Imaging device and electronic device comprising same

Abstract

According to one embodiment of the present disclosure, an imaging device may comprise: an image sensor; and a lens assembly configured to focus or guide light to the image sensor by comprising at least five lenses sequentially aligned along an optical axis from a first lens farthest from the image sensor. In one embodiment, the lens assembly or the at least five lenses may comprise: a first lens having a positive refractive power; a second lens disposed between the first lens and the image sensor and having a negative refractive power; a third lens disposed between the second lens and the image sensor and having a negative refractive power; a fourth lens having a meniscus shape convex toward the image sensor and a shape in which the thickness thereof decreases toward the edge, wherein the fourth lens is disposed between the third lens and the image sensor and has a positive refractive power; and a fifth lens having a shape in which the object-side surface is convex and the sensor-side surface is concave in a central region, wherein the fifth lens is disposed between the fourth lens and the image sensor and has a negative refractive power. In one embodiment, the lens assembly can be easily miniaturized while providing optical performance suitable for a large / high-pixel image sensor by satisfying at least some of the conditions disclosed in the present document. Various other embodiments may also be possible.

Description

Imaging device and electronic device including the same

[0001] Embodiments of the present disclosure relate to an imaging device, for example, an imaging device including a plurality of lenses, and an electronic device including the same.

[0002] Optical devices, such as cameras capable of capturing images or videos, have been widely used for a long time. Recently, digital cameras and video cameras equipped with solid-state image sensors, such as charge-coupled devices (CCDs) or complementary metal-oxide semiconductors (CMOSs), have become widespread. Optical devices employing solid-state image sensors (CCDs or CMOSs) are gradually replacing film-based optical devices because they facilitate image storage, reproduction, and transfer compared to film-based optical devices.

[0003] Recently, multiple optical devices, such as a macro camera, a telephoto camera, and / or a wide-angle camera, are being mounted on a single electronic device to improve the quality of captured images and also to provide various visual effects to the captured images. For example, multiple cameras with different optical characteristics can acquire subject images and synthesize them to obtain a high-quality captured image. As multiple optical devices (e.g., cameras) are mounted to acquire high-quality captured images, electronic devices such as mobile communication terminals and smart phones are gradually replacing electronic devices specialized in capturing functions, such as digital compact cameras, and it is expected that in the future, they will be able to replace high-performance cameras such as digital single-lens reflex cameras (DSLR).

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] According to one embodiment of the present disclosure, an imaging device may include an image sensor, and a lens assembly configured to focus or guide light to the image sensor by including at least five lenses sequentially aligned along an optical axis from a first lens furthest from the image sensor. In one embodiment, the lens assembly or the at least five lenses may include: the first lens having a positive refractive power; a second lens disposed between the first lens and the image sensor and having a negative refractive power; a third lens disposed between the second lens and the image sensor and having a negative refractive power; a fourth lens having a meniscus shape convex toward the image sensor and thinning as it approaches an edge, the fourth lens being disposed between the third lens and the image sensor and having a positive refractive power; and a fifth lens having a shape in which a surface on the subject side in a central region is convex and a surface on the sensor side is concave, the fifth lens being disposed between the fourth lens and the image sensor and having a negative refractive power. In one embodiment, the lens assembly may satisfy the following [Conditional Expression 1].

[0006] [Condition 1]

[0007] 1.5 =< (T34+T45) / T23 =< 3

[0008] Here, 'T23' may be an air gap between the second lens and the third lens, which may be a gap measured from the optical axis, 'T34' may be an air gap between the third lens and the fourth lens, which may be a gap measured from the optical axis, and 'T45' may be an air gap between the fourth lens and the fifth lens, which may be a gap measured from the optical axis.

[0009] According to one embodiment of the present disclosure, an electronic device may include an image sensor, a lens assembly configured to focus or guide light to the image sensor by including at least five lenses sequentially aligned along an optical axis from a first lens furthest from the image sensor, a processor, and a memory storing instructions that, when executed by the processor, cause the electronic device to receive light using the image sensor. In one embodiment, the lens assembly or the at least five lenses may include the first lens having positive refractive power, the second lens disposed between the first lens and the image sensor and having negative refractive power, the third lens disposed between the second lens and the image sensor and having negative refractive power, the fourth lens having a meniscus shape convex toward the image sensor and becoming thinner as it approaches the edge, the fourth lens being disposed between the third lens and the image sensor and having positive refractive power, and the fifth lens having a shape in which a subject-side surface in a central region is convex and a sensor-side surface is concave, the fifth lens being disposed between the fourth lens and the image sensor and having negative refractive power. In one embodiment, the electronic device and / or the lens assembly as described above may satisfy the following [Conditional Expressions 1 and 2].

[0010] [Condition 1]

[0011] 1.5 =< (T34+T45) / T23 =< 3

[0012] [Condition 2]

[0013] 0.6 =< OAL / (ImgH*2) =< 0.69

[0014] Here, 'T23' is an air gap between the second lens and the third lens, which is a gap measured from the optical axis, 'T34' is an air gap between the third lens and the fourth lens, which is a gap measured from the optical axis, 'T45' is an air gap between the fourth lens and the fifth lens, which is a gap measured from the optical axis, 'OAL' is a distance from the subject-side surface of the first lens to the image sensor, which is a distance measured from the optical axis, and 'ImgH' may be a maximum height of the image sensor.

[0015] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0016] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.

[0017] FIG. 2 is a block diagram illustrating a camera module according to one embodiment of the present disclosure.

[0018] FIG. 3 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 4 is a perspective view showing the rear side of the electronic device illustrated in FIG. 3, according to one embodiment of the present disclosure.

[0020] FIG. 5 is a drawing showing an imaging device and / or lens assembly according to one embodiment of the present disclosure.

[0021] FIG. 6 is a graph showing spherical aberration of the lens assembly of FIG. 5 according to one embodiment of the present disclosure.

[0022] FIG. 7 is a graph showing astigmatism of the lens assembly of FIG. 5 according to one embodiment of the present disclosure.

[0023] FIG. 8 is a graph showing the distortion ratio of the lens assembly of FIG. 5 according to one embodiment of the present disclosure.

[0024] FIG. 9 is a drawing showing an imaging device and / or lens assembly according to one embodiment of the present disclosure.

[0025] FIG. 10 is a graph showing spherical aberration of the lens assembly of FIG. 9 according to one embodiment of the present disclosure.

[0026] FIG. 11 is a graph showing astigmatism of the lens assembly of FIG. 9, according to one embodiment of the present disclosure.

[0027] FIG. 12 is a graph showing the distortion ratio of the lens assembly of FIG. 9 according to one embodiment of the present disclosure.

[0028] FIG. 13 is a drawing showing an imaging device and / or lens assembly according to one embodiment of the present disclosure.

[0029] FIG. 14 is a graph showing spherical aberration of the lens assembly of FIG. 13 according to one embodiment of the present disclosure.

[0030] FIG. 15 is a graph showing astigmatism of the lens assembly of FIG. 13 according to one embodiment of the present disclosure.

[0031] FIG. 16 is a graph showing the distortion ratio of the lens assembly of FIG. 13 according to one embodiment of the present disclosure.

[0032] FIG. 17 is a drawing showing an imaging device and / or lens assembly according to one embodiment of the present disclosure.

[0033] FIG. 18 is a graph showing spherical aberration of the lens assembly of FIG. 17 according to one embodiment of the present disclosure.

[0034] FIG. 19 is a graph showing astigmatism of the lens assembly of FIG. 17 according to one embodiment of the present disclosure.

[0035] FIG. 20 is a graph showing the distortion ratio of the lens assembly of FIG. 17 according to one embodiment of the present disclosure.

[0036] FIG. 21 is a drawing showing an imaging device and / or lens assembly according to one embodiment of the present disclosure.

[0037] FIG. 22 is a graph showing spherical aberration of the lens assembly of FIG. 21 according to one embodiment of the present disclosure.

[0038] FIG. 23 is a graph showing astigmatism of the lens assembly of FIG. 21 according to one embodiment of the present disclosure.

[0039] FIG. 24 is a graph showing the distortion ratio of the lens assembly of FIG. 21 according to one embodiment of the present disclosure.

[0040] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0041] Electronic devices are becoming increasingly miniaturized, and the conditions for securing optical performance when integrating imaging devices such as cameras into these devices are becoming increasingly challenging. For example, while increasing the number and size of lenses can facilitate improved optical performance in imaging devices, these limitations may limit their integration into miniaturized electronic devices. As user demand for more advanced optical performance increases, image sensor performance is improving through pixel counts and size (e.g., image height). However, miniaturizing lens assemblies that match the performance of these image sensors can be increasingly challenging.

[0042] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and at least provide the advantages described below, and can provide an imaging device having optical performance suitable for a high-pixel and / or large-sized image sensor and / or an electronic device including the same.

[0043] One embodiment of the present disclosure can provide an imaging device and / or an electronic device including the same that has optical performance suitable for a high-pixel and / or large-sized image sensor and implements good close-up shooting performance.

[0044] One embodiment of the present disclosure can provide an imaging device and / or an electronic device including the same that is easy to be miniaturized while having optical performance suitable for a high-pixel and / or large-sized image sensor.

[0045] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0046] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0047] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0048] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0049] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0050] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0051] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0052] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0053] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0054] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0055] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0056] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0057] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0058] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0060] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0061] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0062] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0063] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0064] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0065] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0066] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0067] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0068] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0069] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0070] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0071] FIG. 2 is a block diagram (200) illustrating a camera module (280) (e.g., camera module (180) of FIG. 1) according to one embodiment of the present disclosure. Referring to FIG. 2, the camera module (280) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). In one embodiment, the lens assembly (210) may include an image sensor (230). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (280) may include a plurality of lens assemblies (210). In this case, the camera module (280) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, F-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. The lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0072] The flash (220) can emit light used to enhance light emitted or reflected from a subject. In one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. In one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0073] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (280) or the electronic device (201) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (280) or the electronic device (e.g., the electronic device (101) of FIG. 1) by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (280). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160) of FIG. 1. Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of a memory (e.g., the memory (130) of FIG. 1) or as a separate memory that operates independently therefrom.

[0074] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (280) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (280) (e.g., memory (130) of FIG. 1, display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include a processor (e.g., 1) may be configured as at least a part of the processor (120) or may be configured as a separate processor that operates independently of the processor (120). When the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0075] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIG. 1) may include a plurality of camera modules (280), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (280) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (280) may be a front camera, and at least another may be a rear camera.

