Speaker module and electronic device comprising speaker module

Abstract

An electronic device according to various embodiments of the present invention comprises: a housing including a front plate, a rear plate facing the opposite direction of the front plate, and a side member, which surrounds the space between the front plate and the rear plate and includes a speaker hole; a display disposed in a first direction of the housing; and a speaker module disposed inside the housing so as to correspond to the speaker hole, wherein the speaker module includes: a first plate disposed in a second direction opposite to the display; a speaker disposed in the second direction of the first plate; a diaphragm disposed in the second direction of the speaker; a second plate spaced apart from the diaphragm and disposed in the first direction of the rear plate; and an acoustic emission port formed between the diaphragm and the second plate, the second plate includes: a first portion having a first distance from the diaphragm; and a second portion having a second distance from the diaphragm, and the first portion can be thinner than the second portion.

Description

Speaker module and electronic device including the speaker module

[0001] Various embodiments of the present invention disclose a speaker module and an electronic device including the speaker module.

[0002] The use of portable electronic devices such as tablet PCs and smart phones is increasing, and modules that perform various functions are being provided to such electronic devices.

[0003] For example, the electronic device may include at least one speaker module to output various sounds to the user.

[0004] The above speaker module can convert an electrical signal generated from an electronic device into a sound signal that can be heard by a user by using the vibration of a diaphragm and output the converted signal.

[0005] A speaker module included in an electronic device may have a sound emission port formed between a diaphragm and a plate.

[0006] If moisture enters the sound emission port of the speaker module, the sound output of the speaker module may be reduced.

[0007] The above speaker module may have limitations in discharging and removing moisture that has entered the sound emission port between the diaphragm and the plate when the thickness of the plate facing the diaphragm is formed to be the same.

[0008] Various embodiments of the present invention can provide a speaker module and an electronic device including the speaker module that can smoothly discharge and remove moisture that has entered a sound emission port by forming a portion of a plate facing at least a portion of a diaphragm thin and expanding the space between the diaphragm and the plate.

[0009] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0010] An electronic device according to one embodiment of the present invention may include a housing including a front plate, a rear plate facing in an opposite direction to the front plate, and a side member surrounding a space between the front plate and the rear plate and including a speaker hole, a display disposed in a first direction of the housing, and a speaker module disposed inside the housing to correspond to the speaker hole. According to one embodiment, the speaker module may include a first plate disposed in a second direction opposite to the display, a speaker disposed in the second direction of the first plate, a diaphragm disposed in the second direction of the speaker, a second plate spaced apart from the diaphragm and disposed in the first direction of the rear plate, and a sound emission port formed between the diaphragm and the second plate. According to one embodiment, the second plate may include a first portion having a first distance from the diaphragm and a second portion having a second distance from the diaphragm, wherein the first portion may be configured to have a thinner thickness than the second portion.

[0011] According to various embodiments of the present invention, by forming a portion of a plate facing a diaphragm thinly to form a wide gap between the diaphragm and the plate, moisture that has entered an acoustic emission port of a speaker module (e.g., an acoustic output module) can be smoothly discharged and removed.

[0012] In addition, various effects may be provided, either directly or indirectly, through this document.

[0013] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0014] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0015] FIG. 2A is a perspective view schematically illustrating the front of an electronic device according to various embodiments of the present invention.

[0016] FIG. 2b is a perspective view schematically illustrating the rear surface of the electronic device of FIG. 2a according to various embodiments of the present invention.

[0017] FIG. 3 is an exploded perspective view schematically showing the configuration of a speaker module included in an electronic device according to one embodiment of the present invention.

[0018] FIG. 4 is a cross-sectional view schematically showing the configuration of a speaker module included in an electronic device according to one embodiment of the present invention.

[0019] FIG. 5a is a perspective view schematically showing a diaphragm included in a speaker module according to one embodiment of the present invention.

[0020] FIG. 5b is a drawing schematically showing a cross-section of a 5-5' portion of the diaphragm disclosed in FIG. 5a according to one embodiment of the present invention.

[0021] FIG. 6A is a perspective view schematically illustrating a diaphragm included in a speaker module according to various embodiments of the present invention.

[0022] FIG. 6b is a schematic drawing showing a cross-section of a portion 6-6' of the diaphragm disclosed in FIG. 6a according to various embodiments of the present invention.

[0023] FIG. 7 is a schematic drawing of a second plate included in a speaker module according to one embodiment of the present invention, viewed from a second direction.

[0024] FIG. 8 is a schematic drawing showing an example in which a cross-section of a portion 8-8' of the second plate disclosed in FIG. 7 according to one embodiment of the present invention is applied to a speaker module.

[0025] FIG. 9 is a schematic drawing showing an example in which a cross-section of a 9-9' portion of the second plate disclosed in FIG. 7 according to one embodiment of the present invention is applied to a speaker module.

[0026] FIG. 10 is a schematic drawing showing an example in which a cross-section of a 10-10' portion of the second plate disclosed in FIG. 7 according to one embodiment of the present invention is applied to a speaker module.

[0027] FIG. 11 is a schematic drawing of a second plate included in a speaker module according to one embodiment of the present invention, viewed from a first direction.

[0028] FIG. 12 is a schematic drawing showing a cross-section of a portion 12-12' of the second plate disclosed in FIG. 11 according to one embodiment of the present invention.

[0029] FIG. 13 is a schematic drawing showing a cross-section of a portion 13-13' of the second plate disclosed in FIG. 11 according to one embodiment of the present invention.

