Semiconductor frame device that is easy to maintain vertically and horizontally

Abstract

The present invention relates to a frame for semiconductor manufacturing equipment in which semiconductor production equipment or inspection equipment is installed, wherein individual frames are laser-processed and then assembled and welded in a fitting manner to facilitate vertical and horizontal maintenance and prevent warping. The frame comprises: a base frame (10); a mounting frame (30) installed at a position spaced a certain distance from the base frame (10) so that semiconductor production equipment or inspection equipment can be seated thereon; and a pair of side frames (20) each installed on both sides of the base frame (10) and to which the mounting frame (30) is coupled. The side frame (20) is coupled to the base frame (10) in a fitting manner, and the mounting frame (30) is coupled to the upper middle portion of the side frame (20) in a fitting manner, and the coupled portion is welded.

Description

Technology Field

[0001] The present invention relates to a frame for semiconductor manufacturing equipment on which semiconductor production equipment or inspection equipment is installed, and more specifically, to a frame for semiconductor manufacturing equipment that supports precision balance by laser processing individual frames and then assembling and welding them in a snap-fit ​​manner, thereby facilitating vertical and horizontal maintenance and preventing warping. Background Technology

[0003] Generally, semiconductor manufacturing equipment is used to produce semi-finished products in each stage of the various semiconductor manufacturing processes, while semiconductor inspection equipment is used to inspect the quality of these manufactured semi-finished products and is produced in various forms depending on the type of semi-finished product.

[0004] The most critical aspect of such semiconductor production and inspection equipment, particularly semiconductor inspection equipment, is that it must always maintain a horizontal and vertical alignment and avoid tilting. If the semiconductor inspection equipment tilts, errors in the inspection results are inevitable, which consequently reduces the reliability of the measurement results. Therefore, semiconductor inspection equipment is installed and used on frame devices that maintain horizontal and vertical alignment without tilting.

[0005] However, conventional frame devices are constructed by assembling each component using bolts, which can result in play at the assembly points. In particular, when a frame device is used for a long period, the play increases due to aging; consequently, maintaining a horizontal or vertical position becomes difficult, and tilting occurs.

[0006] If tilting occurs in the frame device in this manner, the semiconductor inspection equipment installed on the frame device is also bound to tilt, which leads to a decrease in the reliability of the inspection results. The problem to be solved

[0007] The present invention was devised to resolve the problems of the aforementioned prior art, and aims to provide a frame for semiconductor manufacturing equipment in which each member constituting the frame is firmly connected to one another to facilitate vertical and horizontal maintenance and prevent twisting. means of solving the problem

[0008] The present invention for achieving the above objective comprises: a base frame; a mounting frame installed at a position spaced a certain distance from the base frame so that semiconductor production equipment or inspection equipment can be mounted thereon; and a pair of side frames each installed on both sides of the base frame and coupled to the mounting frame; wherein the side frames are coupled to the base frame in a snap-fit ​​manner, and the mounting frame is coupled to the upper part of the middle portion of the side frame in a snap-fit ​​manner, and the coupled portion is welded.

[0009] In addition, according to the frame for semiconductor manufacturing equipment of the present invention, the base frame is characterized by comprising a pair of base materials formed in a rectangular column shape and spaced apart at a certain interval, a plurality of connecting pieces coupled to a jaw formed at the end of the base material so as to connect the side frame and the base material, and a base intermediate material disposed between the base materials.

[0010] In addition, according to the frame for semiconductor manufacturing equipment of the present invention, the side frame comprises: a lower member having both ends connected to the connecting piece; a pair of vertical members each having a connecting portion formed at an opposing corner portion so that the base member and the lower member are fitted together, and installed on the connecting piece; an upper member having both ends connected to the upper surface of the vertical member; a center member having both ends fitted to the vertical member to form the side of the mounting frame; a center support member fitted to the middle portion of the lower member to support the center member; and a spacing member installed between the upper member and the center member to maintain the spacing between the two.

[0011] In addition, according to the frame for semiconductor manufacturing equipment of the present invention, the side frame further comprises a pair of reinforcing members, one end of which is fitted to the lower member on the outer side of the center support member and the other end of which is fitted to the vertical member on the lower side of the center member.

