Visible light sterilization LED package using dual wavelengths
The dual-wavelength visible light germicidal LED package addresses the limitations of ultraviolet-based sterilization and insufficient light quantity in white LED technology by using dual LEDs with wavelength conversion, achieving effective and safe sterilization and suitable indoor lighting.
Patent Information
- Application Number
- PCT/KR2024/018392
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-22
- Filing Date
- 2024-11-20
- Publication Date
- 2025-05-30
AI Technical Summary
Existing LED sterilization methods using ultraviolet rays are harmful to humans and not suitable for use in lighting devices in spaces where people are active, while methods for making white light emitting diodes often result in insufficient light quantity and high costs.
A visible light germicidal LED package utilizing dual wavelengths, which includes an LED chip with a package body, a first light-emitting diode emitting light at a first center wavelength, and a second light-emitting diode emitting light at a second center wavelength, along with a wavelength conversion unit to produce white light, is developed.
The dual-wavelength LED package provides a sterilizing function that is harmless to humans, offers light of various temperatures and colors in the visible light range, and increases light quantity suitable for indoor lighting, while maintaining cost-effectiveness.
Smart Images

Figure KR2024018392_30052025_PF_FP_ABST
Abstract
Description
Visible light germicidal LED package utilizing dual wavelengths
[0001] The present invention relates to a visible light sterilizing LED package utilizing dual wavelengths, and more particularly, to an LED package including a plurality of light emitting diodes, wherein the plurality of light emitting diodes emit light of the same central wavelength or emit light of different central wavelengths.
[0002] LEDs (Light Emitting Diodes) are inorganic light sources that are rapidly finding widespread use in various fields, including display devices, vehicle lamps, and general lighting. In particular, LEDs are rapidly replacing conventional lighting sources due to their long lifespan and low power consumption.
[0003] Meanwhile, ultraviolet (UV) rays are well known for their sterilizing and disinfecting effects. Accordingly, various light sources with sterilizing functions are being developed using UV LEDs. Prior art document 1 (Korean Patent No. 10-2300679) is an invention utilizing such UV LEDs, a sterilizer using an LED UV germicidal lamp. However, UV rays are harmful to the human body, so their use is limited. This is because the sterilizing mechanism of UV rays with a wavelength of 260-290 nm destroys DNA by causing cracks in DNA molecules. Therefore, LED sterilization methods using UV rays have the disadvantage of being unsuitable for use in lighting devices in spaces where people are active.
[0004] Meanwhile, in order to make an LED that emits white light, there is a method in which the blue light of a blue LED is used as an excitation source, a fluorescent material that emits yellow light is applied, and the blue light from the element and the yellow light emitted from the fluorescent material are mixed to implement white light. In other words, a LED element that emits white light is generally made by applying a fluorescent material to the LED and using the blue light from the element and the secondary light source emitted from the fluorescent material. Prior art document 2 (Korean Patent No. 10-1432479) is an invention for making a light emitting diode that emits white light by applying a yellow fluorescent material to a blue light emitting diode. However, this method of making a white light emitting diode makes a blue LED emit white light by applying a fluorescent material to an element with a visible light wavelength of 450 nm, which is the cheapest to make white light.
[0005] Therefore, a method of utilizing a device with a central wavelength of 405 nm was used, but this is not suitable for use as lighting in daily life because it emits blue light, and in the case of a 405 nm device, it is less than 30 lm (lumen), which is short of 60 lm, which is suitable for indoor lighting, and there is a method to improve this light quantity, but there is a problem that excessive costs increase.
[0006] (Prior art literature)
[0007] (Patent Document)
[0008] Prior Document 1: Republic of Korea Patent No. 10-2300679 (registered on September 3, 2021)
[0009] Prior Document 2: Republic of Korea Patent No. 10-1432479 (registered on August 14, 2014)
[0010] The technical object of the present invention is to solve the above problem, and to provide an LED package having a sterilizing function that is harmless to the human body by using an LED having an appropriate center wavelength.
[0011] In addition, the aim is to provide a lighting device with a sterilizing function that can be used in various environments by providing an LED package that emits light of various temperatures and colors in the visible light range.
[0012] Additionally, it provides an LED package to utilize the central wavelength that is difficult to use for lighting due to insufficient light quantity.
