Organic light-emitting display device

Abstract

The organic light-emitting display device may include: a bank between sub-pixels on a substrate; an anode electrode in the sub-pixel; an organic light-emitting layer disposed on the anode electrode and the bank and including a hole injection layer; a cathode electrode disposed on the organic light-emitting layer and in contact with an end of the hole injection layer; and a blocking structure in an edge region of the bank. The organic light-emitting layer has a separation structure corresponding to the blocking structure, and the hole injection layer may be disconnected from the separation structure.

Description

organic light emitting display device

[0001] The embodiment relates to an organic light emitting display device.

[0002] As demand for portable information media increases, attempts to apply organic light-emitting diodes (OLEDs) to various lightweight and thin information electronic devices are expanding. Recently, OLEDs are being applied to product groups such as mobile PCs and automobiles rather than TVs or mobile phones. Since OLEDs applied to mobile PCs and automobiles operate with still images for long periods of time, long lifespan is required. To achieve long lifespan, light extraction from OLEDs must be maximized. Furthermore, to reduce costs, it is necessary to expand the technology to produce OLEDs on substrates (110) of not only 8.5th generation (2200x2500mm) but also 10.5th generation (3370x2940mm). To produce OLEDs with long lifespan, each subpixel with a top emission structure and side-by-side structure must be implemented with a structure of two or more OLEDs.

[0003] The structure of these organic light-emitting devices can be obtained through deposition equipment using a fine metal mask (FMM, hereinafter referred to as FMM). However, the deposition method using FMM has the problem of low productivity because the production logistics must be produced only in a cluster manner rather than an inline manner. In addition, there is a problem of low alignment position accuracy (PPA) of the subpixel unit between the FMM and the substrate. Accordingly, the emission area ratio (EAR) is small, which limits the product life. Here, the emission area ratio is a value obtained by dividing the emission area of ​​a subpixel by the area of ​​the subpixel.

[0004] Therefore, it is very urgent to develop an organic light-emitting display device having a new deposition method and a new organic light-emitting element structure using the new deposition method to solve the aforementioned problems.

[0005] The present invention aims to solve the above-mentioned and other problems.

[0006] Another object of the embodiment is to provide an organic light emitting display device having a novel structure.

[0007] Another object of the present invention is to provide an organic light emitting display device capable of improving lifespan.

[0008] Another object of the present invention is to provide an organic light-emitting display device capable of improving productivity and yield.

[0009] Another object of the present invention is to provide an organic light-emitting display device capable of improving image quality.

[0010] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0011] According to one aspect of the embodiment to achieve the above or other purposes, an organic light-emitting display device includes: a bank between subpixels on a substrate; an anode electrode on the subpixel; an organic light-emitting layer disposed on the anode electrode and the bank, the organic light-emitting layer including a hole injection layer; a cathode electrode disposed on the organic light-emitting layer and in contact with an end of the hole injection layer; and a blocking structure in an edge region of the bank; wherein the organic light-emitting layer has a separation structure corresponding to the blocking structure, and the hole injection layer is disconnected from the separation structure.

[0012] The above blocking structure may include at least one blocking layer extending inward from the side of the bank.

[0013] The above blocking structure may have an undercut structure having a blocking gap corresponding to the width of the blocking layer. The margin of the blocking gap may be set between the distance between the cathode electrode and the second organic light-emitting stack in the red organic light-emitting device having the largest thickness and the distance between the anode electrode and the cathode electrode in the blue organic light-emitting device having the smallest thickness.

[0014] The thickness of the above blocking gap can be set based on a deposition simulation experiment and an actual deposition experiment based on a method of setting the blocking gap calculated from the thickness of the organic light-emitting element for each color.

[0015] The organic light-emitting layer may include a first organic light-emitting stack between the hole injection layer and the charge generation layer; and a second organic light-emitting stack between the charge generation layer and the cathode electrode. The cathode electrode may be in contact with an end of the charge generation layer.

[0016] The first organic light-emitting layer and the charge generation layer may be disconnected in the separation structure.

[0017] The cathode electrode may include at least one of a first conductive layer or a second conductive layer. The first conductive layer may include a Mg:Ag alloy, and the second conductive layer may include a conductive oxide material.

[0018] The organic light-emitting display device may further include a protrusion on an upper side of the bank. The protrusion may have a connection structure including an auxiliary electrode electrically connected to the cathode electrode. The protrusion may include a first layer; and a second layer on the first layer. The connection structure may have an undercut structure in which a side of the first layer is recessed into the inside of the protrusion from a side of the second layer.

[0019] The second conductive layer is disposed on the first conductive layer, the first conductive layer is disposed on the organic light-emitting layer, and the second conductive layer can be in contact with a side of the first layer and a lower side of the second layer.

[0020] The protrusion may further include a third layer below the first layer. A side of the third layer may be positioned on the same line as a side of the second layer or may extend from a side of the second layer in the direction of the subpixel.

[0021] At least one of the first layer, the second layer or the third layer may be the auxiliary electrode.

[0022] The hole injection layer is disposed on the third layer, and the first conductive layer can be in contact with an end of the hole injection layer and an upper side of the third layer.

[0023] The second conductive layer is disposed on the first conductive layer, the first conductive layer is disposed on the organic light-emitting layer, and the second conductive layer can be in contact with a side of the first layer, a lower side of the second layer, an end of the hole injection layer, and an upper side of the third layer.

[0024] The above protrusion may further include a fourth layer on the second layer.

[0025] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0026] According to at least one of the embodiments, there is an advantage that the process can be simplified and the process cost can be reduced because there is no need to use FMM.

[0027] According to at least one of the embodiments, there is an advantage that the EAR within a subpixel can be increased without the need for using an FMM, thereby improving the lifetime.

[0028] According to at least one of the embodiments, the organic light-emitting device is deposited on a large-area substrate in an inline deposition system, thereby providing advantages in productivity, yield, and material utilization efficiency.

[0029] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0030] FIG. 1 is a plan view schematically illustrating an organic light-emitting display device according to a first embodiment.

[0031] Figure 2 is a plan view illustrating one pixel of Figure 1.

[0032] Fig. 3 is a circuit diagram illustrating an organic light-emitting display device according to an embodiment.

[0033] Figure 4a is a cross-sectional view taken along line AA' in the pixel of Figure 2.

[0034] Figure 4b is a cross-sectional view taken along line BB' in the pixel of Figure 2.

[0035] Figure 4c is a cross-sectional view taken along line CC' in the pixel of Figure 2.

[0036] FIG. 5 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0037] Fig. 6 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0038] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0039] FIG. 8a is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment.

[0040] Fig. 8b is a cross-sectional view showing a connection structure in the asymmetric blocking connection structure of Fig. 8a.

[0041] Fig. 8c is a cross-sectional view showing a blocking structure in the asymmetric blocking connection structure of Fig. 8a.

[0042] FIG. 9 illustrates an organic light-emitting element stacked in a two-stack structure in each subpixel according to an embodiment.

[0043] FIG. 10a is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0044] Fig. 10b is a cross-sectional view showing a connection structure in the asymmetric blocking connection structure of Fig. 10a.

[0045] Fig. 10c is a cross-sectional view showing a blocking structure in the asymmetric blocking connection structure of Fig. 10a.

[0046] Figure 11 shows the deposition simulation results of a green organic light-emitting element deposited around the undercut structure of the blocking structure.

[0047] Figures 12a to 12g illustrate various protrusions.

[0048] Figures 13a to 13c show various arrangement positions of the blocking structure in an asymmetric blocking connection structure according to an embodiment.

[0049] Fig. 14 is a cross-sectional view illustrating an organic light-emitting display device according to the sixth embodiment.

[0050] Fig. 15 is a cross-sectional view illustrating an organic light-emitting display device according to the seventh embodiment.

[0051] Fig. 16 is a cross-sectional view illustrating an organic light-emitting display device according to the eighth embodiment.

[0052] Fig. 17 is a cross-sectional view illustrating an organic light-emitting display device according to the ninth embodiment.

[0053] FIGS. 18A to 18D illustrate at least one layer added between the electron injection layer and the cathode electrode of the second organic light-emitting stack.

[0054] Figures 19a to 19c show simulated results of luminance according to the thickness of a capping layer including LiF according to comparative examples and examples.

[0055] Fig. 20 is a plan view schematically illustrating an organic light-emitting display device according to a second embodiment.

[0056] Figure 21 is a plan view illustrating one pixel of Figure 20.

[0057] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0058] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate (110) is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0059] Hereinafter, an organic light-emitting display device having a side-by-side structure manufactured using a photolithography process is disclosed. This structure is referred to as a side-by-side structure by photolithography (Ph-SbS). By using a photolithography process, the use of an FMM is eliminated, simplifying the process and reducing the process cost. In addition, the EAR within a subpixel is increased, thereby improving the lifespan. In addition, since an organic light-emitting element is deposited on a large-area substrate in an inline deposition system, productivity, yield, and material utilization efficiency can be improved.

[0060] Hereinafter, the red subpixel (SPr) may be referred to as a first subpixel, the green subpixel (SPg) may be referred to as a second subpixel, and the blue subpixel (SPb) may be referred to as a third subpixel. In addition, the red organic light-emitting element (120r) may be referred to as a first organic light-emitting element, the green organic light-emitting element (120g) may be referred to as a second organic light-emitting element, and the blue organic light-emitting element (120b) may be referred to as a third organic light-emitting element.

[0061] Hereinafter, the organic light-emitting display device (100) is a top-emitting type that displays an image by emitting light in the upper direction of the substrate (110), but a bottom-emitting type that displays an image by emitting light in the lower direction of the substrate (110) may also be included in the technical concept of the present invention.

[0062] Hereinafter, the drawing symbols of the auxiliary electrodes may be given as AC as shown in Fig. 3 unless a separate drawing symbol is given.

[0063] Fig. 1 is a schematic plan view of an organic light-emitting display device according to a first embodiment. Fig. 2 is a plan view illustrating one pixel of Fig. 1.

[0064] Referring to FIGS. 1 and 2, an organic light-emitting display device (100) according to the first embodiment may include a plurality of pixels (P) arranged in a matrix. The plurality of pixels (P) may be positioned in a display area (AA). An area other than the display area (AA) may be a non-display area (NAA).

[0065] Each pixel (P) may include, for example, a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). For example, a red organic light-emitting element (120r) may be disposed in a red subpixel (SPr), a green organic light-emitting element (120g) may be disposed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be disposed in a blue subpixel (SPb). Although the drawing illustrates that one pixel (P) includes three subpixels (SPr, SPg, SPb), it may include more subpixels.

[0066] The drawing shows the area of ​​the blue subpixel (SPb) to be larger than the area of ​​the red subpixel (SPr) or the area of ​​the green subpixel (SPg), but other variations are possible.

[0067] Each subpixel (SPr, SPg, SPb) may include an emitting area (EA) and a non-emitting area (NEA). The emitting area (EA) may be an area where the organic light-emitting elements (120r, 120g, 120b) of each subpixel (SPr, SPg, SPb) are arranged, and the non-emitting area (NEA) may be an area remaining in each subpixel (SPr, SPg, SPb) excluding the emitting area (EA).

[0068] Meanwhile, a first power line (PL1) and a second power line (PL2) may be provided to supply power to each subpixel (SPr, SPg, SPb). A first power terminal (101) may be electrically connected to one end of the first power line (PL1), and a second power terminal (102) may be electrically connected to one end of the second power line (PL2). The first power terminal (101) and the second power terminal (102) may be electrically connected to a power supply unit (not shown) to receive a first potential voltage and a second potential voltage. The second potential voltage may be greater than the first potential voltage, and the first potential voltage may be grounded.

[0069] A first power line (PL1) and a second power line (PL2) may be arranged between non-emitting areas (NEAs) along a first direction (X). The first power line (PL1) and the second power line (PL2) may be electrically connected to each subpixel (SPr, SPg, SPb).

[0070] The contact pad (103) may be located in the non-emitting area (NEA). The first power line (PL1) may be electrically connected to the contact pad (103).

[0071] The auxiliary electrode (AC in FIG. 3) may be positioned in the non-luminous area (NEA). The auxiliary electrode (AC) may be positioned in the non-luminous area (NEA) along the second direction (Y), but is not limited thereto.

[0072] The auxiliary electrode (AC) may be positioned in a non-emitting area (NEA) adjacent to each subpixel (SPr, SPg, SPb). The auxiliary electrode (AC) may be electrically connected to a first power line (PL1) via a contact pad (103).

[0073] The first power line (PL1), the contact pad (103) and the auxiliary electrode (AC) can be arranged in different layers.

[0074] The auxiliary electrode (AC) may be electrically connected to the cathode electrode of an adjacent organic light-emitting element (120r, 120g, 120b) of an adjacent subpixel (SPr, SPg, SPb). For example, when the auxiliary electrode (AC) is positioned between a red subpixel (SPr) and a green subpixel (SPg), the auxiliary electrode (AC) may be electrically connected to the cathode electrode of the red organic light-emitting element (120r) and the cathode electrode of the green organic light-emitting element (120g).

[0075] Accordingly, the auxiliary electrode (AC) can supply the first potential voltage from the first power line (PL1) to the cathode electrode of each organic light-emitting element (120r, 120g, 120b).

[0076] Meanwhile, the second power line (PL2) may be electrically connected to a driving circuit (106) of each subpixel (SPr, SPg, SPb), for example, a driving transistor, but is not limited thereto. Accordingly, when a specific subpixel is selected in response to a scan signal provided through a specific gate line, light having a brightness corresponding to a current flowing in the driving transistor of the specific subpixel may be emitted by the first potential voltage of the first power line (PL1) and the second potential voltage of the second power line (PL2).

[0077] A plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged in a stripe shape along the second direction (Y). That is, the plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged continuously without being separated along the second direction (Y). For example, red organic light-emitting elements (120r) may be arranged continuously along the second direction (Y), green organic light-emitting elements (120g) may be arranged continuously along the second direction (Y), and blue organic light-emitting elements (120b) may be arranged continuously along the second direction (Y).

[0078] As another example, the plurality of organic light-emitting elements (120r, 120g, 120b) may be separated into pixel (P) units or row-line units along the second direction (Y). That is, the red organic light-emitting element (120r) may be separated into pixel (P) units or row-line units along the second direction (Y), the green organic light-emitting element (120g) may be separated into pixel (P) units or row-line units along the second direction (Y), and the blue organic light-emitting element (120b) may be separated into pixel (P) units or row-line units along the second direction (Y).

[0079] The red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) can be alternately arranged in units of columns along the first direction (X). That is, the red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) having different colors can be sequentially positioned along the first direction (X) to implement an organic light-emitting display device having a side-by-side structure.

