Water-soluble adhesive composition for component capture, water-soluble adhesive sheet for component capture, and method for manufacturing electronic components.

Abstract

The present invention addresses the problem of providing a water-soluble adhesive composition and sheet for component capture that exhibit excellent impact absorption, adhesion, and bonding properties, and is suitable for component capture; as well as a method for manufacturing electronic components using the composition and sheet with high precision and efficiency. To solve the above problems, a composition is provided containing (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the aforementioned component (A)), wherein the viscosity of the water-soluble plasticizer (B) is less than 50,000 mPa·s at room temperature (25°C), and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0; and a sheet containing this composition is also provided. According to the present invention, impact absorption, adhesion, and bonding properties can be improved, especially in the manufacture of semiconductor devices, suppressing damage or positional deviation of components (elements). Furthermore, the sheet of the present invention is easier to handle during bonding or peeling.

Description

Technical Field

[0001] This invention relates to a water-soluble adhesive composition and sheet for capturing components, and a method for manufacturing electronic components. In particular, this invention relates to a water-soluble adhesive composition and sheet for capturing components on a substrate during the manufacture of electronic components, and a method for manufacturing electronic components using the water-soluble adhesive composition and sheet. Prior Technology

[0002] In the manufacture of electronic components such as semiconductor elements and display elements, materials with an adhesive layer (pressure-sensitive adhesive layer) are used to prevent foreign matter from adhering or to efficiently manufacture semiconductor wafers or image display devices.

[0003] For example, Patent Document 1 discloses a method for manufacturing a display device using a light-emitting diode (LED). In this manufacturing method, a method is described in which a large number of LED elements as pixels are formed on a wafer, and then the wafer is cut and enlarged and transferred using a temporary holding member having an adhesive layer (pressure-sensitive adhesive layer). Furthermore, Patent Document 2 proposes a method for separating LED elements from a substrate using laser light during enlargement transfer printing. [Previous Technical Documents] [Invention Patent Documents]

[0004] Invention Patent Document 1: Japanese Patent Application Publication No. 2002-261335. Invention Patent Document 2: Japanese Patent Application Publication No. 2010-161221. Summary of the Invention

[0005] [The problem that the invention aims to solve] However, when transferring LED components from a source substrate to a target substrate via transfer printing, the LED components sometimes shift from their intended position on the target substrate. Also, sometimes the LED components collide with components of the target substrate and bounce back, preventing them from being positioned as desired.

[0006] In view of this, the object of the present invention is to provide a component capture water-soluble adhesive composition and a component capture water-soluble adhesive sheet with excellent shock absorption, adhesion and bonding properties suitable for component capture, and a method for manufacturing electronic components using the component capture water-soluble adhesive composition and the component capture water-soluble adhesive sheet, which can be manufactured with high precision and efficiency. [Methods used to solve problems]

[0007] This invention provides a water-soluble adhesive composition for component capture, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the aforementioned component (A)). In the water-soluble adhesive composition for component capture, the viscosity of the water-soluble plasticizer (B) is less than 50,000 mPa·s at room temperature (25°C), and the ratio of the content of the water-soluble plasticizer (B) to the content of the water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0. The component-capturing water-soluble adhesive composition of the present invention contains a water-soluble plasticizer with a viscosity of less than 50,000 mPa·s at room temperature (25°C) in a specific proportion relative to the content of the water-soluble adhesive. Therefore, the impact absorption, adhesion, and bonding properties of the component-capturing water-soluble adhesive composition can be improved, and damage or positional deviation of the component (element) can be suppressed during the manufacture of electronic components.

[0008] This invention provides a water-soluble adhesive composition for component capture, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the aforementioned component (A)). In the water-soluble adhesive composition for component capture, (B) the water-soluble plasticizer is liquid at room temperature (25°C) and has a molecular weight of less than 5000. The ratio of the content of (B) the water-soluble plasticizer to the content of (A) the water-soluble adhesive ((B) / (A)) is greater than 0.5 and less than 3.0. The component-capturing water-soluble adhesive composition of the present invention contains a liquid water-soluble plasticizer with a molecular weight of less than 5000 in a specific proportion relative to the content of the water-soluble adhesive. Therefore, the impact absorption, adhesion, and bonding properties of the component-capturing water-soluble adhesive composition can be improved, and damage or positional deviation of the component (element) can be suppressed during the manufacture of electronic components.

[0009] This invention provides a water-soluble adhesive composition for component capture, comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the aforementioned component (A)). In the water-soluble adhesive composition for component capture, the weight average molecular weight of (A) the water-soluble adhesive is 1.0 × 10⁴ or more and 1.0 × 10⁶ or less, and the ratio of the content of (B) the water-soluble plasticizer to the content of (A) the water-soluble adhesive ((B) / (A)) is more than 0.5 and less than 3.0. The component capture water-soluble adhesive composition of the present invention contains a water-soluble adhesive with a weight molecular weight of more than 1.0×104 and less than 1.0×106 in a specific proportion, thereby improving the impact absorption, adhesion and bonding properties of the component capture water-soluble adhesive composition, and suppressing the damage or positional deviation of components (elements) during the manufacture of electronic components.

[0010] In the present invention, the component of a sample captures a water-soluble adhesive composition, (A) the water-soluble adhesive preferably contains at least one water-soluble adhesive selected from the group consisting of vinyl alcohol polymers, vinylpyrrolidone polymers, acrylic polymers and sugars. The above embodiments provide a component capture water-soluble adhesive composition with excellent adhesiveness, adhesion and washability.

[0011] In the component of the present invention, which captures water-soluble adhesive composition, (B) the water-soluble plasticizer is preferably a monovalent or polyvalent alcohol that is liquid at room temperature (25°C). According to the above embodiments, a component with excellent compatibility with water-soluble adhesives, excellent adhesiveness and tack, and excellent washability can be provided to capture water-soluble adhesive compositions.

[0012] In the component of the present invention, which captures water-soluble adhesive composition, (B) the water-soluble plasticizer preferably has a boiling point of 120°C or higher. According to the above embodiments, a water-soluble adhesive composition for component capture can be provided, which is not easily evaporated and its physical properties are not easily changed when a bonding step accompanied by heating and / or pressurization is performed after capturing the component.

[0013] In the component of the present invention, the water-soluble adhesive composition for capturing the component preferably contains (B) a water-soluble plasticizer selected from at least one of glycerol, diglycerol, polyethylene glycol, ethylene glycol, propylene glycol and polypropylene glycol. According to the above embodiments, glycerol, diglycerol, polyethylene glycol, ethylene glycol, propylene glycol, and polypropylene glycol all have high boiling points, so they are not easily evaporated during the bonding steps accompanied by heating and / or pressurization, thus suppressing the formation of vapor bubbles (i.e., "voids") in the composition. Furthermore, it also exhibits excellent water washability.

[0014] The present invention provides a water-soluble adhesive sheet for component capture, which is a layer having the above-mentioned water-soluble adhesive composition for component capture molded into a sheet shape. The component capture water-soluble adhesive sheet of the present invention, by forming the above-mentioned component capture water-soluble adhesive composition into a sheet, can exert excellent impact absorption, adhesion, bonding, and handling during application or peeling, thereby improving the operational efficiency of component capture. Furthermore, the component capture water-soluble adhesive sheet can significantly reduce the amount of liquid component, thus improving handling efficiency and maintaining good storage stability.

[0015] The present invention provides a method for manufacturing an electronic component, which includes the step of capturing the component using the above-mentioned component capture water-soluble adhesive composition. According to the manufacturing method of electronic components of the present invention, since a water-soluble adhesive composition with excellent shock absorption, adhesion, and bonding properties is used for component capture, damage or bounce caused by collision between the component (element) and the component to be transferred during the transfer step can be suppressed, thus preventing poor capture (mounting) of the component (element) at the desired position. Therefore, high-precision and efficient manufacturing of electronic components is possible.

[0016] The present invention provides a method for manufacturing an electronic component, which includes the step of capturing the component using a water-soluble adhesive sheet. According to the manufacturing method of electronic components of the present invention, since a water-soluble adhesive sheet with excellent impact absorption, adhesion, and bonding properties is used for component capture, damage or bounce caused by collision between the component (element) and the component to be transferred during the transfer step can be suppressed, thus preventing poor capture (mounting) of the component (element) at the desired location. Furthermore, since a water-soluble adhesive sheet with excellent operability during application or removal is used for component capture, the capture operation and residue removal operation after capture are easy to perform during the manufacturing of electronic components. Therefore, high-precision and efficient manufacturing of electronic components is possible. [Benefits of the Invention]

[0017] The present invention provides a component-capturing water-soluble adhesive composition and a component-capturing water-soluble adhesive sheet that offer excellent impact absorption, adhesion, bonding, and operability during application or removal, and are suitable for component capture; and a method for manufacturing electronic components using the component-capturing water-soluble adhesive composition and the component-capturing water-soluble adhesive sheet that can be manufactured with high precision and efficiency. Simple Explanation of the Diagram

[0018] Figure 1 is a schematic diagram illustrating a non-contact transfer step of an example of the component capture step using the component capture water-soluble adhesive composition (component capture water-soluble adhesive sheet) of the present invention. Figure 2 is a schematic diagram of the contact transfer step of an example of the component capture step using the component capture water-soluble adhesive composition (component capture water-soluble adhesive sheet) of the present invention. Implementation

[0019] [Water-soluble adhesive composition and water-soluble adhesive sheet for component capture] The water-soluble adhesive composition and sheet for component capture of the present invention are used for capturing components, and can be removed by washing with water after capture. The application of the water-soluble adhesive composition and sheet for component capture of the present invention is not particularly limited; for example, it can be used to capture electronic components on a substrate during the manufacture of electronic components. In this case, the captured electronic components can include selected elements such as semiconductor elements, liquid crystal elements, photoelectric conversion elements, piezoelectric elements, thin-film transistor elements, thin-film diode elements, resistive elements, switching elements, micro-magnetic elements, and micro-optical elements, or a combination of such elements. The following description of the water-soluble adhesive composition and water-soluble adhesive sheet for capturing components is based primarily on the premise of capturing semiconductor elements on a substrate, but is not limited thereto. Furthermore, in the following description, the water-soluble adhesive composition for capturing components of the present invention will also be referred to as "capturing composition", and the water-soluble adhesive sheet for capturing components will also be referred to as "capturing sheet".

