Wiring circuit board

Abstract

Provided is a wiring circuit board (1) comprising: an outer frame (2); an inner frame (3) that is surrounded by the outer frame (2) and spaced apart from the outer frame (2); and a joint (4) that connects the outer frame (2) and the inner frame (3). The outer frame (2) is provided with an outer metal support layer (11), an outer base insulating layer (12), and an outer wiring layer (13) in the stated order toward one side in the thickness direction. The inner frame (3) is provided with an inner metal support layer (41), an inner base insulating layer (42), and an inner wiring layer (43) in the stated order toward one side in the thickness direction. The inner metal support layer (41) has at least one of a first region (41a) having a thickness thinner than the thickness of the outer metal support layer (11), and a second region (41b) consisting of a space present in the inner metal support layer (41).

Description

Wired circuit board

[0001] The present invention relates to a printed circuit board.

[0002] Conventionally, a camera module includes a wiring circuit board on which an imaging element is mounted.

[0003] As such a wired circuit board, for example, a wired circuit board has been proposed that includes an image sensor substrate (outer frame), a drive unit (inner frame) surrounded by the image sensor substrate, and a conductive pattern unit (joint) connecting them (see, for example, Patent Document 1). In this wired circuit board, the conductive pattern unit serves as wiring for transmitting electrical signals and is formed of a metal material having elasticity that allows it to move when subjected to force from the drive unit.

[0004] When a camera module including such a wired circuit board moves (vibrates), the image sensor board also moves (vibrates). This causes the drive unit to vibrate (shake) in conjunction with the movement (vibration) of the image sensor board. However, the conductive pattern can correct the vibration (shake) of the drive unit (hereinafter, sometimes referred to as vibration correction).

[0005] Special Publication No. 2022-520370

[0006] On the other hand, there is a demand for correcting the above-mentioned vibration with a smaller force depending on the application and purpose of the printed circuit board.

[0007] The present invention provides a wired circuit board that can correct the vibration of an inner frame with a smaller force.

[0008] The present invention [1] is a wired circuit board comprising an outer frame, an inner frame surrounded by the outer frame and spaced apart from the outer frame, and a joint connecting the outer frame and the inner frame, wherein the outer frame comprises an outer metal support layer, an outer base insulating layer, and an outer wiring layer, in that order toward one side in the thickness direction, and the inner frame comprises an inner metal support layer, an inner base insulating layer, and an inner wiring layer, in that order toward one side in the thickness direction, and the inner metal support layer has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region consisting of a space present within the inner metal support layer.

[0009] In this type of wired circuit board, the inner metal support layer has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region consisting of a space present within the inner metal support layer, which allows the inner metal support layer to be made lighter, thereby enabling the inner frame to compensate for vibration with less force.

[0010] The present invention [2] includes the printed circuit board described in the above [1], in which the inner metal support layer has a third region having a thickness that is the same as or thinner than the outer metal support layer and thicker than the first region.

[0011] If the third region has the same thickness as the outer metal support layer, the strength of the inner frame can be improved. If the third region has a thickness thinner than the outer metal support layer but thicker than the first region, the weight can be reduced.

[0012] The present invention [3] includes the wired circuit board according to the above [2], wherein the inner base insulating layer is disposed directly on one surface in the thickness direction of the inner metal supporting layer.

[0013] The present invention [4] includes the wired circuit board according to the above [2], wherein the joint includes a joint insulating layer and a joint wiring layer.

[0014] With this configuration, the inner frame can be supported by the outer frame via the joint, while the outer wiring layer in the outer frame and the inner wiring layer in the inner frame can be electrically connected via the joint wiring layer.

[0015] The present invention [5] includes the printed circuit board according to the above [2], wherein the third region of the inner metal support layer is disposed on the peripheral edge of the inner frame.

[0016] With this configuration, strength can be ensured at the peripheral edge of the inner frame, and therefore the outer shape of the inner frame can be maintained.

[0017] The present invention [6] includes the wired circuit board according to the above [5], wherein the second region of the inner metal support layer is disposed more inward than the peripheral end portion.

[0018] With this configuration, the weight of the inner metal support layer can be reduced, which allows the inner frame to correct vibration with less force.

[0019] The present invention [7] includes the printed circuit board according to the above [1], in which only the first region is arranged in the inner metal support layer.

[0020] With this configuration, the thickness of the inner metal support layer can be made uniform, and the force applied to the inner frame can be made uniform, which allows the inner frame to be swung uniformly.

[0021] The present invention [8] includes the wired circuit board according to the above [2], wherein the third regions in the inner metal support layer are arranged in a linear shape at intervals from each other.

[0022] According to this configuration, the strength can be improved by the third regions that are arranged linearly and spaced apart from each other.

[0023] The present invention [9] includes the printed circuit board according to the above [8], wherein in the inner metal support layer, the first region is disposed between adjacent third regions.

[0024] Since the first region is disposed between the adjacent third regions, the strength can be improved.

[0025] The present invention

[10] includes the printed circuit board according to the above [8], wherein the second region is disposed between adjacent third regions in the inner metal support layer.

[0026] Since the second region is disposed between the adjacent third regions, weight reduction can be achieved.

[0027] The present invention

[11] includes the printed circuit board according to the above

[10] , further comprising a via wiring penetrating the inner base insulating layer in the thickness direction, the via wiring being in contact with the third region.

[0028] With this configuration, the via wiring can be reliably in contact with the third region, not the second region, and therefore electrical continuity with the inner metal support layer can be achieved through the via wiring.

