Evaporator and chiller system including same

Abstract

The present invention relates to an evaporator and a chiller system including same, the evaporator comprising: a case including a first inlet and a first outlet and a second inlet and a second outlet; a plurality of heat exchange members disposed in the shape of a tube in the case along the axial direction of the case; and a screen spaced apart from the heat exchange members and separating the inside of the case into a first space and a second space, wherein a refrigerant is introduced into the case through the first inlet and a refrigerant vapor is discharged from the case through the first outlet. The evaporator of the present invention can integrate functions of an evaporator, a liquid receiver, a liquid separator, an oil separator, and a cold storage through the screen and the plurality of heat exchange members, and the chiller system including same can provide high energy efficiency and a fast temperature reaction speed by controlling the flow rate of a coolant through a flow rate control valve of a cooling cycle.

Description

Evaporator and chiller system including same

[0001] The present invention relates to an evaporator and a chiller system including the same.

[0002] During the semiconductor manufacturing process, semiconductor processing equipment must always maintain a constant temperature inside the chamber, and the equipment that maintains this temperature is a semiconductor chiller.

[0003] A chiller device basically requires a compressor, a condenser, an expansion valve, and an evaporator to perform a refrigeration cycle, and in order to supply a coolant at a constant temperature to a chamber of a semiconductor process facility, the coolant needs to be maintained at a constant temperature through heat exchange with the evaporator and coolant heater.

[0004] To this end, the evaporator is structured to have a pair of refrigerant inlets and outlets and another pair of coolant inlets and outlets so that the refrigerant and coolant can exchange heat with each other.

[0005] Meanwhile, conventional chillers have the problem of consuming a lot of time and energy to raise and lower the temperature of the system according to the required setting value within the existing process temperature range, for example, -20℃ to 90℃.

[0006] The present invention provides a multifunctional and miniaturized evaporator that integrates the functions of an evaporator, a liquid separator, a liquid separator, an oil separator, and a cold storage.

[0007] The present invention provides a chiller system having good energy efficiency and fast response.

[0008] In order to achieve the above-described object, one embodiment of the present invention relates to an evaporator, comprising a case including a first inlet, a first outlet, a second inlet, and a second outlet, a plurality of heat exchange members arranged in a tube shape along an axial direction of the case inside the case, and a screen positioned spaced apart from the heat exchange members and dividing the inside of the case into a first space and a second space, wherein the first inlet injects refrigerant into the inside of the case, and the first outlet discharges refrigerant vapor to the outside of the case.

[0009] Another embodiment of the present invention for achieving the above-described object is a chiller system comprising a refrigeration cycle including a compressor, a condenser, an expansion valve, and an evaporator, and a cooling cycle including a first heater, a second heater, and a pump, in which a refrigerant circulating in the refrigeration cycle and a coolant circulating in the cooling cycle in the evaporator exchange heat with each other, wherein the cooling cycle includes a main line input and output to the evaporator and a bypass line branched from the main line, and the first heater and the pump are sequentially arranged in the main line output from the evaporator, the second heater is arranged in the bypass line, and a flow controller is arranged at a position where the main line and the bypass line branch.

[0010] According to embodiments of the present invention, the functions of an evaporator, a liquid separator, a liquid separator, an oil separator, and a cold storage can be integrated into one through a screen and a plurality of heat exchange members.

[0011] According to embodiments of the present invention, a chiller system with high energy efficiency and fast temperature response speed can be provided by controlling the flow rate of coolant through a flow rate control valve of a cooling cycle.

[0012] FIG. 1 is a perspective view schematically illustrating an example of an evaporator according to one embodiment of the present invention.

[0013] Figure 2 is a cross-sectional view schematically illustrating the evaporator of Figure 1.

[0014] FIG. 3 is a perspective view schematically illustrating another example of an evaporator according to one embodiment of the present invention.

[0015] Figure 4 is a cross-sectional view schematically illustrating the evaporator of Figure 3.

[0016] Fig. 5 is a cross-sectional view of the heat exchange member of the evaporator of Fig. 4 taken along line A-A'.

[0017] FIG. 6 is a perspective view schematically illustrating another example of an evaporator according to one embodiment of the present invention.

[0018] Fig. 7 is a cross-sectional view schematically illustrating the evaporator of Fig. 6.

[0019] Fig. 8 is a cross-sectional view of the heat exchange member of the evaporator of Fig. 7 taken along line B-B'.

[0020] Fig. 9 is a front view schematically illustrating an example of a heat exchange member of the evaporator of Fig. 8.

[0021] FIG. 10 is a perspective view schematically illustrating an example of an evaporator according to another embodiment of the present invention.

[0022] Fig. 11 is a cross-sectional view schematically illustrating the evaporator of Fig. 10.

[0023] Fig. 12 is a schematic plan view of the screen of the evaporator of Fig. 10.

[0024] FIG. 13 is a perspective view schematically illustrating another example of an evaporator according to another embodiment of the present invention.

[0025] Fig. 14 is a cross-sectional view schematically illustrating the evaporator of Fig. 13.

[0026] FIG. 15 is a perspective view schematically illustrating another example of an evaporator according to another embodiment of the present invention.

[0027] Fig. 16 is a cross-sectional view schematically illustrating the evaporator of Fig. 15.

[0028] FIG. 17 is a schematic diagram illustrating an example of a chiller system according to one embodiment of the present invention.

[0029] FIG. 18 is a schematic diagram illustrating an example of a chiller system according to another embodiment of the present invention.

[0030] Figure 19 is a schematic diagram illustrating another example of the chiller system of Figure 17.

[0031] Figure 20 is a flowchart schematically illustrating an example of the operation method of the chiller system of Figure 19.

[0032] Figure 21 is a schematic diagram illustrating another example of the chiller system of Figure 17.

[0033] Figure 22 is a flowchart schematically illustrating an example of the operation method of the chiller system of Figure 21.

[0034] Figure 23 is a schematic diagram illustrating another example of the chiller system of Figure 17.

[0035] Figure 24 is a flowchart schematically illustrating an example of the operation method of the chiller system of Figure 23.

[0036] Figure 25 is a schematic diagram illustrating another example of the chiller system of Figure 17.

[0037] Figure 26 is a flowchart schematically illustrating an example of the operation method of the chiller system of Figure 25.

[0038] Fig. 27 is a graph showing the heating performance and cooling performance of the chiller system of Fig. 17.

[0039] In order to achieve the above-described object, one embodiment of the present invention relates to an evaporator, comprising a case including a first inlet, a first outlet, a second inlet, and a second outlet, a plurality of heat exchange members arranged in a tube shape along an axial direction of the case inside the case, and a screen positioned spaced apart from the heat exchange members and dividing the inside of the case into a first space and a second space, wherein the first inlet injects refrigerant into the inside of the case, and the first outlet discharges refrigerant vapor to the outside of the case.

[0040] The above refrigerant may be present inside the case so that the heat exchange member is immersed in the refrigerant.

[0041] The plurality of heat exchange members may include 280 to 300 copper tubes.

[0042] The above-mentioned pipe may be in the shape of a circular helicoil.

[0043] The second inlet injects the coolant into the case and can be connected to the plurality of heat exchange members through a single flow path.

[0044] The plurality of heat exchange members may further include an upper head and a lower head on each side covering the plurality of heat exchange members, and the second inlet may be connected to the lower head, and the second outlet may be connected to the upper head.

[0045] The above screen includes a plurality of micro-holes penetrating the screen, and the micro-holes can allow the refrigerant vapor to pass through and prevent the movement of the refrigerant.

[0046] Another embodiment of the present invention for achieving the above-described object relates to a chiller system comprising a refrigeration cycle including a compressor, a condenser, an expansion valve, and an evaporator, and a cooling cycle including a first heater, a second heater, and a pump, in which a refrigerant circulating in the refrigeration cycle and a coolant circulating in the cooling cycle in the evaporator exchange heat with each other, wherein the cooling cycle includes a main line input and output to the evaporator and a bypass line branched from the main line, and the first heater and the pump are sequentially arranged in the main line output from the evaporator, the second heater is arranged in the bypass line, and a flow controller is arranged at a position where the main line and the bypass line branch.

[0047] The above evaporator, the first heater, and the second heater control the temperature of the coolant, and the flow controller can control the flow rate of the coolant flowing into the main line and the bypass line.

[0048] The above flow regulator includes a first valve and a second valve, wherein the first valve can be connected to the main line, and the second valve can be connected to the bypass line.

[0049] The flow rate of the main line and the flow rate of the bypass line can be adjusted differently depending on the opening rates of the first valve and the second valve.

[0050] The bypass line further includes an auxiliary line branched from the bypass line, the bypass line is connected to the main line by bypassing the evaporator, and the auxiliary line can be connected to the main line by bypassing the evaporator and the first heater.

[0051] The second heater is arranged in the auxiliary line, and the second heater can maintain a constant temperature.

[0052] A third valve and a fourth valve may be respectively arranged on both sides of the second heater.

[0053] The evaporator comprises a case including a pair of first inlets and a first outlet and a pair of second inlets and a second outlet, a plurality of heat exchange members arranged in a tube shape along an axial direction of the case inside the case, and a screen positioned spaced apart from the heat exchange members and dividing the inside of the case into a first space and a second space, wherein the first inlet can inject refrigerant into the inside of the case, and the first outlet can discharge refrigerant vapor to the outside of the case.

[0054] The plurality of heat exchange members may include 280 to 300 copper tubes.

[0055] The above-mentioned pipe may be in the shape of a circular helicoil.

[0056] The second inlet injects the coolant into the case and can be connected to the plurality of heat exchange members through a single flow path.

[0057] The plurality of heat exchange members may further include an upper head and a lower head on each side covering the plurality of heat exchange members, and the second inlet may be connected to the lower head, and the second outlet may be connected to the upper head.

[0058] The above screen includes a plurality of micro-holes penetrating the screen, and the micro-holes can allow the refrigerant vapor to pass through and prevent the movement of the refrigerant.

[0059] Before describing in detail the preferred embodiments of the present invention below, it should be noted that the terms and words used in this specification and claims should not be interpreted as limited to their usual or dictionary meanings, but should be interpreted as meanings and concepts that are consistent with the technical spirit of the present invention.

[0060] Hereinafter, embodiments of the present invention will be illustrated in the drawings and described in detail in the detailed description. The effects and / or features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

[0061] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0062] In the examples below, the terms first, second, etc. are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0063] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0064] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0065] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0066] In the following examples, the x-axis, y-axis, and z-axis are not limited to three axes on an orthogonal coordinate system, and can be interpreted in a broad sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

[0067] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0068] One embodiment of the present invention relates to an evaporator, and will be described with reference to FIGS. 1 to 16, which schematically illustrate several examples of evaporators. According to this embodiment, the evaporator includes a case including a first inlet, a first outlet, a second inlet, and a second outlet, a plurality of heat exchange members arranged in a tubular shape along an axial direction of the case inside the case, and a screen positioned spaced apart from the heat exchange members and dividing the inside of the case into a first space and a second space, wherein the first inlet injects refrigerant into the case, and the first outlet discharges refrigerant vapor to the outside of the case, thereby integrating the functions of an evaporator, a receiver, a liquid separator, an oil separator, and a cold storage into one.

[0069] Referring to FIGS. 1 and 2, the evaporator (100) may include a case (110) including a pair of first inlets (111) and a first outlet (112) and a pair of second inlets (121) and a second outlet (122), and a heat exchange member (130) arranged along the axial direction of the case (110) inside the case (110).

[0070] The case (110) forms the exterior of the evaporator (100) and may include a pair of inlets (111, 121) and a pair of outlets (112, 122) connecting the interior and exterior of the case (110).

[0071] As an optional embodiment, the exterior of the case (110) may include a cylindrical shape, and may include a first inlet (111) at the bottom of the side surface of the case (110), and a first outlet (112) at the top of the side surface of the case (110). In addition, the side surface of the case (110) may include a second outlet (122) at least in one area between the first inlet (111) and the first outlet (112), and the bottom surface of the case (110) may include a second inlet (121).

[0072] The first inlet (111) can be located at the lower side of the case (110), and refrigerant liquid supplied from the outside of the case (110) can be injected into the inside of the case (110).

[0073] The first discharge port (112) can be located at the upper side of the case (110) and can discharge refrigerant vapor formed inside the case (110) to the outside of the case (110).

[0074] Meanwhile, the refrigerant vapor discharged through the first discharge port (112) can be condensed back into refrigerant liquid through the compressor, oil separator, condenser, refrigerant dryer, and expansion valve through the refrigeration cycle of the chiller system and then injected into the first inlet port (111).

[0075] The second inlet (121) may be located in at least one area of ​​the bottom surface of the case (110), and may be used to inject a cooling fluid circulated through the cooling cycle of the chiller system into the inside of the heat exchange member (130) described below. At this time, the cooling fluid circulating through the cooling cycle may be injected into the second inlet (121) through a pump and semiconductor equipment.

[0076] As an optional embodiment, the cooling fluid may comprise a secondary refrigerant (indirect refrigerant) or fluorine.

