Image sensor package

Abstract

An image sensor package, according to one embodiment of the present invention, comprises: an image sensor; a first film disposed on a first region which is the center region of one surface of the image sensor; and solder balls disposed on a second region which is more to the outside than the first region on the one surface of the image sensor, wherein the solder balls and the first film are arranged so as to be spaced apart in the direction perpendicular to an optical axis.

Description

Image sensor package

[0001] The present invention relates to an image sensor package.

[0002] Cameras are commonly installed in portable devices such as mobile terminals and MP3 players, as well as electronic devices such as automobiles, endoscopes, and CCTVs. These cameras are increasingly evolving toward higher resolutions and becoming smaller and thinner. Furthermore, current camera devices are evolving to enable the implementation of various additional functions at lower production costs.

[0003] The camera device described above includes a lens barrel that accommodates a lens, a lens holder coupled to the lens barrel, an image sensor positioned within the lens holder, and a drive board on which the image sensor is mounted. The lens transmits an image signal from the subject to the image sensor. The image sensor then converts the image signal into an electrical signal. A larger image sensor can capture more light, enabling high-quality images even in low-light environments.

[0004] The technical problem to be solved by the present invention is to provide an image sensor package.

[0005] In order to solve the above technical problem, an image sensor package according to an embodiment of the present invention includes an image sensor; a first film disposed in a first region, which is a central region of one surface of the image sensor; and a solder ball disposed in a second region outside the first region on the one surface of the image sensor, wherein the solder ball and the first film are disposed to be spaced apart in a direction perpendicular to an optical axis.

[0006] The image sensor package is placed on a substrate, and the solder ball can be soldered on the substrate.

[0007] The ratio of the thickness of the image sensor in the optical axis direction to the thickness of the first film in the optical axis direction may be 1:3 to 1:5.

[0008] The above first film may be made of a non-conductive material.

[0009] The image sensor may include a second film disposed in a third region outside the second region on the first surface.

[0010] The second film and the solder ball may be arranged spaced apart in a direction perpendicular to the optical axis.

[0011] The above second film may be made of a non-conductive material.

[0012] In order to solve the above technical problem, an image sensor package according to another embodiment of the present invention may include an image sensor; a first film disposed in a first region that is the center of one surface of the image sensor; and a third film disposed in a second region that is outside the first region on the one surface of the image sensor.

[0013] The first film and the third film can be formed into one film.

[0014] The first film may be made of a non-conductive material, and the third film may be made of a conductive material.

[0015] According to the present embodiments, crack damage to the image sensor can be prevented.

[0016] Additionally, the underfill process can be omitted when attaching the image sensor to the substrate, preventing overflow problems.

[0017] In addition, by reducing the thickness of the image sensor, the mechanical and optical freedom of the camera module can be secured, and the camera module can be miniaturized.

[0018] Figure 1 is a drawing for explaining a problem occurring in an image sensor package.

[0019] Fig. 2 illustrates an image sensor package according to the present embodiment.

[0020] Figure 3 is an enlarged view of the X area of ​​Figure 2.

[0021] FIG. 4(a) is a drawing for explaining a cutting process of a first film included in an image sensor package according to the present embodiment, and FIG. 4(b) illustrates a first film cut according to the cutting process illustrated in FIG. 4(a).

[0022] Fig. 5 illustrates an image sensor package according to the present embodiment.

[0023] FIG. 6 illustrates an image sensor package according to another embodiment of the present invention.

[0024] FIG. 7 illustrates an image sensor package according to another embodiment of the present invention.

[0025] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0026] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0027] In addition, terms (including technical and scientific terms) used in this embodiment may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which this embodiment belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0028] Additionally, the terms used in this embodiment are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0029] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0030] Additionally, in describing the components of this embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0031] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0032] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0033]

[0034] Figure 1 is a drawing illustrating a problem occurring in an image sensor package. Figure 1(a) illustrates the bottom surface of an image sensor, and Figure 1(b) illustrates an image sensor with crack damage and an overflow phenomenon occurring during an underfill process when the image sensor is placed on a substrate.

