Ohmic heating control method and apparatus, ohmic heating apparatus, and household appliance

By obtaining heating parameters in the ohmic heating device and determining the turn heating conditions, the electrode column movement is controlled to turn the food to be heated. During the heating process, the problem of uneven heating of the food to be heated is solved, and a more uniform heating effect is achieved.

WO2024259941A9PCT designated stage expired Publication Date: 2025-03-20GREE ELECTRIC APPLIANCE INC OF ZHUHAI
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Patent Information

Application Number
PCT/CN2023/142168
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-06-21
Filing Date
2023-12-27
Publication Date
2025-03-20

AI Technical Summary

Technical Problem

During the ohmic heating process, the food to be heated is prone to be unevenly heated due to heating at a fixed position.

Method used

通过获取待加热食物的加热参数,判断是否满足翻转加热条件,如果满足,则控制欧姆加热装置中的电极柱运动,使待加热食物翻转后继续加热。

Benefits of technology

The uniformity of the food to be heated during the heating process is achieved, and the unevenness problem caused by continuous heating in a single position is avoided.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to an ohmic heating control method and apparatus, an ohmic heating apparatus, and a household appliance. The ohmic heating control method comprises: acquiring heating parameters of a food to be heated; on the basis of the heating parameters, determining whether said food satisfies a turning and heating condition; and if said food satisfies the turning and heating condition, controlling an electrode column, which is in contact with said food, in an ohmic heating apparatus to move, so that said food is turned over and then heated.
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Description

Ohmic heating control method, device, ohmic heating device and household appliance

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 2023107484207, filed on June 21, 2023, entitled “Ohmic Heating Control Method, Device, Ohmic Heating Device and Household Appliance,” the entire text of which is incorporated herein by reference. Technical Field

[0003] The present application relates to the field of ohmic heating technology, and in particular to an ohmic heating control method, device, ohmic heating device and household appliance. Background Art

[0004] Ohmic heating of food is a food heating method that treats the food to be heated as a conductor in a circuit. When current flows through the food to be heated, electrical energy is converted into thermal energy, causing the temperature of the food to be heated to rise, thereby achieving heating and sterilization. Due to its advantages such as fast heating speed and high thermal energy utilization efficiency, it is deeply loved by users.

[0005] Summary of the Invention

[0006] The present application provides an ohmic heating control method and device, an ohmic heating device, and a household appliance.

[0007] One aspect of the present application provides an ohmic heating control method, comprising: obtaining heating parameters when food to be heated is heated by ohmic heating; judging whether the food to be heated satisfies a flipping heating condition based on the heating parameters; and if the flipping heating condition is satisfied, controlling the movement of an electrode column in the ohmic heating device that contacts the food to be heated, so that the food to be heated is flipped and then heated.

[0008] In one embodiment, the ohmic heating control method further includes: judging whether the food to be heated meets a heating qualification condition based on the heating parameters; if the heating qualification condition is met, stopping heating of the food to be heated.

[0009] In one embodiment, the heating parameters include heating time and food temperature, and determining whether the food to be heated meets the heating qualification conditions based on the heating parameters includes: determining whether the food temperature is greater than or equal to a preset heating qualification temperature; if the food temperature is greater than or equal to the preset heating qualification temperature, determining whether the heating time is greater than or equal to the preset heating qualification time; if the heating time is greater than or equal to the preset heating qualification time, determining that the food to be heated meets the heating qualification conditions.

[0010] In one embodiment, the heating parameters include heating time, and determining whether the food to be heated meets the flipping heating condition based on the heating parameters includes: determining whether the heating time is greater than or equal to a preset flipping time; if the heating time is greater than or equal to the preset flipping time, determining that the food to be heated meets the flipping heating condition.

[0011] In one embodiment, the heating parameters include food temperature, and determining whether the food to be heated meets the flipping heating condition based on the heating parameters includes: determining whether the food temperature is greater than or equal to a preset flipping temperature, and whether the food temperature is less than a preset heating qualification temperature; if the food temperature is greater than or equal to the preset flipping temperature, and less than the preset heating qualification temperature, determining that the food to be heated meets the flipping heating condition.

[0012] In one embodiment, before obtaining the heating parameters of the food to be heated by ohmic heating, it also includes: if it is detected that the food to be heated is placed on the top surface of the electrode column of the ohmic heating device, electrical signals with opposite electrical properties are applied to any two electrode columns in contact with the food to be heated, so as to heat the food to be heated.

[0013] In one embodiment, if the flip heating condition is met, the method further includes: controlling two electrode columns currently applying electrical signals to replace them with electrical signals applying opposite electrical properties.

[0014] In one embodiment, controlling the movement of the electrode column in the ohmic heating device that is in contact with the food to be heated includes: obtaining temperature parameters of the electrode column in contact with the food to be heated; controlling the electrode column with a lower temperature parameter to descend, and controlling the electrode column with a higher temperature parameter to ascend.

[0015] In one embodiment, the electrode column is attached to the conductive protrusion of the fixed base plate of the driving component through the elastic element of the driving component in the ohmic heating device, and the control of the electrode column with a lower temperature parameter to descend includes: applying electrical signals with opposite electrical properties to the electrode column with a lower temperature parameter and its corresponding conductive protrusion, respectively.

[0016] In one embodiment, controlling the electrode column with a higher temperature parameter to rise includes: applying electrical signals of the same electrical property to the electrode column with a higher temperature parameter and the corresponding conductive protrusion.

[0017] An ohmic heating control device comprises: a heating parameter acquisition module for acquiring heating parameters when food to be heated is heated by ohmic heating; a flip judgment module for judging whether the food to be heated meets flip heating conditions based on the heating parameters; and a flip heating module for controlling the movement of an electrode column in the ohmic heating device that contacts the food to be heated if the flip heating conditions are met, so that the food to be heated is flipped and then heated.

[0018] Another aspect of the present application provides an ohmic heating device, comprising: a plurality of electrode columns, a drive assembly, a temperature detector and a processor, wherein the electrode columns are used to connect to a power supply; the drive assembly is used to connect to a power supply and drive the electrode columns; the temperature detector is arranged on the top surface of the electrode column; the processor is respectively connected to the drive assembly and the temperature detector, and is used to execute the steps of the above-mentioned ohmic heating control method.

