Processing device

Abstract

This processing device comprises: an irradiation optical system that is capable of irradiating an object with first processing light emitted from a first light source, and second processing light emitted from a second light source different from the first light source and having a different peak wavelength from the first processing light; and a material supply member that is capable of supplying a build material to a molten pool formed by the first and second processing light. The peak wavelength of the second processing light is shorter than the peak wavelength of the first processing light. A second region irradiated with the second processing light is broader than a first region irradiated with the first processing light.

Description

processing equipment

[0001] The present invention relates to the technical field of processing devices that can perform additional processing on objects, for example.

[0002] An example of a processing device capable of performing additional processing on an object is described in Patent Document 1. One of the technical challenges of such a processing device is to appropriately process the object.

[0003] US Patent Application Publication No. 2016 / 0311059

[0004] According to a first aspect, a processing device is provided that includes an irradiation optical system capable of irradiating an object with a first processing light emitted from a first light source and a second processing light emitted from a second light source different from the first light source and having a different peak wavelength from the first processing light, and a material supply member capable of supplying a molding material to a molten pool formed by the first and second processing lights, wherein the peak wavelength of the second processing light is shorter than the peak wavelength of the first processing light, and the second area irradiated with the second processing light is wider than the first area irradiated with the first processing light.

[0005] According to a second aspect, a processing device for performing additional processing on an object includes a first optical system capable of irradiating the object with a first processing light emitted from a first light source, a second optical system capable of irradiating the object with a second processing light emitted from a second light source different from the first light source and having a peak wavelength different from that of the first processing light, and a material supply member capable of supplying a shaping material to a molten pool formed by the first and second processing lights, wherein the first optical system has a first focusing position that is changeable along the irradiation direction of the first processing light. A processing apparatus is provided that includes a change member and a first deflection member capable of deflecting the first processing light so as to change the first irradiation position at which the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light, and the second optical system includes a second focusing position change member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light, and a second deflection member capable of deflecting the second processing light so as to change the second irradiation position at which the second processing light is irradiated along a direction intersecting the irradiation direction of the second processing light.

[0006] According to a third aspect, a processing device for performing additional processing on an object is provided, comprising: a first optical system capable of irradiating the object with a first processing light emitted from a first light source and with a second processing light emitted from a second light source different from the first light source and having a different peak wavelength from the first processing light; and a material supply member capable of supplying a molding material to a molten pool formed by the first and second processing lights, wherein the first optical system includes a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light; a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light; and a first deflecting member capable of deflecting the first processing light and the second processing light so as to change the first irradiation position where the first processing light is irradiated and the second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation direction of the first processing light and the second processing light.

[0007] According to a fourth aspect, a processing device for performing additional processing on an object includes a first optical system capable of irradiating the object with a first processing light and a second processing light having a peak wavelength different from that of the first processing light, a second optical system capable of irradiating the object with a third processing light and a fourth processing light having a peak wavelength different from that of the third processing light, and a material supply member capable of supplying a molding material to a molten pool formed by the first processing light, the second processing light, the third processing light, and the fourth processing light, wherein the first optical system includes a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light, a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light, and a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light. a first deflecting member capable of deflecting the first processing light and the second processing light so as to change a first irradiation position and a second irradiation position onto which the second processing light is irradiated along a direction intersecting the irradiation direction of the first processing light and the second processing light, and the second optical system includes a third focusing position changing member capable of changing the focusing position of the third processing light along the irradiation direction of the third processing light, a fourth focusing position changing member capable of changing the focusing position of the fourth processing light along the irradiation direction of the fourth processing light, and a second deflecting member capable of deflecting the third processing light and the fourth processing light so as to change the third irradiation position onto which the third processing light is irradiated and the fourth irradiation position onto which the fourth processing light is irradiated along a direction intersecting the irradiation direction of the third processing light and the fourth processing light.

[0008] According to a fifth aspect, a processing device for performing additional processing on an object is provided, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light; and a material supply member capable of supplying a molding material to a molten pool formed by the first and second processing lights, wherein the first optical system includes a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light, and a first deflecting member capable of deflecting the first processing light so as to change the first irradiation position at which the first processing light is irradiated along a first direction intersecting the irradiation direction of the first processing light, and the second optical system includes a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light, and a second deflecting member capable of deflecting the second processing light so as to change the second irradiation position at which the second processing light is irradiated along a second direction intersecting the irradiation direction of the second processing light.

[0009] According to a sixth aspect, a processing device for performing additional processing on an object is provided, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light; and a material supply member capable of supplying a molding material to a molten pool formed by the first and second processing lights, wherein the first optical system includes a first deflecting member capable of deflecting the first processing light so as to change a first irradiation position at which the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light, and a first detector capable of detecting the intensity of the first processing light, and the second optical system includes a second deflecting member capable of deflecting the second processing light so as to change a second irradiation position at which the second processing light is irradiated along a direction intersecting the irradiation direction of the second processing light, and a second detector capable of detecting the intensity of the second processing light.

[0010] According to a seventh aspect, there is provided a processing device comprising a processing head having a focusing optical system that focuses processing light on an object and electrical components used to control the processing light, and a support member that is adjacent to the processing head along a direction intersecting the optical axis of the focusing optical system and supports the processing head, wherein a first distance between the electrical components and the support member in the direction intersecting the optical axis is longer than a second distance between the optical axis and the support member in the direction intersecting the optical axis.

[0011] According to an eighth aspect, a processing apparatus is provided that includes an irradiation device capable of irradiating an object with a first processing light and a second processing light having a different peak wavelength from the first processing light, and a material supply member capable of supplying a molding material to a molten pool formed by at least one of the first and second processing lights.

[0012] According to a ninth aspect, a processing apparatus is provided which includes an irradiation device capable of irradiating an object with a first processing light and a second processing light having a different peak wavelength from the first processing light, and a material supply member capable of supplying a molding material to a position where the first and second processing lights are irradiated by the irradiation device.

[0013] According to a tenth aspect, there is provided a processing device comprising an irradiation device capable of irradiating an object with first processing light and second processing light having a different peak wavelength from the first processing light, and a material supply member capable of supplying a modeling material to an irradiation area irradiated with the first processing light by the irradiation device, wherein the irradiation area irradiated with the first processing light at least partially overlaps with an area irradiated with the second processing light.

[0014] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0015] FIG. 1 is a cross-sectional view showing the appearance of the processing system of this embodiment. FIG. 2 is a cross-sectional view showing the structure of the processing system of this embodiment. FIG. 3 is a block diagram showing the configuration of the processing system of this embodiment. FIG. 4 is a cross-sectional view showing the structure of the irradiation optical system. FIG. 5(a) is a plan view showing the movement trajectory of the target irradiation area within a processing unit area, and FIG. 5(b) is a plan view showing the movement trajectory of the target irradiation area on the printing surface. FIGS. 6(a) and 6(b) are plan views showing the movement trajectory of the target irradiation area within a processing unit area, and FIG. 6(c) is a plan view showing the movement trajectory of the target irradiation area on the printing surface. FIG. 7 is a perspective view showing a housing unit in which the irradiation optical system is housed.

[0016] FIG. 8 is a bottom view showing the positional relationship between the X-scan motor and the Y-scan motor. FIG. 9 is a cross-sectional view showing an example of an irradiation optical system that is housed in a head housing to facilitate maintenance of the irradiation optical system. FIG. 10 is a cross-sectional view showing a coolant supply nozzle that supplies a coolant to at least a part of the irradiation optical system. FIGS. 11( a) to 11(e) are cross-sectional views showing a state in which a processing light is irradiated onto an area on a workpiece and a modeling material is supplied. FIGS. 12( a) to 12(c) are cross-sectional views showing a process of modeling a three-dimensional structure. FIGS. 13( a) to 13(c) are cross-sectional views showing two processing light beams irradiated onto a modeling surface. FIGS. 14( a) and 14(b) are cross-sectional views showing three-dimensional structures modeled using multiple different types of modeling materials M. FIG. 15 is a timing chart showing the intensities of the two processing light beams. FIG. 16 is a timing chart showing the intensities of the two processing light beams. FIG. 17 is a timing chart showing the intensities of the two processing light beams. FIG. 18 is a timing chart showing the intensities of the two processing light beams. FIG. 19(a) is a plan view showing two beam spots formed on the printing surface by two processing beams, respectively, and FIG. 19(b) is a plan view showing the movement trajectories of the two beam spots (i.e., two target irradiation areas) on the printing surface. FIG. 20(a) is a plan view showing two beam spots formed on the printing surface by two processing beams, respectively, and FIG. 20(b) is a plan view showing the movement trajectories of the two beam spots (i.e., two target irradiation areas) on the printing surface. FIG. 21 is a cross-sectional view showing the processing beam when a galvano-focus interlocking control operation is performed to control the galvanometer mirror based on the control amount of the focus control optical system. FIG. 22 is a cross-sectional view showing the processing beam when a galvano-focus interlocking control operation is performed to control the focus control optical system based on the control amount of the galvanometer mirror. FIG. 23 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to a first modified example. FIG. 24 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to a second modified example. FIG. 25 is a block diagram showing the configuration of a processing system according to a third modified example. FIG. 26 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to the third modified example.Fig. 27 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to a fourth modified example. Fig. 28 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to a fifth modified example. Fig. 29 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to a fifth modified example. Fig. 30 is a cross-sectional view showing the structure of an irradiation optical system provided in a processing system according to a sixth modified example.

[0017] Hereinafter, embodiments of a processing apparatus and a processing method will be described with reference to the drawings. Hereinafter, embodiments of the processing apparatus and the processing method will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. In particular, below, embodiments of the processing apparatus and the processing method will be described using a processing system SYS that performs additive processing based on laser metal deposition (LMD). Additional processing based on laser metal deposition is additive processing that forms a shaped object that is integrated with the workpiece W or that can be separated from the workpiece W by melting a shaping material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light).

[0018] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For convenience of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0019] (1) Structure of the machining system SYS (1-1) Overall structure of the machining system SYS First, the structure of the machining system SYS of this embodiment will be described with reference to Figures 1 to 3. Figure 1 is a perspective view that schematically shows the appearance of the machining system SYS of this embodiment. Figure 2 is a cross-sectional view that schematically shows the structure of the machining system SYS of this embodiment. Figure 3 is a system configuration diagram that shows the system configuration of the machining system SYS of this embodiment.

[0020] The machining system SYS is capable of performing additive processing on the workpiece W. By performing additive processing on the workpiece W, the machining system SYS is capable of forming a shaped object that is integrated with (or separable from) the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds, to the workpiece W, a shaped object that is integrated with (or separable from) the workpiece W. Note that the shaped object in this embodiment may refer to any object that the machining system SYS forms. For example, the machining system SYS is capable of forming a three-dimensional structure ST (that is, a three-dimensional structure that has a size in all three-dimensional directions, a solid object, in other words, a structure that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a shaped object.

[0021] When the workpiece W is a stage 31 described below, the processing system SYS is capable of performing additional processing on the stage 31. When the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYS is capable of performing additional processing on the mounted object. The mounted object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYS. Note that FIGS. 1 and 2 show an example in which the workpiece W is an existing structure placed on the stage 31. Also, the following description will be given using an example in which the workpiece W is an existing structure placed on the stage 31.

[0022] The workpiece W may be a product that has a missing portion and needs to be repaired. In this case, the machining system SYS may perform repair processing to repair the product that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the machining system SYS may include additional processing to add a shaped object to the workpiece W to fill the missing portion.

[0023] As described above, the processing system SYS is capable of performing additive processing based on the laser buildup welding method. In other words, the processing system SYS can also be said to be a 3D printer that processes an object using additive manufacturing technology. Note that additive manufacturing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing. Note that the laser buildup welding method (LMD) may also be referred to as directed energy deposition (DED).

[0024] A processing system SYS using additive manufacturing technology sequentially forms multiple structural layers SL (see FIG. 12 , described later) to form a three-dimensional structure ST in which multiple structural layers SL are stacked. In this case, the processing system SYS first sets the surface of the workpiece W as a printing surface MS on which the object is actually printed, and prints the first structural layer SL on the printing surface MS. The processing system SYS then sets the surface of the first structural layer SL as a new printing surface MS, and prints the second structural layer SL on the new printing surface MS. Thereafter, the processing system SYS repeats the same operations to form a three-dimensional structure ST in which multiple structural layers SL are stacked.

[0025] The processing system SYS performs additive processing by processing the modeling material M using processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered material. In other words, the modeling material M is a powder. However, the modeling material M does not have to be a powder. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0026] Like the forming material M, the workpiece W may also be an object containing a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. The material of the workpiece W may be the same as or different from the forming material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the material of the workpiece W.

[0027] 1 to 3, the processing system SYS includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, and a control device 7. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside a housing 6. In this case, the processing system SYS may perform additional processing in the chamber space 63IN. At least one of the processing system SYS and the processing unit 2 may be referred to as a processing device.

[0028] The material supply source 1 supplies the processing unit 2 with the modeling material M. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additive processing is supplied to the processing unit 2.

[0029] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. To form the model, the processing unit 2 includes a processing head 21 and a head drive system 22. The processing head 21 further includes an irradiation optical system 211 and a plurality of material nozzles 212. However, the processing head 21 may include a plurality of irradiation optical systems 211. The processing head 21 may also include a single material nozzle 212.

[0030] The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits (generates) the processing light EL via a light transmission member 41. An example of the light transmission member 41 is at least one of an optical fiber and a light pipe.

[0031] In the example shown in Figures 1 to 3, the processing system SYS includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 is optically connected to the light sources 4#1 and 4#2 via optical transmission members 41#1 and 41#2, respectively. The irradiation optical system 211 emits both the processed light EL propagating from the light source 4#1 via the optical transmission member 41#1 and the processed light EL propagating from the light source 4#2 via the optical transmission member 41#2. In the following description, when it is necessary to distinguish between the two processed light beams EL emitted by the irradiation optical system 211, the processed light EL generated by the light source 4#1 will be referred to as "processed light EL#1" and the processed light EL generated by the light source 4#2 will be referred to as "processed light EL#2."

[0032] The irradiation optical system 211 emits the processing light EL downward (i.e., toward the -Z side) from the irradiation optical system 211. A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the printing surface MS. For this reason, the irradiation optical system 211 may also be referred to as an irradiation device. Specifically, the irradiation optical system 211 can irradiate the processing light EL onto a target irradiation area (target irradiation position) EA that is set on the printing surface MS as an area to be irradiated (typically, focused) with the processing light EL. In the following description, when it is necessary to distinguish between the two target irradiation areas EA onto which the irradiation optical system 211 respectively irradiates the two processing beams EL, the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing beam EL#1 will be referred to as the "target irradiation area EA#1," and the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing beam EL#2 will be referred to as the "target irradiation area EA#2." Furthermore, under the control of the control device 7, the state of the irradiation optical system 211 can be switched between a state in which the processing beam EL is irradiated onto the target irradiation area EA and a state in which the processing beam EL is not irradiated onto the target irradiation area EA. The direction of the processing beam EL emitted from the irradiation optical system 211 is not limited to directly downward (i.e., aligned with the -Z-axis direction) and may be, for example, inclined by a predetermined angle relative to the Z-axis. In other words, the third optical system 216 (or the fθ lens 2162) described later is not limited to an optical system telecentric on the object side, and may be an optical system non-telecentric on the object side.

[0033] The irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL. For example, the irradiation optical system 211 may form a molten pool MP#1 on the printing surface MS by irradiating the printing surface MS with processing light EL#1. For example, the irradiation optical system 211 may form a molten pool MP#2 on the printing surface MS by irradiating the printing surface MS with processing light EL#2. The molten pool MP#1 and the molten pool MP#2 may be integrated. Alternatively, the molten pool MP#1 and the molten pool MP#2 may be separated from each other. However, the molten pool MP#1 does not necessarily have to be formed on the printing surface MS by irradiating the printing surface MS with processing light EL#1. The molten pool MP#2 does not necessarily have to be formed on the printing surface MS by irradiating the printing surface MS with processing light EL#2.

[0034] The material nozzle 212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. For this reason, the material nozzle 212 may also be referred to as a material supply member. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and a conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 5 is used as the conveying gas. However, the gas supplied from a gas supply source other than the gas supply source 5 may be used as the conveying gas. Although the material nozzle 212 is depicted as a tube in FIG. 2 , the shape of the material nozzle 212 is not limited to this. The material nozzle 212 supplies the modeling material M downward (i.e., toward the −Z side). The stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS. The direction of travel of the modeling material M supplied from the material nozzle 212 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, but may also be toward the −Z side (i.e., directly downward).

[0035] In this embodiment, the material nozzle 212 supplies the building material M to a position where at least one of the processing lights EL#1 and EL#2 is irradiated (i.e., at least one of the target irradiation areas EA#1 and EA#2). For this reason, the material nozzle 212 and the irradiation optical systems 211#1 and 211#2 are aligned so that a target supply area MA, which is set on the building surface MS as an area where the material nozzle 212 supplies the building material M, at least partially overlaps with at least one of the target irradiation areas EA#1 and EA#2. The size of the target supply area MA may be larger, smaller, or the same as the size of at least one of the target irradiation areas EA#1 and EA#2.

[0036] The material nozzle 212 may supply the building material M to the molten pool MP. Specifically, the material nozzle 212 may supply the building material M to at least one of the molten pool MP#1 and the molten pool MP#2. As described above, since the material nozzle 212 supplies the building material M from above the workpiece W, the material nozzle 212 may be considered to supply the building material M from a position away from the molten pool MP formed on the workpiece W. However, the material nozzle 212 does not have to supply the building material M to the molten pool MP. For example, the processing system SYS may melt the building material M from the material nozzle 212 using processing light EL emitted from the irradiation optical system 211 before the building material M from the material nozzle 212 reaches the workpiece W, and then adhere the molten building material M to the workpiece W.

[0037] The processing head 21 may be housed in a head housing 23. The head housing 23 is a housing having an accommodation space 231 (see FIG. 7 described later) formed therein for accommodating the irradiation optical system 211 and the material nozzle 212. In this case, the irradiation optical system 211 and the material nozzle 212 may be housed in the head housing 23.

[0038] The head housing 23 may function as a support member that supports the machining head 21. In order to support the machining head 21, the head housing 23 may be adjacent to the machining head 21 in a direction intersecting the Z-axis direction (for example, a direction along the XY plane). In other words, the head housing 23 may include a member that is adjacent to the machining head 21 in a direction intersecting the Z-axis direction (for example, a direction along the XY plane). The head housing 23 will be described in detail later with reference to FIG. 7, etc.

[0039] The head drive system 22 moves the machining head 21 under the control of the control device 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control device 7. The head drive system 22 moves the machining head 21, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Note that the operation of moving the machining head 21 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the machining head 21 around at least one of the rotation axis along the X-axis, the rotation axis along the Y-axis, and the rotation axis along the Z-axis.

[0040] 1 , the head drive system 22 moves the machining head 21 along each of the X-axis and Z-axis directions. In this case, the head drive system 22 may include, for example, a column 221 which is a wall-like member extending upward along the Z-axis direction from the bed 30 which is the base of the stage unit 3, an X guide member 222 attached to (or formed on) the column 221 and extending along the X-axis direction, an X block member 223 attached to (or movable along) the X guide member 222, a servo motor 224 which generates a driving force for moving the X block member 223, a Z guide member 225 attached to (or formed on) the X block member 223 and extending along the Z-axis direction, a Z block member 226 attached to (or movable along) the Z guide member 225, and a servo motor 227 which generates a driving force for moving the Z block member 226. In this case, the head drive system 22 (particularly the Z-block member 226 ) to which the machining head 21 is attached may be considered to be a support member that supports the machining head 21 .

[0041] The machining head 21 may be attached to a Z-block member 226. Specifically, the head housing 23 that houses the machining head 21 may be attached to the Z-block member 226. In this case, the Z-block member 226 may function as a support member that supports the machining head 21. To support the machining head 21, the Z-block member 226 may be adjacent to the machining head 21 in a direction intersecting the Z-axis direction (e.g., a direction along the X-Y plane). As a result, the machining head 21 moves in the X-axis direction in accordance with the movement of the X-block member 223, and moves in the Z-axis direction in accordance with the movement of the Z-block member 226. In other words, the position of the machining head 21 in the X-axis direction changes as the position of the X-block member 223 changes, and the position of the machining head 21 in the Z-axis direction changes as the position of the Z-block member 226 changes.

[0042] When the head drive system 22 moves the machining head 21, the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 changes. That is, the position of the machining head 21 changes relative to the stage 31 and the workpiece W. As a result, the relative positional relationship between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also changes. That is, the target irradiation areas EA#1 and EA#2 and the target supply area MA each move along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the build surface MS on which additional machining is performed). In this case, it may be considered that the head drive system 22 moves the machining head 21 so that the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the build surface MS.

[0043] The stage unit 3 includes a bed 30 , a stage 31 , and a stage drive system 32 .

[0044] The workpiece W is placed on the stage 31. For this reason, the stage 31 may be referred to as a placement device. The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may also be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the above-mentioned material nozzle 212 supplies the modeling material M during at least a portion of the period during which the workpiece W is placed on the stage 31.

[0045] The stage drive system 32 moves the stage 31. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the stage 31 around at least one of a rotation axis along the X-axis (i.e., A-axis), a rotation axis along the Y-axis (i.e., B-axis), and a rotation axis along the Z-axis (i.e., C-axis).

[0046] 1 , the stage drive system 32 moves the stage 31 along the Y-axis direction and rotates the stage 31 around the respective rotation axes of the A-axis and C-axis. In this case, the stage drive system 32 may include, for example, a Y guide member 321 attached to (or formed on) the bed 30 and extending along the Y-axis direction, a trunnion (Y block member) 322 attached to the Y guide member 321 and movable along the Y guide member 321, a servo motor 323 that generates a driving force for moving the trunnion 322, a cradle 324 attached to the trunnion 322 and rotatable about the A-axis relative to the trunnion 322, and a servo motor (not shown) that generates a driving force for rotating the cradle 324. The stage 31 may be attached to the cradle 324 so as to be rotatable about the C-axis relative to the cradle 324 using the driving force generated by the servo motor (not shown). As a result, the stage 31 moves in the Y-axis direction in accordance with the movement of the trunnion 322, rotates around the A-axis in accordance with the rotation of the cradle 324, and rotates around the C-axis.

[0047] When the stage drive system 32 moves the stage 31, the relative positional relationships between the machining head 21 and the stage 31 and the workpiece W change. That is, the position of the machining head 21 changes relative to the stage 31 and the workpiece W. As a result, the relative positional relationships between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also change. That is, the target irradiation areas EA#1 and EA#2 and the target supply area MA each move along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the build surface MS). In this case, the stage drive system 32 may be considered to be moving the stage 31 so that the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the build surface MS.

[0048] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２ At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0049] As described above, the processing system SYS includes multiple light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by light source 4#1 and the characteristics of the processing light EL#2 emitted by light source 4#2 may be the same. For example, the wavelength of the processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1) and the wavelength of the processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for the processing light EL#1 (or the object whose surface MS is the surface; the same applies below) may be the same as the absorptivity of the workpiece W for the processing light EL#2. In this case, the workpiece W's absorptance for the peak wavelength of processing light EL#1 may be the same as the absorptance for the peak wavelength of processing light EL#2. Alternatively, the characteristics of processing light EL#1 emitted by light source 4#1 may be different from the characteristics of processing light EL#2 emitted by light source 4#2. For example, the wavelength (typically, peak wavelength) of processing light EL#1 may be different from the wavelength (typically, peak wavelength) of processing light EL#2. For example, the wavelength band of processing light EL#1 may be different from the wavelength band of processing light EL#2. For example, the intensity of processing light EL#1 may be different from the intensity of processing light EL#2. For example, the absorptance of workpiece W for processing light EL#1 may be different from the absorptance of workpiece W for processing light EL#2.

