Electronic device including antenna

Abstract

In embodiments, an electronic device is provided. The electronic device may comprise: a conductive portion which is at least partially exposed to the outside of the electronic device; a coil; a near field communication (NFC) circuit; and a transmission line for connecting the conductive portion, the coil, and the NFC circuit. The transmission line may include a first signal path connecting a first terminal of the NFC circuit and a first area of the conductive portion, a second signal path connecting a second terminal of the NFC circuit and a first ending portion of the coil, and a third signal path connecting a second area of the conductive portion and a second ending portion of the coil. A signal path selected from among the first signal path, the second signal path, and the third signal path may include a first ground path and a second ground path which are connected to a ground area of the electronic device.

Description

Electronic device including an antenna

[0001] The present disclosure relates to an electronic device including an antenna.

[0002] NFC (near field communication) is a short-range communication technology that can be used to transfer files between devices over short distances using the NFC standard protocol.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] An electronic device supporting NFC (near field communication) is provided.

[0005] According to an aspect of the present disclosure, an electronic device may include a conductive portion at least partially exposed to the exterior of the electronic device, a coil, a near field communication (NFC) circuit, and a transmission line connecting the conductive portion, the coil, and the NFC circuit. The transmission line may include a first signal path connecting a first terminal of the NFC circuit and a first area of ​​the conductive portion, a second signal path connecting a second terminal of the NFC circuit and a first ending portion of the coil, and a third signal path connecting a second area of ​​the conductive portion and a second end of the coil. A signal path selected from among the first signal path, the second signal path, and the third signal path may include a first ground path and a second ground path connected to a ground area of ​​the electronic device.

[0006] According to an aspect of the present disclosure, an electronic device may include a first conductive portion at least partially exposed to the exterior of the electronic device, a second conductive portion at least partially exposed to the exterior of the electronic device, a coil, a near field communication (NFC) circuit, and at least one transmission line connecting the first conductive portion, the coil, the NFC circuit, and the second conductive portion. The transmission line may include a first signal path connecting a first terminal of the NFC circuit and a first region of the first conductive portion, a second signal path connecting a second terminal of the NFC circuit and a first end of the coil, a third signal path connecting a first region of the second conductive portion and a second end of the coil, and a fourth signal path connecting a second region of the first conductive portion and a second region of the second conductive portion. A signal path selected from among the first signal path, the second signal path, the third signal path, and the fourth signal path may include a first ground path and a second ground path connected to a ground region of the electronic device.

[0007] According to an aspect of the present disclosure, an electronic device may include a conductive portion, a coil, a printed circuit board (PCB), and a near field communication (NFC) circuit disposed on the PCB. A first transmitting terminal of the NFC circuit may be electrically connected to the conductive portion via a first signal path. A second transmitting terminal of the NFC circuit may be electrically connected to the coil via a second signal path. The NFC circuit may be configured to transmit a first signal of a differential output from the first transmitting terminal to the conductive portion via the first signal path, and to transmit a second signal of the differential output from the second transmitting terminal to the coil via the second signal path.

[0008] According to an aspect of the present disclosure, an electronic device may include a first housing portion including a plurality of conductive portions and non-conductive portions, a second housing portion rotatably coupled to the first housing portion, a printed circuit board (PCB) disposed in the first housing portion, a coil disposed in the second housing portion, and a near field communication (NFC) circuit disposed on the PCB. The plurality of non-conductive portions may include a first non-conductive portion and a second non-conductive portion. The plurality of conductive portions may include a first conductive portion formed between the first non-conductive portion and the second non-conductive portion. A first transmitting terminal of the NFC circuit may be electrically connected to the first conductive portion via a first signal path. A second transmitting terminal of the NFC circuit may be electrically connected to the coil via a second signal path. The NFC circuit may be configured to transmit a first signal of the differential output from the first transmitting terminal to the first conductive portion through the first signal path, and to transmit a second signal of the differential output to the coil through the second signal path from the second transmitting terminal.

[0009] Figure 1 is a block diagram of an electronic device within a network environment.

[0010] Figure 2a shows the connection structures between the NFC (near field communication) circuit and the emitters.

[0011] Figure 2b shows an example of a connection type.

[0012] FIGS. 3A, 3B, 3C, and 3D illustrate examples of electronic devices including NFC circuits utilizing conductive portions and coils.

[0013] FIGS. 4A and 4B illustrate examples of electronic devices including NFC circuits utilizing conductive portions and coils.

[0014] FIG. 5 illustrates an example of an electronic device including an NFC circuit utilizing a conductive portion and a coil.

[0015] Figure 6a is a drawing for explaining NFC communication of an electronic device.

[0016] Figure 6b shows an example of voltage changes in NFC reader mode.

[0017] FIGS. 7A, 7B, and 7C illustrate examples of electronic devices including NFC circuits utilizing multiple conductive portions.

[0018] Figure 8 shows the connection structure of a conductive part for cellular communication and an NFC circuit.

[0019] Figure 9 illustrates an example of an NFC path for an NFC circuit and a non-NFC communication path for a wireless communication circuit.

[0020] Figure 10 illustrates an example of an NFC path for an NFC circuit and a non-NFC communication path for a wireless communication circuit.

[0021] Figures 11a and 11b illustrate examples of an NFC path for an NFC circuit and a non-NFC communication path for a wireless communication circuit.

[0022] Figure 12 shows an example of an electronic device including a radio frequency (RF) choke inductor for electrostatic discharge (ESD) prevention.

[0023] Figure 13 shows an example of an electronic device including a varistor capacitor for ESD prevention.

[0024] Figure 14 shows an example of an electronic device including a band-stop filter circuit for ESD prevention.

[0025] Figures 15a to 15c illustrate examples of signal paths of an electronic device.

[0026] Figure 16 shows an example of S-parameter characteristics.

[0027] FIGS. 17a, 17b, 17c, 17d, and 17e illustrate examples of electronic devices including NFC circuits utilizing conductive portions and coils.

[0028] FIGS. 18A, 18B, and 18C illustrate examples of electronic devices including NFC circuits utilizing conductive portions and coils.

[0029] Figures 19a, 19b, and 19c illustrate examples of electronic devices utilizing conductive parts and coils.

[0030] FIGS. 20A and 20B illustrate examples of electronic devices including NFC circuits utilizing multiple conductive portions.

[0031] FIGS. 21A, 21B, and 21C illustrate examples of electronic devices including NFC circuits utilizing conductive portions and coils.

[0032] Figures 22a and 22b illustrate examples of electronic devices including a band-stop filter circuit.

[0033] Figures 23a, 23b, and 23c illustrate examples of electronic devices including NFC circuits utilizing various emitters.

[0034] Figures 24a and 24b show examples of bar-type electronic devices.

[0035] Figures 25a, 25b, and 25c illustrate examples of foldable-type electronic devices.

[0036] Figures 26a, 26b, and 26c illustrate examples of other foldable-type electronic devices.

[0037] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0038] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0039] In the following description, terms referring to parts of electronic devices (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), printed board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to the shape of parts (e.g., structure, structure, support, contact, or protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, or assembly), terms referring to the open structure of an antenna (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, or combiner), etc. are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as "... part," "... machine," "... object," or "... body" used below may mean at least one shape structure or a unit that processes a function.

[0040] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0041] Figure 1 is a block diagram of an electronic device within a network environment.

[0042] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0043] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0044] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0045] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0046] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0047] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0048] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0049] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0050] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0051] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0052] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0053] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0054] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0055] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0056] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0057] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0058] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0059] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB (decibel) or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0060] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0061] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0062] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0063] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0064] Figure 2a illustrates the connection structures between a near field communication (NFC) circuit and emitters. Identical reference numerals may represent identical or similar descriptions.

[0065] Referring to FIG. 2A, the electronic device (101) may include a conductive portion (210), an NFC circuit (220), and a coil (230). The conductive portion (210) corresponds to a conductor or a radiator and may be used as a radiator for NFC communication. The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may include terminals. For example, the NFC circuit (220) may include a first terminal (221) and a second terminal (222).

[0066] The electronic device (101) may include a transmission line electrically connecting a conductive portion (210), an NFC circuit (220), and a coil (230). The transmission line may represent paths along which signals of the NFC circuit (220) are transmitted. For example, the transmission line may include feed lines (or may be referred to as transmission line portions). The transmission line may include a first signal path (231) electrically connecting a first terminal (221) of the NFC circuit (220) and a first region of the conductive portion (210), a second signal path (232) electrically connecting a second terminal (222) of the NFC circuit (220) and a first end of the coil (230), and a third signal path (233) electrically connecting a second region of the conductive portion (210) and a second end of the coil (230).

[0067] A first terminal (221) of an NFC circuit (220) may be connected to a conductive portion (210) via a first signal path (231). A second terminal (222) of an NFC circuit (220) may be connected to a coil (230) via a second signal path (232). The conductive portion (210) and the coil (230) may be connected via a third signal path (233).

[0068] The NFC circuit (220) can operate in a differential mode. The NFC circuit (220) can output a first signal of a differential output through a first terminal (221). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the conductive portion (210) through a first signal path (231). The NFC circuit (220) can output a second signal of the differential output through a second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through a second signal path (232). In some embodiments, the first phase of the first signal and the second phase of the second signal may differ by about 180 degrees. For example, in terms of a signal being output through a terminal, the first terminal (221) may be referred to as a (+)Tx output terminal or a TX1 output terminal, and the second terminal (222) may be referred to as a (-)Tx output terminal or a TX2 output terminal. For example, the first signal may be a positive signal and the second signal may be a negative signal. For another example, the first signal may be a negative signal and the second signal may be a positive signal.

[0069] According to one embodiment, the first signal may be connected to the conductive portion (210) through the first signal path (231) via the impedance matching circuit. For example, the second signal may be connected to the coil (230) through the second signal path (232) via the impedance matching circuit. The electronic device (101) according to embodiments of the present disclosure may use the conductive portion (210) and the coil (230) as radiators to expand the NFC communication area. For example, when the coil (230) is arranged to face the rear of the electronic device (101), the NFC communication area may be expanded, for example, through the conductive portion (210) located at the top of the electronic device (101). The differential output of the NFC circuit (220) can be applied to the conductive portion (210) and the coil (230) via the first signal path (231), the second signal path (232), and / or the third signal path (233). As the conductive portion (210) and the coil (230) are used as radiators (collectively or individually) for the NFC signal, the NFC communication area can be expanded. In one embodiment, each of the first signal path (231), the second signal path (232), and the third signal path (233) can include or correspond to a transmission line or a ground path. The ground path corresponds to a signal path connected to a ground area, and the ground area can include a portion connected to the ground and / or a portion that acts as a ground. For example, each of the first signal path (231) and the second signal path (232) can include a transmission line. For example, the third signal path (233) may include ground paths connected to a ground area. For example, the first signal path (231) may include ground paths connected to a ground area, and the second signal path (232) may include a transmission line. The third signal path (233) may include a transmission line.For example, the first signal path (231) may include a transmission line, the second signal path (232) may include ground paths connected to a ground area, and the third signal path (233) may include a transmission line. The types of each of the first signal path (231), the second signal path (232), and the third signal path (233) are described in detail with reference to FIG. 2B.

[0070] Figure 2b illustrates an example of a connection type. Identical reference numerals may represent identical or similar descriptions.

[0071] Referring to FIG. 2B, according to one embodiment, the first connection type (251) (e.g., the connection type of the first signal path (231), the second signal path (232), or the third signal path (233)) may include a transmission line. For example, the transmission line may include a feeding line and may be formed on a PCB. For example, the NFC circuit (220) and a radiator (e.g., the conductive portion (210) and / or the coil (230)) may be connected through the transmission line. For example, the radiators (e.g., the conductive portion (210) and / or the coil (230)) may be electrically connected through the transmission line.

[0072] According to one embodiment, the second connection type (252) (e.g., the connection type of the first signal path (231), the second signal path (232), or the third signal path (233)) may include a first ground path (252a) and a second ground path (252b). For example, the first ground path (252a) and the second ground path (252b) may be connected to a ground area. The ground area may be a member that provides a ground, for example, a ground layer of a PCB or a support member of the electronic device (101). In the second connection type (252), the first ground path (252a) may be connected to a first ground portion (262a), and the second ground path (252b) may be connected to a second ground portion (262b). The ground portion (e.g., the first ground portion (262a) or the second ground portion (262b)) may be a portion connected to a ground path in the ground area. For example, the first ground portion (262a) and the second ground portion (262b) may be different portions within the same ground area (e.g., a ground layer of a PCB or a support member of an electronic device (101)). For another example, unlike the above, the ground area including the first ground portion (262a) may be different from the ground area including the second ground portion (262b). For example, the first signal path (231) may correspond to the second connection type (252), the second signal path (232) may correspond to the first connection type (251), and the third signal path (233) may correspond to the first connection type (251). For example, the first terminal (221) of the NFC circuit (220) may be connected to the first ground portion (262a), and the conductive portion (210) may be connected to the second ground portion (262b). As another example, the first signal path (231) may correspond to the first connection type (251), the second signal path (232) may correspond to the second connection type (252), and the third signal path (233) may correspond to the first connection type (251).For example, the second terminal (222) of the NFC circuit (220) may be connected to the first ground portion (262a), and the coil (230) may be connected to the second ground portion (262b).

[0073] In one embodiment, the third connection type (253) (e.g., the connection type of the first signal path (231), the second signal path (232), or the third signal path (233)) may include two ground paths that are connected to the same ground portion (e.g., the ground portion (263)). For example, the ground portion (263) may be a ground layer of a PCB, or a portion of a support member of the electronic device (101). The first ground path (252a) and the second ground path (252b) of the third connection type (253) may be short-circuited to each other at one point, and the short-circuited portion may be electrically connected to the ground portion (263). For example, the first signal path (231) may correspond to the third connection type (253), the second signal path (232) may correspond to the first connection type (251), and the third signal path (233) may correspond to the first connection type (251). The first terminal (221) and the second terminal (222) of the NFC circuit (220) may be connected to the ground portion (263). As another example, the first signal path (231) may correspond to the first connection type (251), the second signal path (232) may correspond to the third connection type (253), and the third signal path (233) may correspond to the first connection type (251). The first terminal (221) and the second terminal (222) of the NFC circuit (220) may be connected to the ground area via the ground portion (263).

[0074] FIGS. 3A, 3B, 3C, and 3D illustrate examples of an electronic device (e.g., electronic device (101)) including an NFC circuit (e.g., NFC circuit (220)) utilizing a conductive portion (e.g., conductive portion (210)) and a coil (e.g., coil (230)).

[0075] Fig. 3a shows an example of a circuit in which a first signal path (231) is of a first connection type (251), a second signal path (232) is of a first connection type (251), and a third signal path (233) is of a second connection type (252). Fig. 3b shows an example of a circuit in which a first signal path (231) is of a first connection type (251), a second signal path (232) is of a first connection type (251), and a third signal path (233) is of a third connection type (253). The same reference numerals may represent the same or similar descriptions.

[0076] Referring to FIG. 3A, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, a metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a first conductive portion (301), a second conductive portion (302), a third conductive portion (303), a fourth conductive portion (304), a fifth conductive portion (305), a sixth conductive portion (306), a seventh conductive portion (307), an eighth conductive portion (308), and / or a ninth conductive portion (309). For example, the plurality of non-conductive portions may include a first non-conductive portion (311), a second non-conductive portion (312), a third non-conductive portion (313), a fourth non-conductive portion (314), a fifth non-conductive portion (315), a sixth non-conductive portion (316), a seventh non-conductive portion (317), an eighth non-conductive portion (318), a ninth non-conductive portion (319), a tenth non-conductive portion (320), and / or an eleventh non-conductive portion (321).

[0077] In some embodiments, the first conductive portion (301) may be formed between the tenth non-conductive portion (320) and the eleventh non-conductive portion (321). The second conductive portion (302) may be formed between the first non-conductive portion (311) and the second non-conductive portion (312). The third conductive portion (303) may be formed between the second non-conductive portion (312) and the third non-conductive portion (313). The fourth conductive portion (304) may be formed between the third non-conductive portion (313) and the fourth non-conductive portion (314). The fifth conductive portion (305) may be formed between the fourth non-conductive portion (314) and the fifth non-conductive portion (315). The sixth conductive portion (306) may be formed between the fifth non-conductive portion (315) and the sixth non-conductive portion (316). The seventh conductive portion (307) may be formed between the seventh non-conductive portion (317) and the eighth non-conductive portion (318). The eighth conductive portion (308) may be formed between the eighth non-conductive portion (318) and the ninth non-conductive portion (319). The ninth conductive portion (309) may be formed between the ninth non-conductive portion (319) and the tenth non-conductive portion (320). At least some of the first conductive portion (301), the second conductive portion (302), the third conductive portion (303), the fourth conductive portion (304), the fifth conductive portion (305), the sixth conductive portion (306), the seventh conductive portion (307), the eighth conductive portion (308), and / or the ninth conductive portion (309) can be used as a radiator of an antenna for transmitting a wireless signal.

[0078] In some embodiments, the conductive portion (210) may be a conductive portion of a metal frame of the electronic device (101). For example, the conductive portion (210) may include a fourth conductive portion (304). The fourth conductive portion (304) may be used as a radiator for NFC communication. The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may include transmitting terminals. For example, the NFC circuit (220) may include a first terminal (221) and a second terminal (222). The first terminal (221) of the NFC circuit (220) may be connected to the fourth conductive portion (304) via a first signal path (331). For example, the first signal path (331) may include a transmission line portion (e.g., a feed line) and / or a connecting member (e.g., a C-clip). The above transmission line portion can be electrically connected to the NFC circuit (220) on the PCB.

[0079] In some embodiments, the connecting member may be electrically connected to the fourth conductive portion (304) through contact with the fourth conductive portion (304). For example, the transmission line portion and the connecting member may be electrically connected on the PCB. The second terminal (222) of the NFC circuit (220) may be connected to the coil (230) via a second signal path (332). For example, the second signal path (332) may include a transmission line portion. One end of the second signal path (332) may be electrically connected to the NFC circuit (220) on the PCB. The other end of the second signal path (332) may be connected to the coil (230). As a non-limiting example, the second signal path (332) may include a flexible printed circuit board (FPCB) connected to the PCB on which the NFC circuit (220) is disposed.

[0080] In some embodiments, the NFC circuit (220) can operate in a differential mode. The NFC circuit (220) can output a first signal of a differential output through a first terminal (221). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the fourth conductive portion (304) through a first signal path (331). The NFC circuit (220) can output a second signal of the differential output through a second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through a second signal path (332). The first phase of the first signal and the second phase of the second signal can be about 180 degrees apart. The fourth conductive portion (304) may be connected to a ground portion (e.g., the first ground portion (262a)) via a first ground path (341). For example, the ground portion may be a portion of a ground area (e.g., a PCB on which the NFC circuit (220) is arranged, a support member of the electronic device (101)). For example, the first ground path (341) may include a transmission line portion and / or a connecting member (e.g., a C-clip). The connecting member may be arranged to connect the transmission line portion and the conductive portion (304). The transmission line portion may be connected to the ground portion. The coil (230) may be connected to a ground portion (e.g., the second ground portion (262b)) via a second ground path (342). For example, the ground portion may be a portion of a PCB on which an NFC circuit (220) is arranged, or a portion of a support member of an electronic device (101). For example, the second ground path (342) may include a transmission line portion. The transmission line portion may be connected to the ground portion.As a non-limiting example, the second ground path (342) may further include a connecting member (e.g., FPCB) for the coil (230). For example, the ground portion may be included in a hinge portion of the electronic device (101). The first ground path (341) and the second ground path (342) may not be directly connected, and the conductive portion (304) and the coil (230) may be in an open state.

[0081] In FIG. 3A, the ground portion (e.g., the first ground portion (262a)) to which the fourth conductive portion (304) is connected via the first ground path (341) and the ground portion (e.g., the second ground portion (262b)) to which the coil (230) is connected via the first ground path (341) are described as being independent, but embodiments of the present disclosure are not limited thereto. According to one embodiment, as illustrated in FIG. 3B, the transmission line connected to the fourth conductive portion (304) and the transmission line connected to the coil (230) may be short-circuited, and the short-circuited portion may be connected to the ground portion (e.g., the ground portion (263)). For example, the ground portion may be a part of a ground area (e.g., a PCB on which the NFC circuit (220) is arranged, a support member of the electronic device (101).

