Display panel and display device

Abstract

The present application relates to the technical field of display, and discloses a display panel and a display device. The display panel comprises a substrate, a first conductive layer, an insulating layer, a second conductive layer, and a plurality of light-emitting units. A second conductive pad is composed of a first portion and a second portion. In this way, it can be ensured that in the process of using a patterning process to form the second conductive layer, no metal residue will be generated at any part of the boundary of a first area in the insulating layer. Although a metal residue will still be generated at a part of the boundary of a second area in the insulating layer, because the boundary of the second area is recessed towards a display area or protrudes away from the display area, a sharp corner position is present at the boundary of the second area; as a result, the metal residue generated at a part of the boundary of the second area will be disconnected at the sharp corner position, and two adjacent second conductive pads will not be short-circuited, effectively improving the yield of the display panel.

Description

Display panel and display device

[0001] This application claims priority to Chinese patent application No. 202310798881.5 filed on June 29, 2023, entitled “Display Panel and Display Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0003] With the development of display technology, LED display panels have become the most advantageous new generation display media and have been widely used due to their advantages of pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, large viewing angle and stable and reliable operation.

[0004] Currently, LED display panels typically include a driver backplane and multiple LEDs located on one side of the driver backplane. The driver backplane can send drive signals to each LED, causing the LED to emit corresponding light, thereby allowing the LED display panel to present a corresponding display image.

[0005] However, the driver backplane typically contains multiple drive signal lines, each of which is connected to a conductive pad. This allows the drive signal lines to receive signals from the driver components through the conductive pads. During the driver backplane manufacturing process, short circuits can easily occur between adjacent conductive pads, resulting in a low yield rate for LED display panels.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a display panel and a display device. This can solve the problem of low yield of display panels in the prior art. The technical solution is as follows:

[0008] In one aspect, a display panel is provided, the display panel having a display area and a non-display area located outside the display area; the display panel includes:

[0009] substrate;

[0010] A first conductive layer, an insulating layer, and a second conductive layer are sequentially arranged vertically and away from the substrate; the first conductive layer includes: a plurality of first drive signal lines; the second conductive layer includes: a plurality of first conductive pads located in the display area, and a plurality of second conductive pads located in the non-display area; the first conductive pads are electrically connected to the first drive signal lines, and the second conductive pads are electrically connected to ends of the first drive signal lines;

[0011] a plurality of light-emitting units located in the display area, the light-emitting units being electrically connected to at least a portion of the first conductive pads;

[0012] The second conductive pad is composed of a first part and a second part, the first part is a part of which the orthographic projection of the second conductive pad on the substrate is located within the orthographic projection of the insulating layer on the substrate, and the second part is a part of which the orthographic projection of the second conductive pad on the substrate is located outside the orthographic projection of the insulating layer on the substrate; the insulating layer includes: two first areas overlapping with two adjacent second conductive pads, and a second area located between the two first areas, and the boundary of the second area is concave toward the display area or convex away from the display area.

[0013] Optionally, the first portion of the second conductive pad is closer to the display area than the second portion of the second conductive pad.

[0014] Optionally, the portion of the boundary of the orthographic projection of the insulating layer on the substrate that overlaps with the orthographic projection of the second conductive pad on the substrate is a straight line segment, and the width of the second conductive pad in a direction parallel to the straight line segment is equal to the length of the straight line segment.

[0015] Optionally, the insulating layer also includes: a third area whose boundary is recessed toward the display area, the third area and the insulating layer on both sides that are not recessed form an auxiliary groove, the orthographic projection of the auxiliary groove on the substrate overlaps with the orthographic projection of the second conductive pad on the substrate, and the orthographic projection of the auxiliary groove on the substrate is located within the orthographic projection of the second conductive layer on the substrate.

[0016] Optionally, the auxiliary groove includes a first groove portion and a second groove portion, and the first groove portion is closer to the display area than the second groove portion;

[0017] The second conductive layer further includes: a plurality of transfer leads, and the second conductive pad is electrically connected to the end of the first driving signal line through the transfer leads;

[0018] The orthographic projection of the first groove portion on the substrate is located within the orthographic projection of the transfer lead on the substrate, and the orthographic projection of the second groove portion on the substrate is located within the orthographic projection of the second conductive pad on the substrate.

[0019] Optionally, when the boundary of the second area protrudes away from the display area, the second area and the non-protruding insulating layers on both sides form a protrusion, and the minimum distance between the orthographic projection of the protrusion on the substrate and the orthographic projection of the adjacent second conductive pad on the substrate is greater than or equal to 50 microns.

[0020] Optionally, there are multiple second regions located between the two first regions, and the multiple second regions are distributed at intervals.

[0021] Optionally, the thickness of the insulating layer is less than 7 microns.

[0022] Optionally, the display panel also includes: a first inorganic layer located on the side of the second conductive layer facing away from the substrate, the portion of the first inorganic layer located in the non-display area has a plurality of first openings, the orthographic projection of the first opening on the substrate is located within the orthographic projection of the second conductive pad on the substrate, and is located outside the orthographic projection of the insulating layer on the substrate.

[0023] Optionally, the insulating layer is an organic insulating layer, and the display panel further includes: a second inorganic layer located between the first conductive layer and the insulating layer, and a third inorganic layer located between the insulating layer and the second conductive layer, wherein the portion of the third inorganic layer located in the non-display area covers the side of the organic insulating layer.

[0024] Optionally, the multiple second conductive pads are arranged into at least two rows; wherein, one row of the second conductive pads is distributed on one side of the multiple first drive signal lines, and is respectively electrically connected to the first ends of a portion of the multiple first drive signal lines; the other row of the second conductive pads is distributed on the other side of the multiple first drive signal lines, and is respectively electrically connected to the second ends of another portion of the multiple first drive signal lines.

[0025] In another aspect, a display panel is provided, comprising a display area and a non-display area located outside the display area; the display panel comprises:

[0026] substrate;

[0027] A first conductive layer, an insulating layer, and a second conductive layer are arranged perpendicularly and away from the substrate; the first conductive layer includes: a plurality of first drive signal lines arranged along a first direction; the second conductive layer includes: a plurality of first conductive pads located in the display area, and a plurality of second conductive pads located in the non-display area; the first conductive pads are electrically connected to the first drive signal lines, and the second conductive pads are electrically connected to ends of the first drive signal lines;

[0028] a plurality of light-emitting units located in the display area, the light-emitting units being electrically connected to at least a portion of the first conductive pads;

[0029] In which, the orthographic projections of the second conductive pads on the substrate are all located outside the orthographic projection of the insulating layer on the substrate, and the minimum distance between the orthographic projection of the second conductive pads on the substrate and the orthographic projection of the insulating layer on the substrate is greater than or equal to 50 microns; the insulating layer includes: a second area located between two adjacent first conductive pads in the first direction, and the boundary of the second area is concave toward the display area or convex away from the display area.

[0030] Optionally, the first conductive layer further includes: a plurality of transfer leads, and the second conductive pad is connected to the end circuit of the first driving signal line through the transfer leads.

[0031] Optionally, the display panel also includes: a second inorganic layer located between the first conductive layer and the organic insulating layer, and a third inorganic layer located between the organic insulating layer and the second conductive layer, the portion of the third inorganic layer located in the non-display area covers the side of the organic insulating layer, and the portion of the third inorganic layer located in the non-display area has a second opening, and the second conductive pad is electrically connected to the transfer lead through the second opening.

[0032] Optionally, when the boundary of the second area protrudes away from the display area, the second area and the non-protruding insulating layers on both sides form a protrusion, and the minimum distance between the orthographic projection of the protrusion on the substrate and the orthographic projection of the adjacent second conductive pad on the substrate is greater than or equal to 50 microns.