[0076] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0077] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0078] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0079] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0080] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0081] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0082] FIG. 3 is a perspective view showing the front side of an electronic device (300) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure. FIG. 4 is a perspective view showing the rear side of the electronic device (300) illustrated in FIG. 3 according to one embodiment of the present disclosure.

[0083] Referring to FIGS. 3 and 4 , an electronic device (300) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (310) that includes a first side (or front side) (310A), a second side (or back side) (310B), and a side surface (310C) that surrounds a space between the first side (310A) and the second side (310B). In one embodiment (not shown), the housing (310) may also refer to a structure that forms a portion of the first side (310A), the second side (310B), and the side surface (310C) of FIG. 3 . According to one embodiment, the first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). In one embodiment, the front plate (302) may be coupled to the housing (310) to form an internal space together with the housing (310). In one embodiment, the term “internal space” may refer to an internal space of the housing (310) that accommodates at least a portion of the display (301) described below or the display module (160) of FIG. 1.

[0084] In one embodiment, the second side (310B) may be formed by a substantially opaque back plate (311). The back plate (311) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (310C) may be formed by a side bezel structure (or “side member”) (318) that is coupled to the front plate (302) and the back plate (311) and comprises a metal and / or a polymer. In one embodiment, the back plate (311) and the side bezel structure (318) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0085] In the illustrated embodiment, the front plate (302) may include two first regions (310D) that extend seamlessly from the first surface (310A) toward the rear plate (311), at both ends of a long edge of the front plate (302). In the illustrated embodiment (see FIG. 4), the rear plate (311) may include two second regions (310E) that extend seamlessly from the second surface (310B) toward the front plate (302), at both ends of a long edge. In one embodiment, the front plate (302) (or the rear plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). In one embodiment, some of the first regions (310D) or some of the second regions (310E) may not be included. In the above embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a first thickness (or width) on a side that does not include the first region (310D) or the second region (310E) (e.g., a side where the connector hole (308) is formed), and may have a second thickness that is thinner than the first thickness on a side that includes the first region (310D) or the second region (310E) (e.g., a side where the key input device (317) is arranged).

[0086] According to one embodiment, the electronic device (300) may include at least one of a display (301), an audio module (303, 307, 314), a sensor module (304, 316, 319), a camera module (305, 312, 313) (e.g., the camera module (180, 280) of FIG. 1 or 2), a key input device (317), a light-emitting element (306), and a connector hole (308, 309). In one embodiment, the electronic device (300) may omit at least one of the components (e.g., the key input device (317) or the light-emitting element (306)) or may additionally include other components.

[0087] The display (301) (e.g., the display module (160) of FIG. 1) may be visually exposed, for example, through a substantial portion of the front plate (302). In one embodiment, at least a portion of the display (301) may be visually exposed through the front plate (302) forming the first surface (310A) and the first area (310D) of the side surface (310C). In one embodiment, the corners of the display (301) may be formed to be substantially identical to the adjacent outer shape of the front plate (302). In one embodiment (not shown), in order to expand the area in which the display (301) is visually exposed, the gap between the outer edge of the display (301) and the outer edge of the front plate (302) may be formed to be substantially identical.

[0088] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area (e.g., an active area) or an area outside the screen display area (e.g., an inactive area) of the display (301), and at least one of an audio module (314) (e.g., an audio module (170) of FIG. 1), a sensor module (304) (e.g., a sensor module (176) of FIG. 1), a camera module (305), and a light-emitting element (306) may be included aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (314), a sensor module (304), a camera module (305) (e.g., an under display camera (UDC)), a fingerprint sensor (316), and a light-emitting element (306) may be included on a back surface of the screen display area of ​​the display (301). In one embodiment (not shown), the display (301) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (304, 319) and / or at least a portion of the key input device (317) may be disposed in the first areas (310D) and / or the second areas (310E).

[0089] The audio module (303, 307, 314) may include a microphone hole (303) and a speaker hole (307, 314). The microphone hole (303) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. The speaker hole (307, 314) may include an external speaker hole (307) and a receiver hole (314) for calls. In one embodiment, the speaker hole (307, 314) and the microphone hole (303) may be implemented as a single hole, or a speaker may be included without the speaker hole (307, 314) (e.g., a piezo speaker).

[0090] The sensor modules (304, 316, 319) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device (300) or the external environmental state. The sensor modules (304, 316, 319) may include, for example, a first sensor module (304) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (310A) of the housing (310), and / or a third sensor module (319) (e.g., an HRM sensor) and / or a fourth sensor module (316) (e.g., a fingerprint sensor) disposed on a second surface (310B) of the housing (310). The fingerprint sensor may be disposed on the first surface (310A) (e.g., the display (301)) of the housing (310) as well as the second surface (310B). The electronic device (300) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0091] The camera module (305, 312, 313) may include a first camera device (305) disposed on a first side (310A) of the electronic device (300), and a second camera device (312) and / or a flash (313) disposed on a second side (310B). The camera module (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (300).

[0092] The key input device (317) may be disposed on a side surface (310C) of the housing (310). In one embodiment, the electronic device (300) may not include some or all of the above-mentioned key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301). In one embodiment, the key input device may include a sensor module (316) disposed on a second surface (310B) of the housing (310).

[0093] The light-emitting element (306) may be disposed, for example, on the first surface (310A) of the housing (310). The light-emitting element (306) may provide, for example, status information of the electronic device (300) in the form of light. In one embodiment, the light-emitting element (306) may provide a light source that is linked to the operation of, for example, the camera module (305). The light-emitting element (306) may include, for example, an LED, an IR LED, and a xenon lamp.

[0094] The connector holes (308, 309) may include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (309) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0095] In examining the embodiments below, reference may be made to the electronic devices (101, 102, 104, 300) and / or camera modules (180, 280, 305, 312, 313) of the embodiments described above. The imaging devices (400, 500, 600, 700, 800) of the embodiments described below may implement at least a part or all of the camera modules (180, 280, 305, 312, 313) described above.

[0096] FIG. 5 is a diagram illustrating an imaging device (400) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 6 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 5 according to an embodiment of the present disclosure. FIG. 7 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 5 according to an embodiment of the present disclosure. FIG. 8 is a graph illustrating a distortion ratio of the lens assembly (LA) of FIG. 5 according to an embodiment of the present disclosure.

[0097] FIG. 6 is a graph showing spherical aberration of an imaging device (400) and / or a lens assembly (LA) according to one embodiment of the present disclosure, in which the horizontal axis represents a coefficient of longitudinal spherical aberration, the vertical axis represents a normalized distance from the optical axis, and the change in longitudinal spherical aberration according to the wavelength of light is shown. The longitudinal spherical aberration is shown for light having wavelengths of, for example, 656.3000 (NM, nanometer), 587.6000 (NM), 546.1000 (NM), 486.1000 (NM), and 435.8000 (NM), respectively. FIG. 7 is a graph showing astigmatism of an imaging device (400) and / or a lens assembly (LA) according to an embodiment of the present disclosure, for light having a wavelength of 546.1000 nm, where 'S' exemplifies a sagittal plane with a solid line and 'T' exemplifies a tangential plane (or meridional plane) with a dotted line. FIG. 8 is a graph showing a distortion rate of an imaging device (400) and / or a lens assembly (LA) according to an embodiment of the present disclosure, for light having a wavelength of 546.1000 nm. The refractive index of the lens(es) mentioned in the embodiment described below may refer to the refractive index for light having a wavelength of approximately 587.6000 nm.

[0098] Referring to FIGS. 5 to 8, an imaging device (400) according to an embodiment of the present disclosure (e.g., lens assembly (210) of FIG. 2) may include an image sensor (I, 230) and a lens assembly (LA). The lens assembly (LA) may include, for example, at least five lenses (L1, L2, L3, L4, L5). In one embodiment, at least one of the lenses (L1, L2, L3, L4, L5) may be a lens made of plastic. For example, within a range that satisfies the condition(s) described below, at least one of the lenses (L1, L2, L3, L4, L5) may be made of plastic. By being made of plastic, the manufacturing time or manufacturing cost may be reduced, and / or the lenses (L1, L2, L3, L4, L5) may be easily manufactured in a designed shape.

[0099] According to one embodiment, the lenses (L1, L2, L3, L4, L5) may be arranged sequentially along the optical axis (O) from the subject (SBJ) side toward the image sensor (I, 230). For example, the lenses (L1, L2, L3, L4, L5) may be arranged substantially aligned with the image sensor (I, 230) along the optical axis (O). In the embodiment described below, the ordinal numbers, 'first', 'second', 'third', 'fourth', and 'fifth', assigned to the lenses (L1, L2, L3, L4, L5) may refer to the arrangement order from the subject (SBJ) side. In one embodiment, in the imaging device (400) and / or the lens assembly (LA), an aperture stop (or stop) may be arranged between the first lens (L1) and the third lens (L3). In one embodiment, the aperture (stop) may be understood to be implemented on the sensor side (S4) of the second lens (L2).

[0100] According to one embodiment, an optical component such as an infrared cut filter (F) may be disposed between at least one of five lenses (L1, L2, L3, L4, L5) and the image sensor (I, 230). The infrared cut filter (F) may suppress or block light (e.g., infrared) of a wavelength that is not visible to the naked eye of a user but is detected by a photosensitive material of a film or the image sensor (I, 230) from entering the image sensor (I, 230). The infrared cut filter (F) may be disposed between the fifth lens (L5) and the image sensor (I, 230). Depending on the intended use of the imaging device (400), the infrared cut filter (F) may be replaced with a bandpass filter that transmits infrared light and suppresses or blocks visible light. In one embodiment, the infrared blocking filter (F) may be implemented by a coating material disposed on the surface of any one of the lenses (L1, L2, L3, L4, L5).

[0101] In the detailed description below, the first lens (L1) may be referred to as “the first lens on the subject (SBJ) side” or “the lens arranged furthest from the image sensor (I, 230)”, and the fifth lens (L5) may be referred to as “the first lens on the image sensor (I, 230) side”. In one embodiment, “aligned along the optical axis (O) direction” may refer to the optical axes of the respective lenses (L1, L2, L3, L4, L5) or the optical axis of the image sensor (I, 230) (e.g., the imaging plane (img)) being aligned to coincide with each other. The imaging plane (img) may receive or detect light aligned or focused by, for example, the lenses (L1, L2, L3, L4, L5). For example, the imaging plane (img) may be understood as an active area of ​​the image sensor (I, 230). A processor (e.g., processor (120) of FIG. 1) can acquire an image of a subject (SBJ) by detecting light focused or guided by a lens assembly (LA) using an image sensor (I, 230). In one embodiment, the processor (e.g., processor (120) of FIG. 1) can perform a focus adjustment operation and / or a focal length adjustment operation by linearly moving at least one of the lenses (L1, L2, L3, L4, L5) along the optical axis (O) with respect to the image sensor (I, 230). In one embodiment, the processor can cause an electronic device (e.g., electronic device (101, 102, 104, 300) of FIGS. 1, 3, and / or 4) to receive or detect external light using the image sensor (I, 230) by executing at least a part of command(s) stored in a memory (e.g., memory (130) of FIG. 1). For example, the memory may store instruction(s) causing the electronic device to receive at least a portion of light focused by the image sensor (I, 230) and / or instruction(s) causing the electronic device to acquire an image of a subject based on the received light, and such instruction(s) may be executed by the processor.

