Organic light-emitting display device

Abstract

This organic light-emitting display device may comprise a plurality of stereoscopic structures on a substrate and a plurality of pixels on the substrate. Each of the plurality of pixels may include a first sub-pixel, a second sub-pixel, and a third sub-pixel, each having a three-dimensional structure. The first sub-pixel may be disposed on a first side surface of the stereoscopic structure, and the second sub-pixel may be disposed on a second side surface of the stereoscopic structure. The second sub-pixel may be disposed to horizontally overlap the first sub-pixel, and the third sub-pixel may be disposed on the first sub-pixel and the second sub-pixel. The first sub-pixel may include a first organic light-emitting element, the second sub-pixel may include a second organic light-emitting element, and the third sub-pixel may include a third organic light-emitting element.

Description

organic light emitting display device

[0001] The embodiment relates to an organic light emitting display device.

[0002] Recently, as society enters the full-fledged information age, interest in information displays capable of processing and displaying massive amounts of information has been growing. Furthermore, the growing demand for portable information media has driven rapid development in the display industry. In response, a variety of lightweight and thin flat panel display devices are gaining traction.

[0003] Among these flat panel displays, organic light-emitting diodes (OLEDs) are gaining traction. OLEDs are being actively developed for use in head-mounted displays (HMDs), which are mounted close to the human eye. HMDs can be worn as helmets or glasses, enabling virtual reality (VR) or augmented reality (AR).

[0004] HMDs are equipped with high-resolution, small OLEDs. These small, high-resolution OLEDs are formed using wafer-based semiconductor processes, with organic light-emitting elements positioned on a driving circuit. Meanwhile, glasses-type HMDs require brighter, clearer images on very small screens. To achieve this, the amount of light from the organic light-emitting elements and their extraction efficiency must be maximized. Furthermore, inter-pixel light leakage must be suppressed to enhance image quality. Technology that enhances light extraction efficiency, applicable to ultra-high resolutions, is expected to find widespread application in large-screen display industries such as mobile and IT devices.

[0005] Meanwhile, a fine metal mask (FMM) is conventionally used as a deposition pattern mask to deposit an organic light-emitting layer constituting an organic light-emitting element for each subpixel.

[0006] However, when manufacturing high-definition (e.g., 500 PPI or higher) displays or large-area (e.g., 8th generation or higher) displays, it is quite difficult to form an organic light-emitting layer for each subpixel using FMM. Furthermore, when using FMM, there is a limit to further increasing the high-definition. Furthermore, when using FMM, there are problems such as reduced yield and increased manufacturing costs. In addition, when using FMM, there is a problem of reduced product life due to difficulty in optimizing deposition.

[0007] Meanwhile, as display resolutions have increased in recent years, pixel resolution (ppi) has also increased, resulting in increasingly narrow gaps between pixels (or subpixels). Furthermore, as the efficiency of light-emitting materials for organic light-emitting devices has increased, they can now produce high brightness with low current and voltage, resulting in lower power consumption.

[0008] However, displays with higher resolutions still suffer from a low lifetime luminous efficacy. Here, lifetime luminous efficacy can be defined as the ratio of lifetime or brightness to the luminous area ratio. For example, an increase in the luminous area ratio can result in increased brightness for the same lifetime, increased lifetime for the same brightness, or both increased lifetime and brightness.

[0009] The present invention aims to solve the above-mentioned and other problems.

[0010] Another object of the embodiment is to provide a high-definition and high-resolution organic light-emitting display device.

[0011] Another object of the present invention is to provide an organic light emitting display device that does not use FMM.

[0012] Another object of the present invention is to provide an organic light-emitting display device capable of improving image quality.

[0013] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0014] According to one aspect of the embodiment to achieve the above or other objects, an organic light-emitting display device includes a plurality of three-dimensional structures on a substrate; and a plurality of pixels on the substrate, wherein the plurality of pixels each include a first subpixel, a second subpixel, and a third subpixel having a three-dimensional structure, wherein the first subpixel is disposed on a first side of the three-dimensional structure, the second subpixel is disposed on a second side of the three-dimensional structure, the second subpixel is disposed to horizontally overlap the first subpixel, and the third subpixel is disposed on the first subpixel and the second subpixel, wherein the first subpixel includes a first organic light-emitting element, the second subpixel includes a second organic light-emitting element, and the third subpixel includes a third organic light-emitting element.

[0015] The third subpixel may be arranged on the upper surface of the three-dimensional structure.

[0016] The second organic light-emitting element may be arranged to horizontally overlap the first organic light-emitting element, and the third organic light-emitting element may be arranged on the upper surface of the three-dimensional structure.

[0017] The first organic light-emitting element, the second organic light-emitting element and the third organic light-emitting element each include an anode electrode, a low-resistance layer, an organic light-emitting layer and a cathode electrode,

[0018] The anode electrode can be independently arranged in the first subpixel, the second subpixel, and the third subpixel.

[0019] The low-resistance layer of the first organic light-emitting element and the low-resistance layer of the second organic light-emitting element may be arranged to be spaced apart from each other between the plurality of three-dimensional structures, and the first organic light-emitting layer of the first organic light-emitting element and the second organic light-emitting layer of the second organic light-emitting element may be arranged to vertically overlap between the plurality of three-dimensional structures.

[0020] The low-resistance layer, organic light-emitting layer and cathode electrode of the first organic light-emitting element and the low-resistance layer, organic light-emitting layer and cathode electrode of the second organic light-emitting element may be spaced apart from each other on the upper surface of the three-dimensional structure.

[0021] The first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element may include a reflective metal, and the first cathode electrode of the first organic light-emitting element and the second cathode electrode of the second organic light-emitting element may include a transparent or translucent conductive film.

[0022] The third subpixel may be disposed on the first subpixel and the second subpixel between the plurality of three-dimensional structures.

[0023] The size of the above pixel may be the same as the size of the third subpixel.

[0024] The size of the above pixel may be equal to the sum of the size of the first subpixel and the size of the second subpixel.

[0025] The second organic light-emitting element may be arranged to overlap horizontally with the first organic light-emitting element, and the third organic light-emitting element may be arranged to overlap vertically with the first organic light-emitting element and the second organic light-emitting element.

[0026] The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element each include an anode electrode, an organic light-emitting layer, and a cathode electrode, and the anode electrode may be independently disposed in the first subpixel, the second subpixel, and the third subpixel, and the cathode electrode may be commonly disposed in the first subpixel and the second subpixel.

[0027] The first subpixel, the second subpixel, and the third subpixel each include a light-emitting region and a non-light-emitting region, and the light-emitting region may have a size corresponding to the anode electrode.

[0028] The size of the third anode electrode of the third organic light-emitting element may be larger than the size of the first anode electrode of the first organic light-emitting element or the size of the second anode electrode of the second organic light-emitting element.

[0029] The third anode electrode of the third organic light-emitting element may vertically overlap the first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element.

[0030] The end of the organic light-emitting layer of the first organic light-emitting element and the end of the organic light-emitting layer of the second organic light-emitting element may be positioned lower than the upper surface of the three-dimensional structure.

[0031] The organic light emitting display device may include a plurality of first banks between the plurality of three-dimensional structures; and a plurality of second banks between the plurality of third subpixels.

[0032] The distance between the plurality of second banks may be equal to the width of the pixel or the width of the third subpixel.

[0033] The organic light-emitting display device includes a plurality of insulating layers between the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element, and the plurality of insulating layers may include at least one organic insulating layer and at least one inorganic insulating layer.

[0034] The first side and the second side of the three-dimensional structure may be inclined or perpendicular to the ground, respectively.

[0035] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0036] According to at least one of the embodiments, the first subpixel, the second subpixel, and the third subpixel are arranged three-dimensionally to form a pixel, thereby having the advantage that the size of the pixel can be further reduced, thereby enabling a high-definition, ultra-high-resolution display to be implemented.

[0037] According to at least one of the embodiments, the first subpixel, the second subpixel, and the third subpixel constituting the pixel are arranged three-dimensionally so that the size of the blue subpixel increases to the size of the pixel, thereby greatly increasing the light-emitting area and improving the lifetime light-emitting rate.

[0038] According to at least one of the embodiments, since the organic light-emitting material forming the third organic light-emitting layer is deposited over the entire area of ​​the substrate, there is an advantage in that the degree of process freedom is increased and the yield can be improved because a separate mask is not required.

[0039] According to at least one of the embodiments, there is an advantage in that high definition and high resolution can be implemented without reducing the light-emitting area of ​​each of the first subpixel and the second subpixel by disposing the first subpixel and the second subpixel on the first side and the second side of the three-dimensional structure. In addition, since the first subpixel and the second subpixel are disposed on the first side and the second side of the three-dimensional structure by using the three-dimensional structure, a high definition (e.g., 500 PPI or higher) display or a large-area (e.g., 8th generation or higher) display can be implemented because an FMM is not required. Since a separate deposition pattern mask such as an FMM is not used, the manufacturing cost can be significantly reduced.

[0040] According to at least one of the embodiments, there is an advantage in that the low resistance layer of the first organic light-emitting element and the low resistance layer of the second organic light-emitting element are disconnected on the first bank between the three-dimensional structures or on the upper surface of the three-dimensional structure, thereby preventing transverse current leakage between the first subpixel and the second subpixel. The low resistance layer may include, for example, a hole injection layer, a charge generation layer, or the like.

[0041] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0042] FIG. 1 is a plan view illustrating an organic light-emitting display device according to a first embodiment.

[0043] FIG. 2 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0044] Figure 3 illustrates a laminated structure for each organic light-emitting element.

[0045] Figure 4 schematically illustrates the design structure of the three-dimensional structure and the design structure of the second evaporation source device.

[0046] FIGS. 5A and 5B illustrate a first organic light-emitting element and a second organic light-emitting element arranged on a first bank between three-dimensional structures according to a comparative example and an embodiment.

[0047] FIG. 6a and FIG. 6b illustrate a first organic light-emitting element and a second organic light-emitting element according to a comparative example and an exemplary example, respectively, arranged on the upper surface of a three-dimensional structure.

[0048] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0049] Fig. 8 is a plan view illustrating an organic light-emitting display device according to a second embodiment.

[0050] Fig. 9 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0051] Figures 10a to 10c illustrate a manufacturing process according to a first embodiment for preventing transverse current leakage.

[0052] FIGS. 11A to 11C illustrate a manufacturing process according to a second embodiment for preventing transverse current leakage. FIGS. 10A to 10C illustrate a manufacturing process according to a second embodiment for preventing transverse current leakage.

