Legume flour dough composition and method of using the same to provide a cooked food product

Abstract

The present disclosure relates generally to a dough composition including one or more legume flours present in a total amount in the range of 40-70 wt%, based on the weight of the dough composition; a film-forming starch present in an amount in the range of 5-20 wt%, based on the weight of the dough composition, the film-forming starch having an amylopectin content of at least 80 wt%, an RVA final viscosity after 1 hour at 25°C of no more than 900 centipoise, and an RVA peak-and-breakdown time of no more than 500 s at 25°C; one or more oils or fats present in a total amount in the range of 5-30 wt%, based on the weight of the dough composition; and water present in an amount in the range of 10-40 wt%, based on the weight of the dough composition.

Description

LEGUME FLOUR DOUGH COMPOSITION AND FOOD PRODUCTS AND RELATED METHODS 1. Field

[0001] The present disclosure relates generally to dough compositions, method of making the same, and method of using the same. 2. Technical Background

[0002] The bakery and snack category has experienced growth in segments related to healthier and specialty diets in recent years. This has included increased interest in more allergy-friendly foods, especially gluten-free foods. One way to provide gluten-free baked products and snacks is to replace conventional wheat flour in the dough with a gluten-free flour.

[0003] Many gluten-free flours lack the viscoelastic properties of wheat flour; indeed, it is the gluten of wheat flour that is largely responsible for these viscoelastic properties. This makes forming cohesive, pliable, and non-sticky doughs difficult from gluten-free flours, and as such, gluten-free doughs can be especially difficult to process into baked goods and snacks. This is especially true for the sheeting process used to make thin dough sheets for items like crackers.

[0004] Thus, there is a need in the art for improved dough compositions to provide gluten-free baked products and snacks. SUMMARY

[0005] In one aspect, the present disclosure provides a dough composition comprising: one or more legume flours present in a total amount in the range of 40-70 wt%, based on the weight of the dough composition; a film-forming starch present in an amount in the range of 5-20 wt%, based on the weight of the dough composition, the film-forming starch having an amylopectin content of at least 80 wt%, an RVA final viscosity after 1 hour at 25 C of no more than 900 centipoise, and an RVA peak-and-breakdown time of no more than 500 s at 25 °C; one or more oils or fats present in a total amount in the range of 5-30 wt%, based on the weight of the dough composition; and water present in an amount in the range of 10-50 wt%, based on the weight of the dough composition.

[0006] Another aspect of the present disclosure provides a method for preparing a dough composition (e.g., as described herein). The method includes:1  combining one or more legume flours and a film forming starch to provide a dry mix; combining the dry mix with one or more oils or fats to provide a dough precursor; and combining the dough precursor with water to provide the dough composition.

[0007] Another aspect of the present disclosure provides a dough composition prepared by the methods as described herein.

[0008] Another aspect of the present disclosure provides a method for using a dough composition (e.g., as described herein) to provide a baked food product. The method includes: providing a dough composition (e.g., by preparing the dough composition as described herein); forming the dough composition into a desired shape; and baking the dough composition to provide a baked food product. BRIEF DESCRIPTION OF FIGURES

[0009] The accompanying drawings are included to provide a further understanding of the methods and compositions of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiment(s) of the disclosure, and together with the description serve to explain the principles and operation of the disclosure.

[0010] FIG.1 is a schematic of the pattern used for textural analysis of dough compositions described herein.

[0011] FIG.2 is a graph of the textural analysis of the dough compositions as described herein.

[0012] FIG.3 is a graph of the compression and adhesion of the dough compositions as described herein.

[0013] FIG.4 is a graph of the average stack height of baked products made from dough compositions as described herein.

[0014] FIG.5A is a graph of the sensory results of the baked products made from dough compositions as described herein.

[0015] FIG.5B is a picture of a baked product made from a dough composition as described herein.

[0016] FIG.6 is a graph of the dough elasticity vs. baked expansion of the dough compositions as described herein.2  DETAILED DESCRIPTION

[0017] The present disclosure is concerned with doughs, methods of making and using the same, and baked food products made therefrom. As described above, gluten-free doughs lack the cohesiveness, pliability, and non-stick properties common to wheat-based doughs that are important for forming baked dough products. For easier machinability, higher levels of baked expansion, and a crispy texture, a soft, pliable, and non-sticky dough is desirable.

[0018] The present inventors have noted that legume flours can be especially useful in making a gluten-free food. For example, chickpea flour is a non-networking flour that tends to provide a pasty, sticky, and short textured dough of lower strength. Such doughs often do not sheet well using conventional equipment. Additionally, when the chickpea flour has a fine particle size and low protein content (ex. <15%), it often has a low water holding capacity. Many other legume flours exhibit similar shortcomings with respect to dough processing, particularly if the flours have a fine particle size. Accordingly, the present inventors have determined that developing baked food products and snacks based on legume flours requires a different approach to provide a desirable dough texture and enable a more robust manufacturing process.

[0019] Here, the present inventors have found a dough composition that can depart from the typical gluten-free dough rheology to provide a soft, pliable, and non-sticky dough. In particular, the present inventors have found that the use of relatively high amounts of oil together with a film-forming starch enables improved pliability and sheetability in a dough (e.g., a gluten-free dough) based on legume flour. This dough can provide an expanded, light, crispy texture in finished products.

[0020] Accordingly, in one aspect, the present disclosure provides a dough composition that includes one or more legume flours present in a total amount in the range of 40-70 wt%, based on the weight of the dough composition; a film-forming starch present in an amount in the range of 5-20 wt%, based on the weight of the dough composition; one or more oils or fats present in a total amount in the range of 5-30 wt%, based on the weight of the dough composition; and water present in an amount in the range of 10-50 wt%, based on the weight of the dough composition.

[0021] As used herein, the amounts of materials of the dough composition are exclusive of inclusions, i.e., larger particle materials like seeds, nuts, fruit and chocolate chips. As used herein, an inclusion is a material (i.e., other than a legume flour or other material specifically noted herein) with a particle size of at least 300 microns, at least 400 microns, or at least 500 microns.3

[0022] While there are many gluten-free flours available, the present inventors have found that legume flours are particularly useful in the dough compositions described herein. As would be understood by the skilled person, legume flours with fine particle sizes have low water capacity (i.e., regardless of protein content), which can lead to a sticky dough when water is added. Advantageously, the present inventors have found that the addition of relatively more oil or fat and relatively less water can overcome the low water holding capacity often associated with legume flours.

[0023] The one or more legume flours used in the dough composition may be selected from a variety of legume flours known in the art. For example, in various embodiments as described herein, the one or more legume flours include (or are) one or more pulse flours. For example, in various especially desirable embodiments, the one or more legume flours include (or are) chickpea flour. But other pulse flours, for example, pea flour and lentil flour, can be used in addition to or instead of chickpea flour.

[0024] A variety of other legume flours can be used in addition to or even instead of pulse flours. For example, in various embodiments, the one or more legume flours include one or more of peanut flour and cashew flour. In various embodiments, the one more legume flours include one or more bean flours. For example, in some embodiments, the one or more bean flours include (or are) soybean flour. However, the present inventors have found that superior dough compositions can be made without use of substantial amounts of soybean flour. In various embodiments, the dough composition has no more than 10 wt% soybean flour, e.g., no more than 5 wt% soybean flour. In some embodiments, the dough composition is free of soybean flour.

[0025] In some embodiments as described herein, the legume flours used in the dough compositions have a fine particle size. In some embodiments as described herein, the legume flour has a d50particle size in the range of 1-50 microns. As used herein, the d50particle size is the median particle size, i.e., the size of the particle at which 50% of the particles are of larger particle size and 50% are of smaller particle size, as measured by laser diffraction. In various embodiments as described herein, the legume flour has a d50particle size in the range of 5-50 microns, or 10-50 microns, or 1-35 microns, or 5-35 microns, or 10-35 microns. In various embodiments as described herein, the legume flour has a d50particle size in the range of 1-30 microns, e.g., 5-30 microns, 10-30 microns, or 1- 25 microns, or 5-25 microns, or 10-25 microns. The present inventor have found that small particle size flours such as those described here can be especially problematic with dough stickiness as a result of the manner in which they hydrate and retain water. Thus, the use of relatively higher amounts of oil / fat and lower amounts of water as described herein can be especially useful with such flours.4

[0026] In some embodiments as described herein, along with having a relatively fine particle size, the legume flour also has a relatively narrow particle size distribution. In various embodiments, the d10value of the legume flour is at least 10% of the d50value, e.g., at least 15% of the d50value, or at least 20% of the d50value. In various embodiments, the d90value of the legume flour is no more than 10 times the d50value, e.g., no more than 7 times the d50value, or no more than 5 times the d50value.

[0027] Of course, the person of ordinary skill in the art will appreciate that larger particle size legume flour can alternatively find beneficial use in the dough compositions of the disclosure.

[0028] In various embodiments, the legume flour(s) used in the compositions of the disclosure have relatively low fat content. For example, in various embodiments, the one or more legume flours have a total oil / fat content of no more than 7 wt%, e.g., no more than 5 wt%, or no more than 3 wt%.