[0033] Optionally, the thickness of the insulating layer is less than 7 microns.

[0034] On the other hand, a display device is provided, comprising: a driving component and the above-mentioned display panel; the driving component is electrically connected to the plurality of second conductive pads.

[0035] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0036] A display panel includes: a substrate, a first conductive layer, an insulating layer, a second conductive layer and a plurality of light-emitting units. A second conductive pad in the second conductive layer is composed of a first part and a second part, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the insulating layer on the substrate, while the orthographic projection of the second part on the substrate is located outside the orthographic projection of the insulating layer on the substrate. In this way, it can be ensured that in the process of forming the second conductive layer using a graphical process, no metal residue is generated at the boundary of the first area in the insulating layer. Although metal residue will still be generated at the boundary of the second area in the insulating layer, because the boundary of the second area is concave toward the display area or convex away from the display area, there is a sharp corner at the boundary of the second area, so the metal residue generated at the boundary of the second area will be disconnected at the sharp corner, thereby preventing two adjacent second conductive pads from short-circuiting, which can effectively improve the yield rate of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] FIG1 is a schematic diagram of a film structure of a display panel provided by related art;

[0039] FIG2 is a partial enlarged view of an edge portion of the display panel shown in FIG1 ;

[0040] FIG3 is a schematic diagram of the film structure of the display panel at AA′ shown in FIG2 ;

[0041] FIG4 is a top view of a display panel provided in an embodiment of the present application;

[0042] FIG5 is a schematic diagram of the film layer structure of the display panel at position BB′ shown in FIG4 ;

[0043] FIG6 is a top view of a driving backplane in a display panel provided in an embodiment of the present application;

[0044] FIG7 is a partial enlarged view of the driving backplane at position C shown in FIG6;

[0045] FIG8 is a schematic diagram of the film structure of the driving backplane at position DD' shown in FIG7;

[0046] FIG9 is a partial top view of a driving backplane in another display panel provided by an embodiment of the present application;

[0047] FIG10 is a partial top view of a display panel provided in an embodiment of the present application;

[0048] FIG11 is a partial enlarged view of the driving backplane shown in FIG9 on one side of the plurality of first driving signal lines;

[0049] FIG12 is a partial enlarged view of the driving backplane shown in FIG9 on the other side of the plurality of first driving signal lines;

[0050] FIG13 is a schematic diagram of the back of a display panel provided in an embodiment of the present application;

[0051] FIG14 is a partial side view of a display panel provided in an embodiment of the present application;

[0052] FIG15 is a partial enlarged view of the display panel at position H1 shown in FIG11;

[0053] FIG16 is a partial enlarged view of the display panel at position H2 shown in FIG12;

[0054] FIG17 is another partial enlarged view of the display panel at position H1 shown in FIG11;

[0055] FIG18 is another partial enlarged view of the display panel at position H2 shown in FIG12;

[0056] FIG19 is a schematic diagram of the film structure of the display panel at MM' shown in FIG17 or FIG18;

[0057] FIG20 is a partial enlargement of an edge portion of another display panel provided by an embodiment of the present application;

[0058] FIG21 is a schematic diagram of the film structure of the display panel in the display area according to an embodiment of the present application;

[0059] FIG22 is another partial enlarged view of the driving back plate at position C shown in FIG6 ;

[0060] FIG. 23 is a schematic diagram of the film structure of the driving backplane at the NN′ position shown in FIG. 22 . DETAILED DESCRIPTION

[0061] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0062] Please refer to Figure 1, which is a schematic diagram of the film structure of a display panel provided by related art. The display panel may include a driving backplane 01 and multiple light-emitting units 02 located on one side of the driving backplane 01. The driving backplane 01 may include a substrate 011, a first conductive layer 012 and a second conductive layer 013 located on one side of the substrate, and an organic insulating layer 014 located between the first conductive layer 012 and the second conductive layer 013.

[0063] Here, the light-emitting units 02 can be electrically connected to the drive signal lines in the first conductive layer 012 and the second conductive layer 013. As shown in Figure 2, Figure 2 is a partial enlarged view of the edge of the display panel shown in Figure 1. The second conductive layer 013 is generally provided with conductive pads S0 electrically connected to the ends of these drive signal lines. The conductive pads S0 are used to electrically connect to the driving component, so that these drive signal lines can receive the drive signals provided by the driving component through the conductive pads S0, thereby controlling the corresponding light-emitting units 02 to emit light.

[0064] Please refer to Figure 3, which is a schematic diagram of the film layer structure of the display panel at the line AA' shown in Figure 2. To ensure that the conductive pad S0 in the second conductive layer 013 can be easily connected to the driving component later, the conductive pad S0 needs to be arranged outside the organic insulating layer 014. In other words, the orthographic projection of the conductive pad S0 on the substrate 100 needs to be distributed outside the orthographic projection of the organic insulating layer 014 on the substrate 100.

[0065] Because the second conductive layer 013 is located on the side of the organic insulating layer 014 facing away from the substrate 011, and the second conductive layer 013 requires a patterning process for the entire conductive film, and the organic insulating layer 014 is typically thick, the portion of the conductive film located at the boundary of the organic insulating layer 014 is not easily etched away during the patterning process to form the second conductive layer 013. As a result, after the second conductive layer 013 is formed, metal residues G are easily formed at the boundary of the organic insulating layer 014. Consequently, the two adjacent conductive pads S0 disposed outside the organic insulating layer 014 are easily conductively connected by the metal residues G, resulting in a short circuit between the two conductive pads S0, and thus a low yield rate of the display panel.

[0066] Please refer to Figure 4, which is a top view of a display panel provided by an embodiment of the present application. The display panel 000 may include a display area 00a and a non-display area 00b located outside the display area 00a.

[0067] In order to more clearly see the film structure of the display panel 000, please refer to Figure 5, which is a schematic diagram of the film structure of the display panel at BB' shown in Figure 4. The display panel 000 may include: a substrate 100, a first conductive layer 200, an insulating layer 300, a second conductive layer 400 and a plurality of light-emitting units 500.

[0068] The first conductive layer 200, insulating layer 300, and second conductive layer 400 in the display panel 000 can be arranged in sequence in a direction perpendicular to and away from the substrate 100. That is, the first conductive layer 200, insulating layer 300, and second conductive layer 400 are stacked, and the first conductive layer 200 is closer to the substrate 100 than the second conductive layer 400. It should be noted that the multiple light-emitting units 500 in the display panel 000 can all be located on the side of the second conductive layer 400 facing away from the substrate 100, and the portion of the display panel 000 located below the multiple light-emitting units 500 is the driving backplane in the display panel 000. That is, the driving backplane can include the substrate 100, and the first conductive layer 200, insulating layer 300, and second conductive layer 400 located on one side of the substrate 100. The multiple light-emitting units 500 in the display panel 000 can all be arranged on the driving backplane. Here, below the multiple light-emitting units 500 refers to the side opposite to the light emission direction of the multiple light-emitting units 500.

[0069] Optionally, the first conductive layer 200 and the second conductive layer 400 in the display panel 000 are both metal conductive layers. For example, the first conductive layer 200 and the second conductive layer 400 can both be made of copper. The insulating layer 300 in the display panel 000 can be an organic insulating layer. Because organic insulating layers have good flatness, the side of the insulating layer 300 facing away from the substrate 100 has good flatness, which can ensure that the second conductive layer 400 located on the side of the insulating layer 300 facing away from the substrate 100 is stably disposed on the insulating layer 300.