[0013] The invention provides an LED package characterized by including a package body having electrodes and a lead frame electrically connected to each other, a first light-emitting diode disposed on the package body and emitting first light having a predetermined first wavelength as a center wavelength; and an LED chip including a second light-emitting diode disposed on the package body and emitting second light having a predetermined second wavelength as a center wavelength.
[0014] In addition, an LED package is provided, which is applied to a first light-emitting diode and a second light-emitting diode, and includes a wavelength conversion unit that converts the first light and the second light and provides white light, and the wavelength conversion unit includes at least one wavelength conversion material to emit white light.
[0015] In addition, the wavelength conversion unit provides an LED package characterized in that it is formed using a screen printing method.
[0016] In addition, an LED package is provided, characterized in that a predetermined first wavelength and a predetermined second wavelength are the same 405 nm.
[0017] In addition, an LED package is provided, characterized in that a predetermined first wavelength is 405 nm and a predetermined second wavelength is 460 nm.
[0018] In addition, an LED package is provided characterized by a bulkhead height of 0.4 mm.
[0019] In addition, an LED package is provided, characterized in that it further includes an infrared LED chip emitting light having a center wavelength of 845 nm to 855 nm on the package body.
[0020] In addition, the package body provides an LED package characterized by further including a heat sink made of ceramic material at the bottom of the package body.
[0021] In addition, an LED package is provided, characterized in that the LED chips are provided in multiple numbers, including an R LED chip that emits red light, a G LED chip that emits green light, and a B LED chip that emits blue light, and each LED chip includes a wavelength conversion unit that includes a wavelength conversion material that expresses different red, green, and blue lights so that different colors are emitted according to the corresponding colors.
[0022] According to the present invention, an LED package having a sterilizing function that is harmless to the human body can be provided by using an LED having an appropriate center wavelength.
[0023] In addition, an LED package that emits light of various temperatures and colors in the visible light range can be provided, thereby providing an LED package with a sterilizing function that can be used in various environments.
[0024] Additionally, an LED package can be provided to utilize the central wavelength, which is difficult to use for lighting due to insufficient light quantity.
[0025] FIG. 1 is a drawing showing an LED package according to one embodiment of the present invention.
[0026] all.
[0027] FIG. 2 is a drawing showing a cross-section of an LED package according to one embodiment of the present invention.
[0028] FIG. 3 is a drawing showing a package body of an LED package according to one embodiment of the present invention.
[0029] FIG. 4 is a diagram showing the weight ratio of components of fluorescent materials in two cases: a case where a light-emitting diode having a center wavelength of 405 nm and 450 nm utilizing a 2835 chip according to one embodiment of the present invention has a color temperature of 4500 K; and a case where a light-emitting diode having a center wavelength of 405 nm and 460 nm utilizing a 2835 chip has a color temperature of 4500 K.
[0030] FIG. 5 is a drawing showing the weight ratio of fluorescent material components in the case of an R LED chip and a G LED chip including two light-emitting diodes having a center wavelength of 405 nm according to one embodiment of the present invention.
[0031] FIG. 6 is a diagram showing the weight ratio of components of a fluorescent material that exhibits excellent performance in light quantity and CRI characteristics when including a light-emitting diode having a center wavelength of 405 nm and 460 nm according to one embodiment of the present invention, for color temperatures of 3000 K, 4500 K, and 6000 K.
[0032] FIG. 7 is a diagram showing the weight ratio of fluorescent material components for color temperatures of 3000 K, 4500 K, and 6000 K, when including a light-emitting diode having a center wavelength of 405 nm and 460 nm according to one embodiment of the present invention.
[0033] FIG. 8 is a diagram showing the weight ratio of fluorescent material components for color temperatures of 3000 K, 4500 K, and 6000 K when two light-emitting diodes having a center wavelength of 405 nm are included according to one embodiment of the present invention.
[0034] The invention provides an LED package characterized by including a package body having electrodes and a lead frame electrically connected to each other, a first light-emitting diode disposed on the package body and emitting first light having a predetermined first wavelength as a center wavelength; and an LED chip including a second light-emitting diode disposed on the package body and emitting second light having a predetermined second wavelength as a center wavelength.
