Wiring substrate, backplane, and light-emitting apparatus

Abstract

A wiring substrate, a backplane, and a light-emitting apparatus. The wiring substrate comprises: a base substrate (101); a plurality of connection electrode regions (102) arranged in an array on the base substrate (101); and a plurality of touch electrodes (103), wherein the orthographic projection of the plurality of touch electrodes (103) on the base substrate (101) and the orthographic projection of the plurality of connection electrode regions (102) on the base substrate (101) do not overlap with one another.

Description

Wiring substrate, backplane and light-emitting device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on September 19, 2023, with application number 202311216249.1 and application name "Wiring substrate, backplane and light-emitting device", the entire content of which is incorporated by reference into this disclosure. Technical Field

[0003] The present disclosure relates to the field of display technology, and in particular to a wiring substrate, a backplane, and a light-emitting device. Background Art

[0004] Mini / Micro LED (Mini / Micro Light Emitting Diode) mainly uses miniaturization process technology to miniaturize, array and thin film the traditional LED chips, and then transfers the LED crystal film to the driver backplane in batches through mass transfer technology, uses physical deposition to manufacture the protective layer, and finally completes the packaging.

[0005] Mini LED backlighting replaces the display's previous backlighting, consisting of dozens of LEDs on the sides, with a direct-lit backlight system comprised of thousands, tens of thousands, or even more Mini LEDs. Each pixel in a Micro LED display can be addressed and individually driven, making it a self-luminous LED display with a micron-level pixel pitch that requires no backlight. Compared to the already mass-produced LCD and OLED technologies, Mini / Micro LEDs offer superior performance in nearly every technical dimension, including long life, high contrast, high resolution, fast response, wider viewing angles, rich colors, ultra-high brightness, and lower power consumption.

[0006] Summary of the Invention

[0007] An embodiment of the present disclosure provides a wiring substrate, comprising:

[0008] substrate;

[0009] A plurality of connecting electrode areas are arranged in an array on the base substrate;

[0010] A plurality of touch electrodes, wherein the orthographic projections of the plurality of touch electrodes on the base substrate do not overlap with the orthographic projections of the plurality of connection electrode regions on the base substrate.

[0011] In some embodiments, in the wiring substrate provided by the embodiments of the present disclosure, some of the touch electrodes are provided in the same layer as the plurality of connection electrode areas.

[0012] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of first signal lines arranged in the same layer as the portion of the touch electrodes, and the portion of the touch electrodes is arranged in the gaps between the first signal lines.

[0013] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located;

[0014] The remaining touch electrodes are arranged in the same layer as the plurality of second signal lines, and the remaining touch electrodes are located in gaps between the second signal lines.

[0015] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of data signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located; the remaining touch electrodes are multiplexed with the plurality of data signal lines.

[0016] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located;

[0017] The remaining touch electrodes are located on a side of the layer where the multiple connection electrode regions are located away from the base substrate, and the orthographic projections of the remaining touch electrodes on the base substrate coincide with the orthographic projections of the second signal lines on the base substrate.

[0018] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of first signal lines disposed on the same layer as the plurality of connection electrode areas, and a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located;

[0019] Some of the touch electrodes and the remaining touch electrodes are cross-arranged in different layers on a side of the layer where the multiple connection electrode areas are located, away from the base substrate, and one of the orthographic projections of some of the touch electrodes on the base substrate and the orthographic projections of the remaining touch electrodes on the base substrate coincides with the orthographic projections of the multiple first signal lines on the base substrate, and the other coincides with the orthographic projections of the multiple second signal lines on the base substrate.

[0020] In some embodiments, in the above-mentioned wiring substrate provided by the embodiments of the present disclosure, the multiple touch electrodes include multiple touch drive electrodes and multiple touch sensing electrodes, and the layer where the multiple touch sensing electrodes are located is located on a side of the layer where the multiple touch drive electrodes are located away from the base substrate.

[0021] In some embodiments, in the above-mentioned wiring substrate provided by the embodiments of the present disclosure, at least one of the touch driving electrodes and the touch sensing electrodes has a grid structure.

[0022] In some embodiments, in the above-mentioned wiring substrate provided by the embodiments of the present disclosure, the line width of the grid structure is 2 μm to 5 μm, and the line spacing is 150 μm to 600 μm.

[0023] In some embodiments, in the above-mentioned wiring substrate provided in the embodiments of the present disclosure, the base substrate is a transparent substrate.

[0024] Based on the same inventive concept, an embodiment of the present disclosure provides a backplane, comprising the above-mentioned wiring substrate provided by the embodiment of the present disclosure and a plurality of component groups, wherein the plurality of component groups are electrically connected to the plurality of connection electrode regions.

