Display panel, display device, and tiled display device

Abstract

A display panel, a display device, and a tiled display device. The display panel comprises a substrate, a plurality of light-emitting devices, a plurality of first electrodes, a plurality of second electrodes, and a plurality of connecting traces. The substrate comprises a first surface and a second surface, and a plurality of side surfaces, which connect the first surface and the second surface, wherein at least one of the plurality of side surfaces is a selected side surface. Each of the plurality of connecting traces comprises a first section, a second section and a third section, which are sequentially connected, wherein the first section is at least arranged on the first surface, and is electrically connected to one of the plurality of first electrodes; the second section is arranged on the selected side surface; the third section is at least arranged on the second surface, and is electrically connected to one of the plurality of second electrodes; and the maximum width of the first section in a first direction and / or the maximum width of the third section in the first direction are / is greater than the maximum width of the second section in the first direction.

Description

Display panel, display device, and spliced ​​display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display device, and a spliced ​​display device. Background Art

[0002] Mini LED (Mini Light-Emitting Diode) display devices and Micro LED (Micro Light-Emitting Diode) display devices have self-luminous display characteristics, and their advantages include all-solid-state, long life, high brightness, low power consumption, small size, and ultra-high resolution.

[0003] Due to the high difficulty of mass-transferring Mini LED chips in Mini LED displays and Micro LED chips in Micro LED displays, it is difficult to directly produce large-scale display devices. Therefore, multiple small-scale Mini LED display devices or multiple small-scale Micro LED display devices are usually spliced ​​together to produce large-scale display panels.

[0004] Summary of the Invention

[0005] In one aspect, a display panel is provided. The display panel includes a substrate, multiple light-emitting devices, multiple first electrodes, multiple second electrodes, and multiple connecting traces. The substrate includes a first surface, a second surface, and multiple side surfaces connecting the first and second surfaces, at least one of the multiple side surfaces being a selected side surface. The multiple light-emitting devices are disposed on the first surface. Multiple first electrodes are disposed on the first surface, the multiple first electrodes being spaced apart along a first direction; the multiple first electrodes are close to the selected side surface relative to the multiple light-emitting devices. Multiple second electrodes are disposed on the second surface, the multiple second electrodes being spaced apart along the first direction and close to the selected side surface. The multiple connecting traces are arranged in parallel and spaced apart, and each of the multiple connecting traces includes a first portion, a second portion, and a third portion connected in sequence, wherein the first portion is disposed at least on the first surface and is electrically connected to one of the multiple first electrodes, the second portion is disposed on the selected side surface, and the third portion is disposed at least on the second surface and is electrically connected to one of the multiple second electrodes. The maximum width of the first portion along the first direction and / or the maximum width of the third portion along the first direction is greater than the maximum width of the second portion along the first direction.

[0006] In some embodiments, in at least one connecting trace, among the at least two section segments of the orthographic projection pattern of the first portion on the first surface along the first direction, the section segment closer to the selected side surface has a larger size in the first direction than the section segment farther away from the selected side surface; and / or, among the at least two section segments of the orthographic projection pattern of the third portion on the second surface along the first direction, the section segment closer to the selected side surface has a larger size in the first direction than the section segment farther away from the selected side surface.

[0007] In some embodiments, the second portion of the connecting trace includes a first end and a second end, and a dimension of the first end in the first direction is larger than a dimension of the second end in the first direction.

[0008] In some embodiments, the first portion partially overlaps with the first electrode, and the third portion partially overlaps with the second electrode.

[0009] In some embodiments, the display panel further includes a plurality of signal lines disposed on the first surface, the plurality of signal lines electrically connecting the plurality of first electrodes to a plurality of light-emitting devices, wherein each signal line is electrically connected to one of the first electrodes, and a dimension of the signal line in the first direction is not greater than a dimension of the first electrode in the first direction.

[0010] In some embodiments, the display panel further includes at least one extension line disposed on a side of at least one first electrode close to the selected side surface, the at least one extension line being electrically connected to the first electrode; and the at least one extension line being electrically connected to a connecting trace.

[0011] In some embodiments, there are multiple extension lines electrically connected to the first electrode, and a distance between any two of the extension lines is greater than or equal to 60 μm.

[0012] In some embodiments, at least two of the extension lines are electrically connected to the first portion of the connecting trace; the size of the first portion along the first direction is greater than the spacing between the two extension lines; or, the first portion includes at least two sub-portions, and the size of any sub-portion in the first direction is not less than the size of any of the extension lines in the first direction; and at least two of the sub-portions overlap with at least two of the extension lines, respectively.

[0013] In some embodiments, a dimension of the extension line in the first direction is less than or equal to 30 μm.

[0014] In some embodiments, the plurality of signal lines and the extension lines are formed of a first metal layer, and the plurality of first electrodes are formed of the first metal layer and a second metal layer, wherein the second metal layer is farther away from the first surface than the first metal layer.

[0015] In some embodiments, in the connected signal line and the extended line, a dimension of the signal line in the first direction is larger than a dimension of the extended line in the first direction.

[0016] In some embodiments, the substrate includes a first substrate and a second substrate, the first substrate includes a first surface and a third surface relative to each other, and a plurality of first side surfaces connecting the first surface and the third surface; the second substrate includes a fourth surface and a second surface relative to each other, and a plurality of second side surfaces connecting the fourth surface and the second surface; the third surface and the fourth surface are close to each other; at least one first side surface among the plurality of first side surfaces is a first selected side surface, and at least one second side surface among the plurality of second side surfaces is a second selected side surface, and the first selected side surface and the second selected side surface are located in the same plane, constituting the selected side surface of the substrate.

[0017] In some embodiments, the second surface includes a first area and a second area, the first area has a first distance from the first surface, the second area has a second distance from the first surface, and the first distance is greater than the second distance.

[0018] In some embodiments, the first distance is twice the second distance.

[0019] In some embodiments, the substrate further includes a glue layer, which is disposed between the third surface and the fourth surface and configured to adhere the third surface to the fourth surface.

[0020] In some embodiments, the adhesive layer is made of a thermally curable or UV (Ultra-Violet Ray) curable material, and a plurality of silicon balls are evenly arranged inside the adhesive layer.

[0021] In another aspect, a display device is provided, comprising: a display panel according to any of the above embodiments; and a driver circuit board, wherein the driver circuit board is disposed on the second surface of a substrate of the display panel, and is electrically connected to a plurality of connection traces of the display panel.

[0022] In another aspect, a spliced ​​display device is provided, comprising: the display device according to any one of the above embodiments, wherein the selected side surfaces of the display devices in the same column or row are located on the same side. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0024] FIG1 is a structural diagram of a display panel according to some embodiments;

[0025] FIG2A is a cross-sectional view of a display panel according to some embodiments;

[0026] FIG2B is another cross-sectional view of a display panel according to some embodiments;

[0027] FIG3 is another cross-sectional view of a display panel according to some embodiments;

[0028] FIG4 is a partial physical photograph of connection wiring of a display panel according to some embodiments;

[0029] FIG5A is a diagram illustrating a connection structure between a connection line and a first electrode of a display panel according to some embodiments;

[0030] FIG5B is another connection structure diagram of the connection wiring and the first electrode of the display panel according to some embodiments;

[0031] FIG6 is a diagram illustrating a connection structure between a connection line of a display panel and a second electrode according to some embodiments;

[0032] FIG7A is a structural diagram of a display panel according to some embodiments;

[0033] FIG7B is another structural diagram of a display panel according to some embodiments;

[0034] FIG7C is a cross-sectional view of a display panel according to some embodiments;

[0035] FIG8A is a diagram illustrating a connection structure between connection lines and extension lines of a display panel according to some embodiments;

[0036] FIG8B is a diagram illustrating a connection structure between connection lines and extension lines of a display panel according to some embodiments;

[0037] FIG8C is a cross-sectional view of an extension line of a display panel according to some embodiments;

[0038] FIG9 is another connection structure diagram of the connection lines and extension lines of the display panel according to some embodiments;

[0039] FIG10A is a side structural diagram of a substrate of a display panel according to some embodiments;

[0040] FIG10B is another side structural diagram of a substrate of a display panel according to some embodiments;

[0041] FIG11A is another side structural diagram of a substrate of a display panel according to some embodiments;

[0042] FIG11B is another side structural diagram of a substrate of a display panel according to some embodiments;

[0043] FIG12A is a structural diagram of a glue layer of a display panel according to some embodiments;

[0044] FIG12B is a structural diagram of a glue layer of a display panel according to some embodiments;

[0045] FIG13 is a structural diagram of a display device according to some embodiments;

[0046] FIG14 is another structural diagram of a display device according to some embodiments;

[0047] FIG15 is a structural diagram of a spliced ​​display device according to some embodiments;

[0048] FIG16 is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0049] FIG17 is another flow chart of a method for manufacturing a display panel according to some embodiments;

[0050] FIG18A is a structural diagram of an initial first substrate of a display panel according to some embodiments;

[0051] FIG18B is another structural diagram of an initial first substrate of a display panel according to some embodiments;

[0052] FIG18C is a structural diagram of an initial second substrate of a display panel according to some embodiments;

[0053] FIG18D is another structural diagram of an initial second substrate of a display panel according to some embodiments;

[0054] FIG19A is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0055] FIG19B is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0056] FIG19C is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0057] FIG20 is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0058] FIG21A is a process diagram of a method for manufacturing a display panel according to some embodiments;

[0059] FIG21B is another process diagram of a method for manufacturing a display panel according to some embodiments;

[0060] FIG21C is another process diagram of a method for manufacturing a display panel according to some embodiments;

[0061] FIG22A is a process diagram of a method for manufacturing a display panel according to some embodiments;

[0062] FIG22B is another process diagram of a method for manufacturing a display panel according to some embodiments;

[0063] FIG. 23 is a process diagram of a method for manufacturing a display panel according to some embodiments. DETAILED DESCRIPTION

[0064] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0065] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0066] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0067] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0068] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0069] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0070] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0071] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0072] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0073] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0074] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0075] In order to improve product reliability and reduce transportation and maintenance costs, a large-size display device can be assembled by splicing multiple small-size display devices.

[0076] To avoid the sense of fragmentation in the display caused by splicing, it is necessary to reduce the bezel size of a single small-sized display device and the width of the splicing seam. A small-sized display device includes a display panel. For example, the wiring on the display surface side of the display panel can be connected to the circuit board disposed on the non-display surface side of the display panel via connecting leads located on the side of the substrate. Therefore, when multiple small-sized display devices are spliced ​​together to form a larger large-sized display device, the spacing between adjacent small-sized display devices can be reduced, thereby improving the display quality of the large-sized display device formed by splicing multiple small-sized display devices.