[0102] In the embodiments described below, although some of the reference numbers given to lens surfaces in the drawings are not directly mentioned, those skilled in the art will be able to easily understand the configuration of each lens (L1, L2, L3, L4, L5) or lens surfaces based on lens data presented through the [Tables] described below. In one embodiment, a lens surface (e.g., 'S5' in [Table 1]) that is not shown in the drawings but is exemplified in the [Table] described below may be mentioned. The lens surface exemplified as 'S5' may refer to a mechanical structure or reference position that is referenced in the design or manufacture of the lens assembly (LA). In the embodiments described below, the stop is generally exemplified as being arranged on the sensor-side surface (S4) of the second lens (L2), but it should be noted that the embodiments of the present disclosure are not limited thereto. For example, 'S5' in [Table 1] described below may refer to the position of the stop.

[0103] In examining various embodiments hereinbelow, for the sake of brevity of the drawings, reference numerals for some of the subject-side surface(s) and the sensor-side surface(s) of the lenses (L1, L2, L3, L4, L5) and / or inflection points (IP) may be omitted. The term 'inflection point (IP)' refers to, for example, a point where the radius of curvature changes while not intersecting the optical axis (O), and may be exemplified by the symbol '●' in the drawings and the reference numerals may be omitted. Here, 'the radius of curvature changes' can be understood as the value of the radius of curvature changes from a negative value to a positive value or from a positive value to a negative value.

[0104] Reference numerals for lens surfaces omitted in the drawings may be applied to configurations of different embodiments, and can be easily understood through the [Tables] described below regarding lens data of each embodiment. In the detailed description of the embodiment(s) of the present disclosure, the term "concave" or "convex" with respect to the subject-side surface or the sensor-side surface of the lenses (L1, L2, L3, L4, L5) without other mention may refer to the shape of the lens surface at a point intersecting the optical axis (O) or in a paraxial region intersecting the optical axis (O). The shape referred to as "concave" may refer to a shape in which the lens surface forms a curved surface in such a way that the lens thickness decreases as it approaches the optical axis (O) in the paraxial region. The shape referred to as "convex" may refer to a shape in which the lens surface forms a curved surface in such a way that the lens thickness increases as it approaches the optical axis (O) in the paraxial region.

[0105] In addition, in the detailed description below, values ​​for the radius, effective focal length (f), OAL (total track length), air gap, thickness or image height of the image sensor (I, 230) of the lenses (L1, L2, L3, L4, L5) of the present disclosure may all have units of mm unless otherwise specified. In addition, the radius, effective focal length, OAL, air gap or thickness of the lenses (L1, L2, L3, L4, L5) may be a distance measured from the optical axis (O) (e.g., a distance measured along the optical axis (O) from a point where the optical axes (O) intersect), and / or ImgH of the image sensor (I) may be a distance measured along a direction substantially perpendicular to the optical axis (O) from a point where the optical axes (O) intersect. In one embodiment, ImgH may be half of a diagonal length of the image sensor (I) or the imaging plane (img).

[0106] According to one embodiment, among the lenses (L1, L2, L3, L4, L5), the lens disposed first from the subject (SBJ) side, for example, the first lens (L1) disposed farthest from the image sensor (I, 230), may have a defined refractive power. In one embodiment, the first lens (L1) may be a plastic lens. When the first lens (L1) is manufactured as a plastic lens, manufacturing in a designed shape or mass production may be easy. In one embodiment, the first lens (L1) may have a meniscus shape that is convex toward the subject (SBJ). For example, the first lens (L1) may be a plastic aspherical lens, and / or may have a refractive index of approximately 1.55 or less.

[0107] In one embodiment, when the first lens (L1) has a meniscus shape, the sensor-side surface (S2) of the first lens (L1) may have a concave central region (e.g., a paraxial region) intersecting the optical axis (O), which may be useful for reducing the size (e.g., an overall length) of the lens assembly (LA). In one embodiment, the sensor-side surface (S2) of the first lens (L1) may include at least one inflection point (IP). For example, when the central region of the sensor-side surface (S2) of the first lens (L1) is concave, a peripheral region around the central region may have a convex shape toward the image sensor (I, 230). When the first lens (L1) includes at least one inflection point (IP), it may be easy to control spherical aberration of the lens assembly (LA). In one embodiment, the refractive power or shape of the first lens (L1) described above may be useful for reducing the overall length of the lens assembly (LA) or the outer diameter of the first lens (L1).

[0108] According to one embodiment, the second lens (L2) disposed second from the subject (SBJ) side, for example, disposed between the first lens (L1) and the image sensor (I, 230), may be a meniscus lens having negative refractive power and convex toward the subject (SBJ). In one embodiment, the second lens (L2) may be a plastic aspherical lens and may have a refractive index of about 1.6 or greater. In one embodiment, the second lens (L2) may have a refractive index of about 1.66 or greater. For example, the second lens (L2) may be made of a high-refractive material, and when the second lens (L2) is made of a high-refractive material, the lens assembly (LA) may be miniaturized while implementing an angle of view of about 80 degrees. In one embodiment, when the second lens (L2) is made of a high refractive index and / or low Abbe number material and is combined with the first lens (L1) of a low refractive index and / or high Abbe number material, aberration correction such as chromatic aberration correction can be facilitated.

[0109] According to one embodiment, the third lens (L3) is disposed third from the subject (SBJ) side, for example, between the second lens (L2) and the image sensor (I, 230), and may have negative refractive power. In one embodiment, the third lens (L3) may be a meniscus lens that is convex toward the image sensor (I, 230). For example, the third lens (L3) may be a plastic aspherical lens and / or may have a refractive index of about 1.6 or greater. In one embodiment, the third lens (L3) may have a refractive index of about 1.66 or greater. In one embodiment, when the third lens (L3) is made of a high refractive material of about 1.6 or greater, the miniaturization of the lens assembly (LA) is facilitated, and optical performance such as chromatic aberration may be stabilized.

[0110] According to one embodiment, a stop that affects the brightness (e.g., F-number) of the lens assembly (LA) may be positioned between the first lens (L1) and the third lens (L3). For example, the stop may be positioned between the second lens (L2) and the third lens (L3). In one embodiment, the stop may be implemented on the sensor-side surface (S4) of the second lens (L2). In one embodiment, the lens surface 'S5' mentioned in [Table 1] described below may be understood to refer to the position of the stop. In one embodiment, when the second lens (L2) positioned in front of the stop has a meniscus shape convex toward the subject (SBJ), and the third lens (L3) positioned behind the stop has a meniscus shape convex toward the image sensor (I, 230), it can be useful for miniaturizing the lens assembly (LA) or correcting peripheral curvature.

[0111] In one embodiment, the fourth lens (L4) is positioned fourth from the subject (SBJ) side, for example, between the third lens (L3) and the image sensor (I, 230), and may have a defined refractive power. In one embodiment, the fourth lens (L4) may be a plastic aspherical lens having a meniscus shape that is convex toward the image sensor (I, 230) at least in the central region.

[0112] According to one embodiment, the fifth lens (L5) disposed between the fourth lens (L4) and the image sensor (I, 230) may have a negative refractive power and a shape of the letter 'W'. For example, the fifth lens (L5) may have a meniscus shape that is convex toward the subject (SBJ) in the central region, and a shape that is inclined toward the subject (SBJ) in the peripheral region. For example, at least one of the subject-side surface (S10) and the sensor-side surface (S11) of the fifth lens may include two inflection points (IP). In the imaging device (400) and / or the lens assembly (LA) of FIG. 5, a configuration may be exemplified in which the fifth lens (L5) includes two inflection points (IP) on the subject-side surface (S10) and one inflection point (IP) on the sensor-side surface (S11). In one embodiment, the fifth lens (L5) may be a plastic aspherical lens having a refractive index of approximately 1.55 or less.

[0113] In one embodiment, the inflection shape of the fifth lens (L5), for example, the letter 'W' shape, can be useful for miniaturizing the lens assembly (LA) or correcting peripheral curvature while providing optical performance suitable for a large, high-pixel image sensor. In one embodiment, the inflection shape of the fifth lens (L5) can facilitate control of the incident angle of light incident on the image sensor (I, 230). In one embodiment, the lens assembly (LA) in which the fifth lens (L5) has the letter 'W' shape can exhibit a large resolution change of about 0.5 fields to about 0.6 fields in close-up photography. This change in resolution can be interpreted as a phenomenon caused by a deviation between the width of the upper ray and the width of the lower ray when the light passes through a portion of the fifth lens (L5) in which the curvature change is large.

[0114] In one embodiment, the fourth lens (L4) may have a shape in which the thickness thereof gradually decreases as it approaches the edge of the fourth lens (L4) in the peripheral region. The thickness of the lens(es) mentioned in the embodiment(s) of the present disclosure may be understood to refer to the thickness measured from the optical axis (O) or the thickness measured parallel to the optical axis (O). In one embodiment, the peripheral region of the fifth lens (L5) having the shape of the letter 'W' may become thicker as it moves away from the optical axis (O), and the change in curvature (or radius of curvature) may increase. When the change in thickness or the change in radius of curvature increases, the deviation between the upper and lower rays may increase, and in one embodiment, the deviation between the upper and lower rays in the fifth lens (L5) may be offset by the shape of the fourth lens (L4). For example, the imaging device (400) and / or lens assembly (LA) according to the embodiment(s) of the present disclosure may include a fifth lens (L5) in the shape of the letter 'W', thereby providing optical performance suitable for a large, high-pixel image sensor, and / or may implement good close-up performance by utilizing the shape of the fourth lens (L4).

[0115] In one embodiment, an infrared cut filter (F) may be disposed between the fifth lens (L5) and the image sensor (I, 230). As previously mentioned, the infrared cut filter (F) may block light in a wavelength band that is not detectable by the user's naked eye but is detected by a photosensitive material or the image sensor (I, 230). In one embodiment, when the imaging device (400) functions as a camera (e.g., a depth camera) that detects light in an infrared wavelength band, the infrared cut filter (F) may be replaced with a bandpass filter, and / or may be implemented as a coating material disposed on a lens surface of any one of the lenses (L1, L2, L3, L4, L5).

