Electronic device comprising molding portion

Abstract

An electronic device according to an embodiment of the present disclosure comprises: a support portion comprising at least one seating space; a window cover arranged in the seating space; a display which is arranged in the seating space and on one surface of the window cover and comprises a bending portion formed at the end portion thereof; and a molding portion which surrounds the end portion of the display, is at least partially arranged on one surface of the window cover, and is spaced apart from the inner surface of the support portion, wherein the molding portion comprises a first region which extends in a direction perpendicular to one surface of the window cover, and a second region having at least one surface formed to be inclined with respect to the first region. In addition, a first length of the first region extending from the window cover in the height direction of the electronic device may be greater than a second length that is a length from the window cover to the center of the bending portion.

Description

Electronic device including a molded part

[0001] The present disclosure relates to an electronic device including a molding portion.

[0002] An electronic device (e.g., a wearable electronic device) may include a display and a molded portion extending along the perimeter of the display. The molded portion may be formed to surround a bend portion of the display. The bend portion of the display may be a region extending from an end of the display as the display bends.

[0003] The electronic device may include a molding extending along the perimeter of the display to expand the active area, which is the area on the display where an image is displayed.

[0004] In order to improve the aesthetics of an electronic device (e.g., a wearable electronic device), when a supporting member (e.g., a housing) is formed thinly, at least a portion of an inner surface of the supporting member may be formed as an inclined surface to reinforce the rigidity of the supporting member. When at least a portion of an inner surface of the supporting member is formed as an inclined surface, a molding member located on the inner side of the supporting member may also form an inclined surface on at least a portion of the supporting member.

[0005] As the molding portion forms a slope, the straight section of the molding portion extending from the window cover may be formed short. If the straight section of the molding portion is formed too short, eddies and bubbles caused by the eddies may be formed during the molding portion formation process, resulting in a defective appearance of the molding portion.

[0006] In the process of forming a molding part, if the size of the opening (e.g., the opening for injecting the molding material) of the guide member (e.g., the silicone cap) for forming the molding part is large, the pressure applied to the opening increases, which may cause a part of the display (e.g., the bonding layer) to be excessively pressed. In addition, in the process of forming the molding part, if the molding part formed in the bending part of the display and the area opposite to the bending part have an asymmetrical shape, the pressure difference between the two parts may cause a part of the display (e.g., the bonding layer) to be excessively pressed.

[0007] An electronic device according to one embodiment of the present disclosure includes a support portion including at least one mounting space, a window cover disposed in the mounting space, a display including a bending portion disposed on one side of the mounting space and the window cover and formed at an end portion, and a molding portion surrounding an end portion of the display, at least a portion of which is disposed on one side of the window cover and spaced apart from an inner side of the support portion, wherein the molding portion includes a first region extending in a direction perpendicular to one side of the window cover and a second region having at least one side formed to be inclined with respect to the first region, and a first length of the first region, which is a length extending in a height direction of the electronic device from the window cover, may be formed longer than a second length, which is a length from the window cover to the center of the bending portion.

[0008] An electronic device according to one embodiment of the present disclosure includes a display unit including a bending unit formed at a distal end, a support unit arranged to surround an outer circumference of the display unit, and a molding unit arranged to surround the distal end of the display unit and spaced apart from an inner surface of the support unit, wherein the molding unit includes a first region extending in a direction perpendicular to one surface of the display unit and a second region including a molding unit inclined surface formed to be inclined with respect to the first region, and the support unit includes a support unit inclined surface facing the second region of the molding unit, and the first region extends from one surface of the display unit in a height direction of the electronic device to have a longer distance than a center of the bending unit, and a first angle of the molding unit inclined surface may be formed greater than a second angle of the support unit inclined surface.

[0009] An electronic device according to one embodiment of the present disclosure can reduce or prevent the generation of bubbles during the process of forming a molding portion by forming a straight section of a molding portion to a predetermined distance or more.

[0010] An electronic device according to one embodiment of the present disclosure can improve the rigidity of a support portion by forming a thickness of some areas of a support portion (e.g., a housing) thicker than other areas, thereby maintaining a thin outer thickness of the support portion while maintaining a thin outer thickness of the support portion.

[0011] An electronic device according to one embodiment of the present disclosure can reduce or prevent excessive pressing on a portion of a display during the forming process of a molding portion.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0013] FIGS. 2A and 2B are perspective views of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0015] FIGS. 4A and 4B are drawings showing a display unit, a support unit, and a rear plate according to one embodiment of the present disclosure.

[0016] FIGS. 5A and 5B are drawings showing a display unit, a support unit, and a molding unit according to one embodiment of the present disclosure.

[0017] FIG. 6a and FIG. 6b are drawings showing a state in which a guide member is arranged in a display portion during the process of forming a molding portion according to one embodiment of the present disclosure.

[0018] FIG. 7 is a drawing showing a display and a blocking unit according to one embodiment of the present disclosure.

[0019] FIGS. 8A, 8B and 8C are drawings showing the formation of a blocking portion and a molding portion according to one embodiment of the present disclosure.

[0020] FIG. 9 is a drawing showing the display portion, molding portion, and blocking portion as seen from the C-C' cross-section shown in FIG. 8c.

[0021] FIG. 10 is a drawing showing a display and a molding part according to one embodiment of the present disclosure.

[0022] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] FIG. 2a is a perspective view of the front of an electronic device (200) according to one embodiment. FIG. 2b is a perspective view of the rear of an electronic device (200) according to one embodiment.

[0045] The electronic device (200) of FIGS. 2A and 2B may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) of FIG. 1.

