Display panel, display apparatus and manufacturing method for display panel

Abstract

Disclosed in the present application are a display panel, a display apparatus and a manufacturing method for a display panel. The display panel comprises a substrate, an isolation layer, a light-emitting layer, a first electrode layer, an encapsulation layer, a conductive layer and an anti-oxidation layer. Isolation openings defined by isolation parts are used for arranging light-emitting units, so as to achieve light-emitting display of the display panel. The orthographic projections of the light-emitting units on the substrate are located within the orthographic projections of first electrodes on the substrate, that is, the first electrodes cover the light-emitting units so as to serve as electrodes of the light-emitting units. The encapsulation layer is arranged on the side of the first electrode layer facing away from the substrate. The orthographic projections of conductive parts on the substrate are located within the orthographic projections of anti-oxidation parts on the substrate. The conductive layer is located on the side of a first sub-layer facing away from the substrate and comprises the conductive parts, the conductive parts being electrically connected to the first electrodes by means of via holes, such that the first electrodes and the conductive parts are arranged in parallel, so as to reduce the overall resistance of the first electrodes and the conductive parts, thus reducing the power consumption of the first electrodes, and improving the display effect of the display panel.

Description

Display panel, display device, and method for manufacturing display panel

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202310934795.2, filed on July 27, 2023, entitled “Display Panel, Display Device, and Method for Preparing Display Panel,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of display, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0004] With the rapid development of electronic devices, users have higher and higher requirements for display effects, making the screen display of electronic devices receive more and more attention in the industry.

[0005] In related art, electronic devices use organic light emitting diode (OLED) display panels for light display. However, the metal layer in the OLED display panel is easily oxidized, which affects the performance of the display panel.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the problem of easy oxidation of the metal layer.

[0008] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation layer located on the substrate, the isolation layer comprising an isolation portion and an isolation opening enclosed by the isolation portion; a light-emitting layer comprising a light-emitting unit located in each isolation opening; a first electrode layer located on a side of the light-emitting layer facing away from the substrate, the first electrode layer comprising a first electrode, the orthographic projection of the light-emitting unit on the substrate being located within the orthographic projection of the first electrode on the substrate; an encapsulation layer located on a side of the first electrode layer facing away from the substrate, the encapsulation layer comprising a first sublayer; a conductive layer located on a side of the first sublayer facing away from the substrate, the conductive layer comprising a conductive portion, the conductive portion being connected to the first electrode via; an anti-oxidation layer located on a side of the conductive layer facing away from the substrate, the anti-oxidation layer comprising an anti-oxidation portion, the orthographic projection of the conductive portion on the substrate being located within the orthographic projection of the anti-oxidation portion on the substrate.

[0009] According to an embodiment of the first aspect of the present application, the orthographic projection of the conductive portion on the substrate is at least partially located within the orthographic projection of the isolation portion on the substrate, the conductive portion is mesh-shaped, and the conductive portion includes a metallic conductive material.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the encapsulation layer includes a second sublayer and a third sublayer, wherein: the second sublayer is located on the side of the first sublayer facing away from the substrate, and the conductive layer is located between the first sublayer and the second sublayer; the third sublayer is located on the side of the second sublayer facing away from the substrate;.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the first sublayer includes an inorganic material, the second sublayer includes an organic material, the third sublayer includes an inorganic material, and the anti-oxidation layer includes an inorganic material or an organic material.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the conductive part on the substrate and the orthographic projection of the anti-oxidation part on the substrate coincide with each other, the conductive part includes a side facing the isolation opening, and the anti-oxidation part covers at least part of the side of the conductive part, wherein: the anti-oxidation layer is made of the same material as the first sub-layer.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: an isolation structure, which is located on the substrate and encloses a plurality of isolation openings, the isolation structure includes a first layer, each light-emitting unit and each first electrode is located in the isolation opening, the first electrode is electrically connected to the first layer, and the plurality of mutually spaced first electrodes are all connected to the conductive portion vias, the isolation structure also includes a second layer located on the side of the first layer away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation portion includes a pixel defining portion, the isolation opening includes a pixel opening formed by enclosing the pixel defining portion, and the isolation portion further includes an isolation structure, and the isolation structure is located on the substrate. According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive portion on the substrate are at least partially offset, the isolation structure is located on a side of the isolation portion facing away from the substrate, the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the pixel defining portion on the substrate, a clearance opening is provided on the isolation portion, and the isolation structure is located in the clearance opening.

[0015] An embodiment of the second aspect of the present application provides another display panel, comprising: a substrate; a light-emitting layer, located on one side of the substrate, comprising a plurality of light-emitting units; a first electrode layer, located on the side of the light-emitting layer facing away from the substrate, comprising at least one first electrode, the orthographic projection of the light-emitting unit on the substrate being located within the orthographic projection of the first electrode on the substrate; an encapsulation layer, located on the side of the first electrode layer facing away from the substrate, comprising a first sublayer, the first sublayer comprising at least one via; a conductive layer, located on the side of the first sublayer facing away from the substrate, comprising at least one conductive portion, the at least one conductive portion being connected to the first electrode through at least one via; an anti-oxidation layer, located on the side of the conductive layer facing away from the substrate, comprising at least one anti-oxidation portion, the orthographic projection of the at least one conductive portion on the substrate being located within the orthographic projection of the at least one anti-oxidation portion on the substrate.

[0016] According to an embodiment of the second aspect of the present application, at least one conductive part includes multiple conductive parts corresponding to multiple light-emitting units, at least one via includes multiple vias corresponding to the multiple conductive parts, and at least one anti-oxidation part includes multiple anti-oxidation parts corresponding to the multiple conductive parts, wherein: the conductive part is connected to at least one first electrode through the corresponding via; the orthographic projection of the conductive part on the substrate is located within the orthographic projection of the corresponding anti-oxidation part on the substrate.

[0017] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel also includes a pixel defining portion, which encloses a plurality of pixel openings, and the light-emitting unit is located in the corresponding pixel openings, wherein: the orthographic projection of the anti-oxidation portion on the substrate is located on the side of the pixel defining portion facing the conductive layer and is within the orthographic projection of the substrate; the orthographic projection of the conductive portion on the substrate is located on the side of the pixel defining portion facing the conductive layer and is within the orthographic projection of the substrate.

[0018] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel also includes an isolation structure, the isolation structure encloses a plurality of isolation openings, the light-emitting units are located in the corresponding isolation openings, and at least one first electrode includes a plurality of first electrodes corresponding to the plurality of light-emitting units, wherein: the first sublayer includes a plurality of first packaging portions, the first packaging portion is located on a side of the corresponding first electrode away from the light-emitting unit and extends to a side of the isolation structure away from the substrate; the via is located on the corresponding first packaging portion, and the conductive portion is connected to the corresponding first electrode through the corresponding via.

[0019] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel also includes a pixel defining portion, which encloses a plurality of pixel openings, and the pixel openings are connected to corresponding isolation openings, wherein: the isolation structure is located on the side of the pixel defining portion facing away from the substrate, the orthographic projection of the via on the substrate is located on the side of the pixel defining portion facing the conductive layer and is within the orthographic projection of the substrate, and the orthographic projection of the via on the substrate is located on the side of the isolation structure facing the pixel defining portion and is outside the orthographic projection of the substrate.

[0020] According to any of the aforementioned embodiments of the second aspect of the present application, the encapsulation layer also includes a second sublayer and a third sublayer, wherein: the second sublayer is located on the side of the first sublayer facing away from the substrate, and the second sublayer covers multiple anti-oxidation parts and multiple conductive parts; the third sublayer is located on the side of the second sublayer facing away from the substrate; the first sublayer includes inorganic material, the second sublayer includes organic material, the third sublayer includes inorganic material, the anti-oxidation layer includes inorganic material or organic material, and the conductive part includes metal conductive material.

[0021] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the conductive part on the substrate and the orthographic projection of the anti-oxidation part on the substrate coincide with each other, the anti-oxidation part includes a first top surface facing away from the substrate and a first side surface surrounding the first top surface, and the conductive part includes a second side surface coplanar with the first side surface, wherein: the second sublayer covers the first top surface, the first side surface, the second side surface and the side of the first sublayer facing away from the substrate; the multiple conductive parts are in a mesh shape; the anti-oxidation layer and the first sublayer are made of the same material, and the conductive part includes a transparent conductive material.