[0025] Based on the same inventive concept, an embodiment of the present disclosure provides a light-emitting device, including the above-mentioned backplane provided by an embodiment of the present disclosure, the element group includes at least one light-emitting element, the connecting electrode area includes at least one connecting electrode group, and the at least one light-emitting element is connected to the at least one connecting electrode group. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1 is a schematic structural diagram of a backplane provided by an embodiment of the present disclosure;

[0027] FIG2 is a cross-sectional view along line AA' in FIG1;

[0028] FIG3 is a schematic structural diagram of the touch electrode in FIG1 ;

[0029] FIG4 is a schematic structural diagram of the light-emitting functional layer in FIG1 ;

[0030] FIG5a is an enlarged structural diagram of the Z1 region in FIG4;

[0031] FIG5b is a diagram showing an alternative structure of the structure shown in FIG5a;

[0032] FIG6 is an enlarged structural diagram of the Z2 region in FIG5b;

[0033] FIG7 is a cross-sectional view along line BB' in FIG6;

[0034] FIG8 is a timing diagram of the operation of the data signal line in FIG1;

[0035] FIG9 is a schematic structural diagram of a wiring substrate provided in an embodiment of the present disclosure;

[0036] FIG10 is a cross-sectional view along line CC' in FIG9;

[0037] FIG11 is a schematic structural diagram of the touch electrode in FIG9 ;

[0038] FIG12 is a schematic diagram of another structure of a wiring substrate provided in an embodiment of the present disclosure;

[0039] FIG13 is a cross-sectional view along line DD' in FIG11;

[0040] FIG14 is a schematic structural diagram of the touch electrode in FIG12 ;

[0041] FIG15 is a schematic diagram of another structure of a wiring substrate provided in an embodiment of the present disclosure;

[0042] FIG16 is a cross-sectional view along line EE' in FIG15;

[0043] FIG17 is a schematic structural diagram of the touch electrode in FIG15 ;

[0044] FIG18 is a schematic diagram of another structure of a wiring substrate provided in an embodiment of the present disclosure;

[0045] FIG19 is a cross-sectional view along line FF' in FIG18;

[0046] FIG20 is a schematic structural diagram of the touch electrode in FIG18 . DETAILED DESCRIPTION

[0047] To further clarify the objectives, technical solutions, and advantages of the embodiments of the present disclosure, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present disclosure. It should be noted that in the drawings, the thicknesses of layers, films, panels, regions, etc. are exaggerated for clarity. In this disclosure, exemplary embodiments are described with reference to cross-sectional views that are schematic representations of idealized embodiments. As such, deviations from the shapes shown in the drawings are to be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments described in this disclosure should not be construed as limited to the specific shapes of the regions shown in this disclosure, but rather include deviations in shape resulting from, for example, manufacturing. For example, a region illustrated or described as flat may typically have rough and / or nonlinear features; a sharp angle illustrated may be rounded, etc. Therefore, the regions shown in the drawings are schematic in nature, and their sizes and shapes are not intended to illustrate the precise shapes of the regions or reflect true scale, but are intended solely to illustrate the present disclosure. Throughout, identical or similar reference numerals denote identical or similar elements or elements having identical or similar functions. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components.

[0048] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the present disclosure belongs. The words "first", "second" and similar terms used in the present disclosure and the claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Inside", "outside", "upper", "lower" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0049] In the following description, when an element or layer is referred to as being “on” or “connected to” another element or layer, the element or layer may be directly on, directly connected to, the other element or layer, or there may be intermediate elements or intermediate layers. When an element or layer is referred to as being “disposed on one side of” another element or layer, the element or layer may be directly on, directly connected to, the other element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as being “directly on” or “directly connected to” another element or layer, there are no intermediate elements or intermediate layers. The term “and / or” includes any and all combinations of one or more of the associated listed items.

[0050] During LCD display, light emitted from the backlight passes through polarizers and color filters, resulting in significant energy loss. Mini / Micro LED displays, on the other hand, utilize a self-luminous sub-pixel structure using three primary colors. This reduces power consumption by approximately 10% compared to LCD displays. Mini / Micro LEDs utilize inorganic materials for light emission, resulting in higher luminous efficiency. OLEDs utilize organic materials for light emission, resulting in lower power consumption than OLEDs. Furthermore, unlike OLEDs, which use organic materials, Mini / Micro LEDs utilize gallium nitride (GaN) in their light-emitting components, which significantly surpasses OLED in brightness. In Mini / Micro LED display products, each Mini / Micro LED is a self-luminous pixel. Furthermore, individual Mini / Micro LEDs are micron-sized, enabling very high resolution. In related technologies, Mini / Micro LED displays can achieve pixel densities exceeding 1500 PPI, compared to approximately 800 PPI and 400 PPI for LCD and OLED screens, respectively.

[0051] Based on the above advantages, Mini / Micro LED displays will become the next generation of displays after LCD and OLED displays, with broad application prospects. However, the touch function of related Mini / Micro LED display products is achieved by using external touch modules, which has disadvantages such as high cost, low light transmittance, and overall thicker products.

