Display panel and display device

Abstract

Provided in the present application are a display panel and a display device. In the display panel, an isolation column, an undercut part and a through hole are provided in a functional attachment area, wherein the undercut part is arranged below the isolation column, the through hole is in communication with the undercut part, and a transverse end of an insulating layer in the undercut part extends beyond a transverse end of a partition metal part, such that a portion of a common layer located in the through hole is disconnected by the isolation column and the undercut part, thereby blocking a path of water and oxygen intrusion and improving an encapsulation effect of the display panel.

Description

Display panel and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) displays are widely used in various fields due to their lightweight, wide viewing angle, fast response, low-temperature resistance, high luminous efficiency, and ability to bend and create flexible displays. To implement camera functionality, existing OLED displays are cut to form an O-cut area, where the camera is located. However, during this process, the organic light-emitting materials at the edges of the cuts are susceptible to water and oxygen intrusion, leading to packaging failure. To improve packaging, existing OLED displays incorporate spacers at the edges of the O-cuts to interrupt the organic materials. However, during actual product verification, during dual 85 RA (85% humidity, 85 degrees Celsius) testing, corrosion of the outermost spacers was observed after 240 hours. This can cause the organic light-emitting materials separated by the spacers to connect, leading to packaging failure.

[0003] Therefore, existing OLED display devices have the problem that the isolation columns are easily corroded and water and oxygen invade, resulting in packaging failure. SUMMARY OF THE INVENTION

[0004] Embodiments of the present application provide a display panel and a display device to alleviate the problem in existing OLED display devices that isolation columns are easily corroded and water and oxygen intrusion occurs, resulting in packaging failure.

[0005] To solve the above problems, the technical solutions provided by this application are as follows:

[0006] An embodiment of the present application provides a display panel, comprising a main display area and a function-added area located on at least one side of the main display area, the display panel comprising:

[0007] substrate;

[0008] A driving circuit layer is provided on one side of the substrate, and the driving circuit layer includes an isolation column provided in the function-added area;

[0009] a light-emitting functional layer, comprising a common layer and a pixel electrode layer, wherein the common layer is arranged on a side of the pixel electrode layer away from the driving circuit layer;

[0010] In which, the driving circuit layer also includes an undercut portion and a via, the undercut portion is arranged between the isolation column and the substrate, the via is connected to the undercut portion on the side away from the substrate, the undercut portion includes an insulating layer and a partition metal portion, the insulating layer is arranged between the partition metal portion and the isolation column, the lateral end of the insulating layer is arranged beyond the lateral end of the partition metal portion, the common layer includes a portion located in the via, and the portion of the common layer located in the via is disconnected by the isolation column and the undercut portion.

[0011] At the same time, an embodiment of the present application provides a display device, which includes the display panel as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0013] FIG1 is a first schematic diagram of a display panel provided in an embodiment of the present application.

[0014] FIG2 is a second schematic diagram of a display panel provided in an embodiment of the present application.

[0015] FIG3 is a third schematic diagram of a display panel provided in an embodiment of the present application.

[0016] FIG4 is a fourth schematic diagram of a display panel provided in an embodiment of the present application.

[0017] FIG5 is a schematic diagram of a first structure of a display panel corresponding to each step in the method for manufacturing a display panel provided in an embodiment of the present application.

[0018] FIG6 is a schematic diagram of a second structure of a display panel corresponding to each step in the method for manufacturing a display panel provided in an embodiment of the present application. Modes for Carrying Out the Invention

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0020] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0022] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0023] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0024] The embodiments of the present application provide a display panel and a display device to alleviate the problem that isolation columns of existing OLED display devices are easily corroded and water and oxygen intrusion occurs, resulting in packaging failure.

[0025] As shown in FIG1 and FIG2 , an embodiment of the present application provides a display panel. The display panel 10 includes a main display area 111 and a function-added area 112 located on at least one side of the main display area 111 . The display panel 10 includes:

[0026] substrate 21;

[0027] A driving circuit layer is provided on one side of the substrate 21 , and the driving circuit layer includes an isolation column 31 provided in the function-added area 112 ;

[0028] The light-emitting functional layer 24 includes a common layer 243 and a pixel electrode layer 241 , wherein the common layer 243 is disposed on a side of the pixel electrode layer 241 away from the driving circuit layer;

[0029] In which, the driving circuit layer also includes a bottom cut portion 33 and a via 34, the bottom cut portion 33 is arranged between the isolation column 31 and the substrate 21, and the via 34 is connected to the bottom cut portion 33 on the side away from the substrate 21, the bottom cut portion 33 includes an insulating layer (for example, the interlayer insulating layer 234 in Figure 2) and a partition metal portion 233a, the insulating layer is arranged between the partition metal portion 233a and the isolation column 31, and the lateral end of the insulating layer is arranged beyond the lateral end of the partition metal portion 233a, the common layer 243 includes a portion located in the via 34, and the portion of the common layer 243 located in the via 34 is disconnected by the isolation column 31 and the bottom cut portion 33.