[0022] According to any of the aforementioned embodiments of the second aspect of the present application, the display panel further includes a blocking layer, and the encapsulation layer further includes a fourth sublayer, wherein: the blocking layer is located on the side of the anti-oxidation layer facing away from the substrate, and includes multiple blocking portions corresponding to the multiple anti-oxidation portions, and the orthographic projection of the anti-oxidation portion on the substrate is located within the orthographic projection of the corresponding blocking portion on the substrate; the fourth sublayer is located on the side of the first sublayer facing away from the substrate, and the fourth sublayer covers multiple blocking portions, multiple anti-oxidation portions and multiple conductive portions.

[0023] According to any of the aforementioned embodiments of the second aspect of the present application, the orthographic projection of the conductive part on the substrate, the orthographic projection of the anti-oxidation part on the substrate and the orthographic projection of the blocking part on the substrate coincide with each other, the blocking part includes a second top surface facing away from the substrate and a third side surface surrounding the second top surface, the anti-oxidation part includes a first side surface coplanar with the third side surface, and the conductive part includes a second side surface coplanar with the first side surface, wherein: the fourth sublayer covers the second top surface, the first side surface, the second side surface, the third side surface and the side of the first sublayer facing away from the substrate; the materials of the fourth sublayer, the anti-oxidation layer and the first sublayer include silicon compounds, the material of the blocking layer includes indium tin oxide, and / or indium zinc oxide, the material of the conductive layer includes titanium, and / or aluminum, and / or molybdenum, and / or copper; the materials of the fourth sublayer, the anti-oxidation layer and the first sublayer are the same.

[0024] According to any of the aforementioned embodiments of the second aspect of the present application, at least one via includes multiple vias corresponding to multiple light-emitting units, and the encapsulation layer also includes a fifth sublayer, wherein: at least one conductive portion includes a conductive portion, the conductive portion continuously covers the multiple vias and is connected to the at least one first electrode through the multiple vias; the fifth sublayer covers the side of the at least one conductive portion facing away from the substrate.

[0025] According to any of the aforementioned embodiments of the second aspect of the present application, the material of the conductive part includes indium tin oxide and / or indium zinc oxide, and the material of the first sublayer and the fifth sublayer includes a silicon compound.

[0026] An embodiment of a third aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0027] An embodiment of a fourth aspect of the present application provides a method for manufacturing a display panel, including:

[0028] preparing an isolation layer on the substrate, the isolation layer comprising an isolation portion and an isolation opening enclosed by the isolation portion;

[0029] A light-emitting layer is prepared on a side of the isolation layer facing away from the substrate, wherein the light-emitting layer includes light-emitting units located in each isolation opening;

[0030] A first electrode layer is formed on the side of the light-emitting layer facing away from the substrate, wherein the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate;

[0031] preparing an encapsulation layer on a side of the first electrode layer facing away from the substrate, the encapsulation layer comprising a first sublayer;

[0032] A conductive layer is prepared on a side of the first sublayer facing away from the substrate, wherein the conductive layer includes a conductive portion connected to the first electrode via;

[0033] An anti-oxidation layer is prepared on the side of the conductive layer facing away from the substrate. The anti-oxidation layer includes an anti-oxidation portion. The orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the anti-oxidation portion on the substrate.

[0034] According to an embodiment of the fourth aspect of the present application, after the step of preparing a first electrode layer on a side of the light-emitting layer facing away from the substrate, the method further includes:

[0035] preparing a first sub-material layer on a side of the first electrode layer facing away from the substrate, and patterning the first sub-material layer to obtain a first sub-layer, wherein the first sub-layer includes a via hole;

[0036] A conductive layer is prepared on a side of the first sublayer facing away from the substrate, the conductive layer including a conductive portion, and the conductive portion is connected to the first electrode through a via hole; after the step of preparing the conductive layer on the side of the first sublayer facing away from the substrate, the method further includes:

[0037] preparing an anti-oxidation material layer on a side of the conductive layer facing away from the substrate, and sequentially etching the anti-oxidation material layer and the conductive layer using the same mask to form a conductive portion and an anti-oxidation layer, wherein the anti-oxidation layer includes the anti-oxidation portion, and an orthographic projection of the conductive portion on the substrate coincides with an orthographic projection of the anti-oxidation portion on the substrate;

[0038] Before the step of sequentially etching the anti-oxidation material layer and the conductive layer using the same mask, the method further includes: preparing a barrier material layer on a side of the anti-oxidation material layer facing away from the substrate, and patterning the barrier material layer to obtain a barrier portion, wherein an orthographic projection of the barrier portion on the substrate is located within an orthographic projection of the isolation portion on the substrate;

[0039] The step of sequentially etching the anti-oxidation material layer and the conductive layer using the same mask comprises: sequentially dry etching the anti-oxidation material layer and the conductive layer using the barrier portion as a mask, the anti-oxidation layer including the anti-oxidation portion, and an orthographic projection of the barrier portion on the substrate and an orthographic projection of the anti-oxidation portion on the substrate coinciding with each other;

[0040] The step of preparing a conductive layer on the side of the first sub-layer facing away from the substrate includes: preparing a full-surface conductive layer on the side of the first sub-layer facing away from the substrate;

[0041] The step of preparing an anti-oxidation layer on the side of the conductive layer facing away from the substrate includes: preparing an entire anti-oxidation layer on the side of the conductive layer facing away from the substrate.

[0042] According to the display panel of the embodiment of the present application, the display panel includes a substrate, an isolation layer, a light-emitting layer, a first electrode layer, an encapsulation layer, a conductive layer and an anti-oxidation layer. The isolation opening formed by the isolation portion is used to set the light-emitting unit to realize the light-emitting display of the display panel. The orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate, that is, the first electrode covers the light-emitting unit to serve as the electrode of the light-emitting unit. The encapsulation layer is arranged on the side of the first electrode layer away from the substrate to encapsulate the first electrode layer and the light-emitting layer, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel. The orthographic projection of the conductive part on the substrate is located within the orthographic projection of the anti-oxidation part on the substrate, that is, the anti-oxidation part of the anti-oxidation layer covers at least part of the surface of the conductive part, so as to improve the problem that water and oxygen enter the first electrode layer during the process of etching the via hole in the first sub-layer, thereby oxidizing and corroding the first electrode and reducing the conductivity of the first electrode, and ensure the electrical connection between the first electrode and the conductive part. The conductive layer is located on the side of the first sublayer away from the substrate and includes a conductive part. The conductive part is electrically connected to the first electrode through a via, so that the first electrode and the conductive part are arranged in parallel, reducing the overall resistance of the first electrode and the conductive part, thereby reducing the power consumption of the first electrode and improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0044] FIG1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0045] FIG2 is a partial top view of a display panel provided in an embodiment of the present application;

[0046] FIG3 is a partial cross-sectional view of a display panel in another embodiment;

[0047] FIG4 is a partial cross-sectional view of a display panel in yet another embodiment;

[0048] FIG5 is a partial cross-sectional view of a display panel in yet another embodiment;

[0049] FIG6 is a partial cross-sectional view of a display panel in yet another embodiment;

[0050] FIG7 is a partial cross-sectional view of a display panel in yet another embodiment;

[0051] FIG8 is a partial cross-sectional view of a display panel in another embodiment;

[0052] FIG9 is a partial cross-sectional view of a display panel in yet another embodiment;

[0053] FIG10 is a partial cross-sectional view of a display panel in yet another embodiment;

[0054] FIG11 is a partial cross-sectional view of a display panel in yet another embodiment;

[0055] FIG12 is a partial cross-sectional view of a display panel in yet another embodiment;

[0056] FIG13 is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application.

[0057] DESCRIPTION OF NUMERALS AND REFERENCE NUMERALS: 10. Display panel; 100. Substrate; 200. Isolation layer; 210. Isolation portion; 220. Isolation opening; 300. Light-emitting layer; 310. Light-emitting unit; 400. First electrode layer; 410. First electrode; 500. Conductive layer; 510. Conductive portion; 511. Second side surface; 600. Encapsulation layer; 610. First sublayer; 611. First encapsulation portion; 620. Second sublayer; 630. Third sublayer; 640. Fourth sublayer; 700. Anti-oxidation layer; 710. Anti-oxidation portion; 711. First top surface; 712. First side surface; 720. Blocking portion; 721. Second top surface; 722. Third side surface; 800. Protective layer; 900. Isolation structure; 910. First layer; 920. Second layer; 930. Pixel defining portion; 940, pixel opening; 950, give way opening; 960, pixel electrode. DETAILED DESCRIPTION

[0058] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0059] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0060] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0061] Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Hereinafter, various embodiments of the display panel, the display device, and the method for manufacturing a display panel will be described with reference to the accompanying drawings.

