Conductive paste for gravure printing, electronic component, and laminate ceramic capacitor

Abstract

Provided is conductive paste which is for gravure printing, and which can suppress separation between a conductive powder and a ceramic powder.　This conductive paste for gravure printing includes a conductive powder, a ceramic powder, a dispersant, a binder resin, and organic solvents. The organic solvents include a first organic solvent, and a solvent other than the first organic solvent. The binder resin contains a butyral-based resin. The first organic solvent is at least one selected from the group consisting of ester-based solvents and ether-based solvents. An HSP distance between an HSP value of the first organic solvent and an HSP value of the butyral-based resin is less than that between an HSP value of the solvent other than the first organic solvent and the HSP value of the butyral-based resin.

Description

Conductive paste for gravure printing, electronic components, and multilayer ceramic capacitors

[0001] The present invention relates to a conductive paste for gravure printing, an electronic component, and a multilayer ceramic capacitor.

[0002] As electronic devices such as mobile phones and digital devices become smaller and more powerful, there is a demand for smaller electronic components, including multilayer ceramic capacitors, with higher capacitance. Multilayer ceramic capacitors have a structure in which multiple dielectric layers and multiple internal electrode layers are alternately stacked, and by reducing the thickness of these dielectric layers and internal electrode layers, it is possible to achieve smaller size and higher capacitance.

[0003] For example, a multilayer ceramic capacitor is manufactured as follows: First, barium titanate (BaTiO ３ A conductive paste for internal electrodes is printed in a predetermined electrode pattern on the surface of a ceramic green sheet containing a dielectric powder such as ethylenediaminetetraacetic acid (EPO) and a binder resin, and then dried to form a dry film. The dried film and the ceramic green sheets are then alternately stacked to obtain a laminate. This laminate is then integrated by heat and pressure to form a pressed body. This pressed body is then cut, subjected to an organic binder removal treatment in an oxidizing or inert atmosphere, and then fired to obtain fired chips. A paste for external electrodes is then applied to both ends of the fired chip, and after firing, the surfaces of the external electrodes are nickel-plated or the like to obtain a multilayer ceramic capacitor.

[0004] Conventionally, screen printing has been the most commonly used printing method for printing conductive paste onto dielectric green sheets. However, due to demands for smaller, thinner electronic devices and improved productivity, there is a demand for printing finer electrode patterns with high productivity.

[0005] One method of printing conductive paste is gravure printing, a continuous printing method in which the conductive paste is filled into recesses in a printing plate and then pressed against the surface to be printed, transferring the conductive paste from the plate. Gravure printing has a high printing speed and excellent productivity. When using gravure printing, it is necessary to appropriately select the binder resin, dispersant, solvent, etc. in the conductive paste to adjust its properties, such as viscosity, to a range suitable for gravure printing.

[0006] For example, Patent Document 1 discloses a conductive paste used to form, by gravure printing, internal conductor films in a multilayer ceramic electronic component having a plurality of ceramic layers and internal conductor films extending along specific interfaces between the ceramic layers, the conductive paste containing 30 to 70 wt % of a solid component including a metal powder, 1 to 10 wt % of an ethyl cellulose resin component having an ethoxy group content of 49.6% or more, 0.05 to 5 wt % of a dispersant, and a solvent component as the balance, and the paste is applied at a shear rate of 0.1 (s －１ ) Viscosity η ０．１ is 1 Pa s or more and the shear rate is 0.02 (s －１ ) Viscosity η ０．０２ A conductive paste is described which is a thixotropic fluid that satisfies the condition expressed by a specific formula:

[0007] Furthermore, Patent Document 2 discloses a conductive paste used for forming a conductive paste by gravure printing, similar to Patent Document 1, which contains 30 to 70% by weight of a solid component including a metal powder, 1 to 10% by weight of a resin component, 0.05 to 5% by weight of a dispersant, and a solvent component as the remainder, and which is capable of being applied at a shear rate of 0.1 (s －１ A thixotropic fluid having a viscosity of 1 Pa·s or more at a shear rate of 0.1 (s －１ ) is used as the viscosity reference, －１ ) has a viscosity change rate of 50% or more.

[0008] According to the above-mentioned Patent Documents 1 and 2, these conductive pastes have a shear rate of 0.1 (s －１) is a thixotropic fluid having a viscosity of 1 Pa·s or more, and is said to provide stable continuous printing properties at high speeds in gravure printing and to be capable of producing multilayer ceramic electronic components such as multilayer ceramic capacitors with good production efficiency.

[0009] Patent Document 3 (JP-A-2003-102666) describes a conductive paste for use in internal electrodes of multilayer ceramic capacitors, comprising a conductive powder (A), an organic resin (B), an organic solvent (C), an additive (D), and a dielectric powder (E). The organic resin (B) comprises polyvinyl butyral having a degree of polymerization of 10,000 to 50,000 and ethyl cellulose having a weight-average molecular weight of 10,000 to 100,000. The organic solvent (C) comprises propylene glycol monobutyl ether (PGME), a mixed solvent of PGME and PGME acetate, or a mixed solvent of PGME and mineral spirits. The additive (D) comprises a separation inhibitor and a dispersant, and the separation inhibitor comprises a polycarboxylic acid polymer or a polycarboxylic acid salt. Patent Document 3 (JP-A-2003-1026666) describes a conductive paste for gravure printing, comprising a composition having a viscosity suitable for gravure printing, improved paste uniformity and stability, and good drying properties.

[0010] JP 2003-187638 A JP 2003-242835 A JP 2012-174797 A

[0011] Conductive pastes for gravure printing are required to have low viscosity. However, when ceramic powder such as barium titanate and conductive powder such as Ni are added to a low-viscosity conductive paste, the difference in sedimentation velocity due to the difference in specific gravity between these powders has a more significant effect, and the conductive powder and ceramic powder are more likely to separate from each other than to a high-viscosity conductive paste for screen printing, etc.

[0012] For example, when a conductive paste for gravure printing is prepared, a phenomenon called "white floating" (two-layer separation) can occur, in which a white separation layer containing ceramic powder appears on top.

[0013] Furthermore, as a result of the inventor's investigations, it was found that when ceramic powder segregates in a conductive paste, not only does "white floating" occur, but also the sintering retardation effect of the ceramic powder becomes localized during sintering when forming the internal electrode layers, resulting in a problem of a decrease in the coverage rate when the internal electrode layers are formed. In a conductive paste in which the conductive powder and the ceramic powder are separated, a partial difference occurs in the shrinkage rate of the internal electrode layers during sintering, which is thought to result in a decrease in the coverage rate of the internal electrode layers.

