Circuit board connector structure
Patent Information
- Application Number
- JP2024571932
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2026-03-05
- Estimated Expiration
- 2044-03-25
AI Technical Summary
In existing board connector structures, RF signals leak due to non-conductive inner walls of the connector housing and ground layer, and gaps between the connector housing and the board, leading to inefficient signal transmission.
The board connector structure incorporates a connector housing with a shield portion covering the central conductor pin, and a plurality of board end through holes with conductive films electrically connected to the surface ground surface, ensuring electrical conductivity between the connector housing and the board end through holes via a solder layer.
This configuration effectively suppresses RF signal leakage in both the width and thickness directions, reducing signal loss and improving transmission efficiency by ensuring electrical conductivity and eliminating gaps between the connector and the board.
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Abstract
Description
[Technical field]
[0001] The present disclosure relates to a board connector structure in which a connector is mounted on a board. [Background technology]
[0002] Conventionally, a board connector structure in which a connector is mounted on the outer peripheral edge (board edge) of a board is known. For example, Patent Document 1 discloses a board connector structure in which a connector is disposed in a notch provided on the outer peripheral edge of the board. The notch penetrates the board in the board thickness direction. In the following description, the board thickness direction is referred to as the board thickness direction. Also, the depth direction and width direction of the notch when viewed along the board thickness direction are referred to as the depth direction and width direction, respectively. The board thickness direction, depth direction, and width direction are directions perpendicular to each other.
[0003] The connector has a connector housing that forms an outer shell of the connector, a central conductor pin that protrudes from the connector housing toward the board, and a shield portion that extends from the connector housing toward the board and covers the central conductor pin from one side in the board thickness direction. The shield portion is electrically connected to a surface ground plane provided on the surface of the board.
[0004] In the circuit board connector structure disclosed in Patent Document 1, when an RF (Radio Frequency) signal is transmitted from the central conductor pin to the circuit board, the shielding section can suppress leakage of the RF signal in one direction in the board thickness direction. Also, in the circuit board connector structure disclosed in Patent Document 1, the RF signal output from the central conductor pin is converted in the shielding section into a mode that passes through a strip line provided in the circuit board, so that leakage of the RF signal transmitted from the central conductor pin to the circuit board outside the strip line can be suppressed. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] U.S. Patent No. 7,042,318 Summary of the Invention [Problem to be solved by the invention]
[0006] However, in the board connector structure disclosed in Patent Document 1, the connector housing and the ground layer of the board are not electrically connected at the inner wall of the cutout portion, so that when an RF signal is transmitted from the central conductor pin to the board, the RF signal leaks in both width directions and in the other direction of the board thickness.
[0007] Furthermore, in the circuit board connector structure disclosed in Patent Document 1, when mounting the connector on the outer peripheral edge of the circuit board, unavoidable dimensional tolerances, assembly tolerances, etc. result in a gap between the connector housing and the circuit board (the inner wall of the cutout portion), which causes the problem that RF signals can leak through this gap.
[0008] The present disclosure has been made in consideration of the above, and has an object to provide a board connector structure that can suppress leakage of RF signals more effectively than ever before. [Means for solving the problem]
[0009] In order to solve the above problems and achieve the object, the present disclosure provides a board connector structure including a board and a connector mounted on the board. The board includes a cutout portion provided on an outer peripheral edge of the board and penetrating the board in a thickness direction of the board, a surface ground plane provided on a surface layer of the board, and ,of The connector has a connector housing, a part of which is disposed within the notch, and a board-connecting member protruding from the connector housing toward the board. Board and The connector includes a central conductor pin that is electrically connected to the connector housing, and a shield portion that extends from the connector housing toward the board and covers the central conductor pin from one side in the board thickness direction. Set up The substrate has a plurality of substrate end through holes arranged on both sides of the connection portion between the central conductor pin and the substrate in a direction perpendicular to the thickness direction of the substrate. ComplexEach of the through holes at the end of the board includes a conductive film that is electrically connected to the surface ground plane and is exposed in the cutout. The side surface of the connector housing facing the inner wall of the cutout and the conductive film of each of the through holes at the end of the board are electrically connected to the surface ground plane and exposed in the cutout. ,teeth The electrical connection is made via a solder layer. The substrate has a plurality of lands provided on a back layer of the substrate and electrically connected to the respective conductive films of the plurality of substrate end through-holes, and a back layer ground plane provided on the back layer of the substrate and separated from the lands. Effect of the Invention
[0010] The board connector structure according to the present disclosure has the advantage of being able to suppress leakage of RF signals more effectively than ever before. [Brief description of the drawings]
[0011] [Figure 1] FIG. 1 is a bottom view showing a board connector structure according to a first embodiment; [Diagram 2] FIG. 2 is a cross-sectional view showing the board connector structure according to the first embodiment, taken along line II-II shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view showing the board connector structure according to the first embodiment, taken along line III-III shown in FIG. [Figure 4] FIG. 3 is a cross-sectional view showing a state in which the substrate in the first embodiment is cut in a direction perpendicular to the thickness direction. [Diagram 5] 5 is a cross-sectional view taken along the direction of arrow A in FIG. 4. [Figure 6] FIG. 1 is a bottom view showing the connector according to the first embodiment. [Figure 7] FIG. 1 is a side view showing a connector according to a first embodiment; [Figure 8] 8 is a cross-sectional view showing the connector according to the first embodiment, taken along line VIII-VIII shown in FIG. 7 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a board connector structure according to an embodiment will be described in detail with reference to the drawings.