[0082] Although FIGS. 3A and 3B illustrate an example in which a conductive portion (e.g., a fourth conductive portion (304)) disposed on the upper portion of a housing (e.g., a metal frame) of an electronic device (101) is used as a radiator for an NFC circuit (220), embodiments of the present disclosure are not limited thereto. For example, other conductive portions (e.g., a first conductive portion (301), a second conductive portion (302), a third conductive portion (303), a fifth conductive portion (305), a sixth conductive portion (306), a seventh conductive portion (307), an eighth conductive portion (308), and / or a ninth conductive portion (309)) may be used as a conductive portion (210) connected to an NFC circuit (220). Additionally, for example, in addition to the housing of the electronic device (101), a separate conductive portion (e.g., a conductive pattern, a conductive patch, or a metal structure) may be used as the conductive portion (210) connected to the NFC circuit (220).

[0083] Referring to FIG. 3C, the electronic device (101) may include at least one matching circuit for the NFC circuit (220). For example, the at least one matching circuit may be disposed on a PCB on which the NFC circuit (220) is disposed. Each matching circuit of the at least one matching circuit may include at least one passive element (e.g., an inductor or a capacitor). For example, the electronic device (101) may include a matching circuit (360) for two radiators (e.g., the conductive portion (210) or the coil (230)). The matching circuit (360) may be referred to as a common matching circuit. For example, the electronic device (101) may include a first matching circuit (371) and a second matching circuit (372). The first matching circuit (371) may be used for impedance matching of a first signal of a first terminal (221) of the NFC circuit (220). The second matching circuit (372) may be used for impedance matching of the second signal of the second terminal (222) of the NFC circuit (220). The first signal and the second signal may be signals for differential output of the NFC circuit (220) (or may correspond to each other). For example, the first phase of the first signal and the second phase of the second signal may be approximately 180 degrees apart.

[0084] Referring to FIG. 3D, the electronic device (101) may include at least one matching circuit for the NFC circuit (220). Each matching circuit of the at least one matching circuit may include at least one passive element (e.g., an inductor or a capacitor). For example, the electronic device (101) may include a matching circuit (360) for two radiators (e.g., the conductive portion (210) or the coil (230)). For example, the electronic device (101) may include a first matching circuit (381) and / or a second matching circuit (382). The matching circuit (360) may be configured to output a sinusoidal signal by filtering a square wave signal output from the NFC circuit (220) as well as by matching impedance. In some cases, it may not be easy to perform impedance matching by significantly changing the capacitance or inductance in the matching circuit (360). The first matching circuit (381) may be used for impedance matching of the first signal of the first terminal (221) of the NFC circuit (220). The second matching circuit (382) may be used for impedance matching of the second signal of the second terminal (222) of the NFC circuit (220). The first signal and the second signal may be signals for differential output of the NFC circuit (220) (or may correspond to them).

[0085] In some embodiments, if the inductance of the coil (230) is fixed, the frequency range and / or impedance range for impedance matching in the first matching circuit (381) may be limited. According to one embodiment, the electronic device (101) may further include a matching circuit (e.g., a fourth matching circuit (392)) connected to the end of the coil (230) for more efficient impedance matching. For example, if the inductance of the conductive portion (210) is fixed, the frequency range and / or impedance range for impedance matching in the second matching circuit (382) may also be limited. According to one embodiment, the electronic device (101) may further include a matching circuit (e.g., a third matching circuit (391)) connected to the end of the conductive portion (210) for more efficient impedance matching. In FIG. 3d, an example including a third matching circuit (391) and a fourth matching circuit (392) is illustrated, but as a non-limiting example, one of the third matching circuit (391) and the fourth matching circuit (392) may be omitted.

[0086] Although FIGS. 3A, 3B, 3C, and 3D illustrate examples in which the first signal is a positive signal and the second signal is a negative signal, embodiments of the present disclosure are not limited thereto. The first signal may be a negative signal and the second signal may be a positive signal. As the polarity of the differential output changes, the direction of the signals supplied to each radiator (e.g., conductive portion (210) or coil (230)) may change.

[0087] NFC communication is a wireless communication technology that allows two devices to recognize each other and exchange data in a band of approximately 13.56 MHz (e.g., approximately 13.56 MHz to 13.57 MHz). The two devices may be referred to as a reader and a terminal (e.g., an electronic device (101)). The reader generates a magnetic field, and the terminal can recognize information from the reader through the magnetic field. The terminal may include an antenna referred to as an NFC loop. In order to extract information through the NFC loop, a magnetic field that evenly passes through the entire NFC loop may be required. The influence of the magnetic field passing through the NFC loop can be determined through the degree of coupling. The degree of coupling may represent the ratio of the magnetic flux passing through the NFC loop of the terminal (e.g., the magnetic flux generated by the NFC reader) to the total magnetic flux emitted by the NFC reader. For example, the NFC loop may include a conductive connecting member. When the NFC portion located at the top of the terminal including the NFC loop approaches the reader, coupling occurs as magnetic flux passes through the entire NFC loop. For another example, the NFC loop may include a ground connection member. For example, when the radiator (e.g., conductive portion (210)) located at the top of the terminal including the NFC loop approaches the reader, the NFC loop may be divided into an upper loop and a lower loop based on the ground. Coupling may occur due to magnetic flux passing only through the upper loop.

[0088] In some embodiments, when two radiators (e.g., conductive portion (210) or coil (230)) of the electronic device (101) are far apart, a structure in which the two radiators are connected via ground paths (e.g., the connection structure of FIGS. 3A to 3D ) may be advantageous for communication performance. If the two radiators are connected via a ground area (e.g., a ground area corresponding to a portion of a PCB), loops may be distinguished based on the ground. For example, the loops may include an upper loop for the conductive portion (210) located relatively at the top of the electronic device (101) and a lower loop for the coil (230) located at the bottom of the electronic device (101).

[0089] In a related art (without separating the two loops), if a conductive portion (such as the conductive portion (210) of the electronic device (101)) is brought closer to a reader (e.g., an external electronic device), a magnetic field may be concentrated on the upper loop. If the conductive portion (such as the conductive portion (210)) is connected via a conductive connecting member rather than a ground region, a sufficient magnetic field may not reach the coil (such as the coil (230)) located below, thereby reducing the degree of coupling. Due to the low degree of coupling, it may be difficult to accurately recognize information from the reader. However, in embodiments of the present disclosure, since the two loops are separated via the ground region, the magnetic field received from the reader more effectively reaches the conductive portion (210) of the electronic device (101), thereby improving the performance of recognizing information.

[0090] When two radiators (e.g., conductive portion (210) or coil (230)) of an electronic device (101) are far apart, a structure in which the two radiators are connected via ground paths (e.g., the connection structure of FIGS. 3A to 3D) may also be advantageous in terms of simplifying circuit wiring. If the two radiators (e.g., conductive portion (210) and coil (230)) are to be connected via separate conductive connecting members, the wiring may be arranged from the bottom to the top of the electronic device (101), which may complicate the circuit wiring. On the other hand, if the two radiators (e.g., conductive portion (210) and coil (230)) are to be connected via a ground area, the circuit wiring may be simplified since they only need to be connected to different ground portions in the ground area. For example, in a foldable type electronic device including two housing parts (e.g., an upper housing part and a lower housing part), it may be assumed that an NFC circuit (220) and a conductive portion (210) are located in the upper housing part, and a coil (230) is located in the lower housing part. A portion of a PCB (e.g., a first ground portion (262a)) within the upper housing part may be connected to the conductive portion (210), and another portion of the PCB (e.g., a second ground portion (262b)) may be connected to the coil (230). Since the two radiators are electrically connected through different ground portions within the PCB, unnecessary circuit wiring may be reduced.

[0091] Figures 4a and 4b illustrate examples of an electronic device (e.g., electronic device (101)) including an NFC circuit (e.g., NFC circuit (220)) utilizing a conductive portion (e.g., conductive portion (210)) and a coil (e.g., coil (230)). Figures 4a and 4b illustrate examples of circuits in which a first signal path (231) is of a second connection type (252) or a second signal path (232) is of a second connection type (253). Identical reference numerals may represent identical or similar descriptions.

[0092] Referring to FIG. 4A, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, a metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a first conductive portion (301), a second conductive portion (302), a third conductive portion (303), a fourth conductive portion (304), a fifth conductive portion (305), a sixth conductive portion (306), a seventh conductive portion (307), an eighth conductive portion (308), and / or a ninth conductive portion (309). For example, the plurality of non-conductive portions may include a first non-conductive portion (311), a second non-conductive portion (312), a third non-conductive portion (313), a fourth non-conductive portion (314), a fifth non-conductive portion (315), a sixth non-conductive portion (316), a seventh non-conductive portion (317), an eighth non-conductive portion (318), a ninth non-conductive portion (319), a tenth non-conductive portion (320) and / or an eleventh non-conductive portion (321). For the conductive portions and the non-conductive portions, reference may be made to the descriptions of FIG. 3A.

[0093] The conductive portion (210) according to the embodiments may be a conductive portion of a metal frame of the electronic device (101). For example, the conductive portion (210) may include a fourth conductive portion (304). The fourth conductive portion (304) may be used as a radiator for NFC communication. The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may include transmitting terminals. For example, the NFC circuit (220) may include a first terminal (221) and a second terminal (222). The first terminal (221) of the NFC circuit (220) may be connected to a ground portion via a first ground path (431a). For example, the ground portion may be a portion of a ground area (e.g., a portion of a PCB on which the NFC circuit (220) is arranged, a support member of the electronic device (101). The second terminal (222) of the NFC circuit (220) may be connected to the coil (230) via the second signal path (332). The coil (230) may be connected to the fourth conductive portion (304) via the third transmission path (441). A second signal of a differential output of the NFC circuit (220), which will be described later, may be transmitted from the coil (230) to the fourth conductive portion (304) via the third transmission path (441). For example, the third transmission path (441) may include a transmission line portion (e.g., a feed line) and / or a connecting member (e.g., a C-clip) connected to a PCB. The connecting member may be used to electrically connect the fourth conductive portion (304) and the transmission line portion. As a non-limiting example, the third transmission path (441) may further include a connecting member (e.g., an FPCB) for electrical connection with the coil (230). The fourth conductive portion (304) may be connected to a ground portion via a second ground path (431b). For example, the ground portion may be a portion of a ground area (e.g., a portion of a PCB on which an NFC circuit (220) is placed, or a support member of an electronic device (101)).

[0094] In FIG. 4A, an example is shown in which the output (e.g., second signal) of the second terminal (222) among the differential outputs of the NFC circuit (220) is provided to the coil (230) and the fourth conductive portion (304), and the output (e.g., first signal) of the first terminal (221) is provided to the ground; however, the embodiments of the present disclosure are not limited thereto. According to another embodiment, as illustrated in FIG. 4B, the first signal may be provided to the coil (230) and the fourth conductive portion (304) instead of the second signal.

[0095] Referring to FIG. 4B, the first terminal (221) of the NFC circuit (220) may be connected to the fourth conductive portion (304) via the first signal path (331). For example, the first signal path (331) may include a transmission line portion and / or a connecting member (e.g., a C-clip). The transmission line portion may be electrically connected to the NFC circuit (220) on the PCB. The connecting member may be electrically connected to the fourth conductive portion (304) through contact with the fourth conductive portion (304). For example, the transmission line portion and the connecting member may be electrically connected on the PCB. The fourth conductive portion (304) may be connected to the coil (230) via the third transmission path (441). A first signal of a differential output of the NFC circuit (220) may be transmitted from the fourth conductive portion (304) to the coil (230) via a third transmission path (441). For example, the third transmission path (441) may include a transmission line portion (e.g., a feed line) and / or a connecting member (e.g., a C-clip) connected to a PCB. The connecting member may be used to electrically connect the fourth conductive portion (304) and the transmission line portion. As a non-limiting example, the third transmission path (441) may further include a connecting member (e.g., an FPCB) for electrical connection with the coil (230). The second terminal (222) of the NFC circuit (220) may be connected to a ground portion via a first ground path (432a). For example, the ground portion may be a portion of a ground area (e.g., a portion of a PCB on which an NFC circuit (220) is arranged, or a support member of an electronic device (101)). For example, the first ground path (432a) may include a portion of a transmission line arranged on the PCB. The coil (230) may be connected to the ground portion via the second ground path (432b).The above-mentioned ground portion may be a part of a ground area (e.g., a part of a PCB on which an NFC circuit (220) is arranged, a support member of an electronic device (101). For example, the second ground path (432b) may include a transmission line portion arranged on a PCB. As a non-limiting example, the first ground path (432a) or the second ground path (432b) may further include a connecting member in addition to the transmission line portion. As an example, the connecting member may include a line on an FPCB connected to a coil (230). The ground portion connected through the connecting member may correspond to a hinge portion of the electronic device (101).

[0096] FIG. 5 illustrates an example of an electronic device including an NFC circuit (e.g., an NFC circuit (220)) utilizing a conductive portion (e.g., a conductive portion (210)) and a coil (e.g., a coil (230)). FIG. 5 illustrates an example of a circuit in which a third signal path (233) is of a first connection type (251). Identical reference numerals may represent identical or similar descriptions.

[0097] Referring to FIG. 5, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, a metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a first conductive portion (301), a second conductive portion (302), a third conductive portion (303), a fourth conductive portion (304), a fifth conductive portion (305), a sixth conductive portion (306), a seventh conductive portion (307), an eighth conductive portion (308), and / or a ninth conductive portion (309). For example, the plurality of non-conductive portions may include a first non-conductive portion (311), a second non-conductive portion (312), a third non-conductive portion (313), a fourth non-conductive portion (314), a fifth non-conductive portion (315), a sixth non-conductive portion (316), a seventh non-conductive portion (317), an eighth non-conductive portion (318), a ninth non-conductive portion (319), a tenth non-conductive portion (320), and / or an eleventh non-conductive portion (321). For the conductive portions and the non-conductive portions, reference may be made to the descriptions of FIG. 3A.

[0098] The conductive portion (210) according to the embodiments may be a conductive portion of a metal frame of the electronic device (101). For example, the conductive portion (210) may include a fourth conductive portion (304). The fourth conductive portion (304) may be used as a radiator for NFC communication. The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may include transmitting terminals. The NFC circuit (220) may output a first signal of a differential output through a first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the fourth conductive portion (304) through a first signal path (331). The NFC circuit (220) may output a second signal of the differential output through a second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (332). The first phase of the first signal and the second phase of the second signal may be about 180 degrees apart.

[0099] The fourth conductive portion (304) and the coil (230) may be electrically connected via a third transmission path (541). The first signal may be transmitted from the fourth conductive portion (304) to the coil (230) via the third transmission path (541). The second signal may be transmitted from the coil (230) to the fourth conductive portion (304) via the third transmission path (541). The third transmission path (541) may correspond to the first connection type (251). For example, the third transmission path (541) may include a transmission line portion (e.g., a feed line) and / or a connecting member (e.g., a C-clip) connected on a PCB. The connecting member may be used to electrically connect the fourth conductive portion (304) and the transmission line portion. As a non-limiting example, the third transmission path (541) may further include a connecting member (e.g., FPCB) for electrical connection with the coil (230).

[0100] Figure 6a is a diagram illustrating NFC communication of an electronic device. The electronic device (101) can operate in card mode or reader mode via an NFC circuit (e.g., NFC circuit (220)). For example, NFC communication refers to a short-range wireless communication technology that transmits and receives signals in a band of approximately 13.56 MHz (e.g., approximately 13.56 MHz or more and 13.57 MHz or less).

[0101] Referring to FIG. 6A, the electronic device (101) may include a conductive portion (210) and a coil (230). For example, when the electronic device (101) operates in a reader mode, the electronic device (101) may communicate with an external electronic device (610) (e.g., a card). The electronic device (101) may transmit a wireless signal in an NFC frequency band (e.g., a 13.56 MHz band) through each of the conductive portion (210) and the coil (230). The external electronic device (610) may include a resonant coil (620) and an NFC circuit (630). For example, the NFC circuit (630) may include a plurality of resistors (e.g., a first resistor or a second resistor) and a switching circuit. As an example, the switching circuit may electrically connect the first resistor among the plurality of resistors and the resonant coil (620). As the wireless signal is transmitted to the resonant coil (620), the switching circuit of the NFC circuit (630) may be switched. For example, the switching circuit may change the connection resistance from the first resistor to the second resistor. The switching circuit may electrically connect the second resistor among the plurality of resistors to the resonant coil (620). Due to load modulation according to the change in the resistance of the external electronic device (610) (e.g., change from the first resistor to the second resistor), the voltage induced in the inductor (e.g., conductive portion (210) or coil (230)) on the electronic device (101) side may change. The electronic device (101) may obtain information on the external electronic device (610) through the change in the voltage.

[0102] According to embodiments, the electronic device (101) can utilize both the conductive portion (210) and the coil (230) as radiators. Communication between the radiators (e.g., the conductive portion (210) or the coil (230)) of the electronic device (101) and the resonant coil (620) of the external electronic device (610) may be a coupling between inductors. A coupling coefficient (640) may be determined due to a magnetic field between the radiators of the electronic device (101) and the resonant coil (620). For example, the electronic device (101) may separately include a matching circuit (e.g., a first matching circuit (371)) for the conductive portion (210), and a magnetic field may be formed between the conductive portion (210) and the resonant coil (620). The electronic device (101) separately includes a matching circuit (e.g., a second matching circuit (372)) for the coil (230), and a magnetic field can be formed between the coil (230) and the resonant coil (620). Since a voltage change is detected based on an independent ground, the NFC communication performance of the electronic device (101) can be improved.

[0103] Figure 6b shows an example of voltage changes in NFC reader mode.

[0104] Referring to FIG. 6B, a graph (650) represents voltage changes in NFC communication using both the conductive portion (210) and the coil (230) of the electronic device (101). The horizontal axis of the graph (650) represents time (unit: us (microsecond)), and the vertical axis of the graph (650) represents voltage. For example, the peak voltage at the first point (661) represents approximately 14.476 V, and the peak voltage at the second point (662) represents approximately 8.709 V. Through the pattern that appears through the voltage change, such as at the first point (661) and the second point (662), the electronic device (101) can recognize the external electronic device (610).

[0105] Although FIGS. 6A and 6B illustrate examples in which the electronic device (101) operates in reader mode, the embodiments of the present disclosure are not limited thereto. The external electronic device (610) may be an NFC reader, and the electronic device (101) may operate in NFC card mode. In this case, load modulation may be performed in the electronic device (101) according to a signal transmitted from the external electronic device (610). Due to the load modulation, the magnetic fields of the conductive portion (210) and the coil (230) of the external electronic device (610) may vary. Due to the change in the magnetic field, information about the electronic device (101) may be obtained through the induced voltage.

[0106] Figures 7a, 7b, and 7c illustrate examples of an electronic device (e.g., electronic device (101)) including an NFC circuit (e.g., NFC circuit (220)) utilizing multiple conductive portions. Like reference numerals may represent the same or similar descriptions.

[0107] Referring to FIG. 7A, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, a metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a first conductive portion (301), a second conductive portion (302), a third conductive portion (303), a fourth conductive portion (304), a fifth conductive portion (305), a sixth conductive portion (306), a seventh conductive portion (307), an eighth conductive portion (308), and a ninth conductive portion (309). For example, the plurality of non-conductive portions may include a first non-conductive portion (311), a second non-conductive portion (312), a third non-conductive portion (313), a fourth non-conductive portion (314), a fifth non-conductive portion (315), a sixth non-conductive portion (316), a seventh non-conductive portion (317), an eighth non-conductive portion (318), a ninth non-conductive portion (319), a tenth non-conductive portion (320) and / or an eleventh non-conductive portion (321). For the conductive portions and the non-conductive portions, reference may be made to the descriptions of FIG. 3A.

[0108] According to one embodiment, as a radiator for transmitting or receiving a signal of the NFC circuit (220), an additional conductive portion may be used in addition to the conductive portion (210). For example, as a radiator for transmitting or receiving a signal of the NFC circuit (220), two or more conductive portions may be used. For example, the two or more conductive portions may include a fourth conductive portion (304) and a fifth conductive portion (305). The fourth conductive portion (304) and the fifth conductive portion (305) may be used as radiators for NFC communication. The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may include transmitting terminals. For example, the NFC circuit (220) may include a first terminal (221) and a second terminal (222). A first terminal (221) of an NFC circuit (220) can be connected to a fourth conductive portion (304) via a first signal path (331). A second terminal (222) of an NFC circuit (220) can be connected to a coil (230) via a second signal path (332).

