Display comprising color conversion layer

Abstract

Disclosed in the present document is a display comprising light source panels (310,1420) and color conversion panels (300, 1410) facing the light source panels, and the color conversion panels (300, 500, 1410) can include: front substrates (301, 410); a color conversion layer (330) disposed on the front substrates; partition walls (304, 610) which are disposed on the front substrates and which partition each of a plurality of sub pixels; an organic resin layer (540) which covers the side surface of the partition (610) dividing the plurality of sub-pixels disposed on the outermost sides of the front substrates, and which is disposed between the side surface of the partition (610) and the side surfaces of the front substrates; and a thin film encapsulation layer (510) disposed on the organic resin layer.

Description

Display including a color conversion layer

[0001] One embodiment of the present document relates to a display including a color conversion layer.

[0002] Electronic devices can provide a variety of functions based on various applications. During the process of providing these functions, the electronic device can display a screen corresponding to each function. Users may desire a wider screen when utilizing the various functions described above.

[0003] A display of an electronic device (modular (or tile-type) electronic device, large-area (or large-scale) electronic device, or electronic device having a communication function) according to at least one embodiment of the present document comprises a light source panel (310, 1420); and a color conversion panel (300, 1410) facing the light source panel, wherein the color conversion panel (300, 500, 1410) comprises: a front substrate (301, 410); a color conversion layer (330) disposed on the front substrate; a partition wall (304, 610) disposed on the front substrate and formed to partition each of a plurality of sub-pixels; an organic resin layer (540) formed to cover a side surface of the partition wall (610) that divides the plurality of sub-pixels and is disposed at the outermost portion of the front substrate, and is disposed between the side surface of the partition wall (610) and the side surface of the front substrate; It may include a thin film encapsulation layer (510) disposed on the organic resin layer.

[0004] A color conversion panel according to an embodiment disclosed in this document may include a front substrate (410); a color conversion layer (330) disposed on the front substrate; a partition wall (610) disposed between the color conversion layers on the front substrate; an organic resin layer (540) formed to cover a side surface of the partition wall that separates the plurality of sub-pixels disposed at the outermost edge of the front substrate and disposed between the side surface of the partition wall and the side surface of the front substrate; and a thin film encapsulation layer (510) disposed on the organic resin layer (540).

[0005] A display according to an embodiment disclosed in this document includes a color conversion panel, and the color conversion panel (300, 500, 1410) may include a front substrate (301, 410); a color conversion layer (330) disposed on the front substrate; a partition wall (304, 610) disposed on the front substrate; an organic resin layer (540) having a tapered shape formed to cover a side surface of the partition wall (610) that separates the plurality of sub-pixels disposed at the outermost portion of the front substrate; and a thin film encapsulation layer (510) disposed on the organic resin layer.

[0006] FIG. 1 is a schematic plan view of a display according to one embodiment disclosed in this document.

[0007] FIG. 2 is a cross-sectional view schematically illustrating a display according to one embodiment disclosed in this document.

[0008] FIG. 3 is a plan view showing a color conversion panel according to one embodiment.

[0009] FIG. 4 is a cross-sectional view showing a color conversion panel according to one embodiment.

[0010] FIG. 5 is a cross-sectional view showing a color conversion panel according to one embodiment.

[0011] FIG. 6 is a cross-sectional view showing a color conversion panel according to one embodiment.

[0012] FIG. 7 is a cross-sectional view showing a color conversion panel according to one embodiment.

[0013] FIG. 8 is a cross-sectional view showing a color conversion panel according to one embodiment.

[0014] FIGS. 9A to 9D are cross-sectional views showing a method for manufacturing a color conversion panel according to one embodiment.

[0015] FIG. 10 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment.

[0016] FIG. 11 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment.

[0017] Figure 12 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment.

[0018] FIG. 13 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment.

[0019] Figure 14 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment.

[0020] FIG. 15a is a plan view showing a color conversion panel according to one embodiment before the second region is removed, and FIG. 15b is a plan view showing the color conversion panel after the second region is removed.

[0021] FIGS. 16A and 16B are cross-sectional views illustrating a method for manufacturing a display including a color conversion panel according to one embodiment.

[0022] FIGS. 17A and 17B are cross-sectional views illustrating a method of manufacturing a display including a color conversion panel according to one embodiment.

[0023] FIG. 18 is a drawing showing a display according to one embodiment.

[0024] Hereinafter, an embodiment of this document is described with reference to the attached drawings.

[0025] One embodiment of the present invention described below provides a display of a large-area electronic device capable of supporting moisture-proof performance.

[0026] In addition, one embodiment of the present invention provides a modular display capable of implementing a narrow bezel while improving moisture permeation prevention performance toward the side of a color conversion panel.

[0027] In addition, one embodiment of the present invention provides a display including a color conversion panel capable of reducing non-uniformity in printing quality of a color conversion layer of outermost sub-pixels.

[0028] In addition, one embodiment of the present invention can be applied to a TV, a monitor for a personal computer (PC), a video wall, a large format display (LFD), a digital signage, a digital information display (DID), and a projector display.

[0029] In addition, one embodiment of the present invention is implemented with a plurality of displays (or display panels) in a matrix (or module) form, and can be applied to various display devices through a plurality of assembly arrangements.

[0030] In addition, various purposes and effects provided by the display of a large-area electronic device according to one embodiment may be mentioned according to the embodiment of the detailed description.

[0031] FIG. 1 is a schematic plan view of a display according to one embodiment disclosed in this document.

[0032] Referring to FIG. 1, the display (210) may include a plurality of unit pixels (PXL) that display an image. The pixel (PXL) may include a plurality of sub-pixels (SP1, SP2, SP3) that emit different colors. For example, each of the plurality of pixels (PXL) may include a first sub-pixel (SP1) that emits red, a second sub-pixel (SP2) that emits green, and a third sub-pixel (SP3) that emits blue. For example, each of the plurality of pixels (PXL) may include first to third sub-pixels (SP1, SP2, SP3) and a fourth sub-pixel that emits white. An image may be displayed on the display (210) by controlling the amount of light emitted from each of the sub-pixels (SP1, SP2, SP3).

[0033] According to one embodiment, the plurality of pixels (PXL) are illustrated as being arranged in the order of a first sub-pixel (SP1) implementing red, a second sub-pixel (SP2) implementing green, and a third sub-pixel (SP3) implementing blue, but this is not limited thereto. It may be varied in various ways depending on the design.

[0034] FIG. 2 is a cross-sectional view schematically illustrating a display according to an embodiment disclosed in this document. FIG. 2 is a cross-sectional view schematically illustrating the display taken along line "A-A'" in FIG. 1.

[0035] Referring to FIG. 2, the display (210) may include a light source panel (or, light source substrate, light source module, light source assembly) (310) and a color conversion panel (300) (or, color conversion substrate, color conversion module, color conversion assembly) facing the light source panel (310). Although the light source panel (310) and the color conversion panel (300) illustrated in FIG. 2 are depicted spaced apart from each other, the light source panel (310) and the color conversion panel (300) may be bonded together using an adhesive (not illustrated).

[0036] The light source panel (310) may be a substrate that generates and emits light necessary for displaying an image. The light source panel (310) may include a rear substrate (311), a light emitting element (312), and a pixel circuit that drives the light emitting element (312).

[0037] The rear substrate (311) may be a plastic substrate or a glass substrate. The rear substrate (311) may have flexible characteristics. A light-emitting element (312) and a pixel circuit may be arranged on the rear substrate (311). The light-emitting element (312) may be arranged to overlap with color filters (320) arranged on the front substrate (301), and at least a portion of the pixel circuit (e.g., signal lines, transistors) may be arranged to overlap with a black matrix (302) arranged on the front substrate (301).

[0038] The light-emitting element (312) may include at least one of an organic light-emitting diode, a quantum dot light-emitting diode, an inorganic-based micro light-emitting diode (Micro LED), and an inorganic-based nano light-emitting diode (nano LED). For example, the light-emitting element (312) may be a micro light-emitting diode.

[0039] The pixel circuit may be composed of a plurality of transistors. For example, the pixel circuit may be composed of a CMOS circuit composed of a combination of at least one N-type transistor and at least one P-type transistor.

[0040] The color conversion panel (300) may include a front substrate (301), a color filter (320), a partition (304), a color control member (340), and a black matrix (302).

[0041] The front substrate (301) may be formed of a material having light-transmitting properties. The front substrate (301) may be formed of a plastic substrate or a glass substrate. The front substrate (301) may have flexible properties. A color filter (320), a partition wall (304), a color conversion member (330) (or a color conversion layer), a transparent layer (333), and a black matrix (302) may be laminated on the other side (e.g., a side facing the -Z axis) of the front substrate (301). Since light passing through the color filter (320) is emitted to the outside through one side (e.g., a side facing the +Z axis) of the front substrate (301), an image may be provided to a viewer looking at the display.

[0042] The color filter (320) may include a first color filter (321), a second color filter (322), and a third color filter (323). The first color filter (321) may implement the same color as the light emitted from the first color conversion layer (331). For example, the first color filter (321) may be a red color filter. The first color filter (321) may transmit red light and absorb other color light other than red light. The first color filter (321) may increase the color purity of red light incident through the first color conversion layer (331). The second color filter (322) may implement the same color as the light emitted from the second color conversion layer (332). For example, the second color filter (322) may be a green color filter. The second color filter (322) may transmit green light and absorb other color light other than green light. The second color filter (322) can increase the color purity of green light incident through the second color conversion layer (332). The third color filter (323) can implement the same color as the light emitted from the light emitting element (312). For example, the third color filter (323) can be a blue color filter. The third color filter (323) can transmit blue light and absorb other colors of light other than blue light. The third color filter (323) can increase the color purity of blue light incident through the transparent layer (333).

