Resin compositions and their cured products, adhesives for electronic components, semiconductor devices, and electronic components

Abstract

To provide a resin composition and a cured material thereof excellent in resistance to impact at falling after curing and excellent also in solvent resistance, an adhesive for electronic component containing the resin composition, a semiconductor device containing a cured material of the resin composition, and an electronic component.SOLUTION: A resin composition comprises (A) an epoxy resin containing a hydrogenated bisphenol A type epoxy resin, (B) a polyfunctional thiol resin, and (C) a curing catalyst, wherein the elastic modulus of the cured product at 50°C is 0.5 GPa or more, and (A) the hydrogenated bisphenol A type epoxy resin is contained by 65 pts.mass or more relative to 100 pts.mass of the epoxy resin in the resin composition.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition and its cured product, an adhesive for electronic components, a semiconductor device, and an electronic component. In particular, it relates to a resin composition suitable for use as an adhesive for electronic components, a semiconductor device containing a cured product of this resin composition, and an electronic component. [Background technology]

[0002] Currently, mobile devices and other electronic equipment contain built-in electronic components. Many applications of these devices require resistance to drop impact (hereinafter referred to as resistance to impact during drops). Therefore, resin compositions used for bonding electronic components and other applications require such resistance.

[0003] On the other hand, resin compositions used for bonding electronic components and the like are required to withstand cleaning processes during the manufacturing process to remove solder flux and dust, in other words, to have solvent resistance.

[0004] Conventionally, a method has been known to improve the resistance of resin compositions to impact during drops by lowering the glass transition temperature (low Tg) of the cured product to reduce its elastic modulus (for example, paragraphs 0009, 0077, 0079-0081 of Patent Document 1). However, this method results in a low crosslinking density of the cured resin product, making it prone to swelling. This leads to the problem of poor solvent resistance. On the other hand, raising the glass transition temperature (high Tg) of the cured product deteriorates its resistance to impact during drops. For this reason, it is not suitable for use as an adhesive for electronic components (for example, voice coil motors (VCMs, used for camera focusing, etc.) and image sensor modules, etc.). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2012-188628 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] This invention has been made in view of the above-mentioned problems. The objective is to provide a resin composition and its cured product that, after curing, exhibits excellent resistance to impact during drops and excellent solvent resistance, an adhesive for electronic components containing this resin composition, a semiconductor device containing the cured product of this resin composition, and an electronic component. [Means for solving the problem]

[0007] To solve the above problems, the inventors conducted research and found that a resin composition comprising (A) an epoxy resin of a specific structure, (B) a thiol-based curing agent, and (C) a curing catalyst can possess both resistance to impact during drops and solvent resistance.

[0008] The present invention relates to a resin composition, an adhesive for electronic components, a semiconductor device, and an electronic component, which solve the above problems by having the following configuration. [1] (A) Hydrogenated bisphenol A type epoxy resin, (B) Polyfunctional thiol resin, and (C) Curing catalyst Includes, A resin composition characterized in that the elastic modulus of the cured product at 50°C is 0.5 GPa or higher. [2] The resin composition according to [1] above, further comprising an elastic modulus of 0.5 GPa or more at temperatures between 20°C and 50°C. [3] The resin composition according to [1] or [2] above, wherein the glass transition temperature of the cured product exceeds 50°C. [4] The resin composition according to any one of [1] to [3] above, wherein component (B) contains a polyfunctional thiol resin that does not have ester bonds in its molecule. [5] A resin composition according to any one of [1] to [4] above, wherein component (B) contains a glycoluryl compound. The resin composition according to [5] above, wherein the glycoluril compound of component (B) is 40 to 100 parts by mass with respect to 100 parts by mass of component (B). 〔7〕The resin composition according to any one of [1] to [6] above, further comprising a silica filler. 〔8〕An adhesive for electronic components, comprising the resin composition according to any one of [1] to [7] above. 〔9〕A cured product of the resin composition according to any one of [1] to [7] above. 〔10〕A semiconductor device, comprising the cured product according to [9] above. 〔11〕An electronic component, comprising the cured product according to [9] above or the semiconductor device according to

[10] above.

Advantages of the Invention

[0009] According to the present invention [1], it is possible to provide a resin composition that is excellent in resistance to impact during dropping after curing and also excellent in solvent resistance. According to the present invention [8], it is possible to provide an adhesive for electronic components that is excellent in resistance to impact during dropping after curing and also excellent in solvent resistance.

