Display panel and manufacturing method therefor, and display device

Abstract

The present disclosure provides a display panel and a manufacturing method therefor, and a display device. The display panel comprises a display area and a frame area located on at least one side of the display area. The frame area comprises: a substrate; a first insulating layer, arranged on one side of the substrate and extending from the display area to the frame area; and multiple groups of metal wires, sequentially arranged in the direction away from the display area, the metal wires comprising a first area and a second area, the orthographic projections of the metal wires in the first area on the first insulating layer overlapping the first insulating layer, and the first insulating layer being not arranged on the side of the metal wires in the second area close to the substrate. The distance between the metal wire closest to the second area in the first area and the metal wire closest to the first area in the second area is d1, and the distance between adjacent metal wires located in the first area is d2, wherein 10d2≥d1≥1.5d2.

Description

Display panel, manufacturing method thereof, and display device

[0001] This disclosure claims priority to Chinese patent application No. 202311628616.9 filed on November 30, 2023, entitled “Display panel, manufacturing method thereof, and display device”, the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0002] The present disclosure relates to the field of display technology, and more particularly, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0003] With the development of organic light-emitting diodes (OLEDs), narrower bezels for display devices are becoming increasingly popular. However, under these narrow bezels, there is a step difference under the touch traces, for example, where there is no organic layer filling the area. The organic layer is typically formed using inkjet printing (IJP) technology.

[0004] Summary of the Invention

[0005] An object of the present disclosure is to provide a display panel.

[0006] In one aspect of the present disclosure, a display panel is provided. According to an embodiment of the present disclosure, the display panel includes a display area and a frame area located on at least one side of the display area, the frame area including: a substrate; a first insulating layer, the first insulating layer being disposed on one side of the substrate and extending from the display area to the frame area; a plurality of groups of metal traces, the plurality of groups of metal traces being located on a side of the first insulating layer away from the substrate and arranged sequentially in a direction away from the display area, the metal traces including a first area and a second area, the first area being located between the display area and the second area, the orthographic projections of the metal traces in the first area on the first insulating layer having an overlapping area with the first insulating layer, the first insulating layer not being disposed on a side of the metal traces in the second area close to the substrate, the spacing between the metal traces in the first area closest to the second area and the metal traces in the second area closest to the first area being d1, and the spacing between adjacent metal traces in the first area being d2, wherein 10d2≥d1≥1.5d2.

[0007] According to an embodiment of the present disclosure, 20 micrometers ≥ d1 ≥ 4.1 micrometers.

[0008] According to an embodiment of the present disclosure, 20 micrometers ≥ d1 ≥ 7 micrometers.

[0009] According to an embodiment of the present disclosure, each group of metal traces includes at least one metal layer.

[0010] According to an embodiment of the present disclosure, the display panel also includes: a second insulating layer, the second insulating layer is arranged on a side of the first insulating layer away from the substrate, each group of the metal traces includes a first metal layer and a second metal layer, the second metal layer is arranged on a side of the second insulating layer away from the substrate, the first metal layer is arranged on a side of the second insulating layer close to the substrate, and the first metal layer of the first area is located between the first insulating layer and the second insulating layer, and the orthographic projection of the second metal layer on the substrate overlaps with the orthographic projection of the first metal layer on the substrate.

[0011] According to an embodiment of the present disclosure, an orthographic projection of the second metal layer on the substrate substantially overlaps with an orthographic projection of the first metal layer on the substrate.

[0012] According to an embodiment of the present disclosure, at least for the metal routing located in the first zone closest to the second zone, and the metal routing located in the second zone closest to the first zone, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection.

[0013] According to an embodiment of the present disclosure, a distance between an edge line of the first orthographic projection and an edge line of the second orthographic projection is greater than or equal to 1.2 micrometers.

[0014] According to an embodiment of the present disclosure, a distance d4 between the second metal layer in the metal trace in the first region closest to the second region and the second metal layer in the metal trace in the second region closest to the first region is greater than the distance d1.

[0015] According to an embodiment of the present disclosure, the first metal routing satisfies the following conditions: only for the metal routing located in the first area closest to the second area and the metal routing located in the second area closest to the first area, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection.

[0016] According to an embodiment of the present disclosure, the first metal routing satisfies the following conditions: for all the metal routings, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection, and the widths of all the second metal layers are the same.

[0017] According to an embodiment of the present disclosure, the first metal routing satisfies the following conditions: for all the metal routings, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection; the width of the second metal layer in the metal routing in the first area gradually decreases in the direction from the display area to the second area; and the width of the second metal layer in the metal routing in the second area gradually increases in the direction from the first area to the edge of the display panel.

[0018] According to an embodiment of the present disclosure, at least for the metal routing located in the first area closest to the second area and the metal routing located in the second area closest to the first area, the orthographic projection of the second metal layer on the substrate is close to the edge line of the display area and is located inside the orthographic projection of the first metal layer on the substrate, and the orthographic projection of the first metal layer on the substrate is away from the edge line of the display area and is located inside the orthographic projection of the second metal layer on the substrate.

[0019] According to an embodiment of the present disclosure, the orthographic projection of the second metal layer in the metal routing in the first area closest to the second area on the substrate does not overlap with the orthographic projection of the first metal layer in the metal routing in the second area closest to the first area on the substrate.