[0043] The black matrix (302) may be placed between the first color filter (321), the second color filter (322), and the third color filter (323). Since the black matrix (302) divides the area of ​​each sub-pixel (SP1, SP2, SP3), it may overlap with the partition wall (304). The black matrix (302) may be formed of a material such as a metal, a synthetic resin, a synthetic rubber, or a carbon-based organic material. For example, the black matrix (302) may be composed of chromium (Cr), a chromium oxide film (CrOx), carbon black, or a double film including these.

[0044] The color control member (340) may include a color conversion member (330) and a transparent layer (333). The color conversion member (330) may include a first color conversion layer (331) and a second color conversion layer (332). The first color conversion layer (331) may be formed to overlap with the first color filter (321). The first color conversion layer (331) may be disposed between the light emitting element (312) and the first color filter (321). The first color conversion layer (331) may convert light emitted from the light emitting element (312) into first color light using a first quantum dot. For example, the first color conversion layer (331) may convert blue light emitted from the light emitting element (312) into red light.

[0045] The second color conversion layer (332) may be formed to overlap with the second color filter (322). The second color conversion layer (332) may be positioned between the light-emitting element (312) and the second color filter (322). The second color conversion layer (332) may convert light emitted from the light-emitting element (312) into second color light using the second quantum dot. For example, the second color conversion layer (332) may convert blue light emitted from the light-emitting element (312) into green light.

[0046] The transparent layer (333) may be formed to overlap with the third color filter (323). The transparent layer (333) may be disposed between the light emitting element (312) and the third color filter (323). The transparent layer (333) may transmit light emitted from the light emitting element (312) without color conversion. According to one embodiment, the transparent layer (333) may be hollow so that incident light passes through it as is, or may be made of a transparent resin such as ABS (Acryl-nitrile butadiene styrene), PMMA (Poly methyl methacrylate), or PC (Poly carbonate). According to one embodiment, the transparent layer (330) may include a transparent resin and a scattering agent. The scattering agent may be TiO2, SiO2, or / and glass beads.

[0047] The partition wall (304) may be formed to partition sub-pixels (SP1, SP2, SP3) that implement different colors. The partition wall (304) may block the movement of light between sub-pixels (SP1, SP2, SP3) that implement different colors. The partition wall (304) may be formed of a black color that absorbs light. The partition wall (304) may be formed of a material such as a metal, a synthetic resin, a synthetic rubber, or a carbon-based organic material. For example, the partition wall (304) may be composed of chromium (Cr), a chromium oxide film (CrOx), carbon black, or a double film including these. The partition wall (304) may be formed to ensure a thickness of the color control member (340) greater than a specified thickness. For example, the partition wall (304) may be formed to a thickness of 10 to 15 μm in consideration of the thickness of the color control member (340).

[0048] The bulkhead (304) may include a side that is in contact with the other side of the black matrix (e.g., a side facing the -Z axis). The bulkhead (304) may include a side that is perpendicular to the other side of the black matrix (302), or may be formed in a tapered shape with a side that is inclined to the other side of the black matrix (302).

[0049] According to one embodiment, the color conversion panel (300) can be completed by sequentially forming a black matrix (302), a color filter (320), and a partition wall (304), and then forming a color conversion member (330) and a transparent layer (333) included in a color control member (340) through an electrohydrodynamic (EHD) process or inkjet.

[0050] Fig. 3 is a plan view showing a color conversion panel according to one embodiment, and Figs. 4 and 5 are cross-sectional views showing a color conversion panel according to one embodiment. In Fig. 4, <501> is a cross-sectional view showing a color conversion panel cut along line "B1-B1' in FIG. 3, and <502> is a cross-sectional view showing a color conversion panel cut along the line "B2-B2' in Fig. 3. In Fig. 5, the drawing <503> is a cross-sectional view showing a color conversion panel cut along the line "B3-B3' in FIG. 3, and <504> is a cross-sectional view showing a color conversion panel cut along line "B4-B4' in FIG. 3. In FIGS. 3, 4 and 5, a color conversion panel applied to the electronic device described above will be described as an example.

[0051] Referring to FIGS. 3, 4, and 5, a color conversion panel (500) according to an embodiment (e.g., the color conversion panel (300) of FIG. 2) may include a front substrate (410) (e.g., the front substrate (301) of FIG. 2), a black matrix (302), a color filter (320), an overcoat layer (520), a partition wall (610) (e.g., the partition wall (304) of FIG. 1), a color control member (331, 332, 333), a thin film encapsulation layer (510), and an organic resin layer (540) (or a side resin layer). In describing the embodiment of FIGS. 3, 4, and 5, the color conversion panel of the embodiment illustrated in FIG. 2 may be referred to, and for configurations similar or identical to those of the embodiment illustrated in FIG. 2, the same reference numerals may be assigned or omitted, and a detailed description thereof may also be omitted.

[0052] The front substrate (410) may include a first side (411), a second side (412), a third side (413), and a fourth side (414). The first side (411) of the front substrate (410) may face the second side (412). The first side (411) may face the +Y axis, and the second side (412) may face the -Y axis. The third side (413) may intersect the first side (411) and face the fourth side (414). The third side (413) may face the -X axis, and the fourth side (414) may face the +X axis. The front substrate (410) may include one side (415) facing the +Z axis. At least one of the first side (411), the second side (412), the third side (413), and the fourth side (414) may be formed to be bent from the side (415) while being in contact with the side (415) corresponding to the side on which an image is implemented in the electronic device. At least one of the first side (411), the second side (412), the third side (413), and the fourth side (414) may form an acute angle or a right angle with the side (415).

[0053] The overcoat layer (520) can be placed on the black matrix (302) and the color filters (321, 322, 323) to cover the black matrix (302) and the color filters (321, 322, 323). The overcoat layer (520) can be formed of an organic insulating material to level the step between the color filters (321, 322, 323) and the black matrix (302).

[0054] A color control member (e.g., color control member (340) of FIG. 2) may include a first color conversion layer (331), a second color conversion layer (332), and a transparent layer (333). For example, the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) may be disposed adjacent to the first side (411) and the second side (412) of the front substrate (410). The first color conversion layer (331) may be disposed adjacent to the third side (413) of the front substrate (410). The transparent layer (333) may be disposed adjacent to the fourth side (414) of the front substrate (410).

[0055] The thin film encapsulation layer (510) can be formed to cover a color control member including a color conversion layer (331, 332) that is vulnerable to external moisture or oxygen. The thin film encapsulation layer (510) can block external moisture or oxygen from penetrating into the color control member including the color conversion layer (331, 332).

[0056] According to one embodiment, the thin film encapsulation layer (510) may be formed to cover the first color conversion layer (331), the second color conversion layer (332) and the transparent layer (333), the organic resin layer (540), the side surfaces (521, 522, 523, 524) of the overcoat layer (520) and / or the side surfaces (411, 412, 413, 414) of the front substrate (410). The thin film encapsulation layer (510) may block a moisture permeation path through the first color conversion layer (331), the second color conversion layer (332) and the transparent layer (333), the organic resin layer (540), the side surfaces (521, 522, 523, 524) of the overcoat layer (520) and / or the side surfaces (411, 412, 413, 414) of the front substrate (410).

[0057] The thin film encapsulation layer (510) may be formed with at least one layer structure made of an inorganic insulating material. The thin film encapsulation layer (510) may be formed with at least one layer structure including at least one of Al2O3, SiNx, SiOx, and SiON. The thin film encapsulation layer (510) may be formed with an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, or / and a plasma enhanced chemical vapor deposition (PECD) method.

[0058] According to one embodiment, the thin film encapsulation layer (510) may be formed into a single-layer structure by depositing Al2O3 using an ALD method. According to one embodiment, the thin film encapsulation layer (510) may be formed into a single-layer or multi-layer structure by depositing at least one of SiNx, SiOx, and SiON using a CVD or PECVD method.

[0059] According to one embodiment, the uppermost layer (or the uppermost layer furthest from the front substrate (410)) (e.g., the third encapsulation layer (513)) of the multi-layered thin film encapsulation layer (510) may be formed of a material having a denser texture than the remaining encapsulation layers (e.g., the first encapsulation layer (511) and / or the second encapsulation layer (512)) included in the multi-layered encapsulation layer (510). For example, the uppermost layer of the thin film encapsulation layer (510) may be formed of SiNx, and the remaining encapsulation layers of the thin film encapsulation layer (510) may be formed of SiOx or / and SiON. Since the uppermost layer of the thin film encapsulation layer (510) has a denser texture than the remaining encapsulation layers of the thin film encapsulation layer (510), it may be resistant to moisture. Since the remaining encapsulation layers have a lower tissue density than the top layer of the thin film encapsulation layer (510), the compressive stress occurring in the top layer can be alleviated, thereby preventing the thin film encapsulation layer (510) from being damaged by the top layer.

[0060] According to one embodiment, the thin film encapsulation layer (510) can be formed in a double-layer structure by depositing SiON or / and SiOx using a PECVD method and then depositing SiNx using a PECVD method.

