Bonding packaging method and display device

Abstract

The present application relates to a bonding packaging method and a display device. At least one embodiment of the present application provides a bonding packaging method, comprising: bonding an optical adhesive to a first surface of a first plate body to form an optical adhesive layer, wherein there is a gap between the outer side edge of the optical adhesive layer and the outer side edge of the first plate body, and the size of the optical adhesive layer is smaller than that of the first plate body; dispensing and filling the gap to form a sealant layer, so that the gap is filled with the sealant layer; and bonding a second surface of a second plate body to the optical adhesive layer and the sealant layer, the orthographic projection of the second plate body covering the optical adhesive layer and the sealant layer. According to the present application, the sealant layer is embedded between a substrate and a cover plate, the mode that no sealing depth exists in the traditional technology is changed into the mode that the packaging depth is set, the sealing effect of the display device is improved, and the stability and durability of product sealing are improved.

Description

Lamination packaging method and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on August 28, 2023, with application number 202311090342.2, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of display technology, and in particular to a bonding packaging method and a display device. Background Art

[0004] With the development of display technology, the bonding and packaging process of display devices has also developed accordingly. In traditional technology, the bonding and packaging of display devices usually first applies OCA optical adhesive to the substrate and / or cover plate, and then applies sealant to the outer walls of the substrate and cover plate.

[0005] However, the sealant in the display device packaged by the above method can only contact the outer side of the product, resulting in poor sealing effect and prone to sealing failure, which affects the quality of the display device and further affects subsequent use effects.

[0006] Summary of the Invention

[0007] Based on this, it is necessary to provide a bonding packaging method and a display device to address the problem that the sealant can only contact the outer side of the product.

[0008] An embodiment of the first aspect of the present application provides a bonding packaging method, comprising:

[0009] Laminating optical adhesive on the first surface of the first plate to form an optical adhesive layer, wherein an outer edge of the optical adhesive layer is spaced from an outer edge of the first plate, and a size of the optical adhesive layer is smaller than a size of the first plate;

[0010] Filling the gap with glue to form a sealant layer, so that the sealant layer fills the gap;

[0011] The second surface of the second plate is bonded to the optical adhesive layer and the sealant layer, and the orthographic projection of the second plate covers the optical adhesive layer and the sealant layer.

[0012] According to the bonding and packaging method of the embodiment of the present application, the first plate body can be configured as one of the substrate and the cover plate, and the second plate body can be configured as the other of the substrate and the cover plate. The optical adhesive layer adheres the substrate and the cover plate together, and the sealant layer seals the substrate, the optical adhesive layer, and the cover plate to achieve the effect of sealing and packaging. Compared with the traditional technology in which the optical adhesive layer is fully attached to the substrate and / or the cover plate, and the sealant layer can only be applied to the outer walls of the substrate and the cover plate, the sealant layer in the present application is embedded between the substrate and the cover plate. The traditional technology does not have a sealing depth, but is improved to set a packaging depth, thereby improving the sealing effect of the display device and improving the stability and durability of the product's sealing.

[0013] In one embodiment, the step of dispensing glue in the gap to form a sealant layer includes:

[0014] Obtaining a pattern of the spacing, and formulating a dispensing path according to the pattern;

[0015] Glue is dispensed within the spacing according to the dispensing path to form a sealant layer, so that the height of the sealant layer is greater than or equal to the height of the optical adhesive layer.

[0016] In one embodiment, the dispensing path includes at least a plurality of path segments extending along the circumferential direction, two adjacent path segments are connected to form a continuous dispensing path, and the two adjacent path segments are spaced apart along the inner and outer directions; or

[0017] The dispensing path includes at least a plurality of first paths and second paths, wherein the extension lines of the first paths and the second paths intersect, and adjacent first paths and second paths are connected end to end; at least part of the path segments or the first paths or the second paths are arranged in contact with the outer edge of the optical adhesive layer and the outer edge of the first surface of the first plate;

[0018] The method of making the sealant layer fill the gap includes:

[0019] Glue is dispensed along the dispensing path, and the dispensing glue line covers the dispensing path, so that the formed sealant layer is bonded to the outer edge of the optical adhesive layer and the first surface of the first plate.