[0020] According to an embodiment of the present disclosure, the display panel also includes: a second insulating layer, the second insulating layer is arranged on a side of the first insulating layer away from the substrate, the metal wiring includes a first metal layer and a second metal layer, and the first metal layer and the second metal layer are arranged on the same layer and are located on a side of the second insulating layer close to the first insulating layer.

[0021] According to an embodiment of the present disclosure, the metal wiring farthest from the display area is not electrically connected to the remaining metal wirings.

[0022] In another aspect of the present disclosure, the present disclosure provides another display panel, which includes a display area and a frame area located on at least one side of the display area, the frame area including: a substrate; a first insulating layer, the first insulating layer is arranged on one side of the substrate and extends from the display area to the frame area; multiple groups of metal traces, the multiple groups of metal traces are located on a side of the first insulating layer away from the substrate, and are arranged in sequence in a direction away from the display area, and the orthographic projections of all the metal traces on the first insulating layer are located within the first insulating layer.

[0023] In another aspect of the present disclosure, the present disclosure provides a method for preparing the display panel described above, wherein the display panel includes a display area and a frame area located on at least one side of the display area, and the method for preparing the display panel includes the step of preparing the frame area, including: providing a substrate; forming a first insulating layer, wherein the first insulating layer is on one side of the substrate and extends from the display area to the frame area; forming multiple groups of metal traces, wherein the multiple groups of metal traces are located on a side of the first insulating layer away from the substrate and are arranged in sequence along a direction away from the display area, wherein the metal traces include a first area and a second area, wherein the first area is located between the display area and the second area, and the orthographic projection of the metal traces in the first area on the first insulating layer has an overlapping area with the first insulating layer, and the first insulating layer is not provided on the side of the metal traces in the second area close to the substrate, the spacing between the metal traces in the first area closest to the second area and the metal traces in the second area closest to the first area is d1, and the spacing between adjacent metal traces in the first area is d2, wherein 10d2≥d1≥1.5d2.

[0024] According to an embodiment of the present disclosure, the method for preparing a display panel also includes: forming a second insulating layer, the second insulating layer is formed on a side of the first insulating layer away from the substrate, the metal wiring includes a first metal layer and a second metal layer, wherein the second metal layer is formed on a side of the second insulating layer away from the substrate, the first metal layer is formed on a side of the second insulating layer close to the substrate, and the first metal layer of the first area is located between the first insulating layer and the second insulating layer, the orthographic projection of the second metal layer on the substrate overlaps with the orthographic projection of the first metal layer on the substrate, or, the first metal layer and the second metal layer are arranged on the same layer and are located on the side of the second insulating layer close to the first insulating layer.

[0025] In another aspect of the present disclosure, a display device is provided. According to an embodiment of the present disclosure, the display device includes: a power supply component and the display panel described above, wherein the power supply component is configured to supply power to the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present disclosure will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0027] FIG1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

[0028] FIG2 is a schematic diagram of a planar structure between the metal trace and the first insulating layer in FIG1 ;

[0029] FIG3 is a schematic structural diagram of a display panel in the prior art;

[0030] FIG4 is a scanning electron microscope image of a portion of the structure in FIG3 ;

[0031] FIG5 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0032] FIG6 is a schematic diagram of a planar structure between the metal trace and the first insulating layer in FIG5 ;

[0033] FIG7 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0034] FIG8 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0035] FIG9 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0036] FIG10 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0037] FIG11 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0038] FIG12 is a schematic structural diagram of a display panel in another embodiment of the present disclosure;

[0039] FIG13 is a schematic flow chart of a method for preparing a display panel in another embodiment of the present disclosure;

[0040] FIG14 is a schematic diagram of a structural process for preparing a display panel in another embodiment of the present disclosure;

[0041] FIG15 is a schematic structural diagram of a display device in yet another embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] The scheme of the present disclosure will be explained below in conjunction with the examples. Those skilled in the art will understand that the following examples are only used to illustrate the present disclosure and should not be considered to limit the scope of the present disclosure. Where specific techniques or conditions are not specified in the examples, they are carried out according to the techniques or conditions described in the literature in this area or according to the product instructions. Where the manufacturer of the reagents or instruments is not specified, they are all conventional products that can be obtained commercially.

[0043] The present disclosure is described below with reference to specific embodiments. It should be noted that these embodiments are merely illustrative and do not limit the present disclosure in any way.

[0044] In one aspect of the present disclosure, the present disclosure provides a display panel. According to an embodiment of the present disclosure, referring to Figures 1 and 2, the display panel includes a display area and a frame area located on at least one side of the display area. The frame area includes: a substrate 100, a first insulating layer 210, and a plurality of groups of metal traces 300. The first insulating layer 210 is provided on one side of the substrate 100, and the first insulating layer 210 extends from the display area to the frame area. Each group of metal traces 300 includes at least one metal layer, such as a first metal layer 310 and a second metal layer 320. The plurality of groups of metal traces 300 are located on a side of the first insulating layer 210 away from the substrate 100, and are arranged in sequence in a direction away from the display area, that is, the plurality of groups of metal traces 300 are arranged in sequence in a direction from the display area to the frame area.