[0050] In this embodiment, an example will be described in which the peak wavelength of the processing light EL#2 is shorter than the peak wavelength of the processing light EL#1. That is, in this embodiment, an example will be described in which the peak wavelength of the processing light EL#1 is longer than the peak wavelength of the processing light EL#2. As an example, the light source 4#1 may emit near-infrared light (e.g., light with a peak wavelength of 1070 nm or close to 1070 nm) as the processing light EL#1. The light source 4#2 may emit blue visible light (e.g., light with a peak wavelength of 450 nm or close to 450 nm) as the processing light EL#2.

[0051] In this embodiment, an example is described in which the processing system SYS includes multiple light sources 4. However, the processing system SYS does not necessarily have to include multiple light sources 4. The processing system SYS does not necessarily have to include a single light source 4. As an example, the processing system may include a light source that emits (supplies) light in a wide wavelength band or multiple wavelengths as the single light source 4. In this case, the processing system SYS may generate processing light EL#1 and processing light EL#2 having different wavelengths by wavelength-dividing the light emitted from this light source.

[0052] The gas supply source 5 is a supply source of purge gas for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply source 5 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0053] As described above, when the material nozzle 212 supplies the modeling material M together with a purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M is supplied from the material supply source 1. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M together with the purge gas for pressure-fed the modeling material M.

[0054] The control device 7 controls the operation of the machining system SYS. For example, the control device 7 may control the machining unit 2 (e.g., at least one of the machining head 21 and the head drive system 22) provided in the machining system SYS so as to perform additional machining on the workpiece W. For example, the control device 7 may control the stage unit 3 (e.g., the stage drive system 32) provided in the machining system SYS so as to perform additional machining on the workpiece W.

[0055] The control device 7 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 7 functions as a device that controls the operation of the machining system SYS when the arithmetic device executes a computer program. This computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 7, which will be described later. In other words, this computer program is a computer program for causing the control device 7 to function so as to cause the machining system SYS to perform the operations to be performed by the control device. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 7, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 7. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 7 via a network interface.

[0056] The control device 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 7 may control the movement mode of the processing head 21 by the head drive system 22. The control device 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control device 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0057] The control device 7 does not have to be provided inside the machining system SYS. For example, the control device 7 may be provided as a server or the like outside the machining system SYS. In this case, the control device 7 and the machining system SYS may be connected via a wired and / or wireless network (or a data bus and / or communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (e.g., at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 7 and the machining system SYS may be configured to be able to transmit and receive various information via the network. The control device 7 may also be able to transmit information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control device 7) that transmits information such as commands and control parameters to the control device 7 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 7 may be provided inside the machining system SYS, while a second control device that performs another part of the processing performed by the control device 7 may be provided outside the machining system SYS.

[0058] A computational model that can be constructed by machine learning may be implemented in the control device 7 by the computation device executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control device 7 may control the operation of the machining system SYS using the computational model. That is, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that a computational model that has been constructed by offline machine learning using teacher data may be implemented in the control device 7. Furthermore, the computational model implemented in the control device 7 may be updated by online machine learning on the control device 7. Alternatively, the control device 7 may control the operation of the machining system SYS using a computational model implemented in a device external to the control device 7 (i.e., a device provided outside the machining system SYS) in addition to or instead of the computational model implemented in the control device 7.

[0059] The recording medium for recording the computer program executed by the control device 7 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control device 7 when the control device 7 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array) or ASIC (Application Specific Integrated Circuit)) included in the control device 7, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0060] (1-2) Structure of the Irradiation Optical System 211 Next, the structure of the irradiation optical system 211 will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view showing the structure of the irradiation optical system 211.

[0061] As shown in FIG. 4 , the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 is incident. The first optical system 214 is an optical system that outputs the processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 is incident. The second optical system 215 is an optical system that outputs the processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 are incident. The third optical system 216 is an optical system that emits the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 toward the printing surface MS. Below, the first optical system 214, the second optical system 215, and the third optical system 216 will be described in order.

[0062] The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvanometer scanner 2144. The galvanometer scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not necessarily have to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. The galvanometer scanner 2144 does not necessarily have to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

[0063] The processing light EL#1 emitted from the light source 4#1 is incident on the collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 incident on the collimator lens 2141 into parallel light. Note that if the processing light EL#1 emitted from the light source 4#1 is parallel light (i.e., if the processing light EL#1, which is parallel light, enters the first optical system 214), the first optical system 214 does not need to include the collimator lens 2141. In other words, the installation of the collimator lens 2141 may be omitted. Furthermore, if an optical fiber is interposed between the light source 4#1 and the collimator lens 2141 as an optical transmission member for transmitting the processing light EL#1, the collimator lens 2141 may be positioned so that the front focus of the collimator lens 2141 is located near the exit end of the optical fiber, and the collimator lens 2141 may convert the processing light EL#1 emitted from the optical fiber as a diverging beam into parallel light. The processing light EL#1 converted into parallel light by the collimator lens 2141 is incident on the parallel plate 2142. A part of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. The other part of the processing light EL#1 incident on the parallel plate 2142 is reflected by the parallel plate 2142.

[0064] The processing light EL#1 that has passed through the parallel plate 2142 is incident on the galvanometer scanner 2144. Specifically, the processing light EL#1 that has passed through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvanometer scanner 2144.

[0065] The focus control optical system 2145 is an optical element that can change the focusing position CP of the processing light EL#1 (hereinafter referred to as the "focusing position CP#1"). Therefore, the focus control optical system 2145 may also be referred to as a focusing position changing element. Specifically, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 irradiated onto the printing surface MS. In the example shown in FIG. 4 , the irradiation direction of the processing light EL#1 irradiated onto the printing surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the printing surface MS with the processing light EL from above the workpiece W, the irradiation direction of the processing light EL#1 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 2145 may be considered to be capable of changing the focusing position CP#1 of the processing light EL#1 along a direction intersecting the manufacturing surface MS (e.g., the surface of the workpiece W or the structure layer SL).

[0066] The focus control optical system 2145 may change the condensing position CP#1 of the processing light EL#1 so that the condensing position CP#1 of the processing light EL#1 is located on the printing surface MS. In other words, the focus control optical system 2145 may change the condensing position CP#1 of the processing light EL#1 so that the focused processing light EL#1 is irradiated onto the printing surface MS. In other words, the focus control optical system 2145 may change the condensing position CP#1 of the processing light EL#1 so that a model is formed by the focused processing light EL#1. Alternatively, the focus control optical system 2145 may change the condensing position CP#1 of the processing light EL#1 so that the condensing position CP#1 of the processing light EL#1 is located at a position away from the printing surface MS along the Z-axis direction. In other words, the focus control optical system 2145 may change the condensing position CP#1 of the processing light EL#1 so that the defocused processing light EL#1 is irradiated onto the printing surface MS. In other words, the focus control optical system 2145 may change the condensing position CP#1 of the processing light EL#1 so that the object is formed by the processing light EL#1 in a defocused state.

[0067] The amount of energy transmitted per unit time from the processing light EL#1 in a focused state to the printing surface MS is different from the amount of energy transmitted per unit time from the processing light EL#1 in a defocused state to the printing surface MS. Furthermore, the amount of energy transmitted per unit time from the processing light EL#1 in a defocused state to the printing surface MS varies depending on the defocus amount of the processing light EL#1. Therefore, the focus control optical system 2145 may change the focusing position CP#1 of the processing light L#1 so that the amount of energy transmitted per unit time from the processing light EL#1 to the printing surface MS becomes the desired amount. The focus control optical system 2145 may change the focusing position CP#1 of the processing light L#1 so that the defocus amount of the processing light EL#1 becomes the desired amount.

[0068] The irradiation direction of the processing light EL#1 may refer to the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0069] The focus control optical system 2145 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 may change the focusing position CP#1 of the processing light EL#1 by moving at least one of the plurality of lenses along its optical axis direction.

[0070] When the focus control optical system 2145 changes the condensing position CP#1 of the processing light EL#1, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. For this reason, it can be considered that the focus control optical system 2145 changes the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS by changing the condensing position CP#1 of the processing light EL#1.

[0071] As described above, the galvanometer scanner 2144 does not necessarily have to include the focus control optical system 2145. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, even if the galvanometer scanner 2144 does not include the focus control optical system 2145, the processing system SYS can change the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1. For example, the processing system SYS may change the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#1. For example, the processing system SYS may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#1, thereby changing the positional relationship between the focusing position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the manufacturing surface MS.

[0072] The processing light EL#1 emitted from the focus control optical system 2145 is incident on the galvanometer mirror 2146. The galvanometer mirror 2146 deflects the processing light EL#1, thereby changing the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146. For this reason, the galvanometer mirror 2146 may also be referred to as a deflection member. When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position from which the processing light EL#1 is emitted from the processing head 21 is changed. When the position from which the processing light EL#1 is emitted from the processing head 21 is changed, the target irradiation area EA#1 on the printing surface MS onto which the processing light EL#1 is irradiated moves. In other words, the irradiation position on the printing surface MS onto which the processing light EL#1 is irradiated changes. Specifically, the target irradiation area EA#1 moves along the printing surface MS. The target irradiation area EA#1 moves in a direction along the printing surface MS. As described above, because the irradiation direction of processing light EL#1 intersects with the printing surface MS, the target irradiation area EA#1 moves along a direction intersecting with the irradiation direction of processing light EL#1. The irradiation position of processing light EL#1 is changed along the printing surface MS. The irradiation position of processing light EL#1 is changed along a direction along the printing surface MS. The irradiation position of processing light EL#1 is changed along a direction intersecting with the irradiation direction of processing light EL#1. In this way, the target irradiation area EA#1 may be an area that is stationary relative to the irradiation optical system 211 at a specific timing.

[0073] The galvanometer mirror 2146 includes, for example, an X-scan mirror 2146MX, an X-scan motor 2146AX, a Y-scan mirror 2146MY, and a Y-scan motor 2146AY. The processing light EL#1 emitted from the focus control optical system 2145 is incident on the X-scan mirror 2146MX. The X-scan mirror 2146MX reflects the processing light EL#1 incident on the X-scan mirror 2146MX toward the Y-scan mirror 2146MY. The Y-scan mirror 2146MY reflects the processing light EL#1 incident on the Y-scan mirror 2146MY toward the third optical system 216. Note that each of the X-scan mirror 2146MX and the Y-scan mirror 2146MY may be referred to as a galvanometer mirror.

[0074] The X-scan motor 2146AX is a specific example of an electrical component used to control the processing light EL#1. Specifically, the X-scan motor 2146AX is a drive system capable of electrically generating force. The X-scan motor 2146AX uses the electrically generated force to swing or rotate the X-scan mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2146MX relative to the optical path of the processing light EL#1 incident on the X-scan mirror 2146MX is changed. In this case, the swing or rotation of the X-scan mirror 2146MX causes the processing light EL#1 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#1 moves along the X-axis direction on the printing surface MS.

[0075] The Y-scan motor 2146AY is a specific example of an electrical component used to control the processing light EL#1. Specifically, the Y-scan motor 2146AY is a drive system capable of electrically generating force. The Y-scan motor 2146AY uses the electrically generated force to swing or rotate the Y-scan mirror 2146MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2146MY relative to the optical path of the processing light EL#1 incident on the Y-scan mirror 2146MY is changed. In this case, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#1 moves along the Y-axis direction on the printing surface MS.

[0076] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 is referred to as the machining unit area BSA (particularly, the machining unit area BSA#1). In this case, the target irradiation area EA#1 may be considered to move on a surface (first surface) of the printing surface MS that overlaps with the machining unit area BSA#1. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area BSA (particularly, the machining unit area BSA#1). The machining unit area BSA#1 indicates a virtual area (in other words, a range) in which the machining head 21 actually performs additional machining using the machining light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#1 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#1 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#1 indicates a region (in other words, a range) through which the target irradiation area EA#1 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area BSA#1 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area BSA#1 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area BSA#1.

[0077] As described above, when at least one of the machining head 21 and the stage 31 moves, the positional relationship between the machining head 21 and the printing surface MS changes. Therefore, the positional relationship between the galvanometer mirror 2146 provided in the machining head 21 and the printing surface MS changes. As a result, the machining unit area BSA#1 determined based on the machining head 21 (i.e., the machining unit area BSA#1 to which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS) moves on the printing surface MS. Therefore, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area BSA#1 relative to the printing surface MS.

[0078] 5A , under the assumption that the processing unit area BSA#1 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single direction within the processing unit area BSA#1. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single direction within a coordinate system defined based on the processing unit area BSA#1. In particular, under the assumption that the processing unit area BSA is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves back and forth along a single direction at least once within the processing unit area BSA#1 (in some cases, moves back and forth repeatedly and regularly (i.e., periodically)). In this case, the shape of the processing unit area BSA#1 in which the target irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA#1.

[0079] 6( a) and 6(b), the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple directions within the processing unit area BSA#1 under the assumption that the processing unit area BSA#1 is stationary (i.e., not moving) on ​​the printing surface MS. That is, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple directions within the processing unit area BSA#1 within a coordinate system defined based on the processing unit area BSA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves back and forth at least once along each of multiple directions within the processing unit area BSA#1 under the assumption that the processing unit area BSA#1 is stationary (i.e., not moving) on ​​the printing surface MS ... 6A shows an example in which the target irradiation area EA#1 moves back and forth along the X-axis and Y-axis directions within the processing unit area BSA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area BSA#1 is circular. In this case, the shape of the processing unit area BSA#1 through which the target irradiation area EA#1 moves may be circular. FIG. 6B shows an example in which the target irradiation area EA#1 moves back and forth along the X-axis and Y-axis directions within the processing unit area BSA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area BSA#1 is mesh-shaped. In this case, the shape of the processing unit area BSA#1 through which the target irradiation area EA#1 moves may be rectangular.

[0080] The control device 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area BSA#1 moves on the printing surface MS while using the galvanometer mirror 2146 to move the target irradiation area EA#1 within the machining unit area BSA#1. For example, in the example shown in FIG. 5A, the control device 7 may move the machining unit area BSA#1 along a movement trajectory MT0 that intersects (or, in some cases, is perpendicular to) the movement direction of the target irradiation area EA#1 within the machining unit area BSA#1. As a result, on the printing surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 5B. Specifically, the target irradiation area EA#1 may move along the movement trajectory MT0 of the machining unit area BSA#1 while also moving in a direction that intersects with the movement trajectory MT0. In other words, the target irradiation area EA#1 may move along a waveform-shaped movement trajectory MT#1 that oscillates around the movement trajectory MT0. 6(a) or 6(b), the control device 7 may move the processing unit area BSA#1 along a movement trajectory MT0 extending along at least one of a direction along the movement direction of the target irradiation area EA#1 within the processing unit area BSA#1 and a direction intersecting (or, in some cases, perpendicular to) the movement direction of the target irradiation area EA#1 within the processing unit area BSA#1. Note that Fig. 6(c) shows the movement trajectory MT#1 of the target irradiation area EA#1 on the printing surface MS when the processing unit area BSA#1 shown in Fig. 6(a) moves on the printing surface MS along the movement trajectory MT0.

[0081] The size of the processing unit area BSA#1 in the X-axis direction and the size of the processing unit area BSA#1 in the Y-axis direction may each be several millimeters, but the size of the processing unit area BSA#1 is not limited to several millimeters.

[0082] When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit areas BSA#1, the processing unit areas BSA#1 are scanned with the processing light EL#1 by the galvanometer mirror 2146. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 2146, the amount of energy transmitted from the processing light EL#1 to the processing unit areas BSA#1 is less likely to vary within the processing unit areas BSA#1. In other words, the amount of energy transmitted from the processing light EL#1 to the processing unit areas BSA#1 can be made uniform. As a result, the processing system SYS can form a model on the printing surface MS with relatively high printing accuracy.

[0083] However, the machining system SYS does not have to irradiate the manufacturing surface MS with the processing light EL#1 in units of processing unit areas BSA#1. The machining system SYS may irradiate the manufacturing surface MS with the processing light EL#1 without using the galvanometer mirror 2146. In this case, the target irradiation area EA#1 may move on the manufacturing surface MS in conjunction with the movement of at least one of the machining head 21 and the stage 31.

[0084] Referring again to FIG. 4 , the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 is a specific example of an electrical component used to control the processing light EL#1. Specifically, the power meter 2143 can detect the intensity of the processing light EL#1 incident on the power meter 2143. For example, the power meter 2143 may include a light-receiving element that detects the processing light EL#1 as light. Alternatively, the stronger the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat-detecting element that detects the heat of the processing light EL#1.

[0085] As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Because the parallel plate 2142 is disposed on the optical path of the processing light EL#1 between the light source 4#1 and the galvanometer mirror 2146, the power meter 2143 may be considered to detect the intensity of the processing light EL#1 traveling along the optical path between the light source 4#1 and the galvanometer mirror 2146. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the location of the power meter 2143 is not limited to the example shown in FIG. 4 . For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the printing surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

[0086] The detection result of the power meter 2143 is output to the control device 7. The control device 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (i.e., the detection result of the intensity of the processing light EL#1). For example, the control device 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS is a desired intensity. To control the intensity of the processing light EL#1, for example, the control device 7 may control the light source 4#1 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity. Note that the control device 7 capable of controlling (changing) the intensity of the processing light EL#1 may be referred to as an intensity change device.

[0087] An optical attenuator capable of actively changing the degree of optical attenuation may be disposed between the light source 4#1 and the parallel plate 2142. In this case, the control device 7 may change the intensity of the processing light EL#1 using the optical attenuator in addition to or instead of changing the intensity of the processing light EL#1 emitted from the light source 4#1.

[0088] As described above, the processing light EL#1 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#1 incident on the power meter 2143 may have an intensity capable of melting the shaping material M. However, if the processing light EL#1 having an intensity capable of melting the shaping material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 may be incident on the power meter 2143 with an intensity not strong enough to damage the power meter 2143. In other words, the first optical system 214 may weaken the intensity of the processing light EL#1 incident on the power meter 2143 so that the processing light EL#1 having an intensity not strong enough to damage the power meter 2143 is incident on the power meter 2143.

[0089] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the reflectivity of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2142 for the processing light EL#1, the weaker the intensity of the processing light EL#1 incident on the power meter 2143. Therefore, the reflectivity of the parallel plate 2142 may be set to a value low enough to realize a state in which the processing light EL#1 is incident on the power meter 2143 with an intensity that is not strong enough to damage the power meter 2143. For example, the reflectivity of the parallel plate 2142 may be less than 10%. For example, the reflectivity of the parallel plate 2142 may be less than a few percent. Plain glass may be used as the parallel plate 2142 with such low reflectivity.

[0090] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the first optical system 214 may cause the processing light EL#1 to be incident on the power meter 2143 via multiple parallel plates 2142. Specifically, the processing light EL#1 may be reflected multiple times by each of the multiple parallel plates 2142 and incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by a single parallel plate 2142. Therefore, there is a high possibility that the processing light EL#1 having an intensity not strong enough to damage the power meter 2143 will be incident on the power meter 2143.

[0091] A desired coating treatment may be applied to the surface of the parallel plate 2142 (particularly, at least one of the incident surface onto which the processing light EL#1 is incident and the reflecting surface onto which the processing light EL#1 is reflected). For example, the surface of the parallel plate 2142 may be subjected to anti-reflection coating (AR).

[0092] The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvanometer scanner 2154. The galvanometer scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not necessarily have to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. The galvanometer scanner 2154 does not necessarily have to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

[0093] The processing light EL#2 emitted from the light source 4#2 is incident on the collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 incident on the collimator lens 2151 into parallel light. Note that if the processing light EL#2 emitted from the light source 4#2 is parallel light (i.e., if the processing light EL#2, which is parallel light, enters the second optical system 215), the second optical system 215 does not need to include the collimator lens 2151. That is, the installation of the collimator lens 2151 may be omitted. Furthermore, if an optical fiber is interposed between the light source 4#2 and the collimator lens 2151 as an optical transmission member for transmitting the processing light EL#2, the collimator lens 2151 may be positioned so that the front focus of the collimator lens 2151 is located near the exit end of the optical fiber, and the collimator lens 2151 may convert the processing light EL#2 emitted from the optical fiber as a diverging beam into parallel light. The processing light EL#2 converted into parallel light by the collimator lens 2151 is incident on the parallel plate 2152. A part of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. The other part of the processing light EL#2 incident on the parallel plate 2152 is reflected by the parallel plate 2152.

[0094] Processing light EL#2 that has passed through the parallel plate 2152 is incident on a galvanometer scanner 2154. Specifically, processing light EL#2 that has passed through the parallel plate 2152 is incident on a focus control optical system 2155 of the galvanometer scanner 2154.

[0095] The focus control optical system 2155 is an optical element that can change the focusing position CP of the processing light EL#2 (hereinafter referred to as the "focusing position CP#2"). Therefore, the focus control optical system 2155 may also be referred to as a focusing position changing element. Specifically, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 irradiated onto the printing surface MS. In the example shown in FIG. 4 , the irradiation direction of the processing light EL#2 irradiated onto the printing surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the printing surface MS with the processing light EL from above the workpiece W, the irradiation direction of the processing light EL#2 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 2155 may be considered to be capable of changing the focusing position CP#2 of the processing light EL#2 along a direction intersecting the manufacturing surface MS (e.g., the surface of the workpiece W or the structure layer SL).

[0096] The focus control optical system 2155 may change the condensing position CP#2 of the processing light EL#2 so that the condensing position CP#2 of the processing light EL#2 is located on the printing surface MS. In other words, the focus control optical system 2155 may change the condensing position CP#2 of the processing light EL#2 so that the focused processing light EL#2 is irradiated onto the printing surface MS. In other words, the focus control optical system 2155 may change the condensing position CP#2 of the processing light EL#2 so that a model is formed by the focused processing light EL#2. Alternatively, the focus control optical system 2155 may change the condensing position CP#2 of the processing light EL#2 so that the condensing position CP#2 of the processing light EL#2 is located at a position away from the printing surface MS along the Z-axis direction. In other words, the focus control optical system 2155 may change the condensing position CP#2 of the processing light EL#2 so that the defocused processing light EL#2 is irradiated onto the printing surface MS. In other words, the focus control optical system 2155 may change the condensing position CP#2 of the processing light EL#2 so that the object is formed by the processing light EL#2 in a defocused state.

[0097] The amount of energy transmitted per unit time from the focused processing light EL#2 to the printing surface MS is different from the amount of energy transmitted per unit time from the defocused processing light EL#2 to the printing surface MS. Furthermore, the amount of energy transmitted per unit time from the defocused processing light EL#2 to the printing surface MS varies depending on the defocus amount of the processing light EL#2. Therefore, the focus control optical system 2155 may change the focusing position CP#2 of the processing light L#2 so that the amount of energy transmitted per unit time from the processing light EL#2 to the printing surface MS is the desired amount. The focus control optical system 2155 may change the focusing position CP#2 of the processing light L#2 so that the defocus amount of the processing light EL#2 is the desired amount.

[0098] The irradiation direction of the processing light EL#2 may refer to the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0099] The focus control optical system 2155 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focusing position CP of the processing light EL#2 by moving at least one of the plurality of lenses along its optical axis direction.

[0100] When the focus control optical system 2155 changes the condensing position CP#2 of the processing light EL#2, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. For this reason, it can be considered that the focus control optical system 2155 changes the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS by changing the condensing position CP#2 of the processing light EL#2.

[0101] As described above, the galvanometer scanner 2154 does not necessarily have to include the focus control optical system 2155. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, even if the galvanometer scanner 2154 does not include the focus control optical system 2155, the processing system SYS can change the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2. For example, the processing system SYS may change the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#2. For example, the processing system SYS may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#2, thereby changing the positional relationship between the focusing position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the manufacturing surface MS.

