Method and apparatus for correcting position of predetermined processing line, and processing method and apparatus

Abstract

A method (100) and apparatus (700) for correcting the position of a predetermined processing line, and a processing method and apparatus (800). The method (100) for correcting the position of a predetermined processing line is applied to a processing device, and comprises: acquiring first position information of a target predetermined processing line, the target predetermined processing line being a predetermined processing line to be corrected among at least one predetermined processing line (S110); on the basis of the first position information of the target predetermined processing line and second position information of a processing tool, determining a position deviation value (S120); comparing the position deviation value with a target deviation threshold (S130); and, when the position deviation value is less than or equal to the target deviation threshold, on the basis of the position deviation value, correcting the position of the target predetermined processing line, so as to process, on the basis of the corrected position of the target predetermined processing line, a piece to be processed (S140). The present application can avoid damage to pieces to be processed and reduce the hardware costs of processing devices.

Description

Method and device for correcting predetermined processing line position, processing method and device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 18, 2023, with application number 202311743466.6 and invention name “Method and device for correcting the position of a predetermined processing line, processing method and device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of image processing technology, and more specifically to a method for correcting a predetermined processing line position, a processing method, a predetermined processing line position correction device, a processing device, an electronic device, and a storage medium. Background Art

[0003] In the manufacturing industry, many devices are used in conjunction with X, Y, R, and vision positioning cameras to locate and process workpieces. For example, in the semiconductor industry, wafer splitting involves using a splitter (also known as a chipper) to split the wafer along the cut path, separating the chips from the entire wafer. During the splitting process, vision positioning is often used to determine the angle θ° of the wafer's cut path, and then the R axis is rotated by θ° to level the wafer's cut path.

[0004] When leveling the cutting path to be processed, the correction is generally performed near the center of the part. However, during machining, the workpiece is usually processed from the edge. Since the X- and Y-axes cannot be guaranteed to be 100% vertical during installation, the error will increase with the number of splits during the splitting process, resulting in the processing position not being in the center of the cutting path. Summary of the Invention

[0005] The present application is proposed in view of the above problems. The present application provides a method for correcting a predetermined processing line position, a processing method, a device for correcting a predetermined processing line position, a processing device, an electronic device, and a storage medium.

[0006] In a first aspect of the present application, a method for correcting the position of a predetermined processing line is provided, which is applied to a processing equipment, wherein the processing equipment includes a processing tool, the processing tool is used to process a workpiece along the predetermined processing line, and the workpiece includes at least one predetermined processing line extending along a first direction. The method includes: obtaining first position information of a target predetermined processing line, where the target predetermined processing line is the predetermined processing line to be corrected among the at least one predetermined processing lines; determining a position deviation value based on the first position information of the target predetermined processing line and second position information of the processing tool; comparing the position deviation value with a target deviation threshold; and when the position deviation value is less than or equal to the target deviation threshold, correcting the position of the target predetermined processing line according to the position deviation value, so as to process the workpiece according to the position of the corrected target predetermined processing line.

[0007] In one possible implementation, the target predetermined processing line is corrected in a preset order; before comparing the position deviation value with the target deviation threshold, the method further includes: determining the target deviation threshold based on an expected spacing between the current target predetermined processing line and the previous target predetermined processing line; wherein, when the expected spacing falls within any specific spacing range among at least two spacing ranges, the target deviation threshold is equal to the preset deviation threshold corresponding to the specific spacing range among the at least two preset deviation thresholds, the at least two spacing ranges correspond one-to-one to the at least two preset deviation thresholds, and a larger value of the spacing range corresponds to a larger corresponding preset deviation threshold.

[0008] In one possible implementation, at least two preset deviation thresholds include a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold is greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold correspond to two spacing ranges respectively, the boundary between the two spacing ranges is the preset spacing threshold, and the target deviation threshold is determined based on the expected spacing between the current target predetermined processing line and the previous target predetermined processing line, including: when the expected spacing is greater than or equal to the preset spacing threshold, determining the target deviation threshold as the first preset deviation threshold; when the expected spacing is less than the preset spacing threshold, determining the target deviation threshold as the second preset deviation threshold.

[0009] In one possible implementation, the workpiece to be processed is a wafer, the preset spacing threshold is equal to a specific multiple of the grain spacing of the wafer, the first preset deviation threshold is equal to a specific multiple of the minimum deviation threshold, the grain spacing is the spacing between two adjacent predetermined processing lines, the minimum deviation threshold is equal to the difference between the position of any first predetermined processing line after the movement and the position of the second predetermined processing line before the movement when the workpiece to be processed is moved one grain spacing along the second direction, the second predetermined processing line is a predetermined processing line adjacent to the first predetermined processing line and located on one side of the moving direction of the workpiece, and the second direction is the direction of a second coordinate axis perpendicular to the first coordinate axis corresponding to the first direction in a mechanical coordinate system used by the processing equipment.

[0010] In a possible implementation, before comparing the position deviation value with the target deviation threshold, the method further includes: determining at least two preset deviation thresholds based on first parameter setting information input by a user.

[0011] In a possible implementation, after comparing the position deviation value with the target deviation threshold, the method further includes: outputting alarm information when the position deviation value is greater than the target deviation threshold.

[0012] In a possible implementation, before comparing the position deviation value with the target deviation threshold, the method further includes: determining the target deviation threshold based on second parameter setting information input by the user.

[0013] In one possible implementation, the processing equipment includes a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the center of the field of view of the first image acquisition device; the first position information of the target predetermined processing line is represented by a first image position corresponding to a feature point on the target predetermined processing line in an image to be measured that includes the target predetermined processing line and is acquired by the first image acquisition device, or a first physical position corresponding to the first image position; the second position information of the processing tool is represented by a second image position corresponding to the center of the field of view of the first image acquisition device, or a second physical position corresponding to the second image position.

[0014] In a possible implementation, correcting the position of the target predetermined processing line according to the position deviation value includes: controlling the image acquisition device to move a corresponding distance according to the position deviation value to correct the position of the target predetermined processing line.

[0015] In one possible implementation, before obtaining the first position information of the target predetermined processing line, the method further includes: identifying a first feature point from a first image to be measured captured by the first image acquisition device, the first feature point being a feature point on any predetermined processing line; correcting the third predetermined processing line where the first feature point is located according to a first direction; after the correction is completed, moving the center of the field of view of the first image acquisition device to the physical position corresponding to when the first image acquisition device captured the first image to be measured; acquiring a second image to be measured captured after the first image acquisition device is moved; identifying a second feature point from the second image to be measured, the second feature point being a feature point on any predetermined processing line; moving the center of the field of view of the first image acquisition device by a corresponding distance according to an expected spacing between a fourth predetermined processing line where the second feature point is located and a starting target predetermined processing line in a first processing stage of at least one processing stage; and acquiring a third image to be measured captured after the first image acquisition device is moved and including the starting target predetermined processing line in the first processing stage, so as to perform the step of obtaining the first position information of the target predetermined processing line for the starting target predetermined processing line in the first processing stage based on the third image to be measured.

[0016] In one possible implementation, the processing equipment further includes a second image acquisition device, and the image acquisition range of the second image acquisition device is larger than the image acquisition range of the first image acquisition device. Before identifying the first feature point from the first image to be measured acquired by the first image acquisition device, the method further includes: identifying the contour of the workpiece to be processed from a fourth image to be measured acquired by the second image acquisition device, wherein when the second image acquisition device acquires the fourth image to be measured, the center of the field of view of the second image acquisition device coincides with the center of a carrying device for carrying the workpiece to be processed; determining a third image position of a product center of the workpiece to be processed in the fourth image to be measured based on the contour of the workpiece to be processed; and determining a third image position of a product center of the workpiece to be processed in the fourth image to be measured based on the fourth image to be measured. Determine the physical position difference corresponding to the image position difference based on the image position difference between the second image position and the third image position corresponding to the centers of the fields of view of the two image acquisition devices, and the conversion relationship between the image position and the physical position; move the carrying device into the field of view of the first image acquisition device, wherein the center of the moving carrying device coincides with the center of the field of view of the first image acquisition device; adjust the position of the carrying device based on the physical position difference, so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the center of the field of view of the first image acquisition device; and obtain the first image to be measured captured by the first image acquisition device after the adjustment is completed.

[0017] In one possible implementation, before determining the physical position difference corresponding to the image position difference based on the image position difference between the second image position corresponding to the center of the field of view of the second image acquisition device and the first image position and the conversion relationship between the image position and the physical position, the method further includes: acquiring a plurality of fifth images to be measured, the plurality of fifth images to be measured being images acquired by the first image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively in a plurality of fourth physical positions, the number of the plurality of fifth images to be measured being greater than or equal to 3, and any two of the plurality of fourth physical positions being different; for each of the plurality of fifth images to be measured, determining the image position of the identification feature in the fifth image to be measured according to a template image, the template image including the identification feature on the workpiece to be processed; and determining the conversion relationship according to the image position of the identification feature in the plurality of fifth images to be measured and the plurality of fourth physical positions.

[0018] In one possible implementation, the third predetermined processing line where the first feature point is located is corrected according to the first direction, including: taking the first feature point as a reference position point, sequentially determining multiple groups of position points, each group of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point, and along the first direction, the distance between the two position points included in each of the multiple groups of position points gradually increases, and different position points in the reference position point and the multiple groups of position points are position points corresponding to different feature points on the target predetermined processing line; after each group of position points is determined, calculating the connecting line between the first position point and the second position point in the group of position points. The connection angle relative to the first direction is used, and the following correction operation is performed: when the connection angle is greater than a preset angle threshold, the corresponding adjustment angle is determined according to the connection angle, and the position of the workpiece to be processed is adjusted based on the adjustment angle to correct the position of the third predetermined processing line on the workpiece to be processed; when the connection angle is less than or equal to the preset angle threshold, the correction is stopped; wherein, after each determination of a group of position points and the execution of the correction operation corresponding to the group of position points, the step of determining the next group of position points is performed, wherein, along the first direction, the spacing between two position points included in the next group of position points is greater than the spacing between two position points included in the current group of position points.

[0019] In a second aspect of the present application, a processing method is also provided, which is applied to a processing equipment, the processing equipment including a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, the workpiece including at least one predetermined processing line extending along a first direction, the method including: performing the following first processing operation: using the predetermined processing line position correction method of the first aspect mentioned above to determine the position of the target predetermined processing line during actual processing; controlling the processing tool to perform processing at the position of the target predetermined processing line.

