Sound production device and production method therefor, and display apparatus

Abstract

The present application relates to the technical field of acoustics, and provides a sound production device and a production method therefor, and a display apparatus. The sound production device comprises a first substrate, a first conductive layer, a first protective layer, an organic layer, and a sound production vibration layer, wherein the sound production vibration layer is located on the side of the organic layer away from the first substrate, and at least part of the area between the organic layer and the sound production vibration layer forms a cavity structure; the organic layer comprises a first sub-layer and a supporting pattern located on the first sub-layer, the supporting pattern comprises at least one supporting part, and the first sub-layer covers the first protective layer. The present application is applicable to a display apparatus having a directional sound production function.

Description

Sound-generating device, manufacturing method thereof, and display device Technical Field

[0001] The present application relates to the field of acoustic technology, and in particular to a sound-generating device, a preparation method thereof, and a display device. Background Art

[0002] With the increase in audio-visual scenes, directional sound technology has come into being. Directional sound technology modulates audio signals with ultrasonic carrier signals to concentrate the energy of emitted sound waves, forming audible sound waves with strong directionality, breaking the law of sound propagation in all directions, and creating an independent audio space that does not interfere with the surrounding environment.

[0003] Summary of the Invention

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a sound-generating device, comprising:

[0006] first base;

[0007] a first conductive layer, located on one side of the first substrate;

[0008] a first protective layer, covering the first conductive layer;

[0009] an organic layer, located on a side of the first protective layer away from the first conductive layer;

[0010] a sound-generating vibration layer, located on a side of the organic layer away from the first substrate, wherein at least a portion of the area between the organic layer and the sound-generating vibration layer forms a cavity structure;

[0011] The organic layer includes a first sublayer and a support pattern located on the first sublayer, the support pattern includes at least one support portion, and the first sublayer covers the first protective layer.

[0012] In at least one sound-emitting device provided in an embodiment of the present application, the first sub-layer and the supporting pattern are an integrated structure.

[0013] In at least one sound-emitting device provided in an embodiment of the present application, at least part of the support pattern includes a main support portion and a plurality of auxiliary support portions, wherein the auxiliary support portions surround the main support portion, wherein the minimum distance between two adjacent support patterns is greater than or equal to 5 times the maximum planar dimension of the support portion.

[0014] In at least one sound-emitting device provided in an embodiment of the present application, in the same supporting pattern, the geometric center of the plane figure of each auxiliary supporting part is located at the vertex of the first polygon, the geometric center of the plane figure of the main supporting part is located at the geometric center of the first polygon, and the first polygon is an equilateral polygon.

[0015] In at least one sound-emitting device provided in an embodiment of the present application, the area of ​​the planar figure of the main supporting portion is greater than or equal to the area of ​​the planar figure of each of the auxiliary supporting portions.

[0016] In at least one sound-generating device provided in an embodiment of the present application, the distance between the geometric center of the first polygon and any vertex of the first polygon is less than or equal to the distance between two adjacent vertices along the outline of the first polygon.

[0017] In at least one sound-emitting device provided in an embodiment of the present application, the minimum distance between two adjacent main support portions is greater than or equal to 7 times the maximum planar dimension of the support portion.

[0018] In at least one sound-emitting device provided in an embodiment of the present application, the support pattern includes one support portion, and the planar shape of the support pattern includes an arc, a polygon, or a combination of a polygon and an arc.

[0019] In at least one sound-emitting device provided in an embodiment of the present application, the planar figure of the supporting pattern includes a figure formed by splicing a first rectangle and a second rectangle, the geometric centers of the first rectangle and the second rectangle overlap, and the long sides of the first rectangle and the second rectangle are perpendicular.

[0020] In at least one sound-emitting device provided in an embodiment of the present application, the support pattern includes one support portion and a plurality of hollow structure groups other than the support portion, the plurality of hollow structure groups are arranged in an array, and the hollow structure group includes at least one hollow structure;

[0021] Wherein, the maximum plane size of the hollow structure group is greater than or equal to 5 times the minimum spacing between two adjacent hollow structure groups.

[0022] In at least one sound-generating device provided in an embodiment of the present application, a gap is provided between the support pattern and the sound-generating vibration layer, and at least one of the hollow structures in each hollow structure group is connected to the gap as a whole.

[0023] In at least one sound-generating device provided in an embodiment of the present application, a plurality of the hollow structure groups are connected to the gap and serve as the cavity structure.

[0024] In at least one sound-emitting device provided in an embodiment of the present application, the support pattern is in direct contact with the sound-emitting vibration layer, the cavity structure includes the multiple hollow structure groups, and the multiple hollow structure groups are independently arranged.

[0025] In at least one sound-emitting device provided in an embodiment of the present application, the orthographic projection patterns of the outer contours of the plurality of hollow structures on the first sub-layer are arc-shaped, and the orthographic projection patterns of the hollow structures are the same.

[0026] In at least one sound-emitting device provided in an embodiment of the present application, an orthographic projection area of ​​the support pattern on the first sub-layer is greater than or equal to 15% of an area of ​​the first sub-layer.

[0027] In at least one sound-emitting device provided in an embodiment of the present application, the sound-emitting device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area; the sound-emitting device further includes a fixing portion, the fixing portion being disposed in the non-light-transmitting area and located between the first sub-layer and the sound-emitting vibration layer; and the support pattern is disposed in the light-transmitting area.

[0028] There is a gap between the supporting pattern and the sound-emitting vibration layer, and the height of the supporting pattern along the plane perpendicular to the first substrate is less than or equal to the height of the fixing portion along the plane perpendicular to the first substrate; or

[0029] The supporting pattern is in direct contact with the sound-emitting vibration layer, and a height of the supporting pattern perpendicular to a plane where the first substrate is located is equal to a height of the fixing portion perpendicular to a plane where the first substrate is located.

[0030] In at least one sound-emitting device provided in an embodiment of the present application, the support pattern is in contact with the sound-emitting vibration layer, and the fixing portion, the support pattern, and the first sub-layer are an integrated structure.

[0031] In at least one sound-emitting device provided in an embodiment of the present application, the sound-emitting device further includes a fixing portion, the fixing portion being located on a side of the first protective layer away from the first substrate, and the height of the fixing portion along the plane direction of the first substrate being equal to the sum of the heights of the supporting pattern and the first sublayer along the plane direction of the first substrate.

[0032] In at least one sound-generating device provided in an embodiment of the present application, the sound-generating vibration layer includes a second substrate and a second conductive layer located between the second substrate and the organic layer;

[0033] The sound-emitting device includes a light-transmitting area and a non-light-transmitting area surrounding the light-transmitting area, the non-light-transmitting area includes a first peripheral routing, a second peripheral routing, a second protective layer and a fixed portion, the first peripheral routing is located between the first conductive layer and the first protective layer, and the first peripheral routing is electrically connected to the first conductive layer; the second peripheral routing is arranged between the second conductive layer and the second protective layer, the second protective layer covers the side of the second peripheral routing away from the second conductive layer, and the second peripheral routing is electrically connected to the second conductive layer; at least a portion of the fixed portion is arranged between the organic layer and the second protective layer.

[0034] In at least one sound-generating device provided in an embodiment of the present application, the sound-generating vibration layer further comprises an adhesive sublayer, the adhesive sublayer being located on a side of the second protective layer away from the second substrate, and the adhesive sublayer covering the second protective layer and the second conductive layer;

[0035] The adhesive sublayer is in direct contact with the support pattern and the fixing portion.

[0036] In a second aspect, an embodiment of the present application provides a display device, which includes a sound-emitting device as described in any one of the first aspects, and also includes a display panel; the sound-emitting device is arranged on the light-emitting side of the display panel or inside the display panel; the orthographic projection of the light-transmitting area of ​​the sound-emitting device on the display panel overlaps with the display area of ​​the display panel.

[0037] In at least one display device provided in an embodiment of the present application, the display panel is a liquid crystal display panel;

[0038] An orthographic projection of at least a portion of the support portion on the liquid crystal display panel overlaps with a spacer in the liquid crystal display panel.

[0039] In at least one display device provided in an embodiment of the present application, the display panel is an organic light emitting diode display panel.

[0040] In a third aspect, an embodiment of the present application provides a method for preparing a sound-generating device, which is applied to prepare the sound-generating device as described above, and the method comprises:

[0041] providing a first substrate;

[0042] forming a first conductive layer, a first protective layer, an organic layer and a fixing portion on the first substrate, respectively, wherein the organic layer and the fixing portion are an integrated structure;

[0043] providing a second substrate;

[0044] forming a second conductive layer and a second protective layer on the second substrate respectively;

[0045] forming a bonding sublayer on a side of the second protective layer away from the second substrate, wherein the sound-generating vibration layer includes the second substrate, the second conductive layer, and the bonding sublayer;

[0046] The bonding sublayer is bonded together with the organic layer and the fixing portion by a bonding process.