[0014] In view of the above circumstances, an object of the present invention is to provide a conductive paste that has a low paste viscosity suitable for gravure printing and can suppress separation of the conductive powder and the ceramic powder.

[0015] In a first aspect of the present invention, there is provided a conductive paste for gravure printing comprising a conductive powder, a ceramic powder, a dispersant, a binder resin, and an organic solvent, wherein the binder resin comprises a butyral-based resin, the organic solvent comprises at least two organic solvents other than hydrocarbon-based solvents, and the first organic solvent is at least one selected from the group consisting of ester-based solvents and ether-based solvents, and a solvent other than the first organic solvent, and the HSP distance between the HSP value of the first organic solvent and the HSP value of the butyral-based resin is shorter than the HSP distance between the HSP value of the solvent other than the first organic solvent and the HSP value of the butyral-based resin.

[0016] The first organic solvent is preferably a conductive paste for gravure printing represented by the following formula (1): １ - (OR ２ ) ｎ -OR ３ ...Equation (1) (where R １ represents an acyl group having 1 to 4 carbon atoms, a linear or branched alkyl group, R ２ represents a linear or branched alkylene group having 2 to 6 carbon atoms, R ３ represents hydrogen, an acyl group having 1 to 4 carbon atoms, or a linear or branched alkyl group, and n is 1 to 3.

[0017] The organic solvent preferably further includes a second organic solvent as a solvent other than the first organic solvent, and the second organic solvent is at least one selected from the group consisting of terpineol, dihydroterpineol, dihydroterpineol acetate, and isobornyl acetate. The organic solvent preferably further includes a third organic solvent as a solvent other than the first organic solvent, and the third organic solvent is at least one selected from the group consisting of ketone-based solvents. The first organic solvent is preferably contained in an amount of 3% by mass or more and 25% by mass or less with respect to the entire conductive paste. The binder resin is preferably a mixed resin containing a butyral-based resin and a cellulose-based resin, and the HSP distance between the HSP value of the first organic solvent and the HSP value of the mixed resin is preferably shorter than the HSP distance between the HSP value of the solvent other than the first organic solvent and the HSP value of the mixed resin. The dispersant preferably includes a carboxylic acid-based dispersant. The conductive powder preferably contains at least one metal powder selected from the group consisting of Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof. The conductive powder preferably has an average particle size of 0.05 μm or more and 1.0 μm or less. The ceramic powder preferably contains barium titanate. The ceramic powder preferably has an average particle size of 0.01 μm or more and 0.5 μm or less. The conductive paste for gravure printing is preferably used for internal electrodes of multilayer ceramic components. The conductive paste for gravure printing preferably has a viscosity of 3 Pa·S or less at a shear rate of 100 sec-1 and a viscosity of 1 Pa·S or less at a shear rate of 10,000 sec-1.

[0018] In a second aspect of the present invention, there is provided an electronic component formed using the above-described conductive paste.

[0019] In a third aspect of the present invention, there is provided a multilayer ceramic capacitor having at least a laminate in which dielectric layers and internal electrode layers are laminated, the internal electrode layers being formed using the above-mentioned conductive paste for gravure printing.

[0020] The conductive paste of the present invention has properties suitable for gravure printing, can suppress separation of the conductive powder and the ceramic powder even in a low-viscosity paste, and has excellent printability when forming thin-film electrodes. Furthermore, the internal electrode layer formed using the conductive paste of the present invention can uniformly cover the dielectric layer even when thin-filmed.

[0021] FIG. 1 is a perspective view and a cross-sectional view showing a multilayer ceramic capacitor according to an embodiment.

[0022] [Conductive Paste] The conductive paste of this embodiment contains a conductive powder, a ceramic powder, a dispersant, a binder resin, and an organic solvent. Each component will be described in detail below.

[0023] (Conductive Powder) The conductive powder is not particularly limited, and metal powders can be used. For example, powders of one or more elements selected from Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof can be used. Among these, powders of Ni or its alloys (hereinafter sometimes referred to as "Ni powder") are preferred from the viewpoints of conductivity, corrosion resistance, and cost. As the Ni alloy, for example, an alloy of Ni and at least one element selected from the group consisting of Mn, Cr, Co, Al, Fe, Cu, Zn, Ag, Au, Pt, and Pd can be used. The Ni content in the Ni alloy is, for example, 50% by mass or more, preferably 80% by mass or more. Furthermore, the Ni powder may contain several hundred ppm of element S to suppress rapid gas generation due to partial thermal decomposition of the binder resin during debinding.

[0024] The average particle size of the conductive powder is preferably 0.05 μm or more and 1.0 μm or less, more preferably 0.1 μm or more and 0.5 μm or less. When the average particle size of the conductive powder is in the above range, it can be suitably used as an internal electrode paste for a thin-film multilayer ceramic capacitor (multilayer ceramic component), and for example, the smoothness and density of the dried film are improved. The average particle size is a value determined by observation with a scanning electron microscope (SEM), and is the average value (SEM average particle size) obtained by measuring the particle size of each of a plurality of particles in an image observed with the SEM at 10,000x magnification.

[0025] The content of the conductive powder is preferably 30% by mass or more and less than 70% by mass, more preferably 40% by mass or more and 60% by mass or less, based on the total amount of the conductive paste. When the content of the conductive powder is within the above range, the conductive paste has excellent conductivity and dispersibility.

[0026] (Ceramic Powder) The ceramic powder is not particularly limited, and for example, in the case of a paste for an internal electrode of a multilayer ceramic capacitor, a known ceramic powder is appropriately selected depending on the type of multilayer ceramic capacitor to be applied. As the ceramic powder, for example, a perovskite oxide containing Ba and Ti can be used, and preferably barium titanate (BaTiO ３ ) is included.

[0027] The ceramic powder may be a ceramic powder containing barium titanate as a main component and an oxide as a secondary component. Examples of the oxide include oxides of Mn, Cr, Si, Ca, Ba, Mg, V, W, Ta, Nb, and one or more rare earth elements. Examples of the ceramic powder include barium titanate (BaTiO ３ Alternatively, a ceramic powder of a perovskite-type oxide ferroelectric may be used in which the Ba atoms or Ti atoms of the above-mentioned ferroelectric material are substituted with other atoms such as Sn, Pb, or Zr.