[0020] In a possible implementation, at least one predetermined processing line is processed sequentially according to a preset order, and when any target predetermined processing line needs to be processed, a first processing operation is performed.

[0021] In one possible implementation, the method further includes: when it is necessary to process any non-target predetermined processing line other than the target predetermined processing line, performing the following second processing operation: determining the position of the non-target predetermined processing line based on the position of the previous predetermined processing line processed last time; and controlling the processing tool to perform processing at the position of the non-target predetermined processing line.

[0022] In a third aspect of the present application, a predetermined processing line position correction device is also provided, which is applied to processing equipment, wherein the processing equipment includes a processing tool, and the processing tool is used to process a workpiece to be processed along a predetermined processing line, and the workpiece to be processed includes at least one predetermined processing line extending along a first direction. The device includes: an acquisition module, used to obtain first position information of the target predetermined processing line, the target predetermined processing line is the predetermined processing line to be corrected among at least one predetermined processing lines; a first determination module, used to determine a position deviation value based on the first position information of the target predetermined processing line and the second position information of the processing tool; a comparison module, used to compare the position deviation value with a target deviation threshold; and a correction module, used to correct the position of the target predetermined processing line according to the position deviation value when the position deviation value is less than or equal to the target deviation threshold, so as to process the workpiece to be processed according to the position of the corrected target predetermined processing line.

[0023] In a fourth aspect of the present application, a processing device is also provided, which is applied to processing equipment. The processing equipment includes a processing tool, which is used to process a workpiece along a predetermined processing line. The workpiece includes at least one predetermined processing line extending along a first direction. The device includes an execution module, and the execution module includes a determination submodule and a control submodule. The determination submodule is used to use the predetermined processing line position correction device introduced in the third aspect above to determine the position of the target predetermined processing line during actual processing; the control submodule is used to control the processing tool to perform processing at the position where the target predetermined processing line is located.

[0024] According to the fifth aspect of the present application, an electronic device is also provided, including a processor and a memory, wherein the memory stores computer program instructions, and when the computer program instructions are run by the processor, they are used to execute the predetermined processing line position correction method provided in the first aspect and / or the processing method provided in the second aspect.

[0025] According to the sixth aspect of the present application, a storage medium is also provided, storing a computer program / instruction, which is used to execute the predetermined processing line position correction method provided in the first aspect and / or the processing method provided in the second aspect when running.

[0026] According to the predetermined processing line position correction method, predetermined processing line determination device, processing method, processing device, electronic device and storage medium of the embodiment of the present application, the position deviation value can be determined based on the first position information of the target predetermined processing line and the second position information of the processing tool. After comparing the position deviation value with the target deviation threshold, when the position deviation value is less than or equal to the target deviation threshold, the position of the target predetermined processing line is corrected according to the position deviation value. The workpiece to be processed is processed according to the corrected position of the target predetermined processing line. This solution determines whether the position of the current target predetermined processing line needs to be corrected by obtaining the first position information of the target predetermined processing line and the second position information of the processing tool, and corrects the position of the current target predetermined processing line when correction is required. In this way, it can be determined whether the current splitting position of the splitting knife is accurate to avoid damaging the workpiece to be processed. At the same time, it can also reduce the installation requirements for the verticality of the X-axis and the Y-axis in the processing equipment, thereby reducing the hardware cost of the processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0028] FIG1 shows a schematic flow chart of a method for correcting a predetermined processing line position according to an embodiment of the present application;

[0029] FIG2 is a schematic diagram showing an image coordinate system established for an image to be measured according to an embodiment of the present application;

[0030] FIG3 shows a schematic diagram of a workpiece to be processed according to one embodiment of the present application;

[0031] FIG4 shows a schematic diagram of a template image according to an embodiment of the present application;

[0032] FIG5 shows a schematic diagram of a fourth image to be measured according to an embodiment of the present application;

[0033] FIG6 shows a schematic flow chart of a first processing operation according to one embodiment of the present application;

[0034] FIG7 shows a schematic block diagram of a device for correcting a predetermined processing line position according to an embodiment of the present application;

[0035] FIG8 shows a schematic block diagram of a processing device according to an embodiment of the present application; and

[0036] FIG9 shows a schematic block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the present application more apparent, the following is a detailed description of example embodiments of the present application with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application described in this application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of this application.

[0038] To at least partially address the above-mentioned issues, an embodiment of the present application provides a method for correcting the position of a predetermined processing line. This method can be applied to any processing equipment capable of processing a workpiece along a predetermined processing line on the workpiece, such as a splitting machine. The processing equipment may include a processing tool. The processing tool is used to process the workpiece along the predetermined processing line. For example, when the processing equipment is a splitting machine, the processing tool may be a splitter, which can split the workpiece along the predetermined processing line. The workpiece may include at least one predetermined processing line extending along a first direction. In one possible implementation, the first direction may be the direction of a cleavage line generated when the splitter splits the workpiece along the predetermined processing line. The workpiece may be any product intended for processing, such as ceramics or wafers. The predetermined processing line is any characteristic line on the workpiece. In one example, the predetermined processing line may be a scribe line on a wafer. Figure 1 shows a schematic flow chart of a method 100 for correcting the position of a predetermined processing line according to one embodiment of the present application. As shown in FIG1 , the method 100 may include the following steps S110 , S120 , S130 , and S140 .

[0039] Step S110 , obtaining first position information of a target predetermined processing line, where the target predetermined processing line is a predetermined processing line to be corrected among at least one predetermined processing line.

[0040] In one possible implementation, the workpiece to be processed may include one or more predetermined processing lines extending along a first direction. If the workpiece to be processed may include multiple predetermined processing lines extending along the first direction, correction may be performed before processing the workpiece along each predetermined processing line, or may be performed after a preset number of predetermined processing lines. The target predetermined processing line may be the predetermined processing line to be corrected. The first position information of the target predetermined processing line may represent the physical position or image position of the target predetermined processing line.

[0041] In one possible implementation, the processing equipment may include a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the center of the field of view of the first image acquisition device; the first position information of the target predetermined processing line is represented by a first image position corresponding to a feature point on the target predetermined processing line in the image to be measured containing the target predetermined processing line acquired by the first image acquisition device, or a first physical position corresponding to the first image position; the second position information of the processing tool is represented by a second image position corresponding to the center of the field of view of the first image acquisition device, or a second physical position corresponding to the second image position.

[0042] To facilitate understanding later, the following describes the measurement method of the image position mentioned in this article.

[0043] Figure 2 shows a schematic diagram of an image coordinate system established for an image to be tested according to an embodiment of the present application. For example, the upper left corner vertex of the image to be tested can be used as the origin o, the side passing through the origin o and parallel to the upper side of the image to be tested can be used as the x-axis, and the side passing through the origin o and perpendicular to the x-axis and parallel to the left side of the image to be tested can be used as the y-axis to establish an image coordinate system as shown in Figure 2, where point A is a feature point. For example, the first image to be tested contains a total of 1000×1000 pixels. Feature point A is located at the pixel in the 150th row and 300th column, so the image position of feature point A can be expressed as (150, 300). The feature points described herein (including the first feature point, the second feature point, etc. hereinafter) can be any identifiable feature points on the workpiece to be processed. In one embodiment, the feature points can represent feature points on the workpiece to be processed itself, such as feature points on certain shapes or structures. In one possible implementation, the feature point may also be a feature point additionally marked on the workpiece to be processed by manual labor or processing equipment, such as some easily recognizable symbols, patterns, etc. The feature point may be of any shape, such as a circle, a cross, or a star. The workpiece to be processed may include at least two predetermined processing lines. The predetermined processing line is any feature line on the workpiece to be processed. The feature point is a feature point on the predetermined processing line. In one example, the predetermined processing line may be a cutting path on a wafer. Preferably, the feature point is the center point of the intersection area of ​​two mutually perpendicular cutting paths (referred to as the "cutting path center").

[0044] The various physical positions described herein can be represented by coordinates in the same world coordinate system. This world coordinate system can also be referred to as a mechanism coordinate system. An example of establishing such a world coordinate system is described below. The workpiece to be processed can be placed on a movable carrier (e.g., a movable stage). The movable stage can translate within a plane (referred to as the "moving plane") or rotate about a fixed axis of rotation within the moving plane. The workpiece to be processed moves synchronously with the movable stage, so the physical position of the movable stage described herein can be considered the same as the physical position of the workpiece to be processed and can be expressed interchangeably. Two mutually perpendicular optical scales can be provided within the movable stage's range of motion. For example, when the movable stage rests at a predetermined initial physical position, the optical scale reading at that time can be set to 0, and this physical position can be determined as the origin O of the world coordinate system. A first optical scale can be provided along a first direction through the origin O, and the axis of the first optical scale can serve as the X-axis of the world coordinate system. A second optical scale is provided perpendicular to the X-axis and through the origin O. The axis of the second scale can serve as the Y-axis of the world coordinate system. Once this world coordinate system is established, each time the movable stage moves, i.e., the workpiece moves, the corresponding X-axis and Y-axis coordinates are read from the first and second scales. These (X, Y) coordinates represent the physical position of the workpiece. It is understood that (X, Y) can be coordinate data used to represent the displacement of the workpiece.

[0045] In one embodiment, the processing equipment may include a first image acquisition device. Based on hardware limitations of the processing equipment, the physical position of the processing tool may be assumed to coincide with the physical position corresponding to the center of the field of view of the first image acquisition device. The first position information of the target predetermined processing line may be represented by a first image position corresponding to a feature point on the target predetermined processing line in an image to be measured captured by the first image acquisition device and containing the target predetermined processing line, or by a first physical position corresponding to the first image position. The second position information of the processing tool may be represented by a second image position corresponding to the center of the field of view of the first image acquisition device, or by a second physical position corresponding to the second image position.

[0046] According to the above technical solution, the first position information of the target predetermined processing line and the second position information of the processing tool are represented by the corresponding coordinates in the image coordinate system or the physical coordinate system, which can ensure the accuracy and consistency of the first position information and the second position information.

[0047] Step S120 : determining a position deviation value based on the first position information of the target predetermined processing line and the second position information of the processing tool.

[0048] In one possible implementation, a position deviation value can be determined based on the first position information of the target predetermined processing line and the second position information of the processing tool. The position deviation value can be a deviation along the X-axis or the Y-axis, or a relative deviation between the position of the target predetermined processing line and the position of the processing tool.

