Power supply unit for aerosol generation device, and aerosol generation device
Patent Information
- Application Number
- JP2024564128
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2042-12-16
AI Technical Summary
Aerosol generation devices, particularly those designed for handheld use, face challenges in miniaturization, leading to susceptibility to external noise such as static electricity, which can cause overvoltage and overcurrent issues, resulting in false detection or malfunction of sensors mounted on flexible printed circuit boards.
The implementation of a power supply unit with a flexible printed wiring board featuring laminated wiring layers, where the signal wiring area closer to the case is minimized to reduce external noise interference, and sensors are mounted on the board's surface away from the case to prevent noise entry.
This configuration effectively suppresses false detection and malfunction of sensors due to external noise, enhancing the reliability and accuracy of sensor operations and improving the durability of the aerosol generation device.
Abstract
Description
Power supply unit for aerosol generating device and aerosol generating device
[0001] The present disclosure relates to a power supply unit for an aerosol generating device and an aerosol generating device.
[0002] The aerosol generating device includes a case that houses a power source, a heating unit, multiple sensors, a circuit board on which the sensors and control device are mounted, etc. Furthermore, a flexible printed circuit board may be used in some aerosol generating devices to achieve miniaturization. For example, Patent Document 1 describes an aerosol generating device that includes a rigid substrate and a flexible printed circuit board.
[0003] Japanese Patent Application Publication No. 2021-083383
[0004] Aerosol generating devices such as heated smoking devices are preferably small enough to fit in a user's hand, and miniaturization is desirable. However, miniaturization of the aerosol generating device makes it easier for external noise, such as static electricity, to penetrate into a circuit board, including a flexible printed circuit board. When external noise, such as static electricity, penetrates into a circuit board, including a flexible printed circuit board, from outside the aerosol generating device, an overvoltage or overcurrent is input to a sensor mounted on the circuit board, potentially causing false detection or failure of the sensor.
[0005] The present disclosure discloses a power supply unit for an aerosol generation device that can prevent a sensor mounted on a flexible printed wiring board from falsely detecting or failing due to external noise, and the aerosol generation device.
[0006] The power supply unit of the aerosol generating device of the present disclosure comprises: a power supply capable of supplying power to a heating section that heats at least one of an aerosol source and a flavor source; a flexible printed wiring board on which one or more sensors are mounted or electrically connected; and a case that houses the power supply and the flexible printed wiring board, wherein a first wiring layer and a second wiring layer are laminated on the flexible printed wiring board, and signal wiring is formed on at least one of the first wiring layer and the second wiring layer, and in a case facing region of the flexible printed wiring board that faces the case, the wiring area of the signal wiring formed on the layer of the first wiring layer and the second wiring layer that is closer to the case is smaller than the wiring area of the signal wiring formed on the layer farther from the case.
[0007] The aerosol generating device of the present disclosure comprises: a heating unit that heats at least one of an aerosol source and a flavor source; a power source that can supply power to the heating unit; a flexible printed wiring board on which one or more sensors are mounted or electrically connected; and a case that houses the heating unit, the power source, and the flexible printed wiring board, wherein a first wiring layer and a second wiring layer are laminated on the flexible printed wiring board, and signal wiring is formed on at least one of the first wiring layer and the second wiring layer, and in a case facing region of the flexible printed wiring board that faces the case, the wiring area of the signal wiring formed on the layer of the first wiring layer and the second wiring layer that is closer to the case is smaller than the wiring area of the signal wiring formed on the layer farther from the case.
[0008] According to the present disclosure, it is possible to prevent a sensor mounted on a flexible printed wiring board from falsely detecting or failing due to external noise.
[0009] FIG. 1 is a schematic diagram illustrating a first configuration example of a suction device (suction device 100A). FIG. 2 is a schematic diagram illustrating a second configuration example of a suction device (suction device 100B). FIG. 3 is a perspective view of a suction device 100 according to an embodiment of the present disclosure. FIG. 4 is a perspective view of an internal unit 10 as viewed from the front right side. FIG. 5 is a perspective view of the internal unit 10 as viewed from the front left side. FIG. 6 is an exploded perspective view of the internal unit 10. FIG. 7 is a cross-sectional perspective view of a heater assembly 30. FIG. 8 is a block diagram simply illustrating the electrical connections of the main elements of the internal unit 10. FIG. 9 is a developed view of the front surface of the sensor FPC 73. FIG. 10 is a developed view of the back surface of the sensor FPC 73. FIG. 11 is a cross-sectional view of a first wiring layer 73L1 as viewed from the front surface of the sensor FPC 73. FIG. 12 is a cross-sectional view of a second wiring layer 73L2 as viewed from the front surface of the sensor FPC 73. Fig. 13 is a perspective view of the main part near the sensor FPC 73 as seen from above diagonally from the front right direction. Fig. 14 is a perspective view of the main part near the sensor FPC 73 as seen from above diagonally from the rear left direction.
[0010] A suction device, a control method, and a program according to an embodiment of the present disclosure will be described below with reference to the drawings. First, two configuration examples (a first configuration example and a second configuration example) to which the configuration of the suction device of the present disclosure can be applied will be described. Note that, in the following, identical or similar elements will be denoted by identical or similar reference numerals, and their description may be omitted or simplified as appropriate.
[0011] <<1. Configuration Example of Inhalation Device>> The inhalation device is a device that generates a substance to be inhaled by a user. In the following description, the substance generated by the inhalation device is described as an aerosol. Alternatively, the substance generated by the inhalation device may be a gas.
[0012] (1) First Configuration Example Fig. 1 is a schematic diagram illustrating a first configuration example of an inhalation device. As shown in Fig. 1, an inhalation device 100A according to this configuration example includes a power supply unit 110, a cartridge 120, and a flavor imparting cartridge 130. The power supply unit 110 includes a power supply unit 111A, a sensor unit 112A, a notification unit 113A, a memory unit 114A, a communication unit 115A, and a control unit 116A. The cartridge 120 includes a heating unit 121A, a liquid guide unit 122, and a liquid storage unit 123. The flavor imparting cartridge 130 includes a flavor source 131 and a mouthpiece 124. An air flow path 180 is formed in the cartridge 120 and the flavor imparting cartridge 130.
[0013] The power supply unit 111A stores electric power. The power supply unit 111A supplies electric power to each component of the suction device 100A under the control of the control unit 116A. The power supply unit 111A may be configured by, for example, a rechargeable battery such as a lithium ion secondary battery.
[0014] The sensor unit 112A acquires various types of information related to the suction device 100A. As one example, the sensor unit 112A is configured with a pressure sensor such as a condenser microphone, a flow rate sensor, a temperature sensor, or the like, and acquires values associated with suction by the user. As another example, the sensor unit 112A is configured with an input device such as a button or a switch that accepts information input from the user.
[0015] The notification unit 113A notifies the user of information. The information notified to the user by the notification unit 113A includes, for example, various information such as the SOC (State Of Charge) indicating the charge state of the power supply unit 111A, the preheating time for suction, the period during which suction is possible, etc. The notification unit 113A is configured, for example, by a light-emitting device that emits light, a display device that displays images, a sound output device that outputs sound, or a vibration device that vibrates.
[0016] The storage unit 114A stores various types of information for the operation of the suction device 100 A. The storage unit 114A is configured by a non-volatile storage medium such as a flash memory, for example.
[0017] The communication unit 115A is a communication interface capable of performing communication in accordance with any wired or wireless communication standard, such as Wi-Fi (registered trademark), Bluetooth (registered trademark), BLE (Bluetooth Low Energy (registered trademark)), NFC (Near Field Communication), or LPWA (Low Power Wide Area).