[0029] The present invention

[12] includes the wired circuit board according to any one of the above [1] to

[11] , wherein the inner metal support layer is made of a plated layer.

[0030] With this configuration, it is possible to reduce the weight.

[0031] The wired circuit board of the present invention can correct the vibration of the inner frame with a smaller force.

[0032] FIG. 1 shows a plan view of a first embodiment of a wired circuit board of the present invention. FIG. 2 shows a cross-sectional view of the wired circuit board shown in FIG. 1. FIG. 3A illustrates a manufacturing process diagram for the wired circuit board shown in FIG. 1 and explains the mounting of an imaging element. FIG. 3A shows a first step of disposing a plating layer on one thickness-wise surface of a metal support plate. FIG. 3B shows a second step of disposing a base insulating layer on one thickness-wise surface of the plating layer. FIG. 3C shows a third step of disposing a wiring layer on one thickness-wise surface of the base insulating layer and forming via wiring. FIG. 3D shows a fourth step of disposing a cover insulating layer on one thickness-wise surface of the wiring layer. FIG. 3E shows a fifth step of processing the outer shape and adjusting the thickness of the metal support plate. FIG. 3F shows a step of mounting an imaging element on an inner frame and mounting an external board on an outer frame. FIGS. 4A and 4B show a second embodiment of a wired circuit board of the present invention. FIG. 4A is a cross-sectional view. FIG. 4B is a plan view of an inner metal support layer. Figures 5A and 5B show a third embodiment of the wired circuit board of the present invention. Figure 5A is a cross-sectional view. Figure 5B is a plan view of an inner metal support layer. Figures 6A and 6B show a fourth embodiment of the wired circuit board of the present invention. Figure 6A is a cross-sectional view. Figure 6B is a plan view of an inner metal support layer. Figures 7A and 7B show a fifth embodiment of the wired circuit board of the present invention. Figure 7A is a cross-sectional view. Figure 7B is a plan view of an inner metal support layer. Figure 8 is an explanatory diagram of a modified example in which a plating layer constitutes the inner metal support layer. Figure 9 is an explanatory diagram of a modified example in which the inner frame is rectangular (a rectangular shape with no holes on the inside). Figure 10 is an explanatory diagram of a modified example in which frame terminals and frame wiring are provided on only one side.

[0033] The inner metal support layer of the wired circuit board of the present invention has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region consisting of a space present within the inner metal support layer. The inner metal support layer may also have a third region having a thickness the same as that of the outer metal support layer or thicker than that of the first region.

[0034] Below, we will describe in detail a first embodiment in which the inner metal support layer has only the first region; a second embodiment in which the inner metal support layer has a third region arranged at the peripheral edge of the inner frame and a second region arranged more inward than the peripheral edge; a third embodiment in which the inner metal support layer has a third region arranged at the peripheral edge of the inner frame and a first region arranged more inward than the peripheral edge; a fourth embodiment in which the inner metal support layer has third regions arranged in a linear shape spaced apart from each other in the inner metal support layer and second regions arranged between adjacent third regions; and a fifth embodiment in which the inner metal support layer has third regions arranged in a linear shape spaced apart from each other in the inner metal support layer and first regions arranged between adjacent third regions.

[0035] 1. First Embodiment <Wired Circuit Board> A first embodiment of the wired circuit board of the present invention will be described with reference to FIGS. 1 and 2. FIG.

[0036] As shown in Fig. 1, the wired circuit board 1 has a sheet shape. As shown in Fig. 2, the wired circuit board 1 has a thickness. As shown in Fig. 1, the wired circuit board 1 extends in a planar direction.

[0037] The surface direction is perpendicular to the thickness direction. The wired circuit board 1 includes an outer frame 2, an inner frame 3, and a joint 4.

[0038] <Outer Frame 2> The outer frame 2 has a substantially rectangular frame shape. The outer frame 2 has four sides 23A, 23B, 23C, and 23D. The four sides 23A, 23B, 23C, and 23D are arranged in counterclockwise order in a plan view. Side 23A and side 23C face each other. Side 23B connects one end of side 23A to one end of side 23C. Side 23D connects the other end of side 23A to the other end of side 23C. Side 23B and side 23D face each other.

[0039] As shown in FIG. 2, the outer frame 2 includes an outer metal support layer 11, an outer insulating base layer 12, an outer wiring layer 13, and an outer insulating cover layer 14 in this order toward one side in the thickness direction.

[0040] <Outer Metal Support Layer 11> The outer metal support layer 11 extends in the planar direction. The outer metal support layer 11 forms the outer shape of the outer frame 2. The outer metal support layer 11 has a substantially rectangular frame shape. The outer metal support layer 11 forms the other surface of the outer frame 2 in the thickness direction.

[0041] The outer metal support layer 11 includes, in order toward one side in the thickness direction, a metal support plate 110 and a plating layer 61. More specifically, the outer metal support layer 11 includes, in order toward one side in the thickness direction, a metal support plate 110 and a plating layer 61 that is directly disposed on one surface of the metal support plate 110 in the thickness direction.

[0042] The material of the metal support plate 110 is, for example, a rigid material.

[0043] Examples of rigid materials include stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloys. From the viewpoint of ensuring the strength of the outer frame 2 and the inner frame 3, stainless steel and copper alloys are preferred as rigid materials.

[0044] The thickness of the metal support plate 110 in the outer metal support layer 11 is in the range of, for example, 30 μm to 10,000 μm, or preferably 100 μm to 1,000 μm.

[0045] The material of the plating layer 61 is the same as that of the metal support plate 110. A preferable example of the material of the plating layer 61 is copper.