[0116] According to one embodiment, the lens assembly (LA) as described above is implemented with approximately five lenses (L1, L2, L3, L4, L5), so that miniaturization is easy, and an angle of view of approximately 80 degrees can be implemented. In one embodiment, the lens assembly (LA) as described above can provide optical performance suitable for a high-pixel image sensor (I, 230) of 50M or more while corresponding to an image height of approximately 4.0 mm or more (e.g., approximately 4.2 mm). In one embodiment, when focus adjustment (and / or focal length adjustment) is performed using at least one of the approximately five lenses (L1, L2, L3, L4, L5), the lens assembly (LA) can provide optical performance suitable for close-up photography of approximately 10 cm or less, as well as a telephoto function.

[0117] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) may satisfy the conditions presented by the following [Mathematical Formula 1].

[0118]

[0119] Here, 'T23' is the air gap between the second lens (L2) and the third lens (L3), which is the gap measured from the optical axis (O), 'T34' is the air gap between the third lens (L3) and the fourth lens (L4), which is the gap measured from the optical axis (O), and 'T45' may be the air gap between the fourth lens (L4) and the fifth lens (L5), which is the gap measured from the optical axis (O). When the lens assembly (LA) satisfies the condition of [Mathematical Formula 1], the gaps between the lenses (L1, L2, L3, L4, L5) are appropriately secured, so that the manufacturing or assembly of the lens assembly (LA) can be facilitated, and the lens assembly (LA) can be miniaturized. In one embodiment, when the lens assembly (LA) satisfies the condition of [Mathematical Formula 1], peripheral aberration can be effectively controlled, and performance in telephoto shooting and / or close-up shooting can be improved. In one embodiment, when the calculated value of [Mathematical Formula 1] exceeds the upper limit value of 3, it may be difficult to miniaturize or reduce the weight of the lens assembly (LA). In one embodiment, when the calculated value of [Mathematical Formula 1] does not reach the lower limit value of 1.5, it may be difficult to secure the relative illumination (RI) as the air gap increases in the arrangement of the aperture (stop).

[0120] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) can satisfy the condition presented by the following [Mathematical Formula 2].

[0121]

[0122] Here, 'OAL' is a distance measured from the subject-side surface (S1) of the first lens (L1) to the image sensor (I, 230) (e.g., imaging plane (img)) along the optical axis (O), and 'ImgH' may be a maximum image height of the image sensor (I, 230). In one embodiment, the maximum image height of the image sensor (I, 230) may be measured in a vertical direction from a point where the optical axis (O) intersects the image sensor (I, 230) or the imaging plane (img). In one embodiment, half of the diagonal length of the imaging plane (img) or the active area may be understood as the maximum image height. For example, the maximum image height, 'ImgH', of the image sensor (I, 230) may refer to a maximum length from a point where the optical axis (O) intersects to an edge of the imaging plane (img). In one embodiment, when the lens assembly (LA) satisfies the condition of [Mathematical Formula 2], miniaturization of the imaging device (400) and / or the lens assembly (LA) can be facilitated. For example, the overall length of the lens assembly (LA) can be reduced while providing optical performance suitable for a large image sensor (I, 230). In one embodiment, when the calculated value of [Mathematical Formula 2] is greater than the upper limit, miniaturization of the lens assembly (LA) can be difficult, and when it is less than the lower limit, the lens assembly (LA) can be miniaturized, but processing or assembling of the lenses (L1, L2, L3, L4, L5) can be difficult.

[0123] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) may satisfy the conditions presented by the following [Mathematical Formula 3].

[0124]

[0125] Here, 'Fno' may be the F-number of the lens assembly (LA). When the calculated value of [Mathematical Formula 3] exceeds 1.9, the lens assembly (LA) may be implemented with a dark optical system and / or the resolution may be low, making it difficult to obtain a good quality image. In one embodiment, when the calculated value of [Mathematical Formula 3] is less than 1.7, the lens assembly (LA) may be implemented with a bright optical system, but may require a larger number of lenses, making it difficult to miniaturize the lens assembly (LA).

[0126] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) may satisfy the conditions presented by the following [Mathematical Formula 4].

[0127]

[0128] Here, 'HFOV' is the half field of view of the lens assembly (LA), and the unit may be degree(s). In one embodiment, when the half field of view exceeds the upper limit of [Mathematical Formula 4], the focal length of the lens assembly (LA) may be reduced, which may be advantageous for miniaturization, but there may be difficulties in securing peripheral light. In one embodiment, when the half field of view is smaller than the lower limit of [Mathematical Formula 4], the angle of view may be reduced and it may be easy to secure peripheral light, but the close-up performance may deteriorate as the focal length increases. For example, when the condition of [Mathematical Formula 4] is satisfied, the lens assembly (LA) may be mounted on a miniaturized electronic device such as a smart phone and provide good optical performance in telephoto and close-up functions.

[0129] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) may satisfy the conditions presented by the following [Mathematical Formula 5].

[0130]

[0131] Here, 'T4' is the thickness of the fourth lens (L4) measured from the optical axis, and 'TA' may be the distance from the subject-side surface (S1) of the first lens (L1) to the sensor-side surface (S11) of the fifth lens (L5), measured from the optical axis (O). [Mathematical expression 5] relates to the specifications of the fourth lens (L4), and when the lens assembly (LA) satisfies the conditions of [Mathematical expression 5], the flare or stray light caused by reflection or refraction at the fourth lens (L4) can be suppressed while being miniaturized. For example, when the specifications or arrangement of the lenses (L1, L2, L3, L4, L5) deviate from the conditions presented in [Mathematical expression 5], it may be difficult to miniaturize the lens assembly (LA), and the quality of the captured image may deteriorate due to the flare or stray light phenomenon.

[0132] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) may satisfy the conditions presented by the following [Mathematical Formula 6].

[0133]

[0134] Here, 'R7' may be the radius of curvature of the point where the subject-side surface (S8) of the fourth lens (L4) intersects the optical axis (O), and 'R8' may be the radius of curvature of the point where the sensor-side surface (S9) of the fourth lens (L4) intersects the optical axis (O). [Mathematical expression 6] may, for example, present conditions regarding the shape or refractive power of the fourth lens (L4). In one embodiment, the fifth lens (L5) may have a shape and refractive power that are different from or opposite to those of the fourth lens (L4). In one embodiment, when the fourth lens (L4) satisfies the condition of [Mathematical expression 5], the reduced resolution between approximately 0.5 fields and approximately 0.6 fields due to the shape of the fifth lens (L5) may be offset.

[0135] According to one embodiment, the imaging device (400) and / or its lens assembly (LA) may satisfy the conditions presented by the following [Mathematical Formula 7].

[0136]

[0137] Here, 'Et4' is the edge thickness of the fourth lens (L4) measured parallel to the optical axis (O), and 'T4' may be the thickness of the fourth lens (L4) measured from the optical axis (O). In one embodiment, when the calculated value of [Mathematical Formula 7] exceeds the upper limit, the difference in thickness between the central region and the peripheral region may decrease, which may deteriorate the modulation transfer function (MTF) performance. In one embodiment, when the calculated value of [Mathematical Formula 7] is less than the lower limit, it may be difficult to mold the fourth lens (L4) into plastic due to the difference in thickness between the central region and the peripheral region. For example, it may be difficult to inject molten resin into the mold or control the distribution of molten resin in the molding space, which may make it difficult to mass-produce the fourth lens (L4). In one embodiment, when the calculated value of [Mathematical Formula 7] is less than the lower limit, flare or stray light phenomenon caused by the fourth lens (L4) may increase.

[0138] According to one embodiment, [Mathematical Formulas 5, 6, 7] generally present conditions regarding the fourth lens (L4), and when the lens assembly (LA) and / or the fourth lens (L4) satisfies the conditions presented through [Mathematical Formulas 5, 6, 7], aberration control in the peripheral portion can be facilitated. In one embodiment, when the lens assembly (LA) and / or the fourth lens (L4) satisfies the conditions presented through [Mathematical Formulas 5, 6, 7], the optical performance required for telephoto shooting and the optical performance required for close-up shooting can be well secured. In one embodiment, when the lens assembly (LA) and / or the fourth lens (L4) satisfies the conditions presented through [Mathematical Formulas 5, 6, 7], the flare phenomenon or stray light phenomenon that may be caused by the fourth lens (L4) can be suppressed, and a captured image of even better quality can be obtained.

[0139] According to one embodiment, when including an aperture (stop) disposed between the first lens (L1) and the third lens (L3), the imaging device (400) and / or its lens assembly (LA) may satisfy the condition presented through the following [Mathematical Formula 8].

[0140]

[0141] Here, 'ST' is the distance from the subject-side surface (S1) of the first lens (L1) to the stop, which is the distance measured from the optical axis (O), and 'SL' may be the distance from the stop to the sensor-side surface (S11) of the fifth lens (L5), which is the distance measured from the optical axis (O). According to one embodiment, the stop may be arranged in front of the third lens (L3). For example, the stop may be implemented on the sensor-side surface (S4) of the second lens (L2). The position of the stop may be, for example, based on considerations of aberration control or securing a peripheral light ratio. For example, when the stop is arranged between the first lens (L1) and the third lens (L3), aberration control may be facilitated, and / or the performance of the lens assembly (LA) with respect to the peripheral light ratio may be improved. In one embodiment, when the calculated value of [Mathematical Expression 8] is less than the lower limit value, the angle of view may be reduced, which may facilitate miniaturization of the lens assembly (LA), but aberration control or modulation conversion function performance may deteriorate. In one embodiment, when the calculated value of [Mathematical Expression 8] is less than the lower limit value, the upper light may be cut, which may reduce the peripheral light ratio of the lens assembly (LA). In one embodiment, when the calculated value of [Mathematical Expression 8] exceeds the upper limit value, it may be difficult to miniaturize the lens assembly (LA), and the lower light may be cut, which may reduce the peripheral light ratio.

[0142] The imaging device (400) and / or its lens assembly (LA) according to the embodiment(s) of the present disclosure can be miniaturized while providing optical performance suitable for a high-performance image sensor (I, 230), for example, a large / high-pixel sensor, by satisfying at least some of the conditions described above. For example, the lens assembly (LA) can be implemented with approximately five lenses (L1, L2, L3, L4, L5), which can facilitate miniaturization or lightweighting, and can provide an angle of view, brightness, and / or aberration control performance suitable for an image sensor (I, 230) of approximately 1 / 1.3 inches or larger.

