Display device, and method for manufacturing display device

Abstract

This display device comprises: a pixel circuit layer including a pixel circuit disposed on a base layer; and a light-emitting element layer which is disposed on the pixel circuit layer, and which includes a light-emitting unit including a first anode electrode, a first connection electrode, a second anode electrode, first light-emitting elements disposed on the first anode electrode, and second light-emitting elements disposed on the second anode electrode. The first light-emitting elements and the second light-emitting elements include a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end portion adjacent to the first semiconductor layer, and a second end portion adjacent to the second semiconductor layer. The first connection electrode electrically connects the first end portion of the first light-emitting elements to the second anode electrode such that the first light-emitting elements and the second light-emitting elements are electrically connected in series.

Description

Display device and method for manufacturing the display device

[0001] The present disclosure relates to a display device and a method for manufacturing the display device.

[0002] As interest in information displays has grown recently, research and development on display devices are continuously being conducted.

[0003] One aspect of the present disclosure is to provide a display device and a method of manufacturing a display device that can reduce or prevent malfunctions of pixels (e.g., light-emitting elements), thereby reducing the need for a repair process and improving process efficiency.

[0004] According to one or more embodiments of the present disclosure, a display device may include: a pixel circuit layer including a pixel circuit disposed on a base layer; and a light emitting element layer disposed on the pixel circuit layer, the light emitting unit including a first anode electrode, a first connection electrode, a second anode electrode, first light emitting elements disposed on the first anode electrode, and second light emitting elements disposed on the second anode electrode. The first light emitting elements and the second light emitting elements include a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer. The first connection electrode electrically connects the first ends of the first light emitting elements and the second anode electrode such that the first light emitting elements and the second light emitting elements are electrically connected in series.

[0005] The above first light-emitting elements and the above second light-emitting elements can be electrically connected in series.

[0006] The first light-emitting elements and the second light-emitting elements may collectively comprise one sub-pixel.

[0007] The light-emitting element layer may further include a first electrode and a second electrode. The pixel circuit layer may further include a first power line electrically connected to the first electrode and a second power line electrically connected to the second electrode.

[0008] The first electrode and the first anode electrode may be integral.

[0009] The first light-emitting element may further include a first bonding electrode adjacent to the first end and electrically connected to the first anode electrode. The second light-emitting element may further include a second bonding electrode adjacent to the first end and electrically connected to the second anode electrode.

[0010] The first light-emitting element and the second light-emitting element may have a trapezoidal cross-section.

[0011] The display device may further include a first organic layer covering the first anode electrode and the second anode electrode. The first connection electrode is electrically connected to the second anode electrode through a contact portion penetrating the first organic layer.

[0012] The display device may further include a second organic layer disposed on the first organic layer and may include a flat structure.

[0013] The first connecting electrode may, when viewed in a planar manner, not overlap with the second light-emitting elements and may include an electrical path between the first light-emitting elements and the second light-emitting elements.

[0014] The display device may further include an insulating layer that covers parts of the side surfaces of each of the first light-emitting elements and the second light-emitting elements, and covers the second ends of the first light-emitting elements, but does not cover the second ends of the second light-emitting elements.

[0015] The display device may further include a second connecting electrode electrically connecting the second end of the second light-emitting elements and the second electrode.

[0016] According to one or more embodiments of the present disclosure, a display device may include a base layer and a pixel circuit on the base layer; a first electrode, a first anode electrode, a second anode electrode, and a second electrode, which are disposed on the base layer and are disposed in the same layer as each other and are electrically connected to the first electrode; light-emitting elements each including a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer, and including first light-emitting elements disposed on the first anode electrode and including a first bonding electrode, and second light-emitting elements disposed on the second anode electrode and including a second bonding electrode; a first connection electrode electrically connecting the first ends of the first light-emitting elements to the second bonding electrode; and a second connection electrode electrically connecting the first ends of the second light-emitting elements to the second electrode. The first connecting electrode and the second anode electrode are physically separated from each other.

[0017] The display device may further include a first organic layer covering the first anode electrode and the second anode electrode; a second organic layer disposed on the first organic layer and covering a portion of the second bonding electrode; and a third organic layer disposed on the second organic layer and covering a portion of the second light-emitting elements on which the second bonding electrode is not disposed.

[0018] The first bonding electrode may be electrically connected to the first anode electrode. The second bonding electrode is electrically connected to the second anode electrode. The first bonding electrode and the second bonding electrode have different shapes.

[0019] The second bonding electrode may surround the side of the second light-emitting elements when viewed in a planar manner.

[0020] According to one or more embodiments of the present disclosure, a method of manufacturing a display device may include: manufacturing a pixel circuit layer; and patterning a first anode electrode and a second anode electrode on the pixel circuit layer; transferring first light-emitting elements onto the first anode electrode and transferring second light-emitting elements onto the second anode electrode; patterning a first organic layer defining a hole exposing the second anode electrode; and patterning a first connection electrode, at least a portion of which is electrically connected to the first light-emitting elements and physically spaced from the second light-emitting elements, the first connection electrode being provided in the hole to form a contact portion and electrically connecting the first light-emitting elements and the second anode electrode through the contact portion; and manufacturing a light-emitting element layer disposed on the pixel circuit layer.

[0021] The step of manufacturing the light-emitting element layer may further include a step of forming an insulating layer covering the first connection electrode; and a step of patterning a second organic layer covering the insulating layer on the first organic layer.

[0022] The step of manufacturing the light emitting element layer may further include a step of removing a portion of the insulating layer overlapping the second light emitting elements without removing a portion of the insulating layer overlapping the first light emitting elements, thereby exposing at least a portion of the second light emitting elements.

[0023] The step of manufacturing the light emitting element layer may further include a step of patterning a second connection electrode electrically connected to at least a portion of the second light emitting elements exposed by the insulating layer.

[0024] According to one or more embodiments of the present disclosure, a display device and a method of manufacturing the display device can be provided that can reduce or prevent malfunctions of pixels (e.g., light-emitting elements), thereby reducing the need for a repair process and improving process efficiency.

[0025] The foregoing and other aspects of the present disclosure will become more apparent by describing embodiments in more detail with reference to the accompanying drawings, in which:

[0026] FIG. 1 is a schematic plan view illustrating a display device according to one or more embodiments.

[0027] FIG. 2 is a schematic cross-sectional view illustrating a display device according to one or more embodiments.

[0028] FIG. 3 is a schematic block diagram illustrating an electrical connection structure for a light-emitting element according to one or more embodiments.

[0029] FIGS. 4 and 5 are block diagrams schematically illustrating electrical connection structures related to light emitting units according to one or more embodiments.

[0030] FIGS. 6 and 7 are schematic cross-sectional views illustrating a display device according to one or more embodiments.

[0031] FIGS. 8 to 15 are schematic cross-sectional views illustrating process steps of a method for manufacturing a display device according to one or more embodiments.