[0109] The fourth conductive portion (304) may be connected to the ground portion via the first ground path (751a). For example, the ground portion may be a portion of a ground area (e.g., a portion of a PCB on which the NFC circuit (220) is disposed, or a support member of the electronic device (101). The fifth conductive portion (305) may be connected to the ground portion via the second ground path (751b). For example, the ground portion may be a portion of a ground area (e.g., a portion of a PCB on which the NFC circuit (220) is disposed, or a support member of the electronic device (101). The fifth conductive portion (305) may be electrically connected to the coil (230) via the third transmission path (742). The second signal may be transmitted from the coil (230) to the fifth conductive portion (305) via the third transmission path (742). The third transmission path (742) may correspond to the first connection type (251). For example, the third transmission path (742) may include a transmission line portion and / or a connecting member (e.g., a C-clip) connected to the PCB. The connecting member may be used to electrically connect the fifth conductive portion (305) and the transmission line portion. As a non-limiting example, the third transmission path (742) may further include a connecting member (e.g., an FPCB) for electrical connection with the coil (230).

[0110] Although FIG. 7A illustrates an example in which the ground portion connected to the fourth conductive portion (304) and the ground portion connected to the fifth conductive portion (305) are disposed adjacent to each other, embodiments of the present disclosure are not limited thereto. For example, unlike FIG. 7A, the first ground path (751a) and the second ground path (751b) may be short-circuited with each other, and a portion of the first ground path (751a) or the second ground path (751b) may be connected to the same ground portion. For example, the fourth conductive portion (304) and the fifth conductive portion (305) may be connected to the ground portion through a connection structure of the third connection type (253). For another example, as illustrated in FIG. 7B, the ground portion connected to the fourth conductive portion (304) and the ground portion connected to the fifth conductive portion (305) may be spaced apart from each other by a certain distance or more.

[0111] The direction of the power supply path illustrated in FIGS. 7A and 7B is exemplary and is not to be construed as limiting the embodiments of the present disclosure. For example, as illustrated in FIG. 7C, a signal of the NFC circuit (220) may flow on the fourth conductive portion (304) along the direction from the fourth non-conductive portion (314) to the third non-conductive portion (313), and may flow on the fifth conductive portion (305) along the direction from the fifth non-conductive portion (315) to the fourth non-conductive portion (314). For example, any circuit connection structure that performs NFC communication using a plurality of radiators (e.g., the fourth conductive portion (304), the fifth conductive portion (305), or the coil (230)) connected to the NFC circuit, regardless of the power supply position, the ground position, or the segment position on the conductive portion, can be understood as an embodiment of the present disclosure.

[0112] The electronic device (101) described through FIGS. 2A to 7C can perform NFC communication through a plurality of emitters (e.g., conductive portion (210) or coil (230)). In card mode and / or reader mode, an NFC communication area can be expanded through the plurality of emitters. In the card mode, the expansion of the communication area can be confirmed by the distance (hereinafter, recognition distance) and / or the direction in which an external electronic device (e.g., an NFC reader) can recognize the electronic device (101). In the reader mode, the expansion of the communication area can be confirmed by the distance and / or the direction in which the electronic device (101) can recognize an external electronic device (e.g., a card equipped with an NFC module). For example, the performance of the card mode is as follows.

[0113] Performance of the mod card mode First method Circuit structure using only the coil (230) without the conductive part (210) Top 0°: Not recognized Top 45°: Not recognized Bottom 90°: Not recognized Bottom: Approximately 88 mm: Second method Circuit structure of Fig. 3a Top 0°: Approximately 39 mm Top 45°: Approximately 29 mm Top 90°: Approximately 21 mm Bottom: Approximately 74 mm: Third method Circuit structure of Fig. 4a Top 0°: Approximately 34 mm Top 45°: Approximately 26 mm Top 90°: Approximately 15 mm Bottom: Approximately 74 mm: Fourth method Circuit structure of Fig. 5 Top 0°: Approximately 34 mm Top 45°: Approximately 16 mm Top 90°: Approximately 7 mm Bottom: Approximately 94 mm:

[0114] 'Top 0°' indicates the result of the recognition distance measurement in a situation where the angle between the upper surface of the electronic device (101) (e.g., the surface of the PCB board) and the external electronic device (e.g., the NFC reader) is 0 degrees. 'Top 45°' indicates the result of the recognition distance measurement in a situation where the angle between the upper surface of the electronic device (101) (e.g., the surface of the PCB board) and the external electronic device (e.g., the NFC reader) is about 45 degrees. 'Top 90°' indicates the result of the recognition distance measurement in a situation where the angle between the upper surface of the electronic device (101) (e.g., the surface of the PCB board) and the external electronic device (e.g., the NFC reader) is about 90 degrees. 'Bottom' indicates the result of the recognition distance measurement in a situation where the angle between the lower surface of the electronic device (101) (e.g., the surface of the PCB board) and the external electronic device (e.g., the NFC reader) is about 0 degrees.

[0115] For example, the performance of leader mode is as follows:

[0116] Performance of mode reader mode First method Circuit structure using only coil (230) without conductive part (210) First type NFC card: about 40 mm Second type NFC card: about 30 mm Third type NFC card: about 16 mm Second method Circuit structure of Fig. 3a First type NFC card: about 32 mm Second type NFC card: about 23 mm Third type NFC card: about 13 mm Third method Circuit structure of Fig. 4a First type NFC card: about 27 mm Second type NFC card: about 22 mm Third type NFC card: about 12 mm Fourth method Circuit structure of Fig. 5 First type NFC card: about 42 mm Second type NFC card: about 26 mm Third type NFC card: about 14 mm

[0117] Fig. 8 illustrates a connection structure of a conductive portion (e.g., conductive portion (210)) for cellular communication and an NFC circuit (e.g., NFC circuit (220)). The same reference numbers may indicate the same or similar descriptions.

[0118] Referring to FIG. 8, the electronic device (101) may include a conductive portion (210), an NFC circuit (220), and a coil (230). The conductive portion (210) may be used as a radiator for NFC communication. The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output through a first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the conductive portion (210) through a first signal path (231). The NFC circuit (220) may output a second signal of the differential output through a second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (232). For example, the first phase of the first signal and the second phase of the second signal may be about 180 degrees apart.

[0119] According to one embodiment, the conductive portion (210) can be used as a radiator for communication other than NFC communication (hereinafter, non-NFC communication), such as cellular communication. The electronic device (101) may include a wireless communication circuit (820). For example, the wireless communication circuit (820) may be configured to process (e.g., DAC, ADC, upconversion, downconversion, frequency filtering, or phase shift) an RF signal in the frequency band of WiFi communication or the cellular communication. The wireless communication circuit (820) may radiate the RF signal through the conductive portion (210) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). For example, the NFC circuit (220) and the wireless communication circuit (820) may share the conductive portion (210) as an antenna radiator. In one embodiment, the electronic device (101) may include a switching circuit (845) (or X-GND (ground) circuit) for impedance matching of the conductive portion (210) which is a radiator of the cellular communication. As a non-limiting example, the switching circuit (845) may be omitted.

[0120] According to one embodiment, the electronic device (101) may include passive components to separate an RF signal of a frequency band of non-NFC communication (e.g., cellular communication) and output signals of the NFC circuit (220) (e.g., a first signal of the first terminal (221) or a second signal of the second terminal (222). According to one embodiment, the electronic device (101) may include at least one capacitor to prevent the inflow of output signals of the NFC circuit (220) into a path (hereinafter, a mobile communication path) through which the RF signal of the frequency band of the cellular communication is transmitted. For example, the at least one capacitor may include a first capacitor (841) and a second capacitor (842). As an example, the first capacitor (841) may be connected to a power supply path (831) between the wireless communication circuit (820) and the conductive portion (210) in the mobile communication path. The second capacitor (842) may be connected to the ground path (832) between the ground and the conductive portion (210) among the mobile communication paths. Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking direct current (DC) or frequencies below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). According to one embodiment, at least one of the at least one capacitor may be a varistor capacitor for withstanding electrostatic pressure. The capacitors illustrated in FIG. 8 are only examples of implementation and are not to be construed as limiting the embodiments of the present disclosure. The first capacitor (841) and / or the second capacitor (842) may be omitted from the mobile communication path, or other capacitors may be further added.

[0121] According to one embodiment, the electronic device (101) may include at least one inductor to prevent the inflow of the RF signal of the frequency band of the cellular communication into the path (hereinafter, NFC path) through which the output signals of the NFC circuit (220) are transmitted. For example, the at least one inductor may include a first inductor (851) and / or a second inductor (852). As an example, the first inductor (851) may be arranged in series on the first signal path (331). The second inductor (852) may be arranged in series on a ground path (e.g., the first ground path (341)). The inductors illustrated in FIG. 8 are only examples of implementation and are not to be construed as limiting the embodiments of the present disclosure. The first inductor (851) and / or the second inductor (852) may be omitted on the NFC path, or other inductors may be further added.

[0122] FIG. 9 illustrates an example of an NFC path for an NFC circuit (e.g., NFC circuit (220)) and a non-NFC communication path for a wireless communication circuit (e.g., wireless communication circuit (820)). To describe the NFC path, the circuit structure of FIG. 3A may be referred to. To describe the non-NFC communication path, the description of FIG. 8 may be applied. FIG. 9 illustrates an example in which a power path of an RF signal for a non-NFC communication (e.g., cellular communication such as LTE or NR, wireless LAN communication such as Wi-Fi) is shared with a transmission path of NFC communication, and / or an example in which a ground path of an RF signal for the non-NFC communication (e.g., cellular communication) is shared with a ground path of NFC communication. The same reference numerals may represent the same or similar descriptions.

[0123] Referring to FIG. 9, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For the conductive portions and the non-conductive portions, the descriptions for FIG. 3A may be referred to. The electronic device (101) may include a wireless communication circuit (820). For example, the electronic device (101) may be configured to supply power.

[0124] It may include a path (831) and a ground path (832). For example, the wireless communication circuit (820) may be connected to the fourth conductive portion (304) via the power supply path (831). For example, at least a portion of the power supply path (831) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of the NFC circuit (220). For example, at least a portion (e.g., a transmission line portion and / or a connecting member) of the power supply path (831) may be used as a portion of the first signal path (331) for transmitting a first signal of the first terminal (221) of the NFC circuit (220). In addition, at least a portion of the ground path (832) may be shared with at least a portion of a ground path (e.g., a first ground path (341)) of the NFC circuit (220). For example, at least a portion of the ground path (832) (e.g., a portion of a transmission line and / or a connecting member) may be used as a part of the first ground path (341) to ground the first signal of the first terminal (221) of the NFC circuit (220). In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. For example, the electronic device (101) may include a first capacitor (841) in the power path (831). The electronic device (101) may include a second capacitor (842) in the ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, each of the first capacitor (841) and the second capacitor (842) can be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz).

[0125] According to one embodiment, the electronic device (101) may include an NFC circuit (220). A first terminal (221) of the NFC circuit (220) may be connected to a fourth conductive portion (304) via a first signal path (331). The first signal path (331) may include a first inductor (851). The first inductor (851) may be an RF choke inductor for blocking the inflow of an RF signal in a frequency band of cellular communication. For example, the inductance of the first inductor (851) may provide a high impedance higher than a critical value due to the frequency of the RF signal. The first ground path (341) may include a second inductor (852). The second inductor (852) may be an RF choke inductor for blocking the inflow of an RF signal in a frequency band of cellular communication. For example, the inductance of the second inductor (852) can provide a high impedance above the critical value due to the frequency of the RF signal.

[0126] Fig. 10 illustrates an example of an NFC path for an NFC circuit (e.g., NFC circuit (220)) and a non-NFC communication path for a wireless communication circuit (e.g., wireless communication circuit (820)). To explain the NFC path, reference may be made to the circuit structure of Fig. 3a. To explain the non-NFC communication path, reference may be made to the description of Fig. 8. Fig. 10 illustrates an example in which a ground path of an RF signal for a non-NFC communication (e.g., cellular communication such as LTE or NR, wireless LAN communication such as WiFi) is shared with a transmission path of NFC communication and / or an example in which a power supply path of an RF signal for the non-NFC communication (e.g., cellular communication) is shared with a ground path of NFC communication. The same reference numbers may represent the same or similar descriptions.

[0127] Referring to FIG. 10, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For the conductive portions and the non-conductive portions, the descriptions with respect to FIG. 3A may be referred to. The electronic device (101) may include a wireless communication circuit (820). In FIG. 10, the electronic device (101) may include a power supply path (831) and a ground path (832). For example, the wireless communication circuit (820) may be connected to the fourth conductive portion (304) via the power supply path (831). In FIG. 10, at least a portion of the ground path (832) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of the NFC circuit (220). For example, at least a portion of the ground path (832) (e.g., a transmission line portion and / or a connecting member) may be used as a portion of the first signal path (331) to transmit a first signal of the first terminal (221) of the NFC circuit (220). Additionally, at least a portion of the power supply path (831) may be shared with at least a portion of the ground path (e.g., the first ground path (341)) of the NFC circuit (220). For example, at least a portion of the power supply path (831) (e.g., a transmission line portion and / or a connecting member) may be used as a portion of the first ground path (341) to ground a first signal of the first terminal (221) of the NFC circuit (220). In one embodiment, to isolate the two signals, the electronic device (101) may include at least one passive element. For example, the electronic device (101) may include a first capacitor (841) arranged in series with a power supply path (831). The electronic device (101) may include a second capacitor (842) arranged in series with a ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or frequencies below a reference.For example, each of the first capacitor (841) and the second capacitor (842) can be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz).

[0128] The electronic device (101) may include an NFC circuit (220). A first terminal (221) of the NFC circuit (220) may be connected to a fourth conductive portion (304) via a first signal path (331). For example, a portion of the first signal path (331) that is not shared with the ground path (832) may include a first inductor (851). The first inductor (851) may be an RF choke inductor for blocking the inflow of an RF signal in a frequency band of cellular communication. For example, the inductance of the first inductor (851) may provide a high impedance higher than a critical value due to the frequency of the RF signal. For example, the first ground path (341) may include a second inductor (852). The second inductor (852) may be an RF choke inductor to block the inflow of RF signals in the frequency band of cellular communication. For example, the inductance of the second inductor (852) may provide a high impedance above a critical value due to the frequency of the RF signal.

[0129] Figures 11a and 11b illustrate examples of NFC paths for NFC circuits and non-NFC communication paths for wireless communication circuits. Figures 11a and 11b illustrate examples in which the power supply path and ground path of an RF signal for non-NFC communication (e.g., cellular communication or wireless LAN communication) are shared with the NFC path. Identical reference numerals may indicate identical or similar descriptions.

[0130] Referring to FIG. 11A, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For the conductive portions and the non-conductive portions, reference may be made to the descriptions of FIG. 3A. The electronic device (101) may include a wireless communication circuit (820).

[0131] The electronic device (101) may include a power supply path (831) and a ground path (832). In one embodiment, at least a portion of the power supply path (831) and at least a portion of the ground path (832) may be shared with the NFC path. For example, at least a portion of the power supply path (831) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of the NFC circuit (220). For example, at least a portion (e.g., a transmission line portion and / or a connecting member) of the power supply path (831) may be used as a portion of the first signal path (331) for transmitting a first signal of the first terminal (221) of the NFC circuit (220). For example, at least a portion (e.g., a transmission line portion and / or a connecting member) of the ground path (832) may be used as a first ground path (341) for ground connection of the first signal. In one embodiment, to isolate two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. For example, the electronic device (101) may include a first capacitor (841) arranged in series with the power supply path (831). The first capacitor (841) may have a capacitance for blocking DC or a frequency below a reference level. For example, the first capacitor (841) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). For example, the second capacitor (842) may be omitted in the shared ground path (e.g., the first ground path (341) or the ground path (832)).

[0132] The electronic device (101) may include an NFC circuit (220). A first terminal (221) of the NFC circuit (220) may be connected to a fourth conductive portion (304) via a first signal path (331). The first signal path (331) may include a first inductor (851). The first inductor (851) may be an RF choke inductor for blocking the inflow of an RF signal in a frequency band of cellular communication. For example, the inductance of the first inductor (851) may provide a high impedance higher than a critical value due to the frequency of the RF signal. The first ground path (341) corresponds to the ground path (832), and thus the second inductor (852) may be omitted.

[0133] Referring to FIG. 11b, in one embodiment, the electronic device (101) may include a switching circuit (845) for impedance matching of the conductive portion (210). For example, the switching circuit (845) may be connected to a region of the power supply path (831) in the structure illustrated in FIG. 11a.

[0134] Electrostatic discharge (ESD) refers to a phenomenon in which an object becomes charged due to friction or contact, and the charge is rapidly discharged upon or just before contact with another object. As excessive voltage is applied due to ESD, static electricity may flow in a signal path connected to a conductive portion (e.g., conductive portion (210) or fourth conductive portion (304)). The static electricity may cause damage to components within the electronic device (101). Therefore, the electronic device (101) according to embodiments of the present disclosure may include a circuit structure for preventing ESD. Hereinafter, circuit components for preventing ESD are described with reference to FIGS. 12 to 14.

[0135] Fig. 12 illustrates an example of an electronic device (e.g., electronic device (101)) including a radio frequency (RF) choke inductor for preventing electrostatic discharge (ESD). For a circuit design using a plurality of radiators (e.g., a fourth conductive portion (304) and a coil (230)) for NFC communication, and at least one of the plurality of radiators is used for non-NFC communication (e.g., cellular communication), the circuit structure illustrated in Fig. 9 may be referred to. The same reference numerals may represent the same or similar descriptions.

[0136] Referring to FIG. 12, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For the conductive portions and the non-conductive portions, the descriptions with respect to FIG. 3A may be referred to. The electronic device (101) may include a wireless communication circuit (820). The electronic device (101) may include a power supply path (831) and a ground path (832). For example, at least a portion of the power supply path (831) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of the NFC circuit (220). Additionally, at least a portion of the ground path (832) may be shared with at least a portion of a ground path (e.g., a first ground path (341)) of the NFC circuit (220). For example, at least a portion of the ground path (832) (e.g., a portion of the transmission line and / or a connecting member) may be used as a part of the first ground path (341) to ground the first signal of the first terminal (221) of the NFC circuit (220). In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. For example, the electronic device (101) may include a first capacitor (841) arranged in series with the power supply path (831). The electronic device (101) may include a second capacitor (842) arranged in series with the ground path (832). The electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0137] According to one embodiment, the electronic device (101) may include an RF choke inductor (1210) for ESD prevention. The electronic device (101) may include an ESD path (1212) for guiding generated static electricity to a ground portion. For example, to form the ESD path (1212), the RF choke inductor (1210) may be connected to the power supply path (831). By allowing high voltage static electricity to flow through the RF choke inductor (1210), damage to passive components (e.g., the first capacitor (841)) may be prevented. The RF choke inductor (1210) may have inductance for blocking the inflow of RF signals in a frequency band of cellular communication.

[0138] In FIG. 12, an electronic device (101) including a first capacitor (841), a second capacitor (842), a first inductor (851), and a second inductor (852) for signal separation is illustrated, but embodiments of the present disclosure are not limited thereto. For example, the first capacitor (841), the second capacitor (842), the first inductor (851), and / or the second inductor (852) may be omitted. In addition, the RF choke inductor (1210) for ESD prevention may be connected to the power supply path (831) of the wiring structure illustrated in FIG. 10 (e.g., a wiring structure in which at least a part of the first signal path (331) and at least a part of the power supply path (831) are shared), as well as the wiring structure illustrated in FIG. 11a and FIG. 11b (e.g., a wiring structure in which at least a part of the first signal path (331) and at least a part of the power supply path (831) are shared, and at least a part of the first ground path (341) and at least a part of the ground (342) are shared).

[0139] Fig. 13 illustrates an example of an electronic device (e.g., electronic device (101)) including a varistor capacitor for ESD prevention. A varistor capacitor refers to a capacitive element for overvoltage protection and / or noise filtering. For example, the varistor capacitor may be used to prevent the application of overvoltage due to ESD. The varistor capacitor may include an element configured to rapidly decrease in resistance when a voltage exceeds a certain threshold value. Due to the decreased resistance value, the overvoltage is absorbed, and a circuit connected to the varistor capacitor may be protected. For a circuit design using a plurality of radiators (e.g., the fourth conductive portion (304) and the coil (230)) for NFC communication, and at least one of the plurality of radiators is used for cellular communication, the circuit structure illustrated in Fig. 9 may be referred to. The same reference numerals may represent the same or similar descriptions.

[0140] Referring to FIG. 13, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For the conductive portions and the non-conductive portions, the descriptions with respect to FIG. 3A may be referred to. The electronic device (101) may include a wireless communication circuit (820). The electronic device (101) may include a power supply path (831) and a ground path (832). For example, at least a portion of the power supply path (831) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of the NFC circuit (220). Additionally, at least a portion of the ground path (832) may be shared with at least a portion of a ground path (e.g., a first ground path (341)) of the NFC circuit (220). For example, at least a portion of the ground path (832) (e.g., a portion of the transmission line and / or a connecting member) may be used as a portion of the first ground path (341) to ground the first signal of the first terminal (221) of the NFC circuit (220). In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. For example, the electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341).

