Laser apparatus and laser processing method

Abstract

The laser device includes a chamber where a target substrate is processed, a chamber window disposed on one side of the chamber, a laser module disposed outside the chamber and processing the target substrate by irradiating a laser beam onto the target substrate through the chamber window, a protective window located between the target substrate and the chamber window, a sensor located opposite the upper surface of the protective window and measuring position data, which is a distance from a point on the upper surface of the protective window, and a control unit connected to the sensor and controlling the irradiation position of the laser beam using the position data of the protective window.

Description

Technology Field

[0001] The present invention relates to a laser device. More specifically, it relates to a laser device and a laser processing method using the same. Background Technology

[0002] As with semiconductors, various physical or chemical methods are used in the manufacturing process of display devices. For example, the manufacturing process of display devices may include etching or drilling of the substrate using a laser. Laser processing of the substrate is widely used because it has a simpler structure and can reduce processing time compared to other methods.

[0003] Meanwhile, in the case of a downward-type substrate laser processing device that processes a substrate by irradiating a laser beam from the bottom of the substrate, a protective window may be used to prevent contamination of the chamber window from particles generated and falling from the substrate. If the protective window is tilted, the path of the laser beam passing through the protective window changes, which may degrade the processing quality of the substrate. The problem to be solved

[0004] One objective of the present invention is to provide a laser device with improved processing quality.

[0005] Another objective of the present invention is to provide a laser processing method using the laser device.

[0006] However, the objectives of the present invention are not limited to the objectives described above and may be extended in various ways without departing from the spirit and scope of the present invention. means of solving the problem

[0007] To achieve one objective of the present invention, a laser device according to embodiments may include a chamber in which a target substrate is processed, a chamber window disposed on one surface of the chamber, a laser module disposed outside the chamber and processing the target substrate by irradiating a laser beam onto the target substrate through the chamber window, a protective window located between the target substrate and the chamber window, a sensor located opposite the upper surface of the protective window and measuring position data, which is a distance from a point on the upper surface of the protective window, and a control unit connected to the sensor and controlling the irradiation position of the laser beam using the position data of the protective window.

[0008] In one embodiment, the laser device may further include a driving module that moves the sensor in a first direction and in a second direction intersecting the first direction.

[0009] In one embodiment, the sensor can measure the position data of each of at least two different points on the upper surface of the protective window.

[0010] In one embodiment, the control unit can generate flatness data by calculating the flatness of the upper surface of the protective window using the position data of the protective window.

[0011] In one embodiment, the laser module may include a laser light source that generates the laser beam and a scanner that adjusts the irradiation position of the laser beam.

[0012] In one embodiment, the control unit can control the irradiation position of the laser beam using the flatness data.

[0013] In one embodiment, the control unit can calculate correction data for the irradiation position of the laser beam.

[0014] In one embodiment, the scanner can adjust the irradiation position of the laser beam using the correction data.

[0015] To achieve another objective of the present invention, a laser processing method according to embodiments may include the steps of: replacing a protective window positioned to overlap with the chamber window within a chamber including a chamber window; moving a sensor spaced apart from the protective window on a plane to overlap with the protective window; measuring position data, which is the distance from the sensor to a point on the upper surface of the protective window, using the sensor; generating flatness data of the upper surface of the protective window using the position data; controlling the irradiation position of a laser beam using the flatness data; placing a target substrate within the chamber; and laser processing the target substrate by irradiating the laser beam through the chamber window and the protective window.

[0016] In one embodiment, the step of measuring the position data may include the step of measuring the position data of each of at least two different points on the upper surface of the protective window.

[0017] In one embodiment, the step of generating the flatness data may include the step of calculating the flatness of the upper surface of the protective window using the position data.

[0018] In one embodiment, the step of controlling the irradiation position of the laser beam may include the step of generating correction data for the irradiation position of the laser beam using the flatness data.

[0019] In one embodiment, the step of controlling the irradiation position of the laser beam may include the step of adjusting the irradiation position of the laser beam based on the correction data.

[0020] To achieve another objective of the present invention, a laser processing method according to embodiments may include the steps of: placing a first protective window within a chamber including a chamber window so as to overlap with said chamber window; measuring reference data, which is the distance from said sensor to a point on the upper surface of said first protective window, using a sensor; placing a target substrate within the chamber; laser processing the target substrate by irradiating a laser beam through said chamber window and said first protective window; replacing said first protective window with a second protective window; measuring position data, which is the distance from said sensor to a point on the upper surface of said second protective window or the upper surface of said chamber window opposite to said sensor, using said sensor; and determining the placement state or contamination state of said second protective window using said reference data and said position data.