[0080] Meanwhile, an asymmetric open-connect (AOC) structure (105) may be positioned in the non-emitting area (NEA). In an embodiment, the asymmetric open-connect structure (105) may include a connecting structure (105A) and a blocking structure (105B). Since the ratios of depth and gap in the undercut structures of each of the connecting structure (105A) and the blocking structure (105B) are different, the structure may be named an asymmetric open-connect structure (105). The depth may represent the width of the undercut structure in the horizontal direction, and the gap may represent the width of the undercut structure in the vertical direction.

[0081] As will be explained later, lateral leakage current between a plurality of subpixels (SPr, SPg, SPb) can be prevented by the asymmetric blocking connection structure (105). The lateral leakage current may refer to a leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along the first direction (X). In addition, an electrical short between an anode electrode and a cathode electrode in the corresponding subpixels (SPr, SPg, SPb) can be prevented by the asymmetric blocking connection structure (105). Therefore, by using the asymmetric blocking connection structure (105), color spotting due to leakage current can be improved and luminous efficiency and brightness can be significantly improved.

[0082] The connection structure (105A) may be a structure that electrically connects the auxiliary electrode (AC) to the cathode electrode of each organic light-emitting element (120r, 120g, 120b). The blocking structure (105B) may be a structure that separates a layer including a low-resistance organic light-emitting material of each organic light-emitting element (120r, 120g, 120b), such as a hole injection layer, a charge generation layer, etc., thereby preventing an electrical short between the anode electrode and the cathode electrode and reducing leakage current between sub-pixels. The asymmetric blocking connection structure (105) may also be called a 'paradoxical blocking connection'.

[0083] Fig. 3 is a circuit diagram illustrating an organic light-emitting display device according to an embodiment. Fig. 3 may be a circuit diagram for an electrical connection from the first power terminal (101) and the second power terminal (102) in Fig. 2 to a green subpixel (SPg). The circuit diagram illustrated in Fig. 2 may also be equally applied to a circuit diagram for an electrical connection from the first power terminal (101) and the second power terminal (102) to a red subpixel (SPr) or a blue subpixel (SPb).

[0084] As shown in FIG. 3, the first power terminal (101) and the second power terminal (102) can be arranged in the non-display area (NAA), and the first power line (PL1) and the second power line (PL2) can be arranged in the non-display area (NAA) and the display area (AA).

[0085] A contact pad (103) is positioned in the non-emitting area (NEA) and can be electrically connected to a first power line (PL1). The first power line (PL1) can be electrically connected to an auxiliary electrode (AC) through the contact pad (103).

[0086] The organic light-emitting element (120g) may be arranged in the light-emitting area (EA) of the subpixel (SPg), and the connection structure (105A) and the blocking structure (105B) may be arranged in the non-light-emitting area (NEA). The asymmetric blocking connection structure (105) illustrated in FIG. 2 may be formed by the connection structure (105A) and the blocking structure (105B). The auxiliary electrode (AC) may be electrically connected to the cathode electrode (123g) of the organic light-emitting element (120g) by the connection structure (105A). The hole injection layer, etc., of the organic light-emitting element (120g) may be electrically disconnected by the blocking structure (105B), thereby causing an electrical short circuit between the anode electrode (121g) and the cathode electrode (123g).

[0087] As illustrated in Figure 3, various resistances can be formed between each component. Each resistance can be defined as follows.

[0088] R1: Contact resistance between the contact pad (103) and the auxiliary electrode (AC)

[0089] R2: Resistance between the auxiliary electrode (AC) and the cathode electrode

[0090] R4: Resistance between the anode electrode (121g) and the cathode electrode (123g) due to the hole injection layer arranged in the horizontal direction, etc.

[0091] R5: Resistance between the anode electrode (121g) and the cathode electrode (123g) due to multiple organic light-emitting layers arranged in a vertical direction.

[0092] R6: Resistance between the first power line (PL1) and the contact pad (103)

[0093] R7: Resistance between the first power line (PL1) and the auxiliary electrode (AC)

[0094] Among the resistors mentioned above, the hole injection layer forming the fourth resistor (R4) is made of a low-resistance organic light-emitting material, so that leakage current can easily flow through the hole injection layer. If leakage current flows through the hole injection layer, etc., an electrical short between the anode electrode (121g) and the cathode electrode (123g) may cause light not to be emitted from the corresponding subpixel (SPr, SPg, SPb) or the luminance of the light may be significantly lower than the desired luminance.

[0095] In an embodiment, the hole injection layer corresponding to the blocking structure (105B) is cut off by the blocking structure (105B), so that leakage current flowing to the hole injection layer, etc. can be cut off.

[0096] In an embodiment, the cathode electrode (123g) can be easily connected to the auxiliary electrode (AC) by the connection structure (105A), and the deposition area of ​​the organic light-emitting element (120g) can be maximized to improve the light-emitting efficiency.

[0097] Fig. 4a is a cross-sectional view taken along line AA' in the pixel of Fig. 2. Fig. 4b is a cross-sectional view taken along line BB' in the pixel of Fig. 2. Fig. 4c is a cross-sectional view taken along line CC' in the pixel of Fig. 2.

[0098] Referring to FIGS. 1, 2, and 4a to 4c, an organic light-emitting display device according to an embodiment may include a plurality of banks (111-1, 111-2), a plurality of protrusions (130-1, 130-2), a plurality of organic light-emitting elements (120r, 120g, 120b), etc.

[0099] A plurality of banks (111-1, 111-2), a plurality of protrusions (130-1, 130-2), and a plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged on a substrate (110). The plurality of banks (111-1, 111-2), the plurality of protrusions (130-1, 130-2), and / or the plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged on the substrate (110) in a stripe shape along a second direction (Y), respectively. In this case, subpixels of the same color may be arranged along the second direction (Y). For example, a plurality of red subpixels (SPr) may be arranged in a stripe shape along the second direction (Y). The banks (111-1, 111-2) may include an inorganic material or an organic material. For example, the banks (111-1, 111-2) may include inorganic materials such as SiNx, SiON, etc.

[0100] Meanwhile, as illustrated in FIG. 4c, the transverse banks (111-3) may be arranged in row-line units along the second direction (Y). Conversely, the protrusions may not be arranged in row-line units along the second direction (Y). That is, the protrusions may not be arranged on the transverse banks (111-3) along the second direction (Y).

[0101] To distinguish them from the transverse banks (111-3), the first bank (111-1) and the second bank (111-2) may be referred to as longitudinal banks.

[0102] The plurality of subpixels (SPr, SPg, SPb) may be separated from each other by a plurality of banks (111-1, 111-2). A first bank (111-1) may be arranged between a red subpixel (SPr) and a green subpixel (SPg), and a second bank (111-2) may be arranged between a green subpixel (SPg) and a blue subpixel (SPb). Although not shown, a third bank may be arranged between a blue subpixel (SPb) and another red subpixel (SPr).

[0103] A plurality of organic light-emitting elements (120r, 120g, 120b) can be spatially separated and electrically isolated from each other by a plurality of banks (111-1, 111-2). Accordingly, lateral leakage current between the plurality of subpixels (SPr, SPg, SPb) can be blocked, thereby improving color spotting and enhancing light-emitting efficiency and brightness.

[0104] A red organic light-emitting element (120r) may be placed in a red subpixel (SPr), a green organic light-emitting element (120g) may be placed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be placed in a blue subpixel (SPb).

[0105] The plurality of banks (111-1, 111-2) may have a grid shape. For example, the banks (111-1, 111-2) may be arranged along the perimeter of the subpixels (SPr, SPg, SPb). That is, the plurality of banks (111-1, 111-2) may be arranged between adjacent subpixels (SPr, SPg, SPb) along the first direction (X) and between adjacent subpixels (SPr, SPg, SPb) along the second direction (Y). In this case, the adjacent subpixels (SPr, SPg, SPb) along the first direction (X) may have different colors, while the adjacent subpixels (SPr, SPg, SPb) along the second direction (Y) may have the same color.

[0106] A plurality of organic light-emitting elements (120r, 120g, 120b) can be separated from each other by a plurality of banks (111-1, 111-2). The plurality of banks (111-1, 111-2) can be arranged to distinguish each of the plurality of organic light-emitting elements (120r, 120g, 120b). The red organic light-emitting element (120r) and the green organic light-emitting element (120g) can be separated by the first bank (111-1), and the green organic light-emitting element (120g) and the blue organic light-emitting element (120b) can be separated by the second bank (111-2).

[0107] Meanwhile, the organic light-emitting display device according to the embodiment may include a blocking structure (105B) in the edge region of each of the plurality of banks (111-1, 111-2). For example, the blocking structure (105B) may be arranged in the edge region of the lower side of each of the plurality of banks (111-1, 111-2), but is not limited thereto.

[0108] The blocking structure (105B) may be arranged in an edge region of the banks (111-1, 111-2) between subpixels (SPr, SPg, SPb) along the first direction (X). The blocking structure (105B) may be arranged in an edge region of the banks (111-1, 111-2) between subpixels (SPr, SPg, SPb) along the second direction (Y).

[0109] When organic light-emitting elements (120r, 120g, 120b) are deposited on banks (111-1, 111-2), some layers of the organic light-emitting elements (120r, 120g, 120b) may be disconnected by the blocking structure (105B). For example, the blocking structure (105B) may disconnect a low-resistance layer of each organic light-emitting element (120r, 120g, 120b). The low-resistance layer may include, for example, a hole injection layer, a charge generation layer, etc. The low-resistance layer may mean a layer having a resistance value lower than the resistance value of a high-resistance layer, for example, an organic light-emitting layer, an electron transport layer, an electron injection layer, etc.

[0110] For example, the organic light-emitting layers (122r, 122g, 122b) of each organic light-emitting element (120r, 120g, 120b) may have separation structures (125-1 to 125-3) corresponding to the blocking structure (105B). The separation structures (125-1 to 125-3) may mean a shape in which some layers of the organic light-emitting layers (122r, 122g, 122b) are disconnected. Accordingly, in the separation structures (125-1 to 125-3), for example, a hole injection layer, a charge generation layer, etc. may be disconnected.

[0111] The blocking structure (105B) may include at least one blocking layer (113) extending inward from the side of the bank (111-1, 111-2). An undercut structure may be formed in the edge region of the bank (111-1, 111-2) by the blocking layer (113). The blocking layer (113) may include a silicon-based inorganic material, a metal, or the like. Aluminum (Al), molybdenum (Mo), a molybdenum alloy, or the like may be used as the metal, but is not limited thereto.

[0112] In a case where an organic light-emitting element (120r, 120g, 120b) is deposited on a bank (111-1, 111-2) in which an undercut structure is formed in this way, some layers corresponding to the undercut structure, such as a hole injection layer and a charge generation layer, among the organic light-emitting layers (122r, 122g, 122b) of the organic light-emitting element (120r, 120g, 120b) may be disconnected.

[0113] Meanwhile, as described above, organic light-emitting elements (120r, 120g, 120b) corresponding to each subpixel (SPr, SPg, SPb) may be arranged.

[0114] The red organic light-emitting element (120r) may include an anode electrode (121r), a red organic light-emitting layer (122r), a cathode electrode (123r), etc. The red organic light-emitting layer (122r) may be disposed on the anode electrode (121r), and the cathode electrode (123r) may be disposed on the red organic light-emitting layer (122r). The green organic light-emitting element (120g) may include an anode electrode (121g), a green organic light-emitting layer (122g), a cathode electrode (123g), etc. The green organic light-emitting layer (122g) may be disposed on the anode electrode (121g), and the cathode electrode (123g) may be disposed on the green organic light-emitting layer (122g). The blue organic light-emitting element (120b) may include an anode electrode (121b), a blue organic light-emitting layer (122b), a cathode electrode (123b), etc. The blue organic light-emitting layer (122b) may be disposed on the anode electrode (121b), and the cathode electrode (123b) may be disposed on the blue organic light-emitting layer (122b).

[0115] The anode electrode (121r, 121g, 121b) may include multiple conductive layers. The anode electrode (121r, 121g, 121b) may have a triple structure composed of ITO / Ag alloy / ITO. The anode electrode (121r, 121g, 121b) may have a triple structure composed of ITO / Ag alloy / (Ti, Mo or MoTi).

[0116] One end of the anode electrode (121r, 121g, 121b) may be placed below the bank (111-1, 111-2). That is, one end of the bank (111-1, 111-2) may be placed on one end of the anode electrode (121r, 121g, 121b). One end of the anode electrode (121r, 121g, 121b) may vertically overlap with the bank (111-1, 111-2).

[0117] The red organic light-emitting layer (122r), the green organic light-emitting layer (122g), and the blue organic light-emitting layer (122b) may include at least a hole injection layer including a low-resistance organic light-emitting material.

[0118] Meanwhile, one end of the hole injection layer and / or the charge generation layer may be in contact with the cathode electrode (123r, 123g, 123b). In addition, the lower surface of the hole injection layer may be in contact with the anode electrode (121r, 121g, 121b). In this case, since the resistance of the hole injection layer is small, a leakage current may flow between the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b), which may cause an electrical short between the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b).

[0119] However, according to the embodiment, since the hole injection layer and / or the charge generation layer are disconnected by the blocking structure (105B) arranged in the edge region of the bank (111-1, 111-2), the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b) are electrically disconnected, so that an electrical short can be prevented.

[0120] Meanwhile, the organic light-emitting display device according to the embodiment may include a plurality of protrusions (130-1, 130-2).

[0121] A plurality of organic light-emitting elements (120r, 120g, 120b) can be spatially separated and electrically isolated from each other by a plurality of protrusions (130-1, 130-2). Accordingly, lateral leakage current between the plurality of subpixels (SPr, SPg, SPb) can be blocked, thereby improving color unevenness and enhancing light-emitting efficiency and brightness.

[0122] A plurality of protrusions (130-1, 130-2) may be arranged on the upper side of a plurality of banks (111-1, 111-2). A first protrusion (130-1) may be arranged on the upper side of a first bank (111-1) between a red subpixel (SPr) and a green subpixel (SPg). A second protrusion (130-2) may be arranged on the upper side of a second bank (111-2) between a green subpixel (SPg) and a blue subpixel (SPb).

[0123] The left and right sides of the protrusions (130-1, 130-2) may have shapes that are symmetrical with respect to the central normal line of the protrusions (130-1, 130-2), but this is not limited thereto. For example, the left and right sides of the protrusions (130-1, 130-2) may each have an undercut structure. In this case, the undercut structure on the left side and the undercut structure on the right side may have shapes that are symmetrical with respect to the central normal line of the protrusions (130-1, 130-2).

[0124] The protrusions (130-1, 130-2) may have a connecting structure (105A) including an auxiliary electrode (AC) electrically connected to the cathode electrodes (123r, 123g, 123b).

[0125] The protrusions (130-1, 130-2) may include a first layer (131) and a second layer (132) on the first layer (131).