[0020] In one embodiment, the size of the glue line of the glue dispensing is greater than or equal to the interval between the two adjacent path segments; or

[0021] The glue line size of the glue dispensing is greater than or equal to the distance between the first path and the second path.

[0022] In one embodiment, the method further comprises:

[0023] When dispensing is completed within the interval, the sealant layer is filled within the interval in a first state;

[0024] Before attaching the second plate, the sealant layer is subjected to a pre-forming process so that the sealant layer is in a second state and fills the gap; wherein the hardness of the second state is greater than the hardness of the first state.

[0025] In one embodiment, the method further comprises:

[0026] After the second plate is attached, the sealant layer is cured so that the sealant layer is in a third state, and the hardness of the third state is greater than the hardness of the second state.

[0027] In one embodiment, the sealant layer includes UV glue;

[0028] The pre-setting process includes irradiating the UV glue with a UV curing lamp so that the UV glue is in the second state.

[0029] An embodiment of a second aspect of the present application provides a display device manufactured using the bonding and packaging method described in any of the above embodiments, the display device comprising:

[0030] a first plate;

[0031] a second plate;

[0032] an optical adhesive layer disposed between the first plate and the second plate, wherein a first adhesive surface and a second adhesive surface of the optical adhesive layer are respectively bonded to the first plate and the second plate; the first adhesive surface and the second adhesive surface are disposed opposite to each other;

[0033] There is a distance between the outer edge of the optical adhesive layer and the outer edges of the first plate and the second plate, and the orthographic projections of the first plate and the second plate both cover the optical adhesive layer;

[0034] The display device further includes a sealant layer, and the sealant layer is filled in the gap and completely fills the gap.

[0035] In the above-mentioned display device, the first plate body can be configured as one of the substrate and the cover plate, and the second plate body can be configured as the other of the substrate and the cover plate. The optical adhesive layer adheres the substrate and the cover plate together, and the sealant layer seals the substrate, the optical adhesive layer, and the cover plate together to achieve a sealed package effect. Compared to conventional technologies in which the optical adhesive layer is fully adhered to the substrate and / or the cover plate, and the sealant layer can only be applied to the outer walls of the substrate and the cover plate, the sealant layer in the present application is embedded between the substrate and the cover plate. The conventional technology has no sealing depth, but an encapsulation depth is provided, thereby improving the sealing effect of the display device and enhancing the stability and durability of the product's sealing.

[0036] In one embodiment, the spacing is greater than or equal to 0.1 mm.

[0037] In one embodiment, the center of the optical adhesive layer coincides with or tends to coincide with the centers of the first plate and the second plate; or

[0038] The optical adhesive layer has a hollow portion; the center of the hollow portion coincides with or tends to coincide with the centers of the first plate body and the second plate body. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG1 is a schematic flow chart of a bonding and packaging method according to an embodiment of the present application.

[0040] FIG. 2 is a schematic diagram of a display device manufactured using a bonding packaging method according to an embodiment of the present application.

[0041] FIG3 is a schematic diagram of glue dispensing in a bonding packaging method according to an embodiment of the present application.

[0042] FIG4 is a partial enlarged schematic diagram of point A in FIG3 .

[0043] FIG. 5 is a schematic diagram of a dispensing path when a display device is manufactured using a bonding packaging method according to an embodiment of the present application.

[0044] FIG. 6 is another schematic diagram of a dispensing path when a display device is manufactured using a bonding packaging method according to an embodiment of the present application.

[0045] FIG. 7 is a schematic diagram of a second plate after lamination in a lamination packaging method according to an embodiment of the present application.

[0046] FIG8 is a schematic diagram of a pre-forming process for a sealant layer in a lamination packaging method according to an embodiment of the present application.

[0047] FIG9 is a schematic structural diagram of a display device in an embodiment of the present application.

[0048] FIG10 is a schematic structural diagram of a display device provided with a hollow portion in one embodiment of the present application.