[0020] The water-soluble adhesive composition and sheet for component capture of the present invention, for example, have impact absorption properties, and can capture semiconductor components such as LED elements separated from the transfer source substrate by energy lines (lasers, etc.), and have adhesiveness, adhesiveness, and adhesion to the substrate, capturing the captured semiconductor components at a desired position on the substrate. Furthermore, the water-soluble adhesive composition and sheet for component capture of the present invention can dissolve and remove residues in water during a washing step.

[0021] This invention can also be formulated using a water-soluble adhesive composition to capture liquid components. However, compared to a water-soluble adhesive composition for capturing components, by creating a water-soluble adhesive sheet for capturing components with a sheet-like layer formed from the water-soluble adhesive composition, the coating and drying steps for the wiring substrate can be omitted, making processing easier and thus improving work efficiency. Furthermore, compared to a water-soluble adhesive composition for capturing components, a water-soluble adhesive sheet for capturing components can significantly reduce the amount of liquid component, thus improving handling efficiency and providing better storage stability.

[0022] Furthermore, compared to coating liquid components with water-soluble adhesive compositions, the capturing surface (mounting surface) of components is flatter during sheet bonding. Therefore, the component capturing water-soluble adhesive sheet of the present invention can stably place the components.

[0023] The shape of the water-soluble adhesive sheet used for component capture in this invention is not particularly limited. Examples of possible shapes for the water-soluble adhesive sheet used for component capture in this invention include polygons (e.g., rectangles, squares, and triangles), circles, ellipses, and irregular shapes when viewed from above. Furthermore, the shape of the water-soluble adhesive sheet used for component capture in this invention can be formed to conform to the shape of the adhesive substrate, or other desired shapes. It can also be processed into the desired shape using known methods such as cutting. Additionally, it can be formed into a roll shape and then cut to the necessary quantity for use.

[0024] The thickness of the water-soluble adhesive sheet used in the component of the present invention is not particularly limited, but is preferably 1 μm or more, more preferably 3 μm or more, and even more preferably 5 μm or more. If the thickness of the water-soluble adhesive sheet used in the component of this invention is 1 μm or more, it can improve the impact absorption, which is therefore preferred. Furthermore, the upper limit of the thickness of the water-soluble adhesive sheet used for capturing the component of the present invention is preferably 500 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. If the thickness of the water-soluble adhesive sheet captured by the component of the present invention is less than 500 μm, the amount of residue is less, thus shortening the time of the water washing step for removing the sheet, which is preferable.

[0025] The thickness of the water-soluble adhesive sheet used for capturing components in this invention is preferably selected appropriately in relation to the height of the bumps formed on the semiconductor element. When the capturing sheet is thicker than the height of the bumps, the bottom and side surfaces of the semiconductor element will contact the capturing sheet, thus suppressing the rebound of the semiconductor element.

[0026] The component capture water-soluble adhesive composition and component capture water-soluble adhesive sheet of the present invention contain a water-soluble plasticizer (B). The water-soluble plasticizer (B) is a liquid component. When it is contained in a high proportion, it is easy to wet the side of the semiconductor element bump or the side of the semiconductor element, especially in the initial stage of the rebound after the semiconductor element is sunk. By means of the surface tension or adhesive force formed by the wetting, the effect of inhibiting the rebound or damage of the semiconductor element can be achieved.

[0027] Furthermore, when the semiconductor device is deeply embedded in the capture sheet, the capture sheet will cover the upper surface of the semiconductor device, further increasing the resistance to rebound. Therefore, even when the semiconductor device capture step is performed at high speed, the positional deviation can be reduced. In other words, the rebound suppression effect of semiconductor devices increases in the initial stage of rebound by the following sequence: "wetting the side of the semiconductor device bump with the capture sheet (wetting the bump of the semiconductor device)," "wetting the side of the semiconductor device with the capture sheet (wetting the bump of the semiconductor device, the bottom surface of the semiconductor device, and the side of the semiconductor device)," and "covering the top surface of the semiconductor device with the capture sheet (wetting the bump of the semiconductor device, the bottom surface of the semiconductor device, the side surface of the semiconductor device, and the top surface of the semiconductor device)."

[0028] From the viewpoint of preventing positional deviation or damage to semiconductor elements during semiconductor element capture, the ratio of the thickness of the water-soluble adhesive sheet to the height of the bumps on the semiconductor element (sheet thickness / bump height) in the component capture of the present invention is preferably 1.0 or more, more preferably 1.2 or more, and even more preferably 1.5 or more. If the ratio of the thickness of the water-soluble adhesive sheet to the height of the bumps in the component capture of the present invention is 1.0 or more, the bumps of the conductor element are less likely to shift from the desired position of the electrode on the substrate during the semiconductor element capture step, which is therefore preferable.

[0029] Furthermore, after capturing the semiconductor device without any positional deviation, during the bonding step accompanied by heating and / or pressurization, it is necessary to soften the capturing sheet to (re)sink the semiconductor device and bring the bumps of the semiconductor device into contact with the substrate electrodes. Therefore, when the thickness of the capturing sheet is significantly thicker than the height of the semiconductor device (the shortest distance between the lower surface of the bumps of the semiconductor device and the upper surface of the semiconductor device), the (re)sinking distance of the semiconductor device becomes longer, and the deviation of the substrate electrodes increases due to the shaking of the semiconductor device during sinking.

[0030] In view of this, from the perspective of positional deviation caused by semiconductor element sinking during the bonding step after capture without semiconductor element positional deviation, the ratio of the thickness of the water-soluble adhesive sheet to the height of the bump (thickness of the capture sheet / height of the semiconductor element bump) of the component capture of the present invention is preferably 5.0 or less, more preferably 3.6 or less, and even more preferably 2.3 or less. If the ratio of the thickness of the water-soluble adhesive sheet to the height of the semiconductor element bump is 3.0 or less, the positional deviation between the semiconductor element bump and the substrate electrode caused by sinking during the bonding step can be suppressed after the semiconductor element is captured at the desired position.

[0031] There is no particular limitation on the height of the bumps formed on the semiconductor device, for example, it can be 1 μm or more and 50 μm or less. The lower limit of the bump height is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more. The upper limit of the bump height is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 20 μm or less.

[0032] The component capture water-soluble adhesive composition and component capture water-soluble adhesive sheet of the present invention contain (A) a water-soluble adhesive and (B) a water-soluble plasticizer.

[0033] The content of component (A), for example, based on the overall sheet material for capture, is 10% by mass or more and 65% by mass or less. If component (A) is 10% by mass or more, the sheet material is better in terms of formability. If component (A) is 65% by mass or less, the sheet material is better in terms of adhesion or bonding properties. From the perspective of improving the formability of sheet materials, the lower limit of the content of component (A) is preferably 20% by mass or more, more preferably 25% by mass or more, and even more preferably 30% by mass or more. Furthermore, from the viewpoint of adhesion or bonding, the upper limit of the content of component (A) is preferably 65% ​​by mass or less, more preferably 60% by mass or less, and even more preferably 55% by mass or less.

[0034] The content of component (B) is preferably 35% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more, based on the overall sheet material for capturing. If the content of component (B) is 35% by mass or more, it is preferable to improve the prevention of positional deviations in the transfer process of semiconductor devices from the perspectives of adhesion, bonding force, surface tension, and rheological properties. Maintaining the content of component (B) within the aforementioned range improves its liquid properties and wettability to semiconductor devices, thus suppressing the rebound of semiconductor devices. Furthermore, within the aforementioned range, the polymer chains of water-soluble adhesives are easily mobile and exhibit excellent shock absorption. This is because the storage elastic modulus G′(E′) ​​of the elastic term remains almost constant with increasing frequency, while the loss elastic modulus G″(E″) of the viscous term tends to increase. This results in an increase in the tanδ value of the shock absorption index, thus leading to excellent shock absorption. Furthermore, the content of component (B) is based on component (A), preferably 300% by mass or less, more preferably 250% by mass or less, and even more preferably 200% by mass or less. If the content of component (B) is less than 300% by mass, it is better from the point of view of sheet formability.