[0046] The thickness of the plating layer 61 in the outer metal support layer 11 is in the range of, for example, 0.5 μm to 50 μm, or preferably 1 μm to 30 μm.

[0047] The thickness of the outer metal support layer 11 (the sum of the thickness of the metal support plate 110 and the thickness of the plating layer 61) is in the range of, for example, 30.5 μm to 10050 μm, or preferably 101 μm to 1030 μm.

[0048] <Outer insulating base layer 12> The outer insulating base layer 12 is disposed over the entire surface of one side of the outer metal support layer 11 in the thickness direction. In other words, the outer metal support layer 11 is disposed over the entire surface of the other side of the outer insulating base layer 12 in the thickness direction. The outer insulating base layer 12 contacts one side of the outer metal support layer 11.

[0049] The outer insulating base layer 12 may be made of a resin, for example, such as a polyimide resin.

[0050] The outer insulating base layer 12 has a thickness of, for example, 1 μm to 20 μm, or preferably 5 μm to 15 μm.

[0051] <Outer wiring layer 13> The outer wiring layer 13 is disposed on one surface of the outer insulating base layer 12 in the thickness direction. The outer wiring layer 13 contacts one surface of the outer insulating base layer 12. The outer wiring layer 13 includes a plurality of frame terminals 131 and a plurality of frame wires (not shown) electrically connected to the frame terminals 131.

[0052] <Frame Terminals 131> A plurality of frame terminals 131 are provided corresponding to each of the four sides 23A, 23B, 23C, and 23D. The frame terminals 131 corresponding to side 23A are spaced apart from one another along side 23A. The frame terminals 131 corresponding to sides 23B, 23C, and 23D have the same configuration as the frame terminals 131 corresponding to side 23A. In each side (sides 23A, 23B, 23C, and 23D), the frame terminals 131 and frame wiring (not shown) arranged on the inside in the direction along each side constitute signal terminals and signal frame wiring, while the frame terminals 131 and frame wiring (not shown) arranged on the outside in the direction along each side constitute ground terminals and ground frame wiring. The ground frame wiring is connected to via wiring (not shown).

[0053] The outer wiring layer 13 may be made of a conductor, for example. Preferably, the conductor is copper.

[0054] The thickness of the outer wiring layer 13 is in the range of, for example, 1 μm to 50 μm, or preferably 5 μm to 35 μm.

[0055] 2 , in the outer frame 2, the outer cover insulating layer 14 is disposed on one surface of the outer wiring layer 13 in the thickness direction. Specifically, the outer cover insulating layer 14 covers the frame wiring, which is part of the outer wiring layer 13. The outer cover insulating layer 14 exposes the frame terminals 131, which are the remaining parts of the outer wiring layer 13.

[0056] The material of the outer cover insulating layer 14 may be, for example, a resin, and preferably a polyimide resin.

[0057] The thickness of the outer cover insulating layer 14 is in the range of, for example, 1 μm to 20 μm, or preferably 5 μm to 15 μm.

[0058] <Dimensions of Outer Frame 2> There are no limitations on the external dimensions of the outer frame 2. As shown in Fig. 1 , the distance between side portions 23A and 23C and the distance between side portions 23B and 23D are each, for example, 5 mm to 50 mm, or preferably 8 mm to 30 mm.

[0059] The length of each of the sides 23A, 23B, 23C and 23D is, for example, 5 mm to 50 mm, or preferably 8 mm to 30 mm.

[0060] The width of the outer frame 2 is, for example, 0.1 mm to 50 mm, or preferably 0.3 mm to 30 mm. The width of the outer frame 2 is the length between the inner peripheral edge and the outer peripheral edge.

[0061] <Inner frame 3> As shown in Fig. 1 , the inner frame 3 is surrounded by the outer frame 2. The inner frame 3 is spaced apart from the outer frame 2. The inner frame 3 has a generally rectangular frame shape. The inner frame 3 includes four sides 33A, 33B, 33C, and 33D.

[0062] The four side portions 33A, 33B, 33C, and 33D are arranged in counterclockwise order in a plan view.

[0063] Side portion 33A and side portion 33C face each other. Side portion 33B connects one end of side portion 33A to one end of side portion 33C. Side portion 33D connects the other end of side portion 33A to the other end of side portion 33C. Side portion 33B and side portion 33D face each other.

[0064] Furthermore, the sides 33A, 33B, 33C, and 33D of the inner frame 3 face the sides 23A, 23B, 23C, and 23D of the outer frame 2, respectively.

[0065] As shown in FIG. 2, the inner frame 3 includes an inner metal support layer 41, an inner base insulating layer 42, and an inner wiring layer 43 in this order toward one side in the thickness direction.

[0066] <Inner metal support layer 41> The inner metal support layer 41 extends in the planar direction. The inner metal support layer 41 forms the outer shape of the inner frame 3. The inner metal support layer 41 has a substantially rectangular frame shape. The inner metal support layer 41 forms the other surface of the inner frame 3 in the thickness direction.

[0067] The inner metal support layer 41 includes, in order toward one side in the thickness direction, a metal support plate 110 and a plating layer 61. Specifically, the inner metal support layer 41 includes, in order toward one side in the thickness direction, a metal support plate 110 and a plating layer 61 that is directly disposed on one surface of the metal support plate 110 in the thickness direction.

[0068] The materials of the metal support plate 110 and the plating layer 61 in the inner metal support layer 41 are the same as the materials of the metal support plate 110 and the plating layer 61 in the outer metal support layer 11 .