[0047] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0049] FIG1 is a schematic diagram of a partial structure of a sound-generating device in a related art provided by an embodiment of the present application;

[0050] FIG2 is a scanning electron microscope image of the sound-generating device shown in FIG1 before the support pillar falls off;

[0051] FIG3 is a scanning electron microscope image of the sound-generating device shown in FIG1 after the supporting pillar falls off;

[0052] Figures 4, 7 to 9, 12, 14, 16 and 17 are schematic top views of eight sound-generating devices provided in embodiments of the present application;

[0053] Figures 5 and 6 are schematic diagrams of two cross-sectional structures along the M1M2 direction in Figure 4;

[0054] FIG10 is a schematic diagram of a cross-sectional structure along the M3M4 direction in FIG9 ;

[0055] Figures (1) to (9) in Figure 11 are schematic top views of nine types of support patterns provided in embodiments of the present application;

[0056] FIG13 is a schematic diagram of a cross-sectional structure along the M5M6 direction in FIG12;

[0057] FIG15 is a schematic diagram of a cross-sectional structure along the M7M8 direction in FIG14;

[0058] FIG18 is a schematic diagram of a cross-sectional structure along the M9M10 direction in FIG17;

[0059] FIG19 is a diagram showing a simulation effect of a sound-generating vibration layer of a sound-generating device during a sound-generating vibration process provided by an embodiment of the present application;

[0060] 20 and 21 are diagrams illustrating the state of a sound-generating device provided by an embodiment of the present application during a sound-generating vibration process, wherein FIG21 is a schematic diagram of the cross-sectional structure of FIG20 along the M11M12 direction;

[0061] 22 to 24 are schematic cross-sectional views of three display devices provided in embodiments of the present application;

[0062] 25 to 28 are schematic diagrams of four intermediate structures of a sound-generating device during the preparation process provided by an embodiment of the present application. Specific embodiments

[0063] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0064] In the embodiments of the present application, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with basically the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present application, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0065] In the embodiments of the present application, the terms "upper" and "lower" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0066] Throughout the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present application. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0067] In the embodiments of the present application, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0068] The features "parallel," "perpendicular," and "identical" used in the embodiments of the present application include features such as "parallel," "perpendicular," and "identical" in the strict sense, as well as "approximately parallel," "approximately perpendicular," and "approximately identical" that include certain tolerances, taking into account the measurement and tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), and represent within an acceptable range of deviation for a particular value determined by a person of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the stated value.

[0069] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, that is, meaning "including, but not limited to."

[0070] In the embodiments of this application, "same layer" refers to the relationship between multiple film layers formed from the same material after the same step (e.g., a one-step patterning process). "Same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same. Polygons in this specification are not strictly defined and can be approximate triangles, parallelograms, trapezoids, pentagons, or hexagons, etc., and some small deformations due to tolerances may exist.

[0071] With the increase in audio-visual scenes, directional sound technology has come into being. Directional sound technology modulates audio signals with ultrasonic carrier signals and utilizes the directional characteristics of ultrasonic waves to concentrate the energy of the emitted sound waves, forming audible sound waves with strong directionality, breaking the law of sound propagation in all directions and creating an independent audio space that does not interfere with the surrounding environment.

[0072] In related technologies, a directional sound-emitting device is generally provided with a first electrode, a second electrode, and a support column 3-4 located between the first electrode and the second electrode. A cavity is formed between the first electrode and the second electrode. The support column is arranged on the first electrode. The second electrode can vibrate. The support column is used to control the direction of the sound waves of the sound-emitting device. However, as shown in FIG1 , the sound-emitting device includes a first electrode 3-2 and an electrode protection layer 3-3 sequentially arranged on a substrate 3-1, and a support column 3-4 is arranged on the electrode protection layer 3-3; in combination with the SEM (Scanning Electron Microscope) images shown in FIG2 and FIG3 , during the vibration of the directional sound-emitting device, the support column 3-4 is very likely to fall off, wherein FIG2 is an SEM image of the support column 3-4 before it falls off, and FIG3 is an SEM image of the support column 3-4 after it falls off; thus, on the one hand, after the support column 3-4 falls off, it falls into other areas of the sound-emitting device, causing uneven transmittance of the sound-emitting device, which may reduce the aesthetic appearance; on the other hand, the falling off of the support column 3-4 changes the direction of the directional sound, making it very easy for sound leakage to occur, thereby reducing the effect of the directional sound. When the sound-emitting device is applied to a display device, the falling off of the support column 3-4 is very likely to cause uneven brightness in the display area of ​​the display device, thereby reducing the display effect.

[0073] Based on this, an embodiment of the present application provides a sound-emitting device, a preparation method thereof, and a display device, wherein the sound-emitting device includes a first substrate, a first conductive layer, a first protective layer, an organic layer, and a sound-emitting vibration layer; the sound-emitting vibration layer is located on the side of the organic layer away from the first substrate, and at least a partial area between the organic layer and the sound-emitting vibration layer forms a cavity structure; wherein the organic layer includes a first sublayer and a supporting pattern located on the first sublayer, the supporting pattern includes at least one supporting portion, the first sublayer covers the first protective layer, and the first sublayer and the supporting pattern are made of the same material type.

[0074] In an embodiment of the present application, an organic layer is provided including a first sublayer and a support pattern located on the first sublayer, the support pattern includes at least one support portion, and the first sublayer covers the first protective layer. In this way, since the first sublayer covers the first protective layer, there is a larger contact area between the first sublayer and the first protective layer, thereby improving the adhesion between the first sublayer and the first protective layer. In addition, since the first sublayer and the support pattern are made of the same material type, the adhesion between the first sublayer and the support pattern can be greatly improved, thereby improving the adhesion between the organic layer and the first protective layer as a whole. During the vibration of the directional sound-emitting device, the support portion in the support pattern is largely avoided from falling off from the first sublayer, and the film layer between the organic layer and the first protective layer is also avoided from falling off.

[0075] The sound-generating device and its preparation method, and the display device provided in the embodiments of the present application will be specifically introduced and explained below with reference to the accompanying drawings.

[0076] The embodiments of this application adopt the following technical solutions:

[0077] An embodiment of the present application provides a sound-generating device, as shown in FIG4 and FIG5 , including:

[0078] a first substrate 1;

[0079] A first conductive layer 3 is located on one side of the first substrate 1;

[0080] A first protective layer 4 covering the first conductive layer 3;

[0081] The organic layer 2 is located on a side of the first protective layer 4 away from the first conductive layer 3;

[0082] The sound-generating vibration layer 6 is located on the side of the organic layer 2 away from the first substrate 1 , and at least a portion of the area between the organic layer 2 and the sound-generating vibration layer 6 forms a cavity structure Q;

[0083] The organic layer 2 includes a first sub-layer 22 and a support pattern 21 located on the first sub-layer 22 . The support pattern 21 includes at least one support portion. The first sub-layer 22 covers the first protective layer 4 .

[0084] 5 is a schematic diagram of the cross-sectional structure of FIG. 4 along the M1M2 direction.

[0085] The material of the first substrate 1 is not limited here.

[0086] In some examples, the material of the first substrate 1 can be made of one or more materials selected from the group consisting of glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes but is not limited to these.

[0087] In some examples, the first substrate 1 may be a rigid substrate or a flexible substrate;

[0088] When the first substrate 1 is a flexible substrate, the first substrate 1 may include a single layer of flexible material; or the first substrate 1 may include a first flexible material layer, a first inorganic non-metallic material layer, a second flexible material layer, and a second inorganic non-metallic material layer stacked in sequence. The first flexible material layer and the second flexible material layer are made of polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The first inorganic non-metallic material layer and the second inorganic non-metallic material layer are made of silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the first substrate 1. The first inorganic non-metallic material layer and the second inorganic non-metallic material layer are also referred to as barrier layers. This can improve the reliability of the sound-generating device and increase its service life.

[0089] When the first substrate 1 is a rigid substrate, the first substrate 1 may include a glass substrate.

[0090] It should be noted that when the sound-generating device is used in a display device, the first substrate may preferably be a flexible substrate to reduce the thickness of the sound-generating device, thereby reducing the volume of the display device, making the display device thinner and lighter, and expanding its application scenarios.