[0077] Currently, Mini LED (Mini Light-Emitting Diode) and Micro LED (Micro Light-Emitting Diode) display panels generally use transparent glass or organic glass as substrate materials. During the process of manufacturing display panels, defects are inevitable in the substrate.

[0078] In some embodiments, an array layer is formed on the front of the substrate through an array process. The array layer includes multiple signal lines and multiple electrodes. Light-emitting devices are provided on the side of the array layer away from the substrate, and the multiple signal lines are electrically connected to the light-emitting devices. Multiple connecting wires are provided on the side of the substrate. One end of the connecting wire is connected to the metal electrode on the front of the substrate, and the other end extends to the back of the substrate, serving as a back electrode and connecting to a circuit board. The circuit board transmits control signals to the multiple light-emitting devices via the connecting wires and the front electrodes, thereby controlling the image displayed on the display panel.

[0079] In some examples, metal electrodes and connecting leads are obtained by laser etching a metal layer. After etching, the etched surface of the metal layer is exposed, which is prone to bumps and corrosion. Taking the connecting lines as an example, the etched surface of the connecting lines is partially exposed and is not completely isolated from the outside world. The exposed parts are prone to bumps and corrosion, which eventually causes poor lines, affects the normal transmission of signals, and thus affects the normal operation of the display panel.

[0080] Based on this, some embodiments of the present disclosure provide a display panel, a display device and a spliced ​​display device. The display panel adopts a three-dimensional printing process to produce side wiring, which can avoid line damage and corrosion, solve the problem of poor line, and there is no need to turn the substrate over during the processing process, preventing the substrate from contacting the equipment to cause scratches and dirt, as well as static electricity release, thereby improving product yield and quality.

[0081] The display panel, display device and spliced ​​display device provided by the present disclosure are introduced below respectively.

[0082] Some embodiments of the present invention provide a display panel 10, as shown in FIG1 , which includes a display area AA and a peripheral area BB disposed at least on one side of the display area AA. For example, the peripheral area BB may be located on one side, two sides, or three sides of the display area AA, or the peripheral area BB may be disposed around the display area AA.

[0083] In some embodiments, as shown in FIG2A , a display panel 10 includes a substrate 1, multiple light-emitting devices 2, multiple first electrodes 3, multiple second electrodes 4, and multiple connecting traces 5. The substrate 1 includes a first surface 1a and a second surface 1b, as well as multiple side surfaces 1c connecting the first surface 1a and the second surface 1b. The multiple side surfaces 1c are planar, and at least one of the multiple side surfaces 1c of the substrate 1 is a selected side surface 1cc. The multiple light-emitting devices 2 and the multiple first electrodes 3 are disposed on the first surface 1a of the substrate. The multiple first electrodes 3 are spaced apart along a first direction X, and the multiple first electrodes 3 are located adjacent to the selected side surface 1cc relative to the multiple light-emitting devices 2. The multiple first electrodes 3 are electrically connected to the multiple light-emitting devices 2. The multiple second electrodes 4 are disposed on the second surface 1b of the substrate. The multiple second electrodes 4 are spaced apart along the first direction X and adjacent to the selected side surface 1cc.

[0084] It should be noted that the multiple first electrodes 3 and the multiple light-emitting devices 2 may be in indirect contact with the first surface 1a of the substrate 1. For example, an insulating layer may be provided between the multiple first electrodes 3 and the first surface 1a of the substrate 1, and a film structure such as a drive circuit layer 8 may be provided between the multiple light-emitting devices 2 and the first surface 1a of the substrate 1. The drive circuit layer 8 may include multiple signal lines. The multiple first electrodes 3 are electrically connected to the light-emitting devices 2 via the signal lines in the drive circuit layer 8. The signal lines are configured to transmit signals to the light-emitting devices 2 to drive the light-emitting devices 2 to emit light.

[0085] Exemplarily, as shown in FIG1 , the display panel 10 includes sub-pixels P of at least three colors, wherein the sub-pixels of the multiple colors include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, where the first color, the second color, and the third color are three primary colors (e.g., red, green, and blue). Exemplarily, each sub-pixel P includes at least one light-emitting device.

[0086] Exemplarily, the light-emitting device 2 includes but is not limited to OLED (Organic Light-Emitting Diode), Mini LED, Micro LED, etc.

[0087] The first surface 1 a of the substrate 1 is the front surface of the substrate 1 , corresponding to the display side of the display panel 10 , and the second surface 1 b of the substrate 1 is the back surface of the substrate, corresponding to the non-display side of the display panel 10 .

[0088] Exemplarily, the shapes of the first surface 1 a and the second surface of the substrate 1 are, for example, rectangular, and the material of the substrate 1 is, for example, a rigid material such as glass, quartz, or plastic.

[0089] 2A and 2B , the plurality of first electrodes 3 and the plurality of second electrodes 4 extend in a direction perpendicular to the selected side surface 1cc of the substrate 1, for example, the second direction Y shown in FIG. A dimension D1 of each of the plurality of first electrodes 3 along the second direction Y is smaller than a dimension D2 of each of the plurality of second electrodes 4 along the second direction Y. The plurality of first electrodes 3 are located in the peripheral area BB of the first surface 1a, and the orthographic projections of the plurality of second electrodes 4 on the first surface 1a of the substrate 1 extend to the display area AA.

[0090] In some embodiments, multiple connecting lines 5 are arranged in parallel and at intervals, and the multiple connecting lines 5 are made by a three-dimensional printing process; referring to Figures 2A and 2B, each connecting line 5 in the multiple connecting lines 5 includes a first part 51, a second part 52 and a third part 53 connected in sequence, wherein the first part 51 is at least arranged on the first surface 1a, the second part 52 is arranged on the selected side surface 1cc, and the third part 53 is at least arranged on the second surface 1b, and is electrically connected to one of the multiple second electrodes 4.

[0091] It should be noted that the first portion 51 is at least disposed on the first surface 1a, which means that the first portion 51 is entirely or partially located on the first surface 1a. The third portion 53 is at least disposed on the second surface 1b, which means that the third portion 53 is entirely or partially located on the second surface 1b.

[0092] In some examples, the first surface 1a or the second surface 1b directly connects to the selected side surface 1cc. That is, the two adjacent boundaries of the first surface 1a of the substrate 1 and the selected side surface 1cc coincide, and the two adjacent boundaries of the second surface 1b of the substrate 1 and the selected side surface 1cc coincide. In this case, the first portion 51 may be entirely disposed on the first surface 1a, or may include a portion extending to the selected side surface 1cc. It is understood that the first portion 51 is continuously and integrally formed. The third portion 53 may be entirely disposed on the second surface 1b, or may include a portion extending to the selected side surface 1cc. It is understood that the third portion 53 is continuously and integrally formed.

[0093] In some examples, a transitional side surface may be provided between the first surface 1a or the second surface 1b and the selected side surface 1cc. The transitional side surface may be multiple surfaces connected in sequence, or may be a flat surface or a curved surface, as shown in Figures 2A and 2B. In this case, the first portion 51 may be provided entirely on the first surface 1a, or may include a portion of the transitional side surface extending between the first surface 1a and the selected side surface 1cc, or may include a portion extending to the selected side surface 1cc. It is understood that the first portion 51 is continuous and integral. The third portion 53 may be provided entirely on the second surface 1b, or may include a portion of the transitional side surface extending between the second surface 1b and the selected side surface 1cc, or may include a portion extending to the selected side surface 1cc. It is understood that the third portion 53 is continuous and integral. It is understood that in some embodiments, the second portion 52 may also include a portion extending to the transitional side surface.

[0094] For example, referring to Figures 2A and 2B , a first transition side surface 1d is provided between the selected side surface 1cc and the first surface 1a, and a second transition side surface 1e is provided between the selected side surface 1cc and the second surface 1b. The first surface 1a is connected to the selected side surface 1cc via the first transition side surface 1d, and the second surface 1b is connected to the selected side surface 1cc via the second transition side surface 1e. The connecting trace 5 extends from the first surface 1a through the first transition side surface 1d, the selected side surface 1cc, and the second transition side surface 1e to the second surface 1b. It is understood that a portion of the first portion 51 is located on the first surface 1a of the substrate 1, while another portion may be located on the first transition side surface 1d between the first surface 1a and the selected side surface 1cc. A portion of the third portion 53 is located on the second surface 1b of the substrate 1, while another portion may be located on the second transition side surface 1e between the second surface 1b and the selected side surface 1cc.

[0095] It can be understood that the setting of the first transition side surface 1d and the second transition side surface 1e is equivalent to setting a chamfer or rounded corner between the selected side surface 1cc and the first surface 1a or the second surface 1b and the selected side surface 1cc, which can reduce the possibility of bumps and scratches caused during the setting of the side lines.

[0096] In some embodiments, referring to FIG4 , in the connecting trace 5 , the maximum width B1 of the first portion 51 along the first direction X and / or the maximum width B3 of the third portion 53 along the first direction X are greater than the maximum width B2 of the second portion 52 along the first direction X. The first direction X is a direction perpendicular to the overall extension direction of the connecting trace 5 . Referring to FIG2A , FIG2B , and FIG3 , the overall extension direction of the connecting trace 5 is referred to as the third direction Z.

[0097] Exemplarily, as shown in Figure 4, the connecting trace 5 includes two opposite sides along the first direction X, namely the first side 5a and the second side 5b. The distance between the first side 5a and the second side 5b is the width of the connecting trace 5, and the maximum distance between the first side 5a and the second side 5b is the maximum width of the connecting trace 5.

[0098] It should be noted that at least a portion of the above-mentioned connecting trace 5 is formed by a 3D printing process. In some embodiments, the first portion 51, the second portion 52, and the third portion 53 of the connecting trace 5 are formed separately by three printing processes. Referring to FIG. 4 , during the production of the second portion 52 of the connecting trace 5, it is necessary to ensure that the conductive paste is discharged at a predetermined starting position Q2. The 3D printing device stays at the starting position Q2 for a longer time than other positions on the printing path. Therefore, there will be a certain amount of material accumulation. A "big head" phenomenon will occur at the starting position Q2, that is, the width of the second portion 52 at the starting position Q2 is the maximum width of the second portion 52. The lengths of the first portion 51 and the third portion 53 of the connecting trace 5 are shorter than the length of the second portion 52, and the lengths required for printing are shorter. During the actual printing process, the 3D printing device moves slower and stays longer. Therefore, the material accumulation is more obvious. The maximum width B1 of the first portion 51 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X, and the maximum width B3 of the third portion 53 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X.