[0102] The processing light EL#2 emitted from the focus control optical system 2155 is incident on the galvanometer mirror 2156. The galvanometer mirror 2156 deflects the processing light EL#2, thereby changing the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156. For this reason, the galvanometer mirror 2156 may also be referred to as a deflection member. When the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position from which the processing light EL#2 is emitted from the processing head 21 is changed. When the position from which the processing light EL#2 is emitted from the processing head 21 is changed, the target irradiation area EA#2 on the printing surface MS onto which the processing light EL#2 is irradiated moves. In other words, the irradiation position on the printing surface MS onto which the processing light EL#2 is irradiated changes. Specifically, the target irradiation area EA#2 moves along the printing surface MS. The target irradiation area EA#2 moves in a direction along the printing surface MS. As described above, because the irradiation direction of processing light EL#2 intersects with the printing surface MS, the target irradiation area EA#2 moves along a direction intersecting with the irradiation direction of processing light EL#2. The irradiation position of processing light EL#2 is changed along the printing surface MS. The irradiation position of processing light EL#2 is changed along a direction along the printing surface MS. The irradiation position of processing light EL#2 is changed along a direction intersecting with the irradiation direction of processing light EL#2. In this way, the target irradiation area EA#2 may be an area that is stationary relative to the irradiation optical system 211 at a specific timing.

[0103] The galvanometer mirror 2156 includes, for example, an X-scan mirror 2156MX, an X-scan motor 2156AX, a Y-scan mirror 2156MY, and a Y-scan motor 2156AY. Processing light EL#2 emitted from the focus control optical system 2155 is incident on the X-scan mirror 2156MX. The X-scan mirror 2156MX reflects the processing light EL#2 incident on the X-scan mirror 2156MX toward the Y-scan mirror 2156MY. The Y-scan mirror 2156MY reflects the processing light EL#2 incident on the Y-scan mirror 2156MY toward the third optical system 216. Note that each of the X-scan mirror 2156MX and the Y-scan mirror 2156MY may be referred to as a galvanometer mirror.

[0104] The X-scan motor 2156AX is a specific example of an electrical component used to control the processing light EL#2. Specifically, the X-scan motor 2156AX is a drive system capable of electrically generating force. The X-scan motor 2156AX uses the electrically generated force to swing or rotate the X-scan mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2156MX relative to the optical path of the processing light EL#2 incident on the X-scan mirror 2156MX is changed. In this case, the swing or rotation of the X-scan mirror 2156MX causes the processing light EL#2 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#2 moves along the X-axis direction on the printing surface MS.

[0105] The Y-scan motor 2156AY is a specific example of an electrical component used to control the processing light EL#2. Specifically, the Y-scan motor 2156AY is a drive system capable of electrically generating force. The Y-scan motor 2156AY uses the electrically generated force to swing or rotate the Y-scan mirror 2156MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2156MY relative to the optical path of the processing light EL#2 incident on the Y-scan mirror 2156MY is changed. In this case, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#2 moves along the Y-axis direction on the printing surface MS.

[0106] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 is referred to as the machining unit area BSA (particularly, the machining unit area BSA#2). In this case, the target irradiation area EA#2 may be considered to move on a surface (first surface) of the printing surface MS that overlaps with the machining unit area BSA#2. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without change) is referred to as the machining unit area BSA (particularly, the machining unit area BSA#2). The machining unit area BSA#2 indicates a virtual area (in other words, a range) in which the machining head 21 actually performs additional machining using the machining light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#2 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#2 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#2 indicates a region (in other words, a range) through which the target irradiation area EA#2 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area BSA#2 may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area BSA#2 may be considered to be a virtual area located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area BSA#2.

[0107] As described above, when at least one of the machining head 21 and the stage 31 moves, the positional relationship between the machining head 21 and the printing surface MS changes. Therefore, the positional relationship between the galvanometer mirror 2156 provided in the machining head 21 and the printing surface MS changes. As a result, the machining unit area BSA#2 determined based on the machining head 21 (i.e., the machining unit area BSA#2 to which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) moves on the printing surface MS. Therefore, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area BSA#2 relative to the printing surface MS.

[0108] The characteristics of the processing unit area BSA#2 (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area BSA#1 described above. The movement pattern of the target irradiation area EA#2 within the processing unit area BSA#2 (e.g., movement trajectory, etc.) may be the same as the movement pattern of the target irradiation area EA#1 within the processing unit area BSA#1 described above. For this reason, detailed description of the characteristics of the processing unit area BSA#2 and the movement pattern of the target irradiation area EA#2 within the processing unit area BSA#2 (e.g., movement trajectory, etc.) will be omitted, but an example will be briefly described below. As shown in FIG. 5( a), under the assumption that the processing unit area BSA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along a single direction within the processing unit area BSA#2. As shown in Fig. 5(a), the processing unit area BSA#2 moves along the movement trajectory MT0 on the printing surface MS, so that the target irradiation area EA#2 moves along the movement trajectory MT#2 (e.g., a wave-shaped movement trajectory MT#2 oscillating around the movement trajectory MT0) on the printing surface MS. As shown in Fig. 6(a) and Fig. 6(b), the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along multiple directions within the processing unit area BSA#2 under the assumption that the processing unit area BSA#2 is stationary (i.e., not moving) on ​​the printing surface MS.

[0109] Typically, the processing unit area BSA#1 and the processing unit area BSA#2 coincide. In other words, the processing unit area BSA#1 is identical to the processing unit area BSA#2. Therefore, the galvanometer mirror 2156 may be considered to deflect the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area BSA#1. The galvanometer mirror 2146 may be considered to deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#2. However, the processing unit area BSA#1 and the processing unit area BSA#2 may be partially different.

[0110] However, the machining system SYS does not have to irradiate the manufacturing surface MS with the processing light EL#2 in units of the processing unit area BSA#2. The machining system SYS may irradiate the manufacturing surface MS with the processing light EL#2 without using the galvanometer mirror 2156. In this case, the target irradiation area EA#2 may move on the manufacturing surface MS in accordance with the movement of at least one of the machining head 21 and the stage 31.

[0111] Referring again to FIG. 4 , the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. The power meter 2153 is a specific example of an electrical component used to control the processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 incident on the power meter 2153. For example, the power meter 2153 may include a light-receiving element that detects the processing light EL#2 as light. Alternatively, the stronger the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat-detecting element that detects the heat of the processing light EL#2.

[0112] As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Because the parallel plate 2152 is disposed on the optical path of the processing light EL#2 between the light source 4#2 and the galvanometer mirror 2156, the power meter 2153 may be considered to detect the intensity of the processing light EL#2 traveling along the optical path between the light source 4#2 and the galvanometer mirror 2156. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the location of the power meter 2153 is not limited to the example shown in FIG. 4 . For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the printing surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

[0113] The detection result of the power meter 2153 is output to the control device 7. The control device 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (i.e., the detection result of the intensity of the processing light EL#2). For example, the control device 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the printing surface MS is a desired intensity. To control the intensity of the processing light EL#2, for example, the control device 7 may control the light source 4#2 based on the detection result of the power meter 2153 to change the intensity of the processing light EL#2 emitted from the light source 4#2. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#2 having an appropriate intensity. Note that the control device 7 capable of controlling (changing) the intensity of the processing light EL#2 may be referred to as an intensity change device.

[0114] An optical attenuator capable of actively changing the degree of optical attenuation may be disposed between the light source 4#2 and the parallel plate 2152. In this case, the control device 7 may change the intensity of the processing light EL#2 using the optical attenuator in addition to or instead of changing the intensity of the processing light EL#2 emitted from the light source 4#2.

[0115] As described above, the processing light EL#2 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#2 incident on the power meter 2153 may have an intensity capable of melting the shaping material M. However, if the processing light EL#2 having an intensity capable of melting the shaping material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 may be incident on the power meter 2153 with an intensity not strong enough to damage the power meter 2153. In other words, the second optical system 215 may weaken the intensity of the processing light EL#2 incident on the power meter 2153 so that the processing light EL#2 having an intensity not strong enough to damage the power meter 2153 is incident on the power meter 2153.

[0116] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the reflectivity of the parallel plate 2152 for the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2152 for the processing light EL#2, the weaker the intensity of the processing light EL#2 incident on the power meter 2153. Therefore, the reflectivity of the parallel plate 2152 may be set to a value low enough to realize a state in which the processing light EL#2 is incident on the power meter 2153 with an intensity not strong enough to damage the power meter 2153. For example, the reflectivity of the parallel plate 2152 may be less than 10%. For example, the reflectivity of the parallel plate 2152 may be less than a few percent. Plain glass may be used as the parallel plate 2152 with such low reflectivity.

[0117] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the second optical system 215 may cause the processing light EL#2 to be incident on the power meter 2153 via multiple parallel plates 2152. Specifically, the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by a single parallel plate 2152. Therefore, there is a high possibility that the processing light EL#2 having an intensity not strong enough to damage the power meter 2153 will be incident on the power meter 2153.

[0118] A desired coating treatment may be applied to the surface of the parallel plate 2152 (particularly, at least one of the incident surface onto which the processing light EL#2 is incident and the reflecting surface onto which the processing light EL#2 is reflected). For example, the surface of the parallel plate 2152 may be subjected to anti-reflection coating (AR).

[0119] The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162 .

[0120] Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 are each incident on a prism mirror 2161. The prism mirror 2161 reflects each of processing light EL#1 and EL#2 toward an fθ lens 2162. The prism mirror 2161 reflects processing light EL#1 and EL#2, which are incident on the prism mirror 2161 from different directions, in the same direction (specifically, toward the fθ lens 2162).

[0121] Furthermore, if the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 can each be directly incident on the fθ lens 2162, the third optical system 216 does not need to be equipped with a prism mirror 2161.

[0122] The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the printing surface MS. In other words, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 2162 are irradiated onto the printing surface MS. For this reason, the fθ lens 2162 may also be referred to as an objective optical element.

[0123] The fθ lens 2162 may be an optical element capable of focusing each of the processing beams EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 2162 may be referred to as a focusing optical system. The focusing surface of the fθ lens 2162 may be set, for example, on the printing surface MS. In this case, the third optical system 216 may be considered to have a focusing optical system whose projection characteristic is fθ. However, the third optical system 216 may also have a focusing optical system whose projection characteristic is different from fθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f tan θ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f sin θ.

[0124] The optical axis AX of the fθ lens 2162 is an axis along the Z-axis. Therefore, the fθ lens 2162 emits each of the processing lights EL#1 and EL#2 along the Z-axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be the Z-axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions. The fθ lens 2162 may be composed of a single lens or multiple lenses. The fθ lens 2162 may include a reflective mirror or a diffractive optical element.

[0125] The irradiation optical system 211 described above may be housed in a housing space 2171 inside the housing unit 217. The housing unit 217 housing the irradiation optical system 211 will be described below with reference to Fig. 7. Fig. 7 is a perspective view showing the housing unit 217 housing the irradiation optical system 211. Note that the housing unit 217 shown in Fig. 7 is just an example, and the structure of the housing unit 217 is not limited to the example shown in Fig. 7.

[0126] As shown in FIG. 7 , the housing unit 217 includes a housing 21741, a housing 21751, a housing 21743, a housing 21753, a housing 21745, a housing 21755, a housing 21761, and a housing 21762. The housing 21741 is a housing for accommodating the collimator lens 2141 therein. The housing 21751 is a housing for accommodating the collimator lens 2151 therein. The housing 21743 is a housing for accommodating the parallel plate 2142 and the power meter 2143 therein. The housing 21753 is a housing for accommodating the parallel plate 2152 and the power meter 2153 therein. The housing 21745 is a housing for accommodating the focus control optical system 2145 therein. The housing 21755 is a housing for accommodating the focus control optical system 2155 therein. The housing 21761 is a housing for accommodating therein the galvanometer mirror 2146, the galvanometer mirror 2156, and the prism mirror 2161. The housing 21762 is a housing for accommodating therein the fθ lens 2162.

[0127] The housing 21741, the housing 21751, the housing 21743, the housing 21753, the housing 21745, the housing 21755, the housing 21761, and the housing 21762 may be connected to each other. For example, in the example shown in FIG. 7 , the housing 21741 is connected to the housing 21743, the housing 21751 is connected to the housing 21753, the housing 21743 is connected to the housing 21745, the housing 21753 is connected to the housing 21755, the housings 21745 and 21755 are connected to the housing 21761, and the housing 21761 is connected to the housing 21762. In this case, the two housings connected to each other may be connected so as to be separable from each other. Alternatively, the two housings connected to each other may be connected so as not to be separable from each other. The two housings connected to each other may be connected to each other using a fastening member such as a screw.

[0128] The housings 21751, 21743, 21753, 21745, 21755, 21761, and 21762 may be aligned along the Z-axis direction (i.e., the irradiation direction of the processing lights EL#1 and EL#2, and the direction of the optical axis AX of the fθ lens 2162). For example, in the example shown in Fig. 7 , the housings 21741 and 21743 are aligned along the Z-axis direction, the housings 21751 and 21753 are aligned along the Z-axis direction, the housings 21743 and 21745 are aligned along the Z-axis direction, the housings 21753 and 21755 are aligned along the Z-axis direction, the housings 21745 and 21755 and the housing 21761 are aligned along the Z-axis direction, and the housings 21761 and 21762 are aligned along the Z-axis direction. In this case, the size of the housing unit 217 can be reduced in the direction intersecting the Z-axis direction, which means that the size of the irradiation optical system 211 can be reduced in the direction intersecting the Z-axis direction.

[0129] The positional relationship between the X scan motors 2146AX and 2156AX and the Y scan motors 2146AY and 2156AY may be set in order to reduce the size of the irradiation optical system 211 in a direction intersecting the Z-axis direction. For example, as shown in Fig. 8 , which is a bottom view showing the positional relationship between the X scan motors 2146AX and 2156AX and the Y scan motors 2146AY and 2156AY, the larger the angle θ1 formed between the rotation axis (i.e., motor axis) M46X of the X scan motor 2146AX intersecting the Z-axis direction and the axis 46A connecting the two Y scan motors 2146AY and 2156AY and passing through the optical axis AX of the fθ lens 2162, the smaller the size of the irradiation optical system 211 in the direction intersecting the Z-axis direction (the X-axis direction in the example shown in Fig. 8 ). Similarly, the larger the angle θ2 formed between the rotation axis (i.e., the motor axis) M56X of the X-scan motor 2156AX, which intersects the Z-axis direction, and the axis 46A, the smaller the size of the irradiation optical system 211 in the direction intersecting the Z-axis direction (the X-axis direction in the example shown in FIG. 8 ). Therefore, the angles θ1 and θ2 may be set so that the size of the irradiation optical system 211 in the direction intersecting the Z-axis direction (the X-axis direction in the example shown in FIG. 8 ) is a desired size. As an example, each of the angles θ1 and θ2 may be set to, for example, 30° or greater. As a result, the size of the irradiation optical system 211 in the direction intersecting the Z-axis direction (the X-axis direction in the example shown in FIG. 8 ) is smaller than when at least one of the angles θ1 and θ2 is less than 30°.

[0130] Referring again to FIG. 7 , the housing unit 217 may be housed in a head housing 23 that houses the machining head 21. That is, the irradiation optical system 211 may be housed in the head housing 23 with the irradiation optical system 211 housed in the housing unit 217. For example, in the example shown in FIG. 7 , the head housing 23 includes a plate-shaped rear wall member 232 along the XZ plane and a pair of side wall members 233 that protrude along the −Y axis direction from the +X side end and the −X side end of the rear wall member 232 and that extend along the YZ plane. In this case, the space surrounded by the rear wall member 232 and the pair of side wall members 233 serves as a housing space 231 for housing the machining head 21. The housing unit 217 may be housed in the housing space 231 that is surrounded by the rear wall member 232 and the pair of side wall members 233.

[0131] As described above, the head housing 23 may function as a support member that supports the machining head 21. In this case, the rear wall member 232 and the pair of side wall members 233 may also function as support members that support the machining head 21 (particularly, the irradiation optical system 211). The rear wall member 232 and the pair of side wall members 233 may also be adjacent to the machining head 21 in a direction intersecting the Z-axis direction (for example, a direction along the XY plane).

[0132] 7 , the housing unit 217 may be housed in the head housing 23 using an alignment member 2170 for aligning the housing unit 217 with the head housing 23. The alignment member 2170 may be a member for aligning the housing unit 217 with respect to the reference coordinates of the head drive system 22 to which the head housing 23 is attached. As a result, the housing unit 217 (particularly the irradiation optical system 211 housed in the housing unit 217) is housed in an appropriate position within the housing unit 217. This reduces the load of aligning the irradiation optical system 211.

[0133] 7, the material nozzle 212 is omitted for the sake of simplicity. However, the material nozzle 212 may be attached at a fixed position relative to the irradiation optical system 211. In other words, the material nozzle 212 may be attached at a fixed position relative to the housing unit 217 that houses the irradiation optical system 211. For example, the material nozzle 212 may be attached to an alignment member 2170. For example, the material nozzle 212 may be attached to the housing unit 217. For example, the material nozzle 212 may be attached to the head housing 23.

[0134] As can be seen from the appearance of the machining system SYS shown in FIG. 1 , a general machine tool (e.g., an NC machine tool) may be used to manufacture the machining system SYS. In this case, the head housing 23 may be attached to the machine tool's spindle as a tool (i.e., as an end mill). Alternatively, the head housing 23 may be attached to a position secured by removing the machine tool's spindle. In either case, the head housing 23 (i.e., the machining head 21) can be attached to the general machine tool. In this case, if the head housing 23 is reduced in size by arranging the housings 21751 to 21762 in the Z-axis direction as described above, it becomes even easier to attach the head housing 23 (i.e., the machining head 21) to the general machine tool.

[0135] The head housing 23 may house the irradiation optical system 211 to facilitate maintenance of the irradiation optical system 211. That is, the housing unit 217 may house the irradiation optical system 211 to facilitate maintenance of the irradiation optical system 211. In other words, the housing unit 217 housing the irradiation optical system 211 may be housed in the head housing 23 to facilitate maintenance of the irradiation optical system 211. FIG. 9 shows an example of the irradiation optical system 211 housed in the head housing 23 to facilitate maintenance of the irradiation optical system 211. As shown in FIG. 9 , the irradiation optical system 211 may be housed in the head housing 23 so that electrical components that are relatively likely to require maintenance are arranged at the front within the head housing 23. As described above, a specific example of the electrical components includes at least one of the power meter 2143, the power meter 2153, the X-scan motor 2146AX, the X-scan motor 2156AX, the Y-scan motor 2146AY, and the Y-scan motor 2146AY.

[0136] Specifically, as described above, since the machining head 21 is disposed in the chamber space 63IN where additional machining is performed, the head housing 23 that houses the machining head 21 is also disposed in the chamber space 63IN. An openable / closable door 65 may be formed on the partition member 61 of the housing 6 that defines the chamber space 63IN for maintenance of the irradiation optical system 211. In this case, as shown in FIG. 9 , the irradiation optical system 211 may be housed in the head housing 23 so that an operator performing maintenance on the irradiation optical system 211 can easily access the irradiation optical system 211 from outside the housing 6 via the door 65. As an example, as shown in FIG. 9 , the head housing 23 may be disposed so that the chamber space 63IN is located on the opposite side of the rear wall member 232 of the head housing 23 relative to the machining head 21 (particularly, the irradiation optical system 211) (the -Y side in the example shown in FIG. 9 ). Furthermore, the door 65 may be disposed closer to the chamber space 63IN than the machining head 21 (particularly, the irradiation optical system 211) (the -Y side in the example shown in FIG. 9 ). In this case, the electrical components may be disposed at a position closer to the door 65 than the rear wall member 232. For example, the irradiation optical system 211 may be housed in the head housing 23 so that a distance D1 between the electrical components and the rear wall member 232 in a direction intersecting the optical axis AX of the fθ lens 2162 (in the example shown in FIG. 9 , a direction intersecting the Z axis, i.e., the Y axis direction) is longer than a distance D2 between the optical axis AX of the fθ lens 2162 and the rear wall member 232 in the direction intersecting the optical axis AX. In the example shown in FIG. 9 , the power meters 2143 and 2153 are disposed in the head housing 23 so that a distance D11 between each of the power meters 2143 and 2153 and the rear wall member 232 is longer than the distance D2 between the optical axis AX and the rear wall member 232. 9, the X scanning motors 2146AX and 2156AX are disposed in the head housing 23 so that the distance D12 between each of the X scanning motors 2146AX and 2156AX and the rear wall member 232 is longer than the distance D2 between the optical axis AX and the rear wall member 232. As a result, compared to when distance D1 is shorter than distance D2, electrical components that are more likely to require maintenance are disposed closer to the door 65. As a result, maintenance of the electrical components is easier.

[0137] The processing system SYS may cool at least a part of the irradiation optical system 211 housed in the housing space 2171. That is, the processing system SYS may cool optical components included in the irradiation optical system 211. As a result, even if the irradiation optical system 211 is heated due to the processing light EL passing through the irradiation optical system 211, the temperature of the irradiation optical system 211 is maintained at an appropriate temperature. For example, the processing system SYS may cool at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. For example, the processing system SYS may cool at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. For example, the processing system SYS may cool at least one of the prism mirror 2161 and the fθ lens 2162. An example in which the processing system SYS cools the fθ lens 2162 will be described below.

[0138] The processing system SYS may use a gas as a refrigerant to cool at least a part of the irradiation optical system 211 housed in the accommodation space 2171. For example, the processing system SYS may use a liquid as a refrigerant to cool at least a part of the irradiation optical system 211 housed in the accommodation space 2171. In this case, as shown in FIG. 10 , the housing unit 217 may be formed with a refrigerant supply nozzle 2172 that supplies refrigerant to at least a part of the irradiation optical system 211 (at least a part of the fθ lens 2162 in the example shown in FIG. 10 ).

[0139] 10 , the coolant supply nozzle 2172 is directed obliquely downward so that the coolant supply direction from the coolant supply nozzle 2172 is directed toward the position where the processing beams EL#1 and EL#2 pass through the fθ lens 2162. However, the coolant supply direction from the coolant supply nozzle 2172 is not limited to obliquely downward. The coolant is not limited to a gas, and may be, for example, a liquid.

[0140] As described above, the fθ lens 2162 irradiates the printing surface MS with the processing light beams EL#1 and EL#2. If the characteristics of the processing light beams EL#1 and EL#2 differ, the heating pattern of the first portion 21621 of the fθ lens 2162 irradiated with the processing light beam EL#1 may differ from the heating pattern of the second portion 21622 of the fθ lens 2162 irradiated with the processing light beam EL#2. The heating pattern may include at least one of the following: the temperature of the heated portion, the temperature distribution of the heated portion, the amount of change in the temperature of the heated portion (e.g., the amount of change in temperature per unit time), and the amount of heat transferred to the heated portion (e.g., the amount of heat per unit time). For example, if the intensities of the processing light beams EL#1 and EL#2 differ, the heating pattern of the first portion 21621 may differ from the heating pattern of the second portion 21622. As a result, the temperature of the first portion 21621 and the temperature of the second portion 21622 may differ. For this reason, the processing system SYS may cool the fθ lens 2162 so that the cooling manner of the first portion 21621 and the cooling manner of the second portion 21622 differ. In other words, the processing system SYS may cool the fθ lens 2162 so that the difference in temperature between the first portion 21621 and the second portion 21622 does not become excessively large by changing the cooling manner of the first portion 21621 and the cooling manner of the second portion 21622. The processing system SYS may cool the fθ lens 2162 so that the temperature of the first portion 21621 and the temperature of the second portion 21622 become the same by changing the cooling manner of the first portion 21621 and the cooling manner of the second portion 21622. The cooling mode may include at least one of the temperature of the cooled area, the temperature distribution of the cooled area, the amount of change in temperature of the cooled area (e.g., the amount of change in temperature per unit time), and the amount of heat absorbed from the cooled area (e.g., the amount of heat per unit time).