[0091] The material of the first conductive layer 3 is not limited here.

[0092] In some examples, the material of the first conductive layer 3 is a light-transmitting conductive material;

[0093] Exemplarily, the material of the first conductive layer 3 is metal. In this case, in order to achieve light transmittance, the metal film layer has a relatively small thickness. For example, the thickness of the metal film layer is nanometer level.

[0094] Exemplarily, the material of the first conductive layer 3 is metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0095] Exemplarily, the first conductive layer 3 may be a stacked structure of metal and metal oxide. For example, the first conductive layer 3 may include a stacked structure of metal oxide / metal / metal oxide. Specifically, the first conductive layer 3 may include ITO / Ag / ITO.

[0096] It should be noted that the sound-emitting device can be a directional sound-emitting device, and is applied to a display panel to form a display device with a directional sound-emitting function, wherein the sound-emitting device is usually arranged on the light-emitting side of the display panel. Therefore, most areas of the sound-emitting device are required to have good light transmittance.

[0097] In an exemplary embodiment, the material of the above-mentioned first protective layer 4 is an insulating material, which is used to isolate the first conductive layer 3 from other conductive materials to prevent the circuit from short circuiting; in addition, the first protective layer 4 can also protect the first conductive layer 3 to prevent the first conductive layer 3 from being corroded or damaged due to factors such as water vapor in the external environment during use.

[0098] Exemplarily, the material of the first protective layer 4 may be an inorganic insulating material;

[0099] For example, the inorganic insulating material may be silicon nitride, silicon oxide, or a combination of one or more of silicon oxynitride.

[0100] In an exemplary embodiment, the material of the organic layer 2 is an organic light-transmitting material.

[0101] There is no limitation on whether the first sub-layer 22 in the organic layer 2 and the support pattern 21 on the first sub-layer 22 are made of the same material, which can be determined based on the difficulty and cost of the preparation process.

[0102] Exemplarily, the first sublayer 22 in the organic layer 2 and the support pattern 21 on the first sublayer 22 are made of the same material, for example, both are organic materials, which may include organic polymer materials. Materials of the same type have good adhesion.

[0103] In some embodiments, the materials of the first sublayer 22 and the support pattern 21 can be one of polyimide (PI), polyethylene terephthalate (PET), polystyrene (PS), polycarbonate (PC), allyl diglycol carbonate (CR-39), polymethyl methacrylate (PMMA), epoxy optical plastic or surface-treated polymer soft film.

[0104] In at least one sound-emitting device provided in an embodiment of the present application, as shown in FIG6 , the first sub-layer 22 and the support pattern 21 are an integrated structure.

[0105] Here, "integrated structure" refers to using the same raw materials, being prepared in the same preparation steps, and having the same final material composition.

[0106] In an exemplary embodiment, the first sub-layer 22 is a continuous structure covering the entire surface. The first sub-layer 22 covers at least a majority of the first protective layer 4 , and the support patterns 21 are evenly distributed on the first sub-layer 22 .

[0107] In practical applications, the larger the area of ​​the region in direct contact between the bottom surface of the support pattern 21 and the first sub-layer 22, the more conducive it is to improving the interface adhesion between the support pattern 21 and the first sub-layer 22, thereby improving the vibration stability of the support pattern 21 during the vibration of the sound-emitting device, reducing the probability of it falling off, improving the quality of the sound-emitting device, and ensuring the directional sound effect of the sound-emitting device.

[0108] In some embodiments, the area of ​​the region where the bottom surface of the support pattern 21 directly contacts the first sub-layer 22 may be increased by increasing the area of ​​the planar graphic of the support pattern 21 .

[0109] In some embodiments, as shown in Figure 5 or Figure 10, the area of ​​the bottom surface of the support pattern 21 (the surface in contact with the first sub-layer 22) can be set to be greater than or equal to the area of ​​the top surface of the support pattern 21 (the surface away from the first sub-layer 22), thereby increasing the area of ​​the region in direct contact between the bottom surface of the support pattern 21 and the first sub-layer 22 to improve the adhesion between the two.

[0110] The support pattern 21 includes at least one support portion, and the number of support portions included in the support pattern 21 is not limited here.

[0111] For example, to simplify the design, each support pattern 21 can include only one support portion. In this way, the structure and dimensions of all support portions in the sound-generating device can be set to be identical. The structure of the support portion includes the shape of the support portion's planar shape and cross-sectional shape. The dimensions of the support portion include height, planar dimensions, and cross-sectional dimensions. The planar dimensions refer to the dimensions of the planar shape of the support portion's orthographic projection on the first substrate 1, and the cross-sectional dimensions refer to the dimensions of the cross-sectional shape of the support portion along a direction perpendicular to the first substrate 1.

[0112] For example, in order to improve the product reliability of the sound-generating device and reduce the risk of the support part falling off during the sound-generating vibration process, each support pattern 21 can be set to include two or more support parts. In this way, the more support parts there are, the smaller the vibration energy each support part receives under the same vibration energy, thereby greatly reducing the risk of the support part falling off.

[0113] When each support pattern 21 includes two or more support portions, whether the structures and sizes of the multiple (two or more) support portions in the same support pattern 21 are the same is not limited here; taking each support pattern 21 including two support portions (a first support portion and a second support portion) as an example for explanation, it may include but is not limited to the following situations:

[0114] The first and second supporting parts have the same structure and size.

[0115] Second, the first supporting portion and the second supporting portion have the same structure, but are not completely the same in size, that is, one or two of the height, plane size and cross-sectional size are different.

[0116] For example, the first support portion and the second support portion have different heights;

[0117] For example, the first support portion and the second support portion have different planar dimensions;

[0118] For example, the first support portion and the second support portion have different cross-sectional dimensions.

[0119] Third, the structures of the first supporting portion and the second supporting portion are different.

[0120] For example, the first support portion and the second support portion may have different planar shapes. Specifically, the planar shape of the first support portion may be an arc, or a combination of an arc and a polygon. One of the first support portion and the second support portion may be a main support portion, and the other may be an auxiliary support portion.

[0121] The arc shape may include a circle, an ellipse, a semicircle, a semi-ellipse, a fan shape, etc., and the polygonal shape may include a triangle, a quadrilateral, a pentagon, a hexagon, etc.

[0122] In some embodiments, the first conductive layer 3 can be called an ultrasonic electrode, which is configured to generate an ultrasonic signal under the control of an electrical signal. Each supporting pattern 21 can play a role in regulating the directional transmission of ultrasonic waves, and the sound-emitting vibration layer 6 vibrates after receiving the ultrasonic signal.

[0123] In an exemplary embodiment, the support pattern 21 is located in the cavity structure Q formed by the first sub-layer 22 and the sound-emitting vibration layer 6 .

[0124] In the direction perpendicular to the plane where the first substrate 1 is located, the depth of the cavity structure Q is greater than or equal to the height of the support pattern 21 .

[0125] In some embodiments, there is a gap between the supporting portion of the supporting pattern 21 and the sound-emitting vibration layer 6 , that is, the supporting pattern 21 is not in contact with the sound-emitting vibration layer 6 .

[0126] In some embodiments, the supporting portion of the supporting pattern 21 and the sound-emitting vibration layer 6 are in contact with each other.

[0127] In an embodiment of the present application, in combination with Figures 4 and 5, the organic layer 2 is provided to include a first sublayer 22 and a support pattern 21 located on the first sublayer 22, the support pattern 21 includes at least one support portion, the first sublayer 22 covers the first protective layer 4, and the first sublayer 22 and the support pattern 21 are of the same material type. In this way, since the first sublayer 22 covers the first protective layer 4, there is a larger contact area between the first sublayer 22 and the first protective layer 4, which improves the adhesion between the first sublayer 22 and the first protective layer 4. In addition, since the first sublayer 22 and the support pattern 21 are of the same material type, the adhesion between the first sublayer 22 and the support pattern 21 can be greatly improved, thereby improving the adhesion between the organic layer 2 and the first protective layer 4 as a whole. During the vibration of the directional sound device, the support portion in the support pattern 21 is largely avoided from falling off from the first sublayer 22, and the film layer between the organic layer 2 and the first protective layer 4 is also avoided from falling off.

[0128] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 7, 8, 9, and 10, at least a portion of the support pattern 21 includes a main support portion 21M and multiple auxiliary support portions 21S, with the auxiliary support portions 21S surrounding the main support portion 21M. As shown in Figures 7, 8, and 9, the minimum distance L (or L') between two adjacent support patterns 21 is greater than or equal to five times the maximum planar dimension d1 or d2 of the support portion. Figure 10 is a schematic diagram of the cross-sectional structure of Figure 9 along the M3M4 direction.

