Film-free packaging

Abstract

A printed substrate, preferably for the production of paper-based packaging, with a carrier layer including at least one paper layer. On a first side of the carrier layer a first transfer-metallized metal layer is provided which is connected to the carrier layer via at least one adhesive layer and preferably at least one lacquer layer. The first metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer. The carrier layer on the first transfer-metallized metal layer and / or on the optional coating with a release lacquer provided at least in some areas on the first transfer-metallized metal layer, is printed with at least one electron beam-curable printing ink at least in some areas. The at least one, at least in some areas provided, electron beam-curable coating with an overprint varnish is provided on the printed side of the carrier layer.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

[0001] This patent application is a continuation of International Application No. PCT / EP2024 / 073823, filed on Aug. 26, 2024, which claims the benefit of priority to German Patent Application No. 10 2023 123 568.0, filed Sep. 1, 2023, the entire teachings and disclosures of both applications are incorporated herein by reference thereto.FIELD OF THE INVENTION

[0002] The invention relates to a printed substrate, preferably for the production of paper-based packaging, with a carrier layer comprising at least one paper layer, wherein on a first side of the carrier layer a first transfer-metallized metal layer is provided, which is connected to the carrier layer via at least one adhesive layer, preferably at least one lacquer layer, wherein the first metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer. The invention further relates to a method for the production of a printed substrate comprising the steps:

[0003] (i) providing a carrier layer with at least one paper layer,

[0004] (ii) transfer-metallizing, at least in some areas, the at least one carrier layer on one side with at least one first metal layer, comprising the steps

[0005] a) laminating the carrier layer with a carrier film using at least one adhesive layer, wherein the carrier film has an optional release lacquer layer and a metal layer provided at least in some areas on the release lacquer layer or directly on the carrier film,

[0006] b) curing the at least one adhesive layer, and

[0007] c) separating the carrier film from the carrier layer so that the adhesive layer with the metal layer provided at least in some areas remains on the carrier layer, wherein, optionally, the metal layer on the side opposite the carrier layer has at least one coating with a release lacquer. The invention further relates to packaging for consumer goods, preferably consumer goods from the food sector or the non-food sector.BACKGROUND OF THE INVENTION

[0008] Packaging for consumer goods, in particular packaging for foodstuffs, is today predominantly made from substrates that comprise multilayer composites. Important properties of the packaging, such as barrier properties for water vapor or oxygen or the like, are often adjusted via polymer layers as predominant components of the substrate. The various requirements are usually not met by a single polymer, so different polymer layers in the composite are typically combined to provide the essential properties of the packaging. Essential properties can include resistance to polar and non-polar solvents, such as water, fats, or oils, or barrier properties against the diffusion of gases, such as oxygen, or protection against harmful radiation, such as daylight.

[0009] A disadvantage of these substrates and the packaging produced therefrom is that the different polymer layers used constitute a significant proportion of the total multilayer composite, so that the recyclability of the multilayer composite materials is only possible with great effort or not at all.

[0010] According to international patent application WO 2021 / 165290 A1, improved paper-based substrates should have, in addition to a paper layer, an aluminum layer and a nano-clay barrier layer in which the nano-clay is embedded in a PVOH polyacrylate layer. The aluminum layer is to be applied to the paper layer using a vacuum deposition process. A disadvantage of this substrate is that additional polymer layers are required for printing on the substrate, which reduces its recyclability. Vacuum deposition of the aluminum is also time-consuming and expensive.

[0011] International patent application WO 2022 / 023077 A1 also provides for a vacuum-deposited aluminum layer on paper-based substrates, wherein the paper layer is first provided with a pre-metallization layer for smoothing.

[0012] German disclosure document DE 2907186 A1 describes a method for the production of printed substrates for paper-based packaging using transfer metallization. In this method, a very thin metal coating is applied to a polypropylene film, which serves solely as a carrier film for the metal layer. The metal layer is then, for example, coated with a lacquer coating, for example polyurethane lacquer, on the carrier film. The metal-coated carrier film and the object to be coated are then combined to form a laminate. The lacquer coating is cured and the transfer-metallized object and the carrier film are then separated from each other again. The metal layer remains on the carrier, resulting in a mirror-like, shiny metallic surface with a high-gloss appearance. The drying process of the lacquer coating takes several days. According to the German disclosure document DE 2907186 A1, the metal layer can be printed using the offset printing process.

