Electronic device comprising acoustic conduit

Abstract

The electronic device may comprise: a housing including a front surface, a rear surface opposite to the front surface, an inner space between the front surface and the rear surface, and a front frame surrounding at least a portion of the inner space; a display disposed on the front surface of the housing; and an acoustic module disposed in the inner space and including a speaker that generates sound. The front frame may include: a first frame portion that is disposed in the inner space and supports the acoustic module; and a second frame portion surrounding the periphery of the first frame portion and forming at least a portion of the side surface of the housing. An acoustic hole with a width direction that opens to the outside of the housing may be formed between the first frame portion and the second frame portion. An acoustic conduit for moving sound from an inlet in communication with the acoustic module toward an outlet in communication with the acoustic hole may be formed in the first frame portion. The acoustic conduit may have a cross-sectional width gradually increasing from the inlet toward the outlet in a state where the display is viewed.

Description

Electronic devices containing acoustic ducts

[0001] The disclosure below relates to an electronic device including an acoustic duct.

[0002] Electronic devices, including smartphones, wearable devices, and tablet PCs, may include an acoustic module for generating sound or receiving sound generated from outside the electronic device. The acoustic module is mounted on a housing of the electronic device and can emit or receive sound through an acoustic hole formed in the housing. The sound travels along an acoustic conduit and can be emitted to the outside of the housing through the acoustic hole. When the acoustic conduit is positioned adjacent to the acoustic hole formed at the center of the housing, the acoustic performance of the electronic device can be improved.

[0003] In one embodiment, an electronic device may include a housing including a front surface, a rear surface opposite the front surface, an internal space between the front surface and the rear surface, and a front frame surrounding at least a portion of the internal space; a display disposed on the front surface of the housing; and an acoustic module disposed in the internal space, the acoustic module including a speaker that generates sound. The front frame may include a first frame portion disposed in the internal space and supporting the acoustic module; and a second frame portion surrounding the periphery of the first frame portion and forming at least a portion of a side surface of the housing. An acoustic hole that opens to the outside of the housing in a width direction may be formed between the first frame portion and the second frame portion. An acoustic conduit may be formed in the first frame portion for moving the sound from an inlet communicating with the acoustic module toward an outlet communicating with the acoustic hole. When the display is viewed, a cross-sectional width of the acoustic conduit may gradually increase from the inlet toward the outlet.

[0004] In one embodiment, a method for manufacturing a housing of an electronic device may include a first injection step of injecting a first material for primary molding while a first movable mold is coupled to a first fixed mold to inject a first frame portion having an acoustic conduit formed therein; a first processing step of separating the first movable mold from the first fixed mold and processing the first frame portion; a second injection step of injecting a second material for secondary molding while the first frame portion is inserted into a second fixed mold and injecting a second frame portion connected to an outer periphery of the first frame portion to form a housing having an acoustic hole formed therein; and a second processing step of separating the housing from the second fixed mold and end milling the first frame portion to form an inlet of the acoustic conduit.

[0005] In one embodiment, an electronic device may include a housing including a front surface, a rear surface opposite to the front surface, an internal space between the front surface and the rear surface, and a front frame surrounding at least a portion of the internal space; a display disposed on the front surface of the housing; a camera module disposed to be exposed through the front or rear surface of the housing; and an acoustic module disposed in the internal space, the acoustic module including a speaker that generates sound. The front frame may include a first frame portion disposed in the internal space and supporting the acoustic module; and a second frame portion that surrounds the periphery of the first frame portion, forms at least a portion of a side surface of the housing, and is formed of a material different from the first frame portion. An acoustic hole that opens to the outside of the housing in a width direction may be formed between the first frame portion and the second frame portion. The first frame portion may include an acoustic conduit extending from an inlet communicating with the acoustic module toward an outlet communicating with the acoustic hole, the cross-sectional size of which gradually increases from the inlet toward the outlet; And a camera mounting hole may be formed to penetrate and position adjacent to the acoustic conduit, and for placing the camera module therein. The acoustic conduit may have a cross-sectional width that gradually increases from the inlet toward the outlet when facing the display.

[0006] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0008] FIG. 2 is a block diagram of an audio module of an electronic device according to one embodiment.

[0009] FIG. 3A is a front perspective view of an electronic device according to one embodiment.

[0010] FIG. 3b is a rear perspective view of an electronic device according to one embodiment.

[0011] Figure 4 is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 5A is a cross-sectional view illustrating an acoustic duct through which sound of an electronic device travels according to one embodiment.

[0013] Figure 5b is a drawing showing an enlarged portion of a part of Figure 5a.

[0014] Figure 5c is a cross-sectional view taken along line A-A' of Figure 5b.

[0015] FIG. 5d is a cross-sectional view illustrating an acoustic duct according to one embodiment.

[0016] FIG. 5e is a cross-sectional view illustrating a bridge portion formed in a first frame portion according to one embodiment.

[0017] Figure 5f is a cross-sectional view for explaining a state in which the bridge portion according to Figure 5e is connected by a connecting portion of the second frame portion.

[0018] FIG. 5g is a cross-sectional view illustrating a fingerprint sensing area formed in a first frame portion according to one embodiment.

[0019] Figure 6 is a flowchart of a method for manufacturing a housing of an electronic device according to one embodiment.

[0020] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0021] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0022] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0045] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0046] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., a foldable electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., the foldable electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0048] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0049] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0050]

[0051] FIG. 2 is a block diagram of an audio module of an electronic device according to one embodiment.

[0052] Referring to FIG. 2, the audio module (170) may include, for example, an audio input interface (210), an audio input mixer (220), an analog to digital converter (ADC) (230), an audio signal processor (240), a digital to analog converter (DAC) (250), an audio output mixer (260), or an audio output interface (270).

[0053] The audio input interface (210) can receive an audio signal corresponding to a sound acquired from the outside of the electronic device (101) as part of the input module (150) or through a microphone (e.g., a dynamic microphone, a condenser microphone, or a piezo microphone) configured separately from the electronic device (101). For example, when the audio signal is acquired from an external electronic device (102) (e.g., a headset or a microphone), the audio input interface (210) can receive the audio signal by being directly connected to the external electronic device (102) through a connection terminal (178) or wirelessly (e.g., Bluetooth communication) through a wireless communication module (192). According to one embodiment, the audio input interface (210) can receive a control signal (e.g., a volume control signal received through an input button) related to the audio signal acquired from the external electronic device (102). The audio input interface (210) includes a plurality of audio input channels, and can receive different audio signals for each corresponding audio input channel among the plurality of audio input channels. According to one embodiment, additionally or alternatively, the audio input interface (210) can receive audio signals from other components of the electronic device (101) (e.g., the processor (120) or the memory (130) of FIG. 1).