[0099] It is understood that at least part of the connecting traces is formed by the 3D printing process, that is, part or all of the connecting traces are formed by the 3D printing process. The above description is that all of the connecting traces are formed by the 3D printing process. Part of the connecting traces is formed by the 3D printing process, which can be divided into the following situations:

[0100] In some embodiments, the first portion 51 of the connecting trace 5 is produced by three-dimensional printing, and the second portion 52 and the third portion 53 of the connecting trace 5 are produced by other processes, such as pad printing and screen printing. The formed connecting trace 5 satisfies that the maximum width B1 of the first portion 51 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X.

[0101] In some embodiments, the third portion 53 of the connecting trace 5 is manufactured using 3D printing, while the second portion 52 and the first portion 51 of the connecting trace 5 are manufactured using other processes, such as pad printing and screen printing. The resulting connecting trace 5 satisfies the requirement that the maximum width B3 of the third portion 53 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X.

[0102] In some embodiments, the first portion 51 and the third portion 53 of the connecting trace 5 are manufactured using 3D printing, while the second portion 52 of the connecting trace 5 is manufactured using other processes, such as pad printing or screen printing. The resulting connecting trace 5 satisfies the conditions that the maximum width B1 of the first portion 51 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X, and / or the maximum width B3 of the third portion 53 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X.

[0103] For example, a partial area of ​​the orthographic projection of any one of the first side 5a and the second side 5b obtained by the above process on the substrate 1 is composed of an arc segment, and the distance between the first side 5a and the second side 5b is not uniform everywhere. Specifically, the maximum distance (i.e., maximum width B1) between the first side 5a and the second side 5b located in the first portion 51 is greater than the maximum distance (i.e., maximum width B2) between the first side 5a and the second side 5b located in the second portion 52; and / or the maximum distance (i.e., maximum width B3) between the first side 5a and the second side 5b located in the third portion 53 is greater than the maximum distance (i.e., maximum width B2) between the first side 5a and the second side 5b located in the second portion 52.

[0104] The connecting traces obtained by the above-mentioned preparation process have an anti-corrosion effect. This is because in the preparation process, whether it is a three-dimensional printing process, a pad printing process or a screen printing process, a conductive paste is used as the material for the connecting traces. The selected conductive adhesive is, for example, silver paste, which is mainly composed of silver particles and resin solvents, and the silver paste has the characteristics of rapid film formation. A dense oxide film can be formed on its surface, which can protect its own good conductive effect; at the same time, it can avoid the damage to the film layer on the front of the display panel 10 caused by the laser etching process during the etching process, and after the connecting traces are prepared, the etched surface of the connecting traces is exposed and easily corroded, and its surface is easily scratched.

[0105] It should be noted that, in some embodiments, when the connecting lines are prepared using other processes, for example, when the connecting lines are obtained using a pad printing process or a screen printing process, it can be designed so that the maximum width B1 of the first portion 51 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X, and the maximum width B3 of the third portion 53 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X. In other words, the dimensional relationship between the various parts of the above-mentioned connecting lines is not limited to that obtained by the three-dimensional printing process, but the electrical reliability of the connecting lines can be improved by designing the dimensional relationship in the structure.

[0106] Exemplarily, the first portion 51 of the connecting trace 5 and the first electrode 3 are an integral structure and can be formed by a one-time film forming or patterning process. The maximum width B1 of the first portion 51 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X, and the maximum width B3 of the third portion 53 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X.

[0107] Exemplarily, the third portion 53 of the connecting trace 5 is an integral structure with the second electrode 4 and can be formed by a one-time film forming or patterning process. It can also satisfy that the maximum width B1 of the first portion 51 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X, and the maximum width B3 of the third portion 53 along the first direction X is greater than the maximum width B2 of the second portion 52 along the first direction X.

[0108] In some embodiments, with continued reference to FIG. 4 , a maximum width B1 of the first portion 51 along the first direction X is greater than a maximum width B2 of the second portion 52 along the first direction X.

[0109] Exemplarily, the preparation process of the first portion 51 and the second portion 52 of the connecting wire 5 is the same as the above preparation process, and the effects that can be achieved are similar to those of the above connecting wire 5, which will not be described in detail here.

[0110] In some embodiments, with continued reference to FIG. 4 , a maximum width B3 of the third portion 53 along the first direction X is greater than a maximum width B2 of the second portion 52 along the first direction X.

[0111] Exemplarily, the preparation process of the second portion 52 and the third portion 53 of the connecting wire 5 is the same as the above preparation process, and the effects that can be achieved are similar to those of the above connecting wire 5, which will not be described in detail here.

[0112] In some embodiments, as shown in Figures 5A and 5B, in at least one connecting trace 5, among the at least two section segments of the orthographic projection pattern of the first portion 51 along the first direction X on the first surface 1a, the dimension d1 of the section segment closer to the selected side surface 1cc in the first direction X is greater than the dimension d2 of the section segment farther away from the selected side surface 1cc in the first direction X.

[0113] It should be noted that the intersecting line segment here refers to a line segment between two points where a straight line extending along the first direction X intersects with a boundary of the orthographic projection pattern of the first portion 51 on the first surface 1 a .

[0114] The following takes two of the multiple section segments of the orthographic projection pattern of the first portion on the first surface 1 a along the first direction X as an example to introduce the size relationship of the section segments.

[0115] For example, referring to Figures 5A and 5B, the section segment closer to the selected side surface 1cc is referred to as the first type of section segment, and the section segment farther away from the selected side surface 1cc is referred to as the second type of section segment, wherein the dimension d1 of the first type of section segment in the first direction is greater than the dimension d2 of the first type of section segment in the first direction.

[0116] It should be noted that the above only defines the size relationship between at least two of the multiple cross-sectional segments of the orthographic projection pattern of the first portion 51, that is, it defines the size relationship between the cross-sectional segments close to the selected side surface 1cc and the cross-sectional segments away from the selected side surface 1cc, and does not define the sizes of all cross-sectional segments. Therefore, referring to Figure 5A, the size of the cross-sectional segments of the orthographic projection pattern of the first portion 51 along the first direction X on the first surface 1a gradually decreases in the direction away from the selected side surface 1cc, and the orthographic projection pattern of the first portion 51 has an overall trend of gradually narrowing; alternatively, referring to Figure 5B, the orthographic projection pattern of the first portion 51 includes a first portion and a second portion, and the second portion of the orthographic projection pattern of the first portion 51 away from the selected side surface 1cc is narrowed relative to the first portion close to the selected side surface 1cc. As the orthographic projection pattern of the first portion 51 close to the selected side surface 1cc moves away from the selected side surface 1cc, the size of the first portion of the orthographic projection pattern of the first portion 51 in the X direction remains unchanged, and the second portion of the orthographic projection pattern of the first portion 51 away from the selected side surface 1cc gradually narrows. The orthographic projection pattern of the first portion 51 shown in FIG. 5A and FIG. 5B on the first surface 1 a is not unique, as long as the upper-wide-and-lower-narrow structure is ensured. FIG. 5A and FIG. 5B are only possible implementations.

[0117] The above dimensional relationships are based on the fact that the connecting traces are formed using a 3D printing process. Referring to Figures 2A and 2B , a first transitional side surface 1d is provided between the selected side surface 1cc and the first surface 1a of the substrate 1 shown in Figures 2A and 2B . During the preparation of the first portion 51 of the connecting trace 5, to ensure sufficient thickness of the conductive paste at the location of the first transitional side surface 1d, as previously described, a portion of the first portion 51 is located on the first surface 1a of the substrate 1, while another portion is located on the first transitional side surface 1d between the first surface 1a and the selected side surface 1cc. Therefore, referring to Figures 3 and 4, the starting position Q1 of the 3D printing device corresponds to the end of the first portion 51 to be formed, which is close to the selected side surface. It is located above the first transition side surface 1d, and the orthographic projection of the starting position Q1 on the first transition side surface 1d is the boundary of the first transition side surface 1d close to the selected side surface 1cc. To ensure that the conductive paste is discharged at the predetermined starting position Q1, the conductive paste accumulated at the starting position Q1 is sufficient to cover the first transition side surface 1d, and then print along the second direction Y. Based on the flow characteristics of the conductive paste, the portion of the first portion 51 of the connecting trace 5 away from the selected side surface 1cc is slightly narrower than the portion close to the selected side surface 1cc. During the printing process, due to changes in speed and air pressure caused by movement, the overall thickness of the first portion of the connecting trace fluctuates. That is, the surface of the first portion 51 on the side away from the substrate 1 has a certain roughness. However, it should be noted that this roughness does not affect the resistance of the connecting trace 5 and can ensure normal signal transmission of the display panel.

[0118] In some embodiments, referring to Figure 6, in at least one connecting trace, in at least two section segments of the orthographic projection pattern of the third portion 53 along the first direction X on the second surface 1b, a dimension d3 of the section segment closer to the selected side surface 1cc in the first direction X is greater than a dimension d4 of the section segment farther away from the selected side surface 1cc in the first direction X.

[0119] Exemplarily, the third portion 53 of the connecting line 5 is also formed by the above-mentioned three-dimensional printing process. Therefore, the effect that can be achieved is similar to that of the first portion 51 of the connecting line 5, which will not be described in detail here.

[0120] In some embodiments, referring to Figures 5A, 5B and 6, in at least one connecting trace 5, of the at least two section segments of the orthographic projection pattern of the first surface 1a along the first direction X of the first portion 51, the dimension d1 of the section segment closer to the selected side surface 1cc in the first direction X is larger than the dimension d2 of the section segment farther away from the selected side surface 1cc in the first direction X; of the at least two section segments of the orthographic projection pattern of the third portion 53 along the first direction X of the second surface 1b, the dimension d3 of the section segment closer to the selected side surface 1cc in the first direction X is larger than the dimension d4 of the section segment farther away from the selected side surface 1cc in the first direction X.

[0121] Exemplarily, the first portion 51 and the third portion 53 of the connecting line 5 are also formed by the above-mentioned three-dimensional printing process. Therefore, the effect that can be achieved is similar to that of the first portion 51 of the connecting line 5, which will not be repeated here.

[0122] In some embodiments, continuing to refer to Figure 4, the second portion 52 of the connecting trace 5 includes a first end 52a and a second end 52b, wherein the first end 52a and the second end 52b are opposite ends of the second portion 52 of the connecting trace 5 along its extension direction (i.e., the third direction Z), and the dimension d5 of the first end 52a in the first direction X is greater than the dimension d6 of the second end 52b in the first direction.