[0030] FIG. 14 is a schematic drawing showing a cross-section of a portion 14-14' of the second plate disclosed in FIG. 11 according to one embodiment of the present invention.

[0031] FIG. 15 is a schematic drawing showing a cross-section of a 15-15' portion of the second plate disclosed in FIG. 11 according to one embodiment of the present invention.

[0032] FIG. 16 is a schematic drawing showing a cross-section of a 16-16' portion of the second plate disclosed in FIG. 11 according to one embodiment of the present invention.

[0033] FIG. 17 is a diagram showing a comparison of performance in the low-frequency band for a speaker module according to one embodiment of the present invention and a speaker module according to a comparative embodiment.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present invention.

[0035] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0036] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0041] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0052] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0053] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0054] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] FIG. 2A is a perspective view schematically illustrating the front side of an electronic device according to various embodiments of the present invention. FIG. 2B is a perspective view schematically illustrating the rear side of the electronic device of FIG. 2A according to various embodiments of the present invention.

[0058] According to one embodiment, the electronic device (200) disclosed below may include at least some of the embodiments of the electronic device (101) disclosed in FIG. 1. Embodiments related to the electronic device (200) disclosed below may be applied to, for example, electronic devices such as tablet PCs. However, the electronic device (200) according to one embodiment of the present invention is not limited to tablet PCs, and may be substantially equally applied to electronic devices such as bar type, foldable type, rollable type, sliding type, wearable type, and / or notebook PCs.

[0059] Referring to FIGS. 2A and 2B, an electronic device (200) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present invention may include a housing (210) including a front plate (202) facing a first direction (e.g., the z-axis direction), a rear plate (211) facing a second direction (e.g., the -z-axis direction) opposite to the front plate (202), and a side member (218) surrounding a space between the front plate (202) and the rear plate (211). The side member (218) may include at least one speaker hole (207a, 207b, 207c, and / or 207d).

[0060] According to one embodiment, the side member (218) may include a first side (218a) having a first length, a second side (218b) extending in a direction perpendicular to the first side (218a) (e.g., in the -x-axis direction) and having a second length shorter than the first length, a third side (218c) extending parallel to the first side (218a) from the second side (218b) and having the first length, and a fourth side (218d) extending parallel to the second side (218b) from the third side (218c) and having the second length.

[0061] According to one embodiment, the front plate (202) may be a front cover (e.g., a first cover) forming a front edge of the housing (210). The front plate (202) may be positioned in a first direction (e.g., a z-axis direction) of the electronic device (200). The front plate (202) may be formed by a glass plate or a polymer plate including various coating layers.

[0062] According to one embodiment, the rear plate (211) may be a rear cover (e.g., a second cover) forming at least a portion of the rear surface (e.g., in the -z-axis direction) of the housing (210). The rear plate (211) may be disposed in the second direction (e.g., in the -z-axis direction) of the electronic device (200). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials. The rear plate (211) may be composed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material.

[0063] In one embodiment, the side member (218) is coupled to the front plate (202) and the rear plate (211) and may be formed as a side bezel structure comprising metal and / or polymer. In various embodiments, the rear plate (211) and the side member (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum or magnesium).

[0064] According to one embodiment, the electronic device (200) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), at least one input module (203) (e.g., the input module (150) of FIG. 1), at least one speaker hole (207a, 207b, 207c, and 207d), a sensor module (204) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212 (212a, 212b)) (e.g., the camera module (180) of FIG. 1), a key input device (217), or a connector hole (208). According to various embodiments, the electronic device (200) may omit at least one of the above-described components or may additionally include other components.

[0065] In one embodiment, the display (201) may be disposed in a first direction (e.g., top surface, z-axis direction) of the housing (210). For example, the display (201) may be visible through a substantial portion of the front plate (202). The display (201) may also be visible through substantially the entire area of ​​the front plate (202). An edge of the display (201) may be formed to be substantially identical to an adjacent outer shape of the front plate (202). In various embodiments, the display (201) may have a recess or opening formed in a portion of the screen display area, and at least one of the components described above may be disposed to be aligned with the recess or opening.

[0066] According to various embodiments, the electronic device (200) may include at least one of an audio module (e.g., audio module (170) of FIG. 1), a sensor module (204), a camera module (205), or a light-emitting element (not shown) on the back surface of the screen display area of ​​the display (201).

[0067] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field type electronic pen (e.g., a stylus pen).

[0068] According to one embodiment, the input module (203) may include at least one microphone. The input module (103) may include a plurality of microphones positioned at different locations so as to detect the direction of sound.

[0069] According to one embodiment, the at least one speaker hole (207a, 207b, 207c and / or 207d) can output sound output through the speaker module (230). The at least one speaker hole (207a, 207b, 207c and / or 207d) can be formed in the second side (218b) (e.g., in the -y-axis direction) and / or the fourth side (218d) (e.g., in the y-axis direction) of the housing (210). The at least one speaker hole (207a, 207b, 207c and / or 207d) can be formed at a position corresponding to a sound emission port of the speaker module (230) (e.g., a sound emission port (345) of FIGS. 3 and 4). The speaker module (230) can include an external speaker and / or a receiver for calls.

[0070] According to various embodiments, the electronic device (200) may include at least one speaker module (230). The speaker module (230) may be disposed inside the housing (210). The speaker module (230) may be disposed at each corner portion of the internal space of the housing (210) of the electronic device (200). For example, the speaker module (230) may be disposed at a corresponding position of each of at least one speaker hole (207a, 207b, 207c and / or 207d). At least one speaker module (230) may be disposed between the display (201) and the rear plate (211). The speaker module (230) may be disposed at a lower portion (e.g., in the -z-axis direction) of the display (201). The speaker module (230) may be disposed at an upper portion (e.g., in the z-axis direction) of the rear plate (211).

