Heat-not-burn apparatus and heating control method therefor

Abstract

The present invention relates to a heat-not-burn apparatus and a heating control method therefor. The method comprises: in a first stage, controlling a heating assembly to heat an aerosol-forming substrate to increase the temperature of the aerosol-forming substrate from an initial temperature to a first temperature; in a second stage, controlling the heating assembly to heat the aerosol-forming substrate to decrease the temperature of the aerosol-forming substrate from the first temperature to a second temperature, wherein the second temperature is lower than the first temperature; and in a third stage, controlling the heating assembly to heat the aerosol-forming substrate to increase the temperature of the aerosol-forming substrate from the second temperature to a third temperature, wherein the third temperature is equal to the first temperature. The present invention is capable of providing aerosol delivery with consistent characteristics that do not change over time.

Description

A heating-not-burning device and heating control method thereof Technical Field

[0001] The present invention relates to the field of electronic atomization, and in particular to a heat-without-combustion device and a heating control method thereof. Background Art

[0002] In heat-not-burn devices, it is desirable to generate an aerosol that remains constant over time, particularly when the aerosol is intended for human consumption. However, during continuous or repeated heating, fluctuations in heating temperature can affect the aerosol formation of nicotine and, in some cases, flavorants. Consequently, it is impossible to provide aerosol delivery with consistent characteristics over time. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a heat-not-burn device and a heating control method thereof in order to address the defect of being unable to provide aerosol transmission with consistent characteristics that do not change over time.

[0004] The technical solution adopted by the present invention to solve the technical problem is: a heating control method of a heat-not-burn device, comprising:

[0005] In a first stage, controlling the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate increases from an initial temperature to a first temperature;

[0006] in a second stage, controlling the heating assembly to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate decreases from the first temperature to a second temperature, wherein the second temperature is less than the first temperature;

[0007] In a third stage, the heating assembly is controlled to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate increases from the second temperature to a third temperature; wherein the third temperature is equal to the first temperature.

[0008] Preferably, in the first stage, the temperature of the aerosol-forming substrate is increased in a curve over time;

[0009] In the second stage, the temperature of the aerosol-forming substrate decreases in a curve;

[0010] In the third stage, the temperature of the aerosol-forming substrate is increased in a curved manner.

[0011] Preferably, it also includes:

[0012] The heating component is controlled to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate is maintained within a preset allowable temperature range in the first stage, the second stage and the third stage.

[0013] Preferably, the allowable temperature range has an upper limit between 450°C and 500°C and a lower limit between 250°C and 300°C.

[0014] Preferably, the first temperature is between 300°C and 450°C;

[0015] The second temperature is between 300°C and 400°C.

[0016] Preferably, the time of the first stage is less than 20 seconds;

[0017] The duration of the second stage is greater than 20 seconds;

[0018] The duration of the third stage is from the end time of the second stage to 600 seconds.

[0019] In addition, the present invention also provides a heat-without-combustion device, comprising:

[0020] a heating assembly for heating the aerosol-forming substrate;

[0021] a battery assembly for providing power to the heating assembly;

[0022] A control component, wherein the control component is configured to:

[0023] In a first stage, controlling the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate increases from an initial temperature to a first temperature;

[0024] in a second stage, controlling the heating assembly to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate decreases from the first temperature to a second temperature, wherein the second temperature is less than the first temperature;

[0025] In a third stage, the heating assembly is controlled to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate increases from the second temperature to a third temperature; wherein the third temperature is equal to the first temperature.

[0026] Preferably, the heating assembly includes a shell and a heating element, the heating element is used to generate infrared light for heating the aerosol-forming matrix when electrically heated, the heating element is at least partially spaced apart from the shell wall, and the shell allows the infrared light to pass through.

[0027] Preferably, the heating element is located in the shell, and the heating element includes a heating base and an infrared radiation layer coated on the heating base; the heating element is used to excite the infrared radiation layer to generate infrared light after being energized; at least a portion of the shell is used to insert an aerosol-forming matrix; or

[0028] The heating elements are arranged at intervals on the outer periphery of the shell, and the interior of the shell is hollow and forms a second accommodating cavity for accommodating the aerosol-forming substrate.

[0029] Preferably, the housing includes a first tube body and a second tube body sleeved on the outer periphery of the first tube body;

[0030] A gap is left between the first tube body and the second tube body, and the gap forms a first accommodating cavity for accommodating the heating element;

[0031] The heating element is arranged on the outer periphery of the first tube and is spaced apart from the outer wall of the first tube. A second accommodating cavity for heating the aerosol-forming substrate is formed inside the first tube.

[0032] The heating element includes a heating base and an infrared radiation layer wrapped around the heating base; the heating component is used to excite the infrared radiation layer to generate infrared light after being energized.

