the cover portion 213 transmits 70% or more of the light emitted from the light-emitting element 220 and the light emitted from the wavelength conversion member 240.

[0083] Figure 8 is a top view illustrating the current path of the light-emitting element 220 in the light-emitting device 200 according to the first embodiment. The current path of the light-emitting element 220 will be explained with reference to Figures 1 to 7 as well as Figure 8. Note that in Figure 8, for the sake of explanation, some of the conductive films are shown as a dot pattern.

[0084] The surrounding portion 242 has a wiring region that becomes part of the current path of the light-emitting element 220. Specifically, in the light-emitting device 200, a first conductive film 261 that forms a wiring region is provided on the upper surface 242a of the surrounding portion 242. The first conductive film 261 is provided so as to surround the upper surface 241a of the wavelength conversion portion 241 when viewed from above. Specifically, the first conductive film 261 is provided on the portion of the wavelength conversion portion 241 excluding the upper surface 241a, i.e., at least a part of the upper surface 242a of the surrounding portion 242. It is desirable that the area covered by the first conductive film 261 on the upper surface 242a of the surrounding portion 242 is 80% or more of the total area of ​​the upper surface 242a of the surrounding portion 242. The first conductive film 261 does not have to surround the upper surface 241a of the wavelength conversion portion 241 in a ring shape. The surrounding portion 242, when viewed from above, is a region where, if the first conductive film 261 were provided, it would form an annular first conductive film 261, and it has a defect region where the first conductive film 261 is not provided. The first conductive film 261 may also be provided on the upper surface 242a of the surrounding portion 242 without any defect region.

[0085] In the example shown in Figure 8, in a top view, the inner edge of the first conductive film 261 is aligned with the first side surface 241c, the second side surface 241d, the third side surface 241e, and the fourth side surface 241f, except near the connection between the first side surface 241c and the second side surface 241d of the wavelength conversion section 241. The inner edge of the first conductive film 261 does not reach the first side surface 241c, the second side surface 241d, the third side surface 241e, and the fourth side surface 241f. That is, in a top view, there is an approximately constant gap between the inner edge of the first conductive film 261 and the first side surface 241c, the second side surface 241d, the third side surface 241e, and the fourth side surface 241f, except near the connection between the first side surface 241c and the second side surface 241d. In the example shown in Figure 8, in a top view, the outer edge of the first conductive film 261 coincides with the outer edge of the upper surface 242a of the surrounding section 242. In other words, the first conductive film 261 is provided up to the outermost edge of the upper surface 242a of the surrounding portion 242. Note that, in a top view, the outer edge of the first conductive film 261 does not necessarily coincide with the outer edge of the upper surface 242a of the surrounding portion 242.

[0086] In a top view, the first conductive film 261 is provided extending from one region to the other when the upper surface of the wavelength conversion member 240 is divided by a hypothetical straight line passing through the optical axis OA. This facilitates the joining of the first wiring 271 and the second wiring 272 to the wavelength conversion member 240.

[0087] On the upper surface 214a of the first stepped portion 214, the third conductive film 263 and the fifth conductive film 265 are provided spaced apart from each other along one side of the inner edge shape of the upper surface 212a of the frame portion 212. In the example of Figure 8, in a top view, the third conductive film 263 is provided at a position approximately opposite to the side surface of the wavelength conversion member 240. Also, in a top view, the fifth conductive film 265 is provided at a position approximately opposite to the side surface of the submount 230. In a top view, the third conductive film 263 can be provided in the region sandwiched between a straight line on the side of the wavelength conversion portion 241 that includes the side parallel to the optical axis of the light-emitting element 220 and a straight line on the inner surface 212c of the frame portion 212 that includes the side parallel to the optical axis of the light-emitting element 220. Furthermore, the fifth conductive film can be provided in a region of the submount 230, when viewed from above, that includes a straight line that includes a side of the submount 230 parallel to the optical axis of the light-emitting element 220, and the inner surface 212c of the frame portion 212, which includes a straight line that includes a side of the submount 212 parallel to the optical axis of the light-emitting element 220. Note that the third conductive film 263 and the fifth conductive film 265 do not necessarily have to be provided on the upper surface 214a of the first stepped portion 214.

