Resin films, laminates, metal-clad laminates

Abstract

To provide a resin film which can satisfy adhesion to a polyimide resin film as a base material and adhesion to a metal layer (for example, copper foil having low roughness) that can achieve high speed transmission and has small roughness, while satisfying low dielectric characteristics required for 5 G and 6 G, and can suppress variations in the adhesion.SOLUTION: An SPS resin film contains syndiotactic polystyrene (SPS), and further contains polyphenylene ether (PPE), and a rubbery elastic body containing a hydrogenated product of a styrene-butadiene-styrene block copolymer (SBS), wherein as for a mass ratio of each component in 100 pts.mass of the SPS resin film, the syndiotactic polystyrene is more than 50 pts.mass and 92 pts.mass or less, the polyphenylene ether is 5 pts.mass or more and less than 30 pts.mass, and the rubbery elastic body is 3 pts.mass or more and 20 pts.mass or less.SELECTED DRAWING: None

Claims

1. A syndiotactic polystyrene (SPS) resin film further containing polyphenylene ether (PPE) and a rubbery elastic material containing a hydrogenated styrene-butadiene-styrene block copolymer (SBS), The mass ratio of each component in 100 parts by mass of the SPS resin film is: The amount of syndiotactic polystyrene is more than 50 parts by mass and 92 parts by mass or less. The polyphenylene ether is present in amounts of 5 parts by mass or more and less than 30 parts by mass. The rubber-like elastic material is present in amounts of 3 to 20 parts by mass. An SPS resin film in which the melt flow rate (MFR) of the hydrogenated styrene-butadiene-styrene block copolymer (SBS), measured at 230°C and 2.16 kgf, is 0 g / 10 min or more and less than 0.1 g / 10 min.

2. The SPS resin film according to claim 1, wherein the mass percentage of styrene in the hydrogenated styrene-butadiene-styrene block copolymer (SBS) is 25% by mass or more and 70% by mass or less.

3. The SPS resin film according to claim 1, wherein the relative permittivity of the SPS resin film at a frequency of 28 GHz is 2.8 or less, and the dielectric loss tangent is 0.002 or less.

4. The SPS resin film according to claim 1, wherein the tensile modulus of the SPS resin film, as measured by a method in accordance with JIS K7127, is 2.4 GPa or more and 3.1 GPa or less.

5. The SPS resin film according to claim 1, obtained by using the SPS resin film described in claim 1 and going through the following a) to d), wherein the tensile modulus of elasticity of the post-heat-pressed SPS resin film, after heat-pressing with copper foil, is measured by a method in accordance with the measurement method of JIS K7127 and is 2.7 GPa or more and 3.6 GPa or less. a) Place copper foil on both sides of the SPS resin film. b) Using a hot press machine, sandwich the material between 1 mm thick stainless steel plates, set the hot plate temperature to 80°C, and begin heat pressing with a surface pressure of 3 MPa. Increase the temperature at a heating rate of 7°C / min until the hot plate temperature reaches 290°C while heat pressing is being performed. c) Once it reaches 290°C, cool it down to 230°C at a rate of 4°C / min, then release the pressure and remove it. d) Etch and remove the copper foil, and extract only the SPS resin film.

6. An SPS resin film according to any one of claims 1 to 5, A laminate formed by laminating a heat-resistant resin film that does not have a melting point below 300°C, A laminate in which the linear thermal expansion coefficient (CTE) of the heat-resistant resin film is 50 ppm / °C or less.

7. A metal-clad laminate, wherein a metal layer is laminated on the SPS resin film on the side opposite to the side on which the heat-resistant resin film is disposed, relative to the laminate according to claim 6.

8. The metal-clad laminate according to claim 7, wherein the metal layer is copper foil, and the surface roughness (Rz) of the copper foil surface that contacts the SPS resin film is 1 μm or less.

9. A method for manufacturing a metal-clad laminate according to claim 8, The metal layer, the SPS resin film, the heat-resistant resin film, and the SPS resin film are arranged in this order and heat-pressed together, The process includes arranging the metal layer, the SPS resin film, the heat-resistant resin film, the SPS resin film, and the metal layer in this order, and then heat-pressing them together to obtain a metal-clad laminate. A method for manufacturing a metal-clad laminate, wherein the heat-compression bonding is performed such that, when the melting point of the SPS resin film is Tm (°C), the maximum temperature during heat-compression bonding is within the temperature range of Tm-30°C to Tm+30°C.

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