[0021] In one embodiment, the step of determining the placement state of the second protective window may include determining whether the second protective window is positioned to overlap with the chamber window.

[0022] In one embodiment, when the second protective window does not overlap with the chamber window, the position data may be the distance from the sensor to a point on the upper surface of the chamber window.

[0023] In one embodiment, the laser processing method may further include the step of stopping the irradiation of the laser beam if, after the step of determining the arrangement state of the second protective window, the second protective window does not overlap with the chamber window.

[0024] In one embodiment, the step of determining the contamination state of the second protective window may include the step of determining the degree of particles loaded on the second protective window.

[0025] In one embodiment, the position data may be the distance from the sensor to a point on the upper surface of the second protective window.

[0026] In one embodiment, the laser processing method may further include the step of replacing the second protective window with a third protective window if, after the step of determining the contamination state of the second protective window, the position data is 1% or smaller than the reference data. Effects of the invention

[0027] In a display device according to embodiments of the present invention, the processing quality of the laser device can be guaranteed by including a sensor for measuring position data of a protective window and a control unit for controlling the irradiation position of a laser beam. That is, when replacing the protective window, the degree of error in the irradiation position of the laser beam during laser processing can be detected in advance even if the protective window is tilted. The irradiation position of the laser beam can be corrected even if the protective window is tilted. Accordingly, the processing quality of the laser device can be improved.

[0028] However, the effects of the present invention are not limited to the effects described above, and may be extended in various ways without departing from the spirit and scope of the present invention. Brief explanation of the drawing

[0029] FIG. 1 is a structural diagram showing a laser device according to one embodiment of the present invention. Figure 2 is a top view of the first chamber included in the laser device of Figure 1. FIGS. 3 and FIGS. 4 are structural diagrams showing the first chamber included in the laser device of FIG. 1. FIGS. 5 to 21 are drawings for explaining a laser processing method according to an embodiment of the present invention. FIGS. 22 to 26 are drawings illustrating a laser processing method according to another embodiment of the present invention. FIGS. 27 and 28 are drawings illustrating a laser processing method according to another embodiment of the present invention. Specific details for implementing the invention

[0030] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components are omitted.

[0031] FIG. 1 is a structural diagram showing a laser device according to an embodiment of the present invention. FIG. 2 is a top view of a first chamber included in the laser device of FIG. 1. FIG. 3 and FIG. 4 are structural diagrams showing the first chamber included in the laser device of FIG. 1. For example, FIG. 2 is a plan view showing the interior of the first chamber (CH1) included in the laser device of FIG. 1.

[0032] Referring to FIGS. 1 to 4, a laser device (10) according to one embodiment of the present invention can perform a process using a laser. For example, the laser device (10) can process a target substrate (SUB) by irradiating a laser beam (L) onto the target substrate (SUB).

[0033] The laser device (10) may include a first chamber (CH1), a laser module (LM), a chamber window (CW), a protection window (PW), a replacement module (RM), a sensor (SS), a driving module (MM), and a control unit (CTR).

[0034] The first chamber (CH1) may be a space in which laser processing (e.g., laser etching or laser drilling, etc.) is performed on the target substrate (SUB) inside. For example, while laser processing is performed on the target substrate (SUB), the interior of the first chamber (CH1) may be in a vacuum state. The interior of the first chamber (CH1) may be maintained in a vacuum state by a vacuum pump and a vacuum valve (not shown).

[0035] The above target substrate (SUB) may be a workpiece of the laser device (10). The above target substrate (SUB) may be applied to various types of substrates, such as an organic light-emitting diode display device using an organic light-emitting diode including an organic light-emitting layer, a micro light-emitting diode display device using a micro LED, a quantum dot light-emitting diode display device using a quantum dot light-emitting diode including a quantum dot light-emitting layer, or an inorganic light-emitting diode display device using an inorganic light-emitting diode including an inorganic semiconductor. The above laser device (10) may further include a carrier for moving the above target substrate (SUB).

[0036] The laser module (LM) may be positioned outside the first chamber (CH1). For example, the laser module (LM) may be positioned at the bottom of the first chamber (CH1). The laser module (LM) may process the target substrate (SUB) by irradiating the laser beam (L) toward the target substrate (SUB) (e.g., upward). The laser beam (L) irradiated from the laser module (LM) may pass through the chamber window (CW) and the protective window (PW) and be irradiated onto one side (e.g., bottom) of the target substrate (SUB). The target substrate (SUB) may be processed by the laser beam (L). The laser module (LM) may be composed of one or more than two units depending on the width of the target substrate (SUB) to be processed.