[0141] As an example, when the intensity of the processing light EL#1 is higher than the intensity of the processing light EL#2, the first portion 21621 may be heated faster than the second portion 21622. In this case, the processing system SYS may cool the first portion 21621 faster than the second portion 21622.

[0142] The intensities of the processing light EL#1 and the processing light EL#2 can be detected by the power meters 2143 and 2153, respectively. Therefore, the processing system SYS may cool the fθ lens 2162 based on the detection results of the power meters 2143 and 2153. For example, when the detection results of the power meters 2143 and 2153 indicate that the intensity of the processing light EL#1 is higher than the intensity of the processing light EL#2, the processing system SYS may cool the first portion 21621 faster than the second portion 21622.

[0143] When the coolant supply nozzle 2172 supplies a gas as a coolant, the gas supplied from the coolant supply nozzle 2172 may be set to increase the pressure of the storage space 2171 inside the housing unit 217 to be higher than the pressure of the space outside the housing unit 217 (e.g., the chamber space 63IN). In other words, the storage space 2171 inside the housing unit 217 may be a positive pressure space. In this case, compared to when the storage space 2171 is not a positive pressure space, the likelihood of unwanted material (e.g., the modeling material M) entering the housing unit 217 from the space outside the housing unit 217 (e.g., the chamber space 63IN) is reduced. This reduces the likelihood of unwanted material adhering to the irradiation optical system 211. As a result, the likelihood of unwanted material adhering to the irradiation optical system 211 interfering with the irradiation of the processing light EL onto the modeling surface MS is reduced.

[0144] (2) Operation of the Machining System SYS Next, the operation of the machining system SYS will be described.

[0145] (2-1) Additive Processing Operation First, the additive processing (additive processing operation) performed by the processing system SYS on the workpiece W will be described. The additive processing performed on the workpiece W corresponds to an operation of forming a shaped object by adding an object that is integrated with (or separable from) the workpiece W to the workpiece W. For convenience of explanation, the following describes additive processing for forming a three-dimensional structure ST, which is an object having a desired shape. As described above, the processing system SYS forms the three-dimensional structure ST by performing additive processing based on the laser build-up welding method. For this reason, the processing system SYS may form the three-dimensional structure ST by performing existing additive processing that complies with the laser build-up welding method. Below, an example of an operation of forming the three-dimensional structure ST using the laser build-up welding method will be briefly described.

[0146] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional structure ST to be formed. Measurement data of a three-dimensional object measured by at least one of a measuring device installed within the processing system SYS and a three-dimensional shape measuring device installed separately from the processing system SYS may be used as the three-dimensional model data. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, multiple layered substructures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the processing system SYS sequentially forms multiple structural layers SL layer by layer based on data of multiple layers obtained by slicing a three-dimensional model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST is formed, which is a layered structure in which multiple structural layers SL are stacked. The structural layers SL do not necessarily have to be layered structures. The flow of operations for forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described below.

[0147] First, the operation of forming each structure layer SL will be described with reference to FIGS. 11A to 11E. Under the control of the control device 7, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that processing unit areas BSA#1 and BSA#2 are set in desired areas on the printing surface MS corresponding to the surface of the workpiece W or the surface of the printed structure layer SL. Then, the irradiation optical system 211 irradiates the processing unit areas BSA#1 and BSA#2 with processing beams EL#1 and EL#2, respectively. At this time, the focusing positions CP#1 and CP#2 at which the processing beams EL#1 and EL#2 are focused in the Z-axis direction may coincide with the printing surface MS. Alternatively, the focusing positions CP#1 and CP#2 at which the processing beams EL#1 and EL#2 are focused in the Z-axis direction may be offset from the printing surface MS. As a result, as shown in Figure 11(a), molten pools MP#1 and MP#2 are formed on the building surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Furthermore, as shown in Figure 11(b), the processing system SYS supplies the building material M from the material nozzle 212 under the control of the control device 7. As a result, the building material M is supplied to each of the molten pools MP#1 and MP#2. The building material M supplied to the molten pool MP#1 is melted by the processing beam EL#1 irradiated onto the molten pool MP#1. Similarly, the building material M supplied to the molten pool MP#2 is melted by the processing beam EL#2 irradiated onto the molten pool MP#2.

[0148] Furthermore, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to move the target irradiation areas EA#1 and EA#2 within the machining unit areas BSA#1 and BSA#2, respectively. That is, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to scan the machining unit areas BSA#1 and BSA#2 with the machining beams EL#1 and EL#2, respectively. When the target irradiation area EA#1 moves and the machining beam EL#1 is no longer irradiated onto the molten pool MP#1, the molten build material M in the molten pool MP#1 cools and solidifies (i.e., solidifies). Similarly, when the target irradiation area EA#2 moves and the machining beam EL#2 is no longer irradiated onto the molten pool MP#2, the molten build material M in the molten pool MP#2 cools and solidifies (i.e., solidifies). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in Figure 11(c) , within the processing unit areas BSA#1 and BSA#2 through which the molten pools MP#1 and MP#2 move, a molded object made of the solidified mold material M is deposited on the mold surface MS.

[0149] 11(c), for ease of explanation, the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 are physically separated. However, the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 may be integrated. In particular, when the processing unit areas BSA#1 and BSA#2 coincide (or partially overlap), the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 may be integrated. During a period in which the target irradiation areas EA#1 and EA#2 are moving within the physically separated machining unit areas BSA#1 and BSA#2, respectively, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 move on the printing surface MS. In other words, the machining system SYS may move the target irradiation areas EA#1 and EA#2 within the machining unit areas BSA#1 and BSA#2, respectively, and move the machining unit areas BSA#1 and BSA#2 on the printing surface MS in parallel.

[0150] Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas BSA#1 and BSA#2, respectively, the machining system SYS does not have to move the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 do not move on the printing surface MS. In this case, after additional machining (i.e., printing) within the machining unit areas BSA#1 and BSA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 are set in another area on the printing surface MS. In other words, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 move on the printing surface MS. In this case, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have already been set (i.e., the area where additional machining has already been performed) and the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have newly been set (i.e., the area where additional machining will now be performed) are adjacent to each other. In particular, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have already been set do not overlap with the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have newly been set. However, the processing system SYS may move at least one of the processing head 21 and the stage 31 so that the area on the printing surface MS where processing unit areas BSA#1 and BSA#2 have already been set partially overlaps with the area on the printing surface MS where processing unit areas BSA#1 and BSA#2 have newly been set.

[0151] The machining system SYS repeats a series of molding processes, including forming a molten pool MP by irradiating the machining unit area BSA with the machining light EL, supplying the molding material M to the molten pool MP, melting the supplied molding material M, and solidifying the molten molding material M, while moving the machining head 21 relative to the molding surface MS in at least one of the X-axis direction and the Y-axis direction, as shown in Fig. 11(d) . As a result, as shown in Fig. 11(e) , a structure layer SL corresponding to a molded object, which is an aggregate of the melted and then solidified molding material M, is formed on the molding surface MS. In other words, a structure layer SL corresponding to an aggregate of molded objects formed on the molding surface MS in a pattern corresponding to the movement trajectory of the machining unit area BSA (i.e., a structure layer SL having a shape corresponding to the movement trajectory of the machining unit area BSA in a planar view) is formed.

[0152] Note that when the target irradiation area EA#1 is set in an area where it is not desired to form an object, the processing system SYS does not have to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYS may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop the supply of the building material M. Alternatively, the processing system SYS may supply the building material M to the target irradiation area EA#1 and irradiate the target irradiation area EA#1 with the processing light EL#1 at an intensity that does not cause the formation of a molten pool MP. The same applies when the target irradiation area EA#2 is set in an area where it is not desired to form an object.

[0153] The movement path (in other words, the movement trajectory) of the machining unit area BSA may be referred to as a machining path (in other words, a tool path). The machining path information may include information (e.g., coordinate information) about a plurality of positions where the machining unit areas BSA are set sequentially. In this case, each position where the machining unit areas BSA are set may be referred to as a unit machining path. The control device 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area BSA moves along the movement path specified by the machining path information. Note that, because additional machining (i.e., shaping) is performed within the machining unit area BSA, the machining path may also refer to the path along which the machining unit 2 performs shaping on the shaping surface MS.

[0154] The machining system SYS repeatedly performs operations for forming such a structure layer SL based on the three-dimensional model data under the control of the control device 7. Specifically, before performing operations for forming the structure layer SL, the control device 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYS performs operations for forming the first structure layer SL#1 on the build surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. Specifically, the control device 7 acquires machining path information for forming the first structure layer SL#1, which is generated based on the slice data corresponding to the structure layer SL#1. Note that the control device 7 may generate the machining path information after or before the machining system SYS starts additional machining. Thereafter, the control device 7 controls the machining unit 2 and the stage unit 3 based on the machining path information to form the first structure layer SL#1. As a result, the structure layer SL#1 is formed on the build surface MS as shown in FIG. 12( a). Thereafter, the machining system SYS sets the surface (i.e., the upper surface) of the structure layer SL#1 as a new build surface MS, and then builds a second structure layer SL#2 on the new build surface MS. To build the structure layer SL#2, the control device 7 first controls at least one of the head drive system 22 and the stage drive system 32 so that the machining head 21 moves along the Z axis relative to the stage 31. Specifically, the control device 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the machining head 21 toward the +Z side and / or move the stage 31 toward the −Z side so that the machining unit areas BSA#1 and BSA#2 are set on the surface of the structure layer SL#1 (i.e., the new build surface MS). Thereafter, under the control of the control device 7, the machining system SYS builds the structure layer SL#2 on the structure layer SL#1 based on the slice data corresponding to the structure layer SL#2, using operations similar to those used to build the structure layer SL#1. As a result, a structural layer SL#2 is formed as shown in Fig. 12(b) . Thereafter, the same operation is repeated until all structural layers SL that constitute the three-dimensional structure ST to be formed on the workpiece W are formed.As a result, as shown in FIG. 12( c ), a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

[0155] In addition, the control device 7 (or another device that generates processing path information, the same applies hereinafter in this paragraph) may generate processing path information that is provided with information that can identify whether the processing path is a structure that functions as a wall or a structure for infill (i.e., a structure for filling the inside of the three-dimensional structure ST).

[0156] Furthermore, the control device 7 (or another device that generates processing path information; hereinafter the same applies in this paragraph) may generate processing path information including bead width information that defines the width of the object (which may also be referred to as line width or bead width). Specifically, the control device 7 may generate processing path information for forming an object using multiple bead widths so that an infill object has no gaps and / or a thin object (particularly an object that functions as a wall) can be appropriately formed. In this case, the processing unit 2 may form an object for each bead width.

[0157] Furthermore, the control device 7 (or another device that generates machining path information; the same applies hereinafter in this paragraph) may generate machining path information that the machining unit 2 uses to finish the formed object, in addition to the machining path information that the machining unit 2 uses to form the object. The finishing process may include processing that reduces the flatness of the surface of the object (i.e., reducing the surface roughness or making the surface closer to a flat surface). In this case, the algorithm for generating the machining path information that the machining unit 2 uses to form the object may be the same as or different from the algorithm for generating the machining path information that the machining unit 2 uses to finish the formed object.

[0158] Furthermore, if the machining system SYS is equipped with a measurement device, the control device 7 (or another device that generates machining path information; the same applies hereinafter in this paragraph) may generate measurement path information that indicates the path along which the measuring device performs measurement, in addition to or instead of machining path information that indicates the path along which the machining unit 2 performs modeling (machining). In this case, the algorithm for generating the measurement path information may be the same as or different from the algorithm for generating the machining path information. Note that an example of a measurement device is a monitoring device (for example, an imaging device that images the spot) that monitors the state of the spot formed by the measurement light on the modeling surface MS.

[0159] (2-2) Specific examples of how to use the two processing lights EL#1 and EL#2 As described above, the processing system SYS can perform additional processing to form a model using the processing lights EL#1 and EL#2.

[0160] In this case, the irradiation position of the processing light EL#1 and the irradiation position of the processing light EL#2 may be different. For example, as shown in FIG. 13( a), the processing system SYS may irradiate a first portion of the printing surface MS with the processing light EL#1 and irradiate a second portion of the printing surface MS that is different from the first portion with the processing light EL#2. In this case, the processing system SYS may perform additional processing using the processing light EL#1 and additional processing using the processing light EL#2 in parallel. For example, the processing system SYS may perform additional processing to form a first portion of a three-dimensional structure ST using the processing light EL#1 and additional processing to form a second portion of the same three-dimensional structure ST that is different from the first portion using the processing light EL#2 in parallel. For example, during the period in which a certain structural layer SL is being printed, the processing system SYS may perform additional processing to form a first portion of the structural layer SL using the processing light EL#1 and additional processing to form a second portion of the same structural layer SL that is different from the first portion using the processing light EL#2 in parallel. As a result, the throughput of additive processing is improved.

[0161] Alternatively, the irradiation position of the processing light EL#1 and the irradiation position of the processing light EL#2 may be the same. For example, as shown in FIG. 13( b), the processing system SYS may irradiate both the processing light EL#1 and the processing light EL#2 onto the same portion of the printing surface MS. In this case, the processing system SYS may perform additional processing using both the processing light EL#1 and the processing light EL#2. For example, the processing system SYS may perform additional processing to print the same portion of the three-dimensional structure ST using both the processing light EL#1 and the processing light EL#2. For example, during the period in which a certain structural layer SL is being printed, the processing system SYS may perform additional processing to print the same portion of the structural layer SL using both the processing light EL#1 and the processing light EL#2.

[0162] The application of the processing light EL#1 and the application of the processing light EL#2 may be different. An example of the application of the processing light EL#1 and EL#2 will be described below.

[0163] As an example of the use of the processing beams EL#1 and EL#2, the processing system SYS may use the processing beam EL#2 to preheat the printing surface MS, while using the processing beam EL#1 to form a molten pool MP on the preheated printing surface MS (and thereby form a molded object). As a result, even in situations where the amount of energy transferred from the processing beam EL#1 to the printing surface MS cannot be increased significantly, the processing system SYS can appropriately form a molten pool MP on the printing surface MS. As an example, the lower the absorptivity of the workpiece W (or the object whose surface MS is the surface, the same applies hereinafter) for the processing beam EL#1, the smaller the amount of energy transferred from the processing beam EL#1 to the printing surface MS. In this case, the printing surface MS may be preheated using the processing beam EL#2, which satisfies the condition that the absorptivity of the workpiece W (or the object whose surface MS is the surface, the same applies hereinafter) for the processing beam EL#2 is different from the absorptivity of the workpiece W for the processing beam EL#1. As a result, even in a situation where the absorption rate of the workpiece W for the processing light EL#1 is relatively low, the processing system SYS can appropriately form a molten pool MP on the manufacturing surface MS.

[0164] In this case, the absorption rate of the workpiece W (or the object whose surface is the printing surface MS, the same applies below) for the processing light EL#2 may be higher than the absorption rate of the workpiece W for the processing light EL#1. As a result, the processing system SYS can efficiently preheat the printing surface MS using the processing light EL#2 and appropriately form a molten pool MP on the printing surface MS using the processing light EL#1.

[0165] The processing system SYS may form a molten pool MP on the printing surface MS by preheating the printing surface MS using the processing light EL#2. In this case, the processing system SYS may irradiate the molten pool MP formed on the printing surface MS by the processing light EL#2 with the processing light EL#1. The processing system SYS may expand the molten pool MP by irradiating the molten pool MP formed on the printing surface MS by the processing light EL#2 with the processing light EL#1. Alternatively, the processing system SYS may preheat the printing surface MS using the processing light EL#2 without forming a molten pool MP on the printing surface MS. In this case, the processing system SYS may form the molten pool MP by irradiating the printing surface MS preheated by the processing light EL#2 with the processing light EL#1.

[0166] As another example of the use of the processing light EL#1 and EL#2, the processing system SYS may use the processing light EL#1 to form a model using a first type of modeling material M#1, while using the processing light EL#2 to form a model using a second type of modeling material M#2 different from the first type, as shown in FIG. 13( c). In this case, the absorptivity of the first type of modeling material M with respect to the processing light EL#1 may be higher than the absorptivity of the first type of modeling material M with respect to the processing light EL#2. On the other hand, the absorptivity of the second type of modeling material M with respect to the processing light EL#2 may be higher than the absorptivity of the second type of modeling material M with respect to the processing light EL#1. As a result, when the material nozzle 212 is capable of supplying multiple different types of modeling materials M, the processing system SYS can form a model using each of multiple different types of modeling materials M. For example, even if the second type of modeling material M#2 cannot be efficiently melted using the processing light EL#1 due to the low absorptivity of the second type of modeling material M#2 with respect to the processing light EL#1, the processing system SYS can efficiently melt the second type of modeling material M#2 using the processing light EL#2. As a result, the processing system SYS can efficiently form a model using the second type of modeling material M#2. For example, even if the first type of modeling material M#1 cannot be efficiently melted using the processing light EL#2 due to the low absorptivity of the first type of modeling material M#1 with respect to the processing light EL#2, the processing system SYS can efficiently melt the first type of modeling material M#1 using the processing light EL#1. As a result, the processing system SYS can efficiently form a model using the first type of modeling material M#1.

[0167] As an example, the processing system SYS may use processing light EL#1 containing infrared light to form a shaped object using a building material M containing stainless steel. On the other hand, the processing system SYS may use processing light EL#2 containing visible light (e.g., blue light) to form a shaped object using a building material M containing copper. In this case, although copper has a low absorptivity for infrared light, the processing system SYS can appropriately form a shaped object from a building material M containing copper by using processing light EL#2 containing visible light different from infrared light. Furthermore, even if the workpiece W is copper, the processing system SYS can appropriately form a shaped object on the workpiece W.

[0168] 14A, the processing system SYS capable of forming an object using each of a plurality of different types of forming materials M may form a three-dimensional structure ST including a plurality of objects by sequentially forming a plurality of objects, each of which is formed from a plurality of different types of forming materials M. For example, the processing system SYS may supply a first type of forming material M#1 to the forming surface MS without supplying a second type of forming material M#2 to the forming surface MS, and irradiate the supplied first type of forming material M#1 with processing light EL#1 to form a formed object BO#1 made of the first type of forming material M#1. Thereafter, the processing system SYS may supply the second type of building material M#2 to the building surface MS without supplying the first type of building material M#1 to the building surface MS, and may irradiate the supplied second type of building material M#2 with processing light EL#2 to form a building object BO#2 made of the second type of building material M#2 on the building object BO#1. As a result, a three-dimensional structure ST including the building objects BO#1 and BO#2 is formed.

[0169] 14B, the processing system SYS capable of forming a model using each of a plurality of different types of modeling materials M may form a three-dimensional structure ST by supplying a mixed modeling material M_mix obtained by mixing the plurality of different types of modeling materials M to the modeling surface MS. For example, the processing system SYS may supply a mixed modeling material M_mix obtained by mixing a first type of modeling material M#1 and a second type of modeling material M#2 at a predetermined mixing ratio to the modeling surface MS, and irradiate the supplied mixed modeling material M_mix with processing light EL#1 and EL#2, respectively, to form a three-dimensional structure ST from the mixed modeling material M_mix.

[0170] In this case, the processing system SYS may change the mixing ratio during the period in which the three-dimensional structure ST is being formed. For example, the processing system SYS may gradually increase or decrease the mixing ratio during the period in which the three-dimensional structure ST is being formed. As a result, the processing system SYS can form a three-dimensional structure ST in which the linear expansion coefficient changes gradually (in other words, relatively smoothly) along the stacking direction of the structural layers SL. As a result, the processing system SYS can form a three-dimensional structure ST that is less likely to be damaged by heat, compared to a structure in which the linear expansion coefficient changes abruptly along the stacking direction of the structural layers SL.

[0171] As another example of the use of the processed light EL#1 and the processed light EL#2, the processing system SYS may use the processed light EL#1 to form a model, while using the processed light EL#2 to smooth the surface of the model formed by the processed light EL#1. Specifically, the processing system SYS may melt the surface of the model formed by the processed light EL#1 by irradiating the surface of the model with the processed light EL#2. When the melted surface of the model then solidifies, the surface of the model becomes smoother than the surface before being irradiated with the processed light EL#2. As a result, the processing system SYS can form a model with a smoother surface.

[0172] (2-3) Irradiation Control Operation for Controlling the Irradiation Patterns of the Two Processing Beams EL#1 and EL#2 The processing system SYS (particularly, the control device 7) may perform an irradiation control operation for controlling the irradiation patterns of the processing beams EL#1 and EL#2 during at least a portion of the period during which additional processing is performed to form a model. Specifically, the control device 7 may perform an irradiation control operation for controlling the irradiation patterns of the two processing beams EL#1 and EL#2 on the printing surface MS. The irradiation control operation will be described below.

[0173] The control device 7 may perform an irradiation control operation so that the irradiation pattern of the processing light EL#1 on the printing surface MS and the irradiation pattern of the processing light EL#2 on the printing surface MS are the same. The control device 7 may perform an irradiation control operation so that the irradiation pattern of the processing light EL#1 on the printing surface MS and the irradiation pattern of the processing light EL#2 on the printing surface MS are different. The control device 7 may perform an irradiation control operation so that the irradiation pattern of the processing light EL#1 on the printing surface MS is a desired first pattern. The control device 7 may perform an irradiation control operation so that the irradiation pattern of the processing light EL#2 on the printing surface MS is a desired second pattern.

[0174] The irradiation mode of the processing light EL may include the intensity of the processing light EL on the printing surface MS (typically, the peak intensity corresponding to the maximum intensity). The irradiation mode of the processing light EL may include the intensity distribution of the processing light EL on the printing surface MS. The irradiation mode of the processing light EL may include the irradiation period of the processing light EL on the printing surface MS. If the processing light EL includes multiple pulsed beams, the irradiation period of the processing light EL may refer to a series of periods during which the multiple pulsed beams are continuously irradiated onto the printing surface MS. The irradiation mode of the processing light EL may include the irradiation period (i.e., the time corresponding to the pulse width) during which the pulsed beams included in the processing light EL are irradiated onto the printing surface MS. The irradiation mode of the processing light EL may include the start timing of irradiation of the processing light EL on the printing surface MS. The irradiation mode of the processing light EL may include the end timing of irradiation of the processing light EL on the printing surface MS. The irradiation mode of the processing light EL may include the position on the printing surface MS where the processing light EL is irradiated (i.e., the position of the target irradiation area EA). The irradiation mode of the processing light EL may include the diameter (i.e., size) of the beam spot BS formed by the processing light EL on the printing surface MS. The irradiation mode of the processing light EL may include the movement mode of the processing light EL on the printing surface MS (i.e., the movement mode of the target irradiation area EA). The movement mode of the target irradiation area EA may include the movement direction of the target irradiation area EA. The movement mode of the target irradiation area EA may include the movement trajectory of the target irradiation area EA (particularly, its shape). The movement mode of the target irradiation area EA may include the movement speed of the target irradiation area EA.

[0175] Hereinafter, as specific examples of the irradiation control operation, first and second specific examples of the irradiation control operation will be described in order with reference to FIGS.

[0176] (2-3-1) First Specific Example of Irradiation Control Operation A first specific example of an irradiation control operation is an irradiation control operation for controlling the intensity of at least one of processing beams EL#1 and EL#2.