[0126] The side of the first layer (131) can enter the inside of the protrusion from the side of the second layer (132). Therefore, an undercut structure can be formed on the side of the protrusion by the first layer (131) and the second layer (132). The undercut structure can have a cave shape. For example, the undercut structure can have a U-shaped dongle shape. Therefore, the undercut structure can be called a dongle, a U-shaped cave, a cave, etc. In order to form the undercut structure, the first layer (131) and the second layer (132) can have different etching selectivities. For example, the first layer (131) can include a material having a high etching rate, and the second layer (132) can include a material having a low etching rate. Accordingly, when the first layer (131) and the second layer (132) are etched after a photosensitive pattern is formed on the second layer (132), the side of the first layer (131) is etched faster than the side of the second layer (132), so that an undercut structure can be formed on the side of the protrusion (130-1, 130-2).

[0127] The first layer (131) and / or the second layer (132) may include a metal or a conductive oxide material having excellent electrical conductivity. The metal may include titanium (Ti), molybdenum (Mo), molybdenum-titanium (MoTi), aluminum (Al), copper (Cu), and alloys thereof. The conductive oxide material may include ITO, IZO, and the like.

[0128] Meanwhile, by adjusting the distance between the target and source of the evaporation source (or evaporation source device), the deposition material can be deposited on the substrate (110) at different deposition angles. The target-source distance may be the distance between the evaporation source and the substrate (110). The deposition angle may be the angle of an imaginary line between the evaporation source and the lower edge (132a) of the second layer (132) with respect to the normal direction. For example, the larger the target-source distance, the smaller the deposition angle. The smaller the deposition angle, the closer the layer formed by the deposition material can be deposited to the adjacent subpixel. The larger the deposition angle, the closer the layer can be deposited to the protrusions (130-1, 130-2).

[0129] As shown in FIGS. 4a, 4b, and 4c, by depositing the deposition materials at different deposition angles, one end of the organic light-emitting layer (122r, 122g, 122b) and one end of the first conductive layer (123-1) of the cathode electrode (123r, 123g, 123b) can be positioned differently from each other.

[0130] The cathode electrode (123r, 123g, 123b) may include a plurality of conductive layers (123-1, 123-2). For example, the cathode electrode (123r, 123g, 123b) may include a first conductive layer (123-1) and a second conductive layer (123-2) on the first conductive layer (123-1), but may also include three or more conductive layers.

[0131] One end of the organic light-emitting layer (122r, 122g, 122b) and one end of the first conductive layer (123-1) may be positioned on the upper side of the bank (111-1, 111-2). For example, one end of the organic light-emitting layer (122r, 122g, 122b) may be positioned closer to the first layer (131) than one end of the first conductive layer (123-1).

[0132] The second conductive layer (123-2) may be disposed on the entire area of ​​the substrate (110). The second conductive layer (123-2) may be deposited using a sputtering process. That is, the second conductive layer (123-2) may be disposed on the upper side of the first conductive layer (123-1) of each subpixel (SPr, SPg, SPb), the upper side of the banks (111-1, 111-2), and the side and upper side of the protrusions (130-1, 130-2). The second conductive layer (123-2) may be in contact with the side of the first layer (131) and / or the lower side of the second layer (132).

[0133] For example, the first conductive layer (123-1) may include a metal having excellent electrical conductivity, and the second conductive layer (123-2) may include a conductive oxide material. For example, the first conductive layer (123-1) may include a Mg:Ag alloy, and the second conductive layer (123-2) may include ITO, IZO, and the like.

[0134] A first conductive layer (123-1) can be formed by deposition of a Mg:Ag alloy using an evaporation source. However, since the step coverage characteristics of Mg:Ag are poor, it is difficult for a deposition material including a Mg:Ag alloy to be deposited deep within the undercut structure of the connection structure (105A). In addition, if the film thickness uniformity of the first conductive layer (123-1) including a Mg:Ag alloy is insufficient or the process margin is insufficient, the first conductive layer (123-1) may not be electrically connected to the auxiliary electrode (AC) included in the connection structure (105A), resulting in poor electrical connection.

[0135] To solve this problem, a conductive oxide material such as ITO having excellent step coverage characteristics can be deposited on the substrate (110) using a sputtering process, thereby being deposited deep within the undercut structure of the connection structure (105A). Accordingly, the second conductive layer (123-2) can be stably deposited on the side of the first layer (131), which is the auxiliary electrode (AC), so that electrical connection failure between the cathode electrodes (123r, 123g, 123b) including the first conductive layer (123-1) and the second conductive layer (123-2) and the auxiliary electrode (AC) can be prevented. In addition, the uniformity of the film thickness of the conductive layer can be secured, so that the stability of production quality can be improved.

[0136] When the second conductive layer (123-2) is formed on the first conductive layer (123-1), there is no need to adjust or manage the deposition angle to deposit the first conductive layer (123-1) using an evaporation source. In addition, even if the first conductive layer (123-1) as well as the organic light-emitting layers (122r, 122g, 122b) using an evaporation source are freely deposited without being restricted by the deposition angle, the organic light-emitting layers (122r, 122g, 122b) can be deposited in the corresponding subpixels (SPr, SPg, SPb), and the cathode electrodes (123r, 123g, 123b) can be stably connected to the auxiliary electrodes (AC) of the protrusions (130-1, 130-2) by the second conductive layer (123-2). Therefore, when configured with a combination of the aforementioned connection structure (105A) and blocking structure (105B), productivity and material utilization efficiency can be improved through a more free deposition process.

[0137] In addition, when the organic light-emitting display device is implemented in a top emission manner, the light-emitting efficiency can be improved by utilizing constructive interference between the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b) by using a cathode electrode (123r, 123g, 123b) including a first conductive layer (123-1) including an Ag:Mg alloy and an anode electrode (121r, 121g, 121b) including a semi-transparent material.

[0138] Meanwhile, the protrusions (130-1, 130-2) may include a fourth layer (134) on the second layer (132). The fourth layer (134) may be omitted. The fourth layer (134) may include an inorganic material such as SiO2, SiNx, or SiONx. The fourth layer (134) may include a conductive oxide material such as ITO. The fourth layer (134) may act as a stopper for the second layer (132). As described above, in order to form a side-by-side structure, the red subpixel (SPr), the green subpixel (SPg), and the blue subpixel (SPb) may be etched twice, respectively. At this time, when these two etchings are performed, the area or thickness of the second layer (132) may be changed. In this case, the deposition angle determined by the lower edge (132a) of the second layer (132) is different, so the deposition area in each subpixel (SPr, SPg, SPb) is different, which ultimately leads to a problem of deterioration in image quality.

[0139] In order to solve the above-mentioned problem, when a fourth layer (134) that acts as a stopper is formed on the second layer (132), even if two etchings are performed, the etching of the second layer (132) is suppressed or prevented by the fourth layer (134), so that the deposition angle determined by the edge (132a) on the lower side of the second layer (132) can be fixed. Accordingly, the deposition area in each subpixel (SPr, SPg, SPb) is secured to the target area, so that the image quality can be improved.

[0140] Although not shown, a third layer may be disposed beneath the first layer (131), but this is not limited thereto. The third layer may include a material having a low etching rate. The third layer may include a metal or a conductive oxide material having excellent electrical conductivity. The third layer may include an inorganic material having a low etching rate.

[0141] When the third layer comprises a metal or a conductive oxide material, the third layer may be an auxiliary electrode (AC).

[0142] The etching rate of the third layer may be the same as or slower than the etching rate of the second layer (132). When the second layer (132) and the third layer are etched simultaneously, since the etching rate of the third layer is the same as or slower than the etching rate of the second layer (132), the side of the third layer may be positioned on the same vertical line as the side of the second layer (132) or may be arranged to extend further in the direction of the adjacent subpixel from the side of the second layer (132).

[0143] Meanwhile, the organic light-emitting display device according to the embodiment may include an encapsulating layer (135). The encapsulating layer (135) may be a blocking layer that prevents moisture or the like from penetrating into the organic light-emitting elements (120r, 120g, 120b).

[0144] Meanwhile, the organic light-emitting display device according to the embodiment may include a plurality of color filter layers (140r, 140g, 140b) and a plurality of encapsulating layers (141r, 141g, 141b).

[0145] The plurality of color filter layers (140r, 140g, 140b) may include a resin material. The plurality of encapsulating layers (141r, 141g, 141b) may include a plurality of layers. Some of the plurality of layers may include an inorganic material, and other layers may include an organic material.

[0146] The red color filter layer (140r) may be arranged in the red subpixel (SPr). The red color filter layer (140r) may be arranged on the red organic light-emitting element (120r) in the red subpixel (SPr), so that only red light corresponding to the target red wavelength band preset to the red color filter layer (140r) among the wavelength bands of red light emitted from the red organic light-emitting element (120r) may be emitted.

[0147] A green color filter layer (140g) may be arranged on a green subpixel (SPg). The green color filter layer (140g) may be arranged on a green organic light-emitting element (120g) in the green subpixel (SPg), so that only green light corresponding to a target green wavelength band preset to the green color filter layer (140g) among the wavelength bands of green light emitted from the green organic light-emitting element (120g) may be emitted.

[0148] The blue color filter layer (140b) may be arranged in the blue subpixel (SPb). The blue color filter layer (140b) may be arranged on the blue organic light-emitting element (120b) in the blue subpixel (SPb), so that only blue light corresponding to a target blue wavelength band preset in the blue subpixel layer can be emitted among the wavelength band of blue light emitted from the blue organic light-emitting element (120b).

[0149] Each of the plurality of color filter layers (140r, 140g, 140b) may have a color filter function that allows only color light of a preset wavelength band to be emitted.

[0150] As described above, the plurality of color filter layers (140r, 140g, 140b) can further improve the color purity of each color compared to when there is no color filter layer, and in particular, can play a role in improving the change in color purity according to the viewing angle in an organic light-emitting display device having a top emission structure. Currently, a polarizing plate is attached to remove light reflected by the reflective material of the anode electrode (121r, 121g, 121b) when external light is incident. However, the most important role of the plurality of color filter layers (140r, 140g, 140b) may be that the plurality of color filter layers (140r, 140g, 140b) can absorb external light to improve the contrast ratio, and further, the polarizing plate can be removed to contribute to cost reduction.

[0151] Meanwhile, the plurality of color filter layers (140r, 140g, 140b) may each have the function of a photosensitive pattern for forming a pattern of an encapsulating layer (135), a cathode electrode (123r, 123g, 123b), and an organic light-emitting layer (122r, 122g, 122b).

[0152] As illustrated in Fig. 4a, the encapsulation layer (135), the cathode electrode (123r), and the red organic light-emitting layer (122r) can be etched using the red color filter layer (140r) so that they can be formed only in the red subpixel (SPr). In this case, one end of the encapsulation layer (135), one end of the cathode electrode (123r), and one end of the red organic light-emitting layer (122r) can be positioned on the same vertical line or diagonal line on the first protrusion (130-1).

[0153] As illustrated in Fig. 4b, the encapsulation layer (135), the cathode electrode (123g), and the green organic light-emitting layer (122g) can be etched using the green color filter layer (140g) so that they can be formed only in the green subpixel (SPg). In this case, one end of the encapsulation layer (135), one end of the cathode electrode (123g), and one end of the green organic light-emitting layer (122g) can be positioned on the same vertical line or diagonal line on the first protrusion (130-1).

[0154] As illustrated in Fig. 4c, the encapsulation layer (135), the cathode electrode (123b), and the blue organic light-emitting layer (122b) can be etched using the blue color filter layer (140b) to be formed only in the blue subpixel (SPb). In this case, one end of the encapsulation layer (135), one end of the cathode electrode (123b), and one end of the blue organic light-emitting layer (122b) can be positioned on the same vertical line or diagonal line on the first protrusion (130-1).

[0155] As an example, it may be formed in the order of a blue organic light-emitting element (120b), a green organic light-emitting element (120g), and a red organic light-emitting element (120r), but is not limited thereto.

[0156] Meanwhile, the encapsulating layer (141r, 141g, 141b) may include multiple layers including organic or inorganic materials.

[0157] The encapsulating layers (141r, 141g, 141b) can protect the plurality of color filter layers (140r, 140g, 140b) made of a resin material from being etched. For example, the blue encapsulating layer (141b) is formed on the blue color filter layer (140b) used for patterning the blue organic light-emitting element (120b), so that the blue encapsulating layer (141b) can prevent the etching of the blue color filter layer (140b) while the green organic light-emitting element (120g) is being etched. Similarly, by forming a green encapsulating layer (141g) on ​​a green color filter layer (140g) used for patterning a green organic light-emitting element (120g), the green encapsulating layer (141g) can prevent the etching of the green color filter layer (140g) while the red organic light-emitting element (120r) is etched. Accordingly, the red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) can serve as stoppers to prevent etching.

[0158] Meanwhile, each of the plurality of color filter layers (140r, 140g, 140b) may include a light scattering agent or a light diffusing agent. By scattering or diffusing light by the light scattering agent or the light diffusing agent, the luminous efficiency may be improved.

[0159] Meanwhile, the red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) may each include multiple layers including inorganic materials and organic materials.

[0160] The red encapsulating layer (141r) may be disposed on the red color filter layer (140r), the green encapsulating layer (141g) may be disposed on the green color filter layer (140g), and the blue encapsulating layer (141b) may be disposed on the blue color filter layer (140b).

[0161] The red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) may each include at least one layer. For example, the red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) may each include a first inorganic layer, an organic layer on the first inorganic layer, a second inorganic layer on the organic layer, and the like, but are not limited thereto. The first inorganic layer and the second inorganic layer may include an inorganic material such as SiNx, and the organic layer may include a resin material, but are not limited thereto.

[0162] According to an embodiment, a plurality of subpixels (SPr, SPg, SPb) may be sequentially formed to manufacture an organic light-emitting display device having a side-by-side structure. For example, a blue organic light-emitting element (120b), a blue color filter layer (140b), and a blue encapsulation layer (141b) may be formed and patterned over the entire area of ​​a substrate (110) using a photolithography process, thereby forming a blue subpixel (SPb). Thereafter, a green organic light-emitting element (120g), a green color filter layer (140g), and a green encapsulation layer (141g) may be formed and patterned over the entire area of ​​the substrate (110) using a photolithography process, thereby forming a green subpixel (SPg). Thereafter, a red organic light-emitting element (120r), a red color filter layer (140r), and a red encapsulation layer (141r) may be formed and patterned using a photolithography process, thereby forming a red subpixel (SPr).

[0163] Fig. 5 is a cross-sectional view illustrating an organic light-emitting display device according to a first embodiment. Although Fig. 5 illustrates the green organic light-emitting element (120g) in Figs. 4a to 4c, the red organic light-emitting element (120r) and the blue organic light-emitting element (120b) may also have the same structure or shape as the green organic light-emitting element (120g) illustrated in Fig. 5. Since Fig. 5 is an enlarged view of the asymmetric blocking connection structure (105) illustrated in Fig. 4a, any description overlapping with that related to Fig. 4a may be omitted.