[0037] The laser module (LM) may include a laser light source (LS) and a scanner (SCN). The laser light source (LS) may generate the laser beam (L). The scanner (SCN) may adjust the irradiation position of the laser beam (L). Additionally, although not shown in the drawings, the laser module (LM) may include a laser unit, a lens, a mirror, a beam expander, a filter, etc.

[0038] The chamber window (CW) may be positioned on one side of the first chamber (CH1). For example, the chamber window (CW) may be positioned on one side (e.g., the bottom) of the first chamber (CH1) adjacent to the laser module (LM). The chamber window (CW) can transmit the laser beam (L) irradiated from the laser module (LM). Accordingly, the chamber window (CW) may be made of a transparent material (e.g., quartz). The laser beam (L) irradiated from the laser module (LM) positioned outside the first chamber (CH1) can enter the interior of the first chamber (CH1) through the chamber window (CW).

[0039] The chamber window (CW) may be positioned between the laser module (LM) and the target substrate (SUB). That is, the chamber window (CW) may be positioned to overlap the laser module (LM) and the target substrate (SUB).

[0040] The protective window (PW) is positioned inside the first chamber (CH1) and may be located between the target substrate (SUB) and the chamber window (CW). That is, the protective window (PW) may be positioned to overlap the chamber window (CW) and the target substrate (SUB). For example, the protective window (PW) may be positioned above the chamber window (CW) and below the target substrate (SUB).

[0041] The above protective window (PW) can transmit the laser beam (L) that has entered the interior of the first chamber (CH1) through the chamber window (CW). Therefore, the protective window (PW) may be made of a transparent material. Thus, the laser beam (L) that has passed through the chamber window (CW) may pass further through the protective window (PW) and be irradiated onto the lower surface of the target substrate (SUB). For example, the protective window (PW) may be made of the same material as the chamber window (CW).

[0042] The above protective window (PW) can transmit the laser beam (L) while simultaneously preventing the chamber window (CW) from being contaminated. That is, the protective window (PW) can prevent the chamber window (CW) from being contaminated by particles (P) generated from the substrate (SUB) as laser processing of the target substrate (SUB) proceeds. The particles (P) generated from the target substrate (SUB) by the laser beam (L) may fall and accumulate on one side (e.g., the top surface) of the protective window (PW) rather than on the chamber window (CW). Accordingly, the laser device (10) can prevent the laser beam (L) from being refracted or its transmittance reduced by the accumulation of particles (P) on the chamber window (CW). In addition, the processing quality of the target substrate (SUB) can be improved. In addition, since replacement or cleaning of the chamber window (CW) is unnecessary, or the cycle of opening the first chamber (CH1) for this purpose can be extended, the processing efficiency of the laser device (10) can be improved.

[0043] The above protection window (PW) may be composed of one or two or more. For example, if the target substrate (SUB) to be etched has a large area, the protection window (PW) may be composed of multiple relatively small areas. As another example, it may be composed of one protection window (PW) with a relatively large area corresponding to the area of ​​the target substrate (SUB).

[0044] The sensor (SS) may be located above the protective window (PW). The sensor (SS) may be located opposite the upper surface of the protective window (PW). The sensor (SS) may measure position data. The position data may be a distance (d) from a point on the upper surface of the protective window (PW).

[0045] The above driving module (MM) can move the sensor (SS). The driving module (MM) may include a first driving module (MM1) and a second driving module (MM2). The first driving module (MM1) can move the sensor (SS) in a first direction (DR1) (e.g., Y direction). The second driving module (MM2) can move the sensor in a second direction (DR2) (e.g., X direction). The second direction (DR2) may intersect with the first direction (DR1). Accordingly, the sensor (SS) can be moved through the driving module (MM) to a position that overlaps with the protective window (PW).

[0046] For example, the second driving module (MM2) may move along the first driving module (MM1) in the first direction (DR1). Additionally, the sensor (SS) may move along the second driving module (MM2) in the second direction (DR2). However, embodiments according to the present invention are not limited thereto.

[0047] In one embodiment, the sensor (SS) can measure position data for each of at least two different points on the upper surface of the protective window (PW). For example, the sensor (SS) can measure position data for each of four points on the upper surface of the protective window (PW). However, embodiments according to the present invention are not limited thereto.

[0048] Each of the above points to be measured may be referred to as a measurement point (MP). The driving module (MM) may move the sensor (SS) to each of the above measurement points (MP). The sensor (SS) may measure the position data by moving as many times as the number of above measurement points (MP). The sensor (SS) may measure the position data while overlapping with each of the above measurement points (MP).