[0177] For example, the control device 7 may perform an irradiation control operation so that the intensity (e.g., peak intensity) of processing light EL#1 is higher than the intensity (e.g., peak intensity) of processing light EL#2, as shown in Figures 15 to 17. Note that the "intensity of processing light EL" described in the first specific example of the irradiation control operation may refer to the intensity of processing light EL on the printing surface MS, or may refer to the intensity of processing light EL at the focus position of the irradiation optical system 211.

[0178] 15 , the control device 7 may perform an irradiation control operation so that the period during which the processing light EL#1 is irradiated onto the printing surface MS overlaps with the period during which the processing light EL#2 is irradiated onto the printing surface MS, and the intensity of the processing light EL#1 is higher than the intensity of the processing light EL#2. In other words, the control device 7 may perform an irradiation control operation so that the processing light EL#1 and the processing light EL#2 are irradiated onto the printing surface MS simultaneously, and the intensity of the processing light EL#1 is higher than the intensity of the processing light EL#2. Alternatively, the control device 7 may perform an irradiation control operation so that the processing light EL#1 is irradiated onto the printing surface MS for at least a portion of the period from when the processing light EL#2 starts to be irradiated onto the printing surface MS until the processing light EL#2 finishes being irradiated onto the printing surface MS, and the intensity of the processing light EL#1 is higher than the intensity of the processing light EL#2.

[0179] For example, as shown in FIG. 16 , the control device 7 may perform an irradiation control operation such that after a portion of the printing surface MS is irradiated with processing light EL#2, the same portion of the printing surface MS is irradiated with processing light EL#1, and the intensity of processing light EL#1 is higher than the intensity of processing light EL#2. In other words, the control device 7 may perform an irradiation control operation such that processing light EL#2 is irradiated with processing light EL#1 before processing light EL#1, and the intensity of processing light EL#1 is higher than the intensity of processing light EL#2. Note that, although the irradiation periods of processing light EL#2 and processing light EL#1 partially overlap in FIG. 16 , the irradiation periods of processing light EL#2 and processing light EL#1 do not necessarily have to overlap. For example, the irradiation period of processing light EL#1 may be set between the first irradiation period of processing light EL#2 and the second irradiation period of processing light EL#2.

[0180] For example, as shown in Figure 17, the control device 7 may perform irradiation control operations so that processing light EL#1 is irradiated onto the printing surface MS multiple times during at least a portion of the period in which processing light EL#2 is irradiated onto the printing surface MS, and the intensity of processing light EL#1 is higher than the intensity of processing light EL#2.

[0181] In addition, during one irradiation period of the processing light EL#1 shown in Figures 15 to 17, the processing light EL#1 may include multiple pulsed lights. Similarly, during one irradiation period of the processing light EL#2 shown in Figures 15 to 17, the processing light EL#2 may include multiple pulsed lights. The same applies to Figure 18 described later.

[0182] The control device 7 may perform the irradiation control operations shown in FIGS. 15 to 17 when the processing light EL#2 is used to preheat the printing surface MS and the processing light EL#1 is used for a purpose other than forming a molten pool MP on the preheated printing surface MS (and thereby manufacturing a molded object). As a result, the processing system SYS can efficiently preheat the printing surface MS using the processing light EL#2 and appropriately form a molten pool MP on the printing surface MS using the processing light EL#1. However, even when the processing light EL#2 is used for a purpose other than preheating the printing surface MS, the control device 7 may perform the irradiation mode control operations shown in FIGS. 15 to 17. Even when the processing light EL#1 is used for a purpose other than forming a molten pool MP on the preheated printing surface MS (and thereby manufacturing a molded object), the control device 7 may perform the irradiation mode control operations shown in FIGS. 15 to 17.

[0183] In addition to or instead of the irradiation control operation for making the intensity of the processing light EL#1 higher than the intensity of the processing light EL#2, the control device 7 may perform an irradiation control operation for modulating (i.e., changing) the intensities (e.g., peak intensities) of the processing light EL#1 and EL#2 in accordance with the movement of the target irradiation areas EA#1 and EA#2. For example, the upper diagram of Fig. 18 shows the movement loci MT#1 and MT#2 of the target irradiation areas EA#1 and EA#2 on the printing surface MS when the target irradiation areas EA#1 and EA#2 regularly move back and forth along a first direction (the X-axis direction in Fig. 18) within the processing unit areas BSA#1 and BSA#2, respectively, and the processing unit areas BSA#1 and BSA#2 move along a second direction (the X-axis direction in Fig. 18) perpendicular to the first direction. Furthermore, the lower diagram of Figure 18 shows the intensities of the processing beams EL#1 and EL#2 along with the movement trajectories MT#1 and MT#2. The graph shown in the lower diagram of Figure 18 has a vertical axis indicating the intensity of the processing beams EL#1 and EL#2 and a horizontal axis indicating the irradiation position of the processing beams EL#1 and EL#2 in the X-axis direction. Therefore, Figure 18 shows the relationship between the movement trajectories MT#1 and MT#2 and the intensities of the processing beams EL#1 and EL#2. In other words, Figure 18 shows the relationship between the position of the target irradiation area EA#1 on the movement trajectory MT#1 and the processing beam EL#1, and the relationship between the position of the target irradiation area EA#2 on the movement trajectory MT#2 and the processing beam EL#2.

[0184] 18, the control device 7 may perform an irradiation control operation so that the intensity of the processing light EL#1 irradiated to at least one of the reversal position P1 where the movement direction of the target irradiation area EA#1 is reversed in the first direction and the overlap position P3 where the target irradiation area EA#1 overlaps with the target irradiation area EA#2 is weaker than the intensity of the processing light EL#1 at positions other than the reversal position P1 and the overlap position P3. That is, the irradiation control operation may be performed so that the intensity of the processing light EL#1 at at least one of the first reversal timing where the movement direction of the target irradiation area EA#1 is reversed in the first direction and the overlap timing where the target irradiation area EA#1 overlaps with the target irradiation area EA#2 is weaker than the intensity of the processing light EL#1 at times other than the first reversal timing and the overlap timing. Note that the reversal position P1 may be a position where the sign of the differential value of the movement speed of the target movement area EA#1 (i.e., the acceleration of the target movement area EA#1 during movement) changes. FIG. 18 shows the intensity of processing light EL#1, which is a pulsed beam, when the processing light EL#1 is irradiated onto the printing surface MS.

[0185] As an example, the control device 7 may perform an irradiation control operation so that the intensity of the processing light EL#1 increases and then decreases during a period in which the target irradiation area EA#1 moves from the overlap position P3 toward the reversal position P1. Furthermore, the control device 7 may perform an irradiation control operation so that the intensity of the processing light EL#1 increases and then decreases during a period in which the target irradiation area EA#1 moves from the reversal position P1 toward the overlap position P3.

[0186] 18, the control device 7 may perform an irradiation control operation so that the intensity of the processing light EL#2 at at least one of the reversal position P2 where the movement direction of the target irradiation area EA#2 is reversed in the first direction and the overlap position P3 where the target irradiation area EA#2 overlaps with the target irradiation area EA#1 is weaker than the intensity of the processing light EL#2 at a position other than the reversal position P2 and the overlap position P3. That is, the irradiation control operation may be performed so that the intensity of the processing light EL#2 at at least one of the second reversal timing where the movement direction of the target irradiation area EA#2 is reversed in the first direction and the overlap timing where the target irradiation area EA#2 overlaps with the target irradiation area EA#1 is weaker than the intensity of the processing light EL#2 at a timing other than the second reversal timing and the overlap timing. Note that the reversal position P2 may be a position where the sign of the differential value of the movement speed of the target movement area EA#2 (i.e., the acceleration of the target movement area EA#1 during movement) changes. FIG. 18 shows the intensity of processing light EL#2, which is a pulsed light, when the processing light EL#2 is irradiated onto the printing surface MS.

[0187] As an example, the control device 7 may perform an irradiation control operation so that the intensity of the processing light EL#2 increases and then decreases during a period in which the target irradiation area EA#2 moves from the overlap position P3 toward the reversal position P2. Furthermore, the control device 7 may perform an irradiation control operation so that the intensity of the processing light EL#2 increases and then decreases during a period in which the target irradiation area EA#2 moves from the reversal position P2 toward the overlap position P3.

[0188] 18, the processing system SYS can reduce the possibility that the amount of energy transmitted per unit time from each of the processing beams EL#1 and EL#2 to the printing surface MS varies depending on the positions of the target irradiation areas EA#1 and EA#2 on the printing surface MS. The technical reasons for this will be explained below.

[0189] As shown in FIG. 18 , the movement direction of the target irradiation area EA#1 reverses at the reversal position P1. Therefore, the movement speed of the target irradiation area EA#1, which moves toward the reversal position P1, decreases near the reversal position P1 and becomes zero at the reversal position P1. The movement speed of the target irradiation area EA#1, which moves away from the reversal position P1 after reaching the reversal position P1, increases from zero. In other words, the movement speed of the target irradiation area EA#1 changes near the reversal position P1. Here, the slower the movement speed of the target irradiation area EA#1, the greater the amount of energy transferred from the processing light EL#1 to the printing surface MS per unit time. Therefore, if the intensity of the processing light EL#1 is not modulated (i.e., fixed at a constant value), the amount of energy transferred from the processing light EL#1 to the printing surface MS per unit time may vary depending on the position of the target irradiation area EA#1 on the printing surface MS. Typically, the amount of energy transferred from processing light EL#1 to the printing surface MS per unit time at reversal position P1 may be greater than the amount of energy transferred from processing light EL#1 to the printing surface MS per unit time at a position away from reversal position P1. For the same reason, the amount of energy transferred from processing light EL#2 to the printing surface MS per unit time at reversal position P2 may be greater than the amount of energy transferred from processing light EL#2 to the printing surface MS per unit time at a position away from reversal position P2.

[0190] Furthermore, the target irradiation areas EA#1 and EA#2 overlap at the overlap position P3. Therefore, at the overlap position P3, energy is transmitted to the printing surface MS from both the processing lights EL#1 and EL#2. Therefore, the amount of energy transmitted to the printing surface MS per unit time from both the processing lights EL#1 and EL#2 at the overlap position P3 may be greater than the amount of energy transmitted to the printing surface MS per unit time from either one of the processing lights EL#1 or EL#2 at a position away from the overlap position P3.

[0191] However, in this embodiment, as described above, the processing system SYS performs an irradiation control operation so that the intensity of the processing light EL#1 at the reversal position P1 is weaker than the intensity of the processing light EL#1 at positions other than the reversal position P1 and the overlap position P3. Therefore, the difference between the amount of energy transmitted from the processing light EL#1 to the printing surface MS per unit time at the reversal position P1 and the amount of energy transmitted from the processing light EL#1 to the printing surface MS per unit time at positions away from the reversal position P1 is small. Similarly, as described above, the processing system SYS performs an irradiation control operation so that the intensity of the processing light EL#2 at the reversal position P2 is weaker than the intensity of the processing light EL#1 at positions other than the reversal position P2 and the overlap position P3. Therefore, the difference between the amount of energy transmitted from the processing light EL#2 to the printing surface MS per unit time at the reversal position P2 and the amount of energy transmitted from the processing light EL#2 to the printing surface MS per unit time at positions away from the reversal position P2 is small. Similarly, as described above, the processing system SYS performs irradiation control operations so that the intensities of the processing beams EL#1 and EL#2 at the overlap position P3 are weaker than the intensities of the processing beams EL#1 and EL#2 at positions other than the reversal position P1, the reversal position P2, and the overlap position P3. This reduces the difference between the amount of energy transferred per unit time from both the processing beams EL#1 and EL#2 to the printing surface MS at the overlap position P3 and the amount of energy transferred per unit time from either the processing beams EL#1 or EL#2 to the printing surface MS at positions away from the overlap position P3. This reduces the possibility that the amount of energy transferred per unit time from each of the processing beams EL#1 and EL#2 to the printing surface MS varies depending on the positions of the target irradiation areas EA#1 and EA#2 on the printing surface MS.

[0192] (2-3-2) Second Specific Example of Irradiation Control Operation A second specific example of an irradiation control operation is an irradiation control operation for controlling at least the diameter of the beam spot BS of at least one of processing lights EL#1 and EL#2.

[0193] For example, as shown in FIGS. 19A and 20A, the control device 7 may perform irradiation control operations so that the diameter of the beam spot BS (BS#2) of the processing light EL#2 is larger than the diameter of the beam spot BS (BS#1) of the processing light EL#1. For example, when the focus control optical system 2145 changes the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the Z-axis direction, the diameter of the beam spot BS#1 changes. Therefore, the control device 7 may control the focus control optical system 2145 so that the diameter of the beam spot BS#2 is larger than the diameter of the beam spot BS#1. In other words, changing the diameter of the beam spot BS#1 may include changing the condensing position CP#1 of the processing light EL#1 (i.e., changing the focus). For example, when the focus control optical system 2155 changes the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the Z-axis direction, the diameter of the beam spot BS#2 changes. Therefore, the control device 7 may control the focus control optical system 2155 so that the diameter of the beam spot BS#2 is larger than the diameter of the beam spot BS#1. In other words, changing the diameter of the beam spot BS#2 may include changing the condensing position CP#2 of the processing light EL#2 (i.e., changing the focus).

[0194] Since the beam spots BS#1 and BS#2 are formed by the processing beams EL#1 and EL#2 irradiated onto the target irradiation areas EA#1 and EA#2, respectively, an irradiation control operation for making the diameter of the beam spot BS#2 larger than that of the beam spot BS#1 may be considered to be substantially equivalent to an irradiation control operation for making the target irradiation area EA#2 wider than that of the target irradiation area EA#1. In other words, an irradiation control operation for making the diameter of the beam spot BS#2 larger than that of the beam spot BS#1 may be considered to be equivalent to an irradiation control operation for making the target irradiation area EA#1 narrower than that of the target irradiation area EA#2.

[0195] Note that when the shapes of the beam spots BS#1 and BS#2 are other than circular, for example, the widths of the beam spots BS#1 and BS#2 in a direction along an axis perpendicular to the optical axis of the irradiation optical system 211 may be used as the diameters of the beam spots BS#1 and BS#2. Alternatively, the maximum widths of the beam spots BS#1 and BS#2 in a direction along an axis perpendicular to the optical axis of the irradiation optical system 211 may be used as the diameters of the beam spots BS#1 and BS#2. Alternatively, the average value of the widths of the beam spots BS#1 and BS#2 in a direction along the axis perpendicular to the optical axis of the irradiation optical system 211 may be used as the diameters of the beam spots BS#1 and BS#2.

[0196] The control device 7 may perform the irradiation control operations shown in FIGS. 19 and 20 when the processing light EL#2 is used to preheat the build surface MS and the processing light EL#1 is used for a purpose other than forming a molten pool MP on the preheated build surface MS (and thereby forming a structure). As a result, the machining system SYS can efficiently preheat the build surface MS using the processing light EL#2 and appropriately form a molten pool MP on the build surface MS using the processing light EL#1. This is because the machining system SYS can form a molten pool MP by irradiating a relatively wide area on the build surface MS with the processing light EL#2, preheating the relatively wide area, and then irradiating the portion of the preheated area where the molten pool MP is desired to be formed with the processing light EL#1. However, even when the processing light EL#2 is used for a purpose other than preheating the build surface MS, the control device 7 may perform the irradiation mode control operations shown in FIGS. 19( a) and 20(a). Even when the processing light EL#1 is used for a purpose other than forming a molten pool MP on the preheated build surface MS (and thereby forming a molded object), the control device 7 may perform the irradiation pattern control operation shown in Figures 19(a) and 20(a).

[0197] Alternatively, although not shown, the control device 7 may perform an irradiation control operation so that the diameter of the beam spot BS#1 is larger than the diameter of the beam spot BS#2. That is, the control device 7 may perform an irradiation control operation so that the target irradiation area EA#1 is wider than the target irradiation area EA#2 (in other words, the target irradiation area EA#2 is narrower than the target irradiation area EA#1). Alternatively, the control device 7 may perform an irradiation control operation so that the diameter of the beam spot BS#1 is the same as the diameter of the beam spot BS#2. That is, the control device 7 may perform an irradiation control operation so that the target irradiation area EA#1 is the same size as the target irradiation area EA#2.

[0198] In addition to controlling the diameter of at least one of the beam spots BS#1 and BS#2, the control device 7 may also control the position of at least one of the beam spots BS#1 and BS#2. Because the beam spots BS#1 and BS#2 are formed in the target irradiation areas EA#1 and EA#2, respectively, the control device 7 may change the position of at least one of the target irradiation areas EA#1 and EA#2. For example, as shown in Figures 19(a) and 20(a), the control device 7 may perform an irradiation control operation so that at least a portion of the beam spot BS#1 overlaps with the beam spot BS#2. In other words, the control device 7 may perform an irradiation control operation so that at least a portion of the target irradiation area EA#1 overlaps with the target irradiation area EA#2.

[0199] In the examples shown in FIGS. 19( a) and 20(a), the small-diameter beam spot BS#1 is entirely contained within the large-diameter beam spot BS#2. In this case, the small-diameter beam spot BS#1 may move within the large-diameter beam spot BS#2. In this case, the processing system SYS can appropriately irradiate the area preheated by the processing light EL#1 with the processing light EL#2, thereby efficiently forming a molten pool MP on the build surface MS. However, if the diameter of the beam spot BS#1 is larger than the diameter of the beam spot BS#2, the small-diameter beam spot BS#2 may be entirely contained within the large-diameter beam spot BS#1. In this case, the small-diameter beam spot BS#2 may move within the large-diameter beam spot BS#1. The control device 7 may change the diameter of the beam spot BS#1 contained within the beam spot BS#2. For example, the control device 7 may change the diameter of the beam spot BS#1 contained within the beam spot BS#2 while moving the beam spots BS#1 and BS#2 on the build surface MS. However, if the diameter of beam spot BS#1 becomes larger than the diameter of beam spot BS#2, the control device 7 may change the diameter of beam spot BS#2 contained in beam spot BS#1. For example, the control device 7 may change the diameter of beam spot BS#2 contained in beam spot BS#1 while moving beam spots BS#1 and BS#2 on the printing surface MS.

[0200] In addition to controlling the diameter of at least one of the beam spots BS#1 and BS#2, the control device 7 may also control (e.g., change) at least one of the movement direction of the beam spot BS#1 within the processing unit area BSA#1 and the movement direction of the beam spot BS#2 within the processing unit area BSA#2. Note that the movement direction of the beam spot BS#1 within the processing unit area BSA#1 is equivalent to the movement direction of the target irradiation area #1 within the processing unit area BSA#1. The movement direction of the beam spot BS#2 within the processing unit area BSA#2 is equivalent to the movement direction of the target irradiation area #2 within the processing unit area BSA#2.

[0201] 19(a), the control device 7 may perform an irradiation control operation such that the beam spot BS#1 (target irradiation area EA#1) moves back and forth regularly along the Y-axis direction intersecting the movement direction of the processing unit areas BSA#1 and BSA#2, and the beam spot BS#2 (target irradiation area EA#2) moves back and forth regularly along the X-axis direction along the movement direction of the processing unit areas BSA#1 and BSA#2. As a result, as shown in FIG. 19(b), with the movement of the processing unit areas BSA#1 and BSA#2, the beam spot BS#2 (target irradiation area EA#2) moves on the printing surface MS along a linear movement trajectory MT#2 along the X-axis direction, and the beam spot BS#1 (target irradiation area EA#1) moves along a waveform-like movement trajectory MT#1 oscillating around the movement trajectory MT#2. In this case, the processing system SYS can appropriately irradiate the processing light EL#1 onto the area preheated by the processing light EL#2, thereby efficiently forming a molten pool MP on the manufacturing surface MS.

[0202] In addition to controlling the diameter of at least one of the beam spots BS#1 and BS#2, the control device 7 may also control (e.g., change) at least one of the movement trajectory of the beam spot BS#1 within the processing unit area BSA#1 and the movement trajectory of the beam spot BS#2 within the processing unit area BSA#2. Note that the movement trajectory of the beam spot BS#1 within the processing unit area BSA#1 is equivalent to the movement trajectory of the target irradiation area #1 within the processing unit area BSA#1. The movement trajectory of the beam spot BS#2 within the processing unit area BSA#2 is equivalent to the movement trajectory of the target irradiation area #2 within the processing unit area BSA#2.

[0203] For example, as shown in Fig. 20(a), the control device 7 may perform an irradiation control operation such that the beam spot BS#1 (target irradiation area EA#1) moves back and forth regularly along the Y-axis direction intersecting the movement direction of the processing unit areas BSA#1 and BSA#2, and the beam spot BS#2 (target irradiation area EA#2) moves along a circular movement trajectory (see Fig. 6(a)) within the processing unit area BSA#2. As a result, as shown in Fig. 20(b), with the movement of the processing unit areas BSA#1 and BSA#2, the beam spot BS#2 (target irradiation area EA#2) moves on the manufacturing surface MS along a spiral movement trajectory MT#2 along the X-axis direction, and the beam spot BS#1 (target irradiation area EA#1) moves along a wave-shaped movement trajectory MT#1 oscillating around the movement trajectory MT#2. In this case, the processing system SYS can appropriately irradiate the processing light EL#1 onto the area preheated by the processing light EL#2, thereby efficiently forming a molten pool MP on the manufacturing surface MS.

[0204] 19(b) and 20(b), when the movement direction of the beam spot BS#1 (target irradiation area EA#1) and the movement direction of the beam spot BS#2 (target irradiation area EA#2) are different, the beam spot BS#1 (target irradiation area EA#1) and the beam spot BS#2 (target irradiation area EA#2) may be regarded as moving relatively. Similarly, when the movement trajectory of the beam spot BS#1 (target irradiation area EA#1) and the movement trajectory of the beam spot BS#2 (target irradiation area EA#2) are different, the beam spot BS#1 (target irradiation area EA#1) and the beam spot BS#2 (target irradiation area EA#2) may be regarded as moving relatively. In this case, the control device 7 may be considered to be moving beam spot BS#1 (target irradiation area EA#1) and beam spot BS#2 (target irradiation area EA#2) relative to each other by changing the movement mode of at least one of beam spot BS#1 (target irradiation area EA#1) and beam spot BS#2 (target irradiation area EA#2).

[0205] In addition to controlling the diameter of at least one of the beam spots BS#1 and BS#2, the control device 7 may also control (e.g., change) the shape of at least one of the beam spots BS#1 and BS#2. That is, the control device 7 may also control (e.g., change) the shape of at least one of the target irradiation areas EA#1 and EA#2. In this case, the irradiation optical system 211 may include an optical system that can control (e.g., change) the shape of at least one of the beam spots BS#1 and BS#2.

[0206] The control device 7 may perform control to change the diameters of the beam spots BS#1 and BS#2 while the beam spots BS#1 and / or BS#2 are moving. For example, the control device 7 may change the diameters of the beam spots BS#1 and BS#2 depending on the positions on the machining path.

[0207] (2-4) Galvano-Focus Interlocking Control Operation As described above, the processing system SYS uses the focus control optical system 2145 to change the condensing position CP#1 of the processing light EL#1 in a direction intersecting the printing surface MS, and uses the galvanometer mirror 2146 to move the target irradiation area EA#1 in a direction along the printing surface MS. In this case, the processing system SYS (particularly, the control device 7) may perform a galvano-focus interlocking control operation to control either the focus control optical system 2145 or the galvanometer mirror 2146 based on a control amount of one of the focus control optical system 2145 or the galvanometer mirror 2146. For example, the control device 7 may perform a galvano-focus interlocking control operation to control the galvanometer mirror 2146 based on a control amount of the focus control optical system 2145 (e.g., the amount of change in the condensing position CP#1). For example, the control device 7 may perform a galvano-focus interlocking control operation to control the focus control optical system 2145 based on the control amount of the galvanometer mirror 2146 (for example, the movement amount of the target irradiation area EA#1 and the change amount of the position of the target irradiation area EA#1).