[0129] Exemplarily, as shown in FIG10 , the support pattern 21 includes a main support portion 21M and a plurality of auxiliary support portions 21S, and all the main support portions 21M and the auxiliary support portions 21S may be an integrated structure with the first sub-layer 22 .

[0130] Exemplarily, when the support pattern 21 includes one support portion, the minimum distance L (or L′) between two adjacent support patterns 21 is greater than or equal to 5 times the maximum planar dimension d1 of the support portion.

[0131] For example, as shown in Figure 8, when the support pattern 21 includes a main support portion 21M and an auxiliary support portion 21S, in some embodiments, the minimum distance L (or L') between two adjacent support patterns 21 is greater than or equal to 5 times the maximum planar dimension d1 of the auxiliary support portion 21S; in other embodiments, in some embodiments, the minimum distance L (or L') between two adjacent support patterns 21 is greater than or equal to 5 times the maximum planar dimension d2 of the main support portion 21M.

[0132] The maximum planar dimension d2 of the main support portion 21M is greater than or equal to the maximum planar dimension d1 of the auxiliary support portion 21S.

[0133] For example, the maximum planar dimension d1 of the support portion may be in a range of 10 μm to 100 μm.

[0134] Illustratively, the maximum planar dimension d1 of the auxiliary support portion 21S may be in a range of 10 μm to 100 μm.

[0135] Illustratively, the maximum planar dimension d2 of the main support portion 21M may be in a range of 10 μm to 150 μm.

[0136] Here, there is no limitation on whether the planar shapes of the main support portion 21M and the plurality of auxiliary support portions 21S included in the same support pattern 21 are the same.

[0137] For example, as shown in (1) to (6) of FIG. 11 , the plane shapes of the main support portion 21M and the auxiliary support portion 21S may include polygons, arcs, and a combination of polygons and arcs, respectively.

[0138] Among them, polygons include quadrilaterals, pentagons, hexagons, etc., arcs include circles, ellipses, grid lines, etc., and combinations of polygons and arcs include: figures formed by splicing arcs and polygons, or figures formed by removing local areas based on arcs or polygons.

[0139] In an exemplary embodiment, as shown in FIG. 11 ( 3 ), the main support portion 21M and the auxiliary support portion 21S are independently provided, and a plurality of auxiliary support portions 21S in the same support pattern 21 may be connected as one.

[0140] In an exemplary embodiment, as shown in (7) to (9) of FIG. 11 , the main support portion 21M and the plurality of auxiliary support portions 21S in the same support pattern 21 may be connected as one body.

[0141] In some embodiments, the plane shapes of all main support portions 21M and all auxiliary support portions 21S are the same. The plane shape refers to the shape of the orthographic projection of the support portion on the first substrate 1 .

[0142] For example, in the same supporting pattern 2 , the plane shape of the main supporting portion 21M may be a circle.

[0143] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 7, 8, 9, and 10, within the same support pattern 21, the geometric center of the plane figure of each auxiliary support portion 21S is located at the vertex of a first polygon (e.g., first quadrilateral A1A2A3A4), and the geometric center of the plane figure of the main support portion 21M is located at the geometric center of the first polygon (e.g., first quadrilateral A1A2A3A4), and the first polygon is an equilateral polygon. Figure 10 is a schematic cross-sectional structure diagram of Figure 9 along the M3M4 direction.

[0144] In an exemplary embodiment, the first polygon may include a quadrilateral, a pentagon, a hexagon, a heptagon, or the like.

[0145] The fact that the first polygon is an equilateral polygon has at least the following implications:

[0146] First, when the first polygon is an equilateral polygon, the lengths of the sides of the first polygon are equal, that is, in the same support pattern 21, the distance between the geometric centers of two adjacent auxiliary support portions 21S is equal to the length of the side of the first polygon;

[0147] Second, when the first polygon is an equilateral polygon, the distance between the geometric center of the main support portion 21M located at its geometric center and the geometric center of any auxiliary support portion 21S is equal.

[0148] In an embodiment of the present application, the geometric center of the plane figure of each auxiliary support part 21S is located at the vertex of the first polygon (for example, the first quadrilateral A1A2A3A4), and the geometric center of the plane figure of the main support part 21M is located at the geometric center of the first polygon (for example, the first quadrilateral A1A2A3A4), and the first polygon is an equilateral polygon; in this way, the distance between the geometric center of the main support part 21M and the geometric center of any auxiliary support part 21S is equal, and the auxiliary support parts 21S are evenly distributed around the main support part 21M. In the process of vibration of the sound-emitting device, it can better play the role of evenly distributing the vibration energy. Under the same vibration energy, the smaller the vibration energy borne by each support part, so that the main support part 21M and the auxiliary support part 21S in the same support pattern 21 are as close as possible in the shared vibration energy, while reducing the risk of the main support part 21M and the auxiliary support part 21S falling off, thereby improving the service life of the sound-emitting device. In addition, compared with the sound-emitting devices in the related art, the conductive preparation yield of the sound-emitting devices provided by the embodiments of the present application can be significantly improved, and the problems of support part falling off, air leakage and relaxation of the sound-emitting vibration layer can be significantly improved.

[0149] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 7 to 9 and Figures (1) to (6) in Figure 11, the area of ​​the plane figure of the main support portion 21M is greater than or equal to the area of ​​the plane figure of each auxiliary support portion 21S.

[0150] For example, as shown in (1), (2), (4) and (5) in Figures 7 to 9 and 11, when a support pattern 21 includes a main support portion 21M and multiple auxiliary support portions 21S, the area of ​​the planar figure of the main support portion 21M is greater than or equal to the area of ​​the planar figure of each auxiliary support portion 21S.

[0151] For example, in FIG. 8 , the area of ​​the planar figure of the main support portion 21M is larger than the area of ​​the planar figure of each of the auxiliary support portions 21S.

[0152] For another example, in FIG7 and FIG9 , the area of ​​the plane figure of the main support portion 21M is equal to the area of ​​the plane figure of each auxiliary support portion 21S.

[0153] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 7 and 9, the distance OA1 between the geometric center O of the first polygon (for example, A1A2A3A4 marked in Figure 7) and any vertex of the first polygon (for example, A1 marked in Figure 7) is less than or equal to the distance A1A2 between two adjacent vertices along the outline of the first polygon (for example, A1A2 marked in Figure 7).

[0154] In some embodiments, as shown in FIG8 , when the number of sides of the first polygon gradually increases, the distance between the geometric center of the first polygon and any vertex of the first polygon is greater than or equal to the distance between two adjacent vertices along the outline of the first polygon.

[0155] In at least one sound-generating device provided in an embodiment of the present application, as shown in FIG7 , FIG8 , and FIG9 , the minimum distance H or H′ between two adjacent main support portions 21M is greater than or equal to 7 times the maximum planar dimension of the support portion.

[0156] Exemplarily, the minimum distance H or H′ between two adjacent main support portions 21M is greater than or equal to 7 times the maximum planar dimension d2 of the main support portion 21M.

[0157] Exemplarily, the minimum distance H or H′ between two adjacent main support portions 21M is greater than or equal to 7 times the maximum planar dimension d1 of the auxiliary support portion 21S.

[0158] The minimum distance between two adjacent main support portions 21M includes a minimum distance H between two adjacent main support portions 21M along a first direction (e.g., a horizontal direction), and a minimum distance H' between two adjacent main support portions 21M along a second direction (e.g., a vertical direction). The first direction and the second direction intersect, and in the drawings provided in the embodiments of this application, the first and second directions are perpendicular to each other for illustration and description purposes.

[0159] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures (7) to (8) of Figure 11 and Figure 12, the support pattern 21 includes a support portion, and the planar shape of the support pattern 21 includes an arc, a polygon, or a combination of a polygon and an arc.

[0160] For example, the arc shape may include a circle, an ellipse, a semicircle, a semi-ellipse, a sector, a rounded polygon, and the like.

[0161] For example, the polygon may include a quadrilateral, a pentagon, a hexagon, etc.

[0162] Illustratively, the combination of polygons and arcs includes a figure formed by splicing polygons and arcs, or a figure obtained by removing a local area from a polygon or an arc.

[0163] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 12 and 13 , support patterns 21 are arranged in an array, wherein the planar shape of support pattern 21 comprises a pattern formed by splicing a first rectangle and a second rectangle, with the geometric centers of the first and second rectangles overlapping and the long sides of the first and second rectangles perpendicular. Figure 13 is a schematic cross-sectional view of Figure 12 along the M5M6 direction.