[0049] The sensor (SS) can measure the vertical distance from the sensor (SS) to the measurement point (MP) of the protective window (PW). That is, the position data may be the vertical distance in a third direction (DR3) from the sensor (SS) to the measurement point (MP) of the protective window (PW). The third direction (DR3) (e.g., Z direction) may be orthogonal to the first direction (DR1) and the second direction (DR2).

[0050] However, embodiments according to the present invention are not limited thereto, and in one embodiment, when the protective window (PW) is not placed between the sensor (SS) and the chamber window (CW), the sensor (SS) may measure the distance from the sensor (SS) to a point on the upper surface of the chamber window (CW). In this case, the position data may be the vertical distance in the third direction (DR3) from the sensor (SS) to the upper surface of the chamber window (CW).

[0051] The above control unit (CTR) can be connected to the sensor (SS) and can be connected to the scanner (SCN) of the laser module (LM). The above control unit (CTR) can control the irradiation position of the laser beam (L) using the position data of the protective window (PW).

[0052] The control unit (CTR) can receive position data of the measurement points (MP) of the protective window (PW) from the sensor (SS). The control unit (CTR) can calculate the flatness of the upper surface of the protective window using the position data.

[0053] The control unit (CTR) can generate flatness data by calculating the flatness of the upper surface. The control unit (CTR) can control the irradiation position of the laser beam (L) using the flatness data. Specifically, the control unit (CTR) can calculate correction data for the irradiation position of the laser beam (L) using the flatness data. The scanner (SCN) can adjust the irradiation position of the laser beam (L) using the correction data.

[0054] The laser device (10) may further include a second chamber (CH2) disposed on one side of the first chamber (CH1). The second chamber (CH2) may be a space for storing uncontaminated replacement protective windows (PW'). For example, the second chamber (CH2) may have a vacuum state.

[0055] The above replacement module (RM) can replace the protection window (PW). The protection window (PW) may become contaminated by the laser processing of the target substrate (SUB) inside the first chamber (CH1) (e.g., when particles (P) accumulate on the protection window (PW) in amounts exceeding a reference value). At this time, the replacement module (RM) can move the contaminated protection window (PW) to the second chamber (CH2). In the second chamber (CH2), the contaminated protection window (PW) can be replaced with the replacement protection window (PW'). The replaced protection window (PW') is transferred to the first chamber (CH1) by the replacement module (RM), and laser processing of the target substrate (SUB) can be performed again. Accordingly, the refraction or reduction in transmittance of the laser beam (L) caused by the particles (P) accumulated on the protection window (PW) can be prevented.

[0056] In one embodiment, the processing quality of the laser device (10) can be guaranteed by including the sensor (SS) for measuring the position data of the protective window (PW) and the control unit (CTR) for controlling the irradiation position of the laser beam (L). That is, even when the protective window (PW) is tilted, the degree of error in the irradiation position of the laser beam (L) can be detected in advance during the laser processing. Even when the protective window (PW) is tilted, the irradiation position of the laser beam (L) can be corrected. Accordingly, the processing quality of the laser device (10) can be improved.

[0057] FIGS. 5 to 21 are drawings for explaining a laser processing method according to an embodiment of the present invention. For example, the laser processing method according to FIGS. 5 to 21 may be a processing method using the laser device (10) according to FIGS. 1 to 4. Accordingly, any description of the laser processing method described with reference to FIGS. 5 to 21 that overlaps with the description of the laser device (10) described with reference to FIGS. 1 to 4 may be omitted.

[0058] FIGS. 5 and FIGS. 6 are structural diagrams of a laser device (10) for explaining a laser processing method according to one embodiment of the present invention.

[0059] Referring to FIG. 5, the contaminated protective window (PW') can be replaced by a replacement protective window (PW'') in the second chamber (CH2) by a replacement module (RM). The replaced protective window (PW) can be positioned in the first chamber (CH1) containing the chamber window (CW) so as to overlap with the chamber window (CW).

[0060] Referring to FIG. 6, if the replaced protective window (PW) is not flat, the path (LBP) of the laser beam (L) from the laser light source (LS) may differ from the reference path (RP). The reference path (RP) may be the path of the laser beam (L) when the protective window () is parallel to the chamber window (). Therefore, before proceeding with the laser process on the target substrate (SUB), the flatness of the protective window (PW) can be measured to correct the path (LBP) of the laser beam (L).

[0061] FIG. 7 is a structural diagram of a laser device (10) for explaining a laser processing method according to one embodiment of the present invention, and FIG. 8 is a top view of the laser device (10) of FIG. 7.