[0013] So-called “release lacquers” are also frequently used in the transfer metallization of laminates, which simplify the separation of the carrier film and the metal layer. These are applied to the carrier film before coating the carrier film with metal and remain on the metal layer. The release lacquers provide, for example, higher bonding forces to the metal layer than to the carrier film, so that the two can be separated reliably.

[0014] Based on this state of the art, the object of the present invention is to provide a printed substrate for the production of packaging, which, in addition to being very economical to produce and easily recyclable, also offers other functional properties of today's printed substrates for the production of packaging. In addition, corresponding packaging and a production method for the substrate according to the invention are to be proposed.SUMMARY OF THE INVENTION

[0015] The object described above is solved for a substrate for paper-based packaging mentioned at the beginning in that the carrier layer on the first transfer-metallized metal layer and / or on the coating with a release lacquer optionally provided at least in some areas on the first transfer-metallized metal layer is printed at least in some areas with at least one electron beam-curable printing ink, and at least one, at least in some areas provided electron beam curable coating consisting of an overprint varnish is provided on the printed side of the carrier layer.

[0016] Surprisingly, it has been found that the transfer-metallized substrate can be printed in an economical manner on the transfer-metallized side with at least one electron beam-curable printing ink and that the print can then be protected with at least one electron beam-curable overprint varnish. This is surprising insofar as the surface is metallized. The same applies to printing the optional, at least in some areas provided coating with a release lacquer due to the underlying transfer metal layer.

[0017] To achieve an excellent appearance, a variety of electron beam curable printing inks, for example at least 4 electron beam curable printing inks in the CMYK color model and, additionally, at least one special printing ink, can be provided on the substrate. The arrangement of at least two different electron beam curable overprint varnishes allows additional optical effects to be achieved on the printed substrate. Of course, only one electron beam-curable printing ink with an overprint varnish provided at least in some areas can also be used.

[0018] An at least in some areas provided transfer metallization is conceivable on the printed substrate, for example, in the form of at least one strip free of transfer metallization. Other patterns, such as repeating patterns, are also feasible.

[0019] The printed substrate constructed in this way has very good recyclability and, at the same time, excellent optical properties due to the use of electron beam-curable printing ink and overprint varnishes, as the high-gloss transfer-metallized metal layer is printed. During electron beam curing, the printing ink and overprint varnish are cured in a very short time by radical polymerization. After electron beam curing, electron beam-curable printing inks and overprint varnishes no longer contain any solvents, plasticizers, or photoinitiators and are therefore extremely low in migration. The metal layer can provide barrier properties, for example as a water vapor barrier or a barrier to aroma, oxygen, oil, or grease. It also serves to shield against harmful radiation, such as sunlight. The printed substrate can therefore also be used for food packaging.

[0020] Electron beam curable printing ink and coating lacquers allow the use of the very economical offset printing process with electron beam curing, so that the printed substrate can be provided with virtually no curing time and is therefore particularly economical.

[0021] According to a first embodiment, the at least one paper layer is preferably suitable for processing in offset printing and optionally has a grammage of 20 to 150 g / m2. The paper layer contains cellulose, usually from wood fibers, which can come from different sources and processing stages. The printed substrate can be of any paper quality. The carrier layer can even comprise transparent paper layers consisting of glassine. Recycled paper layers can also be used without any problems to achieve a high level of sustainability for the substrate without significantly affecting its appearance.

[0022] The offset printing process, in particular the continuous offset process, is particularly suitable for printing a large quantity of substrates with very high graphic quality. Preferably, the printed substrate is therefore in strip form after printing and can be wound onto a roll and fed, for example, to a device for the production of the actual packaging. The grammage of paper layers ranges from 7 g / m2 to 225 g / m2. Higher grammages are referred to as cardboard according to DIN 6730. A preferred grammage of 20 g / m2 to 150 g / m2 ensures very good processability in the offset printing process, especially in the continuous offset printing process with very high production speeds.