[0054] The audio input mixer (220) can synthesize a plurality of input audio signals into at least one audio signal. For example, according to one embodiment, the audio input mixer (220) can synthesize a plurality of analog audio signals input through the audio input interface (210) into at least one analog audio signal.

[0055] The ADC (230) can convert an analog audio signal into a digital audio signal. For example, according to one embodiment, the ADC (230) can convert an analog audio signal received through the audio input interface (210), or additionally or alternatively, an analog audio signal synthesized through the audio input mixer (220), into a digital audio signal.

[0056] The audio signal processor (240) may perform various processing on a digital audio signal input through the ADC (230) or a digital audio signal received from another component of the electronic device (101). For example, according to one embodiment, the audio signal processor (240) may change a sampling rate, apply one or more filters, perform interpolation processing, amplify or attenuate all or part of a frequency band, process noise (e.g., noise or echo reduction), change a channel (e.g., switching between mono and stereo), mix, or extract a specified signal on one or more digital audio signals. According to one embodiment, one or more functions of the audio signal processor (240) may be implemented in the form of an equalizer.

[0057] The DAC (250) can convert a digital audio signal into an analog audio signal. For example, according to one embodiment, the DAC (250) can convert a digital audio signal processed by an audio signal processor (240) or a digital audio signal obtained from another component of the electronic device (101) (e.g., a processor (120) or a memory (130)) into an analog audio signal.

[0058] The audio output mixer (260) can synthesize a plurality of audio signals to be output into at least one audio signal. For example, according to one embodiment, the audio output mixer (260) can synthesize an audio signal converted into analog through the DAC (250) and another analog audio signal (e.g., an analog audio signal received through the audio input interface (210)) into at least one analog audio signal.

[0059] The audio output interface (270) can output an analog audio signal converted by the DAC (250), or additionally or alternatively, an analog audio signal synthesized by the audio output mixer (260), to the outside of the electronic device (101) through the audio output module (155). The audio output module (155) can include, for example, a speaker such as a dynamic driver or a balanced armature driver, or a receiver. According to one embodiment, the audio output module (155) can include a plurality of speakers. In this case, the audio output interface (270) can output an audio signal having a plurality of different channels (e.g., stereo or 5.1 channels) through at least some of the speakers among the plurality of speakers. According to one embodiment, the audio output interface (270) can be directly connected to an external electronic device (102) (e.g., an external speaker or headset) through a connection terminal (178) or wirelessly through a wireless communication module (192) to output an audio signal.

[0060] According to one embodiment, the audio module (170) can generate at least one digital audio signal by synthesizing a plurality of digital audio signals using at least one function of the audio signal processor (240) without separately having an audio input mixer (220) or an audio output mixer (260).

[0061] According to one embodiment, the audio module (170) may include an audio amplifier (not shown) (e.g., a speaker amplifier circuit) capable of amplifying an analog audio signal input through an audio input interface (210) or an audio signal to be output through an audio output interface (270). According to one embodiment, the audio amplifier may be configured as a separate module from the audio module (170).

[0062]

[0063] FIG. 3a is a front perspective view of an electronic device according to one embodiment, FIG. 3b is a rear perspective view of an electronic device according to one embodiment, and FIG. 4 is an exploded perspective view of an electronic device according to one embodiment.

[0064] Referring to FIGS. 3a, 3b, and 4, an electronic device (301) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (310) having a front surface (310a) (e.g., a first surface), a rear surface (310b) (e.g., a second surface), and a side surface (311c) (e.g., a third surface) enclosing an internal space between the front surface (310a) and the rear surface (310b).

[0065] In one embodiment, the front surface (310a) may be formed by a first plate (311a) that is at least partially substantially transparent. For example, the first plate (311a) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back surface (310b) may be formed by a second plate (311b) that is substantially opaque. For example, the second plate (311b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination thereof. The side surface (311c) may be formed by a front frame (320) that is joined to the first plate (311a) and the second plate (311b) and includes a metal and / or a polymer. In one embodiment, the second plate (311b) and the front frame (320) may be formed seamlessly as one body. In one embodiment, the second plate (311b) and the front frame (320) may be formed of substantially the same material (e.g., aluminum).

[0066] In one embodiment, the first plate (311a) may include a plurality of first edge regions (312a-1) that are rounded from at least a portion of the front surface (310a) in a direction toward the second plate (311b) and extend in one direction (e.g., + / - X-axis direction), a plurality of second edge regions (312a-2) that are rounded from at least a portion of the front surface (310a) in a direction toward the second plate (311b) and extend in another direction (e.g., + / - Y-axis direction), and a plurality of third edge regions (312a-3) between the plurality of first edge regions (312a-1) and the plurality of second edge regions (312a-2) that are rounded from at least a portion of the front surface (310a) in a direction toward the second plate (311b).

[0067] In one embodiment, the second plate (311b) may include a plurality of fourth edge regions (312b-1) that are rounded in a direction toward the first plate (311a) from at least a portion of the rear surface (310b) and extend in one direction (e.g., + / - X-axis direction), a plurality of fifth edge regions (312b-2) that are rounded in a direction toward the first plate (311a) from at least a portion of the rear surface (310b) and extend in another direction (e.g., + / - Y-axis direction), and a plurality of sixth edge regions (312b-3) between the plurality of fourth edge regions (312b-1) and the plurality of fifth edge regions (312b-2) that are rounded in a direction toward the first plate (311a) from at least a portion of the rear surface (310b).

[0068] In one embodiment, the front frame (320) may surround at least a portion of the interior space between the front (310a) and the rear (310b). The front frame (320) may include a first frame portion (421) that forms a placement space for components of the electronic device (301) and a second frame portion (422) that is connected to the first frame portion (421) and is placed on at least a portion of the side surface (311c).

[0069] In one embodiment, the first frame portion (421) may be disposed inside (or body portion) of the electronic device (301). The first frame portion (421) may be formed integrally with the second frame portion (422) or may be formed separately and connected to the second frame portion (422). In one embodiment, a printed circuit board (451, 452), such as a PCB, may be disposed on the first frame portion (421). The first frame portion (421) may be connected to, for example, a ground of the printed circuit board (451, 452).