[0010] According to the present invention [9], it is possible to provide a cured product of a resin composition that is excellent in impact resistance against dropping and also excellent in solvent resistance.

[0011] According to the present invention

[10] , it is possible to provide a highly reliable semiconductor device, comprising a cured product of a resin composition that is excellent in resistance to impact during dropping and also excellent in solvent resistance. According to the present invention

[11] , it is possible to provide a highly reliable electronic component, comprising a cured product of a resin composition that is excellent in resistance to impact during dropping and also excellent in solvent resistance.

Brief Description of the Drawings

[0012] [Figure 1] DMA charts of Examples 6 and 7 and Comparative Example 3.

Modes for Carrying Out the Invention

[0013] The resin composition of the present invention (hereinafter simply referred to as the resin composition) comprises (A) a hydrogenated bisphenol A type epoxy resin, (B) a polyfunctional thiol resin, and (C) a curing catalyst and is characterized in that the elastic modulus of the cured product at 50 °C is 0.5 GPa or more.

[0014] (A) The hydrogenated bisphenol A type epoxy resin of component (A) imparts curability, heat resistance, adhesiveness, impact resistance, solvent resistance, etc. to the resin composition. Note that hydrogenated bisphenol A is also called hydrogenated bisphenol A (HBPA) or 2,2'-bis(4-hydroxycyclohexyl)propane. Component (A) may contain a monofunctional body or a dimer as impurities. With respect to 100 parts by mass of the epoxy resin in the resin composition, component (A) is preferably contained in 65 parts by mass or more. More preferably, it is contained in 70 parts by mass or more. Even more preferably, it is contained in 75 parts by mass or more. When the content of (A) is small, the resistance to impact during dropping tends to deteriorate. Examples of commercially available products of component (A) include hydrogenated bisphenol A type epoxy resins manufactured by Mitsubishi Chemical Corporation (product names: YX8000, YX8034, YX8040), hydrogenated bisphenol A type epoxy resins manufactured by Kyoeisha Chemical Co., Ltd. (product name: Epolite 4000), hydrogenated bisphenol A type epoxy resins manufactured by Shin Nippon Rika Co., Ltd. (product name: Rikarezine), etc. Component (A) may be used alone or in combination of two or more of these commercially available products. <00​​​​​​​​​​​

[0017] (wherein, R 1 , and R 2 are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, or a phenyl group, and n is an integer of 0 to 10). Examples thereof include those represented by Chemical Formula (2) or Chemical Formula (3):

[0018] [Chemical Formula]

[0019] [Chemical Formula]

[0020] Those represented by are more preferable.

[0021] In addition, examples of the polyfunctional thiol resin having no ester bond in the molecule include General Formula (4):

[0022] [Chemical Formula]

[0023] (wherein, R 3 , R 4 , R 5 and R 6 are each independently hydrogen or C n H 2n SH (n is 2 to 6), and at least one of R 3 , R 4 , R 5 and R 6 is C n H 2n SH (n is 2 to 6)). Examples of the polyfunctional thiol resin include those represented by. From the viewpoint of curability, it is preferable that n is 2 to 4 for the thiol compound of General Formula (4). Further, from the viewpoint of the balance between the physical properties of the cured product and the curing rate, it is more preferable that it is a mercaptopropyl group with n being 3.

[0024] Examples of commercially available components (B) include thiol glycol uryl derivatives manufactured by Shikoku Chemicals (product name: TS-G (corresponding to chemical formula (2), thiol equivalent: 100 g / eq), C3 TS-G (corresponding to chemical formula (3), thiol equivalent: 114 g / eq)) and thiol compounds manufactured by SC Organic Chemicals (product name: PEPT (corresponding to general formula (4), thiol equivalent: 124 g / eq)). Component (B) may be used individually or in combination of two or more of these commercially available products.

[0025] Furthermore, from the viewpoint of the elastic modulus of the resin composition after curing, it is preferable that the glycoluryl compound in component (B) is 40 to 100 parts by mass per 100 parts by mass of component (B). It is more preferable that it is 50 to 100 parts by mass, and even more preferable that it is 60 to 100 parts by mass.

[0026] The curing catalyst (C) imparts curability to the resin composition. Component (C) is not particularly limited as long as it is a general curing catalyst, and examples include phosphine-based, amine-based, etc.