[0069] The inner metal support layer 41 has only a first region 41a having a thickness thinner than that of the outer metal support layer 11. In other words, the thickness of the inner metal support layer 41 is thinner than that of the outer metal support layer 11. As shown in a modified example described later, the thickness of the inner metal support layer 41 may be the same as that of the outer metal support layer 11. In this case, the inner metal support layer 41 has a second region consisting of a space present within the layer.

[0070] Specifically, the thickness of the metal support plate 110 in the inner metal support layer 41 is thinner than the thickness of the metal support plate 110 in the outer metal support layer 11 .

[0071] Specifically, the thickness of the metal support plate 110 in the inner metal support layer 41 is in the range of, for example, 25 μm to 9995 μm, or preferably 95 μm to 995 μm.

[0072] The ratio of the thickness of the inner metal support layer 41 to the thickness of the outer metal support layer 11 is, for example, less than 1, preferably 0.5 or less, and for example, 0.01 or more.

[0073] The thickness of the plating layer 61 in the inner metal support layer 41 and the thickness of the plating layer 61 in the outer metal support layer 11 may be the same or different.

[0074] The thickness of the inner metal support layer 41 (the sum of the thickness of the metal support plate 110 and the thickness of the plating layer 61) is in the range of, for example, 25.5 μm to 10045 μm, or preferably 96 μm to 1025 μm.

[0075] <Inner base insulating layer 42> The inner base insulating layer 42 is disposed over the entire surface of one side of the inner metal support layer 41 in the thickness direction. In other words, the inner metal support layer 41 is disposed over the entire surface of the other side of the inner base insulating layer 42 in the thickness direction. The inner base insulating layer 42 contacts one side of the inner metal support layer 41. That is, the inner base insulating layer 42 is disposed directly on one side of the inner metal support layer 41. When the inner base insulating layer 42 is disposed directly on one side of the inner metal support layer 41, the sensitivity of the inner frame 3 to vibration is improved, and therefore, the inner frame 3 can be compensated for with less force. The material and thickness of the inner base insulating layer 42 are the same as those of the outer base insulating layer 12.

[0076] <Inner wiring layer 43> The inner wiring layer 43 is disposed on one surface of the inner base insulating layer 42 in the thickness direction. The inner wiring layer 43 is in contact with one surface of the inner base insulating layer 42. The inner wiring layer 43 includes a plurality of terminals 133 and a plurality of wires (not shown) electrically connected to the plurality of terminals 133.

[0077] <Terminals 133> A plurality of terminals 133 are provided corresponding to each of the four side portions 33A, 33B, 33C, and 33D. Specifically, the plurality of terminals 133 corresponding to side portion 33B are spaced apart from one another in the direction along side portion 33B. The plurality of frame terminals 133 corresponding to side portions 33A, 33C, and 33D have the same configuration as the plurality of frame terminals 133 corresponding to side portion 33B. Note that, in each side portion (side portions 33A, 33B, 33C, and 33D), the terminals 133 and wiring (not shown) arranged on the inner side in the direction along each side constitute signal terminals and signal wiring, while the terminals 133 and wiring (not shown) arranged on the outer side in the direction along each side constitute ground terminals and ground wiring. The ground wiring is connected to via wiring 60 (see FIG. 3E ).

[0078] <Dimensions of Inner Frame 3> The outer dimensions of the inner frame 3 are not limited as long as they are smaller than the outer dimensions of the outer frame 2. As shown in Fig. 1 , the distance between side portions 33A and 33C and the distance between side portions 33B and 33D are each, for example, 3 mm to 50 mm, or preferably 5 mm to 30 mm.

[0079] The length of each of the sides 33A, 33B, 33C, and 33D is, for example, 3 mm to 50 mm, or preferably 5 mm to 30 mm.

[0080] The width of the inner frame 3 is, for example, 0.3 mm to 30 mm, or preferably 0.5 mm to 20 mm. The width of the inner frame 3 is the length between the outer peripheral edge 30 and the inner peripheral edge 39.

[0081] <Joint 4> As shown in FIG. 1 , the joint 4 is disposed between the outer frame 2 and the inner frame 3. The joint 4 connects the outer frame 2 and the inner frame 3. A plurality of joints 4 are provided corresponding to the plurality of side portions 33 of the inner frame 3. The plurality of joints 4A, 4B, 4C, and 4D correspond to the plurality of side portions 33B, 33C, 33D, and 33A of the inner frame 3, respectively. Specifically, the joint 4A connects the side portion 23A of the outer frame 2 to the side portion 33B of the inner frame 3. The joint 4B connects the side portion 23B of the outer frame 2 to the side portion 33C of the inner frame 3. The joint 4C connects the side portion 23C of the outer frame 2 to the side portion 33D of the inner frame 3. The joint 4D connects the side portion 23D of the outer frame 2 to the side portion 33A of the inner frame 3.

[0082] The joint 4A will be described in detail below. The joints 4B, 4C, and 4D have the same configuration as the joint 4A, and therefore their details will be omitted.

[0083] 1, the joint 4A has a curved shape in a plan view. Preferably, the joint 4A does not have a linear shape and / or a bent shape, but has only a curved shape.

[0084] The joint 4A includes a joint insulating layer, a joint wiring layer, and a joint cover insulating layer. The joint 4A does not include a metal support layer (the metal support plate 110 and the plating layer 61). If the joint 4A does not include a metal support layer (the metal support plate 110 and the plating layer 61), the weight of the joint 4A can be reduced, and the inner frame 3 can be corrected for vibration with less force.

[0085] <Joint Insulating Layer 52> In the joint 4A, the joint insulating layer 52 forms the other surface of the joint 4A in the thickness direction. The joint insulating layer 52 is exposed toward the other side in the thickness direction.