[0077] The second discharge port (122) may be located in an area between the first inlet (111) and the first discharge port (112) on the side of the case (110), and may discharge the cooling fluid in a cooling cycle (Coolant Cycle) so that the cooling fluid inside the heat exchange member (130) described later circulates again in the cooling cycle (Coolant Cycle) of the chiller system.

[0078] The heat exchange member (130) is located inside the case (110) and can be arranged in a tubular shape along the axial direction of the case (110), and the upper and lower parts of the heat exchange member (130) can be covered by heads (131, 132).

[0079] The lower head (132) is connected to the heat exchange member (130) and the second inlet (121) through a single flow path, so that the cooling fluid flowing in through the second inlet (121) can be supplied into the heat exchange member (130) to fill the inside of the heat exchange member (130) with the cooling fluid. In addition, the upper head (131) is connected to the heat exchange member (130) and the second outlet (122) through a single flow path, so that the cooling fluid filling the heat exchange member (130) can be discharged through the second outlet (122) to a cooling cycle. At this time, the cooling fluid filled in the heat exchange member (130) can indirectly exchange heat with the refrigerant without being mixed with it.

[0080] As an optional embodiment, the length of the heat exchange member (130) along the axial direction of the case (110) may be 50 to 70% of the axial length of the case (110).

[0081] When the length of the heat exchange member (130) is less than 50% of the axial length of the case (110), the surface area where the heat exchange member (130) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (100) may decrease, and when the length of the heat exchange member (130) is greater than 70% of the axial length of the case (110), the gas-liquid separation described later may be difficult.

[0082] Meanwhile, the inside of the case (110) can be filled with refrigerant liquid supplied through the first inlet (111). For example, the refrigerant liquid can be filled inside the case (110) so that the heat exchange member (130) is completely submerged, and the filled refrigerant liquid remains inside the case (110), so that the evaporator (100) can serve as a liquid receiver that performs the function of storing the refrigerant liquid.

[0083] Meanwhile, when the evaporator (100) is in a standby state, the cooling fluid filled in the heat exchange member (130) exchanges heat with the refrigerant liquid existing in the case (110) to always maintain a temperature of -35°C or lower. Since the cooling fluid at -35°C or lower exists in a standby state in the heat exchange member (130), the evaporator (100) can serve as a cold storage that stores the cooling fluid at -35°C or lower.

[0084] Meanwhile, when the refrigerant liquid exchanges heat with the cooling fluid filled in the heat exchange member (130), boiling may occur due to the heat amount of the cooling fluid. At this time, the refrigerant oil (oil) mixed in the refrigerant liquid may boil together and become vaporous. Since the first discharge port (112) is located at the top of the case, only the refrigerant oil that has been changed into vaporous form can be discharged through the first discharge port (112). At this time, the refrigerant oil in vaporous form can be discharged through the first discharge port (112) by the suction pressure of the compressor of the refrigeration cycle and sucked into the compressor.

[0085] Meanwhile, the refrigerant liquid can be filled inside the case (110) so that the heat exchange member (130) is completely submerged. However, if the length of the heat exchange member (130) becomes long and too much refrigerant liquid is filled inside the case, when the refrigerant liquid boils, not only the refrigerant vapor but also the refrigerant liquid can be discharged through the first discharge port (112), making it difficult to separate the gas and liquid.

[0086] Accordingly, the evaporator (100) of the present invention can function as a gas-liquid separator by separating the refrigerant liquid and refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerant oil) to the compressor (not shown).

[0087] FIG. 3 is a perspective view schematically illustrating another example of an evaporator according to one embodiment of the present invention, FIG. 4 is a cross-sectional view schematically illustrating the evaporator of FIG. 3, and FIG. 5 is a cross-sectional view of the heat exchange member of the evaporator of FIG. 4 taken along line A-A'.

[0088] Referring to FIGS. 3 to 5, the evaporator (200) may include a case (210) including a pair of first inlets (211) and first outlets (212) and a pair of second inlets (221) and second outlets (222), and a plurality of heat exchange members (230) arranged along the axial direction of the case (210) inside the case (210).

[0089] The case (210) forms the exterior of the evaporator (200) and may include a pair of inlets (211, 221) and a pair of outlets (212, 222) connecting the interior and exterior of the case (210).

[0090] As an optional embodiment, the exterior of the case (210) may include a cylindrical shape, and may include a first inlet (211) at a lower side of the case (210), and a first outlet (212) at an upper side of the case (210). In addition, the side of the case (210) may include a second outlet (222) at at least one area between the first inlet (211) and the first outlet (212), and the bottom of the case (210) may include a second inlet (221).

[0091] The first inlet (211) can be located at the lower side of the case (210), and refrigerant liquid supplied from the outside of the case (210) can be injected into the inside of the case (210).

[0092] The first exhaust port (212) can be located at the upper side of the case (210) and can discharge refrigerant vapor formed inside the case (210) to the outside of the case (210).

[0093] Meanwhile, the refrigerant vapor discharged through the first discharge port (212) can be condensed back into refrigerant liquid through the compressor, oil separator, condenser, refrigerant dryer, and expansion valve through the refrigeration cycle of the chiller system and then injected into the first inlet port (211).

[0094] The second inlet (221) may be located in at least one area of ​​the bottom surface of the case (210), and may be used to inject a cooling fluid circulated through a cooling cycle of the chiller system into the inside of a heat exchange member (230) described later. At this time, the cooling fluid circulating through the cooling cycle may be injected into the second inlet (221) through a pump and semiconductor equipment.

[0095] As an optional embodiment, the cooling fluid may comprise a secondary refrigerant (indirect refrigerant) or fluorine.

[0096] The second discharge port (222) may be located in an area between the first inlet port (211) and the first discharge port (212) on the side of the case (210), and may discharge the cooling fluid in a cooling cycle (Coolant Cycle) so that the cooling fluid inside the heat exchange member (230) described later circulates again in the cooling cycle (Coolant Cycle) of the chiller system.

[0097] The heat exchange member (230) is located inside the case (210), and a plurality of heat exchange members (230) can be arranged in a tube shape along the axial direction of the case (210), and the upper and lower parts of the heat exchange member (230) can be covered by heads (231, 232).

[0098] As an optional embodiment, three heat exchange members can be arranged, and the three heat exchange members can be connected to the upper head (231) and the lower head (232) through one flow path.

[0099] The lower head (232) is connected to the heat exchange member (230) and the second inlet (221) through a single flow path, so that the cooling fluid flowing in through the second inlet (221) can be supplied into the heat exchange member (230) to fill the inside of the heat exchange member (230) with the cooling fluid. In addition, the upper head (231) is connected to the heat exchange member (230) and the second outlet (222) through a single flow path, so that the cooling fluid filling the heat exchange member (230) can be discharged through the second outlet (222) to a cooling cycle. At this time, the cooling fluid filled in the heat exchange member (230) can indirectly exchange heat with the refrigerant without being mixed with it.

[0100] As an optional embodiment, the length of the heat exchange member (230) along the axial direction of the case (210) may be 50 to 70% of the axial length of the case (210).

[0101] When the length of the heat exchange member (230) is less than 50% of the axial length of the case (210), the surface area where the heat exchange member (230) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (200) may decrease, and when the length of the heat exchange member (230) is greater than 70% of the axial length of the case (210), the gas-liquid separation described later may be difficult.

[0102] Meanwhile, the inside of the case (210) can be filled with refrigerant liquid supplied through the first inlet (211). For example, the refrigerant liquid can be filled inside the case (110) so that the heat exchange member (230) is completely submerged, and the filled refrigerant liquid remains inside the case (210), so that the evaporator (200) can serve as a liquid receiver that performs the function of storing the refrigerant liquid.

[0103] Meanwhile, when the evaporator (200) is in a standby state, the cooling fluid filled in the heat exchange member (230) can always maintain a temperature of -35°C or lower by exchanging heat with the refrigerant liquid existing in the case (210). Since the cooling fluid at -35°C or lower exists in a standby state in the heat exchange member (230), the evaporator (200) can serve as a cold storage that stores the cooling fluid at -35°C or lower.

[0104] Meanwhile, when the refrigerant liquid exchanges heat with the cooling fluid filled in the heat exchange member (230), boiling may occur due to the heat amount of the cooling fluid. At this time, the refrigerant oil (oil) mixed in the refrigerant liquid may boil together and become vaporous. Since the first discharge port (212) is located at the top of the case, only the refrigerant oil that has been changed into vaporous form can be discharged through the first discharge port (212). At this time, the refrigerant oil in vaporous form can be discharged through the first discharge port (212) by the suction pressure of the compressor of the refrigeration cycle and sucked into the compressor.

[0105] Meanwhile, the refrigerant liquid can be filled inside the case (210) so that the heat exchange member (230) is completely submerged. However, if the length of the heat exchange member (230) is long and too much refrigerant liquid is filled inside the case, when the refrigerant liquid boils, not only the refrigerant vapor but also the refrigerant liquid can be discharged through the first discharge port (212), making gas-liquid separation difficult.

[0106] Accordingly, the evaporator (200) of the present invention can function as a gas-liquid separator by separating the refrigerant liquid and refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerant oil) to the compressor (not shown).

[0107] FIG. 6 is a perspective view schematically illustrating another example of an evaporator according to one embodiment of the present invention, FIG. 7 is a cross-sectional view schematically illustrating the evaporator of FIG. 6, and FIG. 8 is a cross-sectional view of the heat exchange member of the evaporator of FIG. 7 taken along line B-B'.

[0108] Referring to FIGS. 6 to 8, the evaporator (300) may include a case (310) including a pair of first inlets (311) and first outlets (312) and a pair of second inlets (321) and second outlets (322), and a plurality of heat exchange members (330) arranged along the axial direction of the case (310) inside the case (310).

[0109] The case (310) forms the exterior of the evaporator (300) and may include a pair of inlets (311, 321) and a pair of outlets (312, 322) connecting the interior and exterior of the case (310).

[0110] As an optional embodiment, the exterior of the case (310) may include a cylindrical shape, and may include a first inlet (311) at the bottom of the side surface of the case (310), and a first outlet (312) at the top of the side surface of the case (310). In addition, the side surface of the case (310) may include a second outlet (322) at least in one area between the first inlet (311) and the first outlet (312), and the bottom surface of the case (310) may include a second inlet (321).

[0111] The first inlet (311) can be located at the lower side of the case (310), and refrigerant liquid supplied from the outside of the case (310) can be injected into the inside of the case (310).

[0112] The first discharge port (312) can be located at the upper side of the case (310) and can discharge refrigerant vapor formed inside the case (310) to the outside of the case (310).

[0113] Meanwhile, the refrigerant vapor discharged through the first discharge port (312) can be condensed back into refrigerant liquid through the compressor, oil separator, condenser, refrigerant dryer, and expansion valve through the refrigeration cycle of the chiller system and then injected into the first inlet port (311).

[0114] The second inlet (321) may be located in at least one area of ​​the bottom surface of the case (310), and may be used to inject a cooling fluid circulated through a cooling cycle of the chiller system into the inside of a heat exchange member (330) described later. At this time, the cooling fluid circulating through the cooling cycle may be injected into the second inlet (321) through a pump and semiconductor equipment.

[0115] As an optional embodiment, the cooling fluid may comprise a secondary refrigerant (indirect refrigerant) or fluorine.

[0116] The second discharge port (322) may be located in an area between the first inlet port (311) and the first discharge port (312) on the side of the case (310), and may discharge the cooling fluid in a cooling cycle (Coolant Cycle) so that the cooling fluid inside the heat exchange member (330) described later circulates again in the cooling cycle (Coolant Cycle) of the chiller system.

[0117] The heat exchange member (330) is located inside the case (310), and a plurality of heat exchange members (330) can be arranged in a tube shape along the axial direction of the case (310), and the upper and lower parts of the heat exchange member (330) can be covered by heads (331, 332).

[0118] As an optional embodiment, a plurality of heat exchange members may be connected to the upper head (331) and the lower head (332) through a single flow path.

[0119] The lower head (332) is connected to a plurality of heat exchange members (330) and the second inlet (321) through a single flow path, so that the cooling fluid flowing in through the second inlet (321) can be supplied into each heat exchange member (330) to fill the inside of the heat exchange member (330) with the cooling fluid. In addition, the upper head (331) is connected to a plurality of heat exchange members (330) and the second discharge port (322) through a single flow path, so that the cooling fluid filling the heat exchange member (330) can be discharged through the second discharge port (322) to a cooling cycle. At this time, the cooling fluid filled in the heat exchange member (330) can indirectly exchange heat without being mixed with the refrigerant.

[0120] As an optional embodiment, the length of the heat exchange member (330) along the axial direction of the case (310) may be 50 to 70% of the axial length of the case (310).

[0121] When the length of the heat exchange member (330) is less than 50% of the axial length of the case (310), the surface area where the heat exchange member (330) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (300) may decrease, and when the length of the heat exchange member (330) is greater than 70% of the axial length of the case (310), the gas-liquid separation described later may be difficult.