[0029] As described above, the one or more legume flours are present in the dough composition in a total amount of in the range of 40-70 wt%, based on the weight of the dough composition. For example, in various embodiments as described herein, the one or more legume flours are present in a total amount in the range of 40-65 wt%, or 40-60 wt%, or 40-55 wt%, or 40-50 wt%, based on the weight of the dough composition. In various embodiments, the one or more legumes flours are present in a total amount in the range of 45-70 wt%, or 45-65 wt%, or 45-60 wt%, or 45-55 wt%, or 45-50 wt%, based on the weight of the dough composition. In some embodiments as described herein, the one or more legume flours are present in a total amount in the range of 50-70 wt%, based on the weight of the dough composition. For example, in various embodiments the one or more legume flours are present in a total amount in the range of 50-65 wt%, or 50-60 wt%, or 50-55 wt%, based on the weight of the dough composition.

[0030] The present inventors have determined that chickpea flour is an especially desirable legume flour for use in the compositions described herein. Accordingly, in various embodiments as otherwise described herein, chickpea flour is present in a total amount in the range of 25-65 wt% (e.g., in the range of 25-60 wt%, or 25-55 wt%, or 25-50 wt%), based on the weight of the dough composition. In various embodiments, chickpea flour is present in a total amount in the range of 40-70 wt% (e.g., in the range of 40-65 wt%, or 40- 60 wt%, or 40-55 wt%, or 40-50 wt%), based on the weight of the dough composition. In various embodiments, chickpea flour is present in a total amount in the range of 50-70 wt% (e.g., in the range of 50-65 wt%, or 50-60 wt%, or 50-55 wt%), based on the weight of the dough composition.5

[0031] The film-forming starch component provides improved viscoelastic properties to the dough composition. As would be understood by the skilled person, many gluten-free flours, such as those based on legumes, are non-network forming flours. As such, when water is added to these flours, the resulting doughs lack cohesiveness and pliability. To provide better viscoelastic properties to the dough composition and make up for the non- network forming properties of legume flours, the present inventors have found it particularly advantageous to include a film-forming starch in the dough composition. The film-forming starch quickly absorbs water and then breaks down, and as the starch breaks down, it provides mores stretchiness and elasticity to the dough. This helps to make an extended network of material to provide cohesiveness to the dough, similar to the function of gluten in doughs based on wheat flour.

[0032] As used herein, a “film-forming starch” is a starch that meets three criteria: an amylopectin content of at least 80 wt%, an RVA peak-and-breakdown time of no more than 500 s at 25 °C and an RVA final viscosity after 1 hour at 25 °C of no more than 900 centipoise. If a starch meets these three requirements, it is deemed a “film-forming starch” for purposes of this disclosure.

[0033] The film-forming starches used in the compositions of the disclosure have an amylopectin content of at least 80 wt%. The person of ordinary skill in the art will appreciate that amylopectin content is quantified as a percentage of total starch saccharides in the “starch” material, and thus is exclusive of any protein or water that is present. For example, in various embodiments, the film-forming starch has an amylopectin content of at least 85 wt%, e.g., at least 90 wt%. In various embodiments, the film-forming starch has an amylopectin content of at least 95 wt%, e.g., at least 99 wt%. Without intending to be bound by theory, the present inventors surmise that the high degree of branching in amylopectin help to support air cell formation and expansion during baking by increasing plastic deformation.

[0034] The film-forming starches used in the compositions of the disclosure also have an RVA final viscosity after 1 hour at 25 °C of no more than 900 centipoise. The RVA final viscosity is measured using a Rapid Visco Analyzer (RVA), using a starch slurry at 5 wt% starch solids in 1,3-propylene glycol and pH 6.5 phosphate buffer with 1 wt% NaCl, at a stir rate of 160 rpm. The slurry is prepared by combining 1.6 g of starch (dry solids) with 4.5 g 1,3-propylene glycol in an RVA cup and stirring until smooth and lump-free. pH 6.5 phosphate buffer with 1 wt% NaCl is added to provide a total mass of 32 g and the RVA test is started immediately; temperature is maintained constant at 25 C and the stir rate of the RVA instrument is 160 rpm. Viscosity is monitored throughout, and the viscosity value at one hour is the RVA final viscosity. In various embodiments, the film-forming starch has an6  RVA final viscosity after 1 hour at 25 °C of no more than 800 centipoise, e.g., no more than 750 centipoise or no more than 700 centipoise. In various embodiments, the film-forming starch has an RVA final viscosity after 1 hour at 25 °C of no more than 650 centipoise, e.g., no more than 600 centipoise. In various embodiments, the film-forming starch has an RVA final viscosity after 1 hour at 25 °C of no more than 550 centipoise, e.g., no more than 500 centipoise. However, it can be desirable for the film-forming starch to have some viscosity remaining. Accordingly, in various embodiments, the film forming starch has an RVA final viscosity after 1 hour at 25 °C of at least 25 centipoise, e.g., at least 50 centipoise. In various embodiments, the film forming starch has an RVA final viscosity after 1 hour at 25 °C of at least 75 centipoise, e.g., at least 100 centipoise.

[0035] Moreover, the film-forming starches used in the compositions of the disclosure also have an RVA peak-and-breakdown time of no more than 500 s at 25 °C. As the person of ordinary skill in the art will appreciate, in the RVA test many starches will have a peak in viscosity followed by a breakdown in viscosity. In the film-forming starches of the disclosure exhibiting such a peak, the “peak-and-breakdown time” is the time at which the apex of the peak viscosity is reached during the RVA experiment. In cases where there is no peak, but rather a substantial constant viscosity or a substantially monotonically decreasing viscosity, the peak-and-breakdown time is deemed to be zero seconds.

[0036] As such, film-forming starches suitable for use in the dough composition described herein can hydrate well in the dough without cooking in the dough itself. A variety of types of starches can be used. In various embodiments, the film-forming starch is a pregelatinized starch. In other embodiments, the film-forming starch is a cold-water-swelling starch.

[0037] Starch materials can also be characterized by their degree of solubles and sedimentation volume, each determined at 25 °C. As used herein, sedimentation volume is the volume that 1 g starch occupies in 100 g (i.e. total, including the starch) of salted buffer solution (1% sodium chloride in pH 6.5 phosphate buffer, with ~2 wt% 1,3-propylene glycol). This value is also known in the art as "swelling volume." Sedimentation volume of a starch as described herein is determined by mixing together 5 g (dry solids) of the starch with 10 g of 1,3-propylene glycol, then bringing the total mass to 102 g by the addition of pH 6.5 phosphate buffer with 1 wt% sodium chloride. This is stirred with a glass rod for 6 minutes at room temperature, then allowed to stand at room temperature for an additional 20 minutes. 20 g of the resulting paste is brought to 100 mL total volume with pH 6.5 phosphate buffer with 1 wt% sodium chloride, and sealed. After 24 hours, at 25 °C, the volume occupied by the starch sediment (i.e., as read in the cylinder) is the sedimentation volume for 1 g of starch, i.e., in units of mL / g. The amount of soluble starch is quantified by withdrawing 307  mL of this supernatant and adjusting it to pH 0.09 using concentrated HCl, and autoclaving it for 15 minutes at 121 °C. After cooling, the solution is adjusted to pH 6.3 with concentrated NaOH and then brought to 50 mL using pH 6.5 phosphate buffer. The concentration of dextrose in the solution is measured, e.g., using an instrumental analyzer such as a glucose analyzer available from YSI Incorporated. The concentration of dextrose in the supernatant can be converted algebraically to the percent soluble (i.e., by weight) value of the starch.

[0038] In various embodiments, the film-forming starch has a percent solubles of at least 20 wt%, e.g., at least 40 wt% or at least 60 wt%. In various embodiments as described herein, the film-forming starch has a sedimentation volume of at least 50 mL / g, at least 55 mL / g, or at least 60 mL / g. In various embodiments, the film forming starch has a sum of percent solubles (expressed in wt%) and sedimentation volume (expressed in mL / g) that is at least 50, e.g., at least 55, or at least 60. Of course, other values for these parameters can also be appropriate in a variety of situations.

[0039] The source of the film-forming starch is not particularly limited and many film- forming starches known to those skilled in the art will be acceptable for use therein. For example, the film-forming starch may be produced from waxy corn, potato, or tapioca. In some embodiments as described herein, the film-forming starch is produced from corn (e.g., waxy corn).

[0040] The film-forming starches can have a variety of other attributes. For example, various chemical modifications may be desirable to lend particular attributes to the starch. Examples of chemical modification include, e.g., acid-modification (which can reduce viscosity); bleaching, oxidizing, chemical inhibition, for example, with phosphate or adipate; substitution via acetylation, hydroxypropylation, hydroxyethylation, octenylsuccination, and carboxymethylation. The present inventors note that such chemical modification is not necessary in many cases, and that the film-forming starches used in the products and methods described herein can be so-called clean-label starches. Certain physical methods may be used, for example, to inhibit the starch, although in such cases to maintain swellability a low degree of inhibition is desirable.

[0041] A variety of film-forming starches can be suitable for use in the compositions and methods of the disclosure. Examples include starches sold under the designations MERIGEL 300; MERIGEL 301; X-PAND’R; X-PAND’R 305 NG; X-PAND’R 612; X-PAND’R 683; and X-PAND’R SC, all available from Tate & Lyle Solutions USA LLC.

[0042] As described above, the dough composition includes the film-forming starch in an amount in the range of 5-20 wt%, based on the weight of the dough composition. For example, in various embodiments as described herein, the film-forming starch is present in8  an amount in the range of 5-15 wt%, or 5-10 wt%, or 10-20 wt%, or 10-15 wt%, based on the weight of the dough composition.