[0088] The third conductive film 263 is electrically connected to the first conductive film 261, which is a wiring region provided on the upper surface 242a of the surrounding portion 242, via the first wiring 271. In other words, the current path of the light-emitting element 220 includes the third conductive film 263, the first wiring 271, and the first conductive film 261, which is the wiring region. Furthermore, the third conductive film 263 and the first wiring 271, and the first wiring 271 and the first conductive film 261 are physically joined. This physical connection restricts the movement of the wavelength conversion member 240 even if the wavelength conversion member 240 is not fixed to the base portion 210, thereby reducing the occurrence of abnormalities such as light emitted from the light-emitting element 220 not entering the wavelength conversion portion 241. In the example of Figure 8, two first wirings 271 are provided, but only one first wiring 271 may be provided, or three or more may be provided.

[0089] A fourth conductive film 264 is provided on the upper surface 215a of the second stepped portion 215. In the example shown in Figure 8, viewed from above, the fourth conductive film 264 is provided from a position approximately opposite the side surface of the wavelength conversion member 240 to a position approximately opposite the side surface of the submount 230. Viewed from above, the fourth conductive film 264 may be provided on the entire upper surface 215a of the second stepped portion 215, or on a part of the upper surface 215a of the second stepped portion 215.

[0090] In a top view, a virtual straight line passing through the end face 242e of the wavelength conversion member 240 and parallel to the end face 242e passes through the fourth conductive film 264. This makes it easier to utilize the fourth conductive film 264 when making the wavelength conversion member 240 part of the current path of the light-emitting element 220. Alternatively, in a top view, a virtual straight line passing through the region separating the third conductive film 263 and the fifth conductive film 265 and extending in a direction perpendicular to the optical axis OA may also pass through the fourth conductive film 264.

[0091] In a top view, the fourth conductive film 264 is provided over the entire length in the direction parallel to the optical axis OA in the region bounded by a virtual straight line passing through the point of the wavelength conversion unit 241 closest to the light-emitting element 220 in a direction parallel to the optical axis OA and perpendicular to the optical axis OA, and a virtual straight line passing through the midpoint of the light-emitting element 220 in a direction parallel to the optical axis OA and perpendicular to the optical axis OA. This makes it possible to reduce the wiring length of the second wiring 272 and the third wiring 273, thereby reducing the load on the wiring.

[0092] The first conductive film 261, which is a wiring region provided on the upper surface 242a of the surrounding portion 242, is electrically connected to the fourth conductive film 264 via the second wiring 272. In other words, the current path of the light-emitting element 220 includes the third conductive film 263, the first wiring 271, the wiring region of the first conductive film 261, the second wiring 272, and the fourth conductive film 264. Furthermore, the first conductive film 261 and the second wiring 272, and the second wiring 272 and the fourth conductive film 264 are physically joined. This physical connection restricts the movement of the wavelength conversion member 240 even if the wavelength conversion member 240 is not fixed to the base portion 210, thereby reducing the occurrence of abnormalities such as light emitted from the light-emitting element 220 not entering the wavelength conversion portion 241. In the example of Figure 8, two second wirings 272 are provided, but only one second wiring 272 may be provided, or three or more may be provided.

[0093] A first electrode 221 is provided on the upper surface of the light-emitting element 220. The fourth conductive film 264 is electrically connected to the first electrode 221 of the light-emitting element 220 via the third wiring 273. In other words, the current path of the light-emitting element 220 includes the third conductive film 263, the first wiring 271, the wiring region of the first conductive film 261, the second wiring 272, the fourth conductive film 264, the third wiring 273, and the first electrode 221. Furthermore, the fourth conductive film 264 and the third wiring 273, and the third wiring 273 and the first electrode 221 are physically joined. In the example in Figure 8, three third wirings 273 are provided, but there may be only one, two, or four or more third wirings 273.

[0094] A second electrode is provided on the lower surface of the light-emitting element 220. The second electrode of the light-emitting element 220 is electrically connected to a fifth conductive film 265 provided on the upper surface 214a of the first stepped portion 214 via a fourth wiring 274. In the example of Figure 8, the light-emitting element 220 is mounted on a sixth conductive film 266 provided on the upper surface of the submount 230. The second electrode provided on the lower surface of the light-emitting element 220 is connected to the sixth conductive film 266 via a conductive first junction 295. For example, AuSn can be used as the conductive first junction 295. The sixth conductive film 266 is electrically connected to the fifth conductive film 265 via a fourth wiring 274.

[0095] In other words, the current path of the light-emitting element 220 includes the third conductive film 263, the first wiring 271, the wiring region of the first conductive film 261, the second wiring 272, the fourth conductive film 264, the third wiring 273, the first electrode 221, the second electrode of the light-emitting element 220, the first junction 295, the sixth conductive film 266, the fourth wiring 274, and the fifth conductive film 265. Furthermore, the sixth conductive film 266 and the fourth wiring 274, and the fourth wiring 274 and the fifth conductive film 265 are physically joined. In the example of Figure 8, two fourth wirings 274 are provided, but only one fourth wiring 274 may be provided, or three or more may be provided.