[0070] In one embodiment, a display (361) may be positioned on one surface of the first frame portion (421) (e.g., the lower surface (+Z-axis direction surface) of FIG. 4), and a second plate (311b) may be positioned on the other surface of the first frame portion (421) (e.g., the upper surface (-Z-axis direction surface) of FIG. 4).

[0071] In one embodiment, the second frame portion (422) may connect the edges of the first plate (311a) and the second plate (311b) and surround the space between the first plate (311a) and the second plate (311b) to form a side surface (311c) of the housing (310).

[0072] In one embodiment, the front frame (320) may be formed at least in part from a conductive material. For example, the second frame portion (422) may be formed from a metal and / or a conductive polymer material. In one embodiment, the first frame portion (421), like the second frame portion (422), may be formed from a metal and / or a conductive polymer material.

[0073] In one embodiment, the front frame (320) may include a support area (450) that accommodates or supports the acoustic module (500). Alternatively, the support area (450) may accommodate the acoustic module (500) and support the first circuit board (451). An acoustic conduit (460) through which sound is output from the acoustic module (500) may be formed within the support area (450).

[0074] In one embodiment, the electronic device (301) may include a display (361) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (361) may be positioned on the front surface (310a). In one embodiment, the display (361) may be exposed through at least a portion of the first plate (311a) (e.g., a plurality of first edge regions (312a-1), a plurality of second edge regions (312a-2), and a plurality of third edge regions (312a-3)).

[0075] In one embodiment, the edge of the display (361) may substantially coincide with the outer rim of the first plate (311a). In one embodiment, the display (361) may include a touch sensing circuit, a pressure sensor capable of sensing the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0076] In one embodiment, the display (361) may include a screen display area (361a) that is visually exposed and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (361a) may include a sensing area (361a-1) and a camera area (361a-2). In this case, the sensing area (361a-1) may overlap with at least a portion of the screen display area (361a). The sensing area (361a-1) may allow transmission of an input signal related to the sensor module (376) (e.g., the sensor module (176) of FIG. 1). The sensing area (361a-1) may display content similarly to a screen display area (361a) that does not overlap the sensing area (361a-1). For example, the sensing area (361a-1) may display content while the sensor module (376) is not operating. The camera area (361a-2) may overlap at least a portion of the screen display area (361a). The camera area (361a-2) may allow transmission of an optical signal related to the first camera module (380a, 380b) (e.g., the camera module (180) of FIG. 1). The camera area (361a-2) may display content similarly to the screen display area (361a) that does not overlap the camera area (361a-2). For example, the camera area (361a-2) may display content while the first camera module (380a, 380b) is not operating.

[0077] In one embodiment, the electronic device (301) may include an audio module (370) (e.g., the audio module (170) of FIG. 1). The audio module (370) may acquire sound from the outside of the electronic device (301). For example, the audio module (370) may be located on a side (311c) of the housing (310). In one embodiment, the audio module (370) may acquire sound through at least one hole.

[0078] In one embodiment, the electronic device (301) may include a sensor module (376). The sensor module (376) may sense a signal applied to the electronic device (301). The sensor module (376) may be located, for example, on the front surface (310a) of the electronic device (301). The sensor module (376) may form a sensing area (361a-1) in at least a portion of the screen display area (361a). The sensor module (376) may receive an input signal passing through the sensing area (361a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include a signal related to a user's biometric information (e.g., the user's fingerprint, voice, etc.).

[0079] In one embodiment, the electronic device (301) may include a camera module (380a, 380b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (380a, 380b) may include a first camera module (380a), a second camera module (380b), and a flash (380c). In one embodiment, the first camera module (380a) may be positioned to be exposed through the front side (310a) of the housing (310), and the second camera module (380b) and the flash (380c) may be positioned to be exposed through the back side (310b) of the housing (310). In one embodiment, at least a portion of the first camera module (380a) may be positioned in the housing (310) so as to be covered through the display (361). In one embodiment, the first camera module (380a) may receive an optical signal passing through the camera area (361a-2). In one embodiment, the second camera module (380b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (380c) may include a light-emitting diode or a xenon lamp.

[0080] In one embodiment, the electronic device (301) may include external sound holes (313, 315, 355). The external sound holes (3123, 315, 355) may output sound to the outside of the electronic device (301), and the electronic device (301) may include a plurality of external sound holes (313, 315, 355).

[0081] For example, the first external sound hole (315) may be formed adjacent to a side surface (311c) in one direction (e.g., +Y direction) of the housing (310), and specifically, may be formed adjacent to a camera area (361a-2) of a front camera module (380a) or a display (361). The second external sound hole (355) may be at least one hole formed on a side surface (311c) in one direction (e.g., -Y direction) of the housing (310). The electronic device (301) may output three-dimensional sound to the outside of the electronic device (301) through the first external sound hole (315) and the second external sound hole (355).

[0082] In one embodiment, a negative area of ​​a first external sound hole (315) may be provided on the outer edge of the first plate (311a), and the first plate (311a) and the display (361) may be combined, and the negative area may be implemented as the first external sound hole (315). The display (361) may be provided with a sound hole (362) for sound to pass through, and may guide sound from the sound module (500) toward the first external sound hole (315).

[0083] According to one embodiment, the electronic device (301) may output sound directly to the outside through the sound hole (362) without including the first external sound hole (315). The display (361) of one embodiment may include a notch structure in which the sound hole (362) and the camera module (380a) are located.

[0084] In one embodiment, the electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may receive a user's manipulation signal. The input module (350) may include, for example, at least one key input device that is positioned so as to be exposed on a side surface (311c) of the housing (310).

[0085] In one embodiment, the electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (378) may be disposed on a side surface (311c). For example, when the electronic device (301) is viewed in one direction (e.g., the +Y axis direction of FIG. 3a), the connection terminal may be disposed in the center of the side surface (311c), and the sound output module (355) may be disposed in one direction (e.g., the right direction) based on the connection terminal (378).

