Resin composition

A resin composition with hexagonal boron nitride and silica fillers addresses thermal conductivity and transmission loss issues by enhancing adhesion, suitable for multilayer printed circuit boards and related applications.

KR1020260113007APending Publication Date: 2026-07-21TOKUYAMA CORP
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
KR · KR
Patent Type
Applications
Current Assignee / Owner
TOKUYAMA CORP
Filing Date
2024-11-15
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing resin compositions using hexagonal boron nitride fillers for multilayer printed circuit boards face challenges in achieving high thermal conductivity due to reduced adhesion between the epoxy resin and fillers, leading to decreased thermal conductivity despite increased mixing ratios, and they also suffer from transmission loss issues.

Method used

A resin composition comprising a mixture of hexagonal boron nitride fillers with an average particle size of 1 to 10 μm and silica fillers with an average particle size of 0.1 to 1 μm, along with a specific mass ratio, to enhance adhesion and thermal conductivity while maintaining low dielectric properties.

Benefits of technology

The composition achieves high thermal conductivity with reduced transmission loss, suitable for use in multilayer printed circuit boards, component-embedded substrates, prepregs, and metal foil-attached resin films, providing excellent heat dissipation and dielectric properties.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure PCT00001
    Figure PCT00001
  • Figure PCT00002
    Figure PCT00002
  • Figure PCT00003
    Figure PCT00003
Patent Text Reader

Abstract

The present invention provides a resin composition in which the cured product has high thermal conductivity by using a hexagonal boron nitride filler with an average particle size of 1 to 10 μm, which can be formed into a thin film shape and reduce transmission loss. The resin composition of the present invention comprises an epoxy resin (A), a hexagonal boron nitride filler (B), and a silica filler (C), wherein the total content of the hexagonal boron nitride filler (B) and the silica filler (C) is 200 to 1200 parts by mass for every 100 parts by mass of the epoxy resin (A), the epoxy resin (A) comprises a solid epoxy resin (A-1) and a liquid epoxy resin (A-2), wherein the average particle size D50 of the hexagonal boron nitride filler (B) is 1 to 10 μm and the maximum particle size Dmax is 30 μm or less, the average particle size D50 of the silica filler (C) is 0.1 to 1 μm, and the mass ratio of the content of the hexagonal boron nitride filler (B) and the silica filler (C) is 85:15 to 30:70.
Need to check novelty before this filing date? Find Prior Art