[0043] The dough composition also includes one or more oils or fats. As described above, the use of oils or fats can help to provide a soft, non-sticky dough. As used herein, oils are fatty acid glycerides that are at least 50 wt% liquid at 23 °C, while fats are fatty acid glycerides that are less than 50 wt% liquid at 23 °C. In some embodiments as described herein, the one or more oils or fats comprise one or more oils. In some embodiments as described herein, the one or more oils or fats are one or more oils. The one or more oils of fats can be selected from a variety of non-animal based oils or fats. For example, in some embodiments as described herein, the one or more oils or fats are independently selected from canola oil, soybean oil, grapeseed oil, flaxseed oil, vegetable oil, corn oil, sunflower oil, safflower oil, olive oil, avocado oil, and peanut oil. In some embodiments as described herein, the one or more oils or fats are canola oil or vegetable oil. In some embodiments as described herein, the dough composition comprises one oil or fat. In some embodiments wherein the dough composition comprises one oil or fat, the one oil or fat may be canola oil. In other embodiments as described herein, the dough composition comprises at least two oils or fats. In various embodiments as otherwise described herein, the one or more oils or fats are one or more oils, i.e., materials that are at least 50 wt% liquid at 23 °C, or even substantially completely liquid at 23 °C.

[0044] As described above, the one or more oils or fats are present in the dough composition in a total amount in the range of 5-30 wt%, based on the weight of the dough composition. For example, in some embodiments as described herein, the one or more oils or fats are present in a total amount in the range of 5-25 wt% or in the range of 5-20 wt%, or in the range of 5-14 wt%, based on the weight of the dough composition. In various embodiments as described herein, the one or more oils or fats are present in a total amount in the range of 10-30 wt%, or 10-25 wt%, or 10-20 wt%, or 10-14 wt%, based on the weight of the dough composition. In various embodiments as described herein, the one or more oils or fats are present in a total amount in the range of 14-30 wt%, or 14-25 wt%, or 14-20 wt%, based on the weight of the dough composition. In various embodiments as described herein, the one or more oils or fats are present in a total amount in the range of 20-30 wt% (e.g., in the range of 20-25 wt%, or 25-30 wt%), based on the weight of the dough composition.

[0045] The dough composition as described herein also includes water. The present inventors have noted that the one or more oils or fats can provide a significant amount of the desired texture to the dough, and so relatively less water is necessary to provide pliability. The present inventors have noted that the use of relatively less water is especially desirable with the significant amount of legume flour present; legume flours tend to provide sticky9  doughs with excess water. “Water” is calculated as the amount of water added as water per se, as well as water that is present in other components, e.g., milk and other dairy products, eggs, syrup.

[0046] Within these guidelines, the amount of water used is not particularly limited and may be added in an amount to provide a desired texture of the dough. As described above, the dough composition comprises water present in an amount in the range of 10-40 wt%, based on the weight of the dough composition. For example, in various embodiments as described herein, water is present in an amount in the range of 20-40 wt%, or 25-40 wt%, based on the weight of the dough composition. In some embodiments as described herein, water is present in an amount in the range of 10-35 wt% (e.g., in the range of 15-35 wt%, or 20-35 wt%, or 25-35 wt%), based on the weight of the dough composition. In some embodiments as described herein, water is present in an amount in the range of 10-40 wt% (e.g., in the range of 15-40 wt%, or 20-40 wt%, or 25-40 wt%), based on the weight of the dough composition. In some embodiments as described herein, water is present in an amount in the range of 10-35 wt% (e.g., in the range of 15-35 wt%, or 20-35 wt%, or 25-35 wt%), based on the weight of the dough composition.

[0047] In some embodiments, the film-forming starch and the one or more legume flours are present in the dough composition in a weight ratio of at least 0.1:1. For example, in various embodiments, the film-forming starch and the one or more legume flours are present in weight ratio of at least 0.15:1 or at least 0.2:1. In some embodiments as described herein, the film-forming starch and the one or more legume flours are present in a weight ratio in the range of 0.1:1 to 0.3:1. For example, in various embodiments, the film-forming starch and the one or more legume flours are present in a weight ratio in the range of 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1, or 0.15:1 to 0.3:1, or 0.15:1 to 0.25:1, or 0.15:1 to 0.20:1, or 0.2:1 to 0.3:1.

[0048] In some embodiments, the one or more oils or fats and the one or more legume flours are present in a weight ratio of at least 0.05:1 or at least 0.1:1. For example, in various embodiments as described herein, the one or more oils or fats and the one or more legume flours are present in a weight ratio in the range of 0.05:1 to 0.3:1, or 0.05:1 to 0.25:1, or 0.05:1 to 0.2:1, or 0.1:1 to 0.3:1, or 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1.

[0049] In some embodiments as described herein, the water and the one or more legume flours are present in a weight ratio of at least 0.4:1, at least 0.5:1, or at least 0.6:1. For example, in various embodiments as described herein, the water and the one or more legume flours are present in a weight ratio in the range of 0.4:1 to 0.7:1, or 0.4:1 to 0.6:1, or 0.5:1 to 0.7:1, or 0.5:1 to 0.6:1.10

[0050] In some embodiments of the disclosure as described herein, the dough composition further comprises an emulsifier. In some embodiments as described herein, the emulsifier has a hydrophilic-lipophilic balance (HLB) ratio of at least 3 (e.g., at least 5, or at least 7). As would be understood by the skilled person, the HLB ratio is a measure of the balance of hydrophilic or hydrophobic properties of an emulsifier, with a higher number corresponding to hydrophilic compounds and a lower number corresponding to hydrophobic compounds. In some embodiments, the emulsifier has a HLB ratio in the range of 1-7. In various embodiments as described herein, the emulsifier has an HLB ratio in the range of 2- 7, or 3-7, or 1-6, or 2-6, or 3-6, or 1-5, or 2-5, or 3-5. The emulsifier can be selected from a variety of emulsifiers known in the art. In some embodiments as described herein, the emulsifier comprises a lecithin. For example, in some embodiments, the emulsifier comprises a sunflower lecithin, soy lecithin, or egg lecithin. In some embodiments as described herein, the emulsifier is a lecithin selected from sunflower lecithin, soy lecithin, or egg lecithin. In some embodiments of the present disclosure, the emulsifier comprises soy lecithin. In some embodiments as described herein, the emulsifier is soy lecithin. In various embodiments as described herein, the emulsifier may be present in a mass ratio of emulsifier to the one or more oils or fats in the range of 1:50-1:10, or 1:40-1:10, or 1:30-1:10, or 1:50-1:15, or 1:40-1:15, or 1:30-1:15, or 1-50-1:20, or 1:40-1:20, or 1:30-1:20.

[0051] In some embodiments as described herein, the dough composition further comprises one or more gluten-free non-leguminous flours. For example, in some embodiments as described herein, the one or more gluten-free non-leguminous flours are each independently selected from potato flour, corn flour, rice flour, sorghum flour, buckwheat flour, oat flour, quinoa flour, teff flour, amaranth flour, cassava flour, and arrowroot flour. In some embodiments, the one or more gluten-free non-leguminous flours are present in the dough composition in a total amount of no more than 20 wt %, based on the weight of the dough composition. For example, in various embodiments, the one or more gluten-free non-leguminous flours are present in the dough composition in a total amount of no more than 15 wt%, or no more than 10 wt%, or no more than 5 wt%, based on the weight of the dough composition.

[0052] In some embodiments as described herein, the dough composition is a gluten- free dough composition (i.e. substantially free of gluten). As such, in some embodiments, the dough composition does not include a substantial amount (e.g., or any amount) of gluten-containing components. For example, in various embodiments, the dough composition includes no more than 1 wt% gluten on a dry solids basis, e.g., no more than 0.5 wt% gluten, or no more than 0.25 wt% gluten on a dry solids basis.11

[0053] In some embodiments as described herein, the dough composition further comprises an effective amount of a leavening agent. The leavening agent may be selected from a variety of leavening agents known in the art. In some embodiments, the leavening agent comprises a chemical leavening agent. For example, the chemical leavening agent may be selected from a bicarbonate such as sodium bicarbonate, potassium bicarbonate, or ammonium bicarbonate. In some embodiments, the leavening agent is a chemical leavening agent, e.g., a bicarbonate such as sodium bicarbonate, potassium bicarbonate or ammonium bicarbonate. In some embodiments, the leavening agent further comprises one or more acids. For example, example, in some embodiments, the leavening agent further comprises tartaric acid, mono-calcium phosphate, or sodium aluminum sulfate. In other embodiments, the leavening agent comprises yeast. For example, in some embodiments as described herein, the leavening agent is yeast. In various embodiments as described herein, the leavening agent is present in an effective amount of no more than 1 wt%, no more than 0.6 wt%, or no more than 0.4 wt%, based on the weight of the dough composition. In other embodiments as described herein, the dough composition is substantially free of yeast.

[0054] In some embodiments as described herein, the dough composition further comprises sodium chloride. For example, in various embodiments as described herein, the sodium chloride is present in an amount in a range up to 3 wt%, or up to 2.5 wt%, or up to 2 wt%, or up to 1.5 wt%, based on the weight of the dough composition.