[0086] In one embodiment, the electronic device (301) may include a printed circuit board (451, 452) and a battery (489) (e.g., battery (189) of FIG. 1). In one embodiment, the printed circuit board (451, 452) may include a first circuit board (451) and a second circuit board (452). In this case, the first circuit board (451) may be accommodated in a first substrate slot (442a) of the first frame portion (421), and the second circuit board (452) may be accommodated in a second substrate slot (442b) of the first frame portion (421). In one embodiment, the battery (489) may be accommodated in a battery slot (445) of the first frame portion (421) formed between the first substrate slot (442a) and the second substrate slot (442b).

[0087] In one embodiment, the printed circuit board (451, 452), for example, the first circuit board (451), may be formed with a mounting portion (453) that is open from the front side (e.g., +Z direction) to the back side (e.g., -Z direction) opposite the front side. The mounting portion (453) may have a cross-sectional area equal to or larger than a cross-sectional area in a planar direction (e.g., XY plane) of the acoustic module (500) and may have a shape corresponding to a cross-sectional shape in a planar direction (e.g., XY plane) of the acoustic module (500). The acoustic module (500) may be accommodated in the mounting portion (453), and the acoustic module (500) and the first circuit board (451) may be positioned on a plane (e.g., XY plane) of substantially the same height.

[0088] In one embodiment, a processor (e.g., processor (120) of FIG. 1) may be disposed on the printed circuit boards (451, 452). The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) may be disposed on the printed circuit boards (451, 452). The wireless communication circuit may communicate with, for example, an external device (e.g., electronic device (104) of FIG. 1). The electronic device (301) may include an antenna structure (e.g., antenna module (197) of FIG. 1, antenna structure (50) of FIG. 5), and the wireless communication circuit may be electrically connected to the antenna structure. In one embodiment, the wireless communication circuit may generate a signal to be transmitted through the antenna structure or detect a signal received through the antenna structure. In one embodiment, the printed circuit board (451, 452) includes a ground, and the ground of the printed circuit board (451, 452) can function as a ground of an antenna structure implemented using a wireless communication circuit.

[0089]

[0090] FIG. 5A is a cross-sectional view illustrating an acoustic duct through which sound of an electronic device travels according to an embodiment, FIG. 5B is an enlarged view illustrating a portion of FIG. 5A, FIG. 5C is a cross-sectional view taken along line A-A' of FIG. 5B, FIG. 5D is a cross-sectional view illustrating an acoustic duct according to an embodiment, FIG. 5E is a cross-sectional view illustrating a bridge portion formed in a first frame portion according to an embodiment, FIG. 5F is a cross-sectional view illustrating a state in which the bridge portion according to FIG. 5E is connected by a connecting portion of a second frame portion, and FIG. 5G is a cross-sectional view illustrating a fingerprint sensing area formed in a first frame portion according to an embodiment.

[0091] Referring to FIGS. 5A to 5G, an electronic device (e.g., electronic device (301) of FIG. 3A) according to one embodiment may include a housing (e.g., housing (310) of FIG. 3A) including a front frame (520) (e.g., front frame (320) of FIG. 3B), a display (e.g., display (361) of FIG. 3A) disposed on the front side of the housing (e.g., front side (310a) of FIG. 3A), and an audio module (500) including a speaker that generates sound (e.g., audio module (500) of FIG. 4).

[0092] In one embodiment, the housing may form the exterior of the electronic device. In one embodiment, the housing may form an interior space. In one embodiment, an acoustic hole (515) may be formed on the exterior surface of the housing. For example, the acoustic hole (515) may be formed on the front surface of the housing (e.g., the front surface (310a) of FIG. 3A). In one embodiment, a front frame (520) may be arranged in the interior space of the housing, in which an acoustic conduit (560) (e.g., the acoustic conduit (460) of FIG. 4) is formed.

[0093] In one embodiment, the front frame (520) may be disposed in the interior space of the housing. For example, the front frame (520) may surround at least a portion of the interior space between the front and rear portions of the housing (e.g., the rear portion (310b) of FIG. 3b). For example, the front frame (520) may be provided so as to be close to the front portion of the housing where the sound hole (515) is formed. In one embodiment, the front frame (520) may be formed separately from the housing, but may also be formed integrally with the housing. For example, the front frame (520) may form at least a portion of a side surface of the housing.

[0094] In one embodiment, the front frame (520) may be formed integrally or separately. In one embodiment, the front frame (520) may be formed by a multi-shot injection molding process. In the following description, it is assumed that the front frame (520) is formed by a multi-shot injection molding process. However, the front frame (520) is not limited to a multi-shot injection molding process, and may be formed by various methods.

[0095] In one embodiment, the front frame (520) may include a first frame portion (521) and a second frame portion (522). In one embodiment, the first frame portion (521) and the second frame portion (522) may be connected to each other. For example, the first frame portion (521) and the second frame portion (522) may be connected to each other by an injection molding method. In one embodiment, the first frame portion (521) may form at least a portion of the interior of the front frame (520). For example, the first frame portion (521) may be disposed in an interior space of the housing. In one embodiment, the second frame portion (522) may form at least a portion of the exterior of the front frame (520).

[0096] In one embodiment, the first frame portion (521) may implement an internal structure in which various components implementing the functions of the electronic device are arranged. For example, an acoustic module (500) may be arranged in the first frame portion (521), and the first frame portion (521) may support the acoustic module (500). In one embodiment, an acoustic conduit (560) for moving sound generated by the acoustic module (500) may be formed in the first frame portion (521). In one embodiment, a camera mounting hole (521a) may be formed in the first frame portion (521). In one embodiment, a camera module (e.g., the camera module (180) of FIG. 1) may be arranged in the camera mounting hole (521a). In one embodiment, the camera mounting hole (521a) may be formed penetratingly at a position adjacent to the acoustic conduit (560). In one embodiment, the camera mounting hole (521a) may be formed at a set distance (e.g., 2 mm) or more from the acoustic conduit (560) to prevent or reduce degradation of the acoustic performance of the electronic device and the performance of the camera module.

[0097] In one embodiment, the second frame portion (522) may have an appearance corresponding to the design of the electronic device. For example, the second frame portion (522) may surround the perimeter of the first frame portion (521) and form at least a portion of a side surface of the housing.

[0098] In one embodiment, the first frame part (521) and the second frame part (522) may be connected by injection molding, and an acoustic hole (515) may be formed between the first frame part (521) and the second frame part (522). In one embodiment, the acoustic hole (515) may be formed to be open to the outside of the housing. In one embodiment, sound generated by the acoustic module (500) may be emitted to the outside of the housing through the acoustic hole (515). In one embodiment, the first frame part (521) and the second frame part (522) may be formed of different materials. For example, the first frame part (521) may be formed of a PC GF20% (Polycarbonate GlassFiber 20%) material, and the second frame part (522) may be formed of a PC GF10% material.