[0086] The material and thickness of the joint insulating layer 52 are the same as those of the outer base insulating layer 12, respectively.

[0087] <Joint Wiring Layer 53> The joint wiring layer 53 includes a joint wire (not shown). The joint wire electrically connects a frame wire (not shown) in the outer wiring layer 13 and a wire (not shown) in the inner wiring layer 43.

[0088] 1 , the joint cover insulating layer 54 is disposed on one surface in the thickness direction of the joint wiring layer 53. The joint cover insulating layer 54 covers the joint wiring (not shown) of the joint wiring layer 53.

[0089] <Method of Manufacturing Wired Circuit Board 1> A method of manufacturing the wired circuit board 1 and mounting the imaging element 5 will be described with reference to Figures 3A to 3F. Note that the joint 4 is omitted from Figures 3A to 3F.

[0090] The manufacturing method of the wired circuit board 1 includes a first step of arranging a plating layer 61 on one thickness-wise surface of the metal support plate 110; a second step of arranging a base insulating layer (outer base insulating layer 12, inner base insulating layer 42, and joint base insulating layer (not shown)) on one thickness-wise surface of the plating layer 61; a third step of arranging a wiring layer (outer wiring layer 13, inner wiring layer 43, and joint wiring layer (not shown)) on one thickness-wise surface of the base insulating layer and forming via wiring 60; a fourth step of arranging a cover insulating layer (outer cover insulating layer 14 and joint cover insulating layer (not shown)) on one thickness-wise surface of the wiring layer; and a fifth step of processing the outer shape and adjusting the thickness of the metal support plate 110.

[0091] (First Step) In the first step, as shown in FIG. 3A, a plating layer 61 is disposed on one surface in the thickness direction of the metal support plate 110.

[0092] The metal support plate 110 is a metal plate for forming the outer metal support layer 11 and the inner metal support layer 41 .

[0093] To dispose the plating layer 61 on one surface in the thickness direction of the metal support plate 110, a plating process is performed on one surface in the thickness direction of the metal support plate 110 by a known method.

[0094] (Second Step) In the second step, as shown in FIG. 3B , the insulating base layers (the outer insulating base layer 12, the inner insulating base layer 42, and the joint insulating base layer (not shown)) are arranged on one surface in the thickness direction of the plating layer 61.

[0095] Specifically, a resin is applied to one surface of the plating layer 61, and an insulating base layer having a pattern corresponding to the outer frame 2, the inner frame 3, and the joint 4 is formed by photolithography.

[0096] At this time, via holes 70 are formed near the peripheral edge of the inner insulating base layer 42 .

[0097] (Third Step) In the third step, as shown in Fig. 3C, a wiring layer is disposed on one surface in the thickness direction of the base insulating layer. Specifically, the wiring layer (outer wiring layer 13, inner wiring layer 43, and joint wiring layer (not shown)) is formed by a conductor pattern forming method. Examples of the conductor pattern forming method include an additive method and a subtractive method, and the additive method is preferred.

[0098] This allows the wiring layer to be disposed on one surface in the thickness direction of the insulating base layer.

[0099] In the third step, the via wiring 60 is formed. The via wiring 60 can be formed by filling the via hole 70 with the material of the plating layer 61. In other words, such a wired circuit board 1 includes the via wiring 60 that penetrates the inner base insulating layer 42 in the thickness direction.

[0100] 3D , in the fourth step, an insulating cover layer (an outer insulating cover layer 14 and an insulating joint cover layer (not shown)) is disposed on one surface of the wiring layer in the thickness direction. Specifically, a resin is applied to one surface of the wiring layer, and a insulating cover layer having a pattern corresponding to the outer frame 2 and the joint 4 is formed by photolithography.

[0101] (Fifth Step) In the fifth step, as shown in FIG. 3E, the metal support plate 110 is subjected to outer shape processing and thickness adjustment.

[0102] Methods for processing the outer shape and adjusting the thickness include, for example, etching, punching, and laser. From the viewpoint of productivity, etching is preferably used as the outer shape processing.

[0103] The metal support plate 110 is processed to remove the metal support plate 110 and the plating layer 61 between the outer frame 2 and the inner frame 3. In other words, the joint 4 does not include the metal support layer (the metal support plate 110 and the plating layer 61).

[0104] Further, the metal support plate 110 corresponding to the inner frame 3 is processed to have an outer shape and a thickness adjusted to form the inner metal support layer 41 .

[0105] Specifically, the thickness of a portion of the metal support plate 110 corresponding to the inner metal support layer 41 is adjusted so that the thickness of the inner metal support layer 41 is thinner than the thickness of the outer metal support layer 11. The remaining portion of the metal support plate 110 corresponding to the inner metal support layer 41 constitutes the first region 41a.

[0106] Furthermore, the metal support plate 110 corresponding to the outer metal support layer 11 becomes the outer metal support layer 11 as it is without any thickness adjustment.

[0107] In this manner, the wired circuit board 1 is manufactured.

[0108] Next, the process of mounting the imaging element 5 on the printed circuit board 1 will be described in detail.

[0109] 3F, the imaging element 5 is mounted on the inner frame 3. The electrodes 51 of the imaging element 5 and the plurality of terminals 133 on the inner frame 3 are electrically connected.

[0110] At the same time, the external substrate 6 is mounted on the outer frame 2. The electrodes 62 of the external substrate 6 and the plurality of frame terminals 131 on the outer frame 2 are electrically connected.

