Wheel speed sensor and method for manufacturing wheel speed sensor

Abstract

The present invention relates to a wheel speed sensor and a method for manufacturing the wheel speed sensor comprising: a main body which is a cylindrical hollow body opened downward and has a first concave part concave downward to one side in a radial direction; a plate-shaped terminal connection part which is provided inside the main body and is provided in the first concave unit; a terminal which is bent and extends upward from the terminal connection part and includes a terminal protruding to an upper portion of the main body to extend radially inward and be inclined upward; and an IC seated on the main body from the inside of the main body to the outside of the terminal connection part, wherein an IC connection part branched from the IC to extend upward and bent inward in the radial direction is provided inside the IC in the radial direction, and the IC connection part branched from the IC is provided to be bonded to the terminal connection part.

Description

Wheel speed sensor and method for manufacturing the wheel speed sensor

[0001] The present invention relates to a wheel speed sensor and a method for manufacturing a wheel speed sensor, and more particularly, to a wheel speed sensor installed in a vehicle to detect the speed of a vehicle wheel and a method for manufacturing a wheel speed sensor.

[0002] An automobile's antilock braking system (ABS) prevents the wheels from locking when the driver applies the brakes. ABS requires a wheel speed sensor to detect the wheel speeds and control the deceleration of the four wheels. The wheel speed sensor is used to sense the rotational speed of an encoder attached to the wheel's rotational shaft.

[0003] Encoders rotate along with the wheels, and wheel speed sensors sense the encoders and convert this information into wheel rotations, allowing wheel speed to be detected. ABS uses this detected wheel speed information to control the deceleration of each wheel.

[0004] Conventional wheel speed sensors had problems with IC (integrated circuit) damage due to high temperature and high pressure applied to the IC during the overmolding process during the manufacturing process, and there were problems with defects such as delamination or air gaps occurring at the insert boundary due to injection during the injection process.

[0005] The present invention has been proposed to solve the problems of the above-mentioned conventional technology, and aims to provide a wheel speed sensor and a method for manufacturing a wheel speed sensor that can simplify the process, reduce the possibility of defects, and prevent damage to an IC (integrated circuit) due to injection.

[0006] For the above purpose, the present invention comprises a main body having a cylindrical hollow body with a downward opening and a first concave portion formed downwardly concavely on one side in the radial direction,

[0007] A terminal provided on the inside of the main body, including a plate-shaped terminal connection part provided in the first concave part, and a terminal terminal extending upwardly from the terminal connection part and protruding to the upper part of the main body and extending upwardly in a radially inwardly inclined manner;

[0008] It comprises an IC mounted on the main body and provided on the outside of the terminal connection part on the inside of the main body;

[0009] A wheel speed sensor is provided, characterized in that an IC connection portion is provided on the radially inner side of the IC, branched from the IC, extending upward and radially inwardly bent, and the IC connection portion branched from the IC is provided by being joined to the terminal connection portion.

[0010] In the above, the main body is formed with an IC mounting portion that protrudes downwardly from the terminal mounting portion radially outwardly and has a concave end, a second concave portion is formed on both sides of the IC mounting portion, and an outer protrusion that protrudes downwardly along the perimeter of the terminal mounting portion and the second concave portion is formed outside the terminal mounting portion;

[0011] The above IC is characterized in that it is mounted and provided in an IC mounting portion.

[0012] In the above, the terminal connecting portions are spaced apart in the width direction to form a gap, and the main body is further provided with a main body protrusion that protrudes at the gap formed in the terminal connecting portion;

[0013] The above-mentioned branched IC connection portions are each provided with terminal connection portions spaced apart in the width direction, and the main body protrusion portion protruding between the terminal connection portions is formed into a stack portion that covers the IC connection portions on both sides stacked on the terminal connection portions by being pressurized and heated.

[0014] In the above, a pressing auxiliary member covering the IC connection part and the terminal connection part is further provided on the outer side in the width direction of the IC connection part stacked on the terminal connection part, and a main body protrusion protruding between the pressing auxiliary members and the terminal connection part is formed into a stack part covering the IC connection parts on both sides stacked on the terminal connection part by being pressurized and heated.

[0015] In the above, a plate-shaped cover is further provided that is inserted into the outer protrusion of the main body to cover the terminal and IC exposed downward in the first concave portion;

[0016] The cover is characterized in that it has a first cover protrusion inserted into the first concave portion, a second cover protrusion provided to cover the terminal connection portion, and a third cover protrusion inserted into the second concave portion, and the edge of the cover is in contact with the end of the outer protrusion.