[0070] As shown in Figures 5 and 6, Figure 6 is a top view of a driving backplane in a display panel provided in an embodiment of the present application. The first conductive layer 200 in the display panel 000 may include: a plurality of first driving signal lines 201. The plurality of first driving signal lines 201 in the first conductive layer 200 may be arranged sequentially along a first direction X.

[0071] The second conductive layer 400 in the display panel 000 may include a plurality of first conductive pads S10 and a plurality of second conductive pads S20. The plurality of first conductive pads S10 may be located in the display area 00a of the display panel 000, and the plurality of second conductive pads S20 may be located in the non-display area 00b of the display panel 000.

[0072] Here, the first conductive pad S10 may be electrically connected to the first driving signal line 201 , and the second conductive pad S20 may be electrically connected to an end portion of the first driving signal line S10 .

[0073] For example, the multiple first drive signal lines 201 in the first conductive layer 200 can be electrically connected to at least part of the first conductive pads S10 in the second conductive layer 400, and the multiple first drive signal lines 201 in the first conductive layer 200 and the multiple second conductive pads S20 in the second conductive layer 400 are one-to-one corresponding, and the end of each first drive signal line 201 can be electrically connected to the corresponding second conductive pad S20.

[0074] The plurality of light-emitting units 500 in the display panel 000 may be located within the display area 100, and the light-emitting units 500 may be electrically connected to at least a portion of the first conductive pads S10. It should be noted that in the embodiment of the present application, the display area 00a refers to the area of ​​the display panel 100 where the light-emitting units 500 are distributed, and the non-display area 00a refers to the area of ​​the display panel 100 where the plurality of light-emitting units 500 are distributed.

[0075] In the present application, the second conductive pad S20 in the second conductive layer 400 is used to electrically connect to the driving component. Since the second conductive pad S20 can be electrically connected to the end of the first drive signal line 201 in the non-display area 00b, and the light-emitting unit 500 in the display area 00a can be electrically connected to the first drive signal line 201 via the first conductive pad S10, the driving component can send a drive signal to the first drive signal line 201 via the second conductive pad S20, so that the first drive signal line 201 transmits the drive signal to the light-emitting unit 500 via the first conductive pad S10, thereby allowing the driving component to control the light-emitting state of the light-emitting unit 500 to ensure that the display panel 100 can display the corresponding display image.

[0076] In the embodiment of the present application, as shown in Figures 7 and 8, Figure 7 is a partial enlarged view of the driver backplane shown in Figure 6 at position C, and Figure 8 is a schematic diagram of the film layer structure of the driver backplane shown in Figure 7 at position D-D'. The second conductive pad S20 in the second conductive layer 400 is composed of a first portion S21 and a second portion S22. The first portion S21 of the second conductive pad S20 is the portion whose orthographic projection on the substrate 100 is located within the orthographic projection of the insulating layer 300 on the substrate 100; the second portion S22 of the second conductive pad S20 is the portion whose orthographic projection on the substrate 100 is located outside the orthographic projection of the insulating layer 300 on the substrate 100. In other words, the orthographic projection of the first portion S21 on the substrate 100 is located within the orthographic projection of the insulating layer 300 on the substrate 100, while the orthographic projection of the second portion S22 on the substrate 100 is located outside the orthographic projection of the insulating layer 300 on the substrate 100.

[0077] The insulating layer 300 may include two first regions 301 overlapping two adjacent second conductive pads S20, and a second region 302 located between the two first regions 301. The boundary of the second region 302 may be concave toward the display area 00a or convex away from the display area 00a. In other words, the second region 302 in the insulating layer 300 may be distributed between the two adjacent first conductive pads S20 in the first direction X.

[0078] Here, when the boundary of the second region 302 is recessed toward the display area 00a, the second region 302 and the non-recessed portions of the insulating layer 300 on either side can form a recess U1. When the boundary of the second region 302 is recessed away from the display area 00a, the second region 302 and the non-recessed portions of the insulating layer 300 on either side can form a protrusion. It should be noted that FIG. 7 is a schematic illustration of the example in which the boundary of the second region 302 in the insulating layer 300 is recessed toward the display area 00a, and the second region 302 and the non-recessed portions of the insulating layer 300 on either side can form a recess U1.

[0079] In the embodiment of the present application, although the insulating layer 300 in the display panel 000 is an organic insulating layer, the thickness of the insulating layer 300 is also relatively thick, and the second conductive layer 400 is also located on the side of the insulating layer 300 facing away from the substrate 100. The second conductive layer 400 also requires a patterning process for the entire conductive film. However, in the present application, when the orthographic projection of the first portion S21 of the second conductive pad S20 on the substrate 100 is located within the orthographic projection of the insulating layer 300 on the substrate 100, and the orthographic projection of the second portion S22 on the substrate 100 is located outside the orthographic projection of the insulating layer 300 on the substrate 100, it is ensured that no metal residue is generated at the boundary of the first region 301 in the insulating layer 300 during the patterning process for forming the second conductive layer 400. Although metal residues will still be generated at the boundary of the second area 302 in the insulating layer 300, because the boundary of the second area 302 is concave toward the display area 00a or convex away from the display area 00a, there is a sharp corner position (for example, position E) at the boundary of the second area 302. Therefore, the metal residues generated at the boundary of the second area 302 will be disconnected at the sharp corner, thereby preventing the two adjacent second conductive pads 400 from short-circuiting, which can effectively improve the yield of the display panel 000.

[0080] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a first conductive layer, an insulating layer, a second conductive layer and a plurality of light-emitting units. The second conductive pad in the second conductive layer is composed of a first part and a second part, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the insulating layer on the substrate, while the orthographic projection of the second part on the substrate is located outside the orthographic projection of the insulating layer on the substrate. In this way, it can be ensured that in the process of forming the second conductive layer using a graphical process, no metal residue is generated at the boundary of the first area in the insulating layer. Although metal residue will still be generated at the boundary of the second area in the insulating layer, because the boundary of the second area is concave toward the display area or convex away from the display area, there is a sharp corner position at the boundary of the second area, so the metal residue generated at the boundary of the second area will be disconnected at the sharp corner position, thereby preventing the two adjacent second conductive pads from short-circuiting, which can effectively improve the yield rate of the display panel.

[0081] In an embodiment of the present application, as shown in Figures 9 and 10, Figure 9 is a partial top view of a driving backplane in another display panel provided in an embodiment of the present application, and Figure 10 is a partial top view of a display panel provided in an embodiment of the present application. The multiple light-emitting units 500 in the display panel 000 can be arranged in an array into multiple rows and columns. The multiple first drive signal lines 201 in the first conductive layer 200 can include: multiple groups of drive signal lines 201a corresponding to the multiple columns of light-emitting units 500, and a group of drive signal lines 201a can be electrically connected to a corresponding column of light-emitting units 500. The second conductive layer 400 in the display panel 000 can also include: multiple second drive signal lines 401, the multiple second drive signal lines 401 can correspond one-to-one to the multiple rows of light-emitting units 500, and each second drive signal line 401 can be electrically connected to a corresponding row of light-emitting units 500. Here, the multiple second drive signal lines 401 can be arranged along a second direction Y perpendicular to the first direction X. That is, the first driving signal line 201 in the first conductive layer 200 may be a signal line extending longitudinally (ie, the second direction Y), and the second driving signal line 401 in the second conductive layer 400 may be a signal line extending transversely (ie, the first direction X).

[0082] The orthographic projection of a column of light emitting units 500 on the substrate 100 may overlap with the orthographic projection of a corresponding group of driving signal lines 201 a on the substrate 100 , and a row of light emitting units 500 may be distributed between two adjacent second driving signal lines 401 .

