Plating Equipment

Abstract

A technique capable of reducing the effect of electric field shielding caused by a beam member of a paddle, or a technique capable of removing air bubbles adhering to holes in an ion resistor, is provided. The plating apparatus 1000 includes a paddle 70 disposed between an anode 11 and a substrate Wf and configured to stir the plating solution Ps by reciprocating in a first direction and a second direction parallel to the substrate, the paddle having a plurality of beam members 71 extending in a direction perpendicular to the reciprocating direction of the paddle, and the reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in a first reciprocating manner, and in the first reciprocating manner, the paddle moves in the second direction with a stroke that is different from the stroke when moving in the first direction, thereby making different the positions of the plurality of beam members when the paddle changes its direction of movement from the second direction to the first direction and the positions of the plurality of beam members when it changes its direction of movement from the first direction to the second direction.

Description

[Technical field]

[0001] The present invention relates to a plating apparatus. [Background technology]

[0002] Conventionally, plating devices capable of plating a substrate have been known (see, for example, Patent Document 1). Such plating devices include a plating tank that stores a plating solution, an anode that is disposed inside the plating solution, and a substrate that is disposed inside the plating solution so as to face the anode, and a paddle that is disposed between the anode and the substrate and is configured to stir the plating solution by reciprocating in a first direction parallel to the substrate and a second direction opposite to the first direction.

[0003] Conventionally, a paddle having a plurality of beam members extending in a direction perpendicular to the direction of reciprocating movement of the paddle is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2021-130848 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the conventional plating tank as described above, the stroke of the paddle is constant when the paddle moves back and forth. In this case, when the paddle changes its moving direction from the second direction to the first direction, or when the paddle changes its moving direction from the first direction to the second direction, the beam member of the paddle stops at the same position. In this case, the average residence time of the beam member of the paddle during plating processing becomes non-uniform, and the degree of shielding of the electric field between the anode and the substrate may differ depending on the position of the paddle. As a result, the plating quality of the substrate may deteriorate.

[0006] Alternatively, in the case of conventional plating devices, there is a risk that a large amount of air bubbles contained in the plating solution in the plating tank will adhere to the holes in the ion resistor disposed between the anode and the substrate. If a plating process is performed on the substrate in this state, the air bubbles may cause a deterioration in the plating quality of the substrate.

[0007] The present invention has been made in consideration of the above, and one of its objects is to provide a technology that can reduce the effect of electric field shielding by the beam member of the paddle, or a technology that can remove air bubbles adhering to the holes of an ion resistor. [Means for solving the problem]

[0008] (Aspect 1) In order to achieve the above-mentioned object, a plating apparatus according to one embodiment of the present invention comprises a plating tank for storing a plating solution, an anode disposed inside the plating solution, and a substrate disposed inside the plating solution so as to face the anode; and a paddle disposed between the anode and the substrate and configured to stir the plating solution by reciprocating in a first direction parallel to the substrate and a second direction opposite to the first direction, wherein the paddle has a plurality of beam members extending in a direction perpendicular to the reciprocating movement direction of the paddle, and the reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in a first reciprocating manner, and in the first reciprocating manner, the paddle moves in the second direction with a stroke that is different from the stroke when the paddle moves in the first direction, thereby making different positions of the plurality of beam members when the paddle changes its movement direction from the second direction to the first direction and positions of the plurality of beam members when the paddle changes its movement direction from the first direction to the second direction.

[0009] According to this embodiment, when the paddle changes its moving direction from the second direction to the first direction, or when the paddle changes its moving direction from the first direction to the second direction, the beam member of the paddle is not positioned at the same location. This reduces the effect of electric field shielding by the beam member of the paddle. As a result, the plating quality of the substrate can be improved.

[0010] (Aspect 2) In the above aspect 1, the reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in the first reciprocating manner multiple times followed by the paddle reciprocating in a second reciprocating manner, and in the first reciprocating manner, the stroke of the paddle when moving in the second direction is shorter than the stroke of the paddle when moving in the first direction, and in the second reciprocating manner, the paddle moves in the second direction with a stroke longer than the stroke of the paddle when moving in the first direction, thereby making the positions of the multiple beam members different when the paddle changes its direction of movement from the second direction to the first direction and the positions of the multiple beam members different when the paddle changes its direction of movement from the first direction to the second direction.

[0011] (Aspect 3) In the above aspect 1, the reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in the first reciprocating manner multiple times followed by the paddle reciprocating in a second reciprocating manner, and in the first reciprocating manner, the stroke of the paddle when moving in the second direction is longer than the stroke of the paddle when moving in the first direction, and in the second reciprocating manner, the paddle moves in the second direction with a stroke shorter than the stroke of the paddle when moving in the first direction, thereby making the positions of the multiple beam members different when the paddle changes its direction of movement from the second direction to the first direction and the positions of the multiple beam members different when the paddle changes its direction of movement from the first direction to the second direction.

[0012] (Aspect 4) In any one of the above-mentioned aspects 1 to 3, the substrate may be disposed above the anode, and an ion resistor having a plurality of holes may be disposed inside the plating solution above the anode and below the paddle.

[0013] (Aspect 5) In the above-mentioned aspect 4, the reciprocating movement of the paddle in the first direction and the second direction may include the paddle moving in the first direction multiple times at different speeds, or the paddle moving in the second direction multiple times at different speeds.