[0035] The following describes the components of the water-soluble adhesive composition for component capture and the water-soluble adhesive sheet for component capture that constitute the present invention.

[0036] [(A) Water-soluble adhesive] The water-soluble adhesive in component (A) is a major component of the capture composition and the capture sheet, and is mainly composed of a polymer. Furthermore, the water-soluble adhesive in component (A) is a water-soluble component that can exhibit adhesive properties alone or by adding a water-soluble plasticizer. Here, water solubility refers to the property that does not become cloudy and dissolve when a 1% by mass aqueous solution is formed at room temperature (25°C). Furthermore, adhesiveness refers to the property that, in a sheet made by using a water-soluble adhesive of component (A) alone or with the addition of 30 or 50 parts by mass of a water-soluble plasticizer of component (B), when the sheet (1cm × 5cm × 10μm) is pressed onto, for example, a PET film (non-demolding surface) at room temperature (25°C), and the PET film with the sheet attached is cut into a reed shape, the sheet and the PET film are not immediately separated when the reed-shaped PET film is hung vertically. The component capture water-soluble adhesive composition and component capture water-soluble adhesive sheet of the present invention contain component (A), thereby improving the adhesiveness and adhesion (pressure-sensitive adhesion) relative to the semiconductor device, the adhesion and bonding to the substrate, the decomposition inhibition or melting during heating and / or pressurization in the bonding process, and the water solubility.

[0037] The polymers constituting component (A) include those that exhibit adhesiveness and tackiness not only those polymers themselves have adhesiveness and tackiness, but also those that exhibit adhesiveness and tackiness by forming a gel.

[0038] The water-soluble adhesive composition and sheet for component capture of the present invention are preferably melted during the bonding step, which involves heating and / or pressurizing to electrically connect the substrate and the semiconductor element, thereby making the bumps of the semiconductor element conductive with the electrodes of the substrate. In this case, the polymer of component (A) is preferably one that melts at the temperature required for the bonding step. The softening point of the polymer of component (A) is not particularly limited as long as it melts during the bonding step, provided that the capture composition or the capture sheet is melted. For example, if we consider the case where the content of water-soluble plasticizer (B) in the capture composition or capture sheet is significantly reduced relative to the content of water-soluble adhesive (A) due to the evaporation of water-soluble plasticizer (liquid component) during the bonding step, and from the viewpoint that even without water-soluble plasticizer (B), the semiconductor device can be deposited into the capture composition or capture sheet by softening of water-soluble adhesive (A) during the bonding step, the softening point of the polymer constituting component (A) is preferably below 200°C, more preferably below 150°C, more preferably below 100°C, and even more preferably below 80°C. On the other hand, from the viewpoint that sheet production is possible even with a higher content of water-soluble plasticizer (B), the softening point of the polymer constituting component (A) is preferably 40°C or higher, more preferably 100°C or higher, even more preferably 150°C or higher, and even more preferably 200°C or higher.

[0039] The polymer of component (A) is soluble in water and can therefore be easily removed from the substrate by washing with water after the bonding step. The solubility of the polymer in component (A) is not particularly limited as long as it can be washed away with water. For example, the solubility of the polymer in component (A) relative to water at 90°C is preferably 0.05 g / g-H2O or higher, more preferably 0.10 g / g-H2O or higher, and even more preferably 0.30 g / g-H2O or higher. Furthermore, if the concentration is above 0.05 g / g H2O, it can be washed clean in a short time even at room temperature, which can remove or greatly reduce the washing residue, thus making it better.

[0040] Furthermore, when component (A) has a weight-average molecular weight exceeding 1.0 × 10⁶, its dissolution in water via washing takes a long time, easily producing washing residue. Therefore, from the perspective of shortening washing time and reducing washing residue, it is preferable to reduce the molecular weight of component (A) through decomposition and increase the dissolution rate. There are no particular limitations on the method of reducing molecular weight, as long as it does not damage semiconductor devices or substrates. For example, when component (A) is a natural polymer, various known hydrolytic enzymes can be cited. For example, when component (A) contains polymers of α-glucose such as starch and polytricaglucose, or / and their derivatives, hydrolases such as amylase, glucoamylase, and cherry leaf enzyme can be used. Similarly, when it is a natural polymer containing β-glucose such as carboxymethyl cellulose (CMC), or / and its derivatives, cellulase can be used. Furthermore, when it is a natural polymer derived from amino acids such as silk, proteases can be used. When using this hydrolase, it is preferable to wash within the optimal pH and temperature range for high enzyme activity, and to add additives such as Ca2+ according to the enzyme, thereby further enhancing enzyme activity.

[0041] From the viewpoint of improving sheet formability, the weight average molecular weight (Mw) of the polymer in component (A) is preferably 1.0 × 10⁴ or higher, more preferably 5.0 × 10⁴ or higher, and even more preferably 1.0 × 10⁵ or higher. Furthermore, when the weight average molecular weight (Mw) of the polymer in component (A) exceeds, for example, 1.0 × 10⁶, as mentioned above, from the viewpoint of shortening washing time and reducing washing residue, it is preferable to reduce the molecular weight of component (A) through hydrolysis or the like, thereby increasing its solubility in water. Furthermore, from the viewpoint of enabling semiconductor devices to sink into the capture composition (or capture sheet) by softening the water-soluble adhesive or water washability, the weight average molecular weight Mw of the polymer of component (A) is preferably 1.0×106 or less, more preferably 8.0×105 or less, and even more preferably 4.0×105 or less.

[0042] The molecular weight distribution Mw / Mn of the polymer constituting component (A) (where Mn represents the number average molecular weight) is not particularly limited. For example, the lower limit of the molecular weight distribution Mw / Mn is preferably above 1.5, and more preferably above 1.8. Furthermore, the upper limit of the molecular weight distribution Mw / Mn is preferably below 30, more preferably below 15, and even more preferably below 8. By ensuring that the molecular weight distribution Mw / Mn is within the above range, sheets can be well formed and the inconsistencies in properties within the sheets can be suppressed, resulting in more uniform properties.

[0043] <Vinyl Alcohol-based Polymers> In this invention, the vinyl alcohol polymer is a polymer having a hydroxyl-ethyl repeating unit as shown in general formula (1).

[0044] The structure shown in general formula (1) will be referred to as the vinyl alcohol repeating unit.

[0045] Vinyl alcohol polymers can be homopolymers consisting solely of vinyl alcohol repeating units, or copolymers with other repeating units. Hereinafter, vinyl alcohol polymers with a homopolymer structure consisting only of vinyl alcohol repeating units will also be referred to as "homomers", and vinyl alcohol polymers with a copolymer structure having other repeating units will also be referred to as "copolymers".

[0046] Generally, vinyl alcohol-based polymers are produced by polymerizing or copolymerizing monomers that protect the hydroxyl groups of vinyl alcohol (such as vinyl esters) individually, followed by modification (such as hydrolysis) to remove the protecting groups. Therefore, other repeating units besides the vinyl alcohol repeating unit can be identified as units that retain the repeating unit from before the modification. Examples of repeating units from before modification include those derived from vinyl formate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl isobutyrate, trimethylvinyl acetate, vinyl neodecanoate, vinyl hexanoate, vinyl octanoate, vinyl laurate, vinyl palmitate, vinyl stearate, vinyl oleate, vinyl trifluoroacetate, vinyl benzoate, butyl vinyl ether, and trimethylsilyl vinyl ether. The repeating units in vinyl alcohol polymers that remain in the state of unmodified state with residual functional groups are also called "unmodified repeating units". In vinyl alcohol polymers, the remaining unmodified repeating units can be one or more types. Vinyl alcohol polymers are generally manufactured by saponification of vinyl acetate polymers. Therefore, it is preferable to use readily available vinyl alcohol copolymers modified from vinyl acetate polymers whose repeating unit before modification is vinyl acetate.

[0047] In vinyl alcohol polymers composed of vinyl alcohol repeating units and unmodified repeating units, the solubility and adhesion (pressure-sensitive adhesion) relative to water affect the degree of saponification and polymerization. Here, the degree of saponification in the vinyl alcohol polymer composed of vinyl alcohol repeating units and unmodified repeating units is the ratio of the number of vinyl alcohol repeating units to the total number of repeating units ([number of vinyl alcohol repeating units] / {[number of vinyl alcohol repeating units]+[number of unmodified repeating units]}).

[0048] When the saponification of vinyl alcohol-based polymers composed of vinyl alcohol repeating units and unmodified repeating units is too high or too low, their solubility relative to water will decrease. Furthermore, a higher degree of polymerization will also decrease their solubility relative to water. Therefore, in vinyl alcohol polymers composed of unmodified repeating units, the degree of saponification and degree of polymerization are selected according to the type of unmodified repeating unit. For example, the lower limit of saponification is preferably above 30%, more preferably above 40%, and even more preferably above 50%. For example, the upper limit of saponification is preferably below 90%, more preferably below 80%, and even more preferably below 70%. If it is within the above range, there will be no crystallization that makes it difficult to dissolve in water or a decrease in the number of hydrophilic groups that makes it difficult to dissolve in water, so it can be used better.