[0053] Figure 12 illustrates an additional bank arranged on the upper surface of a three-dimensional structure.

[0054] Figures 13a to 13d illustrate the manufacturing process of an additional bank arranged on the upper surface of a three-dimensional structure.

[0055] Fig. 14 is a cross-sectional view illustrating an organic light-emitting display device according to the fourth embodiment.

[0056] Figure 15 shows the path of light in the L region of Figure 14.

[0057] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0058] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0059]

[0060] Although the following description is limited to a top-emitting display, the embodiments can also be applied to a bottom-emitting display. A top-emitting organic light-emitting display device can display an image by emitting light upward, i.e., forward. A bottom-emitting organic light-emitting display device can display an image by emitting light downward, i.e., backward.

[0061] FIG. 1 is a plan view illustrating an organic light-emitting display device according to a first embodiment.

[0062] As illustrated in FIG. 1, an organic light-emitting display device according to an embodiment may include a plurality of pixels (P) arranged on a substrate (100).

[0063] The substrate (100) may include a display area and a non-display area surrounding the display area. A plurality of pixels (P) may be arranged on the display area. A driving device such as a gate driver, a data driver, etc. may be arranged in the non-display area, but is not limited thereto. The plurality of pixels (P) may be arranged along a first direction (X). The plurality of pixels (P) may be arranged along a second direction (Y). The plurality of pixels (P) may be arranged in a matrix. The first direction (X) may be a horizontal direction or a lateral direction, and the second direction (Y) may be a vertical direction or a longitudinal direction.

[0064] Each pixel (P) may include multiple subpixels (SPr, SPg, SPb). Each pixel (P) may include subpixels (SPr, SPg, SPb) of at least three different colors. Although not shown, the pixel (P) may further include a transparent area without color to implement a transparent display.

[0065] Each pixel (P) may include a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb). In this case, the first subpixel (SPr) may be a red subpixel, the second subpixel (SPg) may be a green subpixel, and the third subpixel (SPb) may be a blue subpixel.

[0066] In FIG. 1, pixels (P) are defined as being arranged in the order of a second subpixel (SPg), a third subpixel (SPb), and a first subpixel (SPr) along a first direction (X). However, the pixels may also be arranged in the order of a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb) along the first direction (X), or in the order of a third subpixel (SPb), a first subpixel (SPr), and a second subpixel (SPg).

[0067] At this time, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may not vertically overlap each other.

[0068] As a first example, the plurality of subpixels (SPr, SPg, SPb) may be separated into one or more pixel (P) units or row-line units along the second direction (Y). For example, the first subpixel (SPr) may be separated into one or more pixel (P) units or row-line units along the second direction (Y), the second subpixel (SPg) may be separated into one or more pixel (P) units or row-line units along the second direction (Y), and the third subpixel (SPb) may be separated into one or more pixel (P) units or row-line units along the second direction (Y).

[0069] As a second example, the plurality of subpixels (SPr, SPg, SPb) may be arranged in a stripe shape along the second direction (Y). In the stripe shape structure, the plurality of subpixels (SPr, SPg, SPb) may be arranged continuously without being separated along the second direction (Y). For example, the second subpixel (SPg) may be arranged continuously along the second direction (Y), the first subpixel (SPr) may be arranged continuously along the second direction (Y), and the third subpixel (SPb) may be arranged continuously along the second direction (Y).

[0070] Meanwhile, in the first and second examples, the second subpixel (SPg), the first subpixel (SPr), and the third subpixel (SPb) may be alternately arranged in units of columns along the first direction (X). That is, in the embodiment, the second subpixel (SPg), the first subpixel (SPr), and the third subpixel (SPb) having different colors may be arranged in a side-by-side structure along the first direction (X). In the side-by-side structure, it is very important to implement high definition and high resolution without reducing the light-emitting area of ​​each of the plurality of subpixels (SPr, SPg, SPb).

[0071] Meanwhile, as illustrated in FIG. 1, in the embodiment, a plurality of pixels (P) may include a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb), each having a three-dimensional structure. That is, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may be arranged three-dimensionally to form a pixel (P). That is, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may be arranged not only horizontally but also vertically with respect to one another, thereby forming a pixel (P).

[0072] For example, the second subpixel (SPg) may be arranged to overlap horizontally with the first subpixel (SPr), and the third subpixel (SPb) may be arranged to overlap vertically with the first subpixel (SPr) and the second subpixel (SPg).

[0073] As will be explained later, the first subpixel (SPr) and the second subpixel (SPg) can be arranged on the first side (SS1) and the second side (SS2) of the three-dimensional structure (130). Accordingly, high definition and high resolution can be implemented without reducing the light-emitting area of ​​each of the first subpixel (SPr) and the second subpixel (SPg). In addition, since the first subpixel (SPr) and the second subpixel (SPg) are arranged on the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) without using an FMM, a high definition (e.g., 500 PPI or higher) display or a large-area (e.g., 8th generation or higher) display can be implemented. Since a separate deposition pattern mask such as an FMM is not used, the manufacturing cost can be significantly reduced.

[0074] Meanwhile, the first subpixel (SPr) can emit first color light, the second subpixel (SPg) can emit second color light, and the third subpixel (SPb) can emit third color light. Accordingly, a full-color image can be displayed for each unit pixel (P) by the first color light, the second color light, and the third color light. For example, the first color light can be red color light, the second color light can be green color light, and the third color light can be blue light, but this is not limited thereto.

[0075] According to an embodiment, a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb) are arranged three-dimensionally to form a pixel (P), so that the size of the pixel (P) can be further reduced, thereby implementing a high-definition, ultra-high-resolution display.

[0076] Meanwhile, as illustrated in FIG. 1, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may each include an emitting area (EAr, EAg, EAb) and a non-emitting area. The emitting area (EAr, EAg, EAb) is an area from which the corresponding color light is emitted, and as the emitting area (EAr, EAg, EAb) becomes wider, the lifetime luminous efficiency may increase. The non-emitting area may be an area remaining in each of the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) excluding the emitting area (EAr, EAg, EAb).

[0077] The first light-emitting area (EAr) of the first subpixel (SPr), the second light-emitting area (EAg) of the second subpixel (SPg), and the third light-emitting area (EAb) of the third subpixel (SPb) may not vertically overlap each other.

[0078]

[0079] [Example 1]

[0080] Fig. 2 is a cross-sectional view illustrating an organic light-emitting display device according to a first embodiment. Fig. 2 is a cross-sectional view taken along line AA' of the organic light-emitting display device of Fig. 1.

[0081] Referring to FIGS. 1 and 2, an organic light-emitting display device according to the first embodiment may include a substrate (100), a plurality of driving circuits (101r, 101g, 101b), a protective layer (110), a plurality of three-dimensional structures (130), a plurality of banks (120 125), a plurality of organic light-emitting elements (140r, 140g, 140b), a plurality of insulating layers (150 to 153, 160, 161), etc.

[0082] A plurality of pixels (P) may be arranged on a substrate (100). The plurality of pixels (P) may each include a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb) having a three-dimensional structure.

[0083] As described above, in order to implement a high-definition, ultra-high-resolution display, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may be arranged three-dimensionally. The third subpixel (SPb) may be arranged on the first subpixel (SPr) and may vertically overlap with the first subpixel (SPr). The third subpixel (SPb) may be arranged on the second subpixel (SPg) and may vertically overlap with the second subpixel (SPg).

[0084] A plurality of driving circuits (101r, 101g, 101b) may be arranged on a substrate (100), and a protective layer (110) may be arranged on the plurality of driving circuits (101r, 101g, 101b).

[0085] The substrate (100) may be a substrate (100) having characteristics such as rigid, flexible, foldable, and rollable. The substrate (100) may be made of a silicon wafer, glass, plastic, ceramic, or the like. The substrate (100) may be made of a transparent material or an opaque material.

[0086] The plurality of driving circuits may include a first driving circuit (101r), a second driving circuit (101g), and a third driving circuit (101b). The first driving circuit (101r) may be connected to the first subpixel (SPr) and may drive the first subpixel (SPr) to emit a first color light. The second driving circuit (101g) may be connected to the second subpixel (SPg) and may drive the second subpixel (SPg) to emit a second color light. The third driving circuit (101b) may be connected to the third subpixel (SPb) and may drive the third subpixel (SPb) to emit a third color light.

[0087] Each driving circuit may include a plurality of transistors and at least one capacitor. One of the plurality of transistors may be a driving transistor.

[0088] A protective layer (110) may be placed on a plurality of driving circuits (101r, 101g, 101b) to protect the plurality of driving circuits (101r, 101g, 101b). The protective layer (110) may be a planarizing layer to ensure that layers are stably formed thereon.

[0089] The protective layer (110) may be a single layer composed of an inorganic film or an organic film. The protective layer (110) may be a combination of multiple layers of inorganic films or multiple layers of inorganic films and multiple layers of organic films. The protective layer (110) may be formed of a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

[0090] For example, the protective layer (110) may be composed of a multi-structure of an organic film and an inorganic film. In this case, the organic film may include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc. The inorganic film may include a silicon oxide film (SiOx), a silicon nitride film (SiNx), etc.

[0091] Meanwhile, a plurality of three-dimensional structures (130) may be arranged on the substrate (100). The plurality of three-dimensional structures (130) may be arranged on the protective layer (110). As will be described later, a plurality of first banks (120) may be arranged on the protective layer (110) between the plurality of three-dimensional structures (130). The plurality of first banks (120) may be omitted.

[0092] The three-dimensional structure (130) may have a first side surface (SS1), a second side surface (SS2), and a top surface (TS). If the top surface (TS) is omitted, the top end of the first side surface (SS1) and the top end of the second side surface (SS2) may meet each other.

[0093] The first subpixel (SPr) may be disposed on the first side (SS1) of the three-dimensional structure (130), the second subpixel (SPg) may be disposed on the second side (SS2) of the three-dimensional structure (130), and the third subpixel (SPb) may be disposed on the top surface (TS) of the three-dimensional structure (130). The third subpixel (SPb) may not horizontally overlap the first subpixel (SPr) or the second subpixel (SPg), and the third subpixel (SPb) may be disposed on the first subpixel (SPr) and the second subpixel (SPg).

[0094] By this structure, one pixel (P) including a first subpixel (SPr), a second subpixel (SPg), and a fourth subpixel can be formed by one three-dimensional structure (130). In this case, as many pixels (P) as there are three-dimensional structures (130) can be provided.

