Substrate processing apparatus and operational state monitoring method

Abstract

The present disclosure aims to provide a technology that can reliably verify the operating state of a gripping part. A substrate processing device comprises a holding unit capable of holding the substrate by gripping the periphery of the substrate at multiple positions, a rotating unit for rotating the holding unit, and a control unit for controlling the holding unit and the rotating unit. The holding unit includes a rotating plate that is rotated by the rotating unit, a first gripping unit that rotates together with the rotating plate and is movable between a gripping position that grips the periphery of the substrate and a release position that releases the substrate, and a second gripping unit that rotates together with the rotating plate and is movable between a gripping position and a release position independently of the first gripping unit. The substrate processing device has a detection unit that, during the rotation of the rotating unit, non-contactually detects the state in which the first gripping unit and the second gripping unit are located at the gripping position and the state in which they are located at the release position, respectively, using a sensor. The control unit determines the operating state of the first gripping unit or the second gripping unit based on the detection signal of the sensor.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus and a method for monitoring operating status. Background Technology

[0002] Patent Document 1 discloses a substrate processing apparatus that holds a wafer by a substrate holding mechanism, rotates the wafer, and supplies a processing liquid to the wafer during this rotation. The substrate holding mechanism is provided with three holding members (grip members) along the circumferential direction, and holds the wafer by each holding member contacting the periphery of the wafer.

[0003] In addition, the substrate processing device determines the state of wafer retention by each retention member based on the detection result of contact or non-contact of a contact-type sensor installed to contact each retention member when the wafer rotation stops. Prior art literature

[0004] Japanese Patent Publication No. 4819010 The problem to be solved

[0005] The present disclosure provides a technology that can reliably verify the operating state of a gripping part during rotation of the gripping part. means of solving the problem

[0006] According to one aspect of the present disclosure, a substrate processing apparatus is provided, comprising a holding portion capable of holding the periphery of a substrate at a plurality of positions and holding the substrate, a rotating portion for rotating the holding portion, and a control portion for controlling the holding portion and the rotating portion. The holding portion includes a rotating plate that is rotated by the rotating portion, a first holding portion that rotates together with the rotating plate and is movable between a holding position for holding the periphery of the substrate and a release position for releasing the substrate, and a second holding portion that rotates together with the rotating plate and is movable between the holding position and the release position independently of the first holding portion. During the rotation of the rotating portion, the apparatus has a detection portion that non-contactually detects the state of being located at the holding position and the state of being located at the release position for each of the first holding portion and the second holding portion by means of a sensor. The control portion determines the operating state of the first holding portion or the second holding portion based on the detection signal of the sensor. Effects of the invention

[0007] According to one embodiment, the substrate processing device can stably check the operating state of the gripping part during rotation of the gripping part. Brief explanation of the drawing

[0008] FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to one embodiment. Figure 2 is a partial enlarged view of Figure 1. FIG. 3 is a cross-sectional view showing a retaining part according to one embodiment, where (A) is a cross-sectional view showing the gripping position of the first gripping part and (B) is a cross-sectional view showing the release position of the first gripping part. FIG. 4 is a plan view showing an example of movement of the first gripping part and the second gripping part, where (A) is a plan view showing a state where both are in the release position, and (B) is a plan view showing a state where one side is in the gripping position and the other side is in the release position. FIG. 5 is a plan view showing an example of movement of the first gripping part and the second gripping part, where (A) is a plan view showing a state where both are in the gripping position, and (B) is a plan view showing a state where one side is in the release position and the other side is in the gripping position. Figure 6 is an enlarged perspective view of the upper part of the fiber sensor. Figure 7 is an explanatory diagram showing the detection signal of the fiber sensor. Figure 8 is an explanatory diagram showing limit setting values ​​for detecting abnormalities in a fiber sensor. Figure 9 is a block diagram showing the functions of the main controller. Figure 10 is a schematic diagram showing the operating state of the gripping part. Figure 11 is a flowchart showing the processing flow of the substrate processing. Figure 12 is a flowchart showing the processing flow of the operation status monitoring method. Specific details for implementing the invention

[0009] Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant descriptions may be omitted. Furthermore, in this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

[0010] As illustrated in FIGS. 1 and 2, the substrate processing device (10) is a device that processes the substrate (W) by supplying a processing solution to the substrate (W). The substrate (W) may be, for example, a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. A conductive film or an insulating film, etc., is formed on the surface of the semiconductor substrate or glass substrate, etc. The substrate (W) may be a laminated substrate with multiple films. In addition, an electronic circuit including a device, an uneven pattern (not shown), etc., may be provided on the upper surface (Wa) or lower surface (Wb) of the substrate (W).

[0011] The substrate processing device (10) is equipped with a holding part (20), a rotating part (40), a first liquid supply part (50), a second liquid supply part (60), a third liquid supply part (70), a cup (80), and a control part (90).

[0012] The holding member (20) holds the substrate (W) horizontally. The holding member (20) includes a rotatable rotating plate (21) and a plurality of gripping members (22) [first gripping member (22A), second gripping member (22B)] that grip the periphery of the substrate (W). The first gripping member (22A) and the second gripping member (22B) rotate integrally with the rotating plate (21) while gripping the substrate (W).

[0013] The rotating plate (21) is formed in a disc shape having a surface parallel to the horizontal direction (X-axis-Y-axis direction). The rotating plate (21) has a hole in the center, and the liquid supply shaft (72) of the third liquid supply unit (70) is disposed in this hole. In addition, the substrate processing device (10) has a plurality of lift pins and a lift pin lifting mechanism for raising and lowering each lift pin on the lower side of the rotating plate (21) (not all shown).

[0014] The gripping portion (22) is located above the rotating plate (21) and holds the substrate (W) while spaced apart from the rotating plate (21). In this embodiment, six gripping portions (22) are arranged spaced apart along the circumferential direction of the rotating plate (21) [see FIG. 4 (A) to FIG. 5 (B)]. Three of the six gripping portions (22) are first gripping portions (22A), and the other three are second gripping portions (22B). The three first gripping portions (22A) and the three second gripping portions (22B) are arranged alternately along the circumferential direction of the rotating plate (21).

[0015] The number of first gripping parts (22A) may be three or more, for example, four. Each first gripping part (22A) is installed at equal intervals (120° intervals) along the circumferential direction of the rotating plate (21), thereby allowing the load applied to the substrate (W) to be evenly distributed when the substrate (W) is held. The number of second gripping parts (22B) may also be three or more, for example, four. Each second gripping part (22B) is arranged at equal intervals (120° intervals) along the circumferential direction of the rotating plate (21), thereby allowing the load applied to the substrate (W) to be evenly distributed when the substrate (W) is held.

[0016] As illustrated in FIG. 1, the rotating part (40) of the substrate processing device (10) rotates the holding part (20). The rotating part (40) includes a rotating shaft (41) extending downward from the center of the rotating plate (21) of the holding part (20), a rotating motor (42) that rotates the rotating shaft (41), and a belt (43) that transmits the rotational driving force of the rotating motor (42) to the rotating shaft (41). The rotating shaft (41) is formed in a cylindrical shape, and a liquid supply shaft (72) is arranged inside it to follow the vertical direction (Z-axis direction). The axis of the rotating shaft (41) and the rotation center of the rotating plate (21) coincide with each other.

[0017] The first liquid supply unit (50) supplies a processing liquid to the upper surface (Wa) of a substrate (W) held in the holding unit (20). The first liquid supply unit (50) has, for example, a nozzle (51) for discharging the processing liquid, a moving mechanism (52) for moving the nozzle (51), and a supply line (53) for supplying the processing liquid to the nozzle (51). The nozzle (51) is installed above the holding unit (20) and discharges the processing liquid downward toward the substrate (W) held in the holding unit (20).

[0018] The supply line (53) includes, for example, a common line (53a) and a plurality of individual lines (53b) connected to the common line (53a). The individual lines (53b) are installed for each type of treatment liquid. Examples of treatment liquids include chemical liquids and rinse liquids. The chemical liquid may be acidic, alkaline, or neutral. Acidic chemical liquids include, for example, DHF (dilute hydrofluoric acid). Alkaline chemical liquids include, for example, SC1 (an aqueous solution containing hydrogen peroxide and ammonium hydroxide). Neutral chemical liquids include, for example, functional water such as ozone water. Rinse liquids include, for example, DIW (deionized water). In the middle of the individual lines (53b), an opening / closing valve (55) for opening and closing the flow path of the treatment liquid and a flow controller (56) for controlling the flow rate of the treatment liquid are installed.