[0019] In one embodiment, the ohmic heating device further includes a support assembly; wherein the electrode column is attached to the driving assembly through the support assembly; the support assembly includes a fixing plate and a support column, the fixing plate is provided with a through hole, the support column is attached to the driving assembly, the fixing plate is fixedly attached to the support column, and each of the electrode columns is attached to the driving assembly through the corresponding through hole.

[0020] In one embodiment, the driving assembly includes a fixed base plate and an elastic element, the fixed base plate is provided with a conductive protrusion, the elastic element is attached to the conductive protrusion, the electrode column is attached to the elastic element, and the conductive protrusion is used to connect to a power source.

[0021] Another aspect of the present application provides a household appliance comprising the above-mentioned ohmic heating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] FIG1 is a flow chart of an ohmic heating control method according to an embodiment of the present application;

[0024] FIG2 is a flow chart of an ohmic heating control method according to another embodiment of the present application;

[0025] FIG3 is a flow chart of an ohmic heating control method according to another embodiment of the present application;

[0026] FIG4 is a flow chart of an ohmic heating control method according to an embodiment of the present application;

[0027] FIG5 is a flow chart of an ohmic heating control method according to another embodiment of the present application;

[0028] FIG6 is a schematic diagram of an ohmic heating control method according to another embodiment of the present application;

[0029] FIG7 is a flow chart of an ohmic heating control method according to another embodiment of the present application;

[0030] FIG8 is a flow chart of an ohmic heating control method according to another embodiment of the present application;

[0031] FIG9 is a schematic diagram of placing food to be heated in one embodiment of the present application;

[0032] FIG10 is a schematic diagram of placing food to be heated in another embodiment of the present application;

[0033] FIG11 is a schematic diagram of an ohmic heating control method in another embodiment of the present application;

[0034] FIG12 is a schematic diagram of an electrode column control process in one embodiment of the present application;

[0035] FIG13 is a schematic diagram of placing food to be heated in one embodiment of the present application;

[0036] FIG14 is a schematic diagram of flipping food to be heated in one embodiment of the present application;

[0037] FIG15 is a schematic structural diagram of an ohmic heating control device according to an embodiment of the present application;

[0038] FIG16 is a schematic structural diagram of an ohmic heating control device in another embodiment of the present application;

[0039] FIG17 is a schematic structural diagram of an ohmic heating control device in another embodiment of the present application;

[0040] FIG18 is a schematic structural diagram of an ohmic heating device according to an embodiment of the present application;

[0041] FIG19 is a front view schematic diagram of the structure of an ohmic heating device according to an embodiment of the present application;

[0042] FIG20 is a schematic side view of the structure of an ohmic heating device according to an embodiment of the present application;

[0043] FIG21 is a schematic diagram of a top view of an ohmic heating device according to an embodiment of the present application;

[0044] FIG22 is a schematic structural diagram of an ohmic heating device in another embodiment of the present application.

[0045] Description of reference numerals:

[0046] 182 - electrode column, 184 - temperature detector, 186 - driving assembly; 192 - supporting assembly; 211 - supporting column, 212 - fixing plate 212; 221 - fixing base plate, 222 - elastic element, 223 - conductive protrusion. DETAILED DESCRIPTION

[0047] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0048] Ohmic heating is widely used as a food heating method. However, in the related art, ohmic heating is prone to the problem of uneven heating of the food to be heated.

[0049] The ohmic heating control method provided in the present application is applied in an ohmic heating device. Specifically, it is applied in an ohmic heating device in which current is applied to food to be heated through an electrode column to heat the food to be heated, and the electrode column can be driven by a driving component to perform telescopic movement, thereby driving the food to be heated to flip.

[0050] It is understandable that the specific shape of the electrode column of the ohmic heating device is not unique. It can be a cylindrical electrode column, a prismatic electrode column, etc., without specific limitation. The type of drive component that drives the movement of the electrode column is also not unique. In one embodiment, the electrode column can be extended and retracted by a motor drive; in another embodiment, the electrode column can be extended and retracted by an electromagnetic drive. There is no specific limitation here, and the choice can be made based on actual needs. To facilitate understanding of the technical solution of the present application, the following embodiments are explained using the drive component of the electromagnetic drive method.

[0051] Furthermore, the ohmic heating device is applied to household appliances, and the specific type of household appliances is not limited to a specific type, and any household appliance that needs to heat food can be used. For example, in one embodiment, the household appliance includes an oven, a steam oven, a microwave oven, or an air fryer, etc., without specific limitation.

[0052] Please refer to FIG. 1 . The present application provides an ohmic heating control method, including step 102 , step 104 and step 106 .

[0053] Step 102: Obtain heating parameters when the food to be heated is heated by ohmic heating.

[0054] Specifically, food to be heated is food that needs to be cooked through ohmic heating. Heating parameters are parameters that change with heating time during the ohmic heating process. There are many different types of heating parameters, and different methods for obtaining them vary depending on the heating parameter. You can choose the right one based on your specific needs.

[0055] It should be noted that the specific type of food to be heated is not limited. In one embodiment, the food to be heated may be solid. For this type of food to be heated, it can be directly placed in the ohmic heating device and heated by applying a current signal through the electrode columns. In another embodiment, the food to be heated may be liquid. For this type of food to be heated, a specific container can be provided. The container can be heated by applying a current signal through the electrode columns, thereby achieving heating of the food to be heated. The specific selection can be based on actual needs.

[0056] In the technical solution of the present application, the ohmic heating device is provided with a processor, which can be integrated with the processor of the household appliance used by the ohmic heating device, or can be an additional processor of an independent household appliance, without specific limitation.

[0057] When food is placed on or in contact with the electrode columns, the ohmic heating device's processor controls the electrode columns to energize them. This direct current then applies an electrical signal (current) to the food, generating heat within the food, thus achieving ohmic heating. During the heating process, the processor also acquires heating parameters related to the food in real time.