[0123] For example, as can be seen from the foregoing, the connecting traces are formed through a 3D printing process. Referring to FIG. 4 , during the production of the connecting trace 5, it is necessary to ensure that the conductive paste is deposited at a predetermined starting position Q. Furthermore, the 3D printing device spends a longer time at the starting position Q than at other positions along the printing path, resulting in a certain amount of material accumulation and a "bulky end" phenomenon at the starting position Q. Near the end position R of printing, the 3D printing device must shut off the air supply in advance, ensuring that the remaining conductive paste attached to the 3D printing device is sufficient to complete the line type printing. Consequently, the line width at the end position R is narrower than at the starting position Q. That is, during the production of the second portion of the connecting trace, the starting position Q2 of the 3D printing device corresponds to the first end 52a of the second portion 52 of the connecting trace 5, and the end position R of the 3D printing device corresponds to the second end 52b of the second portion 52 of the connecting trace 5. Therefore, the dimension d5 of the first end 52a in the first direction X is greater than the dimension d6 of the second end 52b in the first direction.

[0124] In some embodiments, referring to FIG. 3 , the first portion 51 partially overlaps the first electrode 3 , and the third portion 53 partially overlaps the second electrode 4 .

[0125] It can be understood that the first portion 51 overlaps with the orthographic projection of the first electrode 3 on the first surface 1a of the substrate 1, for example, the first portion 51 covers the end of the first electrode 3 close to the selected side surface 1cc, which can ensure that the first portion 51 and the first electrode 3 are fully electrically connected, and the third portion 53 overlaps with the orthographic projection of the second electrode 4 on the second surface 1b of the substrate 1, for example, the third portion 53 covers the end of the second electrode 4 close to the selected side surface 1cc, which can ensure that the third portion 53 and the second electrode 4 are fully electrically connected.

[0126] In some embodiments, referring to Figure 2A, the display panel 10 includes a plurality of signal lines 6 arranged on the first surface 1a, and the plurality of signal lines 6 electrically connect the plurality of first electrodes 3 with the plurality of light-emitting devices 2, wherein, referring to Figures 7A and 7B, each signal line 6 is electrically connected to one first electrode 3 and a dimension H1 of the signal line 6 in the first direction X is not greater than a dimension H2 of the first electrode 3 in the first direction X.

[0127] For example, as shown in FIG7A , FIG7A is a diagram of the connection structure between the signal line 6 and the first electrode 3 . It can be seen from the figure that the dimension H1 of the signal line 6 in the first direction X is equal to the dimension H2 of the first electrode 3 in the first direction X, so as to ensure sufficient contact between the two and achieve electrical connection.

[0128] For example, as shown in FIG7B , which is another connection structure diagram between the signal line 6 and the first electrode 3 , it can be seen from the figure that the dimension H1 of the signal line 6 in the first direction X is smaller than the dimension H2 of the first electrode 3 in the first direction X. This dimension relationship in this connection method can ensure that when the first electrode 3 is electrically connected to the connecting wire 5 , the contact area with the first portion 51 of the connecting wire 5 is increased, thereby reducing contact resistance, further improving signal transmission efficiency, and enhancing the display effect of the display panel 10.

[0129] 7A and 7B , the widths of the multiple signal lines 6 on the first surface 1a in the first direction X are not exactly the same due to the different types of signals they transmit, and the width of the first electrode 3 in the first direction X is positively correlated with the width of the signal line 6 to which it is connected.

[0130] Exemplarily, the width of the connecting trace 5 in the first direction X is positively correlated with the width of the first electrode 3 connected thereto in the first direction X.

[0131] In some embodiments, referring to the film layer structure diagram shown in FIG7C , a driving circuit layer 8 is provided on the substrate 1 , including a buffer layer 81 , a first metal layer 82 , an insulating layer 83 , a second metal layer 84 , a planarization layer 85 and a passivation layer 86 .

[0132] A buffer layer 81 is provided on one side of the first surface 1a; a first metal layer 82 includes multiple signal lines 6 and extension lines 7; an insulating layer 83 is provided on the side of the first metal layer 82 away from the substrate 1; a second metal layer 84 is provided on the side of the insulating layer 83 away from the substrate 1, and the second metal layer 84 includes the multiple first electrodes 3; a planarization layer 85 is provided on the side of the second metal layer 84 away from the substrate 1; and a passivation layer 86 is provided on the side of the planarization layer 85 away from the substrate 1. The insulating layer 83 includes multiple first vias a1, and each of the multiple first electrodes 3 is electrically connected to the signal line 6 of the first metal layer 82 through a corresponding first via a1. It will be understood that the first electrodes 3 are partially located in the first metal layer 82 and partially located in the second metal layer 84.

[0133] In some embodiments, as shown in FIG. 7C , the second metal layer 84 further includes a plurality of connection pads, and the plurality of connection pads include a plurality of first pads 842 for connecting to the light-emitting device 2 and a plurality of second pads 843 for connecting to the pixel driving chip 9 .

[0134] Specifically, as shown in FIG7C , the pins of the light-emitting device 2 and the pins of the pixel driver chip 9 are connected to corresponding connection pads via a soldering material (e.g., solder, tin-silver-copper alloy, tin-copper alloy, etc.). The planar layer 85 includes a plurality of second vias a2, which extend through the second metal layer 84. The passivation layer 86 includes a plurality of third vias a3, which extend through the planar layer 85. One third via a3 corresponds to one second via a2, forming a through-via extending from the passivation layer 86 to the connection pad of the second metal layer 84.

[0135] For example, as shown in Figure 7C, each light-emitting device 2 includes two connecting pins, and each pixel driving chip 9 includes six connecting pins. The pins of each light-emitting device 2 are connected to the two first pads 842 through a through via penetrating the flat layer 85 and the passivation layer 86, and the pins of each pixel driving chip 9 are connected to the six second pads 843 through a via penetrating the flat layer 85 and the passivation layer 86, thereby controlling the light-emitting device 41 to emit light under the signal transmitted by the signal line 6 and the control of the pixel driving chip 9.

[0136] In some embodiments, the first metal layer 82 or the second metal layer 84 is a metal layer comprising a multi-layer structure. For example, the first metal layer 82 or the second metal layer 84 includes a titanium layer, a copper layer, and a titanium layer sequentially disposed from one side of the substrate 1. Alternatively, the first metal layer 82 or the second metal layer 84 includes, for example, a molybdenum layer, a copper layer, and a molybdenum layer sequentially disposed from one side of the substrate 1. Alternatively, the first metal layer 82 or the second metal layer 84 includes, for example, a molybdenum layer, an aluminum layer, and a molybdenum layer sequentially disposed from one side of the substrate 1.

[0137] In some embodiments, the first metal layer 82 or the second metal layer 84 is a single-layer signal wiring layer. Furthermore, the driving circuit layer is, for example, a copper layer or an aluminum layer.

[0138] Specifically, the first metal layer 82 or the second metal layer 84 only needs to have good conductive properties. This is only an exemplary description and does not limit the material used for the driving circuit layer 8 .

[0139] In some embodiments, as shown in Figures 8A and 8B, the display panel 10 also includes at least one extension line 7 arranged on the side of at least one first electrode 3 close to the selected side surface 1cc, and at least one extension line 7 is electrically connected to the first electrode 3; at least one extension line 7 is electrically connected to a connecting trace 5.

[0140] Exemplarily, as shown in Figures 8A and 8B, at least one first electrode 3 is provided with at least one extension line 7 on a side close to the selected side surface 1cc. For example, one first electrode corresponds to one extension line 7 or multiple extension lines 7. The extension line 7 extends from the first electrode 3 to the boundary of the first surface 1a. The first electrode 3 is connected to the corresponding connecting trace 5 through the extension line 7.

[0141] Exemplarily, each first electrode 3 is provided with at least one extension line 7 on one side close to the selected side surface 1cc. As shown in FIG8A , each first electrode 3 is provided with two extension lines 7 on one side close to the selected side surface 1cc, and each first electrode 3 is connected to the corresponding connecting trace 5 through its corresponding extension line 7.

[0142] It should be noted that an extension line 7 or multiple extension lines 7 are correspondingly provided on the side of a first electrode 3 close to the selected side surface 1cc, and the extension line 7 extends to the boundary between the first surface and the selected side surface. By setting the extension line 7, the contact reliability between the first electrode 3 and the connecting trace 5 can be improved, and at the same time, the transmission resistance can be reduced to make the signal transmission efficiency higher, thereby improving the yield of the display panel.

[0143] For example, referring to FIG8A , two extension lines 7 are shown as an example, wherein the two extension lines 7 are electrically connected to one first electrode 3, and any one of the two extension lines 7 is electrically connected to the first electrode 3, and any one of the two extension lines 7 is electrically connected to the connection line 5. It is understandable that if any one of the two extension lines 7 is damaged, the other extension line 7 can still transmit signals, thereby ensuring more stable signal transmission of the display panel 10.

[0144] In some embodiments, with continued reference to FIG. 8A , there are multiple extension lines 7 electrically connected to the first electrode 3 , and among the multiple extension lines 7 corresponding to one first electrode 3 , a spacing s between any two extension lines 7 is greater than or equal to 60 μm.

[0145] For example, as shown in FIG8A , there are multiple, for example, two, extension lines 7 electrically connected to the first electrode 3 . Furthermore, the spacing between any two extension lines 7 is limited to prevent the film from falling off during the subsequent edge grinding process, thereby preventing damage to the extension lines 7 .

[0146] It should be noted that when an extension line 7 is provided, the width of the extension line 7 in the first direction X is positively correlated with the width of the first electrode 3 connected thereto in the first direction X, and the width of the connecting trace 5 in the first direction X is positively correlated with the width of the extension line 7 connected thereto in the first direction X.

[0147] In some embodiments, the width of each extension line 7 in the first direction X is different.

[0148] In some embodiments, each extension line 7 has the same width in the first direction X, and each connecting line 5 has the same width in the first direction X. Based on this arrangement, the structure and process of the equipment used to form the connecting lines 5 can be simplified, thereby improving production efficiency at a lower cost.

[0149] In some embodiments, referring to Figures 8A, 8B and 9, the first electrode 3 is correspondingly connected to the connecting trace 5, and at least two extension lines 7 are provided on the side of the first electrode 3 close to the selected side surface 1cc, and the at least two extension lines 7 are electrically connected to the first portion 51 of the connecting trace 5; wherein, the at least two extension lines 7 are electrically connected to the first portion 51 of the connecting trace 5 in the following manner.