[0017] In addition, the present invention provides a method for manufacturing the wheel speed sensor described above,

[0018] The stage where the main body is injected with the terminal as an insert (injection stage),

[0019] An IC placement step for placing an IC on the main body;

[0020] A method for manufacturing a wheel speed sensor is provided, characterized in that it includes a bonding step in which a terminal connection part of a terminal and an IC connection part of an IC are bonded after IC placement.

[0021] In the above, in the injection step, the main body is injection-molded so that the terminal connection part is exposed, and in the IC placement step, the IC is placed on the main body so that the IC connection part is laminated on the outside of the exposed terminal connection part.

[0022] In the above, a stacking step is further included, and in the stacking step, a main body protrusion protruding between terminal connection parts is pressurized and heated to form a stack part covering both IC connection parts stacked on the terminal connection parts.

[0023] In the above, in the stacking step, a pressing auxiliary member covering the IC connection part and the terminal connection part is further provided on the outer side in the width direction of the IC connection parts on both sides stacked on the terminal connection part, and a main body protrusion protruding between the terminal connection parts is pressurized and heated to form a stack part covering the IC connection parts on both sides stacked on the terminal connection part.

[0024] In the above, the bonding step is characterized in that it is performed between the IC placement step and the stacking step or after the stacking step.

[0025] In the above, it is characterized by including a coating step of applying a sealing material to cover the exposed terminal and IC after the bonding step.

[0026] In the above, it is characterized by further including a cover assembly step in which a cover is assembled to the main body to cover the exposed terminal and IC after the bonding step.

[0027] In the above, the main body is formed with an outer protrusion that protrudes along the periphery outside the terminal connection portion; and the cover is characterized in that it is inserted into the outer protrusion and provided on the main body.

[0028] In the above, a first concave portion concave inwardly in the radial direction of the terminal connection portion is formed in the main body, an IC mounting portion protruding from the terminal connection portion radially outwardly and having a concave end is formed, and a second concave portion concave is formed on both sides of the IC mounting portion; the outer protrusion portion is provided to protrude along the perimeter of the first concave portion and the second concave portion in addition to the outer side of the terminal connection portion;

[0029] The cover is characterized in that it has a first cover protrusion inserted into the first concave portion, a second cover protrusion provided to cover the terminal connection portion, and a third cover protrusion inserted into the second concave portion, and the edge of the cover is in contact with the end of the outer protrusion.

[0030] The wheel speed sensor and the method for manufacturing the wheel speed sensor according to the present invention do not require the creation of a combined insert, and are manufactured through a single injection molding process, so the process is simple, damage to the IC due to injection molding is prevented, and defects such as interface separation or air gap are prevented.

[0031] In addition, by providing a pressurizing auxiliary member on the outside of the IC connection part, there is an effect of more firmly fixing the IC connection part and the terminal connection part.

[0032] FIG. 1 is an exemplary cross-sectional view of a wheel speed sensor manufactured according to a method for manufacturing a wheel speed sensor according to the present invention.

[0033] Figure 2 is a perspective view showing a terminal placed on a body mold.

[0034] Figure 3 is a bottom perspective view showing the injection-molded body with the terminal as an insert.

[0035] Figure 4 is a perspective view showing the state in which the IC is placed on the main body.

[0036] FIG. 5 is an enlarged perspective view of part “A” of FIG. 4, illustrating a stacking step of a wheel speed sensor manufacturing method according to the present invention.

[0037] FIG. 6 is a perspective view illustrating a modified example of the stacking step of the wheel speed sensor manufacturing method according to the present invention.

[0038] Figure 7 illustrates the cover.

[0039] All technical and scientific terms used in the description of the present invention, unless otherwise defined, have the meanings commonly understood by those of ordinary skill in the art to which this disclosure pertains. All terms used in this disclosure have been selected for the purpose of more clearly explaining this disclosure and are not intended to limit the scope of rights under this disclosure.

[0040] Expressions such as “comprising,” “having,” and the like used in the description of the present invention should be understood as open-ended terms that imply the possibility of including other embodiments, unless otherwise stated in the phrase or sentence in which the expression is included.

[0041] The singular forms used in the description of the present invention may include plural meanings unless otherwise stated, and the same applies to the singular forms set forth in the claims.