[0018] The control unit 116A functions as an arithmetic processing unit and a control unit, and controls the overall operation of the suction device 100A in accordance with various programs. The control unit 116A is realized by an electronic circuit such as a CPU (Central Processing Unit) or a microprocessor.
[0019] The liquid reservoir 123 stores an aerosol source. The aerosol source is atomized to generate an aerosol. The aerosol source is a liquid, such as a polyhydric alcohol, such as glycerin or propylene glycol, or water. The aerosol source may contain a tobacco-derived or non-tobacco-derived flavor component. When the inhalation device 100A is a medical inhaler, such as a nebulizer, the aerosol source may contain a drug.
[0020] The liquid guide portion 122 guides and holds the aerosol source, which is a liquid stored in the liquid storage portion 123, from the liquid storage portion 123. The liquid guide portion 122 is, for example, a wick formed by twisting a fiber material such as glass fiber or a porous material such as porous ceramic. In this case, the aerosol source stored in the liquid storage portion 123 is guided by the capillary effect of the wick.
[0021] The heating unit 121A generates aerosol by heating the aerosol source and atomizing the aerosol source. In the example shown in FIG. 1 , the heating unit 121A is configured as a coil and wound around the liquid guide unit 122. When the heating unit 121A generates heat, the aerosol source held in the liquid guide unit 122 is heated and atomized, generating aerosol. The heating unit 121A generates heat when power is supplied from the power supply unit 111A. For example, power may be supplied to the heating unit 121A when the sensor unit 112A detects that the user has started inhaling and / or that predetermined information has been input. Then, power supply to the heating unit 121A may be stopped when the sensor unit 112A detects that the user has stopped inhaling and / or that predetermined information has been input. Note that the user's inhalation operation on the inhalation device 100A can be detected, for example, based on the pressure (internal pressure) within the inhalation device 100A detected by a suction sensor exceeding a predetermined threshold.
[0022] The flavor source 131 is a component for imparting flavor components to the aerosol. The flavor source 131 may include tobacco-derived or non-tobacco-derived flavor components.
[0023] The air flow path 180 is a path for air inhaled by the user. The air flow path 180 has a tubular structure with an air inlet 181, which is an entrance for air into the air flow path 180, and an air outlet 182, which is an exit for air from the air flow path 180, at both ends. A liquid guide section 122 is disposed on the upstream side (closer to the air inlet 181) of the air flow path 180, and a flavor source 131 is disposed on the downstream side (closer to the air outlet 182). Air flowing in through the air inlet 181 as the user inhales is mixed with the aerosol generated by the heating section 121A and, as shown by arrow 190, is transported through the flavor source 131 to the air outlet 182. When the mixed fluid of the aerosol and air passes through the flavor source 131, flavor components contained in the flavor source 131 are imparted to the aerosol.
[0024] Mouthpiece 124 is a member that is held in the mouth by the user when inhaling. Air outlet holes 182 are arranged in mouthpiece 124. By holding mouthpiece 124 in the mouth and inhaling, the user can take in the mixed fluid of the aerosol and air into the oral cavity.
[0025] The above describes an example of the configuration of the suction device 100A. Of course, the configuration of the suction device 100A is not limited to the above, and various configurations such as those exemplified below may be used.
[0026] As an example, the inhalation device 100A may not include the flavoring cartridge 130. In that case, the cartridge 120 is provided with the mouthpiece 124.
[0027] As another example, the inhalation device 100A may include multiple types of aerosol sources. Multiple types of aerosols generated from the multiple types of aerosol sources may be mixed in the air flow path 180 and undergo a chemical reaction to generate additional types of aerosols.
[0028] Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121 A. For example, the means for atomizing the aerosol source may be vibration atomization or induction heating.
[0029] (2) Second Configuration Example Fig. 2 is a schematic diagram illustrating a second configuration example of a suction device. As shown in Fig. 2, a suction device 100B according to this configuration example includes a power supply unit 111B, a sensor unit 112B, a notification unit 113B, a memory unit 114B, a communication unit 115B, a control unit 116B, a heating unit 121B, a housing unit 140, and an insulating unit 144. In the suction device 100A according to the first configuration example, the power supply unit 110 housing the power supply unit 111A and the heating unit 121A are separate entities. However, in the suction device 100B according to the second configuration example, the power supply unit 111B and the heating unit 121B are integrated. In other words, the suction device 100B according to the second configuration example can also be said to be a power supply unit with a built-in heating unit.
[0030] Each of the power supply unit 111B, sensor unit 112B, notification unit 113B, memory unit 114B, communication unit 115B, and control unit 116B is substantially identical to the corresponding components included in the suction device 100A according to the first configuration example.
[0031] The storage unit 140 has an internal space 141 and holds the stick-shaped substrate 150 while accommodating a portion of the stick-shaped substrate 150 in the internal space 141. The storage unit 140 has an opening 142 that connects the internal space 141 to the outside and accommodates the stick-shaped substrate 150 inserted into the internal space 141 through the opening 142. For example, the storage unit 140 is a cylindrical body with the opening 142 and a bottom 143 as its bottom surface, and defines a columnar internal space 141. An air flow path that supplies air to the internal space 141 is connected to the storage unit 140. An air inlet, which is an air inlet to the air flow path, is arranged, for example, on a side surface of the suction device 100. An air outlet, which is an air outlet from the air flow path to the internal space 141, is arranged, for example, on the bottom 143.
[0032] The stick-shaped substrate 150 includes a substrate portion 151 and a mouthpiece portion 152. The substrate portion 151 includes an aerosol source. The aerosol source includes a tobacco-derived or non-tobacco-derived flavor component. When the inhalation device 100B is a medical inhaler such as a nebulizer, the aerosol source may include a medicament. The aerosol source may be, for example, a liquid such as a polyhydric alcohol, such as glycerin or propylene glycol, or water, containing a tobacco-derived or non-tobacco-derived flavor component, or a solid containing a tobacco-derived or non-tobacco-derived flavor component. When the stick-shaped substrate 150 is held in the storage portion 140, at least a portion of the substrate portion 151 is housed in the internal space 141, and at least a portion of the mouthpiece portion 152 protrudes from the opening 142. When a user holds the mouthpiece portion 152 protruding from the opening 142 in their mouth and inhales, air flows into the internal space 141 via an air flow path (not shown) and reaches the user's mouth along with the aerosol generated from the substrate portion 151.
[0033] 2, the heating unit 121B is configured in a film shape and is arranged to cover the outer periphery of the storage unit 140. When the heating unit 121B generates heat, the substrate unit 151 of the stick-shaped substrate 150 is heated from the outer periphery, and an aerosol is generated.
[0034] The heat insulating section 144 prevents heat transfer from the heating section 121B to other components. For example, the heat insulating section 144 is made of a vacuum heat insulating material, an aerogel heat insulating material, or the like.
[0035] The above is a description of an example of the configuration of the suction device 100B. Of course, the configuration of the suction device 100B is not limited to the above, and various configurations such as those exemplified below may be used.
[0036] As one example, the heating unit 121B may be configured in a blade shape and disposed so as to protrude from the bottom 143 of the storage unit 140 into the internal space 141. In this case, the blade-shaped heating unit 121B is inserted into the substrate 151 of the stick-shaped substrate 150 and heats the substrate 151 of the stick-shaped substrate 150 from the inside. As another example, the heating unit 121B may be disposed so as to cover the bottom 143 of the storage unit 140. Furthermore, the heating unit 121B may be configured as a combination of two or more of a first heating unit covering the outer periphery of the storage unit 140, a blade-shaped second heating unit, and a third heating unit covering the bottom 143 of the storage unit 140.