[0028] When used as a conductive paste for internal electrodes, the ceramic powder may have the same composition as the dielectric ceramic powder constituting the green sheets of a multilayer ceramic capacitor (electronic component). This prevents cracks from occurring at the interface between the dielectric layer and the internal electrode layer during the sintering process due to a mismatch in shrinkage. Examples of such ceramic powders include, in addition to those mentioned above, ZnO, ferrite, PZT, BaO, and Al. ２ O ３ , Bi ２ O ３ , R (rare earth element) ２ O ３ , TiO ２ , Nd ２ O ３ The ceramic powder may be one type or two or more types.

[0029] The average particle size of the ceramic powder is, for example, 0.01 μm or more and 0.5 μm or less, preferably 0.01 μm or more and 0.3 μm or less. When the average particle size of the ceramic powder is in the above range, when used as an internal electrode paste, a sufficiently fine, thin, and uniform internal electrode can be formed. The average particle size is a value determined by observation with a scanning electron microscope (SEM), and is the average value (SEM average particle size) obtained by measuring the particle size of each of multiple particles in an image observed with the SEM at a magnification of 50,000 times.

[0030] The content of the ceramic powder is preferably 1% by mass or more and 20% by mass or less, more preferably 3% by mass or more and 15% by mass or less, based on the total mass of the conductive paste. When the content of the ceramic powder is within the above range, the conductive paste has excellent dispersibility and sinterability.

[0031] The content of the ceramic powder is preferably 1 part by mass or more and 30 parts by mass or less, and more preferably 3 parts by mass or more and 30 parts by mass or less, relative to 100 parts by mass of the conductive powder.

[0032] (Binder Resin) The binder resin preferably contains a butyral-based resin. When used as an internal electrode paste, the binder resin may contain a butyral-based resin or may be used alone in order to improve the adhesive strength with the green sheet. When the binder resin contains a butyral-based resin, the viscosity can be easily adjusted to a level suitable for gravure printing, and the adhesive strength with the green sheet can be further improved. The butyral-based resin may be contained in an amount of, for example, 20% by mass or more, 30% by mass or more, 50% by mass or more, 60% by mass or more, or 70% by mass or more of the total binder resin.

[0033] The binder resin may contain a resin other than a butyral-based resin. The resin other than a butyral-based resin is not particularly limited, and known resins can be used, for example, cellulose-based resins such as methyl cellulose, ethyl cellulose, ethylhydroxyethyl cellulose, and nitrocellulose, and acrylic resins. Among them, from the viewpoints of solubility in solvents and combustion decomposition properties, it is preferable to contain a cellulose-based resin, and it is more preferable to contain ethyl cellulose.

[0034] When the binder resin contains a cellulose-based resin and a butyral-based resin, from the viewpoint of further suppressing separation of the conductive powder and the ceramic powder, the binder resin may contain 20% by mass or more of the butyral-based resin relative to the total content (100% by mass) of the cellulose-based resin and the butyral-based resin, preferably 30% by mass or more, more preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. Furthermore, the upper limit of the butyral-based resin content is not particularly limited, and may be less than 100% by mass, 90% by mass or less, or 80% by mass or less.

[0035] The degree of polymerization and weight average molecular weight of the binder resin can be adjusted appropriately within the above ranges depending on the required viscosity of the conductive paste.

[0036] For example, when a cellulose-based resin is included as the binder resin, the weight-average molecular weight (Mw) may be 10,000 or more and 300,000 or less, 30,000 or more and 200,000 or less, or 50,000 or more and 150,000 or less. When the Mw of the cellulose-based resin is within the above range, the viscosity of the conductive paste can be adjusted to a suitable range, and the separation suppression effect can be improved.

[0037] The hydroxyl value of the cellulose-based resin is not particularly limited, but is preferably 0.1 mgKOH / g or more and 15 mgKOH / g or less, more preferably 0.5 mgKOH / g or more and 7 mgKOH / g or less, and even more preferably 1.5 mgKOH / g or more and 3 mgKOH / g or less. When the hydroxyl value of the cellulose-based resin is within the above range, the dispersibility of the conductive powder and the ceramic powder is excellent, and the resin can be suitably used in a conductive paste for gravure printing. The hydroxyl value is a value measured in accordance with JIS K 0070 and indicates the number of milligrams of potassium hydroxide equivalent to the hydroxyl groups in 1 g of sample.

[0038] For example, when a butyral-based resin is included as the binder resin, the weight average molecular weight (Mw) may be 30,000 or more and 300,000 or less, 50,000 or more and 200,000 or less, or 100,000 or more and 150,000 or less. When the Mw of the butyral-based resin is within the above range, the viscosity of the conductive paste can be adjusted to a suitable range, and the separation suppression effect can be improved.

[0039] The content of the binder resin is preferably 0.5% by mass or more and 10% by mass or less, more preferably 1% by mass or more and 7% by mass or less, based on the total amount of the conductive paste. When the content of the binder resin is in the above range, the conductive paste has excellent conductivity and dispersibility.

[0040] The content of the binder resin is preferably 1 part by mass or more and 20 parts by mass or less, and more preferably 1 part by mass or more and 14 parts by mass or less, relative to 100 parts by mass of the conductive powder.

[0041] (Organic Solvent) The conductive paste according to this embodiment contains, as organic solvents, a first organic solvent and a solvent other than the first organic solvent, and the first organic solvent is one selected from the group consisting of acetate-based solvents and ether-based solvents.

[0042] Examples of the first organic solvent include glycol ether acetates such as ethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether acetate (BCA), diethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, 3-methoxy-3-methylbutyl acetate, 1-methoxypropyl-2-acetate, and propylene glycol monomethyl ether acetate; glycol diacetates such as propylene glycol diacetate, 1,4-butanediol diacetate, 1,3-butylene glycol diacetate, and 1,6-hexanediol diacetate; Examples of the alkyl ether include ethylene glycol ethers such as 2-ethylhexyl ether, ethylene glycol mono-2-ethylhexyl ether, diethylene glycol monohexyl ether, ethylene glycol monohexyl ether, dipropylene glycol methyl-n-propyl ether, and dipropylene glycol methyl-n-butyl ether; propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether (PNB); dipropylene glycol dimethyl ether; and cyclohexanol acetate.

[0043] The first organic solvent is preferably at least one selected from the solvents represented by the following formula (1): １ - (OR ２ ) ｎ -OR ３ ...Formula (1)

[0044] In the above formula (1), R １ represents an acyl group having 1 to 4 carbon atoms, a linear or branched alkyl group having 1 to 4 carbon atoms, R ２represents a linear or branched alkylene group having 2 to 6 carbon atoms, R ３ represents hydrogen, an acyl group having 1 to 4 carbon atoms, or a linear or branched alkyl group having 1 to 4 carbon atoms; and n is 1 to 3.