[0055] In some embodiments as described herein, the dough composition further comprises one or more additional components. For example, the dough composition may further comprise stabilizing additives, pH balance additives, viscosity modifiers, and flavor additives.

[0056] In some embodiments as described herein, the one or more legume flours, the film-film forming starch, the one or more oils or fats, the water, the emulsifier (if present), the leavening agent (if present) and the salt (if present) make up at least 90 wt% of the weight of the dough composition. For example, in various embodiments as described herein, the one or more legume flours, the film-film forming starch, the one or more oils or fats, the water, the emulsifier (if present), the leavening agent (if present) and the salt (if present) make up at least 95 wt%, or at least 98 wt%, or at least 99 wt% of the weight of the dough composition.

[0057] As described above, one of the desirable properties of the dough composition is to provide a soft dough that can be easily machinable. The softness / firmness of the dough composition describe herein can be quantified by the total work of compression of the12  dough. As used herein, the total work of compression of the dough is measured in accordance with the Miller Dough Test, as described in the Examples below. In some embodiments as described herein, the dough composition has a firmness as measured by a total work of compression, wherein the total work of compression is at least 5000 g^mm. For example, in various embodiments, the dough composition has a firmness as measured by a total work of compression, wherein the total work of compression is in the range of 5000- 15000 g^mm, or 5000-10000 g^mm, or 5000 to 7500 g^mm, or 5500-15000 g^mm, or 5500- 10000 g^mm, or 5500-7500 g^mm.

[0058] Along with providing a soft dough, the dough composition described herein is also non-sticky. The non-sticky / stickiness of the dough composition describe herein can be quantified by the total work of adhesion of the dough. As used herein, the total work of adhesion of the dough is also measured in accordance with the Miller Dough Test as described in the Examples below. In some embodiments as described herein, the dough composition has a stickiness as measured by a total work of adhesion, wherein the total work of adhesion of is at least -5000 g^mm. For example, in various embodiments, the dough composition has a stickiness as measured by a total work of adhesion, wherein the total work of adhesion in the range of -5000 to -1000 g^mm, or -4500 to -1000 g^mm, or - 4000 to -1000 g^mm, or -5000 to -1500 g^mm, or -4500 to -1500 g^mm, or -4000 to -1500 g^mm.

[0059] The dough compositions as described herein also expand upon baking to provide a light and crispy texture to a baked product. In some embodiments as described herein, the dough composition expands by at least two times (e.g., at least three times, or at least four times) an unbaked height of the dough composition, when sheeted to 1.10 mm and baked in a combination radiant convective oven with the following program: 150 °C for 2 minutes; linear ramp up to 225 °C over 2 minutes; 225 °C for 2 minutes. For example, in various embodiments, the dough composition expands in a range of 2 to 5 times (e.g., in the range of 3 to 5 times, or 2 to 4 times, or 3 to 4 times) an unbaked height of the dough composition, when sheeted to 1.10 mm and baked as described above. In some embodiments as described herein, the dough composition has a high perception of crispiness when sheeted at 1.10 mm and baked at as described above.

[0060] Another aspect of the present disclosure provides a method for preparing a dough composition, such as the dough composition as described herein. The method includes combining one or more legume flours and a film forming starch to provide a dry mix; combining the dry mix with one or more oils or fats to provide a dough precursor; and combining the dough precursor with water to provide the dough composition. The one or more legume flours, film-forming starch, one or more oils or fats, and water, may be used as13  described herein with respect to the dough composition. The person of ordinary skill in the art can use conventional dough preparation techniques to provide doughs of the disclosure.

[0061] As described above, the method requires combining one or more legume flours and a film forming starch to provide a dry mix. The dry mix can also include any other dry components, e.g., salt, seasonings, flavorings, leavening agents. The dry mix can be mixed to substantial homogeneity.

[0062] The method also includes combining the dry mix with one or more oils or fats to provide the dough precursor. In some embodiments, combining the dry mix with the one or more oils or fats comprises adding the one or more oils or fats to the dry mix while mixing the dry mix. In some embodiments, combining the dry mix with the one or more oils or fats comprises mixing until the dry mix and the one or more oils or fats are homogenously incorporated.

[0063] The method also includes combining the dough precursor with water to provide the dough composition. In some embodiments, combining the dough precursor with water comprises adding the water to the dough precursor while mixing the dough precursor. In some embodiments, combining the dough precursor with water comprises mixing until the dough precursor and water are homogenously incorporated.

[0064] Additional additives (e.g., a leavening agent, sodium chloride, a stabilizing additive, pH balance additive, viscosity modifier, or flavor additive) can be added at an appropriate time as understood by the person of ordinary skill in the art. Moreover, the dough composition can be combined with one or more inclusions, such as seeds, nuts, fruits; these become part of the dough composition that is formed and cooked, but as noted above are not used in the calculation of weight proportions of various materials in the dough composition itself.

[0065] As described above, the method provides a dough composition. In some embodiments, the dough composition is as described herein. As such, another aspect of the present disclosure provides a dough composition prepared by the method as described herein.

[0066] Another aspect of the present disclosure provides a method for using a dough composition (e.g., as describe herein) to provide a cooked food product. The method includes providing the dough composition; forming the dough composition into a desired shape; and cooking the dough composition (e.g., by baking) to provide a cooked food product. In some embodiments as describes herein, providing the dough composition is accomplished by preparing the dough composition as described herein.14

[0067] As described above, the method includes forming the dough composition into a desired shape. In some embodiments, forming the dough composition comprises rolling, sheeting, folding, stamping, and / or cutting the dough composition. In some embodiments as described herein, the desired shape is a sheet. For example, the desired shape may be a rectangular sheet, square sheet, triangular sheet, ovular sheet, or circular sheet. As would be understood by the skilled person, a sheet has a smaller height relative to the length and width of the shape. However, the length and width are not particularly limited. Here, too, the person of ordinary skill in the art can use a variety of conventional techniques in shaping the dough composition.

[0068] The method also includes cooking the dough composition. In some embodiments, cooking the dough composition comprises heating the dough at a temperature and for a time to sufficient to (e.g., completely) cook the dough. The cooking can be, e.g., a baking. In various embodiments as described herein, baking is conducted at a temperature in the range of 100-250 °C, or 150-250 °C, or 200-250 °C. In some embodiments, the baking is conducted for a time of at least 2 minutes (e.g., at least 3 minutes). For example, in various embodiments as described herein, baking is conducting for a time in the range of 2 to 20 minutes, or 2 to 10 minutes, or 2 to 5 minutes, or 3 to 20 minutes, or 3 to 10 minutes, or 3 to 5 minutes. Of course, the person of ordinary skill in the art will appreciate that other cooking techniques, e.g., frying, can be used to cook the shaped dough composition, and the person of ordinary skill in the art can adapt conventional techniques to cook the dough.

[0069] The cooked food products described herein can take a number of forms. In some embodiments as described herein, the baked food product is a cracker, a pastry, a biscuit, a pie crust, a baked pizza dough, or a pretzel. For example, in some embodiments as described herein, the baked food product is a cracker.

[0070] Another aspect of the disclosure is a cooked food product that comprises a cooked dough that is a cooked product of a dough composition as described herein. EXAMPLES

[0071] The Examples that follow are illustrative of specific embodiments of the composition and method of the disclosure, and various uses thereof. They are set forth for explanatory purposes only, and are not to be taken as limiting the scope of the disclosure.

[0072] Example 1. Dough Preparation

[0073] A variety of legume-flour based doughs as described herein were prepared and evaluated for their firmness and stickiness. To prepare the dough, the flour, starch, and15  other minor dry components were added to a mixing bowl. An oil and a lecithin were then added to the mixing bowl and mixed with the dry components for 30 seconds at a low speed using a Hobart A120 planetary mixer with a flat beater. A water ammonium bicarbonate solution was then added to the mixer while mixing at 120 second at a low speed and 90 seconds at a medium speed. The following table details the dough compositions prepared.

[0074] Table 1.

[0075] In Table 1, the chickpea flour used in all compositions was ARTESA 10 Chickpea Flour from Tate & Lyle, except for composition 5, which used a different chickpea flour. The film-forming starch used in all compositions was XPANDR 612 starch from Tate & Lyle, which has an RVA final viscosity after 1 hour at 25 °C of about 249 centipoise, an RVA peak-and-breakdown time of about 150 s at 25 °C, and an amylopectin content in the range of 95-100 wt%. It is about 100% soluble.

[0076] Example 2. Characterization of Dough

[0077] The dough compositions of Example 1 were than examined to quantify the dough firmness and stickiness. A Miller Short Dough Test was conducted with a Stable Micro Systems TA-85 texture analyzer to determine these qualities. The texture analyzer settings used for the test are described in Table 2.16

[0078] Table 2.

[0079] Three measurements were taken per dough sample using the pattern shown in FIG.1 to avoid edge effects.

[0080] The results of the texture analysis are shown in FIGS.2 and 3. In FIG.2, traces of the resistive force of the dough composition versus time are shown. A positive peak corresponds to the firmness and can be quantified as the positive area of the curve (i.e. work of compression). A negative peak corresponds to the stickiness of the dough and can be quantified as the negative area of the curve (i.e., work of adhesion). FIG.3 shows the total work of compression and total work of adhesion as calculated from the curves of FIG.2.