[0096] The third conductive film 263, the first wiring 271, the wiring region of the first conductive film 261, the second wiring 272, the fourth conductive film 264, the third wiring 273, the first electrode 221, the second electrode of the light-emitting element 220, the fourth wiring 274, and the fifth conductive film 265 are located within a sealed space formed by the lid portion 213 and the base portion 210. This prevents organic matter and other particles from accumulating on each conductive film and each wiring.

[0097] The third conductive film 263 is electrically connected to the first external connection electrode 291 provided on the lower surface 212b of the frame portion 212 via the first via wiring 281 that penetrates the first stepped portion 214. The fifth conductive film 265 is electrically connected to the second external connection electrode 292 provided on the lower surface 212b of the frame portion 212 via the second via wiring 282 that penetrates the first stepped portion 214.

[0098] In other words, the current path of the light-emitting element 220 includes the first external connection electrode 291, the first via wiring 281, the third conductive film 263, the first wiring 271, the wiring region of the first conductive film 261, the second wiring 272, the fourth conductive film 264, the third wiring 273, the first electrode 221, the second electrode of the light-emitting element 220, the fourth wiring 274, the fifth conductive film 265, the second via wiring 282, and the second external connection electrode 292.

[0099] Furthermore, the current path connecting the first via wiring 281 through the light-emitting element 220 to the second via wiring 282 is located within the sealing space formed by the cover portion 213 and the base portion 210. This suppresses the accumulation of organic matter and other particles on each conductive film and wiring. Note that the current path connecting the first via wiring 281 to the second via wiring 282 here does not include the first via wiring 281 and the second via wiring 282, but rather is the current path connecting the first via wiring 281 and the second via wiring 282.

[0100] For example, metal films can be used as the first conductive film 261, the third conductive film 263, the fourth conductive film 264, the fifth conductive film 265, and the sixth conductive film 266. Examples of metal films include Ni / Au (metal films stacked in the order of Ni and Au) and Ti / Pt / Au (metal films stacked in the order of Ti, Pt, and Au). For the first conductive film 261, the third conductive film 263, the fourth conductive film 264, the fifth conductive film 265, and the sixth conductive film 266, films other than metal films, such as indium tin oxide (ITO), may also be used.

[0101] The surrounding portion 242 of the wavelength conversion member 240 may be formed using a conductive material such as aluminum. In that case, the upper surface 242a of the surrounding portion 242 can be used as a wiring area without providing a conductive film on the upper surface 242a of the surrounding portion 242.

[0102] In the light-emitting device 200, the current path of the light-emitting element 220 is configured to include the first conductive film 261 provided on the upper surface 242a of the surrounding portion 242 of the wavelength conversion member 240. Therefore, if the wavelength conversion member 240 cracks or falls off, causing the first conductive film 261 to break, or if the first wiring 271 and / or the second wiring 272 breaks, current can be prevented from flowing to the light-emitting element 220. As a result, if the wavelength conversion member 240 cracks or falls off, the light-emitting element 220 stops emitting light, and the power supply to the light-emitting element 220 is directly cut off due to the abnormality in the wavelength conversion member 240. This provides a safety measure for the light-emitting device 200.

[0103] Furthermore, because the first conductive film 261 is provided on the upper surface 242a of the surrounding portion 242, even if only the area near the upper surface of the wavelength conversion member 240 is damaged, the first conductive film 261 will break, preventing current from flowing to the light-emitting element 220. On the other hand, for example, if the conductive film is provided on the lower surface 242b of the surrounding portion 242, if only the area near the upper surface of the wavelength conversion member 240 is damaged, current will continue to flow to the light-emitting element 220. For this reason, providing the first conductive film 261 on the upper surface 242a of the surrounding portion 242 improves the safety of the light-emitting device 200 compared to the case where the first conductive film 261 is provided on the lower surface 242b of the surrounding portion 242.

[0104] If the first conductive film 261 is provided with a defect region in a part of the upper surface 242a of the surrounding portion 242, so that current does not flow across the defect region, then even if only one crack occurs from the upper surface 241a of the wavelength conversion portion 241 through the first conductive film 261 to the side surface of the wavelength conversion member 240, the first conductive film 261 will break. In contrast, if the first conductive film 261 is provided around the upper surface 241a of the wavelength conversion portion 241 without a defect region, then if only one crack occurs as described above, the first conductive film on the opposite side of the upper surface 241a of the wavelength conversion portion 241 is in a state where current can conduct, so even if a crack occurs, the current path will not break, and there is a risk that the light-emitting element 220 will remain lit. Therefore, the safety of the light-emitting device 200 can be improved more when the first conductive film 261 surrounds the upper surface 241a of the wavelength conversion unit 241 while providing a defect region, compared to when it is provided without a defect region.