[0027] Examples of phosphine-based curing catalysts include triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, and tri(nonylphenyl)phosphine. Amine-based curing catalysts include imidazole-based curing catalysts. Examples of amine-based curing catalysts include triazine compounds such as 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-triazine, and tertiary amine compounds such as 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), 1,4-diazabicyclo[2.2.2]octane (DABCO), triethylenediamine, benzyldimethylamine, and triethanolamine. Furthermore, examples of imidazole curing catalysts include imidazole compounds such as 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-cyanoethyl-2-ethyl-4-methylimidazole. From the viewpoint of rapid curing at low temperatures, 2-methylimidazole and 1,4-diazabicyclo[2.2.2]octane (DABCO) are preferred.(C) Commercial products containing this ingredient include "Amicure PN-23" (Ajinomoto Fine Techno Co., Ltd. product name), "Amicure PN-40" (Ajinomoto Fine Techno Co., Ltd. product name), "Amicure PN-50" (Ajinomoto Fine Techno Co., Ltd. product name), "Hardener X-3661S" (ACR Co., Ltd. product name), "Hardener X-3670S" (ACR Co., Ltd. product name), and "NovaCure HX-3742" (Asahi Kasei Corporation). Examples of products include, but are not limited to, "NovaCure HX-3721" (Asahi Kasei Corporation, product name), "NovaCure HXA9322HP" (Asahi Kasei Corporation, product name), "NovaCure HXA3922HP" (Asahi Kasei Corporation, product name), "NovaCure HXA3932HP" (Asahi Kasei Corporation, product name), "NovaCure HXA5945HP" (Asahi Kasei Corporation, product name), "NovaCure HXA9382HP" (Asahi Kasei Corporation, product name), "FujiCure FXR1121" (T&K TOKA Co., Ltd., product name), "FujiCure FXE-1000" (T&K TOKA Co., Ltd., product name), "FujiCure FXR-1030" (T&K TOKA Co., Ltd., product name). (C) The components may be used individually or in combination of two or more of these commercially available products. (C) As for component C, a latent curing catalyst is preferred from the viewpoint of pot life and curability.

[0028] (A) Component is preferably in an amount of 10 to 70 parts by mass per 100 parts by mass of the resin composition, from the viewpoint of achieving both resistance to impact when dropped and viscosity. It is more preferably 20 to 60 parts by mass, and even more preferably 30 to 60 parts by mass.

[0029] The thiol equivalent of component (B) is preferably 0.5 to 2.5 equivalents per equivalent of the total epoxy. More preferably 0.5 to 2.0, even more preferably 0.5 to 1.5, and particularly preferably 0.8 to 1.2. By keeping the thiol equivalent of component (B) and the total epoxy equivalent within the above ranges (i.e., the total number of thiol groups and total epoxy groups in the resin composition are within the above ranges), it is possible to prevent insufficient hardness and toughness of the cured resin composition.

[0030] Component (C) is preferably contained in an amount of 0.1 to 10 parts by mass, more preferably 0.3 to 10 parts by mass, and even more preferably 0.5 to 10 parts by mass, based on 100 parts by mass of the total epoxy resin including component (A) and component (B). If the amount is 0.1 parts by mass or more, the reactivity is good. If the amount is 5 parts by mass or less, the heat resistance is good and the viscosity is stable. Note that component (C) is sometimes provided in the form of a dispersion in epoxy resin. When using component (C) in such a form, it should be noted that the amount of epoxy resin in which it is dispersed is excluded from the amount of component (C).

[0031] The resin composition is preferably further enriched with (D) an inorganic filler to prevent sagging and is suitable for dispensing. From the viewpoint of workability, component (D) is preferably spherical. Silica or alumina is preferred for component (D).

[0032] Examples of silica powders include fused silica, ordinary silica, spherical silica, crushed silica, crystalline silica, and amorphous silica.

[0033] The average particle size of component (D) is not particularly limited, but is preferably 0.1 to 15 μm. This is from the viewpoint of dispersibility of component (D) in the resin composition and lower viscosity of the resin composition. If it is less than 0.1 μm, the viscosity of the resin composition may increase, and the workability of the resin composition may deteriorate. If it is greater than 15 μm, it may become difficult to uniformly disperse component (D) in the resin composition. Examples of commercially available silica powders (silica fillers) include Admatex silica (product name: SO-E2, average particle size: 0.5 μm), Ryumori silica (product name: MP-8FS, average particle size: 0.7 μm), and DENKA silica (product name: FB-5D, average particle size: 5 μm). Component (D) can be used alone or in combination of two or more of these commercially available products.