[0019] Additionally, the medicine and rinse liquid are discharged from a single nozzle (51) in FIG. 1, but may be discharged from different nozzles (51). If there are multiple nozzles (51), a supply line (53) is installed for each nozzle (51).

[0020] The second liquid supply unit (60), like the first liquid supply unit (50), supplies a processing liquid to the upper surface (Wa) of the substrate (W) held in the holding unit (20). The second liquid supply unit (60) has a nozzle (61) for discharging the processing liquid, a moving mechanism (62) for moving the nozzle (61), and a supply line (63) for supplying the processing liquid to the nozzle (61). The nozzle (61) is installed above the holding unit (20) and discharges the processing liquid downward toward the substrate (W) held in the holding unit (20).

[0021] The supply line (63) supplies the drying liquid to the nozzle (61). It is preferable to use a drying liquid that has a lower surface tension than the rinsing liquid. The drying liquid is an organic solvent, such as IPA (isopropyl alcohol). The upper surface (Wa) of the substrate (W) is dried by replacing the liquid film of the rinsing liquid with the liquid film of the drying liquid. IPA can suppress the collapse of the uneven pattern due to surface tension during the drying of the substrate (W). An opening / closing valve (65) for opening and closing the flow path of the drying liquid and a flow rate controller (66) for controlling the flow rate of the drying liquid are installed in the middle of the supply line (63).

[0022] The substrate processing device (10) according to the present embodiment moves the supply position of the rinse liquid and the supply position of the drying liquid independently so that the liquid film is not interrupted in the middle when replacing the liquid film of the rinse liquid with the liquid film of the drying liquid. Specifically, with the nozzle (61) fixed at the center of the upper surface (Wa) of the substrate (W), the nozzle (51) is positioned outward in the radial direction from the center of the substrate (W). However, depending on the dimensions and shape of the uneven pattern of the substrate (W), the material of the substrate (W), etc., the drying liquid may be discharged from the nozzle (51) of the first liquid supply unit (50). That is, the substrate processing device (10) does not need to be equipped with a second liquid supply unit (60).

[0023] Unlike the first liquid supply unit (50) and the second liquid supply unit (60), the third liquid supply unit (70) supplies a processing liquid to the lower surface (Wb) of the substrate (W) held in the holding unit (20). The third liquid supply unit (70) includes a plurality of nozzles (71A, 71B, 71C) positioned oppositely to the center of the lower surface of the substrate (W) held in the holding unit (20), and a liquid supply shaft (72).

[0024] A plurality of nozzles (71A, 71B, 71C) are formed on the upper surface of the liquid supply shaft (72) and each discharge fluid upward. Nozzle (71A) discharges, for example, a chemical solution and a rinse solution upward. Nozzle (71B) discharges, for example, a rinse solution upward. Nozzle (71C) discharges, for example, an inert gas such as N2 gas upward.

[0025] The liquid supply shaft (72) is fixed so as not to rotate within the rotating shaft (41). The liquid supply shaft (72) has a plurality of supply lines (73A, 73B, 73C) connected to each of a plurality of nozzles (71A, 71B, 71C).

[0026] The supply line (73A) selectively supplies a chemical solution and a rinse solution to the nozzle (71A). The supply line (73A) includes, for example, a common line (73Aa) and a plurality of individual lines (73Ab) connected to the common line (73Aa). The individual lines (73Ab) are installed for each type of treatment solution. In the middle of the individual lines (73Ab), an opening / closing valve (75A) for opening and closing the flow path of the treatment solution and a flow controller (76A) for controlling the flow rate of the treatment solution are installed.

[0027] Likewise, the supply line (73B) supplies rinse liquid to the nozzle (71B). In the middle of the supply line (73B), an opening / closing valve (75B) for opening and closing the flow path of the rinse liquid and a flow controller (76B) for controlling the flow rate of the rinse liquid are installed.

[0028] Additionally, the supply line (73C) supplies an inert gas, such as N2 gas, to the nozzle (71C). An opening / closing valve (75C) for opening and closing the gas flow path and a flow controller (76C) for controlling the gas flow rate are installed in the middle of the supply line (73C).

[0029] The cup (80) is formed in a container shape (concave shape) to recover various processing liquids supplied to the substrate (W). The cup (80) includes a cylindrical part (81) located outside the rotating plate (21), a bottom cover part (82) blocking the bottom of the cylindrical part (81), and an inclined part (83) formed on the upper part of the cylindrical part (81). Additionally, the cup (80) is provided with a drain pipe (84) for discharging processing liquid stored inside and an exhaust pipe (85) for discharging gas stored inside the cup (80) on the bottom cover part (82). The cup (80) is configured so as not to rotate together with the rotating plate (21) by being fixed to a suitable member of the substrate processing device (10).

[0030] Next, the operating mechanism of the holding part (20), each first gripping part (22A) and each second gripping part (22B) will be explained with reference to FIG. 2 and FIG. 3.

[0031] The holding unit (20) operates three first gripping units (22A) and three second gripping units (22B) independently of each other. For each of the three first gripping units (22A), the holding unit (20) has a first driving unit (23A) and a first transmission unit (24A) that transmits the driving force of the first driving unit (23A) to the first gripping unit (22A). Each first driving unit (23A) and each first transmission unit (24A) can rotate integrally with the rotating plate (21).

[0032] Each first driving unit (23A) includes a slider (25), a spring (26) disposed on the inner side in the diametrical direction of the slider (25), a cylinder (27) that accommodates the slider (25), a pressure adjusting mechanism (28) that adjusts the pressure within the cylinder (27), and a rod (29) fixed to the slider (25).

[0033] The slider (25) is received in a cylinder (27) so as to be reciprocally movable along the diameter direction of the rotating plate (21). The slider (25) is pressed outward in the diameter direction of the rotating plate (21) by a spring (26). Additionally, the slider (25) can be moved outward in the diameter direction of the substrate (W) by centrifugal force during the rotation of each first driving unit (23A) by the rotating plate (21).

[0034] The spring (26) has its base fixed to the bottom part (end of the rotation center side) of the cylinder (27) and elastically extends and retracts along the axial direction of the cylinder (27).

[0035] The cylinder (27) is fixed so that its axis follows the diameter direction of the rotating plate (21) and guides the slider (25) housed in its internal space. The internal space of the cylinder (27) is divided into a first chamber (R1) and a second chamber (R2) by the slider (25). The first chamber (R1) is located on the outer side of the cylinder (27) in the diameter direction and is sealed by the structure of the slider (25), the cylinder (27), and the rod (29). The pressure of the first chamber (R1) is adjusted by a pressure adjustment mechanism (28). The second chamber (R2) is open to the outside and its pressure is maintained at external atmospheric pressure. A spring (26) is placed in the second chamber (R2) in an elastically deformed and compressed state. The spring (26) presses the slider (25) outward in the diameter direction of the rotating plate (21) by its restoring force.

[0036] A pressure regulating mechanism (28) for adjusting the pressure of the first chamber (R1) has a connection line (L) connected to the first chamber (R1), and a boost line (28a) and a depressurization line (28b) connected to the connection line (L). The connection line (L) is composed of, for example, a flow path formed inside a rotating plate (21) and a rotating shaft (41), and an external pipe connected to the rotating shaft (41) through a rotary joint not shown.

[0037] The boost line (28a) is a path for increasing the pressure of the first chamber (R1). The boost line (28a) is equipped with an opening / closing valve (V1), a flow controller (F1), and a pressure controller (P1). The opening / closing valve (V1) opens and closes the flow path of the boost line (28a). The flow controller (F1) controls the flow rate of a fluid, such as air, supplied to the first chamber (R1) when the pressure of the first chamber (R1) is increased. The pressure controller (P1) controls the pressure when the pressure of the first chamber (R1) is increased.