[0164] Exemplarily, the figure formed by splicing the first rectangle and the second rectangle may include a concave dodecagon as shown in FIG. 12 , wherein the lengths of the sides of the concave dodecagon are equal.

[0165] Exemplarily, the maximum planar dimension d3 of the first rectangle and the maximum planar dimension d4 of the second rectangle may both be in the range of 30 μm to 150 μm.

[0166] Exemplarily, the maximum planar dimension d3 of the first rectangle and the maximum planar dimension d4 of the second rectangle are substantially equal.

[0167] Exemplarily, as shown in FIG12 , the interval L or L′ between two adjacent support patterns 21 is greater than or equal to five times the maximum plane dimension d3 of the first rectangle.

[0168] Exemplarily, as shown in FIG12 , the interval L or L′ between two adjacent support patterns 21 is greater than or equal to five times the maximum plane dimension d4 of the second rectangle.

[0169] In some embodiments of the present application, as shown in Figures 4, 7 to 9, and 12, along the first direction (for example, the horizontal direction) or the second direction (for example, the vertical direction), for the support pattern 21 with the smallest distance to the junction position of the non-transparent area FT and the transparent area T, the distance L0 (or L0') between the junction position is less than or equal to the spacing L or L' between any two adjacent support patterns 21.

[0170] In some embodiments, for the support pattern 21 having the smallest distance to the junction between the non-transparent region FT and the transparent region T, the distance L0 from the support pattern 21 along the first direction to the junction is substantially equal to the distance L0' from the support pattern 21 along the second direction to the junction.

[0171] In an embodiment of the present application, for the support pattern 21 having the smallest distance to the junction position between the non-light-transmitting area FT and the light-transmitting area T, the distance L0 along the first direction to the junction position is set to be approximately equal to the distance L0' along the second direction to the junction position; thereby, the support pattern 21 in the area of ​​the sound-emitting device close to the non-light-transmitting area FT can be arranged more evenly, which helps the support pattern 21 to be evenly distributed on the first substrate 1, thereby facilitating the support pattern 21 to play a role in directionally propagating ultrasonic signals and adjusting the directional sound transmission effect, while improving the uniformity of the directional sound transmission, thereby improving the quality of the sound-emitting device and ensuring the directional sound transmission effect of the sound-emitting device.

[0172] In some embodiments of the present application, the sum of the heights of the support pattern 21 and the first sub-layer 22 ranges from 4 μm to 15 μm.

[0173] In an exemplary embodiment, the sum of the heights of the support pattern 21 and the first sublayer 22 may be 4.5 μm, 5 μm, 5.5 μm, 6.0 μm, 6.5 μm, 7.0 μm, 7.5 μm, 8.0 μm, 8.5 μm, 9.0 μm, 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.5 μm, 12 μm, 12.5 μm, 13 μm, 13.5 μm, 14 μm or 14.5 μm.

[0174] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 14, 16 and 17, the supporting pattern 21 includes a supporting portion and a plurality of hollow structure groups LKG other than the supporting portion, and the plurality of hollow structure groups LKG are arranged in an array, and the hollow structure group LKG includes at least one hollow structure LK; wherein, taking the mark shown in Figure 14 as an example, the maximum planar dimension d5 of the hollow structure group LKG is greater than or equal to 5 times the minimum spacing d6 between two adjacent hollow structure groups LKG.

[0175] Exemplarily, for the plurality of hollow structure groups LKG arranged in an array, the maximum planar dimension d5 of the hollow structure group LKG is greater than or equal to 5 times the minimum spacing d6 between two adjacent hollow structure groups LKG along the first direction (eg, horizontal direction).

[0176] Exemplarily, for the plurality of hollow structure groups LKG arranged in an array, the maximum planar dimension d5 of the hollow structure group LKG is greater than or equal to 5 times the minimum spacing d6 between two adjacent hollow structure groups LKG along the second direction (eg, vertical direction).

[0177] Exemplarily, the minimum distance d6 between two adjacent hollow structure groups LKG is in the range of 10 μm to 100 μm.

[0178] In at least one sound-generating device provided in an embodiment of the present application, as shown in FIG15 , a gap is provided between the support pattern 21 and the sound-generating vibration layer 6 , and at least one hollow structure LK in each hollow structure group LKG is integrally connected to the gap. FIG15 is a schematic cross-sectional view of FIG14 along the M7M8 direction.

[0179] In an exemplary embodiment, as shown in FIG15 , there is a gap between the support pattern 21 and the sound-emitting vibration layer 6 , and the multiple hollow structures LK in each hollow structure group LKG are connected to the gap as a whole to form a cavity structure Q.

[0180] Exemplarily, all the hollow structures LK in each hollow structure group LKG are connected with the gaps to form a cavity structure Q as a whole.

[0181] In at least one sound-emitting device provided in an embodiment of the present application, as shown in FIG18 , the support pattern 21 is in direct contact with the sound-emitting vibration layer 6 , the cavity structure Q includes a plurality of hollow structure groups LKG, and the plurality of hollow structure groups LKG are independently arranged.

[0182] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 14, 16 and 17, the orthographic projection patterns of the outer contours of multiple hollow structures LK on the first sub-layer 22 are arc-shaped, and the orthographic projection patterns of each hollow structure LK are the same.

[0183] For example, the arc shape may include a circle, an ellipse, a semicircle, a semi-ellipse, a sector, a rounded polygon, and the like.

[0184] As shown in Figure 19, a simulated effect diagram of the top view of the sound-emitting device during the vibration and sound-emitting process is shown, wherein the area marked A is the area with the largest amplitude in the hollow structure LK. Combined with Figures 20 and 21, in a hollow structure LK, the area A with the largest amplitude in the sound-emitting vibration layer 6 is close to an arc (for example, a circle). Compared with setting the positive projection figure of the outer contour of the hollow structure LK on the first sub-layer 22 to a polygon, in the embodiment of the present application, the positive projection figures of the outer contour of the hollow structure LK on the first sub-layer 22 are all arcs. While ensuring that the area of ​​the area A with the largest actual amplitude remains almost unchanged (so that there is almost no effect on the sound-emitting effect), the area of ​​the support pattern 21 other than the hollow structure LK (for example, a support part shown in Figures 14, 16 and 17) can be significantly increased, thereby improving the buffering effect of the support pattern 21 on the vibration energy, greatly reducing the risk of the support pattern 21 peeling or falling off, and taking into account the directional sound effect and quality of the sound-emitting device.

[0185] 21 is a schematic diagram of the cross-sectional structure of FIG. 20 along the M11M12 direction, FIG. 20 is a schematic diagram of the top view of the area where the hollow structure LK is located, and the arc in FIG. 21 represents the state of the sound vibration layer 6 during vibration.

[0186] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 4, 7 to 9, 12, 14, 16 and 17, the positive projection area of ​​the support pattern 21 on the first sub-layer 22 is greater than or equal to 15% of the area of ​​the first sub-layer 22.

[0187] Exemplarily, the orthographic projection area of ​​the support pattern 21 on the first sub-layer 22 is greater than or equal to 15% of the area of ​​the portion of the first sub-layer 22 located in the light-transmitting region T.

[0188] Exemplarily, the orthographic projection area of ​​the support pattern 21 on the first sub-layer 22 is 15% to 50% of the area of ​​the first sub-layer 22 .

[0189] Exemplarily, the orthographic projection area of ​​the support pattern 21 on the first sub-layer 22 is 20% to 50% of the area of ​​the first sub-layer 22 .

[0190] For example, the orthographic projection area of ​​the support pattern 21 on the first sub-layer 22 is 20% to 50% of the area of ​​the portion of the first sub-layer 22 located in the light-transmitting region T.

[0191] In an embodiment of the present application, by setting the orthographic projection area of ​​the support pattern 21 on the first sub-layer 22 to be greater than or equal to 15% of the area of ​​the first sub-layer 22, the area of ​​the support pattern 21 other than the hollow structure LK (for example, a support portion shown in Figures 14, 16 and 17) can be significantly increased, thereby improving the buffering effect of the support pattern 21 on vibration energy, greatly reducing the risk of peeling or falling off of the support pattern 21, and taking into account the directional sound effect and quality of the sound-emitting device.

[0192] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figures 4 to 10 and 12 to 18 , the sound-emitting device includes a light-transmitting region T and a non-light-transmitting region FT surrounding the light-transmitting region T; the sound-emitting device further includes a fixing portion 8, which is disposed in the non-light-transmitting region FT and between the first sub-layer 22 and the sound-emitting vibration layer 6; and a support pattern 21 is disposed in the light-transmitting region T.