[0049] Furthermore, vinyl alcohol polymers may contain one or more vinyl alcohol repeating units and other repeating units besides the unmodified repeating units. Examples of repeating units other than the vinyl alcohol repeating units and the unmodified repeating units include repeating units derived from ethylene, (meth)acrylic acid, maleic acid, vinylpyrrolidone, aminoalkyl esters of (meth)acrylic acid, and monomers of general formula (2) (e.g., oxyethyl monoallyl ether and ethyl carbitol of (meth)acrylic acid). The following refers to all repeating units other than the vinyl alcohol repeating unit and the unmodified repeating unit as the "third repeating unit". The degree of saponification can be determined by 1H-NMR when there is a third repeating unit (such as an oxoalkyl structure), and by JIS K 6726 when there is no such third repeating unit.

[0050]

Chemistry 2

[0051] In general formula (2), R1 represents a hydrogen atom or an organic group with 1 to 20 carbon atoms. The organic group may also contain one or more of the elements O, N, S, Si and P. Examples of organic groups in R1 include alkyl, acetyl, acetoxy, alkoxycarbonyl, alkyl ester (acetoxy-substituted hydrocarbon groups and alkoxycarbonyl-substituted hydrocarbon groups), alkylacetylamine alkyl, and sulfonate ester.

[0052] Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, and hexyl. Examples of acetyl groups include methyl carbonyl, ethyl carbonyl, n-propyl carbonyl, isopropyl carbonyl, butyl carbonyl, pentyl carbonyl, and hexyl carbonyl. Examples of alkyl ester groups include methyloxycarbonylmethylene, methylcarbonyloxymethylene, ethyloxycarbonylethyl, and ethylcarbonyloxyethyl. Examples of alkyl amide alkylenes include N,N′-dimethylamide alkylene and N,N′-diethylamide alkylene. R1 is preferably a hydrogen atom or an alkyl, acetyl, alkyl ester or alkyl acetylamine alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom. If R1 is a hydrogen atom, it can lower the glass transition temperature of the polymer, which is therefore preferable.

[0053] In general formula (2), R2 represents an ether bond (-O-), an ester bond (-COO-, -OCO-), an amide bond (-NHCO-, -OCNH-), an alkyl group having 1 to 6 carbon atoms, or a complex group or a single bond thereof.

[0054] In general formula (2), R3 represents a hydrogen atom or an organic group with 1 to 20 carbon atoms. The organic group may also contain one or more of the elements O, N, S, Si and P. Examples of organic groups in R3 include alkyl, acetyl, alkoxycarbonyl, alkyl ester (acetyloxy-substituted hydrocarbon group and alkoxycarbonyl-substituted hydrocarbon group), alkylacetamide, alkylacetamide alkyl, and sulfonate group.

[0055] Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, and hexyl. Examples of acetyl groups include methyl carbonyl, ethyl carbonyl, n-propyl carbonyl, isopropyl carbonyl, butyl carbonyl, pentyl carbonyl, and hexyl carbonyl. Examples of alkyl ester groups include methyloxycarbonylmethylene, methylcarbonyloxymethylene, ethyloxycarbonylethyl, and ethylcarbonyloxyethyl. Examples of alkyl amide alkylenes include N,N′-dimethylamide alkylene and N,N′-diethylamide alkylene. R3 is preferably a hydrogen atom or an alkyl, acetyl, alkyl ester or alkyl acetylamine alkyl group having 1 to 10 carbon atoms, more preferably a hydrogen atom or a methyl group.

[0056] In general formula (2), A represents a linear or branched alkyl group having 2 to 22 carbon atoms. In general formula (2), when n is 2 or more, the complex numbers A can be the same or different. In general formula (2), the number of carbons in A is preferably 10 or less, more preferably 4 or less, even more preferably 3 or less, and especially preferably 2.

[0057] Examples of A in general formula (2) include dimethylene (ethyl), trimethylene, methylethyl, tetramethylene, 1-methylpropyl, 2-methylpropyl and 1-ethylethyl, etc. In the structure of oxo-extrinyl groups, oxo-extrinyl groups with fewer carbon atoms that act as hydrophobic groups are more hydrophilic than those with more carbon atoms. Therefore, in general formula (2), the oxy-extended alkyl structure represented by "AO" is preferably an oxy-extended ethyl structure.

[0058] In general formula (2), the number of repetitions n represents the number of alkyl groups represented by the "AO" symbol of the hydrophilic group. Therefore, generally, increasing the number of n will increase the hydrophilicity of the repeating unit represented by general formula (2). Therefore, the lower limit of the number of repetitions n in general formula (2) is preferably 2 or more, more preferably 5 or more, and even more preferably 6 or more. Also, the upper limit of the number of repetitions n in general formula (2) is preferably 300 or less, more preferably 200 or less, even more preferably 65 or less, and especially preferably 20 or less. By keeping the number of repeating units n of the oxyalkylene group within the above range, the solubility relative to low-temperature water can be improved, and the adhesion can also be improved.

[0059] The proportion of the third repeating unit is not particularly limited as long as it is a vinyl alcohol-based polymer that exhibits adhesive and viscous properties (pressure-sensitive adhesion) and is soluble in water. Therefore, from the perspective of adhesiveness, tackiness (pressure-sensitive adhesion) and water solubility, the proportion of the third repeating unit should be selected according to the type of the third repeating unit. For example, the proportion of the third repeating unit in the vinyl alcohol polymer ("third repeating unit" × 100 / "vinyl alcohol repeating unit" + "unmodified repeating unit" + "third repeating unit") is preferably 0.5 mol% or more, more preferably 3.0 mol% or more, and even more preferably 5.0 mol% or more. If the concentration is above 0.5 mol%, it has good solubility in low-temperature water and good miscibility with (B) water-soluble plasticizers, so it can be used better. Furthermore, the proportion of the third repeating unit in the vinyl alcohol polymer is preferably 20 mol% or less, more preferably 10 mol% or less, and even more preferably 5 mol% or less. If the content is below 20 mol%, the sheet has good formability and can be used better.

[0060] Furthermore, the proportion of repeating vinyl alcohol units in vinyl alcohol-based polymers is not particularly limited as long as the vinyl alcohol-based polymer exhibits adhesiveness (pressure-sensitive adhesion) and is soluble in water. For example, the proportion of repeating vinyl alcohol units in vinyl alcohol-based polymers is preferably 20 mol% or more, more preferably 30 mol% or more, and even more preferably 40 mol% or more. If the content is above 20 mol%, the adhesion is good, so it is better. Furthermore, the proportion of vinyl alcohol repeating units in the vinyl alcohol polymer is preferably 90 mol% or less, more preferably 80 mol% or less, and even more preferably 60 mol% or less. If the content is below 90 mol%, the adhesion is good, so it is better.

[0061] Polymers containing repeating units derived from monomers with (poly)oxyalkylene structures in the vinyl alcohol family can improve water solubility. Therefore, the third repeating unit is preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure.

[0062] Furthermore, when the third repeating unit is water-soluble, the water solubility of vinyl alcohol polymers can be improved even without relying on the vinyl alcohol repeating unit. Therefore, from the viewpoint of solubility relative to water, the degree of saponification of vinyl alcohol polymers can be reduced compared to the degree of saponification of vinyl alcohol polymers without the third repeating unit. Furthermore, reducing the proportion of crystalline vinyl alcohol repeating units lowers the glass transition temperature of vinyl alcohol copolymers, thereby improving adhesiveness and tack. Therefore, the third repeating unit is preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure, and even more preferably a repeating unit shown in general formula (2).

[0063] The vinyl alcohol homopolymer or vinyl alcohol copolymer may have the structure shown in general formula (3) at at least one end of the polymer.

[0064] (In the formula, R4 represents an ether bond, ester bond, amide bond, alkyl group with 1 to 6 carbon atoms, or a complex group or single bond thereof; R5 and R6 independently represent hydrogen atoms or alkyl groups with 1 to 10 carbon atoms; R7 represents hydrogen atoms or an organogroup with 1 to 20 carbon atoms. m represents an integer greater than 1.)

[0065] R4, R7 and m in general formula (3) are the same as R2, R3 and n in general formula (2). When R5 and R6 are independently alkyl groups having 1 to 10 hydrogen atoms or carbon atoms, and m is 2 or more, the plural R5 or plural R6 may be the same or different. Examples of alkyl groups in R5 and R6 include methyl, ethyl, n-propyl, isopropyl, butyl, pentyl, and hexyl. From the perspective of improving the water solubility of vinyl alcohol polymers, hydrogen atoms are preferred.

[0066] The vinyl alcohol polymer can be a single polymer selected from vinyl alcohol homopolymers, vinyl alcohol copolymers, or vinyl alcohol polymers having at least one end of the structure shown in general formula (3), or two or more polymers can be used. Furthermore, when two or more polymers are used, two or more polymers selected from vinyl alcohol copolymers can be used, or two or more vinyl alcohol polymers having at least one end of the structure shown in general formula (3) can be used.

[0067] <Vinylpyrrolidone polymers> In this invention, the vinylpyrrolidone polymer is a polymer having the structure shown in general formula (4) as the main repeating unit.

[0068]

[0069] Vinylpyrrolidone polymers can be either vinylpyrrolidone homopolymers or copolymers. Copolymer components may include, for example, ethylene, (meth)acrylic acid, maleic acid, vinylpyrrolidone, aminoalkyl esters of (meth)acrylic acid, monomers of general formula (2) (e.g., oxyethyl monoallyl ether and ethyl carbitol of (meth)acrylic acid), etc.

