LED module for display pixel, display device comprising same, and method for manufacturing LED module for display pixel

Abstract

Embodiments relate to an LED module for a display pixel, a display device comprising same, and a method for manufacturing the LED module for a display pixel. The LED module for a display pixel, according to an embodiment, may comprise: a substrate; an electrode wire disposed on the substrate; an encapsulation layer disposed on the electrode wire; a light-emitting element disposed in the encapsulation layer; an adhesive layer disposed on the encapsulation layer and the semiconductor light-emitting element; and a molding layer molding the encapsulation layer and the adhesive layer. The molding layer may come into contact with the top surface of the adhesive layer.

Description

LED module for display pixels, display device including same, and method for manufacturing LED module for display pixels

[0001] The present invention relates to an LED module for a display pixel, a display device including the same, and a method for manufacturing the LED module for a display pixel.

[0002] Large-area display devices include liquid crystal displays (LCDs), OLED displays, mini-LED displays, and micro-LED displays.

[0003] A mini-LED display is a display that uses a semiconductor light-emitting element, an LED, as a display element with a diameter or cross-sectional area of ​​about 100㎛ to 200㎛, and a micro-LED display can be classified as a display that uses a semiconductor light-emitting element, an micro-LED, as a display element with a diameter or cross-sectional area of ​​about 100㎛ or less.

[0004] Mini-LED displays and micro-LED displays use semiconductor light-emitting devices, such as mini-LEDs or micro-LEDs, as display elements, and therefore have superior performance in many characteristics, including contrast ratio, response speed, color reproducibility, viewing angle, brightness, resolution, lifespan, luminous efficiency, and brightness.

[0005] In particular, mini-LED displays or micro-LED displays have the advantage of being able to freely adjust the size and resolution by separating and combining the screen in a modular manner, and are able to implement flexible displays. They are being applied not only to TVs but also to digital signage.

[0006]

[0007] Digital signage is a display installed inside or outside a building using a digital information display (DID), and is a device that provides images or videos containing advertisements or various information.

[0008] Types of digital signage include outdoor digital signage and indoor digital signage.

[0009] Outdoor digital signage refers to digital signage installed on building exteriors, billboards, or for outdoor cinemas. Indoor digital signage refers to digital signage installed on the interior walls of large shopping malls or in the form of signboards.

[0010] Digital signage can use mini-sized or micro-sized semiconductor light-emitting diodes (LEDs) as display elements.

[0011]

[0012] However, mini-LED displays or micro-LED displays may generate bright lines due to light amplification or dark lines due to light extinction due to total internal reflection caused by the difference in refractive index between the molding layer and the air, depending on the thickness of the molding layer. For example, there is a problem in that bright lines such as cyan, yellow, and white are generated depending on the R, G, and B arrangement, which causes a deterioration in color quality.

[0013] Additionally, there is a problem of cloudiness occurring due to the scattering agent included in the molding layer of the mini-LED display or micro-LED display.

[0014] In addition, conventional mini-LED displays or micro-LED displays have a problem in that they have limitations in implementing a clear black feeling due to optical visibility issues of the LED elements or electrode wiring when the LED elements are turned off.

[0015] One of the technical tasks of the present invention is to provide an LED module for a display pixel that prevents a light-intensifying or light-out phenomenon, a display device including the same, and a method for manufacturing the LED module for a display pixel.

[0016] In addition, one of the technical tasks of the embodiment is to provide an LED module for a display pixel that can prevent a cloudiness phenomenon by a scattering agent included in a molding layer of a mini-LED display or a micro-LED display, a display device including the same, and a method for manufacturing the LED module for a display pixel.

[0017] In addition, one of the technical tasks of the embodiment is to provide an LED module for display pixels with improved blackness, a display device including the same, and a method for manufacturing the LED module for display pixels.

[0018] An LED module for a display pixel according to an embodiment may include a substrate, an electrode wiring disposed on the substrate, an encapsulating layer disposed on the electrode wiring, a semiconductor light-emitting element disposed within the encapsulating layer, an adhesive layer disposed on the encapsulating layer and the semiconductor light-emitting element, and a molding layer molding the encapsulating layer and the adhesive layer.

[0019] The above molding layer can be in contact with the upper surface of the above adhesive layer.

[0020] The above encapsulating layer may include a black layer.

[0021] The above adhesive layer can react to laser light.

[0022] The above molding layer includes an effective molding layer corresponding to the upper surface of the molding layer from the upper surface of the adhesive layer, and the thickness of the effective molding layer can be formed to be 40 to 60% of the total thickness of the molding layer.