[0052] In order to at least solve the above-mentioned technical problems existing in the related art, an embodiment of the present disclosure provides a wiring substrate, as shown in Figures 1 to 4, comprising:

[0053] Base substrate 101;

[0054] A plurality of connection electrode regions 102 are arranged in an array on the base substrate 101; optionally, the connection electrode regions 102 are connected to an element group 104 including at least one light-emitting element to achieve light-emitting display;

[0055] The orthographic projections of the touch electrodes 103 on the base substrate 101 do not overlap with the orthographic projections of the connection electrode regions 102 on the base substrate 101 , so that the patterns of the touch electrodes 103 do not interfere with the connection electrode regions 102 .

[0056] In the wiring substrate provided in the embodiment of the present disclosure, the connection electrode area 102 can be connected to the light-emitting element to realize the display function, and the touch electrode 103 can realize the touch function, thereby realizing the integration of display and touch. Moreover, because the orthographic projection of the touch electrode 103 on the base substrate 101 does not overlap with the orthographic projection of the connection electrode area 102 on the base substrate 101, the touch function and the display function do not affect each other. In addition, compared with the solution of realizing the touch function by using an external touch module, the solution disclosed in the present disclosure realizes the touch function by integrating the touch electrode 103 inside the wiring substrate, which is lower in cost, higher in transmittance, and thinner in overall product.

[0057] Optionally, in the wiring substrate provided in the embodiment of the present disclosure, the base substrate 101 can be a transparent substrate that allows visible light to pass through, so as to be applied in transparent display fields such as smart transportation, smart windows, and outdoor displays; in some embodiments, the transparent substrate can be made of glass, quartz, plastic, polyimide and other materials.

[0058] In some embodiments, as shown in Figures 1, 4, 5a-5b, and 6, in order to achieve color display, the element group 104 connected to the electrode area 102 includes at least a first type of light-emitting element 1041 and a second type of light-emitting element 1042. The first type of light-emitting element 1041 and the second type of light-emitting element 1042 are configured to emit light of different wavelengths, respectively. The first type of light-emitting element 1041 emits light in a wavelength range of 615nm to 650nm, and the second type of light-emitting element 1042 emits light in a wavelength range of 440nm to 550nm. For example, the first type of light-emitting element 1041 includes only one type of light-emitting element, which is used to emit red light of 615nm to 650nm, and its peak wavelength can be 600nm. The second type of light-emitting element 1042 includes two types of light-emitting elements, which are used to emit blue light of 440nm to 480nm and green light of 495nm to 550nm, respectively, and their peak wavelengths can be 450nm and 530nm, respectively.

[0059] The first type of light emitting element 1041 and the second type of light emitting element 1042 can both be inorganic light emitting diodes (LEDs). The type of inorganic light emitting diodes is not limited here. LEDs with quantum well junctions, LEDs with columnar structures, LEDs with double heterojunctions, etc. can be used. The LEDs can be structures with sizes miniaturized to the order of hundreds of microns, i.e., Mini LEDs or Micro LEDs, etc. The area of ​​the light emitting region of the LED is preferably 1mm 2 Below, more preferably 10000 μm 2 Below, more preferably 3000 μm 2 Below, more preferably 700 μm 2 Below, even 200μm 2the following.

[0060] Continuing to refer to Figures 5a, 5b and 6, it can be seen that the first type of light-emitting element 1041 and the second type of light-emitting element 1042 in the element group 104 both include a first electrode "+" and a second electrode "-", wherein the first electrode "+" of the first type of light-emitting element 1041 is connected to the corresponding first fixed potential signal line VR, and the first electrode "+" of the second type of light-emitting element 1042 is connected to the corresponding first fixed potential signal line VGB, and the second electrodes "-" of the first type of light-emitting element 1041 and the second type of light-emitting element 1042 are both connected to the micro-driver chip 105, and the micro-driver chip 105 is also respectively connected to the common potential signal line GND, the data signal line D and the first power supply signal line VCC1.