[0105] Furthermore, compared to damage occurring in the region of the upper surface 242a of the surrounding portion 242 that constitutes the protruding portion 242t, the risk to safety is considered greater when damage occurs in the region further away from the light-emitting element 220. By providing a defect region in the first conductive film 261 located in the region close to the light-emitting element 220, extending from the upper surface 241a of the wavelength conversion portion 241 toward the direction in which the light-emitting element 220 is located, to the end face 242e of the surrounding portion 242, it is possible to reliably interrupt the current to the light-emitting element 220 when damage occurs in the region further away from the light-emitting element 220. On the other hand, for example, if a defect region is provided in the region of the upper surface 242a of the surrounding portion 242 that is far from the light-emitting element 220, there is a possibility that the current to the light-emitting element 220 will not be interrupted even if damage occurs in the region of the upper surface 242a of the surrounding portion 242 that is far from the light-emitting element 220. Therefore, by providing a defect area in the region of the upper surface 242a of the surrounding portion 242 that is close to the light-emitting element 220, the safety of the light-emitting device 200 can be improved compared to the case where the defect area is provided in a region that is farther away.

[0106] Since the light-emitting device 200 does not require indirect control using an external detection circuit, the overall size and complexity of the device, including the light-emitting device 200, can be kept to a minimum. Furthermore, there is no risk of safety measures failing due to a failure of the detection circuit itself. Moreover, when indirect control is performed using a detection circuit, two processes are involved: detection of an anomaly and execution of control based on the detection. Therefore, the response speed of safety measures to the occurrence of an anomaly is faster when the current circuit is directly interrupted. Although the light-emitting device 200 has a mechanism to directly stop the current supply, it may also have a mechanism to indirectly stop the current supply.

[0107] <Second Embodiment> Next, the light-emitting device 201 according to the second embodiment will be described with reference to Figures 1, 9 to 11. Figure 1 is a perspective view of the light-emitting device 201 according to the second embodiment. Figure 9 is a top view of the light-emitting device 201 shown in Figure 1 with the cover portion 213 removed. Figure 10 is a cross-sectional view of the light-emitting device 201 along the XX cross-sectional line in Figure 9. Figure 11 is a top view of the light-emitting device 201 shown in Figure 9 with the components mounted on the mounting surface 211a of the bottom portion 211 and the wiring removed. Note that in Figure 11, for the sake of explanation, some of the conductive films are shown as a dot pattern.

[0108] As shown in Figure 1, the light-emitting device 201 according to the second embodiment has the same external shape as the light-emitting device 200. However, the current path of the light-emitting element 220 in the light-emitting device 201 is different from that of the light-emitting device 200.

[0109] Specifically, in the light-emitting device 201, the wiring region of the surrounding portion 242 is not provided on the upper surface 242a of the surrounding portion 242, but on the lower surface 242b of the surrounding portion 242. That is, in the light-emitting device 201, the upper surface 242a of the surrounding portion 242 does not have a conductive film corresponding to the first conductive film 261 shown in Figure 8. On the other hand, as shown in Figure 10, the lower surface 242b of the surrounding portion 242 has a second conductive film 262, which is the wiring region. The second conductive film 262 may be provided only on the lower surface 242b of the surrounding portion 242, but as shown in Figure 10, it may extend from the lower surface 242b of the surrounding portion 242 to the lower surface 241b of the wavelength conversion portion 241.

[0110] Alternatively, the wavelength conversion member 240 may be provided on the mounting surface 211a of the bottom portion 211 without using the submount 235. If the wavelength conversion member 240 is provided on the upper surface of the mounting surface 211a without using the submount 235, the height of the light-emitting device 201 can be reduced.

[0111] Furthermore, the surrounding portion 242 of the wavelength conversion member 240 may be formed using a conductive material such as aluminum. In that case, the lower surface 242b of the surrounding portion 242 can be used as a wiring area without providing a conductive film on it.

[0112] In a top view, the seventh conductive film 267 and the eighth conductive film 268 are provided in the area of ​​the mounting surface 211a of the bottom portion 211 where the submount 230 is not placed. If the submount 230 is not used, the seventh conductive film 267 and the eighth conductive film 268 can be provided in the area of ​​the mounting surface 211a of the bottom portion 211 where the light-emitting element 220 is not placed, in a top view. At least a portion of the seventh conductive film 267 and the eighth conductive film 268 overlaps with the wavelength conversion member 240 in a top view. The seventh conductive film 267 and the eighth conductive film 268 are bonded to the second conductive film 262. The seventh conductive film 267 and the eighth conductive film 268 are separated from each other.