[0030] An embodiment of the present application provides a display panel, which is provided with an isolation column, an undercut portion and a via in a function-added area. The undercut portion is provided under the isolation column, and the via is connected to the undercut portion. The lateral end of the insulating layer in the undercut portion is provided beyond the lateral end of the partition metal portion, so that the portion of the common layer located in the via is disconnected by the isolation column and the undercut portion. When the display panel is in working or testing state, even if the metal in the isolation column is corroded so that the common connection on the isolation column is connected together, the undercut portion disconnects the common layer, and the common layer remains in multiple disconnected parts, thereby isolating the path for water and oxygen intrusion and improving the packaging effect of the display panel.

[0031] Specifically, as shown in FIG. 2 , it can be seen that the common layer 243 is divided into multiple parts by the isolation pillars 31 and the undercut portions 33 .

[0032] Specifically, as shown in Figure 2, the isolation column 31 includes two barrier metal parts 314 and a side-engraved metal part 312, and the side-engraved metal part 312 is arranged between the two barrier metal parts 314, and the lateral end of the barrier metal part 314 extends farther in the lateral direction than the lateral end of the side-engraved metal part 312.

[0033] Specifically, the lateral end of the barrier metal portion 314 in the isolation column 31 is arranged to extend beyond the lateral end of the side-engraved metal portion 312, so that the side-engraved metal portion 312 is recessed relative to the barrier metal portion 314, and the common layer cannot adhere to the side of the side-engraved metal portion 312. The common layer 243 will be disconnected at the side-engraved metal portion 312 to form a first fracture. At the same time, even if the common layer 243 adheres to the side of the first barrier metal portion 311 and the insulating layer, due to the presence of the bottom cut portion 33, the partition metal portion 233a is recessed relative to the insulating layer, and the common layer 243 cannot adhere to the side of the partition metal portion 233a, resulting in a second fracture in the common layer. When the display panel is working or testing, for example, under test conditions of 85 degrees Celsius and 85% humidity, even if the side-engraved metal portion 312 is corroded, the common layer is still disconnected due to the presence of the bottom cut portion 33, blocking the path for water and oxygen intrusion, thereby improving the packaging performance of the display panel and improving the yield of the display panel.

[0034] Specifically, in the embodiment of the present application, the display panel includes two isolation columns and two bottom cut portions for illustration, but the embodiment of the present application is not limited to this. For example, the display panel may include only one isolation column and one bottom cut portion to be suitable for a display panel with a smaller functional additional area, and still achieve the effect of blocking the path of water and oxygen intrusion; or the display panel may include three or more isolation columns and three or more bottom cut portions to further improve the effect of blocking the path of water and oxygen intrusion.

[0035] Specifically, the function-added area may be an O-cut area or other areas; the function-added area may be displayed or not displayed.

[0036] Specifically, the additional function area can be set on one side of the main display area, or on multiple sides of the main display area. The main display area can be set around the additional function area, or the main display area can be in contact with part of the additional function area.

[0037] Specifically, the materials of the two barrier metal parts may be the same or different, the widths of the two barrier metal parts may be the same or different, and the thicknesses of the two barrier metal parts may be the same or different.

[0038] In some embodiments, the driving circuit layer further includes:

[0039] a buffer layer, disposed between the substrate and the light-emitting functional layer;

[0040] a gate insulating layer, disposed on a side of the buffer layer away from the substrate;

[0041] a gate layer, disposed on a side of the gate insulating layer away from the buffer layer;

[0042] an interlayer insulating layer, disposed on a side of the gate layer away from the gate insulating layer;

[0043] The gate layer includes the partition metal portion, and the interlayer insulating layer includes the insulating layer.

[0044] In some embodiments, the via hole penetrates the interlayer insulating layer, the gate layer, and the gate insulating layer, and the via hole extends to the buffer layer, a groove is formed in the buffer layer, or the via hole penetrates the buffer layer.

[0045] In some embodiments, the driving circuit layer further includes:

[0046] a buffer layer, disposed between the substrate and the light-emitting functional layer;

[0047] a first gate insulating layer, disposed on a side of the buffer layer away from the substrate;

[0048] a first metal layer, disposed on a side of the first gate insulating layer away from the buffer layer;

[0049] a second gate insulating layer, disposed on a side of the first metal layer away from the first gate insulating layer;

[0050] a second metal layer, disposed on a side of the second gate insulating layer away from the first metal layer;

[0051] an interlayer insulating layer, disposed on a side of the second metal layer away from the second gate insulating layer;

[0052] Wherein, one of the first metal layer and the second metal layer includes the partition metal portion.

[0053] In some embodiments, the second metal layer includes the partition metal portion, and the interlayer insulating layer includes the insulating layer.