[0150] In some examples, as shown in FIG. 8A , a dimension d of the first portion 51 along the first direction X is greater than a spacing s between two extension lines 7 , both of which are in contact with the first portion 51 .

[0151] Exemplarily, referring to Figure 8A, the dimension d of the first part 51 along the first direction X is set to be greater than the spacing s between the two extension lines 7. The first part 51 here is an integral pattern. The dimension d of the first part 51 can cover the spacing s between the two extension lines, so that the first part 51 as a whole can fully overlap with the two extension lines 7 to achieve electrical connection, thereby achieving effective signal transmission.

[0152] It should be noted that, in the process of using three-dimensional printing to connect the first part of the wiring, when the printing glue head is thicker, only one printing is required to simultaneously connect the two extension lines 7.

[0153] In other examples, referring to FIG. 9 , first electrode 3 is correspondingly connected to connecting trace 5 . At least two extension lines 7 are provided on a side of first electrode 3 near selected side surface 1cc. First portion 51 of connecting trace 5 includes at least two sub-portions 511 . The dimension r1 of any sub-portion 511 in the first direction X is no less than the dimension r2 of any extension line 7 in the first direction X. Furthermore, at least two sub-portions 511 overlap with at least two extension lines 7 , respectively. In other words, first portion 51 is divided into at least two parts, the number of sub-portions 511 corresponds to the number of extension lines 7 , and the sub-portions 511 overlap with the extension lines 7 in a one-to-one correspondence, achieving corresponding connections.

[0154] It should be noted that, in the process of using three-dimensional printing to connect the first part of the wiring, when the printing glue head is thin, it is necessary to print twice to connect the two extension lines 7 respectively.

[0155] Exemplarily, referring to Figure 9, the dimension r1 of any sub-section 511 in the first direction X is set to be equal to the dimension r2 of any extension line 7 in the first direction X, and at least two sub-sections 511 overlap with at least two extension lines 7 respectively, which can ensure that the two sub-sections 511 included in the first part 51 are overlapped with the two extension lines 7 respectively to achieve electrical connection, so as to realize effective transmission of signals.

[0156] For example, referring again to FIG. 9 , the dimension r1 of any sub-portion 511 in the first direction X is greater than the dimension r2 of any extension line 7 in the first direction X, i.e., r1>r2. Within this dimension constraint, the adjacent sides of two sub-portions 511 formed by the 3D printing device contact each other, and at least two sub-portions 511 overlap with at least two extension lines 7. This increases the overlap area between any sub-portion 511 and any extension line 7, thereby reducing contact resistance, further improving signal transmission efficiency, and enhancing the display quality of the display panel 10.

[0157] It should be noted that the dimension relationship between the dimension r1 of any sub-portion 511 in the first direction X and the dimension r2 of any extension line 7 in the first direction X is defined here to ensure full contact between the sub-portion and the extension line, so that the electrical signal can be transmitted efficiently.

[0158] In some embodiments, a dimension r2 of the extension line 7 in the first direction X is less than or equal to 30 μm.

[0159] Exemplarily, a dimension r2 of the extension line 7 in the first direction X is less than 30 μm, for example, may be 20 μm, 25 μm, etc.

[0160] 8C , the plurality of signal lines 6 and the extension lines 7 are formed by the first metal layer 82 , and the plurality of first electrodes 3 are formed by the first metal layer 82 and the second metal layer 84 , wherein the second metal layer 84 is away from the first surface 1 a relative to the first metal layer 82 .

[0161] For example, referring to Figure 8C, Figure 8C is a cross-section of Figure 8A along the cross-section line DD, wherein the extension line 7 and the signal line 6 are both located in the first metal layer 82, and the first metal layer 82 is provided with an insulating layer on both sides close to and away from the substrate 1, wherein the first electrode 3 is connected to the first metal layer 82 through a via in the insulating layer away from the side of the substrate 1. It can be seen from the figure that part of the first electrode 3 is located in the first metal layer 82, and the other part is located in the second metal layer 84, realizing electrical connection between the extension line 7 and the signal line 6.

[0162] In some embodiments, as shown in FIG9 , in the connected signal line 6 and the extended line 7 , a dimension H1 of the signal line 6 in the first direction X is greater than a dimension r2 of the extended line 7 in the first direction.

[0163] For example, the signal line 6 and the extension line 7 can be electrically connected via the first electrode 3. The dimension H1 of the signal line 6 in the first direction X is defined as being greater than the dimension r2 of the extension line 7 in the first direction. This is because there can be multiple extension lines 7 electrically connected to the first electrode 3, and the dimension r2 of each extension line 7 in the first direction is smaller than the dimension H2 of the first electrode 3 in the first direction. In some examples, the signal line 6 and the first electrode 3 have the same dimensions in the first direction X. Therefore, it can be concluded that the dimension H1 of the signal line 6 in the first direction X is greater than the dimension r2 of the extension line 7 in the first direction.

[0164] As previously mentioned, the substrate 1 in this application is a double-sided substrate, wherein the structure prepared on the front side of the substrate includes multiple light-emitting devices, multiple first electrodes, and multiple signal lines, and the multiple signal lines are electrically connected to the light-emitting devices. The structure prepared on the back side of the substrate includes multiple second electrodes. Multiple connecting wires are provided on the side of the substrate, one end of which is connected to the first electrode on the front side and the other end is connected to the second electrode on the back side of the substrate, transmitting signals to the multiple light-emitting devices, thereby realizing image display on the display panel.

[0165] In some embodiments, a double-sided substrate generally uses a double-sided array process to make the circuits on the front and back of the substrate. Since the electrodes on the substrate are prepared using processes such as electroplating, evaporation, or wet etching, in the actual process of making the circuits on the back of the substrate, it is necessary to flip the substrate over after making the structure on one surface of the substrate, and then make the structure on the other surface of the substrate. During this process, it is inevitable that one surface of the substrate will come into contact with the device base, causing scratches or dirt on one surface of the substrate. Scratches or dirt may cause short circuits, affecting the yield and quality of the display panel; at the same time, the above-mentioned manufacturing steps are numerous and complex, the manufacturing cost is high, and the manufacturing efficiency is low. Therefore, in order to simplify the overall manufacturing process of the display panel, the substrate of the display panel is formed by bonding two single-sided substrates, as described below.

[0166] In some embodiments, as shown in Figures 10A and 10B, the substrate 1 includes a first substrate 11 and a second substrate 12, the first substrate 11 includes a first surface 1a and a third surface 1f relative to each other, and a plurality of first side surfaces 1c1 connecting the first surface 1a and the third surface 1f; the second substrate 12 includes a fourth surface 1g and a second surface 1b relative to each other, and a plurality of second side surfaces 1c2 connecting the fourth surface 1g and the second surface 1b; the third surface 1f and the fourth surface 1g are close to each other; at least one first side surface 1c1 among the plurality of first side surfaces 1c1 is a first selected side surface 1cc1, and at least one second side surface 1c2 among the plurality of second side surfaces 1c2 is a second selected side surface 1cc2, and the first selected side surface 1cc1 and the second selected side surface 1cc2 are located in the same plane, constituting the selected side surface 1cc of the substrate 1.

[0167] It can be understood that the substrate 1 includes a first substrate 11 and a second substrate 12, wherein the first substrate 11 and the second substrate 12 are arranged opposite to each other, the first surface 1a of the first substrate 11 is the first surface 1a of the substrate 1, the second surface 1b of the second substrate 12 is the second surface 1b of the substrate 1, and the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12 are close to each other. By setting the first substrate 11 and the second substrate 12 as described above, relevant devices are manufactured on the first surface 1a and the second surface 1b corresponding to the first substrate 11 and the second substrate 12 respectively, wherein the relevant devices manufactured on the first substrate 11 are the first electrode 3, the light-emitting device 2 and the driving circuit layer 8, etc., and the relevant devices manufactured on the second substrate 12 are the second electrode 4, etc., and then the first substrate 11 and the second substrate 12 are combined into one substrate 1, and finally side wiring is manufactured on the side of the substrate 1, so that in the process of manufacturing the film layer structure on the substrate, there is no need to turn it over, which can prevent the substrate from contacting the equipment and causing scratches and electrostatic discharge. In addition, since the relevant devices on the substrate are prepared separately on the first substrate 11 and the second substrate 12, there will be no problem of laser damage to the film layer already prepared on the other surface caused by the laser etching pattern on one surface of the substrate.

[0168] For example, referring to FIG10A , the first substrate 11 and the second substrate 12 have the same size in the second direction Y. There may be two first selected side surfaces 1cc1 and two second selected side surfaces 1cc2, and the first selected side surfaces 1cc1 and the second selected side surfaces 1cc2 are located in the same plane. In other words, the first selected side surfaces 1cc1 and the second selected side surfaces 1cc2 located on the same side constitute the selected side surface 1cc of the substrate 1. Therefore, there are two selected side surfaces 1cc of the substrate 1.

[0169] Exemplarily, referring to Figure 10B, the size of the first substrate 11 in the second direction Y is larger than the size of the second substrate 12 in the second direction Y, wherein there is one selected side surface 1cc constituting the substrate 1, and the first selected side surface 1cc1 located on the first substrate 11 and the second selected side surface 1cc2 located on the second substrate 12 are located in the same plane.

[0170] In some embodiments, referring to FIG. 10B , the second surface 1 b includes a first region G1 and a second region G2 , the first region G1 and the first surface 1 a have a first distance h1 , the second region G2 and the first surface 1 a have a second distance h2 , and the first distance h1 is greater than the second distance h2 .

[0171] Exemplarily, the orthographic projection area of ​​the first region G1 of the second surface 1b on the first surface 1a and the orthographic projection area of ​​the second substrate 12 on the first surface 1a are equal. The first region G1 is where the second substrate 12 is located, and the second region G2 is the portion of the third surface 1f of the first substrate 11 that is exposed after removing the portion covered by the second substrate 12. In other words, the second surface 1b of the substrate 1 here is the portion of the third surface 1f of the first substrate 11. In other words, the area of ​​the second substrate 12 is smaller than the area of ​​the first substrate 11. The first region G1 is at a first distance h1 from the first surface 1a, where the first distance h1 is the sum of the thicknesses of the first substrate 11 and the second substrate 12. The second region G2 is at a second distance h2 from the first surface 1a, where the second distance h2 is the thickness of the first substrate 11. Therefore, the first distance h1 is greater than the second distance h2.

[0172] In some embodiments, referring to FIG. 10B , the first distance h1 is twice the second distance h2 .

[0173] For example, to facilitate the manufacture of the substrates, the thicknesses of the substrates may be set to be the same, and the first substrate 11 and the second substrate 12 may have the same thickness, that is, the first distance h1 is twice the second distance h2.