[0014] According to this aspect, it is possible to effectively remove air bubbles adhering to the holes in the ion resistor, thereby improving the plating quality of the substrate.

[0015] (Aspect 6) In the above-mentioned aspect 4, the reciprocating movement of the paddle in the first direction and the second direction may include the paddle moving in the first direction at a first speed and then moving in the second direction at a second speed different from the first speed.

[0016] According to this aspect, it is possible to effectively remove air bubbles adhering to the holes in the ion resistor, thereby improving the plating quality of the substrate.

[0017] (Aspect 7) In order to achieve the above-mentioned object, a plating apparatus according to one embodiment of the present invention includes a plating tank for storing a plating solution, an anode disposed inside the plating solution, and a substrate disposed inside the plating solution facing the anode; and a paddle disposed between the anode and the substrate and configured to stir the plating solution by reciprocating in a first direction parallel to the substrate and a second direction opposite to the first direction, wherein the substrate is disposed above the anode, and an ion resistor having a plurality of holes is disposed inside the plating solution above the anode and below the paddle, and the reciprocating movement of the paddle in the first direction and the second direction includes the paddle moving in the first direction at a first speed and then moving in the second direction at a second speed different from the first speed.

[0018] According to this aspect, it is possible to effectively remove air bubbles adhering to the holes in the ion resistor, thereby improving the plating quality of the substrate. [Brief description of the drawings]

[0019] [Figure 1] 1 is a perspective view showing an overall configuration of a plating apparatus according to an embodiment; [Diagram 2] 1 is a plan view showing an overall configuration of a plating apparatus according to an embodiment; [Diagram 3] FIG. 2 is a schematic diagram showing a configuration of a plating module in the plating apparatus according to the embodiment. [Figure 4] FIG. 2 is a schematic diagram showing a state in which a substrate according to an embodiment is immersed in a plating solution. [Diagram 5] FIG. 2 is a schematic plan view of a paddle according to an embodiment. [Figure 6] FIG. 4 is a flow chart for explaining a series of operations from supply of plating solution to start of plating process according to an embodiment. [Figure 7] FIG. 11 is an example of a flow diagram for explaining details of an operation of a paddle according to an embodiment. [Figure 8]8(A) and 8(B) are schematic views for explaining a plating apparatus according to a first modified example of the embodiment. [Figure 9] 9(A) and 9(B) are schematic diagrams for explaining a plating apparatus according to a second modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The drawings are shown in a schematic manner to facilitate understanding of the characteristics of the components, and the dimensional ratios of the components are not necessarily the same as those in reality. In addition, some drawings show XYZ orthogonal coordinates for reference. In these orthogonal coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0021] Fig. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 of this embodiment. Fig. 2 is a plan view (top view) showing the overall configuration of the plating apparatus 1000 of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0022] The load port 100 is a module for loading a substrate accommodated in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and for unloading a substrate from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged in a horizontal line, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to transfer a substrate between the load port 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring a substrate between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrate via a temporary placement table (not shown).

[0023] The aligner 120 is a module for aligning the position of an orientation flat, a notch, etc. of a substrate to a predetermined direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 wets the surface to be plated of the substrate before plating with a treatment liquid such as pure water or degassed water, thereby replacing air inside a pattern formed on the substrate surface with the treatment liquid. The pre-wet module 200 is configured to perform a pre-wet process that makes it easier to supply plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with a plating liquid during plating. In this embodiment, two pre-wet modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wet modules 200 are arbitrary.

[0024] The presoak module 300 is configured to perform a presoak process in which an oxide film with high electrical resistance present on the surface of a seed layer formed on the plated surface of a substrate before plating is etched away with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are arbitrary. The plating module 400 performs plating on the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged in a vertical arrangement of three modules and a horizontal arrangement of four modules, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0025] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers 600 are arranged vertically, but the number and arrangement of the spin rinse dryers 600 are arbitrary. The transport device 700 is a device for transporting the substrate between multiple modules in the plating apparatus 1000. The control module 800 is configured to control multiple modules of the plating apparatus 1000, and can be configured from, for example, a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0026] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is carried into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette of the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, etc. of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0027] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0028] The transfer device 700 transfers the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0029] It should be noted that the configuration of the plating apparatus 1000 described in FIG. 1 and FIG. 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configuration in FIG.

[0030] Next, a description will be given of the plating module 400. Since the plating modules 400 included in the plating apparatus 1000 according to this embodiment have the same configuration, one plating module 400 will be described.

[0031] Fig. 3 is a schematic diagram showing the configuration of a plating module 400 in the plating apparatus 1000 according to this embodiment. Specifically, Fig. 3 shows the plating module 400 in a state before the substrate Wf is immersed in the plating solution Ps. Fig. 4 is a schematic diagram showing the state in which the substrate Wf is immersed in the plating solution Ps.

[0032] 3 and 4 is a cup-type plating apparatus, for example. However, the plating apparatus 1000 is not limited to this configuration, and may be, for example, a plating apparatus in which the substrate Wf is immersed in the plating solution Ps with the surface direction of the substrate Wf facing up and down (i.e., a vertical plating apparatus).