[0054] In some embodiments, the via hole penetrates the interlayer insulating layer, the second metal layer, the second gate insulating layer, and the first gate insulating layer, and the via hole extends to the buffer layer, and a groove is formed in the buffer layer.

[0055] In some embodiments, the isolation column includes a first isolation column and a second isolation column, the undercut portion includes a first undercut portion and a second undercut portion, the first undercut portion is arranged between the first isolation column and the substrate, the second undercut portion is arranged between the second isolation column and the substrate, the via is arranged between the first undercut portion and the second undercut portion, and the common layer is disconnected by the first isolation column, the second isolation column, the first undercut portion and the second undercut portion.

[0056] In some embodiments, a thickness of a portion of the common layer located within the via hole is smaller than a distance between a bottom surface of the via hole and a top surface of the isolation metal portion.

[0057] In some embodiments, the driving circuit layer further includes a source-drain electrode layer, the source-drain electrode layer including a first titanium layer, an aluminum layer, and a second titanium layer, wherein the first titanium layer is disposed between the aluminum layer and the substrate, and the second titanium layer is disposed on a side of the aluminum layer away from the first titanium layer;

[0058] The isolation column includes two barrier metal parts and a side engraved metal part, the side engraved metal part is arranged between the two barrier metal parts, and the lateral end of the barrier metal part is arranged beyond the lateral end of the side engraved metal part, the two barrier metal parts include a first barrier metal part and a second barrier metal part, the first barrier metal part is arranged between the side engraved metal part and the substrate, and the second barrier metal part is arranged on a side of the side engraved metal part away from the first barrier metal part;

[0059] The first titanium layer includes the first barrier metal portion, the second titanium layer includes the second barrier metal portion, and the aluminum layer includes the side-engraved metal portion.

[0060] In some embodiments, the driving circuit layer includes a first barrier metal layer, a second barrier metal layer, and a third barrier metal layer. The two barrier metal portions include a first barrier metal portion and a second barrier metal portion. The first barrier metal layer includes a first barrier metal portion, the second barrier metal layer includes a side-engraved metal portion, and the third barrier metal layer includes a second barrier metal portion. By forming the first barrier metal portion, the second barrier metal layer, and the third barrier metal layer into the first barrier metal portion, the side-engraved metal portion, and the second barrier metal portion, respectively, the size and material of each metal layer can be adjusted to form barrier metal portions and side-engraved metal portions of different materials and sizes, thereby enabling the isolation pillar to meet different requirements.

[0061] Specifically, the first barrier metal layer, the second barrier metal layer and the third barrier metal layer can be multiple single layers in a certain stack. For example, if a certain stack includes three single layers, the first barrier metal layer, the second barrier metal layer and the third barrier metal layer can be three single layers in this stack.

[0062] In some embodiments, the driving circuit layer includes a fourth barrier metal layer, and the fourth barrier metal layer includes a partition metal portion. By forming the fourth barrier metal layer into a partition metal portion, the size of the fourth barrier metal layer can be adjusted to form a partition metal portion of different materials and different sizes, so that the undercut structure meets different needs.

[0063] In order to solve the technical problem that forming an undercut portion by adding a new metal layer will lead to a more complicated manufacturing process of the display panel and a larger thickness, in some embodiments, as shown in FIG2 , the driving circuit layer further includes:

[0064] a buffer layer 22 disposed between the substrate 21 and the light-emitting functional layer 24;

[0065] a gate insulating layer 232 , disposed on a side of the buffer layer 22 away from the substrate 21 ;

[0066] a gate layer 233 , disposed on a side of the gate insulating layer 232 away from the buffer layer 22 ;

[0067] an interlayer insulating layer 234 , disposed on a side of the gate layer 233 away from the gate insulating layer 232 ;

[0068] The gate layer 233 includes the partition metal portion 233a, and the interlayer insulating layer 234 includes the insulating layer. By forming the partition metal portion in the gate layer and the interlayer insulating layer as the insulating layer, an undercut is formed between the interlayer insulating layer and the partition metal portion, eliminating the need for additional film layers, reducing the number of process steps in the display panel, and avoiding increasing the thickness of the display panel.

[0069] Specifically, when a single-gate design is adopted for the thin-film transistor in the display panel, the gate layer can be used to form a partition metal part, and the interlayer insulating layer can be used as an insulating layer. The partition metal part can be wet-etched to form a bottom cut part, without the need for a new film layer, thereby reducing the process steps of the display panel and avoiding increasing the thickness of the display panel.

[0070] Specifically, the scope of the via may refer to a hole consisting of a through hole and a groove from the buffer layer to the interlayer insulating layer, or may refer to a hole consisting of a through hole and a groove from the buffer layer to the common layer, and the via may include the side holes in the bottom cut portion and the side holes in the isolation column, or may not include the side holes in the bottom cut portion and the side holes in the isolation column. For the specific definition of the via, please refer to the following embodiments.