[0045] From the viewpoint of further suppressing the occurrence of white fringing, R ３ is preferably hydrogen or an acyl group having 1 to 4 carbon atoms, more preferably hydrogen or an acyl group having 1 to 2 carbon atoms, more preferably hydrogen or an acetyl group, and even more preferably an acetyl group.

[0046] Also, R １ is preferably an acyl group having 1 to 4 carbon atoms or a linear alkyl group having 1 to 4 carbon atoms, more preferably an acyl group having 1 or 2 carbon atoms or a linear alkyl group having 2 to 4 carbon atoms, and even more preferably an acetyl group or a linear alkyl group having 2 to 4 carbon atoms.

[0047] R １ and R ３ When both of R ２ may be a linear or branched alkylene group having 4 to 6 carbon atoms, and n may be 1.

[0048] R ３ When only R is an acetyl group, １ may be a linear alkyl group having 1 to 4 carbon atoms, and is preferably a linear alkyl group having 2 to 4 carbon atoms. ２ is preferably a linear or branched alkylene group having 2 or 3 carbon atoms, and may be a linear alkylene group having 2 carbon atoms, and n is preferably 2 or more.

[0049] In addition, in the above formula (1), R １ is a linear or branched alkyl group, R ３ may be an acyl group having 1 to 4 carbon atoms, a linear or branched alkyl group having 1 to 4 carbon atoms, an acyl group having 1 or 2 carbon atoms, or an acetyl group. Furthermore, n is preferably 1 or 2.

[0050] The content of the first organic solvent is preferably 3% by mass or more and 40% by mass or less, more preferably 3% by mass or more and 30% by mass or less, even more preferably 5% by mass or more and 25% by mass or less, and may be 10% by mass or more and 20% by mass or less, based on the total amount of the conductive paste.

[0051] The first organic solvent may be one kind or two or more kinds selected from the group consisting of diethylene glycol monobutyl ether acetate (BCA), methyl carbitol acetate, and propylene glycol monobutyl ether (PNB), for example.

[0052] When the first organic solvent contains propylene glycol monobutyl ether (PNB), the content of propylene glycol monobutyl ether is preferably 3% by mass to 20% by mass, or may be 5% by mass to 20% by mass, or may be 12% by mass to 18% by mass. Furthermore, the first organic solvent may contain propylene glycol monobutyl ether (PNB) alone.

[0053] The first organic solvent may contain two or more kinds of propylene glycol monobutyl ether (PNB) and another organic solvent represented by the above formula (1). The other organic solvent represented by the above formula (1) may be, for example, R １ and R ３ At least one of these may be an acyl group having 1 to 4 carbon atoms or an acetyl group. Examples of other organic solvents represented by the above formula (1) include diethylene glycol monobutyl ether acetate (BCA), methyl carbitol acetate, di(propylene glycol) methyl ether acetate (DPMA), and propylene glycol monomethyl ether acetate.

[0054] Furthermore, when the first organic solvent is diethylene glycol monobutyl ether acetate (BCA), the content of the first organic solvent may be 3% by mass or more and 20% by mass or less.

[0055] The organic solvent may contain a solvent other than the first organic solvent. The solvent other than the first organic solvent is not particularly limited, and any known organic solvent capable of dissolving the binder resin may be used. The solvent other than the first organic solvent may be used alone or in combination of two or more.

[0056] The conductive paste according to this embodiment may further include a second organic solvent as a solvent other than the first organic solvent. The second organic solvent is at least one selected from the group consisting of terpineol (TPO), dihydroterpineol (DHT), dihydroterpineol acetate, and isobornyl acetate, preferably at least one of terpineol (TPO) and dihydroterpineol (DHT), more preferably dihydroterpineol (DHT).

[0057] The second organic solvent is preferably 5% by mass or more and 40% by mass or less, or may be 10% by mass or more and 30% by mass or less, or may be 12% by mass or more and 25% by mass or less, based on the total amount of the conductive paste.

[0058] The conductive paste according to this embodiment may further include a third organic solvent other than the first organic solvent. The third organic solvent is at least one selected from the group consisting of ketone-based solvents.

[0059] Examples of ketone solvents include methyl isobutyl ketone (MIBK) and diisobutyl ketone (DIBK). When a third organic solvent is contained in addition to the first organic solvent, the viscosity can be adjusted and drying properties can be improved without impairing the separation suppression effect. For example, the first organic solvent may be propylene glycol monobutyl ether (PNB), and the third organic solvent may be diisobutyl ketone (DIBK).

[0060] The content of the third organic solvent is preferably 1% by mass or more and 20% by mass or less, and may be 3% by mass or more and 15% by mass or less, or may be 3% by mass or more and 10% by mass or less, based on the total amount of the conductive paste. When the third organic solvent is contained, the upper limit of the content of the first organic solvent may be 15% by mass or less, 10% by mass or less, or 8% by mass or less.

[0061] The organic solvent may also contain a hydrocarbon solvent as a solvent other than the first organic solvent. Examples of hydrocarbon solvents (petroleum-based hydrocarbon solvents) containing aliphatic hydrocarbon solvents include solvents containing tridecane, nonane, cyclohexane, etc., mineral spirits (MA), naphthenic solvents, etc. Among these, it is preferable to contain mineral spirits, and the solvent may contain mineral spirits as a main component (the solvent with the highest content among aliphatic hydrocarbon solvents). Note that the mineral spirits may contain a chain saturated hydrocarbon as a main component, and the chain saturated hydrocarbon may be contained in an amount of 20 mass% or more based on the total amount of the mineral spirits.

[0062] The organic solvent contains at least two organic solvents other than hydrocarbon-based solvents. By containing a plurality of organic solvents other than hydrocarbon-based solvents, the compatibility between the butyral-based resin and the organic solvent can be improved. Note that the organic solvent may or may not contain a hydrocarbon-based solvent as long as it satisfies the HSP distance relationship between the organic solvent and the binder resin described below.

[0063] The conductive paste according to this embodiment may contain, as a solvent other than the first organic solvent, a known solvent other than the second organic solvent, the third organic solvent, and the hydrocarbon-based solvent described above, for example, in an amount of 5 mass% or less relative to the total amount of organic solvents.