[0193] As shown in FIG15 , when the sound-generating device is in a stationary state, there is a gap between the support pattern 21 and the sound-generating vibration layer 6 , and the height of the support pattern 21 along a plane perpendicular to the first substrate 1 is less than or equal to the height of the fixing portion 8 along a plane perpendicular to the first substrate 1 ;

[0194] Alternatively, as shown in Figure 18, when the sound-emitting device is in a stationary state, the support pattern 21 is in direct contact with the sound-emitting vibration layer 6, and the height of the support pattern 21 along the plane perpendicular to the first substrate 1 is equal to the height of the fixing part 8 along the plane perpendicular to the first substrate 1.

[0195] In an exemplary embodiment, when the fixing portion 8 and the organic layer 2 are independently provided, the fixing portion 8 may serve as a bonding portion, and the material of the bonding portion may include any one of glue, adhesive material, tape, adhesive, and sealant.

[0196] The bonding portion is disposed in the non-light-transmitting area FT, and the orthographic projection of the bonding portion on the first substrate 1 is in the shape of a ring, wherein the width of the ring is less than or equal to the width of the non-light-transmitting area FT.

[0197] In an embodiment of the present application, when the sound-emitting device is in a stationary state, there is a gap between the supporting pattern 21 and the sound-emitting vibration layer 6, so that the sound-emitting vibration layer 6 can have a larger amplitude, and the vibration of the sound-emitting vibration layer 6 causes less damage (scratch damage) to the supporting pattern 21, thereby extending the service life of the sound-emitting device. In addition, while facilitating the support pattern to propagate ultrasonic signals in a directional manner and adjust the directional sound transmission effect, the uniformity of the directional sound transmission is improved, thereby improving the quality of the sound-emitting device and ensuring the directional sound transmission effect of the sound-emitting device.

[0198] In at least one sound-emitting device provided in an embodiment of the present application, as shown in FIG18 , when the sound-emitting device is in a stationary state, the support pattern 21 is in direct contact with the sound-emitting vibration layer 6 , and the fixing portion 8 , the support pattern 21 and the first sublayer 22 are an integrated structure.

[0199] It should be noted that in FIG18 , in order to distinguish the fixing portion 8 , the support pattern 21 and the first sub-layer 22 , the three are not drawn as one. In actual application, the three can be connected into an integral structure with the same material.

[0200] It should be noted that, when the support pattern 21 is in contact with the sound-emitting vibration layer 6 , and the fixing portion 8 , the support pattern 21 and the first sub-layer 22 are an integrated structure, the fixing portion 8 plays a role in supporting the sound-emitting vibration layer 6 .

[0201] In at least one sound-emitting device provided in an embodiment of the present application, the organic layer 2 may not be provided in the non-light-transmitting area FT, and the fixing portion 8 may be provided on the side of the first protective layer 4 away from the first substrate 1. The height of the fixing portion 8 along the plane direction of the first substrate 1 is equal to the sum of the heights of the supporting pattern 21 and the first sublayer 22 along the plane direction of the first substrate 1. At this time, at least a part of the fixing portion 8 is provided between the first protective layer 4 and the second protective layer 7.

[0202] In at least one sound-generating device provided in an embodiment of the present application, as shown in FIG. 4 to FIG. 10 and FIG. 12 to FIG. 18 , the sound-generating vibration layer 6 includes a second substrate 62 and a second conductive layer 61 located between the second substrate 62 and the organic layer 2 ;

[0203] The sound-emitting device includes a light-transmitting area T and a non-light-transmitting area FT surrounding the light-transmitting area T. The non-light-transmitting area FT includes a first peripheral trace Z1, a second peripheral trace Z2, a second protective layer 7 and a fixed portion 8. The first peripheral trace Z1 is located between the first conductive layer 3 and the first protective layer 4, and the first peripheral trace Z1 is electrically connected to the first conductive layer 3; the second peripheral trace Z2 is arranged between the second conductive layer 61 and the second protective layer 7, the second protective layer 7 covers the side of the second peripheral trace Z2 away from the second conductive layer 61, and the second peripheral trace Z2 is electrically connected to the second conductive layer 61; at least a part of the fixed portion 8 is arranged between the organic layer 2 and the second protective layer 7.

[0204] In an exemplary embodiment, the first peripheral trace Z1 and the second peripheral trace Z2 are both disposed around the light-transmitting area T.

[0205] The specific materials of the first peripheral trace Z1 and the second peripheral trace Z2 are not limited here.

[0206] Exemplarily, the first peripheral trace Z1 and the second peripheral trace Z2 include metal or metal oxide, for example, the metal may include a combination of one or more of gold (Au), silver (Ag), copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti), for example, the metal oxide may include indium tin oxide (ITO) or indium zinc oxide (IZO).

[0207] There is no limitation on whether the materials and line widths of the first peripheral trace Z1 and the second peripheral trace Z2 are the same, and the specific details can be determined according to product design.

[0208] In some embodiments, in order to simplify the design and reduce the difficulty of the manufacturing process, the first peripheral trace Z1 and the second peripheral trace Z2 may be designed to be made of the same material.

[0209] In an exemplary embodiment, the material of the above-mentioned second protective layer 7 is an insulating material, which is used to isolate the second peripheral trace Z2 from other conductive materials to prevent the circuit from short circuiting; in addition, the second protective layer 7 can also protect the second peripheral trace Z2 to prevent the second peripheral trace Z2 from being corroded or damaged due to factors such as water vapor in the external environment during use.

[0210] Exemplarily, the material of the second protective layer 7 may be an inorganic insulating material;

[0211] For example, the inorganic insulating material may be silicon nitride, silicon oxide, or a combination of one or more of silicon oxynitride.

[0212] Exemplarily, the material of the second protective layer 7 may be an organic insulating material;

[0213] For example, the material of the second protective layer 7 can be ink, resin, etc.

[0214] The case where at least a portion of the fixing portion 8 is disposed between the organic layer 2 and the second protective layer 7 includes but is not limited to the following:

[0215] First, as shown in FIG. 4 to FIG. 10 and FIG. 12 to FIG. 18 , part of the fixing portion 8 is disposed between the organic layer 2 and the second protective layer 7 , and part of the fixing portion 8 is disposed between the organic layer 2 and the second conductive layer 61 .

[0216] Second, the entire region of the fixing portion 8 is disposed between the organic layer 2 and the second protective layer 7 .

[0217] In at least one sound-emitting device provided in an embodiment of the present application, as shown in Figure 18, when the sound-emitting device is in a stationary state, when the supporting pattern 21 is in contact with the sound-emitting vibration layer 6, the fixing portion 8, the supporting pattern 21 and the first sublayer 22 are an integrated structure, and the sound-emitting vibration layer 6 also includes a bonding sublayer 63, which is located on the side of the second protective layer 7 away from the second substrate 62, and the bonding sublayer 63 covers the second protective layer 7 and the second conductive layer 61; the bonding sublayer 63 is in direct contact with the supporting pattern 21 and the fixing portion 8.

[0218] In an embodiment of the present application, when the fixing portion 8, the supporting pattern 21 and the first sublayer 22 are an integrated structure, the sound-emitting vibration layer 6 can be provided to further include a bonding sublayer 63, and the bonding sublayer 63 is a whole-surface film layer. On the one hand, it can play a bonding role between the second conductive layer 61 and the fixing portion 8, and between the second conductive layer and the supporting pattern 21; on the other hand, when the material of the second substrate 2 is an organic material, it is very easy to shrink under high temperature or high humidity environment, thereby generating wrinkles on the membrane surface, reducing the vibration performance of the sound-emitting vibration layer 6. By providing a whole-surface bonding sublayer 63, the shrinkage rate of the material of the second substrate 2 under high temperature or high humidity environment can be greatly reduced, thereby improving the vibration performance of the sound-emitting vibration layer 6 and improving the directional sound transmission effect of the sound-emitting device.

[0219] An embodiment of the present application provides a display device, as shown in Figures 22, 23 and 24, including a sound-emitting device 100 as described in any of the above items, and also including a display panel 200 (in Figure 24, 200 includes 201 and 202); the sound-emitting device 100 is arranged on the light-emitting side of the display panel 200 or inside the display panel 200; the orthographic projection of the light-transmitting area T of the sound-emitting device 100 on the display panel 200 overlaps with the display area AA of the display panel 200.