[0071] In some embodiments, as shown in FIG2 , the via 34 penetrates the interlayer insulating layer 234, the gate layer 233, and the gate insulating layer 232, and the via 34 extends to the buffer layer 22, wherein the buffer layer 22 is formed with a groove, or the via 34 penetrates the buffer layer 22. By having the via penetrate the interlayer insulating layer, the gate layer, and the gate insulating layer, and extending the via to the buffer layer, wherein the buffer layer is formed with a groove, the depth of the via is increased. When the common layer is disposed in the via, the common layer will not overlap the undercut portion, thereby preventing the common layers from being connected together. Furthermore, considering that only forming a groove in the buffer layer will result in a smaller via depth, the common layer located in the via may overlap the undercut portion, filling the side hole in the undercut portion, resulting in the problem of connecting the various parts of the common layer together. By having the via penetrate the buffer layer, the depth of the via is further increased, and the various parts of the common layer are disconnected, thereby blocking the path for water and oxygen intrusion, improving the packaging performance of the display panel, and improving the yield of the display panel.

[0072] Specifically, when the thickness of the common layer is large and the depth of the via 34 is small, the common layer 243 will fill the side hole in the bottom cut portion 33 (that is, the hole formed by the partition metal portion 233a being recessed relative to the interlayer insulating layer 234), and the common layer 243 may overlap the side of the interlayer insulating layer 234 and the isolation column 31, so that the common layer 243 will be arranged along the isolation column and the bottom cut portion, so that the common layer will not be isolated by the bottom cut portion, resulting in water and oxygen intrusion. In the embodiment of the present application, the via is extended to the buffer layer, and even the via penetrates the buffer layer, so that the common layer will not be filled into the side hole in the bottom cut portion 33. The various parts of the common layer are disconnected and arranged, thereby blocking the path of water and oxygen intrusion, improving the packaging performance of the display panel, and improving the yield of the display panel.

[0073] In some embodiments, as shown in FIG3 , the driving circuit layer further includes:

[0074] a buffer layer 22 disposed between the substrate 21 and the light-emitting functional layer 24;

[0075] A first gate insulating layer 411 is disposed on a side of the buffer layer 22 away from the substrate 21 ;

[0076] A first metal layer 412 is disposed on a side of the first gate insulating layer 411 away from the buffer layer 22 ;

[0077] A second gate insulating layer 413 is disposed on a side of the first metal layer 412 away from the first gate insulating layer 411;

[0078] A second metal layer 414 is disposed on a side of the second gate insulating layer 413 away from the first metal layer 412 ;

[0079] an interlayer insulating layer 234 , disposed on a side of the second metal layer 414 away from the second gate insulating layer 413 ;

[0080] The partition metal portion 233a is formed by forming the partition metal portion using one of the first metal layer 412 and the second metal layer 414. This eliminates the need for a new metal film layer, reduces the number of process steps for the display panel, and avoids increasing the thickness of the display panel.

[0081] Specifically, when using the first metal layer or the second metal layer to form the partition metal part, an insulating layer located on the first metal layer or the second metal layer can be used to form a bottom cut part accordingly, without adding a new film layer, reducing the process steps of the display panel and avoiding increasing the thickness of the display panel.

[0082] In some embodiments, as shown in FIG3 , the second metal layer 414 includes the partition metal portion 233a, and the interlayer insulating layer 234 includes an insulating layer. By forming the partition metal portion in the second metal layer and the interlayer insulating layer as an insulating layer, an undercut portion can be formed without adding a new film layer, thereby reducing the process steps of the display panel and avoiding increasing the thickness of the display panel. In addition, the embodiment of the present application forms an undercut portion in the second metal layer and the interlayer insulating layer, so that the via hole can penetrate more film layers and the depth of the via hole is greater, thereby further reducing the possibility of the portion of the common layer located under the undercut portion being connected to the portion of the common layer overlapping the undercut portion, further improving the stability of the path for blocking water and oxygen intrusion, improving the packaging performance of the display panel, and improving the yield of the display panel.

[0083] In some embodiments, as shown in FIG3 , the via hole 34 penetrates the interlayer insulating layer 234, the second metal layer 414, the second gate insulating layer 413, and the first gate insulating layer 411, and extends to the buffer layer 22, which is formed with a groove. By having the via hole penetrate the interlayer insulating layer, the second metal layer, the second gate insulating layer, and the first gate insulating layer, and extending to the buffer layer, which is formed with a groove, the via hole has a greater depth, disconnecting portions of the common layer, thereby blocking the path for water and oxygen intrusion, improving the packaging performance of the display panel, and increasing the yield of the display panel.

[0084] Specifically, considering that the thickness of the first gate insulating layer and the second gate insulating layer is relatively small, the common layer may be filled into the side hole of the bottom cut portion, and the portion of the common layer located in the via hole will contact the portion of the common layer located on the side of the isolation column and the side of the bottom cut portion, so that the parts of the common layer are connected together, and water and oxygen may invade from the common layer. In the embodiment of the present application, the common layer can be isolated by the bottom cut portion by extending the via hole to the buffer layer, blocking the path for water and oxygen invasion, thereby improving the packaging performance of the display panel and improving the yield of the display panel.