[0023] The above adhesive may include a black layer.

[0024]

[0025] A display device according to an embodiment may include an LED module for any one of the display pixels.

[0026] A method for manufacturing an LED module for display pixels according to an embodiment may include, in any one of the above display pixel LED modules, a step of removing a base material layer disposed on the adhesive layer before forming the molding layer, and a step of forming the molding layer after removing the base material layer.

[0027] The step of removing the base material layer disposed on the adhesive layer may include a step of irradiating laser light onto the base material layer using a laser device.

[0028] The step of losing the adhesive strength of the adhesive layer by the laser light may be included.

[0029] The embodiment may include a step of forming the molding layer on the adhesive layer after the base material layer is removed from the adhesive layer.

[0030] In an embodiment, by removing the base material layer, the thickness of the molding layer is reduced and the thickness of the effective molding layer is increased, so that color changes according to the viewing angle can be improved.

[0031] In addition, according to the embodiment, the thickness of the molding layer can be reduced, thereby reducing the clouding phenomenon caused by the light scattering agent and improving the light quenching phenomenon.

[0032] In addition, according to an embodiment, the black feeling of an LED module for a display pixel can be improved by including a black material in the encapsulation layer.

[0033] FIG. 1A is an exemplary diagram of a display device (1000) including a semiconductor light-emitting element for a display pixel according to an embodiment.

[0034] FIG. 1b is a perspective view of one of a plurality of display modules (2002) included in a display device (1000) according to an embodiment.

[0035] Fig. 2a shows a cross-sectional view of an LED module (10) for display pixels according to a comparative example.

[0036] Figure 2b shows the light path of an LED module (10) for a display pixel according to a comparative example.

[0037] Fig. 3 is a photograph showing the problem of light saturation of an LED module (10) for display pixels according to a comparative example.

[0038] FIG. 4 is a cross-sectional view of an LED module (20) for a display pixel according to one embodiment of the present invention.

[0039] Fig. 5a shows the light path of an LED module (20) for a display pixel according to an embodiment.

[0040] Fig. 5b illustrates the light path of an LED module (20) for a display pixel according to an additional embodiment.

[0041] Figure 6 is a process diagram illustrating a manufacturing method of an LED module (20) for display pixels according to one embodiment of the present invention.

[0042] Figure 7 is comparative data of the upper and lower viewing angle characteristics of the LED module (10) for display pixels of a comparative example and the LED module (20) for display pixels according to one embodiment of the present invention.

[0043] Figure 8 shows the color change according to the viewing angle of the LED module (10) for display pixels of a comparative example and the LED module (20) for display pixels according to one embodiment of the present invention.

[0044] Figure 9 shows the surface of an LED module (20) for display pixels according to one embodiment of the present invention from which the base material layer (260) has been removed.

[0045] Hereinafter, a concretely feasible embodiment for solving the above-mentioned problem will be described with reference to the attached drawings.

[0046] The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably for the sake of ease of specification writing, and do not in themselves have distinct meanings or roles. In addition, the attached drawings are provided to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be present directly on the other element, or that other intermediate elements may exist therebetween.

[0047] The display devices described in this specification may include digital signage, digital TVs, mobile phones, smart phones, laptop computers, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, slate PCs, tablet PCs, Ultra-Books, desktop computers, and the like. However, the configuration according to the embodiments described in this specification may also be applied to devices capable of displaying, even if they are new product types developed in the future.

[0048]

[0049] A semiconductor light-emitting element for a display pixel and a display device including the same according to the following embodiments are described.

[0050] (Example)

[0051] FIG. 1A is an exemplary diagram of a display device (1000) including a semiconductor light-emitting element for a display pixel according to an embodiment. The display device (1000) according to the embodiment may include a plurality of assembled LED display modules (2000).

[0052] The display device (1000) of the embodiment can be applied to digital signage. For example, FIG. 1A is an example of indoor digital signage, but the display device (1000) of the embodiment can also be applied to outdoor digital signage.

[0053]

[0054] FIG. 1b is a perspective view of one of a plurality of LED display modules (2000) included in a display device (1000) according to an embodiment.

[0055] The display module (2000) illustrated in FIG. 1b can be mounted on each cabinet and assembled in a block manner to implement the display device (1000) of the embodiment.