[0062] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0063] Please refer to FIG. 1 , which is a partial cross-sectional view of a display panel provided in an embodiment of the present application.

[0064] As shown in FIG1 , a first embodiment of the present application provides a display panel 10, which includes a substrate 100, an isolation layer 200, a light-emitting layer 300, a first electrode layer 400, an encapsulation layer 600, a conductive layer 500, and an anti-oxidation layer 700; the isolation layer 200 is located on the substrate 100, and the isolation layer 200 includes an isolation portion 210 and an isolation opening 220 formed by the isolation portion 210; the light-emitting layer 300 includes a light-emitting unit 310 located in each isolation opening 220; the first electrode layer 400 is located on the side of the light-emitting layer 300 facing away from the substrate 100, and the first electrode layer 400 includes a first electrode 410, and the light-emitting unit 310 The orthographic projection of the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100; the encapsulation layer 600 is located on the side of the first electrode layer 400 facing away from the substrate 100, and the encapsulation layer 600 includes a first sublayer 610; the conductive layer 500 is located on the side of the first sublayer 610 facing away from the substrate 100, and the conductive layer 500 includes a conductive portion 510, which is connected to the first electrode 410 via a via; the anti-oxidation layer 700 is located on the side of the conductive layer 500 facing away from the substrate 100, and the anti-oxidation layer 700 includes an anti-oxidation portion 710, and the orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation portion 710 on the substrate 100.

[0065] According to an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation layer 200, a light-emitting layer 300, a first electrode layer 400, and a conductive layer 500. The isolation opening 220 formed by the isolation portion 210 is used to accommodate the light-emitting unit 310, thereby enabling the display panel 10 to emit light. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100. That is, the first electrode 410 is provided to cover the light-emitting unit 310, serving as an electrode for the light-emitting unit 310. An encapsulation layer 600 is provided on the side of the first electrode layer 400 facing away from the substrate 100 to encapsulate the first electrode layer 400 and the light-emitting layer 300, thereby reducing the possibility of water and oxygen intrusion and improving the service life of the display panel 10. An anti-oxidation layer 700 is provided on the side of the conductive portion 510 facing away from the substrate 100. The orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation layer 710 on the substrate 100. The conductive layer 500 is located on the side of the first sublayer 610 facing away from the substrate 100 and includes a conductive portion 510. The conductive portion 510 is electrically connected to the first electrode 410 through a via, so that the first electrode 410 and the conductive portion 510 are arranged in parallel. This reduces the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10. In other words, the anti-oxidation portion 710 of the anti-oxidation layer 700 covers at least a portion of the surface of the conductive portion 510 to improve the problem of the conductive portion 510 being easily oxidized after the conductive layer 500 is formed or during the patterning process, thereby reducing the conductivity of the conductive portion 510. This ensures the electrical connection between the first electrode 410 and the conductive portion 510, and improves the performance of the display panel 10.

[0066] There are many ways to configure the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate. Alternatively, the substrate 100 may be the substrate. Alternatively, the substrate 100 may include a buffer layer and a support plate on a side facing away from the substrate.

[0067] Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a partial top view of a display panel provided in an embodiment of the present application.

[0068] As shown in FIG. 1 and FIG. 2 , in some optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 is at least partially located within the orthographic projection of the isolation portion 210 on the substrate 100 .

[0069] In these optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 is at least within the orthographic projection of the isolation portion 210 on the substrate 100, that is, the conductive portion 510 is at least partially arranged in the area where the isolation portion 210 is located, thereby reducing the influence of the conductive portion 510 on the luminescence of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0070] Optionally, the orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the first electrode 410 on the substrate 100 are at least partially overlapped to ensure that the conductive portion 510 can be electrically connected to the first electrode 410 through the via. Optionally, as shown in FIG2 , the conductive portion 510 is mesh-shaped, and the mesh-shaped conductive portion 510 and the isolation portion 210 are aligned in direction, thereby reducing the impact on the light emission of the light-emitting unit 310. The mesh-shaped conductive portion 510 has a large area, which can effectively reduce the overall resistance of the first electrode 410 and the conductive portion 510, thereby improving the display effect.

[0071] Optionally, the conductive portion 510 includes a metallic conductive material or a transparent conductive material. When the conductive portion 510 is a metallic conductive material, the transmittance of the conductive portion 510 is low, and therefore needs to be arranged away from the light-emitting unit 310. That is, the orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the isolation portion 210 on the substrate 100. The material of the conductive portion 510 includes, for example, metallic silver, aluminum, magnesium, copper, etc., or the material of the conductive portion 510 includes a transparent conductive material such as indium tin oxide and indium zinc oxide.

[0072] Please refer to Figure 3, which is a partial cross-sectional view of a display panel according to another embodiment. As shown in Figure 3, when the conductive portion 510 comprises a transparent conductive material, there is no need to pattern the conductive layer 500 to obtain a mesh-shaped conductive portion 510. Instead, a continuous conductive layer 500 can be directly prepared and electrically connected to the first electrode 410 through vias.

[0073] Please refer to FIG. 4 , which is a partial cross-sectional view of a display panel in yet another embodiment.

[0074] As shown in FIG. 4 , in some optional embodiments, the encapsulation layer 600 includes a second sublayer 620 . The second sublayer 620 is located on a side of the first sublayer 610 facing away from the substrate 100 , and the conductive layer 500 is located between the first sublayer 610 and the second sublayer 620 .

[0075] In these optional embodiments, the encapsulation layer 600 includes a first sublayer 610 and a second sublayer 620. The first sublayer 610 and the second sublayer 620 are used for multi-layer encapsulation to further improve the encapsulation performance of the encapsulation layer 600. The conductive layer 500 is located between the first sublayer 610 and the second sublayer 620. The first sublayer 610 is provided between the conductive layer 500 and the first electrode layer 400 to facilitate patterning of the conductive layer 500 and reduce the impact of etching of the conductive layer 500 on the first electrode layer 400.

[0076] Optionally, the first sub-layer 610 includes an inorganic material. The first sub-layer 610 is encapsulated with the inorganic material, which makes it easier to etch the via hole and reduces the difficulty of etching the via hole. Inorganic materials have good density and good barrier properties to water vapor and oxygen.

[0077] Optionally, the second sub-layer 620 includes an organic material. The second sub-layer 620 is encapsulated using the organic material to further improve the encapsulation performance of the encapsulation layer 600 .

[0078] Optionally, the encapsulation layer 600 further includes a third sublayer 630 , which is located on the side of the second sublayer 620 facing away from the substrate 100 . The encapsulation layer 600 adopts three-layer encapsulation, has better encapsulation performance, and reduces the possibility of water and oxygen intrusion.

[0079] Optionally, the third sublayer 630 includes inorganic materials, and the first sublayer 610, the second sublayer 620 and the third sublayer 630 are encapsulated with inorganic materials, organic materials and inorganic materials respectively to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure, further improving the encapsulation performance of the encapsulation layer 600.

[0080] In some optional embodiments, the anti-oxidation layer 700 includes an inorganic material or an organic material.

[0081] In these alternative embodiments, the anti-oxidation layer 700 includes an inorganic material, such as silicon nitride (SiN) or silicon oxide (SiO), etc. Alternatively, the anti-oxidation layer 700 includes an organic material, such as polyimide.

[0082] Optionally, the anti-oxidation layer 700 is made of the same material as the first sub-layer 610. When the anti-oxidation layer 700 and the first sub-layer 610 are made of the same material, the anti-oxidation layer 700 and the first sub-layer 610 can be prepared using the same film-forming method, that is, the same equipment can be used, thereby reducing equipment investment and lowering preparation costs.

[0083] As shown in FIG. 4 , in some optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the anti-oxidation portion 710 on the substrate 100 overlap.

[0084] In these optional embodiments, the conductive portion 510 and the anti-oxidation portion 710 are arranged to overlap, so that the conductive portion 510 and the anti-oxidation portion 710 can be prepared using the same mask, reducing the number of mask development times and lowering the preparation cost.

[0085] Please refer to FIG. 5 , which is a partial cross-sectional view of a display panel in yet another embodiment.

[0086] As shown in Figure 5, optionally, the conductive part 510 includes a side facing the isolation opening 220, and the anti-oxidation part 710 is arranged to cover at least a portion of the side of the conductive part 510, so that more surface of the conductive part 510 is protected by the anti-oxidation part 710, thereby reducing the possibility of the conductive part 510 being oxidized and ensuring the conductivity of the conductive part 510.