[0141] In one embodiment, the electronic device (101) may include a first varistor capacitor (1341) arranged in series with the power supply path (831). For the description of the first varistor capacitor (1341), reference may be made to the first capacitor (841). The first varistor capacitor (1341) may be used to filter out NFC signals from entering the power supply path (831) as well as prevent damage to components due to the introduction of static electricity. In one embodiment, the electronic device (101) may include a second varistor capacitor (1342) connected to the ground path (832). For the description of the second varistor capacitor (1342), reference may be made to the second capacitor (842). The second varistor capacitor (1342) can be used not only to filter out NFC signals from entering the ground path (832), but also to prevent damage to components due to the inflow of static electricity. For example, even if an overvoltage of static electricity is applied, the wireless communication circuit (820) and the components connected to the wireless communication circuit (820) can be protected due to the change in resistance of the first varistor capacitor (1341) (or the second varistor capacitor (1342)).

[0142] Fig. 14 illustrates an example of an electronic device (e.g., electronic device (101)) including a band-stop filter circuit for ESD prevention. For a circuit design using a plurality of radiators (e.g., a fourth conductive portion (304) and a coil (230)) for NFC communication, at least one of the plurality of radiators being used for cellular communication, the circuit structure illustrated in Fig. 9 may be referred to. The same reference numerals may represent the same or similar descriptions.

[0143] Referring to FIG. 14, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For the conductive portions and the non-conductive portions, the descriptions with respect to FIG. 3A may be referred to. The electronic device (101) may include a wireless communication circuit (820). The electronic device (101) may include a power supply path (831) and a ground path (832). For example, at least a portion of the power supply path (831) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of the NFC circuit (220). Additionally, at least a portion of the ground path (832) may be shared with at least a portion of a ground path (e.g., a first ground path (341)) of the NFC circuit (220). For example, at least a portion of the ground path (832) (e.g., a portion of the transmission line and / or a connecting member) may be used as a part of the first ground path (341) to ground the first signal of the first terminal (221) of the NFC circuit (220). In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. For example, the electronic device (101) may include a first capacitor (841) connected to the power supply path (831). The electronic device (101) may include a second capacitor (842) connected to the ground path (832). The electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0144] According to one embodiment, the electronic device (101) may include a filtering circuit (1410) for preventing ESD. The electronic device (101) may include an ESD path (1412) for guiding generated static electricity to a ground portion. For example, to form the ESD path (1412), the filtering circuit (1410) may be connected in parallel to the power supply path (831). The filtering circuit (1410) may include a band-stop filter circuit (1420) and an RF choke inductor (1431). By allowing high voltage static electricity to flow through the RF choke inductor (1431), damage to passive components for cellular communication may be prevented. The RF choke inductor (1431) may have inductance to block the inflow of RF signals in a frequency band of cellular communication. However, if only the RF choke inductor (1431) is included in the power supply path (831), the NFC signal (e.g., the first signal of the first terminal (221)) may flow to the ground through the ESD path (1412), thereby degrading the NFC communication performance. Therefore, a band-stop filter circuit (1420) may be used to prevent the NFC signal from flowing into the ESD path (1412) connected in parallel to the power supply path (831). The band-stop filter circuit (1420) may be configured to filter signals in the NFC frequency band (e.g., 13.56 MHz). For example, the band-stop filter circuit (1420) may not pass signals in the NFC frequency band among the signals flowing into the band-stop filter circuit (1420), or may pass them as signals with a weak intensity lower than a detection threshold. The band-stop filter circuit (1420) may include passive components for filtering the NFC frequency band. For example, a band-stop filter circuit (1420) may include a capacitor (1421) and an inductor (1422) arranged in parallel. The capacitance of the capacitor (1421) and the inductance of the inductor (1422) may be configured to filter signals in the NFC frequency band.For example, the capacitor (1421) may be configured to pass a high-frequency signal higher than a first frequency according to the capacitance, and the inductor (1422) may be configured to pass only a low-frequency signal lower than a second frequency according to the inductance. Accordingly, signals having a frequency between the first frequency and the second frequency (e.g., signals in the NFC frequency band) may not pass through the band-stop filter (1420). For example, since signals in the NFC frequency band are not transmitted to the ground of the ESD path (1412), the performance of NFC communication may be guaranteed.

[0145] Although FIGS. 12 to 14 illustrate examples of a circuit in which the first signal path (231) of FIG. 2A is of the first connection type (251), the second signal path (232) is of the first connection type (251), and the third signal path (233) is of the second connection type (252), embodiments of the present disclosure are not limited thereto. For example, if an electronic device (101) includes an RF choke inductor (1210) arranged in parallel to a power supply path (831) of a conductive portion (e.g., a fourth conductive portion (304)) shared by NFC communication and cellular communication, it can be understood as an embodiment of the present disclosure without limitation on the connection structure of the NFC circuit. For example, if it is an electronic device (101) including a varistor capacitor (e.g., a first varistor capacitor (1341), a second varistor capacitor (1342)) on a non-NFC communication path using an NFC communication emitter (e.g., a fourth conductive portion (304)), it can be understood as an embodiment of the present disclosure without limitation on the connection structure of the NFC circuit. For example, if it is an electronic device (101) including a filtering circuit (1410) arranged in parallel to a power supply path (831) of a conductive portion (e.g., a fourth conductive portion (304)) shared by NFC communication and cellular communication, it can be understood as an embodiment of the present disclosure without limitation on the connection structure of the NFC circuit.

[0146] Figures 15a to 15c illustrate examples of signal paths (e.g., NFC paths, ESD paths, non-NFC communication paths) of an electronic device (e.g., electronic device (101)). The same reference numerals may represent the same or similar descriptions.

[0147] Referring to FIGS. 15A, 15B, and 15C, the electronic device (101) may include a conductive portion (210), an NFC circuit (220), and a coil (230). The conductive portion (210) may be used as a radiator for the NFC communication. The coil (230) may be used as a radiator for the NFC communication. The NFC circuit (220) may be connected to the conductive portion (210) via a first signal path (331). The NFC circuit (220) may be connected to the coil (230) via a second signal path (332). One end of the coil (230) may be connected to the NFC circuit (220), and the other end of the coil (230) may be connected to a ground portion via a first ground path (341). The conductive portion (210) may be used as a radiator for cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. For example, the electronic device (101) may include a first inductor (851) and a second inductor (852). The first inductor (851) may be arranged in series in the first signal path (331). The second inductor (852) may be arranged in series between the conductive portion (210) and ground. For example, the electronic device (101) may include a first capacitor (841) and a second capacitor (842). The first capacitor (841) may be arranged between the conductive portion (210) and the wireless communication circuit (820). The second capacitor (842) may be arranged between the conductive portion (210) and ground. For example, the electronic device (101) may include a switching circuit (845) for impedance matching of the conductive portion (210). The switching circuit (845) may be connected between the second capacitor (842) and ground.

[0148] Referring to FIG. 15A, the electronic device (101) may include an NFC path. The NFC path represents a path along which output signals of the NFC circuit (220) are transmitted. For example, the NFC path may include a first signal path (331) and a first ground path (341) from the NFC circuit (220) to the conductive portion (210). For example, the NFC path may include a second signal path (332) and a second ground path (342) from the NFC circuit (220) to the coil (230).

[0149] Referring to FIG. 15B, the electronic device (101) may include an ESD path. ESD refers to a phenomenon in which an electric charge is generated due to friction or contact, and the electric charge is rapidly discharged when or just before contacting another object. To prevent static electricity from being introduced, the electronic device (101) may include an ESD path to guide the generated static electricity to a ground portion. To form the ESD path, a filtering circuit (1410) may be connected to a power supply path (831). The ESD path may include a first ground path (341) connected to the conductive portion (210) and a path from the conductive portion (210) to a ground portion connected through the filtering circuit (1410). For example, due to the first capacitor (841), static electricity may not be introduced to the power supply path of the wireless communication circuit.

[0150] Referring to FIG. 15c, the electronic device (101) may include a non-NFC communication path (e.g., a path for long-range wireless communication or a path for cellular communication). The non-NFC communication path may include a path (e.g., a power supply path (831)) between the conductive portion (210) and the wireless communication circuit (820). The non-NFC communication path may include a path (e.g., a ground path (832)) between the conductive portion (210) and a ground portion.

[0151] Fig. 16 shows an example of S-parameter characteristics. To explain the S-parameter characteristics of Fig. 16, the circuit structures illustrated in Figs. 15a, 15b, and 15c can be used.

[0152] Referring to Fig. 16, a graph (1600) represents the characteristics of an S-parameter. The horizontal axis of the graph (1600) represents frequency, and the vertical axis of the graph (1600) represents the S-parameter. A first line (1601) represents a transmission coefficient (S) from an NFC circuit (e.g., an NFC circuit (220)) to a conductive portion (210) (e.g., a fourth conductive portion (304)). 12 ) represents. For example, at a frequency of about 13.60 MHz, the value of the first line (1601) may be -0.111. The second line (1602) represents a reflection coefficient (S) in an NFC circuit (e.g., NFC circuit (220)). 11 ) represents. For example, at a frequency of about 13.60 MHz, the value of the second line (1602) may be -16.024. The third line (1603) represents a pass coefficient of a wireless communication circuit (e.g., wireless communication circuit (820)) in an NFC circuit (e.g., NFC circuit (220)). For example, at a frequency of about 13.60 MHz, the value of the third line (1603) may be -34.910. It can be confirmed that most of the NFC signals of the NFC circuit (220) are transmitted to the conductive portion (210) through the filtering circuit (1410) and are not transmitted to the ground through the ESD path.

[0153] FIGS. 17A, 17B, 17C, 17D, and 17E illustrate examples of an electronic device (e.g., electronic device (101)) including an NFC circuit (e.g., NFC circuit (220)) utilizing a conductive portion (e.g., conductive portion (210)) and a coil (e.g., coil (230)). Like reference numerals may represent the same or similar descriptions.

[0154] Referring to FIG. 17A, the electronic device (101) may include an NFC circuit (220) and a coil (230). To explain the circuit structure of the electronic device (101), the descriptions for FIG. 3A may be applied. The NFC circuit (220) may be connected to the fourth conductive portion (304) via a first signal path (331). The NFC circuit (220) may be connected to the coil (230) via a second signal path (332). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output via a first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the fourth conductive portion (304) via the first signal path (331). The NFC circuit (220) can output the second signal of the differential output through the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (332). The first phase of the first signal and the second phase of the second signal may be, for example, about 180 degrees apart. The fourth conductive portion (304) can be connected to the ground portion through the first ground path (341). The coil (230) can be connected to the ground portion through the second ground path (342).

[0155] The fourth conductive portion (304) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate the RF signal through the conductive portion (210) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). The electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator for the cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. In one embodiment, for example, the electronic device (101) may include a first capacitor (841) in the power supply path (831). The electronic device (101) may include a second capacitor (842) in the ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking direct current (DC) or frequencies below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). According to one embodiment, the electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331).For example, at least a portion of a power path (831) of a non-NFC communication path for a wireless communication circuit (820) may be shared with at least a portion of a transmission path (e.g., a first signal path (331)) of an NFC circuit (220). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The second inductor (852) may be an RF choke inductor for blocking the inflow of an RF signal in a frequency band of cellular communication. The first signal path (331) may include a first inductor (851). The first inductor (851) may be an RF choke inductor for blocking the inflow of an RF signal in a frequency band of cellular communication.

[0156] Referring to FIG. 17B, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, the metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a second conductive portion (1702), a third conductive portion (1703), a fourth conductive portion (1704), and / or a fifth conductive portion (1705). For example, the plurality of non-conductive portions may include a first non-conductive portion (1711), a second non-conductive portion (1712), a third non-conductive portion (1713), a fourth non-conductive portion (1714), or a fifth non-conductive portion (1715). A second conductive portion (1702) may be formed between the first non-conductive portion (1711) and the second non-conductive portion (1712). A third conductive portion (1703) may be formed between the second non-conductive portion (1712) and the third non-conductive portion (1713). A fourth conductive portion (1704) may be formed between the third non-conductive portion (1713) and the fourth non-conductive portion (1714). A fifth conductive portion (1705) may be formed between the fourth non-conductive portion (1714) and the fifth non-conductive portion (1715).

[0157] Instead of the fourth conductive portion (304) of FIG. 17A, the fourth conductive portion (1704) can be used as a radiator for NFC communication and non-NFC communication (e.g., cellular communication). A first signal path (331) for the NFC circuit (220) can be connected to the fourth conductive portion (1704). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the fourth conductive portion (1704) through the first signal path (331). The fourth conductive portion (1704) can be electrically connected to the first inductor (851). The fourth conductive portion (1704) can be connected to the ground portion through the first ground path (341). The fourth conductive portion (1704) can be electrically connected to the second inductor (852). The wireless communication circuit (820) may be connected to the fourth conductive portion (1704) via the first capacitor (841). The fourth conductive portion (1704) may be used as a radiator for non-NFC communication (e.g., cellular communication). Due to the second inductor (852), the first ground path (341) may be understood as an open circuit in terms of the frequency of the RF signal of the wireless communication circuit (820).

[0158] Referring to FIG. 17C, instead of the fourth conductive portion (304) of FIG. 17A, a conductive portion (1710) for protecting a camera (e.g., the camera module (180) of FIG. 1) may be used for NFC communication. A first signal path (331) for the NFC circuit (220) may be connected to the conductive portion (1710). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the conductive portion (1710) through the first signal path (331). As a non-limiting example, the conductive portion (1710) may be connected to ground and the NFC circuit (220), respectively, without an RF choke inductor (e.g., the first inductor (851) and the second inductor (852)). For example, the electronic device (101) may not include the first inductor (851) and the second inductor (852). The NFC path (e.g., the first signal path (331) and the first ground path (341)) may not include the first inductor (851) and the second inductor (852). Since the conductive portion (1710) is physically separated from the fourth conductive portion (304), the electronic device (101) may not include a separate passive component for signal separation.

[0159] The fourth conductive portion (304) can be used as a radiator of an antenna for non-NFC communication (e.g., cellular communication). The wireless communication circuit (820) can be connected to the fourth conductive portion (304) via the first capacitor (841). The fourth conductive portion (304) can be connected to a ground portion via the second capacitor (842). Each of the first capacitor (841) and the second capacitor (842) can be used to prevent the inflow of static electricity due to ESD as well as signals in the NFC frequency band (e.g., 13.56 MHz). For example, the first capacitor (841) can be a varistor capacitor (e.g., the first varistor capacitor (1341)). For example, the second capacitor (842) can be a varistor capacitor (e.g., the second varistor capacitor (1342)). Additionally, for example, for ESD prevention, an RF choke inductor (1720) may be connected in parallel to the power supply path (831) of the wireless communication circuit (820).

[0160] Referring to FIG. 17D, the electronic device (101) may include an NFC circuit (220) and a coil (230). To explain the circuit structure of the electronic device (101), the descriptions for FIG. 3A may be applied. The NFC circuit (220) may be connected to the fourth conductive portion (304) via a first signal path (331). The NFC circuit (220) may be connected to the coil (230) via a second signal path (332). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output via a first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the fourth conductive portion (304) via the first signal path (331). The NFC circuit (220) can output the second signal of the differential output through the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (332). The first phase of the first signal and the second phase of the second signal may be about 180 degrees apart. The fourth conductive portion (304) can be connected to the ground portion through the first ground path (341). The coil (230) can be connected to the ground portion through the second ground path (342).

[0161] In one embodiment, the fourth conductive portion (304) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate an RF signal of non-NFC communication through the conductive portion (210) or receive an RF signal of non-NFC communication from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). The electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator of the cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. In one embodiment, the electronic device (101) may include a first capacitor (841) in the power supply path (831). In one embodiment, the electronic device (101) may include a second capacitor (842) in the ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)).

[0162] According to one embodiment, the electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). Unlike FIG. 17A, at least a portion of a transmission path (e.g., the first signal path (331)) of the NFC circuit (220) may be shared with at least a portion of a ground path (832) of a non-NFC communication path for the wireless communication circuit (820). The first inductor (851) may be connected to the ground path (832). For example, the first inductor (851) may be connected to a point of the ground path (832) between the second capacitor (842) and the fourth conductive portion (304). The second capacitor (842) may be used to block (or filter, block, or attenuate) signals in the NFC frequency band from entering the first signal path (331). The transmission path (e.g., the first signal path (331)) of the NFC circuit (220) may be independent of the power path (831) of the non-NFC communication path for the wireless communication circuit (820). In one embodiment, the electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). For example, the second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. In one embodiment, the first signal path (331) may include a first inductor (851). For example, the first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0163] Referring to FIG. 17E, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, the metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a second conductive portion (1702), a third conductive portion (1703), a fourth conductive portion (1704), and / or a fifth conductive portion (1705). For example, the plurality of non-conductive portions may include a first non-conductive portion (1711), a second non-conductive portion (1712), a third non-conductive portion (1713), a fourth non-conductive portion (1714), or a fifth non-conductive portion (1715). For a description of each conductive portion and non-conductive portion, reference may be made to the descriptions of FIG. 17B. Although FIG. 17B illustrates a circuit structure in which at least a portion of the first signal path (331) for the NFC circuit (220) is shared with at least a portion of the power supply path (831) from the wireless communication circuit (820), embodiments of the present disclosure are not limited thereto. At least a portion of the first ground path (341) for the NFC circuit (220) may be shared with at least a portion of the power supply path (831) from the wireless communication circuit (820). For example, at least a portion of the first signal path (331) for the NFC circuit (220) may be connected to the fourth conductive portion (1714) independently of the power supply path (831) from the wireless communication circuit (820).

[0164] In one embodiment, the electronic device (101) may include a first inductor (851) arranged in parallel with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The first ground path (341) may include a second inductor (852). The second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0165] Figures 18a, 18b, and 18c illustrate examples of an electronic device (e.g., electronic device (101)) including an NFC circuit (e.g., NFC circuit (220)) utilizing a conductive portion (e.g., conductive portion (210)) and a coil (e.g., coil (230)). Like reference numerals may represent the same or similar descriptions.

[0166] Referring to FIG. 18A, the electronic device (101) may include an NFC circuit (220) and a coil (230). To explain the circuit structure of the electronic device (101), the descriptions of FIG. 5 may be applied. The NFC circuit (220) may be connected to the fourth conductive portion (304) via a first signal path (331). The NFC circuit (220) may be connected to the coil (230) via a second signal path (332). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output via a first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the fourth conductive portion (304) via the first signal path (331). The NFC circuit (220) can output the second signal of the differential output through the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (332). The first phase of the first signal and the second phase of the second signal may be about 180 degrees apart. The fourth conductive portion (304) and the coil (230) can be connected through a third transmission path (541). The first signal can be transmitted from the fourth conductive portion (304) to the coil (230) through the third transmission path (541). The second signal can be transmitted from the coil (230) to the fourth conductive portion (304) through the third transmission path (541). The third transmission path (541) can correspond to the first connection type (251).

[0167] The fourth conductive portion (304) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate the RF signal through the conductive portion (210) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). For example, the electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator for the cellular communication.

[0168] In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. According to one embodiment, the electronic device (101) may include a first capacitor (841) in a power supply path (831). The electronic device (101) may include a second capacitor (842) in a ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in an NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). In one embodiment, the electronic device (101) may include an inductor (1851) arranged in series with the third transmission path (541). At least a portion of the third transmission path (541) may correspond to at least a portion of the power supply path (831) of the wireless communication circuit (820). The inductor (1851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0169] Referring to Fig. 18b, instead of the fourth conductive portion (304) of Fig. 18a, the fourth conductive portion (1704) can be used as a radiator for NFC communication and non-NFC communication (e.g., cellular communication). For each conductive portion of Fig. 18b, the description of Fig. 17b can be referenced. A first signal path (331) for the NFC circuit (220) can be connected to the fourth conductive portion (1704). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the fourth conductive portion (1704) through the first signal path (331). For example, the first signal path (331) can include a first inductor (851). The fourth conductive portion (1704) can be connected to the coil (230) through the third transmission path (541). The wireless communication circuit (820) may be connected to the fourth conductive portion (1704) via the first capacitor (841). The fourth conductive portion (1704) may be used as a radiator for cellular communication.