[0045] As shown in Figure 1, the metal trace 300 includes a first area S1 and a second area S2, wherein the first area S1 is located between the display area and the second area S2. The orthographic projection of the metal trace 300 in the first area S1 on the first insulating layer 210 overlaps with the first insulating layer 210. The first insulating layer 210 is not provided on the side of the metal trace 300 in the second area S2 close to the substrate 100 (i.e., directly below the metal trace 300), that is, the metal trace 300 in the second area S2 has no orthographic projection on the first insulating layer 210. In other words, the orthographic projection of the metal trace 300 in the second area S2 on the substrate does not overlap with the orthographic projection of the first insulating layer on the substrate. In addition, the spacing between the metal trace 300 in the first area S1 closest to the second area S2 and the metal trace 300 in the second area S2 closest to the first area S1 is d1, and the spacing between the metal traces in the first area S1 is d2. Among them, the spacing d1 and the spacing d2 satisfy: 10d2≥d1≥1.5d2, such as d1=1.5d2, d1=2d2, d1=3d2, d1=4d2, d1=5d2, d1=6d2, d1=7d2, d1=8d2, d1=9d2 or d1=10d2, etc.

[0046] The display panel provided by the embodiment of the present disclosure increases the distance between two adjacent metal traces in the first and second zones (i.e., the metal trace 300 located in the first zone S1 closest to the second zone S2 and the metal trace 300 located in the second zone S2 closest to the first zone S1). This allows the traces to remain non-contact even if there is a certain amount of metal residue in the gap between the two traces. This effectively prevents short circuits between the two adjacent metal traces in the first and second zones, thereby effectively improving the display quality of the display panel. Furthermore, the aforementioned design requirement of 10d2 ≥ d1 ≥ 1.5d2 effectively prevents short circuits between the two adjacent metal traces in the first and second zones without significantly affecting the width of the border area, thereby still achieving a narrow border design for the display panel. Furthermore, since metal shavings are typically not generated between adjacent metal traces in the first zone and between adjacent metal traces in the second zone, there is no need to increase the spacing between adjacent metal traces in the first zone and between adjacent metal traces in the second zone. A relatively small spacing can still be maintained, thus contributing to a narrow border design for the display panel.

[0047] It is understood that in the embodiments of the present disclosure, in the above definition of the first and second regions, the first region includes the gaps between metal traces in the first region, as well as the gaps between the metal trace 300 located in the first region S1 closest to the second region S2 and the metal trace 300 in the second region S2 closest to the first region S1 (i.e., the gap corresponding to the spacing d1). The second region includes the gaps between metal traces in the second region.

[0048] In some embodiments, the spacing between two adjacent metal traces in the display panel is generally the same, i.e., d1=d2, and the spacing is approximately 2.5 microns. Referring to Figures 3 and 4, for two adjacent metal traces in the first and second regions, since the metal traces in the first region are at the end of the first insulating layer, the step difference generated by the first insulating layer easily causes the two adjacent metal traces to connect, thereby causing a short circuit. In particular, in the scheme where the first metal layer and the second metal layer are layered, due to process reasons and other factors, the second metal layer located on the upper layer (both the first metal layer and the first insulating layer have step differences) is easily left in the gap between the two adjacent metal traces during the preparation process, for example, when the metal layer is patterned. Metal shavings (such as the dotted box in Figure 3 and the oval box in Figure 4) are left. This causes the two adjacent metal traces to connect and cause a short circuit. However, very little or no metal shavings are usually left between the first metal layers located on the lower layer, and no short circuit problem is caused. In summary, the short circuit problem caused by the metal scrap residue is usually caused by the second metal layer at the step difference of the first insulating layer in the first area. The technical solution provided by the embodiment of the present disclosure can effectively solve the above technical problem and prevent the occurrence of short circuit.

[0049] According to some embodiments of the present disclosure, there are no special requirements for the specific structure of the above-mentioned substrate, and those skilled in the art can flexibly select it based on the actual situation such as the specific product type of the display panel. In some embodiments, the substrate includes a substrate; a buffer layer, a thin film transistor and a plurality of signal lines. The buffer layer is arranged on one side of the substrate. The thin film transistor is arranged on the side of the buffer layer away from the substrate. In addition, the thin film transistor includes a source electrode, a gate electrode and a drain electrode, and the specific structure of the thin film transistor can be a top gate structure or a bottom gate structure. The various signal lines can include data signal lines, gate lines, power lines and ground lines, and the data signal lines, gate lines, power lines and ground lines can be arranged on the same layer as structures such as the source electrode or gate electrode.

[0050] According to some embodiments of the present disclosure, as shown in FIG. 1 , as described above, the orthographic projection of the metal trace 300 in the first region S1 on the first insulating layer 210 overlaps with the first insulating layer 210 . Specifically, the orthographic projection of the first portion 01 of the metal trace 300 located closest to the second region S2 in the first region S1 on the first insulating layer 210 is located within the first insulating layer 210 , and the orthographic projection of the second portion 02 of the metal trace 300 (the portion close to the second region S2 ) on the first insulating layer 210 does not overlap with the first insulating layer 210 . There are no specific requirements for the proportions of the first portion 01 and the second portion 02 in the metal trace 300 , and those skilled in the art can flexibly design the proportions based on actual needs. With the exception of the metal trace 300 located closest to the second region S2 in the first region S1 , the orthographic projections of the other metal traces 300 in the first region on the first insulating layer 210 are all located within the first insulating layer 210 .

[0051] According to some embodiments of the present disclosure, the spacing d1 may satisfy the following: 20 μm ≥ d1 ≥ 4.1 μm. For example, d1 is 4.1 μm, 4.2 μm, 4.5 μm, 4.8 μm, 5.0 μm, 5.2 μm, 5.5 μm, 5.8 μm, 6 μm, 6.3 μm, 6.5 μm, 6.8 μm, 7 μm, 7.2 μm, 7.5 μm, 7.7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, or 20 μm.