[0033] The implementation of the heat-without-combustion device and the heating control method thereof of the present invention has at least the following beneficial effects: the present invention controls the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate presents a three-stage heating control curve of rising and falling, which can ensure that the aerosol-forming substrate continuously generates aerosol at the optimal temperature during the entire puffing process, and improve the heat conduction rate from the heating component to the aerosol-forming substrate, thereby providing aerosol transmission with consistent characteristics that do not change with time. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0035] FIG1 is a schematic flow chart of a heating control method for a heat-without-combustion device according to a first embodiment of the present invention;

[0036] FIG2 is a schematic diagram of the temperature distribution of the aerosol-forming substrate in Example 1 of the present invention;

[0037] FIG3 is a schematic structural diagram of a heating without combustion device according to a first embodiment of the present invention;

[0038] FIG4 is a circuit diagram of a heat-without-combustion device according to a first embodiment of the present invention;

[0039] FIG5 is a schematic structural diagram of a heating assembly in Embodiment 1 of the present invention;

[0040] FIG6 is a cross-sectional view of the heating assembly shown in FIG5;

[0041] FIG7 is a schematic diagram of the structural decomposition of the heating assembly shown in FIG5;

[0042] FIG8 is a transverse cross-sectional view of the heating element shown in FIG7;

[0043] FIG9 is a schematic structural diagram of a heating assembly in a second embodiment of the present invention;

[0044] FIG10 is a schematic structural diagram of the heating assembly shown in FIG9 from another angle;

[0045] FIG11 is a cross-sectional view of the heating assembly shown in FIG9;

[0046] FIG12 is a schematic diagram of the structural decomposition of the heating assembly shown in FIG9 .

[0047] In the figure: 1-shell, 11-heating component, 3-battery component, 4-control component, 5-aerosol forming matrix, 20-temperature measuring element, 111-shell, 112-heating element, 113-base, 1110-opening, 1111-tubular body, 1112-peak structure, 1113-first accommodating cavity, 1114-gap, 1120-heating part, 112d-first free end, 112e-second free end, 112a-first heating part, 112b-second heating part, 1121-conductive part, 1122-heating matrix, 1124-infrared radiation layer, 1123-anti-oxidation layer, 111a-first tube body, 111b-second tube body, 1115-second accommodating cavity. DETAILED DESCRIPTION

[0048] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described in detail with reference to the accompanying drawings.

[0049] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0050] FIG1 is a flow chart of a heating control method for a heat-without-combustion device according to a first embodiment of the present invention. The heating control method for the heat-without-combustion device according to this embodiment is applied to a control assembly 4 in the heat-without-combustion device. It should be understood that the heat-without-combustion device further includes a heating assembly 11 and a battery assembly 3. The battery assembly 3 is used to supply energy to the heating assembly 11. The battery assembly 3 can be a battery, such as a rechargeable lithium-ion battery, a nickel-metal hydride battery, a nickel-cadmium battery, or a lithium-based battery. The heating assembly 11, also known as a heater, can take various forms, such as a heating plate, a heating needle, a heating rod, a heating wire, or a wire. Alternatively, the heating assembly 11 can also be a combination of two or more of the above different forms of heating assemblies 11.

[0051] 2 , the heating control method of the heat-without-combustion device of this embodiment specifically includes the following steps:

[0052] S10 . In the first stage, the heating component 11 is controlled to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate increases from an initial temperature to a first temperature.

[0053] In this step, the first stage, from t0 to t1, is a rapid temperature increase phase. During this stage, the permissible temperature setting is, in principle, a temperature at which the desired volatile compounds in the aerosol-forming substrate rapidly evaporate, but below the temperature of undesirable compounds with higher vaporization temperatures. Under normal atmospheric pressure and ambient temperature, the first temperature is between 250°C and 500°C. As shown in Figure 2, during this first stage, the temperature of the aerosol-forming substrate rapidly increases over time in a curve. In one embodiment, the normal atmospheric pressure can be standard atmospheric pressure, and the normal temperature is between 15°C and 25°C.

[0054] S20. In the second stage, the heating component 11 is controlled to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate decreases from the first temperature to a second temperature, wherein the second temperature is lower than the first temperature.

[0055] In this step, the second stage, from t1 to t2, is the cooling phase. In principle, during this phase, the goal is to maintain consistent compound volatilization and, through cooling, reduce the atomization temperature. Therefore, the cooling process must balance consistent compound volatilization with a comfortable atomization temperature. As shown in Figure 2, during the second stage, the temperature of the aerosol-forming substrate decreases over time in a curve, and the downward trend in temperature during this stage is significantly weaker than the upward trend in the first stage.

[0056] S30: In the third stage, the heating component 11 is controlled to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate is increased from the second temperature to a third temperature, wherein the third temperature is equal to the first temperature.

[0057] In this step, the third stage, from t2 to t3, is the temperature-raising phase. In principle, during this phase, it is desirable to achieve reasonable volatilization of the compound and maintain consistent flavor and volatilization across the device. As shown in Figure 2, during the third stage, the temperature of the aerosol-forming substrate rises in a curve over time, with the temperature increase trend during this stage being less than that of the first stage.

[0058] In this embodiment, it should be noted that the selected first temperature and second temperature can ensure that the heat-not-burn device continues to generate aerosol in the first, second and third stages, and the first temperature and the second temperature can be determined based on the temperature range corresponding to the volatilization temperature of the aerosol former in the matrix.

[0059] In this embodiment, the aerosol-forming substrate is heated by controlling the heating component 11 so that the temperature of the aerosol-forming substrate presents a three-stage heating control curve of rising, falling, and rising. This ensures that the aerosol-forming substrate continuously generates aerosol at the optimal temperature throughout the entire puffing process, thereby increasing the heat transfer rate from the heating component 11 to the aerosol-forming substrate. Therefore, it can provide aerosol transmission with consistent characteristics that do not change over time.