[0071] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204) may include, for example, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0072] According to one embodiment, the camera modules (205, 212 (212a, 212b)) may include a front camera module (205) that is arranged to be exposed to the outside through the front plate (202) of the electronic device (200) and a rear camera module (212a, 212b) that is arranged to be exposed to the outside through the rear plate (211). According to one embodiment, the camera modules (205, 212a, 212b) may include one or more lenses, an image sensor, and / or an image signal processor. According to one embodiment, at least two rear camera modules (212a, 212b) may be arranged adjacent to each other as one camera module assembly (212). For example, a pair of camera modules (212a, 212b) of the camera module assembly (212) may perform a dual camera function for normal shooting, wide-angle shooting, or ultra-wide-angle shooting.

[0073] In one embodiment, the key input device (217) may be positioned to be exposed to the outside through a side member (218) of the housing (210). For example, the key input device (217) may be positioned to be exposed to the outside through a first side (218a). In various embodiments, the key input device (217) may also be positioned to be exposed to the outside through a third side (218c). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). For example, the key input device (217) may be implemented using a pressure sensor included in the display (201). The key input device (217) may be disposed within the electronic device (200) and may include at least one pressure-responsive key using a strain gauge that measures pressure changes due to pressurization of the side member (218). In one embodiment, the key input device (217) may include a power button and / or a volume control button of the electronic device (200).

[0074] According to one embodiment, the connector hole (208) may be formed on the second side (218b) of the housing (210). The connector hole (208) may include a connector port (e.g., a USB connector or an IF (interface) connector) therein for transmitting and receiving power and / or data with an external electronic device (e.g., an external electronic device (102, 104) of FIG. 1). The connector hole (208) may also perform a function for transmitting and receiving audio signals with the external electronic device (e.g., an external electronic device (102, 104) of FIG. 1), or may further include a separate connector port (e.g., an ear jack) therein for performing a function for transmitting and receiving audio signals. For example, the connector port (not shown) may include a connection terminal (178) disclosed in FIG. 1.

[0075] FIG. 3 is an exploded perspective view schematically showing the configuration of a speaker module included in an electronic device according to one embodiment of the present invention.

[0076] According to various embodiments, the speaker module (230) may be disposed inside the housing (210) disclosed in FIGS. 2A and 2B. For example, the speaker module (230) may be disposed between the display (201) and the rear plate (211).

[0077] According to one embodiment, the speaker module (230) may include a first plate (310), a first frame (320), a speaker (330), a diaphragm (335), a second frame (340) and / or a second plate (350).

[0078] According to one embodiment, the speaker module (230) is positioned at a position corresponding to the speaker hole (e.g., 207a) disclosed in FIGS. 2A and 2B, and can output an acoustic signal to the outside of the electronic device (200).

[0079] According to one embodiment, the first plate (310) may be disposed on the lower side (e.g., in the -z-axis direction, bottom side) of the display (201). The first plate (310) may be disposed in a second direction (e.g., in the -z-axis direction) opposite to the display (201). The first plate (310) may be disposed in the first direction (e.g., in the z-axis direction, top side) of the first frame (320). The first plate (310) may be made of a conductive material (e.g., metal) such as aluminum, SUS (steel use stainless), or magnesium. The first plate (310) may shield a magnetic force generated from a magnet (not shown) disposed at a designated location of the speaker module (230) (e.g., the speaker (330)).

[0080] According to one embodiment, the first frame (320) may be disposed in a second direction (e.g., in the -z-axis direction, downward) of the first plate (310). The first frame (320) may have a specified thickness and may constitute at least a portion of the outer shape of the speaker module (230). The first frame (320) may include a non-metallic (e.g., polymer) and / or metallic material. The first frame (320) may include an internal space in a specified area.

[0081] According to one embodiment, the speaker (330) may be disposed in a second direction (e.g., in the -z-axis direction, downward) of the first frame (320). For example, the speaker (330) may be disposed in the second direction (e.g., in the -z-axis direction, downward) of the first plate (310). The speaker (330) may be disposed in at least a portion of the internal space of the first frame (310). The speaker (330) may convert an electric signal into sound and output it. The speaker (330) may include a yoke, a magnet, a substrate, and / or a voice coil, which are not illustrated. The speaker (330) may be disposed between the first frame (320) and the second frame (340).

[0082] According to one embodiment, the diaphragm (335) may be arranged in a second direction (e.g., in the -z-axis direction, downward or downward) of the speaker (330). The diaphragm (335) (e.g., a sound generating module) may generate sound by vertical vibration. The sound generated by the vibration of the diaphragm (335) may be output through the sound emission port (345). For example, the sound emission port (345) may be formed in the -y-axis direction of the second frame (340).

[0083] According to one embodiment, the second frame (340) may be disposed in a second direction (e.g., in the -z-axis direction, downward) of the diaphragm (335). The second frame (340) may have a specified thickness and may constitute at least a portion of the outer shape of the speaker module (230). The second frame (340) may include a non-metallic (e.g., polymer) and / or metallic material. The second frame (340) may include an internal space in a specified area. The second frame (340) may include an opening (342). At least a portion of the speaker (330) and the diaphragm (335) may be disposed in the opening (342). The second frame (340) may include a sound emission port (345). The sound emission port (345) may include a sound output space formed between the diaphragm (335) and the second plate (350). For example, if moisture enters the speaker module (230), the moisture can be discharged and / or removed through the sound discharge port (345).