[0143] In one embodiment, the imaging device (400) and / or its lens assembly (LA) can have a focal length of approximately 4.69 mm, an F-number of approximately 1.88, and an angle of view of approximately 80 degrees. In one embodiment, the imaging device (400) and / or its lens assembly (LA) can satisfy at least some of the above-described condition(s), and can be manufactured with the specifications exemplified in the following [Table 1].

[0144] Surface (Surf)Radius of curvature (Radius)Thickness or air gap (Thick)Refractive index (nd)Abbe number (Vd)SBJinfinity1000S11.7080.71.5439255.92S27.1630.099S311.1460.2331.671419.25S4(stop)4.6180.279S5infinity0.213S6-10.9750.4371.67141 9.25S7-58.0260.339S8-6.8870.741.5439255.92S9-2.1980.857S102.6140.5291.53501 55.61S111.2560.274S12infinity0.111.516864.17S13infinity0.786imginfinity0.004

[0145] [Table 2], [Table 3], and [Table 4] below list the aspherical coefficients of lenses (L1, L2, L3, L4, L5), and the definition of aspherical is as follows [Mathematical Formula 9].

[0146]

[0147] In [Mathematical Formula 9], “x” is the distance in the direction of the optical axis (O) from the point where the optical axis (O) passes on the lens surface, “y” is the distance from the optical axis (O) in the vertical direction from the optical axis (O), ‘R’ represents the radius of curvature at the vertex of the lens, ‘k’ represents the conic constant, and ‘Ai’ represents the aspherical coefficient, which can be written as ‘A’, ‘B’, ‘C’, ‘D’, ‘E’, ‘F’, ‘G’, ‘H’, ‘J’, ‘K’, ‘L’, ‘M’, ‘N’, and ‘O’ in the [Table] described below.

[0148] 렌즈면(Surf)1_ASP2_ASP3_ASP곡률 반경(Radius)1.7082137197.16274821311.14631685k(Conic)0.07530702113.0880785535.84007671A(4th) / C40.00937954-0.022377250.026321017B(6th) / C5-0.00226827-0.000832030.012237162C(8th) / C6-0.00238756-0.002083690.000443583D(10th) / C7-0.00116339-0.000370430.000499047E(12th) / C8-0.00048457-6.13E-056.55E-05F(14th) / C9-0.00015873-1.47E-052.45E-05G(16th) / C10-5.11E-051.10E-052.10E-06H(18th) / C11-9.42E-06-1.11E-05-5.47E-06J(20th) / C12-2.46E-074.30E-07-3.65E-06K(22th) / C13-1.42E-076.92E-07-6.76E-07L(24th) / C14-2.30E-07-9.59E-07-2.40E-07M(26th) / C151.27E-073.88E-071.51E-06N(28th) / C16-2.29E-081.33E-06-1.71E-06O(30th) / C17-4.92E-08-1.30E-061.85E-07

[0149] 렌즈면(Surf)4_ASP6_ASP7_ASP곡률 반경(Radius)4.617627482-10.9752988-58.026283k(Conic)-11.749064515.93479564-79.936031A(4th) / C40.050181793-0.09757323-0.15288845B(6th) / C50.00913195-7.96E-050.022468631C(8th) / C60.0013675290.0002873780.002919024D(10th) / C70.0005199657.72E-05-0.00012716E(12th) / C80.0001412311.49E-05-5.29E-05F(14th) / C93.85E-059.53E-069.55E-05G(16th) / C106.72E-063.73E-06-2.85E-05H(18th) / C11-4.65E-06-1.08E-05-2.31E-05J(20th) / C12-4.40E-06-5.68E-06-1.06E-05K(22th) / C13-1.94E-06-5.35E-061.10E-05L(24th) / C14-1.60E-06-3.60E-06-4.66E-06M(26th) / C15-1.01E-06-1.57E-064.07E-06N(28th) / C16-1.27E-06-7.20E-07-2.38E-06O(30th) / C171.47E-061.78E-062.10E-06

[0150] 렌즈면(Surf)8_ASP9_ASP10_ASP11_ASP곡률 반경(Radius)-6.88717916-2.197675562.6135217541.25566591k(Conic)2.084748592-0.22155049-1.27654018-0.99941086A(4th) / C4-0.129884660.11114634-2.97704248-6.17076224B(6th) / C50.0816485820.1243082471.0515844781.360014565C(8th) / C6-0.01469228-0.02515127-0.35270248-0.35799404D(10th) / C7-0.00646047-0.013391030.1093923350.168795061E(12th) / C80.0040118220.003396065-0.03797896-0.08018846F(14th) / C90.0003926890.0029294190.0099713870.020595663G(16th) / C10-0.00114722-0.00141797-0.00302316-0.01839084H(18th) / C110.000197701-0.000663140.0012327370.007456016J(20th) / C120.0001770540.000409082-0.00122744-0.00218295K(22th) / C13-0.000105960.0001637280.0001719060.002065772L(24th) / C14-7.40E-05-1.57E-048.32E-05-0.0007854M(26th) / C154.89E-05-9.34E-05-0.000156490.000190565N(28th) / C165.53E-062.73E-056.83E-06-0.00019272O(30th) / C17-7.04E-061.86E-05-4.81E-056.87E-05

[0151] FIG. 9 is a diagram illustrating an imaging device (500) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 10 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 9 according to an embodiment of the present disclosure. FIG. 11 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 9 according to an embodiment of the present disclosure. FIG. 12 is a graph illustrating a distortion rate of the lens assembly (LA) of FIG. 9 according to an embodiment of the present disclosure.

[0152] The imaging device (500) and / or its lens assembly (LA) of FIG. 9 can have a focal length of approximately 4.69 mm, an F-number of approximately 1.88, and an angle of view of approximately 80 degrees. In one embodiment, the imaging device (500) and / or its lens assembly (LA) can satisfy at least some of the above-described condition(s), can be manufactured with the specifications exemplified in [Table 5] below, and can have aspheric coefficients of [Table 6], [Table 7], and [Table 8].

[0153] Lens Surface (Surf)Radius of Curvature (Radius)Thickness or Air Gap (Thick)Refractive Index (nd)Abbe Number (Vd)SBJInfinity1000S11.6970.691.5439255.92S26.6850.1S310.6130.2571.671419.25S4(stop)4.6470.289S5infinity0.219S6-9.0520.431.671419 .25S7-36.9710.33S8-8.3960.741.5439255.92S9-2.2190.83S103.0920.5681.5350155 .61S111.3290.258S12infinity0.111.516864.17S13infinity0.775imginfinity0.015

[0154] 렌즈면(Surf)1_ASP2_ASP3_ASP곡률 반경(Radius)1.696580946.6854389510.6130204k(Conic)0.0619081411.973391642.8904433A(4th) / C40.00753599-0.02348620.02882868B(6th) / C5-0.0024174-0.00129460.00993296C(8th) / C6-0.0024277-0.00187660.00057268D(10th) / C7-0.0011042-0.00033090.00044298E(12th) / C8-0.0004532-4.14E-058.35E-05F(14th) / C9-0.0001348-1.29E-052.34E-05G(16th) / C10-4.77E-058.46E-068.78E-07H(18th) / C11-5.64E-06-9.56E-06-2.65E-06J(20th) / C12-1.28E-061.08E-06-1.12E-07K(22th) / C130.00000E+000.00000E+000.00000E+00L(24th) / C140.00000E+000.00000E+000.00000E+00M(26th) / C150.00000E+000.00000E+000.00000E+00N(28th) / C160.00000E+000.00000E+000.00000E+00O(30th) / C170.00000E+000.00000E+000.00000E+00

[0155] 렌즈면(Surf)4_ASP6_ASP7_ASP곡률 반경(Radius)4.64738424-9.052249-36.971059k(Conic)-8.3879987-52.930838-100A(4th) / C40.05168327-0.1094426-0.1678988B(6th) / C50.00738326-0.00213660.01497447C(8th) / C60.00103386-0.0003090.00239571D(10th) / C70.00036669-1.04E-051.75E-05E(12th) / C89.12E-05-3.49E-05-5.65E-05F(14th) / C91.93E-052.68E-066.07E-05G(16th) / C102.50E-06-4.50E-067.95E-07H(18th) / C11-1.42E-06-1.18E-06-2.18E-05J(20th) / C12-5.38E-06-9.76E-07-7.77E-06K(22th) / C130.00000E+00-4.08E-070.00000E+00L(24th) / C140.00000E+00-4.55E-060.00000E+00M(26th) / C150.00000E+00-9.95E-070.00000E+00N(28th) / C160.00000E+00-9.08E-070.00000E+00O(30th) / C170.00000E+006.32E-070.00000E+00

[0156] 렌즈면(Surf)8_ASP9_ASP10_ASP11_ASP곡률 반경(Radius)-8.3958737-2.21879443.092141751.32865506k(Conic)-3.0934098-0.3695633-1.0486964-1.0036407A(4th) / C4-0.11104280.16359682-2.6516846-5.5937452B(6th) / C50.088627830.14335450.872761441.16206259C(8th) / C6-0.0148483-0.023112-0.2779702-0.3242373D(10th) / C7-0.005959-0.01222550.080988090.14854641E(12th) / C80.00402080.00413322-0.0256664-0.0631744F(14th) / C90.000186170.003078440.006588610.0222694G(16th) / C10-0.0011116-0.0016644-0.0029174-0.0154649H(18th) / C110.00030096-0.00068470.001619930.00536584J(20th) / C120.000186890.00051899-0.0006698-0.0027143K(22th) / C13-0.00012680.000192253.88E-060.0016828L(24th) / C14-5.10E-05-0.00017210.00011587-0.0005549M(26th) / C154.91E-05-9.24E-05-3.86E-050.00038361N(28th) / C162.95E-064.22E-051.13E-05-0.000144O(30th) / C17-4.22E-061.94E-05-1.82E-079.48E-05

[0157] FIG. 13 is a diagram illustrating an imaging device (600) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 14 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 13 according to an embodiment of the present disclosure. FIG. 15 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 13 according to an embodiment of the present disclosure. FIG. 16 is a graph illustrating a distortion rate of the lens assembly (LA) of FIG. 13 according to an embodiment of the present disclosure.

[0158] The imaging device (600) and / or its lens assembly (LA) of FIG. 13 can have a focal length of approximately 4.69 mm, an F-number of approximately 1.88, and an angle of view of approximately 80 degrees. In one embodiment, the imaging device (600) and / or its lens assembly (LA) can satisfy at least some of the above-described condition(s), can be manufactured with the specifications exemplified in the following [Table 9], and can have aspheric coefficients of [Table 10], [Table 11], and [Table 12].