[0060] In some embodiments, the heating control method of the heat-not-burn device of the present invention further comprises:

[0061] The heating component 11 is controlled to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate is maintained within a preset allowable temperature range in the first stage, the second stage and the third stage.

[0062] In this embodiment, the permissible temperature range depends on the aerosol-forming substrate. Aerosol-forming substrates release some volatile compounds at different temperatures. Some of the volatile compounds released from the aerosol-forming substrate are formed only during the heating process, with each volatile compound being released above a specific release temperature. By controlling the maximum operating temperature below the release temperature of some volatile compounds, the release or formation of these components can be avoided. The maximum operating temperature is also selected to ensure that the substrate does not burn under normal operating conditions.

[0063] The allowable temperature range has an upper limit of 450°C to 500°C and a lower limit of 250°C to 300°C. The first temperature may be between 300°C and 450°C, and the second temperature may be between 300°C and 400°C. Furthermore, the duration of the first stage is less than 20 seconds. The duration of the second stage is greater than 20 seconds. The duration of the third stage is from the end time t2 of the second stage to 600 seconds.

[0064] In an optional embodiment, in the second and third stages, the energy supply of the heating assembly 11 is controlled in the following manner so that the temperature of the aerosol-forming substrate reaches the target temperature (the second stage corresponds to the second temperature, and the third stage corresponds to the third temperature):

[0065] detecting the temperature of the aerosol-forming matrix to obtain a temperature detection value;

[0066] Performing PID calculation on the temperature detection value and the target temperature to obtain first heating control information;

[0067] The heating component 11 is controlled to perform periodic heating according to the first heating control information.

[0068] In this embodiment, the temperature of the aerosol-forming matrix is ​​first detected, and then the temperature detection value and the target temperature are used as PID inputs. After PID calculation, the first heating control information is output, and finally converted into a heating duty cycle value through an internal preset algorithm, and periodic heating is performed on the heating component 11.

[0069] In another optional embodiment, in the second and third stages, the energy supply to the heating assembly 11 is controlled in the following manner so that the temperature of the aerosol-forming substrate reaches the target temperature (the second stage corresponds to the second temperature, and the third stage corresponds to the third temperature):

[0070] Detecting the resistance of the heating component 11 to obtain a resistance detection value;

[0071] Performing a PID calculation on the resistance detection value and the target resistance value to obtain second heating control information, wherein the target resistance value is determined by the corresponding target temperature;

[0072] The heating component 11 is controlled to perform periodic heating according to the second heating control information.

[0073] In this embodiment, the resistance of the heating component 11 is first detected, and then the resistance detection value and the target resistance value (obtained by inverse operation of the target temperature) are used as PID inputs. After PID operation, the second heating control information is output, and finally converted into a heating duty cycle value through an internal preset algorithm, and periodic heating is performed on the heating component 11.

[0074] The above describes two implementations of heating control for the heating assembly 11 in the second and third stages. However, in other embodiments, for the first stage (rapid temperature rise stage), to further shorten the preheating time, constant power or maximum power heating can be employed during an initial preset time, followed by PID control to ensure that the temperature in the first stage reaches the first temperature, thereby avoiding the possibility of significant overshoot. Specifically, when controlling the heating of the heating assembly 11 in the first stage, no integral adjustment is performed during the initial preset time, or the integral term is not taken into account if the deviation between the detected temperature value and the target temperature value is greater than a certain set value. This reduces the impact of the integral term during the temperature rise process and achieves a smooth transition between the temperature control stages.

[0075] Furthermore, during the heating control of the heating component 11, if heating control is performed once per heating cycle, then when a larger heating cycle is selected, the temperature variation of the heating component 11 within a single heating cycle will be larger. When a smaller heating cycle is selected, although the temperature variation of the heating component 11 within a single heating cycle is smaller, the performance of the microprocessor performing PID control may not meet the requirements of real-time data acquisition and processing. Therefore, in actual control, the control cycle can be set to an integer multiple of the heating cycle, that is, control cycle = heating cycle * N, where N is an integer and N>=1. This effectively ensures synchronization of heating and control.

[0076] Furthermore, in an optional embodiment, the temperature detection value may be obtained in the following manner:

[0077] During a stop period of the heating cycle of the heating component 11, detecting the resistance of the heating component 11 to obtain a resistance detection value;

[0078] The temperature detection value of the aerosol forming substrate is determined based on the resistance detection value.

[0079] In this embodiment, it should be noted that since the heating component 11 is periodically heated according to a duty cycle signal, each heating cycle consists of a heating period and a rest period. During the rest period, the resistance of the heating component 11 is detected. After the resistance detection value is obtained, the temperature detection value corresponding to the resistance detection value is calculated based on the corresponding relationship between the resistance value and the temperature.

[0080] Furthermore, after determining the temperature detection value of the aerosol-forming substrate according to the resistance detection value, the method further includes: compensating the temperature detection value according to the cooling and heating state of the heating component 11 to achieve compensation processing for the first temperature.