[0095] High definition and high resolution can be implemented without reducing the light-emitting area of ​​each subpixel (SPg, SPr).

[0096] In the drawing, the side surface of the three-dimensional structure (130) has a straight surface, but may alternatively have a curved surface or an uneven surface. The side surface may be referred to as a wall surface. The terms side surface and wall surface may be used interchangeably.

[0097] The three-dimensional structure (130) may have a dot structure. The three-dimensional structure (130) may be arranged in a matrix along the first direction (X) and the second direction (Y). The three-dimensional structure (130) may be separated into pixel (P) units or column-line units along the first direction (X). The three-dimensional structure (130) may be separated into pixel (P) units or row-line units along the second direction (Y). The three-dimensional structure (130) may be separated into two or more pixel (P) units or row-line units along the second direction (Y). The three-dimensional structure (130) may be arranged in a continuous stripe shape along the second direction (Y). That is, the three-dimensional structure (130) may be arranged lengthwise without being separated along the second direction (Y).

[0098] The three-dimensional structure (130) can be divided into two or more pixel (P) units or row-line units along the second direction (Y).

[0099] The first side (SS1) and the second side (SS2) of the three-dimensional structure (130) may each have an inclined surface inclined at a predetermined angle with respect to the ground.

[0100] Depending on the resolution of the organic light-emitting display device, the height and width of the three-dimensional structure (130) can be determined, and the manufacturing method of the three-dimensional structure (130) can also be determined.

[0101] A plurality of three-dimensional structures (130) may be spaced apart with a separation area between them. A plurality of pixels (P) may be distinguished by the plurality of separation areas. That is, a single pixel (P) may be defined between adjacent separation areas.

[0102] The plurality of banks (120 125) may include a plurality of first banks (120), a plurality of second banks (125), etc.

[0103] A plurality of first banks (120) may be arranged on the protective layer (110) between a plurality of first subpixels (SPr) and a plurality of subpixels (SPr, SPg, SPb). A plurality of first banks (120) may be arranged in a spaced area between a plurality of three-dimensional structures (130). A plurality of second banks (125) may be arranged on the second inorganic insulating layer (151) between a plurality of third subpixels (SPb).

[0104] The first bank (120) may serve to distinguish pixels (P), and the second bank (125) may serve to distinguish adjacent third subpixels (SPb).

[0105] In the drawing, the thickness, size, shape, etc. of the first bank (120) and the second bank (125) are depicted to be different from each other, and the thickness, size, shape, etc. may be changed.

[0106] The first bank (120) and / or the second bank (125) may include an inorganic material or an organic material. For example, the first bank (120) and / or the second bank (125) may include an inorganic material such as SiNx, SiON, etc.

[0107] When forming the second bank (125) after forming the first organic light-emitting element (140r) and the second organic light-emitting element (140g), if the second bank (125) is made of an organic material, the temperature cannot be raised above 80 to 100°C so as not to affect the lifespan of the first organic light-emitting element (140r) and the second organic light-emitting element (140g). In this case, organic components may leak from the resin fired at 100°C or lower, which may also affect the lifespan of the third organic light-emitting element (140b). Therefore, it may be preferable for the second bank (125) to be made of an inorganic material.

[0108] Although not shown, if the second bank (125) is formed of black resin, the viewing angle and visibility can be improved. In this case, the black resin can be covered with an inorganic film to prevent leakage of organic components.

[0109] Meanwhile, the plurality of organic light-emitting elements may include a first organic light-emitting element (140r), a second organic light-emitting element (140g), and a third organic light-emitting element (140b).

[0110] In the embodiment, since the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) are arranged three-dimensionally, the first organic light-emitting element (140r), the second organic light-emitting element (140g), and the third organic light-emitting element (140b) can also be arranged three-dimensionally.

[0111] The first organic light-emitting element (140r) may be disposed in the first subpixel (SPr). The first organic light-emitting element (140r) may be disposed in the first subpixel (SPr) located on the first side (SS1) of the three-dimensional structure (130). The second organic light-emitting element (140g) may be disposed in the second subpixel (SPg). The second organic light-emitting element (140g) may be disposed in the second subpixel (SPg) located on the second side (SS2) of the three-dimensional structure (130). The third organic light-emitting element (140b) may be disposed in the third subpixel (SPb). The third organic light-emitting element (140b) may be disposed on the top surface (TS) of the three-dimensional structure (130). The third organic light-emitting element (140b) may be placed in the third subpixel (SPb) located on the upper surface (TS) of the three-dimensional structure (130).

[0112] The first organic light-emitting element (140r) and the second organic light-emitting element (140g) may be arranged to overlap each other horizontally with the three-dimensional structure (130) interposed therebetween. The third organic light-emitting element (140b) may be arranged on the first organic light-emitting element (140r) and the second organic light-emitting element (140g).

[0113] The first organic light-emitting element (140r) and the second organic light-emitting element (140g) may be disposed on the protective layer (110), and the third organic light-emitting element (140b) may be disposed on the second inorganic insulating layer (151). The first organic light-emitting element (140r) and the second organic light-emitting element (140g) may be disposed under the first inorganic insulating layer (150).

[0114] One of the first organic light-emitting element (140r) and the second organic light-emitting element (140g) may include a red organic light-emitting element, and the other may include a green organic light-emitting element. The third organic light-emitting element (140b) may include a blue organic light-emitting element.

[0115] In the top emission method, the first color light, the second color light, and the third color light generated from each of the first organic light-emitting element (140r), the second organic light-emitting element (140g), and the third organic light-emitting element (140b) can be emitted forward through the third inorganic insulating layer (153). For example, the first color light may be the first color light, the second color light may be the second color light, and the third color light may be blue light, but this is not limited thereto.

[0116] Meanwhile, the first organic light-emitting element (140r) may include a first anode electrode (141r), a first organic light-emitting layer (142r), a first cathode electrode (143r), etc. The second organic light-emitting element (140g) may include a second anode electrode (141g), a second organic light-emitting layer (142g), a second cathode electrode (143g), etc. The third organic light-emitting element (140b) may include a third anode electrode (141b), a third organic light-emitting layer (142b), a third cathode electrode (143b), etc. The first organic light-emitting layer (142r) can generate a first color light using power between the first anode electrode (141r) and the first cathode electrode (143r), the second organic light-emitting layer (142g) can generate a second color light using power between the second anode electrode (141g) and the second cathode electrode (143g), and the third organic light-emitting layer (142b) can generate a third color light using power between the third anode electrode (141b) and the third cathode electrode (143b).

[0117] The first anode electrode (141r), the second anode electrode (141g), and the third anode electrode (141b) can be independently disposed in the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb). That is, the first anode electrode (141r) can be disposed only in the first subpixel (SPr), the second anode electrode (141g) can be disposed only in the second subpixel (SPg), and the third anode electrode (141b) can be disposed only in the third subpixel (SPb).

[0118] As an example, a conductive material may be formed and patterned on a substrate (100), so that a first anode electrode (141r), a second anode electrode (141g), and a third anode electrode (141b) may be independently formed in each of the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb).

[0119] A plurality of first anode electrodes (141r) and a plurality of second anode electrodes (141g) may be arranged to be spaced apart from each other with a plurality of first banks (120) therebetween. A plurality of third anode electrodes (141b) may be arranged to be spaced apart from each other with a plurality of second banks (125) therebetween.

[0120] The first anode electrode (141r) can be electrically connected to the first driving circuit (101r). Since the first anode electrode (141r) and the first driving circuit (101r) are arranged with the protective layer (110) interposed therebetween, the first anode electrode (141r) can be electrically connected to the first driving circuit (101r) through the protective layer (110).

[0121] The second anode electrode (141g) can be electrically connected to the second driving circuit (101g). Since the second anode electrode (141g) and the second driving circuit (101g) are arranged with a protective layer (110) therebetween, the second anode electrode (141g) can be electrically connected to the first driving circuit (101r) through the protective layer (110).

[0122] The first anode electrode (141r) and the second anode electrode (141g) can be electrically connected to the first driving circuit and the second driving circuit through the auxiliary electrode (111). The auxiliary electrode (111) is disposed on the protective layer (110) and can be electrically connected to the first driving circuit and the second driving circuit by penetrating the protective layer (110).

[0123] The third anode electrode (141b) may be electrically connected to the third driving circuit (101b) through a connection portion (not shown). The third anode electrode (141b) may be electrically connected to the third driving circuit (101b) in a non-emission region between the first subpixel (SPr) and the second subpixel (SPg) or in a non-emission region between adjacent pixels (P). For example, the third anode electrode (141b) may be electrically connected to the third driving circuit (101b) through a plurality of insulating layers (150, 160, 151), the first bank (120), and the protective layer (110).

[0124] Cathode electrodes (143r, 143g) may be arranged on the entire area of ​​the substrate. At this time, the cathode electrode included in the first subpixel (SPr) may become the first cathode electrode (143r), and the cathode electrode included in the second subpixel (SPg) may become the second cathode electrode (143g).

[0125] When the cathode electrodes (143r, 143g) are arranged on the entire area of ​​the substrate, when the connecting electrode (or auxiliary electrode) between the third anode electrode (141b) and the third driving circuit (101b) penetrates through the multiple insulating layers (150, 160, 151), the first bank (120), and the protective layer (110), an electrical short may occur between the connecting electrode and the cathode electrode (143r, 143g). To prevent this, a through hole may be formed in the cathode electrode (143r, 143g) so as to be physically separated from the connecting electrode. In addition, an insulating layer may be formed between the connecting electrode and the cathode electrode (143r, 143g) in the through hole of the cathode electrode (143r, 143g), but is not limited thereto.

[0126] In a top-emitting method having a large-area screen of 15” or more, since the cathode electrodes (143r, 143g) are thin and made of a low-resistance material, a power line can be arranged in the display area. In this case, the cathode electrodes (143r, 143g) can be connected to a power line through an EVSS electrode (auxiliary electrode). The third cathode electrode (143b) can be connected to the same power line by penetrating a plurality of insulating layers (150, 160, 151).

[0127] In the case of a small-area screen of 15” or less, it can be directly connected to a power line provided in a non-display area surrounding the display area. For example, in a deposition process, in a cell metal mask divided into panel units, the power line and the organic light-emitting layer (142r, 142g, 142b) are covered so as not to be deposited, and the cathode electrode (143r, 143g, 143b) is opened so as to be deposited, so that the cathode electrode (143r, 143g, 143b) can be electrically connected to the power line.