[0064] The total content of the organic solvent is preferably 20% by mass or more and 60% by mass or less, and more preferably 25% by mass or more and 45% by mass or less, based on the total amount of the conductive paste. When the content of the organic solvent is in the above range, the conductive paste has excellent conductivity and dispersibility.

[0065] The content of the organic solvent is preferably 50 parts by mass or more and 130 parts by mass or less, more preferably 60 parts by mass or more and 90 parts by mass or less, relative to 100 parts by mass of the conductive powder. When the content of the organic solvent is within the above range, the conductive powder has excellent conductivity and dispersibility.

[0066] (HSP distance between organic solvent and binder resin) The HSP distance between the HSP value of the first organic solvent and the HSP value of the butyral-based resin is preferably shorter than the HSP distance between the HSP value of a solvent other than the first organic solvent and the HSP value of the butyral-based resin. When the first organic solvent, the other organic solvent, and the butyral-based resin satisfy the above relationship, the effect of suppressing separation between the conductive powder and the ceramic powder is further improved. Although the details of this reason are unknown, for example, one cause of separation between the conductive powder and the ceramic powder is the low compatibility between the butyral-based resin and the organic solvent. In a conductive paste that satisfies the above relationship, it is thought that the compatibility between the butyral-based resin and the organic solvent is improved, thereby improving the separation suppression effect.

[0067] The HSP distance between the HSP value of the first organic solvent and the HSP value of the butyral resin is not particularly limited as long as the above relationship is satisfied, but may be, for example, 4 or more and less than 8, or 5 or more and 7.5 or less.

[0068] Furthermore, the HSP distance between the HSP value of the solvent other than the first organic solvent and the HSP value of the butyral resin is not particularly limited as long as the above relationship is satisfied, but may be, for example, 6.5 or more and 20 or less, or 8 or more and 15 or less.

[0069] Furthermore, when the binder resin is a mixed resin containing a butyral resin and a cellulose resin, the HSP distance between the HSP value of the first organic solvent and the HSP value of the mixed resin is preferably shorter than the HSP distance between the HSP value of a solvent other than the first organic solvent and the HSP value of the mixed resin. Note that the HSP distance between the HSP value of the organic solvent and the HSP value of the mixed resin varies depending on the content ratio of the butyral resin and the cellulose resin in the mixed resin.

[0070] The HSP distance refers to the distance between the Hansen solubility parameters (HSP values) of each binder resin and organic solvent. The Hansen solubility parameter is one of the indices that indicates the solubility of a substance, and is expressed as a three-dimensional vector. This three-dimensional vector is typically expressed by the dispersion term (δ ｄ ), polar term (δ ｐ ), hydrogen bond term (δ ｈ The closer the distance between the Hansen solubility parameters (HSP distance), the higher the compatibility can be evaluated.

[0071] In this specification, the HSP distance between the binder resin and the organic solvent can be calculated using the HSP value of the organic solvent registered in the database of the Hansen Solubility Parameter software HSPiP (Hansen Solubility Parameter in Practice).

[0072] In the present invention, for organic solvents registered in the HSPiP version 5 database, the value is used, and for organic solvents not registered in the database, a value estimated by HSPiP version 5 is used. For resins not registered in the database, a solubility test is conducted in 10 to 20 organic solvents with known HSP values, and the HSP value is calculated using the HSPiP software from the HSP values ​​of organic solvents in which the resin is soluble.

[0073] In addition, in the case of a mixed resin using multiple types of binder resins (for example, a cellulose-based resin and a butyral-based resin), the HSP value is calculated by multiplying the HSP value of each resin used alone (each component of a three-dimensional vector) by the mixed volume ratio and adding them together.

[0074] Furthermore, when the first organic solvent or other organic solvent is a mixed solvent in which multiple types of organic solvents are mixed, the HSP value is calculated by multiplying the HSP values ​​of the mixed organic solvents alone (each component of a three-dimensional vector) by the mixed volume ratio and adding them together.

[0075] (Dispersant) As the dispersant, a known dispersant can be used. The dispersant may include, for example, an acid-based dispersant. The acid-based dispersant may also include a dispersant having an acidic group such as a carboxyl group or a phosphate group. Among these, a dispersant having a carboxyl group (carboxylic acid-based dispersant) is preferred, and a polycarboxylic acid-based dispersant having multiple carboxyl groups is more preferred.

[0076] For example, when a polycarboxylic acid-based dispersant is used as the dispersant, the inclusion of the polycarboxylic acid-based dispersant improves the dispersibility of the conductive paste. One type of dispersant may be used, or two or more types may be used. The conductive paste according to this embodiment improves the dispersibility by including a dispersant. Furthermore, the polycarboxylic acid-based dispersant may be a comb-shaped carboxylic acid having a comb structure.

[0077] Furthermore, for example, the dispersant may include an acid-based dispersant having a hydrocarbon group. Examples of such acid-based dispersants include carboxylic acid-based dispersants such as higher fatty acids and polymer surfactants, and phosphoric acid-based dispersants. These dispersants may be used alone or in combination of two or more.

[0078] The higher fatty acid may be an unsaturated carboxylic acid or a saturated carboxylic acid, and is not particularly limited, but examples thereof include those having 11 or more carbon atoms, such as stearic acid, oleic acid, myristic acid, palmitic acid, linoleic acid, lauric acid, and linolenic acid. Of these, oleic acid or stearic acid is preferred.

[0079] Other acid dispersants are not particularly limited, and examples thereof include alkyl monoamine salt types such as monoalkylamine salts.

[0080] As the alkyl monoamine salt type, for example, oleoyl sarcosine, which is a compound of glycine and oleic acid, and amide compounds using higher fatty acids such as stearic acid or lauric acid instead of oleic acid are preferred.

[0081] In addition, when the molecular weight of the acid-based dispersant is small or the acid value is large, the incidence of whitening may increase. Therefore, from the viewpoint of further improving the separation suppression effect, the molecular weight of the acid-based dispersant may be 400 or more, or may be 500 or more. The upper limit of the molecular weight of the acid-based dispersant is not particularly limited, but is, for example, 100,000 or less. In addition, the acid value of the acid-based dispersant may be, for example, 280 or less, 200 or less, or 100 or less. In addition, the lower limit of the acid value of the acid-based dispersant is, for example, 20 or more.

[0082] The dispersant may also include a dispersant other than an acid-based dispersant. Examples of dispersants other than acid-based dispersants include basic dispersants, nonionic dispersants, and amphoteric dispersants. These dispersants may be used alone or in combination of two or more.