[0052] This spacing effectively prevents residual metal shavings from electrically connecting the metal trace 300 located in the first area S1 closest to the second area S2 with the metal trace 300 located in the second area S2 closest to the first area S1, thereby preventing a short circuit between the two. Furthermore, this spacing design still meets the display panel's design requirements for a narrow bezel area.

[0053] Furthermore, in some specific embodiments, the distance d1 may satisfy the following relationship: 20 microns ≥ d1 ≥ 7 microns. This can better prevent short circuits and increase product yield.

[0054] According to some embodiments of the present disclosure, as shown in FIG1 , the display panel further includes a second insulating layer 220, which is disposed on a side of the first insulating layer 210 away from the substrate 100. The metal trace 300 includes a first metal layer 310 and a second metal layer 320. The second metal layer 320 is disposed on a side of the second insulating layer 220 away from the substrate 100, and the first metal layer 310 is disposed on a side of the second insulating layer 220 closer to the substrate 100. Furthermore, the first metal layer 310 in the first region S1 is located between the first insulating layer 210 and the second insulating layer 220, and the orthographic projection of the second metal layer 320 on the substrate 100 overlaps with the orthographic projection of the first metal layer 310 on the substrate 100.

[0055] By arranging the first metal layer and the second metal layer in layers, it is possible to effectively ensure good working performance of the metal wiring and effectively avoid short circuits between the two second metal layers in two adjacent metal wirings in the first area and the second area.

[0056] There are no special requirements for the specific materials of the first insulating layer and the second insulating layer, and the material of the first insulating layer and the material of the second insulating layer can be the same or different. Those skilled in the art can flexibly select applicable materials in the prior art according to actual conditions. In some embodiments, the first insulating layer can be a flat layer extending from the display area, and its forming material can be an organic material (such as acrylic insulating organic material, etc.) or an inorganic material, such as silicon nitride, silicon oxide or silicon oxynitride. The material of the second insulating layer can be an organic material (such as acrylic insulating organic material, etc.) or an inorganic material, such as silicon nitride, silicon oxide or silicon oxynitride.

[0057] In another aspect of the present disclosure, the present disclosure provides another display panel. According to an embodiment of the present disclosure, referring to Figures 5 and 6, according to an embodiment of the present disclosure, referring to Figures 5 and 6, the display panel includes a display area and a frame area located on at least one side of the display area. The frame area includes: a substrate 100, a first insulating layer 210, and a plurality of groups of metal traces 300. The first insulating layer 210 is provided on one side of the substrate 100, and the first insulating layer 210 extends from the display area to the frame area. Each group of metal traces 300 includes at least one metal layer, such as a first metal layer 310 and a second metal layer 320. The plurality of groups of metal traces 300 are located on a side of the first insulating layer 210 away from the substrate 100, and are arranged in sequence in a direction away from the display area, that is, the plurality of groups of metal traces 300 are arranged in sequence in a direction from the display area to the frame area.

[0058] Furthermore, in this embodiment, the orthographic projections of all metal traces 300 on the first insulating layer 210 are located within the first insulating layer 210. This means that all metal traces are located in the first region, and the number of metal traces in the second region is zero. This further extends the first insulating layer away from the display region, eliminating the step differences caused by the first insulating layer in the first region. The absence of step differences prevents metal shavings from remaining (i.e., no or minimal metal shavings remain), further improving the problem of short circuits in the second metal layer and increasing product yield.

[0059] According to some embodiments of the present disclosure, referring to Figures 1 and 5, the orthographic projection of the second metal layer 320 on the substrate 100 substantially overlaps with the orthographic projection of the first metal layer 310 on the substrate 100. That is, the first metal layer and the second metal layer have substantially the same shape and substantially the same size. In this way, the same mask can be used when preparing the first metal layer and the second metal layer, thereby speeding up the preparation rate and reducing the preparation cost. At this time, the spacing d1 between the metal trace 300 closest to the second zone S2 in the first region S1 and the metal trace 300 closest to the first zone S1 in the second region S2 is: the spacing between the first metal layer in the metal trace 300 closest to the second zone S2 in the first region S1 and the first metal layer in the metal trace 300 closest to the first zone S1 in the second region S2. In other words, the above spacing d1 may refer to the spacing between the first metal layers in two adjacent groups of metal traces 300.

[0060] According to some embodiments of the present disclosure, referring to Figures 7, 8, and 9, at least for the metal trace 300 located in the first zone S1 closest to the second zone S2 and the metal trace 300 located in the second zone S2 closest to the first zone S1, the first orthographic projection of the second metal layer 320 on the substrate 100 is located within the second orthographic projection of the first metal layer 310 on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection. In other words, the second metal layer 320 is retracted relative to the first metal layer 310, reducing its size. This further increases the spacing d4 between the second metal layer 320 in the metal trace 300 located in the first zone S1 closest to the second zone S2 and the second metal layer 320 in the metal trace 300 located in the second zone S2 closest to the first zone S1. This further avoids short circuits caused by residual metal chips and improves product yield. Furthermore, compared to the structure in Figure 1, this does not affect the bezel width, which still meets the narrow bezel design requirements of display panels.

