Lost-wax manufacturing method for earphone frame

Abstract

A lost-wax manufacturing method for an earphone frame. The lost-wax manufacturing method comprises: performing plate making to form a wax pattern in the shape of an earphone frame; obtaining a silicone mold by means of replicating the wax pattern; and casting a metal slurry to obtain the earphone frame, wherein the earphone frame comprises a sound-producing member accommodating portion, a functional member accommodating portion and a connecting member, two ends of the connecting member being respectively connected to the sound-producing member accommodating portion and the functional member accommodating portion. Compared with a traditional sand casting process, a sand casting manufacturing process for the earphone frame can be applicable to precision and large-scale production, thereby reducing certain costs in terms of labor and materials; moreover, ornaments can be embedded during a casting process.

Description

Lost wax manufacturing method for headphone frame Technical Field

[0001] The present invention relates to the field of manufacturing technology, and in particular to a lost wax manufacturing method for an earphone frame. Background Art

[0002] Existing earphone shells are generally made through injection molding or casting processes. However, the inventors developed an earphone combined with accessories. How to integrate the decorations on the metal earphone frame and mass-produce it is an urgent problem to be solved. Summary of the Invention

[0003] One advantage of the present invention is that it provides a lost wax manufacturing process for earphone frames. The lost wax manufacturing process for earphone frames can manufacture earphone frames in large quantities, thereby improving production efficiency and facilitating promotion.

[0004] One advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame, the material of which can be aluminum, titanium, copper, silver, gold, zinc alloy and stainless steel, especially aluminum, which is low in cost, easy to add, easy to set diamonds, easy to polish, can be mass-produced and is lightweight.

[0005] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame, which solves the problem of design freedom, greatly shortens the casting cycle, and also reduces equipment and labor costs.

[0006] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame, in which the wax paste mold can be used multiple times, thereby reducing a certain manufacturing cost and simplifying the manufacturing process.

[0007] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame, wherein the lost wax manufacturing process directly manufactures an initial wax film through 3D printing, thereby reducing the error caused by the traditional lost wax casting process.

[0008] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame. The lost wax manufacturing process of the earphone frame can design the surface texture on the initial wax mold through initial 3D printing. When the lost wax process is completed, the designed surface texture can be displayed.

[0009] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame. The lost wax manufacturing process for the earphone frame has a high level of mechanization, requires ordinary professional skills from the operator, is easy for the operator to learn and control, and has a low manufacturing threshold.

[0010] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame. The lost wax manufacturing process for the earphone frame emits less harmful substances during the casting process, is environmentally friendly, and meets green production requirements.

[0011] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame, wherein the lost wax manufacturing process for the earphone frame does not require complicated steps during the casting process, thereby saving labor costs.

[0012] Another advantage of the present invention is that it provides a lost wax manufacturing process for an earphone frame. The lost wax manufacturing process for an earphone frame can be applied to the manufacturing of earphone frames made of high-end materials, and the manufacturing process has a certain degree of precision.

[0013] According to one aspect of the present invention, the present invention provides a lost wax manufacturing method for an earphone frame, comprising:

[0014] Making a wax mold in the shape of the earphone frame;

[0015] Obtaining a silicone mold by replicating the wax film; and

[0016] The earphone frame is obtained by casting metal slurry, wherein the earphone frame includes a sound component accommodating portion, a functional component accommodating portion and a connecting member, and two ends of the connecting member are respectively connected to the sound component accommodating portion and the functional component accommodating portion.

[0017] In some embodiments, during the plate-making process, a wax model of the outer shape of an earphone shell is enlarged by 3D printing, and the wax is placed in a plaster cup to heat it to remove the wax paste. Then, copper liquid is poured into the plaster cup to replace the original wax earphone model to obtain an enlarged copper model master plate.

[0018] In some embodiments, the copper model master in the plaster is placed in a silicone mold to replicate the silicone mold, and then the replicated silicone molds are installed on an injection molding machine to injection mold batch wax paste earphone models that are enlarged by a certain proportion.

[0019] In some embodiments, the wax paste earphone model is inlaid with decorations on its surface, which is then placed in a plaster cup and heated to evaporate. When the metal material slurry is cast inside, the earphone frame is obtained after cooling.