[0061] According to one embodiment, the thin film encapsulation layer (510) may be formed in a single-layer or multi-layer structure by depositing at least one of Al2O3, SiNx, SiOx, and SiON using a CVD or PECVD method and an ALD method. For example, the thin film encapsulation layer (510) may be formed in a multi-layer structure by depositing Al2O3 using an ALD method and then sequentially depositing SiON and SiNx using a PECVD method. The thin film encapsulation layer (510) may include a first encapsulation layer (511) formed of Al2O3, a second encapsulation layer (512) formed of SiON on the first encapsulation layer (511), and a third encapsulation layer (513) formed of SiNx on the second encapsulation layer (512).

[0062] The partition wall (610) may include one side (611) (or, first partition wall surface) (e.g., a side facing the +Z axis) adjacent to the overcoat layer (520), the other side (612) (or, second partition wall surface) (e.g., a side facing the -Z axis) adjacent to the thin film encapsulation layer (510), and a first inclined side surface (613) (or, third partition wall surface) and a second inclined side surface (614) (or, fourth partition wall surface) disposed between the one side and the other side.

[0063] The surface area of ​​one side (611) of the partition wall (610) (or the contact area with the overcoat layer (520)) may be smaller than the surface area of ​​the other side (612) of the partition wall (610) (or the contact area with the thin film encapsulation layer (510). Among the partition walls (610), the first inclined side surface (613) of the partition wall (610) formed along the edge of the front substrate (410) may be arranged adjacent to the side surfaces (411, 412, 413, 414) of the front substrate (410), and the second inclined side surface (614) may be arranged far from the side surfaces (411, 412, 413, 414) of the front substrate (410).

[0064] According to one embodiment, the first inclined side (613) located at the outermost edge of the partition wall (610) formed along the edge of the front substrate (410) may contact the organic resin layer (540), and the second inclined side (614) may contact the color control member (331, 332, 333). The first inclined side (613) and the second inclined side (614) of the partition wall (610) located on the inner side of the edge of the front substrate (410) may contact the color control member (331, 332, 333).

[0065] According to one embodiment, the partition wall (610) may be formed in a negative taper shape. The partition wall (610) may be formed to have a wider width as it gets farther away from the front substrate (410). The partition wall (610) may have a wider width as it goes from one side facing the front substrate (410) (e.g., a side facing the +Z axis) to the other side facing the light source panel (e.g., a side facing the -Z axis) (e.g., a side facing the -Z axis). An angle formed by at least one of the first inclined side surface (613) and the second inclined side surface (614) of the reverse taper-shaped partition wall (610) and the one side surface (611) may be formed to be an obtuse angle. The angle formed by at least one of the first inclined side (613) and the second inclined side (614) of the reverse taper-shaped bulkhead (610) and the other surface (612) can be formed as an acute angle.

[0066] According to one embodiment, light passing through the color control member (331, 332, 333) can be widely radiated and emitted toward the front substrate (410) without being lost by the reverse taper-shaped partition wall (610). On the other hand, in the case of a positive taper-shaped partition wall, light generated from the light source panel and passing through the color control member (331, 332, 333) can be reflected by the positive taper-shaped partition wall and returned toward the light source panel (e.g., the light source panel (310) of FIG. 2) without being emitted through the front substrate (410). Therefore, the partition wall (610) made of an opaque material can be formed in a reverse taper shape having an inclined side surface (613, 614) that becomes farther away from the imaginary central axis of the partition wall (610) as it goes from one side (611) to the other side (612) in consideration of light emission efficiency.

[0067] According to one embodiment, the color control members (331, 332, 333) may be formed after the partition wall (610) is formed. Since the partition wall (610) is formed in a reverse taper shape, even if the color control members (331, 332, 333) are formed using a common mask, the color control members (331, 332, 333) may be arranged to be separated by the partition wall (610).

[0068] According to one embodiment, the organic resin layer (540) may be formed to contact the first inclined side surface (613) located at the outermost edge of the partition wall (610) formed along the edge of the front substrate (410). The organic resin layer (540) may be formed to cover the first inclined side surface (613) of the partition wall (610) having a reverse tapered shape. The organic resin layer (540) may be formed by being applied to cover the corner portion (CP) formed by the first inclined side surface (613) of the partition wall (610) surrounding the outermost sub-pixel (e.g., the sub-pixel (SP) of FIG. 2) and the other surface (e.g., the surface facing the -Z axis) of the overcoat layer (520). The organic resin layer (540) may be formed in a form that fills the corner portion (CP). The side surface (541) of the organic resin layer (540) may have a shape symmetrical with the first inclined side surface (613) of the partition wall (610). The side surface (541) (or the first inclined surface) of the organic resin layer (540) in contact with the thin film encapsulation layer (510) may be formed in a regular tapered shape. The side surface (541) of the organic resin layer (540) may be formed to form an acute angle with the other surface of the overcoat layer (520) and an obtuse angle with the other surface (612) of the partition wall. The thin film encapsulation layer (510) disposed on the organic resin layer (540) having a portion of a regular tapered shape may be formed with a uniform thickness over the entire area of ​​the thin film encapsulation layer (510). Since the thin film encapsulation layer (510) disposed on the organic resin layer (540) can be gently formed in an area corresponding to the corner portion (CP), the thin film encapsulation layer (510) can be formed with a uniform thickness without a single line in an area corresponding to the corner portion (CP). By improving the step coverage of the thin film encapsulation layer (510) formed on the organic resin layer (540), moisture penetration toward the side of the thin film encapsulation layer (510) can be prevented.

[0069] The organic resin layer (540) may be formed of an organic resin material that is transparent or opaque. For example, the organic resin layer (540) may be formed of the same material as at least one of the overcoat layer (520), the partition wall, the color filter (321, 322, 323), the first color conversion layer (331), the second color conversion layer (332), the transparent layer (333), and the liquid-repellent material, in a single-layer or multi-layer structure. The organic resin layer (540) may be formed by an electrohydrodynamic (EHD) process or an inkjet process.

[0070] According to one embodiment, when the organic resin layer (540) is formed of a colored (e.g., red, green, or / and blue) organic resin material, the black matrix (302) may be formed to overlap with the organic resin layer (540). The black matrix (302) overlapping with the organic resin layer (540) can prevent light from being emitted to the outside of the color conversion panel (500) through the organic resin layer (540), thereby preventing crosstalk defects from occurring.

[0071] Fig. 6 is a cross-sectional view illustrating a color conversion panel according to one embodiment. In Fig. 6, a color conversion panel applied to the electronic device described above is described as an example.

[0072] Referring to FIG. 6, a color conversion panel according to one embodiment (e.g., the color conversion panel (300) of FIG. 2 or / and the color conversion panel (500) of FIGS. 3, 4, and 5) may include a front substrate (410), a black matrix (302), a color filter (320), an overcoat layer (520), a partition wall (610), a color control member (340), a thin film encapsulation layer (510), and an organic resin layer (540). At least a portion of the configuration of the color conversion panel of FIG. 6 may be applied to at least a portion of the configuration of the color conversion panels of FIGS. 2, 3, 4, and 5. For example, the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), the thin film encapsulation layer (510), and the organic resin layer (540) of FIG. 6 may be applied in accordance with the descriptions of the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), the thin film encapsulation layer (510), and the organic resin layer (540) of FIGS. 2, 3, 4, and 5.

[0073] The front substrate (410) may include one side (415) (or a second side), another side (416) (a first side) facing in the opposite direction to the first side (415), the first side (411), the second side (e.g., the second side (412) of FIG. 3), the third side (e.g., the third side (413) of FIG. 3), and the fourth side (e.g., the fourth side (414) of FIG. 3). A corner surface (601) (or a chamfered surface, a second inclined surface) may be formed between at least a portion of at least one of the first side (411), the second side, the third side, and the fourth side and the other side (416). The corner surface (601) may be formed in the shape of a curved surface or an inclined surface. One side of the corner surface (601) may be formed to be bent from the side surface (411) while being in contact with the side surface (411). One side of the corner surface (601) may be formed to form an obtuse angle with the side surface (411). The other side of the corner surface (601) may be formed to be in contact with the other side (416) and to be bent from the other side (416). The other side of the corner surface (601) may be formed to form an obtuse angle with the other side (416).

[0074] The corner surface (601) can be formed into an inclined or curved shape through a chamfering process or a corner rounding process on the corner portion of the front substrate. For example, the length of the corner surface (601) can be formed to be 10 to 50 μm.

[0075] The overcoat layer (520) may include a side surface (521) that faces the same direction as at least one of the first side surface (411), the second side surface, the third side surface, and the fourth side surface of the front substrate (410). The side surface (521) of the overcoat layer (520) may be spaced apart from the side surface (411) of the front substrate (410) by a specified distance (d). The side surface (521) of the overcoat layer (520) may be spaced apart from the side surface (411) of the front substrate (410) in a first direction (e.g., +X-axis direction) and / or a second direction (e.g., +Y-axis direction). The side surface (521) of the overcoat layer (520) may be formed to protrude more than the first inclined side surface (613) of the partition wall (610) toward the side surface (411) of the front substrate (410). For example, the side surface (521) of the overcoat layer (520) may be formed to protrude by about 20 μm or less than the first inclined side surface (613) of the partition wall (610). The side surface (521) of the overcoat layer (520) may be formed to overlap with the organic resin layer (540).

[0076] The side surface (521) of the overcoat layer (520) formed of an organic insulating material (e.g., polymer) may be positioned closer to the inside of the color conversion panel than the side surface (411) of the front substrate (410). The side surface (521) of the overcoat layer (520) may be prevented from being used as a moisture permeation path. Even if the thin film encapsulation layer (510) is damaged at the edge of the front substrate (410) and moisture permeates through the damaged gap of the thin film encapsulation layer (510), external moisture or oxygen may be prevented from penetrating into the overcoat layer (520).