[0087] Please refer to FIG. 6 , which is a partial cross-sectional view of a display panel in another embodiment.

[0088] As shown in FIG. 6 , in some optional embodiments, the display panel 10 further includes a protective layer 800 . The protective layer 800 is located between the first electrode layer 400 and the encapsulation layer 600 . The protective layer 800 covers at least a portion of the first electrode layer 400 .

[0089] In these optional embodiments, the protective layer 800 is located on a side of the first electrode layer 400 facing away from the substrate 100, and the protective layer 800 covers at least a portion of the first electrode layer 400 to reduce water and oxygen intrusion, making it difficult for the first electrode 410 to oxidize, thereby ensuring the conductivity of the first electrode 410. When the display panel 10 includes the protective layer 800, when etching the via hole in the first sub-layer 610, the protective layer 800 must be etched to expose the first electrode 410 through the protective layer 800 and enable contact with the conductive portion 510, thereby ensuring electrical connection between the first electrode 410 and the conductive portion 510.

[0090] Optionally, the protective layer 800 includes a light extraction material having a high refractive index, thereby effectively improving the coupling efficiency of the protective layer 800 and further improving the luminous efficiency of the display panel 10 .

[0091] Please also refer to FIG. 7 , which is a partial cross-sectional view of a display panel in another embodiment.

[0092] As shown in Figure 7, in some optional embodiments, the isolation portion 210 includes an isolation structure 900, which is located on the substrate 100 and encloses a plurality of isolation openings 220. The isolation structure 900 includes a first layer 910, each light-emitting unit 310 and each first electrode 410 is located in the isolation opening 220, and the first electrode 410 is electrically connected to the first layer 910.

[0093] In these optional embodiments, the isolation structure 900 is disposed on the substrate 100 and encloses a plurality of isolation openings 220 to separate the light-emitting layer 300 into mutually disconnected light-emitting units 310, thereby reducing carrier crosstalk within the light-emitting layer 300 and improving the display effect of the display panel 10. Furthermore, the light-emitting units 310 do not require the use of a precision mask, which can reduce the development and use of precision masks and reduce production costs. The mutually spaced first electrodes 410 are electrically connected through the first layer 910 to form a full-surface electrode, making it easier for the first electrodes 410 to overlap with the first layer 910, thereby improving the overlap efficiency of the first electrodes 410.

[0094] Optionally, a plurality of mutually spaced first electrodes 410 are all connected to the conductive portion 510 via holes, and each first electrode 410 is electrically connected to the conductive portion 510 , so that each first electrode 410 is interconnected to form a full-surface electrode.

[0095] In some optional embodiments, the isolation structure 900 further includes a second layer 920 located on the side of the first layer 910 facing away from the substrate 100 , and the orthographic projection of the first layer 910 on the substrate 100 is located within the orthographic projection of the second layer 920 on the substrate 100 .

[0096] In these optional embodiments, the first layer 910 and the second layer 920 are arranged to form an isolation structure 900. The orthographic projection of the first layer 910, which is arranged near the substrate 100, is located within the orthographic projection of the second layer 920 on the substrate 100. The area of ​​the second layer 920 is larger than that of the first layer 910. The second layer 920 covers the surface of the first layer 910 near the second layer 920. In this case, the first layer 910 is recessed relative to the second layer 920 in a direction away from the isolation opening 220. When preparing the light-emitting layer 300, a large drop in height is generated at the edge of the isolation structure 900, and the first layer 910 is recessed relative to the second layer 920. This makes it difficult for the light-emitting layer 300 to connect at the edge of the isolation structure 900, resulting in breakage. The breakage of the light-emitting layer 300 forms disconnected light-emitting units 310.

[0097] In some optional embodiments, the first layer 910 and the second layer 920 are both made of metal materials, and the materials of the first layer 910 and the second layer 920 are different.

[0098] In these optional embodiments, when both the first layer 910 and the second layer 920 are made of metal materials, an etchant can be used to wet-etch the first layer 910. By configuring the etchant, the etching rate of the second layer 920 can be lower than the etching rate of the first layer 910. Since the etching rate of the first layer 910 is higher, even though the second layer 920 will be etched to some extent during wet etching with the etchant, the first layer 910 will be etched faster, thereby causing the first layer 910 to be recessed relative to the second layer 920.

[0099] Optionally, the second layer 920 includes a non-metallic material, for example, a non-metallic conductive material or an insulating material. When the second layer 920 is a non-metallic material, the second layer 920 is difficult to etch during wet etching of the first layer 910 using an etching solution, thereby making it easier for the first layer 910 to be concave relative to the second layer 920.

[0100] Optionally, the cross-sectional shape of the first layer 910 along the thickness direction includes a trapezoidal shape. When the cross-sectional shape of the first layer 910 is a trapezoidal shape, on the one hand, it can stably support the second layer 920, and on the other hand, the first layer 910 is configured as a concave portion of the second layer 920, which facilitates the disconnection of the light-emitting layer 300 at the isolation structure 900.

[0101] Please refer to FIG. 8 and FIG. 9 . FIG. 8 is a partial cross-sectional view of a display panel according to another embodiment; FIG. 9 is a partial cross-sectional view of a display panel according to another embodiment.

[0102] As shown in Figures 8 and 9, optionally, the isolation portion 210 includes a pixel defining portion 930, and the isolation opening 220 includes a pixel opening 940 enclosed by the pixel defining portion 930, the pixel defining portion 930 defines the light-emitting area of ​​the display panel 10, and the pixel opening 940 is used to set the light-emitting unit 310 to achieve light emission of the display panel 10.

[0103] Optionally, the isolation portion 210 also includes an isolation structure 900, which is located on the substrate 100. The isolation portion 210 includes both a pixel defining portion 930 and an isolation structure 900, so that the light-emitting layer 300 is separated by the isolation structure 900 and falls into the pixel opening 940, thereby realizing the light-emitting display of the display panel 10, and the light-emitting units 310 are spaced apart from each other to reduce the crosstalk of carriers in the light-emitting layer 300.

[0104] Optionally, the orthographic projection of the isolation structure 900 on the substrate 100 and the orthographic projection of the conductive part 510 on the substrate 100 are at least partially offset, so that the portion of the conductive part 510 that is offset from the isolation structure 900 can be connected to the first electrode 410 through a via, so that the first electrode 410 is electrically connected to the conductive part 510, thereby reducing the overall resistance of the first electrode 410 and the conductive part 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10.

[0105] As shown in FIG. 8 , in some optional embodiments, the isolation structure 900 is located on a side of the pixel defining portion 930 facing away from the substrate 100 .

[0106] In these alternative embodiments, the isolation structure 900 is disposed on the pixel defining portion 930, and the isolation structure 900 has a large height difference corresponding to the pixel opening 940. When fabricating the light-emitting layer 300, the large height difference makes it easier to disconnect the light-emitting layer 300 at the location of the isolation structure 900, thereby reducing the difficulty of fabricating the light-emitting layer 300.

[0107] Optionally, the orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the pixel defining portion 930 on the substrate 100, that is, the conductive portion 510 is arranged in the area where the pixel defining portion 930 is located, reducing the influence of the conductive portion 510 on the luminescence of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0108] As shown in FIG. 9 , in some optional embodiments, a clearance opening 950 is opened on the pixel defining portion 930 , and the isolation structure 900 is located in the clearance opening 950 .

[0109] In these optional embodiments, the isolation structure 900 is arranged in the clearance opening 950 on the pixel defining portion 930. During the preparation process, the preparation step of the isolation structure 900 is before the preparation of the pixel electrode 960, that is, after the isolation structure 900 is prepared on the substrate 100, the pixel electrode 960 is prepared on the substrate 100, so as to reduce the impact of the preparation of the isolation structure 900 on the pixel electrode 960 and ensure that the pixel electrode 960 is not damaged.

[0110] Optionally, the light-emitting unit 310 and the isolation structure 900 are spaced apart, and the light-emitting layer 300 and the isolation structure 900 are spaced apart, that is, the light-emitting units 310 are spaced apart from each other, thereby reducing the crosstalk of carriers between the light-emitting units 310 and improving the color crosstalk problem of the light-emitting units 310.

[0111] Optionally, the display panel 10 further includes a pixel electrode 960 exposed by the pixel opening 940. One of the pixel electrode 960 and the first electrode 410 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. In the embodiment of the present application, the pixel electrode 960 serves as the anode of the light-emitting unit 310, and the first electrode 410 serves as the cathode of the light-emitting unit 310.