[0049] Figure numerals: 100, display device; 10, first plate; 11, first surface; 20, optical adhesive layer; 21, first bonding surface; 22, second bonding surface; 23, hollow portion; 30, sealing adhesive layer; 40, second plate; 41, second surface; 50, dispensing path; 51, first path; 52, second path; 200, UV curing lamp; 300, dispensing machine. DETAILED DESCRIPTION

[0050] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0051] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0052] In this document, spatially related terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Therefore, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be directly formed on the other layer, or intervening layers may also be present. Therefore, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers therebetween.

[0053] In the drawings, the dimensions of layers and regions may be exaggerated for clarity. It will be understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or intervening layers may be present. Additionally, it will be understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or one or more intervening layers may be present. Like reference numerals refer to like elements throughout.

[0054] Hereinafter, although terms such as "first," "second," and the like may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are used only to distinguish one component from another. It will also be understood that expressions used in the singular include plural expressions, unless the singular expression has a significantly different meaning in the context. In addition, in the following embodiments, it will also be understood that the terms "including" and / or "having" used herein indicate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0055] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted that the layer, region, or element is not only directly connected but also connected via other constituent elements interposed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly but also via another layer, region, element, etc. interposed therebetween.

[0056] As used in this application, the term "and / or" includes any and all combinations of one or more of the associated listed items. When a phrase such as "at least one of..." follows a list of elements, it modifies the entire list, not the individual elements in the list.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used in the specification of this application are intended only to describe specific embodiments and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0058] It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0059] The electronic or electrical devices and / or any other related devices or components according to the embodiments of the concepts of the present application described herein (for example, a display device including a display panel and a display panel driver, wherein the display panel driver also includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver and an emission driver) can be implemented using any appropriate hardware, firmware (for example, an application specific integrated circuit), software, or a combination of software, firmware and hardware. For example, the various components of these devices can be formed on an integrated circuit (IC) chip or on separate IC chips. In addition, the various components of these devices can be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. In addition, the various components of these devices can be processes or threads that run on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. The computer program instructions are stored in a memory that can be implemented in a computing device using standard storage devices such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Moreover, it should be appreciated by those skilled in the art that the functionality of various computing devices can be combined or integrated into a single computing device, or that the functionality of a particular computing device can be distributed across one or more other computing devices without departing from the spirit and scope of the exemplary embodiments of the concepts of the present application.

[0060] Although exemplary embodiments of a display module and a display device including a display module have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that a display module constructed according to the principles of the present application and a display device including a display module may be implemented otherwise than as specifically described herein. The present application is further defined in the claims and their equivalents.

[0061] Referring to FIG. 1 , and in combination with the schematic diagrams shown in FIG. 2 , FIG. 3 and FIG. 7 , FIG. 1 shows a schematic flow chart of a bonding and packaging method according to an embodiment of the present application.

[0062] At least one embodiment disclosed in this application provides a bonding packaging method, comprising:

[0063] In step S200 , optical adhesive is applied to the first surface 11 of the first plate 10 to form an optical adhesive layer 20 . The outer edges of the optical adhesive layer 20 are spaced apart from the outer edges of the first plate 10 , and the size of the optical adhesive layer 20 is smaller than that of the first plate 10 .

[0064] Step S300 : dispensing glue in the gap to form a sealant layer 30 , so that the sealant layer 30 fills the gap.

[0065] Step S400 , laminating the second surface 41 of the second plate 40 to the optical adhesive layer 20 and the sealant layer 30 , with the orthographic projection of the second plate 40 covering the optical adhesive layer 20 and the sealant layer 30 .

[0066] According to the bonding and packaging method of the embodiment of the present application, the first plate body 10 can be configured as one of the substrate and the cover plate, and the second plate body 40 can be configured as the other of the substrate and the cover plate. The size of the optical adhesive layer 20 is retracted relative to the first surface 11 of the first plate body 10, so that after the optical adhesive layer 20 is bonded to the middle position of the first surface 11, the edge of the first surface 11 is exposed for bonding with the sealant layer 30. The optical adhesive layer 20 bonds the substrate and the cover plate, and the sealant layer 30 seals the substrate, the optical adhesive layer 20, and the cover plate to achieve the effect of sealing and packaging. Compared with the conventional technology in which the optical adhesive layer 20 is fully bonded to the substrate and / or the cover plate, the sealant layer 30 can only be applied to the outer wall of the substrate and the cover plate. The sealant layer 30 in the present application is embedded between the substrate and the cover plate, and the conventional technology has no sealing depth, but has an improved sealing depth, thereby improving the sealing effect of the display device 100 and improving the stability and durability of the product's sealing.