[0058] Step 104: determine whether the food to be heated meets the flipping heating conditions based on the heating parameters.

[0059] Specifically, the flipping condition is a condition that must be met when flipping the food to be heated. It is understood that flipping the food to be heated can be turning the food to be heated over to heat the opposite side of the current heating surface, or turning the food to be heated sideways to heat the side of the current heating surface, without specific limitation.

[0060] After obtaining the heating parameters corresponding to the food to be heated, the processor compares and analyzes them with the internal pre-set flip heating conditions to determine whether the food to be heated meets the flip heating conditions, and thus decides whether to flip the food to be heated for heating.

[0061] Step 106: If the flipping heating condition is met, the electrode column in the ohmic heating device that is in contact with the food to be heated is controlled to move so that the food to be heated is flipped and then heated.

[0062] Specifically, when the food to be heated is placed in an ohmic heating device for heating, the electrode columns are required to apply current to the food to be heated, so the food to be heated needs to be placed in contact with the electrode columns. Therefore, during the actual heating process, the electrode columns in contact with the food to be heated can be driven to move, causing the food to be heated to flip. After the food to be heated flips, the food to be heated continues to be heated. In this way, the food to be heated can be made to contact the electrode columns at different positions, and current can be input from different positions of the food to be heated, avoiding continuous heating in a single position, which would cause the food to be heated unevenly.

[0063] There is no single method for determining which electrode post is in contact with the food to be heated. In one embodiment, a pressure detector may be provided at the bottom of each electrode post to detect changes in pressure to determine whether the electrode post is in contact with the food to be heated. In another embodiment, a temperature detector may be provided at the top of each electrode post to determine whether the electrode post is in contact with the food to be heated based on the difference in temperature parameters between the electrode post in contact with the food to be heated and the electrode post not in contact with the food to be heated.

[0064] Specifically, after the food is placed on the electrode posts, the temperature parameters of the electrode posts in contact with the food change, thereby distinguishing the electrode posts in contact with the food. Alternatively, during the heating process, the electrode posts actually in contact with the food can be determined based on the temperature parameter changes of temperature detectors at each electrode post.

[0065] In actual application scenarios, there is not only one way to control the movement of the electrode column. In one embodiment, the electrode column may be equipped with a driving component, and the driving component may be controlled to work, thereby driving the corresponding electrode column to move. There is no specific limitation.

[0066] The ohmic heating device is equipped with multiple electrode columns, each of which is vertically attached to the drive assembly. Specifically, the bottom surface of each electrode column is attached to the drive assembly, and the top surface of each electrode column is used to place the food to be heated. In more detail, in one embodiment, the electrode columns can be arranged in an array on the drive assembly, with the top surfaces of each electrode column on the same horizontal plane to facilitate the placement of the food to be heated.

[0067] It should be noted that in actual use scenarios, the ohmic heating control method of the present application can be used to ohmically heat a single food item placed in an ohmic heating device. Alternatively, when multiple foods are placed in the ohmic heating device, the ohmic heating control method of the present application can be used to independently heat each food item. The heating control principle for each food item is the same, and the method can be selected based on the actual scenario.

[0068] It is understood that the length of the electrode pillars in an ohmic heating device is not unique. In one embodiment, to achieve flip control of the heated food, the length of the electrode pillars is set to the same in the same ohmic heating device. Furthermore, the length of the electrode pillars in different ohmic heating devices can be set to different lengths depending on the application scenario, and the specific selection can be based on actual conditions.

[0069] The aforementioned ohmic heating control method can obtain the heating parameters of the food to be heated during the heating process, and then use this to analyze whether the food to be heated meets the conditions for flipping heating. If the food to be heated meets the conditions for flipping heating, the movement of the electrode column in the ohmic heating device that contacts the food to be heated is controlled, thereby causing the food to be heated to flip, and ultimately heating the food in its flipped state. Through this solution, the food to be heated can be flipped during the ohmic heating process, solving the problem of uneven heating of the food to be heated due to heating in a fixed position.

[0070] Referring to FIG. 2 , in one embodiment, the ohmic heating control method further includes steps 202 and 204 .

[0071] Step 202: Determine whether the food to be heated meets heating eligibility conditions based on the heating parameters.

[0072] Step 204: If the heating qualification condition is met, stop heating the food to be heated.

[0073] In some embodiments, qualified heating means that the food to be heated is cooked, and the qualified heating condition is the cooking condition of the food to be heated. Specifically, the qualified heating condition is the condition that is satisfied when the food to be heated is cooked. In the solution of the present application, the qualified heating condition is pre-stored in the processor. When the ohmic heating of the food to be heated is started, the heating parameters obtained in real time are compared and analyzed with the qualified heating condition. If it is judged according to the heating parameters that the qualified heating condition is not satisfied, the food to be heated continues to be heated. If it is judged according to the heating parameters that the qualified heating condition is satisfied, the heating of the food to be heated is stopped. Through this solution, the ohmic heating can be stopped in time when the food to be heated is cooked, which not only avoids overheating of the food, but also saves power.

[0074] Specifically, when the heating conditions are met, the electrode column is interrupted from supplying current to the food to be heated. There is not a single way to achieve this. It can be by turning off the power supply connected to the electrode column, or by controlling the current channel between the power supply and the electrode column to be disconnected. The specific setting can be based on actual needs.

[0075] It can be understood that judging whether the food to be heated meets the heating qualification conditions based on the heating parameters can be performed in any time period after the ohmic heating of the food to be heated is turned on, that is, it can be performed between step S102 and step S104, or between step S104 and step S106, or after step S106, without specific limitation.

[0076] Please refer to FIG. 3 . In one embodiment, the heating parameters include heating time and food temperature. Step 202 includes steps 302 , 304 , and 306 .

[0077] Step 302: Determine whether the food temperature is greater than or equal to a preset heating qualification temperature.

[0078] Step 304: If the food temperature is greater than or equal to the preset heating qualified temperature, determine whether the heating time is greater than or equal to the preset heating qualified time.