[0208] Similarly, the processing system SYS (particularly, the control device 7) may perform a galvano-focus interlocking control operation to control either the focus control optical system 2155 or the galvanometer mirror 2156, based on a control amount of either the focus control optical system 2155 or the galvanometer mirror 2156. For example, the control device 7 may perform a galvano-focus interlocking control operation to control the galvanometer mirror 2156, based on a control amount of the focus control optical system 2155 (e.g., a change amount of the focusing position CP#2). For example, the control device 7 may perform a galvano-focus interlocking control operation to control a control amount of the focus control optical system 2145, based on a control amount of the galvanometer mirror 2156 (e.g., a movement amount of the target irradiation area EA#2, or a change amount of the position of the target irradiation area EA#2).

[0209] FIG. 21 shows an example of the galvano-focus interlocking control operation that controls the galvanometer mirror 2146 based on the control amount of the focus control optical system 2145. Specifically, the first diagram in FIG. 21 shows the positional relationship between the condensing position CP#1 and the printing surface MS before the focus control optical system 2145 changes the condensing position CP#1. The second diagram in FIG. 21 shows the positional relationship between the condensing position CP#1 and the printing surface MS after the focus control optical system 2145 changes the condensing position CP#1. As shown in FIG. 21 , when the focus control optical system 2145 changes the condensing position CP#1 in a direction intersecting the printing surface MS (the Z-axis direction in FIG. 21 ), there is a possibility that the condensing position CP#1 may unintentionally move in a direction along the printing surface MS (a direction intersecting the Z-axis in FIG. 21 ). In other words, there is a possibility that the target irradiation area #1 may unintentionally move in a direction along the printing surface MS. 21 , the control device 7 may control the galvanometer mirror 2146 to cancel out the movement of the condensing position CP#1 in the direction along the printing surface MS (i.e., the movement of the irradiation position of the processing light EL#1) that occurs when the focus control optical system 2145 changes the condensing position CP#1 in the direction intersecting the printing surface MS. In other words, the control device 7 may control the galvanometer mirror 2146 to correct the positional deviation of the condensing position CP#1 in the direction along the printing surface MS (i.e., the positional deviation of the irradiation position of the processing light EL#1) that occurs when the focus control optical system 2145 changes the condensing position CP#1 in the direction intersecting the printing surface MS. As a result, the processing system SYS can appropriately irradiate the processing light EL#1 at a desired position on the printing surface MS.

[0210] In addition, if the focus control optical system 2145 changes the focus position CP#1 in a direction intersecting the printing surface MS, causing the focus position CP#1 to move in a direction along the printing surface MS, the processing system SYS can offset the movement of the focus position CP#1 in the direction along the printing surface MS (i.e., the movement of the irradiation position of the processing light EL#1) by using the head drive system 22 to move the processing head 21 in the direction along the printing surface MS. However, moving the processing head 21 also moves the supply position of the printing material M. As a result, a technical problem may arise in which the processing system SYS may be unable to supply the printing material M to the irradiation position of the processing light EL#1. In this embodiment, such a technical problem does not arise because the irradiation position of the processing light EL#1 is moved independently of the supply position of the printing material M.

[0211] Even when performing a galvanometer-focus interlocking control operation that controls the galvanometer mirror 2156 based on the control amount of the focus control optical system 2155, the control device 7 may perform an operation similar to that when performing a galvanometer-focus interlocking control operation that controls the galvanometer mirror 2146 based on the control amount of the focus control optical system 2145. That is, the control device 7 may control the galvanometer mirror 2156 so as to cancel out a movement of the focus position CP#2 in a direction along the printing surface MS (i.e., a movement of the irradiation position of processing light EL#2) that occurs when the focus control optical system 2155 changes the focus position CP#2 along a direction intersecting the printing surface MS. That is, the control device 7 may control the galvanometer mirror 2156 so as to correct a positional shift of the focus position CP#2 in a direction along the printing surface MS (i.e., a positional shift of the irradiation position of processing light EL#2) that occurs when the focus control optical system 2155 changes the focus position CP#2 along a direction intersecting the printing surface MS. As a result, the processing system SYS can appropriately irradiate the processing light EL#2 at a desired position on the printing surface MS.

[0212] FIG. 22 shows an example of a galvanometer-focus interlocking control operation that controls the focus control optical system 2145 based on the control amount of the galvanometer mirror 2146. Specifically, the first diagram in FIG. 22 shows the position of the target irradiation area EA#1 on the printing surface MS before the galvanometer mirror 2146 moves the target irradiation area EA#1. The second diagram in FIG. 22 shows the position of the target irradiation area EA#1 on the printing surface MS after the galvanometer mirror 2146 moves the target irradiation area EA#1. As shown in FIG. 22 , when the galvanometer mirror 2146 moves the target irradiation area EA#1 in a direction along the printing surface MS (i.e., moves the focusing position CP#1), there is a possibility that the focusing position CP#1 may unintentionally move in a direction intersecting the printing surface MS (i.e., in the Z-axis direction). Therefore, as shown in the third diagram of FIG. 22 , the control device 7 may control the focus control optical system 2145 so as to cancel out the movement of the condensing position CP#1 in a direction intersecting the printing surface MS, which occurs when the galvanometer mirror 2146 moves the target irradiation area EA#1 in a direction along the printing surface MS. In other words, the control device 7 may control the focus control optical system 2145 so as to correct the positional deviation of the condensing position CP#1 in a direction intersecting the printing surface MS, which occurs when the galvanometer mirror 2146 moves the target irradiation area EA#1 in a direction along the printing surface MS. As a result, the processing system SYS can set the condensing position CP#1 at a desired position in a direction intersecting the printing surface MS. In other words, the processing system SYS can irradiate the printing surface MS with processing light EL#1 in a desired focus state.

[0213] Furthermore, if the focus position CP#1 moves in a direction intersecting the printing surface MS due to the galvanometer mirror 2146 moving the target irradiation area EA#1 along the printing surface MS, the processing system SYS can offset the movement of the focus position CP#1 in the direction intersecting the printing surface MS by using the head drive system 22 to move the processing head 21 in the direction intersecting the printing surface MS. However, moving the processing head 21 also moves the supply position of the printing material M. As a result, a technical problem may arise in which the processing system SYS may be unable to supply the printing material M to the irradiation position of the processing light EL#1. In this embodiment, such a technical problem does not occur because the irradiation position of the processing light EL#1 is moved independently of the supply position of the printing material M.

[0214] Even when performing a galvanometer-focus interlocking control operation that controls the focus control optical system 2155 based on the control amount of the galvanometer mirror 2156, the control device 7 may perform the same operation as when performing a galvanometer-focus interlocking control operation that controls the focus control optical system 2145 based on the control amount of the galvanometer mirror 2146. That is, the control device 7 may control the focus control optical system 2155 so as to cancel out the movement of the focus position CP#2 in a direction intersecting the printing surface MS that occurs when the galvanometer mirror 2156 moves the target irradiation area EA#2 in a direction along the printing surface MS. That is, the control device 7 may control the focus control optical system 2155 so as to correct the positional deviation of the focus position CP#2 in a direction intersecting the printing surface MS that occurs when the galvanometer mirror 2156 moves the target irradiation area EA#2 in a direction along the printing surface MS. As a result, the processing system SYS can set the focus position CP#2 to a desired position in the direction intersecting the printing surface MS. That is, the processing system SYS can irradiate the processing light EL#2 in a desired focus state onto the printing surface MS.

[0215] (3) Technical Effects As described above, the processing system SYS of this embodiment can perform additive processing using two processing beams EL#1 and EL#2. That is, the processing system SYS can form a model using the two processing beams EL#1 and EL#2. Therefore, compared to when a model is formed using a single processing beam EL, the processing system SYS can properly form a model. For example, as described above, the processing system SYS can improve the throughput of additive processing (i.e., the throughput for forming a model) by performing additional processing using the processing beam EL#1 and additional processing using the processing beam EL#2 in parallel. For example, as described above, the processing system SYS can efficiently preheat the printing surface MS using the processing beam EL#2 and properly form a molten pool MP on the printing surface MS using the processing beam EL#1. For example, as described above, the processing system SYS can form a model using multiple different types of printing materials M that have different absorption rates for the two processing beams EL#1 and EL#2. For example, as described above, the processing system SYS uses processing light EL#1 to form a molded object, while using processing light EL#2 to smooth the surface of the object formed by processing light EL#1, thereby making it possible to form an object with a smoother surface.

[0216] Furthermore, in this embodiment, the processing system SYS is provided with a first optical system 214 for controlling the processing light EL#1 and a second optical system 215 for controlling the processing light EL#2, which are separate and independent. Therefore, the processing system SYS can control the processing light EL#1 and EL#2 separately and independently. As a result, the processing system SYS can flexibly control the irradiation modes of the processing light EL#1 and EL#2 compared to a case in which the processing light EL#1 and EL#2 cannot be controlled separately and independently.

[0217] (4) Modifications Next, modifications of the machining system SYS will be described.

[0218] (4-1) First Modified Example First, a first modified example of the machining system SYS will be described. Note that in the following description, the first modified example of the machining system SYS will be referred to as the "machining system SYSa." The machining system SYSa differs from the above-described machining system SYS in that it includes a machining unit 2a instead of the machining unit 2. Other features of the machining system SYSa may be the same as other features of the machining system SYS. The machining unit 2a differs from the above-described machining unit 2 in that it includes a machining head 21a instead of the machining head 21. Other features of the machining unit 2a may be the same as other features of the machining unit 2. The machining head 21a differs from the above-described machining head 21 in that it includes an irradiation optical system 211a instead of the irradiation optical system 211. Other features of the machining head 21a may be the same as other features of the machining head 21. For this reason, hereinafter, the irradiation optical system 211a in the first modified example will be described with reference to FIG. 23. FIG. 23 is a cross-sectional view showing the structure of an irradiation optical system 211a in the first modified example.

[0219] 23 , the irradiation optical system 211a differs from the above-described irradiation optical system 211 in that it includes a third optical system 216a instead of the third optical system 216. Other features of the irradiation optical system 211a may be the same as other features of the irradiation optical system 211.

[0220] The third optical system 216a differs from the above-described third optical system 216 in that it includes two fθ lenses 2162 (specifically, fθ lenses 2162#1 and 2162#2). Other features of the third optical system 216a may be the same as other features of the third optical system 216.

[0221] In the first modified example, the processing light EL#1 emitted from the first optical system 214 is incident on the fθ lens 2162#1. The processing light EL#2 emitted from the second optical system 215 is incident on the fθ lens 2162#2. The processing light EL#1 that passes through the fθ lens 2162#1 and the processing light EL#2 that passes through the fθ lens 2162#2 are each incident on the prism mirror 2161. The prism mirror 2161 reflects each of the processing light EL#1 and EL#2 toward the printing surface MS. In other words, in the first modified example, the fθ lens 2162#1 emits the processing light EL#1 toward the printing surface MS via the prism mirror 2161, and the fθ lens 2162#2 emits the processing light EL#2 toward the printing surface MS via the prism mirror 2161.

[0222] In the first modified example, the irradiation optical system 211a may irradiate the printing surface MS with the processing light EL#1 emitted from the fθ lens 2162#1 and the processing light EL#2 emitted from the fθ lens 2162#2 without using the prism mirror 2161. In this case, the irradiation optical system 211a does not need to include the prism mirror 2161. Furthermore, the fθ lenses 2162#1 and 2162#2 may be positioned so that the optical axis of the fθ lens 2162#1 and the optical axis of the fθ lens 2162#2 intersect on or near the printing surface MS. Furthermore, if the irradiation optical system 211a includes multiple fθ lenses 2162#1 and 2162#2 as described in the first modified example, each of the fθ lenses 2162#1 and 2162#2 may be referred to as a final optical element. Furthermore, when each of the fθ lenses 2162#1 and 2162#2 is composed of multiple optical elements, the optical element that is positioned closest to the molding surface MS among the multiple optical elements that each of the fθ lenses 2162#1 and 2162#2 has may be referred to as the final optical element.

[0223] The machining system SYSa in the first modified example can also provide the same effects as those that can be provided by the machining system SYS described above.

[0224] (4-2) Second Modification Next, a second modification of the machining system SYS will be described. In the following description, the second modification of the machining system SYS will be referred to as the "machining system SYSb." The machining system SYSb differs from the above-described machining system SYSa in that it includes a machining unit 2a instead of the machining unit 2a. Other features of the machining system SYSb may be the same as other features of the machining system SYSa. The machining unit 2b differs from the above-described machining unit 2a in that it includes a machining head 21b instead of the machining head 21a. Other features of the machining unit 2b may be the same as other features of the machining unit 2a. The machining head 21b differs from the above-described machining head 21a in that it includes an irradiation optical system 211b instead of the irradiation optical system 211a. Other features of the machining head 21b may be the same as other features of the machining head 21a. Therefore, hereinafter, the irradiation optical system 211b in the second modification will be described with reference to FIG. 24. FIG. 24 is a cross-sectional view showing the structure of an irradiation optical system 211b in the second modified example.

[0225] 24 , the irradiation optical system 211b differs from the above-described irradiation optical system 211a in that it includes a first optical system 214b, a second optical system 215b, and a third optical system 216b instead of the first optical system 214, the second optical system 215, and the third optical system 216a. Other features of the irradiation optical system 211b may be the same as other features of the irradiation optical system 211a.

[0226] The first optical system 214b differs from the above-described first optical system 214 in that it includes an fθ lens 2162#1. In the example shown in Fig. 24 , the fθ lens 2162#1 is disposed on the optical path of the processing light EL#1 between the parallel plate 2142 and the galvanometer scanner 2144. However, the position of the fθ lens 2162#1 is not limited to the position shown in Fig. 24 . Other features of the first optical system 214b may be the same as other features of the first optical system 214a.

[0227] The second optical system 215b differs from the above-described second optical system 215 in that it includes an fθ lens 2162#2. In the example shown in Fig. 24 , the fθ lens 2162#2 is disposed on the optical path of the processing light EL#2 between the parallel plate 2152 and the galvanometer scanner 2154. However, the position of the fθ lens 2162#2 is not limited to the position shown in Fig. 24 . Other features of the second optical system 215b may be the same as other features of the second optical system 215a.

[0228] The third optical system 216b differs from the third optical system 216a in that it does not need to include the two fθ lenses 2162#1 and 2162#2. Other features of the third optical system 216b may be the same as those of the third optical system 216a.

[0229] In the second modified example, the prism mirror 2161 having multiple reflective surfaces may be referred to as the final optical element. The machining system SYSb of the second modified example does not need to include the third optical system 216b. In this case, the first optical system 214b and the second optical system 215b may be positioned so that the optical axis of the exit side of the first optical system 214b and the optical axis of the exit side of the second optical system 215b intersect on or near the printing surface MS. In the second modified example, the optical axis of the third optical system 2161 may be an axis extending in the direction of a vector obtained by combining the normal vectors of the reflective surfaces of the prism mirror 2161. If the optical axis on the exit side of the first optical system 214b and the optical axis on the exit side of the second optical system 215b are considered to be bent by the prism mirror 2161, the irradiation direction of the processing light EL#1 may mean the direction of the optical axis on the exit side of the first optical system 214b after being bent, and the irradiation direction of the processing light EL#2 may mean the direction of the optical axis on the exit side of the second optical system 215b after being bent.

[0230] As described above, the irradiation optical system 211b differs from the irradiation optical system 211a in that the positions of the two fθ lenses 2162#1 and 2162#2 are changed. The machining system SYSb of the second modified example, which includes such an irradiation optical system 211b, can also achieve the same effects as those achieved by the machining system SYSa described above.

[0231] (4-3) Third Modification Next, a third modification of the machining system SYS will be described with reference to Fig. 25. Fig. 25 is a block diagram showing the system configuration of the third modification of the machining system SYS. In the following description, the third modification of the machining system SYS will be referred to as the "machining system SYSc."

[0232] As shown in FIG. 25 , the machining system SYSc differs from the above-described machining system SYS in that it includes a machining unit 2c instead of the machining unit 2. Furthermore, the machining system SYSc differs from the above-described machining system SYS in that it does not need to include multiple light sources 4 (i.e., it may include a single light source 4). Other features of the machining system SYSc may be the same as other features of the machining system SYS. The machining unit 2c differs from the above-described machining unit 2 in that it includes a machining head 21c instead of the machining head 21. Other features of the machining unit 2c may be the same as other features of the machining unit 2. The machining head 21c differs from the above-described machining head 21 in that it includes an irradiation optical system 211c instead of the irradiation optical system 211. Other features of the machining head 21c may be the same as other features of the machining head 21.

[0233] Next, an irradiation optical system 211c in a third modified example will be described with reference to Fig. 26. Fig. 26 is a cross-sectional view showing the structure of the irradiation optical system 211c in the third modified example.

[0234] 26 , the irradiation optical system 211c differs from the above-described irradiation optical system 211 in that it further includes a fourth optical system 218c. Other features of the irradiation optical system 211c may be the same as other features of the irradiation optical system 211.

[0235] The fourth optical system 218c includes a wave plate 2181c, a polarizing beam splitter 2182c, and a mirror 2183c. The processing light EL (hereinafter referred to as "processing light EL0") emitted from the light source 4 enters the polarizing beam splitter 2182c via the wave plate 2181c. The p-polarized light contained in the processing light EL0 passes through the polarizing beam splitter 2182c. On the other hand, the s-polarized light contained in the processing light EL0 is reflected by the polarizing beam splitter 2182c. The p-polarized light that passes through the polarizing beam splitter 2182c enters the first optical system 214 as processing light EL#1. The s-polarized light reflected by the polarizing beam splitter 2182c enters the second optical system 215 via the mirror 2183c as processing light EL#2.

[0236] In the third modified example, the irradiation optical system 211c may use a wave plate 2181c to change the polarization state (typically the polarization direction, or in the case of elliptically polarized light, the direction of the major axis of the elliptically polarized light) of the processing light EL0 incident on the polarizing beam splitter 2182c, thereby changing the intensity of the processing light EL#1 incident on the first optical system 214 and the intensity of the processing light EL#2 incident on the second optical system 215. When the processing light EL0 emitted from the light source 4 is linearly polarized, a half-wave plate may be used as the wave plate 2181c. The irradiation optical system 211c may change the polarization direction of the processing light EL0 emitted from the wave plate 2181c by rotating the half-wave plate 2181c around its optical axis.

[0237] Furthermore, the collimator lenses 2141 and 2151 in the third modified example convert the processing light EL#1 and EL#2 split by the fourth optical system 218c into parallel light. However, at least one of the collimator lenses 2141 and 2151 may convert the processing light EL0 not split by the polarizing beam splitter 2182c into parallel light. In this case, instead of the collimator lenses 2141 and 2151, a collimator lens may be disposed in the optical path on the light source side of the wave plate 2181c. A collimator lens may be disposed in the optical path between the wave plate 2181c and the polarizing beam splitter 2182c. This causes the processing light EL0 passing through the wave plate 2181c and the polarizing beam splitter 2182c as polarization optical components to become parallel light, thereby enabling accurate polarization control.

[0238] The machining system SYSc in the third modification can also achieve the same effects as those achieved by the machining system SYS described above. Furthermore, the machining system SYSc can split the machining light EL0 emitted from the single light source 4 into two machining lights EL#1 and EL#2. This eliminates the need for the machining system SYSc to include two light sources 4, thereby reducing the cost of the machining system SYSc.

[0239] (4-4) Fourth Modification Next, a fourth modification of the machining system SYS will be described. In the following description, the fourth modification of the machining system SYS will be referred to as the "machining system SYSd." The machining system SYSd differs from the above-described machining system SYSc in that it includes a machining unit 2d instead of the machining unit 2c. Other features of the machining system SYSd may be the same as other features of the machining system SYSc. The machining unit 2d differs from the above-described machining unit 2c in that it includes a machining head 21d instead of the machining head 21c. Other features of the machining unit 2d may be the same as other features of the machining unit 2c. The machining head 21d differs from the above-described machining head 21c in that it includes an irradiation optical system 211d instead of the irradiation optical system 211c. Other features of the machining head 21d may be the same as other features of the machining head 21c. Therefore, hereinafter, the irradiation optical system 211d in the fourth modification will be described with reference to FIG. 27. FIG. 27 is a cross-sectional view showing the structure of an irradiation optical system 211d in the fourth modified example.

[0240] 27 , the irradiation optical system 211d differs from the above-described irradiation optical system 211c in that it includes a third optical system 216d and a fourth optical system 218d instead of the third optical system 216 and the fourth optical system 218c. Other features of the irradiation optical system 211d may be the same as other features of the irradiation optical system 211c.

[0241] The fourth optical system 218d differs from the fourth optical system 218c described above in that it includes an fθ lens 2162. In the example shown in Fig. 27 , the fθ lens 2162 is disposed on the optical path of the processing light EL0 between the wave plate 2181c and the polarizing beam splitter 2182c. However, the position of the fθ lens 2162 is not limited to the position shown in Fig. 27 . Other features of the fourth optical system 218d may be the same as other features of the fourth optical system 218c.

[0242] The third optical system 216d differs from the third optical system 216 described above in that it may not include the fθ lens 2162. Other features of the third optical system 216d may be the same as other features of the third optical system 216.

[0243] The machining system SYSd in the fourth modified example can also provide the same effects as those that can be provided by the machining system SYSc described above.

[0244] (4-5) Fifth Modification Next, a fifth modification of the machining system SYS will be described. In the following description, the fifth modification of the machining system SYS will be referred to as the "machining system SYSe." The machining system SYSe differs from the above-described machining system SYS (or the machining systems SYSa to SYSd) in that it includes a machining unit 2e instead of the machining unit 2. Other features of the machining system SYSe may be the same as other features of the machining system SYS. The machining unit 2e differs from the above-described machining unit 2 in that it includes a machining head 21e instead of the machining head 21. Other features of the machining unit 2e may be the same as other features of the machining unit 2. The machining head 21e differs from the above-described machining head 21 in that it includes an irradiation optical system 211e instead of the irradiation optical system 211. Other features of the machining head 21e may be the same as other features of the machining head 21. Therefore, the irradiation optical system 211e in the fifth modified example will be described below with reference to Fig. 28. Fig. 28 is a cross-sectional view showing the structure of the irradiation optical system 211e in the fifth modified example.

[0245] 28 , the irradiation optical system 211e differs from the above-described irradiation optical system 211 in that it includes a first optical system 214e and a second optical system 215e instead of the first optical system 214 and the second optical system 215. Other features of the irradiation optical system 211e may be the same as other features of the irradiation optical system 211.

[0246] The first optical system 214e differs from the above-described first optical system 214 in that it includes a collimator lens 2141e and a beam splitter 2147e. Other features of the first optical system 214e may be the same as other features of the first optical system 214.

[0247] Processing light EL#3 is incident on the collimator lens 2141e. The processing light EL#3 may be light in the same wavelength band as the processing light EL#2 incident on the second optical system 215e. In this case, processing light EL#2 emitted from light source 4#2 may be incident on the collimator lens 2141e as processing light EL#3. Alternatively, the processing system SYSe may include a light source that generates processing light EL#3 separate from light source 4#2. However, the processing light EL#3 may be any light as long as it can be used to process the workpiece W.