[0170] Referring to FIG. 18c, instead of the fourth conductive portion (304) of FIG. 18a, a conductive portion (1710) for protecting a camera (e.g., the camera module (180) of FIG. 1) may be used for NFC communication. A first signal path (331) for the NFC circuit (220) may be connected to the conductive portion (1710). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the conductive portion (1710) through the first signal path (331). The conductive portion (1710) may be connected to the coil (230) through the third transmission path (541). As a non-limiting example, the conductive portion (1710) may be connected to the NFC circuit (220) and the coil (230), respectively, without an RF choke inductor (e.g., the first inductor (851) and the second inductor (852)). For example, the electronic device (101) may not include the first inductor (851) and the second inductor (852). The NFC path (e.g., the first signal path (331) and the first ground path (341)) may not include the first inductor (851) and the second inductor (852). Since the conductive portion (1710) is physically separated from the fourth conductive portion (304), the electronic device (101) may not include a separate passive component for signal separation.

[0171] The fourth conductive portion (304) can be used as a radiator of an antenna for non-NFC communication (e.g., cellular communication). The wireless communication circuit (820) can be connected to the fourth conductive portion (304) via the first capacitor (841). The fourth conductive portion (304) can be connected to a ground portion via the second capacitor (842). For example, each of the first capacitor (841) and the second capacitor (842) can be used to prevent the inflow of static electricity due to ESD as well as signals in the NFC frequency band (e.g., 13.56 MHz). For example, the first capacitor (841) can be a varistor capacitor (e.g., the first varistor capacitor (1341)). For example, the second capacitor (842) can be a varistor capacitor (e.g., the second varistor capacitor (1342)). Additionally, for example, for ESD prevention, an RF choke inductor (1720) may be connected in parallel to the power supply path (831) of the wireless communication circuit (820).

[0172] Figures 19a, 19b, and 19c illustrate examples of electronic devices (e.g., electronic devices (101)) utilizing a conductive portion (e.g., conductive portion (210)) and a coil (e.g., coil (230)). Like reference numerals may represent the same or similar descriptions.

[0173] Referring to FIG. 19A, an electronic device (101) may include an NFC circuit (220) and a coil (230). To explain the circuit structure of the electronic device (101), the descriptions for FIG. 4A may be applied. A first terminal (221) of the NFC circuit (220) may be connected to a ground portion via a first ground path (431a). A second terminal (222) of the NFC circuit (220) may be connected to a coil (230) via a second signal path (332). The coil (230) may be connected to a fourth conductive portion (304) via a third transmission path (441). The fourth conductive portion (304) may be connected to a ground portion via a second ground path (431b). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) can output a first signal of differential output through a first terminal (221). The first signal can be grounded through a first ground path (431a). The NFC circuit (220) can output a second signal of the differential output through a second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through a second signal path (332). The first phase of the first signal and the second phase of the second signal can be about 180 degrees apart. The fourth conductive portion (304) and the coil (230) can be connected through a third transmission path (441). The second signal can be transmitted from the coil (230) to the fourth conductive portion (304) through the third transmission path (441). The third transmission path (441) may correspond to the first connection type (251).

[0174] The fourth conductive portion (304) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate the RF signal through the fourth conductive portion (304) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). The electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator for the cellular communication.

[0175] In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) may include at least one passive component. According to one embodiment, for example, the electronic device (101) may include a first capacitor (841) in a power supply path (831). The electronic device (101) may include a second capacitor (842) in a ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in an NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). In one embodiment, the electronic device (101) may include an inductor (1851) arranged in series with the third transmission path (441). At least a portion of the third transmission path (441) may be utilized as at least a portion of the power supply path (831) of the wireless communication circuit (820). The electronic device (101) may include a second inductor (852) arranged in series with the second ground path (431b). The second inductor (852) and / or the inductor (1851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0176] Referring to Fig. 19b, instead of the fourth conductive portion (304) of Fig. 19a, the conductive portion (1704) can be used as a radiator for NFC communication and non-NFC communication (e.g., cellular communication). For each conductive portion of Fig. 19b, the description of Fig. 17b can be referenced. The third transmission path (441) for the NFC circuit (220) can be connected to the fourth conductive portion (1704). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the fourth conductive portion (1704) through the first signal path (331). For example, the first signal path (331) can include a first inductor (851). The fourth conductive portion (1704) can be connected to the coil (230) through the third transmission path (441). The wireless communication circuit (820) may be connected to the fourth conductive portion (1704) via the first capacitor (841). The fourth conductive portion (1704) may be used as a radiator for non-NFC communication (e.g., cellular communication). Due to the second inductor (852), the second ground path (431b) may be understood as an open circuit in terms of the frequency of the RF signal of the wireless communication circuit (820).

[0177] Referring to FIG. 19c, instead of the fourth conductive portion (304) of FIG. 19a, a conductive portion (1710) for protecting a camera (e.g., the camera module (180) of FIG. 1) may be used for NFC communication. The coil (230) may be connected to the conductive portion (1710) via the third transmission path (441). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the conductive portion (1710) via the third transmission path (441). The conductive portion (1710) may be connected to the ground portion via the second ground path (431b). As a non-limiting example, the conductive portion (1710) may be connected to the coil (230) and the ground, respectively, without an RF choke inductor (e.g., the first inductor (851) and the second inductor (852)). For example, the electronic device (101) may not include the first inductor (851) and the second inductor (852). For example, an NFC path (e.g., the third transmission path (441) or the second ground path (431b)) that utilizes the conductive portion (1710) may not include the first inductor (851) and the second inductor (852). Since the conductive portion (1710) is physically separated from the fourth conductive portion (304), the electronic device (101) may not include a separate passive component for signal separation.

[0178] The fourth conductive portion (304) can be used as a radiator of an antenna for non-NFC communication (e.g., cellular communication). The wireless communication circuit (820) can be connected to the fourth conductive portion (304) via the first capacitor (841). The fourth conductive portion (304) can be connected to a ground portion via the second capacitor (842). For example, each of the first capacitor (841) and the second capacitor (842) can be used to prevent the inflow of static electricity due to ESD as well as signals in the NFC frequency band (e.g., 13.56 MHz). For example, the first capacitor (841) can be a varistor capacitor (e.g., the first varistor capacitor (1341)). For example, the second capacitor (842) can be a varistor capacitor (e.g., the second varistor capacitor (1342)). Additionally, for example, for ESD prevention, an RF choke inductor (1720) may be connected in parallel to the power supply path (831) of the wireless communication circuit (820).

[0179] FIGS. 20A and 20B illustrate examples of an electronic device (e.g., electronic device (101)) including an NFC circuit (e.g., NFC circuit (220)) utilizing multiple conductive portions. Like reference numerals may represent like or similar descriptions.

[0180] Referring to FIG. 20A, the electronic device (101) may include an NFC circuit (220) and a coil (230). To explain the circuit structure of the electronic device (101), the descriptions for FIG. 7A may be applied. The fourth conductive portion (304) and the fifth conductive portion (305) may be used as radiators for NFC communication. In FIG. 20A, contrary to FIG. 7A, the fifth conductive portion (305) may be electrically connected to the NFC circuit (220), and the fourth conductive portion (304) may be electrically connected to the coil (230).

[0181] The NFC circuit (220) may be connected to the fifth conductive portion (315) via a first signal path (331). The coil (230) may be used as a radiator for NFC communication. The NFC circuit (220) may include transmitting terminals. For example, the NFC circuit (220) may include a first terminal (221) and a second terminal (222). The first terminal (221) of the NFC circuit (220) may be connected to the fifth conductive portion (305) via a first signal path (331). The second terminal (222) of the NFC circuit (220) may be connected to the coil (230) via a second signal path (332). The fifth conductive portion (305) may be connected to a ground portion via a first ground path (751a). The fourth conductive portion (304) may be connected to the ground portion via the second ground path (751b). For example, the ground portion may be a portion of a ground area (e.g., a portion of a PCB on which the NFC circuit (220) is placed, or a support member of the electronic device (101). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output via the first terminal (221). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the fifth conductive portion (305) via the first signal path (331). The NFC circuit (220) may output a second signal of the differential output via the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (332). The first phase of the first signal and the second phase of the second signal may be about 180 degrees apart. The coil (230) can be connected to the fourth conductive portion (304) through the third transmission path (742). The third transmission path (742) can correspond to the first connection type (251).

[0182] The fourth conductive portion (304) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate the RF signal through the conductive portion (210) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). For example, the electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator for the cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. In one embodiment, the electronic device (101) may include a first capacitor (841) in the power supply path (831). The electronic device (101) may include a second capacitor (842) in the ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). In one embodiment, the electronic device (101) may include an inductor (1851) arranged in series with a third transmission path (742). At least a portion of the third transmission path (742) may be utilized as at least a portion of a power supply path (831) of the wireless communication circuit (820).The electronic device (101) may include an inductor (2052) arranged in series with the second ground path (751b). The inductor (2052) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0183] Referring to FIG. 20B, instead of the third conductive portion (303), the fourth conductive portion (304), and the fifth conductive portion (305) of FIG. 20A, the third conductive portion (1703) and the fourth conductive portion (1704) may be used as radiators for NFC communication and non-NFC communication (e.g., cellular communication). For each conductive portion of FIG. 20B, the description of FIG. 17B may be referenced. A first signal path (331) for the NFC circuit (220) may be connected to the fourth conductive portion (1704). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the fourth conductive portion (1704) through the first signal path (331). For example, the first signal path (331) may include a first inductor (851). The fourth conductive portion (1704) may be connected to the ground portion via the first ground path (751a). The wireless communication circuit (820) may be connected to the fourth conductive portion (1704) via the first capacitor (841). The fourth conductive portion (1704) may be used as a radiator for non-NFC communication (e.g., cellular communication, wireless LAN communication). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (751a). For example, the first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. For example, the second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0184] In one embodiment, the third conductive portion (1703) may be electrically connected to a wireless communication circuit (2020) that is distinct from the wireless communication circuit (820). For example, the wireless communication circuit (2020) may be configured to provide cellular communication signals of a different frequency band than the wireless communication circuit (820). In another example, the wireless communication circuit (2020) may be configured to provide signals of a different communication method (e.g., WiFi) than the wireless communication circuit (820). Although the wireless communication circuit (820) and the wireless communication circuit (2020) are illustrated as separate circuits in FIG. 20B , embodiments of the present disclosure are not limited thereto. For example, the wireless communication circuit (820) and the wireless communication circuit (2020) may be a single circuit. For example, in the wireless communication circuit (820), signals of a first frequency band may be provided to a fourth conductive portion (1704), and signals of a frequency band different from the first frequency band may be provided to a third conductive portion (1703). For example, the wireless communication circuit (2020) may be connected to the third conductive portion (1703) through a capacitor (2041). The third conductive portion (1703) may be used as a radiator for cellular communication. The third conductive portion (1703) may be connected to a ground portion through a second ground path (751b). The third conductive portion (1703) may be connected to the coil (230) through a third transmission path (742). The third transmission path (742) may include an inductor (1851) to prevent inflow of RF signals of a frequency band of cellular communication.

[0185] Figures 21a, 21b, and 21c illustrate examples of electronic devices including an NFC circuit (e.g., NFC circuit (220)) utilizing a conductive portion (e.g., conductive portion (210)) and a coil (e.g., coil (230)). Like reference numerals may represent the same or similar descriptions.

[0186] Referring to FIG. 21A, the electronic device (101) may include an NFC circuit (220) and a coil (230). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output through a first terminal (221). The first signal may be transmitted along a first transmission path (2131). The first transmission path (2131) may be branched into two transmission paths. For example, the first signal may be transmitted along a second transmission path (2132) and a third transmission path (2133). The NFC circuit (220) may be connected to a fourth conductive portion (304) through the second transmission path (2132). The first terminal (221) of the NFC circuit (220) can be electrically connected to the coil (230) through the first transmission path (2131) and the third transmission path (2133). The NFC circuit (220) can be connected to the coil (230) through the second signal path (332). The NFC circuit (220) can output the second signal of the differential output through the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the coil (230) through the second signal path (332). The first phase of the first signal and the second phase of the second signal can be about 180 degrees apart. The fourth conductive portion (304) can be connected to the ground portion through the first ground path (341). The coil (230) can be connected to the ground portion via the second ground path (342). While both ends of the coil (230) are connected to the NFC circuit (220), an output of the NFC circuit (220) (e.g., a first signal of the first terminal (221)) can be provided to a conductive portion (e.g., a fourth conductive portion (304)).For example, while NFC performance at the rear (e.g., the location of the coil (230)) is maintained, NFC performance at the top (e.g., the location of the fourth conductive portion (304)) can be additionally secured.

[0187] The fourth conductive portion (304) can be used as a radiator for cellular communication. The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate the RF signal through the fourth conductive portion (304) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). For example, the electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator for cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. In one embodiment, for example, the electronic device (101) may include a first capacitor (841) in the power supply path (831). The electronic device (101) may include a second capacitor (842) in the ground path (832). Each of the first capacitor (841) and the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, each of the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). According to one embodiment, the electronic device (101) may include a first inductor (851) arranged in series with the second transmission path (2132). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341).The first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The first ground path (341) may include a second inductor (852). The second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication.

[0188] Referring to FIG. 21B, instead of the fourth conductive portion (304), the conductive portion (1704) can be used as a radiator for NFC communication and cellular communication. A second transmission path (2132) for the NFC circuit (220) can be connected to the conductive portion (1704). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the conductive portion (1704) through the second transmission path (2132). For example, the second transmission path (2132) can include a first inductor (851). The conductive portion (1704) can be connected to a ground portion through a first ground path (2141). For example, the first ground path (2141) can include a second inductor (852). The wireless communication circuit (820) may be connected to the conductive portion (1704) via the first capacitor (841). The conductive portion (1704) may be used as a radiator for cellular communication. Due to the second inductor (852), the first ground path (2141) may be understood as an open circuit in terms of the frequency of the RF signal of the wireless communication circuit (820).

[0189] Referring to FIG. 21C, instead of the fourth conductive portion (304), a conductive portion (1710) for protecting a camera (e.g., the camera module (180) of FIG. 1) may be used for NFC communication. A second transmission path (2132) for the NFC circuit (220) may be connected to the conductive portion (1710). The NFC circuit (220) may transmit the first signal from the first terminal (221) to the conductive portion (1710) through the first transmission path (2131) and the second transmission path (2132). As a non-limiting example, the conductive portion (1710) may be connected to ground and the NFC circuit (220), respectively, without an RF choke inductor (e.g., the first inductor (851) and the second inductor (852)). For example, the electronic device (101) may not include the first inductor (851) and the second inductor (852). For example, an NFC path (e.g., the second transmit path (2132), the first ground path (2141)) that utilizes the conductive portion (1710) may not include the first inductor (851) and / or the second inductor (852). Since the conductive portion (1710) is physically separated from the fourth conductive portion (304), the electronic device (101) may not include a separate passive component for signal separation.

[0190] The fourth conductive portion (304) can be used as a radiator of an antenna for cellular communication. The wireless communication circuit (820) can be connected to the fourth conductive portion (304) through the first capacitor (841). The fourth conductive portion (304) can be connected to a ground portion through the second capacitor (842). For example, each of the first capacitor (841) and the second capacitor (842) can be used to prevent the inflow of static electricity due to ESD as well as signals in the NFC frequency band (e.g., 13.56 MHz). For example, the first capacitor (841) can be a varistor capacitor (e.g., the first varistor capacitor (1341)). For example, the second capacitor (842) can be a varistor capacitor (e.g., the second varistor capacitor (1342)). Additionally, for example, for ESD prevention, an RF choke inductor (1720) may be connected in parallel to the power supply path (831) of the wireless communication circuit (820).

[0191] Figures 22a and 22b illustrate examples of electronic devices (e.g., electronic devices (101)) including a band-stop filter circuit. Like reference numerals may represent like or similar descriptions.

[0192] Referring to FIG. 22A, at least a portion of a power path (831) and at least a portion of a ground path of a non-NFC communication path for a wireless communication circuit (820) may be shared with an NFC path for an NFC circuit (220). The electronic device (101) may include an NFC circuit (220) and a coil (230). To describe the circuit structure of the electronic device (101), the descriptions with respect to FIG. 3A may be applied. The NFC circuit (220) may be connected to a fourth conductive portion (304) via a first signal path (331). The NFC circuit (220) may be connected to the coil (230) via a second signal path (332). The fourth conductive portion (304) may be connected to a ground portion via a first ground path (341). The coil (230) may be connected to a ground portion via a second ground path (342). The fourth conductive portion (304) can be used as a radiator for cellular communication. The electronic device (101) can include a wireless communication circuit (820). The wireless communication circuit (820) can radiate the RF signal through the fourth conductive portion (304) or receive the RF signal from an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)). In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. For example, the electronic device (101) can include a first capacitor (841). For example, the first capacitor (841) can be used to prevent the inflow of static electricity due to ESD as well as signals in the NFC frequency band (e.g., 13.56 MHz). For example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). For example, the electronic device (101) may include a first inductor (851).The first inductor (851) may be an RF choke inductor to block the inflow of RF signals in the frequency band of cellular communication. The electronic device (101) may include a filtering circuit (1410) to secure an ESD path. The filtering circuit (1410) may be connected in parallel to the power supply path (831). The filtering circuit (1410) may include a band-stop filter circuit (1420) and an RF choke inductor (1431). By allowing high voltage static electricity to flow through the RF choke inductor (1431), damage to passive components for cellular communication may be prevented. In some embodiments, the first ground path (341) may be used as a ground path (e.g., ground path (832)) for cellular communication. As the ground path is shared, the second inductor (852) and / or the second capacitor (842) for signal separation may be omitted in the first ground path (341).

[0193] Referring to FIG. 22b, at least a portion of the power path (831) of the non-NFC communication path for the wireless communication circuit (820) may be shared with the first signal path (331) of the NFC path for the NFC circuit (220). Unlike FIG. 22a, the ground path connected to the fourth conductive portion (304) may exist separately for cellular communication and NFC communication, respectively. For example, the fourth conductive portion (304) may be connected to the ground portion via the ground path (832) for the cellular communication. The fourth conductive portion (304) may be connected to the ground portion via the first ground path (341) for the NFC communication. In the NFC path, a second inductor (852) may be arranged in series with the first ground path (341) to separate signals for the cellular communication. In a non-NFC communication path, a second capacitor (842) may be placed in series in the ground path (832) to separate signals for the NFC communication.

[0194] FIGS. 23A, 23B, and 23C illustrate examples of electronic devices (e.g., electronic devices (101)) including NFC circuits utilizing various emitters. The circuit structure of the present disclosure may utilize various types of conductive members (e.g., conductive portions of a metal frame, conductive portions for protecting a camera, conductive patterns, chips, LDSs, etc.) as emitters for NFC in addition to the coil (230). Hereinafter, a circuit structure for securing radiation performance of NFC communication using a coil (230) and other types of emitters is described through FIGS. 23A, 23B, and 23C. The same reference numerals may represent the same or similar descriptions.

[0195] Referring to FIG. 23A, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For example, a metal frame of the electronic device (101) may include the plurality of conductive portions. For example, the plurality of conductive portions may include a first conductive portion (301), a second conductive portion (302), a third conductive portion (303), a fourth conductive portion (304), a fifth conductive portion (305), a sixth conductive portion (306), a seventh conductive portion (307), an eighth conductive portion (308), a ninth conductive portion (309), a tenth conductive portion (2301), and / or an eleventh conductive portion (2302). For example, the plurality of non-conductive portions may include a first non-conductive portion (311), a second non-conductive portion (312), a third non-conductive portion (313), a fourth non-conductive portion (314), a fifth non-conductive portion (315), a sixth non-conductive portion (316), a seventh non-conductive portion (317), an eighth non-conductive portion (318), a ninth non-conductive portion (319), a tenth non-conductive portion (320), an eleventh non-conductive portion (321), and / or a twelfth non-conductive portion (2321).

[0196] In one embodiment, the first conductive portion (301) may be formed between the tenth non-conductive portion (320) and the eleventh non-conductive portion (321). The second conductive portion (302) may be formed between the first non-conductive portion (311) and the second non-conductive portion (312). The third conductive portion (303) may be formed between the second non-conductive portion (312) and the third non-conductive portion (313). The fourth conductive portion (304) may be formed between the third non-conductive portion (313) and the fourth non-conductive portion (314). The fifth conductive portion (305) may be formed between the fourth non-conductive portion (314) and the fifth non-conductive portion (315). The sixth conductive portion (306) may be formed between the fifth non-conductive portion (315) and the sixth non-conductive portion (316). The seventh conductive portion (307) may be formed between the seventh non-conductive portion (317) and the eighth non-conductive portion (318). The eighth conductive portion (308) may be formed between the eighth non-conductive portion (318) and the ninth non-conductive portion (319). The ninth conductive portion (309) may be formed between the ninth non-conductive portion (319) and the tenth non-conductive portion (320). The tenth conductive portion (2301) may be formed between the eleventh non-conductive portion (321) and the twelfth non-conductive portion (2321). The eleventh conductive portion (2302) can be formed between the sixth non-conductive portion (316) and the twelfth non-conductive portion (2321). At least some of the first conductive portion (301), the second conductive portion (302), the third conductive portion (303), the fourth conductive portion (304), the fifth conductive portion (305), the sixth conductive portion (306), the seventh conductive portion (307), the eighth conductive portion (308), the ninth conductive portion (309), the tenth conductive portion (2301), and / or the eleventh conductive portion (2302) can be used as a radiator of an antenna for transmitting a wireless signal.