[0046] Referring to FIGS. 2A and 2B, an electronic device (200) according to one embodiment may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and a fastening member (250, 260) connected to at least a portion of the housing (210) and configured to detachably fasten the electronic device (200) to a part of a user's body (e.g., a wrist or ankle). The fastening member (250, 260) may be, for example, a strap that wraps around a user's wrist to secure the electronic device (200). In one embodiment (not shown), the housing may refer to a structure forming a portion of the first surface (210A), the second surface (210B), and the side surface (210C) of FIG. 2A. According to one embodiment, the first surface (210A) may be formed by a front plate (201) that is at least partially substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second surface (210B) may be formed by a back plate (207). The back plate (207) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (206) that is coupled to the front plate (201) and the back plate (207) and includes a metal and / or a polymer. In some embodiments, the back plate (207) and the side bezel structure (206) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum). The fastening members (250, 260) may be formed of various materials and shapes.The unitary and multiple unit links can be formed to be fluidly connected to each other by a woven material, leather, rubber, synthetic resin, metal, ceramic, or a combination of at least two of the above materials.

[0047] According to one embodiment, the electronic device (200) may include at least one of a display (310, see FIG. 3), an audio module (205, 208), a sensor module (211), a key input device (203, 204), and a connector hole (209). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (203, 204), the connector hole (209), or the sensor module (211)) or may additionally include other components.

[0048] The display (310, see FIG. 3) may be visually exposed, for example, through a significant portion of the front plate (201). The shape of the display (310) may correspond to the shape of the front plate (201), and may be circular, oval, or polygonal. The display (310) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0049] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). The microphone hole (205) may have a microphone disposed therein for acquiring external sounds, and in some embodiments, multiple microphones may be disposed therein to detect the direction of sounds. The speaker hole (208) may be used as an external speaker and a receiver for calls. In some embodiments, the speaker hole (208) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (208) (e.g., a piezo speaker).

[0050] The sensor module (211) can generate an electric signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (211) can include, for example, a biometric sensor module (e.g., an HRM sensor, an oxygen saturation sensor, and / or a blood glucose sensor) arranged toward the second surface (210B) of the housing (210). The electronic device (200) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0051] The key input device (203, 204) may include a side key button (203, 204) disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (203, 204), and the key input devices (203, 204) that are not included may be implemented in the form of soft keys or touch keys on the display (220). The key input device (203, 204) according to one embodiment may also include a wheel key (not shown) disposed on a first surface (210A) of the housing (210) and rotatable in at least one direction.

[0052] The connector hole (209) may include another connector hole (not shown) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and may include a connector for transmitting and receiving audio signals with the external electronic device. The electronic device (200) may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (209) and blocks the inflow of external foreign substances into the connector hole (209).

[0053] The fastening member (250, 260) can be detachably fastened to at least a portion of the housing (210) using a locking member (251, 261). The fastening member (250, 260) can include one or more of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fastening ring (255).

[0054] The fixing member (252) can be configured to fix the housing (210) and the fastening members (250, 260) to a part of the user's body (e.g., wrist, ankle). The fastening member fastening hole (253) can fix the housing (210) and the fastening members (250, 260) to a part of the user's body in response to the fastening member (252). The band guide member (254) can be configured to limit the range of motion of the fastening member (252) when the fastening member (252) is fastened to the fastening member fastening hole (253), thereby allowing the fastening members (250, 260) to be fastened in close contact with a part of the user's body. The band fixing ring (255) can limit the range of motion of the fastening members (250, 260) when the fastening member (252) and the fastening member fastening hole (253) are fastened.

[0055] FIG. 3 is an exploded perspective view of an electronic device (300) according to one embodiment of the present disclosure.

[0056] In describing an electronic device (300) according to one embodiment of the present disclosure, the width direction of the electronic device (300) may mean the X-axis direction, and the length direction of the electronic device (300) may mean the Y-axis direction. The height direction of the electronic device (300) may mean the Z-axis direction.

[0057] An electronic device (300) according to one embodiment of the present disclosure may include a display unit (310), a first support unit (320), a second support unit (330), a support member (340), a battery (350), a flexible substrate (353), a sensor unit (355), a driving unit (357), a printed circuit board (360), a rear plate (370), and / or a biosensor module (375).

[0058] The electronic device (300) of FIG. 3 may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) of FIG. 1.

[0059] The electronic device (300) of FIG. 3 may refer to the electronic device (200) of FIGS. 2A and 2B, or may include at least some of the components of the electronic device (200) of FIGS. 2A and 2B. For example, the electronic device (300) according to one embodiment may include the fastening members (250, 260) illustrated in FIGS. 2A and 2B.

[0060] At least one of the components of the electronic device (300) of FIG. 3 may be substantially identical to at least one of the components of the electronic device (200) of FIGS. 2A and 2B, and any overlapping description of components that are substantially identical to the components of the electronic device (200) of FIGS. 2A and 2B may be omitted.

[0061] In one embodiment, the display unit (310) can visually provide information to the outside of the electronic device (300). In FIG. 3, the display unit (310) is illustrated as having a circular shape, but the shape of the display unit (310) is not limited thereto and may also have an oval or polygonal shape. The display unit (310) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor, and / or a fingerprint sensor.

[0062] In one embodiment, the support (320, 330) may be substantially the same component as the housing (210) of FIGS. 2A and 2B. The support (320, 330) may be a component that forms the exterior of the electronic device (300).

[0063] In one embodiment, the support portions (320, 330) may include a first support portion (320) and / or a second support portion (330). The first support portion (320) and the second support portion (330) may be arranged to surround the periphery of the display portion (310). For example, when the display portion (310) is formed in a circular shape, the first support portion (320) may extend in a corresponding circular circumference shape and may be arranged to surround the periphery of the display portion (310).

