Multifunctional adhesion promoter for semiconductor device packages

The use of a polyimide adhesion promoter layer derived from tetracarboxylic dianhydride and functional diamines addresses the delamination issues in semiconductor device packages, improving adhesion and reliability under high temperature conditions.

WO2025085329A1 Publication Date: 2025-04-24WOLFSPEED INC
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Patent Information

Application Number
PCT/US2024/050926
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-10-16
Filing Date
2024-10-11
Publication Date
2025-04-24

AI Technical Summary

Technical Problem

Existing semiconductor device packages face reliability challenges such as interfacial delamination, performance degradation, and failures due to lack of sufficient adhesion between various components, particularly at high temperature conditions.

Method used

A multifunctional adhesion promoter layer made of polyimide, derived from tetracarboxylic dianhydride and diamines with functional groups like benzoxazole and benzimidazole, is used to enhance interfacial adhesion across multiple surfaces within the semiconductor device package.

Benefits of technology

The polyimide adhesion promoter layer significantly improves the interfacial adhesion strength, mitigates delamination, and enhances the thermal and mechanical properties of the semiconductor device package, even under harsh operational conditions.

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Abstract

Semiconductor device packages are provided. The semiconductor device package comprises a first structure having a first surface in the semiconductor device package, a second structure having a second surface in the semiconductor device package, and an adhesion promoting layer in contact with the first surface on a first side and the second surface on a second side. The adhesion promoting layer comprises a polyimide containing repeating units derived from a tetracarboxylic dianhydride and at least one diamine containing a functional group, wherein a diamine benzoxazole or a diamine benzimidazole are preferred, and a combination of a diamine benzoxazole and a diamine benzimidazole is particularly preferred.
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