[0122] As an optional embodiment, the heat exchange member (330) may include 280 to 300 copper tubes. The number of heat exchange members (330) may vary depending on the amount of cooling fluid to be cooled. As the number of heat exchange members (330) increases, the surface area where the heat exchange members (330) and the refrigerant liquid come into contact with each other increases, thereby increasing the heat exchange efficiency between the refrigerant and the cooling fluid, thereby allowing a larger amount of cooling fluid to be cooled in a faster time. In addition, since the heat exchange member (330) is formed of copper tubes with good thermal conductivity, the heat exchange efficiency between the refrigerant and the cooling fluid can be increased.

[0123] Fig. 9 is a front view schematically illustrating an example of a heat exchange member of the evaporator of Fig. 8.

[0124] Referring to FIG. 9, as an optional embodiment, the heat exchange member (330) may include a circular helicoil shape.

[0125] Since the heat exchange member (330) includes a circular helicoil shape, the actual path of the heat exchange member (330) filled with the refrigerant fluid increases, thereby increasing the surface area where the heat exchange member (330) and the refrigerant liquid come into contact, thereby increasing the heat exchange efficiency between the refrigerant and the cooling fluid.

[0126] Meanwhile, the inside of the case (310) can be filled with refrigerant liquid supplied through the first inlet (311). For example, the refrigerant liquid can be filled inside the case (310) so that the heat exchange member (330) is completely submerged, and the filled refrigerant liquid remains inside the case (310), so that the evaporator (300) can serve as a liquid receiver that performs the function of storing the refrigerant liquid.

[0127] Meanwhile, when the evaporator (300) is in a standby state, the cooling fluid filled in the heat exchange member (330) can always maintain a temperature of -35°C or lower by exchanging heat with the refrigerant liquid existing in the case (310). Since the cooling fluid at -35°C or lower exists in a standby state in the heat exchange member (330), the evaporator (300) can serve as a cold storage that stores the cooling fluid at -35°C or lower.

[0128] Meanwhile, when the refrigerant liquid exchanges heat with the cooling fluid filled in the heat exchange member (330), boiling may occur due to the heat content of the cooling fluid. At this time, the refrigerant oil (oil) mixed in the refrigerant liquid may boil together and become vaporous. Since the first discharge port (312) is located at the top of the case, only the refrigerant oil that has been changed into vaporous form can be discharged through the first discharge port (312). At this time, the refrigerant oil in vaporous form can be discharged through the first discharge port (312) by the suction pressure of the compressor of the refrigeration cycle and sucked into the compressor.

[0129] Meanwhile, the refrigerant liquid can be filled inside the case (310) so that the heat exchange member (330) is completely submerged. However, if the length of the heat exchange member (330) is long and too much refrigerant liquid is filled inside the case, when the refrigerant liquid boils, not only the refrigerant vapor but also the refrigerant liquid can be discharged through the first discharge port (312), making gas-liquid separation difficult.

[0130] Accordingly, the evaporator (300) of the present invention can function as a gas-liquid separator by separating the refrigerant liquid and the refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerant oil) to the compressor (not shown).

[0131] FIG. 10 is a perspective view schematically illustrating an example of an evaporator according to another embodiment of the present invention, FIG. 11 is a cross-sectional view schematically illustrating the evaporator of FIG. 10, and FIG. 12 is an enlarged plan view of the screen of the evaporator of FIG. 10.

[0132] Referring to FIGS. 10 to 12, the evaporator (400) may include a case (410) including a pair of first inlets (411) and first outlets (412) and a pair of second inlets (421) and second outlets (422), a heat exchange member (430) arranged along the axial direction of the case (410) inside the case (410), and a screen (440) positioned spaced apart from the heat exchange member (430) and dividing the interior of the case (410) into a first space (s1) and a second space (s2).

[0133] The case (410) forms the exterior of the evaporator (400) and may include a pair of inlets (411, 421) and a pair of outlets (412, 422) connecting the interior and exterior of the case (410).

[0134] As an optional embodiment, the exterior of the case (410) may include a cylindrical shape, and may include a first inlet (411) at a lower side of the case (410), and a first outlet (412) at an upper side of the case (410). In addition, the side of the case (410) may include a second outlet (422) at at least one area between the first inlet (411) and the first outlet (412), and the bottom of the case (410) may include a second inlet (421).

[0135] The first inlet (411) can be located at the lower side of the case (410), and refrigerant liquid supplied from the outside of the case (410) can be injected into the inside of the case (410).

[0136] The first exhaust port (412) can be located at the upper side of the case (410) and can discharge refrigerant vapor formed inside the case (410) to the outside of the case (410).

[0137] Meanwhile, the refrigerant vapor discharged through the first discharge port (412) can be condensed back into refrigerant liquid through the compressor, oil separator, condenser, refrigerant dryer, and expansion valve through the refrigerator cycle of the chiller system and then injected into the first inlet port (411).

[0138] The second inlet (421) may be located in at least one area of ​​the bottom surface of the case (410), and may be used to inject a cooling fluid circulated through the cooling cycle of the chiller system into the inside of the heat exchange member (430) described below. At this time, the cooling fluid circulating through the cooling cycle may be injected into the second inlet (421) through a pump and semiconductor equipment.

[0139] As an optional embodiment, the cooling fluid may comprise a secondary refrigerant (indirect refrigerant) or fluorine.

[0140] The second discharge port (422) may be located in an area between the first inlet port (411) and the first discharge port (412) on the side of the case (410), and may discharge the cooling fluid in a cooling cycle (Coolant Cycle) so that the cooling fluid inside the heat exchange member (430) described later circulates again in the cooling cycle (Coolant Cycle) of the chiller system.

[0141] The heat exchange member (430) is located inside the case (410) and can be arranged in a tubular shape along the axial direction of the case (410), and the upper and lower parts of the heat exchange member (430) can be covered by heads (431, 432).

[0142] The lower head (432) is connected to the heat exchange member (430) and the second inlet (421) through a single flow path, so that the cooling fluid flowing in through the second inlet (421) can be supplied into the heat exchange member (430) to fill the inside of the heat exchange member (430) with the cooling fluid. In addition, the upper head (431) is connected to the heat exchange member (430) and the second outlet (422) through a single flow path, so that the cooling fluid filling the heat exchange member (430) can be discharged through the second outlet (422) to a cooling cycle. At this time, the cooling fluid filled in the heat exchange member (430) can indirectly exchange heat with the refrigerant without being mixed with it.

[0143] As an optional embodiment, the length of the heat exchange member (430) along the axial direction of the case (410) may be 50 to 70% of the axial length of the case (410).

[0144] When the length of the heat exchange member (430) is less than 50% of the axial length of the case (410), the surface area where the heat exchange member (430) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (400) may decrease, and when the length of the heat exchange member (430) is greater than 70% of the axial length of the case (410), the gas-liquid separation described later may be difficult.

[0145] Meanwhile, the inside of the case (410) can be filled with refrigerant liquid supplied through the first inlet (411). For example, the refrigerant liquid can be filled inside the case (410) so that the heat exchange member (430) is completely submerged, and the filled refrigerant liquid remains inside the case (410), so that the evaporator (400) can serve as a liquid receiver that performs the function of storing the refrigerant liquid.

[0146] Meanwhile, when the evaporator (400) is in a standby state, the cooling fluid filled in the heat exchange member (430) can always maintain a temperature of -35°C or lower by exchanging heat with the refrigerant liquid existing in the case (410). Since the cooling fluid at -35°C or lower exists in a standby state in the heat exchange member (430), the evaporator (400) can serve as a cold storage that stores the cooling fluid at -35°C or lower.

[0147] The screen (440) can be positioned inside the case (410) apart from the heat exchange member (430) and can divide the case (410) into a first space (s1) and a second space (s2). For example, the screen (440) can be in the form of a plate including stainless steel.

[0148] Fig. 12 is a schematic plan view of the screen of the evaporator of Fig. 10.

[0149] Referring to FIG. 12, as an optional embodiment, the screen (440) may include a plurality of micro-holes (h) penetrating the screen (440).

[0150] Since the screen (440) includes a plurality of micro-holes (h), the refrigerant liquid can be prevented from moving to the second space (s2) when the refrigerant liquid boils. Accordingly, the refrigerant liquid and refrigerant vapor can be located in the first space (s1), and only the refrigerant vapor can exist in the second space (s2).

[0151] Meanwhile, a first discharge port (412) may be located in the second space (s2). The first discharge port (412) is connected to a compressor (not shown) outside the evaporator (400), and refrigerant vapor can be discharged to the compressor by the suction pressure of the compressor (not shown).

[0152] For example, when the refrigerant liquid inside the case (510) exchanges heat with the cooling fluid inside the heat exchange member (530), boiling may occur in the refrigerant liquid due to the heat of the cooling fluid. At this time, the refrigerant oil (oil) mixed in the refrigerant liquid may boil together and become vapor. At this time, the refrigerant oil, which has a relatively high viscosity compared to the refrigerant liquid, blocks the plurality of micro-holes (h) penetrating the screen (440) due to surface tension, thereby preventing the refrigerant liquid from moving to the second space (s2). However, when the length of the heat exchange member (430) described above becomes longer than 70% of the axial length of the case (410), the refrigerant liquid may be filled in too large a quantity inside the case, so that when the refrigerant liquid boils, not only the refrigerant vapor but also the refrigerant liquid may move to the second space (s2), making gas-liquid separation difficult.

[0153] Meanwhile, the refrigerant oil, which is located outside the evaporator (400) and blocks a plurality of micro-holes (h) by the suction pressure of the compressor (not shown) connected to the first discharge port (412), passes through the screen (440) and moves to the second space (s2) and is sucked into the compressor (not shown) through the first discharge port (412), thereby circulating the refrigeration cycle and being converted into refrigerant liquid again and being introduced back into the first inlet port (411).

[0154] Accordingly, the evaporator (400) of the present invention can function as a gas-liquid separator and an oil separator by separating the refrigerant liquid and the refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerating oil) to the compressor (not shown).

[0155] FIG. 13 is a perspective view schematically illustrating another example of an evaporator according to another embodiment of the present invention, and FIG. 14 is a cross-sectional view schematically illustrating the evaporator of FIG. 13.

[0156] Referring to FIGS. 13 and 14, the evaporator (500) may include a case (510) including a pair of first inlets (511) and first outlets (512) and a pair of second inlets (521) and second outlets (522), a plurality of heat exchange members (530) arranged along the axial direction of the case (510) inside the case (510), and a screen (540) positioned spaced apart from the heat exchange members (530) and dividing the interior of the case (510) into a first space (s1) and a second space (s2).

[0157] The case (510) forms the exterior of the evaporator (500) and may include a pair of inlets (511, 521) and a pair of outlets (512, 522) connecting the interior and exterior of the case (510).

[0158] As an optional embodiment, the exterior of the case (510) may include a cylindrical shape, and may include a first inlet (511) at a lower side of the case (510), and a first outlet (512) at an upper side of the case (510). In addition, the side of the case (510) may include a second outlet (522) at at least one area between the first inlet (511) and the first outlet (512), and the bottom of the case (510) may include a second inlet (521).

[0159] The first inlet (511) can be located at the lower side of the case (510), and refrigerant liquid supplied from the outside of the case (510) can be injected into the inside of the case (510).

[0160] The first exhaust port (512) can be located at the upper side of the case (510) and can discharge refrigerant vapor formed inside the case (510) to the outside of the case (510).

[0161] Meanwhile, the refrigerant vapor discharged through the first discharge port (512) can be condensed back into refrigerant liquid through the compressor, oil separator, condenser, refrigerant dryer, and expansion valve through the refrigerator cycle of the chiller system and then injected into the first inlet port (511).

[0162] The second inlet (521) may be located in at least one area of ​​the bottom surface of the case (510), and may be used to inject cooling fluid circulated through the cooling cycle of the chiller system into the inside of the heat exchange member (530) described below. At this time, the cooling fluid circulating through the cooling cycle may be injected into the second inlet (521) through the pump and the semiconductor.

[0163] As an optional embodiment, the cooling fluid may comprise a secondary refrigerant (indirect refrigerant) or fluorine.

[0164] The second discharge port (522) may be located in an area between the first inlet port (511) and the first discharge port (512) on the side of the case (510), and may discharge the cooling fluid in a cooling cycle (Coolant Cycle) so that the cooling fluid inside the heat exchange member (530) described later circulates again in the cooling cycle (Coolant Cycle) of the chiller system.

[0165] The heat exchange member (530) is located inside the case (510), and a plurality of heat exchange members (530) can be arranged in a tube shape along the axial direction of the case (510), and the upper and lower parts of the heat exchange member (530) can be covered by heads (531, 532).

[0166] As an optional embodiment, three heat exchange members may be arranged, and the three heat exchange members may be connected to the upper head (531) and the lower head (532) through one flow path.

[0167] The lower head (532) is connected to the heat exchange member (530) and the second inlet (521) through a single flow path, so that the cooling fluid flowing in through the second inlet (521) can be supplied into the heat exchange member (530) to fill the inside of the heat exchange member (530) with the cooling fluid. In addition, the upper head (531) is connected to the heat exchange member (530) and the second outlet (522) through a single flow path, so that the cooling fluid filling the heat exchange member (530) can be discharged through the second outlet (522) to a cooling cycle. At this time, the cooling fluid filled in the heat exchange member (530) can indirectly exchange heat with the refrigerant without being mixed with it.