[0128] When the third cathode electrode (143) is connected to the power line through a plurality of insulating layers (150, 160, 151), the EVSS electrode (auxiliary electrode) may be arranged as an intermediate layer on the same layer as the anode electrode (141b) of the third subpixel (SPb). In this case, reliability may be improved by connecting the third cathode electrode (143) to the power line through the EVSS electrode (auxiliary electrode).

[0129] Meanwhile, as illustrated in FIGS. 1 and 2, each of the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may include an emission area (EAr, EAg, EAb) and a non-emission area. In this case, the first emission area (EAr) of the first subpixel (SPr) may have a size corresponding to the first anode electrode (141r). The second emission area (EAg) of the second subpixel (SPg) may have a size corresponding to the second anode electrode (141g). The third emission area (EAb) of the third subpixel (SPb) may have a size corresponding to the third anode electrode (141b).

[0130] As shown in Fig. 2, the third anode electrode (141b) can be placed on the upper side of the first anode electrode (141r) and the upper side of the second anode electrode (141g).

[0131] The first organic light-emitting layer (142r), the second organic light-emitting layer (142g), and the third organic light-emitting layer (142b) can be independently disposed in the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb). That is, the first organic light-emitting layer (142r) can be disposed only in the first subpixel (SPr), and the second organic light-emitting layer (142g) can be disposed only in the second subpixel (SPg).

[0132] A first organic light-emitting layer (142r) may be disposed on a first anode electrode (141r) in a first subpixel (SPr), a second organic light-emitting layer (142g) may be disposed on a second anode electrode (141g) in a second subpixel (SPg), and a third organic light-emitting layer (142b) may be disposed on a third anode electrode (141b) in a third subpixel (SPb). The first organic light-emitting layer (142r) may be disposed on a portion of an upper side of a first bank (120) located on each of both sides of the first subpixel (SPr). The second organic light-emitting layer (142g) may be disposed on a portion of an upper side of a first bank (120) located on each of both sides of the second subpixel (SPg). The first organic light-emitting layer (142r) and the second organic light-emitting layer (142g) may be arranged to be spaced apart from each other on the upper side of the first bank (120). The third organic light-emitting layer (142b) may be arranged on a portion of the upper side of the second bank (125) located on each side of the third subpixel (SPb).

[0133] The third organic light-emitting layer (142b) may be disposed only in an area corresponding to the third subpixel (SPb) on the second inorganic insulating layer (151), and may not be disposed in an area corresponding to the first subpixel (SPr) or the second subpixel (SPg). Accordingly, since the third color light of the third organic light-emitting layer (142b) is not generated in an area corresponding to the first subpixel (SPr) or the second subpixel (SPg) in the second inorganic insulating layer (151), the first color light generated in the first organic light-emitting element (140r) or the second color light generated in the second organic light-emitting element (140g) may be emitted forward without being obstructed by the third color light.

[0134] The second bank (125) may be made of black resin. That is, the second bank (125) may be called a black layer, a black matrix, etc.

[0135] Although not shown, if the second bank (125) is formed of black resin, the viewing angle and visibility can be improved. In this case, the black resin can be covered with an inorganic film to prevent leakage of organic components.

[0136] Meanwhile, the first cathode electrode (143r) and the second cathode electrode (143g) may be disposed on the substrate (100). That is, the first cathode electrode (143r) and the second cathode electrode (143g) may be disposed on the substrate (100) as a single unit without being separated from each other. For example, the first cathode electrode (143r) and the second cathode electrode (143g) may be disposed as a cathode electrode in common only for the first subpixel (SPr) and the second subpixel (SPg).

[0137] The third cathode electrode (143b) may be disposed only on the third subpixel (SPb). That is, the third cathode electrode (143b) may not be disposed between a plurality of third subpixels (SPb). For example, the third cathode electrode (143b) may not be disposed between a plurality of third subpixels (SPb) on the second inorganic insulating layer (151).

[0138] Accordingly, the third organic light-emitting layer (142b), the third cathode electrode (143b), the second bank (125), etc. are not arranged on the remaining area except for the area corresponding to the third subpixel (SPb) in the second inorganic insulating layer (151), thereby minimizing the number of layers. Accordingly, since the first color light of the first organic light-emitting element (140r) and the second color light of the second organic light-emitting element (140g) are emitted forward without light loss, the lifetime luminous efficiency can be improved.

[0139] Meanwhile, in the embodiment, the first anode electrode (141r) and the second anode electrode (141g) may include reflective electrodes having excellent reflective characteristics. In this case, the first color light generated from the first organic light-emitting layer (142r) and the second color light generated from the second organic light-emitting layer (142g) are reflected by the first anode electrode (141r) and the second anode electrode (141g) and emitted forward, respectively, thereby increasing the light extraction rate and improving the image quality.

[0140] In an embodiment, the first cathode electrode (143r) and the second cathode electrode (143g) may include a transparent or translucent conductive film.

[0141] When the first cathode electrode (143r) and the second cathode electrode (143g) include a translucent conductive film, recycling of the first color light may occur between the first anode electrode (141r) and the first cathode electrode (143r) and between the second anode electrode (141g) and the second cathode electrode (143g), thereby improving the light extraction rate. That is, the first color light generated in the first organic light-emitting layer (142r) may be reflected by the first cathode electrode (143r) and may travel downward, and may be reflected again by the first anode electrode (141r) and travel upward. A portion of the first color light that travels upward may transmit through the first cathode electrode (143r) and be emitted forward, and another portion may be reflected by the first cathode electrode (143r). In this way, by recycling the first color light between the first cathode electrode (143r) and the first anode electrode (141r), more first color light can be emitted forward, thereby improving light efficiency.

[0142] Likewise, the second color light generated from the second organic light-emitting layer (142g) is recycled between the second cathode electrode (143g) and the second anode electrode (141g), so that more second color light is emitted forward, thereby improving the light-emitting efficiency.

[0143] Meanwhile, referring to FIGS. 1 and 2, a plurality of insulating layers (150 to 153, 160, 161) may be disposed on the substrate (100). The plurality of insulating layers may include at least one inorganic insulating layer (150 to 153) and at least one organic insulating layer (160, 161). For example, the inorganic insulating layer may include SiNx, SiO2, etc., but is not limited thereto.

[0144] Among the plurality of insulating layers (150, 160, 151) disposed between the first organic light-emitting element (140r) and the third organic light-emitting element (140b), the lowest layer (150) and the uppermost layer (151) may be inorganic insulating layers. For example, the plurality of insulating layers may include, but are not limited to, a first inorganic insulating layer (150), a first organic insulating layer (160), a second inorganic insulating layer (151), etc. At least one of the first inorganic insulating layer (150), the first organic insulating layer (160), and the second inorganic insulating layer (151) may be omitted. The first organic insulating layer (160) may be disposed between the first inorganic insulating layer (150) and the second inorganic insulating layer (151). The first inorganic insulating layer (150) and the second inorganic insulating layer (151) may each include a plurality of insulating films.

[0145] The first inorganic insulating layer (150) may be disposed on the first organic light-emitting element (140r) and the second organic light-emitting element (140g). The first inorganic insulating layer (150) may be disposed on the upper side of the first cathode electrode (143r) of the first organic light-emitting element (140r) and the upper side of the second cathode electrode (143g) of the second organic light-emitting element (140g). The first inorganic insulating layer (150) may prevent moisture, oxygen, etc. from penetrating into the first organic light-emitting layer (142r) under the first cathode electrode (143r) and the second organic light-emitting layer (142g) under the second cathode electrode (143g).

[0146] The second inorganic insulating layer (151) may be disposed under the third organic light-emitting element (140b). The second inorganic insulating layer (151) may be disposed under the third anode electrode (141b) of the third organic light-emitting element (140b). The second inorganic insulating layer (151) may prevent moisture, oxygen, etc. from penetrating into the third organic light-emitting layer (142b) over the third anode electrode (141b).

[0147] Meanwhile, the insulating pattern (152) may include a multilayer inorganic film disposed on the capping layer (CPL) to protect the third cathode electrode (143b) and the third organic light-emitting layer (142b). The multilayer inorganic film may prevent the penetration of a developer during the photo process and the developing process during the patterning process.

[0148] In addition, instead of the second organic insulating layer (161), an inorganic film may be provided, or a multilayer structure including an inorganic film and an organic film may be provided. Accordingly, penetration of the developer can be fundamentally blocked.

[0149] The third inorganic insulating layer (153) may be disposed on the third organic light-emitting element (140b). The third inorganic insulating layer (153) may be disposed on the third cathode electrode (143b) of the third organic light-emitting element (140b). The third inorganic insulating layer (153) may prevent moisture, oxygen, etc. from penetrating into the third organic light-emitting layer (142b) under the third cathode electrode (143b).

[0150] Figure 3 illustrates a stacked structure for each organic light-emitting element. The stacked structure for each organic light-emitting element illustrated in Figure 3 illustrates a 1-stack structure.

[0151] As illustrated in FIG. 3, the first organic light-emitting element (140r), the second organic light-emitting element (140g), and the third organic light-emitting element (140b) may include an anode electrode (141r, 141g, 141b), a plurality of organic layers, a cathode electrode (143r, 143g, 143b), and a capping layer (CPL).

[0152] For example, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), etc. may be commonly included in the first organic light emitting element (140r), the second organic light emitting element (140g), and the third organic light emitting element (140b). A hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), etc. may be commonly formed on the substrate (100).

[0153] For example, a red organic light-emitting layer (R-EML) may be included in a first organic light-emitting element (140r), a green organic light-emitting layer (G-EML) may be included in a second organic light-emitting element (140g), and a blue organic light-emitting layer (B-EML) may be included in a third organic light-emitting element (140b). The red organic light-emitting layer (R-EML) may be formed only in the first subpixel (SPr) on the substrate (100). The green organic light-emitting layer (G-EML) may be formed only in the second subpixel (SPg) on ​​the substrate (100). The blue organic light-emitting layer (B-EML) may be formed only in the third subpixel (SPb) on the substrate (100).

[0154] For example, a red hole transport layer (R-HTL) may be included in the first organic light-emitting element (140r). A green hole transport layer may also be included in the second organic light-emitting element (140g). The red hole transport layer (R-HTL) may be formed only in the first subpixel (SPr) on the substrate (100).

[0155] The stacked structure for each organic light-emitting element can also be applied to a stack structure of two or more.

