Cooking apparatus

Abstract

The present invention relates to a cooking apparatus in which the heating efficiency and power efficiency of a heating coil can be improved by arranging an external insulating material outside an insulating material accommodating the heating coil and arranging a reflector, which reflects radiant heat generated in the heating coil toward a top plate, in an internal accommodation space of the insulating material.

Description

Cooking appliances

[0001] The present invention relates to a cooking appliance, and more particularly, to a cooking appliance in which a temperature sensor is mounted on a coil circuit board module on which a working coil pattern is formed, thereby preventing deterioration in space utilization due to the addition of a temperature sensor, and in which manufacturing cost and manufacturing time can be minimized as the temperature sensor is formed integrally on the coil circuit board module.

[0002]

[0003] Cooking appliances are a type of home appliance used for cooking food. They are installed in kitchens and cook food according to the user's preferences. These cooking appliances can be categorized in various ways based on the heat source, form, or type of fuel used.

[0004] Cooking appliances can be categorized by their cooking method. They can be categorized into open and closed types, based on the space in which the food is placed. Closed types include ovens and microwave ovens, while open types include cooktops and hobs.

[0005] Among open cooking appliances, a cooktop may be provided with at least one burner to heat a food item contained in a cooking vessel.

[0006] These cooktops may be provided with an electric burner or with a gas burner.

[0007] Additionally, the cooktop may be implemented as a standalone unit or as an oven range that includes an oven beneath the cooktop.

[0008] An example of a cooktop with an electric burner is an induction cooker.

[0009] An induction cooking appliance is a cooking device that performs cooking functions using induction heating. In an induction cooking appliance, when high-frequency power is applied to a working coil, a magnetic field can be formed around the working coil.

[0010] Eddy currents are generated in the magnetic cooking container due to the generated magnetic field, and food can be cooked by the cooking container that is heated by acting as resistance to these eddy currents.

[0011] These induction cookers do not require gas combustion and therefore do not produce exhaust gases. Furthermore, by generating heat immediately within the container itself, induction cookers minimize heat transfer through radiation or conduction, allowing for rapid heating of food.

[0012] A conventional induction heating cooktop is configured to form individual burners by twisting a plurality of Litz wires to form a working coil and winding the working coil in a spiral shape in multiple layers.

[0013] At this time, each crater must be equipped with a coil frame to maintain and support the winding shape of the working coil.

[0014] Therefore, the vertical size of each burner, which is the sum of the vertical size of the working coil wound in a multi-layer structure and the vertical size of the coil frame, cannot help but occupy a considerably large proportion of the vertical size of the entire cooktop.

[0015] Due to the limitations in the size of the individual burners that make up a cooktop like this, conventional cooktops inevitably had limitations in increasing the output of each burner.

[0016] In addition, when constructing a cooktop with multiple burners, conventional cooktops have spatial limitations in that there is very little space for installing other components or parts, and therefore the total number of burners that can be installed on the cooktop is inevitably very limited.

[0017] As an alternative to the Litz wire-type working coil, a technology for a cooktop has been developed that forms a burner by forming the working coil in a spiral multilayer pattern on a printed circuit board. (Prior Document 001, Design and Optimization of Small Inductors on Extra-Thin PCB for Flexible Cooking Surfaces / IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, VOL. 53, NO. 1, JANUARY / FEBRUARY 2017)

[0018] The cooktop disclosed in prior art document 001 can be configured to form a burner by forming a single or multiple layer working coil pattern wound in a spiral shape on a single printed circuit board.

[0019] In this way, the cooktop disclosed in prior art document 001 has the advantage that the vertical size of the cooktop can be significantly reduced compared to a conventional cooktop since the working coil patterns forming the burner are integrally formed on a single printed circuit board, thereby improving vertical space utilization, and the number of burners can be significantly increased compared to a conventional cooktop, thereby improving horizontal space utilization.

[0020]

[0021] The cooktop disclosed in the aforementioned prior art document 001 has a problem in that the temperature sensor for detecting the temperature of the container or the temperature of the top plate on which the container is placed is not provided on the printed circuit board on which the working coil pattern is formed, and thus the temperature of the container or the top plate cannot be effectively detected.

[0022] In addition, the cooktop disclosed in prior art document 001 has a problem in that, if a temperature sensor is to be placed at a location other than the printed circuit board where the working coil pattern is formed, additional space must be secured between the printed circuit board and the top plate for the temperature sensor to be installed.

[0023] In addition, the cooktop disclosed in prior art document 001 has the problem that, when a temperature sensor is installed separately, an additional structure for fixing the temperature sensor and additional wiring for electrically connecting the temperature sensor to the control board circuit must be secured.

[0024] In addition, the cooktop disclosed in prior art document 001 has a problem in that manufacturing costs and manufacturing time may increase because, when a temperature sensor is installed separately, a process for placing the temperature sensor on the cooktop must be added.

[0025] The present invention has been devised to solve the problems of the prior art, and the first object of the present invention is to provide a cooking appliance in which a temperature sensor is mounted on a coil circuit board module on which a working coil pattern is formed, thereby preventing deterioration in space utilization due to the addition of a temperature sensor, and in which manufacturing cost and manufacturing time can be minimized as the temperature sensor is formed integrally on the coil circuit board module.

[0026] In addition, the present invention is configured to place a temperature sensor in a central inner region where a sensing coil pattern is not formed, which is formed on a coil circuit board module and detects whether a container is placed, thereby improving the usability of the substrate region of the coil circuit board module by utilizing the central inner region, which could be a meaningless dummy region, as an installation space for the temperature sensor, thereby providing a cooking appliance.

[0027] In addition, the present invention has a third object to provide a cooking appliance in which a pair of electrodes of a temperature sensor and a pair of sensor pads provided on a coil circuit board module, to which the pair of electrodes are connected, are spaced apart from each other so as to have a directionality that is parallel to or intersects with the direction of travel of a working coil pattern, thereby effectively preventing a lead pattern that transmits an output signal generated from a temperature sensor from interfering with the working coil pattern.

[0028] In addition, the present invention provides a cooking appliance in which the temperature sensor is mounted on the coil circuit board module while the sensor body of the temperature sensor is separated from the coil circuit board module, thereby minimizing the heat generated from the working coil pattern from being conducted to the temperature sensor, thereby improving the accuracy of temperature detection for a container or a top plate.

[0029] The objectives of the present invention are not limited to those mentioned above. Other objectives and advantages of the present invention not mentioned above can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the objectives and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0030]

[0031] A cooking appliance according to the present invention comprises: a top plate on which a container is placed; a temperature sensor for detecting the temperature of the top plate; and a coil circuit board module having a working coil pattern formed by being spirally wound to generate a magnetic field and a sensing coil pattern formed by being spirally wound to detect whether the container is placed; wherein the temperature sensor is characterized in that it is arranged on the coil circuit board module in a state surrounded by the sensing coil pattern when viewed from the top plate.

[0032] Additionally, the temperature sensor may be positioned so as not to overlap with the sensing coil pattern and the working coil pattern.

[0033] Additionally, the sensing coil pattern may be formed with a central inner region where no pattern is formed on the inside, and the temperature sensor may be positioned to belong to the central inner region.

[0034] In addition, the temperature sensor includes a sensing chip that outputs an output signal related to the detected temperature; a sensor body that accommodates the sensing chip therein; and a first electrode and a second electrode that are spaced apart from each other with the sensor body interposed therebetween and are electrically connected to the sensing chip; and the coil circuit board module has a rectangular plate shape, and the direction in which the first electrode and the second electrode are spaced apart from each other may be parallel to or intersect with the extension direction of the outer edge of the coil circuit board module.

[0035] In addition, the coil circuit board module has a pair of sensor pads that are electrically connected to the first electrode and the second electrode and are arranged spaced apart from each other with the sensor body therebetween, and the direction in which the pair of sensor pads are arranged spaced apart from each other may be parallel to or intersect with the extension direction of the outer edge of the coil circuit board module.

[0036] In addition, the temperature sensor includes a sensing chip that outputs an output signal related to a sensed temperature; a sensor body that accommodates the sensing chip therein; and first and second electrodes that are spaced apart from each other with the sensor body interposed therebetween and electrically connected to the sensing chip; and the temperature sensor can be mounted on the coil circuit board module in a state where the sensor body is separated from the coil circuit board module.

[0037] In addition, a concave groove is formed on the upper surface of the coil circuit board module, which is disposed below the sensor body and is formed by being sunken in a direction away from the sensor body, and the sensor body can be at least partially separated from the coil circuit board module by the concave groove.

[0038] Additionally, the longitudinal width of the sensor body may be smaller than the longitudinal width of the concave groove, and the transverse width of the sensor body may be smaller than the transverse width of the concave groove.

[0039] Additionally, the depth of the concave groove may be less than or equal to half the vertical thickness of the coil circuit board module.

[0040] In addition, the coil circuit board module may include a pair of sensor pads electrically connected to the first electrode and the second electrode and spaced apart from each other with the sensor body interposed therebetween, and the pair of sensor pads may be arranged on the coil circuit board module such that a predetermined longitudinal gap is formed from each of the concave grooves.

[0041] In addition, the coil circuit board module further includes a through hole formed penetrating from the lower surface of the concave groove to the lower surface of the coil circuit board module, and a horizontal cross-sectional area of ​​the through hole may be smaller than the horizontal cross-sectional area of ​​the concave groove.

[0042] In addition, the coil circuit board module is provided with a through hole formed to penetrate from the upper surface to the lower surface of the coil circuit board module and is disposed below the sensor body, and the sensor body can be entirely separated from the coil circuit board module by the through hole.

[0043] Additionally, the longitudinal width of the sensor body may be smaller than the longitudinal width of the through hole, and the transverse width of the sensor body may be smaller than the transverse width of the through hole.

[0044] Additionally, an insulating material may be provided on the upper surface of the coil circuit board module to completely separate the sensor body from the upper surface of the coil circuit board module.

[0045] In addition, the first electrode and the second electrode each have a protrusion arranged parallel to the upper surface of the coil circuit board module, and when the temperature sensor is mounted on the upper surface of the coil circuit board module, the sensor body can be separated from the upper surface of the coil circuit board module by the protrusion.

[0046] Additionally, a separation gap is formed between the sensor body and the upper surface of the coil circuit board module, and the vertical height of the separation gap may be greater than or equal to the vertical thickness of the protrusion.

[0047] Additionally, the protrusion of the first electrode and the protrusion of the second electrode may each extend in a direction away from the sensor body.

[0048] Additionally, the protrusion of the first electrode and the protrusion of the second electrode may each extend in a direction toward the sensor body.

[0049] In addition, the temperature sensor includes a sensing chip that outputs an output signal related to the detected temperature; a sensor body that accommodates the sensing chip therein; and a first electrode and a second electrode that are spaced apart from each other with the sensor body interposed therebetween and are electrically connected to the sensing chip; and a through slit may be formed in the coil circuit board module at a position that does not overlap the sensor body, the first electrode, and the second electrode in the vertical direction and that penetrates from the upper surface to the lower surface of the coil circuit board module.

[0050] In addition, the through slits are provided in a pair, and the pair of through slits can be arranged on the coil circuit board module spaced apart from each other with the sensor body interposed therebetween.

[0051]

[0052] The present invention is configured so that a temperature sensor is mounted on a coil circuit board module on which a working coil pattern is formed, thereby preventing deterioration in space utilization due to the addition of a temperature sensor, and has the effect of minimizing manufacturing cost and manufacturing time as the temperature sensor is formed integrally on the coil circuit board module.

[0053] In addition, the present invention has the effect of improving the usability of the substrate area of ​​the coil circuit board module by configuring a temperature sensor to be placed in a central inner area where a sensing coil pattern is not formed, inside a sensing coil pattern formed on a coil circuit board module and detecting whether a container is seated, thereby utilizing the central inner area, which could be a meaningless dummy area, as an installation space for the temperature sensor.

[0054] In addition, the present invention has an effect of effectively preventing a lead pattern transmitting an output signal generated from a temperature sensor from interfering with the working coil pattern by arranging a pair of electrodes of a temperature sensor and a pair of sensor pads to which the pair of electrodes are connected and provided on a coil circuit board module so as to have a directionality that is parallel to or intersects with the direction of travel of a working coil pattern.

[0055] In addition, the present invention has the effect of improving the accuracy of temperature detection for a container or top plate by configuring the temperature sensor to be mounted on the coil circuit board module while the sensor body of the temperature sensor is separated from the coil circuit board module, thereby minimizing the heat generated from the working coil pattern from being conducted to the temperature sensor.

[0056] In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention.

[0057]

[0058] Figure 1 is a front perspective view of a cooking appliance according to one embodiment of the present invention.

[0059] Fig. 2 is a plan view of the cooking appliance illustrated in Fig. 1, showing a state in which the indicator line is lit.

[0060] Figure 3 is a perspective view of the cooking appliance illustrated in Figure 1.

[0061] Figure 4 is an exploded perspective view of the cooktop of the cooking appliance illustrated in Figure 1.

[0062] Figure 5 is a partially enlarged view of Figure 4.

[0063] Figure 6 is a plan view of the cooktop illustrated in Figure 4, and is a view looking down at the top plate.

[0064] FIG. 7 is a schematic cross-sectional view for explaining the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0065] FIG. 8 is a plan view of the first layer constituting the layered structure of the first coil circuit board module illustrated in FIG. 4, and FIG. 9 is a partial enlarged view of FIG. 8.

[0066] Fig. 10 is a plan view of the second layer constituting the layered structure of the first coil circuit board module illustrated in Fig. 4.

[0067] Figure 11 is a partial enlarged view of Figure 8, showing patterns formed in the first to twelfth layers.

[0068] FIG. 12 is a plan view of the third to seventh layers constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0069] FIG. 13 is a plan view of the 8th to 12th layers constituting the layered structure of the first coil circuit board module illustrated in FIG. 4.

[0070] Fig. 14(a) is a plan view illustrating a part of the first type pattern illustrated in Fig. 12, and Fig. 14(b) is a plan view illustrating a part of the second type pattern illustrated in Fig. 13.

[0071] Figure 15(a) is a partial enlarged view of Figure 14(a), and Figure 15(b) is a partial enlarged view of Figure 14(b).