[0033] 3 and 4 includes a plating module 400 of a plating apparatus 1000, which includes a plating tank 10, an overflow tank 20, a substrate holder 30, and a paddle 70. The plating module 400 may also include a rotation mechanism 40, a tilt mechanism 45, and a lifting mechanism 50, as shown in FIG.

[0034] The plating tank 10 according to this embodiment is configured as a bottomed container having an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer peripheral edge of the bottom wall 10a, and the upper part of the outer peripheral wall 10b is open. The shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall 10b according to this embodiment has a cylindrical shape as an example. A plating solution Ps is stored inside the plating tank 10.

[0035] The plating solution Ps may be any solution containing ions of metal elements that constitute the plating film, and the specific example is not particularly limited. In this embodiment, a copper plating process is used as an example of a plating process, and a copper sulfate solution is used as an example of the plating solution Ps. The plating solution Ps may also contain a predetermined additive.

[0036] An anode 11 is disposed inside the plating solution Ps in the plating tank 10. At least during plating of the substrate Wf, the substrate Wf is also disposed inside the plating solution Ps in the plating tank 10 so as to face the anode 11. The specific type of the anode 11 is not particularly limited, and may be an insoluble anode or a soluble anode. In the present embodiment, an insoluble anode is used as an example of the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like may be used.

[0037] An ionic resistor 12 may be disposed in the plating solution Ps of the plating tank 10 above the anode 11 and below the substrate Wf (specifically, further below the paddle 70 in this embodiment). Specifically, as illustrated in FIG. 4 (an enlarged view of part B1), the ionic resistor 12 is formed of a porous plate member having a plurality of holes 12a (pores). The holes 12a are provided so as to communicate the lower surface and the upper surface of the ionic resistor 12.

[0038] As shown in Fig. 3, the region in the ion resistor 12 where the multiple holes 12a are formed is referred to as the "hole formation area PA". The hole formation area PA according to this embodiment has a circular shape in a plan view. The area of ​​the hole formation area PA according to this embodiment is the same as or larger than the area of ​​the plated surface Wfa of the substrate Wf. However, this is not limited to the configuration, and the area of ​​the hole formation area PA may be smaller than the area of ​​the plated surface Wfa of the substrate Wf.

[0039] The ionic resistor 12 is provided to homogenize the electric field formed between the anode 11 and the substrate Wf. By disposing the ionic resistor 12 in the plating tank 10 as in this embodiment, it is possible to easily homogenize the thickness of the plating film (plating layer) formed on the substrate Wf.

[0040] As illustrated in Fig. 3 and Fig. 4, a membrane 16 may be disposed in the plating tank 10 at a position above the anode 11 and below the ionic resistor 12. In this case, the inside of the plating tank 10 is divided by the membrane 16 into an anode chamber 17a below the membrane 16 and a cathode chamber 17b above the membrane 16. The anode 11 is disposed in the anode chamber 17a, and the ionic resistor 12 and the substrate Wf are disposed in the cathode chamber 17b. The membrane 16 is configured to allow ionic species including metal ions contained in the plating solution Ps to pass through the membrane 16, while suppressing non-ionic plating additives contained in the plating solution Ps from passing through the membrane 16. For example, an ion exchange membrane can be used as such a membrane 16.

[0041] The plating tank 10 is provided with a supply port for supplying the plating solution Ps to the plating tank 10. Specifically, the outer peripheral wall 10b of the plating tank 10 according to this embodiment is provided with a first supply port 13a for supplying the plating solution Ps to the anode chamber 17a and a second supply port 13b for supplying the plating solution Ps to the cathode chamber 17b.

[0042] The plating tank 10 is also provided with a first outlet 14a for discharging the plating solution Ps in the anode chamber 17a to the outside of the plating tank 10. The plating solution Ps discharged from the first outlet 14a is pumped by a pump (not shown) and is again supplied to the anode chamber 17a from the first supply port 13a.

[0043] The overflow tank 20 is composed of a bottomed container disposed outside the plating tank 10. The overflow tank 20 is provided to temporarily store the plating solution Ps that has exceeded the upper end of the outer peripheral wall 10b of the plating tank 10 (i.e., the plating solution Ps that has overflowed from the plating tank 10). The plating solution Ps stored in the overflow tank 20 is discharged from the second discharge port 14b, and then pressure-fed by a pump (not shown) and supplied again to the cathode chamber 17b from the second supply port 13b.

[0044] The substrate holder 30 holds the substrate Wf as a cathode such that a surface Wfa to be plated of the substrate Wf faces the anode 11. In this embodiment, the surface Wfa to be plated of the substrate Wf is specifically provided on a surface (lower surface) facing downward of the substrate Wf.

[0045] 3, the substrate holder 30 may have a ring 31 provided so as to protrude downward from the outer circumferential edge of the plating surface Wfa of the substrate Wf. Specifically, the ring 31 according to this embodiment has a ring shape when viewed from below.