[0077] The thin film encapsulation layer (510) can be formed to cover the color control member (340) including the color conversion layer (331, 332) that is vulnerable to external moisture or oxygen. The thin film encapsulation layer (510) can block external moisture or oxygen from penetrating into the color control member (340) including the color conversion layer (331, 332).

[0078] According to one embodiment, the thin film encapsulation layer (510) may be formed to cover the color control member (340), the organic resin layer (540), and / or the side surfaces (411, 412, 413, 414) of the front substrate (410). The thin film encapsulation layer (510) may block moisture permeation paths through the color control member (340), the side surface (541) (or the first inclined surface) of the organic resin layer (540), the corner surface (601) (or the second inclined surface) of the front substrate (410), and the side surface (411) of the front substrate (410).

[0079] The organic resin layer (540) may be formed to cover the first inclined side surface (613) of the barrier rib (610) having a reverse tapered shape. The organic resin layer (540) may be formed by being applied to cover the corner portion (CP) formed by the first inclined side surface (613) of the barrier rib (610) surrounding the outermost sub-pixel (e.g., the sub-pixel (SP) of FIG. 2) and the other surface (e.g., the surface facing the -Z axis) of the overcoat layer (520). The thin film encapsulation layer (510) disposed on the organic resin layer (540) may be formed to have a uniform thickness over the entire area of ​​the thin film encapsulation layer (510). Since the thin film encapsulation layer (510) disposed on the organic resin layer (540) may be gently formed in an area corresponding to the corner portion (CP) and the corner surface (601), the thin film encapsulation layer (510) may be formed to have a uniform thickness without a break in an area corresponding to the corner portion (CP). By improving the step coverage of the thin film encapsulation layer (510) formed on the organic resin layer (540), moisture penetration into the thin film encapsulation layer (510) can be prevented.

[0080] Fig. 7 is a cross-sectional view illustrating a color conversion panel according to one embodiment. In Fig. 7, a color conversion panel applied to the electronic device described above is described as an example.

[0081] Referring to FIG. 7, a color conversion panel according to an embodiment (e.g., the color conversion panel (300) of FIG. 2 or / and the color conversion panel (500) of FIGS. 3, 4 and 5) may include a front substrate (410), a black matrix (302), a color filter (320), an overcoat layer (520), a partition wall (610), a color control member (340) (e.g., the first color conversion layer (331), the second color conversion layer (332) or / and the transparent layer (333) of FIG. 2), a first thin film encapsulation layer (710), a second thin film encapsulation layer (720) and an organic resin layer (540). At least a part of the configuration of the color conversion panel of FIG. 7 may apply to at least a part of the configuration of the color conversion panels of FIGS. 2, 3, 4, 5 and 6. For example, the black matrix (302), color filter (320), overcoat layer (520), partition wall (610), and color control member (340) of FIG. 7 may be applied to the descriptions of the black matrix (302), color filter (320), overcoat layer (520), partition wall (610), and color control member (340) of FIGS. 2, 3, 4, 5, and 6.

[0082] The first thin film encapsulation layer (710) may be formed to be in contact with one surface (e.g., the surface facing the +Z axis) of the color control member (340). The first thin film encapsulation layer (710) may block external moisture or oxygen from penetrating into one surface of the color control member (340).

[0083] The second thin film encapsulation layer (720) may be formed to contact the other surface (e.g., the surface facing the -Z axis) of the color control member (340). The second thin film encapsulation layer (720) may block external moisture or oxygen from penetrating the other surface of the color control member (340).

[0084] The organic resin layer (540) may be formed between the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720). The organic resin layer (540) may be formed by applying the organic resin layer (540) to cover a corner portion (CP) formed by a part of the first thin film encapsulation layer (710) on the first inclined side surface (613) of the partition wall (610) surrounding the outermost sub-pixel (e.g., the sub-pixel (SP) of FIG. 2) and a part of the first thin film encapsulation layer (710) on the other surface (e.g., the surface facing the -Z axis) of the overcoat layer (520).

[0085] The second thin film encapsulation layer (720) disposed on the organic resin layer (540) can be formed with a uniform thickness over the entire area of ​​the thin film encapsulation layer (510). Since the second thin film encapsulation layer (720) disposed on the organic resin layer (540) can be gently formed in an area corresponding to the corner portion (CP) and the corner surface (601), the second thin film encapsulation layer (720) can be formed with a uniform thickness without a break in an area corresponding to the corner portion (CP). By improving the step coverage of the second thin film encapsulation layer (720) formed on the organic resin layer (540), moisture penetration into the second thin film encapsulation layer (720) can be prevented.

[0086] According to one embodiment, at least one of the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720) may be formed with at least one layer structure made of an inorganic insulating material. At least one of the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720) may be formed with at least one layer structure including at least one of Al2O3, SiNx, SiOx, and SiON. The second thin film encapsulation layer (720) may be formed with a material having a denser texture than the first thin film encapsulation layer (710). For example, the second thin film encapsulation layer (720) may be formed of SiNx, and the first thin film encapsulation layer (710) may be formed of SiOx or / and SiON.

[0087] Fig. 8 is a cross-sectional view illustrating a color conversion panel according to one embodiment. In Fig. 8, a color conversion panel applied to the electronic device described above is described as an example.

[0088] Referring to FIG. 8, a color conversion panel according to an embodiment (e.g., the color conversion panel (300) of FIG. 2 or / and the color conversion panel (500) of FIGS. 3, 4 and 5) may include a front substrate (410), a black matrix (302), a color filter (320), an overcoat layer (520), a partition wall (610), a color control member (340) (e.g., the first color conversion layer (331), the second color conversion layer (332) or / and the transparent layer (333) of FIG. 2), a first thin film encapsulation layer (710), a second thin film encapsulation layer (720), an organic resin layer (540) and a transparent conductive layer (810). At least a portion of the configuration of the color conversion panel of FIG. 8 may be applied to at least a portion of the configuration of at least one of the color conversion panels of FIGS. 2, 3, 4, 5, 6 and 7. For example, the black matrix (302), color filter (320), overcoat layer (520), partition wall (610), color control member (340), first thin film encapsulation layer (710), and second thin film encapsulation layer (720) of FIG. 8 may be applied to the description of the black matrix (302), color filter (320), overcoat layer (520), partition wall (610), color control member (340), first thin film encapsulation layer (710), and second thin film encapsulation layer (720) of FIG. 7.

[0089] A transparent conductive layer (810) may be disposed between the overcoat layer (520) and the front substrate (410). The transparent conductive layer (810) may be formed to cover the color filter (320) and the black matrix (302), which are each formed of an organic material vulnerable to moisture. The transparent conductive layer (810) may block external moisture or oxygen from penetrating into the color filter (320) and the black matrix (302). The transparent conductive layer (810) may be formed of an inorganic film that is resistant to moisture. For example, the transparent conductive layer (810) may be formed of the same inorganic insulating material as at least one of the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720), or may be formed of an inorganic conductive layer. The inorganic conductive layer may be formed of a transparent conductive material such as indium tin oxide (ITO).

[0090] FIGS. 9A to 9D are cross-sectional views illustrating a method for manufacturing a color conversion panel according to one embodiment. The manufacturing method of FIGS. 9A to 9D will be described by way of example, where the organic resin layer is formed of a liquid-repellent material.

[0091] Referring to FIG. 9A, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels are arranged. The second region (A2) may be an external region arranged outside the first region (A1). The second region (A2) may be a region that can be removed after a thin film encapsulation layer (e.g., the thin film encapsulation layer (510) of FIGS. 4, 5, and 6 or the second thin film encapsulation layer (720) of FIGS. 7 and 8) is formed on the first region (A1). A black matrix (302), a color filter (320), an overcoat layer (520), and a reverse tapered partition wall (610) may be sequentially formed on the first region (A1) of the front substrate (410).

[0092] Referring to FIG. 9B, an organic resin layer (940) may be formed on the front substrate (410) on which the partition wall (610) is formed. The organic resin layer (940) may be formed of a liquid-repellent material between the first region (A1) and the second region (A2). For example, the organic resin layer (940) may be formed by adding a fluorine-based hydrophobic material to an organic material. The organic resin layer (940) may be formed on the side surface of the partition wall (610), the overcoat layer (520), and a portion of the front substrate (410). For example, the organic resin layer (940) may be formed to cover the corner portion (CP) formed by the side surface of the partition wall (610) and the other surface of the overcoat layer (520). For example, the organic resin layer (940) can be formed on the other surface (612) of the corner portion (CP) and the partition wall (610) (e.g., the partition wall (610) of FIG. 6).

[0093] Referring to FIG. 9c, a color control member (340) including a first color conversion layer (331), a second color conversion layer (332), and a transparent layer (333) can be formed on a front substrate (410) on which an organic resin layer (940) is formed.

[0094] The inks forming each of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) can be formed not only in the first region (A1), but also in the second region (A2). Since the inks forming each of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) are applied from the second region (A2), the unevenness of the ink application amount of the outermost sub-pixel (SP) formed in the first region (A1) can be improved.

[0095] An organic resin layer (940) including a hydrophobic material based on fluorine can form a repulsive force with the ink forming each of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333). The color control member (340) including the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) formed in the first region (A1) by the organic resin layer (940) and the residual ink (950) formed in the second region (A2) can be separated.