[0111] Next, the second to fifth embodiments will be described in detail. In the second to fifth embodiments below, the same components and steps as those in the first embodiment described above will be assigned the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, each of the modified examples can achieve the same effects as those of the first embodiment unless otherwise specified. Furthermore, the first to fifth embodiments can be combined as appropriate.

[0112] 4A, the inner metal support layer 41 has a third region 41c disposed at the peripheral edge of the inner frame 3 and a second region 41b disposed more inward than the peripheral edge. That is, as shown in FIG. 4B, the inner metal support layer 41 has a square shape in plan view.

[0113] The thickness of the third region 41 c is the same as that of the outer metal support layer 11 .

[0114] The second region 41b is a space existing within the inner metal support layer 41. In other words, the inner metal support layer 41 is not disposed in the second region 41b.

[0115] In the inner metal support layer 41, the area ratio of the third region 41c is in the range of, for example, 1% to 99%, or preferably 10% to 50%.

[0116] In the inner metal support layer 41, the area ratio of the second region 41b is in the range of, for example, 1% to 99%, or preferably 50% to 90%.

[0117] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3, the ratio of the width of the second region 41b to the width of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0118] In the second embodiment, the via wiring 60 is in contact with the third region 41c. That is, the via wiring 60 is in contact with the third region 41c, not the second region 41b.

[0119] In the second embodiment, in the fifth step, the thickness of the inner metal support layer 41 is adjusted so that the inner metal support layer 41 has the second region 41b and the third region 41c.

[0120] 5A, the inner metal support layer 41 has a third region 41c disposed at the peripheral edge of the inner frame 3 and a first region 41a disposed more inward than the peripheral edge. In other words, as shown in FIG. 5B, the inner metal support layer 41 has a concave shape in plan view.

[0121] The thickness of the third region 41c is either the same as that of the outer metal support layer 11, or is thinner than the outer metal support layer 11 and thicker than the first region 41a. Note that Fig. 5A shows a case where the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a.

[0122] When the thickness of the third region 41c is thinner than that of the outer metal support layer 11 and thicker than that of the first region 41a, the ratio of the thickness of the third region 41c to that of the outer metal support layer 11 is, for example, less than 1, preferably 0.5 or less, or for example, 0.01 or more. Also, the ratio of the thickness of the first region 41a to that of the third region 41c is, for example, less than 1, preferably 0.5 or less, or for example, 0.01 or more.

[0123] The first region 41a is a region having a thickness smaller than the thickness of the outer metal support layer 11 and the thickness of the third region 41c.

[0124] In the inner metal support layer 41, the area ratio of the third region 41c is in the range of, for example, 1% to 99%, or preferably 10% to 50%.

[0125] In the inner metal support layer 41, the area ratio of the first region 41a is in the range of, for example, 1% to 99%, or preferably 50% to 90%.

[0126] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3, the ratio of the width of the first region 41a to the width of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0127] In the third embodiment, the thickness of the inner metal support layer 41 is adjusted in the fifth step so that the inner metal support layer 41 has the first region 41 a and the third region 41 c. 4. Fourth Embodiment In the fourth embodiment, as shown in Fig. 6A, the inner metal support layer 41 has third regions 41 c that are linearly arranged at intervals in the inner metal support layer 41, and second regions 41 b that are arranged between adjacent third regions 41 c. That is, as shown in Fig. 6B, the inner metal support layer 41 has a stripe shape in a planar view.

[0128] The thickness of the third region 41 c is the same as that of the outer metal support layer 11 .

[0129] The second region 41b is a space existing within the inner metal support layer 41. In other words, the inner metal support layer 41 is not disposed in the second region 41b.

[0130] In the inner metal support layer 41, the width of the third region 41c (the width of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.03 mm to 1 mm.

[0131] In addition, in the inner metal support layer 41, the width of the second region 41b (the width of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.05 mm to 1 mm.

[0132] In the inner metal support layer 41, the distance (pitch) between the center point in the width direction of the third region 41c and the center point in the width direction of the second region 41b is, for example, 0.01 mm to 1 mm, or preferably 0.05 mm to 1 mm.

[0133] In the inner metal support layer 41, the area ratio of the third region 41c is in the range of, for example, 1% to 99%, or preferably 10% to 50%.

[0134] In the inner metal support layer 41, the area ratio of the second region 41b is in the range of, for example, 1% to 99%, or preferably 50% to 90%.

[0135] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3, the ratio of the width of the second region 41b to the width of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0136] In the fourth embodiment, the via wiring 60 contacts the third region 41c. That is, the via wiring 60 contacts the third region 41c, not the second region 41b.

[0137] In the fourth embodiment, in the fifth step, the thickness of the inner metal support layer 41 is adjusted so that the inner metal support layer 41 has the second region 41b and the third region 41c.

[0138] 7A, the inner metal support layer 41 has third regions 41c that are linearly arranged at intervals in the inner metal support layer 41, and first regions 41b that are arranged between adjacent third regions 41c in the inner metal support layer 41. That is, as shown in FIG. 7B, the inner metal support layer 41 has a comb shape in a plan view.

[0139] The thickness of the third region 41c is the same as that of the outer metal support layer 11, or is thinner than the outer metal support layer 11 and thicker than the first region 41a. Note that Fig. 7A shows a case where the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a.

[0140] When the thickness of the third region 41c is thinner than that of the outer metal support layer 11 and thicker than that of the first region 41a, the ratio of the thickness of the third region 41c to that of the outer metal support layer 11 is, for example, less than 1, preferably 0.5 or less, or for example, 0.01 or more. Also, the ratio of the thickness of the first region 41a to that of the third region 41c is, for example, less than 1, preferably 0.5 or less, or for example, 0.01 or more.

