Substrate transport apparatus and substrate transport method

Abstract

A substrate transfer device according to one or more embodiments includes a base 101, an elevator unit 111 connected to the base 101 so as to be able to move up and down, hand units 120 and 130 movably connected to the elevator unit 111 and configured to acquire the substrate 101, and a disk 140 provided at a position where the hand units 120 and 130 can move the substrate 101. The hand units 120 and 130 include an arm 120 rotatably connected to the elevator unit 111, and a hand 130 movably connected to the arm 120 and configured to acquire the substrate 101.

Description

Technical Field

[0002] , , , ,

[0003]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and more particularly, to a substrate transfer apparatus and a substrate transfer method for transferring a substrate including a semiconductor wafer or a liquid crystal substrate.

Background Art

[0002] When manufacturing a semiconductor device or a liquid crystal device, a plurality of manufacturing apparatuses including an apparatus for performing a process treatment such as element formation on a substrate and a substrate inspection apparatus are used. A substrate transfer apparatus is used to transfer a semiconductor wafer or a liquid crystal substrate between these manufacturing apparatuses. The substrate transfer apparatus includes an industrial robot, and in particular, an industrial robot used in a clean room where a semiconductor manufacturing apparatus is installed is called a clean robot. The clean robot takes out a substrate from a FOUP (Front Opening Unified Pod) on which a plurality of substrates are mounted and transfers it to a predetermined position in a substrate storage unit included in a manufacturing apparatus of the next process. At the time of this transfer, in order to recognize the position and orientation of the substrate, the substrate may be photographed with an imaging device such as a camera. The substrate transfer apparatus adjusts the position and orientation of the substrate based on the image of the imaging device and transfers it to a semiconductor manufacturing apparatus of the next process.

[0003] Japanese Public Publication JP-H10-329064 (Iwata) discloses a technology for transporting liquid crystal glass substrates using an industrial robot and recognizing the position of the liquid crystal glass substrates using a non-contact method with multiple corresponding cameras. In the above document, Iwata discloses an industrial robot that transports liquid crystal glass substrates and places them in a predetermined position on a substrate holder; an upward illuminator and a set of fixed cameras for the substrate holder located above the substrate holder at the mark recognition location where positioning marks are provided on the substrate holder; a set of fixed cameras for the liquid crystal glass substrate located above the liquid crystal glass substrate at the position recognition location where the position of the liquid crystal glass substrate is recognized; a downward illuminator located below the liquid crystal glass substrate; and a control device that commands the industrial robot to recognize the gripping position of the liquid crystal glass substrate while the robot is gripping the substrate, and commands the industrial robot to perform a difference correction operation between the gripping position recognition result and the position of the positioning marks on the substrate holder. [Overview of the Initiative] [Means for solving the problem]

[0004] A substrate transport device according to one or more embodiments includes a base, a lifting unit connected to the base so as to be able to move up and down, The lifting mechanism includes an arm that is rotatably connected to the lifting mechanism, and a hand that is movably connected to the arm and is used to acquire a circuit board. The lifting section is movably connected to the aforementioned lifting section, The aforementioned A hand unit for acquiring circuit boards, A camera positioned above the hand unit, The arm includes a light that illuminates the substrate with light. disc and The hand is positioned to overlap with the arm, and the disk is placed beneath the substrate that has been removed by the hand, and the camera captures an image of the substrate placed on the disk in order to recognize the position and orientation of the substrate. It may include. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a perspective view showing a substrate transport apparatus according to one or more embodiments. [Figure 2] Figure 2A is a top view showing a disk according to one or more embodiments, and Figure 2B is, for example, a cross-sectional view AA of the disk shown in Figure 2A. [Figure 3] Figure 3A is a top view showing a disk according to one or more embodiments, and Figure 3B is, for example, a cross-sectional view BB of the disk shown in Figure 3A. [Figure 4] Figure 4 is a flowchart showing the operation of a substrate transport device according to one or more embodiments. [Figure 5] Figure 5 is a perspective view showing a substrate transport apparatus according to one or more embodiments. [Figure 6] Figure 6 is a perspective view illustrating the state in which the removed substrate is transported onto a disk provided on the substrate transport device. [Figure 7] Figure 7 is a top view illustrating the state in which the removed substrate is transported onto a disk provided on the substrate transport device. [Figure 8] Figure 8 is a perspective view showing a substrate transport apparatus according to one or more embodiments. [Figure 9] Figure 9 is a perspective view showing a substrate transport apparatus according to one or more embodiments. [Figure 10] Figure 10 is a perspective view showing a substrate transport apparatus according to one or more embodiments. [Figure 11] Figure 11 is a perspective view showing a substrate transport apparatus according to one or more embodiments. [Modes for carrying out the invention]

[0007] A substrate transport apparatus according to one or more embodiments will be described in detail with reference to the drawings. In the drawings, identical or similar parts may be denoted by the same or similar reference numerals. The drawings are schematic, and the relationship between thickness and dimensions, and the ratios of length and thickness of each part are examples only and do not limit the technical concept of the present invention. The relationships and ratios of dimensions may differ between drawings. In the following description, when describing the positional relationship of each component, terms such as "top," "bottom," "right side," and "left side" will be used as appropriate based on the orientation of the drawing being referenced, but these indications do not limit the technical concept of the invention. Expressions such as "top," "bottom," "right side," and "left side" may be used even if the parts are not touching each other. "X-axis," "Y-axis," and "Z-axis" may be used in the specification or drawings to describe directions, and "XY plane," "YZ plane," and "ZX plane" may be used in the specification or drawings to describe planes corresponding to "X-axis," "Y-axis," and "Z-axis" in the figures. "Length direction" may mean the direction of the long side on the main surface of the member, and may mean the X direction in the drawing, or the opposite direction of the X direction. "Width direction" may refer to the direction of the shorter side on the main surface of the member, and may refer to the Y direction or the opposite direction of the Y direction in the drawing. "Height direction" or "up and down direction" may refer to the Z direction or the opposite direction of the Z direction in the drawing.