[0034] (D) Component is preferably 0 to 40 parts by mass per 100 parts by mass of the resin composition, from the viewpoint of further increasing the modulus of elasticity and improving solvent resistance. If the amount is greater than 40 parts by mass, the resin component will be relatively reduced, which may lead to a deterioration in drop impact resistance.

[0035] The resin composition may further contain, as necessary and without impairing the objectives of the present invention, stabilizers (e.g., organic acids, borate esters, metal chelates), carbon black, titanium black, silane coupling agents, ion trapping agents, leveling agents, antioxidants, defoaming agents, thixotropes, and other additives. Furthermore, viscosity modifiers, flame retardants, or solvents may also be added to the resin composition.

[0036] The resin composition can be obtained, for example, by stirring, melting, mixing, and dispersing components (A) to (C) and other additives simultaneously or separately, while applying heat treatment as necessary. While there are no particular limitations on the equipment used for mixing, stirring, and dispersion, a Leikai machine equipped with stirring and heating devices, a Henschel mixer, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc., can be used. These devices may also be used in appropriate combinations.

[0037] The resin composition obtained in this way is thermosetting. The thermosetting of the resin composition is preferably performed at 60-90°C for 30-120 minutes.

[0038] The cured resin composition according to the present invention has an elastic modulus of 0.5 GPa or higher at 50°C. Conventionally, even when the glass transition temperature of the cured product is set to below room temperature to lower the elastic modulus at room temperature and improve drop impact resistance, if the temperature is lowered further below the glass transition temperature, the elastic modulus increases significantly, and the resistance to drop impact deteriorates. The cured resin composition according to the present invention has a glass transition temperature exceeding 50°C. Therefore, even at room temperature and when the temperature is lowered further, the change in elastic modulus is small, and furthermore, because component (A) is used, it has excellent resistance to drop impact. In addition, ultrasonic cleaning is often used in the cleaning process of electronic components. In ultrasonic cleaning, heat is generated, and the temperature of the solvent used can rise to nearly 50°C. For this reason, if the elastic modulus of the cured resin composition at 50°C is less than 0.5 GPa, the solvent resistance deteriorates. Thus, if the elastic modulus between 20°C and 50°C is not 0.5 GPa or higher, the solvent resistance tends to deteriorate, but the cured resin composition according to the present invention has a glass transition temperature exceeding 50°C. That is, the modulus of elasticity at 20°C or higher but less than 50°C is 0.5 GPa or higher. Therefore, the solvent resistance does not deteriorate. The modulus of elasticity at 50°C of the cured resin composition according to the present invention is more preferably 0.8 GPa or higher. Even more preferably 1 GPa or higher. Particularly preferably 1.5 GPa or higher. Furthermore, the upper limit of the modulus of elasticity at 50°C of the cured resin composition is preferably 6 GPa or lower. Even more preferably 5 GPa or lower. Even more preferably 4 GPa or lower.

[0039] [Adhesives for electronic components] The adhesive for electronic components of the present invention comprises the resin composition described above.

[0040] [Cured product of resin composition] The cured product of the resin composition of the present invention is the cured product of the resin composition described above.

[0041] [Semiconductor devices, electronic components] Because the semiconductor device of the present invention contains a cured product of the above-mentioned resin composition, it has excellent resistance to impact during drops. Furthermore, it is highly reliable.

[0042] Because the electronic component of the present invention includes the cured material described above or the semiconductor device described above, it has excellent resistance to drop impact and is highly reliable. [Examples]

[0043] The present invention will be described below with reference to examples, but the present invention is not limited to these examples. In the following examples, parts and % refer to parts by mass and mass%, respectively, unless otherwise specified.