[0020] In some embodiments, the decoration of the earphone frame is provided on a surface of at least one of the sound-emitting member accommodating portion, the functional member accommodating portion, and the connecting member.

[0021] In some embodiments, after obtaining the earphone frame, it also includes any one or a combination of oil filling, diamond inlaying, milling, polishing, and water transfer printing.

[0022] In some embodiments, the material of the earphone frame is selected from any one of aluminum, titanium, copper, silver, gold, zinc alloy and stainless steel.

[0023] The present invention also provides an earphone frame, which includes a sound-generating component accommodating portion, a functional component accommodating portion and a connecting component, wherein the two ends of the connecting component are respectively connected to the sound-generating component accommodating portion and the functional component accommodating portion, wherein the earphone frame is manufactured by the above-mentioned lost wax manufacturing method of the earphone frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is an overall schematic diagram of an earphone with an earphone frame 100 manufactured using a lost wax manufacturing process according to a preferred embodiment of the present invention.

[0025] FIG2 is an overall schematic diagram of an earphone with an earphone frame 100 manufactured using a lost wax manufacturing process according to another preferred embodiment of the present invention.

[0026] FIG3 is an overall schematic diagram of an earphone with an earphone frame 100 manufactured by a lost wax manufacturing process according to another preferred embodiment of the present invention.

[0027] FIG4 is a schematic diagram of the steps of the lost wax manufacturing process of the earphone frame 100 according to the preferred embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0029] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0030] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0031] As shown in Figures 1 to 3, an earphone 1000 and its earphone frame 100 according to a preferred embodiment of the present invention are schematically shown. The earphone frame 100 is manufactured using a lost wax manufacturing process. The earphone frame 100 is made of materials such as aluminum, titanium, copper, silver, gold, zinc alloy, and stainless steel. In other words, the lost wax manufacturing process of the earphone frame 100 can be used to manufacture earphone frames 100 of the same metal material in different shapes.

[0032] The earphone frame 100 is described as an example. It includes a sound-producing component housing 10, a functional component housing 20, and a connecting member 30. The sound-producing component housing 10, the functional component housing 20, and the connecting member 30 are integrally connected. The connecting member 30 is connected to the sound-producing component housing 10 and the functional component housing 20 at both ends. The earphone frame 100 must be equipped with electronic components and a cover to form a complete earphone 1000. The electronic components are suitable for installation within the cavity formed by the sound-producing component housing 10 and the connecting member 30, and are concealed by the cover 50. In other words, the cover 50 encloses the sound-producing component housing 10 and the functional component housing 20, respectively. In this embodiment, the electronic components are implemented as a power supply, a circuit board, and a speaker. The power supply and circuit board are optionally located in the functional component housing 20. The speaker is located in the sound-producing component housing 10.

[0033] The earphone frame 100, when combined with the corresponding cover 50 and housing the corresponding electronic components, forms an earphone 1000 suitable for being worn on a user's ear by clipping onto the ear. More specifically, the sound-producing component housing 10, when assembled with the cover and housing the speaker, can be placed within the user's cavum concha. The functional component housing 20, when assembled with the cover 50 and housing components such as a power supply and circuit board, is positioned on the back of the user's ear. The connecting member 30 spans the pinna of the user's ear.

[0034] In this embodiment, the earphone frame 100 is made of metal, making it suitable for delicate and valuable items. The manufacturing process requires high precision, so the lost wax manufacturing process used for the earphone frame 100 can ensure the exquisiteness of the earphone frame 100.

[0035] The earphone frame 100 also includes one or more decorations 40, which can be arranged on the outer surfaces of the sound-emitting component accommodating portion 10 and the functional component accommodating portion 20 as shown in Figure 1, or on the outer surface of the connecting member 30 as shown in Figure 2, or on the outer surfaces of the sound-emitting component accommodating portion 10, the functional component accommodating portion 20 and the connecting member 30 as shown in Figure 3.