[0023] If the at least one adhesive layer, which is arranged between the paper layer

[0024] and the metal layer, is designed for chemical curing, thermal curing, curing by UV rays, or electron beam curing, wherein the adhesive layer can be provided via one component or optionally by mixing at least two components, fast production cycles can be achieved in the transfer metallization of the paper layer according to one embodiment. In principle, all possible cross-linking processes can be used to cure an adhesive layer, in particular if they combine low layer thicknesses with good adhesion of the metal layer. Preferably, two component adhesives, respectively lacquers, are used, as these can be easily adjusted in terms of the curing time. Even shorter curing cycles can be achieved if the adhesive layer is designed for curing using UV rays or for electron beam curing. The adhesive layer designed for electron beam curing is preferably provided via a single component and, after electron beam curing, allows the provision of particularly low-migration adhesive layers that are free of solvents, plasticizers, or photoinitiators. This makes printed substrates with these adhesive layers particularly well suited for contact with consumer goods in the food sector.

[0025] According to a further embodiment of the printed substrate, the adhesive layer provided between the at least one paper layer and the metal layer has a thickness of 1 μm to 5 μm, preferably 1.5 μm to 4 μm, and particularly preferably 1.5 μm to 3.5 μm. The low thickness of the adhesive layer between the transfer-metallized metal layer and the paper layer enables particularly good recycling properties, since the majority of the printed substrate consists of paper, which is highly recyclable per se. The separation of paper and printing ink, as well as the metal layer, is carried out using standard paper recycling processes.

[0026] Preferably, the metal layer provided at least in some areas has a thickness of 10 nm to 100 nm, preferably 20 nm to 50 nm, according to a further embodiment, wherein the metal layer optionally consists of gold, silver, copper, nickel, tin, aluminum, or alloys of these metals. Aluminum or an aluminum alloy is preferred because it is inexpensive and has good properties in terms of the flexibility and chemical stability of the coating. Due to the transfer metallization, the extremely thin metal layer already provides very good barrier properties for water vapor.

[0027] The barrier properties of the printed substrate can be further improved according to a further embodiment by providing at least one second transfer-metallized metal layer on the second side of the carrier layer opposite the first transfer-metallized metal layer, which is connected to the carrier layer via at least one second adhesive layer, preferably a lacquer layer, wherein, optionally, the second metal layer has at least one coating with a release lacquer on the side opposite the carrier layer.

[0028] The metals mentioned above, namely gold, silver, copper, nickel, tin, aluminum, and their alloys, can also be used for the at least one second transfer-metallized metal layer. The same applies to the selection of adhesive layers. Reference is made to the explanations regarding the first transfer-metallized layer. An electron beam-curable adhesive layer is particularly preferred, so that the double-sided transfer metallized substrate also achieves the advantages in terms of recyclability and low migration of the substrate.

[0029] Finally, according to a further embodiment, the substrate can be further improved in that the side of the second transfer-metallized metal layer opposite the second adhesive layer is printed at least in some areas with at least one electron beam-curable printing ink and / or on the second side of the carrier layer at least one at least in some areas provided electron beam-curable coating comprising an overprint varnish is provided. This makes it possible to provide a substrate printed on both metal layers, which additionally has further improved barrier properties due to the at least one second metal layer. Further advantages resulting from the provision of a plurality of different electron beam-curable printing inks and overprint varnishes already during the printing of the first metal layer can also be achieved on the second side of the carrier layer.

[0030] According to a further embodiment of the printed substrate, at least one further functional, at least partially applied coating is provided on the carrier layer and / or as an outer coating of the printed substrate, which can additionally provide specific properties adapted to the packaging to be produced. On the carrier layer, for example, an additional functional coating can provide additional protection against moisture for the paper layer of the single-sided printed substrate. The provision of heat-sealing properties in some areas on the side intended as the outer coating of the printed substrate can be used to prepare the printed substrate for the production of packaging. In addition, further coatings are conceivable both on the carrier layer and on the outer side of the printed substrate, which can, for example, partially change the mechanical properties of the packaging to be produced.