[0064] In one embodiment, the first support member (320) may be secured to at least a portion of the second support member (330). The second support member (330) may be coupled to the fastening members (250, 260) illustrated in FIGS. 2A and 2B on one side and / or the other side.

[0065] In FIG. 3, the second support portion (330) is illustrated as being manufactured as a separate component from the first support portion (320) and placed on the first support portion (320), but this may be merely exemplary. For example, the second support portion (330) and the first support portion (320) may be a single component rather than separate, separate components. According to one embodiment, the second support portion (330) may not be manufactured as a separate component from the first support portion (320), but may be manufactured as an integral part.

[0066] In one embodiment, the support member (340) provides a space in which other components of the electronic device (300) (e.g., a battery (350)) are placed, and may serve to support the other components. In one embodiment, the support member (340) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material.

[0067] In one embodiment, the support member (340) may include a plate member (341) and / or a mounting member (342). The display unit (310) may be placed on the plate member (341). A battery (350) may be placed in a space formed inside the mounting member (342).

[0068] In one embodiment, the battery (350) may be a device for supplying power to at least one component of the electronic device (300). For example, the battery (350) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (350) may be integrally disposed within the electronic device (300), or may be detachably disposed with the electronic device (300).

[0069] In one embodiment, the flexible substrate (353) may be a flexible printed circuit board electrically connected to the key input devices (203, 204) of FIG. 2A. In one embodiment, the sensor unit (355) may detect the operating state of the electronic device (300) or an external environmental state (e.g., a user state) and generate an electrical signal or data value corresponding to the detected state. For example, the sensor unit (355) may include a barometric pressure sensor. In one embodiment, the driving unit (357) may convert the electrical signal into a stimulus that can be recognized by the user. For example, the driving unit (357) may include a motor that can convert the electrical signal into a mechanical stimulus.

[0070] In one embodiment, the printed circuit board (360) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor processor, or a communication processor.

[0071] In one embodiment, the back plate (370) may be substantially the same component as the back plate (207) of FIG. 2B. Other components of the electronic device (300), such as a printed circuit board (360), a battery (370), may be positioned within the space defined by the display portion (310), the support portions (320, 330), and the back plate (370).

[0072] In one embodiment, the biometric sensor module (375) may be substantially the same component as the sensor module (211) of FIG. 2B. The biometric sensor module (375) may include at least one sensor configured to acquire biometric information of the user (e.g., heart rate, body temperature). The biometric sensor module (375) may be disposed on one surface of the rear plate (370) (e.g., the surface facing the negative Z-axis direction).

[0073] FIG. 4a and FIG. 4b are drawings showing a display unit (310), a support unit (320, 330), and a rear plate (370) according to one embodiment of the present disclosure.

[0074] Referring to FIGS. 4A and 4B, the display portion (310) may be at least partially surrounded by the first support portion (320) and the second support portion (330).

[0075] In one embodiment, the first support member (320) may extend along the perimeter of the display member (310). For example, if the display member (310) extends in a circular perimeter shape, the first support member (320) may extend in a circular perimeter shape from the outer edge of the display member (310).

[0076] In one embodiment, the second support (330) may be disposed on at least a portion of the periphery of the display unit (310). For example, referring to FIG. 4A, the second support (330) may be disposed on one side of the display unit (310) (e.g., the positive X-axis direction side of the display unit (310)) and the other side (e.g., the negative X-axis direction side of the display unit (310)).

[0077] In one embodiment, the second support member (330) may be positioned on at least a portion of the periphery of the back plate (370). For example, referring to FIG. 4B, the second support member (330) may be positioned on one side of the back plate (370) (e.g., the positive X-axis direction side of the back plate (370)) and the other side (e.g., the negative X-axis direction side of the back plate (370)).

[0078] FIG. 5a and FIG. 5b are drawings showing a display portion (310), a support portion (320, 330), and a molding portion (380) according to one embodiment of the present disclosure.

[0079] FIG. 5A may be a drawing showing an electronic device (300) as seen from the A-A' cross-section shown in FIG. 4A. FIG. 5B may be a drawing showing an electronic device (300) as seen from the B-B' cross-section shown in FIG. 4B.

[0080] In one embodiment, the support (320, 330) may include a first support (320) and / or a second support (330).

[0081] In one embodiment, the support (320, 330) may include a mounting space (3301) in which another component of the electronic device (300) may be mounted. For example, a display (310) may be placed in a mounting space (3301) formed by the support (320, 330).

[0082] In one embodiment, the display unit (310) may include a window cover (311) and / or a display (312). The display unit (310) may be placed in a mounting space (3301).

[0083] In one embodiment, the display portion (310) may be arranged to be surrounded by the support portion (320, 330). For example, referring to FIGS. 5A and 5B, the support portion (320, 330) may be arranged to surround at least a portion of the distal end of the display portion (310).

[0084] In one embodiment, a display (312) may be disposed on one side of a window cover (311). For example, the display (312) may be disposed on a side of the window cover (311) that faces the interior of the electronic device (300) (e.g., a side facing the negative Z-axis direction).

[0085] In one embodiment, the display (312) may include at least one layer. For example, the display (312) may include a panel layer including a display panel, a protective layer for protecting the panel layer, a compensation layer for compensating for a step difference between each layer, and / or a bonding layer for bonding each layer.

[0086] In one embodiment, the display (312) may include a bend portion (312a) at a distal end. The bend portion (312a) of the display (312) may be a portion where the display panel bends and extends from a distal end of the display (e.g., an end facing the positive Y-axis direction).

[0087] In one embodiment, a molding portion (380) may be positioned at the distal end of the display (312).

[0088] In one embodiment, a molding material (e.g., resin) may be placed along the perimeter of the display portion (310) and then cured to form a molding portion (380).