[0159] Surface (Surf)Radius of curvature (Radius)Thickness or air gap (Thick)Refractive index (nd)Abbe number (Vd)SBJinfinity1000S11.7180.691.5439255.92S27.1990.099S310.6710.2271.671419.25S4(stop)4.5880.29S5infinity0.222S6-12.2040.4591.6714 19.25S7-196.0290.35S8-7.7360.741.5439255.92S9-2.1740.858S102.7050.51.535015 5.61S111.2440.266S12infinity0.111.516864.17S13infinity0.781imginfinity0.009

[0160] 렌즈면(Surf)1_ASP2_ASP3_ASP곡률 반경(Radius)1.7181225957.19883587710.67097322k(Conic)0.07554574414.0846673333.00764675A(4th) / C40.009229324-0.0208064830.024776553B(6th) / C5-0.002080380.0001710910.0125497C(8th) / C6-0.002123183-0.0021300798.73E-05D(10th) / C7-0.001073391-0.0004642830.000371482E(12th) / C8-0.000453368-8.82E-053.04E-05F(14th) / C9-0.000157417-1.99E-051.69E-05G(16th) / C10-5.58E-051.98E-057.22E-06H(18th) / C11-1.40E-05-1.38E-05-7.50E-06J(20th) / C12-5.87E-076.23E-08-3.61E-07K(22th) / C130.00000E+000.00000E+000.00000E+00L(24th) / C140.00000E+000.00000E+000.00000E+00M(26th) / C150.00000E+000.00000E+000.00000E+00N(28th) / C160.00000E+000.00000E+000.00000E+00O(30th) / C170.00000E+000.00000E+000.00000E+00

[0161] 렌즈면(Surf)4_ASP6_ASP7_ASP곡률 반경(Radius)4.588251597-12.20386749-196.0292426k(Conic)-12.90835592.130244204100A(4th) / C40.048720601-0.100623486-0.165863215B(6th) / C50.008876139-0.0002211190.02399062C(8th) / C60.0011055770.0004237760.004431733D(10th) / C70.0004397965.27E-05-4.64E-05E(12th) / C80.0001065833.27E-056.52E-05F(14th) / C93.37E-05-1.06E-05-4.16E-05G(16th) / C101.01E-054.12E-06-2.43E-05H(18th) / C11-3.23E-06-1.78E-05-5.15E-05J(20th) / C12-3.12E-06-1.23E-061.81E-05K(22th) / C130.00000E+00-5.81E-061.67E-07L(24th) / C140.00000E+00-1.12E-064.05E-06M(26th) / C150.00000E+00-2.63E-06-1.94E-06N(28th) / C160.00000E+00-5.22E-07-3.37E-06O(30th) / C170.00000E+006.41E-07-2.74E-06

[0162] 렌즈면(Surf)8_ASP9_ASP10_ASP11_ASP곡률 반경(Radius)-7.736410481-2.174231492.7047349981.243924765k(Conic)5.646950229-0.270240089-1.202087586-0.998128178A(4th) / C4-0.142741240.139882581-2.941610713-6.211700912B(6th) / C50.0698312020.1063406221.0356041791.387664409C(8th) / C6-0.008266838-0.025371898-0.359121129-0.381429144D(10th) / C7-0.005752064-0.0109470850.1208884090.177395535E(12th) / C80.002986580.004155471-0.042368841-0.081844542F(14th) / C90.0004519250.0024190080.0105199840.024290844G(16th) / C10-0.000960792-0.001688619-0.003589086-0.020199992H(18th) / C110.000101317-0.0006301020.0019145130.007521394J(20th) / C120.0002006360.000442529-0.001530632-0.002846885K(22th) / C13-4.70E-050.0001607970.0001090240.002231221L(24th) / C14-8.60E-05-0.0001522260.000110124-0.000944766M(26th) / C153.41E-05-8.40E-05-0.0001356910.000353192N(28th) / C168.26E-062.71E-05-2.20E-05-0.00010994O(30th) / C17-3.16E-061.39E-05-3.58E-050.00017179

[0163] FIG. 17 is a diagram illustrating an imaging device (700) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 18 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 17 according to an embodiment of the present disclosure. FIG. 19 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 17 according to an embodiment of the present disclosure. FIG. 20 is a graph illustrating a distortion rate of the lens assembly (LA) of FIG. 17 according to an embodiment of the present disclosure.

[0164] The imaging device (700) and / or its lens assembly (LA) of FIG. 17 can have a focal length of approximately 4.69 mm, an F-number of approximately 1.88, and an angle of view of approximately 80 degrees. In one embodiment, the imaging device (700) and / or its lens assembly (LA) can satisfy at least some of the above-described condition(s), can be manufactured with the specifications exemplified in [Table 13] below, and can have aspheric coefficients of [Table 14], [Table 15], and [Table 16].

[0165] Lens Surface (Surf)Radius of Curvature (Radius)Thickness or Air Gap (Thick)Refractive Index (nd)Abbe Number (Vd)SBJInfinity1000S11.7080.6981.5439255.92S27.1410.1S311.0660.2331.671419.25S4(stop)4.6190.28S5infinity0.214S6-10.4550.4331.671419 .25S7-48.4370.337S8-7.0490.741.5439255.92S9-2.2140.864S102.6180.5271.535015 5.61S111.2610.274S12infinity0.111.516864.17S13infinity0.785imginfinity0.005

[0166] 렌즈면(Surf)1_ASP2_ASP3_ASP곡률 반경(Radius)1.7082747127.14058556411.06579295k(Conic)0.07471248913.0883616235.80509776A(4th) / C40.009245161-0.0223299410.026119442B(6th) / C5-0.002254117-0.0007943550.012134379C(8th) / C6-0.002368384-0.0020591160.000404027D(10th) / C7-0.001152955-0.0003883790.000478261E(12th) / C8-0.000488161-5.35E-056.58E-05F(14th) / C9-0.000155974-2.00E-051.67E-05G(16th) / C10-5.31E-051.33E-051.25E-06H(18th) / C11-8.62E-06-1.62E-05-9.29E-06J(20th) / C12-1.45E-061.43E-06-2.57E-06K(22th) / C130.00000E+000.00000E+000.00000E+00L(24th) / C140.00000E+000.00000E+000.00000E+00M(26th) / C150.00000E+000.00000E+000.00000E+00N(28th) / C160.00000E+000.00000E+000.00000E+00O(30th) / C170.00000E+000.00000E+000.00000E+00

[0167] 렌즈면(Surf)4_ASP6_ASP7_ASP곡률 반경(Radius)4.618533407-10.45525048-48.43706139k(Conic)-11.7580973716.71342745-100A(4th) / C40.049970803-0.09894415-0.159299205B(6th) / C50.00899791-0.0001667840.025745624C(8th) / C60.001308410.0003546710.003386394D(10th) / C70.0004927192.05E-05-0.000334707E(12th) / C80.0001312123.50E-054.77E-05F(14th) / C93.48E-05-8.53E-064.42E-05G(16th) / C103.35E-068.50E-06-1.37E-05H(18th) / C11-1.06E-05-2.15E-05-5.05E-05J(20th) / C12-5.47E-06-3.04E-061.21E-05K(22th) / C130.00000E+00-8.08E-065.22E-06L(24th) / C140.00000E+00-2.08E-066.16E-06M(26th) / C150.00000E+00-3.97E-06-2.54E-06N(28th) / C160.00000E+009.33E-07-3.63E-06O(30th) / C170.00000E+006.50E-07-2.15E-06

[0168] 렌즈면(Surf)8_ASP9_ASP10_ASP11_ASP곡률 반경(Radius)-7.049105495-2.2139988692.6179291941.260961884k(Conic)2.383818308-0.214100588-1.286992155-0.999492755A(4th) / C4-0.1312680480.104339918-2.96172467-6.087812052B(6th) / C50.0793870720.1235749351.0434532231.333097451C(8th) / C6-0.013505339-0.02465273-0.347730503-0.35001394D(10th) / C7-0.006576-0.0131412510.1075560420.166902062E(12th) / C80.0038698820.003344795-0.036884007-0.076938175F(14th) / C90.0004404470.0029209390.0097120180.020969098G(16th) / C10-0.001038419-0.001424532-0.003062808-0.018038164H(18th) / C110.000141009-0.000683480.0013807640.006834654J(20th) / C120.000223070.000398472-0.001185974-0.002148387K(22th) / C13-9.05E-050.0002000360.0001485720.001990949L(24th) / C14-7.26E-05-0.0001371580.000125256-0.000736344M(26th) / C153.40E-05-9.84E-05-0.0001510740.000189189N(28th) / C167.51E-069.74E-061.51E-05-0.000148244O(30th) / C17-4.61E-061.77E-05-3.53E-057.70E-05

[0169] FIG. 21 is a diagram illustrating an imaging device (800) and / or a lens assembly (LA) according to an embodiment of the present disclosure. FIG. 22 is a graph illustrating spherical aberration of the lens assembly (LA) of FIG. 21 according to an embodiment of the present disclosure. FIG. 23 is a graph illustrating astigmatism of the lens assembly (LA) of FIG. 21 according to an embodiment of the present disclosure. FIG. 24 is a graph illustrating a distortion rate of the lens assembly (LA) of FIG. 21 according to an embodiment of the present disclosure.

[0170] The imaging device (800) and / or its lens assembly (LA) of FIG. 21 can have a focal length of approximately 4.69 mm, an F-number of approximately 1.79, and an angle of view of approximately 80 degrees. In one embodiment, the imaging device (700) and / or its lens assembly (LA) can satisfy at least some of the above-described condition(s), can be manufactured with the specifications exemplified in the following [Table 17], and can have aspheric coefficients of [Table 18], [Table 19], and [Table 20].