[0031] According to a further embodiment, the printed substrate may also comprise means for identification of the printed substrate for devices for the production of packaging. Means for identification of the printed substrate for devices for the production of packaging may, for example, be specific identification areas which, for example, are left blank during transfer metallization, so that the device can identify the paper material at this point, for example. Other embodiments, for example information readable by corresponding devices, are also conceivable as means for identification.

[0032] Finally, the printed substrate preferably has a total thickness of 10 μm to 200 μm, preferably 15 μm to 150 μm, and particularly preferably 30 μm to 130 μm. The layer sequence of the printed substrate allows, apart from the paper layer, only minimal layer thicknesses of other materials to be used and yet the desired effects, such as high adhesion of the metal layer to the paper layer or a good barrier effect with minimal metal layer thickness, to be achieved. Preferably, the recyclable material content according to DIN 131430 of the substrate is at least 50% by weight, preferably at least 80% by weight, so that the printed substrate has good recycling properties.

[0033] According to a further aspect of the present invention, the object described

[0034] above is solved by a method for the production of a printed substrate mentioned at the beginning, in that

[0035] (iii) the carrier layer on the first side with the first transfer-metallized metal layer and / or on the optional release lacquer layer provided at least in some areas is printed with at least one electron beam-curable printing ink in at least some areas,

[0036] (iv) the printed first metal layer and / or the optionally printed release lacquer layer is coated at least in some areas with at least one electron beam curable overprint varnish, and

[0037] (v) the at least one printing ink and the at least one overprint varnish are cured by electron beam curing.

[0038] As already mentioned with regard to the printed substrate, it has surprisingly been found that electron beam curing of printing ink and electron beam curing of an overprint varnish can also be carried out on a transfer-metallized surface of a substrate, even though it is a metallized surface. The combination of the steps of transfer metallizing a carrier layer with at least one paper layer and subsequent printing the metallized layer and / or the optional release lacquer layer provided at least in some areas with at least one electron beam-curable printing ink, as well as, at least in some areas, coating of the printed side with at least one electron beam-curable overprint varnish, provides outstanding product properties in terms of recyclability, appearance, and barrier properties of the printed substrate, combined with an efficient production process. After electron beam curing of the overprint varnish, the printed substrate is completely manufactured and can be further processed immediately, for example for the production of packaging. No curing times are required.

[0039] The method steps (iii), (iv) and (v) mentioned here are not necessarily understood to be in the order of method steps (iii), (iv) and (v). Rather, the following order is also understood to be included, in which the at least one printing ink is first applied and then cured by electron beam curing. Subsequently, the at least one coating in some areas with an overprint varnish is applied and then cured by means of electron beam curing.

[0040] According to one embodiment of the method, the printing of the first transfer-metallized metal layer and / or the optional release lacquer layer provided at least in some areas is carried out using an offset printing process, preferably a continuous offset printing process, wherein, preferably, the printing with at least one electron beam-curing printing ink and the coating at least in some areas with at least one electron beam-curing overprint varnish can then be carried out, for example, in an offset printing device.

[0041] The offset printing process has the advantage that it can deliver particularly economical high quantities of substrate with consistent, very high print quality. Preferably, a continuous offset printing process is used, which has a web-shaped, printed substrate as the end product. If, in this method, the printing of the at least one electron beam-curable printing ink and the coating, at least in some areas, with at least one electron beam-curable overprint varnish are carried out in an offset printing device, the applied printing inks and overprint varnishes can be cured together in a downstream electron beam curing unit. The printing with at least one electron beam-curable printing ink and the coating, at least some areas, with at least one overprint varnish is carried out, for example, in offset printing units provided for this purpose. In the continuous offset printing process, a large number of such printing units, for example 8 or 10, can be used. Due to the modular design of offset printing machines, there is usually no limitation on the number of offset printing units per offset printing device. Usually, after printing and curing, the finished substrate is wound onto a roll so that it can be fed into devices for the production of corresponding packaging or further processing steps. Preferably, method steps (iii) and (iv), (iii) to (v) or even (ii) to (v) are integrated into an offset printing device, enabling a compact design of the production lines with a very high production rate. It is also conceivable to integrate the metallization of the second side of the carrier layer and its printing and coating into an offset printing device.