[0008] Figure 1 is a perspective view showing one or more embodiments of a substrate transport device 100. The substrate transport device 100 in Figure 1 specifically shows a horizontal articulated clean robot. This substrate transport device 100 includes a base 101 and a hand section including an arm 120 and a hand 130. The base 101 supports a lifting section 111. The lifting and lowering of the base 101 is controlled by a controller 200 that controls the substrate transport device 100. The base 101 may be fixed to the floor surface on which the substrate transport device 100 is installed, or it may be fixed to other semiconductor manufacturing equipment. The lifting section 111 raises and lowers the arm 120 in the Z-axis direction. The arm 120 is rotatably attached to the lifting section 111. The lifting section 111 may be cylindrical or rectangular.

[0009] The arm 120 is mounted so as to be movable in the vertical direction by the lifting unit 111. The arm 120 is rotatably mounted relative to the lifting unit 111. The arm 120 may also be a horizontally articulated arm. The arm 120 includes a first arm 121 and a second arm 122.

[0010] The first arm 121 is mounted between the lifting unit 111 and the second arm 122. The first end of the first arm 122 is provided so as to be able to move up and down in the Z direction as shown in the figure by the lifting unit 111. The first arm 121 is mounted so as to be able to rotate in the XY plane as shown in the figure, with the lifting unit 111 as the center. The second arm 122 is rotatably mounted to the second end of the first arm 121. The axis of rotation of the arm 120 may be located approximately in the center of the cross-section of the XY plane of the lifting unit 111.

[0011] The second arm 122 is mounted between the first arm 121 and the hand 130. The first end of the second arm 122 is rotatably mounted to the first arm 121 in the XY plane shown in the figure. The hand 130 is rotatably mounted to the second end of the second arm 122.

[0012] The hand 130 includes a wrist portion 131 and a fork 132, and is rotatably attached to the second arm 122 via the wrist portion 131. The wrist portion 131 is rotatably attached to the second end of the second arm 122 in the illustrated XY plane. The hand 130 uses the fork 132 to acquire substrates W from a Front Opening Unified Pod (FOUP) on which multiple substrates such as wafers are mounted. The hand 130 then transports the acquired substrates W to a predetermined position in the substrate storage section included in the manufacturing apparatus.

[0013] The hand 130 shown in Figure 1 is a vacuum hand type, and the fork 132 of the hand 130 has a branched structure and a suction part at its tip. The fork 132 conveys the substrate W by sucking its surface with negative pressure. Suction type hands include, for example, Bernoulli chucks.

[0014] The hand 130 is not limited to a vacuum hand type, but may also be a passive grip type or an edge grip type. A passive grip type hand is a grip that does not fix the substrate placed on the hand, and does not have a pressing member. In the edge grip type, edge guides are provided at each of the branched ends of the fork. A pressing member is provided near the wrist. The pressing member can slide along the surface of the hand by an actuator including a pneumatic cylinder. By sliding the pressing member with the substrate placed on the fork, the substrate is held by being sandwiched between the edge guide and the pressing member. In any configuration, the hand 130 has a configuration for supporting the substrate W and transporting the substrate W.

[0015] Each of the lifting unit 111, the first arm 121, the second arm 122, and the hand 130 may be driven by the controller 200. Each of the lifting unit 111, the first arm 121, the second arm 122, and the hand 130 may be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. Encoders (not shown) for detecting the rotational position of the first arm 121, the second arm 122, and the hand 130 may be attached to the arm joints located between the lifting unit 111 and the first arm 121, between the first arm 121 and the second arm 122, and between the second arm 122 and the hand 130. The substrate transport device 100 may also be provided with an encoder (not shown) for detecting the change in position of the first arm 121 in the height direction, for example, the amount of lifting of the first arm 121 of the lifting unit 111. In this way, the joints of the arm 120 and hand 130 are controlled to transport the substrate W.

[0016] The controller 200 is connected to the base 101 and performs various controls including the arm position control of the substrate transfer device 100. The controller 200 controls the operations of the actuators that drive the elevating unit 111, the first arm 121, the second arm 122, and the hand 130 respectively. The control of these actuators may be performed based on the position information including the rotational position or the height position of the first arm 121, the second arm 122, or the hand 130 detected by an encoder (not shown). The controller 200 is provided as a separate housing from the base 101, but the controller 200 and the base 101 may be provided as one housing. Further, the controller 200 only needs to be able to perform various controls of the substrate transfer device 100, and can be connected and controlled to the substrate transfer device 100 by a wired connection or a wireless connection. The controller 200 does not need to be arranged in the vicinity of the substrate transfer device 100. For example, it can be connected via the Internet to perform various controls of the substrate transfer device 100.

[0017] The controller 200 may be, for example, a computer including a CPU (Central Processing Unit). The computer reads a computer program stored in a recording medium and performs various controls of the substrate transfer device 100. As the recording medium, in addition to a "non-transitory computer-readable storage medium", for example, a ROM (Read Only Memory), a tape, a disk, a card, a semiconductor memory, a programmable logic circuit, etc. can be used. Further, the computer may further include a RAM (Random Access Memory) that develops the above program. Further, the above program may be supplied to the above computer via any transmission medium (communication network, broadcast wave, etc.) capable of transmitting the program. Note that the above program may also be realized in the form of a data signal embedded in a carrier wave embodied by electronic transmission.

[0018] The substrate transport device 100 includes a disk 140. The disk 140 is located on the upper part of the first end of the second arm 122. The disk 140 may be positioned at a predetermined distance from the rotation axis (not shown) of the hand 130, taking into consideration the handling of the hand 130. The hand 130 picks up the substrate W and moves the substrate W above the disk 140. After picking up the substrate W, the hand 130 rotates in the XY plane shown in the figure and moves approximately parallel to the second arm 122. When the substrate W is moved onto the first end of the second arm 122, the disk 140 is positioned approximately below the substrate W in the Z-axis direction shown in the figure. The shape of the disk 140 shown in Figure 1 is circular, but it is not limited to this and can be implemented in any way. The shape and dimensions of the disk 140 may be determined considering the shape and dimensions of the substrate W to be transported and the environment in which the substrate transport device 100 is installed. For example, the shape and dimensions of the disk 140 may be approximately the same as the shape and dimensions of the substrate W to be transported. If the shape of the substrate W is approximately circular, the disk 140 may also be approximately circular. Regarding the dimensions of the disk, the diameter may be 50 mm or more and 500 mm or less, or 200 mm or more and 400 mm or less. Depending on the size of the substrate, it may also be 500 mm or more. For example, if the substrate W is 300 mm, the disk may be 300 mm or more. Also, the substrate transport device 100 in Figure 1 includes a 2-link arm with two arms, but is not limited to this, and the number of arms may be one, three, four, or more. The disk may be provided at the end of an arm to which a hand is not connected. In the case of multiple arms, the disk may be placed at the end of an arm connected to a hand, on the opposite side of the arm in the longitudinal direction from the end connected to the hand. In other words, in the case of multiple arms, the disk may be placed at the end of an arm connected to a hand, on the end not connected to a hand. The disk may also be provided on an arm to which a hand is not connected. For example, in the substrate transport device 100 shown in Figure 1, the disk 140 may be provided on the first arm 121. For example, the disk 140 may be provided near the first end of the first arm 121.