[0056] The LED display module (2000) of the embodiment may include a plurality of display panels (2210) that output images, a module holder (2220) on which the display panels (2210) are placed, and a module cover (2230) placed on the outside of the module holder (2220).

[0057] The above-described plurality of display panels (2210) can be arranged in a grid shape on a module holder (2220) to form one LED display module (2000), and individual LED display modules (2000) can be assembled in a predetermined cabinet shape to implement a display device (1000) according to an embodiment. Display data can be transmitted to the assembled individual LED display modules (2000) wired or wirelessly.

[0058]

[0059] Meanwhile, one of the technical tasks of the present invention is to provide an LED module for a display pixel that prevents a light-intensifying or light-out phenomenon, a display device including the same, and a method for manufacturing the LED module for a display pixel.

[0060] In addition, one of the technical tasks of the embodiment is to provide an LED module for a display pixel that can prevent a cloudiness phenomenon by a scattering agent included in a molding layer of a mini-LED display or a micro-LED display, a display device including the same, and a method for manufacturing the LED module for a display pixel.

[0061] In addition, one of the technical tasks of the embodiment is to provide an LED module for display pixels with improved blackness, a display device including the same, and a method for manufacturing the LED module for display pixels.

[0062]

[0063] First, the technical issues of the comparative technology will be explained with reference to FIGS. 2a and 2b.

[0064] Fig. 2a shows a cross-sectional view of an LED module (10) for display pixels according to a comparative example, Fig. 2b shows a light path of an LED module (10) for display pixels according to a comparative example, and Fig. 3 shows a problem of light magnification and quenching when viewed from above and below of an LED module (10) for display pixels according to a comparative example.

[0065]

[0066] Referring to FIGS. 2a to 3, an LED module (10) for a display pixel according to a comparative example may include a substrate (110), a PSR (Photo Solder Resist: PSR) layer (120), an electrode wiring (130), an encapsulating layer (140), a light-emitting element (150), a base material layer (160), and a molding layer (170).

[0067] The above-mentioned base material layer (160) can be formed of a transparent substrate made of silicon or sapphire.

[0068] The encapsulating layer (140) may be transferred and placed on the base material layer (160). The encapsulating layer (140) may include an epoxy material.

[0069] The light emitting element (150) may include a plurality of light emitting elements. For example, the light emitting element (150) may include R, G, and B LEDs.

[0070] In an embodiment, the above-mentioned base material layer (160) may include a black dam (180) for controlling light emission.

[0071] The above molding layer (170) may include a light scattering agent (171) for scattering light.

[0072] In the LED module (10) for display pixels of the comparative example, the first thickness (h1) of the molding layer (170) must be able to cover the upper surface of the base material layer (160), and in order to improve the viewing angle by the light scattering agent (171), a constant effective molding layer of a second thickness (h2) must be formed between the upper surface of the base material layer (160) and the upper surface of the molding layer (170).

[0073] Due to this, there is a restriction that the first thickness (h1) of the molding layer (170) of the LED module (10) for display pixels of the comparative example is formed to be thicker.

[0074] Meanwhile, referring to FIG. 2b, when the first thickness (h1) of the molding layer (170) is formed thick, light emitted from the light-emitting element (150) may be totally reflected due to the difference in refractive index between the molding layer (170) and the air (for convenience, the refractive index by the base material layer is not considered), and as a result, a phenomenon occurs in which light is extinguished on the side or light is increased on the top surface of the surface of the molding layer (170).

[0075]

[0076] That is, in the comparative example mini-LED display or micro-LED display, as the first thickness (h) of the molding layer (170) is formed thick, the difference in refractive index between the molding layer (170) and the air is further increased, which may cause a bright line to be generated due to light amplification by total reflection or a dark line to be generated due to light extinction. For example, there is a problem that bright lines such as cyan, yellow, and white are generated depending on the R, G, and B arrangement, which causes a deterioration in color quality.

[0077] For example, referring to FIG. 3, the LED module (10) of the comparative example shows that the cyan phenomenon (RGBRGB=>RGBBGB) appears as the blue (B) light is amplified (Bright-B) depending on the viewing angle, thereby generating a bright line.

[0078] Accordingly, in the comparative example, a problem was studied in which a difference in light distribution could be caused by a difference in the thickness of each of the above-mentioned base layers (160), thereby causing a color difference between modules in the viewing angle.

[0079] Therefore, in the case of the LED module (10) of the comparative example, the thickness (h1) of the molding layer (160) is controlled as an important factor.