[0037] As another example, the accommodation unit 140 may include an opening / closing mechanism such as a hinge that opens and closes a portion of the outer shell that forms the internal space 141. The accommodation unit 140 may then open and close the outer shell to accommodate the stick-shaped substrate 150 inserted into the internal space 141 while clamping it. In this case, the heating unit 121B may be provided at the clamping location in the accommodation unit 140 and heat the stick-shaped substrate 150 while pressing it.
[0038] Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121B. For example, the means for atomizing the aerosol source may be induction heating. In that case, the suction device 100B has at least an electromagnetic induction source such as a coil that generates a magnetic field, instead of the heating unit 121B. A susceptor that generates heat by induction heating may be provided in the suction device 100B, or may be included in the stick-shaped substrate 150.
[0039] Furthermore, the suction device 100B may further include the heating unit 121A, the liquid guide unit 122, the liquid storage unit 123, and the air flow path 180 according to the first configuration example, and the air flow path 180 may supply air to the internal space 141. In this case, the mixed fluid of the aerosol and air generated by the heating unit 121A flows into the internal space 141 and is further mixed with the aerosol generated by the heating unit 121B, and reaches the oral cavity of the user.
[0040] <<2. Configuration Example of Suction Device According to the Present Disclosure>> Next, an embodiment of a suction device (hereinafter referred to as suction device 100) in which the configuration of the suction device according to the present disclosure is applied to the suction device 100B of the second configuration example described above will be described. Note that, although a specific description will be omitted, part of the configuration of the suction device 100 described in detail below can also be applied to the suction device 100A of the first configuration example.
[0041] 3 is an overall perspective view of the suction device 100. In the following description, the direction in which the stick-shaped substrate 150 is inserted into or removed from the suction device 100 is defined as the up-down direction, the sliding movement direction of the shutter 23 (described later) as the front-rear direction, and the direction perpendicular to the up-down direction and the front-rear direction as the left-right direction. As shown in the figure, the front is defined as Fr, the rear as Rr, the left side as L, the right side as R, the top as U, and the bottom as D.
[0042] The suction device 100 is preferably sized to fit in the hand, and has, for example, a rod shape. For example, a user holds the suction device 100 in one hand while touching the surface of the suction device 100 with the fingertip. The shape of the suction device 100 is not limited to a rod shape, and it may have any shape (for example, a rounded, approximately rectangular parallelepiped shape or an egg shape).
[0043] The suction device 100 includes an internal unit 10 (see FIGS. 4 to 6 ) and a case 20 that forms the exterior of the suction device 100. The case 20 has a lower case 21 and an upper case 22. A portion of the internal unit 10 is housed in the lower case 21, and the entire internal unit 10 is housed in the case 20 by placing the upper case 22 over the lower case 21 from above.
[0044] The top surface of the suction device 100 is provided with an opening 27 (see FIGS. 4 to 6) through which the stick-shaped substrate 150 is inserted and removed, and a shutter 23 that can slide back and forth. The opening 27 is located on the rear side of the top surface of the suction device 100. The shutter 23 selectively takes an open state (front position) that opens the opening 27 to allow the stick-shaped substrate 150 to be inserted and removed, and a closed state (rear position) that positions the shutter 23 above the opening 27 to close the opening 27. When inserting the stick-shaped substrate 150 into the opening 27, the user opens the shutter 23.
[0045] A shutter detection sensor 11 (see FIG. 4) is provided near the shutter 23. The shutter detection sensor 11 detects whether the shutter 23 is open or not. The shutter detection sensor 11 is an example of the sensor unit 112B of the suction device 100B in FIG. 2.
[0046] Additionally, a USB (Universal Serial Bus) port 26 (see FIG. 4) is provided on the top surface of the suction device 100 adjacent to the opening 27. In the open state described above, the shutter 23 blocks the USB port 26. On the other hand, in the closed state described above, the shutter 23 does not block the USB port 26, and the USB port 26 is open. The USB port 26 is configured to be electrically connectable to an external power source (not shown) capable of supplying power to charge the power supply unit 111C (see FIG. 4). The USB port 26 is, for example, a receptacle into which a mating plug can be inserted. As an example, in this embodiment, the USB port 26 is a USB Type-C receptacle.
[0047] An operation unit 24 and a light-emitting unit 25 are provided on the front surface of the suction device 100. The operation unit 24 is disposed below the light-emitting unit 25. More specifically, the operation unit 24 and the light-emitting unit 25 are components of the internal unit 10 housed in the case 20, and are configured so that parts of the operation unit 24 and the light-emitting unit 25 are exposed from openings formed on the front surface of the case 20. The light-emitting unit 25 is an example of the notification unit 113B of the suction device 100B in FIG. 2 .
[0048] The operation unit 24 is a button-type switch that can be operated by the user and is an input device that accepts information input from the user. The operation unit 24 is connected to the main board 50 (see FIGS. 4 to 6), which will be described later. When the user presses the operation unit 24, for example, the MCU (Micro Controller Unit) 1 (see FIGS. 4 to 6) or the heating unit 121C (see FIG. 7) is activated. The MCU 1 functions as the control unit 116B in the suction device 100B. The MCU 1 may also have the function of the communication unit 115B in addition to the function of the control unit 116B in the suction device 100B. Furthermore, the MCU 1 may be composed of a single IC or two or more ICs. For example, the discharge control for the heating unit 121C and the charge control for the power supply unit 111C may be performed by a single IC or by separate ICs.
[0049] The light-emitting unit 25 is composed of light-emitting elements such as LEDs (Light Emitting Diodes). More specifically, the light-emitting unit 25 includes a plurality of LEDs 251 (see FIG. 6 ) provided on the main board 50, and a transparent cover 250 that covers the plurality of LEDs 251 and transmits light from the LEDs 251. A portion of the transparent cover 250 is exposed through an opening formed in the front surface of the case 20. In this embodiment, for example, the plurality of LEDs 251 are configured to be able to emit light in a plurality of colors including blue, yellow, and red. The number of light-emitting elements can be set arbitrarily, and the light-emitting unit 25 may have only one light-emitting element, for example.
[0050] The light-emitting unit 25 emits light in a predetermined light-emitting manner in response to a command from the MCU 1 to notify the user of predetermined information. Here, the light-emitting manner may be, for example, a light color, but is not limited to this and may be, for example, a lighting intensity (in other words, brightness) or a lighting pattern (for example, blinking at a predetermined time interval). Furthermore, the predetermined information may be, for example, operational information indicating whether the power of the suction device 100 is on or not.
[0051] Next, the internal unit 10 of the suction device 100 of this embodiment will be described with reference to Figures 4 to 8. Figure 4 is a perspective view of the internal unit 10 as seen from the front right side, Figure 5 is a perspective view of the internal unit 10 as seen from the front left side, Figure 6 is an exploded perspective view of the internal unit 10, Figure 7 is a cross-sectional perspective view of the heater assembly 30, and Figure 8 is a block diagram simply showing the electrical connections of the main elements of the internal unit 10. Note that the internal unit 10 is the suction device 100 with the case 20 and shutter 23 removed.
[0052] The internal unit 10 includes a chassis 40, a main board 50, a vibration device 60, a heater assembly 30, a power supply unit 111C, a power supply board 71, a peripheral FPC 72, a sensor FPC 73, and various sensors. The peripheral FPC 72 and the sensor FPC 73 are flexible circuit boards. Flexible circuit boards are flexible, include conductive wiring and / or signal wiring, and can mount electronic components (elements) such as resistors and chips. Flexible circuit boards generally have a thickness of 100 μm to 600 μm. The power supply board 71 may be a flexible circuit board, a rigid board (described later), or a combination of a flexible board and a rigid board. However, a flexible circuit board will be described here as an example.
[0053] 6 , the chassis 40 has a power supply holding portion 41 that holds the power supply unit 111C, a board holding portion 42 that holds the main board 50, and a heater holding portion 43 that holds the heater assembly 30. The power supply holding portion 41 is located in the lower part of the chassis 40, and the board holding portion 42 and the heater holding portion 43 are located in the upper part of the chassis 40.