[0012] In addition, according to the frame for semiconductor manufacturing equipment of the present invention, the mounting frame is characterized by comprising: a pair of support frames arranged parallel to a base material such that their two ends are each coupled to the vertical members of the side frames facing each other; an intermediate member whose two ends are each coupled to the center member; a pair of support plates installed on the upper side of the support frames and in close contact with the vertical members; and a support block installed on one of the support frames.

[0013] In addition, according to the frame for semiconductor manufacturing equipment of the present invention, the connecting portion and connecting projection formed for fitting in each element constituting the base frame, side frame, and mounting frame are characterized by being formed by laser processing. Effects of the invention

[0015] The frame for semiconductor manufacturing equipment according to the present invention is integrated by assembling each member in a fitting manner using connecting parts and connecting protrusions formed by laser processing on each member constituting the frame, and then welding them together. As a result, it is easy to maintain the vertical and horizontal alignment of each member, no twisting occurs, and the overall strength is improved, thereby increasing durability.

[0016] In addition, as the frame device maintains a horizontal state and does not experience distortion, there is an effect of improving the reliability of inspection results using semiconductor inspection equipment installed on the frame device. Brief explanation of the drawing

[0017] FIG. 1 is a perspective view showing a frame for semiconductor manufacturing equipment according to the present invention. FIG. 2 is an exploded perspective view of a frame for semiconductor manufacturing equipment according to the present invention. FIG. 3 is a perspective view of a side frame, which is a key part of the present invention. FIG. 4 is an exploded perspective view of a side frame, which is a key part of the present invention. FIG. 5 is a reference diagram showing the connection between the base frame and the side frame, which is a key part of the present invention. FIG. 6 is a diagram showing the schematic configuration of a jig device for clamping a workpiece and precision welding according to one embodiment of the present invention. Figure 7 is a drawing showing the welding jig part of Figure 6. FIG. 8 is a diagram illustrating a driving method for a jig device for clamping a workpiece and precision welding according to an embodiment of FIG. 6. Specific details for implementing the invention

[0018] Hereinafter, the frame for semiconductor manufacturing equipment according to the present invention will be described with reference to the attached drawings.

[0019] As shown in FIGS. 1 to 5, the frame for semiconductor manufacturing equipment according to the present invention comprises: a base frame (10); a mounting frame (30) installed at a position spaced apart from the base frame (10) to allow a semiconductor production equipment or inspection equipment to be mounted thereon; and a pair of side frames (20) each installed on both sides of the base frame (10) and coupled to the mounting frame (30).

[0020] Here, the side frame (20) is joined to the base frame (10) in a fitting manner, and the mounting frame (30) is joined to the upper middle portion of the side frame (20) in a fitting manner, after which the joined portion is welded.

[0021] The base frame (10) is formed in the shape of a square column and comprises a pair of base members (11) spaced apart at regular intervals, a plurality of connecting pieces (13) coupled to a jaw portion (11a) formed at the end of the base member (11) so that the side frame (20) and the base member (10) can be connected, and a base intermediate member (12) positioned between the base members (11). At this time, a connecting projection (11b) coupled to the side frame (20) is formed at the end of the base member (11), and a hole (13') into which a wire or the like can be inserted is formed in the connecting piece (13).

[0022] Accordingly, the connecting piece (13) is coupled to the jaw portion (11a) at the lower end of the base material (11), and the connecting projection (11b) located on the upper side of the connecting piece (13) is coupled to the side frame (20).

[0023] And, as shown in FIGS. 3 and 4, the side frame (20) comprises a lower member (21) whose two ends are connected to the connecting piece (13), a pair of vertical members (22) installed on the connecting piece (13) with connecting parts (22a) and (22b) respectively formed at the corner portions facing each other so that the base material (11) and the lower member (21) are fitted together, and an upper member (26) whose two ends are connected to the upper surface of the vertical member (22); A center member (24) having both ends fitted into the vertical member (22) to form the side of the mounting frame (30), a center support member (23) fitted into the middle part of the lower member (21) to support the center member (24), a spacing member (27) installed between the upper member (26) and the center member (24) to maintain the spacing between the two, and a pair of reinforcing members (25) having one end fitted into the lower member (21) on the outside of the center support member (23) and the other end fitted into the vertical member (22) on the bottom of the center member (24).