[0085] Specifically, the above embodiment is described by taking the buffer layer forming a groove as an example, but the embodiments of the present application are not limited thereto. For example, the buffer layer may form a through hole.

[0086] Specifically, the above embodiments take the via passing through the interlayer insulating layer, the gate insulating layer, and extending to the buffer layer as an example, or take the via passing through the interlayer insulating layer, the first gate insulating layer, the second gate insulating layer and the buffer layer as an example for explanation, but the embodiments of the present application are not limited to this. For example, the via can be further extended to the substrate or the barrier layer, and the via can also be made to pass through only the interlayer insulating layer, the gate insulating layer and the gate layer, and by increasing the thickness of the gate insulating layer, the connection between the parts of the common layer is avoided, for example, the thickness of the gate insulating layer is made greater than the thickness of the common layer; the via can also be made to pass through the interlayer insulating layer, the second metal layer, the first gate insulating layer and the second gate insulating layer, and by increasing the first gate insulating layer and the second gate insulating layer, the connection between the parts of the common layer is avoided, for example, the sum of the thickness of the first gate insulating layer and the second gate insulating layer is made greater than the thickness of the common layer.

[0087] In some embodiments, as shown in Figure 2, the isolation column 31 includes a first isolation column 321 and a second isolation column 322, the undercut portion 33 includes a first undercut portion 331 and a second undercut portion 332, the first undercut portion 331 is arranged between the first isolation column 321 and the substrate 21, the second undercut portion 332 is arranged between the second isolation column 322 and the substrate 21, the via 34 is arranged between the first undercut portion 331 and the second undercut portion 332, and the common layer 243 is disconnected by the first isolation column 321, the second isolation column 322, the first undercut portion 331 and the second undercut portion 332. By making the isolation column include the first isolation column and the second isolation column, the bottom cut portion include the first bottom cut portion and the second bottom cut portion, and the via hole is arranged between the first bottom cut portion and the second bottom cut portion, the common layer will be divided into multiple parts by the first isolation column, the second isolation column, the first bottom cut portion and the second bottom cut portion, further blocking the path of water and oxygen intrusion. Even if some common layers are connected together, water and oxygen intrusion can still be avoided, further improving the packaging performance of the display panel and improving the yield of the display panel.

[0088] In order to address the problem that the common layer may not be disconnected by the undercut due to the small depth of the via hole, in some embodiments, as shown in FIG3 , the thickness L1 of the portion of the common layer 243 located within the via hole 34 is less than the distance L2 between the bottom surface of the via hole 34 and the top surface of the partition metal portion 233a. By making the thickness of the portion of the common layer located within the via hole less than the distance between the bottom surface of the via hole and the top surface of the partition metal portion, the common layer will not be filled in the via hole of the undercut portion, and the portion of the common layer located on the undercut portion will be disconnected from the portion of the common layer located within the via hole, thereby improving the display panel's ability to block water and oxygen intrusion, improving the packaging performance of the display panel, and improving the yield of the display panel.

[0089] Specifically, the thickness of the portion of the common layer located in the via hole and the thickness of the portion of the common layer located in other areas may be the same or different.

[0090] Specifically, the thickness of the portion of the common layer located in the via hole is smaller than the distance between the bottom surface of the via hole and the bottom surface of the interlayer insulating layer.

[0091] The use of additional film layers to prepare the barrier metal portion and the side-engraved metal portion can lead to a more complex display panel manufacturing process and a larger thickness of the display panel. In some embodiments, the drive circuit layer further includes a source / drain electrode layer, the source / drain electrode layer including a first titanium layer, an aluminum layer, and a second titanium layer. The first titanium layer is disposed between the aluminum layer and the substrate, and the second titanium layer is disposed on a side of the aluminum layer away from the first titanium layer.

[0092] The isolation column includes two barrier metal parts and a side engraved metal part, the side engraved metal part is arranged between the two barrier metal parts, and the lateral end of the barrier metal part is arranged beyond the lateral end of the side engraved metal part, the two barrier metal parts include a first barrier metal part and a second barrier metal part, the first barrier metal part is arranged between the side engraved metal part and the substrate, and the second barrier metal part is arranged on a side of the side engraved metal part away from the first barrier metal part;

[0093] The first titanium layer comprises the first barrier metal portion, the second titanium layer comprises the second barrier metal portion, and the aluminum layer comprises the side-engraved metal portion. By forming the first, side-engraved metal portion, and second barrier metal portion, respectively, the first titanium layer, aluminum layer, and second titanium layer in the source / drain electrode layer eliminate the need for additional process steps in the display panel, improving the display panel manufacturing process. Furthermore, the need for additional film layers is avoided, thereby preventing an increase in the thickness of the display panel.