[0067] In addition, the display device 100 obtained by the bonding packaging method provided in the embodiment of the present application has no glue or covering on the side walls of the first plate body 10 and the second plate body 40. While ensuring the stability and durability of the sealing of the display device 100, the side walls of the first plate body 10 and the second plate body 40 are kept exposed, which makes it easier to apply other glue or assemble other parts on the side walls of the first plate body 10 and the second plate body 40 during the process of further processing of the display device 100 to form other products.

[0068] 2 shows a schematic diagram of a display device 100 manufactured using a bonding and packaging method according to an embodiment of the present application. In some embodiments, the outer edge of the optical adhesive layer 20 and the outer edge of the first plate 10 are spaced apart by a distance H1.

[0069] Referring to Figures 3 and 4, Figure 3 shows a schematic diagram of dispensing glue in a bonding packaging method according to an embodiment of the present application. Figure 4 shows a partially enlarged schematic diagram of point A in Figure 3. In some embodiments, dispensing glue within the gap to form a sealant layer 30, step S300 is specifically as follows:

[0070] Step S310: Obtain a pattern of spacing, and formulate a dispensing path 50 according to the pattern.

[0071] Step S320 , dispensing glue within the gap along the dispensing path 50 to form a sealant layer 30 , such that the height of the sealant layer 30 is greater than or equal to the height of the optical adhesive layer 20 .

[0072] The glue dispensing process can be performed by a glue dispenser 300 or manually. The glue dispensing path 50 can be guided by CAD software or determined manually by manually outlining. When dispensing glue using the glue dispenser 300, after determining the glue dispensing path 50, the glue dispenser 300 is placed above the pre-dispensing position of the sealant and glue is applied vertically to the first surface 11 of the first plate 10, performing the glue dispensing process according to the glue dispensing path 50.

[0073] The bonding packaging method of the embodiment of the present application improves the effective sealing connection area of ​​the sealant layer 30 and increases the packaging depth, resulting in smaller limitations on the chemical type of the sealant, lowering the weather resistance requirements of the sealant, and lowering the overall requirements for the sealant. It is easier to select a sealant that meets the sealing requirements, thereby reducing production difficulty and production costs.

[0074] 4 , in some embodiments, the height of the sealant layer 30 is greater than that of the optical adhesive layer 20 , and the height difference is H2 .

[0075] Referring to Figure 5, a schematic diagram of a dispensing path 50 for manufacturing a display device 100 using a bonding and packaging method according to an embodiment of the present application is shown. In some embodiments, the dispensing path 50 includes at least a plurality of path segments extending along a circumferential direction, with two adjacent path segments connected to form a continuous dispensing path 50. The adjacent path segments are spaced apart in the inner and outer directions, i.e., the dispensing path 50 forms a U-shaped path.

[0076] Referring to Figure 6, another schematic diagram of a dispensing path 50 for manufacturing a display device 100 using a bonding and packaging method according to an embodiment of the present application is shown. In some embodiments, the dispensing path 50 includes at least a plurality of first paths 51 and second paths 52. The extensions of the first paths 51 and second paths 52 intersect, and adjacent first paths 51 and second paths 52 are connected end to end, i.e., the dispensing path 50 is a zigzag path. It is understood that the dispensing path 50 can also be designed in other shapes depending on the specific situation.

[0077] At least part of the path segment or the first path 51 or the second path 52 is arranged close to the outer edge of the optical adhesive layer 20 and the outer edge of the first surface 11 of the first plate 10 so that the sealant layer 30 fills the gap. Specifically:

[0078] Glue is dispensed along the dispensing path 50 , and the dispensing glue line covers the dispensing path 50 , so that the formed sealant layer 30 is bonded to the outer edge of the optical adhesive layer 20 and the first surface 11 of the first plate 10 .