[0035] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments disclosed below. Furthermore, in order to clearly disclose the present invention in the drawings, parts unrelated to the present invention have been omitted, and identical or similar symbols in the drawings represent identical or similar components.
[0036] The purpose and effects of the present invention can be naturally understood or made clearer by the following description, and the purpose and effects of the present invention are not limited to the following description alone.
[0037] The purpose, features, and advantages of the present invention will become more apparent through the following detailed description. Furthermore, in describing the present invention, detailed descriptions of known technologies related to the present invention will be omitted if they are deemed to unnecessarily obscure the gist of the invention. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.
[0038]
[0039] In general, light-emitting diodes used for indoor lighting use one light-emitting diode element and have a light output of 60 to 100 lm (lumens).
[0040] However, the 405 nm element to be used in the present invention has a sterilizing effect, but its light output is insufficient (approximately 30 lm or less), making it difficult to use for indoor lighting. Therefore, the insufficient light output has been improved to make it suitable for use as indoor lighting, and this will be described in detail with reference to the drawings below.
[0041] FIG. 1 is a drawing showing an LED package (10) according to one embodiment of the present invention. FIG. 2 is a drawing showing an LED package (10) according to one embodiment of the present invention. Referring to FIGS. 1 and 2, an LED package (10) according to one embodiment of the present invention is configured to include an LED chip including a package body (100), a first light-emitting diode (200), and a second light-emitting diode (300).
[0042] Fig. 2 is a drawing showing a cross-section of an LED package (10). Referring to Fig. 2, the package body (100) is configured to include an electrode (110) and a lead frame (120) that are electrically connected to each other, and a first light-emitting diode (200) and a second light-emitting diode (300) can be placed on the package body (100). In addition, voltage can be applied by being electrically connected through the electrode (110) and the lead frame included in the package body (100), thereby causing the first light-emitting diode (200) and the second light-emitting diode (300) to emit light.
[0043] When the package body (100) is provided in this manner, light-emitting diodes are arranged and electrically connected to emit light, and the first light-emitting diode (200) and the second light-emitting diode (300) are arranged in a dual configuration, thereby solving the problem of insufficient light quantity of diodes using a specific wavelength, thereby providing light quantity suitable for indoor lighting.
[0044] The first light-emitting diode (200) is arranged on the package body (100) and is configured to emit a first light having a center wavelength of a predetermined first wavelength. The first light-emitting diode (200) has a center wavelength of a predetermined first wavelength, and the predetermined first wavelength includes a wavelength that enables sterilization, and specific details will be described later.
[0045] In this way, if the first light-emitting diode (200) is included, light having a predetermined first wavelength as a central wavelength can be emitted, and sterilization can be performed using this.
[0046] The second light-emitting diode is arranged on the package body (100) and is configured to emit second light having a center wavelength of a predetermined second wavelength. The second light-emitting diode (300) has a center wavelength of a predetermined second wavelength, and the predetermined second wavelength includes a wavelength that enables sterilization, and specific details will be described later.
[0047] In this way, if the second light-emitting diode (300) is included, it can sterilize by emitting a second light having a predetermined second wavelength of the center wavelength, and if included together with the first light-emitting diode (200), it can play a role in increasing the amount of light.
[0048] The LED chip is configured to include a package body (100), a first light-emitting diode (200), and a second light-emitting diode (300), and may be provided in multiple units, such as an R LED chip (700), a G LED chip (800), and a B LED chip (900), which will be described later. At this time, each chip individually includes the first and second light-emitting diodes (300), and may be provided to include different wavelength conversion units (400) so as to emit different colors. In addition, the multiple LED chips share the package body (100) and are formed by dividing the sections, so that multiple LED chips are included in one LED package (10) to form an LED package (10) such as a 3 in 1, 4 in 1, etc., and the details will be described later.
[0049] FIG. 2 is a drawing showing a cross-section of an LED package (10) according to one embodiment of the present invention, and referring to FIG. 2, a wavelength conversion unit (400) is applied to a first light-emitting diode (200) and a second light-emitting diode (300) to convert the first light and the second light and provide white light. At this time, the wavelength conversion unit (400) is characterized in that it includes at least one wavelength conversion material to emit white light.
[0050] The wavelength conversion unit (400) includes at least one wavelength conversion material, and the wavelength conversion material may be made of a fluorescent material, and the fluorescent material is configured to emit various visible light by being excited by light having a predetermined wavelength.