[0096] Referring to FIG. 9d, a thin film encapsulation layer (510) may be formed on a front substrate (410) on which a first color conversion layer (331), a second color conversion layer (332), and a transparent layer (333) are formed. The thin film encapsulation layer (510) may be formed by applying at least one inorganic insulating film to the entire surface. After the thin film encapsulation layer (510) is formed, the second region (A2) may be separated and removed from the first region (A1) through a scribing process.

[0097] According to one embodiment, after the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) are formed, the second region (A2) is cut out from the first region (A1) through a scribing process, and then a thin film encapsulation layer may be formed on the first region (A1). The thin film encapsulation layer (510) may be formed on the side surface of the front substrate (410) as well as the organic resin layer (940).

[0098] Figure 10 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment. In Figure 10, <1001> is a plan view showing the color conversion panel before the second area (A2) is removed, and the drawing <1002> is a plan view showing the color conversion panel after the second area (A2) has been removed, and the drawing <1003> Silver drawing <1002> This is a cross-sectional view showing the color conversion panel cut along the line "D1-D1'".

[0099] Referring to FIG. 10, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels (SP1, SP2, SP3) are arranged. The second region (A2) may be an external region arranged outside the first region (A1). In the second region (A2), a partition wall (610) may be arranged without separate sub-pixels. The second region (A2) may be a region that is removable after a thin film encapsulation layer (510) is formed in the first region (A1).

[0100] According to one embodiment, before the second region (A2) is removed from the first region (A1), a trench (1020) may be formed between the first region (A1) and the second region (A2). The trench (1020) may be formed to extend from one side to the other side of the front substrate (410) along the width direction of each sub-pixel (SP1, SP2, SP3). The trench (1020) may be formed one-to-many along a plurality of sub-pixels. The trench (1020) may be formed between a partition wall (610) formed in the first region (A1) and a partition wall (610) formed in the second region (A2).

[0101] After the second region (A2) is removed from the first region (A1), a trench (1020) can be formed to expose the first inclined side of the bulkhead (610).

[0102] According to one embodiment, the ink forming each of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) may be formed not only in the first region (A1), but also in the second region (A2). Since the residual ink formed in the second region (A2) is trapped in the trench (1020), the residual ink formed in the second region (A2) may not flow into the outermost sub-pixels (SP1, SP2, SP3) of the first region (A1) by the trench (1020). The trench (1020) may block a portion of the residual ink formed in the second region (A2) from affecting the outermost sub-pixels (SP1, SP2, SP3) of the first region (A1).

[0103] According to one embodiment, a black matrix (302), a color filter (320), an overcoat layer (520), a reverse taper-shaped partition wall (610), a color control member (340), and a thin film encapsulation layer (510) may be sequentially formed on a first area (A1) of a front substrate (410).

[0104] According to one embodiment, a black matrix (302), a color filter (320), an overcoat layer (520), a reverse tapered partition (610), a color control member (340), an organic resin layer (e.g., the organic resin layer (540) of FIGS. 4, 5, 6, 7, and 8, and the organic resin layer (940) of FIG. 9d) and a thin film encapsulation layer (510) may be sequentially formed on a first area (A1) of a front substrate (410). An organic resin layer (e.g., the organic resin layer (540) of FIGS. 4, 5, 6, 7, and 8, and the organic resin layer (940) of FIG. 9d) may be formed to cover a corner portion (e.g., the corner portion (CP) of FIGS. 4, 5, and 6) between the partition wall (610) and the overcoat layer (520) surrounding the outermost sub-pixel (SP) of the first region (A1).

[0105] According to one embodiment, the thin film encapsulation layer (510) can be formed on the inclined corner surface (601) of the front substrate (410) and the inclined side surface (521) of the overcoat layer (520).

[0106] Since the thin film encapsulation layer (510) can be gently formed in an area corresponding to a corner portion, a corner surface (601) of the front substrate (410), and an inclined side surface (521) of the overcoat layer (520), the thin film encapsulation layer (510) can be formed with a uniform thickness without a single line in the entire area. By improving the step coverage of the thin film encapsulation layer (510), moisture penetration into the thin film encapsulation layer (510) can be prevented.

[0107] Figure 11 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment. In Figure 11, the drawing <1101> is a plan view showing the color conversion panel before the second area (A2) is removed, and the drawing <1102> is a plan view showing the color conversion panel after the second area (A2) has been removed, and the drawing <1103> Silver drawing <1102> This is a cross-sectional view showing the color conversion panel cut along the line "D2-D2'".

[0108] At least a portion of the configuration of the color conversion panel of FIG. 11 may apply at least a portion of the configuration of at least one of the color conversion panels of FIG. 10. For example, the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), and the thin film encapsulation layer (510) of FIG. 11 may apply the description of the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), and the thin film encapsulation layer (510) of FIG. 10.

[0109] Referring to FIG. 11, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels (SP1, SP2, SP3) are arranged. The second region (A2) may be an external region arranged outside the first region (A1). In the second region (A2), a partition wall (610) may be arranged without separate sub-pixels (SP1, SP2, SP3). The second region (A2) may be a region that is removable after a thin film encapsulation layer (510) is formed in the first region (A1).

[0110] A plurality of trenches (1120) may be formed between the first region (A1) and the second region (A2). The plurality of trenches (1120) may be arranged in a row along the width direction of each of the sub-pixels (SP1, SP2, SP3). The plurality of trenches (1120) may correspond one-to-one to each of the plurality of sub-pixels (SP1, SP2, SP3). Any one of the plurality of trenches (1120) may be formed along the width direction of the first color conversion layer (331) of the first sub-pixel (SP1). Any one of the plurality of trenches (1120) may be formed along the width direction of the second color conversion layer (332) of the second sub-pixel (SP2). Any one of the plurality of trenches (1120) may be formed along the width direction of the transparent layer (333) of the third sub-pixel (SP3). Each of the plurality of trenches (1120) can be formed between a partition wall (610) formed in the first region (A1) and a partition wall (610) formed in the second region (A2).

[0111] The ink forming each of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) may be formed not only in the first region (A1), but also in the second region (A2). Since the residual ink formed in the second region (A2) is trapped in the trench (1020), the residual ink formed in the second region (A2) may not flow into the outermost sub-pixels (SP1, SP2, SP3) of the first region (A1) by the trench (1020).

[0112] Figure 12 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment. In Figure 12, <1201> is a plan view showing the color conversion panel before the second area (A2) is removed, and the drawing <1202> is a plan view showing the color conversion panel after the second area (A2) has been removed, and the drawing <1203> Silver drawing <1202> This is a cross-sectional view showing the color conversion panel cut along the line "D3-D3'".

[0113] At least a portion of the configuration of the color conversion panel of FIG. 12 may be applied to at least a portion of the configuration of at least one of the color conversion panels of FIG. 10. For example, the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), the thin film encapsulation layer (510), and the trench (1020) of FIG. 12 may be applied to the description of the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), the thin film encapsulation layer (510), and the trench (1020) of FIG. 12.

[0114] Referring to Fig. 12, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels (SP1, SP2, SP3) are arranged. The first color conversion layer (331) of the first sub-pixels (SP1), the second color conversion layer (332) of the second sub-pixels (SP2), and the transparent layer (333) of the third sub-pixels (DP3) may be separated by a partition wall (610).

[0115] The second region (A2) may be an external region disposed outside the first region (A1). The second region (A2) may be an region in which dummy sub-pixels (DP1, DP2, DP3) are disposed. The first dummy color conversion layer (1231) of the first dummy sub-pixels (DP1), the second dummy color conversion layer (1232) of the second dummy sub-pixels (DP2), and the third dummy transparent layer (1233) of the third dummy sub-pixels (DP3) may be separated by a partition wall (610). The first dummy color conversion layer (1231) may be formed of ink of the same material as the first color conversion layer (331). The first dummy color conversion layer (1231) may be formed simultaneously with (or together with) the first color conversion layer (331) through a single coating process. The second dummy color conversion layer (1232) may be formed using ink of the same material as the second color conversion layer (332). The second dummy color conversion layer (1232) may be formed simultaneously with (or together with) the second color conversion layer (332) through a single application process. The dummy transparent layer (1233) may be formed using ink of the same material as the transparent layer (333). The dummy transparent layer (1233) may be formed simultaneously with (or together with) the transparent layer (333) through a single application process.

[0116] According to one embodiment, the first ink forming the first color conversion layer (331) and the first dummy color conversion layer (1231), and the second ink forming the second color conversion layer (332) and the second dummy color conversion layer (1232) may be applied starting from the second area (A2) to the first area (A1). Since at least one of the first ink and the second ink is applied starting from the second area (A2), the unevenness of the ink application amount of the outermost sub-pixel (SP) formed in the first area (A1) can be improved.

[0117] Figure 13 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment. In Figure 13, the drawing <1301> is a plan view showing the color conversion panel before the second area (A2) is removed, and the drawing <1302> is a plan view showing the color conversion panel after the second area (A2) has been removed, and the drawing <1303> Silver drawing <1302> This is a cross-sectional view showing the color conversion panel cut along the line "D4-D4'".

[0118] At least a portion of the configuration of the color conversion panel of FIG. 13 may be applied to at least a portion of the configuration of at least one of the color conversion panels of FIG. 11. For example, the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), the thin film encapsulation layer (510), and the plurality of trenches (1120) of FIG. 11 may be applied to the description of the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), the thin film encapsulation layer (510), and the plurality of trenches (1120) of FIG. 11.