[0089] In one embodiment, the molding portion (380) may be positioned to surround the distal end of the display (312). The molding portion (380) may be positioned to surround the bend portion (312a) of the display (312) and fill the inner space of the bend portion (312a) formed by the bend portion (312a).

[0090] In one embodiment, the molding portion (380) may be disposed at least partially on one surface of the window cover (311). For example, the molding portion (380) may be disposed on a surface of the window cover (311) that faces the interior of the electronic device (300) (e.g., a surface facing the negative Z-axis direction).

[0091] In one embodiment, the molding portion (380) may be positioned spaced apart from the inner surface of the first support portion (320). The inner surface of the first support portion (320) may refer to a surface of the first support portion (320) that faces the interior of the electronic device (300).

[0092] In one embodiment, the molding portion (380) may include a first region (381) and / or a second region (382).

[0093] In one embodiment, the first region (381) may be a region extending in a direction substantially perpendicular to one surface of the window cover (311). For example, an end surface (3811) of the first region (381) may extend in a direction substantially perpendicular to one surface of the window cover (311).

[0094] In one embodiment, the first region (381) may be arranged to surround the bend portion (312a) of the display (312). For example, the first region (381) may be arranged in the inner space of the bend portion (312a) and on the outer side of the bend portion (312a).

[0095] In one embodiment, a length that the first region (381) of the molding portion (380) extends in a direction substantially perpendicular to one surface of the window cover (311) (e.g., in the Z-axis direction) may vary based on a thickness of the bending portion (312a) (e.g., a length that the bending portion (312a) occupies in the Z-axis direction). For example, the first region (381) may extend longer in a direction substantially perpendicular to one surface of the window cover (311) than the center of the bending portion (312a). Referring to FIG. 5A, the first region (381) may extend from one surface of the window cover (311) by a first length (L1). The center of the bending portion (312a) may have a length of a second length (L2) from one surface of the window cover (311). The center of the bending portion (312a) may refer to the point of the bending portion (312a) that is closest to the first support portion (320) in the Y-axis direction. The first length (L1) may be formed longer than the second length (L2). For example, the first length (L1) may be approximately 0.6 mm, and the second length (L2) may be approximately 0.42 mm.

[0096] When the first length (L1) is formed to be smaller than the second length (L2), the width of the molding portion (380) (e.g., the length by which the first region (381) extends toward the first support portion (320)) becomes narrow, and a vortex is generated during the process of forming the molding portion (380), and the vortex may cause bubbles to be generated. When bubbles are generated during the process of forming the molding portion (380), it may be difficult for the molding portion (380) to be formed into a predetermined shape. The electronic device (300) according to one embodiment may form the first length (L1) to be longer than the second length (L2) to reduce or prevent the generation of bubbles.

[0097] In one embodiment, the second region (382) may be formed to be at least partially inclined relative to the first region (381). For example, the second region (382) may include a molding portion inclined surface (3821) extending in an inclined direction relative to the end face (3811) of the first region (381).

[0098] In one embodiment, the molding portion (380) may extend along the perimeter of the electronic device (300). Since the molding portion (380) extends along the perimeter of the electronic device (300), the molding portion (380) may appear in a cross-section perpendicular to the width direction of the electronic device (300) as shown in FIG. 5A and a cross-section perpendicular to the length direction of the electronic device (300) as shown in FIG. 5B, respectively.

[0099] In one embodiment, the molding portion (380) may extend substantially in the same shape along the perimeter of the electronic device (300). For example, the molding portion (380) may extend along the perimeter of the electronic device (300) with the first region (381) having the same length. For example, in the cross-sections illustrated in FIG. 5A and FIG. 5B, the first region (381) may extend from one side of the window cover (311) by a first length (L1). In the cross-sections illustrated in FIG. 5A and FIG. 5B, the molding portion slope (3821) of the second region (382) may be inclined at substantially the same angle relative to a plane parallel to the width direction and the length direction of the electronic device (300).

[0100] In one embodiment, the first support (320) and the second support (330) may extend at least partially along the height direction (e.g., the Z-axis direction) of the electronic device (300).

[0101] In one embodiment, the first support member (320) may be positioned such that at least a portion thereof faces the ends of the display member (310) and the molding member (380). For example, referring to FIGS. 5A and 5B , the first support member (320) may be positioned such that at least a portion thereof faces the display member (310) and the molding member (380) while being spaced apart from the ends of the display member (310) and the molding member (380). At least a portion of the first support member (320) facing the display member (310) and the molding member (380) may extend in a direction substantially parallel to an end surface (3811) of the molding member (380).

[0102] In one embodiment, the first support member (320) may include a support member slope (321). Referring to FIGS. 5A and 5B , the support member slope (321) may extend in an inclined direction relative to a plane parallel to the width direction and length direction of the electronic device (300) and may be a surface facing the molding member slope (3821) of the molding member (380).

[0103] In one embodiment, the molding portion inclined surface (3821) may be inclined and extended at a greater angle than the support portion inclined surface (321) with respect to a plane parallel to the width direction and length direction of the electronic device (300). For example, referring to FIG. 5A, the molding portion inclined surface (3821) may be inclined at a first angle (AG1) with respect to a plane parallel to the width direction and length direction of the electronic device (300). The support portion inclined surface (321) may be inclined at a second angle (AG2) with respect to a plane parallel to the width direction and length direction of the electronic device (300). The first angle (AG1) may be formed to be greater than the second angle (AG2). For example, the first angle (AG1) may be formed at approximately 60 degrees, and the second angle (AG2) may be formed at approximately 45 degrees.

[0104] In one embodiment, as the first angle (AG1) is formed to be greater than the second angle (AG2), the molding portion slope (3821) may form a gap greater than a predetermined distance from the support portion slope (321). For example, the molding portion slope (3821) may form a gap of approximately 0.2 mm from the support portion slope (321).