[0061] In a specific implementation, the first power signal line VCC1 can transmit either a DC signal or a digital signal. It is used to power the connected micro-driver chip 105. The data signal line D transmits a digital signal. The micro-driver chip 105 receives the digital signal transmitted by the data signal line D to determine the light-emitting time of each light-emitting element in the driver element group 104, thereby controlling the brightness of each light-emitting element. The common potential signal line GND transmits a set potential signal, providing a constant potential. The first electrode "+" of the first-type light-emitting element 1041 is connected to the first fixed potential signal line VR, and the second electrode "-" is connected to the common potential signal line GND through the micro-driver chip 105. The first fixed potential signal line VR is used to provide a first fixed potential. The micro-driver chip 105 controls the conduction and disconnection between the first-type light-emitting element 1041 and the common potential signal line GND, thereby controlling the light-emitting time of the first-type light-emitting element 1041 by controlling the conduction time of the first-type light-emitting element 1041. Similarly, the first electrode "+" of the second type light-emitting element 1042 is connected to the first fixed potential signal line VGB, and the second electrode "-" is connected to the common potential signal line GND via the micro-driver chip 105. The first fixed potential signal line VGB is used to provide a second fixed potential. The micro-driver chip 105 controls the conduction and disconnection between the second type light-emitting element 1042 and the common potential signal line GND, thereby controlling the light-emitting duration of the second type light-emitting element 1042 by controlling the conduction time of the second type light-emitting element 1042. When the second type light-emitting element 1042 includes two light-emitting elements, as shown in FIG5a, the first electrodes "+" of the two light-emitting elements can be connected to the second fixed potential line 32 respectively. Alternatively, as shown in FIG5b, the first electrodes "+" of the two light-emitting elements can be connected and then connected to the second fixed potential line 32; the second electrodes "-" of the two light-emitting elements are connected to the micro-driver chip 105 respectively, as shown in FIG5a and FIG5b.

[0062] In addition, as shown in FIG4 , since the wiring substrate generally forms a binding area at the edge of at least one side in the first direction Y, a second power signal line VCC2 is provided in the embodiment of the present disclosure for connecting to the first power signal line VCC1. One second power signal line VCC2 can be connected to one first power signal line VCC1, thereby connecting the corresponding first power signal line VCC1 to the binding area. In some embodiments, as shown in FIG7 , the wiring substrate may include a first conductive layer L1 and a second conductive layer L2. Optionally, the second power signal line VCC2 is located in the first conductive layer L1, and the first power signal line VCC1 is located in the second conductive layer L2, and the two are electrically connected through a via that penetrates the insulating layer (for example, the stacked first inorganic insulating layer PVX1-1, the first organic insulating layer OC1, and the second inorganic insulating layer PVX1-2).

[0063] In some embodiments, as shown in Figures 4, 5a-5b, and 6 to 7, a first fixed potential signal line VR, a second fixed potential signal line VGB, a common potential signal line GND, and a data signal line D may further be provided in the first conductive layer L1 where the second power signal line VCC2 is located; and multiple types of connecting lines 106 may further be provided in the second conductive layer L2 where the first power signal line VCC1 is located. These connecting lines 106 may be used to connect the first fixed potential signal line VR with the first type of light-emitting element 1041, the second fixed potential signal line VGB with the second type of light-emitting element 1042, the first type of light-emitting element 1041 with the micro-driving chip 105, the second type of light-emitting element 1042 with the micro-driving chip 105, the micro-driving chip 105 with the data signal line D, and the micro-driving chip 105 with the first power signal line VCC1, etc. Optionally, the connecting line 106 for connecting the micro-driving chip 105 with the first power signal line VCC1 is integrally provided with the first power signal line VCC1.

[0064] In the embodiment of the present disclosure, one first power signal line VCC1 is connected to a row of micro-driver chips 105 arranged along the second direction X, and one second power signal line VCC2 is connected to one first power signal line VCC1. FIG1 only illustrates the case where the number of columns of micro-driver chips 105 arranged along the first direction Y and the number of rows arranged along the second direction X are the same. In a specific implementation, the number of columns of micro-driver chips 105 arranged along the first direction Y and the number of rows arranged along the second direction X may be different. For example, when the number of columns of micro-driver chips 105 arranged along the first direction Y is greater than the number of rows of micro-driver chips 105 arranged along the second direction X, only the same number of second power signal lines VCC2 as the number of rows of micro-driver chips 105 need be provided. The second power signal lines VCC2 are electrically connected to the corresponding first power signal lines VCC1 through vias in the insulating layer. When the arrangement of the micro-driver chips 105 and the component group 104 changes, the via connection method of the first power signal lines VCC1 and the second power signal lines VCC2 can also be adaptively adjusted, which is not limited in the embodiment of the present disclosure.

[0065] In addition, as shown in Figures 2 and 7, the wiring substrate may further include a buffer layer (PVX0) located between the first conductive layer L1 and the base substrate 101. The buffer layer (PVX0) may be made of insulating materials such as silicon nitride to offset the deformation of the base substrate 101 that may be caused during the preparation of the signal lines in the first conductive layer L1. When signal lines are set on both sides of the base substrate 101, the stresses between the corresponding signal lines offset each other and will not cause deformation of the base substrate 101. Therefore, the buffer layer (PVX0) may not be set.