[0113] As shown in Figure 10, the second conductive film 262 has a region that overlaps with the seventh conductive film 267 and the eighth conductive film 268 when viewed from above. The seventh conductive film 267 is electrically connected to the second conductive film 262 via a conductive second junction 296. The eighth conductive film 268 is electrically connected to the second conductive film 262 via a conductive third junction 297. In other words, the seventh conductive film 267, the second junction 296, the second conductive film 262, the third junction 297, and the eighth conductive film 268 are connected in series.

[0114] For the second conductive film 262, the seventh conductive film 267, and the eighth conductive film 268, for example, metal films can be used. Examples of metal films include Ni / Au (metal films stacked in the order of Ni and Au) and Ti / Pt / Au (metal films stacked in the order of Ti, Pt, and Au). For the second conductive film 262, the seventh conductive film 267, and the eighth conductive film 268, films other than metal films, such as indium tin oxide (ITO), may be used. Examples of the second joint 296 and the third joint 297 include AuSn, conductive paste, and metal bumps.

[0115] The seventh conductive film 267 is electrically connected to the first external connection electrode 291 provided on the lower surface 211b of the bottom portion 211 via a third via wiring 283 that penetrates the bottom portion 211. The eighth conductive film 268 is electrically connected to the fourth conductive film 264 provided on the upper surface 215a of the second stepped portion 215 via a fourth via wiring 284 that penetrates the second stepped portion 215.

[0116] In the light-emitting device 201, the current paths of the fourth conductive film 264, the third wiring 273, the first electrode 221, the second electrode of the light-emitting element 220, the fourth wiring 274, the fifth conductive film 265, the second via wiring 282, and the second external connection electrode 292 are the same as those of the light-emitting device 200. In the light-emitting device 201, the fifth conductive film 265 may be provided over the entire surface of the upper surface 214a of the first stepped portion 214, or it may be provided in the same shape as in the light-emitting device 200.

[0117] In other words, in the light-emitting device 201, the current path of the light-emitting element 220 includes the first external connection electrode 291, the third via wiring 283, the seventh conductive film 267, the second junction 296, the second conductive film 262, the third junction 297, the eighth conductive film 268, the fourth via wiring 284, the fourth conductive film 264, the third wiring 273, the first electrode 221, the second electrode of the light-emitting element 220, the fourth wiring 274, the fifth conductive film 265, the second via wiring 282, and the second external connection electrode 292.

[0118] Thus, in the light-emitting device 201, the current path of the light-emitting element 220 is set to include the second conductive film 262 provided on the lower surface 242b of the surrounding portion 242 of the wavelength conversion member 240. Therefore, if the wavelength conversion member 240 cracks or falls off and the second conductive film 262 is disconnected, or if the second junction 296 and / or the third junction 297 are disconnected, current can be prevented from flowing to the light-emitting element 220. In addition, since no wiring is connected to the upper surface 241a of the wavelength conversion portion 241, the wavelength conversion member 240 can be miniaturized.

[0119] <Third Embodiment> Next, the light-emitting device 202 according to the third embodiment will be described with reference to Figures 12 to 15. Figure 12 is a perspective view illustrating the light-emitting device 202 according to the third embodiment. Figure 13 is a perspective view of the light-emitting device 202 shown in Figure 12 with the cover portion 213 removed. Figure 14 is a top view of the light-emitting device 202 shown in Figure 13. Figure 15 is a cross-sectional view of the light-emitting device 202 along the cross-sectional line XV-XV in Figure 12.

[0120] The light-emitting device 202 according to the third embodiment differs from the light-emitting device 200 shown in Figure 1, etc., in that the base portion 210 consists only of a bottom portion 211, and has a lid portion 213 consisting of a flat plate portion 213M and a frame portion 212M. The frame portion 212M is, for example, rectangular in shape when viewed from above. The flat plate portion 213M is, for example, rectangular when viewed from above. One or more inner surfaces 212c of the frame portion 212M do not have stepped portions. The lid portion 213 may be formed integrally, or the frame portion 212M and the flat plate portion 213M may be formed separately and then joined together. For the main material of the lid portion 213, inorganic materials such as glass and ceramics can be used. The frame portion 212M and the flat plate portion 213M may also be molded from different materials. In that case, inorganic materials such as glass and ceramics can also be used. The lid portion 213 is joined to the outer edge of the mounting surface 211a of the base portion 211. For joining the base portion 211 and the lid portion 213, for example, a metal adhesive may be used. Examples of metal adhesives include AuSn and metal paste. A resin adhesive may also be used to join the base portion 211 and the lid portion 213.