[0081] In this embodiment, it is first explained that when the temperature of the heating component 11 has a field distribution, as the heating time increases, the heat conductivity of the base of the heating component 11 increases. Under the condition of the same resistance value, the temperature will have a certain drop process. This process is correlated with the heat conductivity of the base of the heating component 11. In other words, when the heating component 11 itself is in a hot state, its volatilization situation is different from that in a cold state. In order to achieve an atomization temperature that takes into account the consistency of compound volatilization and comfort, a compensation algorithm is added internally. This algorithm is for the temperature drop caused by heat conduction. The relevant terms are time and target temperature, that is, the actual temperature detection value T = F(R Heater ) + f (t,T 目标 ), which ensures that the entire suction stage is basically consistent with the cooling state; Among them, R Heateris the current resistance value of the heating element 112, t is the time from receiving the start signal to the present, T is the current target temperature, F(R Heater )、f (t, T 目标 ) are obtained by linear fitting or quadratic fitting.

[0082] Furthermore, the heating control method of the heat-without-combustion device of the present invention further includes:

[0083] The first temperature, the second temperature and / or the third temperature are compensated according to the ambient temperature.

[0084] In this embodiment, when the ambient temperature changes, in order to maintain the experience of the product during the puffing phase, the target temperature also needs to be compensated. For example, when the ambient temperature is low in winter (such as the ambient temperature is lower than 15 degrees Celsius), the target temperature will be increased to maintain the temperature of the product when it is puffed into the mouth; when the temperature is high in summer (such as the ambient temperature is higher than 25 degrees Celsius), the target temperature will be lowered to maintain the temperature of the product when it is puffed into the mouth.

[0085] Optionally, when the ambient temperature changes, in order to maintain the experience of the product inhalation stage, the time t2 of the second stage can also be dynamically adjusted; for example: when the ambient temperature is low in winter, t2 is lowered to prevent the temperature from dropping too quickly and maintain the temperature of the product inhaled into the mouth; when the temperature is high in summer, t2 is increased to maintain the temperature of the product inhaled into the mouth.

[0086] Furthermore, in order to improve the safety performance of use, the heating control method of the heat-not-burn device of the present invention further includes:

[0087] Determine whether the temperature detection value is within a preset range. If it is not within the preset range, control the heating component 11 to stop heating. The upper limit of the preset range is between 450°C and 500°C, and the lower limit is between 250°C and 300°C.

[0088] Alternatively, it is determined whether the energy supply of the heating component 11 exceeds a preset energy value within a preset period of time. When the energy supply exceeds the preset energy value, the heating component 11 is controlled to stop heating.

[0089] In this embodiment, the temperature is calculated throughout the temperature control phase by real-time monitoring of the resistance of the heating element 11. If, under abnormal circumstances, the resistance or temperature of the heating element 11 exceeds a specified upper or lower limit, the device will initiate an emergency shutdown, mitigating safety risks. Furthermore, if the energy supplied to the heating element 11 during a preset period (unit time) exceeds the preset energy level at ambient temperature, the device will also initiate an emergency shutdown, mitigating safety risks. For example, under normal circumstances, the energy supplied to the heating element 11 is between 0.5 and 2.0 W. If it exceeds 3.0 W within a preset period (e.g., 1 to 5 seconds), an emergency shutdown will be initiated.

[0090] As shown in Figure 3, it is a structural diagram of the heat-not-burn device of embodiment 1 of the present invention. The heat-not-burn device of this embodiment includes a housing 1, a heating component 11 accommodated in the housing 1, a control component 4 and a battery component 3 for supplying energy to the heating component 11. The control component 4 is used to execute the heating control method of the heat-not-burn device as described above. In this embodiment, the aerosol-forming matrix 5 is at least partially inserted into the housing 1 from one end of the housing 1, and the heating component 11 is inserted into the interior of the aerosol-forming matrix 5 for heating. The heating component 11 includes a heating element 112 and a base 113 for fixing the heating element 112. The aerosol-forming matrix 5 can be cylindrical. Specifically, the aerosol-forming matrix 5 can be a solid material in the form of silk strips, sheets, particles or one-piece molding made of leaves and / or stems of plants, and aroma components can be further added to the solid material.

[0091] Alternatively, the heating method of the heating device includes but is not limited to resistive heating, infrared heating, etc., and the specific structure of the heating device is determined by the corresponding heating method.

[0092] In this embodiment, the aerosol-forming substrate 5 is heated by controlling the heating component 11 so that the temperature of the aerosol-forming substrate 5 presents a three-stage heating control curve of rising, falling, and rising. This ensures that the aerosol-forming substrate 5 continuously generates aerosol at the optimal temperature throughout the entire puffing process, thereby increasing the heat conduction rate from the heating component 11 to the aerosol-forming substrate 5. Therefore, it can provide aerosol transmission with consistent characteristics that do not change over time.

[0093] Furthermore, the control component 4 includes a detection module and a microprocessor, wherein the detection module is used to detect the temperature / resistance of the aerosol-forming matrix to obtain a temperature / resistance detection value; the microprocessor is used to perform PID calculation on the temperature / resistance detection value and the target temperature / target resistance to obtain heating control information, and control the heating component 11 to perform periodic heating according to the heating control information; wherein the target resistance is determined by the target temperature.