[0168] As an optional embodiment, the length of the heat exchange member (530) along the axial direction of the case (510) may be 50 to 70% of the axial length of the case (510).

[0169] When the length of the heat exchange member (530) is less than 50% of the axial length of the case (510), the surface area where the heat exchange member (530) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (500) may decrease, and when the length of the heat exchange member (530) is greater than 70% of the axial length of the case (510), the gas-liquid separation described later may be difficult.

[0170] Meanwhile, the inside of the case (510) can be filled with refrigerant liquid supplied through the first inlet (511). For example, the refrigerant liquid can be filled inside the case (110) so that the heat exchange member (530) is completely submerged, and the filled refrigerant liquid remains inside the case (510), so that the evaporator (500) can serve as a liquid receiver that performs the function of storing the refrigerant liquid.

[0171] Meanwhile, when the evaporator (500) is in a standby state, the cooling fluid filled in the heat exchange member (530) can always maintain a temperature of -35°C or lower by exchanging heat with the refrigerant liquid existing in the case (510). Since the cooling fluid at -35°C or lower exists in a standby state in the heat exchange member (530), the evaporator (500) can serve as a cold storage that stores the cooling fluid at -35°C or lower.

[0172] The screen (540) can be positioned inside the case (510) apart from the heat exchange member (530) and can divide the case (510) into a first space (s1) and a second space (s2). For example, the screen (540) can be in the form of a plate including stainless steel.

[0173] As an optional embodiment, the screen (540) may include a plurality of micro-holes (h) penetrating the screen (540).

[0174] Since the screen (540) includes a plurality of micro-holes (h), the refrigerant liquid can be prevented from moving to the second space (s2) when the refrigerant liquid boils. Accordingly, the refrigerant liquid and refrigerant vapor can be located in the first space (s1), and only the refrigerant vapor can exist in the second space (s2).

[0175] Meanwhile, a first discharge port (512) may be located in the second space (s2). The first discharge port (512) is connected to a compressor (not shown) outside the evaporator (500), and refrigerant vapor can be discharged to the compressor by the suction pressure of the compressor (not shown).

[0176] For example, when the refrigerant liquid inside the case (510) exchanges heat with the cooling fluid inside the heat exchange member (530), boiling may occur in the refrigerant liquid due to the heat of the cooling fluid. At this time, the refrigerant oil (oil) mixed in the refrigerant liquid may boil together and become vapor. At this time, the refrigerant oil, which has a relatively high viscosity compared to the refrigerant liquid, blocks the plurality of micro-holes (h) penetrating the screen (540) due to surface tension, thereby preventing the refrigerant liquid from moving to the second space (s2). However, when the length of the heat exchange member (530) described above becomes longer than 70% of the axial length of the case (510), the refrigerant liquid may be filled in too large a quantity inside the case, so that when the refrigerant liquid boils, not only the refrigerant vapor but also the refrigerant liquid may move to the second space (s2), making gas-liquid separation difficult.

[0177] Meanwhile, the refrigerant oil, which is located outside the evaporator (500) and blocks a plurality of micro-holes (h) by the suction pressure of the compressor (not shown) connected to the first discharge port (512), passes through the screen (540) and moves to the second space (s2) and is sucked into the compressor (not shown) through the first discharge port (512), thereby circulating the refrigeration cycle and being turned into refrigerant liquid again to be introduced again into the first inlet port (511).

[0178] Accordingly, the evaporator (500) of the present invention can function as a gas-liquid separator and an oil separator by separating the refrigerant liquid and the refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerating oil) to the compressor (not shown).

[0179] FIG. 15 is a perspective view schematically illustrating another example of an evaporator according to another embodiment of the present invention, and FIG. 16 is a cross-sectional view schematically illustrating the evaporator of FIG. 15.

[0180] Referring to FIGS. 15 and 16, the evaporator (600) may include a case (610) including a pair of first inlets (611) and first outlets (612) and a pair of second inlets (621) and second outlets (622), a plurality of heat exchange members (630) arranged along the axial direction of the case (610) inside the case (610), and a screen (640) positioned spaced apart from the heat exchange members (630) and dividing the interior of the case (610) into a first space (s1) and a second space (s2).

[0181] The case (610) forms the exterior of the evaporator (600) and may include a pair of inlets (611, 621) and a pair of outlets (612, 622) connecting the interior and exterior of the case (610).

[0182] As an optional embodiment, the exterior of the case (610) may include a cylindrical shape, and may include a first inlet (611) at a lower side of the case (610), and a first outlet (612) at an upper side of the case (610). In addition, the side of the case (610) may include a second outlet (622) at at least one area between the first inlet (611) and the first outlet (612), and the bottom of the case (610) may include a second inlet (621).

[0183] The first inlet (611) can be located at the lower side of the case (610), and refrigerant liquid supplied from the outside of the case (610) can be injected into the inside of the case (610).

[0184] The first exhaust port (612) can be located at the upper side of the case (610) and can discharge refrigerant vapor formed inside the case (610) to the outside of the case (610).

[0185] Meanwhile, the refrigerant vapor discharged through the first discharge port (612) can be condensed back into refrigerant liquid through the compressor, oil separator, condenser, refrigerant dryer, and expansion valve through the refrigerator cycle of the chiller system and then injected into the first inlet port (611).

[0186] The second inlet (621) may be located in at least one area of ​​the bottom surface of the case (610), and may be used to inject a cooling fluid circulated through the cooling cycle of the chiller system into the inside of the heat exchange member (630) described below. At this time, the cooling fluid circulating through the cooling cycle may be injected into the second inlet (621) through a pump and a semiconductor.

[0187] As an optional embodiment, the cooling fluid may comprise a secondary refrigerant (indirect refrigerant) or fluorine.

[0188] The second discharge port (622) may be located in an area between the first inlet port (611) and the first discharge port (612) on the side of the case (610), and may discharge the cooling fluid in a cooling cycle (Coolant Cycle) so that the cooling fluid inside the heat exchange member (630) described later circulates again in the cooling cycle (Coolant Cycle) of the chiller system.

[0189] The heat exchange member (630) is located inside the case (610), and a plurality of heat exchange members (630) can be arranged in a tube shape along the axial direction of the case (610), and the upper and lower parts of the heat exchange member (630) can be covered by heads (631, 632).

[0190] As an optional embodiment, a plurality of heat exchange members may be connected to the upper head (631) and the lower head (632) in a single flow path.

[0191] The lower head (632) is connected to a plurality of heat exchange members (630) and the second inlet (621) through a single flow path, so that the cooling fluid flowing in through the second inlet (621) can be supplied into each heat exchange member (630) to fill the inside of the heat exchange member (630) with the cooling fluid. In addition, the upper head (631) is connected to a plurality of heat exchange members (630) and the second discharge port (622) through a single flow path, so that the cooling fluid filling the heat exchange member (630) can be discharged through the second discharge port (622) to a cooling cycle. At this time, the cooling fluid filled in the heat exchange member (630) can indirectly exchange heat without being mixed with the refrigerant.

[0192] As an optional embodiment, the length of the heat exchange member (630) along the axial direction of the case (610) may be 50 to 70% of the axial length of the case (610).

[0193] When the length of the heat exchange member (630) is less than 50% of the axial length of the case (610), the surface area where the heat exchange member (630) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (600) may decrease, and when the length of the heat exchange member (630) is greater than 70% of the axial length of the case (610), the gas-liquid separation described later may be difficult.

[0194] As an optional embodiment, the heat exchange member (630) may include 280 to 600 copper tubes. The number of heat exchange members (630) may vary depending on the amount of cooling fluid to be cooled. As the number of heat exchange members (630) increases, the surface area where the heat exchange members (630) and the refrigerant liquid come into contact with each other increases, thereby increasing the heat exchange efficiency between the refrigerant and the cooling fluid, thereby allowing a larger amount of cooling fluid to be cooled in a faster time. In addition, since the heat exchange member (630) is formed of copper tubes with good thermal conductivity, the heat exchange efficiency between the refrigerant and the cooling fluid can be increased.

[0195] As an optional embodiment, the heat exchange member (630) may include a circular helicoil shape.

[0196] Since the heat exchange member (630) includes a circular helicoil shape, the actual path of the heat exchange member (630) filled with the refrigerant fluid increases, thereby increasing the surface area where the heat exchange member (630) and the refrigerant liquid come into contact, thereby increasing the heat exchange efficiency between the refrigerant and the cooling fluid.

[0197] Meanwhile, the inside of the case (610) can be filled with refrigerant liquid supplied through the first inlet (611). For example, the refrigerant liquid can be filled inside the case (610) so that the heat exchange member (630) is completely submerged, and the filled refrigerant liquid remains inside the case (610), so that the evaporator (600) can serve as a liquid receiver that performs the function of storing the refrigerant liquid.

[0198] Meanwhile, when the evaporator (600) is in a standby state, the cooling fluid filled in the heat exchange member (630) can always maintain a temperature of -35°C or lower by exchanging heat with the refrigerant liquid existing in the case (610). Since the cooling fluid at -35°C or lower exists in a standby state in the heat exchange member (630), the evaporator (600) can serve as a cold storage that stores the cooling fluid at -35°C or lower.

[0199] The screen (640) can be positioned inside the case (610) apart from the heat exchange member (630) and can divide the case (610) into a first space (s1) and a second space (s2). For example, the screen (640) can be in the form of a plate including stainless steel.

[0200] As an optional embodiment, the screen (640) may include a plurality of micro-holes (h) penetrating the screen (640).

[0201] Since the screen (640) includes a plurality of micro-holes (h), the refrigerant liquid can be prevented from moving to the second space (s2) when the refrigerant liquid boils. Accordingly, the refrigerant liquid and refrigerant vapor can be located in the first space (s1), and only the refrigerant vapor can exist in the second space (s2).

[0202] Meanwhile, a first discharge port (612) may be located in the second space (s2). The first discharge port (612) is connected to a compressor (not shown) outside the evaporator (600), and refrigerant vapor can be discharged to the compressor by the suction pressure of the compressor (not shown).

[0203] For example, when the refrigerant liquid inside the case (610) exchanges heat with the cooling fluid inside the heat exchange member (630), boiling may occur in the refrigerant liquid due to the heat of the cooling fluid. At this time, the refrigerant oil (oil) mixed in the refrigerant liquid may boil together and become vapor. At this time, the refrigerant oil, which has a relatively high viscosity compared to the refrigerant liquid, blocks the plurality of micro-holes (h) penetrating the screen (640) due to surface tension, thereby preventing the refrigerant liquid from moving to the second space (s2). However, when the length of the heat exchange member (630) described above becomes longer than 70% of the axial length of the case (610), the refrigerant liquid may be filled in too large a quantity inside the case, so that when the refrigerant liquid boils, not only the refrigerant vapor but also the refrigerant liquid may move to the second space (s2), making gas-liquid separation difficult.

[0204] Meanwhile, the refrigerant oil, which is located outside the evaporator (600) and blocks a plurality of micro-holes (h) by the suction pressure of the compressor (not shown) connected to the first discharge port (612), passes through the screen (640) and moves to the second space (s2) and is sucked into the compressor (not shown) through the first discharge port (612), thereby circulating the refrigeration cycle and being converted into refrigerant liquid again to be introduced back into the first inlet port (611).

[0205] Accordingly, the evaporator (600) of the present invention can function as a gas-liquid separator and an oil separator by separating the refrigerant liquid and the refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerating oil) to the compressor (not shown).

[0206] As a result, the evaporator according to one embodiment of the present invention can perform the roles of an evaporator, a liquid receiver, a cold storage, a gas-liquid separator, and an oil separator.

[0207] Another embodiment of the present invention relates to a chiller system, and will be described with reference to FIG. 17, which schematically illustrates an example of a chiller system. According to this embodiment, the chiller system includes a refrigeration cycle including a compressor, a condenser, an expansion valve, and an evaporator, and a cooling cycle including a first heater, a second heater, and a pump, and in the chiller system, a refrigerant circulating in the refrigeration cycle and a coolant circulating in the cooling cycle in the evaporator exchange heat with each other, wherein the cooling cycle includes a main line input and output to the evaporator and a bypass line branched from the main line, and the first heater and the pump are sequentially arranged in the main line output from the evaporator, and the second heater is arranged in the bypass line, and a flow rate controller is arranged at a position where the main line and the bypass line branch, thereby controlling the flow rate of the coolant through the flow rate control valve, thereby providing high energy efficiency and a fast temperature response speed.

[0208] Referring to FIG. 17, the chiller system (1) may be composed of a refrigeration cycle (RC) consisting of a compressor (1100), a separator (1200), a condenser (1300), a refrigerant dryer (1400), an expansion valve (1500), and an evaporator (1600), and a cooling cycle (CC) consisting of a first heater (110), a second heater (120), a pump (130), and a flow controller (140).

[0209] First, the refrigeration cycle (RC) of the chiller system (1) and the compressor (1100), oil separator (1200), condenser (1300), refrigerant dryer (1400), expansion valve (1500), and evaporator (1600) that constitute the refrigeration cycle (RC) will be described.