[0061] It will be appreciated that in FIG7 , only the second metal layer 320 of the metal trace 300 located in the first region S1 closest to the second region S2 and the second metal layer 320 of the metal trace 300 located in the second region S2 closest to the first region S1 are retracted. In FIG8 , the second metal layer 320 of all metal traces 300 is retracted, i.e., the second metal layer 320 of all metal traces 300 has the same size, which reduces the difficulty of the manufacturing process.

[0062] Optionally, in some embodiments of the present disclosure, referring to Figures 7, 8 and 9, the distance d3 between the edge line of the first orthographic projection of the second metal layer 320 on the substrate and the edge line of the second orthographic projection of the first metal layer 310 on the substrate (i.e., the unilaterally retracted dimension of the second metal layer 320 in the first area) is greater than or equal to 1.2 microns.

[0063] In this way, there is sufficient room in the process to design the above-mentioned retracted structure of the second metal layer, which facilitates the implementation of the manufacturing process without affecting the working performance of the second metal layer. Furthermore, according to the above description, in this structure, due to the retracted configuration of the above-mentioned second metal layer 320, the spacing d4 between the second metal layer 320 in the metal trace 300 located in the first region S1 closest to the second region S2 and the second metal layer 320 in the metal trace 300 located in the second region S2 closest to the first region S1 is greater than d1, and d4 is greater than d2. The size relationship between d1 and d2 is determined by the size value of d3.

[0064] Optionally, in some embodiments of the present disclosure, referring to FIG7 , only for the metal trace 300 located in the first region S1 closest to the second region S2 and the metal trace 300 located in the second region S2 closest to the first region S1, the first orthographic projection of the second metal layer 320 on the substrate 100 is located within the second orthographic projection of the first metal layer 310 on the substrate 100, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection. In other words, only the width of the second metal layer 320 in the metal trace 300 located in the first region S1 closest to the second region S2 and the width of the second metal layer 320 in the metal trace 300 located in the second region S2 closest to the first region S1 are reduced, so that they are retracted relative to the first metal layer 310. That is, the width of the second metal layer 320 in the metal trace 300 in the first area S1 closest to the second area S2 is smaller than the width of the second metal layer 320 in other metal traces 300 in the first area S1, and is also smaller than the width of the second metal layer 320 in the metal trace 300 in the second area S2.

[0065] In this way, the distance d4 between the second metal layer 320 in the metal trace 300 located in the first zone S1 closest to the second zone S2 and the second metal layer 320 in the metal trace 300 located in the second zone S2 closest to the first zone S1 can be further increased, thereby further avoiding short circuit problems caused by residual metal chips and improving product yield. Moreover, compared with the structure in Figure 1, it does not affect the width of the frame, that is, it still helps to meet the design requirements of the display panel for a narrow frame. In this embodiment, for the remaining metal traces 300, the orthographic projection of the first metal layer 310 on the substrate 100 can overlap with the orthographic projection of the first metal layer 310 on the substrate 100.

[0066] Optionally, in some embodiments of the present disclosure, referring to FIG8 , the width of all second metal layers 320 in the border area is reduced, and all second metal layers 320 have the same width. This further avoids short circuits caused by residual metal chips and improves product yield. Because the second metal layers have the same dimensions, the manufacturing process can be simplified. Furthermore, compared to the structure in FIG1 , this does not affect the border width, meaning it still meets the narrow border design requirements of the display panel.

[0067] Optionally, in some embodiments of the present disclosure, referring to FIG9 , for all metal traces 300 , the first orthographic projection of the second metal layer 320 on the substrate 100 is located within the second orthographic projection of the first metal layer 310 on the substrate 100 , and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection. However, the width of the second metal layer 320 in the metal trace 300 in the first region S1 gradually decreases in the direction from the display area to the second region S2 , that is, the unilaterally retracted dimension d3 of the second metal layer in the first region gradually increases. For example, the width of the second metal layer 320 in the metal trace 300 closest to the second region S2 in the first region S1 is half of the width of the first metal layer 310 in the corresponding metal trace 300. In contrast, the width of the second metal layer 320 in the metal trace 300 in the second region S2 gradually increases in the direction from the first region S1 to the edge of the display substrate. For example, the width of the second metal layer 320 in the metal trace 300 in the second region S2 closest to the first region S1 is half of the width of the first metal layer 310 in the corresponding metal trace 300.

[0068] This allows for sufficient process flexibility to design the retracted structure of the second metal layer, facilitating fabrication without compromising the performance of the second metal layer. Setting the width of the second metal layer further prevents short circuits caused by residual metal shavings, improving product yield. Furthermore, compared to the structure in Figure 1, this design does not affect the bezel width, effectively meeting the narrow bezel design requirements of display panels.