[0036] Referring to FIG4 , an exemplary embodiment briefly describes the lost wax manufacturing process of the earphone frame 100 :

[0037] Making a wax mold in the shape of the earphone frame 100;

[0038] Obtaining a silicone mold by replicating the wax film; and

[0039] The earphone frame 100 is obtained by embedding the decoration 40 and casting metal slurry.

[0040] More specifically, before the step of forming the wax mold in the shape of the earphone frame 100, the ear impression and structural design are also included. Specifically, for customized earphones or ergonomic earphones, in order to ensure the comfort of wearing or to make your own customized earphones. Usually, the materials of the ear impression include a matrix and a coagulant. In this embodiment, the material selection of the ear impression is not limited by the present invention. The two are rubbed together in a 1:1 ratio and put into a syringe, which is put into the ear of the mold taker to make an ear impression model and then taken out.

[0041] Secondly, the structure of the removed eardrum is designed so that the final earphone frame 100 has a certain degree of comfort during wearing, and whether the sound insulation effect is good and whether it fits the user's ear canal is guaranteed.

[0042] Furthermore, molding modeling is performed on the structure of the designed earphone frame 100. That is, a wax mold of the outer shape of the earphone frame 100 is formed. In this embodiment, the step of forming the wax mold of the outer shape of the earphone frame 100 is implemented by 3D printing. The appearance of the wax mold obtained by 3D printing is basically consistent with the outer shape of the earphone frame 100. The wax mold is obtained by 3D printing, so that the precision of the lost wax production process of the earphone frame 100 is guaranteed, which is suitable for the production of high-end products. For example, the material of the earphone frame 100 is made of precious materials such as gold and silver. The lost wax production process of the earphone frame 100 can achieve no waste of materials and ensure the precision of manufacturing.

[0043] It can be understood that in the plate making process, a wax model of the outer shape of the earphone shell is enlarged by a certain ratio, for example 5%, through 3D printing, and then the earphone shell wax model is placed in a gypsum cup at high temperature to flow away the wax paste, and then copper liquid is poured into the gypsum cup to replace the original wax earphone model, and a copper model master plate with a 5% enlargement ratio is obtained.

[0044] The master copper plate model in the gypsum is placed in the silicone mold to replicate the silicone mold, and then the replicated silicone molds are installed on the injection molding machine to injection mold batch wax paste earphone models with a certain magnification ratio, such as 5%.

[0045] Various decorations such as zircon or diamond are inlaid on the surface of the wax paste model, and then placed in a plaster cup and heated to evaporate. The diamonds or zircon will remain on the inner wall of the plaster cup. When metal material slurry such as aluminum slurry is cast into the interior and cooled, due to the shrinkage ratio, the earphone frame 100 of the desired size can be obtained.

[0046] The lost wax manufacturing process of the earphone frame 100 uses a master copper plate master model to replicate a silicone mold within a silicone mold. This transforms a mold that was originally used only a few times into a reusable mold, improving the production efficiency of the earphone frame 100 in large quantities. This allows for multiple uses while maintaining a certain level of precision. Defects in the earphone frame 100 caused by the manufacturing process are eliminated.

[0047] In the process of forming the wax mold of the earphone frame 100, the structural design of the earphone frame 100 for the final product has been reflected in the initial step, and the wax molds of different shapes can also be designed. The earphone frame 100 of the corresponding shape is finally obtained through the lost wax manufacturing process of the earphone frame 100.

[0048] The earphone frame 100 obtained through the lost wax manufacturing process of the earphone frame 100 is suitable for further refinement through a surface treatment process.

[0049] The surface treatment process of the headphone frame 100 is described as follows: before forming a wax mold of the shape of the headphone frame 100, a model is also constructed to design a texture. Specifically, before 3D printing the wax mold, the texture of the outer surface of the headphone frame 100 is designed and 3D printed. The headphone frame 100 can then be manufactured using the lost wax manufacturing process with the corresponding designed texture.

[0050] In this embodiment, the texture of the headphone frame 100 can optionally be implemented as a water pattern. In another embodiment, the outer surface texture of the headphone frame 100 can optionally be implemented as a meteorite pattern, a stone forest pattern, a honeycomb pattern, a linear pattern, a heart pattern, or a combination of patterns. Therefore, the outer surface texture of the headphone frame 100 is not limited by the present invention.