[0042] According to a further embodiment of the method, the finished printed substrate is transfer metallized, at least in some areas, on the second side of the carrier layer opposite the first transfer metallized metal layer with at least one second metal layer using step (ii), wherein the steps (iii) and (v) and / or (iv) and (v) can optionally be carried out on the second side of the carrier layer. This allows a printed substrate to be produced with a carrier layer that has at least one transfer-metallized metal layer on each side. Steps (iii) and (iv) can in turn be carried out using the offset printing process, preferably the continuous offset printing process with electron beam curable printing inks and overprint varnishes. Of course, steps (iii) and (v) and / or (iv) and (v) can also be carried out in an offset printing device.

[0043] According to a further embodiment of the method, the adhesive layer, preferably a lacquer layer, used in the transfer metallization according to step (ii) between the at least one paper layer and the metal layer is an electron beam curable adhesive layer which is cured by electron beam curing. The use of electron beam curable adhesive layers in transfer metallization allows transfer metallization to be carried out at a very high production rate compared to conventional two-component adhesives. It allows integration into offset printing machines. In addition, it can be used to provide a low-migration bonding layer to the paper layer of the carrier layer, which offers advantages in terms of suitability for food packaging.

[0044] Finally, the method is further improved in that at least one further functional, at least partially applied coating is applied to the finished printed substrate. As explained above, this allows the printed substrate to be equipped with additional functions, for example, heat-sealing areas adapted to the production of the packaging, areas with specific mechanical properties, or barrier properties.

[0045] According to a further aspect of the present invention, the above-mentioned object is solved by packaging comprising a printed substrate according to the invention, wherein the packaging is preferably packaging for consumer goods from the food sector or non-food sector.

[0046] These types of packaging are usually dominated by plastic packaging. Thanks to the recycling-friendly, paper-based packaging comprising the printed substrate according to the invention, food packaging and packaging for consumer goods from the non-food sector can be recycled as paper.

[0047] Particularly preferred packaging comprising the printed substrate according to the invention are flat bags, square-bottom bags, block-bottom bags, cross-bottom bags, stand-up pouches, or tubular bags. These packaging types, equipped with the printed substrate, can be used for entirely new product groups, particularly in the food or non-food sector, even though specific packaging properties such as resistance to certain substances or barrier properties against gaseous substances are required. Other types of packaging, such as packaging lids, can also be provided using the printed substrate.BRIEF DESCRIPTION OF THE DRAWINGS

[0048] There are now a variety of possibilities for designing the invention. Reference is made to the claims and to the description of embodiments in conjunction with the drawing. The drawing shows in

[0049] FIG. 1 shows a schematic representation of a method for transfer metallization, at least in some areas, of a carrier layer with a paper layer,

[0050] FIG. 2 shows a schematic representation of a method for the production of a printed substrate with a transfer-metallized side of a carrier layer according to an embodiment of the invention,

[0051] FIG. 3 shows a schematic representation of a method for the production of a printed substrate with a second transfer-metallized side of a carrier layer according to an embodiment of the invention,

[0052] FIG. 4 shows a schematic representation of a method for converting the substrate into various types of packaging, and

[0053] FIG. 5 shows schematic views of packaging comprising the printed substrate.DETAILED DESCRIPTION

[0054] FIG. 1 first shows a method for the production of a substrate with a carrier layer 1 with at least one paper layer 2, which is transfer metallized on one side. For this purpose, a carrier layer 1 with at least one paper layer 2 is first provided. The carrier layer 1 is preferably web-shaped and is provided as a roll.

[0055] In addition, a carrier film 2 is provided. In addition to an optional layer with a release lacquer 4, the carrier film 2 has a metal layer 5 provided at least in some areas. The carrier film 3 usually consists of a plastic film and can be used again for transfer metallization after transfer metallization.