[0119] Referring to FIG. 13, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels (SP1, SP2, SP3) are arranged. The first color conversion layer (331) of the first sub-pixels (SP1), the second color conversion layer (332) of the second sub-pixels (SP2), and the transparent layer (333) of the third sub-pixels (DP3) may be separated by a partition wall (610).

[0120] The second region (A2) may be an external region disposed outside the first region (A1). The second region (A2) may be an region in which dummy sub-pixels (DP1, DP2, DP3) are disposed. The first dummy color conversion layer (1231) of the first dummy sub-pixels (DP1), the second dummy color conversion layer (1232) of the second dummy sub-pixels (DP2), and the third dummy transparent layer (1233) of the third dummy sub-pixels (DP3) may be separated by a partition wall (610).

[0121] According to one embodiment, any one of the plurality of trenches (1120) may be formed along the width direction of the first color conversion layer (331) of the first sub-pixel (SP1). Any one of the plurality of trenches (1120) may be formed along the width direction of the second color conversion layer (332) of the second sub-pixel (SP2). Any one of the plurality of trenches (1120) may be formed along the width direction of the transparent layer (333) of the third sub-pixel (SP3). Each of the plurality of trenches (1120) may be formed between the partition wall (610) formed in the first region (A1) and the partition wall (610) formed in the second region (A2).

[0122] At least one of the plurality of trenches (1120) may be arranged between a partition wall (610) surrounding the first color conversion layer (331) of the outermost first sub-pixel (SP1) of the first region (A1) and a partition wall (610) surrounding the first dummy color conversion layer (1231) of the second region (A2). At least one of the plurality of trenches (1120) may be arranged between a partition wall (610) surrounding the second color conversion layer (332) of the outermost first sub-pixel (SP2) of the first region (A1) and a partition wall (610) surrounding the second dummy color conversion layer (1232) of the second region (A2). At least one of the plurality of trenches (1120) may be arranged between a partition wall (610) surrounding a transparent layer (333) of the outermost third sub-pixel (SP3) of the first region (A1) and a partition wall (610) surrounding a dummy transparent layer (1233) of the second region (A2).

[0123] According to one embodiment, the first dummy color conversion layer (1231) may be formed of a first ink of the same material as the first color conversion layer (331). The first dummy color conversion layer (1231) may be formed simultaneously with (or together with) the first color conversion layer (331) through a single application process. The second dummy color conversion layer (1232) may be formed of a second ink of the same material as the second color conversion layer (332). The second dummy color conversion layer (1232) may be formed simultaneously with (or together with) the second color conversion layer (332) through a single application process.

[0124] According to one embodiment, the first ink forming the first color conversion layer (331) and the first dummy color conversion layer (1231), and the second ink forming the second color conversion layer (332) and the second dummy color conversion layer (1232) may be applied starting from the second area (A2) to the first area (A1). Since at least one of the first ink and the second ink is applied starting from the second area (A2), the unevenness of the ink application amount of the outermost sub-pixel (SP) formed in the first area (A1) can be improved.

[0125] Figure 14 is a cross-sectional view showing a method for manufacturing a color conversion panel according to one embodiment. In Figure 14, <1401> is a plan view showing the color conversion panel before the second area (A2) is removed, and the drawing <1402> is a plan view showing the color conversion panel after the second area (A2) has been removed, and the drawing <1403> Silver drawing <1402> This is a cross-sectional view showing the color conversion panel cut along the line "D4-D4'".

[0126] At least a portion of the configuration of the color conversion panel of FIG. 14 may apply at least a portion of the configuration of at least one of the color conversion panels of FIG. 12. For example, the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), and the thin film encapsulation layer (510) of FIG. 12 may apply the description of the black matrix (302), the color filter (320), the overcoat layer (520), the partition wall (610), the color control member (340), and the thin film encapsulation layer (510) of FIG. 12.

[0127] Referring to FIG. 14, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels (SP1, SP2, SP3) are arranged. The first color conversion layer (331) of the first sub-pixels (SP1), the second color conversion layer (332) of the second sub-pixels (SP2), and the transparent layer (333) of the third sub-pixels (DP3) may be separated by a partition wall (610).

[0128] The second region (A2) may be an external region disposed outside the first region (A1). The second region (A2) may be an region in which dummy sub-pixels (DP1, DP2, DP3) are disposed. The first dummy color conversion layer (1231) of the first dummy sub-pixels (DP1), the second dummy color conversion layer (1232) of the second dummy sub-pixels (DP2), and the third dummy transparent layer (1233) of the third dummy sub-pixels (DP3) may be separated by a partition wall (610).

[0129] According to one embodiment, before the second region (A2) is removed from the first region (A1), a partition wall (610) may be arranged between the first region (A1) and the second region (A2). The partition wall (610) may be arranged between the first color conversion layer (331) of the outermost first sub-pixel (SP1) of the first region (A1) and the first dummy color conversion layer (1231) of the second region (A2). The partition wall (610) may be arranged between the second color conversion layer (332) of the outermost first sub-pixel (SP2) of the first region (A1) and the second dummy color conversion layer (1232) of the second region (A2). The partition wall (610) can be placed between the transparent layer (333) of the outermost third sub-pixel (SP3) of the first region (A1) and the dummy transparent layer (1233) of the second region (A2).

[0130] According to one embodiment, after the second region (A2) is removed from the first region (A1), the side surface (1411) of the partition wall (610) may be formed to be inclined. The thin film encapsulation layer (510) may be formed on the inclined corner surface (601) of the front substrate (410), the inclined side surface (521) of the overcoat layer (520), and the inclined side surface (1411) of the partition wall (610).

[0131] The thin film encapsulation layer (510) can be gently formed in an area corresponding to the corner surface (601) of the front substrate (410), the inclined side surface (521) of the overcoat layer (520), and the inclined side surface (1411) of the partition wall (610). The thin film encapsulation layer (510) can be formed with a uniform thickness without a single line in the entire area. By improving the step coverage of the thin film encapsulation layer (510), moisture penetration into the thin film encapsulation layer (510) can be prevented.

[0132] According to one embodiment, the second region (A2) is not limited to the embodiments described in each drawing, and the second regions (A2) described in FIGS. 10, 11, 12, 13, and 14 may be applied in combination with each other. For example, the color conversion panel according to one embodiment may employ a combination of a structure including a trench described in FIGS. 10 and 12, a structure including a plurality of trenches described in FIGS. 11 and 13, and a structure not including a trench described in FIG. 14. In addition, the number and shape of the trenches described in FIGS. 10, 11, 12, and 13 are not limited to the above-described examples and may be variously changed.

[0133] Fig. 15a is a plan view showing a color conversion panel according to an embodiment before the second region is removed, and Fig. 15b is a plan view showing the color conversion panel after the second region is removed. In Figs. 15a and 15b, the drawings <1501> is a drawing showing a color conversion panel of a structure that does not include a trench, and the drawing <1502> is a drawing showing a color conversion panel of a structure containing one trench, and the drawing <1503> is a drawing showing a color conversion panel of a structure including multiple trenches, and the drawing <1502> is a drawing showing a color conversion panel having a structure including one trench and a dummy sub-pixel, and <1503> is a drawing showing a color conversion panel having a structure including a plurality of trenches and dummy sub-pixels.

[0134] At least a portion of the configuration of the color conversion panel of FIGS. 15A and 15B may apply to at least a portion of the configuration of at least one of the color conversion panels of FIGS. 10 to 14. For example, one trench (1020) of FIGS. 15A and 15B may apply to the description of the trench (1020) of FIGS. 10 and 11, a plurality of trenches (1120) of FIGS. 15A and 15B may apply to the description of a plurality of trenches (1120) of FIGS. 12 and 13, and a dummy sub-pixel (DP1, DP2, DP3) of FIGS. 15A and 15B may apply to the description of a dummy sub-pixel (DP1, DP2, DP3) of FIGS. 12, 13, and 14.

[0135] Referring to FIGS. 15A and 15B, the front substrate (410) may include a first region (A1) and a second region (A2). The first region (A1) may be a region where sub-pixels (SP1, SP2, and SP3) are arranged. The first color conversion layer (331) of the first sub-pixels (SP1), the second color conversion layer (332) of the second sub-pixels (SP2), and the transparent layer (333) of the third sub-pixels (DP3) may be separated by a partition wall (610).

[0136] At least one of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) disposed in the outermost region of the first region (A1) may be formed long. At least one of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) disposed in the outermost region of the first region (A1) adjacent to the second region (A2) may be formed long. At least one of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) disposed in the outermost region of the first region (A1) may be formed longer than at least one of the first color conversion layer (331), the second color conversion layer (332), and the transparent layer (333) disposed in the remaining region excluding the outermost region.

[0137] The first color conversion layer (331) of the outermost first sub-pixel (SP1) of the first region (A1) and the first color conversion layer (331) of the first sub-pixel (SP1) adjacent to the outermost first sub-pixel (SP1) may be integrated and formed to be long. The second color conversion layer (332) of the outermost second sub-pixel (SP2) of the first region (A1) and the second color conversion layer (332) of the second sub-pixel (SP2) adjacent to the outermost second sub-pixel (SP2) may be integrated and formed to be long. The transparent layer (333) of the outermost third sub-pixel (SP3) of the first region (A1) and the transparent layer (333) of the third sub-pixel (SP3) adjacent to the outermost third sub-pixel (SP3) may be integrated and formed to be long. By adjusting the ink application amount of the sub-pixels (SP) in the outermost region of the first region (A1) to an average value, the unevenness of the ink application amount of the outermost sub-pixels (SP) formed in the first region (A1) can be improved.