[0141] The first region 41a is a region having a thickness smaller than the thickness of the outer metal support layer 11 and the thickness of the third region 41c.

[0142] In the inner metal support layer 41, the width of the third region 41c (the width of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.03 mm to 1 mm.

[0143] In addition, in the inner metal support layer 41, the width of the first region 41a (the width of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.05 mm to 1 mm.

[0144] In the inner metal support layer 41, the distance (pitch) between the center point in the width direction of the third region 41c and the center point in the width direction of the first region 41a is, for example, 0.01 mm to 1 mm, or preferably 0.05 mm to 1 mm.

[0145] In the inner metal support layer 41, the area ratio of the third region 41c is in the range of, for example, 1% to 99%, or preferably 10% to 50%.

[0146] In the inner metal support layer 41, the area ratio of the first region 41a is in the range of, for example, 1% to 99%, or preferably 50% to 90%.

[0147] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see Figure 1)) of the inner frame 3, the ratio of the width of the first region 41a to the width of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0148] In the fifth embodiment, in the fifth step, the thickness of the inner metal support layer 41 is adjusted so that the inner metal support layer 41 has the first region 41a and the third region 41c.

[0149] 6. Effects In the first to fifth embodiments, the inner metal support layer 41 has at least one of a first region 41a having a thickness thinner than the thickness of the outer metal support layer 11 and a second region 41b consisting of a space present within the inner metal support layer 41. Therefore, the inner frame 3 can be corrected for vibration with a smaller force.

[0150] Specifically, the inner metal support layer 41 has at least one of the first region 41 a and the second region 41 b, which reduces the weight of the inner metal support layer 41. As a result, the inner frame 3 can be corrected for vibration with a smaller force.

[0151] In the second to fifth embodiments, the inner metal support layer 41 has a third region 41c that is the same thickness as or thinner than the outer metal support layer 11 and thicker than the first region 41a.

[0152] If the third region 41c has the same thickness as the outer metal support layer 11, the strength of the inner frame 3 can be improved. If the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a, the weight can be reduced.

[0153] In the first to fifth embodiments, the joint 4 includes a joint insulating layer 52, a joint wiring layer 53, and a joint cover insulating layer 54. With this configuration, the outer frame 2 supports the inner frame 3 via the joint 4, while the outer wiring layer 14 of the outer frame 2 and the inner wiring layer 43 of the inner frame 3 can be electrically connected via the joint wiring layer 53.

[0154] In the second embodiment, the third region 41c of the inner metal support layer 41 is disposed at the peripheral edge of the inner frame 3. With this configuration, strength can be ensured at the peripheral edge of the inner frame 3. Therefore, the outer shape of the inner frame 3 can be maintained.

[0155] In the second embodiment, the second region 41b is disposed more inward than the peripheral end portion in the inner metal support layer 41. This configuration reduces the weight of the inner metal support layer 41. This allows the inner frame 3 to be corrected for vibration with a smaller force.

[0156] In the first embodiment, only the first region 41a is disposed in the inner metal support layer 41. With this configuration, the thickness of the inner metal support layer 41 can be made uniform, and the force applied to the inner frame 3 can be made uniform. As a result, the inner frame 3 can be swung uniformly.

[0157] In the fourth and fifth embodiments, the third regions 41c are arranged linearly and spaced apart from one another in the inner metal support layer 41. According to such a configuration, the strength can be improved by the third regions 41c arranged linearly and spaced apart from one another.

[0158] In the fifth embodiment, the first region 41 a is disposed between adjacent third regions 41 c in the inner metal support layer 41. With this configuration, the first region 41 a is disposed between adjacent third regions 41 c, thereby improving the strength.

[0159] In the fourth embodiment, the second region 41 b is disposed between adjacent third regions 41 c in the inner metal support layer 41. With this configuration, the second region 41 b is disposed between adjacent third regions 41 c, thereby achieving weight reduction.

[0160] The second and fourth embodiments further include a via wiring 60 that penetrates the inner base insulating layer 42 in the thickness direction, and the via wiring 60 contacts the third region 41 c. With this configuration, the via wiring 60 can be reliably contacted with the third region 41 c, not the second region 41 b. Therefore, electrical continuity with the inner metal support layer 41 can be achieved through the via wiring 60.

[0161] 7. Modifications In the following modifications, the same components and steps as those in the first to fifth embodiments are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, each modification can achieve the same effects as those of the first to fifth embodiments, unless otherwise specified. Furthermore, the first to fifth embodiments and their modifications can be combined as appropriate.

[0162] In the above description, in the fifth step, a portion of the metal support plate 110 corresponding to the inner metal support layer 41 is contoured, and the remaining portion of the metal support plate 110 corresponding to the inner metal support layer 41 constitutes the first region 41a. Alternatively, as shown in FIG. 8 , the entire metal support plate 110 can be removed. In such a case, the plating layer 61 constitutes the inner metal support layer 41. This configuration allows the weight of the inner metal support layer 41 to be reduced. Note that while FIG. 8 illustrates the first embodiment as an example, this modification also applies to the second to fifth embodiments.

[0163] In addition, in the fifth step, the metal support plate 110 corresponding to the outer metal support layer 11 is used as the outer metal support layer 11 without any external processing, but as long as the inner metal support layer 41 has the first region 41a and / or the second region 41b, the metal support plate 110 corresponding to the outer metal support layer 11 and the plating layer 61 can also be externally processed as appropriate.

[0164] The inner metal support layer 41 may have, for example, a dot shape in plan view.