[0099] In one embodiment, the acoustic conduit (560) is formed by connecting the first frame part (521) and the second frame part (522), thereby forming an outlet (560b) that is in communication with the length of the acoustic conduit (560) and the acoustic hole (515), and the inside of the first frame part (521) may be processed (e.g., end milled) to form an inlet (560a) of the acoustic conduit (560) so as to be in communication with the acoustic module (500). In one embodiment, the acoustic conduit (560) is formed by penetrating the inside of the first frame part (521) and may function as an acoustic path through which sound can travel. In one embodiment, based on the path formed by the acoustic conduit (560), one end of the acoustic conduit (560) may be in communication with the acoustic hole (515) formed in the housing.

[0100] In one embodiment, the inlet (560a) of the acoustic conduit (560) may be in communication with the acoustic module (500), and the outlet (560b) of the acoustic conduit (560) may be in communication with the acoustic hole (515). In one embodiment, sound may pass from the acoustic module (500) through the inlet (560a) of the acoustic conduit (560), through the outlet (560b) of the acoustic conduit (560), reach the acoustic hole (515), and travel to the outside of the housing through the acoustic hole (515).

[0101] Below, the cross-sectional shape of the sound pipe (560) will be described based on a state in which the display (e.g., the display (361) of FIG. 3a) is viewed (e.g., a state in which the display is viewed in the -Z-axis direction).

[0102] In one embodiment, the acoustic conduit (560) may be formed to be spaced apart from the camera mounting hole (521a) disposed adjacent to the central axis (C) of the housing by a minimum distance. In one embodiment, as the distance of the acoustic conduit (560) from the acoustic hole (515) disposed adjacent to the central axis (C) of the housing decreases, the acoustic performance deviation according to the left and right grip of the electronic device may be eliminated. In one embodiment, the size of the cross-section of the acoustic conduit (560) may gradually increase from the inlet (560a) of the acoustic conduit (560) toward the outlet (560b). For example, based on a state of looking at a display of the electronic device (e.g., display (361) of FIG. 3A), the width of the cross-section of the acoustic conduit (560) (e.g., length in the X-axis direction) may gradually increase from the inlet (560a) of the acoustic conduit (560) toward the outlet (560b). For example, based on the length in the height direction (e.g., Z-axis direction) of the housing perpendicular to the front surface of the housing (e.g., front surface (310a) of FIG. 3a), the length (D2) in the height direction at the exit (560b) of the acoustic conduit (560) may be greater than or equal to the length (D1) in the height direction at the entrance (560a) of the acoustic conduit (560).

[0103] In one embodiment, the sound pipe (560) may be formed so that the sound travels from the entrance (560a) of the sound pipe (560) to the exit (560b) of the sound pipe (560) toward the center of the sound hole (515). For example, an imaginary straight line (L3) extending from the center of the entrance (560a) of the sound pipe (560) to the center of the exit (560b) of the sound pipe (560) may be formed so as to be inclined toward the center (515-1) of the sound hole (515).

[0104] In one embodiment, the acoustic conduit (560) may have a cross-sectional width (e.g., length in the X-axis direction) that increases from an inlet (560a) communicating with the acoustic module (500) toward an outlet (560b) communicating with the acoustic hole (515). In one embodiment, the acoustic conduit (560) may include a first side wall (561) and a second side wall (562) when facing a display (e.g., display (361) of FIG. 3A). In one embodiment, the first side wall (561) and the second side wall (562) may be formed to be perpendicular to a front surface of the housing (e.g., front surface (310a) of FIG. 3A) (e.g., in the Z-axis direction of FIG. 5A). In one embodiment, the first side wall (561) may refer to a side wall of the acoustic pipe (560) adjacent to the acoustic hole (515), and the second side wall (562) may refer to a side wall of the acoustic pipe (560) opposite the first side wall (561). In one embodiment, the first side wall (561) and the second side wall (562) may be formed to extend from the inlet (560a) of the acoustic pipe (560) toward the outlet (560b), respectively. For example, the first side wall (561) and the second side wall (562) may be formed to extend away from each other from the inlet (560a) of the acoustic pipe (560) toward the outlet (560b).

[0105] In one embodiment, the first side wall (561) may form a straight line based on a state when looking at a display of the electronic device (e.g., display (361) of FIG. 3A). In one embodiment, the straight line (L1) formed by the first side wall (561) may be formed to be away from the straight line (L2) formed by the second side wall (562) and may be formed to be adjacent to the sound hole (515). For example, the first side wall (561) may form a straight line (L1) that is inclined toward the center (515-1) of the sound hole (515). In one embodiment, the straight line (L1) formed by the first side wall (561) may be formed to be inclined with respect to the straight line (L2) formed by the second side wall (562). In one embodiment, the first side wall (561) may be formed adjacent to a camera mounting hole (521a) for arranging a camera module. In one embodiment, the first side wall (561) may be formed to be spaced apart from the camera mounting hole (521a) by a set distance (e.g., 2 mm) or more. For example, the first side wall (561) may be formed to be in contact with a virtual circle (521a-2) (521a-2) that is concentric with the camera mounting hole (521a).

[0106] In one embodiment, the first side wall (561) may form a curve based on a state in which the display of the electronic device (e.g., the display (361) of FIG. 3A) is viewed. For example, the first side wall (561) may form a curve having a constant curvature based on the center (521a-1) of the camera mounting hole (521a).

[0107] In one embodiment, the second side wall (562) may form a straight line based on a state in which a display of the electronic device (e.g., the display (361) of FIG. 3A) is viewed. In one embodiment, the second side wall (562) may form a straight line that is substantially perpendicular (e.g., the Y-axis direction of FIG. 5A) to a width direction of the sound hole (515) (e.g., the X-axis direction of FIG. 5A). In one embodiment, in order to reduce the eccentricity of the sound pipe (560) from the sound hole (515), the second side wall (562), which is formed at a position farther from the sound hole (515) than the first side wall (561), may form a straight line based on a state in which the display is viewed.