[0079] In some embodiments, the size of the glue line is greater than or equal to the distance between two adjacent path segments; or the size of the glue line is greater than or equal to the distance between the first path 51 and the second path 52 .

[0080] In some embodiments, the bonding packaging method further comprises:

[0081] When dispensing in the gap is completed, the sealant layer 30 is filled in the gap in the first state;

[0082] Before attaching the second plate 40 , the sealant layer 30 is pre-shaped so that the sealant layer 30 is in a second state and fills the gap. The hardness of the second state is greater than that of the first state.

[0083] The second state of the sealant layer 30 means that the sealant layer 30 is in an initial solid state, which does not affect its bonding performance with the second plate, thereby ensuring the sealing between the sealant layer and the subsequently bonded second plate.

[0084] Specifically, before attaching the second plate 40, the sealant layer 30 is pre-shaped to transform the sealant layer 30 from the first state to the second state, i.e., to increase the hardness of the sealant layer 30. When attaching the second plate 40, the internal air pressure generated between the second plate 40 and the first plate 10 causes an air pressure shock to the sealant layer 30. Therefore, the sealant layer 30 is pre-shaped to pre-cure it, thereby increasing its overall hardness and transforming it into the second state, where it has sufficient strength to withstand the internal air pressure generated between the second plate 40 and the first plate 10, thereby reducing structural deformation of the sealant layer 30 caused by this air pressure.

[0085] Referring to Figure 7, a schematic diagram illustrating the lamination of the second plate 40 in accordance with an embodiment of the present application is shown. In some embodiments, the lamination and packaging method further includes curing the sealant layer 30 after laminating the second plate 40, such that the sealant layer 30 is in a third state, wherein the third state has a greater hardness than the second state. The sealant layer 30 exhibits optimal bonding strength when in the third state.

[0086] Specifically, after the first plate 10 is attached, it is heated or placed in other high-temperature environments to increase the hardness of the sealant layer 30 .

[0087] Referring to Figure 8, a schematic diagram illustrating a pre-setting process for sealant layer 30 in a lamination and packaging method according to one embodiment of the present application is shown. In some embodiments, sealant layer 30 comprises UV (Ultraviolet Ray) glue; the pre-setting process includes irradiating the UV glue with a UV curing lamp 200 to cure the UV glue to a second state.

[0088] Specifically, the light from the UV curing lamp 200 activates the photoinitiator within the UV adhesive, inducing a polymerization reaction, thereby pre-setting the UV adhesive and, in other words, pre-setting the sealant layer 30. It will be appreciated that the type, wavelength, and parameters of the UV curing lamp 200 are selected based on the characteristics of the UV adhesive used for the sealant. Since this is a pre-setting process, it only enhances the strength of the UV adhesive, but does not completely dry it out. It also needs to maintain a certain viscosity to achieve a sealed connection with the subsequent second plate 40 and achieve a sealing effect.

[0089] In some embodiments, to pre-shape the sealant layer 30, the UV curing lamp 200 can be configured as a frame-shaped light source similar to the sealant layer 30. Alternatively, a plurality of UV curing lamps 200 light bars can be provided, so that the UV curing lamps 200 illuminate the UV adhesive from above to pre-shape the UV adhesive. This allows the UV curing lamps 200 to precisely illuminate the UV adhesive where it requires UV light, while minimizing the exposure of the optical adhesive layer 20 to maintain its adhesiveness, thereby ensuring a good bonding effect when the second plate 40 is subsequently bonded.

[0090] It is understandable that in some embodiments, when selecting the optical adhesive layer 20, an optical adhesive layer 20 that does not contain a photoinitiator is selected, so that the optical adhesive layer 20 will not be cured due to the irradiation of the UV curing lamp 200, and the influence of the UV curing lamp 200 on the optical adhesive layer 20 when performing the pre-forming treatment on the UV adhesive is avoided from the essential principle.

[0091] In some embodiments, if the UV glue is to be cured later, the height difference is set in advance when the UV glue is applied in the early stage, so that the height of the UV glue is higher before pre-forming, leaving a total margin for the shrinkage caused by the subsequent pre-forming and curing processes.