[0072] FIG. 16 is a schematic cross-sectional view for explaining a structure in which the first type pattern constituting the third to seventh layers shown in FIG. 4 and the second type pattern constituting the eighth to twelfth layers are collectively connected through working coil via holes.

[0073] Fig. 17(a) is a partial enlarged view of Fig. 14(a), and Fig. 17(b) is a partial enlarged view of Fig. 14(b), which are partial enlarged views for explaining the common terminal of the first type pattern and the common terminal of the second type pattern, respectively.

[0074] Fig. 18 is a schematic cross-sectional view illustrating a state in which a temperature sensor is mounted on a first coil circuit board module with the sensor body of the temperature sensor in contact with the upper surface of the first coil circuit board module.

[0075] Figure 19 is a time-temperature graph for explaining the temperature change trend measured when the sensor body of the temperature sensor is in contact with the upper surface of the first coil circuit board module.

[0076] FIG. 20 is a schematic cross-sectional view illustrating a state in which a temperature sensor is mounted on a first coil circuit board module in a state in which the sensor body of the temperature sensor is separated from the upper surface of the first coil circuit board module through a concave portion formed on the upper surface of the first coil circuit board module according to the first embodiment of the present invention.

[0077] Figure 21 is a time-temperature graph for explaining the temperature change trend measured when the sensor body of the temperature sensor is separated from the upper surface of the first coil circuit board module.

[0078] FIG. 22 is a schematic cross-sectional view illustrating a configuration in which a through hole is added to a concave portion formed on the upper surface of a first coil circuit board module according to a second embodiment of the present invention.

[0079] FIG. 23 is a schematic cross-sectional view illustrating a state in which a temperature sensor is mounted on a first coil circuit board module in a state in which the sensor body of the temperature sensor is separated from the upper surface of the first coil circuit board module through a through hole formed on the upper surface of the first coil circuit board module according to a third embodiment of the present invention.

[0080] FIG. 24 is a schematic cross-sectional view illustrating a state in which a temperature sensor is mounted on a first coil circuit board module in a state in which the sensor body of the temperature sensor is separated from the upper surface of the first coil circuit board module through an additional insulating material provided on the upper surface of the first coil circuit board module according to a fourth embodiment of the present invention.

[0081] FIG. 25 and FIG. 26 are schematic cross-sectional views illustrating a state in which a temperature sensor is mounted on a first coil circuit board module in a state in which the sensor body of the temperature sensor is separated from the upper surface of the first coil circuit board module through an extension portion of a pair of electrode portions provided in the temperature sensor according to a fifth embodiment of the present invention.

[0082] FIG. 27 and FIG. 28 are schematic cross-sectional views and plan views for explaining a state in which a through slit is provided in a first coil circuit board module according to a sixth embodiment of the present invention.

[0083]

[0084] The above-described objects, features, and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can easily practice the technical idea of ​​the present invention. In describing the present invention, if it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0085] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a "first" component may also be a "second" component.

[0086] Throughout the specification, unless otherwise specifically stated, each element may be singular or plural.

[0087] Hereinafter, the phrase "any configuration is placed on (or below)" a component or "on (or below)" a component may mean that any configuration is placed in contact with the upper surface (or lower surface) of said component, and that other configurations may be interposed between said component and any configuration placed on (or below) said component.

[0088] Additionally, when it is described that a component is "connected," "coupled," or "connected" to another component, it should be understood that the components may be directly connected or connected to one another, but that other components may also be "interposed" between the components, or that each component may be "connected," "coupled," or "connected" through another component.

[0089] As used herein, singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consisting of" or "comprising" should not necessarily be construed to include all of the components or steps described in the specification, and should be construed to mean that some of the components or steps may not be included, or that additional components or steps may be included.

[0090] Additionally, the singular expressions used herein include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "consist of" or "comprises" should not be construed to necessarily include all of the various components or various steps described in the specification, and should be construed to mean that some of the components or some of the steps may not be included, or that additional components or steps may be included.

[0091] Throughout the specification, when we refer to "A and / or B", this means A, B, or A and B, unless otherwise stated, and when we refer to "C through D", this means C or more and D or less, unless otherwise stated.

[0092] [Overall structure of the cooking appliance]

[0093] Hereinafter, the overall structure of a cooking appliance (1) according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

[0094] FIG. 1 is a perspective view showing a cooking appliance (1) according to one embodiment of the present invention, and FIG. 2 is a plan view of a cooktop (20) constituting the cooking appliance (1) shown in FIG. 1 as viewed from above.

[0095] Referring to FIGS. 1 to 3, a cooking appliance (1) according to one embodiment of the present invention may be configured to include a cooktop (20) and an oven section (10) disposed below the cooktop (20).

[0096] In this way, the cooking appliance (1) according to the embodiment of the present invention may be an oven range type in which a cooktop (20) is arranged on the upper side and an oven section (10) is arranged on the lower side. However, the present invention is not limited thereto, and may be configured as a cooking appliance (1) in which a cooktop (20) is provided alone. Hereinafter, a cooking appliance (1) configured as an oven range type as illustrated will be described as an example.

[0097] The cooking appliance (1) of the embodiment of the present invention can provide both the function of an oven, which is a closed cooking means, and the function of a cooktop, which is an open means, by being provided in the form of an oven range.

[0098] A cooking chamber may be formed inside an oven section (10) that serves as a sealed cooking device. In the oven section (10), food may be cooked as the interior of the cooking chamber is heated.

[0099] For this purpose, although not shown, the oven section (10) may be equipped with a heating unit that heats the interior of the cooking chamber. The heating unit may be a heating device that uses gas fuel or electricity.

[0100] The oven section (10) of the cooking appliance (1) may be provided with a rotatably-mounted door (11) that selectively opens and closes the cooking chamber.

[0101] For example, the door (11) may be provided in the oven section (10) in a form that opens and closes the cooking chamber in a pull-down manner in which the upper part rotates in the up-and-down direction with the lower part as the center.

[0102] A control panel (30) for operating the oven section (10) and cooktop (20) may be provided on the upper front surface of the cooking appliance (1).

[0103] As it is placed on the front surface of the cooking appliance (1), the control panel (30) can form a part of the front surface appearance of the cooking appliance (1).

[0104] Such a control panel (30) may be provided with multiple switches for controlling the operation of the cooking appliance (1) and a display (31) for displaying the operating status of the cooking appliance (1).

[0105] In addition, as illustrated, a plurality of knobs (32) may be further provided on the control panel (30) of the cooking appliance (1). That is, the control panel (30) provided on the upper front surface of the cooking appliance (1) may be provided with a plurality of knobs (32) for controlling the operation of the cooking appliance (1) together with a display (31).

[0106] Each knob (32) may be provided in a form that can be rotated. These knobs (32) may be provided so that either one of the oven section (10) and the cooktop (20) can be operated, or they may be provided so that both the oven section (10) and the cooktop (20) can be operated.

[0107] By operating the knob provided as described above, one of a number of preset cooking modes can be selected, or a heating temperature or heating stage can be selected.

[0108] In addition, the control panel (30) of the cooking appliance (1) according to the present embodiment may further include a knob ring (33). The knob ring (33) may be positioned radially outside the knob (32). For example, the knob ring (33) may be provided in a ring shape that surrounds the knob (32) radially outside.

[0109] The knob ring (33) can play a role in supporting the knob (32) and in finishing the outer appearance of the knob (32) to improve the outer appearance quality of the cooking appliance (1).

[0110] In addition, the knob ring (33) of this embodiment can simultaneously serve as a timer operation switch and a function of indicating the timer time and the intensity of the fire.

[0111] The knob ring (33) is installed so as to be independently rotatable relative to the knob (32), and the timer time can be set through the rotation operation of the knob ring (33) installed in this manner.

[0112] Meanwhile, as described above, a cooktop (20) may be placed on the upper side of the oven section (10).

[0113] The cooktop (20) is installed on the upper surface of the cooktop (20) and can perform the function of heating food or a container containing food.

[0114] For this purpose, the cooktop (20) may include a top plate (21) that forms the upper surface of the cooktop (20) and on which a container containing food is placed.

[0115] Additionally, a heating unit for heating a container containing food may be provided inside the cooktop (20) below the top plate (21).

[0116] The heating unit may be configured to include at least one burner. For example, the burner constituting the heating unit may be provided in the form of a working coil that converts supplied electric power into magnetic power or a heating coil that converts supplied electric power into thermal energy.

[0117] The cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be equipped with an induction heating method.

[0118] To this end, the burner of the cooktop (20) may be configured to include a working coil. The burner including the working coil in this way can generate a strong magnetic field by being operated by a high-frequency current generated and supplied by an inverter.

[0119] In this way, the magnetic field generated from the burner including the working coil generates an eddy current in a container containing a metal component, and as the eddy current flows in the container, heat is generated, which can heat the container, and as the container is heated, food contained in the container can be heated.

[0120] However, the working coil applied to conventional induction heating cooktops was generally formed by twisting a number of electrically conductive wires to form a cable and winding the cable in a spiral shape.

[0121] However, as described later, the working coil constituting the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be configured as a plurality of patterns formed by being spirally stacked on a printed circuit board.

[0122] As such, the working coil of the cooking device (1) according to the present invention may be referred to as a working coil pattern since it has a structure formed by laminating on a printed circuit board.

[0123] The detailed configuration of the heating unit having a working coil pattern is described below with reference to Fig. 3 and below.

[0124] [Overall composition of the cooktop]

[0125] The configuration of a cooktop (20) constituting a cooking appliance (1) according to one embodiment of the present invention will be described with reference to FIGS. 3 to 5 below.

[0126] Fig. 3 is a plan view of the cooktop (20) viewed from the top with the indicator line (L) lit, Fig. 4 is an exploded perspective view of the cooktop (20) shown in Fig. 3, and Fig. 5 is a plan view of the inside of the cooktop (20) shown in Fig. 3.

[0127] First, referring to FIGS. 3 and 4, similar to the oven section (10) described above, the cooktop (20) according to the present embodiment may be equipped with a control panel (22).

[0128] As shown, the control panel (22) of the cooktop (20) is placed on the top plate (21), but may be placed in a position tilted toward the front for the convenience of the user.

[0129] This control panel (22) may be equipped with various switches for controlling the operation of the cooktop (20) and a display panel (221) for displaying the operating status of the cooktop (20).

[0130] As described below, when it is detected that a container is placed on the upper surface (21a) of the top plate (21) through the sensing coil pattern (2514), an icon corresponding to the container may be displayed on the display panel (221) of the control panel (22) provided on the cooktop (20). For example, the icon may be provided in a form corresponding to the size and shape of the container, and may be positioned on the display panel (221) corresponding to the position of the cooking appliance (1).

[0131] The user can select a container that is the target of the icon by pressing the displayed icon, and perform an operation to control the operation of the cooking appliance (1) with respect to the selected container.

[0132] For example, a user can select a container to be manipulated by pressing an icon, and then select a desired heating temperature for that container.

[0133] When heating of the container is started through the operation of the control panel (22) in this way, as shown in Fig. 3, the start of heating of the container can be indicated on the top plate (21) through the indication line (L).

[0134] As shown in Fig. 3, a plurality of display lines (L) may be provided on the top plate (21) of the cooktop (20).

[0135] The display line (L) can visually convey information related to the location of the container, the heating status of the container, temperature, etc. to the user by displaying the information in the form of a light-emitting area on the top plate (21).

[0136] FIG. 3 illustrates an embodiment in which a total of seven display lines (L) are provided. These display lines (L) may be conveniently referred to as first to seventh display lines (L1, L2, L3, L4, L5, L6, L7) from the left side based on the top plate (21). The present invention is not limited thereto, but for convenience, the following description will be based on an embodiment in which a total of seven display lines (L) are provided as illustrated.

[0137] These indicator lines (L) can be a light-emitting area formed such that the width in the left-right direction is much smaller than the width in the front-back direction, as shown.

[0138] In order for each display line (L) to be formed in the form of a light-emitting area, the display line (L) can be implemented by a light source module (23) placed on a substrate supporter (26) described below, below the top plate (21).

[0139] The light source module (23) can be configured to include a plurality of light source elements (231) that generate visible light and a light source circuit board (232) on which the plurality of light source elements (231) are mounted.

[0140] A plurality of light source elements (231) can be arranged to irradiate visible light toward the lower surface of the top plate (21), and the incident visible light can be irradiated to the lower surface of the top plate (21) by passing through a light transmitting hole formed through the substrate supporter (26), a light transmitting slit hole (H_sl) formed in each coil circuit board module constituting the heating unit (25), and a gap formed between adjacent coil circuit board modules, as described later.

[0141] The light source module (23) may be configured to include a plurality of light source elements (231) that receive power and generate visible light, and a light source circuit board (232) on which the plurality of light source elements (231) are mounted.

[0142] The light source element (231) may be applied without limitation to any means capable of receiving power and generating a predetermined amount of visible light, and may be, for example, an LED element. The present invention is not limited thereto, but the following description will be based on an embodiment in which an LED element is applied as the light source element (231).

[0143] As shown, in correspondence with each linearly extending display line (L), each light source circuit board (232) can be linearly extended along the front-back direction, and on each light source circuit board (232), a plurality of light source elements (231) can be linearly arranged and placed so as to have equal or unequal intervals along the front-back direction.

[0144] In addition, as described above, a plurality of light source modules (23) may be provided so that visible light can be independently irradiated to the first to seventh display lines (L1, L2, L3, L4, L5, L6, L7), and these plurality of light source modules (23) may be conveniently referred to as the first to seventh light source modules (23a, 23b, 23c, 23d, 23e, 23f, 23g) from the left with respect to the top plate (21).

[0145] Corresponding to the first to seventh display lines (L1, L2, L3, L4, L5, L6, L7), the first to seventh light source modules (23a, 23b, 23c, 23d, 23e, 23f, 23g) can be spaced apart from each other in the left-right direction at a predetermined interval.

[0146] As described below, the spacing between adjacent display lines (L) and the spacing between adjacent light source modules (23) can be formed to have a width equal to or slightly larger than the left-right width of the working coil pattern (2512) constituting the heating unit (25).

[0147] Meanwhile, as illustrated, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may include a bottom case (24) that forms the front side, the rear side, the front side, both sides, and the lower side of the exterior of the cooktop (20).