[0038] Additionally, the pressure reduction line (28b) is a path for reducing the pressure of the first chamber (R1). The pressure reduction line (28b) is equipped with an opening / closing valve (V2), a flow controller (F2), and a pressure controller (P2). The opening / closing valve (V2) opens and closes the flow path of the pressure reduction line (28b). The flow controller (F2) controls the flow rate of a fluid, such as air, discharged from the first chamber (R1) when the pressure of the first chamber (R1) is reduced. The pressure controller (P2) controls the pressure when the pressure of the first chamber (R1) is reduced.

[0039] Meanwhile, the rod (29) of the first drive unit (23A) extends outward in the radial direction from the slider (25) and protrudes from the cylinder (27) by penetrating the first seal (R1) of the cylinder (27). The longitudinal direction of the rod (29) follows the direction of movement of the slider (25).

[0040] The first transmission unit (24A) has a link (30) connecting the rod (29) of the first driving unit (23A) and the first gripping unit (22A). The inner end of the link (30) and the protruding end of the rod (29) are connected to each other so as to be freely rotatable by a first pin (31). The outer end of the link (30) and the end of the first gripping unit (22A) are connected to each other so as to be freely rotatable by a second pin (32). The link (30) rotates around the first pin (31) according to the advance and retreat of the rod (29), and the position changes to an inclined position and a lateral position along the horizontal direction. As the position changes, the outer end of the link (30) is displaced in the vertical direction (Z-axis direction), thereby operating the first gripping unit (22A).

[0041] The first gripping part (22A) is an L-shaped member when viewed from the side, formed integrally with a connection part (221) connected to the first transmission part (24A) [link (30)] and a contact part (222) extending in a different direction from the connection part (221). A third pin (33) is inserted into the first gripping part (22A) at the connection point between the connection part (221) and the contact part (222). The third pin (33) is fixed to the rotating plate (21). Because of this, the first gripping part (22A) can rotate around the third pin (33).

[0042] At the connection portion (221), the end located opposite the third pin (33) is formed as a connecting end (222e) that is rotatably connected to the link (30) through the second pin (32). As described above, since the outer end of the link (30) moves up and down according to the movement of the rod (29), this operating force is transmitted, causing the connecting end (221e) to also be displaced between the lower value (LP) and the upper value (HP).

[0043] Additionally, the periphery of the connecting end (221e) is formed as a block shape protruding slightly downward in the vertical direction, and a reflector (221r) is installed on its lower surface. The reflector (221r) has a flat reflective surface (221rs) facing downward in the vertical direction and reflects light from the fiber sensor (36) described later. The reflector (221r) is made of a material and structure that has a higher specular reflectivity than the rotating plate (21). When the connecting end (221e) is in the lower position (LP), the reflective surface (221rs) of the reflector (221r) is positioned parallel in the horizontal direction [a direction perpendicular to the optical axis of the fiber sensor (36)]. Meanwhile, the reflective surface (221rs) of the reflector (221r) is inclined with respect to the horizontal direction [a direction perpendicular to the optical axis of the fiber sensor (36)] when the connecting end (221e) is at the upper position (HP).

[0044] Meanwhile, regarding the contact portion (222), the end portion located opposite to the third pin (33) is formed as a contact portion (222e) having an inner surface that directly contacts the substrate (W). In this embodiment, the inner surface of the contact portion (222e) is flat, but it may take an appropriate shape (concave, stepped, etc.) depending on the shape of the periphery of the substrate (W). This contact portion (222e) is moved in an arc shape according to the rotation of the first gripping portion (22A), thereby being displaced to a gripping position (CP) that grips the substrate (W) and a release position (UP) that releases the substrate (W).

[0045] Specifically, when the connecting end (221e) of the connection part (221) is positioned at the lower position (LP), the contact part (222) moves inward in the diameter direction of the rotating plate (21), and the contact end (222e) is positioned at the gripping position (CP). Conversely, when the connecting end (221e) of the connection part (221) is positioned at the upper position (HP), the contact part (222) moves outward in the diameter direction of the rotating plate (21), and the contact end (222e) is positioned at the release position (UP).

[0046] The operation of the first gripping part (22A), the first driving part (23A), and the first transmission part (24A) described above is explained. The pressure adjustment mechanism (28) supplies a fluid, such as air, to the first chamber (R1) to increase the pressure of the first chamber (R1). Accordingly, the slider (25) moves inward in the radial direction while contracting the spring (26), and the rod (29) is retracted inward in the radial direction. As the rod (29) retracts, the link (30) rotates, and the connecting end (221e) of the first gripping part (22A) connected to this link (30) is displaced to an upper value (HP). As a result, the contact end (222e) of the first gripping part (22A) moves to a release position (UP) and moves away from the substrate (W). The load applied to the substrate (W) due to the stress release at that time is determined by the fluid supply pressure and supply speed, etc. The control unit (90) can control the pressure controller (P1) or the flow controller (F1) and control the driving force or driving speed, thereby suppressing the load on the substrate (W).

[0047] The pressure adjustment mechanism (28) reduces the pressure of the first chamber (R1) by discharging a fluid, such as air, from the first chamber (R1). Accordingly, the slider (25) moves outward in the radial direction by the restoring force of the spring (26), and the rod (29) advances outward in the radial direction. As the rod (29) advances, the link (30) rotates, and the connecting end (221e) of the first gripping part (22A) is displaced to the lower value (LP). As a result, the contact end (222e) of the first gripping part (22A) moves to the gripping position (CP) and contacts the substrate (W). The impact that occurs at that time is determined by the restoring force of the spring (26), the fluid discharge pressure, and the discharge speed. The control unit (90) can suppress the impact by controlling the pressure controller (P2) or the flow rate controller (F2) and controlling the driving force or driving speed.

[0048] Unlike the case where the first driving unit (23A) above uses fluid pressure such as air instead of the restoring force of the spring (26), even if the supply of pressure is cut off due to a malfunction or other reasons during the rotation of the substrate (W), the first gripping unit (22A) is continuously positioned at the gripping position (CP) by the compressive force of the spring (26). Because of this, the first gripping unit (22A) can prevent the substrate (W) from detaching during rotation. Additionally, during the rotation of the rotating plate (21), centrifugal force acts on the slider (25) or the rod (29), thereby allowing the contact end (222e) of the first gripping unit (22A) to continuously contact the periphery of the substrate (W).

[0049] As illustrated in FIG. 2, the holding member (20) has a second driving member (23B) and a second transmission member (24B) that transmits the driving force of the second driving member (23B) to the second gripping member (22B) for each of the three second gripping members (22B). Each second driving member (23B) and each second transmission member (24B) can rotate integrally with the rotating plate (21). The second driving member (23B) and the second transmission member (24B) are configured in the same way as the first driving member (23A) and the first transmission member (24A). For this reason, a detailed description of the configuration of the second driving member (23B) and the second transmission member (24B) is omitted.

[0050] As illustrated in FIGS. 4 (A) to FIGS. 5 (B), each first gripping part (22A) and each second gripping part (22B) are arranged alternately in groups of three along the circumferential direction of the rotating plate (21). Accordingly, when gripping the substrate (W) with only each first gripping part (22A) and when gripping the substrate (W) with only each second gripping part (22B), the substrate (W) can be gripped in a balanced manner, thereby suppressing misalignment of the center of the substrate (W).

[0051] Additionally, the substrate processing device (10) releases the substrate (W) when the substrate (W) is brought in / out, and alternately grips the periphery of the substrate (W) with each first gripping part (22A) and each second gripping part (22B) during substrate processing. Because of this, each first gripping part (22A) and each second gripping part (22B) are switched to the overall unclamp form of (A) in FIG. 4, the first clamp form of (B) in FIG. 4, the overall clamp form of (A) in FIG. 5, and the second clamp form of (B) in FIG. 5.