[0165] In the above description, the joint 4 does not include a metal support layer. On the other hand, in the fifth step, the metal support plate 110 corresponding to the joint 4 may remain. In such a case, the joint 4 includes a metal support layer.

[0166] In the above description, the inner frame 3 has a rectangular frame shape, but it may also have a rectangular shape (a rectangular shape without a hole on the inside) as shown in Fig. 9. Note that Fig. 9 illustrates the first embodiment as an example, but this modification also applies to the second to fifth embodiments.

[0167] In the above description, a plurality of frame terminals 131 are provided in the outer wiring layer 13 corresponding to each of the four side portions 23A, 23B, 23C, and 23D, but this is not limitative and the frame terminals 131 may be provided on only one side portion as shown in Fig. 10. In Fig. 10, the frame terminal 131 is provided only on the side portion 23D.

[0168] In such a case, similar to the above description, joint 4D connects side portion 23D of outer frame 2 and side portion 33A of inner frame 3. Then, joint wiring corresponding to joint 4D electrically connects frame wiring (not shown) in outer wiring layer 13 corresponding to side portion 23D and frame wiring (not shown) in inner wiring layer 43 corresponding to side portion 33A.

[0169] Meanwhile, joint 4A connects side 23A of outer frame 2 and side 33B of inner frame 3. The joint wiring corresponding to joint 4A connects to the frame wiring of outer frame 2 at the connection portion of side 23A. This frame wiring (not shown) is routed along side 23A and then side 23D, and is electrically connected to multiple frame terminals 131 on side 23D.

[0170] Similarly, joint 4B connects side 23B of outer frame 2 and side 33C of inner frame 3. The joint wiring corresponding to joint 4B connects to frame wiring (not shown) of outer frame 2 at the connection portion of side 23B. This frame wiring (not shown) is then routed along side 23B, side 23C, and side 23D in that order, and is electrically connected to multiple frame terminals 131 on side 23D.

[0171] Additionally, joint 4C connects side 23C of outer frame 2 and side 33D of inner frame 3. The joint wiring corresponding to joint 4C connects to frame wiring (not shown) of outer frame 2 at the connection portion of side 23C. This frame wiring (not shown) is then routed along side 23C and then side 23D, and is electrically connected to multiple frame terminals 131 on side 23D.

[0172] That is, the joint wiring layers corresponding to the joints 4B, 4C, 4D connected to the sides 23A, 23B, 23C that do not have a plurality of frame terminals 131 and frame wiring (not shown) are connected to the frame wiring at the connection portion with the outer frame 2, routed on the outer frame 2, gathered at the side 23D, and electrically connected to the plurality of frame terminals 131. In this case, the mountability is superior to the case where a plurality of frame terminals 131 and frame wiring (not shown) are provided corresponding to each of the four sides 23A, 23B, 23C, 23D.

[0173] The above invention is provided as an exemplary embodiment of the present invention, but this is merely an example and should not be interpreted as limiting. Modifications of the present invention that are obvious to those skilled in the art are intended to be included in the scope of the following claims.

[0174] The wired circuit board of the present invention is suitable for use in the manufacture of, for example, a camera module.

[0175] REFERENCE SIGNS LIST 1 Wired circuit board 2 Outer frame 3 Inner frame 4, 4A, 4B, 4C, 4D Joint 11 Outer metal support layer 12 Outer base insulating layer 13 Outer wiring layer 41 Inner metal support layer 41a First region 41b Second region 41c Third region 42 Inner base insulating layer 43 Inner wiring layer 52 Joint insulating layer 53 Joint wiring layer 54 Joint cover insulating layer 60 Via wiring 61 Plating layer

Claims

1. A wired circuit board comprising: an outer frame; an inner frame surrounded by the outer frame and spaced apart from the outer frame; and a joint connecting the outer frame and the inner frame, wherein the outer frame comprises an outer metal support layer, an outer base insulating layer, and an outer wiring layer, in that order toward one side in the thickness direction, and the inner frame comprises an inner metal support layer, an inner base insulating layer, and an inner wiring layer, in that order toward one side in the thickness direction, and the inner metal support layer has at least one of a first region having a thickness thinner than that of the outer metal support layer, and a second region consisting of a space existing within the inner metal support layer.

2. The printed circuit board according to claim 1, wherein the inner metal support layer has a third region having a thickness that is the same as or thinner than the outer metal support layer and thicker than the first region.

3. The wired circuit board according to claim 2, wherein the inner base insulating layer is disposed directly on one surface in the thickness direction of the inner metal supporting layer.

4. The wired circuit board according to claim 2, wherein the joint includes a joint insulating layer and a joint wiring layer.

5. The printed circuit board according to claim 2, wherein in said inner metal support layer, said third region is disposed on a peripheral edge of said inner frame.

6. The printed circuit board according to claim 5, wherein in said inner metal support layer, said second region is disposed inside said peripheral end portion.

7. The printed circuit board according to claim 1, wherein only the first region is disposed on the inner metal support layer.

8. The printed circuit board according to claim 2, wherein the third regions in the inner metal support layer are arranged in a linear shape and spaced apart from each other.

9. The printed circuit board according to claim 8, wherein in said inner metal support layer, said first regions are disposed between adjacent third regions.

10. The printed circuit board according to claim 8, wherein in said inner metal support layer, said second regions are disposed between adjacent ones of said third regions.

11. The printed circuit board according to claim 10, further comprising a via wiring penetrating said inner base insulating layer in said thickness direction, said via wiring being in contact with said third region.

12. The wired circuit board according to any one of claims 1 to 11, wherein the inner metal support layer is made of a plating layer.

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