[0121] In the example shown in Figure 14, in a top view, the mounting surface 211a of the bottom portion 211 is rectangular in shape with the optical axis direction of the light-emitting element 220 as its longitudinal direction. The mounting surface 211a of the bottom portion 211 is provided with a third conductive film 263, a fourth conductive film 264, a fifth conductive film 265, and a metal film 269. The third conductive film 263 and the fifth conductive film 265 are provided on one side of the metal film 269 in a direction perpendicular to its longitudinal direction, and are spaced apart from the metal film 269. The third conductive film 263 and the fifth conductive film 265 are also spaced apart from each other. The fourth conductive film 264 is provided on the other side of the metal film 269 in a direction perpendicular to its longitudinal direction, and is spaced apart from the metal film 269. The third conductive film 263 and the fifth conductive film 265 are roughly opposite the fourth conductive film 264, with the metal film 269 in between.

[0122] In the light-emitting device 202, as in the case of the light-emitting device 200, the third conductive film 263 is electrically connected via the first wiring 271 to the first conductive film 261, which is a wiring region provided on the upper surface 242a of the surrounding portion 242. The first conductive film 261 is electrically connected to the fourth conductive film 264 via the second wiring 272. The fourth conductive film 264 is electrically connected to the first electrode 221 of the light-emitting element 220 via the third wiring 273. The second electrode of the light-emitting element 220 is electrically connected to the fifth conductive film 265 via the fourth wiring 274.

[0123] The third conductive film 263 is electrically connected to the first external connection electrode 291 provided on the lower surface 211b of the bottom 211 via the first via wiring 281 that penetrates the bottom 211. The fifth conductive film 265 is electrically connected to the second external connection electrode 292 provided on the lower surface 211b of the bottom 211 via the second via wiring 282 that penetrates the bottom 211. In other words, the current path of the light-emitting element 220 includes the first external connection electrode 291, the first via wiring 281, the third conductive film 263, the first wiring 271, the wiring region of the first conductive film 261, the second wiring 272, the fourth conductive film 264, the third wiring 273, the first electrode 221, the second electrode of the light-emitting element 220, the fourth wiring 274, the fifth conductive film 265, the second via wiring 282, and the second external connection electrode 292.

[0124] Thus, the current path of the light-emitting element 220 in the light-emitting device 202 can be the same as the current path of the light-emitting element 220 in the light-emitting device 200. As a result, the same level of safety can be ensured in the light-emitting device 202 as in the light-emitting device 200.

[0125] Light-emitting devices 200, 201, and 202 can be used, for example, in automotive headlights. Furthermore, these devices can be used as light sources for lighting, projectors, head-mounted displays, and other displays such as backlights.

[0126] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0127] The wavelength conversion member 240 is an example of a light conversion unit that converts light emitted from the light-emitting element 220. Light emitted from the light-emitting element 220 is incident on the light conversion unit, which converts the light through wavelength conversion, diffusion, or other optical processes before emitting it. The optical properties of the light incident on the light conversion unit differ before and after conversion by the light conversion unit. It is desirable that the light emitted from the light-emitting device be in the state after conversion by the light conversion unit, while it is undesirable that it be in the state before conversion. The wavelength conversion member 240 is not limited to such a light conversion unit, but it can be considered an example of such a light conversion unit.