[0051] Meanwhile, the wavelength conversion unit (400) may be provided with a fluorescent material layer composed of an epoxy resin (420) and a fluorescent material, and is configured to convert light emitted from a light-emitting diode into light in the visible light band, such as white, green, orange, and yellow. The fluorescent material layer is configured to uniformly disperse and apply the fluorescent material. The fluorescent material layer is manufactured by uniformly dispersing the fluorescent material in the epoxy resin (420), applying it on the light-emitting diode or placing it in the form of a thin film, and then curing it at 100 to 160°C for 1 hour. In addition, a method of using a small amount of fluorescent material is also possible by applying a paste composition in which a fluorescent material and a glass frit are mixed using a screen printing method.
[0052] When the wavelength conversion unit (400) is provided in this way, colored light having a sterilizing effect can be emitted, and since the first light-emitting diode (200) having a center wavelength of 405 nm is used, the wavelength of 405 nm is longer than that of ultraviolet rays, so the sterilizing distance is long and it is harmless to the skin, making it suitable for space sterilization.
[0053] Meanwhile, the first light-emitting diode (200) is characterized in that it emits first light having a center wavelength of a predetermined first wavelength, and the second light-emitting diode (300) emits second light having a center wavelength of a predetermined second wavelength. At this time, the predetermined first wavelength and the predetermined second wavelength may be provided to be the same or different, and when provided to be the same, the predetermined first wavelength and the predetermined second wavelength may be formed to be the same 405 nm. In addition, when the predetermined first wavelength and the predetermined second wavelength are formed to be different, the predetermined first wavelength may be 405 nm, and the predetermined second wavelength may be formed to be 460 nm. However, the predetermined second wavelength may also be 450 nm, and the predetermined first wavelength and the predetermined second wavelength may be provided to have different center wavelengths.
[0054] In this case, when the predetermined first wavelength and the predetermined second wavelength are formed identically, the 405 nm wavelength is emitted by two light-emitting diodes, thereby increasing the sterilizing power and increasing the light quantity, making it more suitable for indoor lighting. In addition, when the predetermined first wavelength and the predetermined second wavelength are formed differently, the 405 nm wavelength and the 460 nm wavelength work together, so that the 405 nm wavelength exhibits a sterilizing effect against gram-positive bacteria and the 460 nm wavelength exhibits a sterilizing effect against gram-negative bacteria. Therefore, the sterilizing power for a wider variety of bacteria is secured, and the light quantity is increased, making it more suitable for indoor lighting.
[0055] In addition, referring to FIG. 3, the package body (100) includes a body portion (130) in which the first light-emitting diode (200) and the second light-emitting diode (300) are arranged, and a partition wall (140) surrounding the periphery of the body portion (130). The partition wall (140) may be formed lower than 08 mm to improve the amount of light, and it is appropriate to form it at 04 mm. In addition, in order to lower the height of the partition wall (140), the wavelength conversion unit (400) must be formed thin, and due to concerns about interference between fluorescent materials when the wavelength conversion unit (400) is formed thin, the wavelength conversion unit (400) may be formed using a method such as the above-described screen printing method.
[0056] In addition, the angle formed with the body (130) may be provided at a predetermined angle to improve the amount of light. The predetermined angle may be provided at an appropriate angle that does not interfere with the light emitted from the light-emitting diode and thus reduce the amount of light, and the predetermined angle expressed in FIG. 3 may be formed at 90 degrees.
[0057] In this way, when the bulkhead (140) is provided at a predetermined height and the bulkhead (140) is provided at a predetermined angle with the body (130), the amount of light can be improved, and thus, it can be suitable for indoor lighting.
[0058] Referring to FIG. 1, an infrared LED chip (600) emitting light having a center wavelength of 845 nm to 855 nm may be further included on the package body (100).
[0059] The infrared LED chip (600) is configured to emit infrared rays with a central wavelength of 845 to 855 nm to assist in sterilization and to provide sterilization, drying, and heat retention effects. Emitting infrared rays with a central wavelength of 850 nm is preferable for achieving the aforementioned effects, and therefore, one embodiment of the present invention will be described based on a central wavelength of 850 nm.