[0066] Continuing with FIG. 7 , it can be seen that the wiring substrate may further include a protective layer (e.g., a stacked third inorganic insulating layer PVX2 and a second organic insulating layer OC2) disposed on the side of the second conductive layer L2 away from the base substrate 101. The third inorganic insulating layer can be made of a material such as silicon nitride and directly covers the surface of the second conductive layer L2 away from the base substrate 101, thereby providing insulation and protection for the signal lines of the second conductive layer L2. Optionally, the protective layer includes vias that expose the connecting electrode region 102 and the pad region 102' bonded to the micro-driver chip 105.

[0067] It should be understood that the touch electrodes 103 of the present disclosure can be either self-capacitive or mutual-capacitive. This disclosure uses the mutual-capacitive touch electrodes 103 as an example for description. For example, when the touch electrodes 103 are mutual-capacitive, the multiple touch electrodes 103 can include multiple touch drive electrodes Tx and multiple touch sensing electrodes Rx. Optionally, to improve touch sensitivity, the layer containing the multiple touch sensing electrodes Rx can be located on a side of the layer containing the multiple touch drive electrodes Tx that is away from the base substrate 101.

[0068] In some embodiments, in the wiring substrate provided in the embodiments of the present disclosure, some touch electrodes 103 can be disposed on the same layer as the multiple connection electrode regions 102. For example, in Figures 1 to 3, some touch electrodes 103 (e.g., touch sensing electrodes Rx) are disposed on the second conductive layer L2 where the multiple connection electrode regions 102 are located. This allows the second conductive layer L2 where the multiple connection electrode regions 102 are located to be patterned to form the pattern of some touch electrodes 103 (e.g., touch sensing electrodes Rx), thereby minimizing the need for additional film layers, improving transmittance, and facilitating a lightweight and thin design.

[0069] As shown in Figure 1 , multiple first signal lines (e.g., first power signal line VCC1) are provided in the second conductive layer L2 where the multiple connection electrode regions 102 are located. Optionally, to prevent some touch electrodes 103 (e.g., touch sensing electrodes Rx) from short-circuiting with the first signal lines (e.g., first power signal line VCC1), some touch electrodes 103 (e.g., touch sensing electrodes Rx) can be positioned in gaps between the first signal lines (e.g., first power signal line VCC1). In the embodiments shown in Figures 1 to 3 , each touch sensing electrode Rx is strip-shaped and extends along the second direction X. Adjacent touch sensing electrodes Rx are spaced apart along the first direction Y. Optionally, the touch sensing electrodes Rx are made of copper. Generally, the larger the area of ​​the touch sensing electrode Rx, the better the touch sensitivity. Therefore, the present disclosure can maximize the size of the touch sensing electrode Rx in the first direction Y while ensuring that part of the touch electrodes 103 (e.g., the touch sensing electrode Rx) and the first signal line (e.g., the first power signal line VCC1) are not short-circuited.

[0070] FIG1 also shows a plurality of data signal lines D. As can be seen from the above, the data signal lines D are located in the first conductive layer L1 between the base substrate 101 and the second conductive layer L2 where the plurality of connection electrode regions 102 are located. The present disclosure can reuse the remaining touch electrodes (such as the touch drive electrodes Tx) with the plurality of data signal lines D, thereby avoiding the addition of additional film layers, facilitating a lightweight design, and the remaining touch electrodes (such as the touch drive electrodes Tx) will not have any effect on the transmittance. As can be seen from FIG3 , each touch drive electrode Tx is strip-shaped, and each touch drive electrode Tx extends along the first direction Y, and adjacent touch drive electrodes Tx are arranged at intervals along the second direction X. Optionally, the material of the touch drive electrode Tx includes copper. In a specific implementation, the wiring substrate can be time-shared driven using the timing sequence shown in Figure 8. Specifically, display is enabled when the D signal provided by the data signal line D is high, and touch is enabled when the TX signal provided by the data signal line D is high; alternatively, display is enabled when the D signal provided by the data signal line D is low, and touch is enabled when the TX signal provided by the data signal line D is low. The example shown in Figure 1 multiplexes the touch drive electrode Tx with multiple data signal lines D, and places the touch sensing electrode Rx on the same layer as the first power signal line VCC1, with the touch sensing electrode Rx positioned in the gap between the first power signal line VCC1. Compared to wiring substrates without touch functionality in related art, this method eliminates the need for additional layers and reduces transmittance by less than 5%.