[0019] Figures 2A and 2B show disks according to one or more embodiments. In the disk 141 shown in Figure 2A, multiple lights 143 are provided inside the disk 141. The multiple lights 143 are provided on the surface of the disk 141. The multiple lights 143 can be any light-emitting material, such as LEDs (Light Emitted Diodes) or fluorescent lamps. Figure 2B is a cross-sectional view AA of the disk 141. In the disk 141, multiple lights 143 are installed on the disk body 145. A cover 147 is provided to cover the multiple lights 143. The cover 147 is made of a transparent or translucent material that transmits or partially transmits the light from the lights 143. This allows the light from the multiple lights 143 to be emitted to the outside of the disk 141. In the embodiment of Figure 2A, multiple lights 143 that are small compared to the disk 141 are provided, but this is not limited to this, and lights that are approximately the same size as the disk 141 may be provided inside the disk body 145. This allows for a uniform amount of light to be obtained. Furthermore, although the disc 141 is provided with a transparent or translucent cover 147, it is not limited to this, and for example, the light may be exposed to the outside without a cover.

[0020] Figures 3A and 3B are diagrams showing a disk 142 according to one or more embodiments. The disk 142 shown in FIG. 3A has a plurality of lights 143 provided inside the disk 142. The plurality of lights 143 are provided on the surface of the disk 142 and arranged along the outer periphery of the disk 142. The plurality of lights 143 may be any light-emitting ones, such as LEDs (Light Emitted Diodes) or fluorescent lamps. FIG. 3B is a cross-sectional view taken along the line B-B of the disk 142. A plurality of lights 143 are installed on the outer peripheral portion of the disk body 148 of the disk 142. A cover 149 is provided so as to cover the plurality of lights 143. The cover 149 is a transparent or translucent member that transmits or partially transmits the light of the lights 143. Thereby, the light from the plurality of lights 143 can be emitted to the outside of the disk 142. In the embodiment of FIG. 3A, a plurality of lights 143 smaller than the disk 142 are provided, but it is not limited thereto, and lights substantially the same size as the disk 142 may be provided on the inner outer peripheral portion of the disk body 148. Thereby, a uniform light amount can be obtained on the outer peripheral portion of the disk 142. Further, although the disk 142 is provided with a transparent or translucent cover 149, it is not limited thereto. For example, the lights may be exposed to the outside without providing a cover.

[0021] Here, the light 143 may be controlled to be turned on and off. That is, the light 143 may be turned on only when the substrate W is moved onto the disk 140 and imaging is performed by a camera (not shown), and the light 143 may be turned off when the imaging by the camera is completed. By doing so, not only can low power consumption be achieved, but it may also be possible to mitigate possible deterioration of the substrate by the light 143. Further, the intensity of the light of the light 14 may be made changeable. Thereby, a clear image can be obtained by the camera regardless of the environment of the substrate transfer device 100. Further, the color temperature of the light of the light 143 may be about 2,600K to 7,100K. It can be selected according to the environment of the substrate transfer device and the characteristics of the substrate used, such as amber color, bulb color, warm white, white, daylight white, daylight color, etc.

[0022] Next, the operation of the substrate transport device 100 will be explained with reference to the drawings. Figure 4 is a flowchart showing the operation of the substrate transport device 100 according to one or more embodiments. First, the substrate transport device 100 removes the substrate from the FOUP, etc. (step S101). The substrate W is removed using the fork 132 provided on the hand 130 of the substrate transport device 100. Next, the removed substrate W is transported onto the disk 140 provided on the substrate transport device 100 (step S10 3 ). The disk 140 is mounted on the arm 120 of the substrate device 100. The hand 130 that picked up the substrate W is rotated to move the substrate W onto the disk 140 mounted on the arm 120 of the substrate transport device 100. Next, the substrate W is imaged with a camera (not shown) (step S105). When imaging, a light (not shown) provided on the disk 140 is turned on and shines on the substrate W. This makes it possible to obtain a clearer image. The light (not shown) may be turned on only when imaging the substrate W and turned off at other times. This may reduce power consumption and extend the life of the light (not shown). It may also reduce the deterioration of the substrate W that may be caused by light. The camera (not shown) may capture either still images or videos. Here, the objects to be detected by the camera (not shown) include the position of the substrate W, the orientation of the substrate W, detection of defective substrates W, and recognition of the type of substrate W. Next, the position of the substrate W is calculated based on the captured image (step S107). To calculate the position of the substrate W, for example, the positions of notches and orientation flats on the substrate W are obtained from captured images, and a correction amount for the position of the substrate W is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork 132. For the measurement and correction of the misalignment of the substrate W, refer to US Patent Publication 2021 / 0257242. Next, the substrate W is placed on the manufacturing apparatus for the next process based on the calculated correction amount (step S109).

[0023] As described above, according to one or more embodiments of the substrate transport device 100, when acquiring an image of the substrate used for correcting the substrate's position, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is mounted on the arm of the substrate transport device, the distance the disk travels can be shortened, and the disk travel time can be reduced. In addition, since the imaging location is on the upper part of the arm, the detection of the substrate's position and orientation is improved.

[0024] Figure 5 is a perspective view showing a substrate transport device 300 according to one or more embodiments. The substrate transport device 300 in Figure 5 particularly shows a horizontal articulated clean robot. This substrate transport device 300 includes a base 301 and a hand section including an arm 320 and a hand 330. The substrate transport device 300 may have a lifting section. The lifting section may connect the arm 320 so that it can be raised and lowered in the Z-axis direction shown in the figure. The base 301 may be connected to a controller (not shown) that controls the substrate transport device 300. The base 301 may be fixed to the floor surface on which the substrate transport device 300 is installed, or it may be fixed to other semiconductor manufacturing equipment. The lifting section (not shown) raises and lowers the arm 320 to move it in the Z-axis direction. The arm 320 is rotatably attached to the lifting section (not shown). Here, if the substrate W does not need to move in the Z-axis direction shown in the figure, the lifting section (not shown) is not necessary.