[0080]

[0081] In addition, there is a problem that a white clouding phenomenon occurs depending on the ratio of the light scattering agent (271) included in the molding layer (160).

[0082] For example, there is a problem in that an optical cloudiness phenomenon is caused by the scattering agent included for light scattering due to an increase in the first thickness (h1) of the molding layer (170) of the mini-LED display or micro-LED display of the comparative example.

[0083]

[0084] Next, FIG. 4 shows a cross-sectional view of an LED module (20) for a display pixel according to one embodiment of the present invention, and FIG. 5a shows a light path of an LED module (20) for a display pixel according to the embodiment.

[0085] An LED module (20) for a display pixel according to one embodiment of the present invention may include a printed circuit board (210), a photo solder resist (PSR) layer (220), an electrode wiring (230), an encapsulating layer (240), a light-emitting element (250), a molding layer (270), and an adhesive layer (290).

[0086] The printed circuit board (210) may be formed of a conductive substrate or an insulating substrate. For example, the printed circuit board (210) may be formed of at least one of sapphire (Al2O3), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge, and Ga2O3.

[0087] The solder resist layer (220) may be placed on the printed circuit board (210). The solder resist layer (220) may be a PSR (Photo Solder Resist: PSR) layer, but is not limited thereto.

[0088] The above solder resist layer (220) can protect the printed circuit board (210) and prevent the solder bridge phenomenon.

[0089] The above electrode wiring (230) may include a first electrode (231) and a second electrode (232) that are respectively connected to each LED chip. The first electrode (231) and the second electrode (232) may be spaced apart from each other. The light emitting element (250) and the printed circuit board (210) may be electrically connected through the electrode wiring (230).

[0090] For example, the light-emitting element (250) may include a first semiconductor light-emitting element (251), a second semiconductor light-emitting element (252), and a third semiconductor light-emitting element (253).

[0091] For example, the first semiconductor light-emitting element (251), the second semiconductor light-emitting element (252), and the third semiconductor light-emitting element (253) may be R-LED, G-LED, and B-LED, respectively, but are not limited thereto.

[0092] In an embodiment, the light emitting element (250) may be a horizontal or vertical semiconductor light emitting element.

[0093] For example, the first semiconductor light-emitting element (251), the second semiconductor light-emitting element (252), and the third semiconductor light-emitting element (253) may be horizontal LEDs having an n-type electrode (not shown) and a p-type electrode (not shown) formed in the direction of the first electrode (231) and the second electrode (232), respectively, but are not limited thereto.

[0094] The n-type electrode and the p-type electrode of each of the first semiconductor light-emitting element (251), the second semiconductor light-emitting element (252), and the third semiconductor light-emitting element (253) can be electrically connected to the first electrode (231) and the second electrode (232), respectively.

[0095] The above semiconductor light emitting element (250) can be molded by a light-transmitting encapsulating layer (240) such as epoxy.

[0096] In an embodiment, the adhesive layer (290) may be placed on the encapsulating layer (240) and the light-emitting element (250).

[0097] The above adhesive layer (290) may have adhesive strength and may easily react to a laser in a laser process described later. For example, the adhesive layer (290) may include an adhesive material.

[0098]

[0099] The above molding layer (270) can mold the printed circuit board (210), the solder resist layer (220), the encapsulating layer (240), and the adhesive layer (290).

[0100] The molding layer (270) may include an epoxy or silicone-based material. The molding layer (270) may include a light scattering agent (271) for scattering light.

[0101] The above molding layer (270) can form an effective molding layer having a fourth thickness (h4) from the upper surface of the adhesive layer (290) to the upper surface of the molding layer (270).

[0102] The fourth thickness (h4) of the effective molding layer may be formed to be 40% to 60% of the thickness of the third thickness (h3) of the molding layer (270).

[0103] In the LED module (20) for display pixels according to one embodiment of the present invention, since the base material layer (260) to be described later is removed during the process, even if the third thickness (h3) of the molding layer (270) becomes thinner, the fourth thickness (h4) of the effective molding layer can be increased.

[0104] Referring to FIGS. 4 and 5a, according to the embodiment, the third thickness (h3) of the molding layer (270) can be formed significantly thinner than the first thickness (h1) of the molding layer of the comparative example, thereby reducing the difference in refractive index between the molding layer (270) and the air, thereby having a technical effect of preventing the occurrence of a bright line due to total reflection or a dark line due to extinction.