[0094] Specifically, as shown in Figure 2, the source and drain layer includes a first source and drain layer 235 and a second source and drain layer 237, the second source and drain layer 237 includes a first titanium layer 237a, an aluminum layer 237b and a second titanium layer 237c, the first titanium layer 237a includes a first barrier metal portion 311, the aluminum layer 237b includes a side-engraved metal portion 312, and the second titanium layer 237c includes a second barrier metal portion 313.

[0095] Specifically, as shown in Figure 4, the source and drain layer includes a first source and drain layer 235 and a second source and drain layer 237. The first source and drain layer 235 includes a first titanium layer 237a, an aluminum layer 237b and a second titanium layer 237c. The first titanium layer 237a includes a first barrier metal portion 311, the aluminum layer 237b includes a side-engraved metal portion 312, and the second titanium layer 237c includes a second barrier metal portion 313.

[0096] Specifically, the above embodiments are described by taking the example that the driving circuit layer includes the first source and drain layer and the second source and drain layer, but the embodiments of the present application are not limited to this. For example, if the driving circuit layer only includes one source and drain layer, the source and drain layer, other metal layers and / or newly added metal layers can be used to form the barrier metal part and the side-engraved metal part. When the driving circuit layer includes the first source and drain layer, the second source and drain layer and the third source and drain layer, the first source and drain layer, the second source and drain layer and the third source and drain layer can be used to form the barrier metal part and the side-engraved metal part.

[0097] In some embodiments, substrate 21 may include a first flexible layer, a first barrier layer, a second flexible layer, and a second barrier layer.

[0098] 2 , the driving circuit layer further includes an active layer 231, a passivation layer 236, and a planarization layer 238. However, the present invention is not limited thereto. For example, the driving circuit layer includes a first planarization layer and a second planarization layer.

[0099] In some embodiments, as shown in FIG. 2 , the light-emitting functional layer 24 further includes a pixel definition layer 242 .

[0100] In some embodiments, the common layer may include an electron transport layer, an electron injection layer and a common electrode layer, but the embodiments of the present application are not limited thereto. For different display panels, the film layers arranged on the entire surface of the light-emitting functional layer may all belong to the common layer.

[0101] In some embodiments, the thin film transistors in the driving circuit layer may have a top-gate structure or a bottom-gate structure.

[0102] At the same time, an embodiment of the present application provides a method for manufacturing a display panel, which includes:

[0103] providing a substrate;

[0104] forming an active layer on the substrate using a first mask;

[0105] forming a first gate layer on the active layer using a second mask;

[0106] forming a second gate layer on the first gate layer using a third mask;

[0107] A fourth mask is used to form grooves and holes on the second gate layer; specifically, the fourth mask may be an MCD mask;

[0108] A first source and drain electrode layer is formed on the second gate layer using a fifth mask. The structural schematic diagram of the display panel corresponding to this step is shown in (a) of FIG5 .

[0109] A passivation layer is formed on the first source and drain electrode layer using a sixth mask. The structural schematic diagram of the display panel corresponding to this step is shown in (b) of FIG5 .

[0110] A seventh mask is used to form a via hole on the passivation layer. The structural schematic diagram of the display panel corresponding to this step is shown in (c) of FIG5 .

[0111] An eighth mask is used to form an undercut portion on the passivation layer. The structural schematic diagram of the display panel corresponding to this step is shown in (d) of FIG5 .

[0112] The portion of the passivation layer located in the function-added area is removed; the structural schematic diagram of the display panel corresponding to this step is shown in FIG6 ;

[0113] Using a ninth mask plate to etch the display panel to form a deep hole;

[0114] forming a first planarization layer on the passivation layer using a tenth mask; the first planarization layer is not provided in the function-added region;

[0115] forming a second source and drain layer on the first planarization layer using an eleventh mask;

[0116] forming a second planarization layer on the second source and drain layer using a twelfth mask;

[0117] forming a pixel electrode layer on the second planarization layer using a thirteenth mask;

[0118] forming a pixel definition layer and support pillars on the pixel electrode layer using a fourteenth mask;

[0119] The first source and drain electrode layer is wet-etched using the fifteenth mask to form isolation pillars. The structural schematic diagram of the display panel corresponding to this step is shown in FIG4 .

[0120] At the same time, an embodiment of the present application provides a display device, which includes the display panel as described in any of the above embodiments.

[0121] Specifically, the display device further includes electronic components, which can be arranged in the function-added area.