[0013] Embodiment 1 Fig. 1 is a bottom view showing a board connector structure 100 according to the first embodiment. Fig. 2 is a cross-sectional view showing the board connector structure 100 according to the first embodiment, taken along line II-II shown in Fig. 1. Fig. 3 is a cross-sectional view showing the board connector structure 100 according to the first embodiment, taken along line III-III shown in Fig. 1. As shown in Fig. 1, the board connector structure 100 includes a board 1 and a connector 2 mounted on the board 1.
[0014] The substrate 1 shown in Fig. 2 and Fig. 3 is a multi-layer resin substrate formed by laminating a plurality of conductor layers and a plurality of insulating layers. The bottom view shape of the substrate 1 is not particularly limited, but is, for example, rectangular. As shown in Fig. 1 and Fig. 2, the substrate 1 has a cutout portion 1a, a signal pad 1b, a surface ground surface 1c, a signal pattern 1d, a signal through hole 1e, a plurality of ground patterns 1f, 1g, and a plurality of ground through holes 1h. Also, as shown in Fig. 3, the substrate 1 has a plurality of substrate end through holes 1i (only one is shown in Fig. 3), a plurality of lands 1j (only one is shown in Fig. 3), and a back ground surface 1k.
[0015] In addition, the insulating layer is omitted in each figure. In the following description, the uppermost conductor layer is referred to as the surface layer. The lowermost conductor layer is referred to as the back layer. Each of the multiple conductor layers stacked between the uppermost conductor layer and the lowermost conductor layer is referred to as an inner layer. When describing the directions of each component of the board connector structure 100, the depth direction of the cutout portion 1a shown in FIG. 1 is the X-axis direction, the width direction of the cutout portion 1a is the Y-axis direction, and the plate thickness direction of the board 1 shown in FIG. 2 and FIG. 3 is the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular. In addition, the direction from the outer peripheral edge of the board 1 toward the center of the board 1 is referred to as the inside, and the opposite side to the inside is referred to as the outside.
[0016] As shown in FIG. 1, the cutout portion 1a is provided at the outer peripheral end of the substrate 1 and penetrates the substrate 1 in the Z-axis direction. The cutout portion 1a is formed by cutting a predetermined length inward from the outer peripheral end of the substrate 1. The cutout portion 1a penetrates from the front layer to the back layer of the substrate 1. The shape of the cutout portion 1a when viewed from the bottom is rectangular in this embodiment, but may be changed as appropriate. The inner wall of the cutout portion 1a has a bottom wall portion 1m which is the bottom of the cutout portion 1a, and a pair of side wall portions 1n. The bottom wall portion 1m extends in the Y-axis direction and the Z-axis direction. The pair of side wall portions 1n extend outward from one end and the other end of the bottom wall portion 1m in the Y-axis direction. The pair of side wall portions 1n extend in the X-axis direction and the Z-axis direction. Here, the depth of the cutout portion 1a refers to the distance from the outer opening of the cutout portion 1a to the bottom wall portion 1m when viewed from the bottom of the substrate 1. Moreover, the width of the cutout portion 1a refers to the distance between a pair of side walls 1n when viewed from the bottom of the substrate 1.