[0081] From the texture analysis, it was found that small adjustments have larger effects when starting from a hard firm dough, however large adjustments to already soft extensible doughs have much reduced effects. The large effects can be seen in the difference between dough composition 1 and 2, but much smaller effects are observed between dough compositions 2, 3, 6, and even 7.

[0082] The effect of lecithin was more pronounced than expected. The same dough made with (dough composition 3) and without (dough composition 4) lecithin are quite different. The dough without lecithin is bother harder (peak and work of compression) and stickier (work of adhesion) than the dough containing lecithin. Without intending to be bound by theory, the inventors submit that lecithin provides better and more uniform oil distribution. Soybean lecithin has a low HLB value and is more lipophilic in nature, but the inventors believe that improved performance may be achieved by using a much higher HLB valued17  emulsifier that is more hydrophilic in what essentially can be viewed as an oil-in-water emulsion.

[0083] Based on FIG.2, none of these doughs would be considered sticky since water was being limited for machinability. The highest fat levels are the least sticky. The dough without lecithin is slightly lower in fat which could explain some of the increased stickiness but may also be due to how well the fat has been distributed throughout the dough.

[0084] Dough composition 5 also exhibits lower stickiness. The chickpea flour used in this dough was a non-separated chickpea flour, which has a different water holding capacity and oil holding capacity than do the ARTESA 10 flours.

[0085] Example 3. Forming and Baking

[0086] The dough compositions described in Example 1 were then formed into sheets and baked. Initially, a pre-sheet of dough was prepared using a Rondo reversible sheeter until a sheet of approximately 3.5 mm was obtained. The dough sheet was when cut into 11 mm wide strips and transferred to an R-Tech finish line to provide a final 1.00 mm thickness.

[0087] The dough compositions were then baked in a combination radiant convective oven with the following program: about 150 °C for about 2 minutes; linear ramp up to about 225 °C over about 2 minutes; about 225 °C for about 2 minutes. The overall heat and top heat in zones 1 and 2 were lowered to allow expansion before setting in zones 3 and 4. Zone 5 manages color. The conveyer speed, roller speed and gap settings were monitored and adjusted during baking to maintain a 1.10 mm final sheet thickness. The overall bake time was 3.6 minutes and the belt speed of the over was 1.62 m / min. The baked doughs were cooled for at least one hour and sealed in a foil bag before characterization.

[0088] Example 4. Characterization of Baked Dough

[0089] To measure the degree of bake expansion for each dough composition, the stack height of the baked dough was measured. Stack height of a non-uniform bubbled crackers is a difficult task to measure due to piece to piece randomness and how crackers stack, shift and settle. To perform the measurement, five crackers were stacked on top of each other and each cracker was oriented right side up. The height of the stack was measured using a height gauge and the results were normalized by the stack weight. The average of five stacks (normalized by stack weight) for each baked dough is shown in FIG.4.

[0090] Example 5. Sensory Characterization of Baked Dough

[0091] The baked dough samples described in Example 3 were then evaluated by a blinded small group and scoring each on perceived hardness and fracturability.18

[0092] Only hardness and fracturability were scored as these are the most closely related to consumer terms of crunchiness and crispiness. The results are shown in FIG.5A. Hardness was defined as the force required to compress through the product, with a Ritz cracker being the anchor of the lower bound and assigned a value of three, and a Wheat Thin being the anchor of the upper bound and assigned a value of seven. Fracturability was defined by how the sample breaks into pieces. The lower bound was defined as crumbling into a lot of small pieces and the upper bound was defined as cleaning breaking in half. The anchors used were a Cheez-it, given a value of six and a half, and a Wheat Thin, given a value of eight.

[0093] Crispiness and crunchiness are complex measures. Hardness and fracturability are related to these properties but easier to define and measure consistently. There is a general trend seen with increased levels of fat, as softness increases so does expansion and crispiness, shown by the line in FIG.5A. The vertically stacked items of equal fracturability / crispiness have different levels of hardness / crunchiness but may also be of different fat content and dough softness.

[0094] Baked dough sample 3 (with lecithin), baked dough sample 4 (without lecithin) and baked dough sample 5 (with the different flour) of equal fat content fall in very different regions of texture map.

[0095] FIG.5B is a picture of the low factorability (and high crispiness) of baked dough sample 1.

[0096] Conclusion

[0097] It is known that chickpea flour holds water through wetting, wicking and water holding capacity of compositional protein, fiber and fat. The present inventors have noted that ARTESA 10 chickpea flour has a very fine particle size that makes it especially sensitive to water. The tight packing particles reduces voids as available space for water wicking. Fine grinding of flour also separates the protein from the starch allowing the protein to hydrate and solubilize. Reduced wicking and protein solubilization can both contribute to stickiness. While the present inventors note that even if reducing the amount of water alone is can possibly be used to provide a dough that can be sheeted and processed, this can result in hard crunchy and / or glassy products, which are often not desirable.

[0098] The present inventors have found that increasing dough softness by adding fat and optionally an accompanying emulsifier (together with relatively less water) can blunt this sensitivity leading to a soft and non-sticky dough with good machinability. The dough is extensible with lowered levels of dough memory, spring back and elasticity. Higher levels of oil in lieu of water can add dough softness while remaining non-sticky. The amount of water19  is kept to a minimum required to functionalize film-forming starch into solubilized flexible film. Higher water amounts would otherwise lead to sticky texture and difficult to process dough from too much soluble starch or low water holding capacity of chickpea flour. As such, a balance between the water (WHC) and oil (OHC) holding capacities of the film-forming starches and of legume flour can create dough softness without stickiness required for good machinability and baked expansion. To compare the dough softness and elasticity with the baked expansion, the dough elasticity as measured in Example 2 and the baked expansion as measured in Example 4 were plotted on the same graph, as shown in FIG.6.

[0099] From FIG.6, it can be seen that increasing softness up to a point maximizes baked expansion, depicted as dough composition 6 (peak of the bow in FIG.6), beyond which lowered expansion is expected due to the oil / fat disruption of the starch matrix and / or lowered starch solubilization and film elasticity. Either side of this peak in the same general region also achieve high levels of crispiness with more or less expansion, as shown by the box in FIG.6. This region is very robust allowing a wide range of oil / fat. Stack height per mass of product fits the hypothesis set forth that increased levels of softness contributes to baked expansion and perception of hardness or fracturability. Fat content and resultant dough texture can be targeted for desired appearance and levels of expansion. The combination of vegetable oil and soybean lecithin increases effectiveness of dough softening and baked expansion, which increases perceived crispiness. Vegetable oil content in the range of 14-20% of the flour weight leads to the highest levels of baked expansion and crispiness perceptions. Vegetable oil content in the range of 20-30% of flour weight leads to high perception of crispiness, but with lowered baked expansion caused either by starch matrix disruption or lowered starch solubilization and film elasticity. When vegetable oil content is less than 14% of flour weight, a harder firmer dough is created with reduced baked expansion and harder crunchier textures.

[0100] Film-forming starches improve dough cohesion and bake expansion in legume flour snacks similar to snacks made with other substrates. Film-forming starches can be used to recreate some viscoelastic properties required for proper sheeting. The film-forming starch provides cohesiveness, extensibility and a degree of expansion in the dough composition, whether it is made with chickpea flour or a different legume flour.

[0101] It is understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be incorporated within the spirit and purview of this application and scope of the appended claims. All publications, patents, and patent applications cited herein are hereby incorporated herein by reference for all purposes.20