[0051] In another embodiment of the present invention, the initial mold can also be carved. In other words, the texture of the outer surface of the initial mold can be carved manually. Alternatively, the earphone frame 100 formed after the lost wax manufacturing process of the earphone frame 100 can be subjected to a fine texture forging operation. That is, the outer surface texture of the earphone frame 100 can be obtained optionally by 3D printing or manual hammering.

[0052] In addition, the surface treatment process of the earphone frame 100 also includes filling the earphone frame 100 with oil after casting the metal liquid in the plaster to form the earphone frame 100. By filling the grooves and gaps of the earphone frame 100 with oil, the outer surface of the cast earphone frame 100 is colored, giving the earphone frame 100 a different appearance and providing a decorative effect.

[0053] The surface treatment process of the earphone frame 100 also includes steps such as diamond inlay, milling, polishing, and water transfer printing. The diamond inlay step can obtain the appearance of zircon, diamond, etc. inlaid in the earphone frame 100. The milling step can obtain a beautiful and delicate pattern on the outer surface of the earphone frame 100. The polishing step can change the convex part of the surface of the earphone frame 100 to form a smooth surface of the earphone frame 100. The water transfer printing can obtain the outer surface of the earphone frame 100 with a gradient color pattern.

[0054] Finally, the earphone frame 100 obtained through the lost wax manufacturing process is assembled with electronic components and sealed with a cover to form an earphone. The earphone of the present invention is worn on the ear by clamping it on both sides of the ear.

[0055] The metal material of the lost wax process of the earphone frame 100 can be aluminum, titanium, copper, silver, gold, zinc alloy and stainless steel, especially aluminum, which has low cost, is easy to add, easy to set diamonds, easy to polish, can be mass-produced and is light in weight.

[0056] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A lost wax manufacturing method for an earphone frame, characterized in that: include: Making a wax mold in the shape of the earphone frame; Obtaining a silicone mold by replicating the wax film; as well as The earphone frame is obtained by casting metal slurry, wherein the earphone frame comprises a sound-generating component accommodating portion, a functional component accommodating portion and a connecting component, and two ends of the connecting component are respectively connected to the sound-generating component accommodating portion and the functional component accommodating portion.

2. The lost wax manufacturing method of the earphone frame according to claim 1, wherein: In the plate making process, a wax model of the outer shape of the earphone shell with an enlarged ratio is 3D printed, and it is placed in a gypsum cup to heat and flow away the wax paste. Then, copper liquid is poured into the gypsum cup to replace the original wax earphone model to obtain an enlarged copper model master plate.

3. The lost wax manufacturing method of the earphone frame according to claim 2, wherein: The copper model master plate in the plaster is placed in the silicone mold to replicate the silicone mold, and then the replicated multiple silicone molds are installed on the injection molding machine to injection mold batch wax paste earphone models that are enlarged by a certain proportion.

4. The lost wax manufacturing method of the earphone frame according to claim 3, wherein: The wax paste earphone model is inlaid with decorations on its surface, and then placed in a plaster cup for heating and evaporation. When the metal material slurry is cast inside, the earphone frame is obtained after cooling.

5. The lost wax manufacturing method of the earphone frame according to claim 4, wherein: The decoration of the earphone frame is provided on a surface of at least one of the sound-generating member accommodating portion, the functional member accommodating portion and the connecting member.

6. The lost wax manufacturing method of the earphone frame according to any one of claims 1 to 5, wherein: After obtaining the earphone frame, the method further includes any one or a combination of oil filling, diamond inlaying, milling, polishing and water transfer printing.

7. The lost wax manufacturing method of the earphone frame according to any one of claims 1 to 5, wherein: The material of the earphone frame is selected from any one of aluminum, titanium, copper, silver, gold, zinc alloy and stainless steel.

8. An earphone frame, comprising a sound-generating component accommodating portion, a functional component accommodating portion and a connecting component, wherein two ends of the connecting component are respectively connected to the sound-generating component accommodating portion and the functional component accommodating portion, wherein the earphone frame is made by the lost wax manufacturing method of the earphone frame as described in any one of claims 1 to 7.

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