[0094] FIG4 is a circuit diagram of a heat-not-burn device according to a first embodiment of the present invention. The heat-not-burn device according to this embodiment includes a heating component, a battery component (not shown), and a control component, wherein the control component includes a microprocessor U1 and a detection module. The detection module includes: a first switching tube Q1, a second switching tube Q2, a third switching tube Q3 and a reference resistor R1, wherein the first end of the first switching tube Q1 and the first end of the second switching tube Q2 are respectively connected to the positive terminal BAT+ of the battery assembly, the second end of the first switching tube Q1 is connected to the first end of the reference resistor R1, the second end of the reference resistor R1 and the second end of the second switching tube Q2 are respectively connected to the first end of the heating component Heater, the second end of the heating component Heater is connected to the first end of the third switching tube Q3, and the second end of the third switching tube Q3 is grounded, the first input end of the microprocessor U1 is connected to the second end of the first switching tube Q1, the second input end of the microprocessor U1 is connected to the second end of the reference resistor R1, the third input end of the microprocessor U1 is connected to the second end of the heating component Heater, the first output end of the microprocessor U1 is connected to the control end of the first switching tube Q1, the second output end of the microprocessor U1 is connected to the control end of the second switching tube Q2, and the third output end of the microprocessor U1 is connected to the control end of the third switching tube Q3.

[0095] Furthermore, in this embodiment, the first switch Q1 is an NPN transistor, with the first end of the first switch Q1 being the collector, the second end of the first switch Q1 being the emitter, and the control end of the first switch Q1 being the base. The second switch Q2 is a P-type field-effect transistor, with the first end of the second switch Q2 being the source, the second end of the second switch Q2 being the drain, and the control end of the second switch Q2 being the gate. The third switch Q3 is an N-type field-effect transistor, with the first end of the third switch Q3 being the drain, the second end of the third switch Q3 being the source, and the control end of the third switch Q3 being the gate. It should be understood that in other embodiments, the three switches may also be other types of switches.

[0096] The working principle of the circuit is described below:

[0097] First of all, it should be noted that the reference resistor R1 is a high-precision resistor. In order to be compatible with the measurement accuracy and the heat generated by the reference resistor R1, the resistance value of R1 is generally in the range of 1 times R Heater To 10 times R Heater The output voltage range of the battery pack is 2.8V~4.2V.

[0098] When the microprocessor U1 controls the second switch tube Q2 and the third switch tube Q3 to conduct, and controls the first switch tube Q1 to turn off, the battery assembly forms a heating path through the second switch tube Q2, the heater component Heater, and the third switch tube Q3, heating the heater component Heater. In addition, the microprocessor U1 can approximately calculate the current I of the heating path through the voltage at the third input terminal of the collector, that is, I = VMEAS3 / R Q3 , where R Q3 is the internal resistance of the third switch tube Q3 when it is turned on, wherein VMEAS3 is the voltage at the third input terminal of the microprocessor U1. Therefore, whether overcurrent occurs can be determined based on the current I, and overcurrent protection can be performed when overcurrent occurs.

[0099] When the microprocessor U1 controls the first switch tube Q1 and the third switch tube Q3 to be turned on, and controls the second switch tube Q2 to be turned off, the battery assembly forms a resistance measurement path through the first switch tube Q1, the reference resistor R1, the heating component Heater, and the third switch tube Q3. At this time, a voltage V1 is formed on the reference resistor R1, and a voltage V2 is formed on the heating component Heater. The microprocessor U1 determines V1 by collecting the voltages of its first input terminal and the second input terminal, that is, V1 = MEAS1- MEAS2. The microprocessor U1 determines V2 by collecting the voltages of its second input terminal and the third input terminal, that is, V2 = MEAS2-MEAS3. Then, the resistance value R of the heating component Heater is calculated according to the following formula: Heater , that is, R Heater = (MEAS2-MEAS3)*R1 / (MEAS1- MEAS2) Wherein, MEAS1 is the voltage of the first input terminal of the microprocessor U1, and MEAS2 is the voltage of the second input terminal of the microprocessor U1.

[0100] It should also be noted that in a single heating cycle, the microprocessor U1 controls the second switch Q2 according to the duty cycle conduction time to achieve heating control of the heating component. During the off phase of the second switch Q2, part or all of the off phase can be selected to control the first switch Q1 to enable, thereby inferring R Heater In order to avoid large temperature fluctuations of the aerosol-forming substrate during the process from the second switch tube Q2 being turned on to being disabled and the process of being turned on, the time of a single heating cycle can be selected to be between 1mS and 50mS.

[0101] Figure 5 illustrates a schematic diagram of the structure of a heating assembly employing infrared heating, which can be partially inserted into an aerosol-forming substrate. Specifically, the heating assembly can be at least partially inserted into the dielectric segment of the aerosol-forming substrate and, when energized, generates infrared light to heat the dielectric segment of the aerosol-forming substrate, thereby generating an aerosol.

[0102] In some embodiments, as shown in FIG5 , the detection module of the control assembly 4 is a temperature measuring element 20 disposed on the housing 111 of the heating assembly 11. This element can be a thermocouple for measuring temperature, or a resistance circuit with a TCR. When current flows through it, the corresponding resistance is detected to represent the temperature of the heating element 112, and thus the temperature of the aerosol-forming substrate. Furthermore, in actual use, even when no aerosol-forming substrate is inserted, the temperature of the heating assembly 11 can be controlled according to the corresponding temperature control curve of the present invention after the device is turned on.