[0084] According to various embodiments, the first frame (320) (e.g., upper housing) and the second frame (340) (e.g., lower housing) may form a housing of the speaker module (230). For example, the housing of the speaker module (230) may be formed by combining the first frame (320) (e.g., upper housing) and the second frame (340) (e.g., lower housing). The speaker (330) and the diaphragm (335) may be disposed between the first frame (320) and the second frame (340). The sound output through the speaker (330) is transmitted to the diaphragm (335), and the sound transmitted to the diaphragm (335) may be transmitted to the outside of the electronic device (200) through the sound emission port (345) and the speaker hole (207a). For example, the speaker hole (207a) may be formed on the second side (218b) of the housing (210) disclosed in FIGS. 2a and 2b.

[0085] According to one embodiment, the second plate (350) may be disposed in the second direction (e.g., -z-axis direction, bottom) of the diaphragm (335). The second plate (350) may be disposed in at least a part of the second direction (e.g., -z-axis direction, bottom) of the second frame (340). The second plate (350) may be made of a conductive material (e.g., metal) such as aluminum, SUS (steel use stainless), or magnesium. The second plate (350) may be disposed at a position facing the diaphragm (335). The second plate (350) may be disposed spaced apart from the diaphragm (335). An acoustic emission port (345) may be formed between the diaphragm (335) and the second plate (350). The acoustic emission port (345) may include a passage through which sound is transmitted.

[0086] According to various embodiments, the second plate (350) may include a convex portion (355), a first concave portion (430), and / or a second concave portion (440). For example, the convex portion (355) may be formed in a substantially T-shape. For example, the convex portion (355) may be formed in a shape similar to a T-shape, or may be formed in various other shapes.

[0087] According to one embodiment, the second plate (350) may be disposed in a third direction (e.g., in the x-axis direction, upward) of the rear plate (211). For example, the second plate (350) may be disposed to be coupled with at least a portion of an upper surface of the rear plate (211). An elastic member (e.g., an elastic member (450) of FIG. 4) may be disposed at least partially between the second plate (350) and the rear plate (211). The elastic member (450) may include a sponge or a double-sided adhesive tape.

[0088] FIG. 4 is a cross-sectional view schematically showing the configuration of a speaker module included in an electronic device according to one embodiment of the present invention.

[0089] For example, FIG. 4 may be a cross-sectional view of a portion 4-4' of the electronic device (200) disclosed in FIG. 2A according to an embodiment of the present invention, viewed in the x-axis direction. For example, FIG. 4 may be a schematic view of a cross-sectional view of a state in which the speaker module (230) and the rear plate (211) disclosed in FIG. 3 are coupled according to an embodiment of the present invention. In the description of FIG. 4, components that are substantially the same as those of the electronic device (200) disclosed in FIGS. 2A and 2B and the speaker module (230) disclosed in FIG. 3 are given the same reference numerals, and a duplicate description thereof may be omitted.

[0090] According to various embodiments, the speaker module (230) may be disposed inside the housing (210) disclosed in FIGS. 2A and 2B. For example, the speaker module (230) may be disposed in a first direction (e.g., z-axis direction, upper direction) of the rear plate (211). The speaker module (230) may be disposed at a position corresponding to the speaker hole (207a) disclosed in FIGS. 2A and 2B, and may output an acoustic signal to the outside of the electronic device (200) through the acoustic emission port (345).

[0091] According to one embodiment, a dustproof member (348) may be disposed between the sound emission port (345) and the speaker hole (207a) of the speaker module (230). For example, the dustproof member (348) may be disposed at a designated position of the sound emission port (345). The dustproof member (348) may separate the sound emission port (345) and the speaker hole (207a). The dustproof member (348) may prevent and / or block foreign substances from entering the sound emission port (345) through the speaker hole (207a). The dustproof member (348) may be formed of a rubber material including a porous structure and / or a mesh structure. For example, the dustproof member (348) may be formed of at least one of a urethane or silicone material. The dustproof member (348) may be formed in a structure in which moisture is discharged through the speaker hole (207a) via the sound emission port (345). The dustproof member (348) may be formed in a structure in which sound output through the sound emission port (345) can be transmitted to the outside of the electronic device (200) via the speaker hole (207a).

[0092] According to one embodiment, the speaker module (230) may include a first plate (310), a speaker (330), a diaphragm (335) and / or a second plate (350).

[0093] According to one embodiment, the first plate (310) may be positioned in a second direction (e.g., in the -z-axis direction, downward) of the display (201) (e.g., the display (201) of FIGS. 2A and 2B).

[0094] According to one embodiment, the speaker (330) may be positioned in a second direction (e.g., -z-axis direction, downward) of the first plate (310).

[0095] According to one embodiment, the diaphragm (335) may be disposed in a second direction (e.g., in the -z-axis direction, bottom or lower side) of the speaker (330). The diaphragm (335) may include a first groove (410) and a second groove (420). For example, the first groove (410) may be formed in the -y-axis direction of the diaphragm (335). For example, the second groove (420) may be formed in the y-axis direction of the diaphragm (335). The diaphragm (335) (e.g., sound generating module) may generate sound by vertical vibration. The sound generated by the vibration of the diaphragm (335) may be output through the sound emission port (345).