[0105] In one embodiment, the molding portion slope (3821) is positioned at a distance from the support portion slope (321), so that the first support portion (320) can be reduced or prevented from directly impacting the molding portion (380).

[0106] In one embodiment, the second support member (330) may be coupled to the molding member (380) at one end. For example, referring to FIGS. 5A and 5B , the second support member (330) may be coupled to the molding member (380) at an end facing the positive Z-axis direction.

[0107] Referring to FIGS. 5A and 5B , in one embodiment, an adhesive member (305) may be placed between the second support member (330) and the molding member (380). The second support member (330) and the molding member (380) may be joined using the adhesive member (305). The adhesive member (305) may include an adhesive material (e.g., bond, double-sided tape).

[0108] In one embodiment, at least a portion of the second support portion (330) may be positioned in a direction facing inwardly of the first support portion (320). The direction facing inwardly of the first support portion (320) may refer to a direction from the first support portion (320) toward the inside of the electronic device (300). For example, in FIG. 5A , the direction facing inwardly of the first support portion (320) may be a negative Y-axis direction, and in FIG. 5B , the direction facing inwardly of the first support portion (320) may be a negative X-axis direction.

[0109] In one embodiment, the second support (330) may include a structure for placing at least a portion of the first support (320). For example, the second support (330) may include a mounting portion (331) and / or a coupling space (333). The mounting portion (331) and the coupling space (333) may be structures for placing at least a portion of the first support (320).

[0110] Referring to FIG. 5A, the mounting portion (331) may be an area in which a portion of the second support portion (330) extends so as to protrude in a direction substantially perpendicular to the height direction of the electronic device (300) in a direction toward the first support portion (320).

[0111] Referring to FIG. 5b, the bonding space (333) may be a space formed by a part of the second support member (330) being concave in the height direction (e.g., Z-axis direction) of the electronic device (300).

[0112] In one embodiment, the first support (320) may be at least partially seated on the second support (330) and coupled with the second support (330). For example, referring to FIG. 5A, in a cross-section perpendicular to the width direction (e.g., X-axis direction) of the electronic device (300), at least a portion of the first support (320) may be seated on the seating portion (331) of the second support (330). Referring to FIG. 5B, in a cross-section perpendicular to the length direction (e.g., Y-axis direction) of the electronic device (300), at least a portion of the first support (320) may be seated on the coupling space (333) of the second support (330).

[0113] Referring to FIG. 5B, the first support portion (320) may extend longer in at least a portion of the direction toward the inside of the electronic device (300) (e.g., the negative Y-axis direction in FIG. 5A, the negative X-axis direction in FIG. 5B) than the remaining portion. For example, referring to FIG. 5B, one end of the first support portion (320) may extend a third length (L3) along the width direction (e.g., the X-axis direction) of the electronic device (300), and the other end of the first support portion (320) may extend a fourth length (L4) along the width direction (e.g., the X-axis direction) of the electronic device (300). The fourth length (L4) may be formed longer than the third length (L3). For example, the third length (L3) may be approximately 0.7 mm, and the fourth length (L4) may be approximately 1.0 mm. In one embodiment, a support slope (321) may be formed on a portion of the first support (320) as the other end of the first support (320) is relatively long.

[0114] In one embodiment, the first support portion (320) may have at least a portion thereof extended longer in a direction toward the inside of the electronic device (300) (e.g., in the negative Y-axis direction of FIG. 5A, in the negative X-axis direction of FIG. 5B) than the remaining portions, thereby improving the rigidity of the first support portion (320). In one embodiment, the first support portion (320) may have only a portion thereof extended longer in a direction toward the inside of the electronic device (300) (e.g., in the negative Y-axis direction of FIG. 5A, in the negative X-axis direction of FIG. 5B) than the other portions, so that the overall thickness of the first support portion (320) may not increase.

[0115] Referring to FIGS. 5A and 5B , the second support member (330) is illustrated as being manufactured as a separate configuration from the first support member (320) and placed on the first support member (320), but this may be exemplary. For example, according to one embodiment, the second support member (330) may be manufactured as an integral part rather than manufactured as a separate configuration from the first support member (320).

[0116] FIG. 6a and FIG. 6b are drawings showing a state in which a guide member (CAP) is placed on a display portion (310) to form a molding portion (380) according to one embodiment of the present disclosure.

[0117] In order to form a molding part (380) in the electronic device (300) during the manufacturing process according to one embodiment, a guide member (CAP) may be placed in the display part (310) to guide the formation of the molding part (380).

[0118] FIGS. 6A and 6B may be drawings showing a state in which a guide member (CAP) is temporarily placed on a display member (310) for forming a molding member (380). The guide member (CAP) guides a position where the molding member (380) is formed, and may be a member that is removed after the formation of the molding member (380) on the electronic device (300) is completed. In one embodiment, the guide member (CAP) may include silicone.

[0119] In one embodiment, the guide member (CAP) may serve to guide the injection and discharge of a molding material (e.g., resin) for forming the molding portion (380) into and out of at least a portion of the display portion (310). For example, a molding material having flowability may be placed along the perimeter of the display portion (310) through the guide member (CAP) and then cured to form the molding portion (380).

[0120] In one embodiment, the guide member (CAP) may include an inlet opening (HL1) and / or an outlet opening (HL2). A molding material for forming the molding portion (380) may be injected toward the display portion (310) through the inlet opening (HL1) of the guide member (CAP). The molding material injected through the inlet opening (HL1) may move along the flow direction (FL) along the periphery of the display portion (310) and may be discharged to the outside of the display portion (310) through the outlet opening (HL2).