[0102] Additional aspects of the disclosure are provided by the following enumerated embodiments, which may be combined in any number and in any combination that is not logically or technically inconsistent. Embodiment 1. A dough composition comprising: one or more legume flours present in a total amount in the range of 40-70 wt%, based on the weight of the dough composition; a film-forming starch present in an amount in the range of 5-20 wt%, based on the weight of the dough composition, the film-forming starch having an amylopectin content of at least 80 wt%, an RVA final viscosity after 1 hour at 25 C of no more than 900 centipoise, and an RVA peak-and-breakdown time of no more than 500 s at 25 °C; one or more oils or fats present in a total amount in the range of 5-30 wt%, based on the weight of the dough composition; and water present in an amount in the range of 10-40 wt%, based on the weight of the dough composition. Embodiment 2. The dough composition of embodiment 1, wherein the one or more legume flours comprise (or are) one or more pulse flours. Embodiment 3. The dough composition of embodiment 1 or embodiment 2, wherein the one or more legume flours comprise (or are) chickpea flour. Embodiment 4. The dough composition of any of embodiments 2-3, wherein the one or more pulse flours comprise one or more of pea flour and lentil flour. Embodiment 5. The dough composition of any of embodiments 1-4, wherein the one or more legume flours comprise one or more of peanut flour and cashew flour. Embodiment 6. The dough composition of any of embodiments 1-5, wherein the one more legume flours comprise one or more bean flours. Embodiment 7. The dough composition of embodiment 6, wherein the one or more bean flours comprise (or are) soybean flour.21  Embodiment 8. The dough composition of any of embodiments 1-6, having no more than 10 wt% soybean flour, e.g., no more than 5 wt% soybean flour. Embodiment 9. The dough composition of any of embodiments 1-8, wherein the dough composition comprises one legume flour (e.g., chickpea flour). Embodiment 10. The dough composition of any of embodiments 1-9, wherein the dough composition comprises at least two (e.g., at least three) legume flours. Embodiment 11. The dough composition of any of embodiments 1-10, wherein the one or more legume flours have a d50particle size in the range of 1-50 microns, e.g., in the range of 5-50 microns, or 10-50 microns, or 1-35 microns, or 5-35 microns, or 10-35 microns. Embodiment 12. The dough composition of any of embodiments 1-10, wherein the one or more legume flours have a d50particle size in the range of 1-30 microns, e.g., 5-30 microns, 10-30 microns, or 1-25 microns, or 5-25 microns, or 10-25 microns. Embodiment 13. The dough composition of any of embodiments 1-12, wherein the one or more legume flours have a total oil / fat content of no more than 7 wt%, e.g., no more than 5 wt%, or no more than 3 wt%. Embodiment 14. The dough composition of any of embodiments 1-13, wherein the d10value of the legume flour is at least 10% of the d50value, e.g., at least 15% of the d50value, or at least 20% of the d50value. Embodiment 15. The dough composition of any of embodiments 1-14, wherein the d90value of the legume flour is no more than 10 times the d50value, e.g., no more than 7 times the d50value, or no more than 5 times the d50value. Embodiment 16. The dough composition of any of embodiments 1-15, wherein the one or more legume flours are present in a total amount in the range of 40-65 wt% (e.g., in the range of 40-60 wt%, or 40-55 wt%, or 40-50 wt%), based on the weight of the dough composition. Embodiment 17. The dough composition of any of embodiments 1-15, wherein the one or more legume flours are present in a total amount in the range of 45-70 wt% (e.g., in the22  range of 45-65 wt%, or 45-60 wt%, or 45-55 wt%, or 45-50 wt%), based on the weight of the dough composition. Embodiment 18. The dough composition of any of embodiments 1-15, wherein the one or more legume flours are present in a total amount in the range of 50-70 wt% (e.g., in the range of 50-65 wt%, or 50-60 wt%, or 50-55 wt%), based on the weight of the dough composition. Embodiment 19. The dough composition of any of embodiments 1-18, wherein chickpea flour is present in a total amount in the range of 25-65 wt% (e.g., in the range of 25-60 wt%, or 25-55 wt%, or 25-50 wt%), based on the weight of the dough composition. Embodiment 20. The dough composition of any of embodiments 1-18, wherein chickpea flour is present in a total amount in the range of 40-70 wt% (e.g., in the range of 40-65 wt%, or 40-60 wt%, or 40-55 wt%, or 40-50 wt%), based on the weight of the dough composition. Embodiment 21. The dough composition of any of embodiments 1-15 and 18, wherein chickpea flour is present in a total amount in the range of 50-70 wt% (e.g., in the range of 50-65 wt%, or 50-60 wt%, or 50-55 wt%), based on the weight of the dough composition. Embodiment 22. The dough composition of any of embodiments 1-21, wherein the film- forming starch has an amylopectin content of at least 85 wt%, e.g., at least 90 wt%. Embodiment 23. The dough composition of any of embodiments 1-21, wherein the film- forming starch has an amylopectin content of at least 95 wt%, e.g., at least 99 wt%. Embodiment 24. The dough composition of any of embodiments 1-23, wherein the film- forming starch has an RVA final viscosity after 1 hour at 25 °C of no more than 800 centipoise, e.g., no more than 750 centipoise or no more than 700 centipoise. Embodiment 25. The dough composition of any of embodiments 1-23, wherein the film- forming starch has an RVA final viscosity after 1 hour at 25 °C of no more than 650 centipoise, e.g., no more than 600 centipoise.23  Embodiment 26. The dough composition of any of embodiments 1-23, wherein the film- forming starch has an RVA final viscosity after 1 hour at 25 °C of no more than 550 centipoise, e.g., no more than 500 centipoise. Embodiment 27. The dough composition of any of embodiments 1-26, wherein the film forming starch has an RVA final viscosity after 1 hour at 25 °C of at least 25 centipoise, e.g., at least 50 centipoise. Embodiment 28. The dough composition of any of embodiments 1-26, wherein the film forming starch has an RVA final viscosity after 1 hour at 25 °C of at least 75 centipoise, e.g., at least 100 centipoise. Embodiment 29. The dough composition of any of embodiments 1-28, wherein the film- forming starch has an RVA peak-and-breakdown time of no more than 450 s at 25 °C, e.g., no more than 400 s. Embodiment 30. The dough composition of any of embodiments 1-28, wherein the film- forming starch has an RVA peak-and-breakdown time of no more than 350 s at 25 °C, e.g., no more than 300 s. Embodiment 31. The dough composition of any of embodiments 1-30, wherein the film- forming starch is a pregelatinized starch. Embodiment 32. The dough composition of any of embodiments 1-30, wherein the film- forming starch is a cold-water-swelling starch. Embodiment 33. The dough composition of any of embodiments 1-32, wherein the film- forming starch has a percent solubles of at least 20 wt%, e.g., at least 40 wt%, or at least 60 wt%. Embodiment 34. The dough composition of any of embodiments 1-33, wherein the film- forming starch has a sedimentation volume of at least 50 mL / g, e.g., at least 55 mL / g or at least 60 mL / g. Embodiment 35. The dough composition of any of embodiments 1-34, wherein the film forming starch has a sum of percent solubles (expressed in wt%) and sedimentation volume (expressed in mL / g) that is at least 50, e.g., at least 55, or at least 60).24  Embodiment 36. The dough composition of any of embodiments 1-35, wherein the film- forming starch is produced from waxy corn, potato, or tapioca (e.g., from waxy corn). Embodiment 37. The dough composition of any of embodiments 1-36, wherein the film- forming starch is chemical modified (e.g., wherein the film-forming starch is modified by acid- modification (which can reduce viscosity); bleaching, oxidizing, chemical inhibition, for example, with phosphate or adipate; substitution via acetylation, hydroxypropylation, hydroxyethylation, octenylsuccination, or carboxymethylation). Embodiment 38. The dough composition of any of embodiments 1-36, wherein the film- forming starch is a clean-label starch. Embodiment 239. The dough composition of any of embodiments 1-38, wherein the film forming starch is present in an amount in the range of 5-15 wt% (e.g., in the range of 5-10 wt%), based on the weight of the dough composition. Embodiment 40. The dough composition of any of embodiments 1-38, wherein the film forming starch is present in an amount in the range of 10-20 wt% (e.g., in the range of 10-15 wt%), based on the weight of the dough composition. Embodiment 41. The dough composition of any of embodiments 1-40, wherein the one or more oils or fats comprise (or are) one or more oils. Embodiment 42. The dough composition of any of embodiments 1-40, wherein the one or more oils or fats are independently selected from canola oil, soybean oil, grapeseed oil, flaxseed oil, vegetable oil, corn oil, sunflower oil, safflower oil, olive oil, avocado oil, and peanut oil. Embodiment 43. The dough composition of any of embodiments 1-40, wherein the one or more oils or fats are canola oil or vegetable oil. Embodiment 44. The dough composition of any of embodiments 1-43, wherein the dough composition comprises one oil or fat (e.g., canola oil). Embodiment 45. The dough composition of any of embodiments 1-43, wherein the dough composition comprises at least two oils or fats.25  Embodiment 46. The dough composition of any of embodiments 1-45, wherein the one or more oils or fats are present in a total amount in the range of 5-25 wt% (e.g., in the range of 5-20 wt%, or 5-14 wt%), based on the weight of the dough composition. Embodiment 47. The dough composition of any of embodiments 1-45, wherein the one or more oils or fats are present in a total amount in the range of 10-30 wt% (e.g., in the range of 10-25 wt%, or 10-20 wt%, or 10-14 wt%), based on the weight of the dough composition. Embodiment 48. The dough composition of any of embodiments 1-45, wherein the one or more oils or fats are present in a total amount in the range of 14-30 wt% (e.g., in the range of 14-25 wt%, or 14-20 wt%), based on the weight of the dough composition. Embodiment 49. The dough composition of any of embodiments 1-45, wherein the one or more oils or fats are present in a total amount in the range of 20-30 wt% (e.g., in the range of 20-25 wt%, or 25-30 wt%), based on the weight of the dough composition. Embodiment 50. The dough composition of any of embodiments 1-49, wherein the water is present in an amount in the range of 15-40 wt% (e.g., in the range of 20-40 wt%, or 25-40 wt%), based on the weight of the dough composition. Embodiment 51. The dough composition of any of embodiments 1-49, wherein the water is present in an amount in the range of 10-35 wt% (e.g., in the range of 15-35 wt%, or 20-35 wt%, or 25-35 wt%), based on the weight of the dough composition. Embodiment 52. The dough composition of any of embodiments 1-49, wherein the water is present in an amount in the range of 10-30 wt% (e.g., in the range of 15-30 wt%, or 20-30 wt%, or 25-30 wt%), based on the weight of the dough composition. Embodiment 53. The dough composition of any of embodiments 1-49, wherein the water is present in an amount in the range of 10-25 wt% (e.g., in the range of 15-25 wt%, or 20-25 wt%,), based on the weight of the dough composition. Embodiment 54. The dough composition of any of embodiments 1-53, wherein the film- forming starch and the one or more legume flours are present in weight ratio of at least 0.1:1 (e.g., at least 0.15:1, or 0.2:1).26  Embodiment 55. The dough composition of any of embodiments 1-53, wherein the film- forming starch and the one or more legume flours are present in a weight ratio in the range of 0.1:1 to 0.3:1 (e.g., in the range of 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1, or 0.15:1 to 0.3:1, or 0.15:1 to 0.25:1, or 0.15:1 to 0.20:1, or 0.2:1 to 0.3:1). Embodiment 56. The dough composition