[0164] Referring to FIGS. 4A, 4B, and 5, an organic light-emitting display device according to the first embodiment may include a substrate (110), a first bank (111-1), a first protrusion (130-1), a green organic light-emitting element (120g), a first encapsulating layer (135), a green color filter layer (140g), a green encapsulating layer (141g), etc. The green encapsulating layer (141g) may be referred to as a second encapsulating layer.

[0165] The substrate (110) may include a material with excellent insulating performance. For example, the substrate (110) may include a plastic material, a resin material, glass, etc. The substrate (110) may include a rigid material or a flexible material.

[0166] The first bank (111-1) may be positioned on the substrate (110) between the red subpixel (SPr) and the green subpixel (SPg). The first protrusion (130-1) may be positioned on the upper side of the first bank (111-1).

[0167] The first protrusion (130-1) may include a connection structure (105A). The connection structure (105A) may be formed on each of the left and right sides of the first protrusion (130-1). In this case, the undercut structure on the left side and the undercut structure (151) on the right side may be included in the connection structure (105A). For example, the undercut structure on the left side may be included in the first connection structure, and the undercut structure (151) on the right side may be included in the second connection structure (105A).

[0168] The first protrusion (130-1) may include a first layer (131), a second layer (132), a fourth layer (134), etc. The second layer (132) may be disposed on the first layer (131), and the fourth layer (134) may be disposed on the second layer (132). Although not shown, a third layer may be disposed below the first layer (131).

[0169] The connection structure (105A) may include an auxiliary electrode (AC). The auxiliary electrode (AC) may be electrically connected to the first power line (PL1) via a contact pad (103), as illustrated in FIGS. 1 and 2.

[0170] The auxiliary electrode (AC) included in the connection structure (105A) can be electrically connected to adjacent subpixels (SPr, SPg). For example, the auxiliary electrode (AC) can be electrically connected to the cathode electrode (123r) of the red organic light-emitting element (120r) and the cathode electrode (123g) of the green organic light-emitting element (120g). That is, the cathode electrode (123r) of the red organic light-emitting element (120r) can be electrically connected to one side of the auxiliary electrode and can be electrically connected to the cathode electrode (123g) of the green organic light-emitting element (120g).

[0171] At least one of the first layer (131) or the second layer (132) may include a metal or a conductive oxide material having excellent electrical conductivity. In this case, at least one of the first layer (131) or the second layer (132) may be an auxiliary electrode (AC). Accordingly, at least one of the first layer (131) or the second layer (132) may be electrically connected to the cathode electrode (123r) of the red organic light-emitting element (120r) and the cathode electrode (123g) of the green organic light-emitting element (120g).

[0172] The connection structure (105A) may have an undercut structure (151) formed by the first layer (131) and the second layer (132). For this purpose, the first layer (131) may be made of a material having a high etching rate, and the second layer (132) may be made of a material having a low etching rate. Accordingly, when the first layer (131) and the second layer (132) are etched, the side of the first layer (131) may be etched faster than the side of the second layer (132), thereby forming the undercut structure (151). Meanwhile, the etching rate of the third layer may be lower than the etching rate of the first layer (131). The etching rate of the third layer may be equal to or lower than the etching rate of the second layer (132). Therefore, when the first layer (131) and the third layer are etched, the sidewall of the third layer is etched at the same rate as or more slowly than the sidewall of the first layer (131), so that the sidewall of the third layer may be positioned on the same vertical line or diagonal line as the sidewall of the first layer (131) or may extend further in the direction of the green subpixel (SPg) from the sidewall of the first layer (131).

[0173] The green organic light-emitting device (120g) may include an anode electrode (121g), a green organic light-emitting layer (122g), and a cathode electrode (123g).

[0174] As illustrated in FIG. 5, the cathode electrode (123g) may include a first conductive layer (123-1) and a second conductive layer (123-2) on the first conductive layer (123-1). For example, the first conductive layer (123-1) may include a metal having excellent electrical conductivity, and the second conductive layer (123-2) may include a conductive oxide material. For example, the first conductive layer (123-1) may include a Mg:Ag alloy, and the second conductive layer (123-2) may include ITO, IZO, and the like.

[0175] In the green organic light-emitting layer (122g) deposited in the deposition process, a high-resistance deposition material (HTL, EML, ETL) may be deposited at a deposition angle (θo2), and the first conductive layer (123-1) of the cathode electrode (123g) may be deposited at a deposition angle (θc). The deposition angle (θo2) and the deposition angle (θc) may be similar. A low-resistance deposition material (HIL, CGL) may be deposited at a deposition angle (θo1). The deposition angle (θo1) may be 10º or more larger than the deposition angle (θo2) or the deposition angle (θc).

[0176] When a conductive oxide material such as ITO having excellent step coverage characteristics is deposited on the substrate (110) using a sputtering process as the second conductive layer (123-2), the conductive oxide material can be deposited deep inside the undercut structure (151) of the connection structure (105A). In addition, the film quality of the layer formed by the conductive oxide material, i.e., the second conductive layer (123-2), is excellent. Accordingly, not only is the second conductive layer (123-2) formed with excellent film quality, but it is also formed deep inside the undercut structure (151) of the connection structure (105A), so that electrical connection failure between the cathode electrode (123g) including the first conductive layer (123-1) and the second conductive layer (123-2) and the auxiliary electrode (AC) can be prevented.

[0177] In conclusion, since a deposition material including ITO having excellent step coverage characteristics is deposited on the substrate (110) through a sputtering process, the deposition material can be deposited not only over the entire area of ​​the substrate (110) but also deep inside the undercut structure (151) of the connection structure (105A). Accordingly, the second conductive layer (123-2) is electrically connected to the auxiliary electrode (AC), i.e., the first layer (131) and / or the second layer (132), so that poor electrical connection between the first conductive layer (123-1) and the auxiliary electrode (AC) can be prevented.

[0178] The second conductive layer (123-2) may be disposed on the cathode electrode (123g) of the green organic light-emitting element (102g). The second conductive layer (123-2) may be disposed on the side of one end of the green organic light-emitting layer (122g). The second conductive layer (123-2) may be disposed on the upper side of the banks (111-1, 111-2) between the first protrusion (130-1) and the green organic light-emitting layer (122g). The second conductive layer (123-2) may be disposed on the side of the first layer (131). The second conductive layer (123-2) may be disposed on the lower side, the side, and / or the upper side of the second layer (132).

[0179] Meanwhile, not only the first conductive layer (123-1), but also high-resistance organic deposition materials of the green organic light-emitting element (120g), such as the hole transport layer (HTL), the green organic light-emitting layer (EML), the electron transport layer (ETL), etc., may be deposited at a deposition angle (θo2). In an embodiment, the first conductive layer (123-1) may be deposited at the same deposition angle (θo2) together with the hole transport layer (HTL), the green organic light-emitting layer (EML), the electron transport layer (ETL), etc.

[0180] Low-resistance organic deposition materials of the green organic light-emitting device (120g), such as a hole injection layer (HIL), a charge generation layer (n-CGL, p-CGL), etc., can be deposited at a deposition angle (θo1) smaller than the deposition angle (θo2). Accordingly, high-resistance organic deposition materials can surround low-resistance organic deposition materials, so that the low-resistance organic deposition materials may not be exposed.

[0181] Specifically, since the deposition angle (θo2) of the high-resistance deposition material (HTL, EML, ETL) is 10º or more larger than the deposition angle (θo1) of the low-resistance deposition material (HIL, CGL), the first organic light-emitting stack (122-2) can be formed on the upper and side portions of the hole injection layer (122-1), and the second organic light-emitting stack (122-4) can be formed on the upper and side portions of the charge generation layer (122-3). In addition, since the deposition angle (θc) of the first conductive layer (123-1) and the deposition angle (θo2) of the high-resistance deposition material (HTL, EML, ETL) are , the first conductive layer (123-1) can be formed on the upper side of the second organic light-emitting stack (122-4).

[0182] Meanwhile, the second conductive layer (123-2) may be formed on the side of the first organic light-emitting stack (122-2) and the upper and side of the second organic light-emitting stack (122-4). In this case, the second conductive layer (123-2) and the hole injection layer (122-1) may be spaced apart from each other by an amount corresponding to the thickness of the first organic light-emitting stack (122-2) or the sum of the thicknesses of the first organic light-emitting stack (122-2) and the second organic light-emitting stack (122-4). In addition, the second conductive layer (123-2) and the charge generation layer (122-3) may be spaced apart from each other by an amount corresponding to the thickness of the first organic light-emitting stack (122-2) or the sum of the thicknesses of the first organic light-emitting stack (122-2) and the second organic light-emitting stack (122-4). Accordingly, the hole injection layer (122-1) and / or the charge generation layer (122-3) are not electrically connected to the second conductive layer (123-2), so that poor electrical connection can be prevented.

[0183] Accordingly, since the low-resistance deposition material (HIL, CGL) and the high-resistance deposition material (HTL, EML, ETL) are deposited at different deposition angles (θo1, θo2), the hole injection layer (122-1) and the charge generation layer (122-3) are electrically disconnected from the second conductive layer (123-2) of the cathode electrode (123g), there is no need to form a blocking structure (105B in FIGS. 4a to 4c), so that the process can be simplified and the process cost can be reduced.

[0184] However, although the process cost increases by adding a blocking structure (105B), it is possible to completely prevent leakage current between the anode and cathode due to insufficient process margin in an emergency by performing double blocking. In particular, it may be desirable to control the deposition angle as well as the blocking structure (105B) in the order of a thin blue organic light-emitting element (120b) and a greenish blue organic light-emitting element (120g).

[0185] The encapsulating layer (135) may be disposed on the green organic light-emitting element (120g) and the first protrusion (130-1). The encapsulating layer (135) may serve as a barrier to prevent moisture, etc. from penetrating into the green organic light-emitting element (120g). The encapsulating layer (135) may include a plurality of insulating layers (135-1, 135-2), but is not limited thereto. For example, the encapsulating layer (135) may include a first-first insulating layer (135-1) and a first-second insulating layer (135-2) on the first-first insulating layer (135-1). For example, the first-first insulating layer (135-1) may be an inorganic layer including SiO2, etc., and the first-second insulating layer (135-2) may be an inorganic layer including SiNx, etc., but is not limited thereto.

[0186] As illustrated in FIG. 5, the first-first insulating layer (135-1) may also be arranged inside the undercut structure (151) of the connection structure (105A). That is, the first-first insulating layer (135-1) may be arranged on the side of the first layer (131), the lower side of the second layer (132), etc. The first-second insulating layer (135-2) may not be arranged inside the undercut structure (151) of the connection structure (105A), but is not limited thereto.

[0187] A green color filter layer (140g) may be disposed on a green organic light-emitting element (120g), and a green encapsulation layer (141g) may be disposed on the green color filter layer (140g).

[0188] The green sealing layer (141g) includes, but is not limited to, a 2-1 insulating layer (141-1), a 2-2 insulating layer (141-2), a 2-3 insulating layer (141-3), etc. The 2-1 insulating layer (141-1) and the 2-3 insulating layer (141-3) each include an inorganic material such as SiNx, and the 2-2 insulating layer (141-2) may include a resin material, but is not limited to this.

[0189] Fig. 6 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment. Although Fig. 6 illustrates the green organic light-emitting element (120g) in Figs. 4a to 4c, the red organic light-emitting element (120r) and the blue organic light-emitting element (120b) may also have the same structure or shape as the green organic light-emitting element (120g) illustrated in Fig. 6. Since Fig. 6 is an enlarged view of the asymmetric blocking connection structure (105) illustrated in Fig. 4a, any description overlapping with that related to Fig. 4a may be omitted.

[0190] The second embodiment may be identical to the first embodiment (Fig. 5) except for the blocking structure (105B). In the second embodiment, components having the same shape, structure, and / or function as those in the first embodiment (Fig. 5) are given the same drawing reference numerals, and a detailed description thereof is omitted.

[0191] Referring to FIGS. 4a, 4b, and 6, an organic light-emitting display device according to a second embodiment may include a substrate (110), a first bank (111-1), a first protrusion (130-1), a green organic light-emitting element (120g), a first encapsulating layer (135), a green color filter layer (140g), a green encapsulating layer (141g), etc. The green encapsulating layer (141g) may be referred to as a second encapsulating layer.

[0192] An organic light-emitting display device according to a second embodiment may include a blocking structure (105B). The blocking structure (105B) may be provided in an edge region of the first bank (111-1). The blocking structure (105B) may be configured as an asymmetric blocking connection structure (105) together with the connection structure (105A).

[0193] The blocking structure (105B) may include a blocking layer (113). The blocking layer (113) may include an inorganic material or a metal. For example, the blocking layer (113) may include an inorganic material such as SiO2. For example, the blocking layer (113) may include a metal such as aluminum (Al) or molybdenum (Mo).

[0194] The blocking structure (105B) may have an undercut structure (152). By etching the side of the blocking layer (113), an undercut structure (152) extending inward from the side of the first bank (111-1) may be formed. The undercut structure (151) of the connection structure (105A) may be referred to as a first undercut structure, and the undercut structure (152) of the blocking structure (105B) may be referred to as a second undercut structure, or vice versa.

[0195] A separation structure (125-2) in which some layers of a green organic light-emitting element (120g) are disconnected may be formed by the undercut structure (152) of the blocking structure (105B). The separation structure (125-2) formed in the green organic light-emitting element (120g) may be formed corresponding to the blocking structure (105B), specifically, the undercut structure (152).

[0196] As an example, a green organic light-emitting device (120g) may include a hole injection layer. A cathode electrode (123g) may be in contact with an end of the hole injection layer, and an anode electrode (121g) may be disposed below the hole injection layer. When the hole injection layer includes a low-resistance organic light-emitting material, a leakage current may flow between the anode electrode (121g) and the cathode electrode (123g) through the hole injection layer. Therefore, an electrical short may occur between the anode electrode (121g) and the cathode electrode (123g), so that the corresponding subpixels (SPr, SPg, SPb) may not emit light or the luminance may be significantly reduced compared to the target luminance, resulting in poor image quality. According to an embodiment, a separation structure (125-2) corresponding to the blocking structure (105B) may be formed in the hole injection layer. A portion corresponding to the separation structure (125-2) in the hole injection layer may be disconnected. By disconnecting the hole injection layer, the electrical short between the anode electrode (121g) and the cathode electrode (123g) is blocked, thereby preventing poor image quality.