[0156] In a stack structure of two or more, a hole injection layer (HIL), a hole transport layer (HTL), a first organic light-emitting layer, an electron transport layer (ETL), an electron injection layer (EIL), etc. may be disposed between the anode electrode (141r, 141g, 141b) and the charge generation layer, and a hole transport layer (HTL), a second organic light-emitting layer, an electron transport layer (ETL), an electron injection layer (EIL), etc. may be disposed between the charge generation layer and the cathode electrode (143r, 143g, 143b).

[0157] Figure 4 schematically illustrates the design structure of the three-dimensional structure and the design structure of the second evaporation source device. For convenience of explanation, Figure 4 illustrates the deposition of a green emitting layer (G-EML), but the same can be applied to the deposition of a red emitting layer (G-EML).

[0158] As illustrated in Fig. 4, a green light-emitting material of a second evaporation source device (430) may be deposited on the second side (SS2) of a three-dimensional structure (130), so that a second organic light-emitting element (140g) may be formed on the second side (SS2). The second evaporation source device (430) may be installed in a second deposition chamber.

[0159] Although not shown, a red light-emitting material of a first evaporation source device may be deposited on a first side (SS1) of a three-dimensional structure (130), thereby forming a first organic light-emitting element (140r) on the first side (SS1). The first evaporation source device may be installed in the first deposition chamber.

[0160] Key factors in the design of the three-dimensional structure (130) include a height (H), a first width (W1), a second width (W2), etc. The height (H) may be the height of the three-dimensional structure (130). The first width (W1) may be a width projected vertically to the first side (SS1) of the three-dimensional structure (130). The second width (W2) may be a width of a separation area between adjacent three-dimensional structures (130).

[0161] The deposition angle (θe) (or maximum deposition angle) for depositing a green light-emitting material on the second side (SS2) by the shadow effect can be expressed by mathematical expression 1.

[0162] [Mathematical Formula 1]

[0163] tanθe = H / (W1 + W2)

[0164] When a virtual line connecting one end of the upper surface (TS) of the three-dimensional structure (130) to one end of the effective light-emitting area of ​​the first subpixel (SPg) is drawn based on the plane of the substrate (100), this virtual line may substantially correspond to the deposition angle (θe) of mathematical expression 1.

[0165] Meanwhile, the second evaporation source device (430) for deposition on the second side (SS2) of the three-dimensional structure (130) can be arranged to satisfy the deposition angle (θe).

[0166] In this regard, an angle limiting plate (436) may be placed between the second evaporation source device (430) of the green light-emitting material and the substrate (100) within the second deposition chamber.

[0167] The angle limiting plate (436) can be configured to have a width substantially wider than the width of the second evaporation source device (430) so as to cover the entire second evaporation source device (430).

[0168] Meanwhile, the nozzle (435) of the second evaporation source device (430) can be installed so as to be inclined toward the nozzle (435) so as to face the second side (SS2).

[0169] The second evaporation source device (430) and the angle limiting plate (436) can be arranged so that an imaginary line connecting the rear end (i.e., one end in the deposition direction) of the nozzle (435) and the angle limiting plate (436) becomes the deposition angle (θe). This can be expressed by mathematical expression 2.

[0170] [Equation 2]

[0171] tanθe = ET / Loffset

[0172] ET represents the vertical distance between the substrate (100) and the second evaporation source device (430) (more specifically, the nozzle (435)), and Loffset may represent the shortest horizontal distance from the second evaporation source device (430) to the point on the substrate (100) where deposition of the green light-emitting material is possible.

[0173] It is desirable to design the three-dimensional structure (130) and the second evaporation source device (430) so that mathematical expressions 1 and 2 are satisfied.

[0174] FIGS. 5A and 5B illustrate a first organic light-emitting element and a second organic light-emitting element arranged on a first bank between three-dimensional structures according to a comparative example and an embodiment. FIGS. 5A and 5B are enlarged views of area J of FIG. 2.

[0175] As illustrated in FIG. 2 and FIG. 5a, a hole injection layer (HIL), a hole transport layer (HTL), a red hole transport layer (R-HTL), a green organic light-emitting layer (G-EML), a red organic light-emitting layer (R-EML), an electron transport layer (ETL), an electron injection layer (EIL), a cathode electrode (143), etc. may be disposed on the first bank (120). Here, the cathode electrode (143) may be a first cathode electrode (141r) of a first organic light-emitting element (140r) and / or a second cathode electrode (141g) of a second organic light-emitting element (140g).

[0176] A red hole transport layer (R-HTL) and a red organic light-emitting layer (R-EML) may be disposed on one side of a first bank (120), and a green organic light-emitting layer (G-EML) may be disposed on the other side of the first bank (120). The green organic light-emitting layer (G-EML) may vertically overlap with each of the red hole transport layer (R-HTL) and the red organic light-emitting layer (R-EML). The green organic light-emitting layer (G-EML) may be vertically disposed between the red hole transport layer (R-HTL) and the red organic light-emitting layer (R-EML).

[0177] A hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), and a cathode electrode (143) can be arranged over the entire area of ​​the first bank (120).

[0178] The hole injection layer (HIL) is made of a low-resistance organic material, and the hole injection layer of the first organic light-emitting element (140r) and the hole injection layer of the second organic light-emitting element (140g) are connected to each other on the first bank (120), so that transverse current leakage may occur between the first subpixel (SPr) and the second subpixel (SPg). If leakage light emission due to transverse current leakage occurs, problems such as a decrease in yield due to color spots may occur.

[0179] To solve this problem, as illustrated in FIGS. 2 and 5b, the hole injection layers (HIL1, HIL2) may be arranged to be spaced apart from each other on the first bank (120). Accordingly, the hole injection layer (HIL1) of the first organic light-emitting element (140r) and the hole injection layer (HIL2) of the second organic light-emitting element (140g) are disconnected on the first bank (120), thereby preventing lateral current leakage between the first subpixel (SPr) and the second subpixel (SPg).

[0180] As illustrated in FIG. 4, when a plurality of organic layers are deposited to form a second organic light-emitting element (140g), the hole injection layer (HIL2), which is a low-resistance organic material, and the green organic light-emitting layer (G-EML), which is a high-resistance organic material, can be controlled to be sprayed toward the substrate (100) at different deposition angles. For example, by setting the deposition angle of the hole injection layer (HIL2) smaller than that of the green organic light-emitting layer (G-EML) with respect to the horizontal line, the end of the hole injection layer (HIL2) can be positioned closer to the side of the first bank (120) than the end of the green organic light-emitting layer (G-EML).

[0181] The hole injection layer (HIL2) can be called a low-resistance layer, and the green organic light-emitting layer (G-EML) can be called a high-resistance layer.

[0182] Although not shown, when a plurality of organic layers are deposited to form the first organic light-emitting element (140r), the hole injection layer (HIL1), which is a low-resistance organic material, and the red organic light-emitting layer (R-EML), which is a high-resistance organic material, can be controlled to be sprayed toward the substrate (100) at different deposition angles. For example, by setting the deposition angle of the hole injection layer (HIL1) smaller than that of the red organic light-emitting layer (R-EML) with respect to the horizontal line, the end of the hole injection layer (HIL1) can be positioned closer to the side of the first bank (120) than the end of the red organic light-emitting layer (R-EML).

[0183] Accordingly, the end of the hole injection layer (HIL1) of the first organic light-emitting element (140r) and the end of the hole injection layer (HIL2) of the second organic light-emitting element (140g) can be arranged to be spaced apart from each other.

[0184] Meanwhile, when an organic light-emitting device having a stack structure of two or more is applied, since the charge generation layer disposed between the first stack and the second stack is also a low-resistance organic material, the charge generation layers can be disposed to be spaced apart from each other on the first bank (120).

[0185] Figures 6a and 6b illustrate the first organic light-emitting element and the second organic light-emitting element according to the comparative example and the exemplary example, respectively, arranged on the upper surface of the three-dimensional structure. Figures 6a and 6b are enlarged views of the K region of Figure 2.

[0186] As shown in FIG. 2 and FIG. 6a, a hole injection layer (HIL), a hole transport layer (HTL), a red hole transport layer (R-HTL), a green organic light-emitting layer (G-EML), a red organic light-emitting layer (R-EML), an electron transport layer (ETL), an electron injection layer (EIL), a cathode electrode (143), etc. may be arranged on the upper surface (TS) of the three-dimensional structure (130).

[0187] A hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), and a cathode electrode (143) can be arranged over the entire area of ​​the first bank (120).

[0188] In particular, since the hole injection layer (HIL), which is a low-resistance organic material, is disposed over the entire area of ​​the first bank (120), the hole injection layer of the first organic light-emitting element (140r) and the hole injection layer of the second organic light-emitting element (140g) can be connected to each other on the upper surface (TS) of the three-dimensional structure (130). Accordingly, a transverse current leakage may occur between the first subpixel (SPr) and the second subpixel (SPg).

[0189] To solve this problem, as illustrated in FIGS. 2 and 6b, the cathode electrode (143) and the plurality of organic layers disposed on the upper surface (TS) of the three-dimensional structure (130) can be removed using a patterning process. That is, the cathode electrode (143) and the plurality of organic layers can be removed so that the upper surface (TS) of the three-dimensional structure (130) is exposed. Accordingly, the hole injection layer (HIL1) of the first organic light-emitting element (140r) and the hole injection layer (HIL2) of the second organic light-emitting element (140g) are disconnected from each other on the upper surface (TS) of the three-dimensional structure (130), so that transverse current leakage between the first subpixel (SPr) and the second subpixel (SPg) can be prevented.

[0190] Meanwhile, when an organic light-emitting device having two or more stack structures is applied, the charge generation layers disposed between the first stack and the second stack may be disposed to be spaced apart from each other on the upper surface (TS) of the three-dimensional structure (130).

[0191]

[0192] [Example 2]

[0193] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment. Fig. 7 is a cross-sectional view taken along line AA' of the organic light-emitting display device of Fig. 1.

[0194] The second embodiment is identical to the first embodiment (Fig. 2) except that the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) are each perpendicular to the substrate (100). In the second embodiment, components having the same structure, shape, and / or function as those in the first embodiment (Fig. 2) are given the same drawing reference numerals and a detailed description thereof is omitted.

[0195] Referring to FIGS. 1 and 7, an organic light-emitting display device according to a second embodiment may include a substrate (100), a plurality of driving circuits (101r, 101g, 101b), a protective layer (110), a plurality of three-dimensional structures (130), a plurality of banks (120 125), a plurality of organic light-emitting elements (140r, 140g, 140b), a plurality of insulating layers (150 to 153, 160, 161), etc.