[0096] According to one embodiment, the second plate (350) may be disposed in the second direction (e.g., -z-axis direction, downward) of the vibration plate (335). The second plate (350) may be disposed at a position facing the vibration plate (335). The second plate (350) may be disposed spaced apart from the vibration plate (335). An acoustic emission port (345) may be formed between the vibration plate (335) and the second plate (350).

[0097] According to one embodiment, the second plate (350) may include a first portion (P1), a second portion (P2), and / or a third portion (P3). The first portion (P1) of the second plate (350) may have a first gap (g1) with a portion of the diaphragm (335). For example, the first portion (P1) may be spaced apart from a portion of the diaphragm (335) by the first gap (g1). The second portion (P2) of the second plate (350) may have a second gap (g2) with a portion of the diaphragm (335). For example, the second portion (P2) may be spaced apart from a portion of the diaphragm (335) by the second gap (g2). The third portion (P3) of the second plate (350) may have a first gap (g1) with a portion of the vibrating plate (335). For example, the third portion (P3) may be spaced apart from a portion of the vibrating plate (335) by the first gap (g1).

[0098] According to various embodiments, the first gap (g1) between the first portion (P1) of the second plate (350) and a portion of the diaphragm (335) may be at least about 0.6 mm or more. The first gap (g1) between the third portion (P3) of the second plate (350) and a portion of the diaphragm (335) may be at least about 0.6 mm or more. For example, the first gap (g1) between the first portion (P1) of the second plate (350) and a portion of the diaphragm (335) may be about 0.5 mm to 0.9 mm. For example, the second gap (g2) between the second portion (P2) of the second plate (350) and a portion of the diaphragm (335) may be about 0.3 mm to 0.7 mm. For example, the first gap (g1) between the third portion (P3) of the second plate (350) and a portion of the vibration plate (335) may be about 0.5 mm to 0.9 mm. According to various embodiments, the first gap (g1) and the second gap (g2) described above are merely exemplary and are not limited to the above-described examples and may include other various gaps.

[0099] According to one embodiment, the first portion (P1) of the second plate (350) may have a thinner thickness than the second portion (P2). The third portion (P3) of the second plate (350) may have a thinner thickness than the second portion (P2). The first portion (P1) and the third portion (P3) may be formed to have substantially the same thickness. According to various embodiments, the first portion (P1) and the third portion (P3) may be formed to have different thicknesses.

[0100] According to one embodiment, the first portion (P1) of the second plate (350) may include a portion facing a first groove (410) formed in the vibrating plate (335). For example, the first groove (410) of the vibrating plate (335) may be formed to face the first portion (P1) of the second plate (350). The third portion (P3) of the second plate (350) may include a portion facing a second groove (420) formed in the vibrating plate (335). For example, the second groove (420) of the vibrating plate (335) may be formed to face the third portion (P3) of the second plate (350). The second portion (P2) of the second plate (350) may include a portion between the first groove (410) and the second groove (420) of the vibrating plate (335).

[0101] According to one embodiment, the first portion (P1) of the second plate (350) may include a first concave portion (430). The first concave portion (430) may be formed in the first portion (P1) of the second plate (350) via a first step (431). According to various embodiments, the first concave portion (430) may be formed in the first portion (P1) of the second plate (350) via an inclined surface (e.g., a first inclined surface). For example, the first step (431) may be formed as the first inclined surface. The third portion (P3) of the second plate (350) may include a second concave portion (440). The second concave portion (440) may be formed in the third portion (P3) of the second plate (350) via the second step (441). According to various embodiments, the second concave portion (440) may be formed in the third portion (P3) of the second plate (350) via an inclined surface (e.g., a second inclined surface). For example, the second step (441) may be formed as the second inclined surface. For example, the first concave portion (430) and / or the second concave portion (440) may be formed using at least one of an etching process or a milling process. The second portion (P2) of the second plate (350) may include a convex portion (355). The convex portion (355) may be disposed between the first concave portion (430) and the second concave portion (440).

[0102] According to one embodiment, the second plate (350) is formed with a wide gap (e.g., first gap (g1)) facing the vibration plate (335) through the first concave portion (430) formed in the first portion (P1) and / or the second concave portion (440) formed in the third portion (P3), so that moisture introduced into the sound emission port (345) can be easily discharged and / or removed. According to various embodiments, the second plate (350) is formed with a wide gap (e.g., first gap (g1)) facing the vibration plate (335) through the first concave portion (430) and / or the second concave portion (440), so that the range of motion with respect to the vibration plate (335) is widened, so that the performance of the speaker module (230) in the low frequency band can be improved.

[0103] According to one embodiment, an elastic member (450) (e.g., a support member) may be disposed between at least a portion of the second plate (350) and the rear plate (211). For example, the elastic member (450) may be disposed between the second portion (P2) of the second plate (350) and the rear plate (211). The elastic member (450) may mitigate vibration transmitted to the rear plate (211) through the second plate (350) when the diaphragm (335) vibrates. The elastic member (450) may reduce vibration noise or resonant noise of the second plate (350).

[0104] Fig. 5a is a perspective view schematically illustrating a diaphragm included in a speaker module according to one embodiment of the present invention. Fig. 5b is a drawing schematically illustrating a cross-section of a 5-5' portion of the diaphragm disclosed in Fig. 5a according to one embodiment of the present invention.

[0105] Referring to FIGS. 5A and 5B, the diaphragm (335) may be positioned in the second direction (e.g., in the -z-axis direction, downward or downward) of the speaker (330) disclosed in FIG. 3. The diaphragm (335) may include a first groove (410) and a second groove (420).