[0017] As shown in Fig. 2, the signal pad 1b is provided on the surface layer of the substrate 1 and is electrically connected to a central conductor pin 2c described below. Fig. 4 is a cross-sectional view showing the substrate 1 in the first embodiment cut in a direction perpendicular to the thickness direction. The signal pad 1b is provided on a portion of the surface layer of the substrate 1 adjacent to the bottom wall portion 1m. The signal pad 1b is provided at a position facing the cutout portion 1a. The connection point between the central conductor pin 2c and the substrate 1 (signal pad 1b) is adjacent to the bottom wall portion 1m.
[0018] As shown in Fig. 2, the surface ground plane 1c is provided on the surface of the substrate 1. The surface ground plane 1c and the signal pad 1b are arranged on the same plane. As shown in Fig. 4, the surface ground plane 1c surrounds the signal pad 1b from one side in the X-axis direction and from both sides in the Y-axis direction (three directions).
[0019] 2, the signal pattern 1d is provided on an inner layer of the substrate 1. The signal pattern 1d is provided on an inner layer of the substrate 1 that is different from the inner layer on which the ground patterns 1f and 1g are provided.
[0020] The signal through hole 1e electrically connects the signal pad 1b and the signal pattern 1d. The signal through hole 1e extends in the Z-axis direction. One end of the signal through hole 1e in the Z-axis direction is electrically connected to the signal pad 1b. The other end of the signal through hole 1e in the Z-axis direction is electrically connected to the signal pattern 1d.
[0021] A plurality of ground patterns 1f, 1g are provided on the inner layer of the substrate 1 and are disposed on one side and the other side of the signal pattern 1d in the Z-axis direction. The number of inner layers on which the ground patterns 1f, 1g are provided is not particularly limited, but is two in this embodiment. The two ground patterns 1f, 1g are provided apart from each other in the Z-axis direction. The signal pattern 1d is provided between the two adjacent ground patterns 1f, 1g. The two ground patterns 1f, 1g are disposed at a distance from the signal pattern 1d in the Z-axis direction. The signal pattern 1d, which is on the inner layer of the substrate 1 and disposed between the two ground patterns 1f, 1g, constitutes a strip line through which an RF signal passes.
[0022] Each of the ground through holes 1h shown in FIG. 4 electrically connects the surface ground surface 1c and each of the ground patterns 1f and 1g shown in FIG. 2. At the cross-sectional position of FIG. 2, only the ground through holes 1h electrically connecting the surface ground surface 1c and the ground pattern 1f are shown, but there are also ground through holes 1h electrically connecting the surface ground surface 1c, the ground pattern 1f, and the ground pattern 1g. That is, there are also multiple ground through holes 1h electrically connecting the multiple ground patterns 1f and 1g. Each ground through hole 1h extends in the Z-axis direction. One end of each ground through hole 1h in the Z-axis direction is electrically connected to the surface ground surface 1c. The other end of each ground through hole 1h in the Z-axis direction is electrically connected to any one of the multiple ground patterns 1f and 1g. The multiple ground through holes 1h shown in FIG. 4 are arranged at intervals from each other in the X-axis direction and the Y-axis direction. Some of the multiple ground through holes 1h are arranged so as to surround the signal pad 1b and the signal through hole 1e from one side in the X-axis direction and from both sides in the Y-axis direction (three directions).
[0023] The multiple board end through holes 1i are provided in the bottom wall 1m of the cutout portion 1a and are arranged on both sides of the connection point between the central conductor pin 2c and the board 1 (signal pad 1b) in the Y-axis direction. In FIG. 4, the central conductor pin 2c is illustrated by a dashed line for ease of understanding. Each board end through hole 1i is an end face through hole opened in a semicircular or U-shaped manner in the bottom wall 1m. Each board end through hole 1i extends in the Z-axis direction. The multiple board end through holes 1i are arranged at intervals from each other in the Y-axis direction. In this embodiment, the number of board end through holes 1i is two. The interval in the Y-axis direction between the two board end through holes 1i is set to be smaller than the length corresponding to half the wavelength of the RF signal.