[0083] Examples of basic dispersants include aliphatic amines such as laurylamine, rosinamine, cetylamine, myristylamine, and stearylamine. When the conductive paste contains the acid dispersant and the basic dispersant, the conductive paste has better dispersibility and excellent viscosity stability over time.

[0084] The dispersant is preferably contained in an amount of 3 mass% or less based on the total conductive paste. The range including the upper limit of the dispersant content is preferably 2 mass% or less, more preferably 1 mass% or less. The range including the lower limit of the dispersant content is not particularly limited, but is, for example, 0.01 mass% or more, preferably 0.05 mass% or more. When the dispersant content is within the above range, the dispersibility of the conductive paste can be improved while the paste viscosity can be adjusted to an appropriate range, deterioration of drying properties after printing can be prevented, and sheet attack and poor peeling of the green sheet can be suppressed.

[0085] The dispersant may contain only an acid dispersant, or may contain both an acid dispersant and a base dispersant. When both an acid dispersant and a base dispersant are contained, the content of the base dispersant may be smaller than the content of the acid dispersant, and may be 90% by mass or less, 50% by mass or less, or 30% by mass or less relative to the content of the acid dispersant (100% by mass).

[0086] The dispersant is preferably contained in an amount of 0.01 to 5 parts by mass, more preferably 0.05 to 3 parts by mass, and even more preferably 0.2 to 2 parts by mass, per 100 parts by mass of the conductive powder. When the dispersant content is within the above range, the dispersibility of the conductive powder and ceramic powder and the smoothness of the dried electrode surface after application are excellent, the viscosity of the conductive paste can be adjusted to an appropriate range, deterioration of drying properties after printing can be prevented, and sheet attack and poor peeling of the green sheet can be suppressed.

[0087] The conductive paste according to this embodiment may also contain a dicarboxylic acid as an additive. The dicarboxylic acid is a carboxylic acid-based additive having two carboxyl groups (COO- groups).

[0088] The average molecular weight of the dicarboxylic acid is not particularly limited, but may be, for example, 1,000 or less, 500 or less, or 400 or less. When the average molecular weight of the dicarboxylic acid is within the above range, a separation suppression effect can be obtained in a conductive paste using a conventional organic solvent. The average molecular weight of the dicarboxylic acid may be, for example, 100 or more, or 200 or more.

[0089] Furthermore, in the conductive paste according to this embodiment, the dicarboxylic acid may be contained in an amount of less than 2.0% by mass, 1.0% by mass or less, 0.5% by mass or less, or 0.1% by mass or less, based on the total amount of the conductive paste. If the dicarboxylic acid content is too high, the separation suppression effect may not be obtained. Furthermore, if the dicarboxylic acid content is too high, drying may be insufficient during the printing and drying process, causing the internal electrode layers to become soft, which may result in lamination misalignment during the subsequent lamination process. Furthermore, if the dicarboxylic acid remaining during firing evaporates, the evaporated gas components may generate internal stress or cause structural destruction of the laminate.

[0090] In addition, when the conductive paste contains a dispersant (excluding dicarboxylic acid) and a dicarboxylic acid, the total content of the dispersant and the dicarboxylic acid may be 0.05 mass% or more and 3.0 mass% or less, 0.1 mass% or more and 2.0 mass% or less, or 0.1 mass% or more and 1.0 mass% or less, relative to the entire conductive paste.

[0091] The conductive paste according to this embodiment does not necessarily contain a dicarboxylic acid. Even if the conductive paste according to this embodiment does not contain a dicarboxylic acid, it can exhibit a high separation suppression effect by containing a specific binder resin and an organic solvent, as described above. In particular, when a commercially available dicarboxylic acid with a low molecular weight is used in combination with the organic solvent, a certain degree of separation suppression effect can be obtained, but the separation suppression effect may be reduced compared to when other acid dispersants are used.

[0092] (Other Additives) The conductive paste of the present embodiment may contain other additives in addition to the above components, as necessary. Examples of other additives that can be used include conventionally known additives such as antifoaming agents, plasticizers, surfactants, and thickeners.

[0093] (Conductive Paste) The method for producing the conductive paste according to this embodiment is not particularly limited, and a conventionally known method can be used. The conductive paste can be produced, for example, by stirring and kneading the above-mentioned components using a triple-roll mill, a ball mill, a mixer, or the like. It is preferable to weigh and add the dicarboxylic acid (separation inhibitor) when stirring and kneading the material using a mixer or other stirring and kneading device, just like the other materials. However, the same separation-inhibiting effect can be obtained by adding the dicarboxylic acid as a separation inhibitor to the material after stirring and kneading (dispersion) has been completed.

[0094] The conductive paste is applied at a shear rate of 100 sec. －１ The viscosity is preferably 3 Pa·S or less, and may be 2 Pa·S or less. －１ When the viscosity of the paste is within the above range, it can be suitably used as a conductive paste for gravure printing. When the viscosity of the paste exceeds the above range, the viscosity may be too high and the paste may not be suitable for gravure printing. －１ The lower limit of the viscosity is not particularly limited, but is, for example, 0.2 Pa·S or more.

[0095] The conductive paste was applied at a shear rate of 10,000 sec. －１ The viscosity is preferably 1 Pa·S or less. －１ When the viscosity is within the above range, it can be suitably used as a conductive paste for gravure printing. When the viscosity is beyond the above range, the viscosity may be too high and the paste may not be suitable for gravure printing. －１ The lower limit of the viscosity is not particularly limited, but is, for example, 0.05 Pa·S or more.

[0096] Furthermore, the thickness of the whitish layer observed 7 days after preparation of the conductive paste is preferably less than 10% of the total thickness of the conductive paste, and may be 8% or less, 5% or less, 3% or less, or 2% or less. The smaller the thickness of the whitish layer, the better the separation suppression effect. The thickness of the whitish layer can be measured by the method described in the examples below.

[0097] The conductive paste can be suitably used in electronic components such as multilayer ceramic capacitors. A multilayer ceramic capacitor has dielectric layers formed using dielectric green sheets and internal electrode layers formed using the conductive paste.

[0098] [Electronic Component] Hereinafter, embodiments of electronic components and the like of the present invention will be described with reference to the drawings. The drawings may be represented schematically or at a different scale as appropriate. Furthermore, the positions and directions of components will be described with reference to an XYZ Cartesian coordinate system as shown in FIG. 1 and the like as appropriate. In this XYZ Cartesian coordinate system, the X and Y directions are horizontal, and the Z direction is vertical (up-down).