[0174] In some embodiments, referring to FIG. 11A and FIG. 11B , the substrate 1 further includes a glue layer 13 . The glue layer 13 is disposed between the third surface 1 f and the fourth surface 1 g and is configured to bond the third surface 1 f to the fourth surface 1 g .

[0175] Exemplarily, the adhesive layer 13 is arranged between the third surface 1f and the fourth surface 1g, that is, the adhesive layer 13 is arranged between the first substrate 11 and the second substrate 12, tightly fitting the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12.

[0176] In some embodiments, referring to FIG. 11A and FIG. 11B , the adhesive layer 13 is made of a thermally curable or UV (Ultra-Violet Ray) curable material, and a plurality of silicon balls 131 are evenly arranged inside the adhesive layer 13 .

[0177] Exemplarily, referring to Figures 11A and 11B, a plurality of silicon balls 131 are evenly arranged inside the adhesive layer 13, and the sizes of the silicon balls 131 are consistent to ensure the flatness of the bonding between the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12, so as to improve the quality of the display panel.

[0178] In some embodiments, referring to Figures 11A and 12A, the orthographic projection area of ​​the adhesive layer 13 on the fourth surface 1g is equal to the area of ​​the fourth surface 1g, that is, the adhesive layer 13 extends between the first substrate 11 and the second substrate 12, and is arranged corresponding to the first substrate 11 and the second substrate 12.

[0179] In some embodiments, referring to Figures 11B and 12B, the orthographic projection of the adhesive layer 13 on the fourth surface 1g is a frame-shaped structure, and the frame-shaped structure is arranged at the edge of the fourth surface 1g. That is, there can be a certain distance between the outer contour of the adhesive layer 13 and the outer contour of the fourth surface 1g of the second substrate 12, so as to prevent the material of the adhesive layer 13 from exceeding the outer contour of the fourth surface 1g of the second substrate 12 during the setting process, which is not convenient for simplifying the process and increases the cost.

[0180] As shown in Figures 13 and 14, some embodiments of the present disclosure further provide a display device 100, comprising a display panel 10 and a driver circuit board 20 provided in any of the above embodiments. The driver circuit board 20 is disposed on the second surface 1b of the substrate 1 of the display panel 10, and is electrically connected to the plurality of connection traces 5 of the display panel 10.

[0181] Exemplarily, the driving circuit board 20 is electrically connected through multiple second electrodes 4 to electrically connect to multiple connecting traces 5 through multiple second electrodes 4, thereby transmitting signals and voltages to the light-emitting device to achieve the display effect of the display panel 10.

[0182] Exemplarily, the display device 100 may be a Mini LED (Mini Light Emitting Diode) display device, or the display device 100 may be a Micro LED (Micro Light-Emitting Diode) display device.

[0183] In some examples, as shown in Figures 1, 2A, 2B and 14, mini light-emitting diodes or micro light-emitting diodes are used as light-emitting devices 2. Compared with traditional LEDs, they occupy a smaller volume and have smaller particles. Within the same screen size, the light source density per unit area is higher and the unit size of the light source is smaller. Therefore, more precise local control of the light-emitting device 2 can be achieved, and the uniformity of the display brightness can be guaranteed, thereby ensuring the display quality of the display device 100.

[0184] The display device 100 adopts the display panel 10 provided in the above embodiment and has the same technical effects as the above display panel 10 , which will not be described in detail here.

[0185] Some embodiments of the present disclosure further provide a spliced ​​display device 1000 , as shown in FIG15 . The spliced ​​display device 1000 includes a plurality of display devices 100 as provided in the above embodiments, and the selected side surfaces 1cc of the display devices 100 in the same column or row are located on the same side.

[0186] For example, the multiple display devices 100 in the spliced ​​display device 1000 are arranged in an array. The spliced ​​display device 1000 can realize the display of a larger screen, and the spliced ​​display device 1000 can be used as an advertising spliced ​​screen, a conference spliced ​​screen, etc.

[0187] Exemplarily, as shown in FIG15 , the display device 100 is, for example, rectangular.

[0188] 15 and 1 , in the display panel 10, the plurality of first electrodes 3 are arranged in parallel along a first direction X. Accordingly, the plurality of connecting traces 5 are also arranged in parallel along the first direction X. Another direction parallel to the display surface of the display device 100 and perpendicular to the first direction X is referred to as a second direction Y. The display device 100 includes multiple side surfaces. Hereinafter, the side surfaces of the display device 100 that are close to the peripheral area BB of the substrate 1 are referred to as selected side surfaces of the display device 100 for description.

[0189] Exemplarily, as shown in FIG. 1 , FIG. 2A and FIG. 2B , the display panel 10 includes a display area AA and a peripheral area BB located on one side of the display area AA, and multiple connection traces 5 and multiple first electrodes 3 are arranged near the peripheral area BB of the substrate 1 .

[0190] Furthermore, as shown in FIG15 , when a plurality of display devices 100 including the display panels 10 shown in FIG1 , FIG2A , and FIG2B are spliced ​​together, the selected side surfaces of two adjacent display devices 100 are arranged along the first direction X. In this way, among the plurality of display devices 1000 arranged in a row along the first direction X, there is substantially no splicing seam between two adjacent display devices 100 along the first direction X; and among the plurality of display devices 100 arranged in a column along the second direction Y, there is a splicing gap between two adjacent display devices 100. That is, the size of the splicing gap between two adjacent display devices in the plurality of display devices 100 arranged in a row along the first direction X is smaller than the size of the splicing gap between two adjacent display devices 100 in the plurality of display devices 100 arranged in a column along the second direction Y.

[0191] However, the size of the peripheral area BB in the second direction Y is very small. Therefore, when the spliced ​​display device 1000 is actually viewed, the seam between two adjacent display devices 100 is difficult to be seen by the naked eye within the viewing distance, so that the display image of the spliced ​​display device 1000 is more complete and can present a better display effect.

[0192] The spliced ​​display device 1000 adopts the display device 100 provided in the above embodiment and has the same technical effects as the above display device 100, which will not be described in detail here.

[0193] Some embodiments of the present invention further provide a method for manufacturing a display panel 10. As shown in FIG16 , the method for manufacturing the display panel 10 includes:

[0194] S1. Provide a substrate 1.

[0195] As shown in Figures 1, 2A, and 2B, the substrate 1 includes a first surface 1a, a second surface 1b, and a plurality of side surfaces 1c connecting the first surface 1a and the second surface 1b. At least one side surface 1c of the plurality of side surfaces 1c of the substrate 1 is a selected side surface 1cc. The plurality of side surfaces 1c are planes.

[0196] Exemplarily, the first surface 1 a includes a display area AA and a peripheral area BB located on at least one side of the display area AA. The peripheral area BB is closer to the selected side surface 1 cc of the substrate 1 than the display area AA.

[0197] In some examples, the substrate 1 is made of a rigid material such as glass or quartz.

[0198] Exemplarily, referring to Figure 10B, the second surface 1b includes a first area G1 and a second area G2, the first area G1 has a first distance h1 from the first surface 1a, and the second area G2 has a second distance h2 from the first surface 1a, and the first distance h1 is greater than the second distance h2. For example, as shown in Figure 16, the first distance h1 is twice the second distance h2.

[0199] Exemplarily, referring to FIG10A , the first region G1 and the second region G2 included in the second surface 1 b are located in the same plane, that is, the first region G1 and the second region G2 are equidistant from the first surface 1 a , ie, the first distance h1 is equal to the second distance h2 .

[0200] It should be noted that the substrate 1 provided in S1 is a substrate with corresponding film layer structures prepared on the first surface and the second surface.

[0201] S2. Referring to Figures 2A, 2B and 3, the boundary edge between the selected side surface 1cc of the substrate 1 and the first surface 1a is ground to form a first transition side surface 1d, and the boundary edge between the selected side surface 1cc of the substrate 1 and the second surface 1b is ground to form a second transition side surface 1e.

[0202] It should be noted that, referring to Figure 2A, Figure 2B and Figure 3, the formation of the first transition side surface 1d and the second transition side surface 1e can ensure a smooth transition connection during the process of making side wiring, further disperse the stress, reduce the problems of bumps and broken edges and corners caused by excessive stress concentration, and thus enhance the reliability of the display panel.

[0203] S3 . Referring to FIG. 1 and FIG. 3 , a plurality of connecting traces 5 are formed on the first surface 1 a , the selected side surface 1 cc , and the second surface 1 b .

[0204] 1 and 3 , the plurality of connecting lines 5 are arranged in parallel and at intervals; each connecting line 5 among the plurality of connecting lines includes a first portion 51, a second portion 52 and a third portion 53 connected in sequence, wherein the first portion 51 is at least arranged on the first surface 1a, and the first portion 51 is electrically connected to one of the plurality of first electrodes 3, the second portion 52 is arranged on the selected side surface 1cc, and the third portion 53 is at least arranged on the second surface 1b, and is electrically connected to one of the plurality of second electrodes 4.

[0205] 4 , the maximum width B1 of the first portion 51 along the first direction X and / or the maximum width B3 of the third portion 53 along the first direction X are greater than the maximum width B2 of the second portion 52 along the first direction X.

[0206] It should be noted that, in the process of making the connecting traces, the size relationship of the width dimensions mentioned above can be referred to the description in the aforementioned part, and will not be elaborated here.

[0207] Exemplarily, in the first part 51, the second part 52 and the third part 53 of the connecting trace 5, there is an overlap between the two connected parts. Referring to Figure 3, since the first part 51 and the third part 53 of the connecting trace 5 are formed before the second part 52 of the connecting trace 5, it can be seen in Figures 3 and 4 that the parts of the second part 52 that overlap with the first part 51 and the third part 53 are far away from the substrate 1.

[0208] It should be noted that the order of forming the first portion 51 , the second portion 52 and the third portion 53 of the connecting trace 5 is not limited here, and FIG. 3 and FIG. 4 are only examples.

[0209] In some embodiments, as shown in FIG17 , the step S1 of providing the substrate 1 further includes:

[0210] S1-1. Provide an initial first substrate 11' and an initial second substrate 12'.

[0211] 18A, 18B, 18C and 18D, the initial first substrate 11' includes an initial first surface 1a' and an initial third surface 1f' relative to each other, and a plurality of initial first side surfaces 1c1' connecting the initial first surface 1a' and the initial third surface 1f'; the initial second substrate 12' includes an initial fourth surface 1g' and an initial second surface 1b' relative to each other, and a plurality of initial second side surfaces 1c2' connecting the initial fourth surface 1g' and the initial second surface 1b'; at least one initial first side surface 1c1' among the plurality of initial first side surfaces 1c1' is an initial first selected side surface 1cc1', and at least one initial second side surface 1c2' among the plurality of initial second side surfaces 1c2' is an initial second selected side surface 1cc2'.