[0032] Aspects of some embodiments of the present disclosure and methods for achieving them can be more readily understood by reference to the detailed description of the embodiments and the accompanying drawings. The described embodiments are provided by way of example to ensure that this disclosure is thorough and complete, and to fully convey the aspects of the present disclosure to those skilled in the art. Accordingly, processes, elements, and techniques that are redundant, unrelated, or irrelevant to the description of the embodiments, or that are not necessary for those skilled in the art to fully understand the aspects of the present disclosure, may be omitted. Unless otherwise stated, the same reference numbers, letters, or combinations thereof throughout the accompanying drawings and written description represent the same elements, and thus, repeated descriptions may be omitted.

[0033] The described embodiments are capable of various modifications and implementations in different forms, and should not be limited to the embodiments illustrated herein. The terms "may," "could," or "might" used when describing an embodiment refer to one or more embodiments of the present disclosure. This disclosure includes all modifications, equivalents, and alternatives within the scope of the invention and its spirit and technology. Furthermore, the individual features of the various embodiments of the present disclosure may be combined, partially or wholly, with one another, and various technically mutual combinations and operations are possible. Each embodiment may be implemented independently of the other or may be implemented in combination.

[0034] The relative sizes of elements, layers, and areas in the drawings may be exaggerated for clarity and illustrative purposes. Furthermore, the use of crosshatching and / or shading in the accompanying drawings generally serves to clarify boundaries between adjacent elements. Therefore, they do not convey or indicate any specific materials, material properties, dimensions, proportions, commonalities between drawing elements, or any other characteristics or properties of elements.

[0035] Various embodiments are illustrated schematically with reference to the drawings. For example, variations in the shape of the illustrations may be expected due to manufacturing techniques and tolerances. Furthermore, any specific structural or functional descriptions disclosed herein are merely examples for illustrating embodiments according to the concepts of the present disclosure. Accordingly, the embodiments disclosed herein are not limited to the depicted shapes of elements, layers, or regions, and include variations in shape due to manufacturing.

[0036] For example, the implant area depicted as a square typically has curved edges and / or a concentration gradient, and is not a binary transition from the implanted area to the non-implanted area. Similarly, the buried area formed by the implant may have some implantation occurring in the area between the buried area and the surface on which the implant is performed.

[0037] Spatially relative terms such as “below,” “under,” “lower,” “lowerside,” “above,” “upperside,” etc. are used for ease of description to describe the relationship of elements or features as depicted in the drawings. Spatially relative terms are intended to encompass other orientations when the device is used or operated, including orientations other than those depicted in the drawings. For example, if the device in the drawings is turned over, elements described as being “below” or “beneath” another element or feature are positioned “above” the other element or feature. Thus, example terms such as “below” and “below” can encompass both the up and down orientations. The device can also be positioned in other orientations (e.g., rotated 90 degrees or otherwise), and spatially relative terms should be interpreted accordingly. Similarly, if a first part is described as being positioned “above” a second part, this indicates that the first part is positioned above or below with respect to the direction of gravity.

[0038] Also, the phrase “in plan” means a top view of an object portion, and the phrase “in a schematic cross-section” means a side view of a vertical cross-section of an object portion. The terms “overlap” or “superimposed” mean that a first object can be above, below, or beside a second object, and vice versa. Furthermore, the term “overlap” can encompass a variety of situations, such as stacking, facing, opposing, extending, covering, or partially covering, and can include appropriate terms understood by a person skilled in the art. The term “non-overlap” can include “apart from,” “apart from,” or “offset,” and can also include appropriate equivalents understood by a person skilled in the art. The terms “face” and “facing” mean that a first object can directly or indirectly face a second object. When a third object is interposed between the first and second objects, the first and second objects can be understood as indirectly facing each other.

[0039] When an element, layer, region, or component is referred to as being “formed upon,” “over,” “connected to,” or “(operably or communicatively) coupled to” another element, layer, region, or component, it can be directly formed upon, overlying, connected to, or coupled to the other element, layer, region, or component, and there may be one or more intermediate elements, layers, regions, or components. Furthermore, it can encompass direct or indirect coupling or connection, and integral or non-integral coupling or connection. For example, when a layer, region, or component is referred to as being “electrically connected” or “electrically coupled” to another layer, region, or component, it can be directly electrically connected or coupled to the other layer, region, and / or component, and there may be one or more intermediate layers, regions, or components. Intermediate components may include switches, resistors, capacitors, etc. In describing embodiments, the term "connection" refers to an electrical connection unless explicitly described as a direct connection, and "directly connected / directly coupled" or "directly over" means that one component is directly connected to, coupled to, or over another component without any intermediate components.

[0040] Furthermore, when a part of a layer, film, region, plate, etc. is formed on another part in the present specification, the direction of formation is not limited to the upward direction, and also includes forming in the side or downward direction. Conversely, when a part of a layer, film, region, plate, etc. is formed “under” another part, this includes not only “directly under” but also cases where there is another part between them. Meanwhile, other expressions describing the relationship between components, such as “between,” “immediately between,” or “adjacent” and “directly adjacent,” may be interpreted similarly. When an element or layer is referred to as being “between two elements or layers,” it may be the only element or layer between the two elements or layers, or there may be one or more intermediate elements or layers.

[0041] For the purposes of this disclosure, when phrases such as “at least one,” “one or more,” or “one or more” precede a list of elements, they modify the list of elements as a whole and not individual elements. For example, phrases such as “at least one of X, Y, and Z,” “at least one of X, Y, or Z,” “at least one selected from the group consisting of X, Y, and Z,” and “at least one selected from the group consisting of X, Y, or Z” can include X alone, Y alone, Z alone, any combination of two or more of X, Y, and Z, for example, XYZ, XYY, YZ, and ZZ, or variations thereof. Similarly, phrases such as “at least one of A and B” and “at least one of A or B” can include A, B, or A and B. As used herein, “or” generally means “and / or,” and the term “and / or” includes any combination of one or more of the associated list items. For example, phrases such as “A and / or B” can include A, B, or A and B. Similarly, “at least one,” “a number of,” “one,” and other prepositional phrases modify the list of elements as a whole and do not modify individual elements.

[0042] Although the terms “first,” “second,” “third,” etc. may be used to describe various elements, components, regions, layers, and / or sections, such elements, components, regions, layers, and / or sections should not be limited by such terms. These terms do not imply any particular order, position, or precedence, but are used only to distinguish one element, member, component, region, layer, section, or portion from another element, member, component, region, layer, section, or portion. Thus, a first element, component, region, layer, or section described below could be termed a second element, component, region, layer, or section without departing from the spirit and scope of the present disclosure. Describing an element as a “first” element does not require or imply the presence of a second element or other elements. The terms “first,” “second,” etc. may also be used to distinguish different categories or sets of elements. For brevity, the terms “first,” “second,” etc. may represent “first category (or first set),” “second category (or second set),” etc., respectively.

[0043] In the examples, the x-axis, y-axis, and / or z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent directions other than orthogonal. The same applies to the first, second, and / or third directions.

[0044] The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a,” “an,” “an” and “the” include the plural unless the context clearly dictates otherwise, and the plural forms also include the singular. Furthermore, as used herein, the terms “comprises,” “comprising,” “has,” “having,” “includes,” and “comprising” specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups.

[0045] If one or more embodiments can be implemented differently, the order of specific processes may be performed differently from the order described. For example, two processes described in succession may be performed substantially simultaneously or in the reverse order described.