[0138] FIGS. 16A and 16B are cross-sectional views illustrating a method for manufacturing a display including a color conversion panel according to one embodiment. FIGS. 16A and 16B illustrate the color conversion panel and light source panel described above as examples.

[0139] Referring to FIG. 16a, a light source panel (1420) (e.g., the light source panel (310) of FIG. 2) and a color conversion panel (1410) (e.g., the color conversion panel (300) of FIG. 2) may be provided. The color conversion panel (1410) is formed to protrude more than the light source panel (1420), thereby preventing a seam phenomenon in which the light source panel (1420) is exposed to the user's naked eye.

[0140] The color conversion panel (1410) may include a first side region (1611) and a first inclined region (1601) that is inclined. The first side region (1611) may be formed to form an obtuse angle with the first inclined region (1601). The first inclined region (1601) may be an region corresponding to an organic resin layer (e.g., an organic resin layer (540) of FIG. 6) disposed on a side of a partition wall having a reverse tapered shape (e.g., a partition wall (610) of FIG. 6).

[0141] The light source panel (1420) may include a second side region (1612) and a second inclined region (1602). The second side region (1612) may be formed to form an obtuse angle with the second inclined region (1602). The second inclined region (1602) may be formed to face a portion of the first inclined region (1601).

[0142] The light source panel (1420) and the color conversion panel (1410) can be bonded together using an adhesive (1430) so that the first inclined region (1601) and the second inclined region (1602) face each other. The adhesive (1430) can be formed of, for example, an optically clear adhesive (OCA) or / and an optically clear resin (OCR).

[0143] After the light source panel (1420) and the color conversion panel (1410) are bonded together, a side sealing layer (1610) may be formed. The side sealing layer (1610) may be formed to cover at least one of a portion of the front area (1415) of the color conversion panel (1410), the first side area (1611), the first inclined area (1601), a portion of the rear area (1425) of the light source panel (1420), the second side area (1612), and the inclined second inclined area (1602). The side encapsulating layer (1610) may be formed to cover a portion of the front area (1415) of the color conversion panel (1410), the first side area (1611), the first inclined area (1601), a portion of the rear area (1425) of the light source panel (1420), the second side area (1612), and the inclined second inclined area (1602). The side encapsulating layer (1610) may be formed with at least one layer structure including at least one of Al2O3, SiNx, SiOx, and SiON. The side encapsulating layer (1610) may block moisture and / or oxygen from penetrating into the side of the bonded light source panel (1420) and the color conversion panel (1410).

[0144] After the side sealing layer (1610) is formed, a side protection member (or side seal) (1620) can be formed, as illustrated in FIG. 16b. The side protection member (1620) can be formed to cover the side sealing layer (1610).

[0145] FIGS. 17A and 17B are cross-sectional views illustrating a method of manufacturing a display including a color conversion panel according to an embodiment. In FIGS. 17A and 17B, the color conversion panel and light source panel described above will be described as examples. At least a portion of the configuration of the display of FIGS. 17A and 17B may be applied to at least a portion of the configuration of the display of FIGS. 16A and 16B. For example, the light source panel (1420), the color conversion panel (1410), the side sealing layer (1610), and the side protection member (1620) of FIGS. 17A and 17B may be applied to the descriptions of the light source panel (1420), the color conversion panel (1410), the side sealing layer (1610), and the side protection member (1620) of FIGS. 16A and 16B.

[0146] Referring to FIG. 17A, a light source panel (1420) (e.g., the light source panel (310) of FIG. 2) and a color conversion panel (1410) (e.g., the color conversion panel (300) of FIG. 2) may be provided. A second inclined region (1602) of the light source panel (1420) and a first inclined region (1601) of the color conversion panel (1410) may be bonded to face each other using an adhesive (1430). The adhesive (1430) may be formed of, for example, an optically clear adhesive (OCA) or / and an optically clear resin (OCR).

[0147] After the light source panel (1420) and the color conversion panel (1410) are bonded together, a side planarization layer (1710) may be formed. The side planarization layer (1710) may be formed of an organic insulating material. The side planarization layer (1710) may flatten a step between the light source panel (1420) and the color conversion panel (1410). The side planarization layer (1710) may be formed to fill at least a portion of a space between the second inclined region (1602) of the light source panel (1420) and the first inclined region (1601) of the color conversion panel (1410). For example, the side planarization layer (1710) may be formed of the same material as the side protection member (1620).

[0148] Referring to FIG. 17B, a side sealing layer (1610) may be formed on the side flattening layer (1710) to overlap with the side flattening layer (1710). The side sealing layer (1610) may be formed to cover the side flattening layer (1710) on at least one of a portion of the front area (1415) of the color conversion panel (1410), the first side area (1611), the first inclined area (1601), a portion of the rear area (1425) of the light source panel (1420), the second side area (1612), and the inclined second inclined area (1602). The side encapsulation layer (1610) may be formed to cover a portion of the front area (1415) of the color conversion panel (1410), the first side area (1611), the first inclined area (1601), a portion of the rear area (1425) of the light source panel (1420), the second side area (1612), and the side planarization layer (1710) on the inclined second inclined area (1602). The side encapsulation layer (1610) may be formed with at least one layer structure including at least one of Al2O3, SiNx, SiOx, and SiON. The side encapsulation layer (1610) may block moisture and / or oxygen from penetrating into the side of the bonded light source panel (1420) and the color conversion panel (1410).

[0149] After the side seal layer (1610) is formed, a side protection member (or side seal) (1620) may be formed. The side protection member (1620) may be formed to cover the side seal layer (1610).

[0150] FIG. 18 is a diagram illustrating a display according to an embodiment. In FIG. 18, the color conversion panel and light source panel described above will be described as examples. At least a portion of the configuration of the display of FIG. 18 may be applied to at least a portion of the configuration of the displays of FIGS. 16b and 17b. For example, the light source panel (1420) and the color conversion panel (1410) of FIG. 18 may be applied to the descriptions of the light source panel (1420) and the color conversion panel (1410) of FIGS. 16b and 17b.

[0151] Referring to FIG. 18, a display (1810) according to one embodiment may include a plurality of light source panels (1420) and a plurality of color conversion panels (1410). The plurality of light source panels (1420) and the plurality of color conversion panels (1410) may be provided in equal numbers.

[0152] The display (1810) can be manufactured in a large area by tiling a plurality of unit modules (1820) in which a plurality of color conversion panels (1410) are bonded to each of a plurality of light source panels (1420) using an adhesive. The gap between the plurality of unit modules (1820) can be formed narrowly so that no seams are visible. For example, the gap between the plurality of unit modules (1820) can be formed within 50 μm.

[0153] One embodiment of the present invention can provide a display of a large-area electronic device capable of supporting moisture-proof performance.

[0154] In addition, one embodiment of the present invention can provide a modular display capable of implementing a narrow bezel while improving moisture permeation prevention performance toward the side of a color conversion panel.

[0155] In addition, one embodiment of the present invention can provide a display including a color conversion panel capable of reducing the unevenness of the printing quality of the color conversion layer of the outermost sub-pixels. The display according to various embodiments disclosed in this document is applicable to any device having a display function without limitation. The display can be applied to wired electronic devices, wireless electronic devices, fixed electronic devices, mobile (or portable), small, medium and / or large electronic devices. For example, the electronic device can include a TV, a portable communication device (e.g., a smartphone), a computer device, a multimedia device, a medical device, a camera, a wearable device, or a home appliance device.

[0156] A display including a plurality of sub-pixels according to an embodiment disclosed in this document may include a light source panel (310, 1420) and a color conversion panel (300, 1410) facing the light source panel.

[0157] According to one embodiment, the color conversion panel (300, 500, 1410) may include a front substrate (301, 410); a color conversion layer (330) disposed on the front substrate; a partition wall (304, 610) disposed on the front substrate; an organic resin layer (540) formed to cover a side surface of the partition wall (610) that separates the plurality of sub-pixels disposed at the outermost portion of the front substrate and disposed between the side surface of the partition wall (610) and the side surface of the front substrate; and a thin film encapsulation layer (510) disposed on the organic resin layer.

[0158] According to one embodiment, the partition wall may be formed so that its width gradually increases as it approaches the light source panel (310, 1420).

[0159] According to one embodiment, the organic resin layer (540) may be formed so that its width gradually narrows toward the light source panel (310, 1420).

[0160] According to one embodiment, the bulkhead (610) may include an inclined side surface in a reverse taper shape, and the organic resin layer (540) may include an inclined side surface in a positive taper shape.

[0161] According to one embodiment, the front substrate (410) may include a plurality of side surfaces (411, 412, 413, 414) and a first surface (416) that is arranged to be bent relative to the plurality of side surfaces.

[0162] According to one embodiment, the bulkhead (610) may include an inclined side surface (613) that forms an obtuse angle with the first surface (416).

[0163] According to one embodiment, the organic resin layer (540) may include an inclined surface (541) forming an acute angle with the first surface (416).

[0164] According to one embodiment, the front substrate (410) may further include a corner surface (601) formed in an inclined or rounded shape and disposed between at least one of the plurality of side surfaces and the first surface (416).

[0165] According to one embodiment, the thin film encapsulation layer may include a first thin film encapsulation layer (710) formed along a corner surface (601) of the front substrate (410); and a second thin film encapsulation layer (720) formed along a side surface of the organic resin layer (540).

[0166] According to one embodiment, the organic resin layer (540) may be disposed between the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720).