[0042] The expressions “first,” “second,” etc. used in the description of the present invention are used to distinguish between multiple components, and do not limit the order or importance of the components.

[0043] When it is mentioned in the description of the present invention that a component is "connected" or "coupled" to another component, it should be understood that the component can be directly connected or coupled to the other component, or can be connected or coupled via a new other component.

[0044] Hereinafter, with reference to the attached drawings, a method for manufacturing a wheel speed sensor of the present invention will be described in detail.

[0045] FIG. 1 is a cross-sectional view illustrating an example of a wheel speed sensor manufactured according to a method for manufacturing a wheel speed sensor according to the present invention, FIG. 2 is a perspective view illustrating a state in which a terminal is placed on a body mold, FIG. 3 is a bottom perspective view illustrating a body injected with a terminal as an insert, FIG. 4 is a perspective view illustrating a state in which an IC is placed on the body, FIG. 5 is an enlarged perspective view of a portion “A” of FIG. 4 illustrated to explain a stacking step of a method for manufacturing a wheel speed sensor according to the present invention, FIG. 6 is a perspective view illustrated to explain a modified example of the stacking step of a method for manufacturing a wheel speed sensor according to the present invention, and FIG. 7 illustrates a cover.

[0046]

[0047] In the following description, the horizontal direction of Fig. 1 is referred to as the radial direction, the vertical direction is referred to as the up-down direction, and the direction indicated by “x” is referred to as downward.

[0048]

[0049] As shown in FIG. 1, a wheel speed sensor (100) according to the present invention comprises a main body (110), a terminal (120), and an IC (130).

[0050] The above main body (110) is manufactured from synthetic resin. The main body (110) is formed as a downwardly opened cylindrical hollow body with a circular cross-section. A hollow extension portion, which is a cylindrical hollow body that slopes upward from the radially outer side to the radially inner side, is extended on one upper side of the main body (110). A terminal terminal (121) of a terminal (120) is positioned on the hollow extension portion.

[0051] On the inside of the above main body (110), a first concave portion (111) that is concave downward is formed at a position where the hollow section is formed in one radial direction.

[0052] As shown in Fig. 5, an IC mounting portion (119) is formed on the inside of the main body (110) and protrudes downwardly in the radial direction outside of the first concave portion (111) and has a concave end.

[0053] On the inside of the main body (110), an outer protrusion (115) is further formed that protrudes downward and is spaced apart from the IC mounting portion (119) on both sides in the circumferential direction, and a second concave portion (117) is formed between the outer protrusion (115) and the IC mounting portion (119) on both sides in the circumferential direction of the IC mounting portion (119).

[0054] As illustrated in Fig. 1, a reinforcing member (150) may be further provided on the outer surface of the lower portion of the cylindrical portion of the main body (110). The reinforcing member (150) is made of a material such as metal. The reinforcing member (150) is formed in a cylindrical shape and is provided along the circumference of the main body (110) at the lower portion of the main body (110).

[0055] The terminal (120) is provided on the inside of the main body (110). The terminal (120) is made of metal in the shape of a plate having a length.

[0056] The terminal (120) is provided with two plates spaced symmetrically and parallel to each other. The terminal (120) may further be provided with a connecting portion between the two plates forming the terminal (120) and connected by the connecting portion. The connecting portion is provided in multiple numbers spaced apart from each other along the length direction between the two plates. A gap is formed between the two plates by extending along the length direction. The two plates forming the terminal (120) include a terminal connecting portion (123) and a terminal terminal (121).

[0057] The terminal connection portion (123) is provided in the shape of a rectangular plate. The radially outer side of the terminal connection portion (123) is bent downward, and the radially inner side is bent upward and extended. The terminal connection portion (123) forms a gap between terminal connection portions (123) that are provided in parallel and adjacent to each other.

[0058] The terminal terminal (121) is provided at the radially inner end of the terminal connection portion (123). The terminal terminal (121) is provided so as to be inclined upwardly in the radial direction from the upwardly extended radially inner end of the terminal connection portion (123).

[0059] The terminal terminal (121) protrudes from the upper portion of the main body (110) and is located in the hollow extension portion of the main body (110), and the terminal connection portion (123) is provided in the first concave portion (111) on the inside of the main body (110) so that the lower surface of the terminal connection portion (123) is exposed.