[0108] In one embodiment, the first frame portion (521) may include a plurality of bridge portions (5211). In one embodiment, each of the plurality of bridge portions (5211-1, 5211-2) may be formed to be separated along the circumferential direction of the first frame portion (521). In one embodiment, each of the plurality of bridge portions (5211-1, 5211-2) may include a conductive member so that a metal antenna may be mounted on the bridge portion (5211). In one embodiment, each of the plurality of bridge portions (5211-1, 5211-2) may have different lengths, thereby ensuring different frequency bands. In one embodiment, the second frame portion (522) may include a connecting portion (5221) connecting the plurality of bridge portions (5211). In one embodiment, the second frame portion (522) may be formed with a connecting portion (5221) that connects each of a plurality of bridge portions (5211) formed separately along the circumferential direction of the first frame portion (521) to each other. In one embodiment, in the process of connecting the second frame portion (522) to the first frame portion (521), the connecting portion (5221) of the second frame portion (522) may connect the plurality of bridge portions (5211) of the first frame portion (521).

[0109] In one embodiment, the first frame portion (521) may include a fingerprint sensing area (521b). In one embodiment, a fingerprint sensor (not shown) may be arranged in the fingerprint sensing area (521b). In one embodiment, the fingerprint sensing area (521b) may be formed in the first frame portion (521). In one embodiment, the color of the first frame portion (521) in which the fingerprint sensing area (521b) is formed and the color of the second frame portion (522) in which the fingerprint sensing area (521b) is not formed may be different. For example, the first frame portion (521) may have a black color, and the second frame portion (522) may have any color other than black. In one embodiment, in the process of connecting the second frame portion (522) to the first frame portion (521), the fingerprint sensing area (521b) may have a different color from the adjacent area, which may minimize the impact on the angle of view of the fingerprint sensor.

[0110]

[0111] Hereinafter, a method for manufacturing a housing of an electronic device according to an embodiment will be described. In describing the method for manufacturing a housing of an electronic device, descriptions that overlap with those previously mentioned will be omitted. Furthermore, unless otherwise specified, terms identical to those previously mentioned may be understood to refer to the same configuration. In this document, the designations of "~steps" do not limit the order of the processes, and the designations of "~steps" may be understood as "~processes" or "~operations."

[0112] FIG. 6 is a flowchart illustrating a method for manufacturing a housing of an electronic device according to one embodiment.

[0113] A method for manufacturing a housing (e.g., a housing (510) of FIG. 5A) of an electronic device (e.g., an electronic device (301) of FIG. 3A) according to one embodiment may include molding a front frame (e.g., a front frame (520) of FIG. 5A) including a first frame part (e.g., a first frame part (521) of FIG. 5A) and a second frame part (e.g., a second frame part (522) of FIG. 5A) through double injection.

[0114] In one embodiment, a method for manufacturing a housing of an electronic device may include a first injection step (601) of injecting a first material for primary molding while a first movable mold is coupled to a first fixed mold to inject a first frame part in which an acoustic conduit (e.g., an acoustic conduit (560) of FIG. 5A) is formed, a first processing step (602) of separating the first movable mold from the first fixed mold and machining the first frame part, a second injection step (603) of injecting a second material for secondary molding while the first frame part is inserted into a second fixed mold to inject a second frame part connected to the outer periphery of the first frame part to form a housing (e.g., a housing (310) of FIG. 3A) in which an acoustic hole (e.g., an acoustic hole (515) of FIG. 5A) is formed, and a second processing step (604) of separating the housing from the second fixed mold and end milling the first frame part to form an inlet of the acoustic conduit.

[0115] In the first injection step (601), a first material for primary molding (e.g., PC GF20%) is injected while the first movable mold is joined to the first fixed mold, thereby integrally molding the first frame portion in which the acoustic pipe is formed. The first movable mold may be used to secure a space within the first fixed mold for forming the acoustic pipe.

[0116] In the first processing step (602), the first movable mold can be separated from the first fixed mold, and the first frame portion can be processed. In the first processing step (602), a plurality of bridge portions (e.g., a plurality of bridge portions (5211) of FIG. 5E) can be formed in the first frame portion. The plurality of bridge portions can be formed by partially segmenting the first frame portion along the circumferential direction of the first frame portion.

[0117] In the second injection step (603), while the first frame part is inserted into the second fixed mold, a second material (e.g., PC GF10%) for secondary molding is injected to integrally mold the second frame part connected to the outer periphery of the first frame part. As a gap is formed between the first frame part and the second frame part, an acoustic hole can be formed.

[0118] In the second processing step (604), the first frame portion may be end milled to form an inlet of an acoustic conduit. Accordingly, the inlet of the acoustic conduit may be connected to the acoustic module, and the outlet of the acoustic conduit may be connected to the acoustic hole.

[0119]

[0120] In one embodiment, an electronic device (101; 201; 301) comprises a housing (310) including a front surface (310a), a rear surface (310b) opposite to the front surface (310a), an internal space between the front surface (310a) and the rear surface (310b), and a front frame (320; 520) surrounding at least a portion of the internal space; a display (361) disposed on the front surface (310a) of the housing (310); and an acoustic module (500) disposed in the internal space and including a speaker that generates sound, wherein the front frame (320; 520) comprises: a first frame portion (421; 521) disposed in the internal space and supporting the acoustic module (500); And a second frame part (422; 522) that surrounds the periphery of the first frame part (421; 521) and forms at least a part of the side surface (311c) of the housing (310), and an acoustic hole (313; 315; 355; 515) that is open to the outside of the housing (310) in the width direction is formed between the first frame part (421; 521) and the second frame part (422; 522), and an acoustic conduit (460; 560) is formed in the first frame part (421; 521) to move the sound from an inlet (560a) that communicates with the acoustic module (500) toward an outlet (560b) that communicates with the acoustic hole (313; 315; 355; 515), and the acoustic conduit (460; 560) is formed when facing the display (361). The width of the cross-section may gradually increase from the inlet (560a) toward the outlet (560b).

[0121] In one embodiment, when looking at the display (361), an imaginary straight line (L3) extending from the center of the inlet (560a) of the sound pipe (460; 560) to the center of the outlet (560b) of the sound pipe (460; 560) may be inclined toward the center of the sound hole (313; 315; 355; 515).