[0069] According to some embodiments of the present disclosure, referring to FIG. 10 , to better address the aforementioned short circuit issue, at least the second metal layer 320 in the metal trace 300 closest to the second zone S2 in the first zone S1 and the second metal layer 320 in the metal trace 300 closest to the first zone S1 in the second zone S2 may be offset relative to the first metal layer 310. Specifically, in some embodiments, the orthographic projection of the second metal layer 320 on the substrate 100 is located near the edge line I of the display area and within the orthographic projection of the first metal layer 310 on the substrate 100, and the orthographic projection of the first metal layer 310 on the substrate 100 is located away from the edge line K of the display area and within the orthographic projection of the second metal layer 320 on the substrate 100. In other words, the second metal layer 320 is shifted a certain distance away from the display area relative to the first metal layer 310, so that the second metal layer 320 in the metal trace 300 closest to the second zone S2 in the first zone S1 is away from the edge line J of the display area and falls within the first groove 201 of the second insulating layer 220. The first groove 201 refers to a groove formed by the second insulating layer 220 between the metal trace 300 located closest to the second region S2 in the first region S1 and the metal trace 300 located closest to the first region S1 in the second region S2. In other words, as shown in FIG10 , the first groove 201 refers to a groove formed by the metal trace 300 located closest to the second region in the first region S1 and the second insulating layer 220.

[0070] Thus, even if metal chips are generated in the second metal layer 320 of the metal trace 300 located in the first region S1 closest to the second region S2 (indicated by the dotted circle in FIG. 10 ), the presence of the first groove 201 and the staggered arrangement of the second metal layer 320 in the metal trace 300 located in the second region S2 closest to the first region S1 prevent the metal chips from passing through the first groove 201. Furthermore, the metal chips are prevented from contacting the second metal layer 320 in the metal trace 300 located in the second region S2 closest to the first region S1, thereby preventing a short circuit.

[0071] Optionally, as shown in FIG10 , the width of the first groove 201 in the first region S1 is greater than the width of the second groove 202. The second groove 202 is a groove formed by other metal traces 300 and the second insulating layer 220 in the first region S1. As described above, this configuration can better avoid short circuit issues.

[0072] Optionally, as shown in FIG10 , the orthographic projection of the second metal layer 320 in the metal trace 300 located in the first region closest to the second region on the substrate 100 does not overlap with the orthographic projection of the first metal layer 310 in the metal trace located in the second region closest to the first region on the substrate 100. As described above, this arrangement can better avoid short circuit issues.

[0073] According to some embodiments of the present disclosure, the above-mentioned first metal layer 310 and second metal layer 320 are both arranged in a double-layer position. As mentioned above, no metal chips will remain between the first metal layer 310 located below or only a small amount of metal chips will remain. According to some embodiments of the present disclosure, referring to Figure 11, the first metal layer 310 and the second metal layer 320 are arranged in the same layer, and are located on the side of the second insulating layer 220 close to the first insulating layer 210. That is to say, the second metal layer 320 is also arranged at the same layer position as the first metal layer 310. In this way, the short circuit problem between adjacent metal layers can still be avoided. Among them, the spacing between the first metal layer 310 and the second metal layer 320 can be flexibly adjusted, as long as there is no short circuit. At the same time, the design of a narrow frame can also be considered, and the width design of d2 between the metal layers is retained.

[0074] According to some embodiments of the present disclosure, referring to Figures 1 and 5 to 12, the second area S2 may include one or two groups of metal traces 300. This allows the first insulating layer 210 to have an appropriate length in the border area, helping to improve the performance of the display panel. In some embodiments, the second area S2 may include two groups of metal traces 300, i.e., the two groups of metal traces 300 that are farthest from the display area. In other embodiments, the second area S2 may include only one group of metal traces 300, i.e., only the group of metal traces 300 that is farthest from the display area.

[0075] According to some embodiments of the present disclosure, referring to Figures 1 and 5 to 12, the metal trace 300 farthest from the display area (i.e., the metal trace 300 at the extreme edge of the frame area, i.e., the metal trace in the dotted box in Figure 12) is not electrically connected to the remaining metal traces. In this way, the metal trace 300 farthest from the display area (i.e., the metal trace 300 at the extreme edge of the frame area) can serve as a shielding protection metal wire to prevent the external environment from interfering with the electrical signals of other metal traces.

[0076] According to some embodiments of the present disclosure, the display panel can be applied to a touch display device, which also includes a touch panel. The metal trace 300 can be provided on the same layer as the touch electrodes in the touch panel, for example, the metal trace 300 can be provided on the same layer as the touch electrodes TX or RX in the touch panel.

[0077] According to some embodiments of the present disclosure, the above-mentioned border area of ​​the present disclosure is located on at least one side of the display area, and multiple touch electrodes TX or touch electrodes RX are distributed in the first direction of the display area. For example, the border area is located below the display area, and multiple touch electrodes TX (such as TX0, TX1, TX2, TX3, ..., TX14, TX15, etc.) are distributed in the first direction of the display area. There are no special requirements for the specific positions of the multiple touch electrodes TX corresponding to the gap between the metal trace 300 in the first area S1 closest to the second area S2 and the metal trace 300 in the second area S2 closest to the first area S1. Those skilled in the art can flexibly select them according to actual circumstances. In some embodiments, the gap between the metal trace 300 in the first area S1 closest to the second area S2 and the metal trace in the second area S2 closest to the first area S1 corresponds to the touch electrode TX12.

[0078] In another aspect of the present disclosure, a method for preparing the aforementioned display panel is provided. The display panel includes a display area and a frame area located on at least one side of the display area. Referring to Figures 13 and 14 , the method for preparing the display panel includes the step of preparing the frame area. The step of preparing the frame area includes:

[0079] S100: providing a substrate 100.

[0080] S200 : forming a first insulating layer 210 , wherein the first insulating layer 210 is on one side of the substrate 100 and extends from the display area to the frame area.