[0060] The outer protrusion (115) of the main body (110) is provided to protrude along the perimeter of the first concave portion (111) and the second concave portion (117) in addition to the outer side of the terminal connection portion (123).

[0061] The above IC (130; integrated circuit) is mounted on the main body (110) outside the terminal connection part (123). The IC (130) is mounted on the IC mounting part (119).

[0062] The IC (130) comprises an IC leg (132) that branches off from the IC (130) radially inward and is provided in parallel upward, and an IC connection portion (131) that is provided such that the end of the IC leg (132) is bent radially inward and contacts the outer side of the terminal connection portion (123).

[0063] The above IC connection parts (131) are spaced apart in the width direction and are respectively laminated on the outer side of the exposed terminal connection parts (123) and joined to the terminal connection parts (123).

[0064] At the lower part of the main body (110), a body protrusion (113) protruding downward is further formed between the first concave portion (111) and the IC mounting portion (119), and the main body protrusion (113) is located between terminal connection portions (123) spaced apart in the width direction.

[0065] The above body protrusion (113) protrudes downward between the terminal connection portions (123), and the downwardly protruding body protrusion (113) is pressurized and heated to form a stack portion (112) that covers the IC connection portions (131) on both sides stacked on the terminal connection portions (123).

[0066] On both sides in the width direction of the stack portion (112), as shown in FIG. 6, a pressurizing auxiliary member (114) may be further provided to cover the IC connection portion (131) and the terminal connection portion (123) on the outer side in the width direction of the IC connection portion (131) stacked on the terminal connection portion (123).

[0067] The wheel speed sensor (100) according to the present invention may further be provided with a cover (140) inserted into the outer protrusion (115) of the main body (110) to cover the terminal (120) and IC (130) exposed downward in the first concave portion (111) of the main body (110).

[0068] The above cover (140) comprises a plate-shaped second cover portion (143), a first cover portion (141) that is bent and extended radially inward from the upper portion of the second cover portion (143), and a third cover portion (145) that is bent and extended radially outward from the lower portion of the second cover portion (143).

[0069] The second cover part (143) is positioned to cover the terminal connection part (123). The second cover part (143) may be provided to be inclined downward as it radially outwards from the main body (110). The second cover part (143) is provided with a second cover protrusion (144) that protrudes upward to cover the terminal connection part (123).

[0070] The first cover part (141) is positioned radially inward from the upper portion of the second cover part (143). The first cover part (141) is positioned to cover the first concave part (111) of the main body (110). The first cover part (141) is provided with a first cover protrusion (142) that protrudes upward and is inserted into the first concave part (111).

[0071] The third cover part (145) is positioned radially outward from the lower portion of the second cover part (143). The third cover part (145) is positioned to cover the second concave part (117) of the main body (110) and the IC (130). The third cover part (145) is provided with a third cover protrusion (146) that protrudes upward and is inserted into the second concave part (117).

[0072] The cover (140) is inserted into the outer protrusion (115) and is provided on the main body (110). The cover (140) is further provided with a protruding extension (not shown) that protrudes upward along an edge, and the protruding extension is inserted into the outer protrusion (115), and the edge of the cover (140) can be provided by being hooked onto an end of the outer protrusion (115).

[0073]

[0074] The above wheel speed sensor (100) is manufactured by injection molding. The method for manufacturing a wheel speed sensor according to the present invention comprises an injection molding step, an IC placement step, a bonding step, a stacking step, and a coating step. The above wheel speed sensor manufacturing method may be performed by a cover assembly step instead of the coating step.

[0075] In the above injection step, the main body (110) is injected with the terminal (120) as an insert. In the present invention, as illustrated in FIG. 2, the terminal (120) is placed in the body mold (200), and a material to become the main body (110) is injected between the cover molds (not illustrated), so that the terminal (120) becomes an insert and the main body (110) is injection-molded.

[0076] In the above injection step, the body mold (200) has an upwardly protruding mold protrusion (210) on which the terminal (120) is placed, and a connection mounting portion (240) on which the terminal connection portion (123) of the terminal (120) is placed is provided on one side thereof, and an outer concave portion (250) is formed along the circumference on the outer side.

[0077] The above mold protrusion (210) protrudes upwardly from the center of the body mold (200) in a radial direction to one side. The mold protrusion (210) protrudes upwardly from the body mold (200) so that the radially outer surface extends upward from the upper portion of the body mold (200) and is formed to slope upward as it faces radially inward. The terminal (120) placed on the mold protrusion (210) is provided such that the terminal end (121) protrudes radially inwardly from the mold protrusion (210).