[0197] According to one embodiment, the electronic device (101) can radiate signals of the NFC circuit (220) through at least two conductive portions among the plurality of conductive portions. For example, the at least two conductive portions can include a fourth conductive portion (304) and a tenth conductive portion (2301). For example, the electronic device (101) can use at least a portion of the metal frame and a radiator of a metal antenna used for non-NFC communication as radiators for NFC communication.

[0198] According to one embodiment, the electronic device (101) may include an NFC circuit (220) and a tenth conductive portion (2301). To describe the circuit structure of the electronic device (101), the descriptions for FIG. 3A may be applied. In the circuit structure of FIG. 23A, the tenth conductive portion (2301) may be used instead of the coil (230). The NFC circuit (220) may be connected to the fourth conductive portion (304) via a first signal path (331). The NFC circuit (220) may be connected to the tenth conductive portion (2301) via a second signal path (332). The NFC circuit (220) may operate in a differential mode. The NFC circuit (220) may output a first signal of a differential output via a first terminal (221). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the fourth conductive portion (304) through the first signal path (331). The NFC circuit (220) can output the second signal of the differential output through the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the tenth conductive portion (2301) through the second signal path (332). The first phase of the first signal and the second phase of the second signal can be about 180 degrees apart. The fourth conductive portion (304) can be connected to the ground portion through the first ground path (341). The tenth conductive portion (2301) can be connected to the ground portion through the second ground path (342).

[0199] In one embodiment, the fourth conductive portion (304) may be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) may include wireless communication circuitry (820). In one embodiment, the electronic device (101) may include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the conductive portion (210) which is the radiator of the cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of the cellular communication and an output signal of the NFC communication), the electronic device (101) may include at least one passive element. According to one embodiment, the electronic device (101) may include a first capacitor (841) in the power supply path (831). The electronic device (101) may include a second capacitor (842) in the ground path (832). For example, the first capacitor (841) and / or the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, the first capacitor (841) and / or the second capacitor (842) may have a capacitance for blocking the NFC frequency. band (e.g., 13.56 MHz) may be used to block the inflow of signals. As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). According to one embodiment, the electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The first ground path (341) may include the second inductor (852).The second inductor (852) may be an RF choke inductor to block the inflow of RF signals in the frequency band of cellular communication. In addition, for example, to prevent ESD, the RF choke inductor (1720) may be connected in parallel to the power supply path (831) of the wireless communication circuit (820).

[0200] Referring to FIG. 23b, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For a description of each conductive portion and each non-conductive portion, reference may be made to the descriptions of FIG. 23a.

[0201] According to one embodiment, the electronic device (101) can radiate signals of the NFC circuit (220) through at least two conductive portions among the plurality of conductive portions. For example, the at least two conductive portions can include a fourth conductive portion (304) and a ninth conductive portion (309). For example, the electronic device (101) can use at least a portion of a metal frame and a radiator of a metal antenna used for non-NFC communication as a radiator for NFC communication. The electronic device (101) can include the NFC circuit (220) and the ninth conductive portion (309). To explain the circuit structure of the electronic device (101), the descriptions with respect to FIG. 3A may be applied. In the circuit structure of FIG. 23B, the ninth conductive portion (309) may be used instead of the coil (230). The NFC circuit (220) can be connected to the fourth conductive portion (304) through the first signal path (331). The NFC circuit (220) can be connected to the ninth conductive portion (309) via the second signal path (332). The NFC circuit (220) can operate in a differential mode. The NFC circuit (220) can output a first signal of the differential output via the first terminal (221). The NFC circuit (220) can transmit the first signal from the first terminal (221) to the fourth conductive portion (304) via the first signal path (331). The NFC circuit (220) can output a second signal of the differential output via the second terminal (222). The NFC circuit (220) can transmit the second signal from the second terminal (222) to the ninth conductive portion (309) via the second signal path (332). The first phase of the first signal and the second phase of the second signal can be about 180 degrees apart. The fourth conductive portion (304) can be connected to the ground portion via the first ground path (341). The ninth conductive portion (309) can be connected to the ground portion via the second ground path (342).

[0202] In one embodiment, the fourth conductive portion (304) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (820). For example, the electronic device (101) can include a switching circuit (845) (or an X-GND (ground) circuit) for impedance matching of the fourth conductive portion (304), which is a radiator for the cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. In one embodiment, the electronic device (101) can include a first capacitor (841) in a power supply path (831). The electronic device (101) can include a second capacitor (842) in a ground path (832). The first capacitor (841) and / or the second capacitor (842) may have a capacitance for blocking DC or a frequency below a reference. For example, the first capacitor (841) and the second capacitor (842) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). According to one embodiment, the electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The first inductor (851) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The first ground path (341) may include a second inductor (852).The second inductor (852) may be an RF choke inductor to block the inflow of RF signals in the frequency band of cellular communication. In addition, for example, to prevent ESD, the RF choke inductor (1720) may be connected in parallel to the power supply path (831) of the wireless communication circuit (820).

[0203] In one embodiment, the ninth conductive portion (309) can be used as a radiator for non-NFC communication (e.g., cellular communication). The electronic device (101) can include a wireless communication circuit (2320). The electronic device (101) can include a switching circuit (2345) (or an X-GND circuit) for impedance matching of the ninth conductive portion (309), which is a radiator for the cellular communication. In one embodiment, for isolation between two signals (e.g., an RF signal of cellular communication and an output signal of NFC communication), the electronic device (101) can include at least one passive component. In one embodiment, the electronic device (101) can include a third capacitor (2341) in the power supply path (2331). The electronic device (101) can include a fourth capacitor (2342) in the ground path (2332). The third capacitor (2341) and / or the fourth capacitor (2342) may have a capacitance for blocking DC or a frequency below a reference. For example, the third capacitor (2341) and the fourth capacitor (2342) may be used to block the inflow of signals in the NFC frequency band (e.g., 13.56 MHz). As a non-limiting example, the third capacitor (2341) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). As a non-limiting example, the fourth capacitor (2342) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). According to one embodiment, the electronic device (101) may include a third inductor (2351) arranged in series with the second signal path (332). The electronic device (101) may include a fourth inductor (2352) arranged in series with the second ground path (342). The second signal path (332) may include a third inductor (2351). The third inductor (2351) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. The second ground path (2342) may include a fourth inductor (2352).The fourth inductor (2352) may be an RF choke inductor to block the inflow of RF signals in the frequency band of cellular communication.

[0204] Referring to FIG. 23C, the electronic device (101) may include a plurality of conductive portions and a plurality of non-conductive portions. For a description of each conductive portion and each non-conductive portion, the descriptions of FIG. 23A may be referred to. In one embodiment, instead of the coil (230) as a radiator for NFC, a conductive portion (1710) for protecting a camera (e.g., the camera module (180) of FIG. 1) may be used for NFC communication. For example, in the example mentioned in FIG. 23A, instead of the tenth conductive portion (2301), the conductive portion (1710) may be used for NFC communication. The second signal path (332) for the NFC circuit (220) may be connected to the conductive portion (1710). The NFC circuit (220) can transmit a second signal from the second terminal (222) to the conductive portion (1710) via the second signal path (332). As a non-limiting example, the conductive portion (1710) can be connected to the second ground path (342) and the NFC circuit (220) without an RF choke inductor (e.g., the first inductor (851) and the second inductor (852)).

[0205] In one embodiment, a first signal path (331) for the NFC circuit (220) may be connected to a fourth conductive portion (304). The NFC circuit (220) may transmit a first signal from the first terminal (221) to the fourth conductive portion (304) through the first signal path (331). In one embodiment, the fourth conductive portion (304) may be used as a radiator of an antenna for non-NFC communication (e.g., cellular communication). The wireless communication circuit (820) may be connected to the fourth conductive portion (304) through a first capacitor (841). The fourth conductive portion (304) may be connected to a ground portion through a second capacitor (842). For example, the first capacitor (841) and / or the second capacitor (842) may be used to prevent the inflow of static electricity due to ESD as well as signals in the NFC frequency band (e.g., 13.56 MHz). For example, the first capacitor (841) may be a varistor capacitor (e.g., the first varistor capacitor (1341)). For example, the second capacitor (842) may be a varistor capacitor (e.g., the second varistor capacitor (1342)). According to one embodiment, the electronic device (101) may include a first inductor (851) arranged in series with the first signal path (331). The electronic device (101) may include a second inductor (852) arranged in series with the first ground path (341). The first inductor (851) may be an RF choke inductor for preventing the inflow of RF signals in the frequency band of cellular communication. The first ground path (341) may include a second inductor (852). The second inductor (852) may be an RF choke inductor for blocking the inflow of RF signals in the frequency band of cellular communication. As a non-limiting example, at least a portion of the power supply path (831) may be shared with at least a portion of the first signal path (331). At least a portion of the ground path (832) may be shared with at least a portion of the first ground path (341).

[0206] The radiators described through FIGS. 23A to 23C are exemplary, and in addition to the examples described above, combinations of various types of radiators (e.g., LDS and FPCB, a solenoid-shaped conductor and a conductive portion of a metal frame, a conductive portion and a conductive patch, or a conductive portion on a dielectric substrate and a conductive portion of a metal frame) can be used for NFC communication. In addition, regardless of the type of radiator, the location of the feeding point or ground for the radiator, if there is a structure in which the NFC circuit (220) and two radiators are connected (e.g., a connection structure having the connection types according to FIG. 2A), it can be understood as an embodiment of the present disclosure.

[0207] Figures 24a and 24b illustrate examples of bar-type electronic devices (e.g., electronic device (101)).

[0208] Referring to FIG. 24A, for example, the electronic device (101) may include a housing (2410) forming an exterior of the electronic device (101). For example, the housing (2410) may include a front surface (2400A), a rear surface (2400B), and a side surface (2400C) surrounding a space between the front surface (2400A) and the rear surface (2400B). For example, the housing (2410) may also refer to a structure forming at least a portion of the front surface (2400A), the rear surface (2400B), and / or the side surface (2400C).

[0209] For example, the electronic device (101) may include a substantially transparent front plate (2402). For example, the front plate (2402) may form at least a portion of the front surface (2400A). For example, the front plate (2402) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0210] For example, the electronic device (101) may include a substantially opaque back plate (2411). For example, the back plate (2411) may form at least a portion of the back surface (2400B). For example, the back plate (2411) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0211] For example, the electronic device (101) may include a side bezel structure (or side member) (2418). For example, the side bezel structure (2418) may be coupled with the front plate (2402) and / or the back plate (2411) to form at least a portion of the side surface (2400C) of the electronic device (101). For example, the side bezel structure (2418) may form the entire side surface (2400C) of the electronic device (101), or, for another example, the side bezel structure (2418) may form the side surface (2400C) of the electronic device (101) together with the front plate (2402) and / or the back plate (2411).

[0212] Unlike the illustrated embodiment, when the side surface (2400C) of the electronic device (101) is partially formed by the front plate (2402) and / or the rear plate (2411), the front plate (2402) and / or the rear plate (2411) may include a region that extends seamlessly from its edge toward the rear plate (2411) and / or the front plate (2402). The extending region of the front plate (2402) and / or the rear plate (2411) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0213] For example, the side bezel structure (2418) may include a metal and / or a polymer. For example, the back plate (2411) and the side bezel structure (2418) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but are not limited thereto. For example, the back plate (2411) and the side bezel structure (2418) may be formed as separate components and / or may include different materials.

[0214] For example, the electronic device (101) may include at least one of a display (2401) (e.g., the display module (160) of FIG. 1), an audio module (2403, 2404, 2407) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (2405, 2412) (e.g., the camera module (180) of FIG. 1), a key input device (2417) (e.g., the input module (150) of FIG. 1), a light-emitting element, and / or a connector hole (2408). For example, the electronic device (101) may omit at least one of the above components (e.g., the key input device (2417) or the light-emitting element), or may additionally include other components.

[0215] For example, the display (2401) may be visually exposed through a significant portion of the front plate (2402). For example, at least a portion of the display (2401) may be visible through the front plate (2402) forming the front surface (2400A). For example, the display (2401) may be disposed on the back surface of the front plate (2402).

[0216] For example, the outer shape of the display (2401) may be formed to be substantially the same as the outer shape of the front plate (2402) adjacent to the display (2401). For example, in order to expand the area where the display (2401) is visually exposed, the gap between the outer shape of the display (2401) and the outer shape of the front plate (2402) may be formed to be substantially the same.

[0217] For example, the display (2401) (or the front surface (2400A) of the electronic device (101)) may include a screen display area (2401A). For example, the display (2401) may provide visual information to the user through the screen display area (2401A). In the illustrated embodiment, when the front surface (2400A) is viewed from the front, the screen display area (2401A) is depicted as being positioned on the inside of the front surface (2400A) and spaced apart from the periphery of the front surface (2400A), but is not limited thereto. In another embodiment, when the front surface (2400A) is viewed from the front, at least a portion of an edge of the screen display area (2401A) may substantially coincide with an edge of the front surface (2400A) (or the front plate (2402)).

[0218] For example, the screen display area (2401A) may include a sensing area (2401B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (2401A) includes the sensing area (2401B)" may be understood to mean that at least a portion of the sensing area (2401B) may overlap the screen display area (2401A). For example, the sensing area (2401B) may be an area that, like other areas of the screen display area (2401A), can display visual information by the display (2401) and additionally acquire the user's biometric information (e.g., a fingerprint). For example, the sensing area (2401B) may also be formed in the key input device (2417).

[0219] For example, the display (2401) may include an area where the first camera (2405) is positioned. For example, an opening may be formed in the area of ​​the display (2401), and the first camera (2405) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (2400A). In this case, the screen display area (2401A) may surround at least a portion of an edge of the opening. For example, the first camera (2405) (e.g., an under display camera (UDC)) may be positioned below the display (2401) so as to overlap the area of ​​the display (2401). In this case, the display (2401) may provide visual information to the user through the area, and additionally, the first camera (2405) may acquire an image corresponding to a direction facing the front (2400A) through the area of ​​the display (2401).

[0220] For example, the display (2401) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0221] For example, the audio module (2403, 2404, 2407) may include a microphone hole (2403, 2404) and a speaker hole (2407).

[0222] For example, the microphone holes (2403, 2404) may include a first microphone hole (2403) formed in a portion of the side (2400C) and a second microphone hole (2404) formed in a portion of the rear (2400B). A microphone for acquiring external sound may be placed inside the microphone holes (2403, 2404). The microphone may include multiple microphones to detect the direction of the sound.

[0223] For example, a second microphone hole (2404) formed in a portion of the rear (2400B) may be positioned adjacent to a camera module (2405, 2412). For example, the second microphone hole (2404) may acquire sound according to the operation of the camera module (2405, 2412). However, the present invention is not limited thereto.

[0224] The speaker hole (2407) may include an external speaker hole (2407) and a call receiver hole. The external speaker hole (2407) may be formed in a part of the side surface (2400C) of the electronic device (101). For example, the external speaker hole (2407) may be implemented as a single hole with the microphone hole (2403). The call receiver hole may be formed in another part of the side surface (2400C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (2407) in the side surface (2400C). For example, referring to the illustration in FIG. 24A, the external speaker hole (2407) may be formed in the side surface (2400C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (2400C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and for example, the call receiver hole may be formed in a location other than the side (2400C). For example, the call receiver hole may be formed by a space between the front plate (2402) (or display (2401)) and the side bezel structure (2418).

[0225] For example, the electronic device (101) may include at least one speaker configured to output sound to the outside of the housing through an external speaker hole (2407) and / or a call receiver hole. For example, the speaker may include a piezo speaker configured to output audio by vibrating a diaphragm within the speaker using a piezoelectric element, but is not limited thereto.

[0226] For example, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0227] For example, the camera module (2405, 2412) may include a first camera (2405) positioned to face the front (2400A) of the electronic device (101), and a second camera (2412) positioned to face the rear (2400B).

[0228] For example, the second camera (2412) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (2412) is not necessarily limited to including multiple cameras and may include a single camera.

[0229] For example, the first camera (2405) and the second camera (2412) may include one or more lenses, image sensors, and / or image signal processors.

[0230] For example, the electronic device (101) may include a flash (2413) positioned to face the rear (2400B). For example, the flash (2413) may include, for example, a light-emitting diode or a xenon lamp. For example, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be positioned on one side of the electronic device (101).

[0231] For example, the key input device (2417) may be positioned on a side (2400C) of the electronic device (101). For example, the electronic device (101) may not include some or all of the key input devices (2417), and the key input devices (2417) that are not included may be implemented in another form, such as a soft key, on the display (2401).

[0232] For example, a connector hole (2408) may be formed on a side surface (2400C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to a connector of an external device may be arranged within the connector hole (2408). For example, the electronic device (101) may include an interface module (e.g., an interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0233] For example, the electronic device (101) may include a light-emitting element. For example, the light-emitting element may be disposed on the front surface (2400A) of the housing. The light-emitting element may provide status information of the electronic device (101) in the form of light. For example, the light-emitting element may provide a light source that is linked to the operation of the first camera (2405). For example, the light-emitting element may include an LED, an IR LED, and / or a xenon lamp.

[0234] Figure 24b is an exploded perspective view of the electronic device (101). In the following, duplicate descriptions of components having the same reference numerals as those described above are omitted.

[0235] Referring to FIG. 24b, for example, the electronic device (101) may include a display (2401), a front plate (2402), a back plate (2411), a frame structure (2440), a first printed circuit board (2450), a second printed circuit board (2452), a cover plate (2460), and a battery (2470) (e.g., battery (189) of FIG. 1).

[0236] For example, the frame structure (2440) may include a side bezel structure (2418) forming an exterior of the electronic device (101) (e.g., side surface (2400C) of FIG. 24A) and a support structure (2443) extending inwardly from the side bezel structure (2418). For example, the frame structure (2440) may be positioned between the display (2401) and the back plate (2411). For example, the side bezel structure (2418) of the frame structure (2440) may surround a space between the back plate (2411) and the front plate (2402) (and / or the display (2401)), and the support structure (2443) of the frame structure (2440) may extend from the side bezel structure (2418) within the space.

[0237] For example, the frame structure (2440) may support or accommodate other components included in the electronic device (101). For example, a display (2401) may be disposed on one side of the frame structure (2440) facing one direction (e.g., +z direction), and the display (2401) may be supported by a support structure (2443) of the frame structure (2440). For example, a first printed circuit board (2450), a second printed circuit board (2452), a battery (2470), and a second camera (2412) may be disposed on the other side of the frame structure (2440) facing the opposite direction (e.g., -z direction). The first printed circuit board (2450), the second printed circuit board (2452), the battery (2470), and the second camera (2412) can be mounted in recesses defined by the side bezel structure (2418) and / or the support structure (2443) of the frame structure (2440).

[0238] For example, the first printed circuit board (2450), the second printed circuit board (2452), and the battery (2470) may be respectively coupled to the frame structure (2440). For example, the first printed circuit board (2450) and the second printed circuit board (2452) may be fixedly disposed to the frame structure (2440) through a coupling member such as a screw. For example, the battery (2470) may be fixedly disposed to the frame structure (2440) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0239] For example, the cover plate (2460) may be placed between the first printed circuit board (2450) and the back plate (2411). For example, the cover plate (2460) may be placed on the first printed circuit board (2450). For example, the cover plate (2460) may be placed on a surface of the first printed circuit board (2450) facing the -z direction.

[0240] For example, the cover plate (2460) may at least partially overlap the first printed circuit board (2450) with respect to the z-axis. For example, the cover plate (2460) may cover at least a portion of the first printed circuit board (2450). In this way, the cover plate (2460) may protect the first printed circuit board (2450) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (2450).

[0241] For example, the cover plate (2460) may be fixedly positioned on the first printed circuit board (2450) via a joining member (e.g., a screw), or may be joined to the frame structure (2440) together with the first printed circuit board (2450) via the joining member.

[0242] For example, the display (2401) may be positioned between a frame structure (2440) and a front plate (2402). For example, the front plate (2402) may be positioned on one side (e.g., in the +z direction) of the display (2401), and the frame structure (2440) may be positioned on the other side (e.g., in the -z direction).