[0049] Step S130: Compare the position deviation value with the target deviation threshold.

[0050] In one possible implementation, a user can pre-set a target deviation threshold to correct the position of the target predetermined processing line based on the target position deviation threshold and the calculated position deviation value. The target deviation threshold can be equal to any value, such as 0.1 millimeter (mm), 0.2 mm, or 0.3 mm. In one embodiment of the present application, the target position deviation threshold can be equal to 0.2 mm.

[0051] Step S140 : when the position deviation value is less than or equal to the target deviation threshold, the position of the target predetermined processing line is corrected according to the position deviation, so as to process the workpiece according to the corrected position of the target predetermined processing line.

[0052] In one possible implementation, when the position deviation value is less than or equal to a target deviation threshold, the position of the workpiece to be processed may be adjusted based on the position deviation value to correct the position of the target predetermined processing line. For example, when the target position deviation threshold is 0.2 mm and the position deviation value is +0.15 mm, the workpiece to be processed may be moved in the opposite direction by 0.15 mm to correct the position of the target predetermined processing line.

[0053] In one possible implementation, the corrected position of the target predetermined processing line is determined as the actual position of the target predetermined processing line during machining, and the workpiece is machined based on this position. In one embodiment, after the position of the target predetermined processing line is corrected, the corrected position of the target predetermined processing line can be determined as the actual position of the target predetermined processing line during machining. The machining tool can machine the target predetermined processing line along the corrected position of the target predetermined processing line.

[0054] According to the above technical solution, the position deviation value can be determined based on the first position information of the target predetermined processing line and the second position information of the processing tool. After comparing the position deviation value with the target deviation threshold, when the position deviation value is less than or equal to the target deviation threshold, the position of the target predetermined processing line is corrected according to the position deviation value. The workpiece to be processed is processed according to the corrected position of the target predetermined processing line. This solution determines whether the position of the current target predetermined processing line needs to be corrected by obtaining the first position information of the target predetermined processing line and the second position information of the processing tool, and corrects the position of the current target predetermined processing line when correction is required. In this way, it can be determined whether the current splitting position of the splitting knife is accurate to avoid damaging the workpiece to be processed. At the same time, it can also reduce the installation requirements for the verticality of the X-axis and the Y-axis in the processing equipment, thereby reducing the hardware cost of the processing equipment.

[0055] In one possible implementation, the target predetermined processing line is corrected in a preset order; before comparing the position deviation value with the target deviation threshold, the method may further include: determining the target deviation threshold based on an expected spacing between the current target predetermined processing line and the previous target predetermined processing line; wherein, when the expected spacing falls within any specific spacing range among at least two spacing ranges, the target deviation threshold is equal to the preset deviation threshold corresponding to the specific spacing range among the at least two preset deviation thresholds, the at least two spacing ranges correspond one-to-one to the at least two preset deviation thresholds, and a larger value of the spacing range corresponds to a larger corresponding preset deviation threshold.

[0056] In one embodiment, the target predetermined processing line can be corrected in a preset order. The preset order can represent the processing order during the processing. Figure 3 shows a schematic diagram of a workpiece to be processed according to an embodiment of the present application. As shown in Figure 3, the workpiece to be processed includes 7 predetermined processing lines extending along the first direction, namely predetermined processing lines L1, L2,...L7. During processing, it can be processed in a top-to-bottom order (i.e., processed in order from L1 to L7), or in a bottom-to-top order (i.e., processed in order from L7 to L1), or in a sequence from both ends to the middle (for example, first processed from L1 to L4 and then processed from L7 to L4), and this application does not impose any restrictions on this. The user can select any processing order to process the workpiece to be processed according to the actual processing scenario. Based on the expected spacing H between the current target predetermined processing line and the previous target predetermined processing line, the target deviation threshold can be determined.

[0057] The expected spacing H can be equal to an integer multiple of the inter-grain spacing h between any two adjacent cutting lanes. For sequential processing from L7 to L1, if the position of each predetermined processing line needs to be corrected before processing the workpiece along that predetermined processing line, then the expected spacing H is equal to the inter-grain spacing h. If the position of the current predetermined processing line needs to be corrected every two predetermined processing lines, then the expected spacing is equal to twice the inter-grain spacing (i.e., H = 2h). For sequential processing from L1 to L4 and then from L7 to L4, if the position of each predetermined processing line needs to be corrected before processing the workpiece along that predetermined processing line, then after processing L4, the current target predetermined processing line is L7. The previous target predetermined processing line corresponding to the current target predetermined processing line L7 is L4, and the expected spacing H is equal to three times the inter-grain spacing. If the position of the current predetermined processing line needs to be corrected every two predetermined processing lines, then after processing L4, the current target predetermined processing line is L7. The previous target processing line corresponding to the current target processing line L7 is L3, and the expected spacing H is equal to four times the grain spacing. When the expected spacing falls within any specific spacing range of at least two spacing ranges, the target deviation threshold is equal to the preset deviation threshold corresponding to the specific spacing range in the at least two preset deviation thresholds. For example, the spacing ranges are [h, 5h) and [6h, 10h), each of which has a corresponding preset deviation threshold.

[0058] The larger the value of the spacing range, the larger the corresponding preset deviation threshold. In one embodiment of the present application, the preset deviation threshold corresponding to the spacing range [h, 5h) can be equal to 0.01mm, and the preset deviation threshold corresponding to the spacing range [6h, 10h) can be equal to 0.2mm. If the expected spacing is equal to 5h, then the preset deviation threshold corresponding to [6h, 10h) will be used as the target deviation threshold. If the expected spacing is equal to 2h, then the preset deviation threshold corresponding to [h, 5h) will be used as the target deviation threshold.

[0059] According to the above technical solution, a target deviation threshold is determined based on the expected spacing between the current target predetermined processing line and the previous target predetermined processing line. The target deviation threshold can be equal to the preset deviation threshold corresponding to a specific spacing range among at least two preset deviation thresholds, and the larger the spacing range, the larger the corresponding preset deviation threshold. This method can select a larger preset deviation threshold when the expected spacing is large to avoid the error increasing due to the accumulation of processing times. If a smaller preset deviation threshold is still selected to compare with the position deviation value of the current target predetermined line, it may cause the correction to fail. Conversely, when the expected spacing is small, a smaller preset deviation threshold is selected to avoid selecting a larger preset deviation threshold to compare with the position deviation value of the current target predetermined line, which may result in a larger correction.

[0060] In one possible implementation, at least two preset deviation thresholds may include a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold is greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold respectively correspond to two spacing ranges, the boundary between the two spacing ranges is the preset spacing threshold, and the target deviation threshold is determined based on the expected spacing between the current target predetermined processing line and the previous target predetermined processing line, including: when the expected spacing is greater than or equal to the preset spacing threshold, determining the target deviation threshold as the first preset deviation threshold; when the expected spacing is less than the preset spacing threshold, determining the target deviation threshold as the second preset deviation threshold.

[0061] In one embodiment, the at least two preset deviation thresholds may include a first preset deviation threshold and a second preset deviation threshold. The first preset deviation threshold is greater than the second preset deviation threshold. The first preset deviation threshold and the second preset deviation threshold correspond to two spacing ranges, respectively. For example, the spacing ranges [h, 5h) and [5h, 10h) in the above embodiment may correspond to the second preset deviation threshold T respectively. h2 And the first preset deviation threshold T h1 The boundary 5h between the two spacing ranges may represent a preset spacing threshold. When the expected spacing is greater than or equal to the preset spacing threshold, the target deviation threshold may be determined to be the first preset deviation threshold T h1 When the expected distance is less than the preset distance threshold, the target deviation threshold can be determined to be the second preset deviation threshold T h2 .

[0062] According to the above technical solution, the boundary between the two spacing ranges is used as the preset spacing threshold. When the expected spacing is greater than or equal to the preset spacing threshold, the target deviation threshold can be determined as the first preset deviation threshold; otherwise, the target deviation threshold is determined as the second preset deviation threshold. In this way, based on the comparison result of the expected spacing and the preset spacing threshold, different preset deviation thresholds can be determined to ensure the accuracy of the correction result.

[0063] In one possible implementation, the workpiece to be processed is a wafer, the preset spacing threshold may be equal to a specific multiple of the grain spacing of the wafer, the first preset deviation threshold is equal to a specific multiple of the minimum deviation threshold, the grain spacing is the spacing between two adjacent predetermined processing lines, the minimum deviation threshold is equal to the difference between the position of any first predetermined processing line after the movement and the position of the second predetermined processing line before the movement when the workpiece to be processed is moved one grain spacing along the second direction, the second predetermined processing line is a predetermined processing line adjacent to the first predetermined processing line and located on one side of the moving direction of the workpiece, and the second direction is the direction of a second coordinate axis perpendicular to the first coordinate axis corresponding to the first direction in the mechanical coordinate system used by the processing equipment.

[0064] In one embodiment, when the workpiece to be processed is a wafer, the preset spacing threshold can be equal to a specific multiple of the wafer's grain spacing h. For example, if the preset spacing threshold in the aforementioned embodiment is 5h, then the preset spacing threshold is equal to 5 times the grain spacing. The grain spacing is the spacing between two adjacent predetermined processing lines, that is, the distance between any two adjacent cutting lanes in the aforementioned embodiment. The first preset deviation threshold can be equal to a specific multiple of the minimum deviation threshold. The minimum deviation threshold is equal to the difference between the position of any first predetermined processing line after the movement and the position of the second predetermined processing line before the movement when the workpiece to be processed is moved by one grain spacing in the second direction. The first direction is the direction of the first coordinate axis (X-axis), and the second direction can be the direction of the second coordinate axis (Y-axis) perpendicular to the first coordinate axis (X-axis). Referring to Figure 3, if the first predetermined processing line is L2 and the processing order is from predetermined processing line L1 to predetermined processing line L7, then the second predetermined processing line is L3. It can be understood that, in theory, when the processing equipment is installed, the X-axis and the Y-axis are perpendicular to each other. However, due to installation errors, the X-axis and the Y-axis may not be perpendicular. In this case, the difference between the position of any first predetermined processing line after the movement and the position of the second predetermined processing line before the movement is equal to the difference in the direction of the Y-axis in the real physical world.