[0212] Exemplarily, the initial first substrate 11' has four initial first side surfaces 1c1', and one of the four initial first side surfaces 1c1' may be an initial first side surface 1c1' and two of the initial first side surfaces 1c1' are initial first selected side surfaces 1cc1'; the initial second substrate 12' has four initial second side surfaces 1c2', and one of the four initial second side surfaces 1c2' may be an initial second side surface 1c2' and two of the initial second side surfaces 1c2' are initial first selected side surfaces 1cc2'.

[0213] S1-2. Referring to Figures 18A, 18B and 1, a plurality of light-emitting devices 2 and a plurality of first electrodes 3 are formed on the initial first surface 1a' of the initial first substrate 11', the plurality of first electrodes 3 are arranged at intervals along the first direction X, and the plurality of first electrodes 3 are close to the initial first selected side surface 1cc1' relative to the plurality of light-emitting devices 2.

[0214] Exemplarily, the plurality of light-emitting devices 2 are located in the display area AA of the initial first surface 1 a ′, and the plurality of first electrodes 3 are located in the peripheral area BB of the initial first surface 1 a ′.

[0215] S1-3, referring to FIG. 18C , FIG. 18D and FIG. 3 , a plurality of second electrodes 4 are formed on the initial second surface 1 b ′ of the initial second substrate 12 ′. The plurality of second electrodes 4 are arranged at intervals along the first direction X.

[0216] For example, referring to Figures 18C, 18D and 2A, the plurality of second electrodes 4 are arranged on the side of the initial second surface 1b' of the initial second substrate 12' close to the initial second selected side surface 1cc2', and the dimension D2 of the plurality of second electrodes 4 in the second direction Y is greater than the dimension D1 of the plurality of first electrodes in the second direction Y, that is, the orthographic projections of the plurality of second electrodes 4 on the initial first surface 1a' can extend to the display area AA.

[0217] It should be noted that the above order of forming the plurality of light-emitting devices 2 and the plurality of first electrodes 3 and forming the plurality of second electrodes 4 is not limited.

[0218] S1-4. As shown in FIG. 18A to FIG. 18D , FIG. 10A and FIG. 10B , the initial first substrate 11 ′ and the initial second substrate 12 ′ are cut to form a plurality of first substrates 11 and a plurality of second substrates 12 .

[0219] 18A to 18D, 10A, and 10B, the first substrate 11 includes a first surface 1a and a third surface 1f facing each other, as well as a plurality of first side surfaces 1c1 connecting the first surface 1a and the third surface 1f. The second substrate 12 includes a fourth surface 1g and a second surface 1b facing each other, as well as a plurality of second side surfaces 1c2 connecting the fourth surface 1g and the second surface 1b. The third surface 1f and the fourth surface 1g are adjacent to each other. At least one of the plurality of first side surfaces 1c1 is a first selected side surface 1cc1, and at least one of the plurality of second side surfaces 1c2 is a second selected side surface 1cc2. The first selected side surface 1cc1 and the second selected side surface 1cc2 are located in the same plane and constitute the selected side surface 1cc of the substrate 1. The first surface 1a' of the initial first substrate 11' is the first surface of the first substrate 11, the second surface 1b' of the initial second substrate 12' is the second surface 1b of the second substrate 12, the first selected side surface 1cc1' of the initial first substrate 11' is the first selected side surface 1cc1 of the first substrate 11, and the second selected side surface 1cc1' of the initial second substrate 12' is the second selected side surface 1cc2 of the second substrate 12.

[0220] S1-5, as shown in FIG. 12A and FIG. 12B , a glue layer 13 is formed on the fourth surface 1 g of the second substrate 12 , and the third surface 1 f and the fourth surface 1 g of the first substrate 11 are bonded together to form the substrate 1 .

[0221] It can be understood that the substrate 1 includes a first substrate 11 and a second substrate 12, wherein the first substrate 11 and the second substrate 12 are arranged opposite each other, the first surface 1a of the first substrate 11 is the first surface 1a of the substrate 1, the second surface 1b of the second substrate 12 is the second surface 1b of the substrate 1, and the third surface 1f of the first substrate 11 and the fourth surface 1g of the second substrate 12 are adjacent to each other. The substrate 1 includes a selected side surface 1cc consisting of a first selected side surface 1cc1 and a second selected side surface 1cc2, and the first selected side surface 1cc1 and the second selected side surface 1cc2 are located in the same plane.

[0222] It should be noted that, during the bonding process of the third surface 1f and the fourth surface 1g, there may be defects in the edge positions of the first substrate 11 and the second substrate 12 such as misalignment and overflow or depression of the adhesive layer 13. In the subsequent process of making connection wiring, broken wires, short circuits and falling off are likely to occur. To avoid the above phenomena, after the bonding process of the third surface 1f and the fourth surface 1g is completed, the first selected side surface 1cc1 and the second selected side surface 1cc2 of the first substrate 11 and the second substrate 12 are respectively edge-grinded so that the first selected side surface 1cc1 and the second selected side surface 1cc2 are located in the same plane, ensuring the alignment uniformity and flatness of the first selected side surface 1cc1 and the second selected side surface 1cc2.

[0223] The order of the above steps S1-4 and S1-5 in the process of manufacturing the substrate is not limited. For the sake of ease of description, the device structure on the substrate is omitted in the following flow chart.

[0224] In some embodiments, step S1-4 comes first and step S1-5 comes later, as shown in Figure 19A. Figure 19A is a flow chart for forming a substrate, wherein, referring to Figure 19A, an initial first substrate 11' and an initial second substrate 12' are first provided, and the initial first substrate 11' and the initial second substrate 12' are cut (the dotted lines in the figure are cutting lines) to obtain a first substrate 11 and a second substrate 12, and a glue layer 13 is formed on the fourth surface 1g of the second substrate 12, and the third surface 1f of the first substrate 11 and the fourth surface 1g are bonded to form a substrate 1.

[0225] The sizes of the first substrate 11 and the second substrate 12 shown in FIG. 19A are merely examples. For details, please refer to the description in the foregoing section.

[0226] In some embodiments, step S1-5 is performed first and step S1-4 is performed later, as shown in FIG19B . FIG19B is a flow chart for forming a substrate, wherein, referring to FIG19B , an initial first substrate 11 ′ and an initial second substrate 12 ′ are first provided, and the initial second substrate 12 ′ is divided into a plurality of second substrate regions. An adhesive layer 13 is provided on the fourth surface 1 g ′ of the initial second substrate 12 ′, and the adhesive layer 13 is provided near one side edge of each second substrate region. The third surface 1 f ′ of the initial first substrate 11 ′ is bonded to the fourth surface 1 g ′ of the initial second substrate 12 ′, and the bonded initial substrate is cut twice (the dotted lines in the figure are cutting lines) to obtain a substrate 1, wherein the second cutting is to remove the portion of the second substrate not bonded by the adhesive layer.

[0227] The first region and the second region of the second surface of the substrate 1 formed above are at different distances from the first surface.

[0228] In some embodiments, step S1-5 comes first and step S1-4 comes later, as shown in Figure 19C. Figure 19C is a flow chart for forming a substrate, wherein, referring to Figure 19C, an initial first substrate 11' and an initial second substrate 12' are first provided, and the initial second substrate 12' is divided into a plurality of second substrate areas. A glue layer 13 is provided on the fourth surface 1g' of the initial second substrate 12', and the glue layer 13 is provided at the edge of each second substrate area. The third surface 1f' of the initial first substrate 11' is bonded to the fourth surface 1g' of the initial second substrate 12', and the bonded initial substrates are cut once (the dotted line in the figure is the cutting line) to obtain a substrate 1.

[0229] The first region and the second region of the second surface of the substrate 1 formed above are at the same distance from the first surface.

[0230] The following describes a preparation method for forming a connecting trace by taking an example in which the first region and the second region of the second surface of the substrate are at different distances from the first surface.

[0231] In some embodiments, referring to FIG. 20 , step S2 of forming a plurality of connection traces 5 on the first surface 1 a , the selected side surface 1 cc , and the second surface 1 b includes:

[0232] S2 - 1 , referring to FIG. 21B , a first portion 51 of the connecting trace 5 is formed on the first surface 1 a of the first substrate 11 using a three-dimensional printing process.

[0233] It should be noted that since a portion of the first portion 51 is located on the first surface 1a of the substrate 1 and the other portion is on the first transition side surface 1d between the first surface 1a and the selected side surface 1cc, in the process of making the first portion 51 of the connecting trace, it is necessary to ensure that the conductive paste is unloaded at the predetermined starting position Q1, and the starting position Q1 of the three-dimensional printing device is the side of the selected side surface 1cc away from the first surface 1a of the substrate 1.

[0234] S2-2, referring to FIG. 21A , a three-dimensional printing process is used to form the third portion 53 of the connecting trace 5 on the second surface 1 b of the second substrate 12 .

[0235] For example, in the process of making the third part 53 of the connecting line, the starting position Q3 of the 3D printing device is above the junction of the selected side surface 1cc and the second surface 1b. The specific principle can be referred to the description of forming the first part 51, which will not be repeated here.

[0236] S2-3. Referring to FIG. 21C , a second portion 52 of the connecting trace 5 is formed on the first selected side surface 1cc1 and the second selected side surface 1cc2 using a three-dimensional printing process. The second portion 52 of the connecting trace 5 electrically connects the first portion 51 and the third portion 53 .

[0237] For example, the starting position Q of the 3D printing device is selected with the side surface 1cc facing away from the substrate 1 and close to the first surface 1a of the substrate 1. The printing direction is from the first section to the third section. The air is shut off near the end position, ensuring that both ends of the second section overlap with the first and third sections. Alternatively, the printing direction is from the third section to the first section, as indicated by the double-headed arrow in Figure 21C. This printing direction is not limited.

[0238] It should be noted that the order of the above-mentioned steps S2-1 and S2-2 is not limited. The process diagram shown in Figures 21A to 21C is an example of performing step S2-2 first and then step S2-1, and in the flowchart corresponding to the above-mentioned step S2, Figures 21A to 21C use the example of the first area and the second area of ​​the second surface of the substrate being at different distances from the first surface.

