Resin compositions, cured products, resin sheets, circuit boards, and semiconductor chip packages
A resin composition with controlled inorganic filler particle size and silica content stabilizes viscosity and suppresses warping, addressing defects in insulating layers and improving semiconductor chip package quality.
JP7882251B2Active Publication Date: 2026-06-30AJINOMOTO CO INC
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- AJINOMOTO CO INC
- Filing Date
- 2022-06-08
- Publication Date
- 2026-06-30
AI Technical Summary
Technical Problem
Resin compositions used for forming insulating layers in semiconductor chip packages face issues with warping and unstable viscosity life, particularly when inorganic fillers are used to increase density, leading to flow marks and embedding defects.
Method used
A resin composition containing a curable resin and inorganic filler with specific particle size and crystalline silica content, ranging from 0.5 μm to 12 μm and 0% to 2.1% by mass, respectively, to stabilize viscosity life and suppress warping.
Benefits of technology
The resin composition achieves stable viscosity life, reducing warping and defects in insulating layers, enhancing adhesion to substrates, and improving the yield of circuit boards and semiconductor chip packages.
✦ Generated by Eureka AI based on patent content.
Smart Images
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Abstract
A resin composition with a stable viscosity life; a resin sheet that uses said resin composition; a circuit substrate; and a semiconductor chip package are provided. In this resin composition, which contains (A) a curable resin and (B) an inorganic filler, the average particle diameter of the (B) inorganic filler is in the range 0.5-12 μm and the crystalline silica content in the inorganic filler material is greater than or equal to 0 mass% and less than 2.1 mass%.
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