[0121] The size of the inlet opening (HL1) of the guide member (CAP) used in the process of manufacturing the electronic device (300) according to one embodiment of the present disclosure may be formed smaller than the size of the opening of a conventional guide member. For example, the diameter of the inlet opening (HL1) of the guide member (CAP) used in the process of manufacturing the electronic device (300) according to one embodiment may be 0.7 mm, and the diameter of the opening of the conventional guide member may be 1.0 mm. The size of the inlet opening (HL1) of the guide member (CAP) is relatively reduced, and excessive pressure applied to a portion of the display (312) (e.g., an optical clear adhesive (OCA)) by the molding material injected into the inlet opening (HL1) may be reduced or prevented.

[0122] During the process of injecting the molding material to form the molding portion (380), bubbles may be formed. For example, referring to FIGS. 6A and 6B , bubbles may be formed around the discharge opening (HL2) during the process of forming the molding portion (380). If bubbles are formed, it may be difficult to form the molding portion (380) into a predetermined shape.

[0123] In one embodiment, the electronic device (300) may be configured to have a relatively large amount of molding material injected into the molding portion (380) to reduce or prevent the formation of bubbles during the manufacturing process of the electronic device (300). When a relatively large amount of molding material is injected, the molding material may flow into the interior of the display layer (312, see FIG. 8A). The electronic device (300) may include a structure (e.g., a blocking portion (390), see FIG. 8B) that prevents the molding material from moving into the interior of the display layer (312, see FIG. 8A).

[0124] FIG. 7 is a drawing showing a display (312) and a blocking portion (390) according to one embodiment of the present disclosure.

[0125] FIG. 7 is a drawing showing a blocking member (390) arranged on a display (312) according to one embodiment.

[0126] In one embodiment, the blocking member (390) may serve to reduce or prevent a portion of the molding member (380) from penetrating into the display (312) during the forming process of the molding member (380).

[0127] Referring to FIG. 7, the blocking portion (390) may be formed so that at least a portion thereof faces at least a portion of the molding portion (380). For example, the blocking portion (390) may be formed such that one side (390a) faces at least a portion of the molding portion (380) and is relatively long compared to other areas of the blocking portion (390).

[0128] In one embodiment, two blocking portions (390) may be formed on the display (312). The two blocking portions (390) may be formed at positions symmetrical with respect to an imaginary center line (M) passing through the widthwise center point of the electronic device (300).

[0129] The S region illustrated in FIG. 7 may refer to a region of the molding portion (380) where the bending portion (312a, see FIG. 5a) of the display (312) is located. The two blocking portions (390) may be formed at positions symmetrical to each other with respect to the S region.

[0130] FIG. 8a, FIG. 8b and FIG. 8c are drawings showing the formation of a blocking portion (390) and a molding portion (380) according to one embodiment of the present disclosure.

[0131] FIG. 9 is a drawing showing the display portion (310), the molding portion (380), and the blocking portion (390) as viewed from the C-C' cross-section shown in FIG. 8c.

[0132] FIGS. 8A, 8B, and 8C are enlarged views of the T region illustrated in FIG. 7. FIG. 8A is a view showing the display unit (310) before the blocking unit (390) and the molding unit (380) are formed according to one embodiment. FIG. 8B is a view showing a state in which the blocking unit (390) is formed on the display unit (310) according to one embodiment. FIG. 8C is a view showing a state in which the blocking unit (390) and the molding unit (380) are formed on the display unit (310) according to one embodiment.

[0133] In one embodiment, the display (312) may include at least one layer. For example, referring to FIGS. 8A, 8B, and 8C, the display (312) may include a first cover layer (3121), a panel layer (3122), a substrate layer (3123), and / or a second cover layer (3124). The first cover layer (3121) may be a bonding layer for bonding each layer inside the display (312) and / or a protective layer for protecting the display panel. The panel layer (3122) may be a display panel. The panel layer (3122) illustrated in FIGS. 8A, 8B, and 8C may be an area located in a bendable and extending area of ​​the display panel (e.g., a bending portion (312a, see FIG. 5A)). The substrate layer (3123) may be a layer including a flexible printed circuit board electrically connected to the panel layer (3122). The second cover layer (3124) may be a layer that covers and protects at least a portion of the panel layer (3122) and the substrate layer (3123).

[0134] In the process of forming the molding portion (380) around the display portion (310), a portion of the molding portion (380) may be moved into the interior of the display (312). For example, referring to FIG. 8A, a portion of the molding portion (380) may be moved along the penetration direction (IN) and introduced between each layer (e.g., 3121, 3122, 3123, etc.) of the display (312).

[0135] In one embodiment, the blocking portion (390) may be formed at least partially within the display (312). For example, the blocking portion (390) may be formed at least partially between each layer (e.g., 3121, 3122, 3123, 3124) of the display (312).

[0136] In one embodiment, the blocking member (390) may serve to reduce or prevent the molding member (380) from flowing into the display (312). The blocking member (390) may reduce or prevent a portion of the molding member (380) from moving in the infiltration direction (IN).

[0137] In one embodiment, the barrier (390) may include a curable, fluid material. For example, the barrier (390) may include an ultra violet (UV) acrylic adhesive. The barrier (390) may be formed easily between each layer of the display (312) by including the fluid material.

[0138] In one embodiment, the blocking portion (390) may be positioned such that at least a portion thereof faces at least a portion of the molding portion (380). For example, referring to FIG. 8C, one side (390a) of the blocking portion (390) may be formed to face the molding portion (380). The one side (390a) of the blocking portion (390) may be a region that extends relatively long in one direction compared to other regions of the blocking portion (390).

[0139] Referring to FIG. 9, a blocking portion (390) according to one embodiment may be formed at a distance from a molding portion (380). The blocking portion (390) may be formed at a distance in the inner direction of the molding portion (380) (e.g., in the direction from the molding portion (380) toward the inside of the electronic device (300).