[0196] The first side (SS1) and the second side (SS2) of the three-dimensional structure (130) may each be perpendicular to the substrate (100). For example, the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) may each be at an angle of 90 degrees to the substrate (100). In this case, the first organic light-emitting element (140r) may be arranged in the first subpixel (SPr) on the first side (SS1) of the three-dimensional structure (130), and the second organic light-emitting element (140g) may be arranged in the second subpixel (SPg) on ​​the second side (SS2) of the three-dimensional structure (130).

[0197] Since the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) are each perpendicular to the substrate (100), the occupied area of ​​the first organic light-emitting element (140r) and the occupied area of ​​the second organic light-emitting element (140g) are minimized when viewed from the front, so that an ultra-high-resolution display can be implemented.

[0198] In contrast, since the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) are secured as the light-emitting areas of the first subpixel (SPr) and the second subpixel (SPg), respectively, the first color light and the second color light are sufficiently emitted forward, so that a decrease in the lifetime light emission rate can be prevented.

[0199] The transverse current leakage prevention structure illustrated in FIG. 6b may be applied to FIG. 7. That is, since the low-resistance layer of the first organic light-emitting element (140r) and the low-resistance layer of the second organic light-emitting element (140g) are disconnected from each other on the upper surface (TS) of the three-dimensional structure (130), transverse current leakage between the first subpixel (SPr) and the second subpixel (SPg) can be prevented. The low-resistance layer may include, for example, a hole injection layer, a charge generation layer, etc.

[0200]

[0201] Fig. 8 is a plan view illustrating an organic light-emitting display device according to a second embodiment. The second embodiment may be identical to the first embodiment (Fig. 1) except that the third subpixel (SPb) vertically overlaps the first subpixel (SPr) and the second subpixel (SPg). In the second embodiment, components having the same structure, shape, and / or function as those in the first embodiment (Fig. 1) are given the same reference numerals and detailed descriptions are omitted.

[0202] In the first embodiment (Fig. 1), the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may not vertically overlap each other. In contrast, in the second embodiment (Fig. 8), the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may vertically overlap each other.

[0203] In an embodiment, the plurality of pixels (P) may include a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb), each having a three-dimensional structure. That is, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may be arranged three-dimensionally to form the pixel (P). That is, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may be arranged not only horizontally but also vertically with respect to one another, thereby forming the pixel (P).

[0204] For example, the sum of the size (or area) of the first subpixel (SPr) and the size (or area) of the second subpixel (SPg) may be equal to the size (or area) of the pixel (P). For example, the sum of the width of the first subpixel (SPr) and the width of the second subpixel (SPg) may be equal to the width (W) of the pixel (P).

[0205] For example, the size (or area) of the third subpixel (SPb) may be the same as the size (or area) of the pixel (P). For example, the width of the third subpixel (SPb) may be the same as the width (W) of the pixel (P).

[0206] In this case, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) can be arranged three-dimensionally so that the pixel (P) includes all of the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb). Understanding this, the second subpixel (SPg) can be arranged to horizontally overlap the first subpixel (SPr), and the third subpixel (SPb) can be arranged to vertically overlap the first subpixel (SPr) and the second subpixel (SPg).

[0207] According to an embodiment, a first subpixel (SPr), a second subpixel (SPg), and a third subpixel (SPb) are arranged three-dimensionally to form a pixel (P), so that the size of the pixel (P) can be further reduced, thereby implementing a high-definition, ultra-high-resolution display.

[0208] Meanwhile, as illustrated in FIG. 8, the third light-emitting area (EAb) of the third subpixel (SPb) may be arranged to vertically overlap the first light-emitting area (EAr) of the first subpixel (SPr). The third light-emitting area (EAb) of the third subpixel (SPb) may vertically overlap the second light-emitting area (EAg) of the second subpixel (SPg). The first light-emitting area (EAr) of the first subpixel (SPr) and the second light-emitting area (EAg) of the second subpixel (SPg) may not vertically overlap. That is, the first light-emitting area (EAr) of the first subpixel (SPr) and the second light-emitting area (EAg) of the second subpixel (SPg) may be arranged to horizontally overlap.

[0209] The size of the third light-emitting area (EAb) of the third subpixel (SPb) may be larger than the size of the first light-emitting area (EAr) of the first subpixel (SPr). The size of the third light-emitting area (EAb) of the third subpixel (SPb) may be larger than the size of the second light-emitting area (EAg) of the second subpixel (SPg). Although the size of the first light-emitting area (EAr) and the size of the second light-emitting area (EAg) are shown as being the same in the drawing, they may be different from each other.

[0210] According to an embodiment, the size of the third light-emitting area (EAb) of the third subpixel (SPb) is increased to the size of the pixel (P), so that the third light-emitting area (EAb) is greatly increased, and the lifetime light-emitting rate can be improved.

[0211]

[0212] [Example 3]

[0213] Fig. 9 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment. Fig. 9 is a cross-sectional view taken along line BB' of the organic light-emitting display device of Fig. 8.

[0214] In the third embodiment, it is similar to the first embodiment (Fig. 2) and the second embodiment (Fig. 7) except for the third organic light-emitting element (140b). In the third embodiment, components having the same structure, shape, and / or function as those in the first embodiment (Fig. 2) or the second embodiment (Fig. 7) are given the same drawing reference numerals and detailed descriptions are omitted.

[0215] Referring to FIGS. 8 and 9, an organic light-emitting display device according to a third embodiment may include a substrate (100), a plurality of driving circuits (101r, 101g, 101b), a protective layer (110), a plurality of three-dimensional structures (130), a plurality of banks (120 125), a plurality of organic light-emitting elements (140r, 140g, 140b), a plurality of insulating layers (150 to 153, 160), etc.

[0216] To implement a high-definition, ultra-high-resolution display, the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may be arranged three-dimensionally. The third subpixel (SPb) may be arranged on the first subpixel (SPr) and may vertically overlap with the first subpixel (SPr). The third subpixel (SPb) may be arranged on the second subpixel (SPg) and may vertically overlap with the second subpixel (SPg).

[0217] The third subpixel (SPb) can be positioned on the first subpixel (SPr) and the second subpixel (SPg) between the plurality of three-dimensional structures (130).

[0218] The first organic light-emitting element (140r) may be placed in the first subpixel (SPr), the second organic light-emitting element (140g) may be placed in the second subpixel (SPg), and the third organic light-emitting element (140b) may be placed in the third subpixel (SPb).

[0219] Since the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) are arranged three-dimensionally, the first organic light-emitting element (140r), the second organic light-emitting element (140g), and the third organic light-emitting element (140b) can also be arranged three-dimensionally.

[0220] The third organic light-emitting element (140b) can be placed on the upper side of each of the first organic light-emitting element (140r) and the second organic light-emitting element (140g) between the plurality of three-dimensional structures (130).

[0221] The second organic light-emitting element (140g) may be arranged to overlap horizontally with the first organic light-emitting element (140r). The third organic light-emitting element (140b) may be arranged to overlap vertically with the first organic light-emitting element (140r) and the second organic light-emitting element (140g).

[0222] The first organic light-emitting element (140r) and the second organic light-emitting element (140g) may be disposed on the protective layer (110), and the third organic light-emitting element (140b) may be disposed on the second inorganic insulating layer (151). Although not shown, the third organic light-emitting element (140b) may be disposed on the first inorganic insulating layer (151).

[0223] One of the first organic light-emitting element (140r) and the second organic light-emitting element (140g) may include a red organic light-emitting element, and the other may include a green organic light-emitting element. The third organic light-emitting element (140b) may include a blue organic light-emitting element.

[0224] In the top emission method, the first color light, the second color light, and the third color light generated from each of the first organic light-emitting element (140r), the second organic light-emitting element (140g), and the third organic light-emitting element (140b) can be emitted forward through the third inorganic insulating layer (153). For example, the first color light may be the first color light, the second color light may be the second color light, and the third color light may be blue light, but this is not limited thereto.

[0225] Meanwhile, the first organic light-emitting element (140r) may include a first anode electrode (141r), a first organic light-emitting layer (142r), a first cathode electrode (143r), etc. The second organic light-emitting element (140g) may include a second anode electrode (141g), a second organic light-emitting layer (142g), a second cathode electrode (143g), etc. The third organic light-emitting element (140b) may include a third anode electrode (141b), a third organic light-emitting layer (142b), a third cathode electrode (143b), etc.

[0226] As illustrated in FIG. 8, each of the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb) may include an emission area (EAr, EAg, EAb) and a non-emission area. In this case, the first emission area (EAr) of the first subpixel (SPr) may have a size corresponding to the first anode electrode (141r). The second emission area (EAg) of the second subpixel (SPg) may have a size corresponding to the second anode electrode (141g). The third emission area (EAb) of the third subpixel (SPb) may have a size corresponding to the third anode electrode (141b).

[0227] As illustrated in Fig. 9, the third anode electrode (141b) may be placed on the upper side of the first anode electrode (141r) and the upper side of the second anode electrode (141g). The third anode electrode (141b) may vertically overlap the first anode electrode (141r) and the second anode electrode (141g).

[0228] The size of the third anode electrode (141b) may be larger than the size of the first anode electrode (141r). The size of the third anode electrode (141b) may be larger than the size of the second anode electrode (141g). The size of the third anode electrode (141b) may be equal to or larger than the sum of the sizes of the first anode electrode (141r) and the second anode electrode (141g), but is not limited thereto.

[0229] According to an embodiment, in a third subpixel (SPb) having the same size as the pixel (P), the size of the third anode electrode (141b) of the third organic light-emitting element (140b) can be designed to be equal to or larger than the sum of the sizes of the first anode electrode (141r) and the second anode electrode (141g). Accordingly, the occupied area of ​​the third light-emitting area (EAb) of the third subpixel (SPb) within the pixel (P) is maximized, thereby increasing the lifetime luminous efficacy of the third color light, i.e., blue light, thereby improving the image quality.

[0230] The first anode electrode (141r), the second anode electrode (141g), and the third anode electrode (141b) can be independently arranged in the first subpixel (SPr), the second subpixel (SPg), and the third subpixel (SPb).