[0078] The above-mentioned connecting portion (240) is formed radially outwardly of the above-mentioned mold protrusion (210). The above-mentioned connecting portion (240) is formed concavely. The above-mentioned connecting portion (240) is formed so that a protrusion (230) protruding upward is formed at the center thereof and is spaced apart from each other. The terminal connecting portions (123) of two plates forming the terminal (120) are respectively seated on the above-mentioned connecting portion (240), and the spacing between the terminal connecting portions (123) spaced apart from each other is maintained by forming the protrusion (230).

[0079] In the above body mold (200), a concave mold recess (220) is further formed between the connecting portion mounting portions (240) radially inward of the protrusion (230). The mold recess (220) forms a body protrusion (113) of the main body (110).

[0080] The outer concave portion (250) is formed along the perimeter of the mold protrusion (210) and the connecting portion mounting portion (240). The outer concave portion (250) is formed along the perimeter of the mold protrusion (210) and the connecting portion mounting portion (240) and is opened radially outward. The outer concave portion (250) is formed to have a deeper depth than the connecting portion mounting portion (240) at the position where the connecting portion mounting portion (240) is formed.

[0081] And, on the radially outer side of the connection mounting portion (240) where the terminal connection portion (123) is placed, an IC recess (260) is formed that is concave and has a protrusion protruding upward on the bottom. The protrusion formed on the bottom of the IC recess (260) forms an IC mounting portion (119) of the main body (110) into which the IC (130) is inserted. A groove that is more concave than the bottom of the IC recess (260) is formed on both sides of the circumferential direction of the protrusion formed on the bottom of the IC recess (260), and the groove formed in the IC recess (260) forms a second main body protrusion (113-1) of the main body (110).

[0082] The IC recess (260) is formed between the two ends that are opened radially outwardly of the outer recess (250). The IC recess (260) is formed radially outwardly of the protrusion (230). The IC recess (260) is formed concavely to have a deeper depth than the recess formed in the connecting portion mounting portion (240).

[0083] The cover mold, which is not shown, is formed as a downward-opening hollow body. The inner diameter of the cover mold is formed to be larger than the outer diameter of the body mold (200). A space into which the mold protrusion (210) and terminal (120) are inserted is formed on one upper side of the cover mold.

[0084] In the above injection step, the terminal (120) is placed on the body mold (200), and the cover mold is positioned above the body mold (200) and the terminal (120), and then a material to become the main body (110) is injected between the cover mold (not shown) and the body mold (200), so that the terminal (120) becomes an insert and the main body (110) is injection-molded so that the terminal connection portion (123) is exposed.

[0085] The terminal (120) is provided on the inside of the main body (110). The main body (110) is made of synthetic resin. The main body (110) is formed as a downwardly opened hollow body with a circular cross-section. A hollow extension portion, which is a cylindrical hollow body that slopes upward from the radially outer side to the radially inner side, is extended on one upper side of the main body (110). The terminal terminal (121) is positioned on the hollow extension portion.

[0086] As shown in Fig. 7, the main body (110) has an outer protrusion (115) formed on the inside by an outer concave portion (250) of the body mold (200) that protrudes downward along the perimeter toward the outside of the terminal connection portion (123).

[0087] In the above body (110), a first concave portion (111) is formed radially inwardly of the terminal connection portion (123) by the mold protrusion (210), an IC mounting portion (119) is formed radially outwardly of the terminal connection portion (123) by the IC concave portion (260) and protrudes downwardly from the terminal connection portion (123) and has a concave end, and a second concave portion (117) is formed on both sides of the IC mounting portion (119) by the connection mounting portion (240). The outer protrusion (115) is provided to protrude along the perimeter of the first concave portion (111) and the second concave portion (117) in addition to the outer side of the terminal connection portion (123).

[0088] In Fig. 3, drawing reference numeral 113 illustrates a main body protrusion (113) formed by the mold concave portion (220).

[0089] In FIGS. 1, 3, and 4, reference numeral 150 illustrates a reinforcing body (150) that improves the rigidity of the wheel speed sensor (100).

[0090] The above reinforcing body (150) is made of a material such as metal. The reinforcing body (150) is formed in a cylindrical shape and is provided along the circumference of the main body (110) at the lower portion of the main body (110).