[0065] According to the above technical solution, a preset spacing threshold can be set based on the grain spacing, and a first preset deviation threshold can be set based on the minimum deviation threshold. This can ensure the reliability of the determined preset spacing threshold and the first preset deviation threshold.

[0066] In a possible implementation, before comparing the position deviation value with the target deviation threshold, the method may further include: determining at least two preset deviation thresholds based on first parameter setting information input by a user.

[0067] In one embodiment, the processing equipment may further include an input device and / or an output device. The input device and / or the output device may be communicatively connected to the processing parameter detection device or included in the processing parameter detection device. The input device may include but is not limited to one or more of a mouse, a keyboard, a microphone, a touch screen, etc. The output device may include but is not limited to one or more of a display device, a speaker, etc. The user may input first parameter setting information through the input device to determine at least two preset deviation thresholds. In one embodiment of the present application, the display interface of the current display device includes two text input controls, one of which is used to input parameters corresponding to the first preset deviation threshold, and the second text input control is used to input parameters corresponding to the second preset deviation threshold. The user can use a mouse or keyboard to enter 0.2 in the first text input control, indicating that the first preset deviation threshold is 0.2mm. Similarly, the user can also use a mouse or keyboard to enter 0.01 in the second text input control, indicating that the second preset deviation threshold is 0.01mm.

[0068] According to the above technical solution, the user can input the first parameter setting information to determine at least two preset deviation thresholds, which can meet the needs of different users or different application scenarios and has strong interactivity.

[0069] In a possible implementation, after comparing the position deviation value with the target deviation threshold, the method may further include: outputting alarm information when the position deviation value is greater than the target deviation threshold.

[0070] In one embodiment, when the position deviation value exceeds the target deviation threshold, the output device may further output an alarm message. For example, if the output device is a display device, a text message such as "Correction Failed" may be output on the display interface of the display device as an alarm message to inform the user that the current position deviation value exceeds the target deviation threshold. For another example, if the output device is a microphone, a voice message such as "Correction Failed" may be output as an alarm message to inform the user that the current position deviation value exceeds the target deviation threshold.

[0071] According to the above technical solution, when the position deviation value is greater than the target deviation threshold, an alarm message can be output, which can remind the user to manually correct the position of the current predetermined processing line to ensure smooth processing of the workpiece.

[0072] In a possible implementation, before comparing the position deviation value with the target deviation threshold, the method may further include: determining the target deviation threshold based on second parameter setting information input by a user.

[0073] In one embodiment, the implementation method for user input of the second parameter information can refer to the relevant description of the user input of the first parameter information in the previous embodiment, and for the sake of brevity, it is not repeated here. Based on the second parameter setting information input by the user, a target deviation threshold can be determined. The target deviation threshold can be the first preset deviation threshold or the second preset deviation threshold in the above-mentioned embodiment.

[0074] According to the above technical solution, the user can input the second parameter setting information to directly determine the target deviation threshold, which can reduce the user's operations, improve the user experience and enhance interactivity.

[0075] In one possible implementation, before comparing the position deviation value with the target deviation threshold, the method may further include: determining, based on third parameter setting information input by a user, a starting target predetermined processing line and / or a processing line spacing in each processing stage in at least one processing stage, where the processing line spacing is the distance between any two target predetermined processing lines in each processing stage.

[0076] In one embodiment, the implementation method of the user inputting the third parameter information can refer to the relevant description of the user inputting the first parameter information in the previous embodiment. For the sake of brevity, it will not be repeated here. Based on the third parameter setting information input by the user, the starting target predetermined processing line or the processing line spacing in each processing stage in at least one processing stage can be determined, or the starting target predetermined processing line and the processing line spacing in each processing stage in at least one processing stage can also be determined. Referring to Figure 3 again, when the wafer is processed in the order of L1 to L7, there may be invalid cutting paths on the wafer. For example, the cutting path corresponding to the predetermined processing line L1 is an invalid cutting path, then the user can enter "2" in the input control corresponding to the starting target predetermined processing line to indicate that the position of the second predetermined processing line is used as the starting target predetermined processing line. Similarly, the processing line spacing can also be input.

[0077] According to the above technical solution, the user can input third parameter setting information to determine the starting target predetermined processing line and / or processing line spacing in each processing stage of at least one processing stage. This can reduce user operations, improve user experience and enhance interactivity.

[0078] In a possible implementation, correcting the position of the target predetermined processing line according to the position deviation value may include: controlling the image acquisition device to move a corresponding distance according to the position deviation value to correct the position of the target predetermined processing line.

[0079] In one embodiment, the image acquisition device can be controlled to move a corresponding distance based on the position deviation value to correct the position of the target predetermined processing line. For example, if the position deviation value is equal to +0.15mm, it means that the workpiece is deviated by 0.15mm along the positive direction of the Y axis. In this case, the image acquisition device can be controlled to move 0.15mm in the negative direction of the Y axis to correct the position of the target predetermined processing line.

[0080] According to the above technical solution, the image acquisition device is controlled to move a corresponding distance according to the position deviation value to correct the position of the target predetermined processing line. This does not require complicated correction operations and is highly efficient.

[0081] In one possible implementation, before obtaining the first position information of the target predetermined processing line, the method may further include: identifying a first feature point from a first image to be measured captured by the first image acquisition device, the first feature point being a feature point on any predetermined processing line; correcting a third predetermined processing line where the first feature point is located according to a first direction; after the correction is completed, moving the center of the field of view of the first image acquisition device to a physical position corresponding to when the first image acquisition device captured the first image to be measured; obtaining a second image to be measured captured after the first image acquisition device is moved; identifying a second feature point from the second image to be measured, the second feature point being a feature point on any predetermined processing line; moving the center of the field of view of the first image acquisition device by a corresponding distance according to an expected spacing between a fourth predetermined processing line where the second feature point is located and a starting target predetermined processing line in a first processing stage of at least one processing stage; and obtaining a third image to be measured captured after the first image acquisition device is moved and including the starting target predetermined processing line in the first processing stage, so as to perform the step of obtaining the first position information of the target predetermined processing line for the starting target predetermined processing line in the first processing stage based on the third image to be measured.

[0082] In one embodiment, the processing equipment may include a first image acquisition device. The first image to be tested is an image captured by the first image acquisition device. A first feature point is identified from the first image to be tested. Template matching is performed on the first image to be tested using a template image to obtain the first feature point in the first image to be tested. In one embodiment, the workpiece to be processed is a wafer. The template image may include the intersection of two mutually perpendicular cutting lanes on the wafer and an area within a preset range around the intersection. The matching feature point may be the center point of the intersection area. Figure 4 shows a schematic diagram of a template image according to an embodiment of the present application. As shown in Figure 4, the template image includes the center of the cutting lane (represented by a black dot), which can be used as a reference point. In addition, Figure 4 also shows a cross-shaped white area, which is a portion of each of the two mutually perpendicular cutting lanes. The intersection area is the area within the rectangular box indicated by the middle dashed line. At the same time, the template image may also include an area within a preset range around the intersection area (which may be referred to as a preset area), such as the four gray sub-areas shown in Figure 4 and the area where the two cutting lanes are located outside the intersection area. The preset range is set such that the image features contained in the intersection region and the preset region are sufficient for the image processing algorithm to identify the locations of the intersection region and the preset region from the image captured by the image acquisition device based on the image features. As shown in Figure 4, the image features contained in the intersection region are not obvious and difficult to distinguish. Therefore, they can be combined with the surrounding preset region to form a sufficiently distinguishable image feature to help identify the locations of the intersection region and the preset region. The main purpose is to identify the location of the intersection region and, subsequently, determine the location of the matching feature point. Based on the location of the matching feature point, a first feature point can be identified from the first image to be tested. The third predetermined processing line where the first feature point is located is corrected according to a first direction. The first direction can be, for example, horizontal. Specifically, based on the angle between the third predetermined processing line where the first feature point is located and the first direction, for example, if the angle between the predetermined processing line and the first direction is +2 degrees (in a clockwise direction), the predetermined processing line can be rotated 2° counterclockwise to correct the predetermined processing line. After the correction is completed, the center of the field of view of the first image acquisition device is moved to the physical location corresponding to when the first image to be tested was captured by the first image acquisition device. The second image to be tested is then captured using the moved first image acquisition device. Based on the captured second image to be tested and the template image, a second feature point can be identified from the second image to be tested. The second feature point can be a feature point on any predetermined processing line. For example, the second predetermined processing line can be a feature point on predetermined processing line L3 in the embodiment shown in FIG3 . The expected spacing between predetermined processing line L3 and the starting target predetermined processing line (L1) is 2h. The center of the field of view of the first image acquisition device can be moved by 2h so that the starting target predetermined processing line is within the field of view of the first imaging device after the movement.The moved first image acquisition device is used to acquire a third image to be measured that includes the predetermined processing line of the starting target.

[0083] According to the above technical solution, by identifying a first feature point from a first image to be tested captured by a first image acquisition device, the first feature point can be quickly identified from the first image to be tested. The third predetermined processing line where the first feature point is located is corrected according to a first direction. After the correction is completed, the center of the field of view of the first image acquisition device is moved to the physical position corresponding to when the first image to be tested was captured by the first image acquisition device, and a second image to be tested is acquired. A second feature point is then identified from the second image to be tested. By correcting the predetermined processing line, this method achieves high-precision positioning of the predetermined processing line, thereby ensuring the accuracy of the obtained second feature point. By moving the center of the field of view of the first image acquisition device by a distance corresponding to the expected distance between the fourth predetermined processing line where the second feature point is located and the starting target predetermined processing line in the first of at least one processing stage, a third image to be tested, captured after the first image acquisition device has been moved, is acquired and includes the starting target predetermined processing line in the first processing stage. This ensures that the identified starting target predetermined processing line is located as close to the center of the image as possible, thereby ensuring the accuracy of the first position information subsequently obtained for the target predetermined processing line.