[0148] The bottom case (24) can be formed with the upper surface entirely open, and the top plate (21) described above can be combined to the open upper surface.

[0149] As shown in Fig. 3, a fastening bracket (211) for coupling to a bottom case (24) may be provided on the lower surface of the top plate (21) at a position corresponding to the upper end of the bottom case (24).

[0150] As the top plate (21) is connected to the upper side of the bottom case (24) in this way, the internal space surrounded by the top plate (21) and the bottom case (24) can accommodate a number of internal components that constitute the cooktop (20).

[0151] Additionally, the bottom case (24) may be provided with a plurality of mount brackets (241) integrally or separately.

[0152] The mount bracket (241) is placed in the internal space of the cooktop (20) and can be formed to protrude upward from the lower surface of the mount bracket (241) toward the electrical components.

[0153] This mount bracket (241) can support various electrical components (28) constituting the cooktop (20) from the lower side, thereby limiting the occurrence of sagging of components such as the main circuit board (281), SMPS circuit board (282), inverter circuit board (283), resonant circuit board (284), EMI filter (285), etc., and supporting them.

[0154] In addition, as illustrated in FIG. 4, an intake hole (242) and an exhaust hole (243) can be formed in the vertical direction through which air can flow in and out for cooling various electrical components constituting the cooktop (20) on the lower surface (24a) of the bottom case (24).

[0155] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include a heating unit (25) having a working coil that heats a container by induction heating, and as described above, the working coil may be formed by a plurality of working coil patterns (2512) that are formed by being spirally stacked on a printed circuit board.

[0156] Considering that a plurality of working coil patterns (2512) are laminated in a plurality of layered structures to form a crater, a printed circuit board formed by laminating working coil patterns (2512) can be referred to as a coil circuit board module.

[0157] The coil circuit board module constituting the heating unit (25) may be provided in multiple units in consideration of manufacturing convenience and efficiency.

[0158] FIGS. 4 and 6 illustrate an embodiment of a cooktop (20) having a heating element (25) including a total of three coil circuit board modules. The present invention is not limited thereto, but will be described below based on an embodiment in which three coil circuit board modules are provided as illustrated.

[0159] The three coil circuit board modules (251, 252, 253) are referred to in order from the left as the first coil circuit board module (251), the second coil circuit board module (252), and the third coil circuit board module (253).

[0160] Each coil circuit board module (251, 252, 253) may be formed with a plurality of burners (2511) for heating the container.

[0161] FIG. 6 illustrates an embodiment in which the first coil circuit board module (251) and the third coil circuit board module (253) may each be provided with eight burners (2511), and the second coil circuit board module (252) may be provided with six burners (2511). As described below, the number of burners (2511) and the size of the burners (2511) may be set differently depending on the size and output of the cooktop (20). Hereinafter, an embodiment in which eight first coil circuit board modules (251) and the third coil circuit board module (253) are each provided with eight burners (2511), and the second coil circuit board module (252) is provided with six burners will be described as an example.

[0162] In addition, although the shape and size of each burner (2511) are shown as being the same in FIG. 6, this is merely exemplary, and similarly, the shape and size of the burner (2511) may be set differently depending on the size and output of the cooktop (20).

[0163] In each coil circuit board module (251, 252, 253), a working coil pattern (2512) forming a plurality of craters (2511) can be formed by stacking multiple layers.

[0164] Additionally, a sensing coil pattern (2514) may be laminated and formed on each coil circuit board module (251, 252, 253) as a means for detecting whether a container is seated at a specific location on the upper surface (21a) of the top plate (21).

[0165] Additionally, each coil circuit board module (251, 252, 253) may be equipped with a temperature sensor (2515) for detecting the temperature of each top plate (21).

[0166] At this time, as described later, the working coil pattern (2512), the sensing coil pattern (2514), and the temperature sensor (2515) can be provided in a form that is integrated into each coil circuit board module (251, 252, 253). Therefore, the heating unit (25) of the cooktop (20) according to the present invention can reduce the vertical size of the cooktop (20) as the vertical width of the heating unit (25) is significantly reduced compared to the conventional one, so that the space utilization can be significantly improved, and the manufacturing process of the cooktop (20) can be significantly simplified.

[0167] The working coil pattern (2512) and the sensing coil pattern (2514) may be provided in a form that extends in a spiral shape and is stacked in the vertical direction.

[0168] At this time, as described later, the first to third coil circuit board modules (251, 252, 253) may be formed in a form in which the working coil pattern (2512) is stacked in 10 to 12 layers and the sensing coil pattern (2514) is stacked in 2 layers in the vertical direction, respectively. Accordingly, each coil circuit board module (251, 252, 253) may have a layered structure having 12 to 14 layers.

[0169] Meanwhile, each sensing coil pattern may be placed inside an area occupied by a working coil pattern (2512) forming an individual crater (2511), or may be placed in an area between an adjacent pair of working coil patterns (2512).

[0170] In this embodiment, considering the efficiency and accuracy of container detection, a pair of sensing coil patterns (2514) may be placed inside the area occupied by each working coil pattern (2512), and a pair of sensing coil patterns (2514) may be placed in the area between adjacent pairs of working coil patterns (2512), as described below.

[0171] Meanwhile, a temperature sensor (2515) for detecting the temperature of the top plate (21) can be placed at the center of each sensing coil pattern (2514).

[0172] Details regarding the working coil pattern (2512), sensing coil pattern (2514), and temperature sensor (2515) constituting the first to third coil circuit board modules (251, 252, 253) are described below with reference to FIG. 7.

[0173] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include a substrate supporter (26).

[0174] The substrate supporter (26) is installed inside the cooktop (20) and serves to support the internal components.

[0175] More specifically, as illustrated in FIGS. 4 and 5, the first to third coil circuit board modules (251, 252, 253) and the ferrite core module (27) can be mounted on the upper side of the substrate supporter (26). Accordingly, the substrate supporter (26) functions as a coil base on which a conventional working coil and a ferrite core are mounted.

[0176] Additionally, as shown in FIGS. 4 and 5, several electrical components (28) constituting the cooktop (20) can be installed on the lower side of the substrate supporter (26).

[0177] These electrical components (28) may include a main circuit board (281), an SMPS circuit board (switching mode power supply, 282), an inverter circuit board (283), a resonant circuit board (284), an EMI filter (285), a blower fan module (286), a light source module (23), etc.

[0178] These electric components (28) can be placed in the space formed between the lower surface (24a) of the bottom case (24) and the substrate supporter (26) as the lower side of the substrate supporter (26).

[0179] For example, to effectively accommodate these components (28), the substrate supporter (26) may have an inverted box shape configured so that the lower surface facing the bottom case (24) is entirely open.

[0180] Accordingly, the main circuit board (281), SMPS circuit board (switching mode power supply, 282), inverter circuit board (283), resonant circuit board (284), EMI filter (285), blower fan module (286), and light source module (23) can be assembled to the substrate supporter (26) in a manner of being laminated in a receiving space formed inside the substrate supporter (26).

[0181] In this way, as the first to third coil circuit board modules (251, 252, 253) are mounted on the upper surface (21a) of the board supporter (26) and the electrical component (28) is mounted on the lower surface of the board supporter (26) as the interior of the board supporter (26), the wiring structure between the electrical component (28) and the wiring structure between the electrical component (28) and the first to third coil circuit board modules (251, 252, 253) can be significantly simplified and streamlined.

[0182] In particular, in the case of the conventional cooktop (20), it had a structure that required disassembly of almost all components in the reverse order of the assembly process in order to repair the inverter circuit board, which is the main cause of failure and malfunction.

[0183] In contrast, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention is configured so that the electrical components (28) such as the inverter circuit board (283) can be easily accessed by disassembling only the bottom case (24) while the bottom case (24) is turned over so that it faces upward, thereby having the effect of allowing easy repair or replacement of a faulty electrical component (28).

[0184] In this regard, the assembly process of the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention will be briefly described.

[0185] As shown in Fig. 5, first, a plurality of ferrite core modules (27) can be assembled on the upper surface (261) of the substrate supporter (26).

[0186] The ferrite core module (27) according to an embodiment of the present invention may be configured by combining multiple ferrite cores into a modular structure. This is in consideration of the possibility of cracking or magnetic field loss when a ferrite core is applied that is formed as a single body and has a relatively large volume.

[0187] By modularizing multiple ferrite cores in this way to form a ferrite core module (27) and installing it on a substrate supporter (26), the number of parts can be reduced and the assembly process can be simplified.

[0188] For example, the ferrite core module (27) can be manufactured by insert injection molding. By manufacturing the ferrite core module (27) by insert injection molding, a separate jig for fixing the ferrite core unit during assembly of the cooktop (20) as in the past can be omitted.

[0189] In addition, by modularizing the ferrite core in this way to form a plurality of ferrite core modules (27), it has the advantage of being able to be repaired by simply replacing some of the ferrite cores even if they are damaged.

[0190] Meanwhile, when the arrangement of a plurality of ferrite core modules (27) on the upper surface (261) of the substrate supporter (26) is completed, the first to third coil circuit board modules (251, 252, 253) can be installed on the upper side of the ferrite core module (27).

[0191] Next, with the first to third coil circuit board modules (251, 252, 253) installed, the board supporter (26) can be flipped upside down and assembly of the electric components (28) can proceed.

[0192] As described above, several electrical components (28) can be installed and assembled on the lower surface of the substrate supporter (26). At this time, these electrical components (28) can be installed and assembled on the substrate supporter (26) in an upside-down state.

[0193] Meanwhile, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may further include an insulating material (291) disposed on the upper side of the first to third coil circuit board modules (251, 252, 253) between the first to third coil circuit board modules (251, 252, 253) and the top plate (21).

[0194] The insulation (291) is placed on the upper surface (21a) of the top plate (21) and serves to minimize the heat generated from the container heated by the working coil pattern (2512) from being transferred to the working coil pattern (2512).

[0195] To perform this insulation function, the insulation material (291) can be arranged in the form of a pad that entirely covers the first to third coil circuit board modules (251, 252, 253).

[0196] Meanwhile, in this embodiment, the insulation material (291) may be provided divided into a plurality of pads.

[0197] More specifically, each insulation material (291) can be divided into a plurality of pads so as to have a left-right width corresponding to the left-right width of the crater (2511) formed on the first to third coil circuit board modules (251, 252, 253).

[0198] In this way, by dividing the insulation material (291) into multiple pieces and arranging them, a predetermined gap can be formed between adjacent insulation materials (291), and visible light generated from the aforementioned light source module (23) passing through the predetermined gap can be irradiated to the lower surface of the top plate (21), so that the aforementioned display line (L) can be displayed on the top plate (21).

[0199] Meanwhile, the insulation material (291) can additionally perform the role of electrically insulating between the working coil pattern (2512) or sensing coil pattern (2514) formed on the first to third coil circuit board modules (251, 252, 253) and the top plate (21).

[0200] In this case, the insulation material (291) can be made of a material having both insulation performance and insulating performance.

[0201] Meanwhile, although not shown, in order to further improve the insulation performance of the insulation material (291), an insulation material may be added between the insulation material (291) and the top plate (21) on the upper side of the insulation material (291). For example, the insulation material may be a mica sheet having a thickness thinner than the vertical thickness of the insulation material (291).

[0202] [Detailed configuration of the coil circuit board module]

[0203] Hereinafter, with reference to FIGS. 7 to 16, the detailed configuration of the coil circuit board module (251, 252, 253) of the cooktop (20) constituting the cooking appliance (1) according to one embodiment of the present invention will be described.

[0204] As described above, embodiments of the present invention may be configured to include first to third coil circuit board modules (251, 252, 253).

[0205] At this time, the first to third coil circuit board modules (251, 252, 253) can be configured substantially the same except for the number of working coil patterns (2512) and the number of sensing coil patterns (2514) constituting the crater (2511).

[0206] Therefore, the following description will be based on the first coil circuit board module (251), and unless otherwise stated, the contents described below can be applied almost identically to the second coil circuit board module (252) and the third coil circuit board module (253).

[0207] First, as described above, the first coil circuit board module (251) can be formed by stacking multiple working coil patterns (2512) forming a plurality of craters (2511) in multiple layers.

[0208] As illustrated in FIG. 7, the first coil circuit board module (251) may be configured to include working coil patterns (2512) arranged in a ten-layer structure, sensing coil patterns (2514) arranged in a two-layer structure, and an insulating material disposed between each working coil pattern (2512) and each sensing coil pattern (2514) and insulating them.

[0209] Therefore, based on the working coil pattern (2512) and the sensing coil pattern (2514), the first coil circuit board module (251) can have a layered structure having a total of 12 layers from the first layer (251a) forming the uppermost side in the vertical direction to the 12th layer (251l) forming the lowermost layer.

[0210] At this time, a first sensing coil pattern (2514a) constituting a sensing coil pattern (2514) may be arranged on the first layer (251a) of the first coil circuit board module (251) having a 12-layer structure.

[0211] In addition, a lead pattern (2513) may be arranged on the first layer (251a) to electrically connect the first sensing coil pattern (2514a) to a signal processing unit (2518) described later, or to electrically connect the working coil pattern (2512) arranged on the third to twelfth layers (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l) to a substrate terminal (2516).

[0212] Here, the lead pattern (2513) can be divided into a first lead pattern (2513a) that electrically connects the working coil pattern (2512) arranged in the third to twelfth layers (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l) to the substrate terminal (2516), and a second lead pattern (2513b) that electrically connects the first sensing coil pattern (2514a) to the signal processing unit (2518).

[0213] In addition, although not shown in FIG. 7, the first layer (251a) may further include a temperature sensor (2515) for detecting the temperature of the top plate (21), a board terminal (2516) to which high-frequency power is supplied from the inverter circuit board (283), a signal processing unit (2518) for processing the output signal of the sensing coil pattern (2514) and the output signal of the temperature sensor (2515), and a third lead pattern (2513c) for electrically connecting the temperature sensor (2515) and the signal processing unit (2518).

[0214] Meanwhile, a second sensing coil pattern (2514b) constituting a sensing coil pattern (2514) and a second lead pattern (2513b) electrically connecting the second sensing coil pattern (2514b) to a signal processing unit (2518) may be arranged on the second layer (251b) of the first coil circuit board module (251).