[0046] As used herein, the terms “substantially,” “about,” “approximately,” and similar terms are used as approximations, not as degrees of precision, and are used to describe inherent variations in measurements or calculations that would be recognizable by a person skilled in the art. For example, “substantially” can include a range of ±5% of the value. As used herein, “about” or “approximately” is inclusive of the stated value and means within an acceptable range of values ​​determined by a person skilled in the art to take into account the errors associated with the measurement (i.e., the limitations of the measurement system). For example, “about” can mean one or more standard deviations, or a range of ±30%, 20%, 10%, or 5% of the stated value. Furthermore, as used in describing embodiments of the present disclosure, “may” means “one or more embodiments of the present disclosure.”

[0047] In some embodiments, well-known structures and devices may be described in the accompanying drawings in terms of blocks (e.g., block diagrams), units, and / or modules to avoid unnecessarily obscuring various embodiments. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, line connections, and other electronic circuits. These may be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units, and / or modules implemented by microprocessors or other similar hardware may be programmed and controlled using software to perform various functions, and may be driven by firmware and / or software. Furthermore, each block, unit, and / or module may be implemented by dedicated hardware or a combination of dedicated hardware that performs some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) that performs other functions. Furthermore, in some embodiments, the blocks, units, and / or modules may be physically separated into two or more individual blocks, units, and / or modules that interact with each other without departing from the scope of the present disclosure. Additionally, in some embodiments, blocks, units and / or modules may be physically combined into more complex blocks, units and / or modules without departing from the scope of the present disclosure.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. Furthermore, terms defined in commonly used dictionaries have a consistent meaning within the context of the relevant technology and / or this specification, and should not be construed in an idealized or overly formal sense unless explicitly defined herein.

[0049] The present disclosure relates to a display device and a method for manufacturing the display device. Hereinafter, a display device and a method for manufacturing the display device according to one or more embodiments will be described with reference to the accompanying drawings.

[0050] FIG. 1 is a schematic plan view illustrating a display device according to one or more embodiments.

[0051] Referring to FIG. 1, the display device (DD) may include a base layer (BSL) and a pixel (PXL) disposed on the base layer (BSL) (herein, “disposed on” may mean “disposed above”). According to one or more embodiments, the display device (DD) may further include a driving circuit unit (e.g., a scan driving unit and a data driving unit), wires, and pads for driving the pixel (PXL).

[0052] A display device (DD) (or base layer (BSL)) may include a display area (DA) and a non-display area (NDA). The non-display area (NDA) may refer to an area outside the display area (DA). The non-display area (NDA) may surround at least a portion of the display area (DA) (e.g., when viewed in a plan view).

[0053] The base layer (BSL) may form the base surface of the display device (DD). The base layer (BSL) may be a rigid or flexible substrate or film. For example, the base layer (BSL) may include a glass material. Alternatively, the base layer (BSL) may include a silicon material. Alternatively, the base layer (BSL) may include polyimide. However, the present disclosure is not limited thereto.

[0054] The display area (DA) may refer to an area where pixels (PXL) are arranged. The non-display area (NDA) may refer to an area where pixels (PXL) are not arranged. In the non-display area (NDA), driving circuits, wires, and pads connected to the pixels (PXL) of the display area (DA) may be arranged.

[0055] According to one or more embodiments, a pixel (PXL) (or sub-pixels (SPX)) is a stripe or a pentile. TM )(PENTILE TM is a registered trademark of Samsung Display Co., Ltd. of the Republic of Korea) may be arranged according to the array structure, etc., but is not limited thereto, and various embodiments may be applied to the present disclosure.

[0056] According to one or more embodiments, a pixel (PXL) (or sub-pixels (SPX)) may include a first sub-pixel (SPX1), a second sub-pixel (SPX2), and a third sub-pixel (SPX3). The first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) may each be a sub-pixel. At least one of the first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) may form one pixel unit (PXU) capable of emitting light of various colors.

[0057] Each of the first sub-pixel (SPX1), the second sub-pixel (SPX2), and the third sub-pixel (SPX3) can emit light of one color.

[0058] For example, the first sub-pixel (SPX1) may be a red pixel for emitting red light (e.g., a first color), the second sub-pixel (SPX2) may be a green pixel for emitting green light (e.g., a second color), and the third sub-pixel (SPX3) may be a blue pixel for emitting blue light (e.g., a third color). The red pixel may provide light in a wavelength band of about 600 nm to about 750 nm. The green pixel may provide light in a wavelength band of about 480 nm to about 560 nm. The blue pixel may provide light in a wavelength band of about 370 nm to about 460 nm.

[0059] According to one or more embodiments, the number of second sub-pixels (SPX2) may be greater than the number of first sub-pixels (SPX1) and the number of third sub-pixels (SPX3). However, the color, type, and / or number of the first sub-pixels (SPX1), the second sub-pixels (SPX2), and the third sub-pixels (SPX3) forming each pixel unit (PXU) are not limited to a specific example.

[0060] FIG. 2 is a schematic cross-sectional view illustrating a display device according to one or more embodiments.

[0061] Referring to FIG. 2, the display device (DD) may include a pixel circuit layer (PCL), a light emitting element layer (LEL), and an upper layer (UPL).

[0062] The pixel circuit layer (PCL) may include a base layer (BSL) and a pixel circuit (PXC) (see, for example, FIG. 3).

[0063] The base layer (BSL) can form a base on which a pixel circuit (PXC) is arranged. The pixel circuit (PXC) can be arranged on the base layer (BSL) and can be configured to drive a light-emitting element (LD) (e.g., see FIG. 4). The pixel circuit layer (PCL) can include conductive layers and insulating layers, and the conductive layers can form the pixel circuit (PXC).

[0064] A light emitting element layer (LEL) may be disposed on a pixel circuit layer (PCL). The light emitting element layer (LEL) may include a light emitting element (LD). The light emitting element (LD) may include an inorganic light emitting diode including an inorganic material. For example, the light emitting element (LD) may include a micro LED (Light Emitting Diode).

[0065] The upper layer (UPL) may be disposed on the light-emitting element layer (LEL). The upper layer (UPL) may be light-transmitting. According to one or more embodiments, the upper layer (UPL) may include a cover window. The upper layer (UPL) may include a color filter and may also include an upper substrate, etc. However, the present disclosure is not limited to specific examples.

[0066] FIG. 3 is a schematic block diagram illustrating an electrical connection structure for a light-emitting element according to one or more embodiments. For example, FIG. 3 may illustrate an electrical connection structure including a pixel circuit (PXC) corresponding to each sub-pixel (SPX). FIG. 3 illustrates a light-emitting unit (EMU) including a light-emitting element (LD). The description of the light-emitting unit (EMU) in FIG. 3 may be similarly applied to the light-emitting element (LD).

[0067] Referring to FIG. 3, a display device (DD) (e.g., a sub-pixel (SPX)) may include a pixel circuit (PXC) configured to drive a light-emitting element (LD) of a light-emitting unit (EMU), a scan line (SL), a data line (DL), a first power line (PL1), a second power line (PL2), a first electrode (ELT1), and a second electrode (ELT2).