[0231] The first anode electrode (141r) and the second anode electrode (141g) can be electrically connected to the first driving circuit and the second driving circuit through the auxiliary electrode (111). The third anode electrode (141b) can be electrically connected to the third driving circuit (101b) using a connecting portion (not shown). For example, the third anode electrode (141b) can be electrically connected to the third driving circuit (101b) through a plurality of insulating layers (150, 160, 151), the first bank (120), and the protective layer (110) through the connecting portion.

[0232] The cathode electrodes (143r, 143g) may be disposed on the entire area of ​​the substrate (100), but are not limited thereto. The third cathode electrode (143b) may be disposed on the entire area of ​​the second inorganic insulating layer (151), but is not limited thereto.

[0233] The third organic light-emitting layer (142b) may be disposed over the entire area of ​​the substrate (100), but is not limited thereto. That is, the third organic light-emitting layer (142b) may be disposed not only on the third subpixel (SPb) but also between the third subpixels (SPb). For example, the third organic light-emitting layer (142b) may be disposed on a plurality of third anode electrodes (141b) and a plurality of second banks (125).

[0234] According to an embodiment, since the organic light-emitting material forming the third organic light-emitting layer (142b) is deposited over the entire area of ​​the substrate (100), there is no need to use a separate mask, such as an FMM, so that the degree of process freedom is increased and the yield can be improved.

[0235] The third cathode electrode (143b) may be disposed on the entire area of ​​the substrate (100), but is not limited thereto. The third cathode electrode (143b) may be disposed on a plurality of third anode electrodes (141b) and a plurality of second banks (125).

[0236] The third inorganic insulating layer (153) is provided as a multilayer inorganic film on the upper surface of the third cathode electrode (143b), and, as in the first embodiment (Fig. 2), the second organic insulating layer (161) and the third inorganic insulating layer (153) can be provided.

[0237] Meanwhile, a plurality of first banks (120) may be arranged between a plurality of three-dimensional structures (130), and a plurality of second banks (125) may be arranged between a plurality of pixels (P). The plurality of second banks (125) may be arranged on the upper side of the plurality of three-dimensional structures (130).

[0238] As seen from above, a plurality of first banks (120) can be positioned between a plurality of second banks (125).

[0239] The distance (d) between the plurality of second banks (125) may be the width (W) of the pixel (P) or the width of the third subpixel (SPb).

[0240] The distance (d) between the plurality of second banks (125) may be equal to the sum of the width of the first subpixel (SPr) and the width of the second subpixel (SPb), but is not limited thereto.

[0241] Meanwhile, although the first organic light-emitting element (140r) and the second organic light-emitting element (140g) are shown as being connected on the upper surface (TS) of the three-dimensional structure (130) in FIG. 9, they may be disconnected from each other through a subsequent process.

[0242] Referring to FIGS. 10 and 11, a process of disconnecting the first organic light-emitting element and the second organic light-emitting element (140g) from each other on the upper surface (TS) of the three-dimensional structure (130) is described.

[0243] Figures 10a to 10c illustrate a manufacturing process according to a first embodiment for preventing transverse current leakage.

[0244] As shown in Fig. 10a, a first organic light-emitting element (140r), a second organic light-emitting element (140g), a first inorganic insulating layer (150), a first organic insulating layer (160), etc. can be formed on a three-dimensional structure (130).

[0245] As illustrated in FIG. 10b, an ashing process may be performed to remove the first organic insulating layer (160) so that the upper surface of the first inorganic insulating layer (150) is exposed on the three-dimensional structure (130).

[0246] Thereafter, a dry etching process may be performed so that the first inorganic insulating layer (150), the first cathode electrode (143r) and the first organic light-emitting layer (142r) of the first organic light-emitting element (140r), the second cathode electrode (143g) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) may be removed. The dry etching process may be performed until the upper surface (TS) of the three-dimensional structure (130) is exposed. As a result of performing the dry etching process, the upper ends of each of the first cathode electrode (143r) and the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) and the upper ends of each of the second cathode electrode (143g) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) may be positioned lower than the upper surface (TS) of the three-dimensional structure (130).

[0247] As illustrated in FIG. 10c, an additional inorganic insulating layer (150a) may be formed on the substrate (100). The additional inorganic insulating layer (150a) may be referred to as a fourth inorganic insulating layer.

[0248] An additional inorganic insulating layer (150a) may be formed on the upper surface (TS) of the three-dimensional structure (130) to be exposed. The additional inorganic insulating layer (150a) may be formed on the upper ends of each of the first cathode electrode (143r) and the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) and the upper ends of each of the second cathode electrode (143g) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g). The additional inorganic insulating layer (150a) may be formed on the first organic insulating layer (160).

[0249] Accordingly, the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) may be spaced apart from each other with the three-dimensional structure (130) therebetween. In this case, since the low-resistance layer of the first organic light-emitting layer (142r) and the low-resistance layer of the second organic light-emitting layer (142g) are spaced apart from each other with the three-dimensional structure (130) therebetween, transverse current leakage between the first subpixel (SPr) and the second subpixel (SPg) may be prevented. The low-resistance layer may include, for example, a hole injection layer, a charge generation layer, etc.

[0250] FIGS. 11A to 11C illustrate a manufacturing process according to a second embodiment for preventing transverse current leakage. FIGS. 10A to 10C illustrate a manufacturing process according to a second embodiment for preventing transverse current leakage.

[0251] As illustrated in FIG. 11a, a first organic light-emitting element (140r), a second organic light-emitting element (140g), a first inorganic insulating layer (150), a first organic insulating layer (160), etc. can be formed on a three-dimensional structure (130).

[0252] Thereafter, a patterning process is performed so that the first organic insulating layer (160) on the upper surface (TS) of the three-dimensional structure (130) is removed, so that a contact hole (205) can be formed in which the upper surface of the first inorganic insulating layer (150) on the upper surface (TS) of the three-dimensional structure (130) is exposed. The contact hole (205) can be formed along the second direction (Y in FIG. 8) on the upper surface (TS) of the three-dimensional structure (130) between the first subpixel (SPr) and the second subpixel (SPg).

[0253] As illustrated in FIG. 11b, a dry etching process may be performed to remove the first inorganic insulating layer (150), the first cathode electrode (143r) and the first organic light-emitting layer (142r) of the first organic light-emitting element (140r), and the second cathode electrode (143g) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) on ​​the three-dimensional structure (130). The dry etching process may be performed until the upper surface (TS) of the three-dimensional structure (130) is exposed.

[0254] The photosensitive pattern of the dry etching process may be the same as the photosensitive pattern used in the patterning process. Accordingly, when the dry etching process is performed, the first inorganic insulating layer (150), the first cathode electrode (143r) and the first organic light-emitting layer (142r) of the first organic light-emitting element (140r), the second cathode electrode (143g) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) may be removed through the dry etching process through the contact hole (205).

[0255] As illustrated in FIG. 11c, an additional inorganic insulating layer (150a) may be formed on the substrate (100). The additional inorganic insulating layer (150a) may be formed on the upper surface of the first organic insulating layer (160) and the contact hole (205).

[0256] Accordingly, the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) may be spaced apart from each other with the three-dimensional structure (130) therebetween. In this case, since the low-resistance layer of the first organic light-emitting layer (142r) and the low-resistance layer of the second organic light-emitting layer (142g) are spaced apart from each other with the three-dimensional structure (130) therebetween, transverse current leakage between the first subpixel (SPr) and the second subpixel (SPg) may be prevented. The low-resistance layer may include, for example, a hole injection layer, a charge generation layer, etc.

[0257] Meanwhile, as illustrated in FIGS. 10b and 10c, the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) may be removed through a dry etching process. At this time, if the three-dimensional structure (130) is made of an organic material, the upper surface (TS) of the three-dimensional structure (130) may be over-etched. In addition, the three-dimensional structure (130) may be made of black resin to prevent light leakage.

[0258] In this case, the organic component of the three-dimensional structure (130) may affect the lifespan of the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) or the second organic light-emitting layer (142g) of the second organic light-emitting element (140g). In addition, when the thickness of each of the first anode electrode (141r) and the second anode electrode (141g) is 500 Å or more, current concentration may occur at the upper end or corner of each of the first anode electrode (141r) and the second anode electrode (141g). An electrical short may occur between the anode and the cathode during long-term operation.

[0259] To solve the above-mentioned problem, as illustrated in FIG. 12, an additional bank (121) may be placed on the upper surface (TS) of the three-dimensional structure (130).

[0260] After the first anode electrode (141r) of the first organic light-emitting element (140r) is formed on the first side (SS1) of the three-dimensional structure (130) and the second anode electrode (141g) of the second organic light-emitting element (140g) is formed on the second side (SS2) of the three-dimensional structure (130), an additional bank (121) can be formed.

[0261] One end of the first anode electrode (141r) and one end of the second anode electrode (141g) may be positioned lower than the upper surface (TS) of the three-dimensional structure (130). Accordingly, after the first anode electrode (141r) and the second anode electrode (141g) are formed, the upper surface (TS) of the three-dimensional structure (130), an upper portion of the first side (SS1), and an upper portion of the second side (SS2) may be exposed.

[0262] The additional bank (121) may be formed on the exposed areas, i.e., the upper surface (TS) of the three-dimensional structure (130), an upper portion of the first side (SS1), and an upper portion of the second side (SS2). The additional bank (121) may be formed to vertically overlap with the upper portion of the first anode electrode (141r) on the first side (SS1) of the three-dimensional structure (130), and may be formed to vertically overlap with the upper portion of the second anode electrode (141g) on ​​the second side (SS2) of the three-dimensional structure (130).

[0263] The three-dimensional structure (130) may not be exposed by the first anode electrode (141r), the second anode electrode (141g) and the additional bank (121).

[0264] Accordingly, as illustrated in FIGS. 10b and 11c, even if the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) and the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) are removed through a dry etching process, the upper surface (TS) of the three-dimensional structure (130) may not be over-etched because the additional bank (121) acts as a stopper.

[0265] In addition, the organic component of the three-dimensional structure (130) is physically separated from the first organic light-emitting layer (142r) of the first organic light-emitting element (140r) or the second organic light-emitting layer (142g) of the second organic light-emitting element (140g) by the additional bank (121), so that shortening of the lifespan of the first organic light-emitting element (140r) or the second organic light-emitting element (140g) can be prevented.

[0266] In addition, since the upper ends or corners of each of the first anode electrode (141r) and the second anode electrode (141g) are covered by the additional bank (121), current concentration at the upper ends or corners of each of the first anode electrode (141r) and the second anode electrode (141g) is blocked, so that an electrical short between the anode and the cathode may not occur even when driven for a long time.