[0215] That is, in order to increase the efficiency and effectiveness of detection for the container, the sensing coil pattern (2514) may be divided and arranged into a first sensing coil pattern (2514a) arranged in the first layer (251a) and a second sensing coil pattern (2514b) arranged in the second layer (251b).

[0216] At this time, as described later, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are configured to be connected in series through a sensing coil via hole (H_v2) extending through the first layer (251a) and the second layer (251b), so that they can function as one sensing coil pattern (2514).

[0217] Meanwhile, a second sensing coil pattern (2514b) constituting the sensing coil pattern (2514) may be arranged on the second layer (251b) of the first coil circuit board module (251).

[0218] As described below, the working coil pattern (2512) provided on the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may include a first type pattern (2512a) and a second type pattern (2512b) in which the traveling direction or winding direction of individual pattern strands (2512a-1, 2512b-1) are formed in opposite directions so that a magnetic field can be applied evenly to the container.

[0219] As illustrated in FIG. 7, a working coil pattern (2512) may be formed in the third to seventh layers (251c, 251d, 251e, 251f, 251g), for example, and a first type pattern (2512a) configured such that the progress direction or winding direction of the individual pattern strands (2512a-1) becomes the first direction may be arranged.

[0220] In addition, for example, the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) may be configured to have a working coil pattern (2512) formed, and a second type pattern (2512b) configured such that the progress direction or winding direction of the individual pattern strands (2512b-1) is in the second direction.

[0221] At this time, as illustrated, the first lead pattern (2513a) formed on the first layer (251a), the first type pattern (2512a) arranged on the third to seventh layers (251c, 251d, 251e, 251f, 251g), and the second type pattern (2512b) arranged on the eighth to twelfth layers (251h, 251i, 251j, 251k, 251l) can be configured to be connected in batches through a working coil via hole (H_v1) continuously formed to penetrate from the first layer (251a) to the twelfth layer (251l).

[0222] Accordingly, among the plurality of craters described below, a plurality of first type patterns (2512a) and a plurality of second type patterns (2512b) forming a specific crater can be connected in series through a working coil via hole (H_v1).

[0223] Meanwhile, although not shown, an insulating material may be additionally formed on the upper side of the first layer (251a) and on the lower side of the 12th layer (251l).

[0224] Meanwhile, the layered structure of the first coil circuit board module (251) illustrated in FIG. 7 is merely exemplary.

[0225] That is, the layered structure may be modified so that the second sensing coil pattern (2514b) is placed on a layer other than the second layer (251b), such as the sixth layer (251f) or seventh layer (251g) which is an intermediate layer, or on the twelfth layer (251l) which is the lowest layer.

[0226] In addition, FIG. 7 illustrates that the first type pattern (2512a) is arranged continuously from the third layer (251c) to the seventh layer (251g), and the second type pattern (2512b) is arranged continuously from the eighth layer (251h) to the twelfth layer (251l); however, the first type pattern (2512a) and the second type pattern (2512b) may be modified to alternately and repeatedly arrange.

[0227] Such variations are considered to fall within the scope of the present invention. However, the present invention is not limited thereto, and the following description will be made based on the layered structure of the first coil circuit board module (251) as illustrated in FIG. 7.

[0228] The first coil circuit board module (251) having such a multi-layered structure can be formed by printing the shape of the working coil pattern (2512), which becomes the second type pattern (2512b), by masking it on a copper film, removing unnecessary parts through etching to form a pattern, and coating an insulating material on the formed pattern to form the 12th layer (251l), which becomes the lowest layer.

[0229] The thickness of the copper foil applied in this embodiment may be in the range of 0.13 mm to 0.15 mm, and preferably 0.14 mm.

[0230] Therefore, if no additional surface treatment is performed during the lamination process, the vertical thickness of the individual pattern formed through the copper film can be 0.13 mm to 0.15 mm.

[0231] Additionally, the thickness of the insulating material applied in this embodiment may be in the range of 0.09 mm to 0.11 mm, and preferably 0.1 mm.

[0232] After the 12th layer (251l), which is the lowest layer, is formed in this way, a multi-layered structure as shown in Fig. 7 can be formed by repeating the same process as the formation method of the 12th layer (251l) thereon.

[0233] Therefore, when the formation of the first coil circuit board module (251) is completed with a total of 12 layers, the vertical thickness of the first coil circuit board module (251) can be in the range of 2.7 mm to 3.3 mm, and preferably 3 mm.

[0234] A method for manufacturing a multilayer printed circuit board for forming a first coil circuit board module (251) having such a shape and structure can be applied using means already known in the art, and therefore, a description of the specific manufacturing method will be omitted below.

[0235] Figures 8 and 9 illustrate the planar structures of the first layer (251a) and the second layer (251b) of the first coil circuit board module (251) having a multilayer structure, respectively.

[0236] In this embodiment, the first coil circuit board module (251) may be configured to have a rectangular plate shape in which the width in the front-back direction is greater than the width in the left-right direction when placed on the cooktop (20). That is, when placed on the cooktop (20), the first coil circuit board module (251) may have a rectangular plate shape in which, among the outer edges, a front edge (251s1) and a rear edge (251s2) extend in the left-right direction, and, among the outer edges, a left edge (251s3) and a right edge (251s4) extend in the front-back direction.

[0237] In response to this, the first layer (251a), which is the uppermost layer, and the second layer (251b), which is the next upper layer, can be configured to have a rectangular plate shape in which the width in the front-back direction is greater than the width in the left-right direction.

[0238] As described above, in the first layer (251a), a first sensing coil pattern (2514a) forming the first layer among the sensing coil patterns (2514) arranged in two layers may be arranged, and in the second layer (251b), a second sensing coil pattern (2514b) forming the second layer among the sensing coil patterns (2514) arranged in two layers may be arranged.

[0239] At this time, as shown, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be wound in a different shape from the working coil pattern (2512).

[0240] That is, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be wound in a circular spiral shape. For example, the number of turns of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be set to be 18, and the outer diameter can have a range of 32 mm to 34 mm, preferably a range of 33 mm. In addition, the width of the individual pattern strands constituting the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be a range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0241] As described below, the working coil pattern (2512) is wound in a square spiral shape.

[0242] Additionally, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are arranged so that a region partially overlaps with the working coil pattern (2512) in the vertical direction.

[0243] Therefore, due to such overlapping areas, there is a possibility that malfunction or detection error of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may occur.

[0244] In this way, by winding the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) in a circular spiral shape, interference with the working coil pattern (2512) wound in a square spiral shape can be minimized, and the possibility of malfunction and detection errors of the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) can be minimized.

[0245] Meanwhile, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be wound so that a starting point is not formed at the center of the circular spiral. That is, a central internal region in which the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) are not formed may be formed at the center of the circular spiral shape.

[0246] A temperature sensor (2515) can be mounted in the central inner region of the first sensing coil pattern (2514a) as described below.

[0247] The specific configuration regarding placement of the temperature sensor (2515) is described later with reference to FIG. 10.

[0248] In this embodiment, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be provided in multiple numbers.

[0249] More specifically, the plurality of first sensing coil patterns (2514a) and the plurality of second sensing coil patterns (2514b) may include patterns that are arranged entirely within a specific crater and patterns that are arranged across a pair of adjacent craters (2511).

[0250] For example, in an embodiment as illustrated in FIG. 8, when the first coil circuit board module (251) has a total of eight craters (2511), a total of 28 first sensing coil patterns (2514a) and a total of 28 second sensing coil patterns (2514b) may be provided.

[0251] However, this is merely an example, and the number of first sensing coil patterns (2514a) may be adjusted and provided differently depending on the size of the individual crater (2511) and the size of the first coil circuit board module (251). The present invention is not limited thereto, but the following description will be made based on an embodiment in which 28 first sensing coil patterns (2514a) and second sensing coil patterns (2514b) are provided on the first coil circuit board module (251).

[0252] The first sensing coil patterns (2514a) arranged at different locations can be configured to have substantially the same number of turns, and similarly, the second sensing coil patterns (2514b) arranged at different locations can be configured to have the same number of turns.

[0253] A sensing coil via hole (H_v2) may be formed at a starting point or an ending point of a first sensing coil pattern (2514a), and the sensing coil via hole (H_v2) may be connected to an ending point or a starting point of a second sensing coil pattern (2514b). Through this, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) may be connected in series to form one sensing coil pattern (2514).

[0254] A starting point or an ending point that is not connected to a sensing coil via hole (H_v2) can be electrically connected to a signal processing unit (2518) provided in the first layer (251a) through a second lead pattern (2513b) formed in the first layer (251a) or the second layer (251b), as illustrated in FIGS. 8 and 9.

[0255] Meanwhile, a temperature sensor (2515) to be described later may be electrically connected to the signal processing unit (2518) via a third lead pattern (2513c). As illustrated in FIG. 9, the third lead pattern (2513c) may be formed on the second layer (251b).

[0256] In the case where a total of 28 sensing coil patterns (2514) are provided as in the embodiment illustrated in FIG. 8, a total of four signal processing units (2518) may be provided, and a pair of signal processing units (2518) may be formed adjacent to each other at the center of the rear edge (251s2) of the first layer (251a), and another pair of signal processing units (2518) may be arranged adjacent to each other at the center of the front edge (251s1) of the first layer (251a).

[0257] For example, based on the embodiment illustrated in FIG. 8, among a pair of signal processing units (2518) arranged at the leading edge (251s1) of the first layer (251a), a left signal processing unit (2518) may be assigned a group of six sensing coil patterns (2514) arranged on the left side among a plurality of sensing coil patterns (2514) that are divided left and right and arranged rearward from the leading edge (251s1) of the first layer (251a), and a temperature sensor (2515) arranged on each of them, and a right signal processing unit (2518) may be assigned a group of six sensing coil patterns (2514) arranged on the right side among a plurality of sensing coil patterns (2514) that are arranged rearward from the leading edge (251s1) of the first layer (251a), and a temperature sensor (2515) arranged on each of them.

[0258] In the same manner, a group of sensing coil patterns (2514) and a temperature sensor (2515) can be assigned to a pair of signal processing units (2518) arranged at the rear edge (251s2) of the first layer (251a).

[0259] In this way, by arranging the two pairs of signal processing units (2518) at positions that are maximally spaced apart along the front-back direction, the structure of the second lead pattern (2513b) that connects the individual sensing coil pattern (2514) to the signal processing unit (2518) and the third lead pattern (2513c) that connects the individual temperature sensor (2515) to the signal processing unit (2518) can be simplified, and their lengths can be minimized.

[0260] Meanwhile, a first lead pattern (2513a) for transmitting high-frequency power to each of the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) may be formed in the first layer (251a), as described later.

[0261] As illustrated, each first lead pattern (2513a) can be configured to be divided into multiple pattern strands.

[0262] Accordingly, the first lead pattern (2513a) is formed by dividing into multiple pattern strands, so that power loss that may occur due to the skin effect when high-frequency power is applied can be minimized.

[0263] Meanwhile, considering the efficiency of power supply, a plurality of pattern strands may be concentrated at one end and the other end of the first lead pattern (2513a) to form a common lead terminal (2513a1).

[0264] A common lead terminal (2513a1) formed at one end of the first lead pattern (2513a) can be connected to a substrate terminal (2516) formed at the front edge (251s1) and the rear edge (251s2) of the first layer (251a), respectively.

[0265] Meanwhile, the first lead pattern (2513a) may be arranged inside the first layer (251a) from one end and may extend toward a common lead terminal (2513a1) formed at the other end.

[0266] Meanwhile, in this embodiment, a pair of working coil patterns (2512) arranged adjacent to each other can be configured to be supplied with high-frequency power through three substrate terminals (2516) and three first lead patterns (2513a).

[0267] That is, if the high-frequency power is configured to be supplied through a pair of substrate terminals (2516) and a pair of first lead patterns (2513a) for each working coil pattern (2512), two pairs of substrate terminals (2516) and two pairs of first lead patterns (2513a) must be allocated for one pair of working coil patterns (2512).

[0268] The present invention is configured so that high-frequency power is supplied to a pair of working coil patterns (2512) through three substrate terminals (2516) and three first lead patterns (2513a) arranged adjacent to each other, thereby minimizing the number of substrate terminals (2516) and the number of first lead patterns (2513a), and thus simplifying the circuit configuration.

[0269] This will be explained in more detail with reference to Figure 9.

[0270] FIG. 9 is a partial enlarged view of FIG. 8, showing the detailed configuration of a substrate terminal (2516) and a first lead pattern (2513a) for supplying power to a pair of working coil patterns (2512) arranged adjacent to the left rear side based on the state illustrated in FIG. 8.

[0271] Based on the illustrated state, the leftmost board terminal (2516) is referred to as the first board terminal (2516a), the middle board terminal (2516) is referred to as the second board terminal (2516b), and the rightmost board terminal (2516) is referred to as the third board terminal (2516c).

[0272] In addition, the first lead pattern (2513a) connected to the first substrate terminal (2516a) is referred to as the 1-1 lead pattern (2513a-1), the first lead pattern (2513a) connected to the second substrate terminal (2516b) is referred to as the 1-2 lead pattern (2513a-2), and the first lead pattern (2513a) connected to the third substrate terminal (2516c) is referred to as the 1-3 lead pattern (2513a-3).

[0273] As illustrated, the first substrate terminal (2516a) can be electrically connected to the external common terminal of the working coil pattern (2512) positioned further rearward among the pair of working coil patterns (2512) through the first-1 lead pattern (2513a-1).

[0274] Hereinafter, the external common terminal of the working coil pattern (2512) is referred to as the second common terminal (2512a-3, 2512b-3), and the internal common terminal of the working coil pattern (2512) is referred to as the first common terminal (2512a-2, 2512b-2).

[0275] As described below, the first common terminals (2512a-2, 2512b-2) include a first common terminal (2512a-2) of a first type pattern (2512a) and a first common terminal (2512b-2) of a second type pattern (2512b), and the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) may be connected in series through a working coil via hole (H_v1). As described below, the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) may be formed at positions where they vertically overlap each other.

[0276] Likewise, the second common terminals (2512a-3, 2512b-3) include the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b), and the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b) can be connected in series through the working coil via hole (H_v1). As described below, the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b) can be formed at positions where they vertically overlap each other.