[0046] The substrate holder 30 is connected to the rotation mechanism 40. The rotation mechanism 40 is a mechanism for rotating the substrate holder 30. "R1" illustrated in FIG. 3 is an example of a rotation direction of the substrate holder 30. A known rotation motor or the like can be used as the rotation mechanism 40. The tilt mechanism 45 is a mechanism for tilting the rotation mechanism 40 and the substrate holder 30. The lifting mechanism 50 is supported by a support shaft 51 extending in the vertical direction. The lifting mechanism 50 is a mechanism for raising and lowering the substrate holder 30, the rotation mechanism 40, and the tilt mechanism 45 in the vertical direction. A known lifting mechanism such as a linear actuator can be used as the lifting mechanism 50.

[0047] The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, etc. The control module 800 controls the operation of the plating module 400 by the processor 801 operating based on commands of a program stored in the storage device 802.

[0048] Fig. 5 is a schematic plan view of the paddle 70. With reference to Figs. 3, 4 and 5, the paddle 70 is disposed between the anode 11 and the substrate Wf inside the plating tank 10. Specifically, the paddle 70 according to this embodiment is disposed between the ion resistor 12, which is disposed above the anode 11, and the substrate Wf.

[0049] 5, the paddle 70 is driven by a driving device 77. The operation of the driving device 77 is controlled by a control module 800. When the paddle 70 is driven, the plating solution Ps in the plating tank 10 is agitated.

[0050] The driving device 77 according to the present embodiment, upon receiving an instruction from the control module 800, alternately moves the paddle 70 in a "first direction (in the present embodiment, as an example, the X direction)" parallel to the substrate Wf (or the anode 11) and a "second direction (in the present embodiment, as an example, the -X direction)" opposite to the first direction. That is, the paddle 70 according to the present embodiment reciprocates in the first direction and the second direction.

[0051] Further, the driving device 77 according to the present embodiment is configured to be able to change the stroke when moving the paddle 70 in the first direction and the stroke when moving the paddle 70 in the second direction. The mechanical structure of such a driving device 77 is not particularly limited, and a known driving device (for example, JP 2019-151874 A, etc.) can be used. As a specific example, the driving device 77 according to the present embodiment is configured to include a linear motor 77a connected to the paddle 70 and to reciprocate the paddle 70 by the linear motor 77a (that is, the driving device 77 according to the present embodiment is, as an example, a linear motor type driving device).

[0052] As an example, the paddle 70 according to this embodiment moves in the first direction and the second direction at a constant speed (mm / sec or rpm). As an example, the speed at which the paddle 70 according to this embodiment moves in the first direction is the same as the speed at which it moves in the second direction. When the speed of the paddle 70 during reciprocating movement is expressed in rpm, for example, the speed of the paddle 70 being N (rpm) means that the paddle 70 makes one reciprocating movement N times per minute.

[0053] As illustrated in FIG. 5, the paddle 70 according to this embodiment has a plurality of beam members 71 extending in a direction (the direction of the Y-axis) perpendicular to the first direction (and the second direction). A gap is provided between adjacent beam members 71. One end of each of the beam members 71 is connected to a first connecting member 72a, and the other end is connected to a second connecting member 72b. When the paddle 70 is driven, the paddle 70, specifically the beam members 71, stirs the plating solution Ps. That is, the beam members 71 function as an "agitation part."

[0054] The paddle width (the length of the paddle 70 in the X direction in FIG. 5), which is the length of the paddle 70 in the reciprocating movement direction according to this embodiment, is smaller than the "substrate width D1 (the symbol is exemplified in FIG. 3)" which is the maximum distance between the outer edge in the first direction and the outer edge in the second direction of the plating surface Wfa of the substrate Wf, but is not limited to this configuration. The paddle width of the paddle 70 may be the same as the substrate width D1 or larger than the substrate width D1.

[0055] In addition, the paddle width of the paddle 70 in this embodiment is set to a size such that the paddle 70 does not collide with the inner surface of the outer wall 10b of the plating tank 10 when the paddle 70 moves back and forth in the first reciprocating mode or the second reciprocating mode described below.

[0056] The paddle 70 is preferably configured so that, in a plan view, a movement area MA of the paddle 70 (i.e., a range in which the paddle 70 moves back and forth) when stirring the plating solution Ps covers the entire surface of the hole formation area PA of the ionic resistor 12. With this configuration, the plating solution Ps above the hole formation area PA of the ionic resistor 12 can be effectively stirred by the paddle 70.

[0057] The paddle 70 only needs to be disposed inside the plating tank 10 at least when the plating solution Ps is being stirred, and does not need to be disposed inside the plating tank 10 at all times. For example, when the driving of the paddle 70 is stopped and the plating solution Ps is not being stirred by the paddle 70, the paddle 70 may be configured to be disposed outside the plating tank 10.

[0058] 6 is a flow diagram for explaining a series of operations from supply of plating solution to start of plating process according to this embodiment. First, plating solution Ps is supplied to plating tank 10 (step S10). Specifically, plating solution Ps is supplied to plating tank 10 so that anode 11 and ion resistor 12 are immersed in plating solution Ps. More specifically, in this embodiment, plating solution Ps is supplied to plating tank 10 from first supply port 13a and second supply port 13b.

[0059] Next, the substrate Wf is immersed in the plating solution Ps (step S20). Specifically, in this embodiment, the lifting mechanism 50 lowers the substrate holder 30, thereby immersing at least the plating surface Wfa of the substrate Wf in the plating solution Ps.

[0060] Next, the driving device 77 starts driving the paddle 70, thereby causing the paddle 70 to start stirring the plating solution Ps (step S30).