[0079] Step 306: If the heating time is greater than or equal to the preset qualified heating time, it is determined that the food to be heated meets the qualified heating condition.

[0080] Specifically, the preset qualified heating temperature is the preset temperature that the food to be heated needs to meet when it is heated to perfection. The preset qualified heating duration is the preset cumulative heating duration required for the food to be heated to perfection. The food temperature is the temperature of the food to be heated. There is not only one way to obtain the food temperature. In one embodiment, in addition to the temperature detector provided at the electrode column, a temperature collector can be additionally provided in the form of a probe. During the heating process of the food to be heated, the temperature collector is inserted into the food to be heated to obtain the accurate food temperature.

[0081] In another embodiment, the surface temperatures of multiple foods to be heated can be collected by a temperature detector provided at the electrode column in contact with the food to be heated, and the food temperature can be finally obtained by calculating the average of the surface temperatures, etc., without specific limitation.

[0082] In the solution of this embodiment, the processor has a timing function, or a timer is additionally provided in the ohmic heating device. When the electrode column applies current to the food to be heated and the ohmic heating is turned on, the timing starts to obtain the heating time of the food to be heated.

[0083] Referring to FIG. 4 , taking the determination of whether the heating qualification condition is met after the food to be heated is flipped as an example, after obtaining the heating time and food temperature during the ohmic heating process of the food to be heated, the processor first compares and analyzes the food temperature with the preset heating qualification temperature. If the food temperature is less than the preset heating qualification temperature, the ohmic heating after flipping (i.e., cooking stage 2 in the figure) is continued. If the food temperature is greater than or equal to the preset heating qualification temperature, the heating time (i.e., cooking time in the figure) is further compared and analyzed with the preset heating qualification time. If the heating time is greater than or equal to the preset heating qualification time, the heating qualification condition is considered to be met, and the heating operation is terminated. If the heating time is less than the preset heating qualification time, the heating qualification condition is considered to be not met, and the process returns to continue the ohmic heating after flipping.

[0084] The above scheme needs to determine whether the heating time and food temperature meet the corresponding conditions to determine that the food to be heated is completed. This can effectively ensure that when cooking is completed, the food to be heated is in a qualified heating state, such as a cooked state, thereby improving heating reliability.

[0085] It should be noted that, in a more detailed embodiment, the preset qualified heating temperature and the preset qualified heating time are not unique. The processor can match the preset qualified heating temperature and the preset qualified heating time to different types of food to be heated. Specifically, the ohmic heating device can automatically identify the type of food to be heated through image recognition, etc., and thus match the corresponding preset qualified heating temperature and the preset qualified heating time. Alternatively, the user can manually input the current food type to the ohmic heating device, thereby matching the corresponding preset qualified heating temperature and the preset qualified heating time. This is not particularly limited.

[0086] Please refer to FIG. 5 . In one embodiment, the heating parameter includes a heating duration. Step 104 includes steps 502 and 504 .

[0087] Step 502: Determine whether the heating time is greater than or equal to the preset flipping time.

[0088] Step 504: If the heating time is greater than or equal to the preset flipping time, it is determined that the food to be heated meets the flipping heating condition.

[0089] Specifically, the preset flipping time is the preset heating time corresponding to when the food to be heated meets the flipping heating condition. Referring to Figure 6, the scheme of this embodiment, the heating parameters include the heating time (that is, the cooking time shown in the figure). The processor compares and analyzes the obtained heating time with the preset flipping time (taking 10 minutes as an example in the figure). When the heating time is less than the preset flipping time, the current state is maintained for continuous heating. When the heating time is greater than or equal to the preset flipping time, it is considered that the food to be heated meets the flipping heating condition, and the food to be heated is flipped and heated. This scheme analyzes whether the food to be heated meets the flipping heating condition in terms of heating time, which has the advantages of a simple judgment method and high heating control efficiency.

[0090] Similarly, similar to the preset heating qualified temperature and preset heating qualified time in the above embodiment, the preset flipping time may also be different for different types of food to be heated. It can be specifically matched in combination with the type of food to be heated, which will not be repeated here.

[0091] Please refer to FIG. 7 , in one embodiment, the heating parameter includes the food temperature, and step 104 includes step 702 and step 704 .

[0092] Step 702: Determine whether the food temperature is greater than or equal to a preset flipping temperature, and whether the food temperature is less than a preset heating qualified temperature.

[0093] Step 704: If the food temperature is greater than or equal to the preset flipping temperature and less than the preset heating qualification temperature, it is determined that the food to be heated meets the flipping heating conditions.

[0094] Specifically, the preset flipping temperature is the food temperature that corresponds to the food to be heated when it meets the flipping heating conditions. Referring to Figure 4 , in this embodiment, the heating parameters include the food temperature. The processor compares and analyzes the acquired food temperature with the preset flipping temperature (also shown in the figure). If the food temperature is less than the preset flipping temperature, heating is maintained at the current state. If the food temperature is greater than or equal to the preset flipping temperature, the food to be heated is deemed to meet the flipping heating conditions and is flipped before being heated. This solution uses food temperature to determine whether the food to be heated meets the flipping heating conditions, resulting in high flipping control accuracy.

[0095] Similarly, similar to the preset heating qualified temperature and the preset heating qualified time in the above embodiment, the preset flipping temperature may also be different for different types of food to be heated. It can be specifically matched in combination with the type of food to be heated, which will not be repeated here.

[0096] Please refer to FIG. 8 . In one embodiment, before step 102 , the method further includes step 802 .

[0097] In step 802, if it is detected that the food to be heated is placed on the top surface of the electrode column of the ohmic heating device, electric signals with opposite electrical properties are applied to any two electrode columns in contact with the food to be heated to heat the food.

[0098] Specifically, the food to be heated is placed on top of the electrode columns. (See Figures 9 and 10 for details.) One or more food items can be heated simultaneously, with A and B representing the food items. Given that the number of electrode columns in contact with the food is not unique, this embodiment employs the method of applying oppositely charged electrical signals to any two electrode columns to achieve ohmic heating. This method allows for rapid heating of the food, improving heating efficiency.