[0105] Also, according to the example,

[0106] In addition, according to the embodiment, the third thickness (h1) of the molding layer (270) is made thinner to prevent bright lines or dark lines, while the fourth thickness (h4) of the effective molding layer disposed above the light-emitting element (250), which is the main light-emitting area, can be increased compared to the comparative example. Accordingly, the viewing angle improvement effect by the light scattering agent (271) disposed above the light-emitting element (250) can be enhanced.

[0107]

[0108] Next, Fig. 5b shows the light path of an LED module (20) for a display pixel according to an additional embodiment.

[0109] In an additional embodiment, the encapsulating layer (240) may include a black material such as carbon black. Since the encapsulating layer (240) includes a black material, the electrode wiring (230) and the like cannot be visually identified, thereby significantly improving the blackness of the LED module (20) for display pixels.

[0110] Additionally, in another embodiment, the adhesive layer (290) may include a black material, but is not limited thereto.

[0111]

[0112] Figure 6 is a process diagram illustrating a manufacturing method of an LED module (20) for display pixels according to one embodiment of the present invention.

[0113] In Fig. 6, the process of forming an LED module (20) for display pixels according to one embodiment of the present invention after the MIP (Micro LED In Package) process is illustrated, and the process of forming the LED module (20) from the base material layer (260) will be described below.

[0114] First, the embodiment can transfer the first to third light-emitting elements (250:251, 252, 253) onto the base material layer (260) of the transparent substrate through an adhesive layer (290).

[0115] Afterwards, an encapsulating layer (240) using a light-transmitting epoxy or the like can be formed on the transferred first to third light-emitting elements (250:251, 252, 253). Accordingly, a wiring (not shown) process for electrically connecting the n-type electrode and the p-type electrode of each of the first to third light-emitting elements (250:251, 252, 253) can be performed.

[0116] Through this, a MIP (Micro LED In Package) process according to an embodiment can be performed to manufacture a semiconductor light-emitting device package.

[0117] Referring to (a) of FIG. 6, a semiconductor light-emitting device package according to an embodiment can be transferred onto a printed circuit board (210) equipped with electrode wiring (230) through a soldering process or the like.

[0118] Afterwards, a process for removing the base material layer (260), which is a transparent substrate, from the semiconductor light-emitting device package placed on the electrode wiring (230) may be performed.

[0119] The process for removing the above-mentioned base material layer (260) may include a step of irradiating the upper portion of the above-mentioned base material layer (260) with laser light using a laser device (500).

[0120] The laser light can penetrate the base material layer (260) and heat the adhesive layer (290). The adhesive layer (290) can easily react to the laser light.

[0121] A portion of the above adhesive layer (290) may be transformed into a gas or bubble form by the laser light, thereby weakening the adhesive strength with the base material layer (260).

[0122] Referring to (b) and (c) of FIG. 6, the base material layer (260) can be easily removed from the adhesive layer (290).

[0123] After the process of removing the above-mentioned base layer (260), the above-mentioned adhesive layer (290) can be cured to form a flat surface.

[0124] Next, referring to (d) of FIG. 6, after the adhesive layer (290) is cured, a molding layer (270) including a scattering agent (271) can be applied onto the adhesive layer (290).

[0125]

[0126] Fig. 9 illustrates the surface of an LED module (20) for display pixels according to one embodiment of the present invention from which the base material layer (260) has been removed. In the LED module (20) for display pixels according to one embodiment of the present invention, after the base material layer (260), which is a transparent substrate, has been removed, the adhesive layer (290) disposed on the upper side of the first to third semiconductor light-emitting elements (251, 252, 253) can be exposed to the surface.

[0127]

[0128] Referring to FIG. 6 and FIG. 4, FIG. 5a, the third thickness (h3) of the molding layer (270) in the embodiment can be formed significantly thinner than the first thickness (h1) of the molding layer in the comparative example, thereby reducing the difference in refractive index between the molding layer (270) and the air, thereby having a technical effect of preventing the occurrence of a bright line due to total reflection or a dark line due to extinction.

[0129] In addition, according to the embodiment, the third thickness (h1) of the molding layer (270) is made thinner to prevent bright lines or dark lines, while the fourth thickness (h4) of the effective molding layer disposed above the light-emitting element (250), which is the main light-emitting area, can be increased compared to the comparative example. Accordingly, the viewing angle improvement effect by the light scattering agent (271) disposed above the light-emitting element (250) can be enhanced.

[0130]

[0131] For example, FIG. 7 is a graph comparing the viewing angle (△u'v') of a comparative example display pixel LED module (10) and an embodiment of the present invention display pixel LED module (20).