[0061] The homogeneity of the plating solution Ps can be improved by stirring the plating solution Ps with the paddle 70. Furthermore, the following effects can be achieved by stirring the plating solution Ps with the paddle 70.

[0062] Specifically, air bubbles Bu may be generated in the plating solution Ps in the plating tank 10. For example, when the plating solution Ps is supplied to the plating tank 10, if air flows into the plating tank 10 together with the plating solution Ps, the air may become air bubbles Bu.

[0063] As described above, when air bubbles Bu are generated in the plating solution Ps in the plating tank 10, the air bubbles Bu may adhere to the holes 12a of the ion resistor 12 (see FIG. 4). If the plating solution Ps is not stirred by the paddle 70, a large amount of the air bubbles Bu may adhere to the holes 12a. If a plating process is performed on the substrate Wf in this state, the plating quality of the substrate Wf may deteriorate due to the air bubbles Bu.

[0064] In contrast, according to the present embodiment, the paddle 70 agitates the plating solution Ps, thereby promoting the upward movement of the bubbles Bu adhering to the holes 12a of the ion resistor 12. This allows the bubbles Bu adhering to the holes 12a to be sucked upward and removed from the holes 12a. As a result, it is possible to prevent the plating quality of the substrate Wf from deteriorating due to the bubbles Bu adhering to the holes 12a.

[0065] 6, after step S30, a current is applied between the anode 11 and the substrate Wf by a current applying device (not shown), thereby starting the plating process on the substrate Wf (step S40). This starts the formation of a plating film on the surface Wfa of the substrate Wf to be plated. Specifically, in this embodiment, the plating solution Ps is being stirred by the paddle 70 in step S30 even during the plating process on the substrate Wf in step S40 (i.e., the plating solution Ps is being stirred while the plating film is being formed on the surface Wfa to be plated).

[0066] The time when the paddle 70 stirs the plating solution Ps is not limited to the above-mentioned time. For example, the plating solution Ps may be stirred by the paddle 70 even between steps S10 and S20 (i.e., after the plating solution Ps is supplied to the plating tank 10 and before the substrate Wf is immersed in the plating solution Ps).

[0067] Fig. 7 is an example of a flow diagram for explaining details of the operation of the paddle 70. Specifically, Fig. 7 shows details of the operation of the paddle 70 in step S30 of Fig. 6. The details of the operation of the paddle 70 will be explained below with reference mainly to Figs. 5 and 7.

[0068] 5, the arrangement pitch of each beam member 71 in the first direction is "d (mm)", the width of each beam member 71 in the first direction is "W (mm)", and the number of reciprocating movements of the paddle 70 is "n (times)". Note that the number of reciprocating movements is counted as "1 time" when the paddle 70 moves in the second direction after moving in the first direction, for example.

[0069] 7, first, the paddle 70 is driven by the driving device 77 in response to an instruction from the control module 800 to reciprocate in a "first reciprocating mode" which will be described below (step S31).

[0070] In this first reciprocating mode, the paddle 70 moves in the second direction with a stroke different from the stroke when moving in the first direction, thereby making different the position of the beam member 71 when the paddle 70 changes its moving direction from the second direction to the first direction (i.e., the start position (i.e., the "start point") where the paddle 70 starts moving once when it makes a reciprocating movement) and the position of the beam member 71 when the paddle 70 changes its moving direction from the first direction to the second direction (i.e., the turning point (i.e., the "end point") where the paddle 70 turns around when it makes a reciprocating movement). This makes it possible to equalize the average residence time of the beam member 71 during the plating process.

[0071] As an example, in this embodiment, in this first reciprocating mode, the stroke of the paddle 70 when moving in the second direction is shorter than the stroke of the paddle 70 when moving in the first direction. Specifically, as an example of this first reciprocating mode, the paddle 70 according to this embodiment moves in the first direction with a stroke of "A (mm)" and then moves in the second direction with a stroke of "AW (mm)" one or more times.

[0072] That is, in the first reciprocating mode, the paddle 70 moves "A (mm)" in the first direction, and then moves "AW (mm)" in the second direction. Thus, in the first reciprocating mode, the distance the paddle 70 moves in the second direction is shorter by "W (mm)" than the distance the paddle 70 moves in the first direction. As a result, in the first reciprocating mode, the position where the paddle 70 starts its reciprocating movement shifts in the first direction by "W (mm)" for each reciprocating movement.

[0073] However, step S31 is not limited to the above configuration. For example, in step S31, the stroke in the second direction may be a value shorter than "A (mm)" and larger than "AW (mm)".

[0074] Next, the control module 800 determines whether the paddle 70 has reciprocated multiple times (step S32). As an example, the control module 800 according to the present embodiment determines whether the relationship "W×n>d" is satisfied. That is, in step S32, the control module 800 determines whether the value obtained by multiplying the width (W) of the beam member 71 by the number of reciprocating movements (n) of the paddle 70 is greater than the arrangement pitch (d) of the beam member 71.

[0075] Typically, the reciprocating movement of the paddle 70 in the first reciprocating mode in step S31 is executed until the determination in step S32 is Yes.