[0103] As shown in Figures 5 to 7 , in this embodiment, the heating assembly 11 has a central heating structure. That is, when in use, the heating assembly 11 is located at the center of the aerosol-forming substrate. The heating assembly 11 comprises a heating element 112, a housing 111, and a base 113. The heating element 112 is at least partially spaced from the housing 111 and positioned within the housing 111. The housing 111 is at least partially configured to receive the aerosol-forming substrate. The heating element 112 is electrically heated and generates infrared light. For example, a gap 1114 is provided between the housing 111 and the heating element 112. This gap 1114 can be filled with air, allowing air inside the housing to circulate with air outside the housing. Of course, it is understood that in other embodiments, this gap 1114 can also be filled with a reducing gas or an inert gas, in which case the interior of the housing is a sealed space. The housing 111 houses at least a portion of the heating element 112 and is capable of transmitting the infrared light generated by the heating element 112 to heat the aerosol-forming substrate. Specifically, the housing 111 can transmit infrared light generated by the heating element 112 , so that at least a portion of the infrared light generated by the heating element 112 is absorbed by the aerosol, thereby heating the aerosol-forming substrate.

[0104] In this embodiment, the housing 111 can be made of glass, for example, quartz glass. Alternatively, in other embodiments, the housing 111 is not limited to quartz glass, but can also be made of other window materials that allow infrared light to pass through, such as infrared-transmitting glass, transparent ceramics, diamond, etc.

[0105] In this embodiment, the housing 111 is hollow and tubular, i.e., made of transparent quartz glass. The housing 111 is longitudinally elongated and has two axially spaced ends. The longitudinally elongated structure refers to the housing 111 having a dimension in one direction (e.g., the length) that is greater than the dimension in another direction (e.g., the thickness). Specifically, the housing 111 comprises a tubular body 1111 having a circular cross-section and a pointed top structure 1112 disposed at one end of the tubular body 1111. Of course, it is understood that in other embodiments, the cross-section of the tubular body 1111 is not limited to a circular shape. The tubular body 1111 is a hollow structure with an opening 1110 at one end. The pointed top structure 1112 is disposed at the end of the tubular body 1111 remote from the opening 1110. The provision of the pointed top structure 1112 facilitates insertion and removal of at least a portion of the heating assembly 11 into the aerosol-forming substrate. In this embodiment, a first accommodating cavity 1113 is formed inside the shell 111, and the first accommodating cavity 1113 is a cylindrical cavity. In this embodiment, the tubular body 1111 is a cylinder, and the pointed top structure 1112 is a cone. In other embodiments, the shell 111 may also have other forms, such as a triangular prism, a rectangular parallelepiped, or other shapes. In some other embodiments, the heating element 112 may also be arranged at intervals on the outer periphery of the shell 111, and the inner side of the shell 111 may form a second accommodating cavity for accommodating the aerosol-forming substrate.

[0106] As shown in Figure 7, in this embodiment, the heating element 112 can be a single piece and can be arranged longitudinally, with a first free end 112d and a second free end 112e. In this embodiment, the heating element 112 is in the shape of a strip (solid round wire) with a circular cross-section. The heating element 112 is at least partially bent to form a columnar heating portion 1120. Specifically, it can be bent to form a spiral columnar heating portion 1120. It is understood that in other embodiments, the heating element 112 is not limited to a strip shape and can be in the form of a longitudinal sheet or mesh. The heating portion 1120 is not limited to a columnar shape and can also be in the form of a sheet, mesh, or strip. In some embodiments, the heating element 112 can be wound to form a heating portion 1120 in a single spiral, double spiral, M-shaped, N-shaped, or other shapes. Of course, it is understood that in other embodiments, the heating element 112 is not limited to a single piece and can be two, or more than two. It should be noted that, in some other embodiments, the heating element 112 may also be a metal sheet or a metal needle.

[0107] In the present embodiment, the heating part 1120 includes a first heating part 112a and a second heating part 112b; one end of the first heating part 112a and the second heating part 112b are connected. In the present embodiment, the first heating part 112a and the second heating part 112b are an integrally formed structure, which can be formed by bending a heating element 112. It is understandable that in some other embodiments, the first heating part 112a and the second heating part 112b can also be a split structure, and the first heating part 112a and the second heating part 112b can be two heating elements 112 connected together by welding, riveting, etc. It is understandable that in some other embodiments, the second heating part 112b can also be omitted and can be replaced by a non-heating conductive rod.

[0108] In this embodiment, a conductive portion 1121 is provided at one end of the heating portion 1120. The conductive portion 1121 is connected to the heating portion 1120 and can be led out from one end of the housing 111 and passed through the base 113 to be electrically connected to the power supply component in the control assembly. In this embodiment, there can be two conductive portions 1121, which can be spaced apart and respectively connected to the heating portion 1120. The two conductive portions 1121 can be passed through the housing 111 from the same end. In this embodiment, the conductive portion 1121 can be fixed to the heating portion 1120 by welding. Of course, it is understandable that in some other embodiments, the heating portion 1120 can be integrally formed with the conductive portion 1121, and the first free end 112d and the second free end 112e of the heating element 112 can respectively form two conductive portions 1121, that is, the first free end 112d of the first heating portion 112a forms one of the conductive portions 1121; the second free end 112e of the second heating portion 112b forms the other conductive portion 1121. In some other embodiments, the conductive portion 1121 can be a lead having a resistance lower than that of the heating portion, such as a lead made of silver or aluminum material, which can be welded to the heating portion 1120. Of course, it is understandable that in some other embodiments, the conductive portion 1121 is not limited to a lead, and can be other conductive structures.