[0210] The compressor (1100) may serve to suck in refrigerant gas, compress it at high temperature and high pressure, and discharge it. The compressor (1100) may include, for example, a reciprocating type, a crank type, a swash plate type, a wobble plate type, a rotary type, a scroll type, etc.

[0211] The oil separator (1200) is connected to the discharge line of the compressor (1100) and can serve to separate oil contained in the refrigerant gas discharged from the compressor (1100) and prevent the oil from entering the condenser (1300).

[0212] The condenser (1300) can condense the refrigerant gas from which oil has been separated through the oil separator (1200) into a high-temperature, high-pressure liquid refrigerant by dissipating heat.

[0213] The refrigerant dryer (1400) can act as a tank to remove moisture from the liquid refrigerant coming from the condenser (1300) and store it.

[0214] The expansion valve (1500) can control the amount of refrigerant entering the evaporator (1600) by controlling the liquid refrigerant stored in the refrigerant dryer (1400). At this time, the expansion valve (1500) can be linked to a temperature sensor (TS1) disposed at the outlet side of the evaporator (1600) to automatically control the amount of refrigerant entering the evaporator (1600) according to the temperature of the coolant measured by the temperature sensor (TS1).

[0215] As an optional embodiment, the expansion valve (1500) may include an electronic expansion valve such as an EEV or LEV with adjustable opening.

[0216] The evaporator (1600) can control the temperature of the coolant through the introduced refrigerant by being controlled by the expansion valve (1500). Specifically, the evaporator (1600) can have a heat exchange member therein so that heat exchange between the refrigerant and the coolant can be indirectly performed through the heat exchange member. At this time, the refrigerant can take away the heat amount (temperature) of the coolant and evaporate to become a gas, and this refrigerant gas can be sucked back into the compressor (1100) by the suction pressure of the compressor (1100). At this time, a hot gas bypass valve (HG) can be arranged between the evaporator (1600) and the compressor (1100). The hot gas bypass valve (HG) can control the amount of refrigerant gas sucked into the compressor (1100), thereby preventing a load on the compressor (1100) that may be caused by excessive refrigerant gas inflow, and can allow the refrigerant gas to bypass the compressor (1100) and flow into the oil separator (1200).

[0217] As an optional embodiment, the hot gas bypass valve (HG) may include an electronic expansion valve such as an EEV or LEV with adjustable opening and may be controlled by a digital controller.

[0218] As an optional embodiment, the evaporator (1600) can perform the functions of an evaporator, a liquid receiver, a cold storage, and a vapor-liquid separator.

[0219] Referring again to FIGS. 15 and 16, the evaporator (1600) may include a case (610) including a pair of inlets (611, 621) and a pair of outlets (612, 622), a plurality of heat exchange members (630) arranged along the axial direction of the case (610) inside the case (610), and a screen (640) positioned spaced apart from the heat exchange members (1630) and dividing the interior of the case (610) into a first space (s1) and a second space (s2).

[0220] The case (610) forms the exterior of the evaporator (1600) and may include a pair of inlets (611, 621) and a pair of outlets (612, 622) connecting the interior and exterior of the case (610).

[0221] As an optional embodiment, the exterior of the case (610) may include a cylindrical shape, and may include a first inlet (611) at a lower side of the case (610), and a first outlet (612) at an upper side of the case (610). In addition, the case (610) may include a second outlet (622) at at least one area between the first inlet (611) and the first outlet (612) at the side of the case (610), and may include a second inlet (621) at the bottom of the case (610).

[0222] The first inlet (611) can be located at the lower side of the case (610), and refrigerant supplied from the outside of the case (610) can be injected into the inside of the case (610).

[0223] The first exhaust port (612) can be located at the upper side of the case (610) and can discharge refrigerant vapor formed inside the case (610) to the outside of the case (610).

[0224] Meanwhile, the refrigerant vapor discharged through the first discharge port (612) can be condensed into refrigerant through a refrigeration cycle (RC) including a compressor (1100), a condenser (1300), and an expansion valve (1500) and then injected again into the first inlet port (611).

[0225] The second inlet (621) may be located in at least one area of ​​the bottom surface of the case (610), and may inject coolant supplied from the outside of the case (610) into the inside of the heat exchange member (630) described later. At this time, the coolant may include, for example, a secondary refrigerant (indirect refrigerant) or fluorine.

[0226] The second discharge port (622) can be located in an area between the first inlet port (611) and the first discharge port (612) on the side of the case (610), and can discharge the coolant inside the heat exchange member (630) described later to the outside.

[0227] The heat exchange member (630) is located inside the case (610), and a plurality of heat exchange members (630) can be arranged in a tube shape along the axial direction of the case (610), and the upper and lower parts of the heat exchange member (630) can be covered by heads (631, 632).

[0228] For example, a plurality of heat exchange members (630) are connected to a lower head (632) through a single flow path, and the lower head (632) is connected to a second inlet (621) through a single flow path, so that coolant supplied from the outside through the second inlet (621) can be supplied to the inside of each of the plurality of heat exchange members (630) to fill the inside of the heat exchange members (630). In addition, a plurality of heat exchange members (630) are connected to an upper head (631) through a single flow path, and the upper head (631) is connected to a second discharge port (622) through a single flow path, so that coolant filled in the inside of the heat exchange members (630) can be discharged to the outside through the second discharge port (622).

[0229] As an optional embodiment, the length of the heat exchange member (630) along the axial direction of the case (610) may be 50 to 70% of the axial length of the case (610).

[0230] If the length of the heat exchange member (630) is less than 50% of the axial length of the case (610), the surface area where the heat exchange member (630) and the refrigerant come into contact is reduced, so that the heat exchange efficiency of the evaporator (1600) may decrease, and if the length of the heat exchange member (630) is greater than 70% of the axial length of the case (610), the gas-liquid separation described later may be difficult.

[0231] Meanwhile, the inside of the case (610) can be filled with refrigerant supplied through the first inlet (611). For example, the refrigerant can be filled inside the case (610) until all of the heat exchange members (630) are submerged, and the filled refrigerant remains inside the case (610), so that the evaporator (1600) can serve as a liquid receiver that performs the function of storing the refrigerant.

[0232] Meanwhile, when the evaporator (1600) is in standby mode, the coolant filled in the heat exchange member (630) exchanges heat with the refrigerant existing in the case (610), so that the temperature can always be maintained below -35°C. Since the coolant at -35°C or below exists in the heat exchange member (630), the evaporator (1600) can serve as a cold storage that stores the coolant at -35°C or below.

[0233] As an optional embodiment, the heat exchange member (630) may include 280 to 300 copper tubes. The number of heat exchange members (630) may vary depending on the amount of coolant to be cooled. Specifically, as the number of heat exchange members (630) increases, a larger amount of coolant can be filled within the heat exchange member (630), and since the surface area in which the heat exchange member (630) and the refrigerant come into contact with each other increases, the heat exchange efficiency between the refrigerant and the coolant can increase. In addition, since the heat exchange member (630) is formed of copper tubes with good thermal conductivity, the heat exchange efficiency between the refrigerant and the coolant can increase.

[0234] Since the heat exchange member (630) includes a circular helicoil shape, the surface area where the heat exchange member (630) and the refrigerant come into contact increases, so that the heat exchange efficiency between the refrigerant and the coolant can be increased.

[0235] The screen (640) can be positioned inside the case (610) apart from the heat exchange member (630) and can divide the case (610) into a first space (s1) and a second space (s2). For example, the screen (640) can be in the form of a plate including stainless steel.

[0236] Since the screen (640) includes a plurality of micro-holes (h), the refrigerant can be prevented from moving to the second space (s2) when the refrigerant boils. Accordingly, the refrigerant and refrigerant vapor can be located in the first space (s1), and only the refrigerant vapor can exist in the second space (s2).

[0237] Meanwhile, a first discharge port (612) may be located in the second space (s2). The first discharge port (612) is connected to a compressor (not shown) outside the evaporator (1600), and refrigerant vapor may be discharged to the compressor by the suction pressure of the compressor (not shown).

[0238] As a specific example, when the refrigerant inside the case (610) exchanges heat with the coolant inside the heat exchange member (630), boiling may occur in the refrigerant due to the heat amount of the coolant. At this time, the refrigerant oil (oil) mixed in the refrigerant may boil together and become vapor. At this time, the refrigerant oil having a relatively high viscosity compared to the refrigerant blocks the plurality of micro-holes (h) penetrating the screen (640) due to surface tension, thereby preventing the refrigerant from moving to the second space (s2).

[0239] In addition, the refrigerant oil, which is located outside the evaporator (1600) and blocks a plurality of micro-holes (h) by the suction pressure of the compressor (not shown) connected to the first discharge port (612), can pass through the screen (640) and move to the second space (s2) and be sucked into the compressor (not shown) through the first discharge port (612).

[0240] Accordingly, the evaporator (1600) can function as a vapor-liquid separator by separating the refrigerant and refrigerant vapor from each other and discharging only the refrigerant vapor (refrigerant oil) to the compressor (not shown).

[0241] Although the evaporator according to one embodiment of the present invention has been described above as an example, the present invention is not limited thereto, and the chiller system of the present invention can be applied to any evaporator that can be used as a conventional evaporator.

[0242] Meanwhile, since the compressor (1100), oil separator (1200), condenser (1300), refrigerant dryer (1400), expansion valve (1500), and evaporator (1600) constitute a refrigeration cycle (RC), the refrigerant can be maintained at a sub-zero temperature while circulating through the refrigeration cycle (RC).

[0243] Next, the cooling cycle (CC) of the chiller system (1) and the first heater (110), second heater (120), pump (130), flow controller (140), and semiconductor equipment (1000) that constitute the cooling cycle (CC) will be described.

[0244] The cooling cycle (CC) of the chiller system (1) may largely include a main line (R1) and a bypass line (R2) branching from the main line (R1).

[0245] The main line (R1) can be input / output to the evaporator (1600), and the first heater (110), the pump (130), the semiconductor equipment (1000), and the flow controller (140) can be arranged in sequence from the discharge port (622) through which the coolant is discharged from the evaporator (1600), and the coolant can be input back to the evaporator (1600) or branched to the bypass line (R2) by the flow controller (140).

[0246] The bypass line (R2) may further include an auxiliary line (R3), and a second heater (120) may be arranged in the auxiliary line (R3). In addition, valves may be arranged at the inlet and outlet of the auxiliary line (R3), i.e., on both sides of the second heater (120), to control the inflow of coolant flowing through the bypass line (R2).

[0247] The first heater (110) may be a main heater that heats the coolant that circulates through the main line (R1) and is discharged after completing heat exchange with the refrigerant in the evaporator (1600), or the coolant that flows into the bypass line (R2) and joins the main line (R1) without passing through the evaporator (1600), thereby increasing the temperature of the coolant.

[0248] As an optional embodiment, the first heater (110) includes a temperature sensor (TS2) to measure the temperature of the coolant and heat the coolant to a set temperature. In addition, it may include an aluminum nitride filler, which is a super heat conductor, so that energy efficiency can be improved.

[0249] The second heater (120) may be an auxiliary heater that heats the coolant introduced through the bypass line (R2) to increase the temperature of the coolant.

[0250] As an optional embodiment, the second heater (120) includes a temperature sensor (TS3) to measure the temperature of the coolant and heat the coolant to a set temperature. In addition, it may include an aluminum nitride filler, which is a super heat conductor, so that energy efficiency can be improved.

[0251] The pump (130) may serve to provide pressure to the main line (R1) and the bypass line (R2) so that the coolant can circulate through the cooling cycle (CC).

[0252] As an optional embodiment, the pump (230) can be controlled by a digital controller (DC).

[0253] The flow controller (140) is located at the point where the main line (R1) and the bypass line (R2) branch off and can control the amount of coolant flowing into the main line (R1) and the bypass line (R2).

[0254] In an optional embodiment, the flow controller (140) may include three inlets, at least two of which may include valves. Among the two valves, a first valve (V1) may be connected to a main line (R1), and a second valve (V2) may be connected to a bypass line (R2), so that the amount of coolant flowing into the main line (R1) and the bypass line (R2) may be controlled by adjusting the opening / closing ratios of the two valves (V1, V2). At this time, the opening / closing ratios of the first valve (V1) and the second valve (v2) may be determined differently depending on the flow rate of the coolant passing through and discharged from the semiconductor equipment (1000) measured by a flow meter (FM) and the set temperature of the chiller system (1).

[0255] The semiconductor equipment (1000) can be maintained at a constant temperature by a cooling cycle (CC). For example, the semiconductor equipment (1000) can include an inlet through which a coolant is introduced and an outlet through which a coolant is discharged, and can be maintained at a constant temperature by heat-exchanging with the coolant. In addition, a temperature sensor (TS3) is disposed at the outlet through which the coolant is discharged, and by measuring the temperature of the coolant discharged after heat-exchanging with the semiconductor equipment (1000), the temperature of the semiconductor equipment (1000) can be measured.

[0256] As an optional embodiment, the semiconductor equipment (1000) may be a chuck for holding a wafer.

[0257] Meanwhile, the temperature control method of the chiller system (1) can be implemented by the first heater (110), the second heater (120), and the flow controller (140) that constitute the refrigeration cycle (RC) and the cooling cycle (CC).