[0025] The arm 320 is mounted so as to be movable in the vertical direction by a lifting mechanism (not shown). The arm 320 is mounted so as to be rotatable in the XY plane shown in the figure by the lifting mechanism (not shown). The arm 320 may also be a horizontally articulated arm. The arm 320 includes a first arm 321 and a second arm 322.

[0026] The hand 330 is rotatably attached to the second arm 322 via a wrist portion 331. The wrist portion 331 is rotatably attached to the second end of the second arm 322 in the illustrated XY plane. The hand 330 takes out a substrate W such as a wafer from a FOUP (Front Opening Unified Pod) on which multiple substrates are mounted, and transports it to a predetermined position in the substrate storage section included in the manufacturing apparatus. The hand 330 includes suction portions 333A and 333B for sucking up the substrate W, and the substrate W is sucked onto the fork 332 by the suction portion, and has a vacuum hand for moving the substrate. The vacuum hand can reduce the obstruction of light from the disk 340 compared to the edge grip hand. To reduce this obstruction of light, the fork 332 of the hand 330 may be equipped with a light (not shown). When the disk 340 is used as a backlight to illuminate the substrate W, the fork will obstruct the light. To The light is installed to illuminate the circuit board. This allows the light from the light source to compensate for the light from the disc 340 even if the fork blocks the light.

[0027] The disk 340 is provided on the upper part of the first end of the second arm 322. The disk 340 may be, for example, the disks shown in Figures 2A, 2B, 3A, and 3B.

[0028] Next, the operation of the substrate transport device 300 will be described in detail with reference to the drawings. As shown in Figure 5, the substrate transport device 300 first removes the substrate W from a FOUP (not shown) or the like. When removing the substrate W, the substrate transport device 300 controls the position of the hand 330 to move it to a predetermined position on the FOUP (not shown) and removes the substrate. Next, the removed substrate W is transported onto a disk 340 provided on the substrate transport device 300.

[0029] Figure 6 is a perspective view illustrating the state in which the removed substrate W is transported onto a disk 340 provided on the substrate transport device 300. The hand 330 rotates in the XY plane and moves the substrate W onto the disk 340. As shown in the figure, the disk 340 is positioned approximately above the substrate W. Next, the substrate W is imaged by the camera 350. When imaging, a light (not shown) provided on the disk 340 is turned on and illuminates the substrate. This makes it possible to obtain a clearer image. The light may be turned on only when imaging the substrate and turned off at other times. This may reduce power consumption and extend the life of the light (not shown). The camera 350 may capture either still images or videos. Here, the detection targets of the camera 350 include the position of the substrate, the orientation of the substrate, detection of defective substrates, and recognition of the type of substrate. Next, the position of the substrate is calculated based on the captured image. To calculate the position of the substrate, for example, the positions of the substrate's notches and orientation flats are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate relative to the position and orientation of the fork. Next, based on the calculated correction amount, the substrate is placed in the substrate storage section of the manufacturing equipment for the next process. The position of the camera 350 only needs to be such that the substrate W can be captured. The camera 350 may also be placed above the movement range of the disk 340. In this way, the movement of the disk can be minimized. As a result, the disk movement time can be minimized, and the throughput of substrate transport can be improved.

[0030] Figure 7 is a top view illustrating the state in which the removed substrate W is transported onto a disk 340 provided on the substrate transport device 300. In the example in Figure 6, the hand 330 and the second arm 322 overlap, and the substrate W is moved to the top surface of the disk 340. In the example in Figure 7, the hand 330, the second arm 322, and the first arm 321 overlap, and the substrate W is moved to the top surface of the disk 340. For example, the hand 330 rotates in the XY plane and moves the substrate W onto the disk 340. After that, the second arm 322 moves onto the first arm 321. As shown in the figure, the disk 340 is positioned approximately above the substrate W. If the light (not shown) on the disk 340 is turned on and the first arm 321, which images the substrate W with a camera (not shown), is in the same position, the position of the disk 340 in the arrangement shown in Figure 6 and the position of the disk 340 in the arrangement shown in Figure 7 will be the same. This increases the flexibility in camera placement, and allows cameras to be positioned near the substrate transport device 300. This, in turn, increases the flexibility of the floor plan.

[0031] According to one or more embodiments of the substrate transport device, by positioning the camera 350 at a predetermined location on the top of the disk 340, the procedure of moving the substrate W to a station equipped with a camera in order to recognize its position and orientation becomes unnecessary. This reduces the time required to place the substrate W on the hand, recognize its position and orientation, and move it to a predetermined device, thereby maintaining high throughput. Furthermore, since there is no need to provide a station equipped with a camera, it contributes to space saving. In addition, since there is no need to provide a station, the cleanroom environment can be improved. Moreover, by providing a disk including lighting on the arm, the degree of design freedom is increased, and the camera can be positioned closer to the substrate transport device.

[0032] Figure 8 is a perspective view showing a substrate transport device 400 according to one or more embodiments. The substrate transport device 400 in Figure 8 shows a horizontal articulated clean robot, and in particular shows a part of a clean robot with a column-type lifting axis. This substrate transport device 400 includes a lifting column 401, a lifting section 411, and a hand section including an arm 420 and a hand 430. The lifting column 401 supports the lifting section 411 so that it can move up and down. The lifting section 411 is controlled to move up and down by a controller (not shown) that controls the substrate transport device 400. The lifting column 401 may be fixed to the floor surface on which the substrate transport device 400 is installed, or it may be fixed to other semiconductor manufacturing equipment (not shown). The lifting section 411 moves the arm 420 up and down (in the Z-axis direction) along a groove provided in the lifting column 401. The arm 420 is rotatably attached to the lifting section 411. Considering the rotation of the arm 420, the rotation axis of the arm 420 (not shown) and the lifting support column 401 are spaced at a predetermined distance. The lifting support column 401 in Figure 8 has a rectangular parallelepiped structure with grooves for the movement of the lifting section 411, but is not limited to this. For example, it may have a cylindrical structure with grooves for the movement of the lifting section 411.