[0060] Since the light emitted by the infrared LED chip (600) is infrared with a center wavelength of 850 nm, it cannot be seen by the human eye and therefore does not affect the color of the light emitted from the LED package (10). Therefore, the infrared LED chip (600) may not include the wavelength conversion unit (400) and the fluorescent material and fluorescent material layer that are components of the wavelength conversion unit (400), or may be provided to emit colored light by including the fluorescent material and fluorescent material layer. However, since manufacturing it by including the fluorescent material layer and fluorescent material incurs a lot of cost, and since the colored light emitted by other LED chips can be utilized, it is preferable for the infrared LED chip (600) to emit infrared light without including the fluorescent material and fluorescent material layer, which saves cost.
[0061] Meanwhile, as described above, when two light-emitting diodes are placed together to secure light quantity or an infrared LED chip (600) is additionally included, the heat emitted also increases, which may cause heat dissipation problems. Therefore, referring to FIG. 2, a heat sink (500) may be additionally provided at the bottom of the package body (100).
[0062] The heat sink (500) is made of a ceramic material and is provided at the bottom of the package body (100). It is a configuration for dissipating the increased heat generated by the additionally placed light emitting diodes to secure the amount of light, and may be provided with a material having high thermal conductivity, such as aluminum or ceramic, so as to be able to dissipate the heat. In addition, when an infrared LED chip (600) to be described later is added, or when the LED package (10) is provided as a 3 in 1 or 4 in 1 package including an R LED chip (700), a G LED chip (800), and a B LED chip (900), the heat sink (500) is required because the heat generated increases. In addition, heat dissipation from the PCB substrate can also be considered, and it is also possible to configure the substrate with a material such as aluminum or ceramic.
[0063] By including a heat sink (500) in this way, heat can be dissipated by dissipating additional heat generated by arranging two light-emitting diodes or arranging multiple chips, thereby ensuring the durability of the device.
[0064] Meanwhile, instead of providing a heat sink (500) at the bottom of the package body (100), heat dissipation can be achieved by forming the outer surface of the package body (100) with a material capable of dissipating heat.
[0065] Referring to FIG. 1, the LED package (10) according to the present invention is provided in a 4 in 1 manner, and can be formed in a manner in which a plurality of light-emitting diode chips are mounted on one package, and thus can include R, G, B LED chips (900), and additionally can also include an infrared LED chip (600) that emits infrared rays. However, in the present invention, the R, G, B LED chip (900) is configured to include two light-emitting diodes, so as to disclose an LED package (10) including R, G, B chips in which two light-emitting diodes are included in a dual manner, which will be described in detail below.
[0066] Referring to FIG. 1, an LED package (10) according to the present invention may be provided with a plurality of LED chips, including an R LED chip (700), a G LED chip (800), and a B LED chip (900).
[0067] That is, an LED package (10) can be provided in which a plurality of LED chips are provided, including an R LED chip (700) that emits red light, a G LED chip (800) that emits green light, and a B LED chip (900) that emits blue light, and each of the LED chips includes a wavelength conversion unit (400) that includes a wavelength conversion material (410) that expresses different red, green, and blue lights so that different colors are emitted according to the corresponding colors.
[0068] The R LED chip (700) includes a first wavelength conversion unit (400), and the first wavelength conversion unit (400) is applied to the first light-emitting diode (200) and the second light-emitting diode (300) included in the R LED chip (700) to include at least one wavelength conversion material (410) to convert the first light and the second light and emit red light.
[0069] The G LED chip (800) includes a second wavelength conversion unit (400), and the second wavelength conversion unit (400) is characterized in that it is applied to the first light-emitting diode (200) and the second light-emitting diode (300) and includes at least one wavelength conversion material (410) to convert the first light and the second light and emit green light.
[0070] The B LED chip (900) includes a third wavelength conversion unit (400), and the third wavelength conversion unit (400) is applied to the first light-emitting diode (200) and the second light-emitting diode (300) to include at least one wavelength conversion material (410) to convert the first light and the second light and emit blue light. An LED package (10) is provided.