[0056] In addition, an adhesive layer 6 is applied for laminating, for example as a lacquer layer on the carrier layer 1 or on the metal layer 5 of the carrier film. The adhesive layer 6 is designed for thermal curing, curing by UV rays, or electron beam curing, wherein the adhesive layer is provided via one component or optionally by mixing at least two components. The layer thickness of the adhesive layer 6 is 1 μm to 4 μm, preferably 1.5 μm to 3.5 μm. The metal layer provided at least in some areas can have a thickness of 10 nm to 100 nm, preferably 20 nm to 50 nm, wherein the metal layer optionally consists of gold, silver, copper, nickel, tin, aluminum, or alloys of the metals. The carrier film is also provided as a roll.

[0057] The carrier layer 1 is now transfer metallized at least in some areas. For this purpose, the carrier layer 1 is laminated with the carrier foil 3 in step A, for example, so that the adhesive layer 6 of the carrier foil 3 is in contact with the paper layer 2. In step A, the adhesive layer 6 is cured using the curing process specific to the adhesive layer. Both steps A and B can be carried out in quick succession. After the adhesive layer has been cured, the separation of the carrier film 3 from the carrier layer 1 is carried out so that the adhesive layer 6 remains on the carrier layer 1 with the metal layer 5 provided at least in some areas. For example, according to one embodiment, the adhesive layer 6 is designed as an electron beam-curable adhesive layer, so that economical electron beam curing can be used to cure the adhesive layer. After transfer metallization, at least in some areas, of the carrier layer 1, it has, in addition to the paper layer 2, an adhesive layer 6, a metal layer 5 provided at least in som areas, as well as an optional coating with a release lacquer 4 provided on the metal layer 5. The transfer-metallized carrier layer 1a is then fed to the printing process.

[0058] FIG. 2 now shows an embodiment of the present invention, in which the transfer-metallized carrier layer 1 is printed, in accordance with step C, on the first side, at least in some areas, with at least one electron beam-curable printing ink. As shown in FIG. 2, in the present embodiment, the optional coating with a release lacquer 4 is printed. Furthermore, in step C, at least one overprint varnish is applied at least in some areas. Several overprint varnishes can also be used, for example a glossy and a matt overprint varnish, in order to provide additional optical effects on the substrate. Subsequently, in accordance with step D, the at least one printing ink and the at least one overprint varnish are cured on the first metal layer 5 by electron beam curing.

[0059] Preferably, the first transfer-metallized metal layer 5 is printed using an offset printing process, preferably a continuous offset printing process, wherein printing, at least in some areas, with at least one printing ink and at least one overprint varnish is preferably carried out in a device, preferably an offset printing device. The at least one printing ink and the at least one overprint varnish are then cured by electron beam curing. The substrate 1b, which has been transfer metallized and printed on one side in this way, can then be fed to a further transfer metallization step. This is shown schematically in FIG. 3.

[0060] According to FIG. 3, in a preferred embodiment, the finished printed substrate 1b is transfer metallized, at least in some areas, on the second side of the carrier layer 1 opposite the first transfer metallized metal layer 5 with at least one second metal layer 5′ using steps A and B and separating the carrier film 3, wherein, optionally, steps C and D mentioned above are then carried out on the second side of the carrier layer 1. As a result, the carrier layer on the second side has either only an adhesive layer 6′, a metal layer 5′ provided at least in some areas, a coating with a release lacquer 4′, and a coating with an electron beam-curable overprint varnish 8′. Alternatively, in addition to the layers mentioned, at least one electron beam curable printing ink 7′ may also be provided.

[0061] The printed substrates 1b, 1c, and 1d can be subjected to further processing steps 10 in roll form. For example, the printed substrates 1b, 1c, 1d can be provided with further functional coatings. This is shown schematically in FIG. 4.

[0062] Here, according to a further embodiment, the printed substrates 1b, 1c, 1d are provided with at least one further functional, at least partially applied coating in step E and then preferably returned to roll form. The at least one further functional, at least partially applied coating 10 is provided on the carrier layer 1 and / or as an outer coating 9, 9′ of the printed substrate 1b′, 1c′ or 1d′, which can provide specific properties adapted to the packaging to be produced. For example, the printed substrate 1b′ may have coatings adapted to the packaging form of a square-bottom bag 11 to provide heat sealing. Similarly, as shown in FIG. 4, the printed substrates 1c′, 1d′ can be equipped with additional functions, for example, heat-sealing areas adapted to the production of the packaging, areas with specific mechanical properties, or have additional barrier properties.