[0033] The lifting section 411 moves up and down in the vertical direction (Z-axis direction), and the arm 420 is mounted to be movable vertically. The arm 420 is rotatably mounted on the lifting section 411. The arm 420 may be a horizontal multi-jointed arm. The arm 420 includes a first arm 421 and a second arm 422. The axis of rotation of the arm 420 may be located approximately in the center of the arm 420. This makes it possible to minimize the distance between the arm 420 and the lifting support column 401 while avoiding contact with the lifting support column 401 due to the rotational movement of the arm 420.

[0034] The first arm 421 is mounted between the lifting section 411 and the second arm 422. The first end of the first arm 421 is provided by the lifting section 411 so as to be able to move up and down in the Z direction as shown in the figure. The first arm 421 is mounted so as to be able to rotate in the XY plane as shown in the figure. The second arm 422 is attached to the second end of the first arm 421.

[0035] The second arm 422 is mounted between the first arm 421 and the hand 430. The first end of the second arm 422 is rotatably mounted to the first arm 421 in the XY plane shown in the figure. The hand 430 is attached to the second end of the second arm 422.

[0036] The hand 430 includes a wrist portion and a fork, and is rotatably mounted on the second arm 422 via the wrist portion in the illustrated XY plane. The wrist portion is rotatably mounted on the second end of the second arm 422 in the illustrated XY plane. The hand 430 uses the fork to acquire substrates W from a FOUP (Front Opening Unified Pod) on which multiple substrates such as wafers are mounted. The hand 430 then transports the acquired substrates W to a predetermined position in the substrate storage section included in the manufacturing apparatus.

[0037] The fork of the hand 430 shown in Figure 8 may be an edge-grip type with a branched structure, for example, as shown in Figure 5. Furthermore, the hand 430 is not limited to the edge-grip type; it may also be a passive-grip type or a suction type. The hand 430 supports the substrate W and transports the substrate W.

[0038] The operation of the lifting unit 411, the first arm 421, the second arm 422, and the hand 430 is controlled by a controller (not shown). The lifting unit 411, the first arm 421, the second arm 422, and the hand 430 may each be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. Encoders (not shown) for detecting the rotational position of the first arm 421, the second arm 422, and the hand 430 may be attached to the arm joints located between the lifting unit 411 and the first arm 421, between the first arm 421 and the second arm 422, and between the second arm 422 and the hand 430. The substrate transport device 400 may also be provided with an encoder (not shown) for detecting the change in position of the first arm 421 in the height direction, for example, the amount of lifting of the first arm 421 of the lifting unit 411. In this way, the joints of the arm 420 and hand 430 are controlled to transport the circuit board.

[0039] The substrate transport device 400 includes a disk 440. The disk 440 is provided on the upper part of the first end of the first arm 421. Considering the handling of the arm 420 and hand 430, the disk 440 may be provided at a predetermined distance from the rotation axis (not shown) of the second arm. After the hand 430 picks up the substrate W, it rotates in the illustrated XY plane around the rotation axis of the second end of the second arm 422, and the first arm 421 rotates in the illustrated XY plane to position the substrate W so that it is approximately above the disk 440 in the illustrated Z-axis direction. The shape of the disk 440 shown in Figure 8 is circular, but it is not limited to this and can be implemented in other shapes. The shape and dimensions of the disk 440 may be the same as in the embodiments described above. Also, the substrate transport device 400 in Figure 8 includes a two-link arm with two arms, but it is not limited to this, and the number of arms may be one, three, four, or more. The disk may be provided at the end of an arm to which a hand is not connected. In the case of multiple arms, the disc may be placed on the arm connected to the hand, at the end opposite to the end connected to the hand in the longitudinal direction of the arm. In other words, in the case of multiple arms, the disc may be placed on the end of the arm connected to the hand that is not connected to the hand. The disc may also be provided in the lifting mechanism.

[0040] Next, the operation of the substrate transport device 400 will be explained. The substrate transport device 400 may also operate as shown in the flowchart in Figure 4. That is, the substrate transport device 400 first removes the substrate W from the FOUP, etc. (step S101). The substrate W is removed using the fork provided on the hand 430 of the substrate transport device 400. Next, the removed substrate W is transported onto the disk 440 provided on the substrate transport device 400 (step S10 3). The disk 440 is provided on the first arm 421 of the substrate transport device 400. The hand 430 that picked up the substrate W rotates in the XY plane shown in the figure and moves the substrate W onto the disk 440 provided on the first arm 421. Next, the substrate W is imaged with a camera (not shown) (step S105). When imaging, a light (not shown) provided on the disk 440 may be turned on and illuminated onto the substrate W. The light and camera provided on the disk 440 may be the same as those in the embodiment described above. Next, the position of the substrate W is calculated based on the image taken (step S107). In order to calculate the position of the substrate, for example, the positions of notches and orientation flats of the substrate W are obtained from the image taken, and the correction amount for the position of the substrate is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of the misalignment of the substrate W, refer to US Patent Publication 2021 / 0257242. Next, the substrate is placed on the manufacturing equipment for the next process based on the calculated correction amount (step S109).

[0041] As described above, according to one or more embodiments of the substrate transport device 400, when acquiring an image of the substrate used for position correction of the substrate W, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is mounted on the arm of the substrate transport device, the distance the disk travels can be shortened, and the disk travel time can be shortened. In addition, since the imaging location is on the upper part of the arm, the detection of the position and orientation of the substrate is improved.

[0042] Figure 9 is a perspective view showing a substrate transport device 500 according to one or more embodiments. The substrate transport device 500 in Figure 9 shows a horizontal articulated clean robot, and in particular shows a part of a clean robot with a column-type lifting axis. This substrate transport device 500 includes a lifting column 501, a lifting unit 511, and a hand unit including an arm 520 and a hand 530. The lifting column 501 supports the lifting unit 511 so that it can move up and down in the Z-axis direction shown in the figure. The lifting unit 511 is controlled to move up and down by a controller (not shown) that controls the substrate transport device 500. The lifting column 501 may be fixed to the floor surface on which the substrate transport device 500 is installed, or it may be fixed to other semiconductor manufacturing equipment (not shown). The lifting unit 511 moves the arm 520 up and down in the Z-axis direction shown in the figure along a groove provided in the lifting column 501. The arm 520 is rotatably attached to the lifting unit 511. The lifting support column 501 in Figure 9 has a rectangular parallelepiped structure with grooves for the movement of the lifting section 511, but it is not limited to this. For example, it may have a cylindrical structure with grooves for the movement of the lifting section 511.