[0112] Optionally, the light emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light emitting material layer, a hole injection layer (HIL) and a hole transport layer (HTL).

[0113] As shown in FIG1 , an embodiment of the second aspect of the present application provides another display panel 10, comprising: a substrate 100; a light-emitting layer 300, located on one side of the substrate 100, comprising a plurality of light-emitting units 310; a first electrode layer 400, located on a side of the light-emitting layer 300 facing away from the substrate 100, comprising at least one first electrode 410, wherein the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100; and an encapsulation layer 600, located on a side of the first electrode layer 400 facing away from the substrate 100, comprising The first sublayer 610 includes at least one via; the conductive layer 500 is located on the side of the first sublayer 610 facing away from the substrate 100, including at least one conductive portion 510, and the at least one conductive portion 510 is connected to the first electrode 410 through at least one via; the anti-oxidation layer 700 is located on the side of the conductive layer 500 facing away from the substrate 100, including at least one anti-oxidation portion 710, and the orthographic projection of the at least one conductive portion 510 on the substrate 100 is located within the orthographic projection of the at least one anti-oxidation portion 710 on the substrate 100.

[0114] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, a light-emitting layer 300, a first electrode layer 400, an encapsulation layer 600, and a conductive layer 500. The orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100, that is, the first electrode 410 is arranged to cover the light-emitting unit 310, thereby serving as an electrode of the light-emitting unit 310. The encapsulation layer 600 is arranged on the side of the first electrode layer 400 facing away from the substrate 100 to encapsulate the first electrode layer 400 and the light-emitting layer 300, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel 10. An anti-oxidation layer 700 is provided on the side of the conductive portion 510 facing away from the substrate 100. The orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation portion 710 on the substrate 100. The conductive layer 500 is located on the side of the first sublayer 610 facing away from the substrate 100 and includes a conductive portion 510. The conductive portion 510 is electrically connected to the first electrode 410 through a via, so that the first electrode 410 and the conductive portion 510 are arranged in parallel. This reduces the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10. In other words, the anti-oxidation portion 710 of the anti-oxidation layer 700 covers at least a portion of the surface of the conductive portion 510 to improve the problem of the conductive portion 510 being easily oxidized after the conductive layer 500 is formed or during the patterning process, thereby reducing the conductivity of the conductive portion 510. This ensures the electrical connection between the first electrode 410 and the conductive portion 510, and improves the performance of the display panel 10.

[0115] In some optional embodiments, at least one conductive portion 510 includes multiple conductive portions 510 corresponding to multiple light-emitting units 310, at least one via includes multiple vias corresponding to the multiple conductive portions 510, and at least one anti-oxidation portion 710 includes multiple anti-oxidation portions 710 corresponding to the multiple conductive portions 510, wherein: the conductive portion 510 is connected to at least one first electrode 410 through the corresponding via; the orthographic projection of the conductive portion 510 on the substrate is located within the orthographic projection of the corresponding anti-oxidation portion 710 on the substrate 100.

[0116] The conductive portion 510 is connected to at least one first electrode 410 through a corresponding via hole, which means that the orthographic projections of the conductive portion 510, the light-emitting unit 310 and the via hole on the substrate 100 overlap, and the conductive portion 510 and the light-emitting unit 310 are connected through the via hole at the overlapping position.

[0117] In these optional embodiments, the anti-oxidation part 710 of the anti-oxidation layer 700 covers the surface of the conductive part 510 to improve the problem that the conductive part 510 is easily oxidized after the conductive layer 500 is formed or during the patterning process, thereby reducing the conductivity of the conductive part 510, ensuring the electrical connection between the first electrode 410 and the conductive part 510, and improving the performance of the display panel 10.

[0118] Please refer to FIG. 10 and FIG. 11 . FIG. 10 is a partial cross-sectional view of a display panel in another embodiment; FIG. 11 is a partial cross-sectional view of a display panel in another embodiment.

[0119] As shown in Figures 10 and 11, in some optional embodiments, the display panel 10 further includes a pixel defining portion 930, which encloses a plurality of pixel openings 940, and the light-emitting unit 310 is located within the corresponding pixel openings 940, wherein: the orthographic projection of the anti-oxidation portion 710 on the substrate 100 is located on the side of the pixel defining portion 930 facing the conductive layer 500 and is within the orthographic projection of the substrate 100; the orthographic projection of the conductive portion 510 on the substrate 100 is located on the side of the pixel defining portion 930 facing the conductive layer 500 and is within the orthographic projection of the substrate 100.

[0120] In these optional embodiments, the anti-oxidation portion 710 and the conductive portion 510 are arranged in the area where the pixel defining portion 930 is located, reducing the impact of the anti-oxidation portion 710 and the conductive portion 510 on the light emission of the light-emitting unit 310 and ensuring the display effect of the display panel 10.

[0121] As shown in Figures 10 and 11, in some optional embodiments, the display panel 10 also includes an isolation structure 900, the isolation structure 900 encloses a plurality of isolation openings 220, the light-emitting unit 310 is located in the corresponding isolation opening 220, and at least one first electrode 410 includes a plurality of first electrodes 410 corresponding to the plurality of light-emitting units 310, wherein: the first sublayer 610 includes a plurality of first packaging parts, the first packaging part 611 is located on the side of the corresponding first electrode 410 away from the light-emitting unit 310 and extends to the side of the isolation structure 900 away from the substrate 100; the via is located on the corresponding first packaging part 611, and the conductive part 510 is connected to the corresponding first electrode 410 through the corresponding via.

[0122] In these optional embodiments, the light-emitting layer 300 is isolated by the isolation structure 900 and falls into the pixel opening 940, achieving a light-emitting display of the display panel 10, and the light-emitting units 310 are spaced apart from each other, reducing crosstalk of carriers within the light-emitting layer 300. The first encapsulation portion encapsulates the light-emitting units 310 and the first electrode 410 within the isolation opening 220, reducing the intrusion of water and oxygen. The conductive portion is electrically connected to the first electrode through a via in the first encapsulation portion 611, reducing the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display effect of the display panel 10.

[0123] In some optional embodiments, the display panel 10 further includes a pixel defining portion 930, which encloses a plurality of pixel openings 940, and the pixel openings 940 are connected to the corresponding isolation openings 220, wherein: the isolation structure 900 is located on the side of the pixel defining portion 930 facing away from the substrate 100, the orthographic projection of the via on the substrate 100 is located on the side of the pixel defining portion 930 facing the conductive layer 500 and is within the orthographic projection of the substrate 100, and the orthographic projection of the via on the substrate 100 is located on the side of the isolation structure 900 facing the pixel defining portion 930 and is outside the orthographic projection of the substrate 100.

[0124] In these optional embodiments, the isolation structure 900 is disposed on the pixel defining portion 930, and the isolation structure 900 has a large height difference equivalent to the pixel opening 940. When preparing the light-emitting layer 300, due to the large height difference, the light-emitting layer 300 is more easily disconnected at the isolation structure 900, reducing the difficulty of preparing the light-emitting layer 300. The orthographic projection of the isolation structure 900 on the substrate 100 and the orthographic projection of the conductive portion 510 on the substrate 100 are staggered, allowing the conductive portion 510 to be connected to the first electrode 410 through a via. The orthographic projection of the via on the substrate 100 is located on the side of the pixel defining portion 930 facing the conductive layer 500, within the orthographic projection of the substrate 100. The connection position between the first electrode 410 and the conductive portion 510 is located in the area where the pixel defining portion 930 is located, reducing the impact of the via connection between the first electrode 410 and the conductive portion 510 on the light emission of the light-emitting unit 310, thereby ensuring the display effect of the display panel 10.

[0125] Optionally, the encapsulation layer 600 further includes a second sublayer 620 and a third sublayer 630, wherein: the second sublayer 620 is located on the side of the first sublayer 610 facing away from the substrate 100, and covers the multiple anti-oxidation portions 710 and the multiple conductive portions 510; the third sublayer 630 is located on the side of the second sublayer 620 facing away from the substrate 100; the first sublayer 610 comprises an inorganic material, the second sublayer 620 comprises an organic material, the third sublayer 630 comprises an inorganic material, the anti-oxidation layer 700 comprises an inorganic material or an organic material, and the conductive portions 510 comprise a metallic conductive material. The second sublayer 620, made of an organic material, further encapsulates the multiple anti-oxidation portions 710 and the multiple conductive portions 510, improving the overall encapsulation performance of the encapsulation layer 600 and ensuring the display quality of the display panel 10.