[0099] In one embodiment, if the flip heating condition is met, the method further includes: controlling the two electrode columns currently applying electrical signals to be replaced with electrical signals applying opposite electrical polarities.

[0100] Specifically, if the processor determines, based on the heating duration or food temperature, that the food currently being heated meets the flipping conditions, it not only controls the food to be heated to flip, but also changes the polarity of the electrodes applying electrical signals to the food to be heated. Referring to Figure 11 , assuming that electrode columns 1 and 2 are the electrode columns in contact with the food to be heated, after the food to be heated is placed on the electrode columns, a positive electrical signal is first applied to electrode column 1, which acts as the positive electrode, and a negative electrical signal is applied to electrode column 2, which acts as the negative electrode, to ohmically heat the food to be heated.

[0101] When the food temperature monitoring condition is met, the processor controls the power supply to adjust the electrical signal output, applying a negative signal to electrode column 1 and a positive signal to electrode column 2, changing the direction of the current in the food to be heated and achieving ohmic heating. This method promotes even heating of the food through mixed and alternating heating of the electrode columns, ensuring greater heating reliability.

[0102] It should be noted that the solution of this embodiment is applicable to situations where the electrode posts previously providing electrical signals remain in contact with the food after the food is flipped. In another embodiment, if the flipping causes the electrode posts that originally provided electrical signals to the food to be heated to no longer be in contact with the food, then any two electrode posts that remain in contact with the food after the flipping will be selected to apply different electrical signals to achieve heating after the flipping. In this way, mixed and alternating heating of the food by multiple electrode posts can also be achieved.

[0103] Please refer to FIG. 12 , in one embodiment, controlling the movement of an electrode column in contact with food to be heated in an ohmic heating device includes steps 122 and 124 .

[0104] Step 122: Acquire the temperature parameters of the electrode column in contact with the food to be heated.

[0105] Step 124 , controlling the electrode column with the lower temperature parameter to descend, and controlling the electrode column with the higher temperature parameter to ascend.

[0106] Specifically, the temperature parameters of the electrode columns are the temperature parameters collected by the temperature detectors that are located on the top surfaces of the electrode columns and in contact with the food to be heated. The temperature parameters obtained in this embodiment characterize, to a certain extent, the surface temperature of the portion of the food to be heated that is in contact with the electrode columns. By combining the flipping of the food to be heated with the surface temperature of the food to be heated, the electrode columns with lower temperature parameters are lowered, and the electrode columns with higher temperature parameters are raised, so that the portion of the food to be heated with higher surface temperatures is raised, while the portion with lower surface temperatures is lowered. Ultimately, due to the height difference, the food to be heated flips, and the portion with higher surface temperatures no longer contacts the electrode columns. When heated after flipping, other portions of the food to be heated can contact the electrode columns to achieve temperature rise, thereby ensuring uniform heating of the food to be heated during the heating process.

[0107] It should be pointed out that in the actual control process, the electrode column with a higher temperature parameter can be the electrode column with the highest temperature parameter, and the electrode column with a lower temperature parameter can be the electrode column with the lowest temperature parameter. That is, by controlling one of the electrode columns to rise and the other to fall, the food to be heated can be flipped.

[0108] In another embodiment, the electrode column with a higher temperature parameter can also be two or more electrode columns with relatively larger temperature parameters, and the electrode column with a lower temperature parameter can also be two or more electrode columns with relatively lower temperature parameters. That is, by controlling some of the electrode columns to rise and some of the electrode columns to fall, the food to be heated is flipped.

[0109] For example, in one embodiment, referring to FIG. 4 , when the flipping condition is met, the temperature detectors at the electrode columns in contact with the food to be heated obtain the temperature parameters of the electrode columns, and the electrode columns with temperature parameters greater than a first preset temperature threshold (taking 110 degrees Celsius as an example in the figure) are controlled to rise, and the electrode columns with temperature parameters less than a second preset temperature threshold (taking 80 degrees Celsius as an example in the figure) are controlled to fall, while the electrode columns with temperature parameters between the second preset temperature threshold and the first preset temperature threshold are not adjusted, and these electrode columns are automatically adapted in the process of some electrode columns rising and some electrode columns falling.

[0110] 13 and 14 , through the adjustment method of the above embodiment, the food to be heated can be moved from the position shown in FIG. 13 to the position shown in FIG. 14 for ohmic heating, so that the food is heated more evenly.

[0111] It's understandable that when controlling the flipping of the food to be heated based on the temperature parameters of the electrode columns, theoretically, one only needs to raise one or more electrode columns with higher temperature parameters and lower one or more electrode columns with lower temperature parameters to flip the food to be heated. This allows different locations of the food to contact the electrode columns, achieving flip heating and improving the uniformity of the heating of the food to be heated. Therefore, in actual application scenarios, there are no specific restrictions on which electrode column to raise or lower, and the amount of raising or lowering is not limited. You can choose according to your actual needs.

[0112] In one embodiment, the electrode column is attached to the conductive protrusion of the fixed base plate of the driving component through the elastic element of the driving component in the ohmic heating device, and the electrode column with a lower temperature parameter is controlled to descend, including: applying electrical signals with opposite electrical properties to the electrode column with a lower temperature parameter and its corresponding conductive protrusion.

[0113] In one embodiment, controlling the electrode column with a higher temperature parameter to rise includes: applying electrical signals of the same electrical property to the electrode column with a higher temperature parameter and its corresponding conductive protrusion.

[0114] Specifically, in the above scheme, the driving assembly used to drive the movement of the electrode column is a magnetic driving assembly. Specifically, the driving assembly includes a fixed base plate and an elastic element. The fixed base plate is provided with a conductive protrusion, the elastic element is attached to the conductive protrusion, the electrode column is attached to the elastic element, and the conductive protrusion is used to connect to the power supply. It can be understood that in order to achieve attraction or repulsion between the conductive protrusion and the electrode column, the elastic element should be insulated. The specific type of elastic element is not unique. In a more detailed embodiment, it can be an insulated spring or a support pad formed of other elastic materials, etc., which is not specifically limited.