[0076] If the answer to step S32 is Yes (i.e., if the relationship "W×n>d" is satisfied), the paddle 70 is driven by the driving device 77 instructed by the control module 800 to reciprocate in a "second reciprocating mode" described below (step S33). That is, the paddle 70 according to this embodiment reciprocates in the second reciprocating mode after reciprocating multiple times in the first reciprocating mode.

[0077] In this second reciprocating mode, the paddle 70 moves in the second direction with a longer stroke than the stroke when moving in the first direction, thereby making different the position (start point) of the beam member 71 when the paddle 70 changes the moving direction from the second direction to the first direction and the position (end point) of the beam member 71 when the paddle 70 changes the moving direction from the first direction to the second direction. This makes the average residence time of the beam member 71 during the plating process uniform.

[0078] Specifically, as an example of this second reciprocating pattern, the paddle 70 of this embodiment moves in the first direction with a stroke of "AW (mm)" and then moves in the second direction with a stroke of "A (mm)" one or more times.

[0079] That is, in the second reciprocating mode, the paddle 70 moves "AW (mm)" in the first direction, and then moves "A (mm)" in the second direction. That is, in the second reciprocating mode, the distance the paddle 70 moves in the first direction is shorter by "W (mm)" than the distance the paddle 70 moves in the second direction. As a result, in the second reciprocating mode, the position where the paddle 70 starts its reciprocating movement shifts in the second direction by "W (mm)" for each reciprocating movement.

[0080] However, step S33 is not limited to the above configuration. For example, in step S33, the stroke in the first direction may be a value shorter than "A (mm)" and larger than "AW (mm)".

[0081] The timing for ending the reciprocating movement of the paddle 70 in the second reciprocating mode is not particularly limited, but as an example, the control module 800 of this embodiment ends the reciprocating movement of the paddle 70 in the second reciprocating mode when the number of reciprocating movements of the paddle 70 since the start of the reciprocating movement of the paddle 70 in the second reciprocating mode reaches "n (times) (which is the same value as n in step S32)".

[0082] When the reciprocating movement of the paddle 70 in the second reciprocating mode is completed, the control module 800 may execute the flowchart of Fig. 7 again from step S31 (i.e., may repeatedly execute the flowchart of Fig. 7). Furthermore, when the control module 800 receives a drive stop request to forcibly stop the drive of the paddle 70 at any time in the flowchart of Fig. 7, the control module 800 may forcibly end the execution of the flowchart of Fig. 7 and stop the drive of the paddle 70.

[0083] According to the present embodiment as described above, since the mode of reciprocating movement of the paddle 70 includes the first reciprocating mode, when the paddle 70 changes its moving direction from the first direction to the second direction or from the second direction to the first direction (i.e., when the speed of the paddle 70 during reciprocating movement becomes zero), the beam member 71 of the paddle 70 can be prevented from being positioned at the same location. This can reduce the effect of electric field shielding by the beam member 71 of the paddle 70. As a result, the plating quality of the substrate Wf can be improved. Specifically, for example, the uniformity of the film thickness of the plating film formed on the substrate Wf can be improved.

[0084] Furthermore, according to the present embodiment, the reciprocating movement of the paddle 70 further includes the second reciprocating movement, so that it is possible to further reduce the effect of electric field shielding by the beam member 71 of the paddle 70. As a result, it is possible to further improve the plating quality of the substrate Wf.

[0085] The configuration of this embodiment is not limited to the above configuration, and for example, in the second reciprocating mode, the stroke of the paddle 70 during reciprocating movement may be constant. Specifically, in this case, in the second reciprocating mode, the paddle 70 may move in the first direction and the second direction with a stroke of A (mm). Even in this case, as long as the reciprocating movement of the paddle 70 includes the above-mentioned first reciprocating mode, it is possible to reduce the effect of electric field shielding by the beam member 71 of the paddle 70.

[0086] Also, in the first reciprocating mode, the stroke of the paddle 70 when it moves in the second direction may be longer than the stroke when it moves in the first direction. For example, in this case, in the first reciprocating mode, the paddle 70 may move in the first direction with a stroke of "AW (mm)", and then move in the second direction with a stroke of "A (mm)". And in this case, in the second reciprocating mode, it is preferable that the stroke of the paddle 70 when it moves in the second direction is shorter than the stroke when it moves in the first direction. For example, in this case, in the second reciprocating mode, the paddle 70 may move in the first direction with a stroke of "A (mm)", and then move in the second direction with a stroke of "AW (mm)".

[0087] (Variation 1) 8(A) and 8(B) are schematic diagrams for explaining a plating apparatus 1000 according to a first modified example of the embodiment. Specifically, Fig. 8(A) and Fig. 8(B) are schematic enlarged cross-sectional views of the peripheral configuration of an ion resistor 12 of the plating apparatus 1000 according to this modified example. Note that Fig. 8(A) and Fig. 8(B) illustrate a single beam member 71 of the paddle 70.

[0088] This modified example differs from the previously described embodiment in that in at least one of the first and second reciprocating modes, the paddle 70 moves at different speeds when the paddle 70 moves multiple times in the first direction or when the paddle 70 moves multiple times in the second direction.

[0089] As a specific example of this, in this modified example, in "both" the first reciprocating mode and the second reciprocating mode, when the paddle 70 moves multiple times in the first direction or when the paddle 70 moves multiple times in the second direction, the paddle 70 moves at different speeds.