[0044] (A) The hydrogenated bisphenol A epoxy resin is a hydrogenated bisphenol A epoxy resin manufactured by Mitsubishi Chemical (product name: YX8000, epoxy equivalent: 205 g / eq). For component (A'), the bisphenol A type epoxy resin is a bisphenol A type epoxy resin manufactured by Mitsubishi Chemical (product name 828EL:, epoxy equivalent: 173 g / eq). For component (A'), the siloxane skeleton epoxy resin is manufactured by Momentive Performance Materials Japan LLC (product name: TSL9906, epoxy equivalent: 181 g / eq). (B) Component (B-1) C3 TS-G contains a glycoluryl derivative manufactured by Shikoku Chemicals, Inc. (product name: C3 TS-G, thiol equivalent: 114 g / eq) (B-2) For PEPT, SC Organic Chemicals thiol compound (product name: PEPT, thiol equivalent: 124 g / eq) (B-3) PEMP contains pentaerythritol tetrakis(3-mercaptopropionate) manufactured by SC Organic Chemicals (product name: PEMP, thiol equivalent: 128 g / eq), For component (C), the (C-1) curing catalyst is a curing catalyst manufactured by T&K TOKA (product name: FXR1211), and for component (C-2), the curing catalyst is a curing catalyst manufactured by Asahi Kasei (product name: HXA3922). (D) For the silica component, Admatex silica (product name: SO-E2, average particle size: 0.5 μm) is used, and for the silane coupling agent, Shin-Etsu Chemical Co., Ltd. 3-glycidoxypropyltrimethoxysilane (product name: KBM-403) is used. I used it.

[0045] [Examples 1-8, Comparative Examples 1-3] The raw materials were mixed according to the formulations shown in Tables 1 and 2, and then dispersed at room temperature using a three-roll mill. This produced the resin compositions of Examples 1-8 and Comparative Examples 1-3.

[0046] <Measurement of resistance to impact during falls> Materials used in the drop impact resistance test • Component 1: SUS substrate • Part 2: Ni-coated block, Size: Width: 9mm x Length: 9mm x Thickness: 4mm

[0047] 《Measurement Method for Drop Impact Resistance Test》 (i) The prepared resin composition (sample) was applied as an adhesive to a SUS substrate. The application size was 9 mm wide x 9 mm long x 0.3 mm thick. (ii) A Ni-coated block was placed on top of the coated sample to prepare the test specimen. (iii) The test specimens were placed in an oven heated to 80°C and the samples were heated and cured for 30 minutes. (iv) After heating and curing the sample, the test piece was removed from the oven and dropped at room temperature using a drop impact tester (manufactured by Hitachi Technology & Services). The height at which the Ni-coated block peeled off the SUS plate was defined as the drop height. The drop height was increased in 100 mm increments from 200 mm up to 500 mm. Above 500 mm, the height was increased in 50 mm increments for each test. The number of drops was 5 at each height, and if peeling did not occur, the test was moved to the next height. The results are shown in Tables 1 and 2. A drop impact resistance of 450 mm or more is preferable, and 600 mm or more is more preferable.

[0048] <Measurement of elastic modulus> A resin composition was applied to a stainless steel plate (SUS-304, smooth plate: 40mm x 60mm x 0.3mm) to form a coating film with a cured film thickness of 500 ± 100 μm. The coating was then cured at 80°C for 1 hour. After peeling the coating from the stainless steel plate, it was cut to the specified dimensions (5mm x 40mm) using a cutter. The cut edges were then smoothed with sandpaper. This coating was measured using the tensile method at a frequency of 10 Hz using a dynamic thermomechanical analyzer (DMA) manufactured by Seiko Instruments, in accordance with JIS C6481. Tables 1 and 2 show the storage modulus at 50°C. Although not shown in Tables 1 and 2, the modulus of elasticity for Examples 1-6 did not change significantly at 0°C. Furthermore, when the temperature at which the loss modulus / storage modulus ratio obtained by DMA measurement was defined as the glass transition temperature, the glass transition temperature exceeded 50°C in all examples. On the other hand, the elastic modulus of Comparative Example 3 increased when the temperature was set to 0°C. Figure 1 shows the DMA charts for Examples 6 and 7 and Comparative Example 3.

[0049] <Evaluation of solvent resistance> (i) The prepared resin composition (sample) was applied as an adhesive to the LCP substrate. The application size was 2 mm in diameter. (ii) A 3.2 mm × 1.6 mm × 0.45 mm thick alumina chip was placed on the coated sample to prepare a test specimen. (iii) The test specimens were placed in an oven heated to 80°C and the samples were heated and cured for 30 minutes. (iv) The test specimens were impregnated in a glycol ether-based solvent at 50°C for 30 minutes, then removed from the solvent and rinsed with pure water. The rinsed test specimens were then dried at 80°C for 1 hour. (v) The shear strength of the dried test specimens was measured at room temperature. A value of 60N or higher was considered acceptable.