[0084] In one possible implementation, the processing equipment may further include a second image acquisition device, wherein the image acquisition range of the second image acquisition device is greater than the image acquisition range of the first image acquisition device. Before identifying the first feature point from the first image to be measured acquired by the first image acquisition device, the method may further include: identifying the contour of the workpiece to be processed from a fourth image to be measured acquired by the second image acquisition device, wherein when the second image acquisition device acquires the fourth image to be measured, the center of the field of view of the second image acquisition device coincides with the center of a carrying device for carrying the workpiece to be processed; and determining a third image position of a product center of the workpiece to be processed in the fourth image to be measured based on the contour of the workpiece to be processed; Determine the physical position difference corresponding to the image position difference based on the image position difference between the second image position and the third image position corresponding to the center of the field of view of the second image acquisition device and the conversion relationship between the image position and the physical position; move the carrying device into the field of view of the first image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the image acquisition device; adjust the position of the carrying device based on the physical position difference so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the center of the field of view of the first image acquisition device; and obtain the first image to be measured captured by the first image acquisition device after the adjustment is completed.

[0085] In one embodiment of the present application, the processing equipment may further include a second image acquisition device having an image acquisition range greater than that of the first image acquisition device. The outline of the workpiece to be processed is identified from a fourth image to be tested captured by the second image acquisition device. Figure 5 shows a schematic diagram of a fourth image to be tested according to one embodiment of the present application. As shown in Figure 5, the black circular area may represent a wafer. The outline of this black circular area is the outline of the wafer. A grayscale threshold may be set for the fourth image to be tested, and the pixel values ​​in the fourth image to be tested are compared with the grayscale threshold to determine the location of the wafer's outline. The grayscale threshold can be any value, such as 50, 100, 150, etc. Referring to Figure 5, the darker area may represent the area corresponding to pixels with a grayscale value less than 50. This allows the area occupied by the wafer and its outline to be determined. When the second image acquisition device captures the fourth image to be tested, the center of the second image acquisition device's field of view coincides with the center of the support device used to support the workpiece to be processed. In one embodiment of the present application, when the workpiece to be processed is a wafer, the wafer is typically placed on an iron ring. Because the wafer may be skewed or incomplete, the center of the wafer product may not coincide with the center of the iron ring. Due to the hardware limitations of the processing equipment, when the iron ring is placed on the carrier, it can be assumed that the center of the iron ring coincides with the center of the carrier. Therefore, the center of the wafer product may not coincide with the center of the carrier. The image position of the center of the field of view of the second image acquisition device can be expressed as (x M ,y M Based on the outline of the workpiece to be processed, the third image position of the product center in the fourth image to be measured can be determined by calculating the first mean of the sum of the pixel values ​​of each row of pixels within the outline of the workpiece to be processed and the second mean of the sum of the pixel values ​​of each column of pixels. The third image position can be expressed as (x C1 ,y C1 ). According to the third image position (x C1 ,y C1 ) and the second image position (x M ,y M ), the image position (x C1 ,y C1 ) and (x M ,y M ) between the image positions. Wherein, the difference between the horizontal coordinates Δx1=x C1 -x M , the difference between the vertical coordinates Δy1=y C1 -y M. There is a one-to-one conversion relationship between the image position of any object described herein and the physical position of the object in the world coordinate system. For example, for the image position (x', y'), the physical position (X', Y') corresponding to the image position in the world coordinate system can be obtained based on the conversion relationship. Based on the obtained image position differences Δx1 and Δy1, the physical position differences δX1 and δY1 corresponding to the image position differences Δx1 and Δy1 can also be obtained based on the above conversion relationship. The carrier is moved into the field of view of the first image acquisition device so that the center of the carrier after the movement coincides with the field of view center of the first image acquisition device. According to the calculated physical position differences δX1 and δY1, the position of the carrier is adjusted. The operation of moving the carrier can be performed manually by the user or automatically by the processing control system, for example, by controlling the carrier to move the carrier by a robotic arm, or by directly controlling the movement of the carrier. The processing control system can be a processing device for processing the workpiece to be processed or other control systems that can be communicatively connected to the processing device, such as a host computer system. The physical position corresponding to the product center of the workpiece to be processed on the adjusted carrier coincides with the physical position corresponding to the field of view center of the first image acquisition device. Based on the adjusted first image acquisition device, a first image to be measured can be acquired.

[0086] According to the above technical solution, based on the image position difference between the third image position and the second image position corresponding to the center of the field of view of the second image acquisition device, as well as the conversion relationship between image position and physical position, the physical position difference corresponding to the image position difference can be determined. Then, after the carrier device is moved within the field of view of the first image acquisition device, the first image acquisition device is adjusted according to the physical position difference so that the physical position corresponding to the product center of the workpiece to be processed coincides with the center of the field of view of the first image acquisition device. The adjusted first image acquisition device then captures the first image to be measured. This method can quickly determine the physical position at which the physical position corresponding to the product center of the workpiece to be processed coincides with the center of the field of view of the first image acquisition device based on the conversion relationship and in conjunction with the movement of the carrier device. This solution has a relatively simple algorithm and relatively accurate results in determining the coincident physical position.

[0087] In one possible implementation, before determining the physical position difference corresponding to the image position difference based on the image position difference between the second image position corresponding to the center of the field of view of the second image acquisition device and the first image position and the conversion relationship between the image position and the physical position, the method may further include: acquiring a plurality of fifth images to be measured, the plurality of fifth images to be measured being images acquired by the first image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively in a plurality of fourth physical positions, the number of the plurality of fifth images to be measured being greater than or equal to 3, and any two of the plurality of fourth physical positions being different; for each of the plurality of fifth images to be measured, determining the image position of the identification feature in the fifth image to be measured according to a template image, the template image including the identification feature on the workpiece to be processed; and determining the conversion relationship according to the image position of the identification feature in the plurality of fifth images to be measured and the plurality of third physical positions.

[0088] In one embodiment, the number of the plurality of fifth images to be measured is greater than or equal to three. By way of example and not limitation, the number of the plurality of fifth images to be measured is greater than or equal to three and less than or equal to nine. For example, there are nine fifth images to be measured. The nine fifth images to be measured may be images captured by the image acquisition device of the workpiece when the workpiece is in nine different fourth physical positions. The nine different fifth physical positions K1, K2, ..., K9 may be arbitrary.

[0089] For each of the 9 fifth images to be tested, the image position of the identification feature in the fifth image to be tested can be determined based on the acquired template image. The identification feature can be any identifiable feature on the workpiece to be processed, which can be a feature point on the predetermined processing line described in this article, or a feature in other forms. In one embodiment, the identification feature can be a feature that the workpiece to be processed itself has, such as a feature on a certain shape or structure. In a possible implementation, the identification feature can also be a feature that is additionally marked on the workpiece to be processed by manual labor or processing equipment, such as some easily recognizable symbols, patterns, etc. The identification feature can be of any shape, such as a circle, a cross, or a star. Determining the image position of the identification feature in the fifth image to be tested based on the template image can be achieved in the following manner: identifying an identification feature that matches the identification feature in the template image from the fifth image to be tested, and determining the image position of the identification feature in the fifth image to be tested as the image position of the identification feature in the fifth image to be tested.

[0090] According to the image positions F1, F2, ..., F9 of the identification feature in the nine fifth test images and the corresponding nine fourth physical positions K1, K2, ..., K9, a mapping relationship (X) between the coordinates corresponding to the image positions and the coordinates corresponding to the physical positions can be established. K , YK )=f(w)(x F ,y F ). (X K , Y K ) represents each fourth physical location, (x F ,y F ) represents each image position. The f(w) matrix can be calculated using the determined nine coordinate points, thereby determining the conversion relationship between each image position and the corresponding fourth physical position. Based on this conversion relationship, the conversion relationship between any image position and its corresponding physical position can be determined.

[0091] According to the above technical solution, a conversion relationship can be determined based on the image positions of the identification features in multiple fifth images to be tested and the multiple fourth physical positions of the identification features. This method determines the conversion relationship based on multiple image positions and multiple fourth physical positions, has a simple algorithm and is easy to implement.

[0092] In a possible implementation, correcting the third predetermined processing line where the first feature point is located according to the first direction may include: taking the first feature point as a reference position point, sequentially determining multiple groups of position points, each group of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point, and along the first direction, the distance between the two position points included in each of the multiple groups of position points gradually increases, and different position points in the reference position point and the multiple groups of position points are position points corresponding to different feature points on the third predetermined processing line; after each group of position points is determined, calculating the connection between the first position point and the second position point in the group of position points. The method comprises the steps of: determining an angle of a line connecting the first and second lines relative to the first direction, and performing the following correction operation: when the angle of the line connecting the second and second lines is greater than a preset angle threshold, determining a corresponding adjustment angle according to the angle of the line connecting the second and second lines, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the third predetermined processing line on the workpiece to be processed; and stopping the correction when the angle of the line connecting the second and second lines is less than or equal to the preset angle threshold; wherein, after each determination of a group of position points and the execution of the correction operation corresponding to the group of position points, performing the step of determining the next group of position points, wherein, along the first direction, the spacing between two position points included in the next group of position points is greater than the spacing between two position points included in the current group of position points.

[0093] In one embodiment, the first feature point can be used as a reference position point, and multiple groups of position points can be sequentially determined based on the reference position point. In the reference position point and the multiple groups of position points, different position points correspond to different feature points on the third predetermined processing line. The position point corresponding to any feature point can be the image position point corresponding to the feature point in the image coordinate system, or the physical position point corresponding to the feature point in the world coordinate system.

[0094] In a possible implementation, multiple groups of position points can be determined based on the first feature point as the reference position point. For example, for the first group of position points B1B2, it may include the first position point B1 and the second position point B2. The first position point B1 and the second position point B2 may be located on both sides of the reference position point. In a similar manner, multiple groups of position points C1C2, D1D2, etc. can be determined in sequence, and each group of position points may include the first position point and the second position point. Along the first direction (horizontal direction), the distance between the two position points contained in each of the multiple groups of position points gradually increases. That is, the distance between D1D2 is greater than the distance between C1C2. In the reference position point and the multiple groups of position points, different position points are position points corresponding to different feature points on the third predetermined processing line.