[0171] Lens Surface (Surf)Radius of Curvature (Radius)Thickness or Air Gap (Thick)Refractive Index (nd)Abbe Number (Vd)SBJinfinity1000 S11.7500.8131.5439255.92S210.4660.100 S314.5710.2271.671419.25S4(stop)4.5410.270 S5infinity0.200 S6-19.4920.5481.671419.25S754.5870.255 S8-7.3310.7551.5439255.92S9-2.1460.763 S103.3210.5321.5350155.61S111.3500.237 S12infinity0.1101.516864.17S13infinity0.787 imginfinity0.003

[0172] 렌즈면(Surf)1_ASP2_ASP3_ASP곡률 반경(Radius)1.75018E+001.04656E+011.45712E+01k(Conic)2.41162E-021.70125E+016.48236E+01A(4th) / C4-6.80642E-03-2.05002E-02-3.81625E-02B(6th) / C55.60919E-02-5.71196E-021.55539E-01C(8th) / C6-1.31142E-019.94548E-01-9.95209E-01D(10th) / C7-5.16871E-01-6.72558E+008.02902E+00E(12th) / C84.84048E+002.90996E+01-4.30099E+01F(14th) / C9-1.70648E+01-8.61268E+011.52594E+02G(16th) / C103.60443E+011.79157E+02-3.72338E+02H(18th) / C11-5.06382E+01-2.65660E+026.40038E+02J(20th) / C124.90939E+012.81788E+02-7.82252E+02K(22th) / C13-3.30761E+01-2.12007E+026.76244E+02L(24th) / C141.52335E+011.10398E+02-4.04256E+02M(26th) / C15-4.57894E+00-3.78131E+011.59000E+02N(28th) / C168.09940E-017.66004E+00-3.70242E+01O(30th) / C17-6.39642E-02-6.95099E-013.86760E+00

[0173] 라이면(Surf)4_ASP6_ASP7_ASP곡라 반경(Radius)4.54135E+00-1.94922E+015.45873E+01k(Conic)-1.20293E+017.47792E+01-1.00000E+02A( 4th) / C4-1.21802E-03-7.65957E-02-8.30725E-02B(6th) / C51.42819E-01-4.58484E-01-1.90771E-03C(8 th) / C6-4.84774E-015.99168E+00-5.71096E-02D(10th) / C7-1.79350E+00-4.70398E+018.98652E-01E(12th) / C84.43150E+012.41572E+02-4.48390E+00F(14th) / C9-3.10469E+02-8.50483E+021.27340E+01G(16th) h) / C101.24452E+032.10697E+03-2.33866E+01H(18th) / C11-3.24584E+03-3.71855E+032.93537E+01J(2 0th) / C125.76305E+034.67729E+03-2.57151E+01K(22th) / C13-7.04490E+03-4.14092E+031.57185E+01L( 24th) / C145.84777E+032.50476E+03-6.57099E+00M(26th) / C15-3.15237E+03-9.76756E+021.79062E+00N (28th) / C169.96306E+022.18434E+02-2.86608E-01O(30th) / C17-1.40192E+02-2.08319E+012.04398E-02

[0174] 렌즈면(Surf)8_ASP9_ASP10_ASP11_ASP곡률 반경(Radius)-7.33109E+00-2.14588E+003.32100E+001.34954E+00k(Conic)-1.63933E+01-4.53552E-01-1.04869E+00-1.00923E+00A(4th) / C4-5.92576E-02-6.45847E-02-3.01239E-01-3.28007E-01B(6th) / C5-4.64951E-021.85797E-012.19309E-012.60415E-01C(8th) / C62.33741E-01-5.91824E-01-1.65682E-01-1.83075E-01D(10th) / C7-7.27429E-011.37970E+001.22665E-011.02510E-01E(12th) / C81.56504E+00-2.24445E+00-7.70615E-02-4.40835E-02F(14th) / C9-2.41473E+002.59711E+003.77392E-021.43742E-02G(16th) / C102.76369E+00-2.17293E+00-1.38419E-02-3.54026E-03H(18th) / C11-2.29499E+001.32796E+003.73340E-036.56395E-04J(20th) / C121.34625E+00-5.91991E-01-7.31796E-04-9.09242E-05K(22th) / C13-5.46312E-011.89787E-011.02680E-049.26377E-06L(24th) / C141.49306E-01-4.24747E-02-1.00382E-05-6.74258E-07M(26th) / C15-2.61496E-026.28186E-036.49366E-073.32205E-08N(28th) / C162.64351E-03-5.50602E-04-2.49943E-08-9.94375E-10O(30th) / C17-1.16933E-042.16269E-054.33605E-101.36760E-11

[0175] Regarding the conditions presented through the above-described [mathematical formulas], the values ​​calculated by the lens data of the imaging device (400, 500, 600, 700, 800) and / or the lens assembly (LA) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21 are exemplified in [Table 21] below.

[0176] Example 5 Example 9 Example 13 Example 17 Example 21 Mathematical expression 12.432.282.362.432.17 Mathematical expression 20.680.680.680.680.68 Mathematical expression 31.81.81.81.81.7 Mathematical expression 44040404040 Mathematical expression 50.1670.1670.1670.1670.169 Mathematical expression 60.5160.5820.5610.5220.547 Mathematical expression 70.320.360.330.340.39 Mathematical expression 80.420.4280.4170.4210.46

[0177] As described above, the imaging device (e.g., the imaging device (400, 500, 600, 700, 800) of FIGS. 5, 9, 13, 17, and / or 21) and / or the electronic device including the same (e.g., the electronic device (101, 102, 104, 300) of FIGS. 1, 3, and / or 4) according to the embodiment(s) of the present disclosure can provide optical performance suitable for a high-pixel and / or large-sized image sensor by satisfying at least one of the conditions described above. According to one embodiment, the imaging device and / or the electronic device including the same can have good close-up shooting performance using a high-pixel and / or large-sized image sensor while being miniaturized.

[0178] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0179] According to one embodiment of the present disclosure, an imaging device (e.g., an imaging device (400, 500, 600, 800) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) comprises an image sensor (e.g., an image sensor (I, 230) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), and at least five lenses (e.g., lenses (L1, L2, L3, L4) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) sequentially aligned along an optical axis (e.g., an optical axis (O) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) from a first lens (e.g., a first lens (L1) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) furthest from the image sensor. By including L4, L5), a lens assembly configured to focus or guide light to the image sensor (e.g., the lens assembly (LA) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) may be included.In one embodiment, the lens assembly or the at least five lenses comprises: a first lens having positive refractive power, a second lens disposed between the first lens and the image sensor and having negative refractive power (e.g., the second lens (L2) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), a third lens disposed between the second lens and the image sensor and having negative refractive power (e.g., the third lens (L3) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), a fourth lens having a meniscus shape convex toward the image sensor and thinning as it approaches the edge (e.g., the fourth lens (L4) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), the fourth lens having positive refractive power disposed between the third lens and the image sensor, and a subject-side surface (e.g., the second lens (L2) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) in the central region. A fifth lens (e.g., the fifth lens (L5) of FIGS. 5, 9, 13, 17, and / or 21) having a convex shape on the surface indicated by 'S10' and a concave shape on the sensor side surface (e.g., the surface indicated by 'S11' of FIG. 5) may be disposed between the fourth lens and the image sensor and may include the fifth lens having negative refractive power. In one embodiment, the lens assembly may satisfy the following [Conditional Expression 1].

[0180] [Condition 1]

[0181] 1.5 =< (T34+T45) / T23 =< 3

[0182] Here, 'T23' may be an air gap between the second lens and the third lens, which may be a gap measured from the optical axis, 'T34' may be an air gap between the third lens and the fourth lens, which may be a gap measured from the optical axis, and 'T45' may be an air gap between the fourth lens and the fifth lens, which may be a gap measured from the optical axis.

[0183] In one embodiment, at least one of the at least five lenses may be a plastic lens.

[0184] According to one embodiment, the lens assembly can satisfy the following [Conditional Expression 2].

[0185] [Condition 2]

[0186] 0.6 =< OAL / (ImgH*2) =< 0.69

[0187] Here, 'OAL' is the distance measured from the subject-side surface of the first lens (e.g., the surface indicated by 'S1' in FIG. 5) to the image sensor on the optical axis, and 'ImgH' may be the maximum image height of the image sensor. Here, the maximum image height of the image sensor may refer to the maximum length from the point where the optical axes intersect to the imaging plane or the edge of the image sensor.

[0188] According to one embodiment, the lens assembly can satisfy the following [Conditional Expressions 3 and 4].

[0189] [Condition 3]

[0190] 1.7 =< Fno =< 1.9

[0191] [Conditional Expression 4]

[0192] 35 degrees =< HFOV =< 45 degrees

[0193] Here, 'Fno' may be the F-number of the lens assembly, and 'HFOV' may be the half field of view.

[0194] According to one embodiment, the lens assembly can satisfy the following [Conditional Expression 5].

[0195] [Condition 5]

[0196] T4 / TA =< 0.17

[0197] Here, 'T4' may be the thickness of the fourth lens as measured from the optical axis, and 'TA' may be the distance from the subject-side surface of the first lens to the sensor-side surface of the fifth lens as measured from the optical axis.

[0198] According to one embodiment, the lens assembly can satisfy the following [Conditional Expression 6].

[0199] [Condition 6]

[0200] 0 =< (R7-R8) / (R7+R8) =< 1

[0201] Here, 'R7' may be a radius of curvature at a point intersecting the optical axis on the subject-side surface of the fourth lens (e.g., the surface indicated by 'S8' in FIG. 5), and 'R8' may be a radius of curvature at a point intersecting the optical axis on the sensor-side surface of the fourth lens (e.g., the surface indicated by 'S9' in FIG. 5).

[0202] According to one embodiment, the lens assembly can satisfy the following [Conditional Expression 7].

[0203] [Condition 7]

[0204] 0.3 =< Et4 / T4 =< 0.5

[0205] Here, 'Et4' may be the edge thickness of the fourth lens, which may be measured parallel to the optical axis, and 'T4' may be the thickness of the fourth lens, which may be measured on the optical axis.

[0206] According to one embodiment, the lens assembly may further include an aperture (e.g., the aperture stop of FIG. 5, FIG. 9, FIG. 13, FIG. 17, and / or FIG. 21) disposed between the first lens and the third lens. When the aperture is included, the lens assembly may satisfy the following [Conditional Expression 8].

[0207] [Condition 8]

[0208] 0.1 =< ST / SL =< 0.5

[0209] Here, 'ST' may be a distance from the subject-side surface of the first lens to the aperture, which may be measured from the optical axis, and 'SL' may be a distance from the aperture to the sensor-side surface of the fifth lens, which may be measured from the optical axis.

[0210] In one embodiment, the second lens may have a refractive index of 1.6 or greater.

[0211] In one embodiment, the first lens may include a convex subject-side surface and a sensor-side surface (e.g., the surface indicated as 'S2' in FIG. 5) that is concave in a central region and convex in a peripheral region.

[0212] According to one embodiment, the third lens has a convex meniscus shape toward the image sensor and may have a refractive index of 1.6 or greater.

[0213] In one embodiment, the fifth lens may have a convex shape that is inclined toward the subject in a peripheral region around the central region. As a result, the fifth lens may include at least one inflection point (e.g., the inflection point (IP)(s) of FIGS. 5, 9, 13, 17, and / or 21).