[0052] The overall unclamp form is such that both the first gripping part (22A) and the second gripping part (22B) are positioned at the release position (UP), and is performed, for example, when the substrate (W) is brought in / out of the holding part (20). The first clamp form is such that each first gripping part (22A) is positioned at the gripping position (CP) while each second gripping part (22B) is positioned at the release position (UP), and is performed at an appropriate timing during substrate processing. The overall clamp form is such that both the first gripping part (22A) and the second gripping part (22B) are positioned at the gripping position (CP), and is performed, for example, when the substrate (W) is re-grabbed by each first gripping part (22A) and each second gripping part (22B). The second clamp type is such that each second gripping part (22B) is located at the gripping position (CP), while each first gripping part (22A) is located at the release position (UP), and is performed at a different timing from the first clamp type during substrate processing.

[0053] And, the substrate processing device (10) has a detection unit (35) that non-contactually detects the state of being located at the gripping position (CP) and the state of being located at the release position (UP) for each first gripping unit (22A) and each second gripping unit (22B) during the rotation of the rotating plate (21) in order to monitor the operating state of the gripping unit (22). Specifically, the detection unit (35) includes a fiber sensor (36) and an amplifier (38) (pulse generator) electrically connected to the fiber sensor (36).

[0054] The fiber sensor (36) is positioned so as to protrude from the bottom cover portion (82) inside the cup (80) and is fixed so as not to rotate with respect to the cup (80). Additionally, the fiber sensor (36) is installed at a position radially outward from the rotation axis (41) so as to face in an orthogonal direction with respect to the reflector (221r) of each first gripping portion (22A) and the reflector surface (221rs) of the reflector (221r) of each second gripping portion (22B). The upper end of the fiber sensor (36) is positioned at a sufficiently close position (e.g., in the range of 3 mm to 50 mm) with respect to the reflector (221r) of each first gripping portion (22A) and each second gripping portion (22B).

[0055] As illustrated in FIG. 6, the fiber sensor (36) is a reflective optical sensor that emits measurement light and receives reflected light. Additionally, it is preferable to use a fiber sensor (36) with high oil resistance and chemical resistance. The fiber sensor (36) has a cylindrical housing (37) that extends along the vertical direction. At the top of the housing (37), a light-emitting lens (361) and a light-receiving lens (362), which are detectors of the fiber sensor (36), are installed. The light-emitting lens (361) emits measurement light along an optical axis parallel to the vertical direction by the light emission of an unillustrated light-emitting element installed within the housing (37). The light-receiving lens (362) transmits reflected light of the measurement light and collects it on an unillustrated light-receiving element installed within the housing (37). Additionally, the detection unit (35) is not limited to the application of a reflective optical sensor, and may, for example, use a transmissive sensor having a light-emitting element and a light-receiving element at different positions. Furthermore, the sensor detecting each gripping unit (22) is not limited to a fiber sensor (36) and may be other optical sensors, ultrasonic sensors, laser displacement meters, etc.

[0056] The fiber sensor (36) emits a measurement light with a light intensity adjusted by the amplifier (38) during the rotation of the rotating plate (21). When the measurement light comes into contact with the rotating plate (21) facing the fiber sensor (36), it is almost absorbed or scattered, so it is not reflected by the fiber sensor (36). For this reason, the fiber sensor (36) receives reflected light with a reflection intensity of zero.

[0057] Meanwhile, when the measurement light hits the reflector (221r) positioned at the lower level (LP), it becomes a large amount of reflected light from the reflector (221r). Because of this, the fiber sensor (36) receives a high amount of reflected light. Also, when the measurement light hits the reflector (221r) positioned at an angle at the upper level (HP), the distance is longer than at the lower level (LP), so the reflected light spreads until it reaches the fiber sensor (36). Because of this, the fiber sensor (36) receives a lower amount of reflected light than at the lower level (LP). In particular, the reflector (221r) angled from the upper level (HP) cannot direct the reflected light toward the fiber sensor (36) even if it reflects the measurement light of the fiber sensor (36) specularly. Accordingly, the fiber sensor (36) receives diffused light of the measurement light and receives reflected light with a sufficiently low amount of reflected light.

[0058] The light-receiving element of the fiber sensor (36) generates a current value according to the amount of reflected light received. Additionally, the fiber sensor (36) converts the generated current value into a voltage value and outputs an analog detection signal (100) (see FIG. 7) to the amplifier (38).

[0059] Additionally, the fiber sensor (36) has a purge discharge port (363) (discharge section) and a purge outflow notch (364) on the side of the light-emitting lens (361) and the light-receiving lens (362). The purge discharge port (363) is connected to a purge gas supply section (not shown) through a flow path within the housing (37). The purge gas supply section supplies purge gas to the flow path within the housing (37) continuously or intermittently based on the control of the control section (90). The purge gas is not particularly limited and may include inert gases such as N2 gas, dry air, etc. The purge gas supplied to the flow path of the housing (37) flows along the top of the fiber sensor (36) toward the purge outflow notch (364) by being ejected continuously or intermittently from the purge discharge port (363). This purge gas can blow away liquid attached to the light-emitting lens (361) or light-receiving lens (362) through the purge outflow notch (364).

[0060] The amplifier (38) has the function of amplifying an analog detection signal (100) received from a fiber sensor (36) and also converting it into a digital signal. For this reason, the amplifier (38) has a control circuit board (39). The control circuit board (39) has a processor (39a), a memory (39b), an input / output interface not shown, a communication module, etc. Additionally, the control circuit board (39) is connected to a control unit (90) via a communication module to enable information communication. The processor (39a) performs operation control of the fiber sensor (36) and processing of the detection signal (100) by executing a program stored in the memory (39b) in accordance with the startup of the amplifier (38).

[0061] Specifically, the detection signal (100) received by the amplifier (38) during the rotation of the rotary plate (21) is formed into a waveform having a flat section (101) and a peak section (102) according to the change in time, as exemplified in (A) to (D) of FIG. 7.

[0062] The flat section (101) is a period during which reflected light is hardly received because the fiber sensor (36) is not facing the reflector (221r) [facing the rotating plate (21)].

[0063] The mountain section (102) is a period during which a large amount of reflected light is received because the fiber sensor (36) faces the reflector (221r). However, as described above, the amount of reflected light received by the fiber sensor (36) differs depending on whether the reflector (221r) is at a lower value (LP) or at an upper value (HP). For this reason, the mountain section (102) can also be classified into a first mountain section (103) having a high peak value and a second mountain section (104) having a lower peak value than the first mountain section (103). The first mountain section (103) is formed when the reflector (221r) is at a lower value (LP) and receives a large amount of reflected light. The second mountain section (104) is formed when the reflector (221r) is at an upper value (HP) and receives a small amount of reflected light.

[0064] Accordingly, FIG. 7 (A) shows the waveform of a detection signal (100) in an overall unclamped form where the reflector (221r) of all gripping parts (22) is located at the upper value (HP). FIG. 7 (B) shows the waveform of a detection signal (100) in a first clamped form or a second clamped form where one of the reflectors (221r) of the first gripping part (22A) or the second gripping part (22B) is located at the lower value (LP) and the other is located at the upper value (HP). FIG. 7 (C) shows the waveform of a detection signal (100) in an overall clamped form where the reflector (221r) of all gripping parts (22) is located at the lower value (LP).

[0065] Then, the processor (39a) of the amplifier (38) monitors the detection signal (100) received from the fiber sensor (36) and performs a process to identify the first mountain section (103) and the second mountain section (104). Additionally, the processor (39a) performs a process to generate a pulse signal (105) (digital signal) corresponding to the first mountain section (103) and output it to the control unit (90).

[0066] Specifically, as illustrated in (D) of FIG. 7, the control circuit board (39) stores a judgment threshold value (Th) in memory (39b) that divides the first peak portion (103) and the second peak portion (104) (magnitude of reflected light amount) of the detection signal (100). The judgment threshold value (Th) is set to a value between the peak value of the first peak portion (103) and the peak value of the second peak portion (104) by performing experiments in advance. More preferably, the judgment threshold value (Th) should be between the minimum value among the peak values ​​of the six first peak portions (103) reflected by the six reflectors (221r) [three first gripping portions (22A) and three second gripping portions (22B)] and the maximum value among the peak values ​​of the six second peak portions (104) (intermediate value).