[0197] As another example, a green organic light-emitting device (120g) may have a two-stack structure, including a hole injection layer, a first organic light-emitting stack, a charge generation layer, and a second organic light-emitting stack. In this case, the cathode electrode (123g) may be in contact with one end of the charge generation layer, and one end of the charge generation layer may be in contact with one end of the hole injection layer. Therefore, since the hole injection layer and the charge generation layer are made of a low-resistance organic light-emitting material, an electrical short may occur between the anode electrode (121g) and the cathode electrode (123g) through the hole injection layer and the charge generation layer, which may result in poor image quality. According to an embodiment, a separation structure (125-2) corresponding to the blocking structure (105B) may be formed in the hole injection layer, the first organic light-emitting stack, and the charge generation layer. Parts corresponding to the separation structure (125-2) in the hole injection layer, the first organic light-emitting stack, and the charge generation layer may be disconnected. By disconnecting the hole injection layer, the first organic light-emitting stack, and the charge generation layer, electrical shorts between the anode electrode (121g) and the cathode electrode (123g) can be prevented, thereby preventing poor image quality.

[0198] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment. Although Fig. 7 illustrates the green organic light-emitting element (120g) in Figs. 4a to 4c, the red organic light-emitting element (120r) and the blue organic light-emitting element (120b) may also have the same structure or shape as the green organic light-emitting element (120g) illustrated in Fig. 7. Since Fig. 7 is an enlarged view of the asymmetric blocking connection structure (105) illustrated in Fig. 4a, any description overlapping with that related to Fig. 4a may be omitted.

[0199] The third embodiment is similar to the second embodiment (Fig. 6) except that the green color filter layer (140g in Fig. 6) is omitted. In the third embodiment, components having the same shape, structure, and / or function as those in the second embodiment (Fig. 6) are given the same drawing reference numerals, and a detailed description thereof is omitted.

[0200] Referring to FIGS. 4a, 4b, and 7, an organic light-emitting display device according to a second embodiment may include a substrate (110), a first bank (111-1), a first protrusion (130-1), a green organic light-emitting element (120g), a first encapsulating layer (135), a green encapsulating layer (141g), etc. The green encapsulating layer (141g) may be referred to as a second encapsulating layer.

[0201] Unlike the second embodiment (Fig. 6), the green color filter layer (140g in Fig. 6) can be omitted in the third embodiment (Fig. 7).

[0202] A green encapsulating layer (141g) may be formed on a green organic light-emitting element (120g). The green encapsulating layer (141g) may serve to prevent moisture, etc. from penetrating into the green organic light-emitting element (120g). The green encapsulating layer (141g) may serve to protect the green organic light-emitting element (120g) from external impact, etc. The green encapsulating layer (141g) may serve to ensure that the upper surface of the organic light-emitting display device, i.e., the upper surface of the green encapsulating layer (141g), is flat. To this end, at least one of the plurality of insulating layers (141-2, 141-3) included in the green encapsulating layer (141g) may include an organic layer having a thick thickness.

[0203] In the second embodiment (Fig. 6), the green encapsulating layer (141g) includes the 2-1 insulating layer (141-1) to the 2-3 insulating layer (141-3), whereas in the third embodiment (Fig. 7), the green encapsulating layer (141g) may include the 2-2 insulating layer (141-2) and the 2-3 insulating layer (141-3). That is, in the third embodiment (Fig. 7), the 2-1 insulating layer (141-1) may be omitted.

[0204] For example, by forming the thickness of the 2-2 insulating layer (141-2) thicker using a resin material that is easy to form a thickness, the upper surface of the 2-2 insulating layer (141-2) can have a flat surface. By forming the 2-3 insulating layer (141-3) on the 2-2 insulating layer (141-2), the upper surface of the 2-3 insulating layer (141-3) can also have a flat surface.

[0205] Fig. 8a is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment. Fig. 8b is a cross-sectional view illustrating a connection structure in the asymmetric blocking connection structure of Fig. 8a. Fig. 8c is a cross-sectional view illustrating a blocking structure in the asymmetric blocking connection structure of Fig. 8a.

[0206] Although FIGS. 8A to 8C illustrate the green organic light-emitting element (120g) in FIGS. 4A to 4C, the red organic light-emitting element (120r) and the blue organic light-emitting element (120b) may also have the same structure or shape as the green organic light-emitting element (120g) illustrated in FIG. 8A. FIG. 8A is an enlarged view of the asymmetric blocking connection structure (105) illustrated in FIG. 4A, and therefore, any description overlapping with that related to FIG. 4A may be omitted.

[0207] The fourth embodiment is similar to the second embodiment (Fig. 6) and / or the third embodiment (Fig. 7) except for the green organic light-emitting element (120g) having a two-stack structure and the third layer (133) of the first protrusion (130-1). In the fourth embodiment, components having the same shape, structure, and / or function as those of the second embodiment (Fig. 6) and / or the third embodiment (Fig. 7) are given the same drawing reference numerals, and detailed descriptions thereof are omitted.

[0208] Referring to FIGS. 4a, 4b, and 8a to 8c, an organic light-emitting display device according to the fourth embodiment may include a substrate (110), a first bank (111-1), a first protrusion (130-1), a green organic light-emitting element (120g), etc.

[0209] The first protrusion (130-1) may have a connection structure (105A). The connection structure (105A) may include an auxiliary electrode (AC) electrically connected to a cathode electrode (123g) of a green organic light-emitting element (120g). As illustrated in FIGS. 1 and 2 , the auxiliary electrode (AC) may be connected to a first power line (PL1) via a contact pad (103). In this case, a predetermined current may flow to the first power line (PL1) via the anode electrode (121g) of the green organic light-emitting element (120g), the green organic light-emitting layer (122g), the cathode electrode (123g), and the auxiliary electrode (AC). In this case, green light having a luminance corresponding to the current may be emitted upward, i.e., forward, from the green organic light-emitting layer (122g). In contrast, in the bottom emission method, green light emitted from the green organic light-emitting layer (122g) can propagate downward, i.e., backward.

[0210] The first protrusion (130-1) may include a first layer (131), a second layer (132), a third layer (133), and a fourth layer (134). The second layer (132) may be disposed on the first layer (131), the third layer (133) may be disposed below the first layer (131), and the fourth layer (134) may be disposed on the second layer (132). Since the first layer (131), the second layer (132), and the fourth layer (134) have already been described above, a detailed description thereof will be omitted.

[0211] The third layer (133) may include, for example, a metal or a conductive oxide material having excellent electrical conductivity. Accordingly, the third layer (133) may be an auxiliary electrode (AC). A cathode electrode (123g) is disposed on the side and upper side of the third layer (133), so that the third layer (133) can be electrically connected to the cathode electrode (123g).

[0212] The third layer (133) may include a material having a low etching rate. For example, the etching rate of the third layer (133) may be lower than the etching rate of the first layer (131). For example, the etching rate of the third layer (133) may be the same as or slower than the etching rate of the second layer (132). When the second layer (132) and the third layer (133) are etched simultaneously, since the etching rate of the third layer (133) is the same as or slower than the etching rate of the second layer (132), the side of the third layer (133) may be positioned on the same vertical line as the side of the second layer (132) or may be arranged to extend further in the direction of the adjacent subpixel from the side of the second layer (132).

[0213] An undercut structure (151) may be formed by the first layer (131), the second layer (132), and the third layer (133). That is, an undercut structure (151) may be formed in which the side of the first layer (131) is recessed inwardly from the side of the second layer (132) and / or the side of the third layer (133) toward the first protrusion (130-1). In the undercut structure (151) of the connection structure (105A), the depth (or width) into which the side of the first layer (131) is recessed may be defined as the opening depth (D). In the undercut structure (151) of the connection structure (105A), the vertical width between the third layer (133) and the second layer (132) may be defined as the opening gap (G).

[0214] Meanwhile, as illustrated in FIG. 9, not only the green organic light-emitting element (120g), but also the red organic light-emitting element (120r) and the blue organic light-emitting element (120b) may be disposed on the substrate (110). The red organic light-emitting element (120r) may be disposed in the red subpixel (SPr), the green organic light-emitting element (120g) may be disposed in the green subpixel (SPg), and the blue organic light-emitting element (120b) may be disposed in the blue subpixel (SPb).

[0215] The red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) may each have a two-stack structure.

[0216] The red organic light-emitting element (120r) may include an anode electrode (E1), a first organic light-emitting stack (ST11) on the anode electrode (E1), a charge generation layer (71) on the first organic light-emitting stack (ST11), a second organic light-emitting stack (ST12) on the charge generation layer (71), a cathode electrode (E2) on the second organic light-emitting stack (ST12), a capping layer (CPL) on the cathode electrode (E2), etc.

[0217] The green organic light-emitting element (120g) may include an anode electrode (E1), a first organic light-emitting stack (ST21) on the anode electrode (E1), a charge generation layer (72) on the first organic light-emitting stack (ST21), a second organic light-emitting stack (ST22) on the charge generation layer (72), a cathode electrode (E2) on the second organic light-emitting stack (ST22), a capping layer (CPL) on the cathode electrode (E2), etc.

[0218] The blue organic light-emitting element (120b) may include an anode electrode (E1), a first organic light-emitting stack (ST31) on the anode electrode (E1), a charge generation layer (73) on the first organic light-emitting stack (ST31), a second organic light-emitting stack (ST32) on the charge generation layer (73), a cathode electrode (E2) on the second organic light-emitting stack (ST32), a capping layer (CPL) on the cathode electrode (E2), etc.

[0219] The charge generation layer (71 to 73) may include an n-type charge generation layer (n-CGL) and a p-type charge generation layer (p-CGL) on the n-type charge generation layer (n-CGL).

[0220] In the top emission method, the light extraction efficiency in the viewing angle direction can be improved through constructive interference. To this end, the thicknesses of the layers between the anode electrode (E1) and the cathode electrode (E2) can be designed such that the distance between the anode electrode (E1) and the cathode electrode (E2) in each of the red subpixel (SPr), the green subpixel (SPg), and the blue subpixel (SPb) is m (where m is an integer) times the wavelength of the corresponding light. For example, in an organic light emitting display device having a side-by-side structure, the thicknesses can decrease in the order of the red organic light emitting element (120r), the green organic light emitting element (120g), and the blue organic light emitting element (120b). That is, the thickness of the red organic light emitting element (120r) can be the largest, the thickness of the green organic light emitting element (120g) can be the next largest, and the thickness of the blue organic light emitting element (120b) can be the smallest.

[0221] The drawing symbols of FIGS. 8b and 9 correspond as shown in Table 1 and may be used interchangeably. The drawing symbols shown in FIG. 9 may refer to the physical layer shown in FIG. 8b or may refer to a deposition material for forming the physical layer.

[0222] Fig. 8a 9121gE1122-1HIL122-2ST21122-372123-4ST22123gE2

[0223] Referring back to FIGS. 8a and 8b, not only low-resistance organic light-emitting materials (HIL, CGL) but also high-resistance materials (HTL, EML, EIL, ETL) may be deposited on the substrate (110) at a deposition angle (θo), so that a first organic light-emitting stack (122-2) including a hole injection layer (122-1), a charge generation layer (122-3), and a second organic light-emitting stack (122-4) may be formed. A metal deposition material (E2) may be deposited on the substrate (110) at a deposition angle (θc) smaller than the deposition angle (θo) with respect to the horizontal direction, so that a cathode electrode (123g) may be formed. The cathode electrode (123g) may be a single layer including, for example, Mg:Ag. In this case, the cathode electrode (123g) must be directly electrically connected to the auxiliary electrode (AC) of the first protrusion (130-1). Understanding this, by depositing the metal deposition material (E2) on the substrate (110) at a smaller deposition angle (θc), the metal deposition material (E2) can also be formed inside the undercut structure (151) of the connection structure (105A). For example, the cathode electrode (123g) can be disposed on the upper side of the third layer (133), which is the auxiliary electrode (AC), and electrically connected to the third layer (133). When the metal deposition material (E2) is deposited at a deposition angle (θc) smaller than the deposition angle (θo), the cathode electrode (123g) can be disposed on the side of the first layer (131), which is the auxiliary electrode (AC), and electrically connected to the first layer (131). For example, the deposition angle (θc) is set to be 10º or more smaller than the deposition angle (θo), so that the cathode electrode (123g) is formed inside the undercut structure (151) of the connection structure (105A), so that the auxiliary electrode (AC) of the first protrusion (130-1) can be electrically connected to the cathode electrode (123g).

[0224] In Fig. 8a, the deposition angle (θc) and the deposition angle (θo) may be deposition angles in the horizontal direction, but may also be defined as deposition angles in the vertical direction.

[0225] Meanwhile, when the first protrusion (130-1) has a square shape when viewed from above, the cathode electrode (123g) can be electrically connected to the auxiliary electrode (AC) at least two of the four corners of the first protrusion (130-1), but this is not limited thereto. At this time, since the arrangement position of the evaporation source for discharging the metal deposition material and the adjustment and management of the deposition angle (θc) are possible within the range of a typical production method, it does not affect the uniformity of the film thickness, the homogeneity of the film quality, productivity, material utilization efficiency, etc.

[0226] As illustrated in FIG. 2, FIG. 8a, and FIG. 8b, the cathode electrode (123g) may be in contact with the hole injection layer (122-1) and the charge generation layer (122-3) formed of low-resistance organic light-emitting materials at two or more of the four corners of the green subpixel (SPg). For example, one end of the charge generation layer (122-3) may be in contact with one end of the hole injection layer (122-1). The cathode electrode (123g) may be in contact with one end of the hole injection layer (122-1) and one end of the charge generation layer (122-3). Therefore, the cathode electrode (123g) may be electrically connected to the anode electrode (121g) through the hole injection layer (122-1), etc. In this case, the current path between the anode electrode (121g) and the cathode electrode (123g) is as follows.

[0227] - Anode electrode (121g) --> Charge generation layer (122-3) --> Cathode electrode (123g)

[0228] - Anode electrode (121g) --> Auxiliary electrode (AC) --> Hole injection layer (122-1) --> Cathode electrode (123g)

[0229] - Anode electrode (121g) --> (auxiliary electrode (AC) or hole injection layer (122-1)) --> cathode electrode (123g)

[0230] In addition to losses due to leakage current through these current passages, poor image quality may occur due to electrical shorts between the anode electrode (121g) and the cathode electrode (123g).

[0231] As shown in FIGS. 8A to 8C, the cathode electrode (123g) is electrically connected to the auxiliary electrode (AC) by the connection structure (105A), while the electrical short between the anode electrode (121g) and the cathode electrode (123g) is blocked by the blocking structure (105B), so that loss due to leakage current and poor image quality are prevented, resulting in excellent quality stability.

[0232] The organic light emitting display device according to the fourth embodiment may include a blocking structure (105B).

[0233] By disconnecting the hole injection layer (122-1) or charge generation layer (122-3) corresponding to the blocking structure (105B), the electrical short between the anode electrode (121g) and the cathode electrode (123g) can be blocked.

[0234] As illustrated in FIG. 8c, the cathode electrode (123g) positioned on the top layer of the green organic light-emitting element (120g) must be electrically connected to the auxiliary electrode (AC), and therefore must not be disconnected by the blocking structure (105B).