[0024] A jaw portion (21a) is formed at the lower ends of both ends of the lower member (21) to which the connecting piece (13) is coupled, and a coupling portion (21b) is formed on the inner side of the middle portion of the lower member (21) to which a part of the center support member (23) and a coupling projection (25') of the reinforcing member (25) are coupled. Additionally, a coupling projection (21c) is formed at both ends of the lower member (21) to be fitted and assembled into the coupling portion (22a) of the vertical member (22). A coupling portion (22c) is formed in the middle portion of the vertical member (22) to which the coupling projection (24b) formed at both ends of the center member (24) and the coupling projection (25') of the reinforcing member (25) are coupled. Additionally, a coupling portion (24a) is formed on the inner side of the middle portion of the center member (24) so ​​that a coupling projection (27') formed at the bottom of the spacing member (27) is coupled thereto.

[0025] And, the mounting frame (30) comprises a pair of support frames (31) arranged parallel to a base material (11) so that their respective ends are connected to the vertical members (22) of the side frames (20) facing each other, each having connecting protrusions formed at their respective ends; an intermediate member (32) whose respective ends are connected to the center member (24); a pair of support plates (33) installed on the upper side of the support frames (31) and in close contact with the vertical members (22); and a support block (34) installed on one of the support frames (31).

[0026] The semiconductor manufacturing equipment frame of the present invention, configured as described above, is manufactured by forming each component constituting the base frame, side frame, and mounting frame into a rectangular prism shape, and then forming connecting protrusions and connecting parts by laser processing, thereby assembling the components together through the fitting of the connecting protrusions and connecting parts, and finally integrating the assembled parts by welding. Of course, post-processing such as grinding is performed on the welded parts to ensure they are the same height as other parts.

[0027] When welding assembly parts, a fixed jig can be used to facilitate welding.

[0028] FIG. 6 is a diagram showing the schematic configuration of a jig device for clamping a workpiece and precision welding according to one embodiment of the present invention.

[0029] Referring to FIG. 6, a jig device (10) for clamping a workpiece and precision welding according to one embodiment of the present invention includes a clamping part (100), a welding jig part (200), and a tilting drive part (300).

[0030] The clamping unit (100) is installed to be tiltable on the tilting drive unit (300) and secures the disc-shaped workpiece (P) so as not to move during the welding process, and then rotates the workpiece (P) in response to the welding process.

[0031] In one embodiment, the clamping part (100) may include a "U" shaped mounting bracket (110), a mounting bar (120), a lower rotating plate (130), an upper rotating plate (140), a fastening bar (150), and a lifting actuator (160).

[0032] The "U" shaped support (110) is formed in a "U" shape by bending the upper and lower ends in a shear-perpendicular direction, and is connected and installed to the tilting drive unit (300) so as to be tiltable.

[0033] The mounting bar (120) is installed across one side of the front of the "U" shaped mounting bracket (110) or both sides of the front in an up-and-down direction so that the welding jig part (200) can be connected and installed.

[0034] The lower rotating plate (130) is installed so as to be rotatable on the upper side of the lower (110a) of the "U" shaped support (110) so that the workpiece (P) can be placed thereon, and as shown in FIG. 3, when the workpiece (P) is placed thereon and then fastened by the fastening bar (150), the workpiece (P) is rotated.

[0035] The upper rotating plate (140) is rotatably installed on the lower side of the upper (110b) of the "U" shaped mounting bracket (110) while facing the lower rotating plate (130), and is moved up and down in the vertical direction by a plate lifting actuator (160).

[0036] A number of fastening bars (150) are installed upright at regular intervals along the lower side of the upper rotating plate (140), and as the upper rotating plate (140) moves downward, they move together to fasten the workpiece (P) that is seated on the lower rotating plate (130).

[0037] The plate lifting actuator (160) is installed upright on the upper part (110b) of the "U" shaped support (110) and supports the upper rotating plate (140) on the lower side of the upper part (110b) of the "U" shaped support (110) while simultaneously moving the upper rotating plate (140) up and down.

[0038] The welding jig part (200) is installed on the clamping part (100) facing the welding position of the workpiece (P) fastened to the clamping part (100) so as to be able to precisely weld the workpiece (P) fastened to the clamping part (100), and holds a welding gun (not shown in the drawing for convenience of explanation).

[0039] Referring to FIG. 7, the welding jig part (200) may include a support bar (210) connected to a mounting bar (120), a gun mounting ring (220) installed on the support bar (210) to mount a welding gun, and a rod holder (230) forming a through hole into which a welding rod used for welding is inserted and placed at a specific location.

[0040] The tilting drive unit (300) supports the clamping unit (100) and tilts the clamping unit (100) by the drive control of the operator.