[0106] According to one embodiment, the first groove (410) of the vibration plate (335) may be formed at a position facing a part of the first part (P1) of the second plate (350). The second groove (420) of the vibration plate (335) may be formed at a position facing a part of the third part (P3) of the second plate (350). The first groove (410) and the second groove (420) of the vibration plate (335) may be formed in a negative shape. The first groove (410) and the second groove (420) of the vibration plate (335) may be a part from which sound of the sound emission port (345) is output.

[0107] FIG. 6A is a perspective view schematically illustrating a diaphragm included in a speaker module according to various embodiments of the present invention. FIG. 6B is a drawing schematically illustrating a cross-section of a portion 6-6' of the diaphragm disclosed in FIG. 6A according to various embodiments of the present invention.

[0108] Referring to FIGS. 6A and 6B, the diaphragm (335) may be positioned in the second direction (e.g., in the -z-axis direction, downward or downward) of the speaker (330) disclosed in FIG. 3. The diaphragm (335) may include a first protrusion (610) and a second protrusion (620).

[0109] According to one embodiment, the first protrusion (610) of the vibration plate (335) may be formed at a position facing a part of the first part (P1) of the second plate (350). The second protrusion (620) of the vibration plate (335) may be formed at a position facing a part of the third part (P3) of the second plate (350). The first protrusion (610) and the second protrusion (620) of the vibration plate (335) may be formed in a raised shape. The first protrusion (610) and the second protrusion (620) of the vibration plate (335) may be a part from which sound of the sound emission port (345) is output.

[0110] FIG. 7 is a schematic drawing of a second plate included in a speaker module according to an embodiment of the present invention as viewed from a second direction. FIG. 8 is a drawing schematically showing an example in which a cross-section of a portion 8-8' of the second plate disclosed in FIG. 7 according to an embodiment of the present invention is applied to a speaker module. FIG. 9 is a drawing schematically showing an example in which a cross-section of a portion 9-9' of the second plate disclosed in FIG. 7 according to an embodiment of the present invention is applied to a speaker module. FIG. 10 is a drawing schematically showing an example in which a cross-section of a portion 10-10' of the second plate disclosed in FIG. 7 according to an embodiment of the present invention is applied to a speaker module.

[0111] For example, FIG. 7 may be a drawing of the second plate (350) of the speaker module (230) disclosed in FIG. 3 according to one embodiment of the present invention, viewed in the -z-axis direction. In the descriptions of FIGS. 7 to 10, components that are substantially the same as those disclosed in the electronic device (200) disclosed in FIGS. 2A and 2B and the speaker module (230) disclosed in FIGS. 3 to 6 are given the same reference numerals, and a duplicate description thereof may be omitted.

[0112] Referring to FIGS. 7 to 10, the second plate (350) may include a convex portion (355), a first concave portion (430), a second concave portion (440), and / or an elastic member (450).

[0113] According to one embodiment, the convex portion (355) may be formed in a T shape. For example, the convex portion (355) may be a portion corresponding to the second portion (P2) of the second plate (350). The convex portion (355) may complement the high-frequency characteristics of the speaker module (230) through the second gap (g2) with the vibration plate (335). An elastic member (450) may be arranged inside the convex portion (355).

[0114] According to one embodiment, the first concave portion (430) may be formed in the -y-axis direction of the second plate (350).

[0115] According to one embodiment, the second concave portion (440) may be formed in the y-axis direction of the second plate (350).

[0116] According to one embodiment, the elastic member (450) may be disposed between the convex portion (355) of the second plate (350) (e.g., the second portion (P2) of the second plate (350)) and the rear plate (211). The elastic member (450) may be disposed inside the convex portion (355) of the second plate (350). For example, the elastic member (450) may be disposed corresponding to the T-shaped convex portion (355) of the second plate (350). The elastic member (450) may reduce vibration noise or resonance noise of the second plate (350).

[0117] Referring to Fig. 8, when the second plate (350) has a cross-section formed at the center of a convex portion (355) having a T shape, the first concave portion (430) may have a size smaller than that of the convex portion (355) in the y-axis and -y-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and the convex portion (355) in the y-axis and -y-axis directions.

[0118] Referring to Fig. 9, when the second plate (350) has a cross-section formed in the x-axis direction of the convex portion (355) having a T-shape, the first concave portion (430) may have a size larger than that of the convex portion (355) in the y-axis and -y-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and the convex portion (355) in the y-axis and -y-axis directions.

[0119] Referring to Fig. 10, when the second plate (350) has a cross-section formed in the -x-axis direction of the convex portion (355) having a T-shape, the first concave portion (430) may have a size larger than that of the convex portion (355) in the y-axis and -y-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and the convex portion (355) in the y-axis and -y-axis directions.

[0120] FIG. 11 is a schematic drawing of a second plate included in a speaker module according to an embodiment of the present invention as viewed in a first direction. FIG. 12 is a drawing schematically showing a cross-section of a portion 12-12' of the second plate disclosed in FIG. 11 according to an embodiment of the present invention. FIG. 13 is a drawing schematically showing a cross-section of a portion 13-13' of the second plate disclosed in FIG. 11 according to an embodiment of the present invention. FIG. 14 is a drawing schematically showing a cross-section of a portion 14-14' of the second plate disclosed in FIG. 11 according to an embodiment of the present invention. FIG. 15 is a drawing schematically showing a cross-section of a portion 15-15' of the second plate disclosed in FIG. 11 according to an embodiment of the present invention. FIG. 16 is a drawing schematically showing a cross-section of a portion 16-16' of the second plate disclosed in FIG. 11 according to an embodiment of the present invention.