[0095] After each set of position points is determined, the following operations can be performed to correct the position of the third predetermined processing line. The user can pre-set a preset angle threshold to determine whether the third predetermined processing line needs to be corrected. The preset angle threshold can be any angle greater than 0. In one possible implementation, but not limiting, the preset angle threshold can be in the range of [0.001, 0.2] degrees, for example, 0.1 degrees, 0.03 degrees, 0.006 degrees or 0.002 degrees. Correcting the position of the third predetermined processing line may include the following correction operations. If the angle of the line between the first position point B1 and the second position point B2 is 0.7 degrees, which is greater than the preset angle threshold of 0.002 degrees. At this time, the wafer needs to be rotated at an angle opposite to the tilt direction of the line between the first position point B1 and the second position point B2 so that the line coincides with the horizontal direction. Then, for the second group of position points C1C2, for the first position point C1 and the second position point C2 in the second group of position points C1C2, a determination is made in a manner similar to the above description as to whether the angle between the first position point C1 and the second position point C2 is greater than the preset angle threshold of 0.002. If so, a correction operation is performed. After performing the above correction operations in sequence, the correction is stopped until the angle between the first position point and the second position point in the position points is less than or equal to the preset angle threshold of 0.002. It should be noted that the distance between the two position points included in the next group of position points (for example, C1C2) is greater than the distance between the two position points included in the current group of position points (for example, B1B2).

[0096] According to the above technical solution, multiple sets of position points are determined. The position of the workpiece to be processed is adjusted based on the angle between two points in each set relative to a preset reference direction, thereby correcting the position of the third predetermined processing line. By setting multiple sets of position points, high-precision positioning of the third predetermined processing line on the workpiece to be processed can be achieved over a wide range.

[0097] In a second aspect, the present application further provides a processing method. This processing method can be applied to a processing device. The processing device may include a processing tool. The processing tool is used to process a workpiece along a predetermined processing line. The workpiece may include at least one predetermined processing line extending along a first direction. The processing method may include a first processing operation 610. FIG6 shows a schematic flow chart of the first processing operation 610 according to an embodiment of the present application. As shown in FIG6, the first processing operation 610 may include the following steps S611 and S612.

[0098] Step S611 : using the above-mentioned method for correcting the position of the predetermined processing line to determine the position of the target predetermined processing line during actual processing.

[0099] In one possible implementation, a person skilled in the art can understand the specific implementation scheme and technical effects of the above step S611 by reading the above description of the method for correcting the position of the predetermined processing line, and will not be elaborated here for the sake of brevity.

[0100] Step S612: Control the processing tool to perform processing at the location of the target predetermined processing line.

[0101] In a possible implementation, after determining the position of the target predetermined processing line during actual processing, the processing tool may be assumed to be substantially aligned with the target predetermined processing line, and the processing tool may be controlled to start processing at the position of the target predetermined processing line.

[0102] According to the above technical solution, the position of the target predetermined processing line during actual processing is first determined, and then the processing tool is controlled to perform processing at the position of the target predetermined processing line. This can ensure processing accuracy and avoid damage to the workpiece to be processed.

[0103] In a possible implementation, at least one predetermined processing line is processed sequentially according to a preset order, and when any target predetermined processing line needs to be processed, a first processing operation is performed.

[0104] In one embodiment, the implementation method of sequentially processing at least one predetermined processing line in a preset order has been described in detail in the previous embodiment, and for the sake of brevity, it will not be repeated here.

[0105] In one possible implementation, the method may further include: when processing is required for any non-target predetermined processing line other than the target predetermined processing line, performing the following second processing operation: determining the position of the non-target predetermined processing line based on the position of the previously processed predetermined processing line; and controlling the processing tool to perform processing at the position of the non-target predetermined processing line.

[0106] In one embodiment, the location of a non-target scheduled processing line for the next processing step can be determined based on the location of the previous scheduled processing line. Referring again to FIG. 3 , when processing sequentially from scheduled processing lines L1 to L7, if the previous scheduled processing line was L1, the next scheduled processing line can be determined to be L2. When processing the position where scheduled processing line L2 is located, the position of scheduled processing line L2 can be left unchanged, and the processing tool can be controlled to continue processing directly at the position where scheduled processing line L2 is located.

[0107] According to the above technical solution, the location of the non-target scheduled processing line can be determined based on the location of the previous scheduled processing line in the previous processing, and the processing tool can be controlled to perform processing at the location of the non-target scheduled processing line. This eliminates the need to modify each scheduled processing line, thereby improving processing efficiency.

[0108] According to a third aspect of the present application, a device for correcting the position of a predetermined processing line is also provided. The device can be applied to a processing device, wherein the processing device includes a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, wherein the workpiece includes at least one predetermined processing line extending along a first direction. FIG7 shows a schematic block diagram of a device 700 for correcting the position of a predetermined processing line according to one embodiment of the present application. As shown in FIG7 , the device 700 can include an acquisition module 710, a first determination module 720, a comparison module 730, a correction module 740, and a second determination module 750.

[0109] The acquisition module 710 is configured to acquire first position information of a target predetermined processing line, where the target predetermined processing line is a predetermined processing line to be corrected among the at least one predetermined processing line.

[0110] The first determining module 720 is configured to determine a position deviation value based on first position information of the target predetermined processing line and second position information of the processing tool.

[0111] The comparison module 730 is configured to compare the position deviation value with a target deviation threshold.

[0112] The correction module 740 is configured to correct the position of the target predetermined processing line according to the position deviation value when the position deviation value is less than or equal to the target deviation threshold value, so as to process the workpiece according to the corrected position of the target predetermined processing line.

[0113] A person skilled in the art can understand the specific implementation scheme and technical effects of the above-mentioned device for correcting the position of a predetermined processing line by reading the above description of the method for correcting the position of a predetermined processing line. For the sake of brevity, they will not be described in detail here.

[0114] According to a fourth aspect of the present application, a processing device is also provided. This processing device can be applied to processing equipment, which includes a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, where the workpiece includes at least one predetermined processing line extending along a first direction. Figure 8 shows a schematic block diagram of a processing device 800 according to one embodiment of the present application. As shown in Figure 8, the processing device 800 may include an execution module 810. The execution module 810 may include a determination submodule 811 and a control submodule 812.

[0115] The determination submodule 811 is configured to determine the position of the target predetermined processing line during actual processing by using the predetermined processing line position correction device described above.

[0116] The control submodule 812 is used to control the processing tool to perform processing at the location of the target predetermined processing line.

[0117] A person skilled in the art can understand the specific implementation scheme and technical effects of the above-mentioned processing device by reading the above description of the processing method. For the sake of brevity, they will not be repeated here.

[0118] According to a fifth aspect of the present application, an electronic device is also provided. Figure 9 shows a schematic block diagram of an electronic device according to an embodiment of the present application. As shown in Figure 9, the electronic device 900 includes a processor 910 and a memory 920. The memory 920 stores a computer program. When the computer program instructions are executed by the processor 910, they are used to execute the above-mentioned predetermined processing line position correction method and / or the above-mentioned processing method.

[0119] According to a sixth aspect of the present application, a storage medium is further provided, storing a computer program / instructions. The storage medium may include, for example, a storage component of a tablet computer, a hard disk of a personal computer, an erasable programmable read-only memory (EPROM), a compact disc read-only memory (CD-ROM), a USB memory, or any combination thereof. The storage medium may be any combination of one or more computer-readable storage media. The computer program / instructions, when executed by a processor, are used to execute the aforementioned method for correcting the predetermined processing line position and / or the aforementioned processing method.

[0120] A person skilled in the art can understand the specific implementation scheme of the above-mentioned electronic device and storage medium by reading the above description of the predetermined processing line position correction method and / or processing method. For the sake of brevity, it will not be repeated here.

[0121] Example:

[0122] Embodiment 1: A method for correcting the position of a predetermined processing line is applied to a processing device, wherein the processing device includes a processing tool, the processing tool is used to process a workpiece along a predetermined processing line, and the workpiece includes at least one predetermined processing line extending along a first direction, wherein the method includes:

[0123] Acquiring first position information of a target predetermined processing line, where the target predetermined processing line is a predetermined processing line to be corrected among the at least one predetermined processing line;

[0124] determining a position deviation value based on the first position information of the target predetermined processing line and the second position information of the processing tool;

[0125] comparing the position deviation value with a target deviation threshold;

[0126] When the position deviation value is less than or equal to the target deviation threshold, the position of the target predetermined processing line is corrected according to the position deviation value, so as to process the workpiece according to the corrected position of the target predetermined processing line.

[0127] Embodiment 2: The method according to embodiment 1, wherein the target predetermined processing line is corrected in a preset order;

[0128] Before comparing the position deviation value with a target deviation threshold, the method further includes:

[0129] determining the target deviation threshold based on an expected distance between the current target predetermined processing line and the previous target predetermined processing line;

[0130] When the expected spacing falls within any specific spacing range among at least two spacing ranges, the target deviation threshold is equal to the preset deviation threshold corresponding to the specific spacing range among the at least two preset deviation thresholds. The at least two spacing ranges correspond one-to-one to the at least two preset deviation thresholds. The larger the value of the spacing range, the larger the corresponding preset deviation threshold.

[0131] Embodiment 3: The method according to embodiment 1 or 2, wherein the at least two preset deviation thresholds include a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold is greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold respectively correspond to two spacing ranges, and the boundary between the two spacing ranges is the preset spacing threshold.

[0132] The determining the target deviation threshold based on the expected distance between the current target predetermined processing line and the previous target predetermined processing line includes:

[0133] When the expected distance is greater than or equal to the preset distance threshold, determining the target deviation threshold to be the first preset deviation threshold;

[0134] When the expected distance is smaller than the preset distance threshold, the target deviation threshold is determined to be the second preset deviation threshold.

[0135] Embodiment 4: The method according to any one of embodiments 1 to 3, wherein the workpiece to be processed is a wafer, the preset spacing threshold is equal to a specific multiple of the grain spacing of the wafer, and the first preset deviation threshold is equal to the specific multiple of the minimum deviation threshold.

[0136] The grain spacing is the spacing between two adjacent predetermined processing lines. The minimum deviation threshold is equal to the difference between the position of any first predetermined processing line after the movement and the position of the second predetermined processing line before the movement when the workpiece to be processed is moved along the second direction by one of the grain spacings. The second predetermined processing line is a predetermined processing line adjacent to the first predetermined processing line and located on one side of the moving direction of the workpiece. The second direction is the direction of a second coordinate axis perpendicular to a first coordinate axis corresponding to the first direction in a mechanical coordinate system used by the processing equipment.

[0137] Embodiment 5: The method according to any one of embodiments 1 to 4, wherein, before comparing the position deviation value with the target deviation threshold, the method further comprises:

[0138] The at least two preset deviation thresholds are determined based on the first parameter setting information input by the user.

[0139] Embodiment 6: The method according to any one of embodiments 1-5, wherein, after comparing the position deviation value with the target deviation threshold, the method further comprises:

[0140] When the position deviation value is greater than the target deviation threshold, an alarm message is output.