[0083] For example, a group of drive signal lines 201a corresponding to a column of light-emitting units 500 in the display panel 000 may include: an anode drive signal line L1, a data signal line L2, and a ground line L3. A second drive signal line 401 corresponding to a row of light-emitting units 500 may be a power signal line. Here, the multiple first drive signal lines 201 in the first conductive layer 200 may also include: a plurality of power transfer signal lines L4. The multiple power transfer lines L4 may correspond one-to-one with the multiple groups of drive signal lines 201a, and each power transfer line L4 may be distributed on one side of the corresponding group of drive signal lines 201a. The multiple power transfer signal lines L4 may also correspond to the multiple second drive signal lines 401 in the second conductive layer 400, and the power transfer signal lines L4 may be electrically connected to the corresponding second drive signal lines 401. In this way, since the longitudinally extending first drive signal line 201 can access the signal provided by the drive component through the second conductive pad S20, when the transversely extending second drive signal line 401 is electrically connected to the power transfer signal line L4 among the multiple longitudinally extending first drive signal lines 201, the second drive signal line 401 can access the signal provided by the drive component through the power transfer signal line L4.

[0084] The light-emitting unit 500 in the display panel 000 may include a driver chip 502 and at least one LED. It should be noted that the LED in the light-emitting unit 500 in the present application may be a regular-sized LED, a mini light-emitting diode (mini-LED), or a micro-LED (micro-LED).

[0085] In this case, the plurality of first conductive pads S10 distributed within the second conductive layer 400 of the display panel 000 may include: a first pad group S01 for fixedly connecting to the LED in the light-emitting unit 500, and a second pad group S02 for fixedly connecting to the driver chip 502 in the light-emitting unit 500. Optionally, the orthographic projection of the first pad group S01 on the substrate 100 may be located within the orthographic projection of the anode drive signal line L1 on the substrate 100; and the orthographic projection of the second pad group S02 on the substrate 100 may be located within the orthographic projection of the ground line L3 on the substrate 100.

[0086] Here, the first pad group S01 may include a first pad S1 and a second pad S2, and the second pad group S02 may include a third pad S3, a fourth pad S4, and a fifth pad S5.

[0087] Part of the drive signal lines 201a in the group of drive signal lines 201a electrically connected to the light-emitting unit 500 is used to electrically connect to the first pad S1 in the first pad group S01. For example, the second conductive layer 400 may further include a first transfer electrode 402. The anode drive signal line L1 in the group of drive signal lines 201a may be electrically connected to the first pad S1 via the first transfer electrode 402.

[0088] The second pad S2 in the first pad group S01 is electrically connected to the third pad S3 in the second pad group S02. For example, the second conductive layer 300 may further include a second via electrode 403. The first pad S1 may be electrically connected to the third pad S3 via the second via electrode 403.

[0089] Another portion of the drive signal lines 201a in the group of drive signal lines 201a electrically connected to the light-emitting unit 500 is electrically connected to the fourth pad S4 in the second pad group S02. For example, the second conductive layer 400 may further include a third transfer electrode 404. The data signal line L2 in the group of drive signal lines 201a may be electrically connected to one fourth pad S4 via one third transfer electrode 404; and the ground line L3 in the group of drive signal lines 201a may be electrically connected to another fourth pad S4 via another third transfer electrode 404.

[0090] The second driving signal line 401 electrically connected to the light emitting unit 500 is used to electrically connect to the fifth pad S5 in the second pad group S02. For example, the second conductive layer 400 may further include a fourth transfer electrode 405. The second driving signal line 401 may be electrically connected to the fifth pad S5 via the fourth transfer electrode 405.

[0091] For example, the number of LEDs in the light-emitting unit 500 can be three, and these three LEDs can be distributed as follows: a red LED 501a for emitting red light, a green LED 501b for emitting green light, and a blue LED 501c for emitting blue light. In this case, the number of first solder pad groups S01 is also three, and these three first solder pad groups S01 can be electrically connected to the red LED 501a, the green LED 501b, and the blue LED 501c, respectively.

[0092] Here, the red LED 501a, the green LED 501b and the blue LED 501c in the light emitting unit 500 each have two solder pins, which are respectively a positive solder pin and a negative solder pin.

[0093] The positive electrode solder leg of the red LED 501a can be connected to the first solder pad S1 in the corresponding first solder pad group S01, so that the positive electrode solder leg of the red LED 501a can be connected to the corresponding anode drive signal line L1 through the first solder pad S1. The negative electrode solder leg of the red LED 501a can be soldered to the second solder pad S2 in the corresponding first solder pad group S01.

[0094] The positive electrode solder leg of the green LED 501b can be soldered to the first solder pad S1 in the corresponding first solder pad group S01, so that the positive electrode solder leg of the green LED 501b can be connected to the corresponding anode drive signal line L1 through this first solder pad S1. The negative electrode solder leg of the green LED 501b can be soldered to the second solder pad S2 in the corresponding first solder pad group S01.

[0095] The positive electrode solder leg of the blue LED 501c can be soldered to the first solder pad S1 in the corresponding first solder pad group S01, so that the positive electrode solder leg of the blue LED 501c can be connected to the corresponding anode drive signal line L1 through the first solder pad S1. The negative electrode solder leg of the blue LED 501c can be soldered to the second solder pad S2 in the corresponding first solder pad group S01.

[0096] The driver chip 502 in the light-emitting unit 500 has six solder pins, which are: a power signal input solder pin, a data signal input solder pin, a ground solder pin, and three signal output solder pins corresponding to the three LEDs.

[0097] The three signal output pins of the driver chip 502 can be respectively soldered to the three third solder pads S3 in the second solder pad group S02. Since the three third solder pads S3 are electrically connected to the three second solder pads S2 in the three first solder pad groups S01, the three signal output pins of the driver chip 502 can be respectively electrically connected to the three LED cathode pins.

[0098] The power signal input pin of the driver chip 502 can be soldered to a fifth solder pad S5 in the second solder pad group S02, so that the power signal input pin can be connected to the power signal line (ie, the second driving signal line 401) through the fifth solder pad S5.

[0099] The data signal input pin of the driver chip 502 can be soldered to a fourth pad S4 in the second pad group S02 , so that the data signal input pin can be connected to the data signal line L2 through the fourth pad S4 .

[0100] The grounding pin of the driver chip 502 may be soldered to another fourth solder pad S4 in the second solder pad group S02 , so that the grounding pin may be connected to the ground line L3 through the fourth solder pad S4 .

[0101] In this case, when the display panel 000 needs to control the light-emitting unit 500 to emit light, a power drive signal can be applied to the power signal line electrically connected to the light-emitting unit 500 within the display panel 000, and a data drive signal can be applied to the data signal line L2 electrically connected to the light-emitting unit 500. In this way, after the driver chip 502 in the light-emitting unit 500 receives the power drive signal via the power signal input solder pin, the driver chip 502 can enter an operating state. Furthermore, after the driver chip 502 receives the data signal via the data signal input solder pin, it can generate three cathode signals corresponding to the three LEDs based on the data signal. These three cathode signals can be transmitted to the three LED negative pins via three signal output solder pins, respectively. Since the positive electrode soldering of the LED is always connected to the anode signal applied by the anode drive signal line L1, after the LED receives the anode signal and the cathode signal, the LED can emit light of the corresponding intensity.