[0235] The blocking structure (105B) may have an undercut structure (152) formed by at least one blocking layer (113). The undercut structure (152) of the blocking structure (105B) may have a blocking gap (OG) and a blocking depth (OD). The blocking gap (OG) may correspond to the thickness of the blocking layer (113). The blocking gap (OG) may be, for example, a distance between the anode electrode (121g) and the first bank (111-1), but is not limited thereto. The blocking depth (OD) may be a depth at which a side of the blocking layer (113) extends from the side of the first bank (111-1) into the inside of the first bank (111-1).

[0236] As illustrated in FIG. 9, in the red organic light-emitting element (120r) in which the distance between the anode electrode (E1) and the cathode electrode (E2) is the greatest, the hole injection layer (HIL), the first organic light-emitting stack (ST11), and the charge generation layer (71) may be isolated by the blocking structure (105B). In the blue organic light-emitting element (120b) in which the distance between the anode electrode (E1) and the cathode electrode (E2) is the smallest, the hole injection layer (HIL), the first organic light-emitting stack (ST31), the charge generation layer (73), and the second organic light-emitting stack (ST32) may be isolated by the blocking structure (105B), but the cathode electrode (E2) must not be isolated by the blocking structure (105B). Therefore, the margin (GM) of the blocking gap (OG) in the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) can be expressed by Equation 1.

[0237] [Formula 1]

[0238] GM = distance (D11) between the anode electrode (E1) and the cathode electrode (E2) in the blue organic light-emitting device (120b) - distance (D12) between the cathode electrode (E2) and the second organic light-emitting stack in the red organic light-emitting device (120r)

[0239] The margin (GM) of the blocking gap (OG) can be set to a minimum value for the distance between the cathode electrode (E2) and the second organic light-emitting stack in the red organic light-emitting element (120r), and a maximum value for the distance between the anode electrode (E1) and the cathode electrode (E2) in the blue organic light-emitting element (120b). Accordingly, the margin (GM) of the blocking gap (OG) can be set between the distance between the cathode electrode (E2) and the second organic light-emitting stack in the red organic light-emitting element (120r) and the distance between the anode electrode (E1) and the cathode electrode (E2) in the blue organic light-emitting element (120b).

[0240] The thickness of the blocking gap (OG) can be set based on a deposition simulation experiment and an actual deposition experiment based on a method for setting the blocking gap calculated from the thickness of the organic light-emitting element (120r, 120g, 120b) for each color.

[0241] Considering the margin (GM) of the blocking gap (OG), some layers constituting the green organic light-emitting element (120g), such as the hole injection layer (HIL), the first organic light-emitting stack (ST21), and the charge generation layer (72), are disconnected in response to the blocking structure (105B), thereby preventing electrical short between the anode electrode (E1) and the cathode electrode (E2) in the green organic light-emitting element (120g), thereby preventing loss due to leakage current and poor image quality.

[0242] Fig. 10a is a cross-sectional view illustrating an organic light-emitting display device according to a fifth embodiment. Fig. 10b is a cross-sectional view illustrating a connection structure in the asymmetric blocking connection structure of Fig. 10a. Fig. 10c is a cross-sectional view illustrating a blocking structure in the asymmetric blocking connection structure of Fig. 10a.

[0243] Although FIGS. 10A to 10C illustrate the green organic light-emitting element (120g) in FIGS. 4A to 4C, the red organic light-emitting element (120r) and the blue organic light-emitting element (120b) may also have the same structure or shape as the green organic light-emitting element (120g) illustrated in FIG. 10A. FIG. 10A is an enlarged view of the asymmetric blocking connection structure (105) illustrated in FIG. 4A, and therefore, any description overlapping with that related to FIG. 4A may be omitted.

[0244] The fifth embodiment is identical to the fourth embodiment (Figs. 8a to 8c) except for the cathode electrode (123g) including the first conductive layer (123-1) and the second conductive layer (123-2). Components having the same shape, structure, and / or function as those of the fourth embodiment (Figs. 8a to 8c) are given the same drawing reference numerals, and detailed descriptions are omitted.

[0245] Referring to FIGS. 4a, 4b, and 10a to 10, an organic light-emitting display device according to the fifth embodiment may include a substrate (110), a first bank (111-1), a first protrusion (130-1), a green organic light-emitting element (120g), etc.

[0246] In the fourth embodiment (Figs. 8a to 8c), the cathode electrode (123g) includes a single layer including Mg:Ag, etc., whereas in the fifth embodiment (Figs. 10a to 10c), the cathode electrode (123g) may include multiple conductive layers (123-1, 123-2). Although the drawing illustrates a cathode electrode (123g) including a first conductive layer (123-1) and a second conductive layer (123-2), the cathode electrode (123g) may include three or more conductive layers.

[0247] For example, the step coverage characteristics of the second conductive layer (123-2) may be superior to the step coverage characteristics of the first conductive layer (123-1). The first conductive layer (123-1) may include a material having superior bonding characteristics with the green organic light-emitting element (120g) and work function characteristics. For example, the first conductive layer (123-1) may include a metal such as Mg:Ag. The second conductive layer (123-2) may include a conductive oxide material such as ITO or IZO.

[0248] For example, the step coverage characteristic of the first conductive layer (123-1) is inferior to that of the second conductive layer (123-2), so the film quality of the first conductive layer (123-1) is poor and it may be difficult to deposit inside the undercut structure (151) of the connection structure (105A).

[0249] According to an embodiment, a metal deposition material such as Mg:Ag forming the first conductive layer (123-1) may be deposited only on the green subpixel (SPg) at a deposition angle (θc). That is, the metal deposition material may not be deposited inside the undercut structure (151) of the connection structure (105A). In this case, the second conductive layer (123-2) is formed on the first conductive layer (123-1) and deep inside the undercut structure (151) of the connection structure (105A), so that the second conductive layer (123-2) may be electrically connected to the auxiliary electrode (AC) of the connection structure (105A).

[0250] Accordingly, there is no need to design the position of the evaporation source so that the deposition angle (θc) is very small so that the metal deposition material is deposited inside the undercut structure of the connection structure (105A), and thus the degree of freedom in designing the evaporation source can be increased.

[0251] Meanwhile, a low-resistance organic deposition material or a high-resistance organic deposition material constituting a green organic light-emitting element (120g in FIG. 9) having a two-stack structure can be deposited on a green subpixel (SPg) at a deposition angle (θo). A hole injection layer or a charge generation layer can be formed using the low-resistance organic light-emitting material. A hole transport layer, a green organic light-emitting layer (122g), an electron transport layer, an electron injection layer, etc. can be formed using the high-resistance material.

[0252] Since the deposition angle (θc) is the same as or similar to the deposition angle (θo), the distance between the target and source of the evaporation source that discharges the metal deposition material and the distance between the target and source of the evaporation source that discharges the low-resistance organic deposition material or the high-resistance organic deposition material can be designed to be the same, so that the evaporation sources in each of the plurality of chambers constituting the deposition system can be installed to be the same or similar, making it easy to design each chamber.

[0253] As described above, a deposition material composed of a material having excellent step coverage characteristics, for example, a conductive oxide material such as ITO or IZO, can be deposited on the substrate (110) using a sputtering process. Since the deposition material is dispersed over the entire area of ​​the substrate (110) through the sputtering process, the deposition material can be deposited deep inside the undercut structure (151) of the connection structure (105A) as well as the green subpixel (SPg). Accordingly, the second conductive layer (123-2) can be formed not only on the upper side of the green organic light-emitting element (120g), but also on the upper side of the third layer (133) constituting the connection structure (105A), the side portion of the first layer (131), and the lower side, side portion, and / or upper side of the second layer (132).

[0254] The first conductive layer (123-1) contributes to improving the electrical / optical characteristics with respect to the green organic light-emitting element (120g), and the second conductive layer (123-2) strengthens the electrical connectivity between the green organic light-emitting element (120g) and the auxiliary electrode (AC), thereby not only improving the electrical / optical characteristics of each subpixel (SPr, SPg, SPb), but also preventing poor image quality due to poor electrical connection of each subpixel (SPr, SPg, SPb).

[0255] In addition, in the blocking structure (105B), the margin (GM of FIG. 9) of the appropriate blocking gap (OG) for blocking the organic films (122-1, 122-2, 122-3) of different thicknesses of elements for each color pixel with the same blocking gap (OG) is insufficient, which may cause the first conductive layer (123-1) to open. The second conductive layer (123-2) is formed on the upper portion of the first conductive layer (123-1) in which the open is formed, and can connect the open portion of the first conductive layer (123-1) by utilizing the excellent characteristics of the step coverage. Therefore, in the asymmetric blocking connection structure (105) of the embodiment, the double layers (123-1, 123-2) of the cathode electrode (123g) may be complementary to each other.

[0256] As illustrated in FIG. 10b, since the deposition angle (θc) is equal to or similar to the deposition angle (θo), one end of each of the hole injection layer and charge generation layer made of low-resistance organic light-emitting material, the green organic light-emitting layer (122g) made of high-resistance material, and the first conductive layer (123-1) may be positioned vertically or diagonally. Alternatively, one end of the first conductive layer (123-1) may cover a side portion of one end of the green organic light-emitting layer (122g).

[0257] Although the drawing shows one end of the first conductive layer (123-1) as being in contact with the third layer (133), which is an auxiliary electrode (AC), it may not be in contact with the third layer (133). Even if the first conductive layer (123-1) is not in contact with the third layer (133), the second conductive layer (123-2) is in contact with the first layer (131), the second layer (132), and the third layer (133), which are auxiliary electrodes, so that an electrical connection failure may not occur.

[0258] Meanwhile, as illustrated in FIG. 10c, a blocking structure (105B) may be formed by the blocking layer (113). For example, an undercut structure (152) may be formed in the blocking structure (105B) by having the side of the blocking layer (113) enter the interior of the first bank (111-1) from the side of the first bank (111-1). In this case, a separation structure (125-2) may be formed in some layers constituting the green organic light-emitting element (120g in FIG. 9), such as the hole injection layer (HIL), the first organic light-emitting stack (ST21), and the charge generation layer (72), corresponding to the blocking structure (105B). By disconnecting the hole injection layer (HIL), the first organic light-emitting stack (ST21), and the charge generation layer (72) in the separation structure (125-2), an electrical short between the anode electrode (121g) and the cathode electrode (123g) in the green organic light-emitting element (120g) is blocked, thereby preventing loss due to leakage current and poor image quality.

[0259] Fig. 11 shows the deposition simulation results of a green organic light-emitting element deposited around the undercut structure of the blocking structure. In an actual deposition process, the deposition material can be deposited on the deposition surface while the deposition surface is positioned to face the evaporation source located at the lower side of the chamber. Therefore, the deposition simulation results shown in Fig. 11 may be in a state where the substrate (110) on which the actual deposition process is performed is flipped 180 degrees. The deposition simulation results of the green organic light-emitting element shown in the drawing can be applied identically or similarly to the deposition simulation results of the red organic light-emitting element, the blue organic light-emitting element, and the green organic light-emitting element.

[0260] The figures used in the deposition simulation results below are only examples and may change in actual or optimized products.

[0261] As illustrated in Fig. 11, the total thickness of the green organic light-emitting element may be 3,336 Å. The blocking gap (OG) is the distance between the anode electrode (121g) and the bank (111-1) in the blocking structure (105B), and may be, for example, 0.18 µm.

[0262] In this case, the blocking layer and the bank (111-1) may have different etching selectivities. For example, the etching rate of the blocking layer may be greater than the etching rate of the bank (111-1). Accordingly, the blocking layer may be etched faster than the bank (111-1), thereby forming an undercut structure (152) in the blocking structure (105B).

[0263] The barrier layer may include a metal or inorganic material. Drawing symbol 124g may be a capping layer.

[0264] Figures 12a to 12g illustrate various protrusions.

[0265] As shown in Fig. 12a, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0266] The first layer (131) may include a metal having a high etching rate. The first layer (131) may include aluminum (Al), copper (Cu), or an alloy thereof. The second layer (132) and the third layer (133) may include the same material. The second layer (132) and the third layer (133) may each include a metal having an etching rate lower than that of the first layer (131). For example, the second layer (132) and the third layer (133) may each include titanium (Ti), molybdenum (Mo), molybdenum-titanium (MoTi), or the like. The second layer (132) and the third layer (133) may each include a conductive oxide material having an etching rate lower than that of the first layer (131). For example, the second layer (132) and the third layer (133) may each include ITO, IZO, or the like.

[0267] Since the second layer (132) and the third layer (133) contain the same material, the etching selectivity of the material of the second layer (132) and the material of the third layer (133) may also be the same. In this case, the side of the second layer (132) and the side of the third layer (133) may be positioned on a vertical line or a diagonal line, but this is not limited thereto.

[0268] In Fig. 12a, the first layer (131), the second layer (132), and the third layer (133) may be auxiliary electrodes (AC). In this case, as illustrated in Fig. 10a, for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC), it is sufficient for the second conductive layer (123-2) of the cathode electrode (123g) to be in contact with at least one of the first layer (131), the second layer (132), or the third layer (133).

[0269] As shown in Fig. 12b, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0270] The first layer (131) may include a metal having a high etching rate. The first layer (131) may include aluminum (Al), copper (Cu), or an alloy thereof.

[0271] The second layer (132) and the third layer (133) may include different materials. The second layer (132) may include a metal having an etch rate lower than that of the first layer (131). For example, the second layer (132) may include titanium (Ti), molybdenum (Mo), molybdenum-titanium (MoTi), etc. The second layer (132) may include a conductive oxide material having an etch rate lower than that of the first layer (131). For example, the second layer (132) may include ITO, IZO, etc. The third layer (133) may include an inorganic material having an etch rate lower than that of the first layer (131). For example, the third layer (133) may include silicon nitride (SiNx), silicon oxide (SiOx), silicon nitride (SiON), etc.

[0272] Since the second layer (132) and the third layer (133) include different materials, the etching selectivity of the material of the second layer (132) and the material of the third layer (133) may be different, but this is not limited. In this case, the side of the second layer (132) and the side of the third layer (133) may not be positioned on a vertical line. For example, the side of the third layer (133) may be formed to extend further in the direction of the adjacent subpixel than the side of the second layer (132), but this is not limited.

[0273] In Fig. 12b, the first layer (131) and the second layer (132) may be auxiliary electrodes (AC). In this case, as illustrated in Fig. 10a, for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC), it is sufficient for the second conductive layer (123-2) of the cathode electrode (123g) to be in contact with at least one of the first layer (131) or the second layer (132). For example, the second conductive layer (123-2) may be in contact with the first layer (131) or the second layer (132) via the upper side of the third layer (133).