of any of embodiments 1-55, wherein the one or more oils or fats and the one or more legume flours are present in a weight ratio of at least 0.05:1 (e.g., at least 0.1:1). Embodiment 57. The dough composition of any of embodiments 1-55, wherein the one or more oils or fats and the one or more legume flours are present in a weight ratio in the range of 0.05:1 to 0.3:1 (e.g., in the range of 0.05:1 to 0.25:1, or 0.05:1 to 0.2:1, or 0.1:1 to 0.3:1, or 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1). Embodiment 58. The dough composition of any of embodiments 1-57, wherein the water and the one or more legume flours are present in a weight ratio of at least 0.4:1 (e.g., at least 0.5:1, or at least 0.6:1). Embodiment 59. The dough composition of any of embodiment 1-57, wherein the water and the one or more legume flours are present in a weight ratio in the range of 0.4:1 to 0.7:1 (e.g., in the range of 0.4:1 to 0.6:1, or 0.5:1 to 0.7:1, or 0.5:1 to 0.6:1). Embodiment 60. The dough composition of any of embodiments 1-59, further comprising an emulsifier having an HLB ratio of at least 3, at least 5, or at least 7. Embodiment 61. The dough composition of any of embodiments 1-59, further comprising an emulsifier having an HLB ratio in the range of 1-7, e.g., in the range of 2-7, or 3-7, or 1-6, or 2-6, or 3-6, or 1-5, or 2-5, or 3-5. Embodiment 62. The dough composition of embodiment 61, wherein the emulsifier comprises (or is) a lecithin (e.g., sunflower lecithin, soy lecithin, or egg lecithin). Embodiment 63. The dough composition of embodiment 61, wherein the emulsifier comprises (or is) soy lecithin.27  Embodiment 64. The dough composition of any of embodiments 60-63, wherein the emulsifier is present in a mass ratio of emulsifier to oil or fat in the range of 1:50-1:10, e.g., in the range of 1:40-1:10, or 1:30-1:10, or 1:50-1:15, or 1:40-1:15, or 1:30-1:15, or 1-50-1:20, or 1:40-1:20, or 1:30-1:20. Embodiment 65. The dough composition of any of embodiments 1-64, wherein the dough composition further comprises one or more gluten-free non-leguminous flours. Embodiment 66. The dough composition of embodiment 65, wherein the one or more gluten-free non-leguminous flours are each independently selected from potato flour, corn flour, rice flour, sorghum flour, buckwheat flour, oat flour, quinoa flour, teff flour, amaranth flour, cassava flour, and arrowroot flour. Embodiment 67. The dough composition of embodiment 65 or embodiment 66, wherein the one or more gluten-free non-leguminous flours are present in the dough composition in a total amount of no more than 20 wt % (e.g., no more than 15 wt%, or no more than 10 wt%, or no more than 5 wt%), based on the weight of the dough composition. Embodiment 68. The dough composition of any of embodiments 1-67, wherein the dough composition includes no more than 1 wt% gluten on a dry solids basis, e.g., no more than 0.5 wt% gluten, or no more than 0.25 wt% gluten. Embodiment 69. The dough composition according to any of embodiments 1-68, further comprising an effective amount of a leavening agent. Embodiment 70. The dough composition according to embodiment 69, wherein the leavening agent comprises (or is) a chemical leavening agent, e.g., a bicarbonate such as sodium bicarbonate, potassium bicarbonate or ammonium bicarbonate. Embodiment 71. The dough composition according to embodiment 70, wherein the leavening agent further comprises one or more acids, e.g., tartaric acid, mono-calcium phosphate, sodium aluminum sulfate. Embodiment 72. The dough composition according to embodiment 69, wherein the leavening agent comprises (or is) a yeast.28  Embodiment 73. The dough composition of any of embodiments 69-72, wherein the leavening agent is present in an effective amount of no more than 1 wt% (e.g., no more than 0.6 wt%, or no more than 0.4 wt%), based on the weight of the dough composition. Embodiment 74. The dough composition of any of embodiments 1-71 and 73, wherein the dough composition is substantially free of yeast. Embodiment 75. The dough composition of any of embodiments 1-74, further comprising sodium chloride. Embodiment 76. The dough composition of embodiment 75, wherein the sodium chloride is present in an amount in a range up to 3 wt%, based on the weight of the dough composition, e.g., up to 2.5 wt%, or up to 2 wt%, or up to 1.5 wt%. Embodiment 77. The dough composition of any of embodiments 1-76, wherein the dough composition further comprises one or more additional components (e.g., stabilizing additives, pH balance additives, viscosity modifiers, and flavor additives). Embodiment 78. The dough composition of any of embodiments 1-77, wherein the one or more legume flours, the film-film forming starch, the one or more oils or fats, the water, the emulsifier (if present), the leavening agent (if present) and the sodium chloride (if present) make up at least 90 wt% (e.g., at least 95 wt%, or at least 98 wt%, or at least 99 wt%) of the weight of the dough composition. Embodiment 79. The dough composition of any of embodiments 1-78, wherein the dough composition has firmness as measured by a total work of compression, wherein the total work of compression is at least 5000 g^mm. Embodiment 80. The dough composition of any of embodiments 1-79, wherein the dough composition has a firmness as measured by a total work of compression, wherein the total work of compression is in the range of 5000-15000 g^mm (e.g., in the range of 5000- 10000 g^mm, or 5000 to 7500 g^mm, or 5500-15000 g^mm, or 5500-10000 g^mm, or 5500- 7500 g^mm). Embodiment 81. The dough composition of any of embodiments 1-80, wherein the dough composition has a stickiness as measured by a total work of adhesion, wherein the total work of adhesion of at least -5000 g^mm.29  Embodiment 82. The dough composition of any of embodiments 1-80, wherein the dough composition has a stickiness as measured by a total work of adhesion, wherein the total work of adhesion in the range of -5000 to -1000 g^mm (e.g., in the range of -4500 to - 1000 g^mm, or -4000 to -1000 g^mm, or -5000 to -1500 g^mm, or -4500 to -1500 g^mm, or - 4000 to -1500 g^mm). Embodiment 83. The dough composition of any of embodiments 1-82, wherein the dough composition expands by at least two times (e.g., at least three times, or at least four times) an unbaked height of the dough composition, when sheeted to 1.10 mm and baked in a combination radiant convective oven with the following program: 150 °C for 2 minutes; linear ramp up to 225 °C over 2 minutes; 225 °C for 2 minutes. Embodiment 84. The dough composition of any of embodiments 1-82, wherein the dough composition expands in a range of 2 to 5 times (e.g., in the range of 3 to 5 times, or 2 to 4 times, or 3 to 4 times) an unbaked height of the dough composition, when sheeted to 1.10 mm and baked in a combination radiant convective oven with the following program: 150 °C for 2 minutes; linear ramp up to 225 °C over 2 minutes; 225 °C for 2 minutes. Embodiment 85. The dough composition of any of embodiments 1-84, wherein the dough composition has a high perception of crispiness when sheeted to 1.10 mm and baked in a combination radiant convective oven with the following program: 150 °C for 2 minutes; linear ramp up to 225 °C over 2 minutes; 225 °C for 2 minutes. Embodiment 86. A method for preparing a dough composition (e.g., of any of embodiments 1-85), the method comprising: combining one or more legume flours and a film forming starch to provide a dry mix; combining the dry mix with one or more oils or fats to provide a dough precursor; and combining the dough precursor with water to provide the dough composition. Embodiment 87. The method of embodiment 86, wherein the one or more legume flours is as described in any of embodiments 2-21. Embodiment 88. The method of embodiment 76 or embodiment 87, wherein the film forming starch is a described in any of embodiments 22-40.30  Embodiment 89. The method of any of embodiments 76-78, wherein the one or more oils or fats is a described in any of embodiments 41-49. Embodiment 90. The method of any of embodiments 86-89, wherein the water is as described in any of embodiments 50-54. Embodiment 91. The method of any of embodiments 86-90, wherein combining the dry mix with the one or more oils or fats comprises mixing the dry mix with one or more oils or fats until they are homogenously incorporated. Embodiment 92. The method of any of embodiments 86-91, wherein combining the dough precursor with water comprises adding the water to the dough precursor while mixing the dough precursor. Embodiment 93. The method of any of embodiments 86-92, wherein combining the dough precursor with water comprises mixing until the dough precursor and water are homogenously incorporated. Embodiment 94. The method of any of embodiments 86-93, wherein the method further comprises including one or more additional additives (e.g., a leavening agent, a stabilizing additive, pH balance additive, viscosity modifier, or flavor additive) in the dough composition. Embodiment 95. The method of any of embodiments 86-94, wherein the dough composition is as described in any of embodiments 1-85. Embodiment 96. A dough composition prepared by the method of any of embodiments 86-95. Embodiment 97. A method for using a dough composition to provide a cooked food product, the method comprising providing a dough composition (e.g., a dough composition of any of embodiments 1- 85 and 96, or a dough composition made by preparing the dough composition as described in any of embodiments 86-95); forming the dough composition into a desired shape; and cooking (e.g., by baking) the dough composition to provide a cooked food product.31  Embodiment 98. The method of embodiment 97, wherein forming the dough composition comprises rolling, folding, stamping, or cutting the dough composition. Embodiment 99. The method of embodiment 97 or embodiment 98, wherein the desired shape is a sheet (e.g., a rectangular sheet, square sheet, triangular sheet, ovular sheet, or circular sheet). Embodiment 100. The method of any of embodiments 97-99, wherein cooking the dough composition comprises heating the dough at a temperature and for a time to sufficient to (e.g., completely) cook the dough. Embodiment 101. The method of any of embodiments 97-100, wherein the cooking is baking conducted at a temperature in the range of 100-250 °C (e.g., in the range of 150-250 °C, or 200-250 °C). Embodiment 102. The method of embodiment 101, wherein the baking is conducted for a time of at least 2 minutes (e.g., at least 3 minutes). Embodiment 103. The method of embodiment 101, wherein the baking is conducting for a time in the range of 2 to 20 minutes (e.g., in the range or 2 to 10 minutes, or 2 to 5 minutes, or 3 to 20 minutes, or 3 to 10 minutes, or 3 to 5 minutes). Embodiment 104. A cooked food product comprising a cooked dough that is a cooked product of a dough composition of any of embodiments 1-85 or 86, or a dough made by a method according to any of embodiments 76-85. Embodiment 105. A method or cooked food product according to any of embodiments 97-104, wherein the cooked food product is a baked food product. Embodiment 106. A method or cooked food product according to any of embodiments 97-104, wherein the cooked food product is a cracker, a pastry, a biscuit, a pie crust, a baked pizza dough, or a pretzel (e.g., a cracker). Embodiment 107. The present disclosure relates generally to a dough composition including one or more legume flours present in a total amount in the range of 40-70 wt%, based on the weight of the dough composition; a film-forming starch present in an amount in the range of 5-20 wt%, based on the weight of the dough composition, the film-forming32  starch having an amylopectin content of at least 80 wt%, an RVA final viscosity after 1 hour at 25 C of no more than 900 centipoise, and an RVA peak-and-breakdown time of no more than 500 s at 25 °C; one or more oils or fats present in a total amount in the range of 5-30 wt%, based on the weight of the dough composition; and water present in an amount in the range of 10-40 wt%, based on the weight of the dough composition.