[0258] A cooling cycle (CC) may include two paths through which the coolant moves, including a main line (R1) that inputs and outputs the evaporator (1600) and a bypass line (R2) branched from the main line (R1).

[0259] A flow controller (140) placed at a point where the main line (R1) and the bypass line (R2) branch off can control the flow rate of coolant flowing into the main line (R1) and the bypass line (R2), and at this time, the flow rate of coolant flowing into the main line (R1) and the bypass line (R2) can be precisely controlled within a 0.1% error.

[0260] For example, the flow controller (140) may include a first valve (V1) and a second valve (V2).

[0261] The first valve (V1) is connected to the main line (R1), and the second valve (V2) is connected to the bypass line (R2), so that the flow rate of the coolant flowing into the main line (R1) and the flow rate of the coolant flowing into the bypass line (R2) can be controlled according to the opening rates of the first valve (V1) and the second valve (V2).

[0262] For example, if the first valve (V1) is 100% open and the second valve (V2) is 0% open, the coolant may only flow into the main line (R1) and not flow into the bypass line (R2). In addition, if the first valve (V1) is 50% open and the second valve (V2) is 50% open, the coolant may equally flow into the main line (R1) and the bypass line (R2), and if the first valve (V1) is 30% open and the second valve (V2) is 70% open, the coolant may flow into the main line (R1) and the bypass line (R2) at a ratio of 3:7.

[0263] Meanwhile, when the coolant flows into the main line (R1), the coolant passes through the evaporator (1600), and after heat exchange with the refrigerant in the evaporator (1600), it can flow back into the main line (R1). When the coolant flows into the bypass line (R2), the coolant can bypass the evaporator (1600) without passing through the evaporator (1600) and rejoin the main line (R1).

[0264] Accordingly, before heat exchange with the semiconductor equipment (1000), the coolant circulating through the main line (R1) and the coolant circulating through the bypass line (R2) may have different temperatures, and specifically, the temperature of the coolant circulating through the main line (R1) may be lower than the temperature of the coolant circulating through the bypass line (R2). In this way, since the temperatures of the coolant circulating through the main line (R1) and the coolant circulating through the bypass line (R2) are different, the temperature of the coolant can be controlled by adjusting the amount of coolant flowing into the main line (R1) and the bypass line (R2) at an appropriate ratio.

[0265] Meanwhile, the bypass line (R2) may further include an auxiliary line (R3) branched from the bypass line (R2), and the auxiliary line (R3) may also be connected to the main line (R1) like the bypass line (R2).

[0266] A second heater (120) may be placed on the auxiliary line (R3). In addition, a third valve (V3) and a fourth valve (V4) may be placed on both sides of the second heater (120), i.e., at the inlet and outlet of the auxiliary line (R3), respectively.

[0267] As an optional embodiment, the second heater (120) is always operated when the chiller system (1) is in operation and is set to a temperature of about 100°C, thereby maintaining a constant temperature. In addition, the third valve (V3) and the fourth valve (V4) located on each side of the second heater (120) may be normally closed, so that the coolant in the auxiliary line (R3) is maintained in a heated state of 100°C and the heat can be stored in the auxiliary line (R3).

[0268] For example, when the third valve (V3) and the fourth valve (V4) are opened, the coolant can be quickly heated by the heat stored in the auxiliary line (R3) and flow into the main line (R1). At this time, the opening of the third valve (V3) and the fourth valve (V4) can be performed simultaneously, but when closing, the third valve (V3) can be closed first, and then the fourth valve (V4) can be closed with a time difference. By closing the third valve (V3) and the fourth valve (V4) with a time difference, the coolant flowing into the auxiliary line (R3) can be blocked first, and the coolant can be prevented from further flowing into the auxiliary line (R3), so that the flow rate of the coolant flowing into and then discharged from the auxiliary line (R3) can be precisely controlled.

[0269] By the operation of this chiller system (1), the coolant introduced into the bypass line (R2) described above can bypass the evaporator (1600) and be introduced into the bypass line (R2) or the auxiliary line (R3) and then into the main line (R1). At this time, the bypass line (R2) can be connected to the main line (R1) in the inlet direction of the first heater (110), and the auxiliary line (R3) can be connected to the main line (R1) in the outlet direction of the first heater (110). Since the bypass line (R2) is connected to the main line (R1) in the inlet direction of the first heater (110), the coolant can be heated by the first heater (110) even when the coolant circulates only through the bypass line (R2), and since the auxiliary line (R3) is connected to the main line (R1) in the outlet direction of the first heater (110), the first heater (110) and the second heater (120) can operate simultaneously in different paths, thereby eliminating unnecessary heating processes, thereby increasing energy efficiency and preventing overheating of the chiller system (1). In addition, since a large amount of coolant can be heated at one time, rapid temperature control of the coolant can be achieved.

[0270] In this way, since the chiller system (1) includes a bypass line (R2), the coolant can be circulated in a heated state, and the amount of coolant flowing into the main line (R1) and the bypass line (R2) is controlled by the flow controller (140), so that the heated coolant of the bypass line (R2) and the cooled coolant of the main line (R1) are mixed at an appropriate ratio, so that the chiller system (1) can reach the temperature of the coolant at a desired temperature without additional cooling or heating of the coolant. That is, since unnecessary additional cooling or heating processes can be omitted, the energy efficiency of the chiller system (1) can be increased.

[0271] Meanwhile, as an optional embodiment, the first valve (V1), the second valve (V2), the third valve (V3), and the fourth valve (V4) may include electronic valves such as EEV or LEV that can automatically adjust the opening degree according to conditions.

[0272] FIG. 18 is a schematic diagram illustrating an example of a chiller system according to another embodiment of the present invention.

[0273] Referring to FIG. 18, the chiller system (2) may be composed of a refrigeration cycle (RC) comprising a compressor (2100), a separator (2200), a condenser (2300), a refrigerant dryer (2400), an expansion valve (2500), and an evaporator (2600), and a cooling cycle (CC) comprising a first heater (210), a second heater (220), a pump (230), and a flow controller (240), and a plate heat exchanger (2700) may be additionally disposed in the refrigeration cycle (RC).

[0274] First, the refrigeration cycle (RC) of the chiller system (1) and the compressor (2100), oil separator (2200), condenser (2300), refrigerant dryer (2400), expansion valve (2500), and evaporator (2600) that constitute the refrigeration cycle (RC) will be described.

[0275] The compressor (2100) may serve to suck in refrigerant gas, compress it at high temperature and high pressure, and discharge it. The compressor (2100) may include, for example, a reciprocating type, a crank type, a swash plate type, a wobble plate type, a rotary type, a scroll type, etc.

[0276] The oil separator (2200) is connected to the discharge line of the compressor (2100) and can serve to separate oil contained in the refrigerant gas discharged from the compressor (2100) and prevent the oil from entering the condenser (2300).

[0277] The condenser (2300) can condense the refrigerant gas from which oil has been separated through the oil separator (2200) into a high-temperature, high-pressure liquid refrigerant by dissipating heat.

[0278] The refrigerant dryer (2400) can act as a tank to remove moisture from the liquid refrigerant coming from the condenser (2300) and store it.

[0279] The expansion valve (2500) can control the amount of refrigerant entering the evaporator (2600) by controlling the liquid refrigerant stored in the refrigerant dryer (2400). At this time, the expansion valve (2500) can be linked to a temperature sensor (TS1) arranged at the outlet side of the evaporator (2600) to automatically control the amount of refrigerant entering the evaporator (2600) according to the temperature of the coolant measured by the temperature sensor (TS1).

[0280] As an optional embodiment, the expansion valve (2500) may include an electronic expansion valve such as an EEV or LEV with adjustable opening.

[0281] The evaporator (2600) can control the temperature of the coolant through the introduced refrigerant by being controlled by the expansion valve (2500). Specifically, the evaporator (2600) can have a heat exchange member therein so that heat exchange between the refrigerant and the coolant can be indirectly performed through the heat exchange member. At this time, the refrigerant can take away the heat amount (temperature) of the coolant and evaporate to become a gas, and this refrigerant gas can be sucked back into the compressor (2100) by the suction pressure of the compressor (2100). At this time, a hot gas bypass valve (HG) can be arranged between the evaporator (2600) and the compressor (2100). The hot gas bypass valve (HG) can control the amount of refrigerant gas sucked into the compressor (2100), thereby preventing a load on the compressor (2100) that may be caused by excessive refrigerant gas inflow, and can allow the refrigerant gas to bypass the compressor (2100) and flow into the oil separator (2200).

[0282] As an optional embodiment, the hot gas bypass valve (HG) may include an electronic expansion valve such as an EEV or LEV with adjustable opening and may be controlled by a digital controller.

[0283] As an optional embodiment, the evaporator (2600) can perform the functions of an evaporator, a liquid receiver, cold storage, and a vapor-liquid separator.

[0284] The plate heat exchanger (2700) is connected in parallel with the evaporator (2600) and is controlled by the expansion valve (2500) to control the temperature of the coolant through the introduced refrigerant.

[0285] As an optional embodiment, the plate heat exchangers (2700) may be arranged in a plurality of refrigeration cycles (RC) of the chiller system (2), and by arranging a plurality of plate heat exchangers (2700), the amount of coolant that the chiller system (2) can cool at one time can increase. Accordingly, the cooling capacity of the chiller system (2) can be improved. As a specific example, two to three plate heat exchangers (2700) may be arranged in a refrigeration cycle (RC) of the chiller system (2). By arranging two to three plate heat exchangers (2700) in a refrigeration cycle (RC) of the chiller system (2), the coolant is introduced into not only the evaporator (2600) but also two to three plate heat exchangers (2700) and cooled at one time, so that the cooling capacity of the chiller system (2) can be improved.

[0286] The compressor (2100), oil separator (2200), condenser (2300), refrigerant dryer (2400), expansion valve (2500), evaporator (2600), and plate heat exchanger (2700) described above constitute a refrigeration cycle (RC), so that the refrigerant can be maintained at a sub-zero temperature while circulating through the refrigeration cycle (RC).

[0287] Next, the cooling cycle (CC) of the chiller system (2) and the first heater (210), second heater (220), pump (230), flow controller (240), and semiconductor equipment (2000) that constitute the cooling cycle (CC) will be described.

[0288] The cooling cycle (CC) of the chiller system (2) may largely include a main line (R1) and a bypass line (R2) branching from the main line (R1).

[0289] The main line (R1) can be input / output to the evaporator (2600) and the plate heat exchanger (2700), and the first heater (210), the pump (230), the semiconductor equipment (2000), and the flow controller (240) can be arranged in sequence from the outlet through which the coolant is discharged from the evaporator (2600) and the plate heat exchanger (2700), and the coolant can be input again to the evaporator (2600) and the plate heat exchanger (2700) by the flow controller (240) or branched to the bypass line (R2).

[0290] The bypass line (R2) may further include an auxiliary line (R3), and a second heater (220) may be arranged in the auxiliary line (R3). In addition, valves may be arranged at the inlet and outlet of the auxiliary line (R3), i.e., on both sides of the second heater (220), to control the inflow of coolant flowing through the bypass line (R2).

[0291] The first heater (210) may be a main heater that heats the coolant that circulates through the main line (R1) and is discharged after completing heat exchange with the refrigerant in the evaporator (2600) and the plate heat exchanger (2700), or the coolant that flows into the bypass line (R2) and joins the main line (R1) without passing through the evaporator (2600) and the plate heat exchanger (2700), thereby increasing the temperature of the coolant.

[0292] As an optional embodiment, the first heater (210) includes a temperature sensor (TS2) to measure the temperature of the coolant and heat the coolant to a set temperature. In addition, it may include an aluminum nitride filler, which is a super heat conductor, to improve energy efficiency.

[0293] The second heater (220) may be an auxiliary heater that heats the coolant introduced through the bypass line (R2) to increase the temperature of the coolant.

[0294] As an optional embodiment, the second heater (220) includes a temperature sensor (TS3) to measure the temperature of the coolant and heat the coolant to a set temperature. In addition, it may include an aluminum nitride filler, which is a super heat conductor, so that energy efficiency can be improved.

[0295] The pump (230) may serve to provide pressure to the main line (R1) and the bypass line (R2) so that the coolant can circulate through the cooling cycle (CC).

[0296] As an optional embodiment, the pump (230) can be controlled by a digital controller (DC).

[0297] The flow controller (240) is located at the point where the main line (R1) and the bypass line (R2) branch off and can control the amount of coolant flowing into the main line (R1) and the bypass line (R2).

[0298] In an optional embodiment, the flow controller (240) may include three inlets, at least two of which may include valves. A first valve (V1) of the two valves may be connected to a main line (R1), and a second valve (V2) may be connected to a bypass line (R2), so that the amount of coolant flowing into the main line (R1) and the bypass line (R2) may be controlled by adjusting the opening / closing ratios of the two valves (V1, V2). At this time, the opening / closing ratios of the first valve (V1) and the second valve (v2) may be determined differently depending on the flow rate of the coolant passing through and discharged from the semiconductor equipment (2000) measured by a flow meter (FM) and the set temperature of the chiller system (2).