[0081] S300: forming a plurality of groups of metal traces 300, wherein the plurality of groups of metal traces 300 are located on a side of the first insulating layer 210 away from the substrate 100, and are arranged in sequence in a direction away from the display area, the metal traces 300 are divided into a first area S1 and a second area S2, the first area S1 is located between the display area and the second area S2, the orthographic projection of the metal traces 300 of the first area S1 on the first insulating layer 210 has an overlapping area with the first insulating layer 210, the first insulating layer 210 is not provided on a side of the metal traces 300 of the second area SS2 close to the substrate 100, the spacing between the metal traces 300 located in the first area S1 closest to the second area S2 and the metal traces located in the second area S2 closest to the first area S1 is d1, and the spacing between two adjacent first metal layers in the metal traces located in the first area is d2, wherein 10d2≥d1≥1.5d2.

[0082] According to an embodiment of the present disclosure, in the above-mentioned preparation process, by increasing the distance between the two adjacent metal traces in the first area and the second area, even if there is a certain amount of metal residue in the gap between the two, a non-contact state can still be maintained. In this way, a short circuit between the two adjacent metal traces in the first area and the second area can be effectively prevented, thereby improving the preparation yield and productivity.

[0083] Optionally, each group of metal traces 300 includes at least one metal layer.

[0084] According to an embodiment of the present disclosure, referring to FIG. 14 and FIG. 11 , the method for preparing a display panel further includes: forming a second insulating layer 220, the second insulating layer 220 being formed on a side of the first insulating layer 210 away from the substrate 100, and the metal trace 300 including a first metal layer 310 and a second metal layer 320. In this case, the first metal layer 310 and the second metal layer 320 can be arranged in two ways: a first double-layer arrangement and a second single-layer arrangement. Specifically:

[0085] Referring to Figure 14 , the second metal layer 320 is formed on the side of the second insulating layer 220 away from the substrate 100, and the first metal layer 310 is formed on the side of the second insulating layer 220 closer to the substrate 100. Furthermore, the first metal layer 310 in the first region S1 is located between the first insulating layer 210 and the second insulating layer 220, and the orthographic projection of the second metal layer 320 on the substrate 100 overlaps with the orthographic projection of the first metal layer 310 on the substrate 100. The specific configuration requirements for the first metal layer 310 and the second metal layer 320 can be found in Figures 1, 4 to 10, and the above description, and will not be detailed here again.

[0086] Referring to Figure 11, the first metal layer 310 and the second metal layer 320 are arranged in the same layer and are located on the side of the second insulating layer 220 close to the first insulating layer 210. In other words, the second metal layer is also arranged in the same layer as the first metal layer. In this way, the short circuit problem between adjacent metal layers can still be avoided. Among them, the spacing between the first metal layer and the second metal layer can be flexibly adjusted as long as it does not cause a short circuit. At the same time, a narrow frame design can also be considered, and the width design of d2 between the metal layers is retained.

[0087] In another aspect of the present disclosure, a display device is provided. According to an embodiment of the present disclosure, the display device includes the display panel 100 described above. As a result, the display device has high reliability and good display quality. Those skilled in the art will appreciate that the display device has all the features and advantages of the display panel described above, and no further details will be given here. As shown in Figure 15, the display device also includes a power supply component 000, which is used to power the display panel 100.

[0088] According to the embodiments of the present disclosure, there is no special requirement for the specific type of the display device, and those skilled in the art can flexibly select the type according to actual conditions. For example, the display device can be any display device with a display function, such as a mobile phone, computer, iPad, Kindle, or game console.

[0089] Those skilled in the art will appreciate that, in addition to the display panel described above, the display device also includes the necessary structures or components of a conventional display device. For example, in a mobile phone, in addition to the display panel, it also includes a cover plate, touch panel, fingerprint sensor assembly, audio module, camera module, CPU, battery, back cover, and mid-frame, among other necessary structures or components of a mobile phone.

[0090] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and features of different embodiments or examples, unless they are mutually inconsistent.

[0092] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and are not to be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A display panel, comprising a display area and a frame area located on at least one side of the display area, wherein the frame area comprises: substrate; A first insulating layer, which is disposed on one side of the substrate and extends from the display area to the frame area; A plurality of groups of metal routing lines, wherein the plurality of groups of metal routing lines are located on a side of the first insulating layer away from the substrate and are arranged in sequence in a direction away from the display area, wherein the metal routing lines include a first area and a second area, wherein the first area is located between the display area and the second area, wherein the orthographic projection of the metal routing lines in the first area on the first insulating layer has an overlapping area with the first insulating layer, wherein the first insulating layer is not provided on a side of the metal routing lines in the second area close to the substrate, wherein the spacing between the metal routing lines in the first area closest to the second area and the metal routing lines in the second area closest to the first area is d1, and the spacing between adjacent metal routing lines in the first area is d2, wherein 10d2≥d1≥1.5d2.

2. The display panel according to claim 1, wherein: 20 μm ≥ d1 ≥ 4.1 μm.

3. The display panel according to claim 2, wherein: 20 μm ≥ d1 ≥ 7 μm.

4. The display panel according to any one of claims 1 to 3, wherein: Each group of the metal traces includes at least one metal layer.

5. The display panel according to claim 4, wherein: Also includes: a second insulating layer, the second insulating layer being arranged on a side of the first insulating layer away from the substrate; Each group of the metal traces includes a first metal layer and a second metal layer, the second metal layer is arranged on a side of the second insulating layer away from the substrate, the first metal layer is arranged on a side of the second insulating layer close to the substrate, and the first metal layer in the first area is located between the first insulating layer and the second insulating layer, and the orthographic projection of the second metal layer on the substrate overlaps with the orthographic projection of the first metal layer on the substrate.