[0068] A pixel circuit (PXC) may include one or more circuit elements. For example, the pixel circuit (PXC) may include a driving transistor, a switching transistor, and a storage capacitor. However, the present disclosure is not necessarily limited thereto.

[0069] The pixel circuit (PXC) may be electrically connected to a scan line (SL) and a data line (DL). The scan line (SL) may supply a scan signal to the pixel circuit (PXC) and may be electrically connected to a gate electrode of a switching transistor of the pixel circuit (PXC) according to one or more embodiments. The light-emitting element (LD) may be configured to emit light corresponding to a data signal provided from the data line (DL).

[0070] The pixel circuit (PXC) may be electrically connected to a first power line (PL1) and a second power line (PL2). For example, the first electrode (ELT1) may be electrically connected to the pixel circuit (PXC) and the first power line (PL1). The second electrode (ELT2) may be electrically connected to the second power line (PL2). The first power line (PL1) and the second power line (PL2) may be disposed on the base layer (BSL) and may be included in the pixel circuit layer (PCL) according to one or more embodiments.

[0071] The power of the first power line (PL1) and the power of the second power line (PL2) may have different potentials. For example, the power of the first power line (PL1) may be a high-potential pixel power from the first voltage potential (VDD), and the power of the second power line (PL2) may be a low-potential pixel power from the second voltage potential (VSS). The potential difference between the power of the first power line (PL1) and the power of the second power line (PL2) may be set to be equal to or higher than the threshold voltage of the light-emitting elements (LD).

[0072] A first power line (PL1) may be electrically connected to a pixel circuit (PXC) (e.g., a driving transistor). A second power line (PL2) may be electrically connected to a cathode electrode (e.g., a second electrode (ELT2)) of a light emitting element (LD). According to one or more embodiments, the second power line (PL2) may be electrically connected to the second electrode (ELT2).

[0073] Each of the light emitting elements (LD) included in the light emitting unit (EMU) can be connected in a forward direction between a first power line (PL1) and a second power line (PL2) to form each effective light source. These effective light sources can be gathered to form the light emitting elements (LD) of a sub-pixel (SPX).

[0074] The light-emitting elements (LD) can emit light with a brightness corresponding to the driving current supplied through the pixel circuit (PXC). During each frame period, the pixel circuit (PXC) can supply a driving current corresponding to a data signal to the light-emitting elements (LD). The light-emitting elements (LD) can emit light with a brightness corresponding to the current flowing therethrough.

[0075] Hereinafter, with reference to FIGS. 4 to 7, a display device (DD) including an emission unit (EMU) including a serial / parallel structure according to one or more embodiments will be described. Content that may overlap with the above will be briefly described or not repeated.

[0076] FIGS. 4 and 5 are block diagrams schematically illustrating electrical connection structures related to light emitting units according to one or more embodiments.

[0077] Referring to FIGS. 4 and 5, the light emitting unit (EMU) may include a plurality of light emitting elements (LD) that are electrically connected to each other in a serial configuration. The light emitting unit (EMU) may include a plurality of light emitting elements (LD) that are electrically connected to each other in a parallel configuration. The light emitting unit (EMU) may include a plurality of light emitting elements (LD) that are electrically connected to each other in a series / parallel configuration.

[0078] The light emitting unit (EMU) may include a first anode electrode (AE1), a second anode electrode (AE2), a first connection electrode (COE1), and a second connection electrode (COE2) electrically connected to a plurality of light emitting elements (LD).

[0079] A plurality of light-emitting elements (LD) may be electrically connected between a first electrode (ELT1) and a second electrode (ELT2). The plurality of light-emitting elements (LD) may include first light-emitting elements (LD1) and second light-emitting elements (LD2).

[0080] For convenience of explanation, the description will be based on an embodiment in which a plurality of light-emitting elements (LD) include two parallel structures electrically connected in series to each other, including first light-emitting elements (LD1) and second light-emitting elements (LD2).

[0081] However, the number of parallel structures including a plurality of light-emitting elements (LD) is not limited thereto. For example, third light-emitting elements electrically connected to the second light-emitting elements (LD) may be further included.

[0082] The first anode electrode (AE1) may be electrically connected to the first electrode (ELT1). The first anode electrode (AE1) may be an anode for the first light-emitting element (LD1).

[0083] The first light-emitting elements (LD1) can be electrically connected in parallel with each other. The first light-emitting elements (LD1) can be electrically connected in series with the second light-emitting elements (LD2).

[0084] The first connecting electrode (COE1) can be electrically connected to the first light-emitting elements (LD1). The first connecting electrode (COE1) can be electrically connected to the second anode electrode (AE2).

[0085] The second anode electrode (AE2) may be electrically connected to the first light-emitting elements (LD1). The second anode electrode (AE2) may be an anode for the second light-emitting element (LD2).

[0086] The second light-emitting elements (LD2) can be electrically connected in parallel with each other. The second light-emitting elements (LD2) can be electrically connected in series with the first light-emitting elements (LD1).

[0087] The second connecting electrode (COE2) can be electrically connected to the second light-emitting elements (LD2). The second connecting electrode (COE2) can be electrically connected to the second electrode (ELT2).

[0088] Accordingly, the light emitting unit (EMU) can form one sub-pixel (SPX), and the electrical signal supplied by the pixel circuit (PXC) can be supplied to the first and second light emitting elements (LD1, LD2). In addition, due to the series / parallel structure according to one or more embodiments, even if the first light emitting elements (LD1) do not operate normally, the second light emitting elements (LD2) can operate normally, and even if the second light emitting elements (LD2) do not operate normally, the first light emitting elements (LD1) can operate normally.

[0089] According to one or more embodiments, malfunctions of light-emitting elements (LD) and the like can be prevented, and thus the risk of abnormal operation of pixels can be reduced. For example, in a sub-pixel (SPX), when a plurality of light-emitting elements (LD) are all arranged on a single anode, if a short-circuit defect occurs in any one of the light-emitting elements (LD), it may be difficult for all light-emitting elements (LD) on the corresponding anode to normally emit light.

[0090] However, according to one or more embodiments, as described above, the first anode electrode (AE1) and the second anode electrode (AE2) may be provided separately. The first light-emitting elements (LD1) and the second light-emitting elements (LD2) may be provided on the first anode electrode (AE1) and the second anode electrode (AE2), respectively. Accordingly, malfunctions of the sub-pixel (SPX) (e.g., the light-emitting element (LD)) and the like may be reduced or prevented.

[0091] For example, if a malfunction occurs in a sub-pixel (SPX), a separate repair process may be performed, which may complicate the process operation and increase the process cost. However, the risk of a malfunction in the sub-pixel (SPX) may be reduced, which may have the effect of reducing the process cost.

[0092] Next, with reference to FIGS. 6 and 7, a cross-sectional structure of a display device (DD) according to one or more embodiments will be described. FIGS. 6 and 7 are schematic cross-sectional views illustrating a display device according to one or more embodiments. Any content that may overlap with the above will be briefly described or not repeated.

[0093] First, a display device (DD) according to one or more embodiments will be described with reference to FIG. 6. FIG. 6 illustrates a display device (DD) according to one or more embodiments.

[0094] According to one or more embodiments, the pixel circuit layer (PCL) may include a base layer (BSL), a pixel circuit (PXC) disposed on the base layer (BSL), a first power line (PL1), and a second power line (PL2).