[0299] The semiconductor equipment (2000) can be maintained at a constant temperature by a cooling cycle (CC). For example, the semiconductor equipment (2000) can include an inlet through which a coolant is introduced and an outlet through which a coolant is discharged, and can be maintained at a constant temperature by heat-exchanging with the coolant. In addition, a temperature sensor (TS3) is disposed at the outlet through which the coolant is discharged, and by measuring the temperature of the coolant discharged after heat-exchanging with the semiconductor equipment (2000), the temperature of the semiconductor equipment (2000) can be measured.

[0300] As an optional embodiment, the semiconductor equipment (2000) may be a chuck for holding a wafer.

[0301] Meanwhile, the temperature control method of the chiller system (2) can be implemented by the first heater (210), the second heater (220), and the flow controller (240) that constitute the refrigeration cycle (RC) and the cooling cycle (CC).

[0302] A cooling cycle (CC) may include two paths through which the coolant moves, including a main line (R1) that inputs and outputs the evaporator (2600) and the plate heat exchanger (2700) and a bypass line (R2) branched from the main line (R1).

[0303] A flow controller (240) placed at a point where the main line (R1) and the bypass line (R2) branch off can control the flow rate of coolant flowing into the main line (R1) and the bypass line (R2), and at this time, the flow rate of coolant flowing into the main line (R1) and the bypass line (R2) can be precisely controlled within a 0.1% error.

[0304] For example, the flow controller (240) may include a first valve (V1) and a second valve (V2).

[0305] The first valve (V1) is connected to the main line (R1), and the second valve (V2) is connected to the bypass line (R2), so that the flow rate of the coolant flowing into the main line (R1) and the flow rate of the coolant flowing into the bypass line (R2) can be controlled according to the opening rates of the first valve (V1) and the second valve (V2).

[0306] For example, if the first valve (V1) is 100% open and the second valve (V2) is 0% open, the coolant may only flow into the main line (R1) and not flow into the bypass line (R2). In addition, if the first valve (V1) is 50% open and the second valve (V2) is 50% open, the coolant may equally flow into the main line (R1) and the bypass line (R2), and if the first valve (V1) is 30% open and the second valve (V2) is 70% open, the coolant may flow into the main line (R1) and the bypass line (R2) at a ratio of 3:7.

[0307] Meanwhile, when the coolant flows into the main line (R1), the coolant passes through the evaporator (2600) and the plate heat exchanger (2700), and after heat exchange with the refrigerant in the evaporator (2600) and the plate heat exchanger (2700), it can flow back into the main line (R1), and when the coolant flows into the bypass line (R2), the coolant can bypass the evaporator (2600) and the plate heat exchanger (2700) and rejoin the main line (R1).

[0308] Accordingly, before heat exchange with the semiconductor equipment (2000), the coolant circulating through the main line (R1) and the coolant circulating through the bypass line (R2) may have different temperatures, and specifically, the temperature of the coolant circulating through the main line (R1) may be lower than the temperature of the coolant circulating through the bypass line (R2). In this way, since the temperatures of the coolant circulating through the main line (R1) and the coolant circulating through the bypass line (R2) are different, the temperature of the coolant can be controlled by adjusting the amount of coolant flowing into the main line (R1) and the bypass line (R2) at an appropriate ratio.

[0309] Meanwhile, the bypass line (R2) may further include an auxiliary line (R3) branched from the bypass line (R2), and the auxiliary line (R3) may also be connected to the main line (R1) like the bypass line (R2).

[0310] A second heater (220) may be placed on the auxiliary line (R3). In addition, a third valve (V3) and a fourth valve (V4) may be placed on both sides of the second heater (220), i.e., at the inlet and outlet of the auxiliary line (R3), respectively.

[0311] As an optional embodiment, the second heater (220) is always operated when the chiller system (2) is in operation and is set to a temperature of about 100°C, thereby maintaining a constant temperature. In addition, the third valve (V3) and the fourth valve (V4) located on each side of the second heater (220) may be normally closed, so that the coolant in the auxiliary line (R3) is maintained in a heated state of 100°C and the heat can be stored in the auxiliary line (R3).

[0312] For example, when the third valve (V3) and the fourth valve (V4) are opened, the additional coolant introduced can be quickly heated by the heat stored in the auxiliary line (R3) and can be introduced into the main line (R1). At this time, the opening of the third valve (V3) and the fourth valve (V4) can be performed simultaneously, but when closing, the third valve (V3) can be closed first, followed by the fourth valve (V4), so that there can be a time difference. By closing the third valve (V3) and the fourth valve (V4) with a time difference, the coolant introduced into the auxiliary line (R3) can be blocked first, and the coolant can be prevented from additionally introducing into the auxiliary line (R3), so that the flow rate of the coolant introduced into and then discharged from the auxiliary line (R3) can be precisely controlled.

[0313] By the operation of this chiller system (2), the coolant introduced into the bypass line (R2) described above can bypass the evaporator (2600) and the plate heat exchanger (2700), and can then be introduced into the bypass line (R2) or the auxiliary line (R3) and then into the main line (R1). At this time, the bypass line (R2) can be connected to the main line (R1) in the inlet direction of the first heater (210), and the auxiliary line (R3) can be connected to the main line (R1) in the outlet direction of the first heater (210). Since the bypass line (R2) is connected to the main line (R1) in the inlet direction of the first heater (210), the coolant can be heated by the first heater (210) even when the coolant circulates only through the bypass line (R2), and since the auxiliary line (R3) is connected to the main line (R1) in the outlet direction of the first heater (210), the first heater (210) and the second heater (220) can operate simultaneously in different paths, thereby eliminating unnecessary heating processes, thereby increasing energy efficiency and preventing overheating of the chiller system (2). In addition, since a large amount of coolant can be heated at one time, rapid temperature control of the coolant can be achieved.

[0314] In this way, since the chiller system (2) includes a bypass line (R2), the coolant can be circulated in a heated state, and since the amount of coolant flowing into the main line (R1) and the bypass line (R2) is controlled by the flow controller (240), the heated coolant of the bypass line (R2) and the cooled coolant of the main line (R1) are mixed at an appropriate ratio, so that the chiller system (2) can reach the temperature of the coolant at a desired temperature without additional cooling or heating of the coolant. That is, since unnecessary additional cooling or heating processes can be omitted, the energy efficiency of the chiller system (2) can be increased.

[0315] Meanwhile, as an optional embodiment, the first valve (V1), the second valve (V2), the third valve (V3), and the fourth valve (V4) may include electronic valves such as EEV or LEV that can automatically adjust the opening degree according to conditions.

[0316] Below, the automatic temperature control algorithm of the aforementioned chiller system (1) is described.

[0317] The temperature of the semiconductor equipment (1000) can be automatically adjusted to and maintained at the set temperature of the chiller system (1) by the automatic temperature control algorithm of the chiller system (1).

[0318] As an optional embodiment, the semiconductor equipment (1000) may be a chuck used to secure a semiconductor wafer.

[0319] Fig. 19 is a schematic diagram illustrating another example of the chiller system of Fig. 17, and Fig. 20 is a flowchart schematically illustrating an example of an operating method of the chiller system of Fig. 19.

[0320] Referring to Figures 19 and 20, the automatic temperature control algorithm of the chiller system (1) is a starting temperature (S p ) can be started by setting the starting temperature. For example, the starting temperature can be 0℃ or 25℃. The starting temperature (S p) is set, the second heater (120) and pump (130) can be operated, the refrigeration cycle (RC) is operated, and the expansion valve (1500) of the refrigeration cycle (RC) is automatically controlled, so that the amount and temperature of the refrigerant in the evaporator (1600) can be maintained constant.

[0321] After this, the starting temperature (S p ) becomes equal to the temperature of the semiconductor equipment (1000), the chiller system (1) can be in standby mode, and the starting temperature (S p ) is different from the temperature of the semiconductor equipment (1000), the first heater (110) and the flow controller (140) may be operated. At this time, the temperature of the semiconductor equipment (1000) may be measured by a temperature sensor (TS4) disposed on the outlet side where the coolant is discharged from the semiconductor equipment (1000). The temperature sensor (TS4) may indirectly measure the temperature of the semiconductor equipment (1000) by measuring the temperature of the coolant discharged after heat exchange with the semiconductor equipment (1000).

[0322] As a specific example, the temperature of the semiconductor equipment (1000) measured by the temperature sensor (TS4) is the starting temperature (S p ) is higher than the temperature sensor (TS4), the first heater (110) does not operate, and the amount of coolant flowing into the main line (R1) and the bypass line (R2) is controlled at a constant rate according to the opening rate of the first valve (V1) and the second valve (V2) of the flow controller (140) controlled in conjunction with the temperature sensor (TS4), thereby controlling the temperature of the coolant flowing into the semiconductor equipment (1000), thereby making the temperature of the semiconductor equipment (1000) the starting temperature (S p ) can be lowered to fit.

[0323] The temperature of the semiconductor equipment (1000) is the starting temperature (S p) is lower than the starting temperature (S), the first heater (110) is operated to heat the coolant, and the amount of coolant flowing into the main line (R1) and the bypass line (R2) is controlled at a constant rate according to the opening rate of the first valve (V1) and the second valve (V2) which are controlled in conjunction with the temperature sensor (TS4), thereby controlling the temperature of the coolant flowing into the semiconductor equipment (1000), thereby controlling the temperature of the semiconductor equipment (1000) to the starting temperature (S p ) can be increased to fit.

[0324] The above process starts at the starting temperature (S p ) and the semiconductor equipment (1000) can be performed alternately and repeatedly until the temperatures become the same.

[0325] The temperature of the semiconductor equipment (1000) is the starting temperature (S) of the chiller system (1) p ) and the chiller system (1) becomes standby, the chiller system (1) reaches the set temperature (T p ) can be selected. For example, the set temperature (T p ) can be selected in the range of -10℃ to 80℃.

[0326] Set temperature (T) of chiller system (1) p ) is selected, the temperature of the semiconductor equipment (1000) is set to the set temperature (T p ) is the starting temperature (S p ) and the Ramping Up algorithm that is executed when the set temperature (T p ) is the starting temperature (S p ) by the Ramping Down algorithm that is executed when the set temperature (T p ) can be controlled to be the same as .

[0327] Fig. 21 is a schematic diagram illustrating another example of the chiller system of Fig. 17, and Fig. 22 is a flowchart schematically illustrating an example of an operating method of the chiller system of Fig. 23.

[0328] Referring to Figures 21 and 22, the Ramping Up algorithm starts at a starting temperature (S p) is set to the temperature of the semiconductor equipment (1000) p ) of the flow regulator (40) is blocked, and the second valve (V2) is 100% opened so that the coolant can only flow into the bypass line (R2). At this time, the third valve (V3) and the fourth valve (V4) are opened so that the coolant flows into the auxiliary line (R3), and the coolant flowing into the auxiliary line (R3) is at the starting temperature (S) of the chiller system (1). p ) can be quickly heated by the second heater (120) that has been in operation since the setting. At this time, in order to prevent the coolant from being excessively heated, the temperature of the semiconductor equipment (1000) is set to the set temperature (T p ) can be closed sequentially with a time difference when the third valve (V3) and the fourth valve (V4) are closed at 90% of the time difference.

[0329] In addition, the temperature of the semiconductor equipment (1000) is set to a temperature (T p ) becomes 90%, the first heater (110) is operated and the set temperature (T p ) may be stopped about 5°C before reaching the set temperature (T). At this time, the temperature of the semiconductor equipment (1000) may be stopped when the temperature of the semiconductor equipment (1000) reaches the set temperature (T p ) may exceed the set temperature (T) of the semiconductor equipment (1000). p ) is exceeded, the opening rates of the first valve (V1) and the second valve (V2) of the flow controller (140) are adjusted so that the coolant, which was only flowing into the bypass line (R2), flows into the main line (R1) and mixes with the coolant cooled through the evaporator (1600) at an appropriate ratio, thereby lowering the exceeded temperature, and the temperature of the semiconductor equipment (1000) and the set temperature (T p ) can be made to have a difference of within ±0.1℃.

[0330] Fig. 23 is a schematic diagram illustrating another example of the chiller system of Fig. 17, and Fig. 24 is a flowchart schematically illustrating an example of an operating method of the chiller system of Fig. 23.

[0331] Referring to Figures 23 and 24, the Ramping Down algorithm starts at a starting temperature (S p ) is set to the temperature of the semiconductor equipment (1000) p ) to be adjusted, the first valve (V1) of the flow controller (40) is 100% opened, and the second valve (V2) is closed, so that the coolant can only flow into the main line (R1). The coolant flowing into the main line (R1) flows into the evaporator (1600) and exchanges heat with the refrigerant, thereby being cooled. At this time, the temperature of the semiconductor equipment (1000) is lowered to the set temperature (T) due to the supercooling of the coolant. p ) may be lower than the set temperature (T) of the semiconductor equipment (1000). p ) is lower than the first heater (110), the opening rate of the first valve (V1) and the second valve (V2) of the flow controller (140) is adjusted, so that the coolant, which was flowing only into the main line (R1), flows into the bypass line (R2) and bypasses the evaporator (1600), thereby increasing the temperature of the coolant, so that the temperature of the semiconductor equipment (1000) and the set temperature (T p ) can be made to have a difference of within ±0.1℃.