[0099] 1A and 1B are diagrams showing a multilayer ceramic capacitor 1, which is an example of an electronic component according to an embodiment. The multilayer ceramic capacitor 1 includes a ceramic laminate 10 in which dielectric layers 12 and internal electrode layers 11 are alternately stacked, and external electrodes 20.

[0100] A method for manufacturing a multilayer ceramic capacitor using the above-described conductive paste will now be described. First, the conductive paste is printed on a ceramic green sheet and dried to form a dry film. A plurality of ceramic green sheets, each having this dry film on its upper surface, are laminated by pressure bonding to obtain a laminate, which is then fired and integrated to produce a ceramic laminate 10 in which internal electrode layers 11 and dielectric layers 12 are alternately stacked. A pair of external electrodes 20 is then formed on both ends of the ceramic laminate 10 to produce a multilayer ceramic capacitor 1. This method will now be described in more detail.

[0101] First, a ceramic green sheet, which is an unfired ceramic sheet, is prepared. Examples of the ceramic green sheet include a dielectric layer paste obtained by adding an organic binder such as polyvinyl butyral and a solvent such as terpineol to a predetermined ceramic raw material powder such as barium titanate, and then coating the paste on a support film such as a PET film in a sheet form and drying it to remove the solvent. The thickness of the dielectric layer made of the ceramic green sheet is not particularly limited, but is preferably 0.05 μm or more and 3 μm or less in view of the demand for miniaturization of multilayer ceramic capacitors.

[0102] Next, the conductive paste is printed and applied to one side of the ceramic green sheet using a gravure printing method, and then dried to form a dry film on one side of the ceramic green sheet, to prepare a plurality of sheets. Note that, from the viewpoint of the requirement for thinning of the internal electrode layer 11, it is preferable that the thickness of the dry film formed from the conductive paste is 1 μm or less after drying.

[0103] Next, the ceramic green sheets are peeled off from the support film, and the ceramic green sheets and the dried film formed on one side thereof are stacked alternately, followed by a heat and pressure treatment to obtain a laminate. Note that protective ceramic green sheets not coated with the conductive paste may be further placed on both sides of the laminate.

[0104] Next, the laminate is cut to a predetermined size to form green chips, and the green chips are subjected to a binder removal treatment and fired in a reducing atmosphere to produce a fired laminated ceramic body (ceramic laminate 10). The atmosphere in the binder removal treatment is air or N ２It is preferable to carry out the debinding treatment in a gas atmosphere. The temperature during the debinding treatment is, for example, 200°C or higher and 400°C or lower. Furthermore, it is preferable to hold the above temperature for 0.5 hours or higher and 24 hours or lower during the debinding treatment. Furthermore, the firing is carried out in a reducing atmosphere to suppress oxidation of the metal used in the internal electrode layers, and the temperature during firing of the laminate is, for example, 1000°C or higher and 1350°C or lower, and the temperature holding time during firing is, for example, 0.5 hours or higher and 8 hours or lower.

[0105] By firing the green chip, the organic binder in the ceramic green sheet is completely removed, and the ceramic raw material powder is fired to form the ceramic dielectric layer 12. Also, the organic vehicle in the dried film is removed, and the nickel powder or the alloy powder mainly composed of nickel is sintered or melted and integrated to form the internal electrode layer 11, thereby forming a multilayer ceramic fired body in which a plurality of dielectric layers 12 and internal electrode layers 11 are alternately stacked. Note that, from the viewpoint of taking oxygen into the dielectric layer to increase reliability and suppressing reoxidation of the internal electrodes, the fired multilayer ceramic fired body may be subjected to an annealing treatment.

[0106] A pair of external electrodes 20 is then provided on the produced fired multilayer ceramic body, thereby producing the multilayer ceramic capacitor 1. For example, the external electrodes 20 include an external electrode layer 21 and a plating layer 22. The external electrode layer 21 is electrically connected to the internal electrode layer 11. Suitable materials for the external electrodes 20 include, for example, copper, nickel, or an alloy thereof. Electronic components other than multilayer ceramic capacitors may also be used.

[0107] EXAMPLES The present invention will be described in detail below based on examples and comparative examples, but the present invention is not limited to these examples.

[0108] [Evaluation Method] (Viscosity of Conductive Paste) The viscosity of the conductive paste after production was measured using a rheometer (Rheometer MCR302 manufactured by Anton Paar Japan Co., Ltd.). The viscosity was measured using a cone plate with a cone angle of 1° and a diameter of 25 mm at a shear rate of 100 sec. －１ , and 10000sec －１ The values ​​measured under the conditions above were used.

[0109] (Whitening) 10 g of the conductive paste immediately after preparation was left to stand in a glass bottle (diameter φ30 mm × height 65 mm). After 7 days, the appearance of the conductive paste was visually observed and the percentage of whitening observed was measured. The percentage of whitening (%) was calculated by (thickness of the whitening layer / thickness of the entire paste) × 100.

[0110] [Materials Used] (Conductive Powder) Ni powder (SEM average particle size: 0.2 μm) was used as the conductive powder.

[0111] (Ceramic Powder) As the ceramic powder, barium titanate (BaTiO ３ (SEM average particle size 0.10 μm) was used.

[0112] (Binder Resin) As the binder resin, polyvinyl butyral resin and ethyl cellulose resin were used.

[0113] (Dispersant) As the acid-based dispersants, comb-shaped carboxylic acid (molecular weight: 10,000 or more, acid value: 60), monocarboxylic acid-based dispersant, phosphoric acid-based dispersant, and dicarboxylic acid (molecular weight: 370, acid value: 299 / Hypermer KD-16, manufactured by Croda Japan Co., Ltd.) were used, and oleylamine was used as the base-based dispersant. In Table 1, comb-shaped carboxylic acid is represented by "acid type a", monocarboxylic acid-based dispersant and phosphoric acid-based dispersant (mass ratio 1:1) are represented by "acid type b", and dicarboxylic acid is represented by "acid type c".