[0267] Figures 13a to 13d illustrate the manufacturing process of an additional bank arranged on the upper surface of a three-dimensional structure.

[0268] As illustrated in FIG. 13a, a first anode electrode (141r) and a second anode electrode (141g) are formed on the first side (SS1) and the second side (SS2) of the three-dimensional structure (130), and a plurality of first banks (120) can be formed between the three-dimensional structure (130).

[0269] As shown in Fig. 13b, a photosensitive film (210) is formed on a substrate (100), and after a soft baking process is performed, an exposure process can be performed.

[0270] As illustrated in Fig. 13c, by performing the developing process, the upper region of the photosensitive film (210) can be removed. As a result, the upper surface (TS) of the three-dimensional structure (130) is exposed, and the upper surface (TS) of the photosensitive film (210) can be positioned lower than the upper end of the first anode electrode (141r) and / or the upper end of the second anode electrode (141g).

[0271] As illustrated in Fig. 13, after an inorganic film (121a) is formed on a substrate (100), a lift-off process may be performed. By performing the lift-off process, the photosensitive film (210) and the inorganic film (210a) between the three-dimensional structure (130) may be removed. As a result, an additional bank (121) may be formed around the upper side of the three-dimensional structure (130). The additional bank (121) may be formed on the upper surface (TS) of the three-dimensional structure (130). The additional bank (121) may be formed on the upper region of the first side (SS1) and the upper region of the second side (SS2) of the three-dimensional structure (130).

[0272]

[0273] [Example 4]

[0274] Fig. 14 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment. Fig. 14 is a cross-sectional view taken along line BB' of the organic light-emitting display device of Fig. 8.

[0275] The fourth embodiment is identical to the third embodiment (Fig. 9) except that the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) are each perpendicular to the substrate (100). In the fourth embodiment, components having the same structure, shape, and / or function as those of the third embodiment (Fig. 9) are given the same drawing reference numerals and a detailed description thereof is omitted.

[0276] Referring to FIGS. 8 and 14, an organic light-emitting display device according to a fourth embodiment may include a substrate (100), a plurality of driving circuits (101r, 101g, 101b), a protective layer (110), a plurality of three-dimensional structures (130), a plurality of banks (120 125), a plurality of organic light-emitting elements (140r, 140g, 140b), a plurality of insulating layers (150 to 153, 160), etc.

[0277] The first side (SS1) and the second side (SS2) of the three-dimensional structure (130) may each be perpendicular to the substrate (100). For example, the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) may each be at an angle of 90 degrees to the substrate (100). In this case, the first organic light-emitting element (140r) may be arranged in the first subpixel (SPr) on the first side (SS1) of the three-dimensional structure (130), and the second organic light-emitting element (140g) may be arranged in the second subpixel (SPg) on ​​the second side (SS2) of the three-dimensional structure (130).

[0278] Since the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) are each perpendicular to the substrate (100), the occupied area of ​​the first organic light-emitting element (140r) and the occupied area of ​​the second organic light-emitting element (140g) are minimized when viewed from the front, so that an ultra-high-resolution display can be implemented.

[0279] In contrast, since the first side (SS1) and the second side (SS2) of the three-dimensional structure (130) are secured as the light-emitting areas of the first subpixel (SPr) and the second subpixel (SPg), respectively, the first color light and the second color light are sufficiently emitted forward, so that a decrease in the lifetime light emission rate can be prevented.

[0280] The transverse current leakage prevention structure illustrated in FIGS. 10a to 10c can be applied to FIG. 14.

[0281] In this case, a plurality of insulating layers (150, 150a, 151, 153, 1690, 161) may be disposed between the first organic light-emitting element (140r), the second organic light-emitting element (140g), and the third organic light-emitting element (140b). A first inorganic insulating layer (150) and a first organic insulating layer (160) may be disposed between the first organic light-emitting element (140r) and the second organic light-emitting element (140g). The first inorganic insulating layer (150) and the first organic insulating layer (160) may surround the side surfaces (SS1, SS2) of the three-dimensional structure (130).

[0282] An additional inorganic insulating layer (150a), a second organic insulating layer (161), and a second inorganic insulating layer (151) may be disposed on the three-dimensional structure (130) and the first organic insulating layer (160). A third inorganic insulating layer (153) may be disposed on the third cathode electrode (143b) of the third organic light-emitting element (140b).

[0283] Figure 15 shows the path of light in the L region of Figure 14.

[0284] The first color light emitted from the first organic light-emitting element (140r) and the second color light emitted from the second organic light-emitting element (140g) can be transmitted to the organic insulating layer (160) between the three-dimensional structure (130).

[0285] For example, the first anode electrode (141r) and the second anode electrode (141g) may include reflective electrodes. For example, the first cathode electrode (143r) and the second cathode electrode (143g) may include a translucent conductive film. In this case, the first color light or the second color light may be reflected by the reflective electrode and the conductive film and emitted forward.

[0286] Here, P1 and P2 may represent light paths. For example, the first color light may propagate laterally within the first organic light-emitting element (140r) toward the organic light-emitting layer (P1). For example, the first color light may be totally reflected upward within the first organic light-emitting element (140r) and emitted forward (P2).

[0287] That is, the first color light is emitted while constructively interfering in the direction of current flow of the first organic light-emitting element (140r), and the light totally reflected inside the first organic light-emitting element (140r) can be emitted in a direction perpendicular to the current direction along the second path (P2). In particular, by the structure illustrated in Fig. 15, the first color light can be effectively emitted upward by being reflected by the auxiliary electrode (111) connected to the first anode electrode (141r).

[0288] The organic insulating layer (160) may include light-scattering particles. In this case, light traveling along the first path (P1) may be scattered by the light-scattering particles in the organic insulating layer (160) and emitted forward. Since more light is extracted to the outside by the light-scattering particles, the light brightness may be increased.

[0289] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalency range of the embodiments are intended to be included within the scope of the embodiments.

Claims

1. A plurality of three-dimensional structures on a substrate; and comprising a plurality of pixels on the substrate, The above plurality of pixels each include a first subpixel, a second subpixel, and a third subpixel having a three-dimensional structure, The first subpixel is arranged on the first side of the three-dimensional structure, The second subpixel is arranged on the second side of the three-dimensional structure, The second subpixel is arranged to horizontally overlap the first subpixel, The third subpixel is disposed on the first subpixel and the second subpixel, The first subpixel includes a first organic light-emitting element, The second subpixel comprises a second organic light-emitting element, The third subpixel comprises a third organic light-emitting element, Organic light emitting display device.

2. In paragraph 1, The third subpixel is arranged on the upper surface of the three-dimensional structure, Organic light emitting display device.

3. In paragraph 2, The second organic light-emitting element is arranged to horizontally overlap the first organic light-emitting element, The third organic light-emitting element is arranged on the upper surface of the three-dimensional structure. Organic light emitting display device.

4. In paragraph 3, The first organic light-emitting element, the second organic light-emitting element and the third organic light-emitting element each include an anode electrode, a low-resistance layer, an organic light-emitting layer and a cathode electrode, The anode electrode is independently arranged in the first subpixel, the second subpixel and the third subpixel. Organic light emitting display device.

5. In paragraph 4, The low-resistance layer of the first organic light-emitting element and the low-resistance layer of the second organic light-emitting element are spaced apart from each other between the plurality of three-dimensional structures, The first organic light-emitting layer of the first organic light-emitting element and the second organic light-emitting layer of the second organic light-emitting element are arranged to vertically overlap between the plurality of three-dimensional structures. Organic light emitting display device.

6. In paragraph 4, The low resistance layer, the organic light emitting layer and the cathode electrode of the first organic light emitting element and the low resistance layer, the organic light emitting layer and the cathode electrode of the second organic light emitting element are spaced apart from each other on the upper surface of the three-dimensional structure. Organic light emitting display device.

7. In paragraph 4, The first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element include a reflective metal, The first cathode electrode of the first organic light-emitting element and the second cathode electrode of the second organic light-emitting element include a transparent or translucent conductive film. Organic light emitting display device.

8. In paragraph 1, The third subpixel is arranged on the first subpixel and the second subpixel between the plurality of three-dimensional structures. Organic light emitting display device.

9. In paragraph 8, The size of the above pixel is the same as the size of the third subpixel. Organic light emitting display device.

10. In paragraph 8, The size of the above pixel is equal to the sum of the size of the first subpixel and the size of the second subpixel. Organic light emitting display device.

11. In paragraph 8, The second organic light-emitting element is arranged to horizontally overlap the first organic light-emitting element, The third organic light-emitting element is arranged to vertically overlap the first organic light-emitting element and the second organic light-emitting element. Organic light emitting display device.

12. In paragraph 8, The first organic light-emitting element, the second organic light-emitting element and the third organic light-emitting element each include an anode electrode, an organic light-emitting layer and a cathode electrode, The anode electrode is independently arranged in the first subpixel, the second subpixel and the third subpixel, The cathode electrode is commonly arranged in the first subpixel and the second subpixel. Organic light emitting display device.

13. In paragraph 12, The first subpixel, the second subpixel and the third subpixel each include a light-emitting region and a non-light-emitting region, The above-mentioned luminescent area has a size corresponding to the anode electrode, Organic light emitting display device.

14. In paragraph 13, The size of the third anode electrode of the third organic light-emitting element is larger than the size of the first anode electrode of the first organic light-emitting element or the size of the second anode electrode of the second organic light-emitting element. Organic light emitting display device.

15. In paragraph 13, The third anode electrode of the third organic light-emitting element vertically overlaps the first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element. Organic light emitting display device.

16. In paragraph 12, The end of the organic light-emitting layer of the first organic light-emitting element and the end of the organic light-emitting layer of the second organic light-emitting element are positioned lower than the upper surface of the three-dimensional structure. Organic light emitting display device.

17. In paragraph 1, a plurality of first banks between the plurality of three-dimensional structures; and comprising a plurality of second banks between the plurality of third subpixels; Organic light emitting display device.

18. In paragraph 17, The distance between the plurality of second banks is equal to the width of the pixel or the width of the third subpixel. Organic light emitting display device.

19. In paragraph 1, A plurality of insulating layers are included between the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element; The above multiple insulating layers include at least one organic insulating layer and at least one inorganic insulating layer. Organic light emitting display device.

20. In paragraph 1, The first side and the second side of the three-dimensional structure are respectively inclined or perpendicular to the ground, Organic light emitting display device.

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