Thermal stimulation device

The thermal stimulation device addresses the complexity and inefficiency of conventional tei needles by using a grippable, heat-conductive structure with controlled heating, ensuring efficient and prolonged treatment without increased operator burden.

JP7882582B1Active Publication Date: 2026-06-30野澤 雅人

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
野澤 雅人
Filing Date
2026-03-05
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Conventional tei needles require repeated operations to achieve sufficient stimulation, increasing operator burden and treatment time due to their complex structure.

Method used

A thermal stimulation device with a needle tip and heat supply unit, housed in a grippable metal and ceramic structure, allowing efficient thermal stimulation without significantly heating the gripping portion, and optionally detachable parts for varying sizes and shapes.

Benefits of technology

The device provides efficient stimulation with a simple structure, reducing operator burden and prolonging treatment time by stabilizing thermal application through controlled heating.

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Abstract

The present invention provides a thermal stimulation device that has a simple structure while efficiently obtaining a stimulating effect, thereby preventing the burden on the practitioner and prolonging the treatment time. [Solution] The device comprises a needle tip 5, a heat supply unit 7 that supplies heat to the needle tip 5, a power supply unit 10 that supplies power to the heat supply unit 7, and a grippable rod-shaped body 2 that has the needle tip 5 at its tip and houses the heat supply unit 7 and the power supply unit 10.
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