[0243] For example, the front plate (2402) can be coupled with the display (2401). For example, the front plate (2402) and the display (2401) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0244] For example, the front plate (2402) may be coupled with the frame structure (2440). For example, the front plate (2402) may include an outer portion extending outside the display (2401) when viewed in the z-axis direction, and may be coupled to the frame structure (2440) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (2402) and the frame structure (2440) (e.g., side bezel structure (2418)). However, the present invention is not limited to the above-described examples.

[0245] For example, the first printed circuit board (2450) and / or the second printed circuit board (2452) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a nonvolatile memory (e.g., the nonvolatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. For example, the first printed circuit board (2450) and the second printed circuit board (2452) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0246] For example, the battery (2470) may power at least one component of the electronic device (101). For example, the battery (2470) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (2470) may be disposed substantially coplanar with the first printed circuit board (2450) and / or the second printed circuit board (2452).

[0247] For example, the electronic device (101) may include an antenna module. For example, the antenna module may be disposed between the rear plate (2411) and the battery (2470). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0248] For example, a first camera (2405) (e.g., a front camera) may be positioned on at least a portion of a frame structure (2440) (e.g., a support structure (2443)) such that a lens can receive external light through a portion of a front plate (2402) (e.g., a camera area (2437)) (e.g., a front (2400A) of FIG. 24A).

[0249] For example, a second camera (2412) (e.g., a rear camera) may be positioned between the frame structure (2440) and the rear plate (2411). For example, the second camera (2412) may be electrically connected to the first printed circuit board (2450) via a connecting member (e.g., a connector). For example, the second camera (2412) may be positioned such that a lens can receive external light through the camera area (2484) of the rear plate (2411) of the electronic device (101).

[0250] For example, the camera area (2484) may be formed on a surface of the rear plate (2411) (e.g., the rear surface (2400B) of FIG. 24A). For example, the camera area (2484) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (2412). For example, at least a portion of the camera area (2484) may protrude from the surface of the rear plate (2411) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (2484) may form a substantially same plane as the surface of the rear plate (2411).

[0251] For example, the housing (e.g., the housing (2410) of FIG. 24A) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (2402), the frame structure (2440), and / or the rear plate (2411) that form the exterior of the electronic device (101) may be referred to as the housing (2410) of the electronic device (101).

[0252] FIGS. 25A, 25B, and 25C illustrate examples of foldable-type electronic devices (e.g., electronic device (101)). FIG. 25A illustrates an example of an unfolded state of an exemplary foldable electronic device. FIG. 25B illustrates an example of a folded state of an exemplary foldable electronic device. FIG. 25C is an exploded view of an exemplary foldable electronic device.

[0253] Referring to FIGS. 25A, 25B, and 25C, a foldable electronic device (e.g., electronic device (101) of FIG. 1) may include a housing (2501), a flexible display (2530) (e.g., display module (160) of FIG. 1), and at least one camera (2540).

[0254] For example, the housing (2501) may form the exterior of the foldable electronic device (101). For example, the housing (2501) may be a physical exterior of the foldable electronic device (101) that is exposed to the outside, and may be disposed inside the foldable electronic device (101) to enclose components that are not exposed to the outside. For example, the housing (2501) may include a first housing portion (2510), a second housing portion (2520), and a hinge structure (2550).

[0255] For example, the first housing portion (2510) can include a first surface (2511), a second surface (2512) opposite the first surface (2511), and a first side surface (2513) surrounding at least a portion of the first surface (2511) and the second surface (2512). For example, the first surface (2511) can be referred to as a front surface of the first housing portion (2510), and the second surface (2512) can be referred to as a rear surface of the first housing portion (2510). The first side surface (2513) can be connected to a periphery of the first surface (2511) and a periphery of the second surface (2512). The first side (2511), the second side (2512), and the first side (2513) may form an interior space of the first housing portion (2510). For example, at least one component may be placed within the space enclosed by the first side (2511), the second side (2512), and the first side (2513).

[0256] For example, the second housing portion (2520) can include a third face (2521), a fourth face (2522) opposite the third face (2521), and a second side (2523) surrounding at least a portion of the third face (2521) and the fourth face (2522). For example, the third face (2521) can be referred to as a front surface of the second housing portion (2520), and the fourth face (2522) can be referred to as a rear surface of the second housing portion (2520). The second side (2523) can be connected to a periphery of the third face (2521) and a periphery of the fourth face (2522). The third side (2521), the fourth side (2522), and the second side (2523) may form an interior space of the second housing portion (2520). For example, at least one component may be placed within the space enclosed by the third side (2521), the fourth side (2522), and the second side (2523).

[0257] For example, the flexible display (2530) may be configured to display visual information. For example, the flexible display (2530) may include a display area including a plurality of pixels. For example, the active area may be referred to as an active area that displays visual information. For example, the flexible display (2530) may form at least a portion of the front surface of the housing (2501). For example, the flexible display (2530) may at least partially form the first surface (2511) and the third surface (2521).

[0258] For example, the flexible display (2530) may include a first display area (2531) forming at least a portion of a first side (2511) of a first housing portion (2510), a second display area (2532) forming at least a portion of a third side (2521) of a second housing portion (2520), and a third display area (2533) disposed between the first display area (2531) and the second display area (2532). For example, the first display area (2531), the second display area (2532), and the third display area (2533) may at least partially form a front surface of the housing (2501). For example, the foldable electronic device (101) may further include a sub-display (2535) distinct from the flexible display (2530). The sub-display (2535) may be placed on the fourth side (2522) of the second housing portion (2520). The sub-display (2535) may be referred to as a cover display.

[0259] For example, at least one camera (2540) may be configured to acquire an image based on receiving light from a subject outside the foldable electronic device (101). For example, the at least one camera (2540) may include first cameras (2541), second cameras (2542), or third cameras (2543). For example, the first cameras (2541) may be disposed within the first housing portion (2510). For example, the first housing portion (2510) may include at least one opening (2541a) that overlaps the first cameras (2541) when the foldable electronic device (101) is viewed from above. The first cameras (2541) may acquire an image based on receiving light from the outside of the foldable electronic device (101) through the at least one opening (2541a).

[0260] For example, the second camera (2542) may be positioned within the second housing portion (2520). The second housing portion (2520) may include at least one opening (2542a) that overlaps the second camera (2542) when the foldable electronic device (101) is viewed from above. The second camera (2542) may acquire an image based on receiving light from the outside of the foldable electronic device (101) through the at least one opening (2542a).

[0261] For example, the third camera (2543) may be positioned within the first housing portion (2510). For example, the first display area (2531) of the flexible display (2530) may include at least one opening that overlaps the third camera (2543) when the flexible display (2530) is viewed from above. The third camera (2543) may acquire an image based on receiving light from the outside of the flexible display (2530) through the at least one opening.

[0262] For example, the second camera (2542) and the third camera (2543) may be positioned below (e.g., in the -z direction) the flexible display (2530). For example, the second camera (2542) and / or the third camera (2543) may include an under-display camera (UDC) and / or a punch-hole camera.

[0263] For example, the first housing portion (2510) and the second housing portion (2520) may be rotatably coupled. For example, the second housing portion (2520) may be rotatably coupled to the first housing portion (2510) via a hinge structure (2550) with respect to the first housing portion (2510).

[0264] For example, the hinge structure (2550) can rotatably connect the first housing portion (2510) and the second housing portion (2520). The hinge structure (2550) can be disposed between the first housing portion (2510) and the second housing portion (2520) of the foldable electronic device (101) so that the foldable electronic device (101) can be folded. The hinge structure (2550) can enable the foldable electronic device (101) to change from an unfolding state to a folding state. The hinge structure (2550) can enable the foldable electronic device (101) to change from a folded state to an unfolding state. The hinge structure (2550) can maintain the foldable electronic device (101) in an intermediate state between the unfolding state and the folded state.

[0265] For example, the unfolded state may be referred to as a state in which the first direction toward which the first display area (2530a) faces and the second direction toward which the second display area (2530b) faces are the same. For example, the folded state may be referred to as a state in which the first direction is opposite to the second direction. When the foldable electronic device (101) is in a folded state, the first housing portion (2510) and the second housing portion (2520) may be covered or overlapped.

[0266] For example, when the foldable electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the foldable electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the foldable electronic device (101) is in an intermediate state, the first direction may have an inclination (e.g., an angle between 0 and 180 degrees) with respect to the second direction.

[0267] For example, the foldable electronic device (101) may be rotatable about a folding axis (f). The folding axis (f) may be referred to as an imaginary line extending along a direction parallel to the longitudinal direction of the foldable electronic device (101) (e.g., the y-axis) or a direction parallel to the width direction of the foldable electronic device (101) (e.g., the x-axis).

[0268] For example, the foldable electronic device (101) may include at least one conductive portion (2514a, 2524a) and at least one non-conductive portion (2514b, 2524b) included within the first side (2513) and / or the third side (2523). For example, the at least one conductive portion (2514a, 2524a) may be separated from other conductive portions within the first side (2513) and / or the third side (2523) by being in contact with the at least one non-conductive portion (2514b, 2524b). The at least one conductive portion (2514a, 2524a) may operate as an antenna radiator to be used for communication with an external electronic device.

[0269] Referring to FIG. 25c, the hinge structure (2550) may include a hinge cover (2551), a first hinge plate (2552), a second hinge plate (2553), and a hinge module (2554). The hinge cover (2551) may surround internal components of the hinge structure (2550) and form an outer surface of the hinge structure (2550). For example, when the foldable electronic device (101) is in a folded state, at least a portion of the hinge cover (2551) may be exposed to the outside of the foldable electronic device (101) through a space between the first housing portion (2510) and the second housing portion (2520). According to another embodiment, when the foldable electronic device (101) is in an unfolded state, the hinge cover (2551) may be covered by the first housing portion (2510) and the second housing portion (2520) and may not be exposed to the outside of the foldable electronic device (101).

[0270] For example, the first hinge plate (2552) and the second hinge plate (2553) can be operatively coupled with the first housing portion (2510) and the second housing portion (2520), respectively, thereby rotatably connecting the first housing portion (2510) and the second housing portion (2520). For example, the first hinge plate (2552) can be operatively coupled with the first frame (2515) of the first housing portion (2510), and the second hinge plate (2553) can be operatively coupled with the second frame (2527) of the second housing portion (2520). As the first hinge plate (2552) and the second hinge plate (2553) are operatively coupled to the first frame (2515) and the second frame (2527), respectively, the first housing portion (2510) and the second housing portion (2520) can be rotated according to the rotation of the first hinge plate (2552) and the second hinge plate (2553).

[0271] The hinge module (2554) can rotate the first hinge plate (2552) and the second hinge plate (2553). For example, the hinge module (2554) can rotate the first hinge plate (2552) and the second hinge plate (2553) about the folding axis (f) by including gears that are interlocked with each other and can rotate.

[0272] For example, the first housing portion (2510) may include a first frame (2515) and a rear cover (2516). The first frame (2515) may be disposed inside the first housing portion (2510) and may support at least one component disposed within the first housing portion (2510). The rear cover (2516) may at least partially form a second surface (2522) of the first housing portion (2510). For example, the second housing portion (2520) may include a second frame (2527). The second frame (2527) may be disposed inside the second housing portion (2520) and may support at least one component disposed within the second housing portion (2520). For example, the sub-display (2535) may be disposed below (e.g., in the -z direction) the second frame (2527).

[0273] An exemplary foldable electronic device (101) may include a plurality of electronic components for implementing various functions, in addition to at least one camera (2540) described above. For example, the foldable electronic device (101) may include a first printed circuit board (2561), a second printed circuit board (2562), a connection structure (e.g., a flexible printed circuit board) (2563), and / or a battery (189). The electronic components described above are merely exemplary and are not limited thereto.

[0274] For example, the first printed circuit board (2561) and the second printed circuit board (2562) may each provide electrical connections between components within the foldable electronic device (101). For example, the first printed circuit board (2561) may be disposed within the first housing portion (2510), and the second printed circuit board (2562) may be disposed within the second housing portion (2520). The first printed circuit board (2561) may provide electrical connections between electronic components disposed within the first housing portion (2510). The second printed circuit board (2562) may provide electrical connections between electronic components disposed within the second housing portion (2520). The connection structure (2563) may electrically connect the first printed circuit board (2561) and the second printed circuit board (2562). For example, the connection structure (2563) may extend from the first printed circuit board (2561) across the hinge structure (2550) to the second printed circuit board (2562). For example, the connection structure (2563) may at least partially overlap the hinge structure (2550).

[0275] For example, the battery (189) may be a device for supplying power to at least one component of the foldable electronic device (101), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0276] For example, the foldable electronic device (101) may include a plurality of antennas (ANT1, ANT2, ANT3, ANT4) to be used for communication with an external electronic device. For example, the foldable electronic device (101) may include a main antenna (ANT1), a sub antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna for short-range wireless communication (ANT4). However, the present invention is not limited thereto.

[0277] Hereinafter, one or more components to be described with reference to the drawings may be implemented together with components of the foldable electronic device (101) described with reference to FIGS. 25a, 25b, and 25c. The same reference numerals are assigned to components identical to those described above, and redundant descriptions may be omitted.

[0278] In this disclosure, relative terms such as "above" and "under" may be used to describe relative positions between components. For example, if the foldable electronic device (101) illustrated in the drawing is flipped over, "above" and "under" may be interchanged.

[0279] According to one embodiment, the foldable electronic device (101) may include a conductive portion (210) and a coil (230) as emitters for NFC communication. For example, the coil (230) may be disposed in a first housing portion (2510), and the conductive portion (210) (e.g., a portion of a metal frame and at least a portion of which is exposed to the outside) may be disposed in a second housing portion (2520). For electrical connection, a connecting member (e.g., FPCB) disposed across a hinge structure (2550) may be used for an NFC path, an ESD path, and / or a non-NFC communication path. For grounding, a portion of the hinge structure (2550) (e.g., a hinge cover (2551), a first hinge plate (2552), a second hinge plate (2553)) may be used. For another example, a conductive portion (210) may be disposed in a first housing portion (2510), and a coil (230) may be disposed in a second housing portion (2520). For electrical connection, a connecting member (e.g., FPCB) disposed across a hinge structure (2550) may be used for an NFC path, an ESD path, and / or a non-NFC communication path. For grounding, a portion of the hinge structure (2550) may be used (e.g., a hinge cover (2551), a first hinge plate (2552), a second hinge plate (2553)). For another example, both the conductive portion (210) and the coil (230) may be disposed in the first housing portion (2510). For another example, both the conductive portion (210) and the coil (230) may be disposed in the second housing portion (2520).

[0280] Figures 26a, 26b, and 26c illustrate examples of other foldable-type electronic devices (e.g., electronic device (101)). Figure 26a illustrates an unfolded state of the electronic device (101). Figure 26b illustrates a folded state of the electronic device (101). Figure 26c is an exploded view of the electronic device (101).

[0281] Referring to FIGS. 26a, 26b, and 26c, the electronic device (101) may include a first housing portion (2610), a second housing portion (2620), and a display (2630).

[0282] The first housing portion (2610) may include a first surface (2611), a second surface (2612) facing away from the first surface (2611), and a first side surface (2613) surrounding at least a portion of the first surface (2611) and the second surface (2612). The second housing portion (2620) may further include at least one camera (2634) and a display panel (2635) exposed through a portion of the second surface (2612). The first housing portion (2610) may provide a space formed by the first surface (2611), the second surface (2612), and the first side surface (2613) as a space for arranging components of the electronic device (101). The first side surface (2613) and the second side surface (2623) may include a conductive material, a non-conductive material, or a combination thereof. For example, the first side (2613) and the second side (2623) may include a conductive portion (2628) and a non-conductive portion (2629). The conductive portion (2628) may include a plurality of conductive members, and the plurality of conductive members may be spaced apart from each other. The non-conductive portion (2629) may be disposed between the plurality of conductive members. An antenna structure may be formed by some or a combination of the plurality of conductive members and the plurality of non-conductive members.

[0283] The second housing portion (2620) may include a third side (2621), a fourth side (2622) facing and spaced from the third side (2621), and a second side (2623) surrounding at least a portion of the third side (2621) and the fourth side (2622). The fourth side (2622) may further include a back plate (2690) disposed on the fourth side (2622).

[0284] The second side (2623) can be pivotally connected to the first side (2613) via a hinge structure (2650) disposed on a hinge cover (2655). The hinge structure (2650) can include a hinge plate. For example, the hinge plate can include a first hinge plate and a second hinge plate. The first hinge plate can be connected to the first housing portion (2610), and the second hinge plate can be connected to the second housing portion (2620). The second housing portion (2620) may provide a space formed by a third surface (2621), a fourth surface (2622) facing and separated from the third surface (2621), and a side surface (2623) surrounding at least a portion of the third surface (2621) and the fourth surface (2622), as a space for arranging components of the electronic device (101). The display (2630) may include a window exposed to the outside. The window may protect a surface of the display (2630) and may be formed of a transparent material to transmit visual information provided from the display (2630) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI). The display (2630) may include a first display area (2631) disposed on a first surface (2611) of a first housing portion (2610), a second display area (2632) disposed on a third surface (2621) of a second housing portion (2620), and a third display area (2633) between the first display area (2631) and the second display area (2632). At least a portion of the third display area (2633) may be disposed on a hinge structure (2650).

[0285] For example, an opening may be formed in a portion of a screen display area of ​​the display (2630), or a recess or opening may be formed in a support member (e.g., a bracket) that supports the display (2630). The electronic device (101) may include at least one camera aligned with the recess or opening. For example, the first display area (2631) may further include at least one camera (2636) that can acquire an image from the outside through a portion of the first display area (2631). For example, at least one camera (2636) may be included on the back of the display (2630) corresponding to the first display area (2631) or the second display area (2632) of the display (2630). For example, the at least one camera (2636) may be disposed below the display (2630) and surrounded by the display (2630). At least one camera (2636) may be enclosed by the display (2630) and not exposed to the outside. However, the display (2630) may include an opening that exposes the at least one camera (2636) to the outside. Although not shown in FIGS. 26A and 26B , the display (2630) may further include a back surface opposite the front surface. The display (2630) may be supported by a first support member (2615) of the first housing portion (2610) and a second support member (2627) of the second housing portion (2620).

[0286] The hinge structure (2650) may be configured to rotatably connect a first support member (2615) coupled to a first hinge plate and a second support member (2627) coupled to a second hinge plate. A hinge cover (2655) surrounding the hinge structure (2650) may be at least partially exposed between the first housing portion (2610) and the second housing portion (2620) while the electronic device (101) is in a folded state. The hinge cover (2655) may be covered by the first housing portion (2610) and the second housing portion (2620) while the electronic device (101) is in an unfolded state.

[0287] The electronic device (101) can be folded about a folding axis (f) passing through the hinge cover (2655). For example, the hinge cover (2655) can be disposed between a first housing portion (2610) and a second housing portion (2620) of the electronic device (101) to enable the electronic device (101) to be bent, curved, or folded. For example, the first housing portion (2610) is connected to the second housing portion (2620) through a hinge structure (2650) disposed in the hinge cover (2655) and can rotate about the folding axis (f).

[0288] The electronic device (101) can be folded so that the first housing portion (2610) and the second housing portion (2620) face each other by rotating around the folding axis (f). The electronic device (101) can be folded so that the first housing portion (2610) and the second housing portion (2620) cover or overlap each other.

[0289] Referring to FIG. 26c, the electronic device (101) may include a first housing portion (2610), a second housing portion (2620), a hinge structure (2650), a display (2630), a printed circuit board (2661), a display panel (2635), and a back plate (2690). For example, the electronic device (101) may omit at least one of the components or additionally include other components.

[0290] For example, the hinge structure (2650) may include a hinge plate. For example, the hinge structure (2650) may include a hinge gear that allows the first housing portion (2610) and the second housing portion (2620) to pivot.

[0291] For example, the first support member (2615) may be partially wrapped by the first side (2613). For example, the first support member (2615) may be formed integrally with the first side (2613). For example, the second support member (2627) may be partially wrapped by the second side (2623). For example, the second support member (2627) may be formed integrally with the second side (2623). However, the present invention is not limited thereto. For example, the first support member (2615) may be formed separately from the first side (2613). For example, the second support member (2627) may be formed separately from the second side (2623).

[0292] For example, one side of the first support member (2615) may be coupled with the display (2630), and the other side of the first support member (2615) may be coupled with the display panel (2635). One side of the second support member (2627) may be coupled with the display (2630), and the other side of the second support member (2627) may be coupled with the rear plate (2690).

[0293] For example, a printed circuit board (2661) and a battery may be placed between a surface formed by the first support member (2615) and the second support member (2627) and a surface formed by the display panel (2635) and the rear plate (2690). The printed circuit board (2661) may be electrically connected to components for implementing various functions of the electronic device (101).