[0050] [Table 1]

[0051] [Table 2]

[0052] [Table 3]

[0053] As can be seen from Tables 1 and 2, in all of Examples 1 to 8, which used resin compositions containing components (A) to (C), the elastic modulus was 0.5 GPa or higher, and the drop impact resistance values ​​were also good. Among the examples with an elastic modulus of 0.5 GPa or higher, Examples 2, 6, and 7, which underwent solvent resistance testing, all had a shear strength of 100 N or higher in the evaluation of solvent resistance, and as shown in Table 3, it was confirmed that the evaluation results for solvent resistance were good. In contrast, Comparative Example 1, which did not contain component (A), had poor drop impact resistance. Comparative Example 2, which contained component (A), had a low elastic modulus at 50°C, and therefore had poor solvent resistance. Comparative Example 3, which did not contain component (A), had a low elastic modulus and therefore had poor solvent resistance.

[0054] The resin composition of the present invention is extremely useful because it exhibits excellent drop impact resistance and solvent resistance after curing. Furthermore, semiconductor devices and electronic components containing cured products of this resin composition have excellent resistance to drop impact and are highly reliable.

Claims

1. (A) Epoxy resin containing hydrogenated bisphenol A type epoxy resin, (B) Polyfunctional thiol resins (excluding compounds shown in general formula (4) below), and (C) Curing catalyst A resin composition containing, The storage modulus of the cured product at 50°C is 0.5 GPa or higher. The resin composition contains 65 parts by mass or more of (A) hydrogenated bisphenol A type epoxy resin per 100 parts by mass of epoxy resin. A resin composition characterized by the following. 【Chemistry 1】 〔In the general formula (4), R ３ , R ４ , R ５ and R ６ are each independently hydrogen or C ｎ H ２ｎ SH (n is 2 to 6), and at least one of R ３ , R ４ , R ５ and R ６ is C ｎ H ２ｎ SH (n is 2 to 6).〕

2. (A) Hydrogenated bisphenol A epoxy resin, (B) Polyfunctional thiol resins (excluding compounds shown in general formula (4) below), and (C) Curing catalyst A resin composition containing, The storage modulus of the cured product at 50°C is 0.5 GPa or higher. A resin composition characterized by having a content of (A) hydrogenated bisphenol A type epoxy resin of 10 to 70 parts by mass per 100 parts by mass of the resin composition (excluding cases where a rubber particle dispersion curable epoxy resin is included). 【Chemistry 2】 [In the above general formula (4), R ３ , R ４ , R ５ and R ６ Each of them is independently of hydrogen or C ｎ H ２ｎ SH (n is 2 to 6) and R ３ , R ４ , R ５ and R ６ At least one of them is C ｎ H ２ｎ SH (n is 2-6).

3. (A) Hydrogenated bisphenol A epoxy resin, (B) Polyfunctional thiol resins (excluding compounds shown in general formula (4) below), and (C) Curing catalyst A resin composition containing, The storage modulus of the cured product at 50°C is 0.5 GPa or higher. A resin composition characterized in that the content of (A) hydrogenated bisphenol A type epoxy resin is 20 to 70 parts by mass per 100 parts by mass of the resin composition. 【Transformation 3】 [In the above general formula (4), R ３ , R ４ , R ５ and R ６ Each of them is independently of hydrogen or C ｎ H ２ｎ SH (n is 2 to 6) and R ３ , R ４ , R ５ and R ６ At least one of them is C ｎ H ２ｎ SH (n is 2-6).

4. (B) The resin composition according to any one of claims 1 to 3, wherein the polyfunctional thiol resin does not have ester bonds in its molecule.

5. Furthermore, the resin composition according to any one of claims 1 to 4, wherein the elastic modulus at 20°C or higher and less than 50°C is 0.5 GPa or higher.

6. The resin composition according to any one of claims 1 to 5, wherein the glass transition temperature of the cured product exceeds 50°C.

7. An adhesive for electronic components comprising the resin composition according to any one of claims 1 to 6.

8. A cured product of the resin composition according to any one of claims 1 to 6.

9. A semiconductor device comprising the cured product described in claim 8.

10. An electronic component comprising a cured product according to claim 8, or a semiconductor device according to claim 9.

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