[0024] FIG. 5 is a cross-sectional view seen from the direction of the arrow A shown in FIG. 4. Each board end through hole 1i includes a conductive film 1o serving as a metallized layer. The conductive film 1o is provided on the semicircular or U-shaped inner surface of each board end through hole 1i. The conductive film 1o extends in the Z-axis direction. One end of the conductive film 1o in the Z-axis direction is electrically connected to the surface ground surface 1c. The other end of the conductive film 1o in the Z-axis direction is electrically connected to the land 1j. As shown in FIG. 4, the conductive film 1o is exposed in the cutout portion 1a. As shown in FIG. 3, each ground pattern 1f, 1g and the conductive film 1o of each board end through hole 1i are electrically connected.
[0025] 5, each of the multiple lands 1j is provided on the back layer of the substrate 1 and is electrically connected to each of the conductive films 1o of the multiple substrate end through holes 1i. One land 1j is electrically connected to one conductive film 1o.
[0026] 3, the back-layer ground plane 1k is provided on the back layer of the substrate 1 and is separated from the lands 1j. The back-layer ground plane 1k is provided inside the lands 1j and separated from the lands 1j.
[0027] As shown in FIG. 2, the connector 2 has a connector housing 2a, a supporting dielectric 2b, a central conductor pin 2c, and a shield portion 2d.
[0028] A part of the connector housing 2a is disposed in the cutout portion 1a shown in FIG. 1. The connector housing 2a constitutes an outer shell of the connector 2. FIG. 6 is a bottom view showing the connector 2 in the first embodiment. FIG. 7 is a side view showing the connector 2 in the first embodiment. FIG. 8 is a cross-sectional view showing the connector 2 in the first embodiment, taken along the line VIII-VIII shown in FIG. 7. As shown in FIGS. 6 and 7, the connector housing 2a includes a base portion 2e and a tip portion 2f. The base portion 2e and the tip portion 2f are aligned in the Z-axis direction. The base portion 2e is a portion disposed in the cutout portion 1a shown in FIG. 1. The tip portion 2f is a portion larger than the base portion 2e in the X-axis direction and the Y-axis direction, and is a portion disposed outside the cutout portion 1a shown in FIG. 1.
[0029] The tip 2f is continuous with one end of the base 2e in the Z-axis direction. A planar step surface 2g is formed on the end of the tip 2f facing the base 2e. The step surface 2g extends longer in the X-axis direction and the Y-axis direction than the base 2e. A housing side surface 2h is formed on the base 2e, which is continuous with the step surface 2g and perpendicular to the step surface 2g. The housing side surface 2h extends in the Y-axis direction and the Z-axis direction. The housing side surface 2h is a surface of the connector housing 2a facing the bottom wall portion 1m of the cutout portion 1a shown in FIG. 1. The housing side surface 2h of the connector housing 2a is electrically connected to the conductive film 1o of the board end through hole 1i.
[0030] As shown in Fig. 8, the supporting dielectric 2b is accommodated in the connector housing 2a and surrounds the central conductor pin 2c. The supporting dielectric 2b has a cylindrical shape in this embodiment, but may be modified as appropriate. The supporting dielectric 2b is made of, for example, resin or glass beads.
[0031] As shown in FIG. 2, the central conductor pin 2c protrudes from the connector housing 2a toward the substrate 1 and is electrically connected to the substrate 1. The central conductor pin 2c protrudes from the tip 2f along the surface of the substrate 1. With the base 2e disposed in the cutout 1a, the tip 2f is disposed on one side of the surface of the substrate 1 in the Z-axis direction. The central conductor pin 2c is disposed on one side of the signal pad 1b in the Z-axis direction. As shown in FIG. 8, a part of the central conductor pin 2c is accommodated in the connector housing 2a and disposed inside the supporting dielectric 2b. As shown in FIG. 6, the remaining part of the central conductor pin 2c is exposed outside the connector housing 2a and outside the supporting dielectric 2b.
[0032] As shown in FIG. 2, the shielding portion 2d is an eave-shaped portion that extends from the connector housing 2a toward the substrate 1 and covers the central conductor pin 2c from one side in the Z-axis direction. The shielding portion 2d extends from the tip portion 2f along the surface layer of the substrate 1 and extends beyond the tip of the central conductor pin 2c toward one side in the X-axis direction. The shielding portion 2d is disposed on one side in the Z-axis direction from the surface layer of the substrate 1. The shielding portion 2d is a part of the tip portion 2f, and is a part of the tip portion 2f that protrudes toward one side in the X-axis direction from the base portion 2e. The end portion of the shielding portion 2d facing toward the base portion 2e is a part of the step surface 2g. The step surface 2g is disposed on one side in the Z-axis direction from the surface layer of the substrate 1. A recess 2i that accommodates the central conductor pin 2c is formed in the part of the end portion of the shielding portion 2d facing toward the base portion 2e, except for the step surface 2g. The recess 2i is recessed toward one side in the Z-axis direction so as to move away from the substrate 1. As shown in FIG. 6, the inner walls of the recess 2i surround the central conductor pin 2c from one side in the X-axis direction, both sides in the Y-axis direction, and one side in the Z-axis direction (four directions).