[0103] The particulars shown herein are by way of example and for purposes of illustrative discussion of the preferred embodiments of the present invention only and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of various embodiments of the disclosure. In this regard, no attempt is made to show structural details of the disclosure in more detail than is necessary for the fundamental understanding of the disclosure, the description taken with the drawings and / or examples making apparent to those skilled in the art how the several forms of the disclosure may be embodied in practice. Thus, before the disclosed processes and devices are described, it is to be understood that the aspects described herein are not limited to specific embodiments, apparatuses, or configurations, and as such can, of course, vary. It is also to be understood that the terminology used herein is for the purpose of describing particular aspects only and, unless specifically defined herein, is not intended to be limiting.

[0104] The terms “a,” “an,” “the” and similar referents used in the context of describing the disclosure (especially in the context of the following claims) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. Recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range. Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

[0105] All methods described herein can be performed in any suitable order of steps unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., “such as”) provided herein is intended merely to better illuminate the disclosure and does not pose a limitation on the scope of the disclosure otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the disclosure.

[0106] Unless the context clearly requires otherwise, throughout the description and the claims, the words ‘comprise’, ‘comprising’, and the like are to be construed in an inclusive33  sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to”. Words using the singular or plural number also include the plural and singular number, respectively. Additionally, the words “herein,” “above,” and “below” and words of similar import, when used in this application, shall refer to this application as a whole and not to any particular portions of the application.

[0107] As will be understood by one of ordinary skill in the art, each embodiment disclosed herein can comprise, consist essentially of or consist of its particular stated element, step, ingredient or component. As used herein, the transition term “comprise” or “comprises” means includes, but is not limited to, and allows for the inclusion of unspecified elements, steps, ingredients, or components, even in major amounts. The transitional phrase “consisting of” excludes any element, step, ingredient or component not specified. The transition phrase “consisting essentially of” limits the scope of the embodiment to the specified elements, steps, ingredients or components and to those that do not materially affect the embodiment.

[0108] Unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present disclosure. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.

[0109] Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.

[0110] Groupings of alternative elements or embodiments of the disclosure disclosed herein are not to be construed as limitations. Each group member may be referred to and claimed individually or in any combination with other members of the group or other elements found herein. It is anticipated that one or more members of a group may be included in, or deleted from, a group for reasons of convenience and / or patentability. When any such inclusion or deletion occurs, the specification is deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended claims.

[0111] Some embodiments of this disclosure are described herein, including the best mode known to the inventors for carrying out the disclosure. Of course, variations on these34  described embodiments will become apparent to those of ordinary skill in the art upon reading the foregoing description. The inventor expects skilled artisans to employ such variations as appropriate, and the inventors intend for the disclosure to be practiced otherwise than specifically described herein. Accordingly, this disclosure includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the disclosure unless otherwise indicated herein or otherwise clearly contradicted by context.

[0112] Furthermore, it is to be understood that the embodiments of the disclosure disclosed herein are illustrative of the principles of the present disclosure. Other modifications that may be employed are within the scope of the disclosure. Thus, by way of example, but not of limitation, alternative configurations of the present disclosure may be utilized in accordance with the teachings herein. Accordingly, the present disclosure is not limited to that precisely as shown and described. 35

Claims

We claim:

1. A dough composition comprising: one or more legume flours present in a total amount in the range of 40-70 wt%, based on the weight of the dough composition; a film-forming starch present in an amount in the range of 5-20 wt%, based on the weight of the dough composition, the film-forming starch having an amylopectin content of at least 80 wt%, an RVA final viscosity after 1 hour at 25 °C of no more than 900 centipoise, and an RVA peak-and-breakdown time of no more than 500 s at 25 °C; one or more oils or fats present in a total amount in the range of 5-30 wt%, based on the weight of the dough composition; and water present in an amount in the range of 10-40 wt%, based on the weight of the dough composition.

2. The dough composition of claim 1, wherein the one or more legume flours comprise one or more pulse flours.

3. The dough composition of claim 1, wherein the one or more legume flours comprise chickpea flour.

4. The dough composition of claim 1, wherein the legume flour has a d50particle size in the range of 1 to 50 microns.

5. The dough composition of claim 1, wherein the d10value of the legume flour is at least 15% of the d50value, and the d90value of the legume flour is no more than 7 times the d50value.

6. The dough composition of claim 1, wherein the one or more legume flours are present in a total amount in the range of 50-70 wt%, based on the weight of the dough composition.

7. The dough composition of claim 1, wherein the film-forming starch has an RVA final viscosity after 1 hour at 25 °C of in the range of 75-700 centipoise.36  8. The dough composition of claim 1, wherein the film-forming starch has an RVA peak- and-breakdown time of no more than 350 s at 25 °C.

9. The dough composition of claim 1, wherein the film-forming starch is a pregelatinized starch or is a cold-water-swelling starch.

10. The dough composition of claim 1, wherein the film forming starch has a sum of percent solubles (expressed in wt%) and sedimentation volume (expressed in mL / g) that is at least 50, e.g., at least 55, or at least 60).

11. The dough composition of claim 1, wherein the film-forming starch is a clean-label starch.

12. The dough composition of claim 1, wherein the film forming starch is present in an amount in the range of 10-20 wt%, based on the weight of the dough composition.

13. The dough composition of claim 1, wherein the one or more oils or fats comprise (or are) one or more oils, for example, canola oil or vegetable oil.

14. The dough composition of claim 1, wherein the one or more oils or fats are present in a total amount in the range of 10-30 wt%, based on the weight of the dough composition.

15. The dough composition of claim 1, wherein the water is present in an amount in the range of 10-30 wt%, based on the weight of the dough composition.

16. The dough composition of claim 1, wherein the film-forming starch and the one or more legume flours are present in a weight ratio in the range of 0.1:1 to 0.3:

1.

17. The dough composition of claim 1, wherein the one or more oils or fats and the one or more legume flours are present in a weight ratio in the range of 0.05:1 to 0.3:

1.

18. The dough composition of claim 1, wherein the water and the one or more legume flours are present in a weight ratio in the range of 0.4:1 to 0.7:

1.

19. The dough composition of claim 1, further comprising an emulsifier having an HLB ratio in the range of 1-7.37  20. The dough composition of claim 19, wherein the emulsifier comprises a lecithin (e.g., sunflower lecithin, soy lecithin, or egg lecithin).

21. The dough composition of claim 1, wherein the dough composition further comprises one or more gluten-free non-leguminous flours.

22. The dough composition of claim 1, wherein the dough composition includes no more than 0.5 wt% gluten.

23. The dough composition of claim 1, wherein the one or more legume flours, the film- film forming starch, the one or more oils or fats, the water, an emulsifier (if present), a leavening agent (if present) and sodium chloride (if present) make up at least 90 wt% of the weight of the dough composition.

24. A method for using a dough composition to provide a cooked food product, the method comprising providing a dough composition of any of claims 1-23; forming the dough composition into a desired shape; and cooking (e.g., by baking) the dough composition to provide a cooked food product.

25. A method of claim 24, wherein the cooked food product is a cracker, a pastry, a biscuit, a pie crust, a baked pizza dough, or a pretzel (e.g., a cracker).   38