[0054] The power supply holding unit 41 has a cylindrical shape with a portion of the side cut out, in other words, a substantially semi-cylindrical shape. The power supply holding unit 41 has a bottom wall 401, an arc-shaped side wall 402 standing upward from the bottom wall 401, and an upper wall 403 provided at the upper end of the side wall 402. The power supply unit 111C is disposed in a space surrounded by the bottom wall 401, the side wall 402, and the upper wall 403.
[0055] The board holding portion 42 is provided on a standing wall portion 404 that stands upward from the upper wall portion 403 of the power supply holding portion 41. The board holding portion 42 is provided on one side (here, the front side) of the standing wall portion 404 in the front-rear direction, and holds the main board 50.
[0056] The heater holding portion 43 is provided on the opposite side (here, rear side) of the standing wall portion 404 from the substrate holding portion 42 in the front-rear direction. The heater holding portion 43 has a space surrounded by the standing wall portion 404, a pair of left and right wall portions 405 extending in the front-rear direction from the standing wall portion 404, and the upper surface of the upper wall portion 403 of the power supply holding portion 41, and the heater assembly 30 is disposed in this space.
[0057] (Main Board) The main board 50 is a rigid board with multiple electronic components (elements) mounted on both sides. Rigid boards are not flexible and generally have a thickness of 300 μm to 1,600 μm. The main board 50 is mounted with an MCU 1, LEDs 251, a charging IC (Integrated Circuit) 81, a step-up DC / DC converter 82, and other components. The main board 50 is held by the board holder 42 of the chassis 40 with the element mounting surface facing forward and backward. FIG. 6 shows only the front surface 501 (here, the front surface) of the main board 50. Therefore, the charging IC 81 and step-up DC / DC converter 82 mounted on the back surface 502 (here, the rear surface) are not shown.
[0058] A power supply connection section 51 electrically connected to the power supply section 111C is provided in a lower region of the surface 501 of the main substrate 50. The power supply connection section 51 is electrically connected to the power supply section 111C via a substrate connection section 710 of the power supply substrate 71. The power supply section 111C is a cylindrical lithium ion secondary battery, and is an example of the power supply section 111B of the suction device 100B in FIG. 2 .
[0059] As shown in FIG. 6 , the power supply unit 111C is provided with a positive electrode tab 111a and a negative electrode tab 111b. The power supply unit 111C is disposed in the power supply holding portion 41 of the chassis 40 with the positive electrode tab 111a and the negative electrode tab 111b disposed forward. The power supply board 71 is disposed in front of the power supply unit 111C and the main board 50 and extends vertically. Referring also to FIG. 8 , the positive electrode tab connection portion 711a and the negative electrode tab connection portion 711b of the power supply board 71 are connected to the positive electrode tab 111a and the negative electrode tab 111b of the power supply unit 111C, respectively, and the board connection portion 710 is electrically connected to the power supply connection portion 51 of the main board 50. Power from the power supply unit 111C is transmitted to the main board 50 through conductive tracks formed on the power supply board 71 and supplied to various electronic components, such as the step-up DC / DC converter 82. The power supply board 71 also includes a power supply temperature sensor 16. The power supply temperature sensor 16 is a sensor that detects the temperature of the power supply unit 111C. The power supply temperature sensor 16 is, for example, a thermistor. The power supply temperature sensor 16 is an example of the sensor unit 112B of the suction device 100B in FIG.
[0060] A USB port 26 is provided in an upper region of the rear surface 502 of the main board 50. The USB port 26 is electrically connected to the charging IC 81 by wiring formed on the main board 50.
[0061] 8, heater connectors 57a and 57b are provided on the rear surface 502 of the main board 50 in addition to a charging IC 81 and a step-up DC / DC converter 82. The charging IC 81 controls charging by supplying (charging) power input from the USB port 26 to the power supply unit 111C. The step-up DC / DC converter 82 boosts the power supplied from the power supply unit 111C to generate power to be supplied to the heating unit 121C via a heating switch 85. The heating switch 85 is, for example, a field effect transistor (FET).
[0062] A board connection part 121a extending from below the heater assembly 30 is connected to the heater connection parts 57a and 57b, and supplies power to the heating part 121C of the heater assembly 30. As a result, power is supplied to the heating part 121C of the heater assembly 30 from the power supply part 111C via the main board 50.
[0063] (Vibration Device) The vibration device 60 is composed of a vibration element such as a vibration motor. As shown in FIG. 6 , the vibration device 60 is disposed in the power supply holding portion 41 of the chassis 40, between the upper surface of the power supply unit 111C and the upper wall portion 403. The lead wires 61 of the vibration device 60 are connected to the peripheral FPC 72. The vibration device 60 vibrates in a predetermined vibration mode in response to a command from the MCU 1 to notify the user of predetermined information. For example, when heating of the stick-shaped substrate 150 starts or ends, the vibration device 60 vibrates in a predetermined vibration mode to notify the user of the start or end of heating. The vibration device 60 is an example of the notification unit 113B of the suction device 100B in FIG. 2 .
[0064] 7, the heater assembly 30 includes a heating section 121C, a housing section 140C, and a heat insulating section 144C. The heating section 121C is, for example, a film heater, and is wound around the outer periphery of the housing section 140C. The heating section 121C and the board connection section 121a may be formed by a single heater FPC.
[0065] The heater assembly 30 is also provided with a stick guide 31. The stick guide 31 is provided on the upper part of the heater assembly 30 and guides the insertion and removal of the stick-shaped substrate 150 into the housing portion 140C. The stick guide 31 is a cylindrical member that has an opening 27 and constitutes a part of the housing portion 140C.
[0066] The heater assembly 30 is also provided with a heater temperature sensor 15 capable of detecting the temperature of the heating portion 121C. More specifically, the heater temperature sensor 15 is provided between the heating portion 121C and the heat insulating portion 144C, in contact with or in close proximity to the heating portion 121C. The heater temperature sensor 15 is, for example, a thermistor.
[0067] 6, the sensor FPC 73 is disposed between the standing wall portion 404 of the heater holding portion 43 and the heater assembly 30. One or more sensors are mounted or electrically connected to the sensor FPC 73. In this embodiment, the sensor FPC 73 is equipped with a stick detection sensor 12, a suction sensor 13, and a case temperature sensor 14. The stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 are examples of the sensor unit 112B of the suction device 100B in FIG. 2.
[0068] The stick detection sensor 12 is a sensor capable of detecting the stick-shaped substrate 150 housed in the housing section 140. In this embodiment, the stick detection sensor 12 is an optical sensor capable of detecting the stick-shaped substrate 150 based on the amount of reflected light of light irradiated onto the housing section 140. Here, the term "amount of light" is a concept that includes luminous flux, illuminance, luminous emittance, luminous intensity, brightness, etc. The optical sensor is, for example, an IR (Infrared Rays) sensor.
[0069] The suction sensor 13 is a sensor that detects a puffing action (inhalation action) by the user. The suction sensor 13 is composed of, for example, a condenser microphone, a pressure sensor, a puff thermistor, etc. The suction sensor 13 is provided in the sensor FPC 73 near the stick guide 31.
[0070] The case temperature sensor 14 is a sensor that detects the temperature of the case 20. The case temperature sensor 14 is, for example, a thermistor. The case temperature sensor 14 is disposed adjacent to the inner surface of the case 20 on the sensor FPC 73.
[0071] The sensor FPC 73 is also provided with a heater temperature sensor connection 731 that connects to the heater temperature sensor 15 of the heater assembly 30. The heater temperature sensor connection 731 is provided on the lower part of the sensor FPC 73. More specifically, a lead wire 15a is connected to the heater temperature sensor 15, and the heater temperature sensor connection 731 is connected to the lead wire 15a that extends from below the heater assembly 30.