[0062] Referring to FIGS. 7 and 8, a driving module (MM) can move a sensor (SS). The driving module (MM) may include a first driving module (MM1) and a second driving module (MM2). The first driving module (MM1) can move the sensor (SS) in a first direction (DR1). The second driving module (MM2) can move the sensor (SS) in a second direction (DR2). For example, the second driving module (MM2) can move in the first direction (DR1) along the first driving module (MM1). Additionally, the sensor (SS) can move in the second direction (DR2) along the second driving module (MM2). However, embodiments according to the present invention are not limited thereto.

[0063] The sensor (SS) may be located above the protective window (PW). The sensor (SS) may be spaced apart from the protective window (PW) on a flat surface.

[0064] FIG. 9 is a structural diagram of a laser device (10) for explaining a laser processing method according to one embodiment, and FIG. 10 is a top view of the laser device (10) of FIG. 9. Likewise, FIG. 11 is a structural diagram of the laser device (10), and FIG. 12 is a top view of FIG. 11.

[0065] Referring to FIGS. 9 to 11, the sensor (SS) can be moved to overlap with the protective window (PW) through the driving module (MM). Accordingly, the sensor (SS) can be positioned opposite the upper surface of the protective window (PW).

[0066] FIGS. 13, FIGS. 15, and FIGS. 17 are structural diagrams of the laser device (10), and FIGS. 14, FIGS. 16, and FIGS. 18 are top-down views of the laser device (10) of FIGS. 13, FIGS. 15, and FIGS. 17, respectively.

[0067] Referring to FIGS. 11 to 18, position data can be measured using the sensor (SS). The position data may represent the distance from a point on the upper surface of the protective window (PW) to the sensor (SS) (e.g., distance (d) in FIG. 3). That is, the position data may be the vertical distance in the third direction (DR3) from the sensor (SS) to the measurement point (MP) of the protective window (PW).

[0068] The sensor (SS) can measure position data for each of at least two different points on the upper surface of the protective window (PW). For example, the sensor (SS) can measure position data for each of four points on the upper surface of the protective window (PW). However, embodiments according to the present invention are not limited thereto.

[0069] Each of the above points being measured may be referred to as a measurement point (MP). For example, the measurement point (MP) may consist of first to fourth measurement points (MP1, MP2, MP3, MP4). The first to fourth measurement points (MP1, MP2, MP3, MP4) may be located at the four corners of the upper surface of the protective window (PW). However, embodiments according to the present invention are not limited thereto.

[0070] The driving module (MM) can move the sensor (SS) to each of the first to fourth measurement points (MP1, MP2, MP3, MP4). The sensor (SS) can measure the position data by moving as many times as the number of measurement points (MP). For example, the sensor (SS) can measure the position data of each of the four first to fourth measurement points (MP1, MP2, MP3, MP4). The sensor (SS) can measure the position data while overlapping with each of the measurement points (MP).

[0071] Referring to FIGS. 11 and 12, the driving module (MM) can move the sensor (SS) onto the first measurement point (MP1). The sensor (SS) can measure the vertical distance (d1) from the first measurement point (MP1) to the sensor (SS).

[0072] Referring to FIGS. 13 and 14, the second driving module (MM2) can move the sensor (SS) in the second direction (DR2). Thus, the sensor (SS) can be positioned on the second measurement point (MP2). Likewise, the sensor (SS) can measure the vertical distance (d2) from the second measurement point (MP2) to the sensor (SS).

[0073] Referring to FIGS. 15 and 16, the first driving module (MM1) can move the sensor (SS) in the first direction (DR1). Thus, the sensor (SS) can be positioned on the third measurement point (MP3). Likewise, the sensor (SS) can measure the vertical distance (d3) from the third measurement point (MP3) to the sensor (SS).

[0074] Referring to FIGS. 17 and 18, the second driving module (MM2) can move the sensor (SS) in the second direction (DR2). Thus, the sensor (SS) can be positioned on the fourth measurement point (MP4). Likewise, the sensor (SS) can measure the vertical distance (d4) from the fourth measurement point (MP4) to the sensor (SS).

[0075] FIGS. 19 to 21 are structural diagrams of the laser device (10) for explaining a laser processing method.

[0076] Referring further to FIG. 19, the sensor (SS) can transmit the position data for the vertical distances (d1, d2, d3, d4) from the first to fourth measurement points (MP1, MP2, MP3, MP4) to the sensor (SS) to the control unit (CTR).

[0077] The control unit (CTR) can generate flatness data of the upper surface of the protective window (PW) using the position data. Specifically, the control unit (CTR) can receive the position data and calculate the flatness of the upper surface of the protective window (PW).

[0078] Referring further to FIG. 20, the control unit (CTR) can control the irradiation position of the laser beam (L) using the flatness data. The irradiation position of the laser beam (L) may refer to the position where the laser beam (L) reaches the target substrate (SUB). That is, the control unit (CTR) can control the irradiation path of the laser beam (L).