[0071] In some embodiments, as shown in Figures 9 to 11 , while some touch electrodes 103 (e.g., touch sensing electrodes Rx) are located in the second conductive layer L2 where the connection electrode region 102 is located, the remaining touch electrodes (e.g., touch drive electrodes Tx) may be located in the first conductive layer L1 between the base substrate 101 and the second conductive layer L2 where the connection electrode regions 102 are located. This eliminates the need for a new conductive layer (e.g., a metal layer) to form the touch electrodes 103. Optionally, each touch sensing electrode Rx is strip-shaped and extends along the second direction X, with adjacent touch sensing electrodes Rx spaced apart along the first direction Y. Each touch drive electrode Tx is strip-shaped and extends along the first direction Y, with adjacent touch drive electrodes Tx spaced apart along the second direction X. Both the touch drive electrodes Tx and the touch sensing electrodes Rx may be made of copper, for example. However, the first conductive layer L1 where the multiple connection electrode regions 102 are located is provided with multiple second signal lines (e.g., a first fixed potential signal line VR, a second fixed potential signal line VGB, a common potential signal line GND, a data signal line D, and a second power signal line VCC2). Therefore, to prevent the remaining touch electrodes (e.g., the touch drive electrodes Tx) provided on the same layer from short-circuiting with the second signal lines (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, the common potential signal line GND, the data signal line D, and the second power signal line VCC2), the remaining touch electrodes (e.g., the touch drive electrodes Tx) can be provided in the gaps between the second signal lines (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, the common potential signal line GND, the data signal line D, and the second power signal line VCC2). This solution affects the transmittance by 5%-10%.

[0072] In some embodiments, in order to avoid connecting the electrode area 102 and the pad area 102' and to prevent the pulse signal of the data signal line D from interfering with the signals of the remaining touch electrodes (for example, the touch drive electrode Tx), as shown in Figure 9, the remaining touch electrodes (for example, the touch drive electrode Tx) can be set in the gap between the first fixed potential signal line VR and the common potential signal line GND, and / or the remaining touch electrodes (for example, the touch drive electrode Tx) can be set in the gap between the second fixed potential signal line VGB and the common potential signal line GND.

[0073] In some embodiments, as shown in Figures 12 to 14 , the touch drive electrodes Tx can also be used as part of the touch electrodes 103 and arranged on the same layer as the first power signal line VCC1 (for example, on the same second conductive layer L2). To prevent the touch drive electrodes Tx from shorting with the first power signal line VCC1, the touch drive electrodes Tx can be arranged in a gap between the first power signal line VCC1. As shown in Figure 14 , each touch drive electrode Tx is strip-shaped and extends along the second direction X. Adjacent touch drive electrodes Tx are spaced apart along the first direction Y. Optionally, the touch drive electrodes Tx are made of copper, etc. Generally, the larger the area of ​​the touch drive electrodes Tx, the better the touch sensitivity. Therefore, the present disclosure can maximize the size of the touch drive electrodes Tx in the first direction Y while ensuring that the touch drive electrodes Tx and the first power signal line VCC1 are not shorted.

[0074] In Figures 12 to 14 , touch sensing electrodes Rx, as part of the remaining touch electrodes 103, are disposed on the side of the second conductive layer L2, where the first power signal line VCC1 is located, away from the base substrate 101. This means that the touch sensing electrodes Rx are located in a newly added film layer. Optionally, to minimize the impact of the touch sensing electrodes Rx on transmittance, the orthographic projections of the touch sensing electrodes Rx on the base substrate 101 can be aligned with the orthographic projections of the second signal lines (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, and the second power signal line VCC2) on the base substrate 101. As shown in Figure 14 , each touch sensing electrode Rx is strip-shaped and extends along a first direction Y. Adjacent touch sensing electrodes Rx are spaced apart along a second direction X. In some embodiments, the touch sensing electrodes Rx are made of copper, for example. It should be understood that, as shown in Figure 12, to prevent the touch sensing electrodes Rx from interfering with the connection electrode area 102 binding to the light-emitting element and the pad area 102' binding to the micro-driver chip 105, the touch sensing electrodes Rx avoid the common potential signal line GND that overlaps with the connection electrode area 102, as well as the data signal line D near the pad area 102'. In the solutions shown in Figures 12 to 14, only the touch drive electrodes Tx are shielded, and the transmittance is affected by less than 5%.

[0075] Optionally, to prevent a short circuit between the second conductive layer L2 where the first power signal line VCC1 resides and the newly added film layer of the touch sensing electrodes Rx, an insulating layer (e.g., OC2) is provided between the two, as shown in FIG13 . In some embodiments, as shown in FIG13 , an insulating layer (e.g., OC3) is further provided on the side of the newly added film layer of the touch sensing electrodes Rx away from the base substrate 101 to provide insulation protection for the touch sensing electrodes Rx.

[0076] In some embodiments, as shown in FIG. 15 to FIG. 20 , the layer where the touch driving electrodes Tx are located and the layer where the touch sensing electrodes Rx are located may be both arranged on a side of the second conductive layer L2 where the multiple connection electrode regions 102 are located away from the base substrate 101 , that is, two new conductive layers are added to respectively form the touch driving electrodes Tx and the touch sensing electrodes Rx.