[0072] The stick detection sensor 12, suction sensor 13, case temperature sensor 14, and heater temperature sensor connection part 731 are connected to the board connection part 730 via signal wiring formed on the sensor FPC 73. The board connection part 730 is connected to the sensor FPC connection part 55 provided in the central region of the surface 501 of the main board 50. This allows the detection results of each sensor to be output to the MCU 1 and the like mounted on the main board 50. The sensor FPC 73 will be explained in more detail later.
[0073] In the suction device 100 configured in this manner, when the shutter detection sensor 11 detects the open state of the shutter 23 and the stick detection sensor 12 detects the stick-shaped substrate 150, the MCU 1 begins heating the heating unit 121C. When a user holds the suction mouthpiece 152 of the stick-shaped substrate 150 in their mouth and inhales, aerosol is supplied into the user's mouth from the aerosol source of the stick-shaped substrate 150 heated by the heating unit 121C. The suction sensor 13 detects the number of suctions, and the MCU 1 stops heating after a predetermined number of suctions or after a predetermined time has elapsed. While the suction device 100 is heating, the case temperature sensor 14, heater temperature sensor 15, and power supply temperature sensor 16 detect their respective temperatures. If abnormal heating is determined, the MCU 1 stops or suppresses heating of the heating unit 121C. The user can also operate the operation unit 24 to, for example, check the SOC of the power supply unit 111C. The light-emitting unit 25 (LED 251) and the vibration device 60 notify the user of various information such as the SOC of the power supply unit 111C, error indications, etc. If the SOC of the power supply unit 111C decreases, the user can connect an external power source to the USB port 26 to charge the power supply unit 111C.
[0074] Next, the sensor FPC 73 will be described in detail with reference to Figures 9 and 10. Figure 9 is a development view of the front surface (the rear surface side of the main body 751) of the sensor FPC 73, and Figure 10 is a development view of the back surface (the front surface side of the main body 751) of the sensor FPC 73. The dashed-dotted lines and dashed-two-dotted lines in Figures 9 and 10 are folding lines. Note that the front surface and back surface of the sensor FPC 73 are defined merely for the sake of convenience in order to simplify and clarify the description, and may face in any direction in the suction device 100.
[0075] The sensor FPC 73 has a substantially rectangular main body 751 that is longer in the vertical direction than in the horizontal direction, a right-upper extending portion 752 that extends to the right from an upper portion of the main body 751, a right-lower extending portion 753 that extends to the right from a lower portion of the main body 751 and then bends upward, a lower extending portion 754 that extends further downward from the lower portion of the main body 751, an upper extending portion 755 that extends further upward from an upper portion of the main body 751, an upper-right extending portion 756 that extends to the right from the upper extending portion 755, and an upper-left extending portion 757 that extends to the left from the upper extending portion 755. The upper-left extending portion 757 is longer than the upper-right extending portion 756, and is configured so that the tip end (left end) of the upper-left extending portion 757 faces the main body 751 when the sensor FPC 73 is folded and housed in the case 20 (hereinafter referred to as the housed state) as shown in FIG.
[0076] As described above, the sensor FPC 73 is equipped with the stick detection sensor 12, suction sensor 13, and case temperature sensor 14, and is connected to the sensor FPC connection portion 55 of the main board 50 via the board connection portion 730. More specifically, the stick detection sensor 12, suction sensor 13, and case temperature sensor 14 are mounted on the surface of the sensor FPC 73 (the surface that forms the rear surface of the main body portion 751), as shown in FIG.
[0077] The stick detection sensors 12 are arranged on the upper right extension portion 756 and the upper left extension portion 757, one on each side, at positions approximately symmetrical on either side of the upper extension portion 755. The stick detection sensors 12 are arranged on the outer periphery of the stick guide 31 in the housed state, and detect the stick-shaped substrate 150 housed in the housing portion 140.
[0078] Suction sensor 13 is disposed at the tip (left end) of upper left extension 757. Suction sensor 13 is disposed on the outer periphery of stick guide 31 in the housed state, and detects pressure changes and temperature changes in the air flowing from near opening 27 to housing portion 140 in conjunction with the puffing action (suction action).
[0079] The case temperature sensor 14 is located at the tip (upper end) of the lower right extension 753. The case temperature sensor 14 is located close to the wall of the case 20 in the housed state and detects the temperature of the case 20. While the two stick detection sensors 12 and the suction sensor 13 are located at approximately the same position in the vertical direction (longitudinal direction of the sensor FPC), the case temperature sensor 14 is located at a different position in the vertical direction, that is, at the bottom in this embodiment.
[0080] 10 , the board connection part 730 is mounted on the back surface (the surface that forms the front surface of the main body part 751) of the sensor FPC 73. The board connection part 730 is disposed at the tip (right end part) of the upper right extension part 752, that is, at a position between the vertical positions of the two stick detection sensors 12 and the suction sensor 13 and the vertical position of the case temperature sensor 14.
[0081] In this way, by mounting the stick detection sensor 12, suction sensor 13, and case temperature sensor 14 on the sensor FPC 73, which is a flexible circuit board that is thinner and more flexible than a rigid board, it is possible to reduce the size of the main board 50, which is a rigid board. Furthermore, these sensors 12 to 14 are connected collectively to the sensor FPC connection part 55 of the main board 50 at the board connection part 730 through signal wiring 738, 739 formed on the sensor FPC 73. Therefore, the connection parts of the sensors 12 to 14 to the main board 50 can be made common, and the main board 50, which is a rigid board, can be reduced in size.
[0082] The board connection portion 730 of the sensor FPC 73 and the sensor FPC connection portion 55 of the main board 50 are preferably connectors 19 consisting of a plug (male connector) and a receptacle (female connector). This facilitates the connection work. As shown in Figure 8, the sensor FPC connection portion 55 is connected to the MCU 1 via signal wiring formed on the main board 50.
[0083] In this embodiment, three sensors, namely, the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14, are mounted on the sensor FPC 73. However, other sensors may be mounted in place of or in addition to these sensors, as long as one or more sensors are mounted on or electrically connected to the sensor FPC 73. An example of such other sensor is the power supply temperature sensor 16. In other words, it is sufficient that one or more sensors, regardless of the type of sensor, are mounted on or electrically connected to the sensor FPC 73 and that the connection to the main board 50 is shared.
[0084] Furthermore, even if the sensor placement positions (longitudinal direction of the sensor FPC) are different, it is preferable that the connection parts to the main board 50 are common. In this embodiment, the case temperature sensor 14, which is placed at a different position in the up-down direction (longitudinal direction of the sensor FPC) from the two stick detection sensors 12 and the suction sensor 13, is also connected to the sensor FPC connection part 55 of the main board 50 via the board connection part 730.
[0085] In this case, the connection portion to the main board 50 is preferably located between the sensor located at one end and the sensor located at the other end in the longitudinal direction of the sensor FPC. In this embodiment, the board connection portion 730 is located between the vertical positions (longitudinal direction of the sensor FPC) of the two stick detection sensors 12 and the suction sensor 13 and the vertical position (longitudinal direction of the sensor FPC) of the case temperature sensor 14. This allows the length of the signal wiring from each sensor to the board connection portion 730 to be equalized.
[0086] 8, the suction sensor 13 and the case temperature sensor 14 are supplied with the input voltage VCC1, which is an input voltage of the same potential. Therefore, the suction sensor 13 and the case temperature sensor 14 are connected to the signal wiring 738 of the same potential, and can be connected to the main board 50 by the same electrical contact 55a. By mounting sensors connected to signal wiring of the same potential on the sensor FPC 73 in this way, the same electrical contact 55a can be used in the sensor FPC connection portion 55, so there is no need to provide multiple electrical contacts for each sensor in the sensor FPC connection portion 55, and the main board 50 can be made smaller.