[0126] In some optional embodiments, the orthographic projection of the conductive part 510 on the substrate 100 coincides with the orthographic projection of the anti-oxidation part 710 on the substrate 100, the anti-oxidation part 710 includes a first top surface 711 facing away from the substrate 100 and a first side surface 712 surrounding the first top surface 711, the conductive part 510 includes a second side surface 511 coplanar with the first side surface 712, wherein: the second sublayer 620 covers the first top surface 711, the first side surface 712, the second side surface 511 and the side of the first sublayer 610 facing away from the substrate 100; the multiple conductive parts 510 are in a mesh shape; the material of the anti-oxidation layer 700 and the first sublayer 610 is the same, and the conductive part 510 includes a transparent conductive material.

[0127] In these optional embodiments, the second sublayer 620 covers the first top surface 711, the first side surface 712, the second side surface 511, and the side of the first sublayer 610 facing away from the substrate 100, so that the surfaces of the anti-oxidation portion 710 and the conductive portion 510 are protected by the second sublayer 620, reducing the possibility of oxidation of the anti-oxidation portion 710 and the conductive portion 510, thereby ensuring the protective performance of the anti-oxidation portion 710 and the conductivity of the conductive portion 510. The anti-oxidation layer 700 and the first sublayer 610 are made of the same material. When the anti-oxidation layer 700 and the first sublayer 610 are made of the same material, the anti-oxidation layer 700 and the first sublayer 610 can be prepared using the same film-forming method, that is, using the same equipment, reducing equipment investment and reducing preparation costs.

[0128] Please refer to FIG. 12 , which is a partial cross-sectional view of a display panel in another embodiment.

[0129] As shown in Figure 12, in some optional embodiments, the display panel 10 further includes a blocking layer, and the encapsulation layer 600 further includes a fourth sublayer 640, wherein: the blocking layer is located on the side of the anti-oxidation layer 700 facing away from the substrate 100, including multiple blocking portions 720 corresponding to the multiple anti-oxidation portions 710, and the orthographic projection of the anti-oxidation portion 710 on the substrate 100 is located within the orthographic projection of the corresponding blocking portion 720 on the substrate 100; the fourth sublayer 640 is located on the side of the first sublayer 610 facing away from the substrate 100, and the fourth sublayer 640 covers the multiple blocking portions 720, the multiple anti-oxidation portions 710 and the multiple conductive portions 510.

[0130] In these optional embodiments, the barrier portion 720 is provided so that when the anti-oxidation layer 700 is subsequently patterned, the barrier portion 720 can protect a portion of the anti-oxidation layer 700 from being etched, thereby forming the anti-oxidation portion 710 and protecting the conductive portion 510. Furthermore, the fourth sublayer 640 covers the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510, thereby encapsulating the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510, reducing the intrusion of water and oxygen into the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510, and thereby increasing the service life of the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510.

[0131] In some optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100, the orthographic projection of the anti-oxidation portion 710 on the substrate 100, and the orthographic projection of the blocking portion 720 on the substrate 100 coincide with each other, the blocking portion 720 includes a second top surface 721 facing away from the substrate 100 and a third side surface 722 surrounding the second top surface 721, the anti-oxidation portion 710 includes a first side surface 712 coplanar with the third side surface 722, and the conductive portion 510 includes a second side surface 511 coplanar with the first side surface 712, wherein: the fourth The sublayer 640 covers the second top surface 721, the first side surface 712, the second side surface 511, the third side surface 722 and the side of the first sublayer 610 facing away from the substrate 100; the materials of the fourth sublayer 640, the anti-oxidation layer 700 and the first sublayer 610 include silicon compounds, the material of the barrier layer includes indium tin oxide and / or indium zinc oxide, and the material of the conductive layer 500 includes titanium, and / or aluminum, and / or molybdenum, and / or copper; the materials of the fourth sublayer 640, the anti-oxidation layer 700 and the first sublayer 610 are the same.

[0132] In these optional embodiments, the orthographic projection of the conductive portion 510 on the substrate 100, the orthographic projection of the anti-oxidation portion 710 on the substrate 100, and the orthographic projection of the blocking portion 720 on the substrate 100 overlap with each other. The blocking portion 720 can serve as a mask for etching to form the anti-oxidation portion 710 and the conductive portion 510, thereby simplifying the manufacturing process. The blocking portion 720 is made of a dry-etching-resistant metal oxide such as indium tin oxide or indium zinc oxide, which can block the dry etching process and thus serve as a mask for the anti-oxidation portion 710 and the conductive portion 510. The etching process for the blocking portion 720 is wet etching, which involves a large amount of water vapor. When the blocking portion 720 is wet-etched, the anti-oxidation layer 700 is a solid surface material, which can prevent the water vapor from the wet etching process from invading the conductive layer 500. When the fourth sublayer 640, the anti-oxidation layer 700, and the first sublayer 610 are made of the same material, they can be prepared using the same film-forming method, i.e., the same equipment can be used, thereby reducing equipment investment and manufacturing costs. The fourth sublayer 640 covers the surfaces of the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510, thereby encapsulating the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510, reducing the intrusion of water and oxygen into the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510, and thereby increasing the service life of the barrier portion 720, the anti-oxidation portion 710, and the conductive portion 510.

[0133] In some optional embodiments, at least one via includes multiple vias corresponding to multiple light-emitting units 310, and the encapsulation layer 600 also includes a fifth sublayer, wherein: at least one conductive portion 510 includes a conductive portion 510, the conductive portion 510 continuously covers the multiple vias and is connected to the at least one first electrode 410 through the multiple vias; the fifth sublayer covers the side of the at least one conductive portion 510 facing away from the substrate 100.

[0134] In these optional embodiments, the fifth sublayer covers the surface of the conductive part 510 facing away from the substrate 100 to achieve packaging protection for the conductive part 510, reduce the invasion of water and oxygen into the conductive part 510, and improve the service life of the conductive part 510.

[0135] Optionally, the material of the conductive part 510 includes indium tin oxide and / or indium zinc oxide, and the material of the first sublayer 610 and the fifth sublayer includes silicon compounds. Silicon compounds have good density and better barrier ability to water and oxygen.

[0136] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made based on actual conditions. This application does not impose any specific restrictions on it.

[0137] The third aspect of the present application also provides a display device, including the display panel 10 of any of the above-mentioned embodiments. Since the display device provided by the third aspect of the present application includes the display panel 10 of any of the above-mentioned embodiments, the display device provided by the third aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned embodiments, which will not be further described here.

[0138] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0139] The fourth aspect of the present application also provides a method for manufacturing a display panel 10. The display panel 10 may be any of the first aspect embodiments described above. Please refer to Figures 1 to 9 and Figure 13, which is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application. The method includes:

[0140] Step S01: preparing an isolation layer on a substrate, wherein the isolation layer includes an isolation portion and an isolation opening formed by the isolation portion.

[0141] Step S02: preparing a light-emitting layer on a side of the isolation layer facing away from the substrate, wherein the light-emitting layer includes light-emitting units located in each isolation opening.

[0142] Step S03: preparing a first electrode layer on the side of the light-emitting layer facing away from the substrate, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0143] Step S04: preparing an encapsulation layer on a side of the first electrode layer facing away from the substrate, the encapsulation layer including a first sub-layer.

[0144] Step S05: preparing a conductive layer on a side of the first sub-layer facing away from the substrate, wherein the conductive layer includes a conductive portion connected to the first electrode via.

[0145] Step S06: preparing an anti-oxidation layer on the side of the conductive layer facing away from the substrate, the anti-oxidation layer comprising an anti-oxidation portion, and an orthographic projection of the conductive portion on the substrate is located within an orthographic projection of the anti-oxidation portion on the substrate.