[0091] For example, the reinforcing body (150) is formed by a terminal (120) being installed in the body mold (200), a cover mold being positioned above the body mold (200) and the terminal (120), and a cylindrical reinforcing body (150) being inserted between the body mold (200) and the cover mold, and then a material to become the main body (110) is injected between the cover mold (not shown) and the body mold (200) so that the terminal (120) and the reinforcing body (150) become inserts and the main body (110) can be injection-molded.

[0092]

[0093] The method for manufacturing a wheel speed sensor after the above injection step is performed with the lower part of the main body (110) facing upward.

[0094] As shown in FIGS. 4 and 5, in the IC placement step, an IC (130) is placed on the main body (110). The IC (130) is inserted and placed in an IC mounting portion (119) concavely formed on the main body (110). The IC (130) is provided on the outer side of the radial reflection of the terminal (120) within the main body (110).

[0095] The IC (130) further includes an IC leg (132) that branches off from the IC (130) radially inward and is provided in parallel upward, and an IC connection portion (131) that is provided such that the end of the IC leg (132) is bent radially inward and is in contact with the outer side of the terminal connection portion (123).

[0096] In the above IC placement step, the IC (130) is placed on the main body (110) so that the IC connection portion (131) is stacked on the outside of the exposed terminal connection portion (123). The IC (130) is inserted and placed in the IC mounting portion (119) formed concavely in the main body (110), and the IC connection portions (131) are stacked on the outside of the terminal connection portions (123) on both sides.

[0097] Since the IC (130) is placed in the IC placement step after the injection step, damage to the IC (130) due to injection is prevented.

[0098] In the above bonding step, after the IC (130) is placed, the terminal connection part (123) of the terminal (120) and the IC connection part (131) of the IC (130) are bonded. In the above bonding step, the IC (130) and the terminal (120) are melted and bonded by electrical resistance by conducting current through the stacked IC connection part (131) and terminal connection part (123).

[0099] The above bonding step may be performed between the IC placement step and the stacking step, or may be performed after the stacking step.

[0100] In the stacking step, as illustrated in FIG. 5, the main body protrusion (113) protruding between the terminal connection portions (123) is pressurized and heated to form a stack portion (112) that covers the IC connection portions (131) on both sides stacked on the terminal connection portions (123). The stack portion (112) is formed so that the main body protrusion (113) is pressed by a heated plate-shaped pressing member to deform laterally and cover the IC connection portions (131) on both sides. By forming the stack portion (112), separation of the IC connection portion (131) and the terminal connection portion (123) is prevented.

[0101] In the above stacking step, the second main body protrusion (113-1) formed to protrude outwardly in the circumferential direction of the IC mounting portion (119) is pressurized and heated to further form a second stack portion (112-1) that covers the IC (130) inserted into the IC mounting portion (119). The second stack portion (112-1) is formed so that the second main body protrusion (113-1) is pressed by a heated plate-shaped pressing member to deform laterally and cover both sides of the IC (130). By forming the second stack portion (112-1), separation of the IC (130) is prevented and it is firmly fixed.

[0102] As illustrated in Fig. 6, a pressing auxiliary member (114) may be further provided to cover the IC connection part (131) and the terminal connection part (123) on the outer side in the width direction of the IC connection parts (131) laminated on the terminal connection part (123). The pressing auxiliary member (114) is made of a synthetic resin material such as nylon.

[0103] When the above-mentioned pressurizing auxiliary member (114) is provided, the stacking step positions the plate-shaped pressurizing auxiliary member (114) on the outer side in the width direction of the two-sided IC connection parts (131) stacked on the terminal connection part (123), and pressurizes and heats the main body protrusion part (113) protruding between the terminal connection parts (123) to form a stack part (112) so as to cover the two-sided IC connection parts (131) stacked on the terminal connection part (123).

[0104] By further adding a pressurizing auxiliary member (114) to the outer side in the width direction of the IC connection portion (131), high heat is prevented from being transferred to the IC connection portion (131) and terminal connection portion (123) during the stacking process, and the pressurizing auxiliary member (114) holds the entire width direction to prevent load concentration, thereby providing more stable fixation.