[0090] As an example, Figures 8(A) and 8(B) illustrate the manner in which the paddle 70 moves at different speeds when it moves multiple times in the "first direction". Specifically, as illustrated in Figure 8(A), the first reciprocating mode and the second reciprocating mode according to this modification include the paddle 70 moving in the first direction at a "first speed V1 (mm / sec or rpm)" and, as illustrated in Figure 8(B), the paddle 70 moving in the first direction at a "second speed V2 (mm / sec or rpm)" that is faster than the first speed V1.

[0091] Specifically, when the drive device 77 receives instructions from the control module 800 in this modified example, in the first reciprocating mode and the second reciprocating mode, it moves the paddle 70 in a first direction multiple times, and in some of the multiple movements in the first direction, moves the paddle 70 at a first speed V1 and in the remaining movements, moves the paddle 70 at a second speed V2.

[0092] In the above case, when driving the paddle 70 in the second direction, the driving device 77 may move the paddle 70 at one speed (i.e., a constant speed) selected from, for example, the first speed V1 and the second speed V2.

[0093] Alternatively, this modified example may be configured such that the paddle 70 moves multiple times at different speeds in the “second direction.” Specifically, in this case, at least one of the first reciprocating mode and the second reciprocating mode includes the paddle 70 moving in the second direction at a first speed V1 and the paddle 70 moving in the second direction at a second speed V2.

[0094] According to this modification, the paddle 70 moves multiple times in the first direction at different speeds, or moves multiple times in the second direction at different speeds, thereby effectively removing the bubbles Bu attached to the holes 12a of the ion resistor 12. This makes it possible to prevent the plating quality of the substrate Wf from deteriorating due to the bubbles Bu attached to the holes 12a of the ion resistor 12 (i.e., to improve the plating quality of the substrate Wf).

[0095] Specifically, according to this modified example, as illustrated in FIG. 8(A), when the paddle 70 moves at a relatively slow speed, the relatively large bubbles Bu adhering to the holes 12a of the ionic resistor 12 can be sucked upward and effectively removed from the holes 12a.

[0096] On the other hand, as illustrated in FIG. 8(B), when the paddle 70 moves at a relatively high speed, it can suck up relatively small bubbles Bu adhering to the holes 12a of the ionic resistor 12 (i.e., bubbles Bu of a size that would not be sucked up when the paddle 70 moves at a low speed) and effectively remove them from the holes 12a.

[0097] Specifically, in this case, by moving the paddle 70 at the second speed V2, a vortex flow Sw of the plating solution Ps can be effectively formed between the beam member 71 of the paddle 70 and the upper surface of the ionic resistor 12. Even if the size of the air bubbles Bu adhering to the holes 12a is small, the air bubbles Bu can be effectively sucked up and removed from the holes 12a by the vortex flow Sw. In this manner, according to this modification, air bubbles Bu of different sizes adhering to the holes 12a of the ionic resistor 12 can be effectively removed.

[0098] The specific value of the first velocity V1 is not particularly limited, but may be, for example, a velocity that can remove bubbles Bu whose size (maximum outer dimension) is equal to or larger than a reference value from the holes 12a of the ion resistor 12. A suitable value for this first velocity V1 may be determined, for example, by experiment. The specific value of the second velocity V2 is not particularly limited, but may be, for example, a velocity that can remove bubbles Bu whose size is smaller than a reference value from the holes 12a. A suitable value for this second velocity V2 may also be determined, for example, by experiment.

[0099] As an example of a suitable ratio between the first speed V1 and the second speed V2, the second speed V2 can be set to about 1.5 times or more the first speed V1.

[0100] (Variation 2) 9(A) and 9(B) are schematic diagrams for explaining a plating apparatus 1000 according to Modification 2 of the embodiment. Specifically, Fig. 9(A) and Fig. 9(B) are schematic enlarged cross-sectional views of the peripheral configuration of an ion resistor 12 of the plating apparatus 1000 according to this modification. Note that Fig. 9(A) and Fig. 9(B) illustrate a single beam member 71 of the paddle 70.

[0101] This modified example differs from the previously described embodiment and modified example 1 in that in at least one of the first reciprocating mode and the second reciprocating mode, the paddle 70 moves in a first direction at a "first speed V1" (see Figure 9(A)), and then moves in a second direction at a "second speed V2" different from the first speed (see Figure 9(B)).

[0102] That is, upon receiving instructions from the control module 800 in this modified example, the drive device 77 repeats multiple times the process of moving the paddle 70 in a first direction at a first speed V1 and then in a second direction at a second speed V2 in at least one of the first and second reciprocating modes.

[0103] In this modified example, the second speed V2 is, for example, faster than the first speed V1. However, the present invention is not limited to this configuration, and the second speed V2 may be slower than the first speed V1.

[0104] According to this modification, the paddle 70 can move at a first speed V1 and a second speed V2 when the paddle 70 makes one reciprocating motion. This makes it possible to effectively remove the bubbles Bu adhering to the holes 12a of the ion resistor 12. As a result, it is possible to improve the plating quality of the substrate Wf.