[0063] Furthermore, it is conceivable to incorporate means for identification of the printed substrate 1b, 1c, 1d for devices for the production of packaging in step E. Here, too, mechanical or optical features can be incorporated. In principle, it is also possible not to equip partial regions of the carrier layer with a transfer-metallized metal layer 5, 5′ in order to enable identification as a paper-based substrate. It is also conceivable to incorporate perforations adapted to the packaging for the production of corresponding packaging. In FIG. 4, substrates 1b′, 1c′, and 1d′ are therefore adapted to other packaging such as the stand-up pouch 12 and the block-bottom bag 13.

[0064] Additionally, FIG. 5 shows further packaging that may comprise the printed substrate 1b, 1c, 1d according to the invention. Compared to FIG. 4, FIG. 5 additionally shows the tubular bag 14 and the cross-bottom bag 15 as examples of packaging.

[0065] All references, including publications, patent applications, and patents cited herein are hereby incorporated by reference to the same extent as if each reference were individually and specifically indicated to be incorporated by reference and were set forth in its entirety herein.

[0066] The use of the terms “a” and “an” and “the” and similar referents in the

[0067] context of describing the invention (especially in the context of the following claims) is to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. The terms “comprising,”“having,”“including,” and “containing” are to be construed as open-ended terms (i.e., meaning “including, but not limited to,”) unless otherwise noted. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., “such as”) provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.

[0068] Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. Variations of those preferred embodiments may become apparent to those of ordinary skill in the art upon reading the foregoing description. The inventors expect skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than as specifically described herein. Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.

Claims

1. Printed substrate, preferably for the production of paper-based packaging, with a carrier layer comprising at least one paper layer, wherein on a first side of the carrier layer a first transfer-metallized metal layer is provided, which is connected to the carrier layer via at least one adhesive layer, preferably at least one lacquer layer,wherein the first metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer,whereinthe carrier layer on the first transfer-metallized metal layer and / or on the coating with a release lacquer optionally provided at least in some areas on the first transfer-metallized metal layer is printed at least in some areas with at least one electron beam-curable printing ink, and at least one, at least in some areas provided electron beam-curable coating with an overprint varnish is provided on the printed side of the carrier layer, wherein the recyclable material content according to DIN 131430 of the substrate is at least 80% by weight.

2. Printed substrate according to claim 1,whereinthe at least one paper layer is suitable for processing in the offset printing process, preferably the continuous offset printing process, and optionally has a grammage of 20 to 150 g / m2, preferably 35 to 120 g / m2.

3. Printed substrate according to claim 1,whereinthe at least one adhesive layer arranged between the paper layer and the metal layer is designed for thermal curing, for curing by UV rays, or for electron beam curing,wherein the adhesive layer can be provided via one component or optionally by mixing at least two components.

4. Printed substrate according to claim 1,whereinthe adhesive layer provided between the at least one paper layer and the metal layer has a thickness of 1 μm to 5 μm, preferably 1.5 μm to 4 μm, particularly preferably 1.5 μm to 3 μm.

5. Printed substrate according to claim 1,whereinthe metal layer provided at least in some areas has a thickness of 10 nm to 100 nm, preferably 20 nm to 50 nm, wherein the metal layer optionally consists of gold, silver, copper, nickel, tin, aluminum, or alloys of the metals.

6. Printed substrate according to claim 1,whereinon the second side of the carrier layer opposite the first transfer-metallized metal layer, at least one second transfer-metallized metal layer is provided, which is connected to the carrier layer via at least one second adhesive layer, preferably a lacquer layer,wherein optionally the second metal layer has at least one coating with a release lacquer on the side opposite the carrier layer.

7. Printed substrate according to claim 6,whereinthe side of the second transfer-metallized metal layer opposite the second adhesive layer is printed at least in some areas with at least one electron beam-curable printing ink and / or on the second side of the carrier layer at least one, at least in some areas provided electron beam-curable coating comprising an overprint varnish is provided.