[0071] That is, an LED package (10) according to one embodiment of the present invention includes an R LED chip (700), a G LED chip (800), and a B LED chip (900), and the R LED chip (700), the G LED chip (800), and the B LED chip (900) may each include a first light-emitting diode (200), a second light-emitting diode (300), and a wavelength converter (400), and the R LED chip (700) may emit red light through the first wavelength converter (400), the G LED chip (800) may emit green light through the second wavelength converter (400), and the B LED chip (900) may emit blue light through the third wavelength converter (400), and these may be combined to emit various lights in the visible light band suitable for white light or lighting.
[0072] Meanwhile, the B LED chip (900) was previously described as including a wavelength conversion unit (400), but since the first light-emitting diode (200) and the second light-emitting diode (300) are equipped with a wavelength that emits blue light, it may be formed without including a wavelength conversion unit (400).
[0073] In addition, by further including a color control unit, it is possible to change the color by controlling the intensity of the voltage transmitted to each of the R, G, and B LED chips (900), and to display various color temperatures.
[0074] In this way, by providing R, G, B LED chips (900), color control is possible and a sterilization function can be achieved by using R, G, B LED chips (900) with a wavelength of 405 nm instead of RGB LEDs composed of R 620 nm, G 520 nm, and B 460 nm, which are commonly used wavelengths, so that sterilization is possible.
[0075] In this way, when the LED chip is provided in multiple numbers, such as an R LED chip (700), a G LED chip (800), and a B LED chip (900), each of which individually includes first and second light-emitting diodes (300) and includes different wavelength conversion units (400) to emit light of different colors, the multiple LED chips share a package body (100) and are formed by dividing the sections, so that multiple LED chips are included in one LED package (10) to form an LED package (10) in the form of a 3 in 1, 4 in 1, etc., thereby forming the LED package (10) of the present invention.
[0076] Meanwhile, the predetermined first wavelength and the predetermined second wavelength of the first light-emitting diode (200) and the second light-emitting diode (300) included in each of the R LED chip (700), G LED, and B LED chip (900) may be provided to be the same or different from each other, and may be provided to have the same wavelength of 405 nm as described above or to have a wavelength of 405 nm and a wavelength of 460 nm.
[0077] In addition, the R LED chip (700), the G LED chip (800), and the B LED chip (900) may be provided so that the predetermined first wavelength and the predetermined second wavelength of the first light-emitting diode (200) and the second light-emitting diode (300) are respectively different. For example, the R LED chip (700) may be provided so that the predetermined first wavelength and the predetermined second wavelength are the same as 405 nm, and the G LED chip (800) and the B LED chip (900) may be provided so that the predetermined first wavelength and the predetermined second wavelength are different as 405 nm and 460 nm, respectively. That is, the R LED chip (700), the G LED chip (800), and the B LED chip (900) may be formed by combining various cases by being configured so that the predetermined first wavelength and the predetermined second wavelength are respectively the same or not. Accordingly, various light quantities and color temperatures can be secured, and color temperatures such as 3000K, 4500K, and 6000K can be achieved.
[0078] When two 405nm wavelength LEDs are included, the light output increases, but relatively less, making it ideal for under-cabinet lighting or surface sterilization within 50cm of areas such as kitchens and bathrooms. However, this is not a limitation; it is obvious that it can be used for indoor lighting through combinations with other LED chips. Furthermore, when a 405nm wavelength LED and a 460nm wavelength LED are included, it is suitable for sterilization and indoor lighting, and can produce a variety of colors.
[0079] Meanwhile, in the case of a combination of 405 nm and 460 nm light-emitting diodes, the resistance values between the elements are different, so a power supply value of 6 V is used for this, and in the case of a combination of two 405 nm light-emitting diodes, the resistance values between the elements are the same, so a power supply of 3 V can be used, and even if elements of different wavelengths are used, the same power value can be used, thereby increasing convenience of use and management.
[0080] Referring to FIG. 4, in the case of including light-emitting diodes having center wavelengths of 405 nm and 450 nm utilizing a 2835 chip, the weight ratio of components of the fluorescent material is preferably C: O: Si: Ca: Sr: Eu = 3129: 2185: 3159: 064: 1332: 130 for a color temperature of 4500 K. In addition, in the case of including light-emitting diodes having center wavelengths of 405 nm and 460 nm utilizing a 2835 chip, the weight ratio of components of the fluorescent material is preferably O: Al: Si: Ca: Sr: Eu = 2680: 000: 5774: 083: 1293: 169 for a color temperature of 4500 K.