[0043] The lifting section 511 moves up and down, and the arm 520 is mounted to move up and down. The arm 520 is rotatably mounted to the lifting section 511. The arm 520 may be a horizontally articulated arm. The arm 520 includes a first arm 521 and a second arm 522.

[0044] The first arm 521 is mounted between the lifting section 511 and the second arm 522. The first end of the first arm 521 is rotatably mounted to the lifting section 511 in the XY plane as shown in the figure. The second arm 522 is attached to the second end of the first arm 521.

[0045] The second arm 522 is mounted between the first arm 521 and the hand 530. The first end of the second arm 522 is rotatably mounted to the second end of the first arm 521 in the illustrated XY plane. The hand 530 is attached to the second end of the second arm 522.

[0046] The hand 530 includes a wrist portion and a fork. The hand 530 is rotatably mounted on the second end of the second arm 522 via the wrist portion in the illustrated XY plane. The hand 530 uses the fork to acquire substrates W from a FOUP (Front Opening Unified Pod) on which multiple substrates such as wafers are mounted. The hand 530 then transports the acquired substrates W to a predetermined position in the substrate storage section included in the manufacturing apparatus.

[0047] The fork of the hand 530 shown in Figure 9 may be an edge-grip type having a branched structure as shown in Figure 5, for example. Furthermore, the hand 530 is not limited to the edge-grip type, but may also be a passive-grip type or a suction type. The hand 530 supports the substrate W and transports the substrate W.

[0048] The operation of the lifting unit 511, the first arm 521, the second arm 522, and the hand 530 is controlled by a controller (not shown). The lifting unit 511, the first arm 521, the second arm 522, and the hand 530 may each be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. Encoders (not shown) for detecting the rotational position of the first arm 521, the second arm 522, and the hand 530 may be attached to the arm joints located between the lifting unit 511 and the first arm 521, between the first arm 521 and the second arm 522, and between the second arm 522 and the hand 530. The substrate transport device 500 may also be provided with an encoder (not shown) for detecting the change in position of the first arm 521 in the height direction, for example, the amount of lifting or lowering of the first arm 521 of the lifting unit 511. In this way, the joints of the arm 520 and hand 530 are controlled to transport the circuit board.

[0049] The substrate transport device 500 includes a disk 540. The disk 540 is provided on the upper part of the lifting unit 511. The disk 540 may be provided at a predetermined distance from the rotation axis of the arm 520, taking into consideration the handling of the arm 520 and the hand 530. The hand 530 picks up the substrate W and moves the substrate W above the disk 540. For example, after picking up the substrate W, the hand 530 rotates in the illustrated XY plane and moves approximately parallel to the second arm 522. The second arm 522 rotates in the illustrated XY plane and moves approximately parallel to the first arm 521. The first arm 521 rotates in the illustrated XY plane and moves approximately parallel to the lifting unit 511. When the substrate W is moved onto the lifting unit 511, the disk 540 is positioned approximately below the substrate W in the illustrated Z-axis direction. The shape of the disk 540 shown in Figure 9 is circular, but it is not limited to this and can be implemented in other shapes. The shape and dimensions of the disk 540 may be the same as those of the embodiments described above. Also, the substrate transport device 500 in Figure 9 includes a two-link arm with two arms, but is not limited to this, and the number of arms may be one, three, four, or more. The disk 540 is provided on the lifting section 511, but is not limited to this. The disk may be provided at the end of an arm to which a hand is not connected. In the case of multiple arms, the disk may be placed at the end of an arm connected to a hand, on the opposite end of the arm in the longitudinal direction from the end connected to the hand. In other words, in the case of multiple arms, the disk may be placed at the end of an arm connected to a hand, on the end not connected to the hand.

[0050] Next, the operation of the substrate transport device 500 will be explained. The substrate transport device 500 may also operate as shown in the flowchart in Figure 4. That is, the substrate transport device 500 first removes the substrate W from the FOUP, etc. (step S101). The substrate W is removed using the fork provided on the hand 530 of the substrate transport device 500. Next, the removed substrate W is transported onto the disk 540 provided on the substrate transport device 500 (step S10 3). The disk 540 is provided on the lifting section 511. The hand 530 that picked up the substrate W is rotated to move the substrate W onto the disk 540 provided on the lifting section 511 of the substrate transport device 500. Next, the substrate W is imaged with a camera (not shown) (step S105). When imaging, a light (not shown) provided on the disk 540 may be turned on to illuminate the substrate W. The light and camera provided on the disk 540 may be the same as those in the embodiment described above. Next, the position of the substrate W is calculated based on the image taken (step S107). In order to calculate the position of the substrate, for example, the positions of the notches and orientation flats of the substrate W are obtained from the image taken, and the correction amount for the position of the substrate is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of the misalignment of the substrate W, refer to US Patent Publication 2021 / 0257242. Next, the substrate is placed on the manufacturing apparatus for the next process based on the calculated correction amount (step S109).

[0051] As described above, according to one or more embodiments of the substrate transport device 500, when acquiring an image of the substrate used for position correction of the substrate W, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is provided on the arm of the substrate transport device, the distance the disk travels can be shortened, and the disk travel time can be shortened. In addition, since the imaging location is on the upper part of the arm, the detection of the position and orientation of the substrate is improved. Furthermore, by providing the disk 540 on the lifting section 511, an unexpected effect is obtained in which the amount of light seen from the substrate W is stabilized.