[0277] At this time, the common lead terminal (2513a1) formed at the other end of the 1-1 lead pattern (2513a-1) can be formed at a position that vertically overlaps with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) arranged at the rear, and can be connected in series with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) through the working coil via hole (H_v1).

[0278] Meanwhile, as illustrated, the second substrate terminal (2516b) can be electrically connected to the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) positioned further forward among a pair of working coil patterns (2512) through the first-second lead pattern (2513a-2).

[0279] At this time, the common lead terminal (2513a1) formed at the other end of the first-second lead pattern (2513a-2) can be formed at a position that vertically overlaps the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) arranged in the front, and can be connected in series with the second common terminal (2512a-3, 2512b-3) of the working coil pattern (2512) through the working coil via hole (H_v1).

[0280] Additionally, the third substrate terminal (2516c) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of a pair of working coil patterns (2512) simultaneously through the first-third lead pattern (2513a-3).

[0281] That is, as illustrated, the 1-3 lead pattern (2513a-3) has a common lead terminal (2513a1) formed at the other end, and a common lead terminal (2513a1) may be additionally provided at an intermediate position between one end and the other end.

[0282] A common lead terminal (2513a1) formed at the other end of the 1-3 lead pattern (2513a-3) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of the working coil pattern (2512) positioned at the front among a pair of working coil patterns (2512) through a working coil via hole (H_v1).

[0283] In addition, the common lead terminal (2513a1) formed at the middle position of the 1-3 lead pattern (2513a-3) can be electrically connected to the first common terminal (2512a-2, 2512b-2) of the working coil pattern (2512) positioned at the rear among a pair of working coil patterns (2512) through a working coil via hole (H_v1).

[0284] That is, the 1-3 lead pattern (2513a-3) can be configured to act as a common lead pattern capable of simultaneously supplying power to a pair of working coil patterns (2512).

[0285] Accordingly, when only the rear working coil pattern (2512) is driven, power is supplied to the first substrate terminal (2516a) and the third substrate terminal (2516c) and power to the second substrate terminal (2516b) is cut off, when only the front working coil pattern (2512) is driven, power is supplied to the second substrate terminal (2516b) and the third substrate terminal (2516c) and power to the first substrate terminal (2516a) is cut off, and when a pair of working coil patterns (2512) are driven simultaneously, power is supplied to all of the first to third substrate terminals (2516c). The driving of a pair of working coil patterns (2512) can be controlled.

[0286] Meanwhile, based on the state illustrated in FIGS. 8 and 9, a plurality of edge notches (2517) may be formed at the front edge (251s1) and the rear edge (251s2) of the first layer (251a).

[0287] The edge notch (2517) serves to provide a mating space into which a connector (not shown) that supplies high-frequency power to the board terminal (2516) can be fitted.

[0288] As illustrated, the individual board terminals (2516) can be arranged in a split form with the edge notch (2517) in between so that the connector can be connected to the board terminal (2516) while being fitted into the edge notch (2517).

[0289] To reduce manufacturing costs through component commonality, connectors having the same shape and structure can be coupled to each edge notch (2517). To this end, each edge notch (2517) can be formed to have the same shape and size.

[0290] Meanwhile, as illustrated in FIG. 10, the edge notch (2517) can be formed entirely from the first layer (251a) of the first coil circuit board module (251) through the second layer (251b) to the twelfth layer (251l).

[0291] Additionally, a screw hole (H_sc) may be formed through the first coil circuit board module (251). The screw hole (H_sc) may be formed through the first layer (251a) to the twelfth layer (251l) in the same manner as the edge notch (2517).

[0292] A fastening means such as a screw bolt not shown can be connected to the aforementioned substrate supporter (26) through the screw hole (H_sc), and through this, the first coil circuit board module (251) can be firmly connected to the aforementioned substrate supporter (26).

[0293] For example, the screw holes (H_sc) can be placed on the four corner sides so as not to cause interference with the patterns constituting the first coil circuit board module (251).

[0294] Additionally, a ground terminal for grounding the first coil circuit board module (251) can be formed in the first layer (251a) around the screw hole (H_sc).

[0295] Meanwhile, the first coil circuit board module (251) may be provided with a light-transmitting slit hole (H_sl) formed penetrating from the first layer (251a) to the twelfth layer (251l).

[0296] The aforementioned light source module (23) can be placed below the light projection slit hole (H_sl), and visible light generated from the light source module (23) can pass through the light projection slit hole (H_sl) and be irradiated to the lower surface of the top plate (21). Through this, a linearly extending display line (L) can be formed on the top plate (21).

[0297] In order to implement a linearly extended display line (L), the light-transmitting slit hole (H_sl) can be linearly extended corresponding to the shape of the display line (L).

[0298] However, as shown in Fig. 8, in order to prevent the rigidity of the first coil circuit board module (251) from rapidly decreasing, the light transmitting slit hole (H_sl) may be formed by being divided into multiple pieces, and the divided light transmitting slit holes (H_sl) may be arranged linearly.

[0299] Hereinafter, with reference to FIG. 11, the relative arrangement position of the sensing coil pattern (2514) and the arrangement and arrangement structure of the temperature sensor (2515) will be described.

[0300] Fig. 11 is a partially enlarged view of a plan view of the first coil circuit board module (251) as viewed from above, in which the sensing coil pattern (2514) and the working coil pattern (2512) are illustrated together for the purpose of explaining and understanding their relative positions. However, in the present embodiment, the sensing coil pattern (2514) and the working coil pattern (2512) are actually arranged on different layers, so the sensing coil pattern (2514) and the working coil pattern (2512) cannot be observed together.

[0301] As described above, the individual sensing coil patterns (2514) wound in a circular spiral shape can be arranged so that a region partially overlaps with the working coil patterns (2512) wound in a square spiral shape in the vertical direction.

[0302] At this time, some of the plurality of sensing coil patterns (2514) may be entirely arranged within a single crater (2511) formed through the working coil pattern (2512), and other some of the plurality of sensing coil patterns (2514) may be arranged across an adjacent pair of craters (2511).

[0303] Fig. 11(a) illustrates a state in which a sensing coil pattern (2514) is arranged entirely within a working coil pattern (2512), and Fig. 11(b) illustrates a state in which a sensing coil pattern (2514) is arranged between a pair of adjacent working coil patterns (2512).

[0304] First, referring to FIG. 11(a), a working coil pattern (2512) formed by stacking a plurality of first type patterns (2512a) and a plurality of second type patterns (2512b) can be wound multiple times to have a square spiral shape.

[0305] For example, the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) can be wound a total of 9 times. That is, they can be wound to have a total of 9 turns.

[0306] Additionally, for example, six to five pattern strands (2512a-1, 2512b-1) can be tied together to form one turn.

[0307] At this time, as shown, the interval between each turn forming the first type pattern (2512a) and the second type pattern (2512b) is maintained approximately constant, but the horizontal interval between the third turn and the fourth turn can be formed to be much larger.

[0308] Internal clearance (D1) can be formed through the horizontal gap formed relatively larger in this way.

[0309] In addition, as shown in Fig. 11(b), an external gap (D2) that is a front-back gap similar to the internal gap (D1) can be formed between a pair of working coil patterns (2512) that are arranged adjacently along the front-back direction based on the state in which the first coil circuit board module (251) is arranged.

[0310] The internal clearance (D1) and the external clearance (D2) can be formed to have the same size, and for example, the internal clearance (D1) and the external clearance (D2) can have a range of 3.8 mm to 4.2 mm, and preferably, 4 mm.

[0311] As illustrated, the sensing coil pattern (2514) can be arranged so that the center point is located at the inner clearance (D1) and the outer clearance (D2).

[0312] Preferably, when the center point of the sensing coil pattern (2514) is located at the internal clearance (D1) as in Fig. 11(a), the center point of the sensing coil pattern (2514) may roughly coincide with the middle position between the third turn and the fourth turn.

[0313] In addition, preferably, when the center point of the sensing coil pattern (2514) is located at the external clearance (D2) as in FIG. 11(b), the center point of the sensing coil pattern (2514) may roughly coincide with the middle position between a pair of adjacently arranged working coil patterns (2512).

[0314] In addition, as described above, the first sensing coil pattern (2514a) and the second sensing coil pattern (2514b) each have an area where no pattern is formed inside, through which a central inner area (2514c) can be formed on the inner side of the sensing coil pattern (2514).

[0315] As illustrated, the central inner region (2514c) of the sensing coil pattern (2514) may have a disk shape, and the diameter of the inner region of the disk shape may be formed to be equal to or slightly smaller than the size of the inner clearance (D1) and the outer clearance (D2).

[0316] In this way, the internal clearance (D1) and external clearance (D2) of the working coil pattern (2512) and the central internal area (2514c) of the sensing coil pattern (2514) can provide a space in which a temperature sensor (2515) can be mounted.

[0317] As illustrated, a temperature sensor (2515) for detecting the temperature of the top plate (21) may be mounted in the central inner region (2514c) of each sensing coil pattern (2514) of the first layer (251a). At this time, the size of the internal clearance (D1) and the external clearance (D2) and the diameter of the sensing coil pattern (2514) may be formed to be larger than the size of the temperature sensor (2515), i.e., the longitudinal width.

[0318] Through this, when viewed from the top plate (21), individual temperature sensors (2515) can be placed in the first layer (251a) so as to belong to the central inner region (2514c) as a position surrounded by each sensing coil pattern (2514).

[0319] Additionally, to prevent interference with the sensing coil pattern (2514), the temperature sensor (2515) may be positioned at a location where vertical overlap with the sensing coil pattern (2514) does not occur, as shown inside the central inner region (2514c).

[0320] Meanwhile, as an example, a temperature sensor (2515) may be a SMD (Surface Mounted Devices) type thermistor in chip form that is relatively small, easy to mount on the first layer (251a), and has excellent detection capability.

[0321] However, in the case where an SMD type thermistor is mounted on the first coil circuit board module (251) as a temperature sensor (2515), there is a very high possibility that it will be affected by heat generated from the working coil pattern (2512).

[0322] In order to minimize the influence of heat generation from such a working coil pattern (2512), it is necessary to place it as far away as possible from the working coil pattern (2512) in the horizontal direction.

[0323] As locations where the influence of such heat generation can be minimized, an area where the central inner region (2514c) of the sensing coil pattern (2514) and the internal clearance (D1) overlap, and an area where the central inner region (2514c) of the sensing coil pattern (2514) and the external clearance (D2) overlap can be selected.

[0324] Although FIG. 11 illustrates that the temperature sensor (2515) is positioned at a position where the center point of the temperature sensor (2515) and the center point of the central inner region (2514c) of the sensing coil pattern (2514) roughly coincide, this is merely exemplary, and the influence of heat generation of the working coil pattern (2512) can be minimized simply by positioning the temperature sensor (2515) at any position in the region where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the internal clearance (D1), and in the region where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the external clearance (D2).

[0325] In addition, by configuring the temperature sensor (2515) to be placed in an area where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the internal clearance (D1), and an area where the central inner region (2514c) of the sensing coil pattern (2514) overlaps with the external clearance (D2), a space for installing a third lead pattern (2513c) that electrically connects the temperature sensor (2515) and the signal processing unit (2518), and a temperature sensor via hole (H_v3) through which the temperature sensor (2515) and the third lead pattern (2513c) are connected can be effectively secured.

[0326] At this time, as shown, the temperature sensor (2515) as an SMD type thermistor may have first and second electrodes formed at each end in the longitudinal direction, and the first layer (251a) may be provided with a pair of pads soldered to the first and second electrodes.

[0327] As illustrated, in the present embodiment, the direction in which the first electrode and the second electrode provided at both ends of the temperature sensor (2515) are arranged to be spaced apart from each other may be arranged in a direction parallel to the direction in which the working coil pattern (2512) is arranged adjacent to the temperature sensor (2515) or may be arranged in a direction intersecting the direction in which the working coil pattern (2512) is arranged. In other words, the direction in which the first electrode (2515c) and the second electrode (2515d) are arranged to be spaced apart from each other may be, based on the state illustrated in FIG. 11(a), an extension direction of the outer edge of the first coil circuit board module (251), that is, an extension direction of the rear edge (251s2) and the front edge (251s1), and may be parallel to the left edge (251s3) and the right edge (251s4), and based on the state illustrated in FIG. 11(b), may be parallel to the extension direction of the rear edge (251s2) and the front edge (251s1), and may intersect the left edge (251s3) and the right edge (251s4).

[0328] That is, when the temperature sensor (2515) is arranged in the region of the first gap (D1) as illustrated in Fig. 11(a), the individual pattern strands (2512a-1, 2512b-1) of the working coil pattern (2512) arranged adjacent to both sides of the temperature sensor (2515) proceed along the front-back direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor (2515) arranged in the region of the first gap (D1) are arranged spaced apart from each other may be the front-back direction or the left-right direction intersecting the front-back direction.

[0329] In addition, when the temperature sensor (2515) is arranged in the area of ​​the second gap (D2) as illustrated in FIG. 11(b), the individual pattern strands (2512a-1, 2512b-1) of the working coil pattern (2512) arranged adjacent to both sides of the temperature sensor (2515) advance along the left-right direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor (2515) arranged in the area of ​​the second gap (D2) are arranged to be spaced apart from each other may be the left-right direction or the front-back direction intersecting the left-right direction.

[0330] At this time, a pair of pads corresponding to the first electrode and the second electrode of the temperature sensor (2515) arranged in the area of ​​the first gap (D1), and the first electrode and the second electrode of the temperature sensor (2515) arranged in the second gap (D2) can be arranged with the same direction as these.

[0331] Through this, the third lead pattern (2513c) for transmitting an electrical signal generated from the temperature sensor (2515) to the signal processing unit (2518) can be extended toward the signal processing unit (2518) without interference with the working coil pattern (2512) or with interference with the working coil pattern (2512) being minimized.

[0332] More specifically, the portion where the third lead pattern (2513c) overlaps with the sensing coil pattern (2514) and extends across the sensing coil pattern (2514) may be provided in any one of the third to seventh layers (251c, 251d, 251e, 251f, 251g) on ​​which the first type pattern (2512a) is formed, or may be provided in any one of the eighth to twelfth layers (251h, 251i, 251j, 251k, 251l) on which the second type pattern (2512b) is formed.