[0077] Optionally, to prevent the touch driving electrodes Tx and the touch sensing electrodes Rx from affecting transmittance and affecting the bonding of the connection electrode area 102 to the light-emitting element and the bonding of the pad area 102' to the micro-driving chip 105, in Figures 15 to 17, the orthographic projection of the touch sensing electrodes Rx on the base substrate 101 is configured to coincide with the orthographic projections of the second signal lines, such as the first fixed potential signal line VR, the second fixed potential signal line VGB, and the second power signal line VCC2, on the base substrate 101. The orthographic projection of the touch driving electrodes Tx on the base substrate 101 coincides with the orthographic projection of the first power signal line VCC1 on the base substrate 101. Exemplarily, each touch sensing electrode Rx is strip-shaped and extends along a first direction Y, with adjacent touch sensing electrodes Rx arranged at intervals along a second direction X. Each touch driving electrode Tx is strip-shaped and extends along the second direction X, with adjacent touch driving electrodes Tx arranged at intervals along the first direction Y. The touch drive electrodes Tx and the touch sensing electrodes Rx may both be made of copper, for example. As shown in Figures 18 to 20 , the orthographic projection of the touch drive electrodes Tx on the substrate 101 coincides with the orthographic projections of the first fixed potential signal line VR, the second fixed potential signal line VGB, the second power signal line VCC2, and other second signal lines on the substrate 101. The orthographic projection of the touch sensing electrodes Rx on the substrate 101 coincides with the orthographic projection of the first power signal line VCC1 on the substrate 101. Exemplarily, each touch drive electrode Tx is strip-shaped and extends along a first direction Y, with adjacent touch drive electrodes Tx spaced apart along a second direction X. Each touch sensing electrode Rx is strip-shaped and extends along the second direction X, with adjacent touch sensing electrodes Rx spaced apart along the first direction Y. Both the touch drive electrodes Tx and the touch sensing electrodes Rx may be made of copper, for example.

[0078] It should be noted that in the embodiments provided in the present disclosure, due to the limitations of process conditions or the influence of other factors such as measurement, the "overlap" may be exactly overlapping, or there may be some deviations (for example, a deviation of ±2μm). Therefore, as long as the "overlap" relationship between related features meets the error allowance, it falls within the scope of protection of the present disclosure.

[0079] In some embodiments, to reduce the impact on transmittance, at least one of the touch drive electrodes Tx and the touch sensing electrodes Rx can be arranged in a grid structure. Optionally, to reduce the probability of wire breakage, the grid structure has a line width of 2μm to 5μm, such as 2μm, 3μm, 4μm, 5μm, etc., and a line spacing of 150μm to 600μm, such as 150μm, 200μm, 250μm, 300μm, 350μm, 400μm, 450μm, 500μm, 550μm, 600μm, etc.

[0080] In some embodiments, the wiring substrate provided by the present disclosure can be applied to the field of transparent displays. In Figures 1, 4, 9, 12, 15, and 18, 2*2 pixel areas are separated by dotted lines. When the touch electrode 103 is not provided, within a pixel area, the wiring (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, the common potential signal line GND, the data signal line D, the first power signal line VCC1, the second power signal line VCC2), the connecting line 106, the connecting electrode area 102, and the pad area 102' are opaque areas, and the rest are translucent areas. The area ratio of the opaque area to the translucent area is in the range of 25:75 to 35:65 (e.g., 30:70). In the present disclosure, since the touch electrodes 103 adopt a metal grid structure, the transmittance of the area where the single-layer touch electrodes 103 are located is in the range of 92% to 98% (for example, 95%); preferably, one of the touch electrodes 103 (for example, the touch drive electrode Tx) is multiplexed with a certain routing line (for example, the data signal line D), or the orthographic projection of at least one of the touch electrodes 103 (for example, the touch drive electrode Tx and / or the touch sensing electrode Rx) coincides with the routing line (for example, the first fixed potential signal line VR, the second fixed potential signal line VGB, the first power signal line VCC1, and the second power signal line VCC2), which can better ensure that the entire wiring substrate has good transmittance and can achieve a display effect with high transparency.

[0081] Based on the same inventive concept, the embodiments of the present disclosure further provide a backplane, as shown in FIG1 , comprising the aforementioned wiring substrate provided in the embodiments of the present disclosure and a plurality of component groups 104, wherein the plurality of component groups 104 are electrically connected to a plurality of connection electrode regions 102. Since the principles for solving the problems of the backplane are similar to those for solving the problems of the aforementioned wiring substrate, the implementation of the backplane can refer to the embodiments of the aforementioned wiring substrate, and any repetitions will not be repeated.

[0082] Based on the same inventive concept, embodiments of the present disclosure further provide a light-emitting device, comprising the aforementioned backplane provided in embodiments of the present disclosure, wherein the element group includes at least one light-emitting element, and the connection electrode region includes at least one connection electrode group. Optionally, one light-emitting element is connected to one connection electrode group. Because the principles for solving the problem solved by this light-emitting device are similar to those for solving the problem solved by the aforementioned wiring substrate, the implementation of this light-emitting device can be referred to the embodiments of the aforementioned wiring substrate, and any repetitions will not be repeated here.