[0070] The proportion of the copolymer component in the vinylpyrrolidone polymer is not particularly limited as long as it does not impede the effectiveness of the invention. For example, the proportion of the copolymer component is preferably 30 mol% or less, more preferably 10 mol% or less, and even more preferably 5 mol% or less. If the concentration is below 30 mol%, it will not hinder the formation of strong hydrogen bonds with water accompanied by heat generation, and its solubility in water is good, so it is better. Furthermore, vinylpyrrolidone is particularly advantageous in terms of availability, water solubility, and adhesion.

[0071] <Acrylic polymers> Acrylic polymers are polymers that have a monomer addition polymerization structure with a (meth)acryloxy group as the main repeating unit. Water-soluble acrylic polymers are preferably functional groups having hydroxyl, carboxyl (including salts of carboxyl, such as sodium carboxylate, ammonium carboxylate, etc.), oxoalkyl (e.g., oxoethyl or oxopropyl structures, etc.), or amino (including salts of amino, such as ammonium hydrochloride, ammonium sulfate, etc.). Acrylic polymers with hydroxyl or alkyl groups have improved water solubility and are therefore preferred.

[0072] Furthermore, the acrylic polymer used in this invention has adhesive properties (pressure-sensitive adhesion) either alone or by means of (B) water-soluble plasticizer, so the glass transfer temperature is preferably below 120°C, more preferably below 80°C, and even more preferably below 50°C.

[0073] The method for determining glass transition temperature is based on JIS K6240 (DSC method).

[0074] Acrylic polymers can be, for example, copolymers formed by one or more of a selection of hydrophilic acrylic monomers (acrylic acid, carboxyethyl acrylate, hydroxyethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, polyoxyethylene acrylate, polyoxypropylene acrylate, and polyoxyethylene acrylate polyoxypropylene, etc.) with one or more of a selection of alkyl acrylates (methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, etc.), methacrylic monomers (methacrylic acid, alkyl methacrylate, hydroxyalkyl methacrylate, and poly(oxyalkyl) methacrylate, etc.) and acrylonitrile.

[0075] In acrylic polymers, the proportion of monomers other than hydrophilic acrylic monomers is not particularly limited, as long as they are soluble in water and have a glass transition temperature preferably below 120°C. For example, the monomer proportion is preferably below 30 mol%, more preferably below 10 mol%, and even more preferably below 5 mol%.

[0076] Acrylic polymers can be exemplified by combining hydrophilic acrylic monomers that derive homopolymers with low glass transition temperatures, as well as (meth)acrylic monomers and (meth)acrylates that have polar groups (carboxyl and hydroxyl groups) that improve adhesion to metals (pressure-sensitive adhesion), and copolymerizing such copolymers.

[0077] Carbohydrates In this invention, the sugar is a polymer possessing the properties of the aforementioned water-soluble adhesive. Examples include poly(triacoglucose) as a repeating unit in general formula (5), hydroxyethyl cellulose as a repeating unit in general formula (6), carboxymethyl cellulose as a repeating unit in general formula (7), and starch.

[0078]

[0079] (In the formula, R8 independently represents a hydrogen atom or a mono- or polyoxyalkylene group having a hydrogen atom at the end)

[0080] (In the formula, R9 independently represents a hydrogen atom or CH2COONa or CH2COONH4)

[0081] [(B) Water-soluble plasticizers] The water-soluble plasticizer in component (B) functions as a plasticizer in component (A) and further softens component (A), the main component of the capture composition and capture sheet of the present invention. This absorbs the impact when the semiconductor element separated from the transfer source substrate comes into contact with the capture composition and capture sheet of the present invention, preventing damage to the semiconductor element and positional deviation caused by bounce. Therefore, in order to make component (A) more flexible, the water-soluble plasticizer (B) is preferably in liquid form when the component is captured or joined. For example, it is preferably in liquid form at room temperature (25°C). The water-soluble plasticizer (B) in this invention is other than component (A). Furthermore, the water-soluble plasticizer (B) in this invention contains water.

[0082] (B) There is no particular limitation on the boiling point of the water-soluble plasticizer, for example, it is above 120°C, preferably above 150°C, and even more preferably above 180°C. (B) When the boiling point of the water-soluble plasticizer is above 120°C, it is not easy to evaporate during capture, so it can exert the effect of making the properties of the component capture water-soluble adhesive composition and the component capture water-soluble adhesive sheet of the present invention less prone to change during capture and bonding.

[0083] Furthermore, the water-soluble adhesive composition and sheet for component capture of the present invention are provided in the bonding step accompanied by heating and / or pressurization. Therefore, (B) the water-soluble plasticizer is preferably a liquid plasticizer whose vapor pressure at the temperature during the bonding step does not reach atmospheric pressure. In the case of a liquid plasticizer whose vapor pressure at the temperature does not reach atmospheric pressure, evaporation will not occur, thus suppressing the formation of vapor bubbles (i.e., "voids") in the capture composition and the capture sheet. Furthermore, (B) there is no particular limit to the upper limit of the boiling point of water-soluble plasticizers, for example, it can be below 500°C.

[0084] (B) Water-soluble plasticizers can be removed by washing with water after the bonding step. Therefore, they can be used as long as they are soluble in water, without any particular limitation. In order to perform water washing efficiently, the solubility of (B) water-soluble plasticizers relative to water at room temperature (25°C) is preferably 0.10 g / g-H2O or more, more preferably 0.30 g / g-H2O or more, and even more preferably 0.50 g / g-H2O or more.

[0085] Furthermore, (B) the water-soluble plasticizer is preferably one that not only does not hinder the melting of component (A) in the bonding step but also has excellent water solubility, and the aqueous solution of (B) the water-soluble plasticizer has low viscosity. Therefore, (B) the water-soluble plasticizer is preferably in liquid form at room temperature (25°C). Furthermore, the upper limit of the viscosity of (B) the water-soluble plasticizer at room temperature (25°C) is preferably 50,000 mPa·s or less, more preferably 40,000 mPa·s or less, even more preferably 1,000 mPa·s or less, and even more preferably 600 mPa·s or less. On the other hand, the lower limit is not particularly limited, but is preferably 0.8 mPa·s or more, more preferably 1.0 mPa·s or more. Furthermore, the viscosity of an aqueous solution depends on the molecular weight of the solute. Therefore, for example, the molecular weight of the compound used as (B) water-soluble plasticizer is preferably 5000 or less, more preferably 3000 or less, even more preferably 1000 or less, even more preferably 800 or less, and most preferably 600 or less. Also, in the description of this invention, the molecular weight of the water-soluble plasticizer with molecular weight distribution refers to the weight average molecular weight.

[0086] (B) The water-soluble plasticizer is selected so that it will not reduce the solvent solubility, meltability and surface tension due to reaction or interaction with component (A), thereby impairing the effectiveness of the present invention. For example, when component (A) reacts with component (B) to form a three-dimensional cross-linked structure, it will impair the solvent's solubility, meltability, and surface tension.

[0087] The water-soluble plasticizer of component (B) of the present invention is preferably a monovalent or polyvalent alcohol and an alkanolamine. These have multiple hydrophilic functional groups, and are therefore superior from the viewpoint of water solubility.

[0088] (B) Water-soluble plasticizers include, more specifically, glycerol, diglycerol, ethylene glycol, diethylene glycol, propane-1,2-diol, 1,3-propanediol, diethylene glycol monomethyl ether, ethanolamine and triethanolamine. Furthermore, examples of water-soluble plasticizers of polymers include polyethylene glycol, terminal monoalkoxy polyethylene glycol, terminal dialkoxy polyethylene glycol, polyglycerol, propylene glycol, and polypropylene glycol.

[0089] Here, (B) the water-soluble plasticizer is preferably glycerol, diglycerol, polyethylene glycol, polypropylene glycol, and triethanolamine. Glycerol, diglycerol, polyethylene glycol, polypropylene glycol, and triethanolamine have excellent miscibility with water and high boiling points. Therefore, the sheet material used for capture in the bonding step has excellent meltability, surface tension, and washability in the washing step. More preferably, glycerol, diglycerol, polyethylene glycol, and polypropylene glycol are readily available and easy to process, and even more preferably, glycerol and polyethylene glycol.

[0090] Furthermore, the ratio of the content of water-soluble plasticizer (B) to the content of water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.0. As shown in the examples described later, if this value is not met, sufficient impact absorption, adhesion, and bonding cannot be obtained, resulting in poor operability during application or peeling.

[0091] [Other ingredients] The capture sheet of the present invention may contain less than 10% by mass of water based on the entire capture sheet, without hindering the effectiveness of the present invention. Furthermore, the capture composition and capture sheet of the present invention may contain other ingredients within a range that does not impair the effectiveness of the present invention. Other components may include lubricants, antioxidants, antistatic agents, surfactants, heat stabilizers, rust inhibitors, and surface conditioners (leveling agents). Furthermore, the capture composition and capture sheet of the present invention preferably do not contain thermosetting resin. This is because thermosetting resin hardens during the bonding process and may not be removed by washing with water or the like.