[0102] It should be noted that to simplify the wiring structure within display panel 000, at least two of the anode pins of red LED 501a, green LED 501b, and blue LED 501c can be connected to the same anode drive signal line L1. Since the luminous characteristics of red LED 501a differ significantly from those of green LED 501b and blue LED 501c, respectively, while the luminous characteristics of green LED 501b differ slightly from those of blue LED 501c, the anode pins of green LED 501b and blue LED 501c can be connected to the same anode drive signal line L1, while the anode pin of red LED 501a can be connected to a different anode drive signal line L1. In this case, the first soldering pad S1 soldered to the anode leg of the green LED 501b and the first soldering pad S1 soldered to the anode leg of the blue LED 501c can be integrally formed. That is, the anode leg of the green LED 501b and the anode leg of the blue LED 501c can be soldered to the same first soldering pad S1, while the anode leg of the red LED 501a can be soldered to another first soldering pad S1.

[0103] In an embodiment of the present application, please refer to Figures 11 and 12. Figure 11 is a partial enlarged view of the driving backplane shown in Figure 9 on one side of the plurality of first driving signal lines, and Figure 12 is a partial enlarged view of the driving backplane shown in Figure 9 on the other side of the plurality of first driving signal lines. The plurality of second conductive pads S20 in the second conductive layer 300 can be arranged in at least two rows. Among them, one row of second conductive pads S20 in the two rows of second conductive pads S20 is distributed on one side of the plurality of first driving signal lines 201, and the second conductive pads S20 in this row are respectively electrically connected to the first ends of a portion of the first driving signal lines 201 in the plurality of first driving signal lines 201. For example, the second conductive pads S20 in this row can be respectively connected to the plurality of anode driving signal lines L1 and the plurality of ground lines L3 in the plurality of first driving signal lines 201. Another row of second conductive pads S20 in the two rows of second conductive pads S20 is distributed on the other side of the multiple first drive signal lines 201, and this row of second conductive pads S20 is respectively electrically connected to the second ends of another part of the multiple first drive signal lines 201. For example, this row of second conductive pads S20 can be respectively electrically connected to the multiple data signal lines L2 and the multiple power transfer signal lines L4 in the multiple first drive signal lines 201.

[0104] In the present application, there are two driving components for providing driving signals to the plurality of first driving signal lines 201. Of the two driving components, one driving component can be attached to one side of the display panel 000 to provide electrical connections to the plurality of anode driving signal lines L1 and the plurality of grounding lines L3 in the plurality of first driving signal lines 201; the other driving component can be attached to the other side of the display panel 000 to provide electrical connections to the plurality of data signal lines L2 and the plurality of power transfer signal lines L4 in the plurality of first driving signal lines 201.

[0105] Here, since the display panel 000 in this application can be used as a spliced ​​display unit in a spliced ​​screen, a larger spliced ​​display screen can be obtained by splicing multiple display panels 000. Therefore, in order to ensure a good display effect of the spliced ​​display screen obtained by subsequent splicing, it is necessary to ensure that the width of the non-display area 00a of the display panel 000 is relatively narrow. To this end, in this application, it is necessary to bind the driver component to the display panel 000 through back binding.

[0106] For example, as shown in Figure 13, Figure 13 is a schematic diagram of the back of the display panel provided by an embodiment of the present application. The edge drive of the side of the substrate 100 in the display panel 000 facing away from the drive layer 200 may include: two binding areas F. The display panel 000 may also include: a plurality of first signal leads D1 located in each binding area F. Here, one end of each first signal lead D1 in each binding area F is used to be electrically connected to the corresponding first drive signal line 201, and the other end is used to be bound and connected to the drive component, so that the drive component can be bound to the display panel 000.

[0107] For example, as shown in FIG14 , which is a partial side view of a display panel provided in an embodiment of the present application, the display panel 000 may further include: a plurality of second signal leads D2 electrically connected to the plurality of first signal leads D1. A portion of the second signal leads D2 is located on a side of the substrate 100 close to the drive layer 200, and this portion of the second signal leads D2 may be electrically connected to the corresponding first drive signal lines 201 via a second conductive pad S20. Another portion of the second signal leads D2 is located on a side of the substrate 100, and the end of this portion of the second signal leads D2 facing the back of the display panel 000 may be electrically connected to the corresponding first signal leads D1.

[0108] In this way, the driver component can send a driving signal to the first drive signal line 201 through the first signal lead D1 and the second signal lead D2, so that the corresponding light-emitting unit 500 can be illuminated. When the driver component is attached to the back of the display panel 000, the driver component does not occupy the space on the front of the display panel 000, so that the screen-to-body ratio of the front of the display panel 000 is high, thereby ensuring that the width of the non-display area 00b of the display panel 000 is narrow.

[0109] It should be noted that the multiple second signal leads D2 and the multiple first signal leads D1 are formed using the same process. For example, a laser etching process can be used to simultaneously form the multiple second signal leads D2 and the multiple first signal leads D1. For example, after the driver backplane is prepared, a conductive layer can be sputtered in the edge area of ​​the front side of the driver backplane, the side of the driver backplane, and the bonding area of ​​the back side of the driver backplane. Then, a laser etching process can be performed on the conductive layer to simultaneously form the multiple second signal leads D2 and the multiple first signal leads D1.

[0110] It should also be noted that the above embodiments illustrate the driving principle of the driving backplane in the display panel 000 , and the following embodiments will explain the improved design of each film layer structure in the display panel 000 .

[0111] In the present application, there are various positional relationships between the second conductive pad S20 in the display panel 000 and the boundary of the insulating layer 300. The present application embodiment uses the following two optional implementations as examples for illustration:

[0112] For a first possible implementation, please refer to Figures 15 and 16. Figure 15 is a partial enlarged view of the display panel at position H1 shown in Figure 11, and Figure 16 is a partial enlarged view of the display panel at position H2 shown in Figure 12. The first portion S21 of the second conductive pad S20 is closer to the display area 00a than the second portion S22 of the second conductive pad S20.

[0113] For example, the portion of the boundary of the orthographic projection of the insulating layer 300 on the substrate 100 that overlaps with the orthographic projection of the second conductive pad S20 on the substrate is a straight line segment I. The width of the second conductive pad S20 in a direction parallel to the straight line segment I is equal to the length of the straight line segment I. In this case, the second conductive pad S20 can be divided into a first portion S21 and a second portion S22 along the straight line segment I. The first portion S21 of the second conductive pad S20 covers a portion of the boundary of the insulating layer 300, thereby ensuring that no metal residue is generated at the boundary of the insulating layer 300 adjacent to the second conductive pad S20 during the formation of the second conductive layer 400 using a patterning process.

[0114] For a second possible implementation, please refer to Figures 17 and 18. Figure 17 is another partial enlarged view of the display panel shown in Figure 11 at H1, and Figure 18 is another partial enlarged view of the display panel shown in Figure 12 at H2. The insulating layer 300 in the display panel 000 may also include: a third area whose boundary is recessed toward the display area 00a. Here, the third area and the insulating layers on both sides that are not recessed constitute an auxiliary groove U2. The orthographic projection of the auxiliary groove U2 on the substrate 100 may overlap with the orthographic projection of the second conductive pad S20 on the substrate 100, and the orthographic projection of the auxiliary groove U2 on the substrate 100 may be located within the orthographic projection of the second conductive layer 400 on the substrate 100.

[0115] For example, the auxiliary groove U2 may include a first groove portion U21 and a second groove portion U22, with the first groove portion U21 being closer to the display area 00a than the second groove portion U22. The second conductive layer 400 may further include a plurality of transfer leads D3. The second conductive pad S20 may be electrically connected to the end of the first drive signal line 201 via the transfer leads D3. The orthographic projection of the first groove portion U21 on the substrate 100 may be located within the orthographic projection of the transfer lead on the substrate 100, and the orthographic projection of the second groove portion U22 on the substrate 100 may be located within the orthographic projection of the second conductive pad S20 on the substrate 100. In this case, the provision of the auxiliary groove U2 ensures that the boundary of the orthographic projection of the first opening K1, which is subsequently provided above the second conductive pad S20 for overlapping with the second signal lead D2, on the substrate 100 is farther away from the boundary of the orthographic projection of the insulating layer 300 on the substrate 100, thereby ensuring that the second signal lead D2 can more stably connect to the second conductive pad S20 through the first opening K1. It should be noted that the position and function of the first opening K1 are described in subsequent embodiments and will not be elaborated here.