[0109] As shown in Figure 8, in this embodiment, the heating portion 1120 includes a heating base 1122 and an infrared radiation layer 1124. The heating base 1122 can generate heat when powered. The infrared radiation layer 1124 is coated on the outer surface of the heating base 1122. When powered and heated, the heating base 1122 can excite the infrared radiation layer 1124 to generate infrared light and radiate it. In this embodiment, the heating base 1122 and the infrared radiation layer 1124 are distributed in concentric circles on the cross section of the heating portion 1120.

[0110] In this embodiment, the heating base 1122 can be strip-shaped overall with a circular cross-section. Specifically, the heating base 1122 can be a heating wire. Of course, it is understood that in other embodiments, the heating base 1122 can also be sheet-shaped, that is, the heating base 1122 can be a heating sheet. The heating base 1122 comprises a metal substrate with high-temperature oxidation resistance, which can be a metal wire. Specifically, the heating base 1122 can be a nickel-chromium alloy substrate (such as nickel-chromium alloy wire) or an iron-chromium-aluminum alloy substrate (such as iron-chromium-aluminum alloy wire), a metal material with excellent high-temperature oxidation resistance, high stability, and resistance to deformation. In this embodiment, the radial dimension of the heating base 1122 can be 0.15 mm to 0.8 mm. The metal wire can be bent or wound into various shapes, such as a spiral, mesh, M-shape, or N-shape. The bent or wound heating element can have an overall cylindrical shape, a spiral segment, a mesh, or other curved, three-dimensional or planar shape.

[0111] In this embodiment, the heating portion 1120 further includes an anti-oxidation layer 1123, which is formed between the heating base 1122 and the infrared radiation layer 1124. Specifically, the anti-oxidation layer 1123 can be an oxide film. The heating base 1122 undergoes high-temperature heat treatment and forms a dense oxide film on its own surface. The oxide film forms the anti-oxidation layer 1123. Of course, it is understandable that in some other embodiments, the anti-oxidation layer 1123 is not limited to including the oxide film formed by itself. In some other embodiments, it can be an anti-oxidation coating applied to the outer surface of the heating base 1122. By forming the anti-oxidation layer 1123, it can be ensured that the heating base 1122 is not or rarely oxidized when heated in an air environment, thereby improving the stability of the heating base 1122. As a result, there is no need to evacuate the first accommodating chamber 1113 or fill it with a reducing gas, thereby simplifying the assembly process of the entire heating component 11 and saving manufacturing costs. In this embodiment, the thickness of the anti-oxidation layer 1123 can be selected to be 1 μm-150 μm. When the thickness of the anti-oxidation layer 1123 is less than 1 μm, the heating substrate 1122 is easily oxidized. When the thickness of the anti-oxidation layer 1123 is greater than 150 μm, it will seriously affect the heat conduction between the heating substrate 1122 and the infrared radiation layer 1124.

[0112] In this embodiment, the infrared radiation layer 1124 may be an infrared layer. The infrared layer may be formed on a side of the anti-oxidation layer 1123 away from the heat-generating substrate 1122 by a high-temperature heat treatment. In this embodiment, the infrared layer may be formed on a substrate formed by a silicon carbide, spinel, or a composite thereof.

[0113] Of course, it is understandable that in some other embodiments, the infrared radiation layer 1124 is not limited to an infrared layer. In some other embodiments, the infrared radiation layer 1124 can be a composite infrared layer. In this embodiment, the infrared layer can be formed on the side of the anti-oxidation layer 1123 away from the heating substrate 1122 by dipping, spraying, brushing, etc. The thickness of the infrared radiation layer 1124 can be 10um-300um. When the thickness of the infrared radiation layer 1124 is 10um-300um, its infrared light effect is better, and the atomization efficiency and atomization taste of the aerosol-forming matrix 200 are better. Of course, it is understandable that in some other embodiments, the thickness of the infrared radiation layer 1124 is not limited to 10um-300um.

[0114] In this embodiment, unlike the heating elements of existing electronic atomizer devices, the heating element 112 has a maximum operating temperature range of 500°C to 1300°C. That is, the maximum operating temperature of the heating element 112 can be any temperature between 500°C and 1300°C during the entire operation period, depending on the temperature control requirements. In contrast, the maximum operating temperature of the heating elements in the prior art is generally only within 400°C.

