Insulation plate for a semiconductor manufacturing apparatus

USD1112115SActive Publication Date: 2026-02-10KOKUSAI DENKI KK
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Patent Information

Application Number
US29/920441
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Priority Date
2023-06-12
Filing Date
2023-12-11
Publication Date
2026-02-10
Estimated Expiration
2041-02-10

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Description

[0001] FIG. 1 is a front, bottom and right side perspective view of an insulation plate for a semiconductor manufacturing apparatus, showing my new design;

[0002] FIG. 2 is a front elevational view thereof;

[0003] FIG. 5 is a rear elevational view thereof;

[0004] FIG. 4 is a left side elevational view thereof;

[0005] FIG. 3 is a right side elevational view thereof;

[0006] FIG. 6 is a top plan view thereof;

[0007] FIG. 7 is a bottom plan view thereof; and,

[0008] FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2.

Claims

The ornamental design for an insulation plate for a semiconductor manufacturing apparatus, as shown and described.

Citation Information

Patent Citations

  • Heat-retaining tube heat-radiating fin for semiconductor manufacturing equipment

    JP1375365S

  • Heat insulating plate for substrate processing equipment

    JP1624353S

  • Adiabatic plate for substrate processing apparatus

    USD924823S

  • Vertical wafer boat

    US10008402B1

  • Method for controlling temperature of furnace in semiconductor fabrication process

    US10453713B2