[0083] In some embodiments, the light-emitting device can be any product or component with a display function, such as a projector, a 3D printer, a virtual reality device, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a smart watch, a fitness wristband, a personal digital assistant, etc. The display device includes, but is not limited to, components such as a radio frequency unit, a network module, an audio output & input unit, a sensor, a display unit, a user input unit, an interface unit, and a control chip. Optionally, the control chip is a central processing unit, a digital signal processor, a system-on-chip (SoC), etc. For example, the control chip may also include a memory, a power module, etc., and realize power supply and signal input and output functions through additionally provided wires, signal lines, etc. For example, the control chip may also include hardware circuits and computer executable code, etc. The hardware circuit may include conventional very large scale integration (VLSI) circuits or gate arrays and existing semiconductors or other discrete components such as logic chips and transistors; the hardware circuit may also include field programmable gate arrays, programmable array logic, programmable logic devices, etc. In addition, those skilled in the art will understand that the above structure does not constitute a limitation on the above display device provided in the embodiment of the present disclosure. In other words, the above display device provided in the embodiment of the present disclosure may include more or fewer of the above components, or a combination of certain components, or different component arrangements.

[0084] Although the present disclosure has described preferred embodiments, it should be understood that those skilled in the art may make various changes and modifications to the embodiments without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations.

Claims

1. A wiring substrate, wherein: include: substrate substrate; A plurality of connection electrode regions are arranged in an array on the substrate; A plurality of touch electrodes, wherein the orthographic projections of the plurality of touch electrodes on the base substrate do not overlap with the orthographic projections of the plurality of connection electrode regions on the base substrate.

2. The wiring substrate according to claim 1, wherein: Some of the touch electrodes are arranged in the same layer as the plurality of connection electrode areas.

3. The wiring substrate according to claim 2, wherein: Also includes: A plurality of first signal lines are arranged in the same layer as the part of the touch electrodes, and the part of the touch electrodes are arranged in the gaps between the first signal lines.

4. The wiring substrate according to claim 2 or 3, wherein: Also includes: A plurality of second signal lines located between the substrate and the layer where the plurality of connection electrode regions are located; The remaining touch electrodes are arranged in the same layer as the plurality of second signal lines, and the remaining touch electrodes are located in the gaps between the second signal lines.

5. The wiring substrate according to claim 2 or 3, wherein: Also includes: A plurality of data signal lines located between the substrate and the layer where the plurality of connection electrode regions are located; The remaining touch electrodes are multiplexed with the plurality of data signal lines.

6. The wiring substrate according to claim 2 or 3, wherein: Also includes: A plurality of second signal lines located between the substrate and the layer where the plurality of connection electrode regions are located; The remaining touch electrodes are located on a side of the layer where the multiple connection electrode regions are located away from the base substrate, and the orthographic projections of the remaining touch electrodes on the base substrate coincide with the orthographic projections of the second signal lines on the base substrate.

7. The wiring substrate according to claim 1, wherein: Also includes: a plurality of first signal lines disposed on the same layer as the plurality of connection electrode regions, and a plurality of second signal lines located between the substrate and the layer where the plurality of connection electrode regions are located; Some of the touch electrodes and the remaining touch electrodes are cross-arranged in different layers on a side of the layer where the multiple connecting electrode areas are located away from the base substrate, and one of the orthographic projections of some of the touch electrodes and the orthographic projections of the remaining touch electrodes on the base substrate coincides with the orthographic projections of the multiple first signal lines on the base substrate, and the other coincides with the orthographic projections of the multiple second signal lines on the base substrate.

8. The wiring substrate according to any one of claims 1 to 3 and 7, wherein: The plurality of touch electrodes include a plurality of touch driving electrodes and a plurality of touch sensing electrodes. The layer where the plurality of touch sensing electrodes are located is located on a side of the layer where the plurality of touch driving electrodes are located away from the base substrate.

9. The wiring substrate according to claim 8, wherein: At least one of the touch driving electrodes and the touch sensing electrodes has a grid structure.

10. The wiring substrate according to claim 9, wherein: The line width of the grid structure is 2 μm to 5 μm, and the line spacing is 150 μm to 600 μm.

11. The wiring substrate according to any one of claims 1 to 3, 7, 9, and 10, wherein: The base substrate is a transparent substrate.

12. A back plate, wherein: The invention comprises the wiring substrate according to any one of claims 1 to 11 and a plurality of component groups, wherein the plurality of component groups are electrically connected to the plurality of connection electrode regions.

13. A light emitting device, wherein: Comprising the backplane as described in claim 12, the element group comprises at least one light-emitting element, the connecting electrode area comprises at least one connecting electrode group, and the at least one light-emitting element is connected to the at least one connecting electrode group.

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