[0081] Referring to Fig. 5, in the case of an R LED chip (700) including two light-emitting diodes having a center wavelength of 405 nm, the weight ratio of the components of the fluorescent material is preferably C: O: Si: Rb = 6029:1385:2408:178. In addition, in the case of a G LED chip (800), the weight ratio of the components of the fluorescent material is preferably C: O: Al: Si: Ca = 6129:1394:032:2420:025.
[0082] Referring to Fig. 6, when including light-emitting diodes having center wavelengths of 405 nm and 460 nm, the component weight ratio of the fluorescent material showing excellent performance in light quantity and CRI characteristics is preferably O: Si = 2597: 7403 for a color temperature of 3000 K. For a color temperature of 4500 K, the component weight ratio of the fluorescent material is preferably C: O: Si: Rb = 6009: 1415: 2397: 180. In addition, for a color temperature of 6000 K, the component weight ratio of the fluorescent material is preferably C: O: Si: Rb = 5837: 1496: 2494: 174. At this time, it can be seen that the CRI is 80 or higher for each color temperature.
[0083] Referring to Fig. 7, when including light emitting diodes having center wavelengths of 405 nm and 460 nm, the weight ratio of components of fluorescent materials is preferably O: Si: Rb = 2627: 6885: 488 for a color temperature of 3000 K. In addition, when the color temperature is 4500 K, the weight ratio of components of fluorescent materials is preferably C: O: Si: Rb = 6099: 1377: 2332: 192. In addition, when the color temperature is 6000 K, the weight ratio of components of fluorescent materials is preferably C: O: Si: Rb = 5969: 1415: 2441: 175. At this time, it can be seen that the CRI is 90 or higher for each color temperature.
[0084] Referring to Fig. 8, when two light-emitting diodes having a center wavelength of 405 nm are included, the weight ratio of the components of the fluorescent material is preferably C: O: Si: Cl: Ca: Sr: Zr: Eu = 5626: 1417: 2213: 036: 019: 319: 311: 060 for a color temperature of 3000 K. In addition, the weight ratio of the components of the fluorescent material is preferably C: O: Si: Cl: Ca: = 5555: 1371: 2183: 038: 016 for a color temperature of 4500 K. In addition, the weight ratio of the components of the fluorescent material is preferably C: O: Si: Cl: Ca: = 5937: 1313: 2214: 024: 250: 262 for a color temperature of 6000 K. At this time, it can be seen that the CRI for each color temperature is 90 or higher.
[0085] The table below shows the light output of each LED chip when using light-emitting diodes with center wavelengths of 405 nm and 460 nm as described above. Referring to the table below, you can see that the light output of each LED chip is improved from 30 lm, which is the light output when using 405 nm alone, to 45-55 lm.
[0086]
[0087]
[0088] In addition, the table below shows the light quantity of the entire LED chip manufactured by additionally changing the height of the bulkhead (140) from 0.8 mm to 0.4 mm. Referring to the table below, the light quantity of the entire LED chip is improved to 90 to 100 lm, and a light quantity sufficient to be used for indoor lighting can be secured.
[0089]
[0090]
[0091] Meanwhile, as the amount of light increases, the present invention can be utilized as lighting for plant growth, and at this time, the center wavelength can be set to 300 to 900 nm. In addition, existing LED lighting for plant growth emits visible light colors, which tires the eyes of workers, and there is a problem that the leaves of plants are burned when the LED is installed close to the plants due to insufficient light. By utilizing the present invention that increases the amount of light described above and emitting light of 2500 to 7000K, the eye fatigue of workers can be reduced, efficiency can be improved, and as the amount of light increases, the distance between the LED and the plants can be secured, so that damage to the leaves of the plants can be prevented, and at the same time, light can be irradiated to multiple plants in a wider area with a single lighting fixture.
[0092] The above preferred embodiments of the present invention are disclosed for the purpose of illustration, and those skilled in the art with ordinary knowledge of the present invention will be able to make various modifications, changes, and additions within the spirit and scope of the present invention, and such modifications, changes, and additions should be considered to fall within the scope of the above claims.
[0093] Anyone having ordinary skill in the art to which the present invention pertains can make various substitutions, modifications, and changes within the scope that does not depart from the technical spirit of the present invention, and therefore the present invention is not limited to the above-described embodiments and the attached drawings.