[0121] For example, FIG. 11 may be a drawing of the second plate (350) of the speaker module (230) disclosed in FIG. 3 according to one embodiment of the present invention, viewed in the z-axis direction. In the descriptions of FIGS. 11 to 16, components that are substantially the same as those disclosed in the electronic device (200) disclosed in FIGS. 2A and 2B and the speaker module (230) disclosed in FIGS. 3 to 10 are given the same reference numerals, and redundant descriptions thereof may be omitted.

[0122] Referring to FIGS. 11 to 16, the second plate (350) may include a convex portion (355), a first concave portion (430), and / or a second concave portion (440).

[0123] According to one embodiment, the convex portion (355) may be formed in a T shape. For example, the convex portion (355) may be a portion corresponding to the second portion (P2) of the second plate (350).

[0124] According to one embodiment, the first concave portion (430) may be formed in the -y-axis direction of the second plate (350).

[0125] According to one embodiment, the second concave portion (440) may be formed in the y-axis direction of the second plate (350).

[0126] Referring to Fig. 12, when the second plate (350) has a cross-section formed at the center of a convex portion (355) having a T shape, the first concave portion (430) may have a size smaller than that of the convex portion (355) in the y-axis and -y-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and the convex portion (355) in the y-axis and -y-axis directions.

[0127] Referring to Fig. 13, when the second plate (350) has a cross-section formed in the -x-axis direction of the convex portion (355) having a T-shape, the first concave portion (430) may have a size larger than that of the convex portion (355) in the y-axis and -y-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and the convex portion (355) in the y-axis and -y-axis directions.

[0128] Referring to Fig. 14, when the second plate (350) has a cross-section formed in the x-axis direction of the convex portion (355) having a T-shape, the first concave portion (430) may have a size larger than that of the convex portion (355) in the y-axis and -y-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and the convex portion (355) in the y-axis and -y-axis directions.

[0129] Referring to FIG. 15, when the second plate (350) has a cross-section formed at the center (e.g., in the x-axis direction and the -x-axis direction) of the convex portion (355) having a T-shape, the first concave portion (430) may have a size larger than that of the convex portion (355) in the -x-axis and x-axis directions. In this case, the second concave portion (440) may have a size smaller than that of the first concave portion (430) and larger than that of the convex portion (355) in the -x-axis and x-axis directions.

[0130] Referring to FIG. 16, when the second plate (350) has a cross-section formed on the lower portion (e.g., in the x-axis direction and the -x-axis direction) of the convex portion (355) having a T-shape, for example, only the first concave portion (430) may appear. For example, when the second plate (350) has a cross-section formed on the upper portion (e.g., in the x-axis direction and the -x-axis direction) of the convex portion (355) having a T-shape, only the second concave portion (440) may appear.

[0131] FIG. 17 is a diagram showing a comparison of performance in the low-frequency band for a speaker module according to one embodiment of the present invention and a speaker module according to a comparative embodiment.

[0132] For example, a speaker module (230) included in an electronic device (200) according to one embodiment of the present invention may include a second plate (350) facing a diaphragm (335) that includes a first concave portion (430), a convex portion (355), and / or a second concave portion (440). In a speaker module according to a comparative embodiment, a second plate facing a diaphragm may be formed with the same thickness.

[0133] In FIG. 17, the first graph (1710) may represent the performance of a speaker module according to a comparative example. The second graph (1720) may represent the performance of a speaker module (230) according to an embodiment of the present invention.

[0134] Referring to FIG. 17, it can be confirmed that the performance (1720) of the speaker module (230) according to one embodiment of the present invention is improved in the low-frequency band (e.g., about 150 Hz to 400 Hz) compared to the performance (1710) of the speaker module according to the comparative embodiment. For example, the speaker module (230) according to one embodiment of the present invention can improve the sound volume in the low-frequency band (e.g., about 150 Hz to 400 Hz) output through the speaker (330) and the sound emission port (345).

[0135] In one embodiment, a volume recovery experiment was conducted five times at a volume within about 5 dB after playing a sound source for about 30 seconds through a speaker module (230) according to one embodiment of the present invention and a speaker module according to a comparative embodiment.

[0136] As a result of the experiment, as shown in Table 1 below, it can be confirmed that the speaker module (230) according to one embodiment of the present invention has improved volume recovery performance compared to the speaker module according to the comparative embodiment.

[0137] Speaker module according to the example of comparison of the number of times Speaker module according to the present invention Initial volume (dB) Late volume (dB) Initial volume (dB) Late volume (dB) 181.174.182.678.8282.370.882.580.8381.87082.080.5481.172.782.180.4581.873.982.179.5

[0138] An electronic device (101, 200) according to one embodiment of the present invention may include a housing (210) including a front plate (202), a rear plate (211) facing in an opposite direction to the front plate (202), and a side member (218) surrounding a space between the front plate (202) and the rear plate (211) and including a speaker hole (207a), a display (201) arranged in a first direction of the housing (210), and a speaker module (230) arranged inside the housing (210) to correspond to the speaker hole (207a).

[0139] According to one embodiment, the speaker module (230) may include a first plate (310) disposed in a second direction opposite to the display (201), a speaker (330) disposed in the second direction of the first plate (310), a vibration plate (335) disposed in the second direction of the speaker (330), a second plate (350) spaced apart from the vibration plate (335) and disposed in the first direction of the rear plate (211), and an acoustic emission port (345) formed between the vibration plate (335) and the second plate (350).