[0092] Specifically, before the UV adhesive is pre-set, the surface of the UV adhesive away from the first plate 10 and the surface of the optical adhesive layer 20 away from the first plate 10 have a height difference of H2 (see FIG4 ). After the UV curing lamp 200 irradiates the UV adhesive, the surface of the UV adhesive away from the first plate 10 retracts to a position that is substantially flush with the surface of the optical adhesive layer 20 away from the first plate 10, thereby improving the smoothness of the bonding.

[0093] It is understandable that the light from the UV curing lamp 200 activates the photoinitiator in the UV glue, causing a polymerization reaction. On the one hand, heat is released during this polymerization reaction, causing the polymer volume to shrink, resulting in shrinkage. On the other hand, the light required for the UV glue to cure will also generate heat, causing the temperature around the UV glue to rise. When the ambient temperature is too high or the light source is too strong, more heat will be generated during the curing process, thereby exacerbating the shrinkage caused by polymerization shrinkage. Therefore, in order to alleviate the shrinkage problem caused by pre-forming of the UV glue, when applying the UV glue, a height difference is set in advance so that the UV glue is higher before pre-forming, leaving a margin for subsequent shrinkage. It is understandable that the height difference can be set according to the type, band and parameters of the UV curing lamp 200 and the characteristics of the UV glue.

[0094] Please refer to FIG9 , which shows a schematic structural diagram of a display device 100 in an embodiment of the present application.

[0095] At least one embodiment disclosed in the present application provides a display device 100, manufactured using the bonding and packaging method described in any of the above embodiments. The display device 100 includes a first plate 10, a second plate 40, and an optical adhesive layer 20. The optical adhesive layer 20 is disposed between the first plate 10 and the second plate 40, and the first bonding surface 21 and the second bonding surface 22 of the optical adhesive layer 20 are bonded to the first plate 10 and the second plate 40, respectively; the first bonding surface 21 and the second bonding surface 22 are disposed opposite each other. Referring to FIG. 3 , there is a gap between the outer edge of the optical adhesive layer 20 and the outer edges of both the first plate 10 and the second plate 40, and the orthographic projections of the first plate 10 and the second plate 40 both cover the optical adhesive layer 20. The display device 100 also includes a sealant layer 30, which fills the gap and completely fills the gap.

[0096] In the display device 100, the first plate 10 can be configured as one of a substrate and a cover plate, and the second plate 40 can be configured as the other of the substrate and the cover plate. The optical adhesive layer 20 bonds the substrate and the cover plate together, and the sealant layer 30 seals the substrate, the optical adhesive layer 20, and the cover plate together to achieve a sealed package. Compared to conventional techniques in which the optical adhesive layer 20 is fully adhered to the substrate and / or cover plate, and the sealant layer 30 can only be applied to the outer walls of the substrate and cover plate, the sealant layer 30 in this application is embedded between the substrate and the cover plate. The conventional technique, which does not have a sealing depth, is improved to one in which a sealing depth is provided, thereby enhancing the sealing effect of the display device 100 and improving the stability and durability of the product's sealing.

[0097] In some embodiments, the spacing is greater than or equal to 0.1 mm. Because the sealant layer 30 fills the spacing and completely fills the spacing, the width dimension of the sealant layer 30 sealed to the first plate 10 is greater than or equal to 0.1 mm, and the width dimension of the sealant layer 30 sealed to the second plate 40 is greater than or equal to 0.1 mm. Compared to the conventional technology of sealing the sidewalls of the first plate 10 and the second plate 40, the sealant layer 30 in this application is embedded between the substrate and the cover plate. The conventional technology has no sealing depth, but an encapsulation depth is provided, which improves the sealing effect of the display device 100 and enhances the stability and durability of the product's sealing.

[0098] In some embodiments, the center of the optical adhesive layer 20 coincides with or tends to coincide with the centers of the first plate 10 and the second plate 40 .