[0116] Furthermore, since the first groove portion U21 in the auxiliary groove U2 can be covered by the transfer lead D3 in the second conductive layer 400, and the second groove portion U22 in the auxiliary groove U2 can be covered by the second conductive pad S20 in the second conductive layer 400, it can be ensured that no metal residue is generated at the boundary adjacent to the second conductive pad S20 in the insulating layer 300 during the process of forming the second conductive layer 400 using a patterning process.

[0117] It should be noted that the width of the second conductive pad S20 can be greater than or equal to the width of the transfer lead D3 in the first direction X. For example, in FIG17 , the width of the second conductive pad S20 can be equal to the width of the transfer lead D3 in the first direction X. In this case, the second conductive pad S20 is close to the boundary Z1 of the insulating layer 300 and is closer to the display area 00a than the boundary of the insulating layer 300 covered by the second conductive pad S20.

[0118] For another example, in Figure 18 , the boundary of the second conductive pad S20 near the insulating layer 300 includes the boundary Z2 of the transfer lead D3 where it connects to the second conductive pad S20. This boundary can be considered as a sudden widening of the transfer lead D3. In this case, in the first direction X, the width of the second conductive pad S20 can be greater than the width of the transfer lead D3.

[0119] In the present application, the second conductive pad S20 includes an overlapping portion covered by the first opening K1 and an extension portion surrounding the overlapping portion. Here, in the first direction X, the orthographic projection of the extension portion of the second conductive pad S20 on the substrate 100 must overlap with the orthographic projection of the insulating layer 300 on the substrate 100.

[0120] Alternatively, please refer to FIG. 19 , which is a schematic diagram of the film layer structure of the display panel at the MM′ position shown in FIG. 17 or FIG. 18 . The display panel 000 may further include: a first inorganic layer 601 located on the side of the second conductive layer 400 facing away from the substrate 100 . The portion of the first inorganic layer 601 located within the non-display area 00b may have a first opening K1 . The orthographic projection of the first opening K1 on the substrate 100 may be located within the orthographic projection of the second conductive pad S20 on the substrate 100 and outside the orthographic projection of the insulating layer 300 on the substrate 100 . Here, a signal lead (e.g., the second signal lead D2 ) bound to the driving component may be connected to the second conductive pad S20 through the first opening K1 . In the present application, when the orthographic projection of the first opening K1 on the substrate 100 is located outside the orthographic projection of the insulating layer 300 on the substrate 100 , the second signal lead D2 can be ensured to have a higher stability when passing through the first opening K1 and connecting to the second conductive pad S20.

[0121] Since the second conductive pad S20 and the transfer lead D3 are both part of the second conductive layer 400, one end of the transfer lead D3 can be directly electrically connected to the second conductive pad S20. Furthermore, since the first drive signal line 201 is part of the first conductive layer 200, a first transfer via V1 is required in the insulating layer 300 so that the other end of the transfer lead D3 can be electrically connected to the end of the first drive signal line 201 through the first transfer via V1.

[0122] Here, the first inorganic layer 601 can isolate water and oxygen in the external environment, so that water and oxygen in the external environment will not corrode the second conductive layer 400 from the side of the second conductive layer 400 away from the substrate 100, thereby effectively reducing the probability of oxidation corrosion of the first conductive layer 200.

[0123] Alternatively, please refer to Figure 20, which is a partial enlarged view of an edge portion of another display panel provided in an embodiment of the present application. When the boundary of the second region 302 of the insulating layer 300 protrudes away from the display area 00a, the second region 302 and the unprotruded insulating layer 300 on either side may form a recess U1 protrusion P. In this case, in the first direction, each second conductive pad S20 is distributed between two adjacent protrusions P. The minimum distance d1 between the orthographic projection of the protrusion P on the substrate 100 and the orthographic projection of the adjacent second conductive pad S20 on the substrate 100 is greater than or equal to 50 microns. Thus, the orthographic projection of the protrusion P on the substrate 100 is farther away from the orthographic projection of the adjacent second conductive pad S20 on the substrate 100. During the patterning process for forming the second conductive layer 400, no metal residue is generated between the protrusion P of the insulating layer 300 and the adjacent second conductive pad S20, thereby preventing a short circuit between the two adjacent second conductive pads S20.

[0124] In the embodiment of the present application, the number of second regions 302 located between two adjacent first regions 301 in the insulating layer 300 can be multiple, and the multiple second regions 302 are spaced apart. That is, in the first direction, the number of second regions 302 located between two adjacent second conductive pads S20 is multiple, and the boundary of each second region 302 can be either concave toward the display area 00a or convex away from the display area 00a. This ensures that there are multiple sharp corners between two adjacent second conductive pads S20. Because the metal residue generated between two adjacent second conductive pads S20 in the boundary of the insulating layer 300 during the patterning process for forming the second conductive layer 400 is disconnected at the sharp corners, the presence of multiple sharp corners between two adjacent second conductive pads S20 can further reduce the probability of a short circuit between the two adjacent second conductive pads S20.

[0125] In the present application, when the insulating layer 300 in the display panel 000 is an organic insulating layer with good flatness, the thickness of the insulating layer 300 can be less than 7 microns to reduce the probability of metal residues being generated at the boundary of the insulating layer 300 during the patterning process for forming the second conductive layer 400. Furthermore, to ensure that the insulating layer 300 still has good flatness, the thickness of the insulating layer 300 needs to be greater than or equal to 2 microns.

[0126] Alternatively, referring to Figure 21, which is a schematic diagram of the film structure of the display panel in the display area according to an embodiment of the present application, the display panel 000 may further include: a second inorganic layer 602 located between the first conductive layer 200 and the insulating layer 300, and a third inorganic layer 603 located between the insulating layer 300 and the second conductive layer 400.

[0127] Here, the second inorganic layer 602 can cover the first conductive layer 200, and the second inorganic layer 602 has a first sub-opening; the insulating layer 300 can be located on the side of the second inorganic layer 602 away from the substrate 100, and the insulating layer 300 can have a second sub-opening connected to the first sub-opening; the third inorganic layer 603 can be located on the side of the insulating layer 300 away from the substrate 100, and a portion of the third inorganic layer 603 extends into the first sub-opening and the second sub-opening, and can cover the inner wall of the first sub-opening and the inner wall of the second sub-opening, and the portion of the third inorganic layer 603 extending into the first sub-opening and the second sub-opening has a third sub-opening. To this end, the interconnected first sub-opening, second sub-opening, and third sub-opening can form a second transfer via V2. Here, part of the structure in the second conductive layer 400 can be electrically connected to part of the structure in the first conductive layer 200 through the second transfer via V2. For example, the first transfer electrode 402 in the second conductive layer 400 may be electrically connected to the first driving signal line 201 in the first conductive layer 200 through the second transfer via V2.

[0128] It should be noted that the second inorganic layer 602 can isolate water and oxygen in the external environment, so that water and oxygen in the external environment will not corrode the first conductive layer 200 from the side of the first conductive layer 200 away from the substrate 100, thereby effectively reducing the probability of the first conductive layer 200 being oxidized and corroded.