[0105]

[0106] In the above-described application step, a sealing material is applied to cover the terminal (120) and IC (130) exposed after the above-described bonding and stacking steps. In the above-described application step, the sealing material is applied to cover the terminal (120) and IC (130) exposed downward of the main body (110) after the above-described bonding and stacking steps are performed. The sealing material is a liquid sealant, and the liquid sealant is applied to cover the terminal (120) and IC (130) exposed downward of the main body (110) and solidifies to form a cover portion that covers the exposed terminal (120) and IC (130).

[0107]

[0108] The above wheel speed sensor manufacturing method may be performed by a cover assembly step instead of the above coating step.

[0109] In the above cover assembly step, a cover (140) is assembled to the main body (110) to cover the terminal (120) and IC (130) exposed after the bonding step and stacking step. The cover (140) can be manufactured through a separate injection molding process. The cover (140) is manufactured from synthetic resin.

[0110] As shown in Fig. 7, the cover (140) comprises a plate-shaped second cover portion (143), a first cover portion (141) that is bent and extended radially inward from the upper portion of the second cover portion (143), and a third cover portion (145) that is bent and extended radially outward from the lower portion of the second cover portion (143).

[0111] The second cover part (143) is positioned to cover the terminal connection part (123). The second cover part (143) may be provided to be inclined downward as it radially outwards from the main body (110). The second cover part (143) is provided with a second cover protrusion (144) that protrudes upward to cover the terminal connection part (123).

[0112] The first cover part (141) is positioned radially inward from the upper portion of the second cover part (143). The first cover part (141) is positioned to cover the first concave part (111) of the main body (110). The first cover part (141) is provided with a first cover protrusion (142) that protrudes upward and is inserted into the first concave part (111).

[0113] The third cover part (145) is positioned radially outward from the lower portion of the second cover part (143). The third cover part (145) is positioned to cover the second concave part (117) of the main body (110) and the IC (130). The third cover part (145) is provided with a third cover protrusion (146) that protrudes upward and is inserted into the second concave part (117).

[0114] The cover (140) is inserted into the outer protrusion (115) and is provided on the main body (110). The cover (140) is further provided with a protruding extension (not shown) that protrudes upward along an edge, and the protruding extension is inserted into the outer protrusion (115), and the edge of the cover (140) can be provided by being hooked onto an end of the outer protrusion (115).

[0115] As described above, the method for manufacturing a wheel speed sensor according to the present invention is simple in that it involves a single injection process, and defects such as interface separation or air gap of the wheel speed sensor (100) are prevented.

[0116]

[0117] The wheel speed sensor and the method for manufacturing the wheel speed sensor according to the present invention are manufactured through a single injection without the need to create a combined insert, so the process is simple and the manufacturing process is efficient, damage to the IC due to injection is prevented, defects such as interface separation or air caps are prevented, and waste of materials is prevented, thereby reducing costs.

Claims

1. A main body (110) having a cylindrical hollow body with a downward opening and a first concave portion (111) that is concave downward on one side in the radial direction, A terminal (120) provided on the inside of the main body (110), including a plate-shaped terminal connection portion (123) provided in the first concave portion (111), and a terminal terminal (121) extending upwardly from the terminal connection portion (123) and protruding to the upper portion of the main body (110) and extending upwardly in a radially inwardly inclined manner, It comprises an IC (130) that is installed on the main body (110) and provided on the outside of the terminal connection part (123) on the inside of the main body (110); A wheel speed sensor (100) characterized in that an IC connection portion (131) branching from the IC (130) and extending upward and radially inwardly bent is provided on the radially inner side of the IC (130), and the IC connection portion (131) branched from the IC (130) is provided by being joined to the terminal connection portion (123).

2. In the first paragraph, an IC mounting portion (119) is formed on the main body (110) so as to protrude downwardly from the terminal connection portion (123) radially outward from the terminal connection portion (123) and have a concave end, a concave second concave portion (117) is formed on both sides of the IC mounting portion (119), and an outer protrusion (115) is formed so as to protrude downwardly along the perimeter of the terminal connection portion (123) and the second concave portion (117) outside the terminal connection portion (123); A wheel speed sensor (100) characterized in that the above IC (130) is mounted and provided in an IC mounting portion (119).

3. In the second paragraph, the terminal connecting portions (123) are spaced apart in the width direction to form a gap, and the main body (110) is further provided with a main body protrusion portion (113) that protrudes at the gap formed between the terminal connecting portions (123); A wheel speed sensor (100) characterized in that the above-mentioned branched IC connection portions (131) are respectively provided in terminal connection portions (123) spaced apart in the width direction, and a body protrusion portion (113) protruding between the terminal connection portions (123) is formed into a stack portion (112) that covers the IC connection portions (131) on both sides stacked on the terminal connection portions (123) by being pressurized and heated.