[0033] As shown in FIG. 2, the connector housing 2a including the shield portion 2d and the surface ground surface 1c of the substrate 1 are electrically connected via the solder layer 3. Specifically, the step surface 2g of the connector housing 2a and the surface ground surface 1c of the substrate 1 are electrically connected via the solder layer 3. The step surface 2g is disposed on the surface ground surface 1c via the solder layer 3. The central conductor pin 2c and the signal pad 1b are electrically connected via the solder layer 3. As shown in FIG. 3, the housing side surface 2h facing the bottom wall portion 1m of the cutout portion 1a of the connector housing 2a and the conductive film 1o of the substrate end through hole 1i are electrically connected via the solder layer 3.
[0034] Here, a method of mounting the connector 2 on the outer peripheral edge of the substrate 1 will be described with reference to FIGS. 2 to 4. First, a solder paste, which is the base of the solder layer 3 shown in FIG. 2, is applied onto the surface ground surface 1c and the signal pads 1b of the substrate 1 using a solder mask (not shown). Next, a mounter (not shown) is used to place the connector housing 2a in the cutout portion 1a of the substrate 1, and the connector housing 2a is placed on the surface ground surface 1c of the substrate 1 via the solder paste. After that, the solder paste is heated to the melting temperature of the solder paste to perform a reflow process, and the solder paste is melted and liquefied. The liquefied solder paste hardens, and the connector 2 is mounted on the surface ground surface 1c and the signal pads 1b of the substrate 1 via the solder layer 3.
[0035] When the connector housing 2a is placed in the cutout 1a of the substrate 1, the connector housing 2a is pushed toward the surface ground surface 1c of the substrate 1, so that the solder paste is easily attached to the entire step surface 2g. Therefore, when the solder paste is liquefied during the reflow process, the solder paste spreads (permeates) the conductive film 1o of the substrate end through-hole 1i along the surface ground surface 1c shown in FIG. 3. At this time, the surface tension of the solder paste attracts the connector housing 2a to the bottom wall 1m of the cutout 1a, so that the solder paste fills the gap between the connector housing 2a and the conductive film 1o of the substrate end through-hole 1i. After that, the liquefied solder paste hardens, so that the housing side surface 2h of the connector housing 2a facing the bottom wall 1m of the cutout 1a and the conductive film 1o of the substrate end through-hole 1i are joined via the solder layer 3. 2, the step surface 2g of the connector housing 2a and the surface ground surface 1c of the substrate 1 are joined via a solder layer 3. The center conductor pin 2c and the signal pad 1b are joined via the solder layer 3.
[0036] Next, the effects of the board connector structure 100 according to this embodiment will be described.
[0037] 2, an RF signal propagated in a coaxial mode between the connector housing 2a, the supporting dielectric 2b, and the central conductor pin 2c is transmitted from the central conductor pin 2c to the signal pad 1b and the signal through hole 1e on the surface layer of the substrate 1, and then transmitted to the signal pattern 1d (strip line) on the inner layer of the substrate 1. Although not shown, in this embodiment, the multiple ground patterns 1f, 1g are electrically connected to each other via multiple ground through holes 1h. This configuration makes it possible to suppress the RF signal transmitted from the central conductor pin 2c to the substrate 1 from leaking outside the signal pattern 1d (outside the strip line).
[0038] 2, the connector 2 has a shield portion 2d that extends from the connector housing 2a toward the board 1 and covers the central conductor pin 2c from one side in the Z-axis direction. This configuration makes it possible to suppress leakage of the RF signal to one side in the Z-axis direction when the RF signal is transmitted from the central conductor pin 2c to the board 1.