[0122] According to the above embodiments, it can be seen that:

[0123] An embodiment of the present application provides a display panel and a display device; the display panel includes a main display area and a functional additional area located on at least one side of the main display area, the display panel includes a substrate, a driving circuit layer and a light-emitting functional layer, the driving circuit layer is arranged on one side of the substrate, the driving circuit layer includes an isolation column arranged in the functional additional area, the light-emitting functional layer includes a common layer and a pixel electrode layer, the common layer is arranged on the side of the pixel electrode layer away from the driving circuit layer, wherein the driving circuit layer also includes a bottom cut portion and a via, the bottom cut portion is arranged between the isolation column and the substrate, the via is connected to the bottom cut portion on the side away from the substrate, the bottom cut portion includes an insulating layer and a partition metal layer, the insulating layer is arranged between the partition metal portion and the isolation column, the lateral end of the insulating layer is arranged beyond the lateral end of the partition metal layer, the common layer includes a portion located in the via, and the portion of the common layer located in the via is disconnected by the isolation column and the bottom cut portion. The present application arranges an isolation column, an undercut portion and a via in a function-added area, wherein the undercut portion is arranged under the isolation column, the via is connected to the undercut portion, and the lateral end of the insulating layer in the undercut portion is arranged beyond the lateral end of the partition metal portion, so that the portion of the common layer located in the via is disconnected by the isolation column and the undercut portion. When the display panel is in working or testing state, even if the metal in the isolation column is corroded so that the common connection on the isolation column is connected together, the undercut portion disconnects the common layer, and the common layer remains in multiple disconnected parts, thereby isolating the path for water and oxygen intrusion and improving the packaging effect of the display panel.

[0124] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0125] The above is a detailed introduction to a display panel and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel comprising a main display area and a function-added area located at at least one side of the main display area, the display panel comprising: substrate; A driving circuit layer, disposed on one side of the substrate, the driving circuit layer comprising an isolation column disposed in the function-addition area; A light-emitting functional layer, comprising a common layer and a pixel electrode layer, wherein the common layer is arranged on a side of the pixel electrode layer away from the driving circuit layer; Among them, the driving circuit layer also includes an undercut portion and a via hole, the undercut portion is arranged between the isolation column and the substrate, the via hole is connected to the undercut portion on the side away from the substrate, the undercut portion includes an insulating layer and a partition metal portion, the insulating layer is arranged between the partition metal portion and the isolation column, the lateral end of the insulating layer is arranged beyond the lateral end of the partition metal portion, the common layer includes a portion located in the via hole, and the portion of the common layer located in the via hole is disconnected by the isolation column and the undercut portion.

2. The display panel according to claim 1, wherein: The driving circuit layer also includes: A buffer layer is disposed between the substrate and the light-emitting functional layer; A gate insulating layer, disposed on a side of the buffer layer away from the substrate; A gate layer, disposed on a side of the gate insulating layer away from the buffer layer; An interlayer insulating layer, disposed on a side of the gate layer away from the gate insulating layer; Wherein, the gate layer includes the partition metal portion, and the interlayer insulating layer includes the insulating layer.

3. The display panel according to claim 2, wherein: The via hole penetrates the interlayer insulating layer, the gate layer and the gate insulating layer, and the via hole extends to the buffer layer, the buffer layer is formed with a groove or the via hole penetrates the buffer layer.

4. The display panel according to claim 1, wherein: The driving circuit layer also includes: A buffer layer is disposed between the substrate and the light-emitting functional layer; A first gate insulating layer, disposed on a side of the buffer layer away from the substrate; A first metal layer is disposed on a side of the first gate insulating layer away from the buffer layer; A second gate insulating layer is disposed on a side of the first metal layer away from the first gate insulating layer; A second metal layer is disposed on a side of the second gate insulating layer away from the first metal layer; an interlayer insulating layer, disposed on a side of the second metal layer away from the second gate insulating layer; Wherein, one of the first metal layer and the second metal layer includes the partition metal part.

5. The display panel according to claim 4, wherein: The second metal layer includes the partition metal portion, and the interlayer insulating layer includes the insulating layer.

6. The display panel according to claim 5, wherein: The via hole penetrates the interlayer insulating layer, the second metal layer, the second gate insulating layer, and the first gate insulating layer, and the via hole extends to the buffer layer, and a groove is formed in the buffer layer.

7. The display panel according to claim 1, wherein: The isolation column includes a first isolation column and a second isolation column, the undercut portion includes a first undercut portion and a second undercut portion, the first undercut portion is arranged between the first isolation column and the substrate, the second undercut portion is arranged between the second isolation column and the substrate, the via is arranged between the first undercut portion and the second undercut portion, and the common layer is disconnected by the first isolation column, the second isolation column, the first undercut portion and the second undercut portion.

8. The display panel according to claim 1, wherein: A thickness of a portion of the common layer located in the via hole is smaller than a distance between a bottom surface of the via hole and a top surface of the partition metal portion.