[0115] In practical scenarios, the principle of like charges repel and opposite charges attract is employed. By applying signals of equal charge to the electrode column and the corresponding conductive protrusion, the electrode column is raised. By applying signals of opposite charge to the electrode column and the corresponding conductive protrusion, the electrode column is lowered, achieving actuation of the electrode column. This solution utilizes a magnetic drive assembly to drive the electrode column, offering the advantages of simple control and cost savings.

[0116] It should be noted that, in one embodiment, the fixed base plate of the driving assembly is made of insulating material. Accordingly, in this embodiment, each conductive protrusion is connected to a power source via a power line.

[0117] In another embodiment, the fixed base plate can also be made of a conductive material. In this case, to prevent the conductive protrusions corresponding to different electrode columns from interfering with each other, the fixed base plate needs to be partitioned and insulated in combination with the conductive protrusions. This prevents an electrical signal applied to a conductive protrusion from being transmitted to another conductive protrusion. In this embodiment, the conductive protrusions can be connected to a power source through the fixed base plate.

[0118] The above embodiments are all described using the example of flipping the food to be heated only once during the heating process. It should be noted that in other embodiments, the food to be heated can be controlled to flip twice or more during the heating process. In this case, two or more flipping judgment conditions can be set for the food to be heated. If the food temperature of the food to be heated is lower than the preset heating qualification temperature, or the heating time is lower than the preset heating qualification time, the food to be heated is flipped once each time it is detected that the food to be heated meets a flipping judgment condition based on the heating time or the food temperature, until the food to be heated is finally heated.

[0119] In order to facilitate understanding of the technical solution of the present application, the present application is explained below in conjunction with more detailed embodiments.

[0120] First, when the user needs to use ohmic heating to heat the food to be heated, the food to be heated is placed on the top of each electrode column. At this time, due to the pressure of the food to be heated on the electrode column, or the change in the temperature parameters of the electrode column caused by the food to be heated, the electrode columns in contact with the food to be heated are identified and the numbers of these electrode columns are obtained.

[0121] The processor then controls the connection between any two of these electrodes and the power supply, applying opposite electrical signals to each. For example, the power supply applies a positive signal to electrode 1 and a negative signal to electrode 2. This current then flows through the food, converting it into heat energy to heat it. During this process, the processor monitors the heating time and food temperature in real time. If the food temperature is greater than or equal to the preset flip temperature and less than the preset heating qualification temperature, or if the heating time is greater than or equal to the preset flip time, the flip condition is considered met.

[0122] The processor will control the drive assembly to drive the electrode columns to move, thereby turning the food to be heated. Specifically, the processor obtains the temperature parameters of each electrode column in contact with the food to be heated through a temperature detector, and applies electrical signals of opposite electrical properties (that is, positive and negative signals are applied respectively) to at least one electrode column with a temperature parameter less than 80 degrees Celsius and its corresponding conductive protrusion, thereby lowering this part of the electrode columns. Electrical signals of the same electrical properties (that is, positive or negative signals are applied at the same time) are applied to at least one electrode column with a temperature parameter greater than 110 degrees Celsius and its corresponding conductive protrusion, thereby raising this part of the electrode columns, while the remaining electrode columns remain unchanged.

[0123] In this way, the top surface of the electrode column where the food is heated flips, causing different locations of the food to contact the electrode column. If electrode column 1 and electrode column 2 are still in contact with the food, the power supply will be controlled to apply a negative electrical signal to electrode column 1 and a positive electrical signal to electrode column 2, achieving alternating heating. If electrode column 1 and / or electrode column 2 are not in contact with the food, the electrical signal will be switched to another electrode column in contact with the food to achieve heating.

[0124] After the food to be heated is flipped, the processor obtains the food temperature in real time and compares and analyzes it with the preset heating qualification temperature. If the food temperature is greater than or equal to the preset heating qualification temperature, the connection between the electrode column and the power supply is cut off to complete ohmic heating.

[0125] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0126] Based on the same technical concept, embodiments of the present application also provide an ohmic heating control device for implementing the aforementioned ohmic heating control method. The solution provided by this device is similar to the solution described in the aforementioned method. Therefore, the specific limitations of one or more embodiments of the ohmic heating control device provided below can be found in the above-described limitations of the ohmic heating control method and will not be further elaborated here.

[0127] Please refer to FIG. 15 , which shows an ohmic heating control device including a heating parameter acquisition module 152 , a flip judgment module 154 and a flip heating module 156 .

[0128] The heating parameter acquisition module 152 is used to obtain the heating parameters of the food to be heated when it is heated by ohmic heating; the flip judgment module 154 is used to judge whether the food to be heated meets the flip heating conditions based on the heating parameters; the flip heating module 156 is used to control the movement of the electrode column in the ohmic heating device that contacts the food to be heated if the flip heating conditions are met, so that the food to be heated can be flipped and heated.

[0129] Please refer to FIG. 16 . In one embodiment, the ohmic heating control device further includes an end control module 162 .

[0130] The end control module 162 is used to determine whether the food to be heated meets the heating qualification conditions according to the heating parameters; if the heating qualification conditions are met, the heating of the food to be heated is stopped.

[0131] In one embodiment, the end control module 162 is also used to determine whether the food temperature is greater than or equal to the preset heating qualification temperature; if the food temperature is greater than or equal to the preset heating qualification temperature, determine whether the heating time is greater than or equal to the preset heating qualification time; if the heating time is greater than or equal to the preset heating qualification time, determine that the food to be heated meets the heating qualification conditions.

[0132] In one embodiment, the flipping judgment module 154 is further used to determine whether the heating time is greater than or equal to the preset flipping time; if the heating time is greater than or equal to the preset flipping time, it is determined that the food to be heated meets the flipping heating conditions.

[0133] In one embodiment, the flip judgment module 154 is also used to determine whether the food temperature is greater than or equal to the preset flip temperature, and whether the food temperature is less than the preset heating qualification temperature; if the food temperature is greater than or equal to the preset flip temperature, and less than the preset heating qualification temperature, it is determined that the food to be heated meets the flip heating conditions.