[0115] Figures 9 to 12 illustrate the structure of a heating assembly according to a second embodiment of the present invention. In this embodiment, the housing 111 comprises a first tubular body 111a and a second tubular body 111b. The first tubular body 111a is a hollow structure with both ends extending through it. The first tubular body 111a can be cylindrical, with an inner diameter slightly larger than the outer diameter of the aerosol-forming substrate. A second accommodating cavity 1115 can be formed within the first tubular body 111a for accommodating the aerosol-forming substrate and forming a heating space for heating the dielectric segment of the aerosol-forming substrate. The axial length of the first tubular body 111a can be greater than the axial length of the second tubular body 111b. The second tube 111b can be sleeved around the outer circumference of the first tube 111a. The second tube 111b can be cylindrical, and the radial dimension of the second tube 111b can be larger than the radial dimension of the first tube 111a. In other words, a gap is left between the second tube 111b and the first tube 111a. This gap can form a first accommodating cavity 1113 for accommodating the heating element 112. The heating element 112 is disposed around the outer circumference of the first tube 111a and spaced apart from the outer wall of the first tube 111a. In some embodiments, the heating element 112 is disposed around the outer circumference of the first tube 111a, with a gap 1114 between the entire heating element 112 and the inner wall of the second tube 111b and the outer wall of the first tube 111a (i.e., the heating element 112 is at least partially spaced apart from the housing 111). This creates a certain temperature difference between the inner wall of the first accommodating cavity 1113 and the heating element 112, providing thermal insulation. In some embodiments, a reflective layer may be provided on the inner wall of the second tube 111 b to reflect the heat of the heating element 112 and radiate the heat to the aerosol-forming substrate, thereby enhancing the heating efficiency.

[0116] In some other embodiments, the heating element 112 is not limited to being spaced apart from the first tube 111a or the second tube 111b. In some other embodiments, the heating element 112 may also be partially spaced apart from the first tube 111a, and the radial dimension of a portion of the heating portion 1120 may be equivalent to the outer diameter of the first tube 111a, which may serve as a limiter. In some embodiments, the heating element 112 may also be partially spaced apart from the second tube 111b, and the radial dimension of a portion of the heating portion 1120 may be equivalent to the radial dimension of the second tube 111b.

[0117] It is understandable that the above embodiments only express preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it should not be understood as limiting the patent scope of the present invention.

[0118] It should be pointed out that, for ordinary technicians in this field, without departing from the concept of the present invention, the above-mentioned technical features can be freely combined, and several variations and improvements can be made, all of which fall within the scope of protection of the present invention; therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A heating control method for a heat-not-burn device, characterized in that, Comprising: In the first stage, controlling the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate rises from an initial temperature to a first temperature; In the second stage, controlling the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate drops from the first temperature to a second temperature, wherein the second temperature is less than the first temperature; In the third stage, controlling the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate rises from the second temperature to a third temperature; wherein the third temperature is equal to the first temperature.

2. The heating control method of a heat-not-burn device according to claim 1, characterized in that In the first stage, the temperature of the aerosol-forming substrate rises in a curve form over time; In the second stage, the temperature of the aerosol-forming substrate drops in a curve form; In the third stage, the temperature of the aerosol-forming substrate rises in a curve form.

3. The heating control method of the heat-not-burn device according to claim 1, characterized in that Further comprising: Controlling the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate remains within a preset allowable temperature range in the first stage, the second stage, and the third stage.

4. The heating control method of the heat-not-burn device according to claim 3, characterized in that The allowable temperature range has an upper limit between 450°C and 500°C and a lower limit between 250°C and 300°C.

5. The heating control method of a heat-not-burn device according to claim 1, characterized in that The first temperature is between 300°C and 450°C; The second temperature is between 300°C and 400°C.

6. The heating control method of a heat-not-burn device according to claim 1, characterized in that The time of the first stage is less than 20 seconds; The time of the second stage is greater than 20 seconds; The time of the third stage is from the end moment of the second stage to 600 seconds.

7. A heat-not-burn device, characterized in that Comprising: A heating component for heating the aerosol-forming substrate; A battery component for supplying power to the heating component; A control component, and the control component is configured to: In the first stage, control the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate rises from an initial temperature to a first temperature; In the second stage, control the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate drops from the first temperature to a second temperature, wherein the second temperature is less than the first temperature; In the third stage, control the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate rises from the second temperature to a third temperature; wherein the third temperature is equal to the first temperature.

8. The heat-not-burn device according to claim 7, wherein The heating component includes a housing and a heating element, the heating element is used for generating infrared light for heating the aerosol-forming substrate through electricity, the heating element is at least partially spaced from the housing wall of the housing, and the housing allows the infrared light to pass through.

9. The heat-not-burn device according to claim 8, wherein, The heating element is located within the housing. The heating element includes a heating substrate and an infrared radiation layer coated on the outer surface of the heating substrate. The heating element is configured to excite the infrared radiation layer to generate infrared light after being powered on. At least a part of the housing is for insertion into an aerosol-forming substrate; or The heating elements are spaced apart and disposed on the outer periphery of the housing. The interior of the housing is hollow and forms a second accommodation cavity for accommodating an aerosol-forming substrate.

10. The heat-not-burn device according to claim 8, characterized in that, The housing includes a first tube body and a second tube body sleeved on the outer periphery of the first tube body; A gap is left between the first tube body and the second tube body, and the gap forms a first accommodation cavity for accommodating the heating element; The heating element is disposed on the outer periphery of the first tube body and is spaced apart from the outer wall of the first tube body. A second accommodation cavity for heating an aerosol-forming substrate is formed inside the first tube body; The heating element includes a heating substrate and an infrared radiation layer coated on the outer surface of the heating substrate. The heating assembly is configured to excite the infrared radiation layer to generate infrared light after being powered on.

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