[0095] A first power line (PL1) is electrically connected to a pixel circuit (PXC) and can supply power of a first voltage potential (VDD) to the pixel circuit (PXC). A second power line (PL2) can be separated from the first power line (PL1) and can supply power of a second voltage potential (VSS) to a second electrode (ELT2).

[0096] The light emitting element layer (LEL) may include a first electrode (ELT1), a second electrode (ELT2), and a light emitting unit (EMU) electrically connected between the first and second electrodes (ELT1, ELT2). The light emitting element layer (LEL) (or light emitting unit (EMU)) may include a first anode electrode (AE1), a second anode electrode (AE2), a first connection electrode (COE1), and a second connection electrode (COE2). The light emitting element layer (LEL) may include a first organic layer (OL1), an insulating layer (INF), and a second organic layer (OL2).

[0097] The first electrode (ELT1) and the second electrode (ELT2) may be disposed on the pixel circuit layer (PCL). According to one or more embodiments, the first electrode (ELT1) and the second electrode (ELT2) may be patterned within the same process and may include the same material. For example, the first electrode (ELT1) and the second electrode (ELT2) may be formed within the same deposition process.

[0098] The first electrode (ELT1) and the second electrode (ELT2) may include a conductive material and may be electrically connected to another layer within the pixel circuit layer (PCL) via a contact structure. For example, the first electrode (ELT1) may be electrically connected to the pixel circuit (PXC), and the second electrode (ELT2) may be electrically connected to the second power line (PL2).

[0099] The first anode electrode (AE1) and the second anode electrode (AE2) may be disposed on the pixel circuit layer (PCL). According to one or more embodiments, the first anode electrode (AE1) and the second anode electrode (AE2) may be patterned within the same process and may include the same material. For example, the first anode electrode (AE1) and the second anode electrode (AE2) may be formed within the same deposition process.

[0100] The first and second electrodes (ELT1, ELT2) and the first and second anode electrodes (AE1, AE2) may be patterned within the same process and may comprise the same material.

[0101] According to one or more embodiments, the first anode electrode (AE1) may be formed integrally with the first electrode (ELT1). For example, a portion of the electrode layer patterned on the pixel circuit layer (PCL) may be the first electrode (ELT1), and another portion may be the first anode electrode (AE1).

[0102] The first light-emitting elements (LD1) may be disposed on the first anode electrode (AE1). The first light-emitting elements (LD1) may be in contact with the first anode electrode (AE1). For example, the first light-emitting elements (LD1) may be disposed on the same first anode electrode (AE1) and may emit light based on the same electrical signal.

[0103] The second light-emitting elements (LD2) may be disposed on the second anode electrode (AE2). The second light-emitting elements (LD2) may be in contact with the second anode electrode (AE2). For example, the second light-emitting elements (LD2) may be disposed on the same second anode electrode (AE2) and may emit light based on the same electrical signal.

[0104] According to one or more embodiments, a light emitting element (LD) may include a first semiconductor layer (SCL1), a second semiconductor layer (SCL2), an active layer (AL), an element insulating layer (EINF), and a bonding electrode (BE). The light emitting element (LD) may include a first end (EP1) adjacent to the first semiconductor layer (SCL1) and a second end (EP2) adjacent to the second semiconductor layer (SCL2).

[0105] The light emitting diode (LD) can be manufactured based on an epitaxial process and an etching process performed on a separate wafer, and can be transferred onto a pixel circuit layer (PCL) by various methods.

[0106] The light emitting elements (LD) can be aligned vertically on the first and second anode electrodes (AE1, AE2). For example, the direction from the first end (EP1) to the second end (EP2) can correspond to the thickness direction of the base layer (BSL).

[0107] The light emitting elements (LD) may have various shapes. For example, the light emitting elements (LD) may have a trapezoidal cross-section. The cross-sectional area at the first end (EP1) of the light emitting elements (LD) may be smaller than the cross-sectional area at the second end (EP2). However, the present disclosure is not limited to a particular example. According to one or more embodiments, the light emitting elements (LD) may have a columnar shape extending in one direction.

[0108] The light emitting device (LD) may have various sizes. For example, the light emitting device (LD) may have a nanoscale or microscale size. However, the present disclosure is not limited thereto.

[0109] The first semiconductor layer (SCL1) may include a first conductivity type semiconductor. The first semiconductor layer (SCL1) is disposed on the active layer (AL) and may include a semiconductor layer of a different type from the second semiconductor layer (SCL2). For example, the first semiconductor layer (SCL1) may include a P-type semiconductor layer. For example, the first semiconductor layer (SCL1) may include one or more semiconductor materials selected from the group consisting of InAlGaN, GaN, AlGaN, InGaN, AlN, or InN, and may include a P-type semiconductor layer doped with a first conductivity type dopant such as Ga, B, or Mg. However, the present disclosure is not limited to the examples described above. The first semiconductor layer (SCL1) may include various materials.

[0110] The first semiconductor layer (SCL1) may be adjacent to the bonding electrode (BE) and may face the first anode electrode (AE1).

[0111] According to one or more embodiments, the first semiconductor layer (SCL1) may include a first-first semiconductor layer (SCL1-1) included in the first light-emitting elements (LD1) and a first-second semiconductor layer (SCL1-2) included in the second light-emitting elements (LD2).

[0112] The active layer (AL) may be positioned between the second semiconductor layer (SCL2) and the first semiconductor layer (SCL1). The active layer (AL) may include a single-quantum well or multi-quantum well structure. The position of the active layer (AL) is not limited to a specific example and may vary depending on the type of light-emitting device (LD).

[0113] A cladding layer doped with a conductive dopant may be formed on one side and / or the other side of the active layer (AL). For example, the cladding layer may include one or more of AlGaN or InAlGaN. However, the present disclosure is not limited to the examples described above.

[0114] According to one or more embodiments, the active layer (AL) may include a first active layer (AL1) included in the first light-emitting elements (LD1) and a second active layer (AL2) included in the second light-emitting elements (LD2).

[0115] The second semiconductor layer (SCL2) may include a second conductivity type semiconductor. The second semiconductor layer (SCL2) is disposed on the active layer (AL) and may include a semiconductor layer of a different type from the first semiconductor layer (SCL1). For example, the second semiconductor layer (SCL2) may include an N-type semiconductor layer. For example, the second semiconductor layer (SCL2) may include at least one selected from the group consisting of InAlGaN, GaN, AlGaN, InGaN, AlN, or InN, and may include an N-type semiconductor layer doped with a second conductivity type dopant such as Si, Ge, or Sn. However, the present disclosure is not limited to the examples described above. The second semiconductor layer (SCL2) may include various materials.

[0116] The second semiconductor layer (SCL2) may be adjacent to the first connection electrode (COE1) or the second connection electrode (COE2) and may face the first connection electrode (COE1) or the second connection electrode (COE2).

[0117] According to one or more embodiments, the second semiconductor layer (SCL2) may include a second-first semiconductor layer (SCL2-1) included in the first light-emitting elements (LD1) and a second-second semiconductor layer (SCL2-2) included in the second light-emitting elements (LD2).