[0092] [Method for manufacturing a water-soluble adhesive composition for component capture] The component of the present invention can be manufactured using a known manufacturing method by means of a water-soluble adhesive composition. For example, the raw materials described in Tables 1 and 2 below can be used to manufacture the product by mixing them together in a mixer or similar equipment.

[0093] [Method for manufacturing water-soluble adhesive sheets for component capture] The component of the present invention can be manufactured using a known manufacturing method for manufacturing sheets containing adhesives, which captures water-soluble adhesive sheets. For example, it can be manufactured by forming a layer of water-soluble adhesive composition using the components of the present invention on a prepared peeling sheet. The substrate of the release sheet is not particularly limited as long as it can be used to peel off the component of the present invention to capture the water-soluble adhesive composition. Examples of substrates for the release sheet include polyester, polyolefin, and polyamide. Polyesters include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate. Examples of polyolefins include linear low-density polyethylene, low-density polyethylene, medium-density polyethylene, and polypropylene. Examples of polyamides include polycaprolactam, polyhexamethylene hexamethylene diamide, polytetramethylene hexamethylene diamide, polyhexamethylene isophthalamide, polyhexamethylene decanediamide, polyhexamethylene dodecanediamide, polyhexamethylene terephthalamide, polynonamethylene terephthalamide, polydecamethylene terephthalamide, polyundecane lactone, polydodecane lactone, and polyisophthalic anhydride. The sheet material for release can be subjected to known demolding treatment on at least one side. The layer of the water-soluble adhesive composition captured by the components of the present invention can be formed on one or both sides of the release sheet.

[0094] There are no particular limitations on the method of setting the layer of the capture composition of the present invention, and known methods can be used. For example, it can be manufactured by dissolving or dispersing a composition containing all or part of the components constituting the capture sheet in a solvent and coating it onto the release sheet. Solvents include water, organic solvents, and mixtures of water and organic solvents. Organic solvents include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-1-butanol, 3-methyl-2-butanol, 2,2-dimethyl-1-propanol, etc. The coating method is not particularly limited as long as it enables the layer formed using the capture composition of the present invention to have a uniform thickness. Examples of methods for forming a layer of uniform thickness include spin coating, blade coating, slot coating, and groove die coating. When using a composition containing a component that forms part of the trapping sheet, for example, a liquid component (e.g., component (B)) may be impregnated or replaced before or after the trapping sheet is dried, after the formation of the layer. At this time, the drying temperature is 60°C to 140°C, preferably 80°C to 120°C.

[0095] [Usage of Water-Soluble Adhesive Composition for Component Capture (Water-Soluble Adhesive Sheet for Component Capture)] The water-soluble adhesive composition and sheet for component capture of the present invention can be used, for example, in the manufacture of electronic components having the following steps. The following mainly describes the method of using the water-soluble adhesive sheet for component capture according to the present invention. Furthermore, the following description related to the method of using the water-soluble adhesive composition for component capture (water-soluble adhesive sheet for component capture) can be substituted for the description of the manufacturing method of the electronic component of the present invention. (1) The step of placing the capture sheet (capture composition) of the present invention on the electrode side of the wiring substrate and bonding (coating). (2) Step of capturing a semiconductor element on the capture sheet (capture composition) of the present invention. (3) A bonding step for electrically bonding semiconductor elements to wiring substrates. (4) Washing steps to remove residue. (5) Drying step of the wiring substrate.

[0096] <(1) Adhesion Steps> The capture sheet of the present invention is disposed on the electrode side of the wiring substrate. In the bonding step, the capture sheet of the present invention, formed on the release sheet, is bonded to the wiring substrate. If the capture sheet of the present invention has a release sheet, the release sheet is released. The electrode surfaces of the wiring substrate can be cleaned before attaching the capture sheet of the present invention. Cleaning can be performed using organic solvents, acidic aqueous solutions, or alkaline aqueous solutions. There are no particular restrictions on the substrate used for wiring, as long as it is a substrate with wiring. Examples include TFT backplanes with glass substrates, FR-4 with glass epoxy substrates, ceramic substrates, and polysiloxane wafers. Alternatively, as an alternative to the bonding step of using the capture sheet of the present invention, a step of directly coating the capture composition of the present invention onto the electrode side of the wiring board and drying it can be performed.

[0097] <(2) Capture Steps> In the step of capturing semiconductor elements on the capture sheet of the present invention, components (elements) are disposed at a desired position on the substrate. This capture step can also be used as a transfer step in semiconductor manufacturing. The transfer step involves determining the position of the semiconductor element in the wiring substrate and moving the semiconductor element from the substrate on which the semiconductor element is formed, or the substrate temporarily holding the semiconductor element, to the capture sheet of the present invention, which is the object of transfer. Furthermore, the transfer step is known to include non-contact transfer steps or contact transfer steps, but there is no particular limitation.

[0098] Non-contact transfer steps As one of the transfer steps, a non-contact transfer step is taken as an example and explained with reference to FIG1. ​​The transfer step using the capture sheet of the present invention is not limited to the illustrated form. Also, some parts in the figures are enlarged or reduced for ease of understanding.

[0099] (i) In the transfer target substrate 1A shown in FIG1(a) manufactured by the bonding step (1) above, the component capture water-soluble adhesive sheet 11A of the present invention is bonded to the wiring substrate 12A, such that the opposite side of the wiring substrate 12A in the component capture water-soluble adhesive sheet 11A faces the side of the transfer source substrate 2A with semiconductor element 21A, and is arranged with a gap. Here, the transfer source substrate 2A shown in FIG1(a) has a semiconductor element 21A, which is held in an adhesive layer 22A, which is formed on one side of a holding substrate 23A that temporarily holds the element.

[0100] (ii) In the transfer source substrate 2A shown in FIG1(b), an energy line (laser, etc.) 3 is irradiated from the side opposite to the surface where the semiconductor element 21A is formed at the desired position of one or more semiconductor elements. By irradiating the energy line (laser, etc.) 3, as shown in FIG1(c), the semiconductor element 21A is separated from the transfer source substrate 2A, and the separated semiconductor element 21A is then captured by the water-soluble adhesive sheet 11A on the component to be transferred and transferred.

[0101] (iii) Subsequently, relative to the transfer target substrate 1A shown in FIG1(d), the transfer source substrate 2B has a holding substrate 23B that temporarily holds other semiconductor elements 21B that are different from semiconductor elements 21A, and the transfer source substrate 2B is moved to the desired position. After the movement, the steps of (ii) above are repeated as shown in FIG1(e) and FIG1(f).

[0102] (iv) Repeat steps (ii), (iii), and (i) as needed, to transfer and arrange the semiconductor elements at all desired locations on the transfer target substrate 1A. (No illustration)

[0103] The holding substrates 23A and 23B in the transfer source substrates 2A and 2B can be, for example, any of sapphire substrates, quartz glass, glass, or plastic. The components constituting the adhesive layers 22A and 22B can be decomposed (and foamed), agglomerated, softened, or melted by irradiation with energy lines (lasers, etc.), thereby causing the separation of the holding substrate 23A from the semiconductor element 21A and the separation of the holding substrate 23B from the semiconductor element 21B. Therefore, in order for the adhesive layers 22A and 22B to efficiently absorb the energy of the energy lines (lasers, etc.) 3, it is preferable that the substrates 23A and 23B are either permeable to the energy lines 3 or absorb less energy.

[0104] The adhesive layers 22A and 22B constituting the transfer source substrates 2A and 2B contain adhesive components. Examples of adhesive components include polysiloxane, acrylic polymers, polyvinyl alcohol polymers, and vinylpyrrolidone polymers. Furthermore, the components constituting adhesive layers 22A and 22B may contain components that are foamed by the energy line (laser) 3 or cross-linking components that promote aggregation.

[0105] Energy lines 3 can be exemplified by lasers. Examples of lasers include excimer lasers and high-harmonic generation (HHM) YAG lasers.

[0106] Contact transfer steps Next, the contact transfer step will be described according to Figure 2 as another form of the transfer step. In this embodiment, the semiconductor element in the holding substrate of the temporary holding element is brought into contact with the capture sheet of the present invention in the substrate and transferred, otherwise it is the same as the non-contact transfer step. Therefore, (i) to (iv) below will be described, and the description of other contents common to the non-contact transfer step will be omitted.

[0107] (i) As shown in Figures 2(a) and 2(b), the semiconductor element 21C in the transfer source substrate 2C is brought into contact with the component capture water-soluble adhesive sheet 11B in the transfer target substrate 1B.

[0108] (ii) As shown in FIG2(c), an energy line (laser, etc.) 3 is irradiated from the side opposite to the surface on which the semiconductor element 21C is formed in the transfer source substrate 2C at the desired position of one or more semiconductor elements. By irradiating the energy line (laser, etc.) 3, as shown in FIG2(d), the semiconductor element 21C is separated from the transfer source substrate 2C, and the separated semiconductor element 21C is attached to the component of the transfer target and captured by the water-soluble adhesive sheet 11B and transferred.

[0109] (iii) After transferring the separated semiconductor element 21C, as shown in FIG2(e), a semiconductor element 21D different from the semiconductor element 21C is held on a holding substrate 23D in the transfer source substrate 2D. The transfer source substrate 2D is moved to the desired position so that the semiconductor element 21D in the transfer source substrate 2D comes into contact with the component capturing water-soluble adhesive sheet 11B. After contact, the steps in (ii) above are repeated as shown in FIG2(f) to FIG2(h).