[0294] According to one embodiment, the foldable electronic device (101) may include a conductive portion (210) and a coil (230) as emitters for NFC communication. For example, the coil (230) may be disposed in a first housing portion (2610), and the conductive portion (210) may be disposed in a second housing portion (2620). For electrical connection, a connecting member (e.g., FPCB) disposed across a hinge structure (2650) may be used for an NFC path, an ESD path, and / or a non-NFC communication path. For grounding, a cover (2655) and / or a plate (e.g., a first hinge plate, a second hinge plate) of the hinge structure (2650) may be used. In another example, the conductive portion (210) may be disposed in the first housing portion (2610), and the coil (230) may be disposed in the second housing portion (2620). For electrical connection, a connecting member (e.g., FPCB) disposed across the hinge structure (2650) may be used for an NFC path, an ESD path, and / or a non-NFC communication path. For grounding, a cover (2655) and / or a plate (e.g., a first hinge plate, a second hinge plate) of the hinge structure (2650) may be used. In another example, both the conductive portion (210) and the coil (230) may be disposed in the first housing portion (2610). In another example, both the conductive portion (210) and the coil (230) may be disposed in the second housing portion (2620).

[0295] When two radiators (e.g., conductive portion (210) or coil (230)) of an electronic device (101) are far apart, a structure in which the two radiators are connected via ground paths (e.g., third signal path (233) is the second connection type (252)) may also be advantageous in terms of simplifying circuit wiring. When two radiators (e.g., conductive portion (210) or coil (230)) are to be connected via a conductive line, the wiring must be laid across a substrate (e.g., PCB) of a housing part, which may complicate the circuit wiring within the substrate. On the other hand, when two radiators (e.g., conductive portion (210) or coil (230)) are to be connected via a ground area (e.g., part of the PCB), the circuit wiring may be simplified since they only need to be connected to different ground portions in the ground area of ​​the PCB. For example, the electronic device (101) may be a foldable type electronic device and may include a first housing part (e.g., a first housing part (2510) or a first housing part (2610)) and a second housing part (e.g., a second housing part (2520) or a second housing part (2620)). For example, it is assumed that an NFC circuit (220) and a conductive portion (210) are located in the first housing part, and a coil (230) is located in the second housing part. A portion of a PCB (e.g., a first ground portion (262a)) in the upper first housing part may be connected to the conductive portion (210), and another portion of the PCB (e.g., a second ground portion (262b)) may be connected to the coil (230). Since the two radiators are electrically connected through different ground portions in the PCB, unnecessary circuit wiring may be reduced.

[0296] In embodiments of the present disclosure, while maintaining the radiation performance using the coil (230), additional radiation performance can be secured using the conductive portion (210). In addition to the coil (230), by using the conductive portion (210), the NFC communication area can be expanded. In addition, the conductive portion (210) can also be utilized as a radiator for cellular communication. In other words, the wireless communication circuit (820) for cellular communication and the NFC circuit (220) can share a radiator. For IC protection, the present disclosure describes circuit structures for separating the ESD path through which signals of the NFC circuit (220) are transmitted.

[0297] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0298] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0299] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0300] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a conductive portion (210), a coil (230), a printed circuit board (PCB), and a near field communication (NFC) circuit disposed on the PCB. A first terminal (221) of the NFC circuit (220) may be electrically connected to the conductive portion (210) through a first signal path. A second terminal (222) of the NFC circuit (220) may be electrically connected to the coil (230) through a second signal path. The NFC circuit (220) may be configured to transmit a first signal of a differential output from the first terminal (221) to the conductive portion (210) through the first signal path, and to transmit a second signal of the differential output from the second terminal (222) to the coil (230) through the second signal path.

[0301] In one embodiment, the first portion of the coil (230) may be electrically connected to the NFC circuit (220) via the second signal path. The second portion of the coil (230) may be electrically connected to the ground portion. The conductive portion (210) may be electrically connected to the ground portion.

[0302] In one embodiment, the first portion of the coil (230) may be connected to the NFC circuit (220) via the second signal path. The second portion of the coil (230) may be electrically connected to the conductive portion (210).

[0303] According to one embodiment, the electronic device (101) may further include a wireless communication circuit (820) for cellular communication, which is disposed on the PCB. The wireless communication circuit (820) may be configured to transmit a wireless signal in a frequency band of the cellular communication to the conductive portion (210) through a power supply path.

[0304] In one embodiment, the first signal path connected to the conductive portion (210) may include a radio frequency (RF) choke inductor. The power supply path connected to the conductive portion (210) may include a capacitor for filtering a direct current (DC) signal and RF frequencies below a reference frequency.

[0305] According to one embodiment, the electronic device (101) may further include an inductor electrically connected to the power supply path. The inductor may be used to prevent electrostatic discharges (ESD).

[0306] In one embodiment, the capacitor may be a varistor capacitor for overvoltage protection.

[0307] According to one embodiment, the electronic device (101) may further include a band-stop filter circuit for filtering NFC frequencies electrically connected to the power supply path, and an inductor disposed between the band-stop filter circuit and a ground portion. The band-stop filter circuit and the inductor may be used to prevent electrostatic discharges (ESD).

[0308] According to one embodiment, the band-stop filter circuit may include an inductor and a capacitor arranged in parallel.

[0309] According to one embodiment, the electronic device (101) may further include a second conductive portion that is different from the conductive portion (210). The conductive portion (210) may be electrically connected to the NFC circuit and the ground portion. The second conductive portion may be electrically connected to the ground portion and the coil (230).

[0310] According to one embodiment, the electronic device (101) may include a common matching circuit connected to the first terminal (221) and the second terminal (222), a first matching circuit electrically connected to the coil (230), and a second matching circuit electrically connected to the conductive portion (210). The first signal may be transmitted to the conductive portion (210) through the common matching circuit, the first matching circuit, and the first transmission path. The second signal may be transmitted to the conductive portion (210) through the common matching circuit, the second matching circuit, and the second transmission path.

[0311] According to one embodiment, the second terminal (222) of the NFC circuit (220) may be electrically connected to each of the conductive portion (210) and the coil (230). A first portion of the coil (230) may be electrically connected to the first terminal (221) of the NFC circuit (220). A second portion of the coil (230) may be electrically connected to the second terminal (222) of the NFC circuit (220).

[0312] According to one embodiment, the conductive portion (210) may be positioned between non-conductive portions of the metal frame of the electronic device (101).

[0313] According to one embodiment, the electronic device (101) may further include a camera module. The conductive portion (210) may correspond to a decoration portion arranged to protect the camera module.

[0314] According to one embodiment, the electronic device (101) may include a first housing portion and a second housing portion. The coil (230) may be disposed in the first housing portion. The printed circuit board and the conductive portion (210) may be disposed in the second housing portion.

[0315] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a first housing portion including a plurality of conductive portions and non-conductive portions, a second housing portion rotatably coupled to the first housing portion, a printed circuit board (PCB) disposed in the first housing portion, a coil (230) disposed in the second housing portion, and a near field communication (NFC) circuit disposed in the PCB. The plurality of non-conductive portions may include a first non-conductive portion and a second non-conductive portion. The plurality of conductive portions may include a first conductive portion formed between the first non-conductive portion and the second non-conductive portion. A first terminal (221) of the NFC circuit (220) may be electrically connected to the first conductive portion through a first signal path. The second terminal (222) of the NFC circuit (220) may be electrically connected to the coil (230) through a second signal path. The NFC circuit (220) may be configured to transmit a first signal of a differential output from the first terminal (221) to the first conductive portion through the first signal path, and to transmit a second signal of the differential output from the second terminal (222) to the coil (230) through the second signal path.

[0316] In one embodiment, the first portion of the coil (230) may be electrically connected to the NFC circuit (220) via the second signal path. The second portion of the coil (230) may be electrically connected to the ground portion. The conductive portion (210) may be electrically connected to the ground portion.

[0317] In one embodiment, the first portion of the coil (230) may be connected to the NFC circuit (220) via the second signal path. The second portion of the coil (230) may be electrically connected to the conductive portion (210).

[0318] According to one embodiment, the electronic device (101) may further include a wireless communication circuit (820) for cellular communication, which is disposed on the PCB. The wireless communication circuit (820) may be configured to transmit a wireless signal of a frequency band of the cellular communication to the conductive portion (210) through a power supply path. The first signal path connected to the conductive portion (210) may include an RF (radio frequency) choke inductor. The power supply path connected to the conductive portion (210) may include a capacitor for filtering a DC (direct current) signal and an RF frequency below a reference frequency.

[0319] In one embodiment, the plurality of non-conductive portions may further include a third non-conductive portion. The plurality of conductive portions may include a second conductive portion formed between the second non-conductive portion and the third non-conductive portion. The first conductive portion may be electrically connected to the NFC circuit and the ground portion. The second conductive portion may be electrically connected to the ground portion and the coil (230).

[0320] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a conductive portion at least partially exposed to the outside of the electronic device (101), a coil (230), an NFC (near field communication) circuit (220), and a transmission line electrically connecting the conductive portion, the coil (230), and the NFC circuit (220). The transmission line may include a first signal path (231) electrically connecting a first terminal (221) of the NFC circuit (220) and a first area of ​​the conductive portion, a second signal path (232) electrically connecting a second terminal (222) of the NFC circuit (220) and a first end portion of the coil (230), and a third signal path (233) electrically connecting a second area of ​​the conductive portion and a second end portion of the coil (230). A signal path selected from among the first signal path (231), the second signal path (232), and the third signal path (233) may include a first ground path (252a) and a second ground path (252b) connected to a ground area of ​​the electronic device (101).

[0321] According to one embodiment, one end of the first ground path (252a) may be connected to a first ground portion of the ground area, and one end of the second ground path (252b) may be connected to a second ground portion of the ground area that is different from the first ground portion.

[0322] In one embodiment, the selected signal path may be the third signal path (233), another end of the first ground path (252a) may be connected to the conductive portion, and another end of the second ground path (252b) may be connected to the coil (230).

[0323] In one embodiment, the electronic device (101) may include a non-NFC communication circuit. The conductive portion may form a portion between a first non-conductive portion and a second non-conductive portion formed on a lateral frame of the electronic device (101). A third region of the conductive portion may be connected to a power supply path electrically connected to the non-NFC communication circuit.

[0324] In one embodiment, the electronic device (101) may include a camera module. The conductive portion may form part of a decoration covering the camera module.

[0325] According to one embodiment, the electronic device (101) may include a printed circuit board (PCB). The NFC circuit (220) may be disposed on the PCB. The ground area may be formed as a part of the PCB.

[0326] According to one embodiment, the electronic device (101) may include a first housing portion and a second housing portion that are rotatably coupled to each other. At least a portion of the first ground path (252a) may be formed in a first PCB portion disposed in the first housing portion. At least a portion of the second ground path (252b) may be formed in a second PCB portion disposed in the second housing portion and electrically connected to the first PCB portion.

[0327] In one embodiment, the coil (230) may be disposed in the first housing portion. The conductive portion may be disposed in the second housing portion.

[0328] In one embodiment, the electronic device (101) may include a non-folding housing. The coil (230) may be arranged eccentrically in a first direction with respect to the longitudinal direction of the non-folding housing. The conductive portion may be arranged eccentrically in a second direction opposite to the first direction with respect to the longitudinal direction.

[0329] In one embodiment, each end of the first ground path (252a) and the second ground path (252b) may be connected to the same ground portion of the ground area.

[0330] According to one embodiment, the NFC circuit (220) may be configured to provide a first signal forming a differential output to the conductive portion via the first signal path (231), and a second signal forming the differential output to the coil (230) via the second signal path (232).

[0331] According to one embodiment, the first signal path (231) connected to the conductive portion (210) may include a radio frequency (RF) choke inductor. The power supply path connected to the conductive portion (210) may include a capacitor for filtering a direct current (DC) signal and an RF frequency below a reference frequency.

[0332] According to one embodiment, the electronic device (101) may further include an inductor electrically connected to the power supply path. The inductor may be used to prevent electrostatic discharges (ESD).

[0333] In one embodiment, the capacitor may be a varistor capacitor for overvoltage protection.

[0334] According to one embodiment, the electronic device (101) may further include a band-stop filter circuit for filtering NFC frequencies electrically connected to the power supply path, and an inductor disposed between the band-stop filter circuit and a ground portion. The band-stop filter circuit and the inductor may be used to prevent electrostatic discharges (ESD).

[0335] According to one embodiment, the band-stop filter circuit may include an inductor and a capacitor arranged in parallel.

[0336] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a first conductive portion at least partially exposed to the exterior of the electronic device (101), a second conductive portion at least partially exposed to the exterior of the electronic device (101), a coil (230), a near field communication (NFC) circuit, and at least one transmission line connecting the first conductive portion, the coil (230), the NFC circuit (220), and the second conductive portion. The transmission line may include a first signal path (231) electrically connecting a first terminal (221) of the NFC circuit (220) and a first region of the first conductive portion, a second signal path (232) electrically connecting a second terminal (222) of the NFC circuit (220) and a first end of the coil (230), a third signal path (233) electrically connecting a first region of the second conductive portion and a second end of the coil (230), and a fourth signal path electrically connecting a second region of the first conductive portion and a second region of the second conductive portion. A signal path selected from among the first signal path (231), the second signal path (232), the third signal path (233), and the fourth signal path may include a first ground path (252a) and a second ground path (252b) connected to a ground region of the electronic device (101).

[0337] In one embodiment, the first conductive portion may form a portion between a first non-conductive portion and a second non-conductive portion formed on a lateral frame of the electronic device (101). The second conductive portion may form a portion between the second non-conductive portion and a third non-conductive portion formed on the lateral frame of the electronic device (101).

[0338] According to one embodiment, the electronic device (101) may include a first non-NFC communication circuit and a second non-NFC communication circuit. A third region of the first conductive portion may be connected to a first power supply path electrically connected to the first non-NFC communication circuit. A third region of the second conductive portion may be connected to a second power supply path electrically connected to the second non-NFC communication circuit.

[0339] According to one embodiment, the electronic device (101) may include a printed circuit board (PCB). The NFC circuit (220) may be disposed on the PCB, and the ground area may be formed as a part of the PCB.

[0340] According to one embodiment, one end of the first ground path (252a) may be connected to a first ground portion of the ground area, and one end of the second ground path (252b) may be connected to a second ground portion of the ground area that is different from the first ground portion.

[0341] In one embodiment, the selected signal path may be the fourth signal path, and the other end of the first ground path (252a) may be connected to the first conductive portion, and the other end of the second ground path (252b) may be connected to the second conductive portion.

[0342] According to one embodiment, the electronic device (101) may include a first housing portion and a second housing portion that are rotatably coupled to each other. At least a portion of the first ground path (252a) and at least a portion of the second ground path (252b) may be formed on a printed circuit board (PCB) disposed in the first housing portion.

[0343] In one embodiment, each end of the first ground path (252a) and the second ground path (252b) may be connected to the same ground portion of the ground area.

[0344] According to one embodiment, the NFC circuit (220) may be configured to provide a first signal forming a differential output to the conductive portion via the first signal path (231), and a second signal forming the differential output to the coil (230) via the second signal path (232).

[0345] According to one embodiment, the first signal path (231) connected to the conductive portion (210) may include a radio frequency (RF) choke inductor. The power supply path connected to the conductive portion (210) may include a capacitor for filtering a direct current (DC) signal and an RF frequency below a reference frequency.

[0346] According to one embodiment, the electronic device (101) may further include an inductor electrically connected to the power supply path. The inductor may be used to prevent electrostatic discharges (ESD).

[0347] In one embodiment, the capacitor may be a varistor capacitor for overvoltage protection.

[0348] According to one embodiment, the electronic device (101) may further include a band-stop filter circuit for filtering NFC frequencies electrically connected to the power supply path, and an inductor disposed between the band-stop filter circuit and a ground portion. The band-stop filter circuit and the inductor may be used to prevent electrostatic discharges (ESD).

[0349] According to one embodiment, the band-stop filter circuit may include an inductor and a capacitor arranged in parallel.

[0350] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0351] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured to be executed by one or more processors in an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0352] These programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, magnetic cassettes, or may be stored in memories formed by a combination of some or all of these. In addition, each configuration memory may include multiple copies.

[0353] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network, such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device implementing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device implementing an embodiment of the present disclosure.

[0354] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed singularly or plurally, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in plural may be composed of singular elements, or components expressed in singular may be composed of plural elements.

[0355] According to embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0356] Although specific embodiments have been described in the detailed description of the present disclosure, it is to be understood that various modifications may be made without departing from the scope of the present disclosure.

Claims

1. In electronic devices, A conductive portion at least partially exposed to the exterior of said electronic device; coil; NFC (near field communication) circuit; and Including a transmission line connecting the above-mentioned conductive portion, the above-mentioned coil, and the above-mentioned NFC circuit; The above transmission lines are: A first signal path connecting a first terminal of the NFC circuit and a first area of ​​the conductive portion; A second signal path connecting the second terminal of the NFC circuit and the first ending portion of the coil; and A third signal path connecting the second region of the above-mentioned challenging portion and the second end of the above-mentioned coil is included, The signal path selected from the first signal path, the second signal path, and the third signal path includes a first ground path and a second ground path connected to a ground area of ​​the electronic device. Electronic devices.

2. In claim 1, The above ground area includes a first ground portion and a second ground portion different from the first ground portion, One end of the first ground path is connected to the first ground portion, and one end of the second ground path is connected to the second ground portion. Electronic devices.

3. In claim 2, The above selected signal path is the third signal path, Another end of the above first ground path is connected to the above conductive portion, and The other end of the second ground path is connected to the coil, Electronic devices.

4. In claim 1, Further comprising non-NFC communication circuitry, The above conductive portion corresponds to a portion between the first non-conductive portion and the second non-conductive portion formed on the lateral frame of the electronic device, A third region of the above challenging portion is an electronic device connected to a power path connected to the non-NFC communication circuit.

5. In claim 1, Including an additional camera module, The above challenging portion corresponds to a part of the decoration covering the camera module. Electronic devices.

6. In claim 1, Further comprising a printed circuit board (PCB), The above NFC circuit is placed on the PCB, and The above ground area corresponds to a portion of the above PCB, Electronic devices.

7. In claim 1, Further comprising a first housing portion and a second housing portion rotatably coupled to each other, At least a portion of the first ground path is formed on a first PCB portion disposed in the first housing portion, and An electronic device, wherein at least a portion of the second ground path is formed on a second PCB portion disposed in the second housing portion and connected to the first PCB portion.

8. In claim 7, The above coil is arranged in the first housing portion, and An electronic device, wherein the above challenging portion is disposed in the second housing portion.

9. In claim 1, Further comprising a non-folding housing, The above coil is arranged eccentrically in a first direction with respect to the longitudinal direction of the non-folding housing, and The above challenging portion is arranged eccentrically in a second direction opposite to the first direction with respect to the longitudinal direction. Electronic devices.

10. In claim 1, Each end of the first ground path and the second ground path is connected to the same ground portion of the ground area, Electronic devices.

11. In claim 1, The NFC circuit is configured to provide a first signal forming a differential output to the conductive portion via the first signal path, and a second signal forming the differential output to the coil via the second signal path. Electronic devices.

12. In electronic devices, A first conductive portion at least partially exposed to the exterior of said electronic device; A second conductive portion at least partially exposed to the exterior of said electronic device; coil; NFC (near field communication) circuit; and A transmission line connecting the first conductive portion, the coil, the NFC circuit, and the second conductive portion, wherein the transmission line comprises: A first signal path connecting a first terminal of the NFC circuit and a first region of the first conductive portion; A second signal path connecting the second terminal of the NFC circuit and the first end of the coil; a third signal path connecting the first region of the second conductive portion and the second end of the coil; and A fourth signal path is included connecting the second region of the first conductive portion and the second region of the second conductive portion, The signal path selected from the first signal path, the second signal path, the third signal path, and the fourth signal path includes a first ground path and a second ground path connected to a ground area of ​​the electronic device. Electronic devices.

13. In claim 12, The first conductive portion corresponds to a portion between the first non-conductive portion and the second non-conductive portion formed on the lateral frame of the electronic device, The second conductive portion forms a portion between the second non-conductive portion and the third non-conductive portion formed on the side frame of the electronic device. Electronic devices.

14. In claim 13, a first non-NFC communication circuit; and Including a second non-NFC communication circuit, The third region of the first challenging portion is connected to the first power path connected to the first non-NFC communication circuit, The third region of the second challenging portion is connected to a second power path connected to the second non-NFC communication circuit. Electronic devices.

15. In claim 12, Further comprising a printed circuit board (PCB), The above NFC circuit is placed on the PCB, The above ground area corresponds to a part of the PCB, Electronic devices.

Images