[0332] Semiconductor equipment (1000) is set to a set temperature (T p ) and the chiller system (1) that is maintained can then perform an algorithm to stabilize the temperature.

[0333] Fig. 25 is a schematic diagram illustrating another example of the chiller system of Fig. 17, and Fig. 26 is a flowchart schematically illustrating an example of an operating method of the chiller system of Fig. 25.

[0334] Referring to FIGS. 25 and 26, the stabilizing algorithm can be divided into an FTT algorithm that stabilizes the temperature of the semiconductor equipment (1000) when the load is on (equipment ON) and an LTT algorithm that stabilizes the temperature of the semiconductor equipment (1000) when the load is off (equipment OFF).

[0335] As an optional embodiment, the load of the semiconductor equipment (1000) may be generated by a plasma process having a capacity of 2 KW.

[0336] In the FTT algorithm, the set temperature (T) of the chiller system (1) p ) is the starting temperature (S p ) is higher than the temperature of the semiconductor equipment (1000) set to the set temperature (T p ) and the semiconductor equipment (1000), the opening rate of the first valve (V1) and the second valve (V2) of the flow controller (140) is adjusted to increase the amount of coolant flowing into the bypass line (R2), thereby increasing the temperature of the coolant, and at this time, the set temperature (T p ) by increasing the insufficient temperature with the first heater (110) operated at the same temperature as the semiconductor equipment (1000), so that the temperature of the semiconductor equipment (1000) is set to the set temperature (T p- ) can be the same.

[0337] Meanwhile, semiconductor equipment (1000) and set temperature (T p ) exceeds the range of ±0.1℃, the amount of coolant flowing into the main line (R1) and the bypass line (R2) is controlled at a constant rate according to the opening rate of the first valve (V1) and the second valve (V2) of the flow controller (140), and the set temperature (T p ) is repeatedly operated at the same temperature as the first heater (110), so that the semiconductor equipment (1000) and the set temperature (T p ) can be adjusted to a temperature difference within the range of ±0.1℃.

[0338] Set temperature (T) of chiller system (1) p ) is the starting temperature (S p) is lower than the temperature of the semiconductor equipment (1000) set to the set temperature (T), the opening rates of the first valve (V1) and the second valve (V2) of the flow controller (140) are adjusted to increase the amount of coolant flowing into the main line (R1), thereby lowering the temperature of the coolant, so that the temperature of the semiconductor equipment (1000) is lowered to the set temperature (T p- ) can be the same.

[0339] Meanwhile, semiconductor equipment (1000) and set temperature (T p ) is different by +0.1℃ or more, the temperature of the coolant can be lowered by increasing the amount of coolant flowing into the main line (R1) by the flow controller (140), and the semiconductor equipment (1000) and the set temperature (T p ) is -0.1℃ or more different, the amount of coolant flowing into the bypass line (R2) by the flow controller (140) is increased, and the set temperature (T p ) can be operated at the same temperature as the first heater (110). Therefore, by repeating the above process alternately, the semiconductor equipment (1000) and the set temperature (T p ) can be adjusted to a temperature difference within the range of ±0.1℃.

[0340] Through this algorithm, the set temperature (T) during the 2KW plasma process is maintained. p ) and the semiconductor equipment (1000) can be maintained within ±0.1℃.

[0341] When the 2KW plasma process is completed and the load on the semiconductor equipment (1000) is removed, the temperature of the coolant may decrease.

[0342] At this time, the set temperature (T) in the LTT algorithm p ) is the starting temperature (S p) is higher than the temperature of the semiconductor equipment (1000) set to, the first valve (V1) of the flow controller (140) is blocked, the second valve (V2) is 100% opened so that the coolant flows only into the bypass line (R2), and the first heater (110) is set to the set temperature (T p ) is operated at the same temperature as the set temperature (T) by increasing the temperature of the coolant. p ) and the semiconductor equipment (1000) can be made to have the same temperature.

[0343] Meanwhile, semiconductor equipment (1000) and set temperature (T p ) is different by +0.1℃ or more, the first valve (V1) is opened, thereby increasing the amount of coolant flowing into the main line (R1), thereby lowering the temperature of the coolant, and the first heater (110) is set to the set temperature (T p ) and by operating at the same temperature as the evaporator, the temperature of the coolant can be slightly lowered by compensating for the temperature of the supercooled coolant passing through the evaporator. In addition, the semiconductor equipment (1000) and the set temperature (T p ) is -0.1℃ or more different, the first valve is blocked, the coolant flows only into the bypass line (R2), and the set temperature (T p ) can be operated at the same temperature as the first heater (110). Therefore, by repeating the above process alternately, the semiconductor equipment (1000) and the set temperature (T p ) can be adjusted to a temperature difference within the range of ±0.1℃.

[0344] Set temperature (T p ) is the starting temperature (S p ) is lower than the temperature of the semiconductor equipment (1000) set to, the first valve (V1) of the flow controller (140) is 100% opened, the second valve (V2) is closed, and the amount of coolant flowing into the evaporator (1600) through the main line (R1) is increased, thereby lowering the temperature of the coolant, and the temperature of the first heater (110) is lower than the set temperature (T p) is adjusted lower than the set temperature (T p ) and the semiconductor equipment (1000) can be made to have the same temperature.

[0345] Meanwhile, semiconductor equipment (1000) and set temperature (T p ) is different by +0.1℃ or more, the amount of coolant flowing into the main line (R1) by the flow controller (140) increases, so that the temperature of the coolant can be lowered, and the first heater can be set to the set temperature (T p ) can be operated continuously at the same temperature as the semiconductor equipment (1000) to compensate for the temperature of the supercooled coolant, thereby slightly lowering the temperature of the coolant. The semiconductor equipment (1000) and the set temperature (T p ) is -0.1℃ or more different, the first valve (V1) is blocked, and the process of the coolant circulating only through the bypass line (R2) is repeated, thereby increasing the temperature of the coolant and causing the semiconductor equipment (1000) and the set temperature (T p ) can be adjusted to a temperature difference within the range of ±0.1℃.

[0346] Meanwhile, in the LTT stage, semiconductor equipment (1000) and set temperature (T p ) can be maintained when the temperature difference is adjusted to within the range of ±0.1℃. In order to terminate the chiller system (1) in the maintenance state, the semiconductor equipment (1000) and the set temperature (T) are connected again. p ) is judged to be within ±0.1℃, then the semiconductor equipment (1000) and the set temperature (T p ) the temperature difference is ±0.1℃, the LTT algorithm can be performed again, and the semiconductor equipment (1000) and the set temperature (T p ) is within ±0.1℃, the chiller system (1) may be shut down.

[0347] Fig. 27 is a graph showing the heating performance and cooling performance of the chiller system of Fig. 17.

[0348] Referring to FIG. 27, it can be seen that in the Ramping Up step, the temperature of the coolant increases from -10°C to 80°C in about 80 seconds, and the temperature of the coolant increases at an average rate of 1.125°C / Sec. At this time, the temperature of the coolant can be precisely controlled within the error range of ±0.5°C of the target temperature. In addition, it can be seen that in the Ramping Down step, the temperature of the coolant decreases from 80°C to -10°C in about 90 seconds, and the temperature of the coolant can be precisely controlled within the error range of ±0.5°C of the target temperature. Therefore, it can be seen that the chiller system according to the embodiment of the present invention can quickly and precisely control the temperature rising and falling speeds of the coolant, and the temperature response speed is extremely excellent because the temperature rising and falling speeds are quickly controlled.

[0349] As a result, the chiller system can omit the unnecessary process of cooling and reheating the coolant by controlling the amount of coolant flowing into the main line and bypass line through the flow controller, and can have an efficient and excellent temperature response speed by utilizing the heat (temperature) stored in the coolant without unnecessary cooling.

[0350] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

[0351] The specific implementations described in the embodiments are exemplary embodiments and do not limit the scope of the embodiments in any way. For the sake of brevity of the specification, descriptions of conventional electronic components, control provision methods, software, and other functional aspects of the above provision methods may be omitted. In addition, the lines connecting or connecting members between components illustrated in the drawings are merely representative of functional connections and / or physical or circuit connections, and may be replaced or represented as various additional functional connections, physical connections, or circuit connections in an actual device. In addition, if there is no specific mention such as “essential,” “important,” etc., the component may not be absolutely necessary for the application of the present invention.

[0352] The use of the term "above" and similar referential terms in the specification of embodiments (especially in the claims) may refer to both the singular and the plural. Furthermore, if a range is described in the embodiments, the invention encompasses the application of individual values ​​within the range (unless otherwise stated), and is equivalent to describing each individual value constituting the range in the detailed description. Finally, unless the order of steps constituting a method according to an embodiment is explicitly stated or otherwise stated to the contrary, the steps may be performed in any suitable order. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., "for example," etc.) in the embodiments is merely intended to describe the embodiments in detail, and the scope of the embodiments is not limited by the examples or exemplary terms, unless otherwise defined by the claims. Furthermore, those skilled in the art will recognize that various modifications, combinations, and variations may be made within the scope of the appended claims or their equivalents, depending on design conditions and factors.

Claims

1. A case including a first inlet and a first outlet and a second inlet and a second outlet; A plurality of heat exchange members arranged in a tube shape along the axial direction of the case inside the case; and A screen is positioned apart from the heat exchange member and divides the interior of the case into a first space and a second space; An evaporator in which the first inlet injects refrigerant into the case, and the first outlet discharges refrigerant vapor to the outside of the case.

2. In paragraph 1, An evaporator wherein the refrigerant is present inside the case so that the heat exchange member is immersed in the refrigerant.

3. In paragraph 1, An evaporator wherein the plurality of heat exchange members include 280 to 300 copper tubes.

4. In paragraph 3, The above-mentioned copper tube is an evaporator in the shape of a circular helicoil.

5. In paragraph 1, The second inlet is an evaporator that injects the coolant into the case and is connected to the plurality of heat exchange members through a single flow path.

6. In paragraph 5, The plurality of heat exchange members further include an upper head and a lower head covering the plurality of heat exchange members on both sides, respectively, An evaporator wherein the second inlet is connected to the lower head, and the second outlet is connected to the upper head.

7. In paragraph 1, An evaporator wherein the screen includes a plurality of micro-holes penetrating the screen, the micro-holes allowing the refrigerant vapor to pass through and preventing the movement of the refrigerant.

8. A chiller system comprising a refrigeration cycle consisting of a compressor, a condenser, an expansion valve, and an evaporator, and a cooling cycle consisting of a first heater, a second heater, and a pump, wherein a refrigerant circulating in the refrigeration cycle and a coolant circulating in the cooling cycle exchange heat with each other in the evaporator. The above cooling cycle includes a main line input / output to the evaporator and a bypass line branched from the main line, A chiller system in which the first heater and the pump are sequentially arranged in the main line output from the evaporator, the second heater is arranged in the bypass line, and a flow controller is arranged at a location where the main line and the bypass line branch off.

9. In paragraph 8, A chiller system in which the evaporator, the first heater, and the second heater control the temperature of the coolant, and the flow rate controller controls the flow rate of the coolant flowing into the main line and the bypass line.

10. In paragraph 9, The above flow regulator comprises a first valve and a second valve, A chiller system wherein the first valve is connected to the main line and the second valve is connected to the bypass line.

11. In paragraph 10, A chiller system in which the flow rate of the main line and the flow rate of the bypass line are differently controlled according to the opening rates of the first valve and the second valve.

12. In paragraph 8, A chiller system in which the bypass line further includes an auxiliary line branched from the bypass line, the bypass line bypassing the evaporator and connected to the main line, and the auxiliary line bypassing the evaporator and the first heater and connected to the main line.

13. In paragraph 12, A chiller system in which the second heater is arranged in the auxiliary line, and the second heater maintains a constant temperature.

14. In paragraph 13, A chiller system in which a third valve and a fourth valve are respectively arranged on both sides of the second heater.

15. In paragraph 8, The evaporator comprises a case including a pair of first inlets and a first outlet and a pair of second inlets and a second outlet; A plurality of heat exchange members arranged in a tube shape along the axial direction of the case inside the case; and A screen is positioned apart from the heat exchange member and divides the interior of the case into a first space and a second space; A chiller system in which the first inlet injects refrigerant into the case, and the first outlet discharges refrigerant vapor to the outside of the case.

16. In paragraph 15, A chiller system, wherein the plurality of heat exchange members include 280 to 300 copper tubes.

17. In paragraph 16, The above-mentioned chiller system is a circular helicoil type.

18. In paragraph 15, A chiller system in which the second inlet injects the coolant into the case and is connected to the plurality of heat exchange members through a single flow path.

19. In paragraph 18, The plurality of heat exchange members further include an upper head and a lower head covering the plurality of heat exchange members on both sides, respectively, A chiller system wherein the second inlet is connected to the lower head, and the second outlet is connected to the upper head.

20. In paragraph 15, A chiller system, wherein the screen includes a plurality of micro-holes penetrating the screen, the micro-holes allowing the refrigerant vapor to pass through and preventing the movement of the refrigerant.

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