[0087] In this embodiment, the heater temperature sensor 15 connected to the sensor FPC 73 via the lead wire 15a is also supplied with the same input voltage VCC1 as the suction sensor 13 and the case temperature sensor 14, is connected to signal wiring of the same potential, and is connected to the main board 50 by the same electrical contact 55a. This allows the main board 50 to be further miniaturized.
[0088] Furthermore, the two stick detection sensors 12 are supplied with an input voltage VCC2. Therefore, the two stick detection sensors 12 are connected to the signal wiring 739 of the same potential and can be connected to the main board 50 via the same electrical contact 55b. The input voltage VCC2 of the two stick detection sensors 12 and the input voltage VCC1 of the suction sensor 13 and the case temperature sensor 14 may be the same or different. When the input voltages VCC1 and VCC2 are the same, the electrical contacts 55a and 55b may be common or different. On the other hand, when the input voltages VCC1 and VCC2 are different, the electrical contacts 55a and 55b must be different. In this way, even sensors with different input voltages can be mounted on the sensor FPC 73 by using different electrical contacts, allowing the connection to the main board 50 to be common.
[0089] The sensor FPC 73 is a laminated wiring board in which a first wiring layer 73L1 and a second wiring layer 73L2 are laminated. Fig. 11 is a cross-sectional view of the first wiring layer 73L1 as viewed from the front side of the sensor FPC 73 (the rear side of the main body 751), and Fig. 12 is a cross-sectional view of the second wiring layer 73L2 as viewed from the front side of the sensor FPC 73 (the rear side of the main body 751).
[0090] The first wiring layer 73L1 and the second wiring layer 73L2 are stacked in the sensor FPC 73 so that the first wiring layer 73L1 is closer to the back side (front side of the main body portion 751) than the second wiring layer 73L2, and the second wiring layer 73L2 is closer to the front side (rear side of the main body portion 751) than the first wiring layer 73L1.
[0091] The sensor FPC 73 is folded along the folding lines shown by the dashed and dotted lines in FIGS.
[0092] As shown in FIG. 6 and FIGS. 11 to 14, the sensor FPC 73 is folded along the folding lines indicated by the dashed and double-dashed lines in FIGS. 9 and 10, and has a case facing region 73A facing the case 20.
[0093] As shown in Figures 11 to 14, in this embodiment, in the sensor FPC 73, the case facing area 73A has a first case facing area 73A1 which is the area to the left of the folding line in the upper right extension portion 752, a second case facing area 73A2 which is the area of the lower right extension portion 753, a third case facing area 73A3 which is the area of the upper right extension portion 756, and a fourth case facing area 73A4 which is the area of the upper left extension portion 757.
[0094] In the first case facing area 73A1, the front surface (the rear surface side of the main body portion 751) faces the case 20, in the second case facing area 73A2, the back surface side (the front surface side of the main body portion 751) faces the case 20, and in the third case facing area 73A3 and the fourth case facing area 73A4, the back surface side (the front surface side of the main body portion 751) faces the case 20.
[0095] 11 and 12 , printed wiring 732 including signal wiring 733 and ground wiring 734 is formed on the first wiring layer 73L1 and the second wiring layer 73L2. The printed wiring 732 is formed of a metal thin film of a conductive material. In this embodiment, the printed wiring 732 is formed of a copper thin film. In general, metals used as conductive materials, including copper, have higher thermal conductivity than resins and the like.
[0096] At least a portion of the ground wiring 734 formed in the first wiring layer 73L1 and the second wiring layer 73L2 is formed in a mesh shape. In this embodiment, the ground wiring 734 is formed in a diagonal lattice mesh shape. The mesh shape of the ground wiring 734 may be a hexagonal honeycomb mesh shape, a rectangular mesh shape, or a mesh shape with many circles cut out.
[0097] The signal wiring 733 formed on the first wiring layer 73L1 and the second wiring layer 73L2 constitutes the above-mentioned signal wiring 738 and signal wiring 739. The signal wiring 733 formed on the first wiring layer 73L1 and the second wiring layer 73L2 includes a first signal wiring 733a connecting the board connection portion 730 and the stick detection sensor 12, a second signal wiring 733b connecting the board connection portion 730 and the suction sensor 13, a third signal wiring 733c connecting the board connection portion 730 and the case temperature sensor 14, and a fourth signal wiring 733d connecting the board connection portion 730 and the heater temperature sensor connection portion 731.
[0098] The first signal wiring 733a runs from the substrate connection portion 730 through the upper right extension portion 752, the main body portion 751, and the upper extension portion 755, and then through the upper right extension portion 756 or the upper left extension portion 757 to connect to each of the two stick detection sensors 12.
[0099] The second signal wiring 733 b passes from the substrate connection portion 730 through the upper right extension portion 752 , the main body portion 751 , the upper extension portion 755 , and the upper left extension portion 757 to connect to the suction sensor 13 .
[0100] The third signal wiring 733 c runs from the board connection portion 730 through the upper right extension portion 752 , near the right end of the main body portion 751 , and the lower right extension portion 753 to connect to the case temperature sensor 14 .
[0101] The fourth signal wiring 733 d passes from the substrate connection portion 730 through the upper right extension portion 752 , near the right end of the main body portion 751 , and the lower extension portion 754 to connect to the heater temperature sensor connection portion 731 .
[0102] The first signal wiring 733a to the fourth signal wiring 733d are formed in the first wiring layer 73L1 and the second wiring layer 73L2, and the first signal wiring 733a to the fourth signal wiring 733d of the first wiring layer 73L1 and the first signal wiring 733a to the fourth signal wiring 733d of the second wiring layer 73L2 are connected through vias.
[0103] In the suction device 100, external noise such as static electricity enters from the outside of the case 20. Therefore, in the sensor FPC 73, external noise such as static electricity is likely to enter from a location close to the case 20.
[0104] In this embodiment, in the case facing region 73A of the sensor FPC 73, the wiring area of the signal wiring 733 formed on one of the first wiring layer 73L1 and the second wiring layer 73L2 that is closer to the case 20 is smaller than the wiring area of the signal wiring 733 formed on one of the layers farther from the case 20. Specifically, in the first case facing region 73A1, the wiring area of the signal wiring 733 formed on the second wiring layer 73L2 that is closer to the case 20 of the first wiring layer 73L1 and the second wiring layer 73L2 is smaller than the wiring area of the signal wiring 733 formed on the first wiring layer 73L1 that is farther from the case 20. In the second case facing region 73A2, the wiring area of the signal wiring 733 formed on the first wiring layer 73L1 that is closer to the case 20 of the first wiring layer 73L1 and the second wiring layer 73L2 is smaller than the wiring area of the signal wiring 733 formed on the second wiring layer 73L2 that is farther from the case 20. In the third case facing region 73A3 and the fourth case facing region 73A4, the wiring area of the signal wiring 733 formed on the first wiring layer 73L1, which is closer to the case 20, of the first wiring layer 73L1 and the second wiring layer 73L2, is smaller than the wiring area of the signal wiring 733 formed on the second wiring layer 73L2, which is farther from the case 20.
[0105] Therefore, even if external noise such as static electricity enters the suction device 100, the sensor FPC 73 can prevent the external noise such as static electricity from entering the signal wiring 733. This prevents external noise such as static electricity from flowing through the signal wiring 733 and prevents the sensors 12 to 14 mounted on the sensor FPC 73 from making false detections or breaking down due to the external noise, improving the durability of the suction device 100 and the power supply unit 110.