[0105] Specifically, when the paddle 70 moves at a relatively slow speed during one reciprocating motion (FIG. 9(A)), the relatively large bubbles Bu adhering to the holes 12a of the ionic resistor 12 can be sucked upward and effectively removed from the holes 12a. On the other hand, when the paddle 70 moves at a relatively high speed (FIG. 9(B)), the relatively small bubbles Bu adhering to the holes 12a of the ionic resistor 12 can be sucked upward and effectively removed from the holes 12a.

[0106] (Other variations) In the above-described modified example 1 and modified example 2, the stroke of the paddle 70 when it reciprocates may be constant. That is, in this case, the paddle 70 may move by A (mm) in each of the first and second directions when it reciprocates. With this configuration, it is difficult to achieve the action and effect specific to the above-described embodiment, but it is possible to achieve the action and effect specific to modified example 1 and modified example 2 (the action and effect of removing the air bubbles Bu attached to the holes 12a of the ion resistor 12 and improving the plating quality of the substrate Wf).

[0107] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various further modifications and alterations are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0108] 10 Plating tank 11 Anode 12 Ion resistor 12a hole 30 Substrate holder 70 Paddle 71 Beam member 77 Drive Unit 1000 Plating Equipment Wf substrate Ps plating solution Bu bubbles V1 1st speed V2 2nd speed

Claims

1. a plating tank that stores a plating solution, an anode is disposed inside the plating solution, and a substrate is disposed inside the plating solution so as to face the anode; a paddle disposed between the anode and the substrate and configured to agitate the plating solution by reciprocating in a first direction parallel to the substrate and in a second direction opposite to the first direction; The paddle has a plurality of beam members extending in a direction perpendicular to a reciprocating direction of the paddle, The reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in a first reciprocating manner, In the first reciprocating mode, the paddle moves in the second direction with a stroke that differs by a predetermined constant value from the stroke when moving in the first direction, thereby making different positions of the multiple beam members when the paddle changes its movement direction from the second direction to the first direction and different positions of the multiple beam members when the paddle changes its movement direction from the first direction to the second direction.

2. The reciprocating movement of the paddle in the first direction and the second direction includes the paddle reciprocating in the first reciprocating manner a plurality of times and then reciprocating in a second reciprocating manner, In the first reciprocating mode, a stroke of the paddle when moving in the second direction is shorter than a stroke of the paddle when moving in the first direction by the certain value; 2. The plating apparatus of claim 1, wherein in the second reciprocating mode, the paddle moves in the second direction with a stroke that is longer than a stroke when moving in the first direction by the constant value, thereby making different positions of the multiple beam members when the paddle changes its movement direction from the second direction to the first direction and different positions of the multiple beam members when the paddle changes its movement direction from the first direction to the second direction.

3. The reciprocating movement of the paddle in the first direction and the second direction is a first reciprocating manner is repeated a plurality of times, and then a second reciprocating manner is performed; In the first reciprocating mode, a stroke of the paddle when moving in the second direction is longer than a stroke of the paddle when moving in the first direction by the certain value; 2. The plating apparatus of claim 1, wherein in the second reciprocating mode, the paddle moves in the second direction with a stroke that is shorter than the stroke when moving in the first direction by the constant value, thereby making different positions of the multiple beam members when the paddle changes its movement direction from the second direction to the first direction and different positions of the multiple beam members when the paddle changes its movement direction from the first direction to the second direction.

4. the substrate is disposed above the anode; 2. The plating apparatus according to claim 1, wherein an ion resistor having a plurality of holes is disposed inside the plating solution above the anode and below the paddle.

5. 5. The plating apparatus of claim 4, wherein reciprocating movement of the paddle in the first direction and the second direction includes moving the paddle in the first direction multiple times at different speeds, or moving the paddle in the second direction multiple times at different speeds.

6. 5. The plating apparatus of claim 4, wherein the reciprocating movement of the paddle in the first direction and the second direction includes the paddle moving in the first direction at a first speed and then moving in the second direction at a second speed different from the first speed.

7. a plating tank that stores a plating solution, an anode is disposed inside the plating solution, and a substrate is disposed inside the plating solution so as to face the anode; a paddle disposed between the anode and the substrate and configured to agitate the plating solution by reciprocating in a first direction parallel to the substrate and in a second direction opposite to the first direction; the substrate is disposed above the anode; an ion resistor having a plurality of holes is disposed inside the plating solution above the anode and below the paddle; The reciprocating movement of the paddle in the first direction and the second direction includes the paddle moving in the first direction at a first speed and then moving in the second direction at a second speed faster than the first speed, A plating apparatus in which the paddle moves at the first speed to suck up and remove from the holes air bubbles of a predetermined size that are attached to the holes of the ionic resistor, and the paddle moves at the second speed to suck up and remove from the holes air bubbles that are smaller than the predetermined size that are attached to the holes of the ionic resistor.

8. A plating apparatus as described in claim 2, wherein in the second reciprocating mode, the paddle performs reciprocating movements the same number of times as the number of reciprocating movements of the paddle in the first reciprocating mode, and then the reciprocating movement of the paddle in the second reciprocating mode is terminated.

9. A plating apparatus as described in claim 3, wherein in the second reciprocating mode, the paddle performs reciprocating movements the same number of times as the number of reciprocating movements of the paddle in the first reciprocating mode, and then the reciprocating movement of the paddle in the second reciprocating mode is terminated.

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