[0079] The control unit (CTR) above can generate correction data for the laser irradiation position using the flatness data. The correction data for the laser irradiation position (hereinafter, correction data) may refer to data that corrects the irradiation position of the laser beam (L) to be the same as the reference irradiation position. The reference irradiation position may be the irradiation position of the laser beam (L) when the protective window (PW) is not tilted and is parallel to the chamber window (CW).

[0080] Referring further to FIG. 21, the scanner (SCN) can adjust the irradiation position of the laser beam (L) based on the correction data. That is, the control unit (CTR) can control the irradiation position of the laser beam (L) using the scanner (SCN). Thus, the path (LBP) of the laser beam (L) can be corrected to be the same as the reference path (RP). Thus, the corrected path (LBP') of the laser beam (L) after passing through the protective window (PW) can be the same as the reference path (RP). Therefore, even when the protective window (PW) is tilted, the irradiation position of the laser beam (L) can be corrected, and as a result, the processing quality of the laser device (10) can be improved.

[0081] After the irradiation position of the laser beam (L) is corrected, the target substrate (SUB) can be placed inside the first chamber (CH1). The laser module (LM) can laser process the target substrate (SUB) by irradiating the corrected laser beam (L) through the chamber window (CW) and the protection window (PW).

[0082] In one embodiment, the flatness is calculated by measuring the position data of the protective window (PW), and the irradiation position of the laser beam (L) is controlled thereby, so that the processing quality of the laser device (10) can be guaranteed. Even when the protective window (PW) is tilted, the degree of error in the irradiation position of the laser beam (L) can be detected in advance during the laser processing, and the irradiation position of the laser beam (L) can be corrected through this. Accordingly, the processing quality of the laser device (10) can be improved.

[0083] FIGS. 22 to 26 are drawings illustrating a laser processing method according to another embodiment of the present invention. Among the laser processing methods described with reference to FIGS. 22 to 26, descriptions that overlap with the laser processing methods described with reference to FIGS. 5 to 21 may be omitted.

[0084] Referring to FIG. 22, a first protective window (PW1) may be placed within a first chamber (CH1) that includes a chamber window (CW) so as to overlap with said chamber window (CW). A driving module (MM) may move a sensor (SS) so as to overlap with said first protective window (PW1). The sensor (SS) may measure reference data on the upper surface of said first protective window (PW1). The reference data may represent a distance (Rd) from said sensor (SS) to a point on the upper surface of said first protective window (PW1).

[0085] At this time, the first protective window (PW1) overlaps with the chamber window (CW) and can be positioned parallel to the chamber window (CW).

[0086] Referring further to FIG. 23, a target substrate (SUB) may be placed in the first chamber (CH1), and the target substrate (SUB) may be laser processed by irradiating it with a laser beam (L).

[0087] Referring further to FIG. 24, if the first protective window (PW1) becomes contaminated as the laser processing proceeds, the first protective window (PW1) can be replaced with a second protective window (PW2).

[0088] After replacing the first protective window (PW1) with the second protective window (PW2) for replacement, the sensor (SS) can be moved to overlap with the second protective window (PW2). Using the sensor (SS), position data can be measured, which is the distance from the sensor (SS) to a point on the upper surface of the second protective window (PW2) or the upper surface of the chamber window (CW).

[0089] The sensor (SS) can measure position data of the upper surface of the second protective window (PW2) or the upper surface of the chamber window (CW) facing the sensor (SS). For example, if the second protective window (PW2) is located between the sensor (SS) and the chamber window (CW), the upper surface of the second protective window (PW2) may face the sensor (SS). Therefore, the sensor (SS) can measure position data of the upper surface of the second protective window (PW2) (see, for example, FIG. 27). As another example, if an error occurs during the replacement of the second protective window (PW2) and the second protective window (PW2) is not located between the sensor (SS) and the chamber window (CW), the upper surface of the chamber window (CW) may face the sensor (SS). Accordingly, the sensor (SS) can measure position data of the upper surface of the chamber window (CW) (see FIG. 25).

[0090] Referring to FIGS. 25 and 26, the sensor (SS) can transmit the position data to the control unit (CTR). The control unit (CTR) can determine the placement state and contamination state of the second protection window (PW2) using the reference data and the position data. For example, determining the placement state of the second protection window (PW2) may involve the control unit (CTR) determining, based on the position data, whether the second protection window (PW2) is positioned to overlap with the chamber window (CW) (e.g., see FIG. 25). Additionally, determining the contamination state of the second protection window (PW2) may involve the control unit (CTR) determining the degree of particles (P) loaded on the second protection window (PW2) based on the position data (e.g., see FIG. 27).