[0114] (Organic Solvents) The following organic solvents were used: (1) First Organic Solvent: Propylene glycol monobutyl ether (PNB), diethylene glycol monobutyl ether acetate (BCA), 1,6-hexanediol diacetate (1,6-HDDA), 1,3-butanediol diacetate (1,3-BGDA), diethylene glycol monoethyl ether acetate (EDGAC), ethylene glycol monobutyl ether acetate (EGBA), di(propylene glycol) methyl ether acetate (DPMA) (2) Second Organic Solvent: Dihydroterpineol (DHT), terpineol (TPO) (3) Other Organic Solvents Diisobutyl ketone (DIBK), mineral spirits (MA), ethanol (EtOH), isobornyl acetate (IBA), (note that ethanol and isobornyl acetate are not the first organic solvents, but for comparison with the first organic solvent, in Table 1, "EtOH" is listed under the heading of the first organic solvent. ＊ " and "IBA ＊ ")

[0115] [Example 1] A conductive paste was prepared by mixing 49% by weight of conductive powder, 12% by weight of ceramic powder, 0.1% by weight of acid dispersant, 2.5% by weight of binder resin (polyvinyl butyral resin:ethyl cellulose = 7:3 (mass ratio)), and 10.9% by weight of PNB as organic solvent, 7.3% by weight of MA, and the remainder of DHT, to a total of 100% by weight. The content of each material in the conductive paste and the evaluation results of whitening (%) are shown in Table 1.

[0116] [Examples 1 to 19] Conductive pastes were prepared and evaluated in the same manner as in Example 1, except that the type and content of the organic solvent and the type and content of the dispersant were changed as shown in Table 1. Table 1 shows the content of each material in the conductive paste and the evaluation results for whitening (%).

[0117]

[0118] (Evaluation Results) The conductive pastes of Examples 1 to 11 had reduced occurrence of whitish floating compared to the conductive pastes of Examples 9 to 18, which did not contain the first organic solvent. Furthermore, Example 19, which used only one type of first organic solvent as the organic solvent other than the hydrocarbon-based organic solvent, had a high occurrence rate of whitish floating.

[0119] In addition, in all of the conductive pastes of the examples and comparative examples shown in Table 1, the shear rate was 100 sec. －１ The viscosity is 3 Pa·S or less at a shear rate of 10,000 sec －１ The viscosity at this temperature was 1 Pa·S or less. These viscosity ranges are suitable for use in gravure printing.

[0120] When the conductive paste of the present invention is used to form internal electrodes of a multilayer ceramic capacitor, a highly reliable multilayer ceramic capacitor can be obtained with high productivity. Therefore, the conductive paste of the present invention can be suitably used as a raw material for internal electrodes of multilayer ceramic capacitors, which are chip components in electronic devices that are becoming increasingly miniaturized, such as mobile phones and digital devices, and can also be suitably used as a conductive paste for gravure printing.

[0121] The technical scope of the present invention is not limited to the aspects described in the above embodiments. One or more of the requirements described in the above embodiments may be omitted. The requirements described in the above embodiments may be combined as appropriate. Furthermore, to the extent permitted by law, the disclosures of Japanese Patent Application No. 2021-093299 and all documents cited in this specification are incorporated by reference as part of the description in this document.

[0122] REFERENCE SIGNS LIST 1 Multilayer ceramic capacitor 10 Ceramic laminate 11 Internal electrode layer 12 Dielectric layer 20 External electrode 21 External electrode layer 22 Plated layer

Claims

1. A conductive paste for gravure printing, comprising a conductive powder, a ceramic powder, a dispersant, a binder resin, and an organic solvent, the binder resin includes a butyral resin, the organic solvent includes at least two organic solvents other than hydrocarbon-based solvents, and includes a first organic solvent which is at least one selected from the group consisting of ester-based solvents and ether-based solvents, and a solvent other than the first organic solvent; an HSP distance between the HSP value of the first organic solvent and the HSP value of the butyral-based resin is shorter than an HSP distance between the HSP value of a solvent other than the first organic solvent and the HSP value of the butyral-based resin; Conductive paste for gravure printing.

2. The conductive paste for gravure printing according to claim 1 , wherein the first organic solvent is represented by the following formula (1): R １ -(OR ２ ) ｎ -OR ３ ... Formula (1) (However, R １ represents an acyl group having 1 to 4 carbon atoms, a linear or branched alkyl group, R ２ represents a linear or branched alkylene group having 2 to 6 carbon atoms, R ３ represents hydrogen, an acyl group having 1 to 4 carbon atoms, or a linear or branched alkyl group, and n is 1 to 3.

3. 3. The conductive paste for gravure printing according to claim 2, wherein the organic solvent further includes a second organic solvent as a solvent other than the first organic solvent, and the second organic solvent is at least one selected from the group consisting of terpineol, dihydroterpineol, dihydroterpineol acetate, and isobornyl acetate.

4. 2. The conductive paste for gravure printing according to claim 1, wherein the organic solvent further includes a third organic solvent as a solvent other than the first organic solvent, and the third organic solvent is at least one selected from the group consisting of ketone-based solvents.

5. The conductive paste for gravure printing according to claim 1 , wherein the first organic solvent is contained in an amount of 3% by mass to 25% by mass based on the entire conductive paste.

6. 2. The conductive paste for gravure printing according to claim 1, wherein the binder resin is a mixed resin containing the butyral-based resin and the cellulose-based resin, and the HSP distance between the HSP value of the first organic solvent and the HSP value of the mixed resin is shorter than the HSP distance between the HSP value of a solvent other than the first organic solvent and the HSP value of the mixed resin.

7. The conductive paste for gravure printing according to claim 1 , wherein the dispersant comprises a carboxylic acid-based dispersant.

8. 2. The conductive paste for gravure printing according to claim 1, wherein the conductive powder contains at least one metal powder selected from the group consisting of Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof.

9. The conductive paste for gravure printing according to claim 1 , wherein the conductive powder has an average particle size of 0.05 μm or more and 1.0 μm or less.

10. The conductive paste for gravure printing according to claim 1 , wherein the ceramic powder contains barium titanate.

11. The conductive paste for gravure printing according to claim 1, wherein the ceramic powder has an average particle size of 0.01 μm or more and 0.5 μm or less.

12. 2. The conductive paste for gravure printing according to claim 1, which is used for internal electrodes of multilayer ceramic parts.

13. Shear rate 100 sec －１ The viscosity is 3 Pa·S or less at a shear rate of 10,000 sec －１ 2. The conductive paste for gravure printing according to claim 1, wherein the viscosity at 1 Pa·S is 1 Pa·S or less.

14. An electronic component formed using the conductive paste according to any one of claims 1 to 13.

15. The laminate has at least a laminate of dielectric layers and internal electrode layers, A multilayer ceramic capacitor, wherein the internal electrode layers are formed using the conductive paste for gravure printing according to any one of claims 1 to 13.