[0134] Please refer to FIG. 17 . In one embodiment, before the heating parameter acquisition module 152 , the apparatus further includes a heating control module 172 .

[0135] The heating control module 172 is used to apply electrical signals with opposite electrical properties to any two electrode columns in contact with the food to be heated if it detects that the food to be heated is placed on the top surface of the electrode column of the ohmic heating device, so as to heat the food to be heated.

[0136] In one embodiment, the flip heating module 156 is further used to control the two electrode columns currently applying electrical signals to be replaced with electrical signals applying opposite electrical polarities.

[0137] In one embodiment, the flip heating module 156 is further used to obtain the temperature parameters of the electrode column in contact with the food to be heated; control the electrode column with lower temperature parameters to descend, and control the electrode column with higher temperature parameters to ascend.

[0138] In one embodiment, the flip heating module 156 is also used to apply electrical signals with opposite electrical properties to the electrode column with lower temperature parameters and its corresponding conductive protrusion; and / or, to apply electrical signals with the same electrical properties to the electrode column with higher temperature parameters and its corresponding conductive protrusion.

[0139] The aforementioned ohmic heating control device can obtain the heating parameters of the food to be heated during the heating process, and then use this information to analyze whether the food meets the conditions for flipping heating. If the food meets the conditions for flipping heating, the ohmic heating device controls the movement of the electrode column in contact with the food to be heated, thereby causing the food to flip, and ultimately heating the food in its flipped state. This solution allows the food to be flipped during the ohmic heating process, solving the problem of uneven heating of the food caused by heating in a fixed position.

[0140] Please refer to Figure 18. The present application also provides an ohmic heating device, including: an electrode column 182, a driving component 186, a temperature detector 184 and a processor (not shown in the figure), the electrode column 182 is used to connect to a power source; the driving component 186 is used to connect to a power source and drive the electrode column 182; the temperature detector 184 is arranged on the top surface of the electrode column 182; the processor is respectively connected to the driving component 186 and the temperature detector 184, and is used to execute the steps of the above-mentioned ohmic heating control method.

[0141] Specifically, the ohmic heating control method is as shown in the above-mentioned embodiments and drawings, and will not be described in detail here. The ohmic heating device can obtain the heating parameters of the food to be heated during the process of heating the food to be heated, and then use this to analyze whether the food to be heated meets the flipping heating conditions. When the food to be heated meets the flipping heating conditions, the electrode column 182 in the ohmic heating device that is in contact with the food to be heated is controlled to move, thereby causing the food to be heated to flip, and finally heating the food to be heated in the flipped state. Through this solution, during the ohmic heating process, the food to be heated can be flipped and heated, solving the problem of uneven heating of the food to be heated caused by heating in a fixed position.

[0142] 19 , in one embodiment, the ohmic heating device further includes a support assembly 192 , and each electrode column 182 is attached to the driving assembly 186 via the support assembly 192 . For example, each electrode column 182 is disposed on the driving assembly 186 via the support assembly 192 .

[0143] Specifically, the solution of this embodiment movably attaches each electrode column 182 to the driving component 186 through the support component 192. While ensuring the stability of the arrangement of each electrode column 182 in the driving component 186, it can also ensure that when the driving component 186 drives a certain electrode column 182, it will not affect other electrode columns 182, thereby improving the driving reliability of the electrode columns 182.

[0144] Please refer to Figures 20 and 21 in combination. In one embodiment, the support assembly 192 includes a fixing plate 212 and a support column 211. The fixing plate 212 is provided with a through hole. The support column 211 is attached to the driving assembly 186. The fixing plate 212 is fixedly attached to the support column 211. Each electrode column 182 is attached to the driving assembly 186 through the corresponding through hole.

[0145] Specifically, the specific type of the support assembly 192 is not unique. In the solution of this embodiment, the support column 211 is fixed to the driving assembly 186, and a fixing plate 212 with multiple through holes is used to fix the support column 211. Each electrode column 182 is attached to the driving assembly 186 through a through hole respectively, ensuring that each electrode column 182 moves along the through hole and the movement between the electrode columns 182 will not interfere with each other.

[0146] Please refer to Figure 22. In one embodiment, the driving assembly 186 includes a fixed base plate 221 and an elastic element 222. The fixed base plate 221 is provided with a conductive protrusion 223. The elastic element 222 is attached to the conductive protrusion 223. The electrode column 182 is attached to the elastic element 222. The conductive protrusion 223 is used to connect to a power source.

[0147] Specifically, the figure takes an electrode column 182 as an example for explanation. A power line and a signal line are embedded inside the electrode column 182. The power line is connected to a power source and is used to apply an electrical signal to the electrode column 182. One end of the signal line is connected to a temperature detector 184 arranged on the top surface of the electrode column 182, and the other end of the signal line is connected to a processor to realize the collection of temperature parameters.

[0148] To achieve attraction or repulsion between the conductive protrusion 223 and the electrode column 182, the elastic element 222 should be insulated. The specific type of the elastic element 222 is not limited. In a more detailed embodiment, it can be an insulated spring or a support pad formed of other elastic materials, etc., without specific limitation.

[0149] In actual scenarios, utilizing the principle that like charges repel and opposite charges attract, the electrode column 182 is driven by applying an electrical signal of the same electrical property to the electrode column 182 and the corresponding conductive protrusion 223, thereby causing the electrode column 182 to rise. The electrode column 182 is driven by applying an electrical signal of opposite electrical property to the electrode column 182 and the corresponding conductive protrusion 223, thereby causing the electrode column 182 to fall. This solution uses a magnetic drive assembly 186 to drive the electrode column 182, offering the advantages of simple control and cost savings.

[0150] It should be noted that, in one embodiment, the fixed base plate 221 of the driving assembly 186 is made of insulating material. Accordingly, in this embodiment, each conductive protrusion 223 is connected to a power source via a power line.