[0122] In one embodiment, the acoustic conduit (460; 560) includes a first side wall (561) perpendicular to the front surface (310a) of the housing (310) and adjacent to the acoustic hole (313; 315; 355; 515); and a second side wall (562) perpendicular to the front surface (310a) of the housing (310) and opposite to the first side wall (561), wherein the first side wall (561) and the second side wall (562) each extend from the inlet (560a) toward the outlet (560b), and the first side wall (561) and the second side wall (562) may extend away from each other.

[0123] In one embodiment, when looking at the display (361), the first side wall (561) may form a straight line (L1) that slopes toward the center of the sound hole (313; 315; 355; 515).

[0124] In one embodiment, when looking at the display (361), the second side wall (562) can form a straight line (L2) substantially perpendicular to the width direction of the sound hole (313; 315; 355; 515).

[0125] In one embodiment, when looking at the display (361), the first side wall (561) forms a straight line (L1), and the straight line (L1) formed by the first side wall (561) can be inclined with respect to the straight line (L2) formed by the second side wall (562).

[0126] In one embodiment, when looking at the display (361), the first side wall (561-1) may form a curve.

[0127] In one embodiment, the acoustic conduit (460; 560) may be formed such that the cross-sectional size of the acoustic conduit (460; 560) gradually expands from the inlet (560a) toward the outlet (560b).

[0128] In one embodiment, the sound pipe (460; 560) may have a length (D2) in the height direction at the outlet (560b) that is greater than or equal to the length (D1) in the height direction at the inlet (560a), based on the length in the height direction perpendicular to the front surface (310a).

[0129] In one embodiment, the first frame portion (421; 521) is formed with a camera mounting hole (521a) formed through a hole adjacent to the sound pipe (460; 560) and for placing a camera module (180), and when looking at the display (361), the sound pipe (460; 560) can be spaced apart from the camera mounting hole (521a) by a set distance or more.

[0130] In one embodiment, based on a state in which the display (361) is viewed, the sound conduit (460; 560) may include a first side wall (561) adjacent to the camera mounting hole (521a) and in contact with an imaginary circle (521a-2) concentric with the camera mounting hole (521a); ​​and a second side wall (562) facing the first side wall (561) and extending perpendicularly to the width direction of the sound hole (313; 315; 355; 515) from the inlet (560a) toward the outlet (560b).

[0131] In one embodiment, based on a state in which the display (361) is viewed, the sound conduit (460; 560) may include a first side wall (561) adjacent to the camera mounting hole (521a), forming a constant curvature based on the center (521a-1) of the camera mounting hole (521a), and extending from the inlet (560a) to the outlet (560b); and a second side wall (562) opposite to the first side wall (561), extending perpendicularly to the width direction of the sound hole (313; 315; 355; 515) from the inlet (560a) toward the outlet (560b).

[0132] In one embodiment, the first frame portion (421; 521) may include a plurality of bridge portions (5211) separated along the circumferential direction of the first frame portion (421; 521) and each including a conductive member, and the second frame portion (422; 522) may include a connecting portion (5221) connecting the plurality of bridge portions (5211).

[0133] In one embodiment, the first frame portion (421; 521) and the second frame portion (422; 522) may be formed of different materials.

[0134] In one embodiment, the first frame portion (421; 521) includes a fingerprint sensing area (521b) where a fingerprint sensor is placed, and the colors of the first frame portion (421; 521) and the second frame portion (422; 522) may be different.

[0135] In one embodiment, a method for manufacturing a housing (310) of an electronic device (101; 201; 301) comprises: a first injection step (610) of injecting a first material for primary molding while a first movable mold is coupled to a first fixed mold to inject a first frame part (421; 521) in which an acoustic conduit (460; 560) is formed; a first processing step (620) of separating the first movable mold from the first fixed mold and processing the first frame part (421; 521); The method may include a second injection step (630) of forming a housing (310) in which sound holes (313; 315; 355; 515) are formed by injecting a second frame part (422; 522) connected to the outer periphery of the first frame part (421; 521) by injecting a second material for secondary molding while the first frame part (421; 521) is inserted into the second fixed mold; and a second processing step (640) of separating the housing (310) from the second fixed mold and end milling the first frame part (421; 521) to form an inlet (560a) of the sound conduit (460; 560).

[0136] In one embodiment, the first processing step (620) includes a step of forming a plurality of bridge portions (5211) by partially segmenting the first frame portion (421; 521) along the circumferential direction, and the second frame portion (422; 522) may include a connecting portion (5221) connecting the plurality of segmented bridge portions (5211).

[0137] In one embodiment, an electronic device (101; 201; 301) comprises a housing (310) including a front surface (310a), a rear surface (310b) opposite to the front surface (310a), an internal space between the front surface (310a) and the rear surface (310b), and a front frame (320; 520) surrounding at least a portion of the internal space; a display (361) disposed on the front surface (310a) of the housing (310); a camera module (180) disposed to be exposed through the front surface (310a) or the rear surface (310b) of the housing (310); and an acoustic module (500) disposed in the internal space and including a speaker that generates sound, wherein the front frame (320; 520) comprises: a first frame portion (421; 521) disposed in the internal space and supporting the acoustic module (500); And a second frame part (422; 522) that surrounds the periphery of the first frame part (421; 521), forms at least a part of the side surface (311c) of the housing (310), and is formed of a different material from the first frame part (421; 521), and an acoustic hole (313; 315; 355; 515) that is open to the outside of the housing (310) in a width direction is formed between the first frame part (421; 521) and the second frame part (422; 522), and in the first frame part (421; 521), an inlet (560a) that communicates with the acoustic module (500) extends toward an outlet (560b) that communicates with the acoustic hole (313; 315; 355; 515), and a size of the cross section is from the inlet (560a) toward the outlet (560b). A gradually increasing acoustic conduit (460; 560); and a camera mounting hole (521a) formed penetratingly at a position adjacent to the acoustic conduit (460; 560) and for which the camera module (180) is placed, are formed, and the width of the cross-section of the acoustic conduit (460; 560) can gradually increase from the inlet (560a) toward the outlet (560b) when facing the display (361).