[0118] The light emitting element (LD) can be electrically connected to the first and second anode electrodes (AE1, AE2) via the first end (EP1) (e.g., the bonding electrode (BE)). The light emitting element (LD) can be electrically connected to the first connection electrode (COE1) or the second connection electrode (COE2) via the second end (EP2).

[0119] When a voltage higher than the threshold voltage is applied to the first end (EP1) and the second end (EP2) of the light-emitting element (LD), electron-hole pairs in the active layer (AL) can recombine with each other, and the light-emitting element (LD) can emit light. By controlling the light emission of the light-emitting element (LD) using this principle, the light-emitting element (LD) can be used as a light source in various devices.

[0120] The bonding electrode (BE) may be patterned to be placed on the first semiconductor layer (SCL1) when manufacturing the light-emitting elements (LD). The bonding electrode (BE) may be a layer for transferring the light-emitting elements (LD) onto the first and second anode electrodes (AE1, AE2).

[0121] For example, light-emitting elements (LD) may be placed on the first and second anode electrodes (AE1, AE2) such that the bonding electrode (BE) faces the first and second anode electrodes (AE1, AE2), and heat may be applied to the bonding electrode (BE), so that the light-emitting elements (LD) and the first and second anode electrodes (AE1, AE2) may be bonded to each other.

[0122] The bonding electrode (BE) may include various conductive materials. The bonding electrode (BE) may include a first bonding electrode (BE1) included in the first light-emitting elements (LD1) and a second bonding electrode (BE2) included in the second light-emitting elements (LD2).

[0123] An element insulating layer (EINF) can be disposed on the outer surfaces of the first semiconductor layer (SCL1), the active layer (AL), and the second semiconductor layer (SCL2). The element insulating layer (EINF) can surround the outer surface of the active layer (AL), and in addition, can further surround a portion of each of the first semiconductor layer (SCL1) and the second semiconductor layer (SCL2). The element insulating layer (EINF) can have a single-layer or multi-layer structure. The element insulating layer (EINF) can expose each of the first end (EP1) and the second end (EP2) of the light-emitting element (LD) having different polarities.

[0124] According to one or more embodiments, the element insulating layer (EINF) may include one or more of the group consisting of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlxOy), or titanium oxide (TiOx), but is not limited to the examples described above in the present disclosure.

[0125] The element insulating layer (EINF) may include a first element insulating layer (EINF1) included in the first light-emitting elements (LD1) and a second element insulating layer (EINF2) included in the second light-emitting elements (LD2).

[0126] The first organic layer (OL1) may be disposed on the pixel circuit layer (PCL). The first organic layer (OL1) may cover the first and second anode electrodes (AE1, AE2). The first organic layer (OL1) may fill the space between the light-emitting elements (LD). The first organic layer (OL1) may surround the contact portion (CNP) and the area where the first and second light-emitting elements (LD1, LD2) are disposed.

[0127] The first organic layer (OL1) may be a first via layer. The first organic layer (OL1) may include an organic material. For example, the first organic layer (OL1) may include one or more of the group consisting of acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin. However, the present disclosure is not limited thereto.

[0128] The first organic layer (OL1) can electrically isolate the first anode electrode (AE1) and the first connection electrode (COE1). Accordingly, the second end (EP2) of the first light-emitting elements (LD1) can be electrically connected to the second anode electrode (AE2) through the first connection electrode (COE1) and the contact portion (CNP).

[0129] A contact portion (CNP) may be formed in the first organic layer (OL1). The contact portion (CNP) is manufactured in the same process as the first connection electrode (COE1), penetrates the first organic layer (OL1), and can electrically connect the first connection electrode (COE1) and the second anode electrode (AE2).

[0130] A first connection electrode (COE1) may be disposed on the first light-emitting elements (LD1) and the first organic layer (OL1). The first connection electrode (COE1) may be electrically connected to the second end (EP2) of the first light-emitting elements (LD1) and may be electrically separated from the second light-emitting elements (LD2) so as to not overlap with the second light-emitting elements (LD2) when viewed in a plan view. The first connection electrode (COE1) may be electrically connected to the second anode electrode (AE2) through the contact portion (CNP).

[0131] The first connecting electrode (COE1) may be patterned after the light-emitting elements (LD) are transferred onto the first and second anode electrodes (AE1, AE2). The first connecting electrode (COE1) may be an intermediate electrode for electrically connecting the first and second light-emitting elements (LD1, LD2) in series with each other.

[0132] The first connection electrode (COE1) may include a conductive material. According to one or more embodiments, the first connection electrode (COE1) may include a transparent conductive material. For example, the first connection electrode (COE1) may include one or more of the group consisting of silver nanowire (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotube (CNT), or graphene.

[0133] An insulating layer (INF) may be disposed on the first connection electrode (COE1), the first organic layer (OL1), and the first and second light-emitting elements (LD1, LD2). The insulating layer (INF) may cover the first connection electrode (COE1) and may cover a side surface of each of the second light-emitting elements (LD2).

[0134] The insulating layer (INF) may include an inorganic material. For example, the insulating layer (INF) may include one or more of the group consisting of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), aluminum oxide (AlxOy), and titanium oxide (TiOx), but is not limited to the examples described above in the present disclosure.

[0135] The insulating layer (INF) may be a protective layer for the first connection electrode (COE1). For example, the insulating layer (INF) may cover the upper surface of the first connection electrode (COE1), and the risk of the first connection electrode (COE1) being damaged by an etchant or the like during an etching process for patterning the second connection electrode (COE2) may be reduced.

[0136] The second organic layer (OL2) may be disposed on the pixel circuit layer (PCL). The second organic layer (OL2) may cover the insulating layer (INF). The second organic layer (OL2) may fill the space between the light-emitting elements (LD).

[0137] The second organic layer (OL2) may be a planarization layer. The second organic layer (OL2) may include an organic material. For example, the second organic layer (OL2) may include one or more of the group consisting of acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin. However, the present disclosure is not limited thereto.

[0138] The second organic layer (OL2) can expose the second ends (EP2) of the second light-emitting elements (LD2). The second organic layer (OL2) can reduce the step difference between the components of the second organic layer (OL2) and the pixel circuit layer (PCL), thereby allowing the second connection electrode (COE2) to be suitably patterned.

[0139] The second connection electrode (COE2) may be disposed on the second light-emitting elements (LD2) and the second organic layer (OL2). The second connection electrode (COE2) may be electrically connected to the second end (EP2) of the second light-emitting elements (LD2). According to one or more embodiments, the second connection electrode (COE2) may not overlap with the first light-emitting elements (LD1) when viewed in a plan view. The second connection electrode (COE2) may be electrically connected to the second electrode (ELT2).

[0140] The second connection electrode (COE2) may be patterned after the second organic layer (OL2) is manufactured. The second connection electrode (COE2) may be an intermediate electrode for electrically connecting the first and second light-emitting elements (LD1, LD2) in series with the second electrode (ELT2).

[0141] The second connection electrode (COE2) may include a conductive material. According to one or more embodiments, the second connection electrode (COE2) may include a transparent conductive material. For example, the second connection electrode (COE2) may include one or more of the group consisting of silver nanowire (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotube (CNT), or graphene.