[0067] The processor (39a) reads out a judgment threshold (Th) in monitoring the detection signal (100), and turns the pulse signal (105) to 1 (on) when the detection signal (100) is greater than or equal to the judgment threshold (Th) [see (B) and (C) of FIG. 7]. Conversely, when the detection signal (100) is lower than the judgment threshold (Th), the pulse signal (105) remains 0 (off). Accordingly, the control circuit board (39) can output the pulse signal (105) according to the judgment of the first shaping part (103) of the detection signal (100) to the control unit (90).

[0068] Additionally, as shown in FIG. 8, the control circuit board (39) has a limit setting value (T) for determining the decrease in the detection signal (100) [first mountain-shaped part (103)] accompanied by aging deterioration of the reflector (221r) or attachment of foreign matter to the fiber sensor (36). lim ) is stored in memory (39b). For example, the reflector (221r) may become discolored due to aging or become difficult to reflect the measurement light due to liquid adhering to it.

[0069] Limit setting value (T lim ) is set to a value lower than the peak value of the first mountain-shaped part (103) and higher than the judgment threshold value (Th) by performing experiments, etc. in advance. The processor (39a) sets all first mountain-shaped parts (103) detected according to the reflector (221r) at the lower value (LP) in the overall clamp shape, for example, to a limit setting value (T lim If it is greater than ), the normality of the reflector (221r) is determined, and the use of the reflector (221r) is permitted as is. Meanwhile, any one of the plurality of first mountain-shaped parts (103) has a limit setting value (T lim When the value falls below ), the processor (39a) turns on the maintenance signal (106). Accordingly, the main controller (91) notifies the alarm of the maintenance request of the detection unit (35) through the user interface (94) by setting a maintenance flag not shown.

[0070] In addition, the control circuit board (39) of the amplifier (38) has an APC (Auto Power Control) function that automatically corrects the amount of light of the measurement light in the control of the fiber sensor (36), and suppresses the decrease in the amount of light of the fiber sensor (36) over time.

[0071] The control unit (90) includes a main controller (91) and a user interface (94) connected to the main controller (91) and operated by a user. Additionally, the control unit (90) has a counting board (95) installed between the amplifier (38) and the main controller (91).

[0072] The counting board (95) is a circuit board having a processor, memory, and an input / output interface not shown. The counting board (95) receives a pulse signal (105) output by the amplifier (38), counts the number of pulses over a period specified by the main controller (91), and transmits the counted count value to the main controller (91). Additionally, the function of counting the number of pulses [first counting unit (103)] of the detection unit (35) may be provided in the amplifier (38) or the main controller (91), and the control unit (90) may be configured to omit the counting board (95).

[0073] The main controller (91) controls the maintenance unit (20), the rotation unit (40), the first liquid supply unit (50), the second liquid supply unit (60), and the third liquid supply unit (70). The main controller (91) may be a computer having one or more processors (92), memory (93), an input / output interface not shown, and electronic circuits. The processor (92) is a combination of one or more of the following: a CPU, an ASIC, an FPGA, a circuit including multiple discrete semiconductors. The memory (93) includes volatile memory and non-volatile memory (e.g., compact disc, DVD, hard disk, flash memory, etc.) and stores recipes such as programs and process conditions for operating the substrate processing device (10). The control unit (90) controls the operation of the substrate processing device (10) by executing the program stored in the memory (93) on the processor (92).

[0074] The main controller (91) performs an operation state monitoring method to monitor the operation state of the maintenance unit (20) during substrate processing. Accordingly, as shown in FIG. 9, the processor (92) forms a maintenance control unit (110), a rotation control unit (111), a liquid treatment control unit (112), a rotation count acquisition unit (113), a clamp shape acquisition unit (114), a count value acquisition unit (115), and an operation monitoring unit (116) within the main controller (91).

[0075] The holding control unit (110) controls the operation of the holding unit (20) to hold and release the substrate (W). For example, after the lowering of a lift pin (not shown) that has received the substrate (W), the holding control unit (110) moves one of the gripping units (22) that had taken on a full unclamp form [e.g., the first gripping unit (22A)] to a gripping position (CP) to grip the substrate (W). Additionally, when processing the substrate, the holding control unit (110) switches from one of the gripping units (22) that is gripping the substrate (W) [the first gripping unit (22A)] to the other side that is not gripping the substrate (W) [the second gripping unit (22B)]. In this switching process, the entire clamp form is passed in which the substrate (W) is gripped by both the first gripping unit (22A) and the second gripping unit (22B).

[0076] The rotation control unit (111) controls the operation of the rotation unit (40) to rotate the substrate (W) held in the holding unit (20). The rotation control unit (111) commands a target rotation speed to a motor driver (not shown), thereby supplying appropriate power from the motor driver to the rotation motor (42) and rotating the rotating plate (21) to follow the target rotation speed. The motor driver receives feedback of the actual rotation speed from an encoder installed on the rotation motor (42), etc., and adjusts the rotation of the rotation motor (42) to match the target rotation speed. For example, before substrate processing (preparation, start), the rotation control unit (111) rotates the rotating plate (21) at a constant speed of 200 rpm or less. During substrate processing, the rotating plate (21) and the substrate (W) are rotated at a constant speed at an appropriate rotation speed in the range of 200 rpm to 1500 rpm.

[0077] The liquid treatment control unit (112) controls the operation of the first liquid supply unit (50), the second liquid supply unit (60), and the third liquid supply unit (70) to discharge various treatment liquids to the substrate (W) maintained in the maintenance unit (20).

[0078] The rotational speed acquisition unit (113) acquires a rotational speed and stores it in memory (93) in order to use the rotational speed of the rotating plate (21) [substrate (W)] in the operation state monitoring method. For example, the rotational speed acquisition unit (113) may acquire the actual rotational speed of the rotating plate (21) as the rotational speed by receiving information on the actual rotational speed from the motor driver. Alternatively, the rotational speed acquisition unit (113) may acquire the target rotational speed of the rotating plate (21) as the rotational speed from the rotation control unit (111).

[0079] The clamp type acquisition unit (114) acquires information on the gripping type from the maintenance control unit (110) in order to determine the number of each gripping part (22) located at the gripping position (CP) in the operation state monitoring method. The information on the gripping type may include an all-unclamp type in which there are zero gripping parts (22) at the gripping position (CP), a first clamp type in which three first gripping parts (22A) are at the gripping position (CP), an all-clamp type in which all (six) gripping parts (22) are at the gripping position (CP), and a second clamp type in which three second gripping parts (22B) are at the gripping position (CP).

[0080] The count value acquisition unit (115) transmits a count start command and a count end command to the counting substrate (95), receives the count value counted according to the start command and the count end command from the counting substrate (95), and temporarily stores it in memory (93). In transmitting the start command and the count end command, the count value acquisition unit (115) determines whether the rotating plate (21) is rotating at a constant speed based on the number of rotations of the rotating plate (21) received sequentially by the number of rotations of the rotating plate (21) by the number of rotations of the rotating plate (21), and transmits the start command and the count end command in the constant speed rotation state.

[0081] Additionally, the count value acquisition unit (115) commands the count value to be counted at different sampling periods depending on the rotational speed of the rotating plate (21). For example, when the rotational speed of the rotating plate (21) is 200 rpm or less, the count value acquisition unit (115) sets a sampling period of 3 seconds and outputs a termination command 3 seconds after outputting a start command. On the other hand, when the rotational speed of the rotating plate (21) is 200 rpm to 1500 rpm, the count value acquisition unit (115) sets a sampling period of 1 second and outputs a termination command 1 second after outputting a start command. Accordingly, even when the rotational speed of the rotating plate (21) is low, the number of pulses required for monitoring can be secured, and the method for monitoring the operating state can be performed stably.

[0082] The operation monitoring unit (116) monitors the operation status of each gripping unit (22) based on the number of rotations of the rotating plate (21) acquired by the number of rotations acquired by the number of rotations acquired by the number of rotations acquired by the number of rotations acquired by the number of gripping units (21), the number of gripping units acquired by the number of gripping units (22), and the number of gripping units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of counting units acquired by the number of gripping

[0083] CL=n / 60×x×t … (1)

[0084] The operation monitoring unit (116), when calculating the theoretical count value (CL), compares the calculated theoretical count value (CL) with the count value. Then, if the theoretical count value (CL) and the count value match, it determines that the operation state of each gripping unit (22) is normal.