[0129] For the third inorganic layer 603, since the subsequent second conductive layer 400 needs to be arranged on the side of the third inorganic layer 603 away from the substrate 100, the third inorganic layer 603 can ensure that water and oxygen in the external environment will not corrode the second conductive layer 400 from the side of the second conductive layer 400 close to the substrate 100, thereby effectively reducing the probability of the second conductive layer 400 being oxidized and corroded.

[0130] In the embodiment of the present application, as shown in FIG19 , since the insulating layer 300 in the display panel 000 is an organic insulating layer, this organic insulating layer has poor sealing properties against moisture and oxygen in the external environment. Therefore, the portion of the third inorganic layer 603 located within the non-display area 00b needs to cover the sides of the organic insulating layer to prevent moisture and oxygen in the external environment from invading the organic insulating layer from the sides, thereby enhancing the overall barrier properties of the display panel 000 against moisture and oxygen in the external environment.

[0131] Optionally, as shown in Figures 19 and 21, the display panel 000 may further include a fourth inorganic layer 604 located between the first conductive layer 200 and the substrate 100. The fourth inorganic layer 604 prevents water and oxygen in the external environment from corroding the first conductive layer 200 from the side of the first conductive layer 200 close to the substrate 100, thereby further reducing the probability of oxidation corrosion of the first conductive layer 200.

[0132] In an embodiment of the present application, as shown in FIG. 21 , the display panel 000 may further include a light absorbing layer 700 located on the side of the first inorganic layer 601 facing away from the substrate 100. The orthographic projection of the light absorbing layer 700 on the substrate 100 may overlap with the orthographic projection of the first conductive layer 200 on the substrate 100 and also overlap with the orthographic projection of the second conductive layer 400 on the substrate 100. Thus, the light absorbing layer 700 can absorb ambient light directed toward the display panel 000, thereby minimizing reflection of the ambient light directed toward the display panel 000 by the first conductive layer 200 and the second conductive layer 400, thereby ensuring a low reflectivity of the display panel 000 for ambient light. Furthermore, the light absorbing layer 700 in the display panel 000 may have a plurality of third transfer vias V3 corresponding to the plurality of first conductive pads S10. The orthographic projection of each third transfer via V3 on the substrate 100 may be located within the orthographic projection of the corresponding first conductive pad S10 on the substrate 100. In this way, it can be ensured that the light absorbing layer 700 does not block the first conductive pad S10, so as to ensure that the light emitting unit 500 in the display panel 000 can be electrically connected to the first conductive pad S10 through the third transfer via V3.

[0133] Optionally, the display panel 000 may further include: an organic covering layer 800 located on the side of the light absorbing layer 700 facing away from the substrate 100. The portion of the organic covering layer 800 extending into the third transfer via V3 may completely cover the inner wall of the third transfer via V3 to ensure that the light absorbing layer 700 is not exposed. It should be noted that the portion of the organic covering layer 800 located outside the third transfer via V3 may be in contact with the side of the light absorbing layer 700 facing away from the substrate 100. In this way, the portion of the organic covering layer 800 located outside the third transfer via V3 may protect the light absorbing layer 700 from the side of the light absorbing layer 700 facing away from the substrate 100, and the portion of the organic covering layer 800 located inside the third transfer via V3 may protect the light absorbing layer 700 from the inner wall of the third transfer via V3.

[0134] Furthermore, because the organic cover layer 800 has good flatness, when the organic cover layer 800 is disposed on the side of the light absorbing layer 700 facing away from the substrate 100, the side of the organic cover layer 800 facing away from the substrate 100 can be ensured to have good flatness. Furthermore, in this case, the side of the organic cover layer 800 facing away from the substrate 100 is the outermost side of the driving backplane. Therefore, when multiple light-emitting units 500 are subsequently formed on the driving backplane, the sides of each light-emitting unit 500 facing away from the substrate 100 can be ensured to be flush, thereby ensuring a good display effect for the display panel 000.

[0135] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a first conductive layer, an insulating layer, a second conductive layer and a plurality of light-emitting units. The second conductive pad in the second conductive layer is composed of a first part and a second part, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the insulating layer on the substrate, while the orthographic projection of the second part on the substrate is located outside the orthographic projection of the insulating layer on the substrate. In this way, it can be ensured that in the process of forming the second conductive layer using a graphical process, no metal residue is generated at the boundary of the first area in the insulating layer. Although metal residue will still be generated at the boundary of the second area in the insulating layer, because the boundary of the second area is concave toward the display area or convex away from the display area, there is a sharp corner position at the boundary of the second area, so the metal residue generated at the boundary of the second area will be disconnected at the sharp corner position, thereby preventing the two adjacent second conductive pads from short-circuiting, which can effectively improve the yield rate of the display panel.

[0136] The present application also provides a display panel. The display panel may include a display area and a non-display area located outside the display area. The display panel may include a substrate, a first conductive layer, an insulating layer, a second conductive layer, and a plurality of light-emitting units. It should be noted that the structure of the display panel can refer to the corresponding contents of Figures 4, 5, and 6 in the above embodiments. This will not be further described here.

[0137] In an embodiment of the present application, as shown in FIG. 22 , which is another partially enlarged view of the driver backplane at position C shown in FIG. The orthographic projections of the second conductive pads S20 in the second conductive layer 400 on the substrate 100 are all located outside the orthographic projection of the insulating layer 300 on the substrate 100, and the minimum distance d2 between the orthographic projections of the second conductive pads S20 on the substrate 100 and the orthographic projections of the insulating layer 300 on the substrate 100 is greater than or equal to 50 microns. Thus, the orthographic projections of the second conductive pads S20 on the substrate 100 are relatively far from the orthographic projections of the insulating layer 300 on the substrate 100. During the process of forming the second conductive layer 400 using a patterning process, no metal residue is generated at the boundary of the insulating layer 300 adjacent to the second conductive pads S20.

[0138] In addition, the insulating layer 300 may include a second region 302 located between two adjacent first conductive pads S20 in the first direction X. The boundary of the second region 302 may be concave toward the display area 00a or convex away from the display area 00a. For the design principles of the second region 302, reference may be made to the corresponding contents of the aforementioned embodiments and will not be repeated here.

[0139] In an embodiment of the present application, as shown in Figures 22 and 23, Figure 23 is a schematic diagram of the film layer structure of the driving backplane shown in Figure 22 at the N-N' position. The first conductive layer 200 may also include: a plurality of transfer leads D3. The second conductive pad S20 can be electrically connected to the end of the first driving signal line 201 through the transfer lead D3. Here, the role of the transfer lead D3 is consistent with that of the transfer lead in the aforementioned embodiment, but the difference is that the transfer lead D3 here is part of the first conductive layer 200, while the transfer lead in the aforementioned embodiment is part of the second conductive layer. For this reason, the role of the transfer lead D3 will not be repeated here.

[0140] Optionally, the display panel 000 may further include: a second inorganic layer 602 located between the first conductive layer 200 and the insulating layer 300, and a third inorganic layer 603 located between the insulating layer 300 and the second conductive layer 400. The functions of the second inorganic layer 602 and the third inorganic layer 603 may be referred to in the corresponding contents of the aforementioned embodiments and will not be further described here.

[0141] The portion of the third inorganic layer 603 located in the non-display area 00 b has a second opening K2 , and the second conductive pad S20 can be electrically connected to the transfer lead D3 through the second opening K2 .

[0142] In this case, since the transfer lead D3 is part of the first conductive layer 200 and the second conductive pad S20 is part of the second conductive layer 400, and the first conductive layer 200 is closer to the substrate 100 than the insulating layer 300, during the manufacturing process of the display panel 000, the first conductive layer 200 is formed before the insulating layer 300, ensuring that no metal residue is generated at the edges of the insulating layer 300 where it overlaps with the first conductive layer 200. Although the second conductive layer 400 is formed after the insulating layer 300, because the second conductive pad S20 in the second conductive layer 400 intersects the insulating layer 300 farther away, no metal residue is generated at the edges of the insulating layer 300 adjacent to the second conductive pad S20. This ensures that no short circuit occurs between two adjacent second conductive pads S20.