[0333] By way of example, in the present embodiment, as illustrated in FIG. 14, a third lead pattern (2513c) may be provided in any one of the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) on which a second type pattern (2512b) is formed, and the third lead pattern (2513c) formed in any one of the 8th to 12th layers (251h, 251i, 251j, 251k, 251l) may extend parallel to the pattern strand (2512b-1) of the second type pattern (2512b) within the first gap (D1) and the second gap (D2).

[0334] Through this, the third lead pattern (2513c) can be extended while effectively avoiding the working coil pattern (2512).

[0335] The remaining portion of the third lead pattern (2513c) can be formed on the first layer (251a) or the second layer (251b) that does not cause interference with the working coil pattern (2512), as shown in FIGS. 10 and 11.

[0336] Hereinafter, the detailed configuration of the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) will be described with reference to FIGS. 12 to 17.

[0337] Figure 12 illustrates the planar structure of the third layer (251c) of the first coil circuit board module (251) having a multi-layer structure.

[0338] The configuration of the third layer (251c) of the first coil circuit board module (251) described below can be applied equally to the fourth to seventh layers (251d, 251e, 251f, 251g) unless otherwise described.

[0339] Referring to FIG. 12, a first type pattern (2512a) of a working coil pattern (2512) consisting of a total of eight pieces can be arranged on a third layer (251c) of a first coil circuit board module (251) so as to form a total of eight craters (2511).

[0340] As illustrated, one first type pattern (2512a) can be assigned to one crater (2511), and the size of each first type pattern (2512a) can be formed to be the same so that the size of each crater (2511) can be formed to be the same.

[0341] At this time, for example, eight craters (2511) can be arranged in a grid shape, and accordingly, the first type pattern (2512a) can be arranged in a grid shape.

[0342] Accordingly, as the first type pattern (2512a) is arranged in a grid shape like this, a heating area can be evenly formed inside the third layer (251c) by being configured to be wound in a square spiral shape.

[0343] Meanwhile, in a case where a plurality of first type patterns (2512a) are arranged in a grid shape, the second type patterns (2512b) can be arranged symmetrically.

[0344] That is, a plurality of first type patterns (2512a) can be arranged in a left-right symmetrical shape centered on the light-transmitting slit hole (H_sl), which becomes the left-right center line of the third layer (251c).

[0345] Additionally, a plurality of first type patterns (2512a) can be arranged to have a front-back symmetrical shape centered on the front-back center line of the third layer (251c).

[0346] By arranging a plurality of first type patterns (2512a) in a symmetrical manner, the length of the first lead pattern (2513a) for supplying high-frequency power to the individual third layer (251c) can be minimized, and the structure of the first lead pattern (2513a) can be simplified.

[0347] Figure 13 illustrates the planar structure of the eighth layer (251h) of the first coil circuit board module (251) having a multi-layer structure.

[0348] The configuration of the 8th layer (251h) of the first coil circuit board module (251) described below can be equally applied to the 9th to 12th layers (251i, 251j, 251k, 251l) unless otherwise described.

[0349] As illustrated in FIG. 13, a second type pattern (2512b) of a working coil pattern (2512) consisting of a total of eight pieces can be arranged on the eighth layer (251h) of the first coil circuit board module (251) so as to form a total of eight craters (2511).

[0350] As illustrated, one second type pattern (2512b) can be assigned to one crater (2511), and the size of each second type pattern (2512b) can be formed to be the same so that the size of each crater (2511) can be formed to be the same.

[0351] At this time, the second type pattern (2512b) can be arranged in a grid shape, similar to the first type pattern (2512a).

[0352] In addition, similarly to the first type pattern (2512a) described above, a plurality of second type patterns (2512b) may be arranged to have a left-right symmetrical shape centered on the light-transmitting slit hole (H_sl), and a plurality of second type patterns (2512b) may be arranged to have a front-back symmetrical shape centered on the front-back center line of the third layer (251c).

[0353] Figure 14 illustrates a first type pattern (2512a) and a second type pattern forming one identical crater (2511).

[0354] The first type pattern (2512a) and the second type pattern (2512b) illustrated in FIG. 14 can be arranged in a layered structure along the vertical direction as described above so as to form the same crater (2511).

[0355] As illustrated in FIG. 14, the first type pattern (2512a) and the second type pattern (2512b) constituting the working coil pattern (2512) can be wound to have a square spiral shape from the first common terminal (2512a-2, 2512b-2) formed on the inside to the second common terminal (2512a-3, 2512b-3) formed on the outside as described above.

[0356] For example, it can be wound with a total of 9 turns from the first common terminal (2512a-2, 2512b-2) to the second common terminal (2512a-3, 2512b-3). That is, it can be wound with a total of 9 turns.

[0357] As illustrated, the first common terminals (2512a-2, 2512b-2) may be formed at positions eccentric outward from the center of the crater (2511). That is, an area in which the first type pattern (2512a) and the second type pattern (2512b) are not formed may be formed in the center of the crater (2511). This is to prevent overheating that may occur due to heat generated by individual pattern strands (2512a-1, 2512b-1) being concentrated in the center of the crater (2511). Although not illustrated, a means for preventing overheating on the center side of the crater (2511) may be additionally provided in the form of a via hole on the center side of the crater (2511).

[0358] Additionally, as described above, the spacing between each turn forming the first type pattern (2512a) and the second type pattern (2512b) is maintained approximately constant, but an internal clearance (D1) for placement of a temperature sensor (2515) may be formed between the third turn and the fourth turn.

[0359] Meanwhile, for example, the first type pattern (2512a) may be formed by binding six pattern strands (2512a-1) to form one turn, and the second type pattern (2512b) may be formed by binding five pattern strands (2512b-1) to form one turn.

[0360] The widths of the individual pattern strands (2512a-1, 2512b-1) constituting the first type pattern (2512a) and the second type pattern (2512b) can be formed identically in a range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0361] However, although the first type pattern (2512a) has six individual pattern strands (2512a-1) that constitute one turn, the ninth turn from the first turn does not proceed with only six individual pattern strands (2512a-1).

[0362] Likewise, the second type pattern (2512b) has five individual pattern strands (2512b-1) that constitute one turn, but the ninth turn does not proceed from the first turn with only five individual pattern strands (2512b-1).

[0363] That is, the first type pattern (2512a) can be arranged by dividing a plurality of pattern strands (2512a-1) in such a way that when one turn is completed while progressing from the first turn to the ninth turn, one of the six individual pattern strands (2512a-1) is stopped and a new individual pattern strand (2512a-1) is newly progressed.

[0364] Similarly, the second type pattern (2512b) can be arranged by dividing multiple pattern strands (2512b-1) in such a way that when one turn is completed while progressing from the first turn to the ninth turn, one of the five individual pattern strands (2512b-1) is stopped and a new individual pattern strand (2512b-1) is newly progressed.

[0365] By configuring the first type pattern (2512a) and the second type pattern (2512b) to be formed through a plurality of divided individual pattern strands (2512a-1, 2512b-1) in this way, it is possible to achieve the effect of a bundle of wires being bundled similar to the Litz wire applied to conventional cooktops.

[0366] At this time, the starting point and the ending point of the individual pattern strand (2512a-1) of the first type pattern (2512a) arranged to form a new turn as illustrated in FIG. 15, and the starting point and the ending point of the individual pattern strand (2512b-1) of the second type pattern (2512b) arranged to form a new tube in the same manner can be connected in series through the working coil via hole (H_v1).

[0367] At this time, the working coil via hole (H_v1) connecting the starting point and the ending point of the individual pattern strand (2512a-1) of the first type pattern (2512a) to the starting point and the ending point of the individual pattern strand (2512b-1) of the second type pattern (2512b) can be configured to collectively connect the individual pattern strands (2512a-1, 2512b-1) arranged in each layer by penetrating the entirety from the third layer (251c) to the twelfth layer (251l), as illustrated in FIG. 16.

[0368] However, as illustrated in FIG. 15, the individual pattern strands (2512a-1) constituting the first type pattern (2512a) and the individual pattern strands (2512b-1) constituting the second type pattern (2512b) may be configured to extend in opposite directions.

[0369] For example, individual pattern strands (2512a-1) constituting a first type pattern (2512a) may extend along a first direction (W1), and individual pattern strands (2512b-1) constituting a second type pattern (2512b) may extend along a second direction (W2) opposite to the first direction (W1).

[0370] As illustrated by way of example, the first direction (W1) can be clockwise, and the second direction (W2) can be counterclockwise.

[0371] Therefore, when high-frequency power is supplied through the same working coil via hole (H_v1), currents having opposite directions may flow in the individual pattern strands (2512a-1) of the first type pattern (2512a) and the individual pattern strands (2512b-1) of the second type pattern (2512b), which are electrically connected simultaneously to the same working coil via hole (H_v1), and magnetic fields having opposite directions may be formed.

[0372] As magnetic fields in opposite directions are formed in the first type pattern (2512a) and the second type pattern (2512b) in this way, a magnetic field dispersion effect similar to a conventional twisted Litz wire can be created.

[0373] Accordingly, the magnetic field generated from the first type pattern (2512a) and the second type pattern (2512b) is evenly transmitted to the container without being concentrated on a specific part of the container, thereby improving the heating efficiency and heating effect for the container.

[0374] Meanwhile, as illustrated in FIG. 17, a plurality of working coil via holes (H_v1) may be formed in the first common terminal (2512a-2) of the first type pattern (2512a) and the first common terminal (2512b-2) of the second type pattern (2512b) to minimize loss due to resistance.

[0375] These multiple working coil via holes (H_v1) can be formed to penetrate the entire layer from the first layer (251a) to the twelfth layer (251l) so as to be electrically connected to the first lead pattern (2513a) formed on the first layer (251a).

[0376] As a common working coil via hole (H_v1) is formed through the entire layer in this way, heat generated by individual working coil patterns (2512) can be effectively released from the first coil circuit board module (251) through the working coil via hole (H_v1). That is, the working coil via hole (H_v1) can function as a ventilation hole that prevents overheating of the first coil circuit board module (251).

[0377] Although not shown in FIG. 17, a plurality of working coil via holes (H_v1) may be formed to penetrate the entire area from the first layer (251a) to the twelfth layer (251l) in the second common terminal (2512a-3) of the first type pattern (2512a) and the second common terminal (2512b-3) of the second type pattern (2512b), similarly to the first common terminals (2512a-2, 2512b-2).

[0378] [Detailed structure and layout of the temperature sensor]

[0379] Referring to FIGS. 18 to 28 below, the detailed structure of a temperature sensor (2515) provided in a cooktop (20) of a cooking appliance (1) according to one embodiment of the present invention and the structure in which the temperature sensor (2515) is placed in a coil circuit board module (251, 252, 253) will be described.

[0380] As described above, the cooktop (20) of the cooking appliance (1) according to one embodiment of the present invention may be equipped with a temperature sensor (2515) for detecting the temperature of the top plate (21), and the top temperature sensor (2515) may be mounted on the upper surface of the coil circuit board module (251, 252, 253) in a state surrounded by a sensing coil pattern (2514).

[0381] That is, the temperature sensor (2515) may be mounted on the coil circuit board module (251, 252, 253), and may be placed on the upper surface of the coil circuit board module (251, 252, 253) facing the top plate (21).

[0382] At this time, as described above, the temperature sensor (2515) may be applied as an SMD type thermistor to facilitate integration into the coil circuit board module (251, 252, 253) through mounting on the coil circuit board module (251, 252, 253).

[0383] In Fig. 18, a state in which an SMD type thermistor and a temperature sensor (2515) applied as a temperature sensor (2515) to the present invention are mounted on a first coil circuit board module (251) is illustrated. Hereinafter, as illustrated, the state in which the temperature sensor (2515) is placed on the first coil circuit board module (251) will be described as an example, and the configuration described below can be equally applied to a second coil circuit board module (252) and a third coil circuit board module (253) that are not described otherwise.

[0384] Referring to FIG. 18, a temperature sensor (2515) that is an SMD type thermistor may be configured to include a sensing chip (2515a) that generates an output signal related to a sensed temperature, a sensor body (2515b) that houses the sensing chip (2515a) therein, and a first electrode (2515c) and a second electrode (2515d) that are spaced apart from each other with the sensor body (2515b) interposed therebetween and electrically connected to the sensing chip (2515a), respectively.

[0385] FIG. 18 illustrates an SMD type thermistor having a configuration in which a sensing chip (2515a) is arranged inside a sensor body (2515b) having a square pillar shape, and a first electrode (2515c) and a second electrode (2515d) are arranged at each end of the sensor body (2515b) based on the longitudinal direction of the temperature sensor (2515).

[0386] At this time, the first electrode (2515c) and the second electrode (2515d) may be provided in the shape of a cylinder or a disk that protrudes from the longitudinal ends of the sensor body (2515b) in a direction away from the sensor body (2515b). The first electrode (2515c) and the second electrode (2515d) may be directly soldered and connected to the sensor pad (P_s) formed on the upper surface (251t) of the first coil circuit board module (251), respectively.

[0387] The sensor pad (P_s) is connected to the third lead pattern (2513c) described above, and the output signals of the first electrode (2515c) and the second electrode (2515d) can be transmitted to the signal processing unit (2518) through the sensor pad (P_s) and the third lead pattern (2513c).

[0388] However, the SMD type thermistor provided as the temperature sensor (2515) in the present invention can be configured in various shapes and formats and applied to the present invention as is already known in the art. The present invention is not limited thereto, but the following description will be made based on the configuration of the SMD type thermistor illustrated as an example.

[0389] The temperature sensor (2515) can be an SMD type thermistor having a small chip shape that is easy to mount on the upper surface (251t) of the first coil circuit board module (251) as described above and easy to place in the central inner area (2514c) of the sensing coil pattern (2514).

[0390] For example, the temperature sensor (2515) may be an SMD type thermistor having a longitudinal width of about 3.2 mm from the end surface of the first electrode (2515c) to the end surface of the second electrode (2515d) and a transverse width and vertical width of about 1.65 mm.

[0391] In particular, the sensor body (2515b) of the temperature sensor (2515) that acts as a temperature sensing surface may have a size such that the longitudinal width (Ws_l) is approximately 2.3 mm and the transverse width (Ws_t) is approximately 1.65 mm.