[0085] Here, with reference to FIG. 10, the determination of the operating state in the case where one gripping part (22) is released in the overall clamp form in which six gripping parts (22) grip the substrate (W) is explained. That is, the overall clamp form is a pattern in which the reflector (221r) of each gripping part (22) is originally all located at the lower position (LP), but due to an abnormal operation, the reflector (221r) of one gripping part (22) is located at the upper position (HP).

[0086] In this case, when the rotating plate (21) rotates one full turn, the fiber sensor (36) detects five first mountain-shaped parts (103) and one second mountain-shaped part (104) as a detection signal (100). Accordingly, the amplifier (38) that receives the detection signal (100) of the fiber sensor (36) repeatedly outputs five pulses per turn.

[0087] The counting board (95) continuously counts five pulses per input rotation over the period of the start command and end command commanded by the count value acquisition unit (115). That is, the count value counted by the counting board (95) is less than the theoretical count value (CL). The operation monitoring unit (116) determines that the gripping of the board (W) by the gripping unit (22) in the overall clamp form is abnormal when the count value is less than the theoretical count value (CL). Additionally, the operation monitoring unit (116) can determine whether the gripping of the board (W) is normal or abnormal in other gripping forms by the same method.

[0088] However, the number of pulses counted by the counting board (95) between the start command and the end command may vary slightly. Factors of variation include, for example, when the actual number of rotations deviates slightly from the target number of rotations even though the rotating plate (21) was basically rotating at a constant speed, or when the pulses counted overlap at the start or end timing of the sampling.

[0089] To address this fluctuation factor, the operation monitoring unit (116) is configured to assign an allowable range (AR) to the theoretical count value (CL) based on the number of grips of each gripping unit (22). Then, the operation monitoring unit (116) determines that the operation state is normal if the count value falls within the allowable range (AR) centered on the theoretical count value (CL), while determining that the operation state is abnormal if the count value does not fall within the allowable range (AR). For example, when the number of grips of each gripping unit (22) is three (first clamp type, second clamp type), the operation monitoring unit (116) sets an allowable range (AR) of ±30% to the theoretical count value (CL). This is because if an allowable range (AR) of 34% or more to the theoretical count value (CL) is set, an abnormality where one gripping unit (22) is not gripped will be missed. Likewise, when the number of grips of the gripping part (22) is 6 (in the form of a full clamp), the operation monitoring part (116) sets an allowable range (AR) of ±15% for the theoretical count value (CL).

[0090] When the control unit (90) determines an abnormality in the gripping of the substrate (W) by the operation monitoring unit (116), it performs a process such as notifying the abnormality through the user interface (94) or stopping the rotation of the rotation unit (40) to stop the substrate processing. Alternatively, if an abnormality is determined during the transition from the first clamp form to the entire clamp form, the gripping operation of each second gripping unit (22B) may be repeated multiple times by the maintenance control unit (110). Accordingly, the likelihood of the gripping of each second gripping unit (22B) being performed normally increases. On the other hand, if the entire clamp form is not achieved even after repeated attempts multiple times, the control unit (90) may take measures such as notifying the abnormality or stopping the substrate processing. Furthermore, it is desirable to take the same measures during the transition from the second clamp form to the entire clamp form.

[0091] The substrate processing device (10) according to the present embodiment is basically configured as described above, and its operation is explained below with reference to the flowchart of FIG. 11. In addition, the operation of the holding part (20) and the monitoring of the operation state of each gripping part (22) during substrate processing are exemplified below, but the monitoring of the operation state of each gripping part (22) can be performed even during rotation before substrate processing (preparation time, start time), for example.

[0092] In the process of substrate processing, the control unit (90) of the substrate processing device (10) is first brought into the substrate processing device (10) by a conveying device not shown (step S1). At this time, the holding control unit (110) of the control unit (90) forms an overall unclamped shape by moving the contact end (222e) of each first gripping part (22A) and each second gripping part (22B) to a release position (UP) [see also (A) of FIG. 4]. Accordingly, the substrate processing device (10) raises the lift pin not shown within the cup (80) to receive the substrate (W) from the conveying device and also lowers the lift pin to a predetermined position. At this predetermined position, the holding control unit (110) moves the contact end (222e) of each first gripping part (22A) among each gripping part (22) to a gripping position (CP). Accordingly, the holding control unit (110) forms a first clamp shape in which each contact end (222e) of each first gripping unit (22A) grips the periphery of the substrate (W) [see also (B) of FIG. 4]. The lift pin retracts further downward after the first clamp shape is formed.

[0093] In the first clamp configuration, the rotation control unit (111) starts the rotation of the rotating plate (21) and the substrate (W) by commanding the motor driver to a target rotation speed according to the recipe for substrate processing (step S2). After the rotation starts, the rotating plate (21) and the substrate (W) gradually increase the rotation speed, and when the target rotation speed is reached, they rotate at a constant speed.

[0094] Additionally, during the rotation of the rotating plate (21) and the substrate (W), the detection unit (35) detects the position of the reflector (221r) of each gripping unit (22) by the fiber sensor (36) based on the control of the amplifier (38). The amplifier (38) compares the detection signal (100) received from the fiber sensor (36) with a judgment threshold (Th), and if the detection signal (100) is greater than or equal to the judgment threshold (Th), it forms a pulse accordingly. In this way, the amplifier (38) can simply generate a pulse signal (105) corresponding to the detection signal of the fiber sensor (36) by using the judgment threshold (Th). Then, the control unit (90) monitors the operating state of each gripping unit (22) based on the pulse signal (105) output from the amplifier (38). This method of monitoring the operating state will be explained in detail later.

[0095] Next, the liquid treatment control unit (112) supplies a chemical solution to both the upper surface (Wa) and the lower surface (Wb) of the substrate (W) (step S3). The chemical solution is supplied to the center of the upper surface (Wa) from the nozzle (51) of the first liquid supply unit (50) and spreads to the entire upper surface (Wa) by centrifugal force to treat the entire upper surface (Wa). Additionally, the chemical solution is supplied to the center of the lower surface (Wb) from the nozzle (71A) of the third liquid supply unit (70) and spreads to the entire lower surface (Wb) by centrifugal force to treat the entire lower surface (Wb).

[0096] Additionally, in step S3, each first gripping part (22A) and each second gripping part (22B) alternately grip the substrate (W). For example, the holding control unit (110) supplies a chemical solution to the substrate (W) in the form of a first clamp to etch the substrate (W), and then re-grips the substrate (W) in the form of a second clamp. At this time, the holding control unit (110) transitions to a total clamp form in which both each first gripping part (22A) and each second gripping part (22B) simultaneously grip the substrate (W) [see Fig. 5 (A)]. Then, after the total clamp form, the holding control unit (110) releases each first gripping part (22A) and takes on a second clamp form in which the substrate (W) is gripped by each second gripping part (22B) [see Fig. 5 (B)]. By supplying the chemical solution to the substrate (W) in the form of a second clamp, the etching near the first gripping part (22A), which is delayed in the form of a first clamp, can be carried out. In particular, during the supply of the chemical solution, the substrate processing device (10) does not need to increase or decrease the rotational speed of the holding part (20), thereby suppressing the decrease in processing speed.

[0097] It is preferable for the substrate processing device (10) to remove foreign matter by supplying a chemical solution to the substrate (W) even after the etching of the substrate (W) is completed. Even at this time, the maintenance control unit (110) may perform re-grafting of the substrate (W) of each first gripping unit (22A) and each second gripping unit (22B) (e.g., transition from the second clamp form → the entire clamp form → the first clamp form).

[0098] Next, the liquid treatment control unit (112) supplies rinse liquid to both the upper surface (Wa) and the lower surface (Wb) of the substrate (W), and replaces the liquid film of the chemical liquid formed in step S3 with a liquid film of rinse liquid. The rinse liquid is supplied to the center of the upper surface (Wa) from the nozzle (51) of the first liquid supply unit (50) and spreads over the entire upper surface (Wa) by centrifugal force to wash away the chemical liquid remaining on the upper surface (Wa) and form a liquid film of rinse liquid. Additionally, the rinse liquid is supplied to the center of the lower surface (Wb) from the nozzle (71A) of the third liquid supply unit (70) and spreads over the entire lower surface (Wb) by centrifugal force to wash away the chemical liquid remaining on the lower surface (Wb) and form a liquid film of rinse liquid.