[0106] As described above, the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 are all mounted on the surface of the sensor FPC 73 that is farther from the case 20, that is, on the back surface of the sensor FPC 73 in this embodiment.
[0107] This makes it possible to prevent external noise such as static electricity from entering the sensors 12 to 14 in the sensor FPC 73, thereby preventing the sensors 12 to 14 from making false detections or breaking down.
[0108] More specifically, since it is possible to prevent external noise such as static electricity from entering the stick detection sensor 12 and causing the stick detection sensor 12 to make a false detection or malfunction, the detection accuracy of the stick detection sensor 12 is improved and it is possible to more accurately detect whether the stick-shaped substrate 150 is contained in the storage section 140.
[0109] Similarly, since external noise such as static electricity can be prevented from entering the suction sensor 13 and causing false detection or malfunction, the detection accuracy of the suction sensor 13 is improved, and the user's puffing action (suction action) can be detected more accurately.
[0110] Similarly, it is possible to prevent external noise such as static electricity from entering the case temperature sensor 14 and causing the case temperature sensor 14 to make false detections or malfunction, thereby improving the detection accuracy of the case temperature sensor 14 and enabling it to detect the temperature of the case 20 more accurately.
[0111] The MCU 1 mounted on the main board 50 controls the suction device 100 based on the detection results of these sensors 12 to 14.
[0112] Therefore, external noise such as static electricity can be prevented from entering the sensors 12 to 14, causing the sensors 12 to 14 to make false detections or malfunction, and the detection accuracy of the sensors 12 to 14 is improved, allowing the MCU 1 to control the suction device 100 with greater precision.
[0113] Furthermore, in the sensor FPC 73, a ground wiring 734 is formed on the layer of the first wiring layer 73L1 and the second wiring layer 73L2 that is closer to the case 20 in the area overlapping with the sensors 12 to 14. In this embodiment, the ground wiring 734 is formed on the first wiring layer 73L1 of the first wiring layer 73L1 and the second wiring layer 73L2 of the sensor FPC 73, which is closer to the case 20 in the area overlapping with the stick detection sensor 12. Similarly, in the sensor FPC 73, the ground wiring 734 is formed on the first wiring layer 73L1 of the first wiring layer 73L1 and the second wiring layer 73L2, which is closer to the case 20 in the area overlapping with the suction sensor 13. In the sensor FPC 73, the ground wiring 734 is formed on the first wiring layer 73L1 of the first wiring layer 73L1 and the second wiring layer 73L2, which is closer to the case 20 in the area overlapping with the case temperature sensor 14.
[0114] As a result, even if external noise such as static electricity enters the vicinity of the sensors 12 to 14 from outside the suction device 100, the external noise such as static electricity can be released to the ground wiring 734 formed on the layer closer to the case 20 in the area overlapping with the sensors 12 to 14, thereby further preventing external noise such as static electricity from entering the sensors 12 to 14 and causing false detection or failure of the sensors 12 to 14.
[0115] Furthermore, in the sensor FPC 73, of the first wiring layer 73L1 and the second wiring layer 73L2, the first wiring layer 73L1, which is the layer closer to the case 20 in the area overlapping with the suction sensor 13, does not have signal wiring formed in a predetermined area 73B1 that includes the area overlapping with the suction sensor 13. The predetermined area 73B1 is an area of the upper left extension portion 757 to the left of a bending line formed in a position that is approximately symmetrical to the right end of the upper right extension portion 756 with the upper extension portion 755 in between.
[0116] In the sensor FPC 73, of the first wiring layer 73L1 and the second wiring layer 73L2, the first wiring layer 73L1, which is the layer closer to the case 20 in the area overlapping with the case temperature sensor 14, does not have the signal wiring 733 formed in a predetermined area 73B2 that includes the area overlapping with the case temperature sensor 14. The predetermined area 73B2 is a lower right extension 753.
[0117] As a result, even if external noise such as static electricity enters the vicinity of the suction sensor 13 and the case temperature sensor 14 from outside the suction device 100, the external noise such as static electricity can be more reliably dissipated to the ground wiring 734 formed on the layer closer to the case 20 in the area overlapping with the suction sensor 13 and the case temperature sensor 14, and external noise such as static electricity can be more reliably prevented from entering the signal wiring 733 (second signal wiring 733b and third signal wiring 733c) connected to the suction sensor 13 and the case temperature sensor 14, thereby more reliably preventing external noise such as static electricity from entering the suction sensor 13 and the case temperature sensor 14 and causing false detection or failure of the suction sensor 13 and the case temperature sensor 14.
[0118] As shown in Figures 13 and 14, the sensor FPC 73 is bent so that the two stick detection sensors 12 are away from the case 20, and the upper extension portion 755, the upper right extension portion 756, and the upper left extension portion 757 surround the stick guide 31.
[0119] This allows the stick detection sensor 12 to be positioned farther away from the case 20, thereby further preventing external noise such as static electricity from entering the stick detection sensor 12 and causing the stick detection sensor 12 to make false detections or malfunction.
[0120] Although not shown, at least a part of the area of the case 20 facing the sensor FPC 73 may be covered with a metal or insulating film.
[0121] This makes it possible to prevent external noise such as static electricity from being transmitted from the case 20 to the sensor FPC 73 even if the external noise enters the case 20 .
[0122] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention.
[0123] For example, the positions of the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 on the sensor FPC 73 are not limited to those described above and can be changed as appropriate.
[0124] Furthermore, for example, the inhalation device 100A may further include a heating unit that heats the flavor source 131 in addition to the heating unit 121A.
[0125] This specification describes at least the following items. Note that the components in parentheses correspond to those in the above-described embodiment, but are not limited to these.
[0126] (1) A power supply unit (power supply unit 110) for an aerosol generating device (suction device 100, 100A, 100B) includes: a power supply (power supply units 111A-111C) capable of supplying power to heating units (heating units 121A-121C) that heat at least one of an aerosol source (stick-shaped substrate 150) and a flavor source (flavor source 131); a flexible printed wiring board (sensor FPC 73) on which one or more sensors (stick detection sensor 12, suction sensor 13, case temperature sensor 14) are mounted or electrically connected; and a case (case 20) that houses the power supply and the flexible printed wiring board, wherein a first wiring layer (first wiring layer 73L1) and a second wiring layer (second wiring layer 73L2) are laminated on the flexible printed wiring board, and a signal wiring (signal wiring 733) is formed on at least one of the first wiring layer and the second wiring layer, A power supply unit for an aerosol generation device, wherein in a case facing region (case facing region 73A) of the flexible printed wiring board facing the case, the wiring area of the signal wiring formed in the layer of the first wiring layer and the second wiring layer that is closer to the case is smaller than the wiring area of the signal wiring formed in the layer farther from the case.
[0127] According to (1), even if external noise such as static electricity enters the aerosol generation device, the flexible printed circuit board can prevent the external noise such as static electricity from entering the signal wiring. This prevents the external noise such as static electricity from flowing through the signal wiring and the sensor mounted on the flexible printed circuit board from making a false detection or breaking down due to the external noise, thereby improving the durability of the power supply unit of the aerosol generation device.
[0128] (2) The power supply unit of the aerosol generation device according to (1), wherein the sensor is mounted on a surface of the flexible printed wiring board that is farther from the case.
[0129] According to (2), the flexible printed wiring board can prevent external noise such as static electricity from entering the sensor, which can cause false detection or failure of the sensor.
[0130] (3) A power supply unit for the aerosol generating device described in (2), wherein a ground wiring (ground wiring 734) is formed on the layer of the first wiring layer and the second wiring layer of the flexible printed wiring board that is closer to the case in the area overlapping with the sensor.