[0392] Meanwhile, as illustrated in FIG. 18, when the temperature sensor (2515) is mounted on the upper surface (251t) of the first coil circuit board module (251), a part of the outer surface of the sensor body (2515b) that acts as a temperature sensing surface, i.e., the lower surface based on the illustrated state, may be arranged to be in direct contact with the upper surface of the first coil circuit board module (251).

[0393] At this time, as described above, an insulating material (291) may be placed between the first coil circuit board module (251) and the top plate (21).

[0394] As shown, an opening may be formed in the insulation material (291) to prevent interference with the temperature sensor (2515) so that the temperature of the top plate (21) can be easily detected.

[0395] In addition, the upper surface of the sensor body (2515b) of the temperature sensor (2515) can directly contact the lower surface (21b) of the top plate (21) to detect the temperature of the top plate (21), or can indirectly detect the temperature of the lower surface (21b) of the top plate (21) through an insulating material (292) as shown.

[0396] Meanwhile, as described above, the temperature sensor (2515) is configured to be placed in the internal clearance (D1) and external clearance (D2) of the working coil pattern (2512), and therefore, the temperature sensor (2515) is placed at a position very close to the pattern strands (2512a-1, 2512b-1) constituting the working coil pattern (2512) in the horizontal direction.

[0397] At this time, when high-frequency power is applied to the working coil pattern (2512) to heat the container, each pattern strand (2512a-1, 2512b-1) acts as a resistor, generating a significant level of heat, and the heat generated in the pattern strand (2512a-1, 2512b-1) can be transferred to the sensor body (2515b) of the temperature sensor (2515) through conduction.

[0398] Due to the arrangement structure of the temperature sensor (2515), a problem may arise in which the temperature sensor (2515) tracks the temperature of the first coil circuit board module (251) rather than the temperature of the top plate (21).

[0399] This is explained based on the experimental results shown in Figure 19.

[0400] The experimental results in which temperature was measured are shown based on a configuration in which the outer surface of the sensor body (2515b) of the temperature sensor (2515) is placed in direct contact with the upper surface (251t) of the first coil circuit board module (251).

[0401] The experimental conditions are as follows.

[0402] First, 1700 W of power was supplied to the working coil pattern (2512) of the first coil circuit board module (251) for a first time (about 180 seconds), and then 3400 W of power was supplied for a second time (about 200 seconds).

[0403] Afterwards, the power supply was cut off for the third hour (approximately 100 seconds) and the container placed on the top plate (21) was replaced with another container. After the container was replaced, power of 3400 W and 1700 W was supplied for the fourth hour (approximately 180 seconds) and the fifth hour (approximately 200 seconds), respectively.

[0404] In order to determine the temperature change pattern detected by the temperature sensor (2515) according to the present invention, the temperature of the top plate (21) and the temperature of the first coil circuit board module (251) were measured through a separate experimental sensor.

[0405] As illustrated in Fig. 19, it was confirmed that the change pattern of the temperature detected by the temperature sensor (2515) clearly follows the change in temperature of the first coil circuit board module (251) throughout the entire temperature rising section and temperature falling section.

[0406] That is, it was confirmed that the temperature sensor (2515) is more affected by the temperature of the first coil circuit board module (251) than by the temperature of the top plate (21), which is the main measurement target. It can be judged that this phenomenon occurs because the sensor body (2515b) of the temperature sensor (2515) is positioned to directly contact the upper surface (251t) of the first coil circuit board module (251).

[0407] The present invention provides a means for minimizing or preventing a phenomenon in which the temperature detection characteristic of the temperature sensor (2515) follows the temperature of the first coil circuit board module (251) rather than the temperature of the top plate (21), as the temperature sensor (2515) is mounted on the upper surface (251t) of the first coil circuit board module (251).

[0408] In order to solve the phenomenon in which the temperature detection characteristic of the temperature sensor (2515) follows the temperature of the first coil circuit board module (251), the temperature sensor (2515) constituting the cooktop (20) of the cooking appliance (1) according to the present invention can be configured such that the sensor body (2515b) is mounted on the upper surface (251t) of the first coil circuit board module (251) in a state in which it is separated from the first coil circuit board module (251).

[0409] FIG. 20 illustrates a configuration in which a sensor body (2515b) of a temperature sensor (2515) is separated from a first coil circuit board module (251) by a concave groove (G_th) formed in the first coil circuit board module (251) as a first embodiment of the present invention.

[0410] Referring to FIG. 20(a) and FIG. 20(b), the temperature sensor (2515) is mounted on the first coil circuit board module (251) and is positioned below the sensor body (2515b) of the temperature sensor (2515), and a concave groove (G_th) formed by being sunken in a direction away from the sensor body (2515b) may be provided on the upper surface (251t) of the first coil circuit board module (251).

[0411] At this time, as illustrated, based on the longitudinal and transverse directions of the temperature sensor (2515), the longitudinal width (Wg_l) of the concave groove (G_th) may be formed to be larger than the longitudinal width of the sensor body (2515b) of the temperature sensor (2515).

[0412] Additionally, the transverse width (Wg_t) of the concave groove (G_th) may be formed to be larger than the transverse width of the sensor body (2515b) of the temperature sensor (2515).

[0413] That is, as the size of the concave groove (G_th) is formed so that the longitudinal width (Ws_l) of the sensor body (2515b) is smaller than the longitudinal width (Wg_l) of the concave groove (G_th), and the transverse width (Ws_t) of the sensor body (2515b) is smaller than the transverse width (Wg_t) of the concave groove (G_th), the sensor body (2515b) of the temperature sensor (2515) can be formed in a state in which it is entirely separated from the upper surface (251t) of the first coil circuit board module (251).

[0414] However, in order to maintain electrical connection to the first electrode (2515c) and the second electrode (2515d), the longitudinal width (Wg_l) of the concave groove (G_th) may be formed smaller than the entire longitudinal width of the temperature sensor (2515).

[0415] Accordingly, as illustrated, the first electrode (2515c) and the second electrode (2515d) of the temperature sensor (2515) can conduct heat generated from the working coil pattern (2512) to the temperature sensor (2515) through the soldering portion (2515e), but a state can be formed in which the sensor body (2515b) having a contact area larger than at least the first electrode (2515c) and the second electrode (2515d) is entirely separated from the first coil circuit board module (251).

[0416] Through this, the area where the temperature sensor (2515) physically comes into contact with the first coil circuit board module (251) can be minimized, so that heat generated from the working coil pattern (2512) can be minimized from being conducted to the temperature sensor (2515), and the accuracy of temperature detection for the container or top plate (21) can be improved.

[0417] Meanwhile, as illustrated, the depth of the concave groove (G_th) may be limited to a predetermined level or less compared to the vertical thickness of the first coil circuit board module (251).

[0418] More specifically, the depth of the concave groove (G_th) can be set to be less than or equal to half the vertical thickness of the first coil circuit board module (251).

[0419] That is, as described above, the first coil circuit board module (251) can be formed to have a vertical thickness of approximately 3 mm when composed of a total of 12 layers.

[0420] Therefore, when the concave groove (G_th) is formed to a depth greater than half of the vertical thickness of the first coil circuit board module (251), the vertical thickness of the first coil circuit board module (251) at the portion corresponding to the concave groove (G_th) becomes less than 1.5 mm, which increases the possibility of easy damage. In consideration of this, the thickness range of the concave groove (G_th) may be selected to be greater than half of the vertical thickness of the first coil circuit board module (251).

[0421] Meanwhile, as described above, a pair of sensor pads (P_s) connected to the first electrode (2515c) and the second electrode (2515d) through soldering may be formed on the upper surface (251t) of the first coil circuit board module (251).

[0422] At this time, as shown in Fig. 20(b), the longitudinal spacing between a pair of sensor pads (P_s) based on the longitudinal direction of the temperature sensor (2515) needs to be larger than the longitudinal spacing of the concave groove (G_th).

[0423] More specifically, the relative positions of the concave grooves (G_th) of a pair of sensor pads (P_s) can be set so that a predetermined longitudinal distance (G_l) is formed from each concave groove (G_th).

[0424] For example, the predetermined longitudinal gap (G_l) may range from 0.9 mm to 1.1 mm, and preferably may be 1 mm.

[0425] In this way, by forming a longitudinal gap of about 1 mm between a pair of sensor pads (P_s) and a concave groove (G_th), damage to the sensor pad (P_s) can be prevented during processing of the first coil circuit board module (251) for forming the concave groove (G_th).

[0426] FIG. 21 shows the experimental results of temperature measurement based on a configuration in which a concave groove (G_th) is formed on the upper surface (251t) of the first coil circuit board module (251) according to the first embodiment of the present invention.

[0427] For comparative verification, experiments and measurements were conducted under the same experimental conditions as those shown in Fig. 19.

[0428] As illustrated in FIG. 21, the temperature change output from the temperature sensor (2515) generally follows the middle value of the temperature of the top plate (21) and the temperature of the first coil circuit board module (251), but it was confirmed that the temperature change of the top plate (21) rather than the temperature change of the first coil circuit board module (251) is followed throughout the entire temperature rising section and temperature falling section.

[0429] Through this, it was confirmed that by simply separating the sensor body (2515b) of the temperature sensor (2515) from the upper surface (251t) of the first coil circuit board module (251) through the concave groove (G_th), the heat generated in the working coil pattern (2512) can be minimized from being conducted to the temperature sensor (2515), and the temperature of the top plate (21) can be clearly tracked.

[0430] Meanwhile, FIG. 22 illustrates a configuration in which a through hole (H_O) is further added to a concave groove (G_th) formed in a first coil circuit board module (251) as a second embodiment of the present invention.

[0431] As shown, the through hole (H_O) can be continuously formed from the lower surface of the concave groove (G_th) to the lower surface (251v) of the first coil circuit board module (251).

[0432] At this time, the horizontal cross-sectional area of ​​the hole (H_O) can be formed smaller than the horizontal cross-sectional area of ​​the concave groove (G_th).

[0433] In the illustrated embodiment, one opening (H_O) is provided, but a plurality of openings (H_O) may be provided depending on the cross-sectional area of ​​the opening (H_O) and the size of the concave groove (G_th).

[0434] By adding at least one through hole (H_O) connected to the concave groove (G_th) in this way, the through hole (H_O) can function as a ventilation hole that connects the upper surface (251t) and the lower surface (251v) of the first coil circuit board module (251).

[0435] Overheating of the first coil circuit board module (251) due to heat generation of the working coil pattern (2512) can be prevented by the through hole (H_O) functioning as a ventilation hole, and the effect of preventing overheating of the temperature sensor (2515) itself can be expected at the same time.

[0436] Meanwhile, FIG. 23 illustrates a configuration in which a sensor body (2515b) of a temperature sensor (2515) is separated from a first coil circuit board module (251) by a through hole (H_th) formed in the first coil circuit board module (251) as a third embodiment of the present invention.

[0437] Referring to FIG. 23(a) and FIG. 23(b), similar to the concave groove (G_th) of the first embodiment described above, a temperature sensor (2515) may be mounted on the first coil circuit board module (251) and may be positioned below the sensor body (2515b) of the temperature sensor (2515), and a through hole (H_th) formed penetrating from the upper surface (251t) to the lower surface (251v) of the first coil circuit board module (251) may be provided.

[0438] In addition, as illustrated, similar to the concave groove (G_th), the longitudinal width of the through hole (H_th) may be formed to be larger than the longitudinal width (Ws_l) of the sensor body (2515b) of the temperature sensor (2515) in the longitudinal and transverse directions of the temperature sensor (2515).

[0439] Additionally, the transverse width of the through hole (H_th) may be formed to be larger than the transverse width of the sensor body (2515b) of the temperature sensor (2515).

[0440] As the through hole (H_th) is formed in the first coil circuit board module (251) in this way, the sensor body (2515b) of the temperature sensor (2515) can be formed in a state in which it is entirely separated from the upper surface (251t) of the first coil circuit board module (251).

[0441] In this way, based on the longitudinal direction of the temperature sensor (2515), the through hole (H_th) can be configured to have a slit shape with a longitudinal width greater than a transverse width.

[0442] Accordingly, it can also be seen that the through hole (H_th) of the third embodiment is configured in a way that it penetrates the first coil circuit board module (251) more deeply than the concave groove (G_th) of the first embodiment.

[0443] In this way, forming a through hole (H_th) having a slit shape may be suitable when it is difficult to process the concave groove (G_th) of the first embodiment or when the vertical thickness of the portion where the concave groove (G_th) is formed is formed too small during processing of the concave groove (G_th).

[0444] For example, it may be suitable in cases where the vertical thickness of the first coil circuit board module (251) is formed to be 1.5 mm or less, such as when the first coil circuit board module (251) is formed with a total of 6 or fewer layers, making it difficult to form a concave groove (G_th).

[0445] Meanwhile, by forming a through hole (H_th) having the same horizontal cross-sectional area as the concave groove (G_th) in the first coil circuit board module (251), the through hole (H_th) can function as a ventilation hole, similar to the through hole (H_O) of the second embodiment described above.

[0446] Therefore, the overheating prevention effect of the first coil circuit board module (251) due to the heat generation of the working coil pattern (2512) and the overheating prevention effect of the temperature sensor (2515) itself can be achieved at a higher level than that of the above-described through hole (H_th) functioning as a ventilation hole.

[0447] Meanwhile, FIGS. 24(a) and 24(b) illustrate a configuration in which a sensor body (2515b) of a temperature sensor (2515) is separated from a first coil circuit board module (251) by an additional insulating material (293) disposed on the upper surface of the first coil circuit board module (251) as a fourth embodiment of the present invention.

[0448] Referring to FIGS. 24(a) and 24(b), the fourth embodiment of the present invention may further include an additional insulating material (293) disposed between the sensor body (2515b) of the temperature sensor (2515) and the upper surface (251t) of the first coil circuit board module (251).

[0449] The additional insulation (293) may be formed of the same material as the insulation (291) described above or may be formed of a different material.

[0450] However, since the main purpose of the additional insulation (293) is to separate the sensor body (2515b) of the temperature sensor (2515) from the upper surface (251t) of the first coil circuit board module (251), as shown, the additional insulation (293) may be provided in the form of an insulation sheet in which the vertical thickness is much smaller than the vertical thickness of the insulation (291).