[0141] Embodiment 7: The method according to any one of embodiments 1-6, wherein, before comparing the position deviation value with the target deviation threshold, the method further comprises:

[0142] The target deviation threshold is determined based on second parameter setting information input by the user.

[0143] Embodiment 8: The method according to any one of embodiments 1-7, wherein the processing equipment includes a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the center of the field of view of the first image acquisition device;

[0144] The first position information of the target predetermined processing line is represented by a first image position corresponding to a feature point on the target predetermined processing line in the image to be measured and captured by the first image acquisition device, which contains the target predetermined processing line, or a first physical position corresponding to the first image position. The second position information of the processing tool is represented by a second image position corresponding to the center of the field of view of the first image acquisition device, or a second physical position corresponding to the second image position.

[0145] Embodiment 9: The method according to any one of embodiments 1 to 8, wherein the step of correcting the position of the target predetermined processing line according to the position deviation value comprises:

[0146] The image acquisition device is controlled to move a corresponding distance according to the position deviation value, so as to correct the position of the target predetermined processing line.

[0147] Embodiment 10: The method according to any one of embodiments 1 to 9, wherein, before acquiring the first position information of the target predetermined processing line, the method further comprises:

[0148] Identifying a first feature point from a first image to be measured acquired by the first image acquisition device, where the first feature point is a feature point on any predetermined processing line;

[0149] Correcting a third predetermined processing line where the first feature point is located according to the first direction;

[0150] After the calibration is completed, the center of the field of view of the first image acquisition device is moved to the physical position corresponding to when the first image acquisition device acquires the first image to be measured;

[0151] Acquire a second image to be measured that is captured after the first image acquisition device completes moving;

[0152] Identifying a second feature point from the second image to be measured, where the second feature point is a feature point on any predetermined processing line;

[0153] moving the center of the field of view of the first image acquisition device by a corresponding distance according to an expected distance between a fourth predetermined processing line where the second feature point is located and a starting target predetermined processing line in a first processing stage of at least one processing stage;

[0154] Acquire a third image to be measured that is captured by the first image acquisition device after movement and includes the starting target predetermined processing line in the first processing stage, so as to perform the step of acquiring the first position information of the target predetermined processing line for the starting target predetermined processing line in the first processing stage based on the third image to be measured.

[0155] Embodiment 11: The method according to any one of embodiments 1 to 10, wherein the processing equipment further comprises a second image acquisition device, the image acquisition range of the second image acquisition device being larger than the image acquisition range of the first image acquisition device, and before identifying the first feature point in the first image to be measured acquired by the first image acquisition device, the method further comprises:

[0156] identifying the contour of the workpiece to be processed from a fourth image to be measured captured by the second image acquisition device, wherein when the second image acquisition device acquires the fourth image to be measured, a center of the field of view of the second image acquisition device coincides with a center of a carrying device for carrying the workpiece to be processed;

[0157] Determining a third image position of a product center of the workpiece to be processed in the fourth image to be measured based on a contour of the workpiece to be processed;

[0158] determining a physical position difference corresponding to the image position difference based on an image position difference between a second image position corresponding to a center of a field of view of the second image acquisition device and the third image position and a conversion relationship between image positions and physical positions;

[0159] Moving the carrying device to within the field of view of the first image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the first image acquisition device;

[0160] Based on the physical position difference, adjusting the position of the carrying device so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the field of view center of the first image acquisition device;

[0161] The first image to be measured acquired by the first image acquisition device after the adjustment is completed is acquired.

[0162] Embodiment 12: The method according to any one of embodiments 1 to 11, wherein before determining the physical position difference corresponding to the image position difference between the second image position corresponding to the field of view center of the second image acquisition device and the first image position and the conversion relationship between the image position and the physical position, the method further comprises:

[0163] Acquire a plurality of fifth images to be measured, wherein the plurality of fifth images to be measured are images acquired by the first image acquisition device of the workpiece to be processed when the workpiece is respectively at a plurality of fourth physical positions, the number of the plurality of fifth images to be measured being greater than or equal to three, and any two of the plurality of fourth physical positions being different;

[0164] For each fifth image to be measured among the plurality of fifth images to be measured, determining an image position of the identification feature in the fifth image to be measured according to a template image, wherein the template image includes the identification feature on the workpiece to be processed;

[0165] The conversion relationship is determined according to the image position of the identification feature in the plurality of fifth images to be measured and the plurality of fourth physical positions.

[0166] Embodiment 13: The method according to any one of embodiments 1 to 12, wherein the correcting the third predetermined processing line where the first feature point is located according to the first direction comprises:

[0167] Using the first feature point as a reference position point, sequentially determining multiple groups of position points, each group of position points including a first position point and a second position point, the first position point and the second position point being located on either side of the reference position point, and along the first direction, a distance between two position points included in each of the multiple groups of position points gradually increases, and different position points in the reference position point and the multiple groups of position points are position points corresponding to different feature points on the third predetermined processing line;

[0168] After each set of position points is determined, the angle of the line between the first position point and the second position point in the set of position points relative to the first direction is calculated, and the following correction operation is performed:

[0169] When the connecting line angle is greater than a preset angle threshold, determining a corresponding adjustment angle according to the connecting line angle, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the third predetermined processing line on the workpiece to be processed;

[0170] When the connecting line angle is less than or equal to the preset angle threshold, stopping the correction;

[0171] In which, after each time a group of position points is determined and the correction operation corresponding to the group of position points is completed, the step of determining the next group of position points is performed, wherein along the first direction, the distance between two position points included in the next group of position points is greater than the distance between two position points included in the current group of position points.

[0172] Embodiment 14: A processing method, applied to a processing device, wherein the processing device includes a processing tool, wherein the processing tool is used to process a workpiece along a predetermined processing line, wherein the workpiece includes at least one predetermined processing line extending along a first direction, wherein the method includes:

[0173] Perform the first machining operation as follows:

[0174] The position of the target predetermined processing line during actual processing is determined by using the predetermined processing line position correction method described in any one of Examples 1-13;

[0175] The processing tool is controlled to perform processing at the position where the target predetermined processing line is located.

[0176] Embodiment 15: The method according to embodiment 14, wherein the at least one predetermined processing line is processed sequentially in a preset order, and when any target predetermined processing line needs to be processed, the first processing operation is performed.

[0177] Embodiment 16: The method according to embodiment 14 or 15, wherein the method further comprises:

[0178] When it is necessary to process any non-target predetermined processing line other than the target predetermined processing line, the following second processing operation is performed:

[0179] Determining the location of the non-target scheduled processing line based on the location of the previous scheduled processing line in the last processing;

[0180] The processing tool is controlled to perform processing at a position where the non-target predetermined processing line is located.

[0181] Embodiment 17: A device for correcting the position of a predetermined processing line, applied to a processing device, wherein the processing device includes a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, the workpiece including at least one predetermined processing line extending along a first direction, wherein the device includes:

[0182] an acquisition module, configured to acquire first position information of a target predetermined processing line, wherein the target predetermined processing line is a predetermined processing line to be corrected among the at least one predetermined processing line;

[0183] a first determining module, configured to determine a position deviation value based on first position information of the target predetermined processing line and second position information of the processing tool;

[0184] a comparison module, configured to compare the position deviation value with a target deviation threshold;

[0185] The correction module is used to correct the position of the target predetermined processing line according to the position deviation value when the position deviation value is less than or equal to the target deviation threshold, so as to process the workpiece according to the corrected position of the target predetermined processing line.

[0186] Embodiment 18: A processing device, applied to a processing equipment, the processing equipment including a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, the workpiece including at least one predetermined processing line extending along a first direction, wherein the device includes an execution module, the execution module including a determination submodule and a control submodule,

[0187] The determination submodule is used to determine the position of the target predetermined processing line during actual processing using the predetermined processing line position correction device as described in Example 17;

[0188] The control submodule is used to control the processing tool to perform processing at the location of the target predetermined processing line.

[0189] Example 19: An electronic device comprising a processor and a memory, wherein the memory stores computer program instructions, and the computer program instructions are used by the processor to execute the predetermined processing line position correction method as described in any one of Examples 1-13 and / or the processing method as described in any one of Examples 14-16 when the processor is running.

[0190] Example 20: A storage medium storing a computer program / instruction, wherein the computer program / instruction is used to execute the predetermined processing line position correction method described in any of Examples 1-13 and / or the processing method described in any of Examples 14-16 during runtime.

[0191] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0192] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0193] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units described is merely a logical function division. In actual implementation, other division methods may be used, such as combining or integrating multiple units or components into another device, or ignoring or not performing some features.

[0194] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0195] Similarly, it should be understood that in order to streamline the present application and aid in understanding one or more of the various inventive aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, this approach of the present application should not be interpreted as reflecting the intention that the application claimed for protection requires more features than those explicitly recited in each claim. More precisely, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0196] It will be understood by those skilled in the art that, except where mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus disclosed herein may be combined in any combination. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature providing the same, equivalent, or similar purpose.

[0197] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

[0198] The various component embodiments of the present application can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that a microprocessor or a digital signal processor (DSP) can be used in practice to implement some or all of the functions of some modules in the predetermined processing line position correction device and / or processing device according to the embodiment of the present application. The application can also be implemented as a device program (e.g., a computer program and a computer program product) for executing part or all of the methods described herein. Such a program implementing the present application can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0199] It should be noted that the above embodiments illustrate rather than limit the present application, and that a person skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbols placed between brackets should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present application may be implemented by means of hardware comprising several different elements and by means of appropriately programmed computers. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0200] The above description is merely a specific embodiment or illustration of a specific embodiment of the present application, and the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. The scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A method for correcting the position of a predetermined processing line, applied to a processing device, wherein the processing device comprises a processing tool, wherein the processing tool is used to process a workpiece along a predetermined processing line, wherein the workpiece comprises at least one predetermined processing line extending along a first direction, wherein: The method comprises: Acquire first position information of a target predetermined processing line, wherein the target predetermined processing line is a predetermined processing line to be corrected among the at least one predetermined processing line; Determining a position deviation value based on the first position information of the target predetermined processing line and the second position information of the processing tool; comparing the position deviation value with a target deviation threshold; When the position deviation value is less than or equal to the target deviation threshold, the position of the target predetermined processing line is corrected according to the position deviation value, so as to process the workpiece according to the corrected position of the target predetermined processing line.