[0274] As shown in Fig. 12c, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0275] In Fig. 12c, the first layer (131) may include the same material as the first layer (131) illustrated in Fig. 12b. In Fig. 12c, the materials of each of the second layer (132) and the third layer (133) may be opposite to the materials of each of the second layer (132) and the third layer (133) illustrated in Fig. 12b. That is, in Fig. 12c, the second layer (132) may include an inorganic material having an etching rate lower than that of the first layer (131). In Fig. 12c, the third layer may include a metal or conductive oxide material having an etching rate lower than that of the first layer (131).

[0276] In Fig. 12c, the first layer (131) and the third layer (133) may be auxiliary electrodes (AC). In this case, as illustrated in Fig. 10a, for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC), it is sufficient for the second conductive layer (123-2) of the cathode electrode (123g) to be in contact with at least one of the first layer (131) or the third layer (132). For example, it is sufficient for the second conductive layer (123-2) to be in contact with the upper side of the third layer (133) or the side of the first layer (131).

[0277] As shown in FIG. 12d, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0278] In Fig. 12d, the materials of the second layer (132) and the third layer (133) may be the same as the materials of the second layer (132) and the third layer (133) illustrated in Fig. 12a, respectively. In Fig. 12d, the first layer (131) may include a material having an etching rate greater than that of the second layer (132) or the third layer (133). For example, the first layer (131) may include silicon nitride (SiNx), silicon oxide (SiOx), silicon nitride (SiON), or the like.

[0279] In Fig. 12d, the second layer (132) and the third layer (133) may be auxiliary electrodes (AC). In this case, as illustrated in Fig. 10a, for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC), it is sufficient for the second conductive layer (123-2) of the cathode electrode (123g) to be in contact with at least one of the second layer (132) or the third layer (132). For example, it is sufficient for the second conductive layer (123-2) to be in contact with the upper side of the third layer (133) or the lower side of the second layer (131).

[0280] As shown in FIG. 12e, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0281] In FIG. 12e, the first layer (131) may include a material having a high etch rate, and the second layer (132) and the third layer (133) may include a material having a low etch rate. For example, the first layer (131) and the second layer (132) may include different inorganic materials, and the third layer (133) may include a metal or a conductive oxide material.

[0282] In Fig. 12e, the third layer (133) may be an auxiliary electrode (AC). In this case, as illustrated in Fig. 10a, the second conductive layer (123-2) of the cathode electrode (123g) may be in contact with the third layer (132) for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC).

[0283] As shown in FIG. 12f, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0284] In FIG. 12f, the first layer (131) may include a material having a high etch rate, and the second layer (132) and the third layer (133) may include a material having a low etch rate. For example, the first layer (131) may include aluminum (Al), copper (Cu), or an alloy thereof. The second layer (132) and the third layer (133) may each include silicon nitride (SiNx), silicon oxide (SiOx), silicon nitride (SiON), or the like.

[0285] In Fig. 12e, the first layer (131) may be an auxiliary electrode (AC). In this case, as illustrated in Fig. 10a, the second conductive layer (123-2) of the cathode electrode (123g) may be in contact with the first layer (131) for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC).

[0286] As shown in FIG. 12g, the first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0287] In FIG. 12g, the first layer (131) may include a material having a high etch rate, and the second layer (132) and the third layer (133) may include a material having a low etch rate. The first layer (131) and the third layer (133) may include different inorganic materials. The second layer (132) may include a metal or a conductive oxide material.

[0288] In Fig. 12e, the second layer (132) may be an auxiliary electrode (AC). In this case, as illustrated in Fig. 10a, the second conductive layer (123-2) of the cathode electrode (123g) may contact the lower side of the second layer (132) via the upper side of the third layer (133) and the side of the first layer (131) for electrical connection between the cathode electrode (123g) and the auxiliary electrode (AC).

[0289] Figures 13a to 13c illustrate various arrangement positions of the blocking structure in an asymmetric blocking connection structure according to an embodiment. Although the drawings illustrate the connection structure (105A) and the blocking structure (105B) of the first protrusion (130-1) illustrated in Figure 4a, the same can be applied to the connection structure (105A) and the blocking structure (105B) of the second protrusion (130-2).

[0290] As illustrated in FIG. 4A and FIG. 13A, a first bank (111-1) may be placed on a substrate (110). The first bank (111-1) may be placed on the substrate (110) between a red subpixel (SPr) and a green subpixel (SPg).

[0291] A first protrusion (130-1) may be arranged on the upper side of the first bank (111-1). The first protrusion (130-1) may have a connection structure (105A). The first protrusion (130-1) may include a first layer (131), a second layer (132) on the first layer (131), and a third layer (133) below the first layer (131). The third layer (133) may be omitted. Although not shown, a fourth layer may be arranged on the second layer (132). The fourth layer may serve as a stopper to prevent etching of the second layer (132), but is not limited thereto.

[0292] The first layer (131), the second layer (132), and the third layer (133) may include materials having different etching selectivities. For example, since the etching rate of the first layer (131) is greater than the etching rates of the second layer (132) and / or the third layer (133), an undercut structure (151) may be formed in which the side of the first layer (131) is recessed into the first protrusion (130-1) from the side of the second layer (132) or the side of the third layer (133).

[0293] At least one of the first layer (131), the second layer (132), or the third layer (133) may be an auxiliary electrode (AC) to which the cathode electrode is electrically connected. For example, a green organic light-emitting element including an anode electrode, a green organic light-emitting layer, and a cathode electrode may be arranged in a green subpixel.

[0294] The cathode electrode may extend in the direction of the first protrusion (130-1) from the green organic light-emitting layer and be electrically connected to the auxiliary electrode (AC).

[0295] Meanwhile, a blocking structure (105B) may be arranged on the lower side of the edge region of the first bank (111-1). The blocking structure (105B) may include at least one blocking layer (113a). By having the side of at least one blocking layer (113a) enter from the side of the first bank (111-1) to the inside of the first bank (111-1), an undercut structure (152) may be formed. By disconnecting some layers (layers made of low-resistance organic light-emitting materials) constituting the green organic light-emitting element, such as a hole injection layer, a first organic light-emitting stack, a charge generation layer, etc., an electrical short between the anode electrode and the cathode electrode in the green organic light-emitting element may be blocked, thereby preventing loss due to leakage current and poor image quality.

[0296] In an embodiment, the connection structure (105A) may serve to connect the cathode electrode to the auxiliary electrode (AC), and the blocking structure (105B) may serve to block an electrical short between the anode electrode and the cathode electrode constituting the green organic light-emitting element. In this way, a structure including the connection structure (105A) and the blocking structure (105B) arranged around the first bank (111-1) may be referred to as an asymmetric blocking connection structure (105 in FIG. 4A).

[0297] As illustrated in FIG. 13b, a blocking layer (113b) included in the blocking structure (105B) can be placed inside the first bank (111-1).

[0298] The first bank (111-1) may include a first-first bank (111a) and a first-second bank (111b) on the first-first bank (111a). The first-first bank (111a) and the first-second bank (111b) may include the same material, but are not limited thereto.

[0299] The blocking layer (113b) may be arranged between the first-first bank (111a) and the first-second bank (111b). The etching rate of the blocking layer (113b) may be greater than the etching rates of the first-first bank (111a) and / or the first-second bank (111b). When the first-first bank (111a), the first-second bank (111b), and the blocking layer (113b) are etched, the side of the blocking layer (113b) may enter the inside of the first bank (111-1) from the side of the first-first bank (111a) or the first-second bank (111b), thereby forming an undercut structure (152).

[0300] As illustrated in FIG. 13c, the blocking layer (113c) of the blocking structure (105B) may be disposed on the upper side of the first bank (111-1). For example, the blocking layer (113c) may be disposed between the first bank (111-1) and the first layer (131) of the first protrusion (130-1). When the third layer (133) is disposed below the first layer (131), the blocking layer (113c) may be disposed between the first bank (111-1) and the third layer (133).

[0301] The blocking layer (113c) may be one of the layers forming the first protrusion (130-1). For example, the first protrusion (130-1) may include a first layer (131), a second layer (132) on the first layer (131), a third layer (133) below the first layer (131), and a fourth layer (not shown) on the second layer (132). In this case, the first protrusion (130-1) may further include a fifth layer as the blocking layer (113c) below the third layer (133).

[0302] The blocking layer (113c), the third layer (133), and the first bank (111-1) may have different etching selectivities.

[0303] The etching rate of the blocking layer (113c) may be greater than the etching rate of the third layer (133) and / or the first bank (111-1). In this case, an undercut structure (152) may be formed on the side of the blocking layer (113c) that extends from the side of the third layer (133) and / or the first bank (111-1) into the inside of the first protrusion (130-1).

[0304] The undercut structure (151) formed by the first layer (131) between the second layer (132) and the third layer in the first protrusion (130-1) is called the first undercut structure, and the undercut structure (152) formed by the blocking layer (113c) between the third layer (133) and the first bank (111-1) is called the second undercut structure, or vice versa.

[0305] The following are points to note depending on the formation location of the blocking layers (113a, 113b, 113c).

[0306] The thickness of the deposition films deposited on the blocking structure (105B) may be thinner than the thickness formed on the actual light-emitting portion depending on the deposition angle and the structure of the upper films of the blocking structure (105B) and the installation location thereof. For example, the thickness of the deposition film formed on the undercut structure (152) of the blocking structure (105B) illustrated in FIG. 13c may be formed to be 30% or thinner than the thickness of the deposition film formed on the undercut structure (152) of the blocking structure (105B) illustrated in FIG. 13a. This is because the thickness of the final deposited deposition film decreases as it gets closer to the first protrusion (130-1) due to the shadow effect of the first protrusion (130-1). Therefore, the thickness of the blocking gap (OG) may be set based on a deposition simulation experiment and an actual deposition experiment in addition to a method of setting the thickness of the theoretical blocking gap calculated from the thickness of the organic light-emitting element (120r, 120g, 120b) for each color. The following sixth embodiment (Fig. 14) to ninth embodiment (Fig. 17) relate to a moisture penetration blocking structure and are described in detail with reference to Figs. 14 to 17. In the description related to Figs. 14 to 17, identical or similar drawing reference numerals previously illustrated represent components having identical or similar shapes, structures and / or functions, and thus detailed descriptions thereof are omitted.

[0307] Fig. 14 is a cross-sectional view illustrating an organic light-emitting display device according to a sixth embodiment. Although the drawing illustrates a red subpixel (SPr) and a first bank (130-1), the same may be applied to a green subpixel (SPg), a blue subpixel (SPb) and other banks.

[0308] Referring to FIG. 14, an organic light-emitting display device according to the sixth embodiment may include a substrate (110), a first bank (130-1), a first protrusion (130-1), a red organic light-emitting element (120r), an encapsulating layer (135), etc. Since the encapsulating layer (135) has a moisture penetration blocking structure, moisture, etc. is blocked, and thus the organic light-emitting element can be prevented from being damaged by moisture, etc.

[0309] An organic light-emitting display device having a side-by-side structure in which a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb) are sequentially formed can be manufactured using a photolithography process. The photolithography process including an exposure process and an etching process can be performed three times to sequentially form the red subpixel (SPr), the green subpixel (SPg), and the blue subpixel (SPb). In this case, the undercut structure (151), for example, the U-cavity, is a very important area for ensuring the yield and reliability of the product. Therefore, the sealing layer (135) disposed on the red organic light-emitting layer (122r) or the cathode electrode (123r) using the undercut structure (151) needs to have a structure that reliably blocks moisture, etc., i.e., a moisture penetration blocking structure. A red organic light-emitting element (120r) can be formed by an anode electrode (not shown), a red organic light-emitting layer (122r), and a cathode electrode (123r).

[0310] In an embodiment, the sealing layer (135) may include a first-first insulating layer (135-1) and a first-second insulating layer (135-2) on the first-first insulating layer (135-1). For example, the first-first insulating layer (135-1) and the first-second insulating layer (135-2) may include different inorganic materials. For example, the first-first insulating layer (135-1) may include a silicon oxide-based material, and the first-second insulating layer (135-2) may include a silicon nitride-based material. For example, the first-first insulating layer (135-1) may include an inorganic material, and the first-second insulating layer (135-2) may include an organic material. By forming a sealing layer (135) having a double structure of the 1-1 insulating layer (135-1) and the 1-2 insulating layer (135-2), moisture, etc. does not penetrate through the sealing layer (135) to the cathode electrode (123r) or the red organic light-emitting element (120r).

[0311] Fig. 15 is a cross-sectional view illustrating an organic light-emitting display device according to a seventh embodiment. Although the drawing illustrates a red subpixel (SPr) and a first bank (130-1), the same may be applied to a green subpixel (SPg), a blue subpixel (SPb) and other banks.

[0312] Referring to FIG. 15, an organic light-emitting display device according to the seventh embodiment may include a substrate (110), a first bank (130-1), a first protrusion (130-1), a red organic light-emitting element (120r), an encapsulating layer (135), etc. Since the encapsulating layer (135) has a moisture penetration blocking structure, moisture, etc. is blocked, and thus the organic light-emitting element can be prevented from being damaged by moisture, etc.

[0313] In the seventh embodiment (Fig. 15), the sealing layer (135) may have a double structure, similar to the sixth embodiment (Fig. 14). However, in the sealing layer (135) of the seventh embodiment (Fig. 15), the first-first insulating layer (135-1) and the first-second insulating layer (135-2) may include different inorganic materials. For example, the first-first insulating layer (135-1) may include a silicon nitride-based material, and the first-second insulating layer (135-2) may include a silicon oxide-based material. Since the sealing layer (135) having a double structure of the first-first insulating layer (135-1) and the first-second insulating layer (135-2) is formed, moisture or the like does not penetrate through the sealing layer (135) to the cathode electrode (123r) or the red organic light-emitting element (120r).

[0314] Meanwhile, the organic light-emitting display device according to the seventh embodiment may include a resin layer (136). The resin layer (136) may be formed inside the undercut structure (151). The resin layer (136) may be a residual film remaining from an organic film constituting a photosensitive pattern or an encapsulation layer (135) after an etching process is performed to form a red subpixel (SPr), but is not limited thereto. The resin layer (136) may also be included as a part of the encapsulation layer (135), but is not limited thereto.

[0315] To be more specific, after the red organic light-emitting element (120r) and the like are deposited on the entire area of ​​the substrate (110), the red organic light-emitting element (120r) and the like can be removed from the first bank (130-1) or the green subpixel (SPg) and the blue subpixel (SPb) using a photosensitive pattern so that the red organic light-emitting element (120r) remains only in the red subpixel (SPr). Thereafter, the photosensitive pattern can be removed. The photosensitive pattern can have high purity, low water vapor transmission rate (WVTR), and the like and can include a transparent resin material. Even if the photosensitive pattern removal process is performed, a part of the photosensitive pattern may remain without being removed inside the undercut structure (151), thereby being formed as a residual film as a resin layer (136).