[0035] Due to the increase in the quantum efficiency (QE) of image sensors and the minimization of pin maps, the thickness of the image sensor film is decreasing. This causes a hollow area to appear in the center area of ​​the image sensor. When placing the image sensor on a substrate, a BGA (Ball Grid Array) is placed on the edge area of ​​the bottom surface of the image sensor, as shown in Fig. 1(a).

[0036] Afterwards, there is a problem that an overflow phenomenon occurs during the epoxy underfill process between the image sensor and the substrate. Alternatively, there is a problem that cracks occur in the image sensor due to insufficient underfill between the image sensor and the substrate.

[0037] The present invention aims to solve these problems, and the image sensor package according to the present embodiment can prevent crack damage to the image sensor. Furthermore, the underfill process can be omitted when attaching the image sensor to a substrate, thereby preventing overflow problems. Furthermore, by reducing the thickness of the image sensor, the mechanical and optical freedom of the camera module can be secured, and the camera module can be miniaturized.

[0038]

[0039] FIG. 2 illustrates an image sensor package according to the present embodiment, FIG. 3 is an enlarged view of an X region of FIG. 2, FIG. 4(a) is a drawing for explaining a cutting process of a first film included in an image sensor package according to the present embodiment, FIG. 4(b) illustrates a first film cut according to the cutting process illustrated in FIG. 4(a), FIG. 5 illustrates an image sensor package according to the present embodiment, FIG. 6 illustrates an image sensor package according to another embodiment of the present invention, and FIG. 7 illustrates an image sensor package according to yet another embodiment of the present invention.

[0040] An image sensor package according to the present embodiment may include an image sensor (11), a first film (13), and a solder ball (12), and may include a second film (14). The image sensor package may be placed on a substrate (20). The image sensor package may be attached to the substrate (20). The image sensor package may be mounted on the substrate (20).

[0041] The image sensor (11) may include a first region, which is a central region of one side, and a second region, which is outermost than the first region. The second region may be referred to as an edge region. The image sensor (11) may include a third region, which is outermost than the second region. The third region may be referred to as an outermost region. The second region, which is an edge region, may refer to a region innermost than the third region, which is an outermost region. One side of the image sensor (11) may be a bottom surface attached to a substrate (20).

[0042] The first film (13) may be placed in the first region, which is the central region of one side of the image sensor (11). The first film (13) may be a DAF (DIE Attach Film). DAF is a film used for adhesion between a die and a substrate during the manufacture of a semiconductor image sensor package, and has a double-sided adhesion function. The first film (13) may be made of a non-conductive material.

[0043] Referring to Fig. 4(a), the first film (13) is continuously placed and manufactured on a reel-type protective tape (14). Thereafter, when the protective tape (14) is attached to the upper and lower surfaces of the first film (13), it is cut into individual first films (13). As illustrated in Fig. 4(b), the first film (13) has the protective tape (14) attached to both sides before being attached to the image sensor (11). When placing it on the image sensor (11), the protective tape (14) is removed and placed on the first region of the image sensor (11).

[0044] The solder balls (12) may be arranged in a second region on one side of the image sensor (11). The solder balls (12) may be arranged in a region surrounding the edge of the first film (13) in a BGA (Ball Grid Array) form. A plurality of solder balls may be arranged to be spaced apart from each other. A plurality of solder balls may be arranged to be in contact with each other. The solder balls (12) may be arranged on a substrate (20) and soldered (S). The solder balls (12) may be arranged on a substrate (20) and bonded with epoxy.

[0045] The first film (13) and the solder ball (12) may be spaced apart from each other in a direction perpendicular to the optical axis. Since the solder ball (12), which is a conductive material, must transmit electric signals, interference with the first film (13), which is a non-conductive material, must be minimized. Therefore, as shown in FIG. 3, the surfaces facing each other of the solder ball (12) and the first film (13) may be spaced apart from each other. The solder ball (12) and the first film (13), which are placed on the left side of the first film (13), may be spaced apart from each other by A. The solder ball (12) and the first film (13), which are placed on the upper side of the first film (13), may be spaced apart from each other by B. A and B may have different values. A and B may have the same value. For example, A and B may be about 50 um.