[0239] Alternatively, step S2 of forming a plurality of connecting traces 5 on the first surface 1a, the selected side surface 1cc and the second surface 1b is specifically as follows:

[0240] S21. Use a three-dimensional printing process to form a material for the connecting traces 5 on the selected side surface 1cc, and arrange the material for the connecting traces 5 on the first surface 1a and the second surface 1b, overlapping with the first electrode 3 and the second electrode 4 to form a plurality of connecting traces 5.

[0241] Exemplarily, the material forming the connecting trace 5 is, for example, silver paste, which has fluidity. While forming the second part 52 of the connecting trace, the silver paste can extend to the first surface 1a and the second surface 1b, achieving fluid overlap with the first electrode 3 and the second electrode 4, thereby forming multiple connecting traces 5.

[0242] It should be noted that the process for forming the plurality of connecting traces can also be a pad printing or screen printing process, and this is not limited here. The connecting traces obtained using the above-mentioned preparation process can avoid damage and corrosion, and can also prevent certain damage to the film layer on the front surface of the display panel 10 caused by laser etching, thereby simplifying the display panel preparation process and improving the yield of the display panel during the manufacturing process.

[0243] In some embodiments, referring to FIG. 22A and FIG. 22B , step S2 of forming a plurality of connection traces 5 on the first surface 1 a , the selected side surface 1 cc , and the second surface 1 b includes:

[0244] S2 - 1 . Form the first portion 51 of the connecting trace 5 on the first surface 1 a of the first substrate 11 by using a pad printing process.

[0245] S2-2, forming the third portion 53 of the connecting trace 5 on the second surface 1b of the second substrate 12 by using a pad printing process.

[0246] S2-3. Form the second portion 52 of the connecting trace 5 on the first selected side surface 1cc1 and the second selected side surface 1cc2 by a pad printing process. The second portion 52 of the connecting trace 5 electrically connects the first portion 51 and the third portion 53.

[0247] Illustratively, the pad printing head used in the pad printing process is made of silicone, and the conductive adhesive that can be transferred onto the pad printing head is silver paste, wherein the silver paste is composed of silver particles and a resin solvent.

[0248] It should be noted that the order of the above steps S2-1 and S2-2 is not limited. Specifically, referring to the pad printing process diagram shown in Figure 22A, the conductive adhesive 102 is evenly applied on the steel mesh 101 provided with the wiring pattern 1011, and the excess conductive adhesive on the surface of the steel mesh with the wiring pattern is scraped flat with a scraper 103, and the pad printing rubber head 104 is pressed down, and the conductive adhesive 102 in the wiring pattern 1011 is dipped, and the rubber head is raised, and the conductive adhesive is transferred to the pad printing rubber head 104. After adjusting the position on the substrate to be printed to correspond to the position of the conductive adhesive of the pad printing rubber head 104, refer to Figure 22B, and press the pad printing rubber head down to print the conductive adhesive at the position on the substrate to be printed, thereby forming the side connection wiring. Referring to the above introduction, in the process of forming the connection wiring, it needs to be completed through three transfers, that is, it needs to be pad printed three times.

[0249] In some cases, referring to FIG. 22B and FIG. 4 , in the process of preparing the connecting trace 5 using the above-mentioned pad printing process, the maximum width B1 of the first portion 51 of the connecting trace 5 along the first direction X and / or the maximum width B3 of the third portion 53 along the first direction X are greater than the maximum width B2 of the second portion 52 along the first direction X. For example, in the process of forming the first portion 51 of the connecting trace 5, the length of the first portion 51 is shorter than the length of the second portion 52, and the first portion 51 is located between the first surface 1a and the first transition side surface. 1d, to ensure that the pad printing head 104 can form the first portion 51 with a single downward press, a relatively large force needs to be applied to the pad printing head 104. This allows the conductive adhesive to be formed on both the first surface 1a and the first transition side surface 1d simultaneously. Thus, because the greater the force applied to the pad printing head 104, the greater its deformation, the larger the contact area between the pad printing head 104 and the substrate. This results in the maximum width B1 of the formed first portion 51 along the first direction X being greater than the maximum width B2 of the second portion 52 along the first direction X. The process for forming the third portion 53 of the connecting trace is similar to the process for forming the first portion 51.

[0250] In some cases, as shown in FIG22B and FIG4 , the surface of the pad printing head is an arcuate surface. During the process of forming the second portion 52 of the connecting trace 5 , due to the longer length of the second portion 52 , the starting end of the conductive adhesive applied to the pad printing head is first brought into contact with the selected side surface 1cc of the substrate, near the end of the first surface 1a , completing the pad printing of the starting end of the second portion 52 . The pad printing head is then rotated so that the remaining portions of the conductive adhesive sequentially contact the selected side surface, forming the middle portion and the end of the second portion. When forming the starting end of the second portion 52 , the force applied to the pad printing head is relatively greater than that applied to the middle portion and the end, resulting in a dimension d5 of the first end 52a of the connecting trace 5 in the first direction X being greater than a dimension d6 of the second end 52b in the first direction. The second portion 52 includes a first end 52a and a second end 52b , with the first end 52a being the starting end and the second end being the end.

[0251] In some embodiments, the process of forming the connecting traces adopts the screen printing process. Referring to Figure 23, only the third part of the connecting trace of the screen-printed substrate is taken as an example here. The connecting traces formed by the screen printing process also require three screen printings to complete, first forming the first part on the front side of the substrate and the third part on the back side, and then forming the second part on the side.

[0252] In some cases, the various parts of the connecting traces formed by the screen printing process also have the above-mentioned dimensional relationship, which can be achieved by controlling the filling amount and flow rate of the conductive paste during the screen printing process, which will not be described in detail here.

[0253] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, comprising: a substrate including a first surface, a second surface, and a plurality of side surfaces connecting the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface; a plurality of light-emitting devices disposed on the first surface; a plurality of first electrodes disposed on the first surface, the plurality of first electrodes being arranged at intervals in a first direction; the plurality of first electrodes being closer to the selected side surface than the plurality of light-emitting devices; a plurality of second electrodes disposed on the second surface, the plurality of second electrodes being arranged at intervals in the first direction and being close to the selected side surface; a plurality of connecting traces arranged in parallel and at intervals; each of the plurality of connecting traces includes a first portion, a second portion, and a third portion connected in sequence, wherein the first portion is at least disposed on the first surface and is electrically connected to one of the plurality of first electrodes, the second portion is disposed on the selected side surface, and the third portion is at least disposed on the second surface and is electrically connected to one of the plurality of second electrodes; wherein the maximum width of the first portion in the first direction and / or the maximum width of the third portion in the first direction is greater than the maximum width of the second portion in the first direction.

2. The display panel according to claim 1, wherein, In at least one connecting trace, among at least two line segments of the orthographic projection pattern of the first portion on the first surface in the first direction, the line segment closer to the selected side surface is larger in size in the first direction than the line segment farther from the selected side surface. and / or, among at least two line segments of the orthographic projection pattern of the third portion on the second surface in the first direction, the line segment closer to the selected side surface is larger in size in the first direction than the line segment farther from the selected side surface.

3. The display panel according to claim 2, wherein, The second portion of the connecting trace includes a first end and a second end, the size of the first end in the first direction being greater than the size of the second end in the first direction, where the first end and the second end are opposite ends of the second portion of the connecting trace along its extending direction.

4. The display panel according to claim 2 or 3, wherein, The first portion overlaps with the first electrode partially, and the third portion overlaps with the second electrode partially.

5. The display panel according to any one of claims 1 to 4 further includes a plurality of signal lines disposed on the first surface, and the plurality of signal lines electrically connect the plurality of first electrodes to a plurality of light-emitting devices, wherein, Each signal line is electrically connected to one of the first electrodes, and the size of the signal line in the first direction is not greater than the size of the first electrode in the first direction.

6. The display panel according to claim 5, wherein, The display panel further includes at least one extension line disposed on one side of at least one first electrode close to the selected side surface, the at least one extension line being electrically connected to the first electrode; the at least one extension line is electrically connected to a connecting trace.

7. The display panel according to claim 6, wherein, The number of extension lines electrically connected to the first electrode is multiple, and the distance between any two of the extension lines is greater than or equal to 60 μm.

8. The display panel according to claim 7, wherein, At least two of the extension lines are electrically connected to the first portion of the connecting trace; the size of the first portion in the first direction is greater than the distance between the two extension lines; or, The first part includes at least two sub-parts, and the size of any sub-part in the first direction is not less than the size of any of the extension lines in the first direction; and at least two of the sub-parts respectively overlap with at least two of the extension lines.

9. The display panel according to claim 8, wherein, The size of the extension line in the first direction is less than or equal to 30 μm.

10. The display panel according to any one of claims 6 to 9, wherein, The multiple signal lines and the extension lines are formed of a first metal layer, and the multiple first electrodes are formed of the first metal layer and a second metal layer, wherein the second metal layer is farther from the first surface than the first metal layer.

11. The display panel according to claim 10, wherein, Among the connected signal line and the extension line, the size of the signal line in the first direction is greater than the size of the extension line in the first direction.

12. The display panel according to claims 1 to 11, wherein, The substrate includes a first substrate and a second substrate. The first substrate includes an opposite first surface and a third surface, and a plurality of first side surfaces connecting the first surface and the third surface; the second substrate includes an opposite fourth surface and a second surface, and a plurality of second side surfaces connecting the fourth surface and the second surface; the third surface and the fourth surface are close to each other. At least one of the plurality of first side surfaces is a first selected side surface, and at least one of the plurality of second side surfaces is a second selected side surface. The first selected side surface and the second selected side surface are located in the same plane to form a selected side surface of the substrate.

13. The display panel according to claim 12, wherein, The second surface includes a first region and a second region. The first region has a first distance from the first surface, and the second region has a second distance from the first surface. The first distance is greater than the second distance.

14. The display panel according to claim 13, wherein, The first distance is twice the second distance.

15. The display panel according to any one of claims 12 to 14, wherein, The substrate further includes an adhesive layer disposed between the third surface and the fourth surface and configured to bond the third surface and the fourth surface together.

16. The display panel according to claim 15, wherein, The material of the adhesive layer is a thermosetting or UV (Ultra-Violet Ray) curable material, and a plurality of silicon balls are uniformly disposed inside the adhesive layer.

17. A display device, comprising the display panel according to any one of claims 1 to 16; A driving circuit board, which is disposed on the second surface of the substrate of the display panel, and the driving circuit board is electrically connected to a plurality of connection traces of the display panel.

18. A tiled display device, comprising a plurality of the display devices according to claim 17, and the selected side surfaces of the display devices located in the same column or the same row are on the same side.

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