[0316] Fig. 16 is a cross-sectional view illustrating an organic light-emitting display device according to the eighth embodiment.

[0317] Although the drawing shows a red subpixel (SPr) and a first bank (130-1), the same may be applied to green subpixels (SPg), blue subpixels (SPb) and other banks.

[0318] Referring to FIG. 16, an organic light-emitting display device according to the eighth embodiment may include a substrate (110), a first bank (130-1), a first protrusion (130-1), a red organic light-emitting element (120r), an encapsulating layer (135), a resin layer (136), etc. Since the encapsulating layer (135) has a moisture penetration blocking structure, moisture, etc. is blocked, and thus the organic light-emitting element can be prevented from being damaged by moisture, etc.

[0319] In the sixth embodiment (Fig. 14) and the seventh embodiment (Fig. 15), a sealing layer (135) having a double structure is provided, whereas in the eighth embodiment (Fig. 16), the sealing layer (135) may have a triple structure.

[0320] The sealing layer (135) may include a first-first insulating layer (135-1), a first-second insulating layer (135-2) on the first-first insulating layer (135-1), and a first-third insulating layer (135-3) on the first-second insulating layer (135-2). The first-first insulating layer (135-1), the first-second insulating layer (135-2), and the first-third insulating layer (135-3) may include different inorganic materials. For example, the first-first insulating layer (135-1) and the first-third insulating layer (135-3) may include a silicon oxide-based material, and the first-second insulating layer (135-2) may include a silicon nitride-based material.

[0321] The resin layer (136) can be formed on the red subpixel (SPr) as well as inside the undercut structure (151).

[0322] As described above, a photosensitive pattern may be formed on the red subpixel (SPr) to remove the red organic light-emitting element (120r) deposited on the green subpixel (SPg) and the blue subpixel (SPb) except for the red subpixel (SPr). After the red organic light-emitting element (120r) deposited on the green subpixel (SPg) and the blue subpixel (SPb) is removed using the photosensitive pattern, the photosensitive pattern is not removed, so that the resin layer (136) may be formed on the red subpixel (SPr) as well as inside the undercut structure (151). The resin layer (136) may be included as a part of the encapsulation layer (135), but is not limited thereto.

[0323] Fig. 17 is a cross-sectional view illustrating an organic light-emitting display device according to a ninth embodiment. The ninth embodiment is similar to the seventh embodiment (Fig. 15) or the eighth embodiment (Fig. 16) except for the second sealing layer (141r). In the ninth embodiment, components having the same shape, structure, and / or function as those in the seventh embodiment (Fig. 15) or the eighth embodiment (Fig. 16) are given the same reference numerals, and a detailed description thereof is omitted. Although the drawing illustrates a red subpixel (SPr) and a first bank (130-1), the same may be applied to a green subpixel (SPg), a blue subpixel (SPb), and other banks.

[0324] Referring to FIG. 17, an organic light-emitting display device according to the ninth embodiment may include a substrate (110), a first bank (130-1), a first protrusion (130-1), a red organic light-emitting element (120r), a first encapsulating layer (135), a resin layer (136), a second encapsulating layer (141r), etc. Since the first encapsulating layer (135) and the second encapsulating layer (141r) have a moisture penetration blocking structure, moisture, etc. are blocked, and thus the organic light-emitting element can be prevented from being damaged by moisture, etc.

[0325] A moisture penetration path (arrow) is illustrated in Fig. 17. That is, moisture can penetrate through the etched cross-section of the red organic light-emitting layer (122r) formed on the first protrusion (130-1) and the opening gap (G) of the undercut structure (151), move toward the anode electrode (121r) of the red subpixel (SPr), and penetrate along the organic light-emitting layer of the red subpixel (SPr).

[0326] To more completely block these moisture penetration paths (arrows), in an embodiment, a second sealing layer (141r) may be disposed on the first sealing layer (135). The second sealing layer (141r) may include a 2-1 insulating layer (141-1), a 2-2 insulating layer (141-2), a 2-3 insulating layer (141-3), etc. The 2-1 insulating layer (141-1), the 2-2 insulating layer (141-2), and the 2-3 insulating layer (141-3) may each include a photosensitive material. The 2-1 insulating layer (141-1), the 2-2 insulating layer (141-2), and the 2-3 insulating layer (141-3) may each include an inorganic material or an organic material.

[0327] Meanwhile, although not shown, in a photolithography process in which blue subpixels (SPb), green subpixels (SPg), and red subpixels (SPr) are formed in that order, three insulating layers may be provided as second encapsulation layers on the first encapsulation layer (135) of the blue subpixel (SPb), two insulating layers may be provided as second encapsulation layers on the first encapsulation layer (135) of the green subpixel (SPg), and one insulating layer may be provided as second encapsulation layers on the first encapsulation layer (135) of the red subpixel (SPr).

[0328] After the red subpixel (SPr) is patterned, there is no need to form a separate undercut structure (151), so one insulating layer of the second encapsulation layer on the first encapsulation layer (135) of the red subpixel (SPr) can be used for pad opening of the non-display area (NAA) on the outside of the panel.

[0329] When one insulating layer is not used for pad opening of the non-display area (NAA), two insulating layers may be provided as a second encapsulating layer on the first encapsulating layer (135) of the blue subpixel (SPb), one insulating layer may be provided as a second encapsulating layer on the first encapsulating layer (135) of the green subpixel (SPg), and no insulating layer may be provided on the first encapsulating layer of the red subpixel (SPr).

[0330] Meanwhile, the first-first insulating layer (135-1) and the first-third insulating layer (135-3) of the first sealing layer (135) may be formed of an ALD process-based inorganic film having a moisture vapor transmission rate (WVTR) that is approximately 20 times better than that of a PECVD process-based inorganic film. Accordingly, a high-reliability product with dramatically improved moisture penetration blocking performance can be realized. Such a high-reliability product can be applied to automotive and military organic light-emitting display devices that must be guaranteed for a long time in a high-temperature / high-humidity environment.

[0331] Although not shown, a polymer resin may be applied using an inkjet process on the 2nd-3rd insulating layer (141-3) of the 2nd sealing layer (141r) to form a resin layer, and another sealing layer or another insulating layer containing an inorganic material may be formed on the resin layer.

[0332] FIGS. 18A to 18D illustrate at least one layer added between the electron injection layer and the cathode electrode of the second organic light-emitting stack.

[0333] As illustrated in Fig. 18a, a cathode electrode (E2) may be formed on an electron injection layer (EIL). As illustrated in Fig. 18b, a first conductive layer (123-1 in Fig. 10a) may be deposited on the electron injection layer (EIL), and a second conductive layer (123-2) may be deposited on the first conductive layer (123-1) using a sputtering process. A cathode electrode (E2) may be formed by the first conductive layer (123-1) and the second conductive layer (123-2).

[0334] The electron injection layer (EIL) may include Yb or Li, the first conductive layer (123-1) may include Mg:Ag, and the second conductive layer (123-2) may include ITO, IZO, etc. In this case, the electron injection layer (EIL) or the first conductive layer (123-1) may be damaged by radicals from the plasma during the sputtering process.

[0335] A plasma protection layer (PPL) may be formed on the electron injection layer (EIL). As an example, as illustrated in FIG. 18c, the plasma protection layer (PPL) may be formed between the electron injection layer (EIL) and a first conductive layer (123-1) including Mg:Ag. As another example, as illustrated in FIG. 18d, the plasma protection layer (PPL) may be formed between a first conductive layer (123-1) including Mg:Ag and a second conductive layer (123-2) including IZO or the like.

[0336] When the properties of the material of the plasma protection layer (PPL), such as refractive index, electrical conductivity, and transmittance, the type and amount of doping material, and the thickness of each layer are optimized, the luminous efficiency of the organic light-emitting display device can be improved.

[0337] Figures 19a to 19c show simulated results of luminance according to the thickness of the capping layer including LiF according to the comparative example and the embodiment. Figures 19b and 19c are results comparing the light efficiency of each of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) according to the thickness of each of the inorganic capping layer (LiF) and the organic capping layer illustrated in Figure 18d with the light efficiency in the comparative example (Figure 19a).

[0338] In FIGS. 19a to 19c, the horizontal axis may represent the thickness of the inorganic capping layer, and the vertical axis may represent the brightness.

[0339] In Fig. 19a, when the thickness of the inorganic camping layer is 40 nm, the luminance of each of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) with the thickness of the organic capping layer being 90 nm is 1024 cd / cm. 2 , 1056cd / cm 2 and 185cd / cm 2 It could be.

[0340] As shown in Fig. 19b, when the thickness of the inorganic capping layer is 160 nm in the structure with the plasma protection layer (PPL) added, the luminance of each of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) with the thickness of the organic capping layer being 60 nm is 767 cd / cm. 2 , 939cd / cm 2 and 450cd / cm 2 It could be.

[0341] As shown in Fig. 19c, in the structure with the plasma protection layer (PPL) added, the thickness of the inorganic capping layer is 144 nm, and the brightness of each of the red organic light-emitting element (120r), green organic light-emitting element (120g), and blue organic light-emitting element (120b) with the thickness of the organic capping layer is 46 nm is 1303 cd / cm. 2 , 1404cd / cm 2 and 291cd / cm 2 It could be.

[0342] As shown in FIGS. 19a to 19c, it can be seen that the luminance of each of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) varies depending on the thickness of the inorganic capping layer.

[0343] Therefore, by optimizing the thickness of the inorganic capping layer and the thickness of the organic capping layer, the luminous efficiency of each of the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) in the embodiment is much higher than that of the comparative example, and thus the luminance can also be increased.

[0344] Fig. 20 is a schematic plan view of an organic light-emitting display device according to a second embodiment. Fig. 21 is a plan view illustrating one pixel of Fig. 20. Although the drawing illustrates that the substrate (110) is transported along the second direction (Y), this is not a limitation.

[0345] As described above, in the first embodiment (Figs. 1 and 2), the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) can be arranged in a stripe shape along the second direction (Y).

[0346] In contrast, as illustrated in FIGS. 20 and 21, in the second embodiment, a red organic light-emitting element (120r), a green organic light-emitting element (120g), and a blue organic light-emitting element (120b) may be arranged spaced apart from each other in a dot shape. The red organic light-emitting element (120r) may be arranged in a red subpixel (SPr), the green organic light-emitting element (120g) may be arranged in a green subpixel (SPg), and the blue organic light-emitting element (120b) may be arranged in a blue subpixel (SPb). One pixel (P) may be configured by the red subpixel (SPr), the green subpixel (SPg), and the blue subpixel (SPb).

[0347] For example, the red organic light-emitting element (120r) and the green organic light-emitting element (120g) may be each disconnected by one row line along the second direction (Y). For example, the blue organic light-emitting element (120b) may be disconnected by two row lines along the second direction (Y).

[0348] For example, the area of ​​the blue organic light-emitting element (120b) may be larger than the area of ​​the red organic light-emitting element (120r) or the area of ​​the green organic light-emitting element (120g). The length of the blue organic light-emitting element (120b) in the second direction (Y) may be similar to the sum of the width of the red organic light-emitting element (120r) and the width of the green organic light-emitting element (120g), but is not limited thereto.

[0349] Meanwhile, in the pixel structure illustrated in FIGS. 20 and 21, there is no connection structure (105A in FIG. 4A) between adjacent subpixels along the first direction (X), but along the second direction (Y), an asymmetric blocking connection structure (105), i.e., a connection structure (105A) and a blocking structure (105B), may be provided at least at two or more corners of each subpixel (SPr, SPg, SPb).

Claims

1. Bank between subpixels on the substrate; An anode electrode in the above subpixel; An organic light-emitting layer disposed on the anode electrode and the bank, and including a hole injection layer; A cathode electrode disposed on the organic light-emitting layer and in contact with an end of the hole injection layer; and A blocking structure is included in the edge area of ​​the above bank; The above organic light-emitting layer has a separation structure corresponding to the above blocking structure, The above hole injection layer is disconnected from the above separation structure, Organic light emitting display device.

2. In paragraph 1, The above blocking structure is, At least one blocking layer extending inward from the side of the bank; Organic light emitting display device.

3. In paragraph 2, The above blocking structure has an undercut structure having a blocking gap corresponding to the width of the blocking layer, The margin of the above blocking gap is, The distance between the cathode electrode and the second organic light-emitting stack in the red organic light-emitting device having the largest thickness is set between the distance between the anode electrode and the cathode electrode in the blue organic light-emitting device having the smallest thickness. Organic light emitting display device.

4. In paragraph 3, The thickness of the above blocking gap is set based on a deposition simulation experiment and an actual deposition experiment based on a method of setting a blocking gap calculated from the thickness of the organic light-emitting element for each color. Organic light emitting display device.

5. In paragraph 1, The above organic light-emitting layer, a first organic light-emitting stack between the hole injection layer and the charge generation layer; and a second organic light-emitting stack between the charge generation layer and the cathode electrode; The above cathode electrode is in contact with the end of the charge generation layer, organic light emitting display device, 6. In paragraph 5, The first organic light-emitting layer and the charge generation layer are disconnected from the separation structure. organic light emitting display device, 7. In paragraph 1, The above cathode electrode is, Containing at least one of a first conductive layer or a second conductive layer, The first conductive layer comprises a Mg:Ag alloy, The second conductive layer comprises a conductive oxide material, Organic light emitting display device.

8. In paragraph 7, Further comprising a protrusion on the upper side of the above bank; The above protrusion has a connecting structure including an auxiliary electrode electrically connected to the cathode electrode, The above protrusion is, 1st floor; and a second layer on the first layer; The above connection structure is, The side of the first layer has an undercut structure that goes into the inside of the protrusion from the side of the second layer, organic light emitting display device, 9. In paragraph 8, The second conductive layer is disposed on the first conductive layer, The first conductive layer is disposed on the organic light-emitting layer, The second conductive layer is in contact with the side of the first layer and the lower side of the second layer. Organic light emitting display device.

10. In paragraph 8, The above protrusion is, further comprising a third layer below the first layer; The side of the third layer is positioned on the same line as the side of the second layer or extends from the side of the second layer in the direction of the subpixel. Organic light emitting display device.

11. In paragraph 10, At least one of the first layer, the second layer or the third layer is the auxiliary electrode, Organic light emitting display device.

12. In paragraph 10, The above hole injection layer is disposed on the third layer, The first conductive layer is in contact with the end of the hole injection layer and the upper side of the third layer. Organic light emitting display device.

13. In paragraph 10, The second conductive layer is disposed on the first conductive layer, The first conductive layer is disposed on the organic light-emitting layer, The second conductive layer is in contact with the side of the first layer, the lower side of the second layer, the end of the hole injection layer, and the upper side of the third layer. Organic light emitting display device.

14. In paragraph 10, The above protrusion is, further comprising a fourth layer on the second layer; Organic light emitting display device.

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