[0138] In one embodiment, the acoustic conduit (460; 560) has a first side wall (561) perpendicular to the front surface (310a) of the housing (310) and adjacent to the acoustic hole (313; 315; 355; 515); And a second side wall (562) perpendicular to the front surface (310a) of the housing (310) and facing the first side wall (561), wherein the first side wall (561) and the second side wall (562) each extend from the inlet (560a) toward the outlet (560b), and the first side wall (561) and the second side wall (562) extend away from each other, and when facing the display (361), the first side wall (561) forms a straight line that is inclined toward the center of the sound hole (313; 315; 355; 515), and the second side wall (562) forms a straight line that is substantially perpendicular to the width direction of the sound hole (313; 315; 355; 515), and the straight line formed by the first side wall (561) is formed by the second side wall (562). It can be inclined to a straight line.

[0139] In one embodiment, the first frame portion (421; 521) may be formed of a PC GF20% material, and the second frame portion (422; 522) may be formed of a PC GF10% material.

Claims

1. In electronic devices (101; 201; 301), A housing (310) including a front surface (310a), a rear surface (310b) opposite to the front surface (310a), an internal space between the front surface (310a) and the rear surface (310b), and a front frame (320; 520) surrounding at least a portion of the internal space; A display (361) placed on the front (310a) of the housing (310); and It includes an acoustic module (500) that is arranged in the above internal space and includes a speaker that generates sound, The above front frame (320; 520) is A first frame part (421; 521) positioned in the above internal space and supporting the above acoustic module (500); and A second frame portion (422; 522) is included, which surrounds the periphery of the first frame portion (421; 521) and forms at least a portion of a side surface (311c) of the housing (310). Between the first frame part (421; 521) and the second frame part (422; 522), an acoustic hole (313; 315; 355; 515) is formed that is open to the outside of the housing (310) in the width direction. In the first frame part (421; 521) above, an acoustic conduit (460; 560) is formed to move the sound from an inlet (560a) communicating with the acoustic module (500) toward an outlet (560b) communicating with the acoustic hole (313; 315; 355; 515). The above sound pipe (460; 560) is an electronic device (101; 201; 301) in which the width of the cross section gradually increases from the inlet (560a) toward the outlet (560b) when facing the display (361).

2. In paragraph 1, When looking at the above display (361), An electronic device (101;201;301), wherein an imaginary straight line (L3) extending from the center of the inlet (560a) of the above-mentioned sound conduit (460;560) to the center of the outlet (560b) of the above-mentioned sound conduit (460;560) is inclined toward the center of the above-mentioned sound hole (313;315;355;515).

3. In paragraph 1 or 2, The above sound pipe (460; 560) is A first side wall (561; 561-1) perpendicular to the front surface (310a) of the housing (310) and adjacent to the sound hole (313; 315; 355; 515); and It includes a second side wall (562) that is perpendicular to the front surface (310a) of the housing (310) and faces the first side wall (561), The first side wall (561) and the second side wall (562) each extend from the inlet (560a) toward the outlet (560b), An electronic device (101; 201; 301), wherein the first side wall (561) and the second side wall (562) extend away from each other.

4. In any one of paragraphs 1 to 3, When looking at the above display (361), The electronic device (101; 201; 301), wherein the first side wall (561) forms a straight line (L1) that slopes toward the center of the sound hole (313; 315; 355; 515).

5. In any one of paragraphs 1 to 4, When looking at the above display (361), The electronic device (101; 201; 301), wherein the second side wall (562) forms a straight line (L2) substantially perpendicular to the width direction of the sound hole (313; 315; 355; 515).

6. In any one of paragraphs 1 to 5, When looking at the above display (361), The above first side wall (561) forms a straight line (L1), An electronic device (101; 201; 301) in which a straight line (L1) formed by the first side wall (561) is inclined with respect to a straight line (L2) formed by the second side wall (562).

7. In any one of paragraphs 1 to 6, When looking at the above display (361), The above first side wall (561-1) forms a curve, electronic device (101; 201; 301).

8. In any one of paragraphs 1 to 7, An electronic device (101;201;301) in which the above-mentioned acoustic conduit (460;560) is formed such that the size of the cross-section of the above-mentioned acoustic conduit (460;560) gradually expands from the inlet (560a) toward the outlet (560b).

9. In any one of paragraphs 1 to 8, The above sound pipe (460; 560) is Based on the length in the vertical direction to the front (310a) above, An electronic device (101; 201; 301) in which the length (D2) in the height direction at the above outlet (560b) is greater than or equal to the length (D1) in the height direction at the above inlet (560a).

10. In any one of paragraphs 1 to 9, In the first frame part (421; 521) above, a camera mounting hole (521a) is formed through a penetration formed at a position adjacent to the sound pipe (460; 560) and for placing a camera module (180). Based on the state of looking at the above display (361), The above sound pipe (460; 560) is an electronic device (101; 201; 301) spaced apart from the camera mounting hole (521a) by a set distance or more.

11. In any one of paragraphs 1 to 10, Based on the state of looking at the above display (361), The above sound pipe (460; 560) is A first side wall (561) adjacent to the camera mounting hole (521a) and in contact with a virtual circle (521a-2) concentric with the camera mounting hole (521a); ​​and An electronic device (101; 201; 301) comprising a second side wall (562) facing the first side wall (561) and extending perpendicularly to the width direction of the sound hole (313; 315; 355; 515) from the inlet (560a) toward the outlet (560b).

12. In any one of paragraphs 1 to 11, Based on the state of looking at the above display (361), The above sound pipe (460; 560) is A first side wall (561) adjacent to the camera mounting hole (521a), forming a constant curvature based on the center (521a-1) of the camera mounting hole (521a), and extending from the inlet (560a) to the outlet (560b); and An electronic device (101; 201; 301) comprising a second side wall (562) facing the first side wall (561) and extending perpendicularly to the width direction of the sound hole (313; 315; 355; 515) from the inlet (560a) toward the outlet (560b).

13. In any one of paragraphs 1 to 12, The first frame portion (421; 521) includes a plurality of bridge portions (5211) separated along the circumferential direction of the first frame portion (421; 521) and each including a conductive member. An electronic device (101; 201; 301), wherein the second frame portion (422; 522) includes a connecting portion (5221) connecting the plurality of bridge portions (5211).

14. In any one of paragraphs 1 to 13, An electronic device (101; 201; 301), wherein the first frame portion (421; 521) and the second frame portion (422; 522) are formed of different materials.

15. In any one of paragraphs 1 to 14, The above first frame portion (421; 521) includes a fingerprint sensing area (521b) where a fingerprint sensor is placed, An electronic device (101; 201; 301), wherein the colors of the first frame portion (421; 521) and the second frame portion (422; 522) are different.

Images