[0039] In this embodiment, as shown in Fig. 4 and Fig. 5, the board 1 has a plurality of board end through holes 1i provided in the bottom wall 1m of the cutout 1a and arranged on both sides of the connection point between the central conductor pin 2c and the board 1 in the Y-axis direction. In this embodiment, each of the plurality of board end through holes 1i includes a conductive film 1o that is electrically connected to the surface ground surface 1c and exposed in the cutout 1a. In this embodiment, as shown in Fig. 1, the housing side surface 2h of the connector housing 2a facing the bottom wall 1m of the cutout 1a and the conductive film 1o of each board end through hole 1i are electrically connected via a solder layer 3. With these configurations, the connector housing 2a and the board end through holes 1i of the board 1 are electrically connected at the bottom wall 1m. That is, the housing side surface 2h of the connector housing 2a and the conductive film 1o of the multiple board end through holes 1i arranged on both sides of the connection point between the center conductor pin 2c and the signal pad 1b in the Y-axis direction are joined at ground potential (the same potential as the ground potential of the surface ground surface 1c) via the solder layer 3. Therefore, as shown in Figures 4 and 5, when an RF signal is transmitted from the center conductor pin 2c to the board 1, leakage of the RF signal in both directions in the Y-axis direction and in the other direction in the Z-axis direction (in the direction of the dashed arrow shown in Figure 5) can be suppressed. Therefore, in this embodiment, a board connector structure 100 that can suppress leakage of an RF signal more than in the past can be obtained.
[0040] In the board connector structure disclosed in Patent Document 1, when mounting the connector on the outer peripheral edge of the board, a gap is generated between the connector housing and the board due to unavoidable dimensional tolerances, assembly tolerances, etc., and there is a problem that an RF signal leaks from the gap. In this regard, in this embodiment, as shown in Figs. 1 and 4, the housing side surface 2h of the connector housing 2a and the conductive film 1o of the two board end through holes 1i arranged on both sides of the connection part between the central conductor pin 2c and the signal pad 1b in the Y-axis direction are joined via a solder layer 3. Therefore, the gap between the housing side surface 2h of the connector housing 2a and the board 1 (bottom wall portion 1m of the cutout portion 1a) can be eliminated or reduced. This makes it possible to suppress leakage of the RF signal from the gap in both the Y-axis direction and the other Z-axis direction when the RF signal is transmitted from the central conductor pin 2c to the board 1.
[0041] 1, in the present embodiment, a housing side surface 2h of the connector housing 2a facing the bottom wall portion 1m of the cutout portion 1a and a conductive film 1o of a board end through hole 1i are joined via a solder layer 3. With this configuration, the connector housing 2a is attracted to and fixed to the board 1 by the solder layer 3, so that the variation in the mounting position of the connector housing 2a on the board 1 is reduced. This improves the positional accuracy when mounting the connector housing 2a on the board 1, and reduces the variation in the RF signal transmission characteristics.
[0042] In this embodiment, the ground patterns 1f, 1g and the conductive film 1o of each of the board-end through-holes 1i are electrically connected as shown in Fig. 3. This configuration can further suppress leakage of the RF signal in both Y-axis directions and the other Z-axis direction when the RF signal is transmitted from the central conductor pin 2c to the board 1.
[0043] In this embodiment, as shown in Figures 3 and 5, the substrate 1 has a plurality of lands 1j provided on the back layer and electrically connected to the conductive films 1o of the plurality of substrate end through holes 1i. With this configuration, by visually checking the lands 1j, it is easy to see that the solder layer 3 is formed along the conductive film 1o. Also, in this embodiment, as shown in Figure 5, the substrate 1 has a back layer ground surface 1k provided on the back layer and separated from the lands 1j. With this configuration, it is possible to prevent the solder layer 3 from leaking and spreading to the back layer ground surface 1k.
[0044] Next, a modified example of the board connector structure 100 according to the present embodiment will be described.
[0045] In this embodiment, as shown in FIG. 3, each of the ground patterns 1f, 1g and the conductive film 1o of each of the board-end through-holes 1i are electrically connected, but they do not have to be electrically connected.
[0046] In this embodiment, as shown in FIG. 5, the back ground plane 1k is separated from the land 1j, but may be in contact with the land 1j.
[0047] 4, the number of board end through holes 1i may be three or more if there are no dimensional constraints. In this way, leakage of the RF signal in both Y-axis directions and the other Z-axis direction when the RF signal is transmitted from the central conductor pin 2c to the board 1 can be further suppressed.