[0220] The above-mentioned display device can be an organic light-emitting diode (OLED) display device, a Micro LED (Micro light Emitting Diode) display device, a Mini LED (Mini light Emitting Diode) display device or an LCD (Liquid Crystal Display) display device.

[0221] The display device may include any device or product with a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc.

[0222] In an exemplary embodiment, as shown in FIG. 22 and FIG. 23 , the sound-emitting device 100 is disposed on the light-emitting side of the display panel 200 .

[0223] Exemplarily, when the display panel 200 is one of an OLED display panel, a Micro LED display panel, a Mini LED display panel, and an LCD display panel, the sound-emitting device 100 can be set on the light-emitting side of the display panel 200 .

[0224] In an exemplary embodiment, as shown in FIG. 24 , the sound generating device 100 is disposed inside the display panel 200 .

[0225] Exemplarily, when the display panel 200 is one of an OLED display panel, a Micro LED display panel, and a Mini LED display panel, the sound-emitting device 100 can be disposed inside the display panel 200 .

[0226] In which, regardless of the type of display panel, the orthographic projection of the light-transmitting area T of the sound-emitting device 100 on the display panel 200 overlaps with the display area AA of the display panel 200, and the orthographic projection of the non-light-transmitting area FT of the sound-emitting device 100 on the display panel 200 overlaps with the peripheral area BB of the display panel 200.

[0227] In the display device provided in the embodiment of the present application, the organic layer 2 is provided to include a first sublayer 22 and a support pattern 21 located on the first sublayer 22, the support pattern 21 includes at least one support portion, the first sublayer 22 covers the first protective layer 4, and the first sublayer 22 and the support pattern 21 are made of the same material type. In this way, since the first sublayer 22 covers the first protective layer 4, there is a larger contact area between the first sublayer 22 and the first protective layer 4, which improves the adhesion between the first sublayer 22 and the first protective layer 4. In addition, since the first sublayer 22 and the support pattern 21 are made of the same material type, the adhesion between the first sublayer 22 and the support pattern 21 can be greatly improved, thereby improving the adhesion between the organic layer 2 and the first protective layer 4 as a whole. During the vibration of the directional sound-emitting device, the support portion in the support pattern 21 is largely avoided from falling off from the first sublayer 22, and the film layer between the organic layer 2 and the first protective layer 4 is also avoided from falling off.

[0228] In at least one display device provided in an embodiment of the present application, the display panel 200 is a liquid crystal display panel;

[0229] At least a portion of the orthographic projection of the supporting portion on the liquid crystal display panel overlaps with the spacer PS in the liquid crystal display panel.

[0230] In an exemplary embodiment, an orthographic projection of a portion of the supporting portion on the liquid crystal display panel overlaps with the spacer PS in the liquid crystal display panel.

[0231] In an exemplary embodiment, an orthographic projection of each supporting portion on the liquid crystal display panel overlaps with a corresponding spacer PS in the liquid crystal display panel.

[0232] The distribution density of the spacers PS in the liquid crystal display panel is greater than the distribution density of the supporting parts in the sound-generating device 100 .

[0233] In the display device provided in the embodiment of the present application, since the sound-emitting device 100 is arranged on the light-emitting side of the display panel 200, by arranging that the orthographic projection of at least part of the supporting portion on the liquid crystal display panel and the spacer PS in the liquid crystal display panel overlap, the interference of the supporting portion 5 on the display light can be greatly reduced, thereby improving the light-emitting efficiency of the display device and enhancing the display effect.

[0234] In at least one display device provided by an embodiment of the present application, the display panel 200 is an organic light emitting diode (OLED) display panel.

[0235] For example, when the sound-emitting device 100 is disposed inside the display panel 200 , since the OLED display panel 200 may include a light-emitting substrate 202 and a cover plate (or packaging substrate) 201 , the sound-emitting device 100 may be disposed between the light-emitting substrate 202 and the cover plate (or packaging substrate) 201 .

[0236] In some embodiments, when the sound-emitting device 100 is arranged between the light-emitting substrate 202 and the cover plate (or packaging substrate) 201, the first base 1 can be shared with the packaging layer or organic film layer in the light-emitting substrate 202, thereby further reducing the thickness of the display device and improving the application flexibility of the display device.

[0237] In an exemplary embodiment, as shown in FIG. 17 , a ring-shaped connecting portion 300 may be provided to fix the sound generating device 100 and the display panel 200 together.

[0238] In an exemplary embodiment, as shown in FIG. 18 , a connecting portion 300 may be provided on a whole surface to fix the sound device 100 and the display panel 200 together.

[0239] The material of the connection portion 300 may include sealant.

[0240] An embodiment of the present application provides a method for preparing a sound-generating device, which is applied to preparing the sound-generating device as described above. The method comprises:

[0241] S01. Provide a first substrate 1 as shown in FIG25 .

[0242] The material of the first substrate 1 is not limited here.

[0243] In some examples, the first substrate 1 may be a rigid substrate or a flexible substrate.

[0244] In some examples, the material of the first substrate 1 can be made of one or more materials selected from the group consisting of glass, polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes but is not limited to these.

[0245] It should be noted that when the sound-generating device is used in a display device, the first substrate may preferably be a flexible substrate to reduce the thickness of the sound-generating device, thereby reducing the volume of the display device, making the display device thinner and lighter, and expanding its application scenarios.

[0246] S02. As shown in FIG. 26 , FIG. 27 and FIG. 28 , a first conductive layer 3, a first protective layer 4, an organic layer 2 and a fixing portion 8 are respectively formed on the first substrate 1 , and the organic layer 2 and the fixing portion 8 are an integrated structure.

[0247] In some examples, the material of the first conductive layer 2 is a light-transmitting conductive material;

[0248] Exemplarily, the material of the first conductive layer 2 is metal. In this case, in order to achieve light transmittance, the metal film layer has a relatively small thickness. For example, the thickness of the metal film layer is nanometer level.

[0249] Exemplarily, the material of the first conductive layer 2 is metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0250] In an exemplary embodiment, the material of the above-mentioned first protective layer 3 is an insulating material, which is used to isolate the first conductive layer 2 from other conductive materials to prevent short circuits in the circuit; in addition, the first protective layer 3 can also protect the first conductive layer 2 to prevent the first conductive layer 2 from being corroded or damaged by factors such as water vapor in the external environment during use.

[0251] Specifically, S02, as shown in FIG. 26 , FIG. 27 and FIG. 28 , a first conductive layer 3, a first protective layer 4, an organic layer 2 and a fixing portion 8 are formed on a first substrate 1, respectively. The organic layer 2 and the fixing portion 8 are an integrated structure, including the following steps:

[0252] Sub-step 1: forming a first conductive layer 3 and a first protective layer 4 on the first substrate 1;

[0253] Sub-step 2: forming an organic thin film as shown in FIG. 27 ;

[0254] Sub-step 3: patterning the organic thin film to simultaneously form an organic layer 2 and a fixing portion 8 of an integrated structure, wherein the organic layer 2 includes a first sub-layer 22 and a support pattern 21 .

[0255] S03: Provide a second substrate 62 as shown in FIG. 25 .

[0256] S04. As shown in FIG. 26 and FIG. 27 , a second conductive layer 61 and a second protective layer 7 are formed on the second substrate 62 .

[0257] Steps S01 to S02 and steps S03 to S04 can be performed on two production lines respectively, and step S03 is not limited to be performed after step S02.

[0258] S05. As shown in FIG28 , a bonding sublayer 63 is formed on a side of the second protective layer 7 away from the second substrate 62 , wherein the sound-generating vibration layer 6 includes the second substrate 62 , the second conductive layer 61 , and the bonding sublayer 63 ;

[0259] S06 , using a lamination process to laminate the adhesive sublayer 63 , the organic layer 2 (including the first sublayer 22 and the support pattern 21 ), and the fixing portion 8 .

[0260] In the sound-emitting device prepared by the preparation method provided in the embodiment of the present application, the organic layer 2 is provided to include a first sublayer 22 and a support pattern 21 located on the first sublayer 22, the support pattern 21 includes at least one support portion, the first sublayer 22 covers the first protective layer 4, and the first sublayer 22 and the support pattern 21 are of the same material type. In this way, since the first sublayer 22 covers the first protective layer 4, there is a larger contact area between the first sublayer 22 and the first protective layer 4, which improves the adhesion between the first sublayer 22 and the first protective layer 4. In addition, since the first sublayer 22 and the support pattern 21 are of the same material type, the adhesion between the first sublayer 22 and the support pattern 21 can be greatly improved, thereby improving the adhesion between the organic layer 2 and the first protective layer 4 as a whole. During the vibration of the directional sound-emitting device, the support portion in the support pattern 21 is largely avoided from falling off from the first sublayer 22, and the film layer between the organic layer 2 and the first protective layer 4 is also avoided from falling off.