[0091] Referring to FIG. 25, the sensor (SS) can transmit the position data to the control unit (CTR). Based on the position data, the control unit (CTR) can determine whether the second protection window (PW2) is positioned to overlap with the chamber window (CW).

[0092] For example, if the second protection window (PW2) does not overlap with the chamber window (CW), the position data may be the distance (d') from the sensor (SS) to a point on the upper surface of the chamber window (CW). The control unit (CTR) may compare the reference data with the position data. If the position data, the distance (d') from the sensor (SS) to a point on the upper surface of the chamber window (CW), is about 5% greater than the reference data, the straight-line distance (Rd) from the sensor (SS) to a point on the upper surface of the first protection window (PW1), the control unit (CTR) may determine that the second protection window (PW2) does not overlap with the chamber window (CW).

[0093] Referring further to FIG. 26, if the second protective window (PW2) does not overlap with the chamber window (CW), the control unit (CTR) can stop the irradiation of the laser beam (L) to prevent contamination of the chamber window (CW).

[0094] In addition, since the second protection window (PW2) serves to protect the chamber window (CW) from the particles (P), if the second protection window (PW2) does not overlap with the chamber window (CW), the control unit (CTR) can move the second protection window (PW2) to overlap with the chamber window (CW).

[0095] In one embodiment, by determining the arrangement state of the second protection window (PW2) and overlapping the position of the second protection window (PW2) with the chamber window (CW), contamination of the chamber window (CW) can be prevented.

[0096] FIGS. 27 and 28 are drawings illustrating a laser processing method according to another embodiment of the present invention. Among the laser processing methods described with reference to FIGS. 27 and 28, descriptions that overlap with the laser processing methods described with reference to FIGS. 22 to 26 may be omitted.

[0097] Referring to FIGS. 22, 23, 24 and 27, the sensor (SS) can measure reference data on the upper surface of the first protective window (PW1). The reference data may represent the distance (Rd) from the sensor (SS) to a point on the upper surface of the first protective window (PW1).

[0098] The sensor (SS) can measure position data of the upper surface of the second protective window (PW2) or the upper surface of the chamber window (CW) facing the sensor (SS). For example, if the second protective window (PW2) is located between the sensor (SS) and the chamber window (CW), the upper surface of the second protective window (PW2) may face the sensor (SS). Accordingly, the sensor (SS) can measure position data of the upper surface of the second protective window (PW2).

[0099] The sensor (SS) can transmit the position data to the control unit (CTR). The control unit (CTR) can determine the placement status and contamination status of the second protection window (PW2) using the reference data and the position data.

[0100] Determining the contamination state of the second protection window (PW2) may involve the control unit (CTR) determining the degree of particles (P) loaded on the second protection window (PW2) based on the position data.

[0101] When the second protection window (PW2) overlaps with the chamber window (CW), the position data may be the distance (d'') from the sensor (SS) to a point on the upper surface of the second protection window (PW2). During the laser processing, the second protection window (PW2) may be contaminated by particles (P) falling from the target substrate (SUB). Consequently, the particles (P) may accumulate on the second protection window (PW2). Therefore, the second protection window (PW2) may have a thicker thickness than when it is not contaminated. Consequently, due to the thickness caused by the accumulation of particles (P), the position data may be smaller than the reference data. If the second protection window (PW2) is contaminated by the particles (P), the degree of processing by the laser beam (L) decreases, so the second protection window (PW2) may be replaced.

[0102] The control unit (CTR) can compare the reference data and the position data. If the distance (d'') from the sensor (SS), which is the position data, to a point on the upper surface of the second protection window (PW2) is about 1% or more smaller than the distance (Rd) from the sensor (SS), which is the reference data, to a point on the upper surface of the first protection window (PW1), the control unit (CTR) can replace the second protection window (PW2).

[0103] Referring further to FIG. 28, the control unit (CTR) can replace the second protection window (PW2) with a replacement third protection window (PW3) through a replacement module (RM).

[0104] In one embodiment, by determining the contamination state of the second protective window (PW2) and replacing the second protective window (PW2), the degree of processing of the target substrate (SUB) by the laser beam (L) can be guaranteed, and the processing quality of the laser device (10) can be improved. Industrial applicability

[0105] A laser device according to exemplary embodiments of the present invention can be applied to a display device including a computer, laptop, mobile phone, smartphone, smartpad, PMP, PDA, MP3 player, etc.