[0048] In this embodiment, the connector 2 is provided with the supporting dielectric 2b as shown in Fig. 8, but the supporting dielectric 2b may be omitted. In other words, the connector 2 may have an air coaxial structure without the supporting dielectric 2b.
[0049] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies. Also, parts of the configurations may be omitted or modified without departing from the spirit of the invention. [Explanation of symbols]
[0050] 1 board, 1a cutout portion, 1b signal pad, 1c surface ground surface, 1d signal pattern, 1e signal through hole, 1f, 1g ground pattern, 1h ground through hole, 1i board end through hole, 1j land, 1k back ground surface, 1m bottom wall portion, 1n side wall portion, 1o conductive film, 2 connector, 2a connector housing, 2b supporting dielectric, 2c central conductor pin, 2d shield portion, 2e base portion, 2f tip portion, 2g step surface, 2h housing side surface, 2i recess portion, 3 solder layer, 100 board connector structure.
Claims
1. A substrate; a connector mounted on the substrate; A board connector structure comprising: The substrate is a notch portion provided at an outer peripheral edge of the substrate and penetrating the substrate in a thickness direction of the substrate; a surface ground plane provided on a surface layer of the substrate; signal pads provided on a surface layer of the substrate; and The connector comprises: a connector housing, a portion of which is disposed within the notch; a central conductor pin that protrudes from the connector housing toward the board and is electrically connected to the signal pad of the board; a shield portion extending from the connector housing toward the board and covering the center conductor pin from one side in the board thickness direction; and the substrate has a plurality of substrate end through holes that are provided on an inner wall of the cutout portion from the front layer to the back layer of the substrate and are arranged on both sides of a connection point between the center conductor pin and the substrate in a direction perpendicular to the plate thickness direction, the plurality of substrate-end through holes are arranged at intervals that are smaller than a length corresponding to half the wavelength of an RF signal that passes through the signal pad; each of the plurality of substrate-end through holes includes a conductive film electrically connected to the surface ground plane and exposed in the cutout portion; A connector structure for a board, characterized in that the side surface of the connector housing facing the inner wall of the cutout portion and the conductive film of each of the board end through holes are electrically connected via a solder layer extending from the surface layer to the back layer of the board.
2. A substrate, a connector mounted on the substrate; A board connector structure comprising: The substrate is a notch portion provided at an outer peripheral edge of the substrate and penetrating the substrate in a thickness direction of the substrate; a surface ground plane provided on a surface layer of the substrate; and The connector comprises: a connector housing, a portion of which is disposed within the notch; a central conductor pin that protrudes from the connector housing toward the board and is electrically connected to the board; a shield portion extending from the connector housing toward the board and covering the center conductor pin from one side in the board thickness direction; and the substrate has a plurality of substrate-end through holes provided on an inner wall of the notch portion and arranged on both sides of a connection point between the center conductor pin and the substrate in a direction perpendicular to the plate thickness direction, each of the plurality of substrate-end through holes includes a conductive film electrically connected to the surface ground plane and exposed in the cutout portion; a housing side surface of the connector housing facing the inner wall of the notch portion and the conductive film of each of the board-end through-holes are electrically connected via a solder layer; The substrate is a plurality of lands provided on a back surface of the substrate and electrically connected to the conductive films of the plurality of substrate end through holes; a back-layer ground plane provided on a back layer of the substrate and separated from the lands; A connector structure for a circuit board, comprising:
3. The substrate is a signal pattern provided on an inner layer of the substrate; a signal through hole electrically connecting the signal pad and the signal pattern; a plurality of ground patterns provided in an inner layer of the board and disposed on one side and the other side of the signal patterns in the board thickness direction; 2. The circuit board connector structure according to claim 1, further comprising:
4. The substrate is a signal pad provided on a surface layer of the substrate and electrically connected to the central conductor pin; a signal pattern provided on an inner layer of the substrate; a signal through hole electrically connecting the signal pad and the signal pattern; a plurality of ground patterns provided in an inner layer of the board and disposed on one side and the other side of the signal patterns in the board thickness direction; 3. The circuit board connector structure according to claim 2, further comprising:
5. the connector housing including the shield portion and the surface ground surface of the substrate are electrically connected via the solder layer; 5. The circuit board connector structure according to claim 1, wherein the central conductor pin and the signal pad are electrically connected via the solder layer.
6. 5. The circuit board connector structure according to claim 3, wherein each of the ground patterns is electrically connected to the conductive film of each of the circuit board end through holes.