[0248] The collimator lens 2141e converts the processing light EL#3 incident on the collimator lens 2141e into parallel light. Note that if the processing light EL#3, which is parallel light, is incident on the first optical system 214e, the first optical system 214e does not need to include the collimator lens 2141e. In other words, the collimator lens 2141e may be omitted. Furthermore, if an optical fiber is interposed on the incident side of the beam splitter 2147e as an optical transmission member for transmitting the processing light EL#3, the collimator lens 2141e may be positioned so that the front focus of the collimator lens 2141e is located near the exit end of the optical fiber, and the collimator lens 2141e may convert the processing light EL#3, which is emitted as a diverging beam from the optical fiber, into parallel light. The processing light EL#3 converted into parallel light by the collimator lens 2141e is incident on the beam splitter 2147e. Furthermore, the processing light EL#1 converted into parallel light by the collimator lens 2141 also enters the beam splitter 2147e. The beam splitter 2147e functions as a combining optical system that combines the processing lights EL#1 and EL#3. Specifically, the processing light EL#1 passes through the beam splitter 2147e. The processing light EL#3 is reflected by the beam splitter 2147e. The processing light EL#1 that passes through the beam splitter 2147e and the processing light EL#3 that is reflected by the beam splitter 2147e both enter the parallel plate 2142. The processing lights EL#1 and EL#3 that enter the parallel plate 2142 are irradiated onto the printing surface MS via the galvanometer scanner 2144 and the third optical system 216. Therefore, in the fifth modified example, the first optical system 214e emits the processing lights EL#1 and EL#3 toward the third optical system 216, and the third optical system 216 irradiates the processing lights EL#1 and EL#3 onto the printing surface MS.

[0249] The irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#3 may be the same direction. For example, the irradiation direction of each of processing light EL#1 and EL#3 may be a direction along the optical axis AX of the fθ lens 2162 (the Z-axis direction in FIG. 28). Alternatively, the irradiation direction of processing light EL#1 and the irradiation direction of processing light EL#3 may be mutually different directions.

[0250] The irradiation optical system 211e may simultaneously irradiate the printing surface MS with the processing light EL#1 and EL#3. That is, the irradiation optical system 211e may irradiate the printing surface MS with the processing light EL#3 during at least a portion of the period during which the printing surface MS is irradiated with the processing light EL#1. The irradiation optical system 211e may irradiate the printing surface MS with the processing light EL#1 during at least a portion of the period during which the printing surface MS is irradiated with the processing light EL#3. Alternatively, the irradiation optical system 211e may irradiate the printing surface MS with the processing light EL#1 and EL#3 separately. That is, the irradiation optical system 211e may irradiate the printing surface MS with the processing light EL#3 during at least a portion of the period during which the printing surface MS is not irradiated with the processing light EL#1. The irradiation optical system 211e may irradiate the printing surface MS with the processing light EL#1 during at least a portion of the period during which the printing surface MS is not irradiated with the processing light EL#3.

[0251] If the wavelength bands of the processing light EL#1 and the processing light EL#3 are different, the focusing position CP of the processing light EL#1 irradiated onto the printing surface MS via the first optical system 214e and the third optical system 216 and the focusing position CP of the processing light EL#3 irradiated onto the printing surface MS via the first optical system 214e and the third optical system 216 may be misaligned along the irradiation direction of the processing light EL#1 and the processing light EL#3 (in the Z-axis direction in FIG. 28 ). In other words, chromatic aberration (particularly axial chromatic aberration or longitudinal chromatic aberration) may occur. Furthermore, the position of the beam spot BS#1 formed on the printing surface MS by the processing light EL#1 irradiated onto the printing surface MS via the first optical system 214e and the third optical system 216 may not be the same as the position of the beam spot BS#3 (not shown in FIG. 28 ) formed on the printing surface MS by the processing light EL#3 irradiated onto the printing surface MS via the first optical system 214e and the third optical system 216. That is, chromatic aberration (particularly, lateral chromatic aberration or magnification chromatic aberration) may occur. Therefore, as shown in FIG. 29 , the first optical system 214e may include an aberration correction member 2148e that corrects such chromatic aberration. The aberration correction member 2148e may include at least one of an achromatic lens, a color-extracting lens, a direct-view prism, and the like. As a result, the processing system SYSe can irradiate the processing beams EL#1 and EL#3 onto the printing surface MS while reducing the effects of chromatic aberration.

[0252] The control device 7 may correct chromatic aberration by controlling the drive amount of the galvanometer mirror 2146 (i.e., the rotation amount of at least one of the X scanning mirror 2146MX and the Y scanning mirror 2146MY). For example, the control device 7 may correct chromatic aberration by controlling the drive amount of the galvanometer mirror 2146 so that the drive amount of the galvanometer mirror 2146 when irradiating the printing surface MS with processing light EL#1 is different from the drive amount of the galvanometer mirror 2146 when irradiating the printing surface MS with processing light EL#3. As a result, the processing system SYSe can irradiate the printing surface MS with processing light EL#1 and EL#3 while reducing the effects of chromatic aberration.

[0253] Next, the second optical system 215e differs from the above-described second optical system 215 in that it includes a collimator lens 2151e and a beam splitter 2157e. Other features of the second optical system 215e may be the same as other features of the second optical system 215.

[0254] Processing light EL#4 is incident on the collimator lens 2151e. The processing light EL#4 may be light in the same wavelength band as the processing light EL#1 incident on the first optical system 214e. In this case, processing light EL#1 emitted from light source 4#1 may be incident on the collimator lens 2151e as processing light EL#4. Alternatively, the processing system SYSe may include a light source that generates processing light EL#4 separate from light source 4#1. However, the processing light EL#4 may be any light as long as it can be used to process the workpiece W.

[0255] The collimator lens 2151e converts the processing light EL#4 incident on the collimator lens 2151e into parallel light. When the processing light EL#4, which is parallel light, enters the second optical system 215e, the second optical system 215e does not need to include the collimator lens 2151e. In other words, the collimator lens 2151e may be omitted. When an optical fiber is interposed on the incident side of the beam splitter 2157e as an optical transmission member for transmitting the processing light EL#4, the collimator lens 2151e may be positioned so that the front focus of the collimator lens 2151e is located near the exit end of the optical fiber, and the collimator lens 2151e may convert the processing light EL#4, which is emitted as a diverging beam from the optical fiber, into parallel light. The processing light EL#4 converted into parallel light by the collimator lens 2151e enters the beam splitter 2157e. Furthermore, the processing light EL#2 converted into parallel light by the collimator lens 2151 also enters the beam splitter 2157e. The beam splitter 2157e functions as a combining optical system that combines the processing lights EL#2 and EL#4. Specifically, the processing light EL#2 passes through the beam splitter 2157e. The processing light EL#4 is reflected by the beam splitter 2157e. The processing light EL#2 that passes through the beam splitter 2157e and the processing light EL#4 that is reflected by the beam splitter 2157e both enter the parallel plate 2152. The processing lights EL#2 and EL#4 that enter the parallel plate 2152 are irradiated onto the printing surface MS via the galvanometer scanner 2154 and the third optical system 216. Therefore, in the fifth modified example, the second optical system 215e emits the processing lights EL#2 and EL#4 toward the third optical system 216, and the third optical system 216 irradiates the processing lights EL#2 and EL#4 onto the printing surface MS.

[0256] The irradiation direction of processing light EL#2 and the irradiation direction of processing light EL#4 may be the same direction. For example, the irradiation direction of each of processing light EL#2 and EL#4 may be a direction along the optical axis AX of the fθ lens 2162 (the Z-axis direction in FIG. 28). Alternatively, the irradiation direction of processing light EL#2 and the irradiation direction of processing light EL#4 may be mutually different directions.

[0257] The illumination optical system 211e may simultaneously irradiate the printing surface MS with the processing light EL#2 and EL#4. That is, the illumination optical system 211e may irradiate the printing surface MS with the processing light EL#4 during at least a portion of the period during which the printing surface MS is irradiated with the processing light EL#2. The illumination optical system 211e may irradiate the printing surface MS with the processing light EL#2 during at least a portion of the period during which the printing surface MS is irradiated with the processing light EL#4. Alternatively, the illumination optical system 211e may irradiate the printing surface MS with the processing light EL#2 and EL#4 separately. That is, the illumination optical system 211e may irradiate the printing surface MS with the processing light EL#4 during at least a portion of the period during which the printing surface MS is not irradiated with the processing light EL#2. The illumination optical system 211e may irradiate the printing surface MS with the processing light EL#2 during at least a portion of the period during which the printing surface MS is not irradiated with the processing light EL#4.

[0258] Because the wavelength bands of the processing light EL#2 and the processing light EL#4 are different, the focusing position CP of the processing light EL#2 irradiated onto the printing surface MS via the second optical system 215e and the third optical system 216 and the focusing position CP of the processing light EL#4 irradiated onto the printing surface MS via the second optical system 215e and the third optical system 216 may be misaligned along the irradiation direction of the processing light EL#2 and the processing light EL#4 (in the Z-axis direction in FIG. 28 ). In other words, chromatic aberration (particularly axial chromatic aberration or longitudinal chromatic aberration) may occur. Furthermore, the position of the beam spot BS#2 formed on the printing surface MS by the processing light EL#2 irradiated onto the printing surface MS via the second optical system 215e and the third optical system 216 may not be the same as the position of the beam spot BS#4 (not shown in FIG. 28 ) formed on the printing surface MS by the processing light EL#4 irradiated onto the printing surface MS via the second optical system 215e and the third optical system 216. That is, chromatic aberration (particularly, lateral chromatic aberration or magnification chromatic aberration) may occur. Therefore, as shown in FIG. 28 , the second optical system 215e may include an aberration correction member 2158e that corrects such chromatic aberration. The aberration correction member 2158e may include at least one of an achromatic lens, a color-extracting lens, a direct-view prism, and the like. As a result, the processing system SYSe can irradiate the processing beams EL#2 and EL#4 onto the printing surface MS while reducing the effects of chromatic aberration.

[0259] The control device 7 may correct chromatic aberration by controlling the drive amount of the galvanometer mirror 2156 (i.e., the rotation amount of at least one of the X scanning mirror 2156MX and the Y scanning mirror 2156MY). For example, the control device 7 may correct chromatic aberration by controlling the drive amount of the galvanometer mirror 2156 so that the drive amount of the galvanometer mirror 2156 when irradiating the printing surface MS with processing light EL#2 is different from the drive amount of the galvanometer mirror 2156 when irradiating the printing surface MS with processing light EL#4. As a result, the processing system SYSe can irradiate the printing surface MS with processing light EL#2 and EL#4 while reducing the effects of chromatic aberration.

[0260] The machining system SYSe in the fifth modified example can also provide the same effects as those that can be provided by the machining system SYS described above.

[0261] 29 , the first optical system 214e may include a focus control optical system 2145e#1 for changing the focus position CP of processing light EL#1 independently from the focus position of processing light EL#3, in addition to or instead of the focus control optical system 2145 for collectively changing the focus position CP of processing light EL#1 and the focus position of processing light EL#3. The first optical system 214e may include a focus control optical system 2145e#3 for changing the focus position CP of processing light EL#3 independently from the focus position of processing light EL#1, in addition to or instead of the focus control optical system 2145. In this case, the processing system SYSe can irradiate the processing light EL#1 and EL#3 onto the printing surface MS while reducing the effects of chromatic aberration.

[0262] Furthermore, the second optical system 215e may include a focus control optical system 2155e#2 for changing the focus position CP of processing light EL#2 independently from the focus position of processing light EL#4, in addition to or instead of the focus control optical system 2155 for collectively changing the focus position CP of processing light EL#2 and the focus position of processing light EL#4. The second optical system 215e may include a focus control optical system 2155e#4 for changing the focus position CP of processing light EL#4 independently from the focus position of processing light EL#2, in addition to or instead of the focus control optical system 2155. In this case, the processing system SYSe can irradiate the processing lights EL#2 and EL#4 onto the printing surface MS while reducing the effects of chromatic aberration.

[0263] The first optical system 214e may also include a power meter for detecting the intensity of the processing light EL#1 and a power meter for detecting the intensity of the processing light EL#3. In this case, the processing light EL#1 and EL#3 reflected by the parallel plate 2142 may be incident on the two power meters via an optical element for separating the processing light EL#1 and EL#3. An example of an optical element for separating the processing light EL#1 and EL#3 is a dichroic mirror.

[0264] The second optical system 215e may also include a power meter for detecting the intensity of the processing light EL#2 and a power meter for detecting the intensity of the processing light EL#4. In this case, the processing light EL#2 and EL#4 reflected by the parallel plate 2152 may be incident on the two power meters via an optical element for separating the processing light EL#2 and EL#4. An example of an optical element for separating the processing light EL#2 and EL#4 is a dichroic mirror.

[0265] (4-6) Sixth Modification Next, a sixth modification of the machining system SYS will be described. Note that in the following description, the sixth modification of the machining system SYS will be referred to as the "machining system SYSf." The machining system SYSf differs from the above-described machining system SYSe in that it includes a machining unit 2f instead of the machining unit 2e. Other features of the machining system SYSf may be the same as other features of the machining system SYSe. The machining unit 2f differs from the above-described machining unit 2e in that it includes a machining head 21f instead of the machining head 21e. Other features of the machining unit 2f may be the same as other features of the machining unit 2e. The machining head 21f differs from the above-described machining head 21e in that it includes an irradiation optical system 211f instead of the irradiation optical system 211e. Other features of the machining head 21f may be the same as other features of the machining head 21e. Therefore, hereinafter, the irradiation optical system 211f in the sixth modification will be described with reference to FIG. 30. FIG. 30 is a cross-sectional view showing the structure of an irradiation optical system 211f in the sixth modified example.

[0266] As described above, in the fifth modified example, the irradiation optical system 211e includes a first optical system 214e that emits the processing light EL#1 and EL#3 toward the third optical system 216. On the other hand, in the sixth modified example, as shown in Fig. 30 , the irradiation optical system 211f includes a first optical system 214 (214#1) that emits the processing light EL#1 toward the third optical system 216 and a first optical system 214 (214#2) that emits the processing light EL#3 toward the third optical system 216. Similarly, in the fifth modified example, the irradiation optical system 211e includes a second optical system 215e that emits the processing light EL#2 and EL#4 toward the third optical system 216. 30 , the irradiation optical system 211f includes a second optical system 215 (215#1) that emits the processing light EL#2 toward the third optical system 216 and a second optical system 215 (215#2) that emits the processing light EL#4 toward the third optical system 216. That is, the irradiation optical system 211f differs from the irradiation optical system 211e in that it includes four optical systems (i.e., first optical systems 214#1 and 214#2 and second optical systems 215#1 and 215#2) that respectively emit the four processing lights EL#1 to EL#4 toward the third optical system 216. Other features of the irradiation optical system 211f may be the same as other features of the irradiation optical system 211e.

[0267] The machining system SYSf in the sixth modified example can also provide the same effects as those that can be provided by the machining system SYSe described above.

[0268] (4-7) Other Modifications The light source 4 included in the processing system SYS may be replaceable. For example, if the processing system SYS includes a first light source 4 that emits processing light EL having a first wavelength, the first light source 4 may be replaced with a second light source 4 that emits processing light EL having a second wavelength different from the first wavelength. For example, if the processing system SYS includes a third light source 4 that emits processing light EL having a first intensity, the third light source 4 may be replaced with a fourth light source 4 that emits processing light EL having a fourth wavelength different from the first intensity. If the processing system SYS includes a light source 4 that has deteriorated over time, the light source 4 may be replaced with a new light source 4.

[0269] In the above description, the processing unit 2 melts the shaping material M by irradiating the shaping material M with the processing light EL. However, the processing unit 2 may melt the shaping material M by irradiating the shaping material M with any energy beam. Examples of the any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0270] In the above description, the processing unit 2 forms the three-dimensional structure ST by performing additive processing based on the laser build-up welding method. However, the processing unit 2 may form the three-dimensional structure ST by performing additive processing based on other methods capable of forming the three-dimensional structure ST. Examples of other methods capable of forming the three-dimensional structure ST include at least one of powder bed fusion (PBF) methods such as selective laser sintering (SLS), binder jetting, material jetting, stereolithography, and laser metal fusion (LMF). Alternatively, the processing unit 2 may form the three-dimensional structure ST by performing subtractive processing in addition to or instead of performing additive processing. The processing unit 2 may form the three-dimensional structure ST by performing machining in addition to or instead of performing at least one of additive processing and subtractive processing.

[0271] The processing system SYS may perform both additive processing and removal processing. For example, the processing system SYS shown in FIGS. 1 to 3 may perform additive processing using one of the processing lights EL#1 and EL#2, and may perform removal processing using the other of the processing light and EL#1 and EL#2. For example, the processing system SYSe shown in FIG. 28 or the processing system SYSf shown in FIG. 30 may perform additive processing using at least one of the processing lights EL#1 to EL#3, and may perform removal processing using the processing light and at least one other of EL#1 to EL#4. In this case, the processing system SYS, SYSe, or SYSf can perform additive processing and removal processing simultaneously. Note that if the processing system SYS, SYSe, or SYSf does not need to perform additive processing and removal processing simultaneously, the processing system SYS, SYSe, or SYSf may perform additive processing and removal processing using the same processing light EL.

[0272] In addition to at least one of additive processing and subtractive processing, the processing system SYS may also perform a remelt process to reduce the flatness of the surface of the workpiece W (or a shaped object formed on the workpiece W) processed by the additive processing or subtractive processing (i.e., reduce the surface roughness or make the surface closer to a flat surface). For example, the processing system SYS shown in FIGS. 1 to 3 may perform at least one of additive processing and subtractive processing using one of the processing lights EL#1 and EL#2, and may also perform a remelt process using the other of the processing light and EL#1 and EL#2. For example, the processing system SYSe shown in FIG. 28 or the processing system SYSf shown in FIG. 30 may perform at least one of additive processing and subtractive processing using at least one of the processing lights EL#1 to EL#3, and may also perform a remelt process using the processing light and at least one other of EL#1 to EL#4. In this case, the processing system SYS, SYSe, or SYSf can simultaneously perform at least one of additive processing and subtractive processing and a remelt process. Furthermore, if the processing system SYS, SYSe, or SYSf does not need to perform at least one of additional processing and removal processing and remelt processing simultaneously, the processing system SYS, SYSe, or SYSf may use the same processing light EL to perform at least one of additional processing and removal processing and remelt processing.

[0273] The above-described processing unit 2 (particularly, the processing head 21) may be attached to a robot. For example, the processing unit 2 (particularly, the processing head 21) may be attached to a welding robot for performing welding. For example, the processing unit 2 (particularly, the processing head 21) may be attached to a self-propelled mobile robot.