4. In the third paragraph, a pressing auxiliary member (114) is further provided to cover the IC connection part (131) and the terminal connection part (123) on the outer side in the width direction of the IC connection part (131) stacked on the terminal connection part (123), and a body protrusion part (113) protruding between the pressing auxiliary member (114) and the terminal connection part (123) is formed into a stack part (112) that covers the IC connection parts (131) on both sides stacked on the terminal connection part (123) by being pressurized and heated.

5. In the second paragraph, a plate-shaped cover (140) is further provided that is inserted into the outer protrusion (115) of the main body (110) to cover the terminal (120) and IC (130) exposed downward in the first concave portion (111); A wheel speed sensor (100) characterized in that the cover (140) has a first cover protrusion (142) inserted into the first concave portion (111), a second cover protrusion (144) provided to cover the terminal connection portion (123), and a third cover protrusion (146) inserted into the second concave portion (117), and the edge of the cover (140) is in contact with the end of the outer protrusion (115).

6. In a method for manufacturing a wheel speed sensor (100) described in any one of clauses 1 to 5, A step (injection step) in which the main body (110) is injected with the terminal (120) as an insert, An IC placement step for placing an IC (130; integrated circuit) on the main body (110); A method for manufacturing a wheel speed sensor, characterized in that it includes a bonding step in which a terminal connection part (123) of a terminal (120) and an IC connection part (131) of an IC (130) are bonded after an IC (130) is placed.

7. A method for manufacturing a wheel speed sensor, characterized in that in the injection step of paragraph 6, the main body (110) is injection-molded so that the terminal connection part (123) is exposed, and in the IC placement step, the IC (130) is placed on the main body (110) so that the IC connection part (131) is laminated on the outside of the exposed terminal connection part (123).

8. A method for manufacturing a wheel speed sensor, characterized in that in the 7th paragraph, a stacking step is further included, and in the stacking step, a main body protrusion (113) protruding between terminal connection parts (123) is pressurized and heated to form a stack part (112) that covers the IC connection parts (131) on both sides stacked on the terminal connection parts (123).

9. In the 8th paragraph, in the stacking step, a pressing auxiliary member (114) is further provided to cover the IC connection part (131) and the terminal connection part (123) on the outer side in the width direction of the IC connection parts (131) stacked on the terminal connection part (123), and a body protrusion part (113) protruding between the terminal connection parts (123) is pressurized and heated to form a stack part (112) covering the IC connection parts (131) stacked on the terminal connection part (123).

10. A method for manufacturing a wheel speed sensor, characterized in that in the 8th paragraph, the bonding step is performed between the IC placement step and the stacking step or after the stacking step.

11. A method for manufacturing a wheel speed sensor, characterized in that it includes a coating step of applying a sealing material to cover the exposed terminal (120) and IC (130) after the bonding step in the 10th paragraph.

12. A method for manufacturing a wheel speed sensor, characterized in that in the 10th paragraph, a cover assembly step is further included in which a cover (140) is assembled to the main body (110) to cover the exposed terminal (120) and IC (130) after the bonding step.

13. A method for manufacturing a wheel speed sensor, characterized in that in the 12th paragraph, the main body (110) is formed with an outer protrusion (115) that protrudes along the periphery outside the terminal connection portion (123); and the cover (140) is inserted into the outer protrusion (115) and provided on the main body (110).

14. In the 13th paragraph, the main body (110) is formed with a first concave portion (111) concave inwardly in the radial direction of the terminal connection portion (123), an IC mounting portion (119) protruding from the terminal connection portion (123) and having a concave end is formed radially outwardly of the terminal connection portion (123), and a second concave portion (117) concave is formed on both sides of the IC mounting portion (119); and the outer protrusion (115) is provided to protrude along the perimeter of the first concave portion (111) and the second concave portion (117) in addition to the outer side of the terminal connection portion (123); A method for manufacturing a wheel speed sensor, characterized in that the cover (140) has a first cover protrusion (142) inserted into the first concave portion (111), a second cover protrusion (144) provided to cover the terminal connection portion (123), and a third cover protrusion (146) inserted into the second concave portion (117), and the edge of the cover (140) is in contact with the end of the outer protrusion (115).

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