[0099] In this step S4, the maintenance control unit (110) alternately grips the substrate (W) with each first gripping unit (22A) and each second gripping unit (22B). For example, rinse liquid is supplied to the substrate (W) in the form of a first clamp to wash away the chemical liquid remaining on the substrate (W), and then the substrate (W) is re-gripped in the form of a second clamp. Even at this time, the maintenance control unit (110) passes through a total clamp form in which both the first gripping unit (22A) and each second gripping unit (22B) simultaneously grip the substrate (W) to become the second clamp form. Accordingly, the substrate processing device (10) can suppress uneven replacement from the chemical liquid to the rinse liquid.

[0100] Next, the liquid treatment control unit (112) supplies a drying liquid to the upper surface (Wa) of the substrate (W) and replaces the liquid film of the rinse liquid formed in step S4 with a liquid film of the drying liquid (step S5). The drying liquid is supplied to the center of the upper surface (Wa) from the nozzle (61) of the second liquid supply unit (60) and spreads over the entire upper surface (Wa) by centrifugal force to wash away the rinse liquid remaining on the upper surface (Wa) and form a liquid film of the drying liquid.

[0101] In this step S5, the maintenance control unit (110) alternately grips the substrate (W) with each first gripping unit (22A) and each second gripping unit (22B). For example, a drying liquid is supplied to the substrate (W) in the form of a first clamp, and after replacing the rinse liquid remaining on the substrate (W), the substrate (W) is re-gripped in the form of a second clamp. Even at this time, the maintenance control unit (110) passes through a total clamp form in which both the first gripping unit (22A) and each second gripping unit (22B) simultaneously grip the substrate (W) to become the second clamp form. Accordingly, the substrate processing device (10) can suppress uneven replacement from the rinse liquid to the drying liquid.

[0102] Next, the rotation control unit (111) rotates the substrate (W) at a predetermined rotational speed (step S6). At this time, since the processing liquid is not supplied to the substrate (W), the drying liquid remaining on the substrate (W) is shaken off, and the substrate (W) is dried. In this step S6 as well, the holding control unit (110) alternately grips the substrate (W) with each first gripping unit (22A) and each second gripping unit (22B). For example, after shaking off the drying liquid in the first clamp form, the substrate (W) is re-gripped in the second clamp form after passing through the entire clamp form. Accordingly, the substrate processing device (10) can suppress uneven drying of the drying liquid.

[0103] Next, the control unit releases the holding of the substrate (W) by the holding unit (20) as the lift pin rises, and transfers the substrate (W) to a return device, thereby removing the substrate (W) from the substrate processing device (10) (step S7). Accordingly, this substrate processing is completed.

[0104] In the processing flow of steps S2 to S6 described above, the control unit (90) performs an operation monitoring method to monitor whether the operating state of each gripping part (22) that is rotating is normal, as shown in FIG. 12. Specifically, as described above, while the rotating plate (21) and the substrate (W) are rotating, the control unit (90) commands the amplifier (38) to measure each gripping part (22) by the fiber sensor (36) (step S11). Accordingly, the amplifier (38) generates a pulse signal (105) corresponding to the first mountain-shaped part (103) detected by the fiber sensor (36) and continuously transmits it to the counting substrate (95).

[0105] While the plurality of gripping parts (22) rotate together with the rotating plate (21), the fiber sensor (36) is fixed. The fiber sensor (36) is fixed directly below a point on the rotational path through which the plurality of gripping parts (22) pass. In detecting the operating state of each gripping part (22), the substrate processing device (10) uses a single fiber sensor (36) to detect the reflected light of the entire reflector (221r) (see FIG. 3). Accordingly, the control unit (90) can recognize the operating state of each gripping part (22) simply and at low cost. Furthermore, when the reflector (221r) is positioned at the lower level (LP) and is in close proximity to and opposite to the fiber sensor (36), a large (maximum) amount of reflected light can be returned from the reflector (221r) to the fiber sensor (36). When the reflector (221r) is located at the lower position (LP), the contact terminal (222e) is located at the gripping position (CP). Accordingly, the control unit (90) can properly recognize the holding state of the substrate (W).

[0106] Conversely, when the reflector (221r) is positioned at the upper level (HP) and is also inclined away from the fiber sensor (36), a small amount of reflected light is returned from the reflector (221r) to the fiber sensor (36). Because of this, based on the small amount of reflected light from the reflector (221r), the control unit (90) can immediately recognize that it is not in the gripping position (CP). That is, the detection unit (35) can increase the recognition accuracy of the control unit (90) by creating a large difference between the shape of the first mountain-shaped part (103) and the shape of the second mountain-shaped part (104).

[0107] The count value acquisition unit (115) of the control unit (90) determines whether the rotating plate (21) and the substrate (W) have rotated at a constant speed at the target rotation speed based on the rotation speed acquired by the rotation speed acquisition unit (113) (step S12). If the rotation speed has been constant (step S12: YES), the count value acquisition unit (115) commands the counting substrate (95) to count the pulse signal (105) based on the sampling period set according to the actual rotation speed (step S13). Accordingly, the counting substrate (95) counts the pulse signal (105) of the amplifier (38) over the period between the start command and the end command received from the count value acquisition unit (115), and transmits the count value to the count value acquisition unit (115). The count value acquisition unit (115) acquires the transmitted count value (step S14) and temporarily stores this count value in the memory (93) until the acquisition of the next count value.

[0108] In this way, the substrate processing device (10) can simply determine the operating state of each rotating gripping part (22) by outputting a pulse signal (105) from the amplifier (38) and counting the number of pulses of the pulse signal (105). In addition, the control unit (90) can accurately determine the operating state of each gripping part (22) even at a rotation speed lower than 200 rpm or at a high-speed rotation speed of 200 rpm to 1500 rpm by changing the sampling period according to the rotation speed of the rotating plate (21). Furthermore, the control unit (90) can determine the operating state of each gripping part (22) with sufficiently high precision based on the count value of the sampling period.

[0109] The operation monitoring unit (116) calculates a theoretical count value (CL) and an allowable range (AR) based on the target number of rotations of the rotating plate (21), the number of grips of each gripping unit (22), and the sampling period (step S15). Additionally, the operation monitoring unit (116) monitors the state of each gripping unit (22) by comparing the theoretical count value (CL) including the calculated allowable range (AR) with the count value acquired by the count value acquisition unit (115) (step S16).

[0110] If the count value is included within the allowable range (AR) centered on the theoretical count value (CL) (step S16: YES), the operation monitoring unit (116) determines that each gripping unit (22) is operating normally (step S17). Accordingly, the control unit (90) continues the substrate processing. Then, the control unit (90) determines whether the substrate processing has proceeded until the drying of the substrate (W) (step S6) is completed (step S18). If the drying of the substrate (W) is not completed (step S18: NO), the process returns to step S13 and repeats the processing flow as follows. Meanwhile, if the drying of the substrate (W) is completed (step S18: YES), the current operation status monitoring method is terminated.

[0111] Additionally, if the count value is not included within the allowable range (AR) centered on the theoretical count value (CL) (step S16: NO), the operation monitoring unit (116) determines that there is an abnormality in the operation of any one of the gripping units (22) (step S19). When this abnormality determination is made, the control unit (90) stops the substrate processing and notifies the user of the occurrence of the abnormality through the user interface (94) (step S19). Accordingly, the user can take necessary countermeasures early.

[0112] As described above, the substrate processing device (10) detects the operating state of the gripping part (22) [first gripping part (22A), second gripping part (22B)] non-contactually by the detection part (35) during the rotation of the substrate (W). Therefore, for example, even when substrate processing is in full swing, the substrate processing device (10) can stably check the operating state of the gripping part (22) and continue substrate processing well. In particular, since there is no need to install a detection part (35) for each of the multiple gripping parts (22), the substrate processing device (10) can simplify the device configuration and achieve a reduction in manufacturing costs.