9. The display panel according to claim 1, wherein: The driving circuit layer further includes a source-drain electrode layer, the source-drain electrode layer includes a first titanium layer, an aluminum layer, and a second titanium layer, the first titanium layer is arranged between the aluminum layer and the substrate, and the second titanium layer is arranged on a side of the aluminum layer away from the first titanium layer; The isolation column includes two barrier metal parts and a side engraved metal part, the side engraved metal part is arranged between the two barrier metal parts, the lateral end of the barrier metal part is arranged beyond the lateral end of the side engraved metal part, the two barrier metal parts include a first barrier metal part and a second barrier metal part, the first barrier metal part is arranged between the side engraved metal part and the substrate, and the second barrier metal part is arranged on a side of the side engraved metal part away from the first barrier metal part; The first titanium layer includes the first barrier metal portion, the second titanium layer includes the second barrier metal portion, and the aluminum layer includes the side-engraved metal portion.

10. The display panel according to claim 1, wherein: The driving circuit layer also includes an active layer, a passivation layer and a planarization layer.

11. A display device, comprising a display panel, the display panel comprising a main display area and a function-added area located at at least one side of the main display area, the display panel comprising: substrate; A driving circuit layer, disposed on one side of the substrate, the driving circuit layer comprising an isolation column disposed in the function-addition area; A light-emitting functional layer, comprising a common layer and a pixel electrode layer, wherein the common layer is arranged on a side of the pixel electrode layer away from the driving circuit layer; Among them, the driving circuit layer also includes an undercut portion and a via hole, the undercut portion is arranged between the isolation column and the substrate, the via hole is connected to the undercut portion on the side away from the substrate, the undercut portion includes an insulating layer and a partition metal portion, the insulating layer is arranged between the partition metal portion and the isolation column, the lateral end of the insulating layer is arranged beyond the lateral end of the partition metal portion, the common layer includes a portion located in the via hole, and the portion of the common layer located in the via hole is disconnected by the isolation column and the undercut portion.

12. The display device according to claim 11, wherein: The driving circuit layer also includes: A buffer layer is disposed between the substrate and the light-emitting functional layer; A gate insulating layer, disposed on a side of the buffer layer away from the substrate; A gate layer, disposed on a side of the gate insulating layer away from the buffer layer; An interlayer insulating layer, disposed on a side of the gate layer away from the gate insulating layer; Wherein, the gate layer includes the partition metal portion, and the interlayer insulating layer includes the insulating layer.

13. The display device according to claim 12, wherein: The via hole penetrates the interlayer insulating layer, the gate layer and the gate insulating layer, and the via hole extends to the buffer layer, the buffer layer is formed with a groove or the via hole penetrates the buffer layer.

14. The display device according to claim 11, wherein: The driving circuit layer also includes: A buffer layer is disposed between the substrate and the light-emitting functional layer; A first gate insulating layer, disposed on a side of the buffer layer away from the substrate; A first metal layer is disposed on a side of the first gate insulating layer away from the buffer layer; A second gate insulating layer is disposed on a side of the first metal layer away from the first gate insulating layer; A second metal layer is disposed on a side of the second gate insulating layer away from the first metal layer; an interlayer insulating layer, disposed on a side of the second metal layer away from the second gate insulating layer; Wherein, one of the first metal layer and the second metal layer includes the partition metal part.

15. The display device according to claim 14, wherein: The second metal layer includes the partition metal portion, and the interlayer insulating layer includes the insulating layer.

16. The display device according to claim 15, wherein: The via hole penetrates the interlayer insulating layer, the second metal layer, the second gate insulating layer, and the first gate insulating layer, and the via hole extends to the buffer layer, and a groove is formed in the buffer layer.

17. The display device according to claim 11, wherein: The isolation column includes a first isolation column and a second isolation column, the undercut portion includes a first undercut portion and a second undercut portion, the first undercut portion is arranged between the first isolation column and the substrate, the second undercut portion is arranged between the second isolation column and the substrate, the via is arranged between the first undercut portion and the second undercut portion, and the common layer is disconnected by the first isolation column, the second isolation column, the first undercut portion and the second undercut portion.

18. The display device according to claim 11, wherein: A thickness of a portion of the common layer located in the via hole is smaller than a distance between a bottom surface of the via hole and a top surface of the partition metal portion.

19. The display device according to claim 11, wherein: The driving circuit layer further includes a source-drain electrode layer, the source-drain electrode layer includes a first titanium layer, an aluminum layer, and a second titanium layer, the first titanium layer is arranged between the aluminum layer and the substrate, and the second titanium layer is arranged on a side of the aluminum layer away from the first titanium layer; The isolation column includes two barrier metal parts and a side engraved metal part, the side engraved metal part is arranged between the two barrier metal parts, the lateral end of the barrier metal part is arranged beyond the lateral end of the side engraved metal part, the two barrier metal parts include a first barrier metal part and a second barrier metal part, the first barrier metal part is arranged between the side engraved metal part and the substrate, and the second barrier metal part is arranged on a side of the side engraved metal part away from the first barrier metal part; The first titanium layer includes the first barrier metal portion, the second titanium layer includes the second barrier metal portion, and the aluminum layer includes the side-engraved metal portion.

20. The display device according to claim 11, wherein: The driving circuit layer also includes an active layer, a passivation layer and a planarization layer.

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