2. The method according to claim 1, characterized in that The target predetermined processing line is corrected according to a preset sequence; Before comparing the position deviation value with a target deviation threshold, the method further includes: Determining the target deviation threshold based on an expected spacing between a current target predetermined processing line and a previous target predetermined processing line; Among them, when the expected spacing falls into any specific spacing range among at least two spacing ranges, the target deviation threshold is equal to the preset deviation threshold corresponding to the specific spacing range among at least two preset deviation thresholds, and the at least two spacing ranges correspond to the at least two preset deviation thresholds one-to-one. The larger the value of the spacing range, the larger the corresponding preset deviation threshold.

3. The method according to claim 2, characterized in that The at least two preset deviation thresholds include a first preset deviation threshold and a second preset deviation threshold, the first preset deviation threshold is greater than the second preset deviation threshold, the first preset deviation threshold and the second preset deviation threshold correspond to two spacing ranges respectively, and the boundary between the two spacing ranges is the preset spacing threshold, The step of determining the target deviation threshold based on an expected distance between the current target predetermined processing line and the previous target predetermined processing line includes: When the expected distance is greater than or equal to the preset distance threshold, determining the target deviation threshold to be the first preset deviation threshold; When the expected distance is less than the preset distance threshold, the target deviation threshold is determined to be the second preset deviation threshold.

4. The method according to claim 3, characterized in that The workpiece to be processed is a wafer, the preset spacing threshold is equal to a specific multiple of the grain spacing of the wafer, and the first preset deviation threshold is equal to the specific multiple of the minimum deviation threshold. The grain spacing is the spacing between two adjacent predetermined processing lines, the minimum deviation threshold is equal to the difference between the position of any first predetermined processing line after the movement and the position of the second predetermined processing line before the movement when the workpiece to be processed is moved along the second direction by one of the grain spacings, the second predetermined processing line is a predetermined processing line adjacent to the first predetermined processing line and located on one side of the moving direction of the workpiece, and the second direction is the direction of a second coordinate axis perpendicular to a first coordinate axis corresponding to the first direction in a mechanical coordinate system adopted by the processing equipment.

5. The method according to claim 2, characterized in that Before comparing the position deviation value with the target deviation threshold, the method further includes: The at least two preset deviation thresholds are determined based on the first parameter setting information input by the user.

6. The method according to claim 1, characterized in that After comparing the position deviation value with the target deviation threshold, the method further includes: When the position deviation value is greater than the target deviation threshold, an alarm message is output.

7. The method according to claim 1, characterized in that Before comparing the position deviation value with the target deviation threshold, the method further includes: The target deviation threshold is determined based on second parameter setting information input by a user.

8. The method according to any one of claims 1 to 7, characterized in that: The processing equipment includes a first image acquisition device; the physical position of the processing tool is aligned with the physical position corresponding to the center of the field of view of the first image acquisition device; The first position information of the target predetermined processing line is represented by a first image position corresponding to a feature point on the target predetermined processing line in the image to be tested and contained in the target predetermined processing line acquired by the first image acquisition device, or a first physical position corresponding to the first image position, and the second position information of the processing tool is represented by a second image position corresponding to the center of the field of view of the first image acquisition device, or a second physical position corresponding to the second image position.

9. The method according to claim 8, characterized in that The step of correcting the position of the target predetermined processing line according to the position deviation value comprises: The image acquisition device is controlled to move a corresponding distance according to the position deviation value to correct the position of the target predetermined processing line.

10. The method according to claim 8, characterized in that Before acquiring the first position information of the target predetermined processing line, the method further includes: Identify a first feature point from a first image to be measured acquired by the first image acquisition device, wherein the first feature point is a feature point on any predetermined processing line; Correcting a third predetermined processing line where the first feature point is located according to the first direction; After the calibration is completed, the center of the field of view of the first image acquisition device is moved to the physical position corresponding to when the first image acquisition device acquires the first image to be measured; Acquire a second image to be measured that is acquired after the first image acquisition device completes moving; Identify a second feature point from the second image to be tested, where the second feature point is a feature point on any predetermined processing line; According to the expected distance between the fourth predetermined processing line where the second feature point is located and the starting target predetermined processing line in the first processing stage of at least one processing stage, the center of the field of view of the first image acquisition device is moved by a corresponding distance; Acquire a third image to be tested that is captured by the first image acquisition device after movement and includes the starting target predetermined processing line in the first processing stage, so as to perform the step of acquiring the first position information of the target predetermined processing line for the starting target predetermined processing line in the first processing stage based on the third image to be tested.

11. The method according to claim 10, characterized in that The processing equipment further includes a second image acquisition device, the image acquisition range of the second image acquisition device is larger than the image acquisition range of the first image acquisition device, wherein before identifying the first feature point from the first image to be measured acquired by the first image acquisition device, the method further includes: Identify the contour of the workpiece to be processed from the fourth image to be measured acquired by the second image acquisition device, wherein when the second image acquisition device acquires the fourth image to be measured, the center of the field of view of the second image acquisition device coincides with the center of the carrying device for carrying the workpiece to be processed; Based on the contour of the workpiece to be processed, determining a third image position of a product center of the workpiece to be processed in the fourth image to be measured; Determine the physical position difference corresponding to the image position difference based on the image position difference between the second image position corresponding to the field of view center of the second image acquisition device and the third image position and the conversion relationship between the image position and the physical position; Move the carrying device to within the field of view of the first image acquisition device, wherein the center of the carrying device after the movement coincides with the center of the field of view of the first image acquisition device; Based on the physical position difference, adjusting the position of the carrying device so that the physical position corresponding to the product center of the workpiece to be processed on the adjusted carrying device coincides with the physical position corresponding to the field of view center of the first image acquisition device; The first image to be measured acquired by the first image acquisition device after the adjustment is completed is acquired.

12. The method according to claim 11, characterized in that Before determining the physical position difference corresponding to the image position difference between the second image position corresponding to the field of view center of the second image acquisition device and the first image position and the conversion relationship between the image position and the physical position, the method further includes: Acquire a plurality of fifth images to be measured, wherein the plurality of fifth images to be measured are images acquired by the first image acquisition device for the workpiece to be processed when the workpiece to be processed is respectively at a plurality of fourth physical positions, the number of the plurality of fifth images to be measured is greater than or equal to 3, and any two of the plurality of fourth physical positions are different; For each fifth image to be tested among the plurality of fifth images to be tested, determining an image position of the identification feature in the fifth image to be tested according to a template image, wherein the template image includes the identification feature on the workpiece to be processed; The conversion relationship is determined according to the image position of the identification feature in the plurality of fifth images to be tested and the plurality of fourth physical positions.

13. The method according to claim 10, characterized in that The correcting the third predetermined processing line where the first feature point is located according to the first direction includes: Taking the first feature point as a reference position point, determining a plurality of groups of position points in sequence, each group of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point, and along the first direction, the distance between two position points included in each of the plurality of groups of position points gradually increases, and different position points in the reference position point and the plurality of groups of position points are position points corresponding to different feature points on the third predetermined processing line; After a group of position points is determined each time, the angle of the line between the first position point and the second position point in the group of position points relative to the first direction is calculated, and the following correction operation is performed: In the case where the connecting line angle is greater than a preset angle threshold, determining a corresponding adjustment angle according to the connecting line angle, and adjusting the position of the workpiece to be processed based on the adjustment angle to correct the position of the third predetermined processing line on the workpiece to be processed; When the connection angle is less than or equal to the preset angle threshold, stopping the correction; Wherein, after each determination of a group of position points and the completion of the correction operation corresponding to the group of position points, the step of determining the next group of position points is performed, wherein, along the first direction, the spacing between two position points included in the next group of position points is greater than the spacing between two position points included in the current group of position points.

14. A processing method, applied to a processing device, the processing device comprising a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, the workpiece comprising at least one predetermined processing line extending along a first direction, characterized in that: The method comprises: Perform the first machining operation as follows: Determine the position of the target predetermined processing line during actual processing by using the predetermined processing line position correction method as described in any one of claims 1 to 13; The processing tool is controlled to perform processing at the position where the target predetermined processing line is located.

15. The method according to claim 14, characterized in that The at least one predetermined processing line is processed sequentially according to a preset order, and when any target predetermined processing line needs to be processed, the first processing operation is performed.

16. The method according to claim 15, characterized in that The method further comprises: When it is necessary to process any non-target predetermined processing line other than the target predetermined processing line, the following second processing operation is performed: Determine the location of the non-target predetermined processing line based on the location of the previous predetermined processing line in the last processing; The processing tool is controlled to perform processing at a position where the non-target predetermined processing line is located.

17. A device for correcting the position of a predetermined processing line, applied to a processing device, the processing device comprising a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, the workpiece comprising at least one predetermined processing line extending along a first direction, characterized in that: The device comprises: An acquisition module, configured to acquire first position information of a target predetermined processing line, wherein the target predetermined processing line is a predetermined processing line to be corrected among the at least one predetermined processing line; A first determination module, configured to determine a position deviation value based on first position information of the target predetermined processing line and second position information of the processing tool; A comparison module, used for comparing the position deviation value with a target deviation threshold; A correction module is used to correct the position of the target predetermined processing line according to the position deviation value when the position deviation value is less than or equal to the target deviation threshold value, so as to process the workpiece according to the corrected position of the target predetermined processing line.

18. A processing device, applied to a processing equipment, the processing equipment comprising a processing tool, the processing tool being used to process a workpiece along a predetermined processing line, the workpiece comprising at least one predetermined processing line extending along a first direction, characterized in that: The device comprises an execution module, wherein the execution module comprises a determination submodule and a control submodule. The determination submodule is used to determine the position of the target predetermined processing line during actual processing by using the predetermined processing line position correction device as claimed in claim 17; The control submodule is used to control the processing tool to perform processing at the location where the target predetermined processing line is located.

19. An electronic device comprising a processor and a memory, characterized in that: The memory stores computer program instructions, which are used by the processor to execute the method for correcting the position of a predetermined processing line as described in any one of claims 1 to 13 and / or the processing method as described in any one of claims 14 to 16 when the computer program instructions are executed.

20. A storage medium storing a computer program / instruction, characterized in that: The computer program / instructions are used to execute the method for correcting the position of a predetermined processing line as described in any one of claims 1 to 13 and / or the processing method as described in any one of claims 14 to 16 when running.

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