[0131] According to (3), even if external noise such as static electricity enters the vicinity of the sensor from outside the aerosol generating device, the external noise such as static electricity can be dissipated to the ground wiring formed in the layer closer to the case in the area overlapping with the sensor, thereby further preventing external noise such as static electricity from entering the sensor and causing false detection or failure of the sensor.
[0132] (4) A power supply unit for an aerosol generating device described in (3), wherein, in the flexible printed wiring board, the signal wiring is not formed in the layer of the first wiring layer and the second wiring layer that is closer to the case in the area overlapping with the sensor within a predetermined area including the area overlapping with the sensor.
[0133] According to (4), even if external noise such as static electricity enters the vicinity of the sensor from outside the aerosol generating device, the external noise such as static electricity can be more reliably dissipated to the ground wiring formed in the layer closer to the case in the area overlapping with the sensor, and external noise such as static electricity can be more reliably prevented from entering the signal wiring connected to the sensor, thereby more reliably preventing external noise such as static electricity from entering the sensor and causing false detection or failure of the sensor.
[0134] (5) The power supply unit of the aerosol generating device according to any one of (1) to (4), wherein the sensor is a temperature sensor (case temperature sensor 14).
[0135] According to (5), external noise such as static electricity can be prevented from entering the temperature sensor, thereby improving the detection accuracy of the temperature sensor.
[0136] (6) The power supply unit of the aerosol generation device according to any one of (1) to (4), wherein the sensor is an optical sensor (stick detection sensor 12).
[0137] According to (6), external noise such as static electricity can be prevented from entering the optical sensor, thereby improving the detection accuracy of the optical sensor.
[0138] (7) The power supply unit of the aerosol generating device according to (6), wherein the flexible printed circuit board is bent in a direction in which the optical sensor moves away from the case.
[0139] According to (7), the optical sensor can be placed farther away from the case, which makes it possible to prevent external noise such as static electricity from entering the optical sensor and causing false detection or failure of the optical sensor.
[0140] (8) A power supply unit of the aerosol generating device according to any one of (1) to (7), further comprising a controller (MCU1) that controls the aerosol generating device, and the controller controls the aerosol generating device based on the detection result of the sensor.
[0141] According to (8), external noise such as static electricity can be prevented from entering the sensor, causing the sensor to make false detections or malfunction, improving the detection accuracy of the sensor, thereby allowing the controller to control the aerosol generating device more accurately.
[0142] (9) A power supply unit for an aerosol generating device according to any one of (1) to (8), wherein at least a portion of the area of the case facing the flexible printed wiring board is covered with a metal or insulating film.
[0143] According to (9), even if external noise such as static electricity enters the case, the external noise such as static electricity can be prevented from being transmitted from the case to the flexible printed wiring board.
[0144] (10) An aerosol generating device (suction device 100, 100A, 100B) comprising: a heating unit (heating units 121A to 121C) that heats at least one of an aerosol source (stick-shaped substrate 150) and a flavor source (flavor source 131); a power source (power source units 111A to 111C) that can supply power to the heating unit; a flexible printed wiring board (sensor FPC 73) on which one or more sensors (stick detection sensor 12, suction sensor 13, case temperature sensor 14) are mounted or electrically connected; and a case (case 20) that accommodates the heating unit, the power source, and the flexible printed wiring board, wherein a first wiring layer (first wiring layer 73L1) and a second wiring layer (second wiring layer 73L2) are laminated on the flexible printed wiring board, and a signal wiring (signal wiring 733) is formed on at least one of the first wiring layer and the second wiring layer, An aerosol generating device, wherein in a case facing region (case facing region 73A) of the flexible printed wiring board facing the case, the wiring area of the signal wiring formed in the layer of the first wiring layer and the second wiring layer that is closer to the case is smaller than the wiring area of the signal wiring formed in the layer farther from the case.
[0145] According to (10), even if external noise such as static electricity enters the aerosol generation device, the flexible printed wiring board can prevent the external noise such as static electricity from entering the signal wiring. This prevents the external noise such as static electricity from flowing through the signal wiring and the sensor mounted on the flexible printed wiring board from making a false detection or breaking down due to the external noise, thereby improving the durability of the aerosol generation device.
[0146] DESCRIPTION OF SYMBOLS 1 MCU (controller) 12 Stick detection sensor (sensor, optical sensor) 13 Suction sensor (sensor) 14 Case temperature sensor (sensor, temperature sensor) 20 Case 73 Sensor FPC (flexible printed circuit board) 73A Case facing area 73L1 First wiring layer 73L2 Second wiring layer 733 Signal wiring 734 Ground wiring 100, 100A, 100B Suction device (aerosol generating device) 110 Power supply unit 111A to 111C Power supply section (power supply) 121A to 121C Heating section 131 Flavor source 150 Stick-shaped substrate (aerosol source)
Claims
1. a power source capable of supplying power to a heating unit that heats at least one of the aerosol source and the flavor source; a flexible printed wiring board on which one or more sensors are mounted or electrically connected; a case that accommodates the power supply and the flexible printed wiring board; A power supply unit for an aerosol generating device, comprising: The flexible printed wiring board has a first wiring layer and a second wiring layer laminated thereon, signal wiring is formed in at least one of the first wiring layer and the second wiring layer; In a case facing region of the flexible printed wiring board facing the case, a wiring area of the signal wiring formed in one of the first wiring layer and the second wiring layer that is closer to the case is smaller than a wiring area of the signal wiring formed in the other of the first wiring layer and the second wiring layer that is farther from the case. Power supply unit for the aerosol generator.
2. A power supply unit for the aerosol generating device according to claim 1, the sensor is mounted on a surface of the flexible printed wiring board that is farther from the case; Power supply unit for the aerosol generator.
3. A power supply unit for the aerosol generating device according to claim 2, In the flexible printed wiring board, a ground wiring is formed on one of the first wiring layer and the second wiring layer that is closer to the case in an area overlapping with the sensor. Power supply unit for the aerosol generator.
4. A power supply unit for the aerosol generating device according to claim 3, In the flexible printed wiring board, the signal wiring is not formed in a predetermined area including the area overlapping with the sensor in the layer of the first wiring layer and the second wiring layer that is closer to the case in the area overlapping with the sensor. Power supply unit for the aerosol generator.
5. A power supply unit for the aerosol generating device according to any one of claims 1 to 4, the sensor is a temperature sensor; Power supply unit for the aerosol generator.
6. A power supply unit for the aerosol generating device according to any one of claims 1 to 4, the sensor is an optical sensor; Power supply unit for the aerosol generator.
7. A power supply unit for the aerosol generating device according to claim 6, The flexible printed wiring board is The optical sensor is bent away from the case. Power supply unit for the aerosol generator.
8. A power supply unit for the aerosol generating device according to any one of claims 1 to 4, a controller for controlling the aerosol generating device; The controller controls the aerosol generating device based on the detection result of the sensor. Power supply unit for the aerosol generator.
9. A power supply unit for the aerosol generating device according to any one of claims 1 to 4, At least a part of the area of the case facing the flexible printed wiring board is covered with a metal or insulating film. Power supply unit for the aerosol generator.
10. a heating unit that heats at least one of the aerosol source and the flavor source; a power source capable of supplying power to the heating unit; a flexible printed wiring board on which one or more sensors are mounted or electrically connected; a case that accommodates the heating unit, the power source, and the flexible printed wiring board; An aerosol generating device comprising: The flexible printed wiring board has a first wiring layer and a second wiring layer laminated thereon, signal wiring is formed in at least one of the first wiring layer and the second wiring layer; In a case facing region of the flexible printed wiring board facing the case, a wiring area of the signal wiring formed in one of the first wiring layer and the second wiring layer that is closer to the case is smaller than a wiring area of the signal wiring formed in the other of the first wiring layer and the second wiring layer that is farther from the case. Aerosol generator.