[0132] It can be seen that the LED module (10) for the display pixel of the comparative example has a large deviation according to the upper and lower viewing angle (△), which deviates from the mass production line standards (G1, G2).

[0133] Due to this, the LED module (10) for display pixels of the comparative example may exhibit noticeable changes in color between blue and red depending on the upper and lower viewing angles.

[0134]

[0135] On the other hand, the LED module (20) for display pixels of the embodiment has a deviation in the upper and lower viewing angles (△), but the deviation is not large and is maintained within the mass production line standards (G1, G2), and the difference in viewing angle may not be visible to the user's naked eye.

[0136]

[0137] Next, Fig. 8 shows the color change according to the viewing angle of the LED module (10) for display pixels of a comparative example and the LED module (20) for display pixels according to one embodiment of the present invention.

[0138] In Fig. 8, the upper part of the indicator line (A) is where the LED module (10) for display pixels according to the comparative example is installed, and the lower part of the indicator line (A) is where the LED module (20) for display pixels according to the embodiment is installed.

[0139] The LED module (100) for display pixels according to the comparative example can be recognized as blue light as it is directed toward the right viewing angle (0 to 80°).

[0140] In addition, the LED module (100) for display pixels according to the comparative example can be seen to have red light that becomes more noticeable as the viewing angle to the left (0 to -80˚) increases.

[0141] On the other hand, it can be seen that the LED module (100) for display pixels according to the embodiment does not have a large color difference depending on the left and right viewing angles.

[0142] In an embodiment, by removing the base material layer, the thickness of the molding layer is reduced and the thickness of the effective molding layer is increased, so that color changes according to the viewing angle can be improved.

[0143] In addition, according to the embodiment, the thickness of the molding layer can be reduced, thereby reducing the clouding phenomenon caused by the light scattering agent and improving the light quenching phenomenon.

[0144] In addition, according to an embodiment, the black feeling of an LED module for a display pixel can be improved by including a black material in the encapsulation layer.

[0145]

[0146] Although the above description focuses on examples, these are merely examples and are not intended to limit the examples. Those skilled in the art will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present examples. For example, each component specifically shown in the examples can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

[0147] [Explanation of symbols]

[0148] 20: LED module for display pixel 210: Substrate

[0149] 220: Solder resist layer 230: Electrode wiring

[0150] 240: Encapsulation layer 250: Light-emitting element

[0151] 260: Base layer 270: Molding layer

[0152] 290: Adhesive layer

[0153] The embodiment can be applied to display devices such as digital signage and digital TV.

Claims

1. Substrate; Electrode wiring arranged on the above substrate; An encapsulating layer disposed on the above electrode wiring; A semiconductor light emitting element disposed within the above encapsulating layer; An adhesive layer disposed on the encapsulating layer and the semiconductor light-emitting element; and A molding layer for molding the encapsulating layer and the adhesive layer; An LED module for display pixels, wherein the molding layer is in contact with the upper surface of the adhesive layer.

2. In paragraph 1, An LED module for a display pixel, wherein the encapsulating layer includes a black layer.

3. In paragraph 1, An LED module for display pixels, wherein the adhesive layer reacts to laser light.

4. In paragraph 1, The above molding layer is, Including an effective molding layer corresponding to the upper surface of the molding layer from the upper surface of the adhesive layer, An LED module for display pixels, wherein the thickness of the effective molding layer is formed to be 40 to 60% of the total thickness of the molding layer.

5. In paragraph 1, The above adhesive comprises an LED module for display pixels, which includes a black layer.

6. A display device comprising an LED module for a display pixel according to any one of claims 1 to 5.

7. In any one of the display pixel LED modules of clauses 1 to 5, Before forming the above molding layer, A step of removing a base material layer disposed on the above adhesive layer; A method for manufacturing an LED module for a display pixel, comprising: a step of forming the molding layer after removing the base material layer.

8. In paragraph 7, The step of removing the base material layer disposed on the above adhesive layer is: A method for manufacturing an LED module for a display pixel, comprising the step of irradiating laser light onto the base material layer using a laser device.

9. In paragraph 8, Comprising a step of losing the adhesive strength of the adhesive layer by the laser light, A method for manufacturing an LED module for display pixels.

10. In paragraph 9, After the parent material layer is removed from the adhesive layer, A method for manufacturing an LED module for display pixels, comprising a step of forming the molding layer on the adhesive layer.

Images