[0146] According to the preparation method of the embodiment of the fourth aspect of the present application, an isolation layer 200 is prepared on the substrate 100 by step S01, and the isolation opening 220 formed by the isolation portion 210 is used to set the light-emitting unit 310 to realize the light-emitting display of the display panel 10. Then, the light-emitting layer 300 is prepared by step S02. The first electrode layer 400 is prepared by step S03, and the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 410 on the substrate 100, that is, the first electrode 410 covers the light-emitting unit 310 and is set to serve as the electrode of the light-emitting unit 310. The encapsulation layer 600 is prepared by step S04, and the encapsulation layer 600 is arranged on the side of the first electrode layer 400 away from the substrate 100 to encapsulate the first electrode layer 400 and the light-emitting layer 300, reduce the possibility of water and oxygen intrusion, and improve the service life of the display panel 10. A conductive layer 500 is prepared in step S05. The conductive layer 500 is located on the side of the first sub-layer 610 facing away from the substrate 100 and includes a conductive portion 510. The conductive portion 510 is electrically connected to the first electrode 410 through a via hole, so that the first electrode 410 and the conductive portion 510 are arranged in parallel. This reduces the overall resistance of the first electrode 410 and the conductive portion 510, thereby reducing the power consumption of the first electrode 410 and improving the display quality of the display panel 10. Finally, an anti-oxidation layer 700 is prepared in step S06. The orthographic projection of the conductive portion 510 on the substrate 100 is located within the orthographic projection of the anti-oxidation portion 710 on the substrate 100. In other words, the anti-oxidation portion 710 of the anti-oxidation layer 700 covers at least a portion of the surface of the conductive portion 510. This prevents water and oxygen from entering the first electrode layer 400 during the etching of the via hole in the first sub-layer 610, thereby oxidizing and corroding the first electrode 410 and reducing the conductivity of the first electrode 410, thereby ensuring the electrical connection between the first electrode 410 and the conductive portion 510.

[0147] In some optional embodiments, after the step of forming the first electrode layer 400 on the side of the light-emitting layer 300 facing away from the substrate 100 , the method further includes:

[0148] A first sub-material layer is prepared on a side of the first electrode layer 400 facing away from the substrate 100 , and the first sub-material layer is patterned to obtain a first sub-layer 610 . The first sub-layer 610 includes vias.

[0149] A conductive layer 500 is formed on a side of the first sub-layer 610 facing away from the substrate 100 . The conductive layer 500 includes a conductive portion 510 . The conductive portion 510 is connected to the first electrode 410 through a via.

[0150] In these optional embodiments, after forming the first sub-layer 610, the first sub-layer 610 is etched to form via holes, and then the conductive layer 500 is formed. The conductive portion 510 of the conductive layer 500 can be electrically connected to the first electrode 410 through the via holes. The first sub-layer 610 is provided between the conductive layer 500 and the first electrode layer 400 to facilitate patterning of the conductive layer 500 and reduce the impact of etching of the conductive layer 500 on the first electrode layer 400.

[0151] In some optional embodiments, after the step of preparing the conductive layer 500 on the side of the first sub-layer 610 facing away from the substrate 100 , the method further includes:

[0152] An anti-oxidation material layer is prepared on the side of the conductive layer 500 facing away from the substrate 100. The anti-oxidation material layer and the conductive layer 500 are sequentially etched using the same mask to form a conductive portion 510 and an anti-oxidation layer 700. The anti-oxidation layer 700 includes an anti-oxidation portion 710. The orthographic projection of the conductive portion 510 on the substrate 100 and the orthographic projection of the anti-oxidation portion 710 on the substrate 100 coincide with each other.

[0153] Before the step of sequentially etching the anti-oxidation material layer and the conductive layer 500 using the same mask, the method further includes: preparing a barrier material layer on a side of the anti-oxidation material layer facing away from the substrate 100, and patterning the barrier material layer to obtain a barrier portion 720, wherein the orthographic projection of the barrier portion 720 on the substrate 100 is located within the orthographic projection of the isolation portion on the substrate 100;

[0154] The step of sequentially etching the anti-oxidation material layer and the conductive layer 500 using the same mask includes: sequentially dry etching the anti-oxidation material layer and the conductive layer 500 using the blocking portion 720 as a mask, wherein the anti-oxidation layer 700 includes an anti-oxidation portion 710, and an orthographic projection of the blocking portion 720 on the substrate 100 coincides with an orthographic projection of the anti-oxidation portion 710 on the substrate 100;

[0155] The step of preparing the conductive layer 500 on the side of the first sub-layer 610 facing away from the substrate 100 includes: preparing the entire conductive layer 500 on the side of the first sub-layer 610 facing away from the substrate 100;

[0156] The step of forming the anti-oxidation layer 700 on the side of the conductive layer 500 facing away from the substrate 100 includes forming the entire anti-oxidation layer 700 on the side of the conductive layer 500 facing away from the substrate 100 .

[0157] In these optional embodiments, after the conductive layer 500 and the anti-oxidation layer 700 are prepared, the anti-oxidation material layer is first etched, and then the conductive layer 500 is etched. The etching is performed sequentially, but the same mask is used, which reduces the number of mask developments and reduces the manufacturing cost. Using the blocking portion 720 as a mask to sequentially dry-etch the anti-oxidation material layer and the conductive layer 500 can reduce the preparation and use of masks and simplify the manufacturing process. The etching process of the blocking portion 720 is wet etching, which involves a large amount of water vapor. When the blocking portion 720 is wet-etched, the anti-oxidation layer 700 is a solid surface material, which can prevent the water vapor of the wet etching process from invading the conductive layer 500.

[0158] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation layer, located on the substrate, the isolation layer comprising an isolation portion and an isolation opening formed by the isolation portion; a light-emitting layer, the light-emitting layer comprising light-emitting units located in each of the isolation openings; A first electrode layer is located on a side of the light-emitting layer away from the substrate, the first electrode layer comprises a first electrode, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; an encapsulation layer, located on a side of the first electrode layer away from the substrate, the encapsulation layer comprising a first sublayer; A conductive layer, located on a side of the first sub-layer away from the substrate, the conductive layer comprising a conductive portion, and the conductive portion is connected to the first electrode via; The anti-oxidation layer is located on a side of the conductive layer away from the substrate, the anti-oxidation layer comprises an anti-oxidation portion, and the orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the anti-oxidation portion on the substrate.

2. The display panel according to claim 1, characterized in that: The orthographic projection of the conductive part on the substrate is at least partially located within the orthographic projection of the isolation part on the substrate; the conductive part is mesh-shaped; and the conductive part includes a metal conductive material.

3. The display panel according to claim 1, characterized in that: The encapsulation layer further includes a second sublayer and a third sublayer, wherein: The second sub-layer is located on a side of the first sub-layer away from the substrate, and the conductive layer is located between the first sub-layer and the second sub-layer; The third sublayer is located on a side of the second sublayer away from the substrate; The first sub-layer includes an inorganic material; the second sub-layer includes an organic material; the third sub-layer includes an inorganic material, and the anti-oxidation layer includes an inorganic material or an organic material.

4. The display panel according to claim 1, characterized in that: The orthographic projection of the conductive part on the substrate and the orthographic projection of the anti-oxidation part on the substrate overlap; the conductive part includes a side facing the isolation opening, and the anti-oxidation part covers at least part of the side of the conductive part, wherein: The anti-oxidation layer is made of the same material as the first sub-layer.

5. The display panel according to claim 1, characterized in that: The isolation portion includes an isolation structure, the isolation structure is located on the substrate and encloses a plurality of isolation openings, the isolation structure includes a first layer, each of the light-emitting units and each of the first electrodes is located in the isolation opening, and the first electrode is electrically connected to the first layer; A plurality of mutually spaced first electrodes are all connected to the conductive portion via holes; The isolation structure further includes a second layer located on a side of the first layer facing away from the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the second layer on the substrate.

6. The display panel according to claim 1, characterized in that: The isolation portion includes a pixel defining portion, and the isolation opening includes a pixel opening formed by being surrounded by the pixel defining portion; The isolation portion further includes an isolation structure, and the isolation structure is located on the substrate; The orthographic projection of the isolation structure on the substrate and the orthographic projection of the conductive portion on the substrate are at least partially offset; The isolation structure is located on a side of the pixel defining portion away from the substrate; The orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the pixel defining portion on the substrate; The pixel defining portion is provided with a clearance opening, and the isolation structure is located in the clearance opening.

7. A display panel, characterized in that: include: substrate; A light-emitting layer, located on one side of the substrate, comprising a plurality of light-emitting units; A first electrode layer, located on a side of the light-emitting layer away from the substrate, comprising at least one first electrode, wherein the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; an encapsulation layer, located on a side of the first electrode layer away from the substrate, comprising a first sublayer, wherein the first sublayer comprises at least one via hole; a conductive layer, located on a side of the first sublayer away from the substrate, comprising at least one conductive portion, wherein the at least one conductive portion is connected to the first electrode through the at least one via hole; The anti-oxidation layer is located on a side of the conductive layer away from the substrate, and includes at least one anti-oxidation portion, wherein the orthographic projection of the at least one conductive portion on the substrate is located within the orthographic projection of the at least one anti-oxidation portion on the substrate.