[0142] According to one or more embodiments, a light emitting unit (EMU) can form a sub-pixel (SPX). In addition, an electrical structure in which the light emitting elements (LD) are electrically connected in series / parallel can be implemented as a structure in which the light emitting elements (LD) are aligned vertically. In this case, the risk of defects in the sub-pixels (SPX) can be significantly reduced.

[0143] Next, a display device (DD) according to one or more embodiments will be described with reference to FIG. 7. FIG. 7 illustrates a display device (DD) according to one or more embodiments.

[0144] A display device (DD) according to one or more embodiments differs from the display device (DD) according to one or more embodiments described above in that the first connection electrode (COE1) is electrically connected to the second light-emitting elements (LD2) via the second bonding electrode (BE2).

[0145] According to one or more embodiments, the first bonding electrode (BE1) and the second bonding electrode (BE2) may have different shapes. For example, the first bonding electrode (BE1) may have a generally flat shape, and the second bonding electrode (BE2) may have a shape corresponding to a shape of a second element insulating layer (EINF2) of a corresponding second light-emitting element (LE2). The second bonding electrode (BE2) may surround a side of the second light-emitting element (LD2) (e.g., when viewed in plan view) and may be formed to correspond to a side shape of the second light-emitting element (LD2). For example, at least a portion of the second bonding electrode (BE2) may be electrically connected to the first-second semiconductor layer (SCL1-2), while another portion of the second bonding electrode (BE2) may be disposed on the second element insulating layer (EINF2).

[0146] According to one or more embodiments, the first connection electrode (COE1) may be electrically connected to the second bonding electrode (BE2). For example, the first connection electrode (COE1) may be physically spaced apart from the second anode electrode (AE2) and may be in contact with the second bonding electrode (BE2). Accordingly, an electrical signal provided from the pixel circuit (PXC) may be provided to each of the second light-emitting elements (LD2) through the first connection electrode (COE1) and the second bonding electrode (BE2).

[0147] According to one or more embodiments, the light emitting element layer (LEL) may further include a third organic layer (OL3). The third organic layer (OL3) may be disposed on the second organic layer (OL2) and may include one or more of the organic materials described above with reference to the second organic layer (OL2). The third organic layer (OL3) may cover the side of the second light emitting elements (LD2) on which the second bonding electrodes (BE2) are not disposed.

[0148] The third organic layer (OL3) may electrically isolate the first connection electrode (COE1) and the second bonding electrode (BE2) from the second connection electrode (COE2). For example, at least a portion of the third organic layer (OL3) may be disposed between the first connection electrode (COE1) / second bonding electrode (BE2) and the second connection electrode (COE2).

[0149] Since the first connection electrode (COE1) is electrically connected to the second bonding electrode (BE2) rather than the first anode electrode (AE1), the need for a portion of the first anode electrode (AE1) to be electrically connected to the first connection electrode (COE1) can be reduced. In this case, since the area of ​​the first anode electrode (AE1) can be efficiently utilized, process convenience is improved, and the area where the second light-emitting elements (LD2) can be arranged can be secured more widely.

[0150] Next, with reference to FIGS. 8 to 15, a method for manufacturing a display device (DD) according to one or more embodiments will be described. Content that may overlap with the above will be briefly described or not repeated.

[0151] FIGS. 8 to 15 are schematic cross-sectional views illustrating process operations for manufacturing a display device according to one or more embodiments. For convenience of explanation, FIGS. 8 to 15 are described based on one or more embodiments described above with reference to FIG. 6.

[0152] Referring to FIG. 8, a pixel circuit layer (PCL) can be manufactured, and a first electrode (ELT1), a second electrode (ELT2), a first anode electrode (AE1), and a second anode electrode (AE2) can be patterned on the pixel circuit layer (PCL).

[0153] According to one or more embodiments, a pixel circuit layer (PCL) may be manufactured by patterning a conductive layer and an insulating layer on a base layer (BSL). According to one or more embodiments, the conductive layer or the insulating layer on the base layer (BSL) may be formed based on a conventional process for manufacturing a semiconductor device. For example, the conductive layer or the insulating layer on the base layer (BSL) may be formed by a photolithography process, etched by various methods (wet etching, dry etching, etc.), or deposited by various methods (sputtering, chemical vapor deposition, etc.). The present disclosure is not necessarily limited to specific examples.

[0154] In this operation, first and second power lines (PL1, PL2) and pixel circuits (PXC) can be patterned on a base layer (BSL).

[0155] In this operation, first and second electrodes (ELT1, ELT2) and first and second anode electrodes (AE1, AE2) can be patterned. As described above, according to one or more embodiments, the first anode electrode (AE1) and the first electrode (ELT1) can be formed integrally. Accordingly, the first and second anode electrodes (AE1, AE2) that are spaced apart from each other can be provided.

[0156] In this operation, the first electrode (ELT1) can be electrically connected to the pixel circuit (PXC1), and the second electrode (ELT2) can be electrically connected to the second power line (PL2).

[0157] Referring to FIG. 9, light emitting elements (LD) can be transferred onto a pixel circuit layer (PCL).

[0158] In this operation, the light emitting elements (LD) can be transferred onto the pixel circuit layer (PCL) such that the first end (EP1) faces the first and second anode electrodes (AE1, AE2). For example, the first and second bonding electrodes (BE1, BE2) can be disposed on the first and second anode electrodes (AE1, AE2), respectively, and a thermal melting process or the like can be performed to bond the first and second bonding electrodes (BE1, BE2) to the first and second anode electrodes (AE1, AE2). However, the present disclosure is not limited thereto, and the light emitting elements (LD) can be transferred by various methods.

[0159] In this operation, the first light-emitting elements (LD1) can be electrically connected to the first anode electrode (AE1), and the second light-emitting elements (LD2) can be electrically connected to the second anode electrode (AE2).

[0160] Referring to FIG. 10, a first organic layer (OL1) can be patterned on a pixel circuit layer (PCL).

[0161] In this operation, the first organic layer (OL1) can cover a side surface (e.g., a portion of the side surface) of each of the first and second light-emitting elements (LD1, LD2) and fill a space between the light-emitting elements (LD). The first organic layer (OL1) can cover a side surface of the first and second bonding electrodes (BE1, BE2).

[0162] In this operation, the first organic layer (OL1) can form a hole (H) that exposes the second anode electrode (AE2).

[0163] Referring to FIG. 11, the first connection electrode (COE1) can be patterned.

[0164] In this operation, the first connection electrode (COE1) can be electrically connected to the second ends (EP2) of the first light-emitting elements (LD1). In addition, a conductive material formed (e.g., deposited) in the same process as the first connection electrode (COE1) can be provided in the hole (H) to form a contact portion (CNP). Accordingly, in this operation, the first light-emitting elements (LD1) can be electrically connected to the second anode electrode (AE2) through the first connection electrode (COE1) and the contact portion (CNP).

[0165] In this operation, the first connecting electrode (COE1) can be patterned so as not to overlap the second light-emitting elements (LD2) when viewed in a plane.

[0166] Referring to FIG. 12, the insulating layer (INF) can be patterned.