[0274] (5) Supplementary Notes The following supplementary notes are provided in relation to the above-described embodiment. [Supplementary Note 1] A processing device comprising: an irradiation optical system capable of irradiating an object with a first processing light emitted from a first light source and a second processing light emitted from a second light source different from the first light source and having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by the first and second processing light, wherein the peak wavelength of the second processing light is shorter than the peak wavelength of the first processing light, and a second region irradiated with the second processing light is wider than a first region irradiated with the first processing light. [Supplementary Note 2] The processing device described in Supplementary Note 1, wherein the wavelength band of the first processing light and the wavelength band of the second processing light are different. [Supplementary Note 3] The processing device described in Supplementary Note 1 or 2, wherein the object has a higher absorptivity for the second processing light than the object has absorptivity for the first processing light. [Supplementary Note 4] The processing device according to any one of Supplements 1 to 3, wherein the first processing light includes near-infrared light, and the second processing light includes visible light. [Supplementary Note 5] The processing device according to any one of Supplements 1 to 4, wherein the modeling material includes copper. [Supplementary Note 6] The processing device according to any one of Supplements 1 to 5, wherein the irradiation optical system includes: a first optical system that emits the first processing light; and a second optical system that emits the second processing light. [Supplementary Note 7] The processing device according to Supplementary Note 6, wherein the irradiation optical system includes a third optical system onto which the first processing light emitted from the first optical system and the second processing light emitted from the second optical system are incident, and which irradiates the object with the incident first and second processing lights. [Supplementary Note 8] The processing device according to Supplementary Note 7, wherein the third optical system includes a final optical element through which the first processing light and the second processing light pass and which is arranged closest to the object among the optical elements constituting the third optical system. [Supplementary Note 9] The processing apparatus according to Supplementary Note 7 or 8, wherein the third optical system includes a focusing optical system that focuses the first processing light and the second processing light on the object.[Supplementary Note 10] The processing apparatus described in any one of Supplementary Notes 6 to 9, wherein the first optical system includes a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light and a first deflecting member that can deflect the first processing light to change the first irradiation position where the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light, and the second optical system includes a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the first processing light and a second deflecting member that can deflect the second processing light to change the second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation direction of the first processing light. [Supplementary Note 11] The processing apparatus described in any one of Supplementary Notes 1 to 10, wherein the irradiation optical system irradiates the first processing light and the second processing light onto the surface of the object so that the irradiation mode of the first processing light and the irradiation mode of the second processing light are different. [Supplementary Note 12] The processing apparatus according to Supplementary Note 11, wherein the irradiation mode includes at least one of intensity, intensity distribution, irradiation period, irradiation time, diameter of a spot formed on the surface of the object, and movement mode of the irradiation position on the surface of the object. [Supplementary Note 13] The processing apparatus according to any one of Supplements 1 to 12, wherein the irradiation optical system irradiates the object with the first processing light and the second processing light so that a peak intensity of the first processing light is higher than a peak intensity of the second processing light. [Supplementary Note 14] The processing apparatus according to any one of Supplements 1 to 13, wherein the irradiation optical system irradiates the object with the first processing light and the second processing light so that a size of an area on the surface of the object scanned by the second processing light per unit time is larger than a size of an area on the surface of the object scanned by the first processing light per unit time. [Supplementary Note 15] The processing device described in any one of Supplementary Notes 1 to 14, wherein the irradiation optical system irradiates the first processing light and the second processing light onto the object such that (i) a period in which the first processing light is irradiated onto the object and a period in which the second processing light is irradiated onto the object overlap, and (ii) an intensity of the first processing light is higher than an intensity of the second processing light.[Supplementary Note 16] The processing apparatus according to any one of Supplements 1 to 14, wherein the irradiation optical system (i) irradiates a portion of the object with the first processing light after the second processing light has been irradiated onto the portion of the object, and (ii) irradiates the object with the first processing light and the second processing light such that the intensity of the first processing light is higher than the intensity of the second processing light. [Supplementary Note 17] The processing apparatus according to any one of Supplements 1 to 16, wherein the irradiation optical system (i) irradiates the object with the first processing light multiple times during at least a portion of a period during which the second processing light is irradiated onto the object, and (ii) irradiates the object with the first processing light and the second processing light such that the intensity of the first processing light is higher than the intensity of the second processing light. [Supplementary Note 18] The processing device according to any one of Supplementary Notes 1 to 17, wherein the irradiation optical system irradiates the object with the first processing light and the second processing light so that (i) a first irradiation position irradiated with the first processing light and a second irradiation position irradiated with the second processing light on a first plane intersecting with the irradiation direction of the first processing light regularly reciprocate along a movement direction within the first plane, (ii) an intensity of the first processing light at at least one of a first reversal timing at which the movement direction of the first irradiation position is reversed in the movement direction and an overlap timing at which the first irradiation position and the second irradiation position overlap is weaker than an intensity of the first processing light at a timing different from the first reversal timing and the overlap timing, and (iii) an intensity of the second processing light at at least one of a second reversal timing at which the movement direction of the second irradiation position is reversed in the movement direction and the overlap timing is weaker than an intensity of the second processing light at a timing different from the second reversal timing and the overlap timing.[Supplementary Note 19] The processing device described in any one of Supplementary Notes 1 to 17, wherein the irradiation optical system (i) regularly reciprocates a first irradiation position, on a first surface intersecting the irradiation direction of the first processing light, where the first irradiation position is irradiated with the first processing light along a first movement direction within the first surface, (ii) regularly reciprocates a second irradiation position, on the first surface, where the second processing light is irradiated with the second processing light along a second movement direction along the first surface and intersecting the first movement direction, and (iii) irradiates the first processing light and the second processing light onto the object so that a diameter of a spot formed on the object by the second processing light is larger than a diameter of a spot formed on the object by the first processing light. [Supplementary Note 20] The processing apparatus according to any one of Supplements 1 to 17, wherein the irradiation optical system irradiates the object with the first processing light and the second processing light such that (i) a first irradiation position on a first surface intersecting the irradiation direction of the first processing light, where the first irradiation position is irradiated with the first processing light, moves regularly along a first movement locus, (ii) a second irradiation position on the first surface, where the second processing light is irradiated, moves regularly along a second movement locus different from the first movement locus, and (iii) a diameter of a spot formed on the object by the second processing light is larger than a diameter of a spot formed on the object by the first processing light. [Supplementary Note 21] The processing apparatus according to any one of Supplements 1 to 20, wherein the irradiation optical system is further capable of irradiating the object with a third processing light having the same wavelength band as the wavelength band of the second processing light and a fourth processing light having the same wavelength band as the wavelength band of the first processing light. [Supplementary Note 22] The processing device according to Supplementary Note 21, wherein the irradiation optical system includes: a first optical system that emits the first and third processing beams; and a second optical system that emits the second and fourth processing beams.[Appendix 23] The processing apparatus described in Appendix 22, wherein the first optical system includes a first focusing position changing member that can change the focusing positions of the first and third processing light along the irradiation direction of the first processing light, and a first deflecting member that can deflect the first and third processing light so as to change the first irradiation position where the first processing light is irradiated and the third irradiation position where the third processing light is irradiated along a direction intersecting with the irradiation direction of the first processing light, respectively; and the second optical system includes a second focusing position changing member that can change the focusing positions of the second and fourth processing light along the irradiation direction of the first processing light, and a second deflecting member that can deflect the second and fourth processing light so as to change the second irradiation position where the second processing light is irradiated and the fourth irradiation position where the fourth processing light is irradiated along a direction intersecting with the irradiation direction of the first processing light, respectively. [Supplementary Note 24] The processing apparatus according to Supplementary Note 23, wherein a drive amount of the first deflection member when the first optical system irradiates a portion of the object with the first processing light is different from a drive amount of the first deflection member when the first optical system irradiates the portion of the object with the third processing light, and a drive amount of the second deflection member when the second optical system irradiates the portion of the object with the second processing light is different from a drive amount of the second deflection member when the second optical system irradiates the portion of the object with the fourth processing light. [Supplementary Note 25] The processing apparatus according to any one of Supplements 22 to 24, wherein the first optical system includes a first aberration correction member for correcting chromatic aberration caused by the first and third processing lights, and the second optical system includes a second aberration correction member for correcting chromatic aberration caused by the second and fourth processing lights. [Appendix 26] The processing apparatus described in Appendix 21, wherein the irradiation optical system includes: a first optical system that emits the first processing light; a second optical system that emits the second processing light; a third optical system that emits the third processing light; and a fourth optical system that emits the fourth processing light.[Supplementary Note 27] The first optical system includes a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light, and a first deflecting member that can deflect the first processing light so as to change the first irradiation position onto which the first processing light is irradiated along a direction intersecting with the irradiation direction of the first processing light; the second optical system includes a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the first processing light, and a second deflecting member that can deflect the second processing light so as to change the second irradiation position onto which the second processing light is irradiated along a direction intersecting with the irradiation direction of the first processing light; and the third optical system includes a third focusing position changing member that can change the focusing position of the third processing light along the irradiation direction of the first processing light, and a third deflecting member that can deflect the third processing light so as to change the third irradiation position onto which the third processing light is irradiated along a direction intersecting with the irradiation direction of the first processing light. The processing apparatus described in Appendix 26, wherein the fourth optical system includes a fourth focusing position changing member that can change the focusing position of the fourth processing light along the irradiation direction of the first processing light, and a fourth deflecting member that can deflect the fourth processing light so as to change the fourth irradiation position at which the fourth processing light is irradiated along a direction intersecting the irradiation direction of the first processing light. [Appendix 28] The processing apparatus described in any one of Appendices 1 to 27, further including a cooling device that can cool an optical element included in the irradiation optical system, wherein the cooling device cools the optical element such that a cooling mode of a first portion of the optical element onto which the first processing light is incident differs from a cooling mode of a second portion of the optical element onto which the second processing light is incident. [Appendix 29] The processing apparatus described in Appendix 28, wherein the cooling device can cool the first portion faster than the second portion.[Supplementary Note 30] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light emitted from a first light source; a second optical system capable of irradiating the object with a second processing light emitted from a second light source different from the first light source and having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by the first and second processing lights, wherein the first optical system includes a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light, and a first deflecting member capable of deflecting the first processing light so as to change the first irradiation position at which the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light, The second optical system includes a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light, and a second deflecting member that can deflect the second processing light so as to change the second irradiation position at which the second processing light is irradiated along a direction intersecting the irradiation direction of the second processing light. [Appendix 31] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light emitted from a first light source and with a second processing light emitted from a second light source different from the first light source and with a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by the first and second processing lights, wherein the first optical system includes: a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light; a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light; and a first deflecting member capable of deflecting the first processing light and the second processing light so as to change a first irradiation position where the first processing light is irradiated and a second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation directions of the first processing light and the second processing light.[Supplementary Note 32] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light and with a second processing light having a peak wavelength different from that of the first processing light; a second optical system capable of irradiating the object with a third processing light and with a fourth processing light having a peak wavelength different from that of the third processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by the first processing light, the second processing light, the third processing light, and the fourth processing light, wherein the first optical system comprises: a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light; and a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light. a first deflecting member capable of deflecting the first processing light and the second processing light so as to change a first irradiation position onto which the first processing light is irradiated and a second irradiation position onto which the second processing light is irradiated along a direction intersecting the irradiation directions of the first processing light and the second processing light; wherein the second optical system includes: a third focusing position changing member capable of changing the focusing position of the third processing light along the irradiation direction of the third processing light; a fourth focusing position changing member capable of changing the focusing position of the fourth processing light along the irradiation direction of the fourth processing light; and a second deflecting member capable of deflecting the third processing light and the fourth processing light so as to change a third irradiation position onto which the third processing light is irradiated and a fourth irradiation position onto which the fourth processing light is irradiated along a direction intersecting the irradiation directions of the third processing light and the fourth processing light.[Appendix 33] A processing device that performs additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light; and a material supply member capable of supplying a molding material to a molten pool formed by the first and second processing lights, wherein the first optical system includes a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light, and a first deflecting member that can deflect the first processing light so as to change the first irradiation position at which the first processing light is irradiated along a first direction that intersects with the irradiation direction of the first processing light, and the second optical system includes a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light, and a second deflecting member that can deflect the second processing light so as to change the second irradiation position at which the second processing light is irradiated along a second direction that intersects with the irradiation direction of the second processing light. [Supplementary Note 34] The processing apparatus described in Supplementary Note 33, wherein the first deflection member is controlled based on an amount of change of the focusing position of the first processing light by the first focusing-position changing member, and the second deflection member is controlled based on an amount of change of the focusing position of the second processing light by the second focusing-position changing member. [Supplementary Note 35] The processing apparatus described in Supplementary Note 33 or 34, wherein the first deflection member changes the first irradiation position in a direction along the surface of the object so as to correct a deviation of the first irradiation position in the direction along the surface of the object caused by the first focusing-position changing member changing the focusing position of the first processing light, and the second deflection member changes the second irradiation position in a direction along the surface of the object so as to correct a deviation of the second irradiation position in the direction along the surface of the object caused by the second focusing-position changing member changing the focusing position of the second processing light. [Appendix 36] The processing apparatus described in any one of Appendices 33 to 35, wherein the first light-focusing-position-changing member is controlled based on an amount of change of the first irradiation position by the first deflection member, and the second light-focusing-position-changing member is controlled based on an amount of change of the second irradiation position by the second deflection member.[Appendix 37] The processing apparatus described in any one of Appendices 33 to 36, wherein the first focusing position changing member changes the focusing position of the first processing light in a direction intersecting with the surface of the object so as to correct a shift in the focusing position of the first processing light in the direction intersecting with the surface of the object caused by the first deflecting member changing the first irradiation position, and the second focusing position changing member changes the focusing position of the second processing light in a direction intersecting with the surface of the object so as to correct a shift in the focusing position of the second processing light in the direction intersecting with the surface of the object caused by the second deflecting member changing the second irradiation position. [Appendix 38] The processing apparatus described in any one of Appendices 33 to 37, wherein the first optical system includes a first detector capable of detecting the intensity of the first processing light, and the second optical system includes a second detector capable of detecting the intensity of the second processing light. [Appendix 39] A processing device that performs additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light; and a material supply member capable of supplying a shaping material to a molten pool formed by the first and second processing lights, wherein the first optical system includes a first deflecting member that can deflect the first processing light so as to change a first irradiation position where the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light, and a first detector that can detect the intensity of the first processing light, and the second optical system includes a second deflecting member that can deflect the second processing light so as to change a second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation direction of the second processing light, and a second detector that can detect the intensity of the second processing light. [Appendix 40] The processing device described in Appendix 38 or 39, wherein the first detector is capable of detecting the intensity of the first processing light traveling along the optical path between a first light source that emits the first processing light and the first deflection member, and the second detector is capable of detecting the intensity of the second processing light traveling along the optical path between a second light source that emits the second processing light and the second deflection member.[Supplementary Note 41] The processing apparatus according to any one of Supplements 38 to 40, further comprising an intensity change device capable of changing the intensity of at least one of the first processing light and the second processing light, wherein the intensity change device changes the intensity of at least one of the first processing light and the second processing light based on a detection result of at least one of the first detector and the second detector. [Supplementary Note 42] The processing apparatus according to any one of Supplements 38 to 41, further comprising: an objective optical member for irradiating the object with the first processing light and the second processing light; and a cooling device capable of cooling the objective optical member, wherein the cooling device cools the objective optical member based on a detection result of at least one of the first detector and the second detector. [Supplementary Note 43] A processing apparatus comprising: a processing head including a focusing optical system that focuses processing light on an object and electrical components used to control the processing light; and a support member adjacent to the processing head along a direction intersecting an optical axis of the focusing optical system and supporting the processing head, wherein a first distance between the electrical component and the support member in the direction intersecting the optical axis is longer than a second distance between the optical axis and the support member in the direction intersecting the optical axis. [Supplementary Note 44] The processing apparatus described in Supplementary Note 43, wherein the electrical component includes a detector that can detect the intensity of the processing light. [Supplementary Note 45] The processing apparatus described in Supplementary Note 43 or 44, wherein the electrical component includes a drive system that drives a deflecting member that can deflect the processing light so as to change the irradiation position on the surface of the object where the processing light is irradiated along a direction along the surface of the object. [Supplementary Note 46] The processing apparatus described in any one of Supplements 43 to 45, wherein the position of the processing head relative to the object is changeable. [Supplementary Note 47] The processing device according to any one of Supplementary Notes 43 to 46, further comprising a drive device that changes the position of the support member, wherein the position of the processing head is changed in accordance with the change in the position of the support member. [Supplementary Note 48] The processing device according to any one of Supplementary Notes 43 to 47, further comprising a first space on the opposite side of the processing head from the support member.[Appendix 49] The processing device according to any one of Appendix 48, further comprising an openable and closable door on the first space side of the processing head. [Appendix 50] The processing device according to Appendix 48 or 49, wherein additional processing is performed in the first space. [Appendix 51] A processing device comprising: an irradiation device capable of irradiating an object with a first processing light and a second processing light having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a shaping material to a molten pool formed by at least one of the first and second processing lights. [Appendix 52] A processing device comprising: an irradiation device capable of irradiating an object with a first processing light and a second processing light having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a shaping material to a position where the first and second processing lights are irradiated by the irradiation device. [Appendix 53] A processing apparatus comprising: an irradiation device capable of irradiating an object with a first processing light and a second processing light having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to an irradiation area irradiated with the first processing light by the irradiation device, wherein the irradiation area irradiated with the first processing light at least partially overlaps with an area irradiated with the second processing light. [Appendix 54] The processing apparatus described in any one of Appendices 51 to 53, wherein the first area irradiated with the first processing light is the same as a second area irradiated with the second processing light. [Appendix 55] The processing apparatus described in any one of Appendices 51 to 53, wherein the first area irradiated with the first processing light is narrower than the second area irradiated with the second processing light. [Appendix 56] The processing apparatus described in Appendices 55, wherein the first processing light is movable inside the second area. [Appendix 57] The processing apparatus described in Appendices 55 or 56, wherein the size of the first processing light is changed within the second area. [Appendix 58] The processing device according to any one of Appendices 51 to 53, wherein the second region irradiated with the second processing light is narrower than the first region irradiated with the first processing light. [Appendix 59] The processing device according to Appendices 57 and 58, wherein the second processing light is movable inside the first region. [Appendix 60] The processing device according to Appendices 58 and 59, wherein the size of the second processing light is changed within the first region.[Appendix 61] The processing device described in any one of Appendices 51 to 60, wherein the first processing light is irradiated onto a molten pool formed by the second processing light. [Appendix 62] The processing device described in any one of Appendices 51 to 61, wherein the first processing light and the second processing light are irradiated onto the object simultaneously. [Appendix 63] The processing device described in any one of Appendices 51 to 62, wherein the second processing light is irradiated onto the object before the first processing light. [Appendix 64] The processing device described in any one of Appendices 51 to 63, wherein the first processing light is irradiated onto the object during at least a portion of a period during which the second processing light is irradiated. [Appendix 65] The processing device described in any one of Appendices 51 to 64, wherein the processing device modulates the peak intensity of at least one of the first processing light and the second processing light. [Appendix 66] The processing device is capable of changing the shape or size of an irradiation area of ​​at least one of the first processing light and the second processing light. The processing device is described in any one of Appendices 51 to 65. [Appendix 67] The processing device is capable of changing the scanning direction of at least one of the first processing light and the second processing light. [Appendix 68] The processing device is described in any one of Appendices 51 to 67. The processing device is capable of relatively moving an irradiation area of ​​the first processing light and an irradiation area of ​​the second processing light. [Appendix 69] The processing device is described in any one of Appendices 51 to 68. Changing the size of an irradiation area of ​​at least one of the first processing light and the second processing light includes changing the focus of at least one of the first processing light and the second processing light.[Appendix 70] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by at least one of the first and second processing lights, wherein the first optical system includes at least one of a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light and a first deflecting member that can deflect the first processing light so as to change the first irradiation position at which the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light; and the second optical system includes at least one of a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light and a second deflecting member that can deflect the second processing light so as to change the second irradiation position at which the second processing light is irradiated along a direction intersecting the irradiation direction of the second processing light. [Appendix 71] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light and with a second processing light having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by at least one of the first and second processing lights, wherein the first optical system includes at least one of a first focusing position changing member capable of changing the focusing position of the first processing light along the irradiation direction of the first processing light, a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the second processing light, and a first deflecting member capable of deflecting the first processing light and the second processing light so as to change the first irradiation position where the first processing light is irradiated and the second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation directions of the first processing light and the second processing light.[Supplementary Note 72] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light and with a second processing light having a peak wavelength different from that of the first processing light; a second optical system capable of irradiating the object with a third processing light and with a fourth processing light having a peak wavelength different from that of the third processing light; and a material supply member capable of supplying a modeling material to a molten pool formed by at least one of the first processing light, the second processing light, the third processing light, and the fourth processing light. the first optical system includes at least one of a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light, a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light, and a first deflecting member that can deflect the first processing light and the second processing light so as to change a first irradiation position onto which the first processing light is irradiated and a second irradiation position onto which the second processing light is irradiated along a direction intersecting the irradiation directions of the first processing light and the second processing light, The second optical system includes at least one of a third focusing position changing member that can change the focusing position of the third processing light along the irradiation direction of the third processing light, a fourth focusing position changing member that can change the focusing position of the fourth processing light along the irradiation direction of the second processing light, and a second deflecting member that can deflect the third processing light and the fourth processing light so as to change the third irradiation position where the third processing light is irradiated and the fourth irradiation position where the fourth processing light is irradiated along a direction intersecting the irradiation directions of the third processing light and the fourth processing light.[Appendix 73] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light having a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a position where at least one of the first and second processing lights is irradiated, wherein the first optical system includes at least one of a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light and a first deflecting member that can deflect the first processing light so as to change the first irradiation position where the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light; and the second optical system includes at least one of a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light and a second deflecting member that can deflect the second processing light so as to change the second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation direction of the second processing light. [Appendix 74] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light emitted from a first light source and with a second processing light emitted from a second light source different from the first light source and with a peak wavelength different from that of the first processing light; and a material supply member capable of supplying a modeling material to a position where at least one of the first and second processing lights is irradiated, wherein the first optical system includes at least one of a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light, a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light, and a first deflecting member that can deflect the first processing light and the second processing light so as to change a first irradiation position where the first processing light is irradiated and a second irradiation position where the second processing light is irradiated along a direction intersecting the irradiation directions of the first processing light and the second processing light.[Supplementary Note 75] A processing device for performing additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light and with a second processing light having a peak wavelength different from that of the first processing light; a second optical system capable of irradiating the object with a third processing light and with a fourth processing light having a peak wavelength different from that of the third processing light; and a material supply member capable of supplying a modeling material to a position where at least one of the first processing light, the second processing light, the third processing light, and the fourth processing light is irradiated. the first optical system includes at least one of a first focusing position changing member that can change the focusing position of the first processing light along the irradiation direction of the first processing light, a second focusing position changing member that can change the focusing position of the second processing light along the irradiation direction of the second processing light, and a first deflecting member that can deflect the first processing light and the second processing light so as to change a first irradiation position onto which the first processing light is irradiated and a second irradiation position onto which the second processing light is irradiated along a direction intersecting the irradiation directions of the first processing light and the second processing light, The second optical system includes at least one of a third focusing position changing member that can change the focusing position of the third processing light along the irradiation direction of the third processing light, a fourth focusing position changing member that can change the focusing position of the fourth processing light along the irradiation direction of the second processing light, and a second deflecting member that can deflect the third processing light and the fourth processing light so as to change the third irradiation position where the third processing light is irradiated and the fourth irradiation position where the fourth processing light is irradiated along a direction intersecting the irradiation directions of the third processing light and the fourth processing light. [Appendix 76] A processing device that performs additional processing on an object, comprising: a first optical system capable of irradiating the object with a first processing light; a second optical system capable of irradiating the object with a second processing light; and a material supply member capable of supplying a shaping material to a molten pool formed by at least one o...

Claims

1. an irradiation optical system capable of irradiating an object with a first processing light emitted from a first light source and a second processing light emitted from a second light source different from the first light source and having a shorter peak wavelength than the first processing light; a material supply member capable of supplying a modeling material to a molten pool formed by the first and second processing lights; Equipped with The second region irradiated with the second processing light is larger than the first region irradiated with the first processing light, The irradiation optical system irradiates the object with the first processing light and the second processing light such that (i) a first irradiation position, on a first surface intersecting an irradiation direction of the first processing light, where the first irradiation position is irradiated with the first processing light moves regularly along a first movement locus, and (ii) a second irradiation position, on the first surface, where the second processing light is irradiated with the second processing light moves regularly along a second movement locus different from the first movement locus. Processing equipment.

2. The wavelength band of the first processing light is different from the wavelength band of the second processing light. The processing device according to claim 1 .

3. The absorptivity of the object with respect to the second processing light is higher than the absorptivity of the object with respect to the first processing light.

3. The processing device according to claim 1 or 2.

4. the first processing light includes near-infrared light, The second processing light includes visible light. The processing device according to any one of claims 1 to 3.

5. The build material comprises copper The processing device according to any one of claims 1 to 4.

6. The irradiation optical system includes: a first optical system that emits the first processing light; a second optical system that emits the second processing light; Including, the first optical system includes a first focusing position changing member capable of changing a focusing position of the first processing light along an irradiation direction of the first processing light, and a first deflecting member capable of deflecting the first processing light so as to change a first irradiation position at which the first processing light is irradiated along a direction intersecting the irradiation direction of the first processing light, The processing apparatus according to any one of claims 1 to 5, wherein the second optical system includes a second focusing position changing member capable of changing the focusing position of the second processing light along the irradiation direction of the first processing light, and a second deflection member capable of deflecting the second processing light so as to change the second irradiation position at which the second processing light is irradiated along a direction intersecting the irradiation direction of the first processing light.

7. The irradiation optical system irradiates the first processing light and the second processing light onto the surface of the object such that an irradiation mode of the first processing light and an irradiation mode of the second processing light are different from each other. The processing device according to any one of claims 1 to 6.

8. The irradiation mode includes at least one of intensity, intensity distribution, irradiation period, irradiation time, diameter of a spot formed on the surface of the object, and a movement mode of an irradiation position on the surface of the object. The processing apparatus according to claim 7.

9. The irradiation optical system irradiates the object with the first processing light and the second processing light such that a peak intensity of the first processing light is higher than a peak intensity of the second processing light. The processing device according to any one of claims 1 to 8.

10. The irradiation optical system irradiates the first processing light and the second processing light onto the object such that (i) a period during which the first processing light is irradiated onto the object and a period during which the second processing light is irradiated onto the object overlap, and (ii) an intensity of the first processing light is higher than an intensity of the second processing light. The processing device according to any one of claims 1 to 9.

11. The irradiation optical system (i) irradiates a portion of the object with the second processing light, and then irradiates the portion of the object with the first processing light, and (ii) irradiates the object with the first processing light and the second processing light such that an intensity of the first processing light is higher than an intensity of the second processing light. The processing device according to any one of claims 1 to 9.

12. The irradiation optical system irradiates the first processing light and the second processing light onto the object such that (i) the first processing light is irradiated onto the object a plurality of times during at least a portion of a period during which the second processing light is irradiated onto the object, and (ii) an intensity of the first processing light is higher than an intensity of the second processing light. The processing device according to any one of claims 1 to 11.

13. The irradiation optical system irradiates the object with the first processing light and the second processing light such that (i) a first irradiation position to be irradiated with the first processing light and a second irradiation position to be irradiated with the second processing light move regularly back and forth along a moving direction in the first plane on a first surface intersecting the irradiation direction of the first processing light, (ii) an intensity of the first processing light at at least one of a first reversal timing at which the moving direction of the first irradiation position is reversed in the moving direction and an overlap timing at which the first irradiation position and the second irradiation position overlap is weaker than an intensity of the first processing light at a timing different from the first reversal timing and the overlap timing, and (iii) an intensity of the second processing light at at least one of a second reversal timing at which the moving direction of the second irradiation position is reversed in the moving direction and the overlap timing is weaker than an intensity of the second processing light at a timing different from the second reversal timing and the overlap timing. The processing device according to any one of claims 1 to 12.

14. The irradiation optical system irradiates the object with the first processing light and the second processing light such that (i) the first irradiation position moves back and forth regularly along a first moving direction in the first plane, and (ii) the second irradiation position moves back and forth regularly along a second moving direction along the first plane and intersecting the first moving direction. The processing device according to any one of claims 1 to 12.

15. The irradiation optical system irradiates the first processing light and the second processing light onto the object such that a diameter of a spot formed on the object by the second processing light is larger than a diameter of a spot formed on the object by the first processing light. The processing device according to any one of claims 1 to 12.

16. The irradiation optical system is further capable of irradiating the object with a third processing light having the same wavelength band as the wavelength band of the second processing light and a fourth processing light having the same wavelength band as the wavelength band of the first processing light. The processing device according to any one of claims 1 to 15.

17. The shape of the first movement trajectory is different from the shape of the second movement trajectory.

17. A processing device according to any one of claims 1 to 16.

18. The direction of the first movement trajectory is different from the direction of the second movement trajectory.

18. A processing device according to any one of claims 1 to 17.