[0451] Additionally, for the same reason, the area of ​​the additional insulation (293) does not need to be larger than the area of ​​the lower surface of the sensor body (2515b), and may be formed to be approximately the same as or slightly smaller than the area of ​​the lower surface of the sensor body (2515b).

[0452] Additionally, the additional insulation (293) may be arranged in a manner in which it is pre-attached to the lower surface of the sensor body (2515b) or pre-attached to the upper surface (251t) of the first coil circuit board module (251).

[0453] Meanwhile, FIGS. 25 and 26 illustrate a configuration in which a sensor body (2515b) of a temperature sensor (2515) is separated from a first coil circuit board module (251) by protrusions (2515c -1, 2515d-1) provided on the first electrode (2515c) and the second electrode (2515d), respectively, as a fifth embodiment of the present invention.

[0454] Referring to FIGS. 25 and 26, the first electrode (2515c) and the second electrode (2515d) of the temperature sensor (2515) according to the fifth embodiment of the present invention may further include protrusions (2515c -1, 2515d-1) arranged parallel to the upper surface (251t) of the first coil circuit board module (251), respectively.

[0455] For example, the protrusions (2515c -1, 2515d-1) of the first electrode (2515c) and the second electrode (2515d) may be formed to protrude from the first electrode (2515c) and the second electrode (2515d) in a direction parallel to the upper surface (251t) of the first coil circuit board module (251).

[0456] As an example, in the case where the first electrode (2515c) and the second electrode (2515d) have a circular or cylindrical shape as described above, the protrusions (2515c-1, 2515d-1) may be fixed ends integrally connected to the outer circumference surface of the first electrode (2515c) and the outer circumference surface of the second electrode (2515d) at one end, and may be free ends extending in a direction away from the first electrode (2515c) and the second electrode (2515d) at the other end.

[0457] At this time, as shown, the protrusion (2515c-1) of the first electrode (2515c) and the protrusion (2515d-1) of the second electrode (2515d) each function as a connection part that is connected to a pair of sensor pads (P_s) through soldering.

[0458] Accordingly, when the protrusion (2515c-1) of the first electrode (2515c) and the protrusion (2515d-1) of the second electrode (2515d) are each soldered to the sensor pad (P_s), a separation gap having a height corresponding to at least the vertical thickness of the protrusion (2515c-1) of the first electrode (2515c) and the vertical thickness of the protrusion (2515d-1) of the second electrode (2515d) can be formed between the lower surface of the sensor body (2515b) and the upper surface of the first coil circuit board module (251).

[0459] That is, a separation gap having a vertical height greater than or equal to the vertical thickness of the protrusions (2515c-1, 2515d-1) can be formed between at least the lower surface of the sensor body (2515b) and the upper surface of the first coil circuit board module (251).

[0460] By this separation interval, the sensor body (2515b) of the temperature sensor (2515) can be formed in a state in which it is entirely separated from the upper surface (251t) of the first coil circuit board module (251).

[0461] Meanwhile, the protrusion (2515c-1) of the first electrode (2515c) and the protrusion (2515d-1) of the second electrode (2515d) may be formed to extend in a direction away from the sensor body (2515b) as illustrated in FIG. 25, or to extend in a direction toward the sensor body (2515b) as illustrated in FIG. 26.

[0462] When the protrusion (2515c-1) of the first electrode (2515c) and the protrusion (2515d-1) of the second electrode (2515d) extend in a direction toward the sensor body (2515b), the protrusion (2515c-1) of the first electrode (2515c) and the protrusion (2515d-1) of the second electrode (2515d) may extend between the upper surface (251t) of the first coil circuit board module (251) and the sensor body (2515b), respectively.

[0463] Meanwhile, FIGS. 27 and 28 illustrate a configuration having a through slit (H_ths) as a sixth embodiment of the present invention.

[0464] The above-described embodiments are configured to separate the sensor body (2515b) of the temperature sensor (2515) from the first coil circuit board module (251) in order to resolve the phenomenon in which the temperature sensor (2515) tracks the temperature of the first coil circuit board module (251).

[0465] As illustrated in FIGS. 27 and 28, the sixth embodiment of the present invention may include a through slit (H_ths) as a means for minimizing the temperature sensor (2515) from tracking the temperature of the first coil circuit board module (251) when the sensor body (2515b) of the temperature sensor (2515) is in contact with the upper surface (251t) of the first coil circuit board module (251).

[0466] In more detail, referring to FIGS. 27 and 28, the first coil circuit board module (251) according to the sixth embodiment of the present invention may be provided with a through slit (H_ths) formed in a position that does not overlap with the temperature sensor (2515) in the vertical direction and that penetrates from the upper surface (251t) to the lower surface (251v) of the first coil circuit board module (251).

[0467] Although FIGS. 27 and 28 illustrate a configuration in which a through slit (H_ths) is provided while the sensor body (2515b) of the temperature sensor (2515) is in contact with the upper surface (251t) of the first coil circuit board module (251), it is also possible to configure a configuration in which a through slit (H_ths) is additionally provided while the above-described concave groove (G_th) and through hole (H_th) are provided in the first coil circuit board module (251). The present invention is not limited thereto, but below, as an example, an embodiment in which a through slit (H_ths) is provided while the sensor body (2515b) is in contact with the first coil circuit board module (251) will be described based on the illustrated embodiment.

[0468] The through slit (H_ths) functions as a blocking wall or barrier to minimize the heat generated from the working coil pattern (2512) from being conducted to the sensor body (2515b) through the first coil circuit board module (251).

[0469] In this way, in order to minimize the heat generation of the working coil pattern (2512) from being transmitted to the sensor body (2515b), the through slits (H_ths) may be provided in a pair, and the pair of through slits (H_ths) may be arranged on the first coil circuit board module (251) in a state of being spaced apart from each other with the sensor body (2515b) therebetween. That is, the sensor body (2515b) may be sandwiched between the pair of through slits (H_ths).

[0470] Meanwhile, a pair of through slits (H_ths) can be placed in the central inner region (2514c) of the sensing coil pattern (2514) adjacent to the temperature sensor (2515) together with the temperature sensor (2515).

[0471] At this time, as illustrated, a pair of through slits (H_ths) may be arranged at positions that do not overlap in the vertical direction with respect to the temperature sensor (2515). That is, a pair of through slits (H_ths) may be arranged in the central inner region (2514c) of the sensing coil pattern (2514) so ​​as not to overlap in the vertical direction with the sensor body (2515b), the first electrode (2515c), and the second electrode (2515d) that constitute the temperature sensor (2515).

[0472] Additionally, a pair of through slits (H_ths) can be arranged so that the direction parallel to the longitudinal direction of the sensor body (2515b) is the longitudinal direction.

[0473] In this way, since the temperature sensor (2515) is arranged so that no overlap occurs in the vertical direction and the direction parallel to the longitudinal direction of the sensor body (2515b) is arranged so that the longitudinal direction is the longitudinal direction, a horizontal gap can be formed between a pair of through slits (H_ths) and the sensor body (2515b).

[0474] Meanwhile, as illustrated, the through slit (H_ths) is configured not to be positioned at a position that blocks the first electrode (2515c) and the second electrode (2515d). As illustrated in FIG. 28, if the through slit (H_ths) is positioned at a position that blocks the first electrode (2515c) and the second electrode (2515d), the extended area of ​​the second lead pattern (2513b) or the third lead pattern (2513c) described above cannot be secured.

[0475] As illustrated in Fig. 27, a pair of through slits (H_ths) can be formed to have approximately the same shape and size.

[0476] More specifically, a pair of through slits (H_ths) can be formed in a slit hole shape in which the longitudinal width (L_ths) is formed much larger than the transverse width (W_ths).

[0477] However, the size of a pair of through slits (H_ths) needs to be limited so that they are effectively placed in the central inner region (2514c) of the sensing coil pattern (2514) and so that interference does not occur with the sensing coil pattern (2514), the second lead pattern (2513b), and the third lead pattern (2513c).

[0478] To this end, as illustrated, the transverse width (W_ths) of a pair of through slits (H_ths) may be limited to have a smaller size than the transverse width (Ws_t) of the sensor body (2515b), and the longitudinal width (L_ths) of a pair of through slits (H_ths) may be limited to have a smaller size than the longitudinal width of the temperature sensor (2515).

[0479] However, as illustrated in Fig. 27(b), in order to prevent the heat conduction blocking effect for the sensor body (2515b) from being reduced, the longitudinal width (L_ths) of a pair of through slits (H_ths) may be set to be larger than the longitudinal width (Ws_l) of the sensor body (2515b).

[0480] Although the present invention has been described with reference to the drawings exemplified above, it is to be understood that the present invention is not limited to the embodiments and drawings disclosed herein, and that various modifications may be made by those skilled in the art within the scope of the technical idea of ​​the present invention. Furthermore, even if the operational effects according to the configuration of the present invention have not been explicitly described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be acknowledged.

Claims

1. Top plate on which the container is mounted; a temperature sensor for detecting the temperature of the top plate; and A coil circuit board module having a working coil pattern formed by being spirally wound to generate a magnetic field and a sensing coil pattern formed by being spirally wound to detect whether the container is settled; Including, A cooking appliance in which the temperature sensor is placed on the coil circuit board module in a state surrounded by the sensing coil pattern when viewed from the top plate.

2. In paragraph 1, A cooking appliance in which the temperature sensor is positioned so as not to overlap with the sensing coil pattern and the working coil pattern.

3. In paragraph 1, The above sensing coil pattern is formed with a central inner region where no pattern is formed on the inside, A cooking appliance wherein the temperature sensor is positioned so as to belong to the central inner area.

4. In paragraph 1, The above temperature sensor, A sensing chip that outputs an output signal related to the detected temperature; a sensor body accommodating the sensing chip therein; and First electrodes and second electrodes are arranged spaced apart from each other with the sensor body interposed therebetween and are electrically connected to the sensing chip; Including, The above coil circuit board module has a rectangular plate shape, A cooking device in which the direction in which the first electrode and the second electrode are arranged spaced apart from each other is parallel to or intersects with the extension direction of the outer edge of the coil circuit board module.

5. In paragraph 4, The above coil circuit board module has a pair of sensor pads electrically connected to the first electrode and the second electrode and spaced apart from each other with the sensor body interposed therebetween. A cooking appliance in which the direction in which the pair of sensor pads are arranged spaced apart from each other is parallel to or intersects with the extension direction of the outer edge of the coil circuit board module.

6. In paragraph 1, The above temperature sensor, A sensing chip that outputs an output signal related to the detected temperature; a sensor body accommodating the sensing chip therein; and First electrodes and second electrodes are arranged spaced apart from each other with the sensor body interposed therebetween and are electrically connected to the sensing chip; Including, A cooking appliance in which the temperature sensor is mounted on the coil circuit board module while the sensor body is separated from the coil circuit board module.

7. In paragraph 6, On the upper surface of the above coil circuit board module, a concave groove is formed that is positioned below the sensor body and is sunken in a direction away from the sensor body, A cooking appliance wherein the sensor body is at least partially separated from the coil circuit board module by the recessed groove.

8. In paragraph 7, The longitudinal width of the above sensor body is smaller than the longitudinal width of the above concave groove, A cooking appliance in which the transverse width of the sensor body is smaller than the transverse width of the concave groove.

9. In paragraph 7, A cooking appliance in which the depth of the above concave groove is less than or equal to half the vertical thickness of the coil circuit board module.

10. In paragraph 7, The above coil circuit board module has a pair of sensor pads electrically connected to the first electrode and the second electrode and spaced apart from each other with the sensor body interposed therebetween. A cooking appliance in which the pair of sensor pads are arranged on the coil circuit board module so that a predetermined longitudinal distance is formed from the concave groove.

11. In paragraph 7, The above coil circuit board module further includes a through hole formed from the lower surface of the concave groove to the lower surface of the coil circuit board module. A cooking appliance in which the horizontal cross-sectional area of ​​the above-mentioned hole is smaller than the horizontal cross-sectional area of ​​the above-mentioned groove.

12. In paragraph 6, In the above coil circuit board module, a through hole is formed that is positioned below the sensor body and penetrates from the top surface to the bottom surface of the coil circuit board module, A cooking appliance in which the sensor body is entirely separated from the coil circuit board module by the through hole.

13. In paragraph 12, The longitudinal width of the above sensor body is smaller than the longitudinal width of the above through hole, A cooking appliance in which the transverse width of the sensor body is smaller than the transverse width of the through hole.

14. In paragraph 6, A cooking appliance in which an insulating material is provided on the upper surface of the coil circuit board module to entirely separate the sensor body from the upper surface of the coil circuit board module.

15. In paragraph 6, The first electrode and the second electrode each have a protrusion arranged parallel to the upper surface of the coil circuit board module, A cooking appliance in which the temperature sensor is mounted on the upper surface of the coil circuit board module, and the sensor body is separated from the upper surface of the coil circuit board module by the protrusion.

16. In paragraph 15, A separation gap is formed between the sensor body and the upper surface of the coil circuit board module, A cooking appliance in which the vertical height of the above separation gap is greater than or equal to the vertical thickness of the above protrusion.

17. In paragraph 15, A cooking appliance in which the protrusion of the first electrode and the protrusion of the second electrode each extend in a direction away from the sensor body.

18. In paragraph 15, A cooking appliance in which the protrusions of the first electrode and the protrusions of the second electrode each extend in a direction toward the sensor body.

19. In paragraph 1, The above temperature sensor, A sensing chip that outputs an output signal related to the detected temperature; a sensor body accommodating the sensing chip therein; and First electrodes and second electrodes are arranged spaced apart from each other with the sensor body interposed therebetween and are electrically connected to the sensing chip; Including, A cooking appliance in which the coil circuit board module is formed with a through slit that is formed in a position that does not overlap the sensor body, the first electrode, and the second electrode in the vertical direction and penetrates from the upper surface to the lower surface of the coil circuit board module.

20. In paragraph 19, The above through slits are provided in pairs, A cooking appliance in which the pair of through slits are spaced apart from each other with the sensor body interposed therebetween and are arranged on the coil circuit board module.

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