[0261] In addition, when the fixing part 8, the supporting pattern 21 and the first sublayer 22 are an integrated structure, the sound-emitting vibration layer 6 can be provided to also include a bonding sublayer 63, and the bonding sublayer 63 is a whole-surface film layer. On the one hand, it can play a bonding role between the second conductive layer 61 and the fixing part 8, and between the second conductive layer and the supporting pattern 21; on the other hand, when the material of the second substrate 2 is an organic material, it is very easy to shrink under high temperature or high humidity environment, thereby generating wrinkles on the membrane surface and reducing the vibration performance of the sound-emitting vibration layer 6. By providing a whole-surface bonding sublayer 63, the shrinkage rate of the material of the second substrate 2 under high temperature or high humidity environment can be greatly reduced, thereby improving the vibration performance of the sound-emitting vibration layer 6 and improving the directional sound transmission effect of the sound-emitting device.

[0262] It should be noted that only the preparation process of the structure related to the invention point is introduced here. The introduction of the specific components and materials of the above-mentioned sound-emitting device and display device can be referred to the description in the previous text and will not be repeated here.

[0263] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any modifications or substitutions that can be readily conceived by a person skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A sound generating device, wherein, The sound generating device includes: A first substrate; A first conductive layer located on one side of the first substrate; A first protective layer covering the first conductive layer; An organic layer located on the side of the first protective layer away from the first conductive layer; A sound generating vibration layer located on the side of the organic layer away from the first substrate, and at least a partial region between the organic layer and the sound generating vibration layer forms a cavity structure; Wherein, the organic layer includes a first sub-layer and a support pattern located on the first sub-layer, the support pattern includes at least one support portion, and the first sub-layer covers the first protective layer.

2. The sound generating device according to claim 1, wherein, The first sub-layer and the support pattern are an integrated structure.

3. The sound generating device according to claim 1 or 2, wherein, At least a part of the support pattern includes a main support portion and a plurality of auxiliary support portions, the auxiliary support portions surround the main support portion, wherein the minimum distance between two adjacent support patterns is greater than or equal to 5 times the maximum planar dimension of the support portion.

4. The sound generating device according to claim 3, wherein, In the same support pattern, the geometric centers of the planar figures of the auxiliary support portions are located at the vertices of a first polygon, the geometric center of the planar figure of the main support portion is located at the geometric center of the first polygon, and the first polygon is an equilateral polygon.

5. The sound emitting device according to claim 4, wherein, The area of the planar figure of the main support portion is greater than or equal to the area of the planar figures of the auxiliary support portions.

6. The sound generating device according to claim 4, wherein, The distance between the geometric center of the first polygon and any vertex of the first polygon is less than or equal to the distance between two adjacent vertices along the contour of the first polygon.

7. The sound generating device according to claim 3, wherein The minimum distance between two adjacent main support portions is greater than or equal to 7 times the maximum planar dimension of the support portion.

8. The sound generating device according to claim 1 or 2, wherein, The support pattern includes one support portion, and the planar figure of the support pattern includes an arc, a polygon, or a combination of a polygon and an arc.

9. The sound generating device according to claim 8, wherein, The planar figure of the support pattern includes a figure formed by splicing a first rectangle and a second rectangle, the geometric centers of the first rectangle and the second rectangle overlap, and the long sides of the first rectangle and the second rectangle are perpendicular.

10. The sound generating device according to claim 1 or 2, wherein, The support pattern includes one support portion and a plurality of sets of hollow structures other than the support portion, the plurality of sets of hollow structures are arranged in an array, and each set of hollow structures includes at least one hollow structure; Wherein, the maximum planar dimension of the set of hollow structures is greater than or equal to 5 times the minimum distance between two adjacent sets of hollow structures.

11. The sound generating device according to claim 10, wherein, There is a gap between the support pattern and the sound generating vibration layer, and at least one of the hollow structures in each set of hollow structures is in communication with the gap as a whole.

12. The sound generating device according to claim 11, wherein, The plurality of sets of hollow structures are all in communication with the gap and serve as the cavity structure.

13. The sound generating device according to claim 10, wherein, The support pattern is in direct contact with the sound generating vibration layer, the cavity structure includes the plurality of sets of hollow structures, and the plurality of sets of hollow structures are independently arranged from each other.

14. The sound generating device according to claim 12 or 13, wherein, The orthographic projection figures of the outer contours of the plurality of hollow structures on the first sub-layer are arcs, and the orthographic projection figures of each hollow structure are the same.

15. The sound generating device according to claim 14, wherein, The orthographic projection area of the support pattern on the first sub-layer is greater than or equal to 15% of the area of the first sub-layer.

16. The sound emitting device according to claim 14, wherein, The sound - generating device includes a light - transmissive region and a non - light - transmissive region surrounding the light - transmissive region; the sound - generating device further includes a fixing portion, the fixing portion is disposed in the non - light - transmissive region and located between the first sub - layer and the sound - generating vibration layer, and the support pattern is disposed in the light - transmissive region; There is a gap between the support pattern and the sound - generating vibration layer, and the height of the support pattern along a plane perpendicular to the plane where the first substrate is located is less than or equal to the height of the fixing portion along a plane perpendicular to the plane where the first substrate is located; or, The support pattern is in direct contact with the sound - generating vibration layer, and the height of the support pattern along a plane perpendicular to the plane where the first substrate is located is equal to the height of the fixing portion along a plane perpendicular to the plane where the first substrate is located.

17. The sound generating device according to claim 16, wherein, The support pattern is in direct contact with the sound - generating vibration layer, and the fixing portion, the support pattern and the first sub - layer are of an integrated structure.

18. The sound generating device according to any one of claims 4 to 7 and 9, wherein, The sound - generating device further includes a fixing portion, the fixing portion is located on a side of the first protective layer away from the first substrate, and the height of the fixing portion in the direction of the plane where the first substrate is located is equal to the sum of the heights of the support pattern and the first sub - layer in the direction of the plane where the first substrate is located.

19. The sound emitting device according to any one of claims 1 to 7, 9, 11 to 13, and 15 to 17, wherein, The sound - generating vibration layer includes a second substrate and a second conductive layer located between the second substrate and the organic layer; The sound - generating device includes a light - transmissive region and a non - light - transmissive region surrounding the light - transmissive region. The non - light - transmissive region includes a first peripheral trace, a second peripheral trace, a second protective layer and a fixing portion. The first peripheral trace is located between the first conductive layer and the first protective layer, and the first peripheral trace is electrically connected to the first conductive layer; the second peripheral trace is disposed between the second conductive layer and the second protective layer, the second protective layer covers a side of the second peripheral trace away from the second conductive layer, and the second peripheral trace is electrically connected to the second conductive layer; at least a partial region of the fixing portion is disposed between the organic layer and the second protective layer.

20. The sound emitting device according to claim 19, wherein, The sound - generating vibration layer further includes an adhesive sub - layer, the adhesive sub - layer is located on a side of the second protective layer away from the second substrate, and the adhesive sub - layer covers the second protective layer and the second conductive layer; The adhesive sub - layer is in direct contact with the support pattern and the fixing portion.

21. A display device, wherein, Including the sound - generating device according to any one of claims 1 - 20, further including a display panel; the sound - generating device is disposed on a light - emitting side of the display panel or inside the display panel; a positive projection of the light - transmissive region of the sound - generating device on the display panel overlaps with a display region of the display panel.

22. The display device according to claim 21, wherein, The display panel is a liquid - crystal display panel; A positive projection of at least a part of the support portion on the liquid - crystal display panel overlaps with spacers in the liquid - crystal display panel.

23. The display device according to claim 21, wherein, The display panel is an organic light - emitting diode display panel.

24. A method for manufacturing a sound - generating device, applied to manufacture the sound - generating device according to claim 20, the method includes: Providing a first substrate; Forming a first conductive layer, a first protective layer, an organic layer and a fixing portion on the first substrate respectively, and the organic layer and the fixing portion are of an integrated structure; Providing a second substrate; A second conductive layer and a second protective layer are respectively formed on the second substrate; An adhesive sub-layer is formed on a side of the second protective layer away from the second substrate, wherein the sound generating and vibrating layer includes the second substrate, the second conductive layer and the adhesive sub-layer; The adhesive sub-layer, the organic layer and the fixing portion are bonded together by an adhering process.

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