[0167] According to one embodiment, the display further includes an overcoat layer (520) disposed on the front substrate (410), and a side surface of the overcoat layer (520) overlaps with the organic resin layer (540) and may be formed to protrude more than the partition wall (610) toward the side surface of the front substrate (410).

[0168] According to one embodiment, the organic resin layer (540) may be formed of the same material as the overcoat layer (520) or a liquid-repellent material.

[0169] According to one embodiment, the display may further include at least one trench (1020, 1120) disposed between a partition wall (610) that partitions a plurality of sub-pixels located at the outermost edge of the front substrate (410) and a side surface of the front substrate (410).

[0170] According to one embodiment, the at least one trench (1020, 1120) may be formed one-to-many along a plurality of sub-pixels, or may be formed in multiples so as to correspond one-to-one with each of the plurality of sub-pixels.

[0171] According to one embodiment, the display may further include a side encapsulation layer (1610) formed to cover a side of the light source panel (1420) and a side of the color conversion panel (1410).

[0172] According to one embodiment, the display may further include a side planarization layer (1710) disposed between each of the side surfaces of the light source panel (1420) and the side surface of the color conversion panel (1410) and the side sealing layer.

[0173] According to one embodiment, the display may further include a side protection member (1620) formed to cover the side sealing layer (1610).

[0174] According to one embodiment, at least one of the thin film encapsulation layer (510) and the side encapsulation layer (1610) may be formed with at least one layer structure including at least one of Al2O3, SiNx, SiOx, and SiON.

[0175] A color conversion panel according to an embodiment disclosed in this document may include a front substrate (410); a color conversion layer (330) disposed on the front substrate; a partition wall (610) disposed between the color conversion layers on the front substrate and formed to partition each of the plurality of sub-pixels; an organic resin layer (540) formed to cover a side surface of the partition wall that divides the plurality of sub-pixels disposed at the outermost portion of the front substrate and disposed between the side surface of the partition wall and the side surface of the front substrate; and a thin film encapsulation layer (510) disposed on the organic resin layer (540).

[0176] According to one embodiment, the bulkhead (6100) may be formed so that its width gradually increases as it moves away from the front substrate (410).

[0177] According to one embodiment, the organic resin layer (540) may be formed so that its width gradually increases toward the front substrate (410).

[0178] According to one embodiment, the front substrate (410) may include a plurality of side surfaces (411, 412, 413, 414), a first surface (416) arranged to be bent with the plurality of side surfaces, and a corner surface (601) arranged between at least one side surface (411, 412, 413, 414) of the plurality of side surfaces and the first surface (416) and formed in an inclined or rounded shape.

[0179] According to one embodiment, the thin film encapsulation layer (510) includes a first thin film encapsulation layer (710) formed along a corner surface (601) of the front substrate (410) and a second thin film encapsulation layer (720) formed along a side surface of the organic resin layer (540), and the organic resin layer (540) can be disposed between the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720).

[0180] According to one embodiment, the color conversion panel further includes an overcoat layer (520) disposed on the front substrate (410), and a side surface of the overcoat layer (520) overlaps with the organic resin layer (540) and may be formed to protrude more than a side surface of the partition wall (610) toward the side surface of the front substrate (410).

[0181] A display according to an embodiment disclosed in this document includes a color conversion panel, and the color conversion panel (300, 500, 1410) may include a front substrate (301, 410); a color conversion layer (330) disposed on the front substrate; a partition wall (304, 610) disposed on the front substrate and dividing each of the plurality of sub-pixels; an organic resin layer (540) having a tapered shape formed to cover a side surface of the partition wall (610) disposed at the outermost portion of the front substrate and dividing the plurality of sub-pixels; and a thin film encapsulation layer (510) disposed on the organic resin layer.

[0182] According to one embodiment, the bulkhead (304, 610) may be formed in a reverse taper shape.

[0183] The embodiments of this document and the terminology used herein are not intended to limit the technology described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, and / or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar components. The singular expressions may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B," "at least one of A and / or B," "A, B, or C," or "at least one of A, B, and / or C" can include all possible combinations of the items listed together. Expressions such as "first," "second," "first," or "second," may modify the corresponding components regardless of order or importance, and are only used to distinguish one component from another, but do not limit the corresponding components. When it is said that a component (e.g., a first component) is “(functionally or communicatively) connected” or “connected” to another component (e.g., a second component), the component may be directly connected to the other component, or may be connected via another component (e.g., a third component).

[0184] In this document, "adapted to or configured to" may be used interchangeably with, for example, "suitable for," "capable of," "modified to," "made to," "capable of," or "designed to," for example, hardware-wise or software-wise. In some contexts, the phrase "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a processor configured (or adapted) to perform A, B, and C" may mean a dedicated processor (e.g., an embedded processor) for performing those operations, or a general-purpose processor (e.g., a CPU or AP) that can perform those operations by executing one or more programs stored in a memory device (e.g., a memory).

[0185] The term "module" as used in this document includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A "module" may be an integral component or a minimum unit or part thereof that performs one or more functions. A "module" may be implemented mechanically or electronically, and may include, for example, an application-specific integrated circuit (ASIC) chip, field-programmable gate array (FPGA), or programmable logic device, known or to be developed in the future, that performs certain operations.

[0186] At least a part of a device (e.g., modules or functions thereof) or a method (e.g., operations) according to an embodiment may be implemented as instructions stored in a computer-readable storage medium (e.g., memory) in the form of a program module. When the instructions are executed by a processor (e.g., a processor), the processor may perform a function corresponding to the instructions. The computer-readable recording medium may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical recording medium (e.g., a CD-ROM, a DVD, a magneto-optical medium (e.g., a floptical disk), an internal memory, etc. The instructions may include code generated by a compiler or code executable by an interpreter.

[0187] Each component (e.g., a module or a program module) according to an embodiment may be composed of one or more entities, and some of the aforementioned sub-components may be omitted, or other sub-components may be further included. Alternatively or additionally, some components (e.g., a module or a program module) may be integrated into a single entity, which may perform the same or similar functions as those performed by each of the respective components prior to integration. Operations performed by modules, program modules, or other components according to various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

Claims

1. In a display including a plurality of sub-pixels, Light source panel (310,1420) and; It includes a color conversion panel (300, 500, 1410) facing the above light source panel, The above color conversion panel (300,500,1410) Front substrate (301,410) and; A color conversion layer (330) disposed on the front substrate; A partition wall (304,610) disposed on the front substrate and formed to partition each of the plurality of sub-pixels; An organic resin layer (540) formed to cover the side surface of the partition wall (304,610) that separates the plurality of sub-pixels arranged at the outermost edge of the front substrate, and arranged between the side surface of the partition wall (304,610) and the side surface of the front substrate; A display including a thin film encapsulation layer (510) disposed on the organic resin layer (540).

2. In paragraph 1, The above bulkhead, It is formed so that the width gradually increases as it approaches the light source panel (310, 420). The above organic resin layer (540) A display formed so that the width gradually narrows as it approaches the light source panel (310, 1420).

3. In paragraph 1 or 2, The above bulkhead (610) includes an inclined side in a reverse tapered shape, The above organic resin layer (540) is a display including a sloped surface in a regular tapered shape.

4. In paragraph 1 or 2, The above front substrate (410) Multiple sides (411,412,413,414), It includes a first surface (416) that is arranged to be folded with the above-mentioned plurality of side surfaces, The above bulkhead (610) includes an inclined side surface (613) that forms an obtuse angle with the first surface (416), A display in which the organic resin layer (540) includes an inclined surface (541) forming an acute angle with the first surface (416).

5. In paragraph 4, The above front substrate (410) A display further comprising a corner surface (601) formed in an inclined or rounded shape and positioned between at least one of the plurality of sides and the first side (416).

6. In paragraph 5, The above thin film encapsulation layer A first thin film encapsulation layer (710) formed along the corner surface (601) of the front substrate (410); It includes a second thin film encapsulation layer (720) formed along the side of the organic resin layer (540). A display in which the above organic resin layer (540) is positioned between the first thin film encapsulation layer (710) and the second thin film encapsulation layer (720).

7. In paragraph 1, It further comprises an overcoat layer (520) placed on the front substrate (410). A display in which the side of the above overcoat layer (520) overlaps with the organic resin layer (540) and is formed to protrude more than the partition wall (610) toward the side of the front substrate (410).

8. In paragraph 7, A display in which the above organic resin layer (540) is formed of the same material as the overcoat layer (520) or a liquid-repellent material.

9. In paragraph 1, A display further comprising at least one trench (1020, 1120) arranged between a partition (610) that divides a plurality of sub-pixels located at the outermost portion of the front substrate (410) and a side surface of the front substrate (410).

10. In paragraph 9, A display in which at least one trench (1020) is formed along a plurality of sub-pixels so as to correspond one-to-many with each of the plurality of sub-pixels.

11. In paragraph 9, A display in which at least one trench (1120) is formed in multiple numbers so as to correspond one-to-one with each of a plurality of sub-pixels.

12. In paragraph 1, A display further comprising a side sealing layer (1610) formed to cover a side of the light source panel (1420) and a side of the color conversion panel (1410).

13. In paragraph 12, A display further comprising a side planarization layer (1710) disposed between at least one of the side of the light source panel (1420) and the side of the color conversion panel (1410) and the side sealing layer.

14. In clause 12 or 13, A display further comprising a side protection member (1620) formed to cover the side sealing layer (1610).

15. In paragraph 14, A display in which at least one of the thin film encapsulation layer (510) and the side encapsulation layer (1610) is formed with at least one layer structure including at least one of Al2O3, SiNx, SiOx, and SiON.

Images