[0110] (iv) Repeat steps (ii), (iii), and (i) as needed, to transfer and arrange the semiconductor elements at all desired locations on the transfer target substrate 1B. (No illustration)

[0111] • Deformation of form during the transfer process The form in the transfer step is not limited to the form described above. It may include variations and modifications within the scope of achieving the purpose of this invention.

[0112] All semiconductor elements formed on the holding substrate in the above-mentioned non-contact transfer step or contact transfer step can be irradiated with energy lines (lasers) and transferred together. Furthermore, in step (iii) of the above-mentioned non-contact transfer step or contact transfer step, the transfer target substrates 1A and 1B can be moved in place of the holding substrates (23B and 23D) or together with the holding substrates (23B or 23D).

[0113] Furthermore, the transfer source substrate (2A, 2B, 2C and 2D) in the above-mentioned non-contact transfer step or contact transfer step can be replaced by the element forming the substrate together with the transfer source substrate (2A, 2B, 2C and 2D). For example, a substrate for forming a device can be a sapphire substrate on which a multilayer having various layers such as a conductive layer is formed, and a semiconductor crystal is grown on the multilayer to form a light-emitting diode. If a laser is irradiated through the crystal on the sapphire substrate, the surface of the layer located at the interface with the sapphire substrate will decompose, thereby allowing the light-emitting diode to be separated.

[0114] <(3) Joining Steps> In the bonding step of electrically bonding the component to the wiring substrate, heating and / or pressurizing are applied to soften or melt the trapping composition and trapping sheet of the present invention. By softening or melting the trapping composition and trapping sheet of the present invention located between the component and the wiring substrate, the component and the wiring substrate can be electrically bonded. The temperature of the bonding step can be selected according to the characteristics of the resin or solder, but for example, it can be 150°C or 160°C, or it can be heated in multiple stages. Furthermore, the maximum temperature of the bonding step can be selected according to the heat resistance of the semiconductor device, but for example, it is preferably below 260°C, more preferably below 240°C, and even more preferably below 230°C.

[0115] <(4) Washing steps> The capture composition and capture sheet of the present invention remain after the bonding step. Therefore, they are removed by washing. Cleaning can be performed using only deionized water (ultrapure water, ion-exchanged water, and distilled water, etc.) or a mixture of water-soluble organic solvents and water. From the perspective of low environmental impact and easy availability, deionized water is preferred. Hereinafter, deionized water and mixtures of water-soluble organic solvents and water will also be referred to as "water, etc." Additives that hydrolyze water-soluble adhesives can be added to the aforementioned water, etc. Examples include hydrolytic enzymes such as amylase, glucoamylase, cherry leaf enzyme, cellulase, and protease. When using this hydrolytic enzyme, it is preferable to perform cleaning within the optimal pH and temperature range for high enzyme activity. Furthermore, additives such as Ca2+ can be added depending on the enzyme to further enhance enzyme activity. Examples of water-soluble organic solvents include alcohols and ketones, with alcohols being preferred. When using water-soluble organic solvents, one or more can be used alone or in combination. Examples of alcohols include methanol, ethanol, n-propanol, and n-butanol, while examples of ketones include acetone and methyl ethyl ketone. A mixture of deionized water and a water-soluble organic solvent can also be used; the mixing ratio is not particularly limited, but from the perspective of reducing environmental impact, a lower ratio of water-soluble organic solvent is preferable. Furthermore, surfactants can be added to the aforementioned water or similar substances as additives to enhance their penetrability into narrow gaps. Additionally, other additives that improve cleaning power can also be added.

[0116] During the washing process, the temperature of the water used can be selected according to the solubility of components (A) and (B). For example, the temperature of the water used in the washing process is preferably above 10°C, more preferably above 20°C, and even more preferably above 30°C. If the temperature is above 10℃, there is a tendency for the product to leave little or no residue after washing, which is better. Furthermore, the temperature of the water used in the washing process is preferably below 80°C, more preferably below 70°C, and even more preferably below 60°C. If the temperature is below 80℃, energy consumption is lower and the environmental impact is lower, so it is better. Furthermore, when using hydrolytic enzymes, each enzyme has an optimal temperature range for high activity, so it is preferable to perform the washing at the aforementioned temperature.

[0117] <(5) Drying Steps> The drying steps for wiring substrates include methods such as dehydration by centrifugal force (rotary dryer) or drying by using a water-miscible organic solvent with strong evaporation (such as isopropanol) and then washing with the organic solvent. The drying temperature can be appropriately designed based on factors such as the boiling point of the solvent.

[0118] (Example) The present invention will be specifically described below through embodiments, but the technical scope of the present invention is not limited to these embodiments.

[0119] The measurement and evaluation methods used in this invention are as follows. [1] Determination method (1) Composition calculation of the sheet material for capturing In Tables 3 and 4, the moisture content of the capture sheets was determined by the Karl Fischer method. Furthermore, (A) water-soluble adhesives and (B) water-soluble plasticizers were calculated as those that would not be removed from the system by evaporation or other means during the drying process of the capture sheet manufacturing, while solvents other than water were calculated as those that would be completely removed from the system. (2) Viscosity measurement Viscosity was measured at 25°C using a rotational viscometer (TVE-25H type viscometer manufactured by Toki Industrial Co., Ltd.). Rotational speeds were 1 rpm (polyglycerol), 50 rpm (glycerol, PEG600, PPG3000), and 100 rpm (diethylene glycol, ethylene glycol, propylene glycol, PEG400, diethylene glycol monomethyl ether).

[0120] [2] Evaluation methods (1) Evaluation method of adhesion A glass plate (AS ONE, product name: Slide Glass, thickness 1.0 to 1.2 mm, weight 5 g) and a water-soluble adhesive sheet (5 μm thick) for capturing the component were rolled together at room temperature (25°C), and then the polyethylene terephthalate film was peeled off. The bottom of a 10 mm diameter cylindrical glass tube was pressed into the center of the glass plate with the adhesive sheet, and then the plate was picked up by hand. The time until the bottom of the glass tube peeled off from the adhesive sheet and the glass plate fell off was then measured. ○: It did not fall after 41 seconds. △: It will fall within 21 to 40 seconds. ×: It will fall within 20 seconds.

[0121] (2) Evaluation method of adhesiveness A ball-rolling device with a 10° inclined plane and a continuous horizontal plane below the inclined plane is used. A capture sheet (5 μm thick) is attached to the horizontal plane, and a test ball (made of alumina, weighing 0.1 g and with a diameter of 4 mm) is rolled down from the position above the inclined plane (9 mm high). The distance until the test ball stops is measured. ○: Stop within 9mm. △: Stop within 10 to 20 mm. ×: Did not stop within 20mm.

[0122] Furthermore, the aforementioned adhesion and adhesive properties are used to evaluate the component's ability to capture water-soluble adhesive sheets.

[0123] (3) Evaluation method for operability during adhesion or peeling After the glass plate (AS ONE, product name: Slide Glass, thickness 1.0 to 1.2 mm, weight 5 g) and the water-soluble adhesive sheet (thickness 5 μm) for capturing the component are rolled together at room temperature (25°C), the release film (polyethylene terephthalate film) is peeled off. Visual inspection is then performed to confirm whether any capture sheet remains on the release film and is either pulled into threads or peeled off along with it. ○: No strands were formed or the fibers were peeled off together. △: Slightly creates strands or is peeled off together. ×: Multiple strands may be produced or the strands may be peeled off together, or the material may be unable to adhere.

[0124] Tables 1 and 2 show the composition and proportion of the raw materials (component capture water-soluble adhesive composition) used in the sheet manufacturing of the Examples and Comparative Examples. Tables 3 and 4 show the mass ratio of each component and the evaluation results of the sheet (component capture water-soluble adhesive sheet) manufactured using the raw materials (component capture water-soluble adhesive composition).

[0125] [Example 1] (Manufacturing of sheet material for capture) A polyvinylpyrrolidone solution was obtained by dissolving 50 parts by weight of polyvinylpyrrolidone (Daiichi Kogyo Pharmaceutical Co., Ltd., K-30) and 35 parts by weight of polyethylene glycol (Nippon Oil Co., Ltd., PEG#400) in 350 parts by weight of deionized water. A polyvinylpyrrolidone solution was applied to a polyethylene terephthalate film (LINTEC 6502) that had undergone demolding treatment using a coater. A capture sheet with a film thickness of 5 μm was obtained by drying at 100°C. Furthermore, the drying temperature in the following examples and comparative examples was 100°C when the solvent was ion-exchanged water or ethanol, and 120°C when the solvent was 1-butanol.

[0126] [Example 2] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution of 50 parts by weight of polyvinylpyrrolidone (Daiichi Kogyo Pharmaceutical Co., Ltd., K-50) and 45 parts by weight of diethylene glycol was dissolved in 350 parts by weight of ethanol was used to obtain the capture sheet in the same manner.

[0127] [Example 3] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution containing 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 60 parts by weight of ethylene glycol in 350 parts by weight of 1-butanol was used to obtain a capture sheet in the same manner.