[0143] Optionally, when the boundary of the second area protrudes away from the display area, the second area and the non-protruding insulating layers on both sides form a protrusion, and the minimum distance between the orthographic projection of the protrusion on the substrate and the orthographic projection of the adjacent second conductive pad on the substrate is greater than or equal to 50 microns.

[0144] Optionally, the thickness of the insulating layer is less than 7 microns.

[0145] It should be noted that, for other structures in this display panel, reference may be made to the corresponding contents of the aforementioned embodiments, and no further description will be given here.

[0146] Embodiments of the present application also provide a display device. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. The display device can include a drive component and the display panel described in the above embodiment. The drive component can be electrically connected to a second conductive pad in the display panel, and the drive component is configured to provide a drive signal to a first drive signal line in the display panel via the second conductive pad.

[0147] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0148] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0149] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a non-display area located outside the display area; The display panel comprises: substrate; A first conductive layer, an insulating layer, and a second conductive layer are sequentially arranged vertically and away from the substrate; the first conductive layer comprises: a plurality of first drive signal lines; the second conductive layer comprises: a plurality of first conductive pads located in the display area, and a plurality of second conductive pads located in the non-display area; the first conductive pads are electrically connected to the first drive signal lines, and the second conductive pads are electrically connected to the ends of the first drive signal lines; a plurality of light-emitting units located in the display area, wherein the light-emitting units are electrically connected to at least a portion of the first conductive pads; Among them, the second conductive pad is composed of a first part and a second part, the first part is a part of the orthographic projection of the second conductive pad on the substrate that is located within the orthographic projection of the insulating layer on the substrate, and the second part is a part of the orthographic projection of the second conductive pad on the substrate that is located outside the orthographic projection of the insulating layer on the substrate; the insulating layer includes: two first areas overlapping with two adjacent second conductive pads, and a second area located between the two first areas, and a boundary of the second area is concave toward the display area or convex away from the display area.

2. The display panel according to claim 1, characterized in that: The first portion of the second conductive pad is closer to the display area than the second portion of the second conductive pad.

3. The display panel according to claim 2, characterized in that: The portion of the boundary of the orthographic projection of the insulating layer on the substrate that overlaps with the orthographic projection of the second conductive pad on the substrate is a straight line segment, and the width of the second conductive pad in a direction parallel to the straight line segment is equal to the length of the straight line segment.

4. The display panel according to claim 1, characterized in that: The insulating layer also includes: a third area whose boundary is recessed toward the display area, the third area and the insulating layer on both sides that are not recessed form an auxiliary groove, the orthographic projection of the auxiliary groove on the substrate overlaps with the orthographic projection of the second conductive pad on the substrate, and the orthographic projection of the auxiliary groove on the substrate is located within the orthographic projection of the second conductive layer on the substrate.

5. The display panel according to claim 4, characterized in that: The auxiliary groove includes a first groove portion and a second groove portion, wherein the first groove portion is closer to the display area than the second groove portion; The second conductive layer further includes: a plurality of transfer leads, through which the second conductive pad is electrically connected to the end of the first drive signal line; The orthographic projection of the first groove portion on the substrate is located within the orthographic projection of the transfer lead on the substrate, and the orthographic projection of the second groove portion on the substrate is located within the orthographic projection of the second conductive pad on the substrate.

6. The display panel according to any one of claims 1 to 5, characterized in that: When the boundary of the second region protrudes away from the display area, the second region and the insulating layers that are not protruding on both sides form a protrusion, and the minimum distance between the orthographic projection of the protrusion on the substrate and the orthographic projection of the adjacent second conductive pad on the substrate is greater than or equal to 50 microns.

7. The display panel according to any one of claims 1 to 5, characterized in that: There are multiple second regions located between the two first regions, and the multiple second regions are distributed at intervals.

8. The display panel according to any one of claims 1 to 5, characterized in that: The thickness of the insulating layer is less than 7 microns.

9. The display panel according to any one of claims 1 to 5, characterized in that: The display panel also includes: a first inorganic layer located on the side of the second conductive layer facing away from the substrate, a portion of the first inorganic layer located in the non-display area has a plurality of first openings, an orthographic projection of the first opening on the substrate is located within the orthographic projection of the second conductive pad on the substrate, and is located outside the orthographic projection of the insulating layer on the substrate.

10. The display panel according to claim 9, characterized in that: The insulating layer is an organic insulating layer, and the display panel further includes: a second inorganic layer located between the first conductive layer and the insulating layer, and a third inorganic layer located between the insulating layer and the second conductive layer, wherein a portion of the third inorganic layer located in the non-display area covers a side surface of the organic insulating layer.

11. The display panel according to any one of claims 1 to 5, characterized in that: The multiple second conductive pads are arranged into at least two rows; wherein, one row of the second conductive pads is distributed on one side of the multiple first drive signal lines, and is respectively electrically connected to the first ends of a part of the multiple first drive signal lines; the other row of the second conductive pads is distributed on the other side of the multiple first drive signal lines, and is respectively electrically connected to the second ends of another part of the multiple first drive signal lines.

12. A display panel, characterized in that: The display panel comprises a display area and a non-display area located outside the display area; The display panel comprises: substrate; A first conductive layer, an insulating layer, and a second conductive layer are arranged vertically and away from the substrate; the first conductive layer includes: a plurality of first drive signal lines arranged along a first direction; the second conductive layer includes: a plurality of first conductive pads located in the display area, and a plurality of second conductive pads located in the non-display area; the first conductive pads are electrically connected to the first drive signal lines, and the second conductive pads are electrically connected to the ends of the first drive signal lines; a plurality of light-emitting units located in the display area, wherein the light-emitting units are electrically connected to at least a portion of the first conductive pads; In which, the orthographic projections of the second conductive pads on the substrate are all located outside the orthographic projection of the insulating layer on the substrate, and the minimum distance between the orthographic projection of the second conductive pads on the substrate and the orthographic projection of the insulating layer on the substrate is greater than or equal to 50 microns; the insulating layer includes: a second area located between two adjacent first conductive pads in the first direction, and a boundary of the second area is concave toward the display area or convex away from the display area.

13. The display panel according to claim 12, characterized in that: The first conductive layer further includes: a plurality of transfer leads, and the second conductive pad is connected to the end circuit of the first driving signal line through the transfer leads.

14. The display panel according to claim 13, characterized in that: The display panel also includes: a second inorganic layer located between the first conductive layer and the organic insulating layer, and a third inorganic layer located between the organic insulating layer and the second conductive layer, wherein a portion of the third inorganic layer located in the non-display area covers a side surface of the organic insulating layer, and a portion of the third inorganic layer located in the non-display area has a second opening, and the second conductive pad is electrically connected to the transfer lead through the second opening.

15. The display panel according to any one of claims 12 to 14, characterized in that: When the boundary of the second region protrudes away from the display area, the second region and the insulating layers that are not protruding on both sides form a protrusion, and the minimum distance between the orthographic projection of the protrusion on the substrate and the orthographic projection of the adjacent second conductive pad on the substrate is greater than or equal to 50 microns.

16. The display panel according to any one of claims 12 to 14, characterized in that: The thickness of the insulating layer is less than 7 microns.

17. A display device, characterized in that: include: A driving component, and a display panel as claimed in any one of claims 1 to 16; The driving component is electrically connected to the plurality of second conductive pads.

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