[0140] Referring to FIG. 9, the blocking portion (390) may be formed to overlap at least a portion of the display (312). For example, the blocking portion (390) may be formed to overlap at least a portion of the first cover layer (3121) and the panel layer (3122).

[0141] FIG. 10 is a drawing showing a display (312) and a molding part (380) according to one embodiment of the present disclosure.

[0142] Referring to FIG. 10, a molding portion (380) according to one embodiment may extend along the perimeter of the display (312).

[0143] In one embodiment, the molding portion (380) may include a first molding surface (380a), a second molding surface (380b), a first molding region (380c), and / or a second molding region (380d).

[0144] In one embodiment, the first molding surface (380a) may be a surface of a molding portion (380) formed in an area where a bending portion (312a, see FIG. 5A) of the display (312) is located. The first molding surface (380a) may extend in a direction substantially parallel to the width direction (e.g., X-axis direction) of the electronic device (300).

[0145] In one embodiment, the second molding surface (380b) may be a surface of a molding portion (380) formed on the opposite side of the first molding surface (380a). For example, the second molding surface (380b) may be a surface of a molding portion (380) formed on the opposite side of the first molding surface (380a) with respect to the display (312).

[0146] In one embodiment, the second molding surface (380b) may be formed to have substantially the same shape as the first molding surface (380a). For example, the second molding surface (380b) may extend in a direction substantially parallel to the width direction (e.g., X-axis direction) of the electronic device (300). The second molding surface (380b) may be formed to be parallel to the first molding surface (380a).

[0147] In one embodiment, when the first molding surface (380a) and the second molding surface (380b) are formed to have substantially the same shape, pressure can be prevented from being concentrated in a portion of the molding part (380) (e.g., a portion adjacent to the first molding surface (380a)). Pressure can be prevented from being concentrated in a portion of the molding part (380) (e.g., a portion adjacent to the first molding surface (380a)), and excessive pressing of a portion of the display (312) (e.g., an optical clear adhesive (OCA) positioned around the bending part (312a)) can be reduced or prevented.

[0148] In one embodiment, the first molding region (380c) may be an area of ​​a molding part (380) formed at a position corresponding to the inlet opening (HL1) of FIG. 6b. The second molding region (380d) may be an area of ​​a molding part (380) formed at a position corresponding to the discharge opening (HL2) of FIG. 6b.

[0149] In one embodiment, the size of the inlet opening (HL1, FIG. 6b) of the guide member (CAP, see FIG. 6b) positioned at a position corresponding to the first molding area (380c) during the forming process of the molding portion (380) may be formed smaller than the size of the opening in a conventional guide member.

[0150] In one embodiment, the first molding region (380c) may correspond to the discharge opening (HL2) of FIG. 6B, and the second molding region (380d) may correspond to the inlet opening (HL1) of FIG. 6B. In this case, the size of the inlet opening (HL1) positioned at a position corresponding to the second molding region (380d) may be formed smaller than the size of the opening in a conventional guide member.

[0151] An electronic device (300) according to one embodiment of the present disclosure may include a support portion (320, 330) including at least one mounting space (3301), a window cover (311) disposed in the mounting space (3301), a display (312) disposed on one surface of the mounting space (3301) and the window cover (311) and including a bending portion (312a) formed at an end portion, and a molding portion (380) surrounding an end portion of the display (312), at least a portion of which is disposed on one surface of the window cover (311), and spaced apart from an inner surface of the support portion (320, 330).

[0152] A molding portion (380) according to one embodiment of the present disclosure may include a first region (381) extending in a direction perpendicular to one surface of a window cover (311) and a second region (382) having at least one surface formed to be inclined with respect to the first region (381).

[0153] In one embodiment, the first length (L1), which is the length that the first region (381) extends in the height direction of the electronic device (300) from the window cover (311), may be formed longer than the second length (L2), which is the length from the window cover (311) to the center of the bending portion (312).

[0154] In one embodiment, the support member (320, 330) may be formed to extend so as to be inclined relative to the window cover (311) and may include a support member inclined surface (321) facing the second area (382) of the molding member (380).

[0155] In one embodiment, the second region (382) of the molding portion (380) may include a molding portion slope (3821) facing the support portion slope (321).

[0156] In one embodiment, the first angle (AG1) of the molding portion slope (3821) may be formed to be greater than the second angle (AG2) of the support portion slope (321).

[0157] In one embodiment, the molding portion (380) may be formed to extend along the perimeter of the electronic device (300) and spaced apart from the inner surface of the support portion (320, 330).

[0158] In one embodiment, the display (312) may include a panel layer (3122) including a display panel, a first cover layer (3121) disposed in one direction of the panel layer (3122), and a second cover layer (3124) disposed in the other direction of the panel layer (3122).

[0159] In one embodiment, the electronic device (300) may include a barrier (390) formed between at least a portion of the panel layer (3122), the first cover layer (3121), and the second cover layer (3124).

[0160] In one embodiment, the blocking member (390) can block a portion of the molding member (380) from flowing into the interior of the display (312) during the forming process of the molding member (380).

[0161] In one embodiment, the blocking portion (390) may extend such that at least a portion thereof faces at least a portion of the molding portion (380).

[0162] In one embodiment, the support portion (320, 330) may include a first support portion (320) spaced apart from the molding portion (380) and a second support portion (330) on which at least a portion of the first support portion (320) is secured.

[0163] In one embodiment, the first support portion (320, 330) may extend longer in at least some areas toward the inside of the electronic device (300) than the remaining areas.