[0128] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) A base having a mounting surface, A light-emitting element is placed on the mounting surface and emits light from its exit end face, A light-emitting device comprising: a wavelength conversion member arranged on the mounting surface in the direction in which light emitted from the light-emitting element travels, and having a wiring region that becomes part of the current path of the light-emitting element. (Note 2) The wavelength conversion member is A wavelength conversion unit having an incident side into which light emitted from the light-emitting element enters, and an upper surface from which light is emitted, The light-emitting device according to Appendix 1, comprising: an enclosing portion provided around the wavelength conversion portion and provided with the wiring region. (Note 3) The surrounding portion, when viewed from above, has an upper surface that surrounds the upper surface of the wavelength conversion portion. The light-emitting device according to Appendix 2, wherein the wiring region is a first conductive film provided on the upper surface of the surrounding portion. (Note 4) The surrounding portion has a lower surface facing the mounting surface of the base, The light-emitting device according to Appendix 2, wherein the wiring region is a second conductive film provided on the lower surface of the surrounding portion. (Note 5) The surrounding portion is made of a conductive material, as described in Appendix 2, for the light-emitting device. (Note 6) The base consists of a bottom having the aforementioned surface and a frame that surrounds the aforementioned surface when viewed from above. The light-emitting device according to any one of the appendices 1 to 5, wherein the wavelength conversion member and the light-emitting element are arranged inside the frame portion when viewed from above. (Note 7) The light-emitting device according to Appendix 6, further comprising a lid portion which is joined to the frame portion and forms a sealing space in which the light-emitting element and the wavelength conversion member are arranged. (Note 8) The side surface of the wavelength conversion member has a recess, A light-emitting device according to any one of the appendices 1 to 7, wherein a portion of the recess is a wavelength conversion section. (Note 9) In a top view, the light-emitting end face of the light-emitting element is located directly below the recess, as described in Appendix 8 of the light-emitting device. (Note 10) The base consists of a bottom and a frame, and the wavelength conversion member and the light-emitting element are arranged inside the frame when viewed from above. It has a first stepped portion having an upper surface located above the upper surface of the bottom portion and below the upper surface of the frame portion, A third conductive film is provided on the upper surface of the first stepped portion. The third conductive film is electrically connected to the wiring region via the first wiring, The current path includes the third conductive film, the first wiring, and the wiring region, as described in any one of the appendices 1 to 3. (Note 11) It has a second stepped portion having an upper surface located above the upper surface of the bottom portion and below the upper surface of the frame portion, A fourth conductive film is provided on the upper surface of the second stepped portion. The wiring region is electrically connected to the fourth conductive film via the second wiring. The light-emitting device according to Appendix 10, wherein the current path includes the third conductive film, the first wiring, the wiring region, the second wiring, and the fourth conductive film. (Note 12) The fourth conductive film is electrically connected to the first electrode of the light-emitting element via the third wiring. The light-emitting device according to Appendix 11, wherein the current path includes the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, and the first electrode. (Note 13) A fifth conductive film is provided on the first stepped portion, separated from the third conductive film. The second electrode of the light-emitting element is electrically connected to the fifth conductive film via the fourth wiring. The light-emitting device according to Appendix 12, wherein the current path includes the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, the first electrode, the second electrode, the fourth wiring, and the fifth conductive film. (Note 14) The system further comprises a lid portion which is joined to the frame portion and forms a sealing space in which the light-emitting element and the wavelength conversion member are arranged, The light-emitting device according to Appendix 13, wherein the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, the first electrode, the second electrode, the fourth wiring, and the fifth conductive film are located within the sealing space. (Note 15) The third conductive film is electrically connected to the first external connection electrode provided on the lower surface of the base via a first via wiring that penetrates the first stepped portion. The fifth conductive film is electrically connected to a second external connection electrode provided on the lower surface of the base via a second via wiring that penetrates the first stepped portion. The light-emitting device according to Appendix 14, wherein the current path includes the first external connection electrode, the first via wiring, the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, the first electrode, the second electrode, the fourth wiring, the fifth conductive film, the second via wiring, and the second external connection electrode. (Note 16) A base having a mounting surface, A light-emitting element is placed on the mounting surface and emits light from its exit end face, A light-emitting device comprising: a light conversion unit arranged on the mounting surface in the direction in which the light emitted from the light-emitting element travels, and having a wiring region that becomes part of the current path of the light-emitting element. [Explanation of symbols]

[0129] 200, 201, 202 Light-emitting devices 210 base 211 Bottom 211a Mounting surface 211b Bottom side 212,212M frame 212a Top 212b Bottom side 212c inner surface 212d External surface 213 Lid 213a Top side 213b Bottom surface 213c side 213M Flat plate part 214 First step section 215 Second step section 214a,215a Top surface 214b,215b Bottom surface 220 light-emitting elements 220a Output end face 221 1st electrode 230,235 Submount 240 wavelength conversion component 241 Wavelength conversion section 241a Top side 241b Bottom surface 241c 1st side 241d 2nd side 241e 3rd side 241f 4th side 241i entrance side 242 Encircled section 242a Top 242b Bottom side 242t protrusion 250 protective elements 261 First conductive film 262 Second Conductive Drill 263 Third conductive film 264 Fourth conductive film 265 Fifth conductive film 266 Sixth Conductive Film 267 Conductive film #7 268 The eighth conductive film 269 ​​Metal film 271 1st wiring 272 2nd wiring 273 3rd wiring 274 4th wiring 275 5th wiring 281 First via wiring 282 Second via wiring 283 Third via wiring 284 Via 4 Wiring 291 First external connection electrode 292 Second external connection electrode 295 1st joint 296 2nd joint 297 Third joint

Claims

1. A base having a mounting surface, A light-emitting element is placed on the mounting surface and emits light from its exit end face, The mounting surface includes a wavelength conversion member that is arranged in the direction in which the light emitted from the light-emitting element travels and has a wiring region that becomes part of the current path of the light-emitting element, The wavelength conversion member is A wavelength conversion unit having an incident side into which light emitted from the light-emitting element enters, and an upper surface from which light is emitted, A light-emitting device having a surrounding portion provided around the wavelength conversion portion and in which the wiring region is provided.