8. Printed substrate according to claim 1,whereinat least one further functional, at least partially applied coating is provided on the carrier layer and / or as an outer coating of the printed substrate, which can provide specific properties adapted to the packaging to be produced.

9. Printed substrate according to claim 1,whereinmeans for identification of the printed substrate for devices for the production of packaging are provided.

10. Printed substrate according to claim 1,whereinthe printed substrate preferably has a total thickness of 10 μm to 200 μm, preferably 15 μm to 150 μm, particularly preferably 30 μm to 130 μm.

11. Method for the production of a printed substrate according to claim 1, comprising the steps:(i) providing a carrier layer with at least one paper layer,(ii) transfer-metallizing, at least in some areas, the at least one carrier layer on one side with at least one first metal layer comprising the stepsa) laminating the carrier layer with a carrier film comprising at least one optional release lacquer layer and at least one metal layer provided at least in some areas on the release lacquer layer or directly on the carrier film, wherein an adhesive layer is provided between the metal layer of the carrier film and the carrier layer, and the carrier layer and the metal layer are brought into contact with each other via the at least one adhesive layer,b) curing the at least one adhesive layer, andc) separating the carrier film from the carrier layer) so that the adhesive layer remains on the carrier layer with the metal layer provided at least in some areas,wherein, optionally, the metal layer on the side opposite the carrier layer has at least one coating with a release lacquer,wherein(iii) the carrier layer is printed on the first side with the first transfer-metallized metal layer and / or on the optional release lacquer layer provided at least in some areas with at least one electron beam-curable printing ink in at least some areas,(iv) the printed first metal layer and / or the optionally printed release lacquer layer is coated at least in some areas with at least one electron beam-curable overprint varnish, and(v) the at least one printing ink and the at least one overprint varnish are cured by electron beam curing.

12. Method according to claim 11,whereinthe printing of the first transfer-metallized metal layer and / or the optional release lacquer layer provided at least in some areas is carried out by means of an offset printing process, preferably a continuous offset printing process, wherein, preferably, the printing with printing ink and the coating, at least in some areas, with overprint varnish are carried out sequentially in an offset printing device.

13. Method according to claim 11,whereinthe finished printed substrate is transfer metallized, at least in some areas, on the second side of the carrier layer opposite the first transfer metallized metal layer with at least one second metal layer using step, wherein, optionally, subsequentially, the steps (iii) and (v) and / or (iv) and (v) are carried out on the second side of the carrier layer.

14. Method according to claim 11,whereinthe adhesive layer, preferably lacquer layer, used in the transfer metallization according to step (ii) between the at least one paper layer and the metal layer is an electron beam curable adhesive layer, which is cured in step b) by electron beam curing.

15. Method according to claim 11,whereinthe finished printed substrate undergoes at least one further processing step, which preferably comprises coating a further functional, at least partially applied coating and / or introducing at least one microperforation provided at least in some areas.

16. Packaging comprising a printed substrate preferably for the production of paper-based packaging, with a carrier layer comprising at least one paper layer, wherein on a first side of the carrier layer a first transfer-metallized metal layer is provided, which is connected to the carrier layer via at least one adhesive layer, preferably at least one lacquer layer, wherein the first metal layer optionally has at least one coating with a release lacquer on the side opposite the carrier layer,whereinthe carrier layer on the first transfer-metallized metal layer and / or on the coating with a release lacquer optionally provided at least in some areas on the first transfer-metallized metal layer is printed at least in some areas with at least one electron beam-curable printing ink, and at least one, at least in some areas provided electron beam-curable coating with an overprint varnish is provided on the printed side of the carrier layer, wherein the recyclable material content according to DIN 131430 of the substrate is at least 80% by weight;wherein the printed substrate has preferably been produced using the method according to claim 11, wherein the packaging is preferably packaging for consumer goods from the food sector or non-food sector.

17. Packaging according to claim 16,whereinthe packaging is a flat bag, a square-bottom bag, a stand-up pouch, a block-bottom bag, a tubular bag, or a cross-bottom bag.

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