6. The display panel according to claim 5, wherein: An orthographic projection of the second metal layer on the substrate substantially overlaps with an orthographic projection of the first metal layer on the substrate.

7. The display panel according to claim 5, wherein: At least for the metal routing located in the first zone closest to the second zone, and the metal routing located in the second zone closest to the first zone, a first orthographic projection of the second metal layer on the substrate is located within a second orthographic projection of the first metal layer on the substrate, and an edge line of the first orthographic projection does not overlap with an edge line of the second orthographic projection.

8. The display panel according to claim 7, wherein: A distance between an edge line of the first orthographic projection and an edge line of the second orthographic projection is greater than or equal to 1.2 micrometers.

9. The display panel according to claim 7 or 8, wherein: A distance d4 between the second metal layer in the metal routing in the first region closest to the second region and the second metal layer in the metal routing in the second region closest to the first region is greater than the distance d1.

10. The display panel according to any one of claims 7 to 9, wherein: The first metal trace meets the following conditions: Only for the metal routing located in the first zone closest to the second zone and the metal routing located in the second zone closest to the first zone, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection.

11. The display panel according to any one of claims 7 to 9, wherein: The first metal trace meets the following conditions: For all the metal traces, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection, and all the second metal layers have the same width.

12. The display panel according to any one of claims 7 to 9, wherein: The first metal trace meets the following conditions: For all the metal routings, the first orthographic projection of the second metal layer on the substrate is located within the second orthographic projection of the first metal layer on the substrate, and the edge line of the first orthographic projection does not overlap with the edge line of the second orthographic projection, the second metal layer in the metal routings in the first area has a width that gradually decreases in the direction from the display area to the second area, and the second metal layer in the metal routings in the second area has a width that gradually increases in the direction from the first area to the edge of the display panel.

13. The display panel according to any one of claims 4 to 12, wherein: At least for the metal routing located in the first area closest to the second area and the metal routing located in the second area closest to the first area, the orthographic projection of the second metal layer on the substrate is close to the edge line of the display area and is located inside the orthographic projection of the first metal layer on the substrate, and the orthographic projection of the first metal layer on the substrate is away from the edge line of the display area and is located inside the orthographic projection of the second metal layer on the substrate.

14. The display panel according to any one of claims 10 to 12, wherein: The orthographic projection of the second metal layer in the metal routing in the first area closest to the second area on the substrate does not overlap with the orthographic projection of the first metal layer in the metal routing in the second area closest to the first area on the substrate.

15. The display panel according to claim 4, wherein: Also includes: The second insulating layer is arranged on a side of the first insulating layer away from the substrate, the metal trace comprises a first metal layer and a second metal layer, and the first metal layer and the second metal layer are arranged on the same layer and located on a side of the second insulating layer close to the first insulating layer.

16. The display panel according to any one of claims 1 to 15, wherein: The metal wiring farthest from the display area is not electrically connected to the other metal wirings.

17. A display panel, comprising a display area and a frame area located on at least one side of the display area, wherein the frame area comprises: substrate; A first insulating layer, which is disposed on one side of the substrate and extends from the display area to the frame area; A plurality of groups of metal routing lines are located on a side of the first insulating layer away from the substrate and are arranged in sequence in a direction away from the display area, and the orthographic projections of all the metal routing lines on the first insulating layer are located in the first insulating layer.

18. A method for preparing a display panel, the display panel comprising a display area and a frame area located on at least one side of the display area, the method for preparing the display panel comprising the step of preparing the frame area, including: providing a substrate; forming a first insulating layer, wherein the first insulating layer is on one side of the substrate and extends from the display area to the frame area; A plurality of groups of metal routing lines are formed, wherein the plurality of groups of metal routing lines are located on a side of the first insulating layer away from the substrate and are arranged in sequence in a direction away from the display area, wherein the metal routing lines include a first area and a second area, wherein the first area is located between the display area and the second area, wherein the orthographic projection of the metal routing lines in the first area on the first insulating layer has an overlapping area with the first insulating layer, and the first insulating layer is not provided on a side of the metal routing lines in the second area close to the substrate, wherein the spacing between the metal routing lines in the first area closest to the second area and the metal routing lines in the second area closest to the first area is d1, and the spacing between adjacent metal routing lines in the first area is d2, wherein 10d2≥d1≥1.5d2.

19. The method according to claim 18, wherein: Also includes: A second insulating layer is formed, wherein the second insulating layer is formed on a side of the first insulating layer away from the substrate, the metal trace comprises a first metal layer and a second metal layer, wherein: The second metal layer is formed on a side of the second insulating layer away from the substrate, the first metal layer is formed on a side of the second insulating layer close to the substrate, and the first metal layer in the first region is located between the first insulating layer and the second insulating layer, and an orthographic projection of the second metal layer on the substrate overlaps with an orthographic projection of the first metal layer on the substrate; Alternatively, the first metal layer and the second metal layer are arranged in the same layer and are located on a side of the second insulating layer close to the first insulating layer.

20. A display device, comprising: A power supply component, and a display panel as claimed in any one of claims 1 to 17, wherein the power supply component is used to supply power to the display panel.

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