[0167] In this operation, the insulating layer (INF) can cover the first connection electrode (COE1). In addition, the insulating layer (INF) can cover at least a portion of the second light-emitting elements (LD2). Accordingly, the insulating layer (INF) can suitably passivate the first connection electrode (COE1), and the risk of damage to the first connection electrode (COE1) can be reduced.

[0168] Referring to FIG. 13, a second organic layer (OL2) can be patterned on the first organic layer (OL1) and the insulating layer (INF).

[0169] In this operation, the second organic layer (OL2) can cover the sides of each of the first and second light-emitting elements (LD1, LD2) and fill the space between the light-emitting elements (LD). Accordingly, the second organic layer (OL2) can alleviate the step difference formed by other configurations.

[0170] Referring to FIG. 14, at least a portion of the insulating layer (INF) may be etched to expose the second ends (EP2) of the second light-emitting elements (LD2).

[0171] In this operation, a part of the insulating layer (INF) on the first light-emitting elements (LD1) may not be removed, and another part of the insulating layer (INF) on the second light-emitting elements (LD2) may be removed.

[0172] Referring to FIG. 15, the second connecting electrode (COE2) can be patterned.

[0173] In this operation, the second connection electrode (COE2) may be electrically connected to the second ends (EP2) of the second light-emitting elements (LD2). In addition, the second connection electrode (COE2) may be electrically connected to the second electrode (ELT2). Accordingly, in this operation, a series / parallel electrical connection structure between the first and second light-emitting elements (LD1, LD2) may be defined between the first and second electrodes (ELT1, ELT2).

[0174] Thereafter, a step of forming an upper layer (UPL) on the light emitting element layer (LEL) according to one or more embodiments may be further performed, so that a display device (DD) according to one or more embodiments may be provided.

[0175] While the present disclosure has been described with reference to one or more embodiments as described above, those skilled in the art or having general knowledge will appreciate that the present disclosure can be variously modified and altered without departing from the spirit and scope of the present disclosure as set forth in the claims below.

[0176] Accordingly, the technical scope of the present disclosure should not be limited to what is described in the detailed description of the specification, but should be defined by the claims, and should also include corresponding functional equivalents.

Claims

1. A pixel circuit layer including a pixel circuit arranged on a base layer; and A light emitting element layer including a light emitting unit disposed on the pixel circuit layer and including a first anode electrode, a first connecting electrode, a second anode electrode, first light emitting elements disposed on the first anode electrode, and second light emitting elements disposed on the second anode electrode; The above first light-emitting elements and the above second light-emitting elements include a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer. The first connecting electrode electrically connects the first end of the first light-emitting elements and the second anode electrode so that the first light-emitting elements and the second light-emitting elements are electrically connected in series. Display device.

2. In paragraph 1, The above first light-emitting elements and the above second light-emitting elements are electrically connected in series, Display device.

3. In paragraph 1, The first light-emitting elements and the second light-emitting elements collectively comprise one sub-pixel. Display device.

4. In paragraph 1, The light emitting element layer further includes a first electrode and a second electrode, The pixel circuit layer further includes a first power line electrically connected to the first electrode and a second power line electrically connected to the second electrode. Display device.

5. In paragraph 4, The above first electrode and the above first anode electrode are integral, Display device.

6. In paragraph 1, The first light-emitting element further includes a first bonding electrode adjacent to the first end and electrically connected to the first anode electrode, The second light-emitting element further comprises a second bonding electrode adjacent to the first end and electrically connected to the second anode electrode. Display device.

7. In paragraph 1, The first light-emitting element and the second light-emitting element have a trapezoidal cross-section. Display device.

8. In paragraph 1, Further comprising a first organic layer covering the first anode electrode and the second anode electrode; The first connecting electrode is electrically connected to the second anode electrode through a contact portion penetrating the first organic layer. Display device.

9. In paragraph 8, Further comprising a second organic layer disposed on the first organic layer, forming a flat structure; Display device.

10. In paragraph 1, The first connecting electrode, when viewed in a plane, does not overlap with the second light-emitting elements and includes an electrical path between the first light-emitting elements and the second light-emitting elements. Display device.

11. In paragraph 1, An insulating layer further comprising: an insulating layer covering parts of side surfaces of each of the first light-emitting elements and the second light-emitting elements, and covering the second ends of the first light-emitting elements but not covering the second ends of the second light-emitting elements; Display device.

12. In paragraph 4, A second connecting electrode electrically connecting the second end of the second light-emitting elements and the second electrode; further comprising: Display device.

13. Base layer and pixel circuit on the base layer; A first electrode, a first anode electrode, a second anode electrode, and a second electrode electrically connected to the first electrode, the first electrode being disposed on the base layer and disposed in the same layer as each other; Light-emitting elements each including a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer, wherein the light-emitting elements include first light-emitting elements disposed on the first anode electrode and including a first bonding electrode, and second light-emitting elements disposed on the second anode electrode and including a second bonding electrode; A first connecting electrode electrically connecting the first end of the first light-emitting elements and the second bonding electrode; and A second connecting electrode electrically connecting the first end of the second light-emitting elements and the second electrode; The first connecting electrode and the second anode electrode are physically separated from each other. Display device.

14. In paragraph 13, A first organic layer covering the first anode electrode and the second anode electrode; A second organic layer disposed on the first organic layer and covering portions of the second bonding electrode; and A third organic layer disposed on the second organic layer and covering the side of the second light-emitting elements where the second bonding electrode is not disposed; further comprising: Display device.

15. In paragraph 13, The first bonding electrode is electrically connected to the first anode electrode, The above second bonding electrode is electrically connected to the second anode electrode, The first bonding electrode and the second bonding electrode have different shapes. Display device.

16. In paragraph 15, The second bonding electrode surrounds the side of the second light-emitting elements when viewed in a planar manner. Display device.

17. A step of manufacturing a pixel circuit layer; and A step of manufacturing a light emitting element layer disposed on the pixel circuit layer; including; The step of manufacturing the above light-emitting element layer is: A step of patterning a first anode electrode and a second anode electrode on the pixel circuit layer; A step of transferring first light-emitting elements onto the first anode electrode and transferring second light-emitting elements onto the second anode electrode; A step of patterning a first organic layer including a hole exposing the second anode electrode; and A step of patterning a first connecting electrode, at least some of which is electrically connected to the first light-emitting elements and physically separated from the second light-emitting elements; The first connecting electrode is provided in the hole to form a contact portion, and electrically connects the first light-emitting elements and the second anode electrode through the contact portion. A method for manufacturing a display device.

18. In paragraph 17, The step of manufacturing the light-emitting element layer further includes the step of forming an insulating layer covering the first connection electrode; and the step of patterning a second organic layer covering the insulating layer on the first organic layer. A method for manufacturing a display device.

19. In paragraph 18, The step of manufacturing the light emitting element layer further includes the step of removing a portion of the insulating layer overlapping the second light emitting elements without removing a portion of the insulating layer overlapping the first light emitting elements, thereby exposing at least a portion of the second light emitting elements; A method for manufacturing a display device.

20. In paragraph 19, The step of manufacturing the light emitting element layer further includes the step of patterning a second connecting electrode electrically connected to at least a portion of the second light emitting elements exposed by the insulating layer; A method for manufacturing a display device.

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