[0140] According to one embodiment, the second plate (350) includes a first portion (P1) having a first gap (g1) with the vibration plate (335) and a second portion (P2) having a second gap (g2) with the vibration plate (335), wherein the first portion (P1) may be configured to have a thinner thickness than the second portion (P2).

[0141] According to one embodiment, the second plate (350) may include a third portion (P3) having the vibration plate (335) and the first gap (g1).

[0142] According to one embodiment, an elastic member (450) may be placed between the second portion (P2) of the second plate (350) and the rear plate (211).

[0143] According to one embodiment, the vibration plate (335) may include a first groove (410) formed on a portion of the second plate (350) facing the first portion (P1).

[0144] According to one embodiment, the vibration plate (335) may include a second groove (420) formed on a portion of the second plate (350) facing the third portion (P3).

[0145] According to one embodiment, the vibration plate (335) may include a first protrusion (610) formed on a portion of the second plate (350) facing the first portion (P1).

[0146] According to one embodiment, the vibration plate (335) may include a second protrusion (620) formed on a portion facing the third portion (P3) of the second plate (350).

[0147] According to one embodiment, a vibration-proof member (348) may be placed at a designated location of the sound emission port (345).

[0148] According to one embodiment, a first concave portion (430) may be formed in the first portion (P1) of the second plate (350).

[0149] According to one embodiment, a second concave portion (440) may be formed in the third portion (P3) of the second plate (350).

[0150] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0151] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0152] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0153] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0154] Although the present invention has been described above according to various embodiments of the present invention, it is obvious that changes and modifications made by a person having ordinary skill in the art to which the present invention pertains within a scope that does not depart from the technical spirit of the present invention also belong to the present invention.

Claims

1. In an electronic device (101, 200), A housing (210) including a front plate (202), a rear plate (211) facing in an opposite direction to the front plate (202), and a side member (218) surrounding a space between the front plate (202) and the rear plate (211) and including a speaker hole (207a); A display (201) arranged in the first direction of the above housing (210); and It includes a speaker module (230) arranged inside the housing (210) to correspond to the speaker hole (207a). The above speaker module (230) is A first plate (310) arranged in a second direction opposite to the above display (201); A speaker (330) arranged in the second direction of the first plate (310); A vibration plate (335) arranged in the second direction of the above speaker (330); A second plate (350) spaced apart from the above vibration plate (335) and arranged in the first direction of the rear plate (211); and It includes a sound emission port (345) formed between the above vibration plate (335) and the second plate (350), The above second plate (350) is, An electronic device comprising a first part (P1) having a first gap (g1) with the vibration plate (335) and a second part (P2) having a second gap (g2) with the vibration plate (335), wherein the first part (P1) is configured to have a thinner thickness than the second part (P2).

2. In paragraph 1, The above second plate (350) is, An electronic device including a third part (P3) having the above-described vibration plate (335) and the first gap (g1).

3. In paragraph 1 or 2, An electronic device in which an elastic member (450) is arranged between the second portion (P2) of the second plate (350) and the rear plate (211).

4. In paragraph 1 or 2, An electronic device in which the vibration plate (335) includes a first groove (410) formed on a portion facing the first portion (P1) of the second plate (350).

5. In paragraph 2, An electronic device in which the vibration plate (335) includes a second groove (420) formed on a portion facing the third portion (P3) of the second plate (350).

6. In paragraph 1 or 2, An electronic device in which the vibration plate (335) includes a first protrusion (610) formed on a portion facing the first portion (P1) of the second plate (350).

7. In paragraph 2, An electronic device in which the above-mentioned vibration plate (335) includes a second protrusion (620) formed on a portion facing the third portion (P3) of the above-mentioned second plate (350).

8. In any one of paragraphs 1 to 7, An electronic device in which a dustproof member (348) is placed at a designated location of the above sound emission port (345).

9. In paragraph 1 or 2, An electronic device in which a first concave portion (430) is formed in the first portion (P1) of the second plate (350).

10. In paragraph 2, An electronic device in which a second concave portion (440) is formed in the third portion (P3) of the second plate (350).

11. In the speaker module (230), First plate (310); A speaker (330) arranged in the second direction of the first plate (310); A vibration plate (335) arranged in the second direction of the above speaker (330); A second plate (350) spaced apart from the above vibration plate (335) and arranged in the second direction; and It includes a sound emission port (345) formed between the above vibration plate (335) and the second plate (350), The above second plate (350) is, A speaker module comprising a first part (P1) having a first gap (g1) with the vibration plate (335) and a second part (P2) having a second gap (g2) with the vibration plate (335), wherein the first part (P1) is configured to have a thinner thickness than the second part (P2).

12. In paragraph 11, The above second plate (350) is, A speaker module including a third part (P3) having the above-mentioned vibration plate (335) and the first gap (g1).

13. In paragraph 11 or 12, A speaker module in which an elastic member (450) is arranged in the second direction of the second portion (P2) of the second plate (350).

14. In paragraph 11 or 12, A speaker module in which the above-mentioned vibration plate (335) includes a first groove (410) formed on a portion facing the first portion (P1) of the above-mentioned second plate (350).

15. In paragraph 12, A speaker module in which the above-mentioned vibration plate (335) includes a second groove (420) formed on a portion facing the third portion (P3) of the above-mentioned second plate (350).

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