[0164] In one embodiment, the second support member (330) may extend so as to protrude in a direction perpendicular to the height direction of the electronic device (300) toward the first support member (320) and may include a mounting member (331) on which at least a portion of the first support member (320) is mounted.

[0165] In one embodiment, the first support (320) and the second support (330) may be manufactured and formed integrally.

[0166] In one embodiment, an adhesive member (305) may be disposed between the second support member (330) and the molding member (380) and may be included to bond the second support member (330) and the molding member (380).

[0167] In one embodiment, the molding portion (380) may include a first molding surface (380a), which is a surface of the molding portion (380) formed in an area where the bending portion (312a) of the display (312) is located, and a second molding surface (380b) formed on the opposite side of the first molding surface (380a).

[0168] In one embodiment, the first molding surface (380a) and the second molding surface (380b) may be formed parallel to each other.

[0169] In one embodiment, the electronic device (300) may be a wearable electronic device that can be attached to a part of the user's body.

[0170] An electronic device (300) according to one embodiment of the present disclosure includes a display unit (310) including a bending unit (312a) formed at an end portion, a support unit (320, 330) arranged to surround the outer periphery of the display unit (310), and a molding unit (380) arranged to surround the end portion of the display unit (310) and spaced apart from the inner surface of the support unit (320, 330), and the molding unit (380) includes a first region (381) extending in a direction perpendicular to one surface of the display unit (310) and a second region (382) including a molding unit inclined surface (3821) formed to be inclined with respect to the first region (381), and the support unit (320, 330) includes a support unit inclined surface (321) facing the second region of the molding unit (380), and the first region (381) It may be extended from one side of the display portion (310) to have a longer distance than the center of the bending portion (312a) in the height direction of the electronic device (300), and the first angle (AG1) of the molding portion slope (3821) may be formed to be larger than the second angle (AG2) of the support portion slope (321).

[0171] In one embodiment, the display unit (310) may include a window cover (311) disposed at the outermost portion of the display unit (310).

[0172] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0173] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0174] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0175] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0176] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0177] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0178] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A support (320, 330) including at least one settling space (3301); A window cover (311) placed in the above-mentioned settling space; A display (312) disposed on one side of the above-mentioned settling space and the above-mentioned window cover and including a bending portion (312a) formed at the end; and A molding part (380) is included, which surrounds the end of the display, at least a portion of which is disposed on one side of the window cover, and is disposed spaced apart from the inner side of the support part. The above molding part, A first region (381) extending in a direction perpendicular to one side of the above window cover; and At least one side includes a second region (382) formed at an angle to the first region, An electronic device in which a first length (L1), which is a length extending from the window cover in the height direction of the electronic device, is formed longer than a second length (L2), which is a length from the window cover to the center of the bending portion.

2. In paragraph 1, The above support part, An electronic device including a support slope (321) formed to extend so as to be inclined based on the window cover and facing the second region of the molding part.

3. In paragraph 2, The second region of the above molding part is, Includes a molding part slope (3821) facing the above support part slope, An electronic device in which the first angle (AG1) of the inclined surface of the molding portion is formed larger than the second angle (AG2) of the inclined surface of the support portion.

4. In paragraph 1, The above molding part, An electronic device formed by extending along the periphery of the electronic device while being spaced apart from the inner surface of the support member.

5. In paragraph 1, The above display is, A panel layer (3122) including a display panel; A first cover layer (3121) arranged in one direction of the above panel layer; and It includes a second cover layer (3124) arranged in the other direction of the above panel layer, An electronic device further comprising a blocking portion (390) formed between at least a portion of the panel layer, the first cover layer and the second cover layer.

6. In paragraph 5, The above blocking part is, An electronic device that blocks a portion of the molding portion from flowing into the interior of the display during the forming process of the molding portion.

7. In paragraph 5, The above blocking part is, An electronic device wherein at least a portion of the device extends to face at least a portion of the molded portion.

8. In paragraph 1, The above support part, A first support member (320) arranged at a distance from the molding member; and An electronic device comprising a second support member (330) on which at least a portion of the first support member is secured.

9. In paragraph 8, The above first support An electronic device wherein at least a portion of the electronic device extends longer than the remaining portion in a direction facing inwardly toward the electronic device.

10. In paragraph 8, The above second support member, An electronic device including a mounting portion (331) that extends so as to protrude in a direction perpendicular to the height direction of the electronic device toward the first support portion and on which at least a portion of the first support portion is mounted.

11. In paragraph 8, The above first support part and the above second support part, An electronic device characterized by being manufactured and formed integrally.

12. In paragraph 8, An electronic device further comprising an adhesive member (305) disposed between the second support member and the molding member and connecting the second support member and the molding member.

13. In paragraph 1, The above molding part, A first molding surface (380a), which is a surface of the molding part formed in an area where the bending part of the display is located; and It includes a second molding surface (380b) formed on the opposite side of the first molding surface, An electronic device in which the first molding surface and the second molding surface are formed parallel to each other.

14. In paragraph 1, The above electronic device, An electronic device characterized by being a wearable electronic device that can be attached to a part of a user's body.

15. In wearable electronic devices, A display portion (310) including a bending portion (312a) formed at a distal end; A support member (320, 330) arranged to surround the periphery of the above display unit; and It includes a molding part (380) arranged to surround the end of the display part and spaced apart from the inner surface of the support part. The above molding part, A first region (381) extending in a direction perpendicular to one side of the display portion; and It includes a second region (382) including a molding part slope (3821) formed at an angle with the first region, The above support part, It includes a support slope (321) facing the second area of ​​the above molding part, The first region extends from one side of the display portion to a greater distance than the center of the bending portion in the height direction of the electronic device, A wearable electronic device in which the first angle (AG1) of the inclined surface of the molding portion is formed larger than the second angle (AG2) of the inclined surface of the support portion.

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