[0099] Referring to Figure 10 , Figure 10 illustrates a schematic structural diagram of a display device 100 having a hollow portion 23 in accordance with one embodiment of the present application. In some embodiments, the optical adhesive layer 20 includes the hollow portion 23, wherein the center of the hollow portion 23 coincides with, or approaches the center of, the first plate 10 and the second plate 40. It is understood that the optical adhesive layer 20 can be a single piece, or it can be a frame-shaped optical adhesive layer 20 having the hollow portion 23 in the middle, so that a gap exists between the first plate 10 and the second plate 40 after bonding, preventing direct contact.

[0100] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A bonding packaging method, comprising: Laminating optical adhesive on the first surface of the first plate to form an optical adhesive layer, wherein an outer edge of the optical adhesive layer is spaced from an outer edge of the first plate, and a size of the optical adhesive layer is smaller than a size of the first plate; Filling the gap with glue to form a sealant layer, so that the sealant layer fills the gap; The second surface of the second plate is bonded to the optical adhesive layer and the sealant layer, and the orthographic projection of the second plate covers the optical adhesive layer and the sealant layer.

2. The bonding packaging method according to claim 1, wherein: The step of dispensing glue in the spacing to form a sealant layer includes: Acquire a pattern of the spacing, and formulate a dispensing path according to the pattern; Glue is dispensed within the spacing according to the glue dispensing path to form a sealant layer, so that the height of the sealant layer is greater than or equal to the height of the optical glue layer.

3. The bonding packaging method according to claim 2, wherein: The dispensing path at least comprises a plurality of path segments extending in the circumferential direction, two adjacent path segments are connected to form a continuous dispensing path, and the two adjacent path segments are spaced apart in the inner and outer directions; or The dispensing path includes at least a plurality of first paths and second paths, the extension lines of the first paths and the second paths intersect, and adjacent first paths and second paths are connected end to end; at least part of the path segments or the first paths or the second paths are arranged close to the outer edge of the optical adhesive layer and the outer edge of the first surface of the first plate; The method of making the sealant layer fill the gap includes: Glue is dispensed along the glue dispensing path, and the glue line of the glue dispensing covers the glue dispensing path, so that the formed sealant layer is bonded to the outer side of the optical glue layer and the first surface of the first plate body.

4. The bonding packaging method according to claim 3, wherein: The size of the glue line of the glue dispensing is greater than or equal to the interval between the two adjacent path segments; or The glue line size of the glue dispensing is greater than or equal to the distance between the first path and the second path.

5. The bonding packaging method according to claim 2, wherein: The method further comprises: When dispensing in the interval is completed, the sealant layer is filled in the interval in a first state; Before attaching the second plate body, the sealant layer is subjected to a pre-molding treatment so that the sealant layer is in a second state and fills the gap; wherein the hardness of the second state is greater than the hardness of the first state.

6. The bonding packaging method according to claim 5, wherein: The method further comprises: After the second plate is attached, the sealant layer is cured so that the sealant layer is in a third state, and the hardness of the third state is greater than the hardness of the second state.

7. The bonding packaging method according to claim 5, wherein: The sealant layer includes UV glue; The pre-setting process includes irradiating the UV glue with a UV curing lamp so that the UV glue is in the second state.

8. A display device, manufactured by the bonding and packaging method according to any one of claims 1 to 7, the display device comprising: A first plate body; A second plate; An optical adhesive layer is disposed between the first plate body and the second plate body, and a first adhesive surface and a second adhesive surface of the optical adhesive layer are respectively attached to the first plate body and the second plate body; the first adhesive surface and the second adhesive surface are disposed opposite to each other; There is a gap between the outer side of the optical adhesive layer and the outer sides of the first plate and the second plate, and the orthographic projections of the first plate and the second plate both cover the optical adhesive layer; The display device further includes a sealant layer, and the sealant layer is filled in the gap. and fill the said spacing.

9. The display device according to claim 8, wherein: The spacing is greater than or equal to 0.1 mm.

10. The display device according to claim 8, wherein: The center of the optical adhesive layer coincides with or tends to coincide with the centers of the first plate and the second plate; or The optical adhesive layer has a hollow portion; the center of the hollow portion coincides with or tends to coincide with the centers of the first plate body and the second plate body.

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