[0046] The thickness of the image sensor (11) in the optical axis direction may be about 0.05 mm. The thickness of the first film (13) in the optical axis direction may be about 0.2 mm. The thickness of the solder ball (12) in the optical axis direction may be about 0.19 mm. The ratio of the thickness of the image sensor (11) in the optical axis direction to the thickness of the solder ball (12) in the optical axis direction may satisfy 1:3 to 1:5, and preferably 1:3.5 to 1:4. The ratio of the thickness of the image sensor (11) in the optical axis direction to the thickness of the first film (13) in the optical axis direction may satisfy 1:3 to 1:5, and preferably 1:3.5 to 1:4. When this is satisfied, DAF bonding including BGA can be performed, and product defects can be reduced by reducing the thickness in the optical axis direction and increasing the flatness.

[0047] Referring to FIG. 6, the second film (14) may be arranged in a third region on one side of the image sensor (11). The second film (14) may be arranged in the outer direction of the solder ball (12). The second film (14) and the solder ball (12) may be arranged to be spaced apart from each other in a direction perpendicular to the optical axis. The second film (14) may be arranged in a corner region of the image sensor (11). When the solder ball (12) is arranged in a square line, the second film (14) may be arranged in an region surrounding the solder ball (12). The second film (14) may include an area that overlaps the image sensor (11) in the optical axis direction and an area that does not overlap. Through this, crack damage in the edge region of the image sensor can be prevented.

[0048]

[0049] In Fig. 7, an image sensor package according to another embodiment of the present invention may include an image sensor (11), a first film (16), and a third film (17).

[0050] The first film (16) may be arranged in the first region, which is the central region of one side of the image sensor (11), and the third film (17) may be arranged in the second region, which is outside the first region, on one side of the image sensor (11). The first film (16) and the third film (17) may be formed as a single film (15). The first film (16) and the third film (17) may be individually attached to the image sensor (11) or the substrate (20) as separate films. The first film (16) may be made of a non-conductive material, and the third film (17) may be made of a conductive material. The third film (17) may be configured to be arranged in place of the solder ball (12) described above.

[0051] An image sensor package according to another embodiment of the present invention illustrated in FIG. 7 can simplify the manufacturing process by manufacturing the image sensor package through attachment of a single film, and can increase the flatness of the image sensor attached to the substrate.

[0052]

[0053] Those skilled in the art will appreciate that the present invention can be implemented in modified forms without departing from the essential characteristics of the above-described description. Therefore, the disclosed methods should be considered illustrative rather than restrictive. The scope of the present invention is set forth in the claims, not the foregoing description, and all differences within the scope equivalent thereto should be construed as being encompassed by the present invention.

Claims

1. Image sensor; A first film arranged in a first region, which is a central region of one side of the image sensor; and Including a solder ball arranged in a second region outside the first region on the one surface of the image sensor, An image sensor package in which the solder ball and the first film are spaced apart in a direction perpendicular to the optical axis.

2. In paragraph 1, The above image sensor package is placed on a substrate, The above solder ball is an image sensor package soldered on the substrate.

3. In paragraph 1, An image sensor package wherein a ratio of a thickness of the image sensor in the optical axis direction to a thickness of the first film in the optical axis direction is 1:3 to 1:

5.

4. In paragraph 1, The above first film is an image sensor package made of a non-conductive material.

5. In paragraph 1, An image sensor package including a second film disposed in a third region outside the second region on the one surface of the image sensor.

6. In paragraph 5, An image sensor package in which the second film and the solder ball are spaced apart in a direction perpendicular to the optical axis.

7. In paragraph 5, The above second film is an image sensor package made of a non-conductive material.

8. Image sensor; A first film arranged in a first area, which is the center of one side of the image sensor; and An image sensor package including a third film disposed in a second region outside the first region on the one surface of the image sensor.

9. In paragraph 8, An image sensor package wherein the first film and the third film are formed as a single film.

10. In paragraph 8, The above first film is made of a non-conductive material, The above third film is an image sensor package made of a conductive material.

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