[0094] In the exemplary system described above, the methods are described based on a flowchart as a series of steps or blocks. However, the present invention is not limited to the order of the steps, and some steps may occur in a different order or simultaneously with other steps described above. Furthermore, those skilled in the art will understand that the steps depicted in the flowchart are not exclusive, and other steps may be included, or one or more steps in the flowchart may be deleted without affecting the scope of the present invention.
[0095]
[0096] (Explanation of symbols)
[0097] 10: LED package
[0098] 100: Package body 110: Electrode
[0099] 120: Lead frame 130: Body
[0100] 140: Bulkhead
[0101] 200: First light-emitting diode
[0102] 300: Second light-emitting diode
[0103] 400: Wavelength conversion unit 410: Wavelength conversion material
[0104] 420: Epoxy resin
[0105] 500: Heat sink
[0106] 600: Infrared LED chip
[0107] 700: R LED chip 800: G LED chip
[0108] 900: B LED chip
Claims
1. A package body (100) having an electrode (110) and a lead frame (120) that are electrically connected to each other; A first light-emitting diode (200) is placed on the above package body (100) and emits a first light having a center wavelength of a predetermined first wavelength; and It is characterized by including an LED chip including a second light-emitting diode (300) that is placed on the above package body (100) and emits a second light having a second wavelength as the center wavelength; It is applied to the first light-emitting diode (200) and the second light-emitting diode (300) and includes a wavelength conversion unit (400) that converts the first light and the second light and provides white light. The above wavelength conversion unit (400) is characterized by emitting white light by including at least one wavelength conversion material (410). The above wavelength conversion unit (400) is It is characterized by being formed using a screen printing method. The above package body (100) is, It includes a body part (130) in which the first light-emitting diode (200) and the second light-emitting diode (300) are arranged and a partition wall (140) surrounding the periphery of the body part (130). The height of the above bulkhead (140) is characterized by being 0.4 mm. It is characterized by further including an infrared LED chip (600) emitting light having a center wavelength of 845 nm to 855 nm on the above package body (100), The above package body (100) is, It is characterized by further providing a ceramic heat sink (500) at the bottom of the above package body (100). The above LED chips are provided in multiple units, including an R LED chip (700) that emits red light, a G LED chip (800) (2) that emits green light, and a B LED chip (900) that emits blue light. An LED package characterized in that each of the above LED chips (700, 800, 900) includes a wavelength conversion unit (400) that includes a wavelength conversion material (410) that expresses different red, green, and blue lights so that each of the above LED chips (700, 800, 900) emits different colors.
2. In paragraph 1, It is characterized in that the above predetermined first wavelength and the predetermined second wavelength are the same 405 nm, For a color temperature of 3000K, C: O: Si: Cl: Ca: Sr: Zr: Eu = 56.26: 14.17: 22.13: 0.36: 0.19: 3.19: 3.11: 0.60 For color temperature 4500K, C: O: Si: Cl: Ca: = 55.55: 13.71: 21.83: 0.38: 0.16 An LED package including the wavelength conversion material (410) having a component weight ratio of C: O: Si: Cl: Ca: Sr: Zr: = 59.37: 13.13: 22.14: 0.24: 2.50: 2.62 for a color temperature of 6000K.
3. In paragraph 1, The above-mentioned first wavelength is 405 nm, The above-mentioned second wavelength is characterized by being 460 nm, For color temperature 3000K, O: Si: Rb = 26.27: 68.85: 4.88 For a color temperature of 4500K, C: O: Si: Rb = 60.99: 13.77: 23.32: 1.92 An LED package including the wavelength conversion material (410) having a weight ratio of C: O: Si: Rb = 59.69: 14.15: 24.41: 1.75 for a color temperature of 6000K.
4. In paragraph 1, It is characterized in that the above predetermined first wavelength and the predetermined second wavelength are the same 405 nm, For the R LED chip (700), the weight ratio of the fluorescent material components is C: O: Al: Si: Ca = 61.29: 13.94: 0.32: 24.20: 0.
25. An LED package including the wavelength conversion material (410) having a component weight ratio of the fluorescent material of C: O: Si: Rb = 60.29: 13.85: 24.08: 1.78 in the case of the G LED chip (800).
Citation Information
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