[0128] [Example 4] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution containing 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 70 parts by weight of polyethylene glycol (Nippon Yusei Co., Ltd., PEG#400) dissolved in 350 parts by weight of ethanol was used to obtain the capture sheet in the same manner.

[0129] [Example 5] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a capture sheet was obtained by dissolving 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 80 parts by weight of polyethylene glycol (FUJIFILM Wako Pure Chemical Co., Ltd., PEG#600) in 350 parts by weight of 1-butanol in a polyvinylpyrrolidone solution.

[0130] [Example 6] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a capture sheet was obtained by dissolving 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 90 parts by weight of polypropylene glycol (FUJIFILM Wako Pure Chemical Co., Ltd., PPG#3000) in 350 parts by weight of 1-butanol in a polyvinylpyrrolidone solution.

[0131] [Example 7] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution containing 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 110 parts by weight of propylene glycol dissolved in 350 parts by weight of 1-butanol was used to obtain a capture sheet in the same manner.

[0132] [Example 8] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution in which 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-90N) and 130 parts by weight of polyglycerol (Daicel Co., Ltd., PLG20PW) were dissolved in 350 parts by weight of ethanol was used to obtain a capture sheet in the same manner.

[0133] [Example 9] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution in which 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-90N) and 140 parts by weight of polyglycerol (Daicel Co., Ltd., PLG20PW) were dissolved in 350 parts by weight of ethanol was used to obtain a capture sheet in the same manner.

[0134] [Example 10] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyvinyl alcohol solution containing 50 parts by weight of polyvinyl alcohol (GOHSENOL (registered trademark) GR-14) manufactured by Nippon Synthetic Chemical Industry Co., Ltd. and 40 parts by weight of diethylene glycol monomethyl ether dissolved in 350 parts by weight of deionized water was used to obtain the capture sheet in the same manner.

[0135] [Example 11] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polyacrylic acid solution in which 50 parts by weight of polyacrylic acid (AS-58 manufactured by Nippon Shokubai Co., Ltd.) and 100 parts by weight of glycerol were dissolved in 350 parts by weight of deionized water was used to obtain the capture sheet in the same manner.

[0136] [Example 12] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a polytriglucose solution consisting of 50 parts by weight of polytriglucose (manufactured by Hayashihara Co., Ltd.), 80 parts by weight of polyethylene glycol (FUJIFILM and Wako Pure Chemical Industries, Ltd., PEG#600), and 20 parts by weight of glycerol dissolved in 350 parts by weight of ethanol was used to obtain a capture sheet.

[0137] [Example 13] (Manufacturing of sheet material for capture) Instead of the polyvinylpyrrolidone solution in Example 1, a sheet for capturing was obtained by dissolving 30 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N), 20 parts by weight of polyvinyl alcohol (GOHSENOL (registered trademark) GR-14) manufactured by Nippon Synthetic Chemical Industry Co., Ltd., 90 parts by weight of glycerol in a mixed solution of 100 parts by weight of deionized water and 250 parts by weight of 1-butanol.

[0138] [Comparative Example 1] Instead of the polyvinylpyrrolidone solution in Example 1, a comparative sheet was obtained by dissolving 50 parts by weight of polyvinylpyrrolidone (Daiichi Kogyo Pharmaceutical Co., Ltd., K-30) and 25 parts by weight of polyethylene glycol (Nippon Oil Co., Ltd., PEG#400) in 350 parts by weight of ethanol in a polyvinylpyrrolidone solution.

[0139] [Comparative Example 2] Instead of the polyvinylpyrrolidone solution in Example 1, a comparative sheet was obtained by dissolving 50 parts by weight of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-90N) and 160 parts by weight of polyglycerol in 350 parts by weight of ethanol in a polyvinylpyrrolidone solution.

[0140] The weight-average molecular weight Mw of the water-soluble adhesive of component (A) used in the examples and comparative examples is as follows. Polyvinylpyrrolidone The K-30 costs 45,000, and the K-50 costs 250,000. The K-85N is 340,000, and the K-90N is 360,000. • Polyvinyl alcohol (GR-14) is 29,000. • Polyacrylic acid (AS-58) is 800,000. • Polytriglucose is 200,000.

[0141] [Table 1] PEG: Polyethylene Glycol PPG: Polypropylene Glycol

[0142] [Table 2]

[0143] [Table 3]

[0144] [Table 4]

[0145] Comparing the various embodiments (Examples 1 to 13) with Comparative Example 1, the evaluation results of adhesiveness show that by making the ratio of the content of water-soluble plasticizer (B) to the content of water-soluble adhesive (A) ((B) / (A)) 0.5 or less, and making the proportion of solid component (A) higher than a certain value, the adhesiveness will decrease, and it will be impossible to stop the ball from moving forward. That is to say, because the adhesiveness is lower, the sheet properties are closer to elasticity, so the ability to catch the component after impact is lower in Comparative Example 1, while the various embodiments show sufficient impact absorption.

[0146] Furthermore, comparing the various embodiments (Examples 1 to 13) and Comparative Example 2, based on the evaluation results of adhesion and operability, if the ratio of the content of water-soluble plasticizer (B) to the content of water-soluble adhesive (A) ((B) / (A)) exceeds 3.0, the proportion of the liquid component (B) will be higher than a certain value, and therefore the sheet will stretch. This shows that in Comparative Example 2, the adhesion or operability of the sheet is reduced, making industrial use more difficult. On the other hand, the embodiments exhibit sufficient adhesion and good operability.

[0147] (Industrial utilization) The water-soluble adhesive composition and sheet for component capture of the present invention are suitable for use as components. In particular, they are suitable for use as components for mounting semiconductor elements on a substrate in the manufacture of electronic components. Furthermore, the electronic component manufacturing method of the present invention can easily capture components (semiconductor elements, etc.) at desired locations on a substrate, making it suitable as a manufacturing method that can produce components with high precision and efficiency.

[0148] 1A: Transfer substrate 1B: Transfer substrate 11A: Component capture using water-soluble adhesive sheet 11B: Component capture using water-soluble adhesive sheet 12A: Wiring board 12B: Wiring board 2A: Transfer source substrate 2B: Transfer source substrate 2C: Transfer source substrate 21A: Semiconductor Components 21B: Semiconductor components 21C: Semiconductor components 21D: Semiconductor Components 22A: Adhesive layer 22B: Adhesive layer 22C: Adhesive layer 22D: Adhesive layer 23A: Holding substrate 23B: Holding substrate 23C: Retaining the substrate 23D: Retaining substrate 3: Energy Line

[0149] none.

Claims

1. A component capture water-soluble adhesive composition comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding substances and solvents identical to those in component (A)), wherein an electronic component separated from a transfer source substrate is attached to and captured on a transfer target substrate, wherein the weight average molecular weight of the aforementioned water-soluble adhesive (A) is 5.0 × 10⁴ or more and 1.0 × 10⁶ or less, the aforementioned water-soluble plasticizer (B) is liquid at room temperature (25°C), and the ratio of the content of the aforementioned water-soluble plasticizer (B) to the content of the aforementioned water-soluble adhesive (A) ((B) / (A)) is greater than 0.5 and less than 3.

0.

2. A component capture water-soluble adhesive composition comprising (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding substances and solvents identical to those in component (A)), wherein an electronic component separated from a transfer source substrate is attached to and captured on a transfer target substrate, wherein the weight average molecular weight of the aforementioned water-soluble adhesive (A) is 1.0 × 10⁴ or more and 1.0 × 10⁶ or less, the aforementioned water-soluble plasticizer (B) is liquid at room temperature (25°C), and the ratio of the content of the aforementioned water-soluble plasticizer (B) to the content of the aforementioned water-soluble adhesive (A) ((B) / (A)) is 0.7 or more and 3.0 or less.

3. The component captures a water-soluble adhesive composition as claimed in claim 1 or 2, wherein the aforementioned (A) water-soluble adhesive contains at least one water-soluble adhesive selected from the group consisting of vinyl alcohol polymers, vinylpyrrolidone polymers, acrylic polymers and sugars.

4. The component captures a water-soluble adhesive composition as claimed in claim 1 or 2, wherein the aforementioned (B) water-soluble plasticizer is a liquid monovalent or polyvalent alcohol at room temperature (25°C).

5. The component as described in claim 1 or 2 captures a water-soluble adhesive composition, wherein the boiling point of the aforementioned (B) water-soluble plasticizer is above 120°C.

6. The component capture water-soluble adhesive composition as claimed in claim 1 or 2, wherein the aforementioned water-soluble plasticizer (B) contains at least one selected from glycerol, diglycerol, polyethylene glycol, ethylene glycol, propylene glycol and polypropylene glycol.

7. The component captures a water-soluble adhesive composition as described in claim 1 or 2, wherein solder and substrate are removed from the aforementioned component.

8. A component capture water-soluble adhesive sheet having a layer formed into a sheet from the component capture water-soluble adhesive composition as described in claim 1 or 2.

9. A method for manufacturing an electronic component, comprising the steps of: capturing the component using a component capture water-soluble adhesive composition as described in claim 1 or 2.

10. A method for manufacturing an electronic component, comprising the steps of: capturing the component using a water-soluble adhesive sheet as described in claim 8.

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