[0106] Although the present invention has been described above with reference to embodiments thereof, those skilled in the art will understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the invention as described in the following claims. Explanation of the symbols

[0107] 10: Laser device CH1: First chamber CH2: 2nd Chamber CTR: Control Unit CW: Chamber Window LM: Laser Module MM: Drive Module PW: Protection Window SCN: Scanner SS: Sensor SUB: Target board RM: Replacement module

Claims

Claim 1 A laser device comprising: a chamber in which a target substrate is processed; a chamber window disposed on one side of the chamber; a laser module disposed outside the chamber and processing the target substrate by irradiating a laser beam onto the target substrate through the chamber window; a protective window located between the target substrate and the chamber window; a sensor located opposite the upper surface of the protective window and measuring position data, which is a distance from a point on the upper surface of the protective window; and a control unit connected to the sensor, which generates flatness data of the upper surface of the protective window using the position data of the protective window and corrects the path of the laser beam irradiated using the flatness data. Claim 2 A laser device according to claim 1, further comprising a driving module for moving the sensor in a first direction and in a second direction intersecting the first direction. Claim 3 A laser device according to claim 1, characterized in that the sensor measures position data of each of at least two different points on the upper surface of the protective window. Claim 4 A laser device according to claim 1, wherein when the path of the laser beam is defined as a reference path when the protective window and the chamber window are parallel, the control unit corrects the path of the laser beam after passing through the protective window to be the same as the reference path. Claim 5 A laser device according to claim 1, wherein the laser module comprises a laser light source that generates the laser beam and a scanner that adjusts the irradiation position of the laser beam. Claim 6 delete Claim 7 A laser device according to claim 5, wherein the control unit calculates correction data of the path where the laser beam is irradiated. Claim 8 A laser device according to claim 7, wherein the scanner adjusts the path along which the laser beam is irradiated using the correction data. Claim 9 A laser processing method comprising: a step of replacing a protective window positioned to overlap with the chamber window within a chamber including a chamber window; a step of moving a sensor spaced apart from the protective window on a plane to overlap with the protective window; a step of measuring position data, which is the distance from the sensor to a point on the upper surface of the protective window, using the sensor; a step of generating flatness data of the upper surface of the protective window using the position data; a step of controlling the irradiation position of a laser beam using the flatness data; a step of placing a target substrate within the chamber; and a step of laser processing the target substrate by irradiating the laser beam through the chamber window and the protective window. Claim 10 A laser processing method according to claim 9, wherein the step of measuring the position data comprises the step of measuring the position data of each of at least two different points on the upper surface of the protective window. Claim 11 A laser processing method according to claim 9, wherein the step of generating the flatness data includes the step of calculating the flatness of the upper surface of the protective window using the position data. Claim 12 A laser processing method according to claim 11, wherein the step of controlling the irradiation position of the laser beam comprises the step of generating correction data for the irradiation position of the laser beam using the flatness data. Claim 13 A laser processing method according to claim 12, wherein the step of controlling the irradiation position of the laser beam includes the step of adjusting the irradiation position of the laser beam based on the correction data. Claim 14 A laser processing method comprising: a step of placing a first protective window within a chamber including a chamber window so as to overlap with said chamber window; a step of measuring reference data, which is the distance from said sensor to a point on the upper surface of said first protective window, using a sensor; a step of placing a target substrate within said chamber; a step of laser processing said target substrate by irradiating a laser beam through said chamber window and said first protective window; a step of replacing said first protective window with a second protective window; a step of measuring position data, which is the distance from said sensor to a point on the upper surface of said second protective window or the upper surface of said chamber window opposite to said sensor, using said sensor; and a step of determining the placement state or contamination state of said second protective window using said reference data and said position data. Claim 15 A laser processing method according to claim 14, wherein the step of determining the arrangement state of the second protective window includes the step of determining whether the second protective window is positioned to overlap with the chamber window. Claim 16 A laser processing method according to claim 15, wherein, when the second protective window does not overlap with the chamber window, the position data is the distance from the sensor to a point on the upper surface of the chamber window. Claim 17 A laser processing method according to claim 15, further comprising the step of stopping the irradiation of the laser beam when the second protective window does not overlap with the chamber window after the step of determining the arrangement state of the second protective window. Claim 18 A laser processing method according to claim 14, wherein the step of determining the contamination state of the second protective window includes the step of determining the degree of particles loaded on the second protective window. Claim 19 A laser processing method according to claim 18, characterized in that the above position data is the distance from the sensor to a point on the upper surface of the second protective window. Claim 20 A laser processing method according to claim 18, further comprising the step of replacing the second protective window with a third protective window if, after the step of determining the contamination state of the second protective window, the position data is 1% or more smaller than the reference data.

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