[0113] In addition, when the substrate processing device (10) re-grabs the substrate (W) by each first gripping part (22A) and each second gripping part (22B), the recognition of the operating state of each gripping part (22) becomes more effective. For example, in the process of switching from the first clamp form → the entire clamp form → the second clamp form, the number of substrates (W) gripped by each gripping part (22) changes in the order of 3 → 6 → 3. If the number of substrates (W) gripped in each form is different, an operational failure occurs. Therefore, for example, if there is an operational abnormality [a gripping part (22) that is not present at the gripping position (CP)] in the entire clamp form, it is desirable for the control unit (90) to control so as not to transition to the second clamp form. Accordingly, the detachment of the substrate (W) due to a gripping failure by each second gripping part (22B) can be prevented in advance. Additionally, if there is an operational abnormality in the overall clamp form, the substrate processing device (10) may continue processing the substrate in that form (or the first clamp form presumed to be normal). In this case as well, by continuing the substrate (W), it is possible to prevent the substrate (W) from being wasted, for example, when the process proceeds to the drying process of step S6. Furthermore, this processing is the same in the process of switching from the second clamp form → overall clamp form → first clamp form.

[0114] In addition, the substrate processing device (10) is equipped with a fiber sensor (36) located below the rotating plate (21), thereby preventing the processing liquid or particles of the substrate processing from adhering to the fiber sensor (36), and making it possible to continuously and stably monitor the operating state of the gripping part. Furthermore, the fiber sensor (36) has a purge discharge port (363) (discharge port) that continuously or intermittently discharges purge gas toward a light-emitting lens (361) or a light-receiving lens (362) (detector) facing each gripping part (22). Because of this, the opportunity for the detection precision of the fiber sensor (36) to decrease can be further reduced.

[0115] In addition, the substrate processing device (10) has a limit setting value (T) set in the amplifier (38). lim Based on ), it is possible to notify the user early of the deterioration of the detection signal due to aging or foreign matter attachment. As a result, the user of the substrate processing device (10) can take measures such as maintenance at an appropriate timing.

[0116] The substrate processing device (10) and the method for monitoring the operating state according to the embodiments disclosed herein are illustrative in all respects and are not restrictive. The embodiments may be modified and improved in various forms without departing from the appended claims and their common knowledge. The matters described in the plurality of embodiments may also take other configurations within a non-contradictory scope and may also be combined within a non-contradictory scope.

Claims

Claim 1 A substrate processing device comprising a holding part capable of holding the periphery of a substrate at a plurality of positions to hold the substrate, a rotating part for rotating the holding part, and a control part for controlling the holding part and the rotating part, wherein the holding part comprises a rotating plate rotated by the rotating part, a first holding part that rotates together with the rotating plate and is movable between a holding position for holding the periphery of the substrate and a release position for releasing the substrate, and a second holding part that rotates together with the rotating plate and is movable between the holding position and the release position independently of the first holding part, wherein during the rotation of the rotating part, for each of the first holding part and the second holding part, a detection part that non-contactually detects the state of being located at the holding position and the state of being located at the release position by means of a sensor, wherein the sensor is a reflective optical sensor that emits a measurement light and receives the reflected light, and the first holding part and the second holding part are orthogonal to the optical axis of the measurement light of the sensor at either the holding position or the release position. A substrate processing device having a reflector plate having a reflective surface, wherein the control unit determines the operating state of the first gripping unit or the second gripping unit based on the detection signal of the sensor. Claim 2 A substrate processing device according to claim 1, wherein the first gripping part and the second gripping part change the distance of the reflector plate and the orientation of the reflective surface with respect to the sensor by moving between the gripping position and the release position. Claim 3 In paragraph 2, the sensor is a substrate processing device in which the amount of reflected light is maximized when the first gripping part and the second gripping part are located at the gripping position, and the amount of reflected light is minimized when the first gripping part and the second gripping part are located at the release position. Claim 4 A substrate processing device comprising a holding part capable of holding the substrate by gripping the periphery of the substrate at a plurality of positions, a rotating part for rotating the holding part, and a control part for controlling the holding part and the rotating part, wherein the holding part comprises a rotating plate rotated by the rotating part, a first gripping part that rotates together with the rotating plate and is movable between a gripping position that grips the periphery of the substrate and a release position that releases the substrate, and a second gripping part that rotates together with the rotating plate and is movable between the gripping position and the release position independently of the first gripping part, and a detection part that non-contactually detects the state of being located at the gripping position and the state of being located at the release position for each of the first gripping part and the second gripping part by means of a sensor during the rotation of the rotating part, and wherein each of the first gripping part and the second gripping part is formed in an L-shape having a connection part connected to a transmission part to which an operating force is transmitted, and a contact part that is connected to the connection part and extends in a direction different from the connection part to contact the periphery of the substrate. A substrate processing device, wherein a sensor is installed below the rotating plate and detects displacement of the contact area, and a control unit determines the operating state of the first gripping part or the second gripping part based on the detection signal of the sensor. Claim 5 A substrate processing device comprising a holding unit capable of holding the periphery of a substrate at a plurality of positions and holding the substrate, a rotating unit for rotating the holding unit, and a control unit for controlling the holding unit and the rotating unit, wherein the holding unit comprises a rotating plate rotated by the rotating unit, a first gripping unit that rotates together with the rotating plate and is movable between a gripping position that holds the periphery of the substrate and a release position that releases the substrate, and a second gripping unit that rotates together with the rotating plate and is movable between the gripping position and the release position independently of the first gripping unit, wherein during the rotation of the rotating unit, for each of the first gripping unit and the second gripping unit, a detection unit that non-contactually detects the state of being located at the gripping position and the state of being located at the release position by means of a sensor, wherein the detection unit comprises a pulse generating unit that generates a pulse signal that is turned on at one of the gripping position and the release position and turned off at the other of the gripping position and the release position based on the detection signal of the sensor, and wherein the control unit, based on the detection signal of the sensor, A substrate processing device for determining the operating state of a first gripping part or the second gripping part. Claim 6 A substrate processing device according to claim 5, wherein the control unit counts the number of pulses of the pulse signal generated by the pulse generator over a set sampling period and determines whether the first gripping unit or the second gripping unit is operating normally based on the counted count value. Claim 7 In claim 6, the control unit sets a plurality of sampling periods based on the rotational speed of the rotating part, a substrate processing device. Claim 8 A substrate processing apparatus according to any one of claims 5 to 7, wherein the pulse generating unit has a judgment threshold set between the peak value of the detection signal at one of the gripping position and the release position and the peak value of the detection signal at the other of the gripping position and the release position, and turns on when the detection signal is greater than or equal to the judgment threshold, and turns off when the detection signal is less than or equal to the judgment threshold. Claim 9 A substrate processing device according to any one of claims 5 to 7, wherein the pulse generating unit has a limit setting value for determining the degradation of the detection signal due to aging or foreign matter attachment based on the detection signal received from the sensor. Claim 10 A substrate processing apparatus according to any one of claims 1 to 7, wherein the sensor has a discharge portion that continuously or intermittently discharges purge gas toward a detector facing the first gripping portion and the second gripping portion. Claim 11 A method for monitoring the operating state of a substrate processing device comprising: a holding part capable of holding the periphery of a substrate at a plurality of positions to hold the substrate; a rotating part for rotating the holding part; and a control part for controlling the holding part and the rotating part, wherein the holding part comprises a rotating plate rotated by the rotating part; a first holding part that rotates together with the rotating plate and is movable between a holding position that holds the periphery of the substrate and a release position that releases the substrate; and a second holding part that rotates together with the rotating plate and is movable between the holding position and the release position independently of the first holding part, wherein the substrate processing device comprises a detection part that non-contactually detects, by means of a sensor, the state of being located at the holding position and the state of being located at the release position for each of the first holding part and the second holding part during the rotation of the rotating part, wherein the sensor is a reflective optical sensor that emits a measurement light and receives the reflected light, and wherein the first holding part and the second holding part, at either the holding position and the release position, the sensor A method for monitoring an operating state, comprising a reflector having a reflective surface orthogonal to the optical axis of a measurement light, and a process for non-contact detection by the sensor of the detection unit, and a process for determining the operating state of the first gripping unit or the second gripping unit by the control unit based on the detection signal of the sensor. Claim 12 delete

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