[0052] Figure 10 is a perspective view showing a substrate transport device 600 according to one or more embodiments. The substrate transport device 600 in Figure 10 shows a horizontal articulated clean robot, and in particular shows a part of a clean robot in which the lifting column 601 is of the column type and the hand 630 is directly connected to the lifting unit 611. This substrate transport device 600 includes a lifting column 601, a lifting unit 611, and a hand 630. The lifting column 601 supports the lifting unit 611. The lifting unit 611 is controlled to move up and down by a controller (not shown) that controls the substrate transport device 600. The lifting column 601 may be fixed to the floor surface on which the substrate transport device 600 is installed, or it may be fixed to other semiconductor manufacturing equipment (not shown). The lifting unit 611 moves the hand 630 up and down (in the Z-axis direction) along a groove provided in the lifting column 601. The hand 630 is rotatably mounted on the lifting unit 611 in the XY plane shown in the figure. The lifting support column 601 in Figure 10 has a rectangular parallelepiped structure with grooves for the movement of the lifting unit 611, but is not limited to this. For example, it may have a cylindrical structure with grooves for the movement of the lifting unit 611.

[0053] The lifting unit 611 moves up and down, and the hand 630 is mounted to be able to move up and down. The hand 630 is mounted to the lifting unit 611 so as to be able to rotate in the XY plane as shown in the figure.

[0054] The hand 630 includes a wrist portion and a fork, and is rotatably mounted to the lifting unit 611 via the wrist portion in the illustrated XY plane. The hand 630 uses the fork to acquire substrates W from a FOUP (Front Opening Unified Pod) on which multiple substrates such as wafers are mounted. The hand 630 then transports the acquired substrates W to a predetermined position in the substrate storage unit included in the manufacturing apparatus.

[0055] The fork of the hand 630 shown in Figure 10 may be an edge-grip type with a branched structure, for example, as shown in Figure 5. Furthermore, the hand 630 is not limited to the edge-grip type; it may also be a passive-grip type or a suction type. The hand 630 supports the substrate W and transports the substrate W.

[0056] The operation of the lifting unit 611 and the hand 630 is controlled by a controller. The lifting unit 611 and the hand 630 may also be driven by actuators (not shown). These actuators may include, for example, electric motors. An encoder (not shown) for detecting the rotational position of the hand 630 may be attached to the arm joint located between the lifting unit 611 and the hand 630. The substrate transport device 600 may also be provided with an encoder (not shown) for detecting changes in the position of the hand 630 in the height direction, for example, the amount of lifting or lowering of the hand 630 on the lifting unit 611. In this way, the joints of the hand 630 are controlled to transport the substrate.

[0057] The substrate transport device 600 includes a disk 640. The disk 640 is provided on the upper part of the lifting unit 611. The disk 640 may be provided at a predetermined distance from the hand rotation axis (not shown) to allow for handling of the hand 630. The hand 630 picks up the substrate W and moves the substrate W above the disk 640. For example, after picking up the substrate W, the hand 630 rotates in the XY plane shown in the figure and moves approximately parallel to the lifting unit 611. When the substrate W is moved onto the lifting unit 611, the disk 640 is positioned approximately below the substrate W in the Z-axis direction shown in the figure. The shape of the disk 640 shown in Figure 10 is circular, but it is not limited to this and can be implemented in other shapes. The shape and dimensions of the disk 640 may be the same as in the embodiments described above.

[0058] Next, the operation of the substrate transport device 600 will be explained. The substrate transport device 600 may also operate as shown in the flowchart in Figure 4. That is, the substrate transport device 600 first removes the substrate W from the FOUP, etc. (step S101). The substrate W is removed using the fork provided on the hand 630 of the substrate transport device 600. Next, the removed substrate W is transported onto the disk 640 provided on the substrate transport device 600 (step S10 3). The disk 640 is provided on the lifting section 611. The hand 630 that picked up the substrate W is rotated to move the substrate W onto the disk 640 provided on the lifting section 611 of the substrate transport device 600. Next, the substrate W is imaged with a camera (not shown) (step S105). When imaging, a light (not shown) provided on the disk 640 may be turned on to illuminate the substrate W. The light and camera provided on the disk 640 may be the same as those in the embodiment described above. Next, the position of the substrate W is calculated based on the image (step S107). In order to calculate the position of the substrate, for example, the positions of the notches and orientation flats of the substrate W are obtained from the image, and the correction amount for the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of the misalignment of the substrate W, refer to US Patent Publication 2021 / 0257242. Next, the substrate is placed on the manufacturing apparatus for the next process based on the calculated correction amount (step S109).

[0059] As described above, according to one or more embodiments of the substrate transport device 600, when acquiring an image of the substrate used for position correction of the substrate W, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is provided on the substrate transport device 600, the distance the disk travels can be shortened, and the disk travel time can be shortened. In addition, since the imaging location is on the upper part of the arm, detection of the position and orientation of the substrate is improved. Furthermore, by providing the disk 640 on the lifting section 611, an unexpected effect is obtained in which the amount of light seen from the substrate W is stabilized. For structural examples and operational examples of the embodiments shown in Figure 10, please refer to US Patent No. 8746631 and US Patent No. 10083851.

[0060] Figure 11 is a perspective view showing a substrate transport device 700 according to one or more embodiments. The substrate transport device 700 in Figure 11 shows a horizontal articulated clean robot, and in particular, a part of a clean robot in which the lifting column 701 is of column type and the hand 730 is directly connected to the first lifting unit 711. This substrate transport device 700 is similar to the substrate transport device 600 shown in Figure 10, but differs in that the disk 740 is held in a disk holding unit 712. The disk holding unit 712 is connected to a groove provided in the lifting column 701, and the disk 740 is positioned at a predetermined distance from the lifting column 701. The disk holding unit 712 is positioned lower than the first lifting unit 711, but is not limited to this, and the disk holding unit 712 may be positioned higher than the first lifting unit 711. Also, the disk holding unit 712 is positioned near the first lifting unit 711. The disk holding section 712 may be configured to move up and down in the Z-axis direction as the first lifting section 711 moves.

[0061] The operation of the first lifting unit 711 and the hand 730 is controlled by a controller (not shown). Furthermore, the first lifting unit 711 and the hand 730 may be driven by an actuator (not shown). The actuator (not shown) may include, for example, an electric motor. 1 An encoder (not shown) for detecting the rotational position of the hand 730 may be attached to the arm joint located between the lifting unit 711 and the hand 730. Furthermore, the substrate transport device 700 may also detect changes in the position of the hand 730 in the height direction, for example, 1 An encoder (not shown) may be provided to detect the amount of lifting and lowering of the hand 730 of the lifting unit 711. In this way, the joints of the hand 730 are controlled to transport the substrate. The disk holding unit 712 may be fixed to the lifting support column 701, or its operation may be controlled by a controller (not shown). The disk holding unit 712 may also be driven by an actuator (not shown). The substrate transport device 700 may also be provided with an encoder (not shown) to detect the change in position of the disk holding unit 712 in the height direction, for example, the amount of lifting and lowering of the disk 740 of the disk holding unit 712.