[0041] A jig device (10) for clamping a workpiece and precision welding according to one embodiment of the present invention having the configuration described above can be implemented to clamp a workpiece to be used in a semiconductor process, etc., while simultaneously enabling precision welding.

[0043] In this way, connecting protrusions and connecting parts are formed on each component constituting the frame device through laser processing, and after the components are assembled by fitting the connecting protrusions and connecting parts together, they are integrated through welding. Consequently, the horizontal and vertical states of each assembled component are maintained, preventing tilting. As a result, errors are minimized and the reliability of inspection results is improved during semiconductor inspection using semiconductor inspection equipment mounted on the mounting frame.

[0045] Although the technical concept of the present invention has been described and illustrated in relation to several embodiments for exemplifying it, the present invention is not limited to the configuration and operation as described above, and those skilled in the art will understand that numerous changes and modifications can be made to the present invention without departing from the scope of the technical concept described in the specification. Accordingly, all such appropriate changes and modifications and equivalents should be considered to be within the scope of the present invention. Explanation of the symbols

[0047] 10...Base frame 11...Base material 11a...chin 11b...connecting protrusion 12...Base intermediate material 13...Connecting Part 13'...hole 20...side frame 21...lower member 21a...chin 21b...connecting protrusion 22...vertical member 22a, 22b...joining part 23...center support member 23a...joint 23b...connecting protrusion 24.... Center absence 24a...joint 24b...connecting protrusion 25...Reinforcing member 25'...protrusion 26...Upper member 27...Spacing member 27'...connecting protrusion 30... Mounting frame 31...support frame 32...Intermediate absence 33...support plate 34...support block

Claims

Claim 1 The apparatus comprises a base frame (10); a mounting frame (30) installed at a position spaced apart from the base frame (10) to allow a semiconductor production equipment or inspection equipment to be mounted thereon; and a pair of side frames (20) each installed on both sides of the base frame (10) and coupled to the mounting frame (30). The base frame (10) comprises a pair of base materials (11) formed in a rectangular column shape and spaced apart at a certain interval, a plurality of connecting pieces (13) coupled to a jaw portion (11a) formed at the end of the base material (11) so that the side frame (20) and the base material (10) can be connected, and a base intermediate material (12) disposed between the base materials (11). Each member constituting the base frame (10), the side frame (20), and the mounting frame (30) is formed in a rectangular column shape, and then a connecting protrusion and a connecting portion are formed on each member by laser processing, and through the fitting of the connecting protrusion and the connecting portion, each A frame for semiconductor manufacturing equipment characterized in that the members are assembled together and integrated by welding the assembled parts to form the base frame (10), the side frame (20), and the mounting frame (30), respectively, and the side frame (20) is joined to the base frame (10) in a snap-fit ​​manner, and the mounting frame (30) is joined to the upper middle part of the side frame (20) in a snap-fit ​​manner, and then the joined parts are welded. Claim 2 A frame for semiconductor manufacturing equipment according to claim 1, wherein the side frame (20) comprises a lower member (21) having both ends connected to the connecting piece (13), a pair of vertical members (22) installed on the connecting piece (13) with connecting portions (22a) and (22b) formed on opposite corner portions so that the base material (11) and the lower member (21) are fitted together, an upper member (26) having both ends connected to the upper surface of the vertical member (22); a center member (24) having both ends fitted to the vertical member (22) to form the side of the mounting frame (30), a center support member (23) fitted to the middle portion of the lower member (21) to support the center member (24), and a spacing member (27) installed between the upper member (26) and the center member (24) to maintain the spacing between the two. Claim 3 A frame for semiconductor manufacturing equipment according to paragraph 2, characterized in that the side frame (20) further includes a pair of reinforcing members (25) in which one end is fitted to the lower member (21) on the outside of the center support member (23) and the other end is fitted to the vertical member (22) on the bottom of the center member (24). Claim 4 A frame for semiconductor manufacturing equipment according to paragraph 2, wherein the mounting frame (30) comprises a pair of support frames (31) arranged parallel to a base material (11) such that both ends are respectively connected to a vertical member (22) of a side frame (20) facing each other, an intermediate member (32) whose both ends are respectively connected to a center member (24), a pair of support plates (33) installed on the upper side of the support frames (31) and in close contact with the vertical member (22), and a support block (34) installed on one of the support frames (31).

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