Thermal stimulation device
The thermal stimulation device addresses the complexity and inefficiency of conventional tei needles by using a grippable, heat-conductive structure with controlled heating, ensuring efficient and prolonged treatment without increased operator burden.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- 野澤 雅人
- Filing Date
- 2026-03-05
- Publication Date
- 2026-06-30
AI Technical Summary
Conventional tei needles require repeated operations to achieve sufficient stimulation, increasing operator burden and treatment time due to their complex structure.
A thermal stimulation device with a needle tip and heat supply unit, housed in a grippable metal and ceramic structure, allowing efficient thermal stimulation without significantly heating the gripping portion, and optionally detachable parts for varying sizes and shapes.
The device provides efficient stimulation with a simple structure, reducing operator burden and prolonging treatment time by stabilizing thermal application through controlled heating.
Smart Images

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