[0214] According to one embodiment, the lens assembly may further include an infrared cutoff filter (e.g., the infrared cutoff filter (F) of FIGS. 5, 9, 13, 17, and / or 21) disposed between the fifth lens and the image sensor.

[0215] According to one embodiment of the present disclosure, an electronic device (e.g., an electronic device (101, 102, 104, 300) of FIG. 1, FIG. 3 and / or FIG. 4) includes an image sensor (e.g., an image sensor (I, 230) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), at least five lenses (e.g., lenses (L1, L2, L3, L4, L5) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) sequentially aligned along an optical axis (e.g., an optical axis (O) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) from a first lens (e.g., a first lens (L1) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) furthest from the image sensor, thereby It may include a lens assembly configured to focus or guide light (e.g., the lens assembly (LA) of FIGS. 5, 9, 13, 17 and / or 21), a processor (e.g., the processor (120) of FIG. 1), and a memory (e.g., the memory (130) of FIG. 1) storing instructions that, when executed by the processor, cause the electronic device to receive light using the image sensor.In one embodiment, the lens assembly or the at least five lenses comprises: a first lens having positive refractive power, a second lens disposed between the first lens and the image sensor and having negative refractive power (e.g., the second lens (L2) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), a third lens disposed between the second lens and the image sensor and having negative refractive power (e.g., the third lens (L3) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), a fourth lens having a meniscus shape convex toward the image sensor and thinning as it approaches the edge (e.g., the fourth lens (L4) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21), the fourth lens having positive refractive power disposed between the third lens and the image sensor, and a subject-side surface (e.g., the second lens (L2) of FIG. 5, FIG. 9, FIG. 13, FIG. 17 and / or FIG. 21) in the central region. A fifth lens (e.g., the fifth lens (L5) of FIGS. 5, 9, 13, 17 and / or 21) having a convex shape on the surface indicated by 'S10' and a concave shape on the sensor side surface (e.g., the surface indicated by 'S11' of FIG. 5) may be disposed between the fourth lens and the image sensor and may include the fifth lens having negative refractive power. In one embodiment, the electronic device and / or the lens assembly as described above may satisfy the following [Conditional Expressions 1 and 2].

[0216] [Condition 1]

[0217] 1.5 =< (T34+T45) / T23 =< 3

[0218] [Condition 2]

[0219] 0.6 =< OAL / (ImgH*2) =< 0.69

[0220] Here, 'T23' is an air gap between the second lens and the third lens, which is a gap measured from the optical axis, 'T34' is an air gap between the third lens and the fourth lens, which is a gap measured from the optical axis, 'T45' is an air gap between the fourth lens and the fifth lens, which is a gap measured from the optical axis, 'OAL' is a distance from the subject-side surface of the first lens to the image sensor, which is a distance measured from the optical axis, and 'ImgH' may be a maximum height of the image sensor.

[0221] In one embodiment, at least one of the at least five lenses may be a plastic lens.

[0222] According to one embodiment, the lens assembly can satisfy the following [Conditional Expressions 3 and 4].

[0223] [Condition 3]

[0224] 1.7 =< Fno =< 1.9

[0225] [Conditional Expression 4]

[0226] 35 degrees =< HFOV =< 45 degrees

[0227] Here, 'Fno' may be the F-number of the lens assembly, and 'HFOV' may be the half field of view.

[0228] According to one embodiment, the lens assembly can satisfy the following [Conditional Expressions 5, 6, 7].

[0229] [Condition 5]

[0230] T4 / TA =< 0.17

[0231] [Condition 6]

[0232] 0 =< (R7-R8) / (R7+R8) =< 1

[0233] [Condition 7]

[0234] 0.3 =< Et4 / T4 =< 0.5

[0235] Here, 'T4' is the thickness of the fourth lens, which is the thickness measured from the optical axis, 'TA' is the distance from the subject-side surface of the first lens (e.g., the surface indicated by 'S1' in FIG. 5) to the sensor-side surface of the fifth lens (e.g., the surface indicated by 'S11' in FIG. 5), which is the distance measured from the optical axis, 'R7' is the radius of curvature of the point where the subject-side surface of the fourth lens (e.g., the surface indicated by 'S8' in FIG. 5) intersects the optical axis, 'R8' is the radius of curvature of the point where the sensor-side surface of the fourth lens intersects the optical axis, 'Et4' is the edge thickness of the fourth lens, which is the thickness measured parallel to the optical axis, and 'T4' may be the thickness of the fourth lens, which is the thickness measured from the optical axis.

[0236] According to one embodiment, the lens assembly may further include an aperture (e.g., the aperture stop of FIG. 5, FIG. 9, FIG. 13, FIG. 17, and / or FIG. 21) disposed between the first lens and the third lens. When the aperture is included, the lens assembly may satisfy the following [Conditional Expression 8].

[0237] [Condition 8]

[0238] 0.1 =< ST / SL =< 0.5

[0239] Here, 'ST' may be a distance from the subject-side surface of the first lens to the aperture, which may be measured from the optical axis, and 'SL' may be a distance from the aperture to the sensor-side surface of the fifth lens, which may be measured from the optical axis.

[0240] In one embodiment, the first lens may include a convex subject-side surface and a sensor-side surface that is concave in a central region and convex in a peripheral region.

[0241] According to one embodiment, the fifth lens may have a convex shape inclined toward the subject in a peripheral region around the central region, thereby including at least one inflection point.

[0242] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In the imaging device (180; 280; 305; 312; 313; 400; 500; 600; 700; 800), Image sensor (I; 230); and A lens assembly (LA) configured to focus or guide light to the image sensor by including at least five lenses (L1, L2, L3, L4, L5) sequentially aligned along the optical axis (O) from the first lens (L1) furthest from the image sensor, The above lens assembly or at least five lenses, The first lens having a defined refractive power; A second lens (L2) positioned between the first lens and the image sensor and having negative refractive power; A third lens (L3) disposed between the second lens and the image sensor and having negative refractive power; A fourth lens (L4) having a convex meniscus shape toward the image sensor and a thickness that becomes thinner as it approaches the edge, the fourth lens being positioned between the third lens and the image sensor and having a positive refractive power; and A fifth lens (L5) having a convex shape on the subject-side surface (S10) and a concave shape on the sensor-side surface in the central area, and including the fifth lens having negative refractive power and arranged between the fourth lens and the image sensor, The above lens assembly is an imaging device that satisfies the following [Conditional Expression 1]. [Condition 1] 1.5 =< (T34+T45) / T23 =< 3 (Here, 'T23' is the air gap between the second lens and the third lens, which is the gap measured from the optical axis, 'T34' is the air gap between the third lens and the fourth lens, which is the gap measured from the optical axis, and 'T45' is the air gap between the fourth lens and the fifth lens, which is the gap measured from the optical axis.) 2. An imaging device according to claim 1, wherein at least one of the at least five lenses is a plastic lens.

3. An imaging device according to any one of claims 1 to 2, wherein the lens assembly satisfies the following [Conditional Expression 2]. [Condition 2] 0.6 =< OAL / (ImgH*2) =< 0.69 (Here, 'OAL' is the distance measured from the subject-side surface (S1) of the first lens to the image sensor on the optical axis, and 'ImgH' is the maximum height of the image sensor.) 4. An imaging device according to any one of claims 1 to 3, wherein the lens assembly satisfies the following [Conditional Expressions 3 and 4]. [Condition 3] 1.7 =< Fno =< 1.9 [Conditional expression 4] 35 degrees =< HFOV =< 45 degrees (Here, 'Fno' is the F-number of the lens assembly, and 'HFOV' is the half field of view) 5. An imaging device according to any one of claims 1 to 4, wherein the lens assembly satisfies the following [Conditional Expression 5]. [Condition 5] T4 / TA =< 0.17 (Here, 'T4' is the thickness of the fourth lens as measured from the optical axis, and 'TA' is the distance from the subject-side surface of the first lens to the sensor-side surface (S11) of the fifth lens as measured from the optical axis.) 6. An imaging device according to any one of claims 1 to 5, wherein the lens assembly satisfies the following [Conditional Expression 6]. [Condition 6] 0 =< (R7-R8) / (R7+R8) =< 1 (Here, 'R7' is the radius of curvature of the point where the subject-side surface (S8) of the fourth lens intersects the optical axis, and 'R8' is the radius of curvature of the point where the sensor-side surface (S9) of the fourth lens intersects the optical axis.) 7. An imaging device according to any one of claims 1 to 6, wherein the lens assembly satisfies the following [Conditional Expression 7]. [Condition 7] 0.3 =< Et4 / T4 =< 0.5 (Here, 'Et4' is the edge thickness of the fourth lens, which is measured parallel to the optical axis, and 'T4' is the thickness of the fourth lens, which is measured on the optical axis.) 8. In any one of claims 1 to 7, the lens assembly further includes a stop arranged between the first lens and the third lens, The above lens assembly is an imaging device that satisfies the following [Conditional Expression 8]. [Condition 8] 0.1 =< ST / SL =< 0.5 (Here, 'ST' is the distance from the subject-side surface of the first lens to the aperture, as measured from the optical axis, and 'SL' is the distance from the aperture to the sensor-side surface of the fifth lens, as measured from the optical axis.) 9. An imaging device according to any one of claims 1 to 8, wherein the second lens has a refractive index of 1.6 or more.

10. An imaging device according to any one of claims 1 to 9, wherein the first lens includes a convex subject-side surface (S1) and a sensor-side surface (S2) that is concave in a central area and convex in a peripheral area.

11. An imaging device according to any one of claims 1 to 10, wherein the third lens has a convex meniscus shape toward the image sensor and has a refractive index of 1.6 or more.

12. An imaging device according to any one of claims 1 to 11, wherein the fifth lens has a convex shape inclined toward the subject in a peripheral region around the central region, thereby including at least one inflection point (IP).

13. An imaging device according to any one of claims 1 to 12, wherein the lens assembly further includes an infrared cut filter (F) disposed between the fifth lens and the image sensor.

14. In electronic devices (101; 102; 104; 300), An imaging device (180; 280; 305; 312; 313; 400; 500; 600; 700; 800) according to any one of claims 1 to 13; Processor (120); and An electronic device including a memory (130) having stored therein commands that, when executed by the processor, cause the electronic device to receive light using the image sensor.

15. In the 14th paragraph, an electronic device further having stored in the memory instructions that, when executed by the processor, cause the imaging device or the electronic device to perform a focus adjustment operation or a focal length adjustment operation by linearly moving at least one of the at least five lenses along the optical axis direction.

Images