8. The display panel according to claim 7, characterized in that: The at least one conductive portion includes a plurality of conductive portions corresponding to the plurality of light-emitting units, the at least one via hole includes a plurality of via holes corresponding to the plurality of conductive portions, and the at least one anti-oxidation portion includes a plurality of anti-oxidation portions corresponding to the plurality of conductive portions, wherein: The conductive portion is connected to the at least one first electrode through the corresponding via hole; The orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the corresponding anti-oxidation portion on the substrate.

9. The display panel according to claim 8, characterized in that: The display panel further includes a pixel defining portion, the pixel defining portion encloses a plurality of pixel openings, and the light emitting unit is located in the corresponding pixel openings, wherein: The orthographic projection of the anti-oxidation portion on the substrate is located within the orthographic projection of the substrate on the side of the pixel defining portion facing the conductive layer; The orthographic projection of the conductive portion on the substrate is located within the orthographic projection of the substrate on a side of the pixel defining portion facing the conductive layer.

10. The display panel according to claim 8, characterized in that: The display panel further includes an isolation structure, the isolation structure encloses a plurality of isolation openings, the light-emitting units are located in corresponding isolation openings, and the at least one first electrode includes a plurality of first electrodes corresponding to the plurality of light-emitting units, wherein: The first sublayer includes a plurality of first encapsulation parts, wherein the first encapsulation parts are located on a side of the corresponding first electrode away from the light-emitting unit and extend to a side of the isolation structure away from the substrate; The via hole is located on the corresponding first packaging part, and the conductive part is connected to the corresponding first electrode through the corresponding via hole.

11. The display panel according to claim 10, characterized in that: The display panel further includes a pixel defining portion, the pixel defining portion encloses a plurality of pixel openings, and the pixel openings are connected to the corresponding isolation openings, wherein: The isolation structure is located on the side of the pixel defining portion facing away from the substrate, the orthographic projection of the via on the substrate is located within the orthographic projection of the substrate on the side of the pixel defining portion facing the conductive layer, and the orthographic projection of the via on the substrate is located outside the orthographic projection of the substrate on the side of the isolation structure facing the pixel defining portion.

12. The display panel according to claim 8, characterized in that: The encapsulation layer further includes a second sublayer and a third sublayer, wherein: The second sublayer is located on a side of the first sublayer away from the substrate, and the second sublayer covers the plurality of anti-oxidation portions and the plurality of conductive portions; The third sublayer is located on a side of the second sublayer away from the substrate; The first sub-layer includes an inorganic material, the second sub-layer includes an organic material, the third sub-layer includes an inorganic material, the anti-oxidation layer includes an inorganic material or an organic material, and the conductive portion includes a metal conductive material.

13. The display panel according to claim 12, characterized in that: The orthographic projection of the conductive portion on the substrate coincides with the orthographic projection of the anti-oxidation portion on the substrate, the anti-oxidation portion comprises a first top surface facing away from the substrate and a first side surface surrounding the first top surface, and the conductive portion comprises a second side surface coplanar with the first side surface, wherein: The second sub-layer covers the first top surface, the first side surface, the second side surface, and a side of the first sub-layer facing away from the substrate; The plurality of conductive parts are in a mesh shape; The anti-oxidation layer and the first sub-layer are made of the same material, and the conductive part includes a transparent conductive material.

14. The display panel according to claim 8, characterized in that: The display panel further includes a barrier layer, and the encapsulation layer further includes a fourth sublayer, wherein: The barrier layer is located on a side of the anti-oxidation layer away from the substrate, and includes a plurality of barrier portions corresponding to the plurality of anti-oxidation portions, wherein the orthographic projections of the anti-oxidation portions on the substrate are located within the orthographic projections of the corresponding barrier portions on the substrate; The fourth sublayer is located on a side of the first sublayer away from the substrate, and the fourth sublayer covers the plurality of blocking portions, the plurality of anti-oxidation portions, and the plurality of conductive portions.

15. The display panel according to claim 14, characterized in that: The orthographic projection of the conductive portion on the substrate, the orthographic projection of the anti-oxidation portion on the substrate and the orthographic projection of the blocking portion on the substrate overlap with each other, the blocking portion includes a second top surface facing away from the substrate and a third side surface surrounding the second top surface, the anti-oxidation portion includes a first side surface coplanar with the third side surface, and the conductive portion includes a second side surface coplanar with the first side surface, wherein: The fourth sublayer covers the second top surface, the first side surface, the second side surface, the third side surface, and a side of the first sublayer facing away from the substrate; The materials of the fourth sublayer, the anti-oxidation layer and the first sublayer include silicon compounds, the material of the barrier layer includes indium tin oxide and / or indium zinc oxide, and the material of the conductive layer includes titanium and / or aluminum and / or molybdenum and / or copper; The fourth sub-layer, the anti-oxidation layer and the first sub-layer are made of the same material.

16. The display panel according to claim 7, characterized in that: The at least one via hole includes a plurality of via holes corresponding to the plurality of light emitting units, and the encapsulation layer further includes a fifth sublayer, wherein: The at least one conductive portion includes a conductive portion, the conductive portion continuously covers the plurality of via holes and is connected to the at least one first electrode through the plurality of via holes; The fifth sublayer covers a side of the at least one conductive portion facing away from the substrate.

17. The display panel according to claim 16, characterized in that: The material of the conductive part includes indium tin oxide and / or indium zinc oxide, and the material of the first sub-layer and the fifth sub-layer includes silicon-based compounds.

18. A display device, characterized in that: A display panel comprising any one of claims 1-17.

19. A method for preparing a display panel, characterized in that: include: preparing an isolation layer on a substrate, wherein the isolation layer comprises an isolation portion and an isolation opening formed by the isolation portion; A light-emitting layer is prepared on a side of the isolation layer away from the substrate, wherein the light-emitting layer includes light-emitting units located in each of the isolation openings; A first electrode layer is prepared on a side of the light-emitting layer away from the substrate, and the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; A packaging layer is prepared on the side of the first electrode layer away from the substrate, and the packaging layer includes First sublayer; A conductive layer is prepared on a side of the first sublayer facing away from the substrate, wherein the conductive layer includes a conductive portion, and the conductive portion is connected to the first electrode via hole; An anti-oxidation layer is prepared on a side of the conductive layer away from the substrate, wherein the anti-oxidation layer comprises an anti-oxidation portion, and an orthographic projection of the conductive portion on the substrate is located within an orthographic projection of the anti-oxidation portion on the substrate.

20. The preparation method according to claim 19, characterized in that: After the step of preparing a first electrode layer on a side of the light-emitting layer facing away from the substrate, the method further comprises: Preparing a first sub-material layer on a side of the first electrode layer facing away from the substrate, and patterning the first sub-material layer to obtain a first sub-layer, wherein the first sub-layer includes a via hole; A conductive layer is prepared on a side of the first sublayer facing away from the substrate, wherein the conductive layer includes the conductive portion, and the conductive portion is connected to the first electrode through the via hole; After the step of preparing the conductive layer on the side of the first sub-layer facing away from the substrate, the method further comprises: Preparing an anti-oxidation material layer on a side of the conductive layer away from the substrate, and sequentially etching the anti-oxidation material layer and the conductive layer using the same mask to form the conductive portion and the anti-oxidation layer, wherein the anti-oxidation layer includes the anti-oxidation portion, and the orthographic projection of the conductive portion on the substrate coincides with the orthographic projection of the anti-oxidation portion on the substrate; Before the step of sequentially etching the anti-oxidation material layer and the conductive layer using the same mask, the method further comprises: preparing a barrier material layer on a side of the anti-oxidation material layer away from the substrate, and patterning the barrier material layer to obtain a barrier portion, wherein the orthographic projection of the barrier portion on the substrate is located within the orthographic projection of the isolation portion on the substrate; The step of sequentially etching the anti-oxidation material layer and the conductive layer using the same mask comprises: sequentially dry etching the anti-oxidation material layer and the conductive layer using the blocking portion as a mask, the anti-oxidation layer comprising an anti-oxidation portion, and an orthographic projection of the blocking portion on the substrate coincides with an orthographic projection of the anti-oxidation portion on the substrate; The step of preparing a conductive layer on a side of the first sublayer facing away from the substrate comprises: preparing a full-surface conductive layer on a side of the first sublayer facing away from the substrate; The step of preparing an anti-oxidation layer on a side of the conductive layer away from the substrate comprises: preparing an entire anti-oxidation layer on a side of the conductive layer away from the substrate.

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