[0151] In another embodiment, the fixed base plate 221 may also be made of a conductive material. In this case, to prevent mutual interference between the conductive protrusions 223 corresponding to different electrode columns 182, the fixed base plate 221 is divided into sections and insulated in combination with the conductive protrusions 223. This ensures that when an electrical signal is applied to a conductive protrusion 223, it is not transmitted to other conductive protrusions 223. In this embodiment, the conductive protrusions 223 can be connected to a power source through the fixed base plate 221.

[0152] A household appliance comprises the above-mentioned ohmic heating device.

[0153] Specifically, the structure of the ohmic heating device enables the working mode, as shown in the above embodiments and drawings, the specific type of household appliance is not unique. In one embodiment, it can be an oven, a steam oven, a microwave oven or an air fryer, etc., without specific limitation.

[0154] Through the above solution, during the heating process of the food to be heated, the heating parameters of the food to be heated can be obtained, and then used to analyze whether the food to be heated meets the conditions for flipping heating. If the food to be heated meets the conditions for flipping heating, the movement of the electrode column in the ohmic heating device that contacts the food to be heated is controlled, thereby causing the food to be heated to flip, and ultimately heating the food to be heated in the flipped state. Through this solution, during the ohmic heating process, the food to be heated can be flipped and heated, solving the problem of uneven heating of the food to be heated caused by heating in a fixed position.

[0155] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0156] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An ohmic heating control method, comprising: Obtaining heating parameters when the food to be heated is heated by ohmic heating; Determining whether the food to be heated meets the flipping heating condition according to the heating parameters; If the flipping heating condition is met, the electrode column in the ohmic heating device that is in contact with the food to be heated is controlled to move so that the food to be heated is flipped and then heated.

2. The ohmic heating control method according to claim 1, further comprising: Determining whether the food to be heated meets the heating qualification condition according to the heating parameter; If the heating qualified condition is met, the heating of the food to be heated is stopped.

3. The ohmic heating control method according to claim 2, wherein: The heating parameters include heating time and food temperature, and judging whether the food to be heated meets the heating qualification conditions according to the heating parameters includes: Determining whether the temperature of the food is greater than or equal to a preset heating qualified temperature; If the food temperature is greater than or equal to the preset heating qualified temperature, determine whether the heating time is greater than or equal to the preset heating qualified time; If the heating time is greater than or equal to the preset qualified heating time, it is determined that the food to be heated meets the qualified heating condition.

4. The ohmic heating control method according to claim 1, wherein: The heating parameters include heating duration, and judging whether the food to be heated meets the flipping heating condition according to the heating parameters includes: Determine whether the heating time is greater than or equal to a preset flipping time; If the heating time is greater than or equal to the preset flipping time, it is determined that the food to be heated meets the flipping heating condition.

5. The ohmic heating control method according to claim 1, wherein: The heating parameter includes the food temperature, and judging whether the food to be heated meets the flipping heating condition according to the heating parameter includes: Determine whether the food temperature is greater than or equal to a preset flipping temperature, and whether the food temperature is less than a preset heating qualified temperature; If the food temperature is greater than or equal to the preset flipping temperature and less than the preset heating qualified temperature, it is determined that the food to be heated meets the flipping heating condition.

6. The ohmic heating control method according to any one of claims 1 to 5, wherein: Before obtaining the heating parameters of the food to be heated by ohmic heating, the method further includes: If it is detected that the food to be heated is placed on the top surface of the electrode column of the ohmic heating device, electrical signals with opposite electrical properties are applied to any two electrode columns in contact with the food to be heated to heat the food to be heated.

7. The ohmic heating control method according to claim 6, wherein: If the flip heating condition is met, the method further includes: controlling two electrode columns currently applying electrical signals to be replaced with electrical signals applying opposite electrical properties.

8. The ohmic heating control method according to any one of claims 1 to 5, wherein: The controlling the movement of the electrode column in the ohmic heating device in contact with the food to be heated comprises: Acquiring temperature parameters of the electrode column in contact with the food to be heated; The electrode column with the lower temperature parameter is controlled to descend, and the electrode column with the higher temperature parameter is controlled to ascend.

9. The ohmic heating control method according to claim 8, wherein: The electrode column is attached to the conductive protrusion of the fixed bottom plate of the driving component through the elastic element of the driving component in the ohmic heating device, and the electrode column with a lower temperature parameter is controlled to descend, including: Electrical signals with opposite electrical properties are applied to the electrode column with a lower temperature parameter and the corresponding conductive protrusion.

10. The ohmic heating control method according to claim 8, wherein: The step of controlling the electrode column with a higher temperature parameter to rise comprises: Electrical signals with the same electrical properties are applied to the electrode column with a higher temperature parameter and the corresponding conductive protrusion.

11. An ohmic heating control device, comprising: A heating parameter acquisition module, used to acquire heating parameters when the food to be heated is heated by ohmic heating; A flipping judgment module, used for judging whether the food to be heated meets the flipping heating condition according to the heating parameters; The flipping heating module is used to control the movement of the electrode column in the ohmic heating device that is in contact with the food to be heated if the flipping heating condition is met, so that the food to be heated is flipped and heated.

12. An ohmic heating device, comprising: A plurality of electrode columns for connecting to a power source; A driving component, used to connect to a power source and drive the electrode column; A temperature detector is arranged on the top surface of the electrode column; A processor is connected to the driving component and the temperature detector respectively, and is used to execute the steps of the ohmic heating control method described in any one of claims 1-10.

13. The ohmic heating device according to claim 12, further comprising a support assembly; in, The electrode column is attached to the drive assembly via the support assembly; The support assembly includes a fixing plate and a support column, the fixing plate is provided with a through hole, the support column is attached to the driving assembly, the fixing plate is fixedly attached to the support column, and each electrode column is attached to the driving assembly through the corresponding through hole.

14. The ohmic heating device according to claim 12, wherein: The driving assembly includes a fixed base plate and an elastic element, the fixed base plate is provided with a conductive protrusion, the elastic element is attached to the conductive protrusion, the electrode column is attached to the elastic element, and the conductive protrusion is used to connect a power source.

15. A household appliance comprising the ohmic heating device according to any one of claims 12 to 14.