[0062] The substrate transport device 700 includes a disk 740. The disk 740 is provided in the disk holding section 712. The disk 740 may be positioned considering the position of the substrate W held by the hand 730. The hand 730 picks up the substrate W and moves the substrate W above the disk 740. For example, after picking up the substrate W, the hand 730 rotates in the illustrated XY plane to move the substrate W above the Z axis of the disk 740. 1 The lifting unit 711 moves, for example, downward in the Z-axis direction shown in the figure, to position the substrate W approximately directly above the disk 740. As a result, the disk 740 is positioned approximately below the substrate W. The shape of the disk 740 shown in Figure 11 is circular, but it is not limited to this and can be implemented in other shapes. The shape and dimensions of the disk 740 may be the same as in the embodiments described above.

[0063] Next, the operation of the substrate transport device 700 will be explained. The substrate transport device 700 may also operate as shown in the flowchart in Figure 4. That is, the substrate transport device 700 first removes the substrate W from the FOUP, etc. (step S101). The substrate W is removed using the fork provided on the hand 730 of the substrate transport device 700. Next, the removed substrate W is transported onto the disk 740 provided on the substrate transport device 700 (step S10 3 ). The disk 740 is provided in the disk holding section 712. The hand 730 that took out the substrate W is moved, and the substrate W is moved onto the disk 740 provided in the disk holding section 712 of the substrate transport device 700. Here, when transporting the removed substrate W onto the disk 740 provided in the substrate transport device 700, 1The lifting unit 711 may move the substrate W above the disk holding unit 712, or the disk holding unit 712 may move the disk 740 below the substrate W. Next, the substrate W is imaged with a camera (not shown) (step S105). When imaging, a light (not shown) provided on the disk 740 may be turned on to illuminate the substrate W. The light and camera provided on the disk 740 may be the same as those in the embodiments described above. Next, the position of the substrate W is calculated based on the image (step S107). To calculate the position of the substrate, for example, the positions of notches and orientation flats on the substrate W are obtained from the image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For measurement and correction of the misalignment of the substrate W, refer to US Patent Publication 2021 / 0257242. Next, the substrate is placed on the manufacturing apparatus for the next process based on the calculated correction amount (step S109).

[0064] Thus, according to one or more embodiments of the substrate transport device 700, when acquiring an image of the substrate used for position correction of the substrate W, the substrate is transported onto a disk 740 having a light that illuminates the substrate. Since the disk 740 is provided on the substrate transport device 700, the distance the disk travels can be shortened, and the disk travel time can be shortened. For structural examples and operational examples of the embodiments shown in Figure 11, please refer to US Patent No. 8746631 and US Patent No. 10083851.

[0065] In related technologies, the substrate was placed on the handle of a substrate transport device and moved to the imaging location. Additionally, an aligner needed to be placed near the substrate transport device to adjust the substrate's orientation. This increased the disk's travel distance and thus the disk's travel time, impacting throughput. Furthermore, if a dedicated station or aligner for imaging was required, additional equipment was needed, limiting the floor plan. Moreover, the floor plan had to be designed considering the movement of the substrate transport device's arm.

[0066] According to one or more embodiments of the substrate transport apparatus, a disk is provided within the substrate transport apparatus, and imaging of the substrate is performed on the disk. This minimizes the movement of the disk. As a result, the disk movement time can be minimized, and the throughput of substrate transport can be improved. The disk also has a light that illuminates the substrate with light during imaging. Here, the camera is positioned above the substrate, and the disk is positioned below the substrate. That is, the disk acts as a backlight during imaging, so a clearer image of the substrate can be obtained.

[0067] Furthermore, according to one or more embodiments of the substrate transport apparatus, a correction amount for the position and orientation of the substrate is calculated, and the substrate is placed on the semiconductor manufacturing apparatus for the next process based on the correction amount. In this case, the substrate is placed at a predetermined position and orientation by a placement operation based on the correction amount. As a result, there is no need to place an aligner in the substrate transport apparatus as in related technologies, thus improving the flexibility of the floor plan.

[0068] One or more embodiments described herein can be combined with one another insofar as they are practicable within the scope of the intended embodiments. The embodiments described herein should be considered in all respects to be illustrative and not limiting. The illustrated and described embodiments can be extended to include other embodiments in addition to those specifically described without departing from the intended scope of the invention. The scope of the invention should be determined by the claims, not by the foregoing description alone, but in light of the specification including its equivalents. Accordingly, all configurations, including those included in equivalent configurations of the claims, are intended to be included in the invention.

Claims

1. A device for transporting substrates, Base and, A lifting mechanism is connected to the base so as to be able to move up and down, The lifting section includes an arm that is rotatably connected to the lifting section, and a hand that is movably connected to the arm and acquires the substrate, and the hand section is movably connected to the lifting section and acquires the substrate. A camera positioned above the hand unit, A disk provided on the arm and including a light that irradiates light onto the substrate, A substrate transport device characterized in that, when the hand is positioned to overlap with the arm, the disk is placed beneath the substrate that has been taken out by the hand, and the camera takes an image of the substrate placed on the disk in order to recognize the position and orientation of the substrate.

2. The substrate transport apparatus according to claim 1, characterized in that the disk includes a plurality of lights for irradiating the substrate with light.

3. The substrate transport device according to claim 2, characterized in that the plurality of lights are arranged on the entire surface of the disk.

4. The substrate transport device according to claim 2, characterized in that the plurality of lights are arranged on the outer periphery of the disk.

5. The substrate transport device according to claim 1, characterized in that the light is turned on when the substrate is imaged.

6. The arm is A first arm rotatably connected to the lifting section, It includes a second arm rotatably connected to the first arm, The substrate transport apparatus according to claim 1, characterized in that the disk is arranged on the second arm.

7. The substrate transport apparatus according to claim 1, characterized in that the hand includes a suction hand having a suction section.

8. The substrate transport device according to claim 2, characterized in that the hand includes a light that emits light.

Images