2. The base consists of a bottom having the aforementioned surface and a frame that surrounds the aforementioned surface when viewed from above. The light-emitting device according to claim 1, wherein the wavelength conversion member and the light-emitting element are arranged inside the frame portion when viewed from above.

3. The light-emitting device according to claim 2, further comprising a lid portion which is joined to the frame portion and forms a sealing space in which the light-emitting element and the wavelength conversion member are arranged.

4. A base having a mounting surface, A light-emitting element is placed on the mounting surface and emits light from its exit end face, The mounting surface includes a wavelength conversion member that is arranged in the direction in which the light emitted from the light-emitting element travels and has a wiring region that becomes part of the current path of the light-emitting element, The side surface of the wavelength conversion member has a recess, A portion of the recess is a light-emitting device that is a wavelength conversion unit.

5. The light-emitting device according to claim 4, wherein, in a top view, the emission end face of the light-emitting element is located directly below the recess.

6. A base having a mounting surface, A light-emitting element is placed on the mounting surface and emits light from its exit end face, The mounting surface includes a wavelength conversion member that is arranged in the direction in which the light emitted from the light-emitting element travels and has a wiring region that becomes part of the current path of the light-emitting element, The base consists of a bottom and a frame, and the wavelength conversion member and the light-emitting element are arranged inside the frame when viewed from above. It has a first stepped portion having an upper surface located above the upper surface of the bottom portion and below the upper surface of the frame portion, A third conductive film is provided on the upper surface of the first stepped portion. The third conductive film is electrically connected to the wiring region via the first wiring, The current path includes the third conductive film, the first wiring, and the wiring region of the light-emitting device.

7. It has a second stepped portion having an upper surface located above the upper surface of the bottom portion and below the upper surface of the frame portion, A fourth conductive film is provided on the upper surface of the second stepped portion. The wiring region is electrically connected to the fourth conductive film via the second wiring. The light-emitting device according to claim 6, wherein the current path includes the third conductive film, the first wiring, the wiring region, the second wiring, and the fourth conductive film.

8. The fourth conductive film is electrically connected to the first electrode of the light-emitting element via the third wiring. The light-emitting apparatus according to claim 7, wherein the current path includes the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, and the first electrode.

9. A fifth conductive film is provided on the first stepped portion, separated from the third conductive film. The second electrode of the light-emitting element is electrically connected to the fifth conductive film via the fourth wiring. The light-emitting device according to claim 8, wherein the current path includes the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, the first electrode, the second electrode, the fourth wiring, and the fifth conductive film.

10. The system further comprises a lid portion which is joined to the frame portion and forms a sealing space in which the light-emitting element and the wavelength conversion member are arranged, The light-emitting device according to claim 9, wherein the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, the first electrode, the second electrode, the fourth wiring, and the fifth conductive film are located within the sealing space.

11. The third conductive film is electrically connected to the first external connection electrode provided on the lower surface of the base via a first via wiring that penetrates the first stepped portion. The fifth conductive film is electrically connected to the second external connection electrode provided on the lower surface of the base via a second via wiring that penetrates the first stepped portion. The light-emitting device according to claim 10, wherein the current path includes the first external connection electrode, the first via wiring, the third conductive film, the first wiring, the wiring region, the second wiring, the fourth conductive film, the third wiring, the first electrode, the second electrode, the fourth wiring, the fifth conductive film, the second via wiring, and the second external connection electrode.

12. The surrounding portion, when viewed from above, has an upper surface that surrounds the upper surface of the wavelength conversion portion. The light-emitting device according to any one of claims 1 to 3, wherein the wiring region is a first conductive film provided on the upper surface of the surrounding portion.

13. The surrounding portion has a lower surface facing the mounting surface of the base, The light-emitting device according to any one of claims 1 to 3, wherein the wiring region is a second conductive film provided on the lower surface of the surrounding portion.

14. The light-emitting device according to any one of claims 1 to 3, wherein the surrounding portion is made of a conductive material.

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