Electronic device comprising housing assembly including frame and bracket, and manufacturing method therefor

Abstract

This electronic device comprises a housing assembly. The housing assembly includes: a rear cover that defines the rear surface of the electronic device; a frame attached to the rear cover and formed of a first metal material; and a bracket which includes a support portion and which is formed of a second metal material that differs from the first metal material. The frame includes: a first portion for defining the side surfaces of the electronic device; and a second portion disposed on the inner surface of the first portion. The electronic device comprises a display supported by the support portion. The second portion of the frame is disposed between the first portion of the frame and the support portion of the bracket. A portion of the second metal material of the bracket is inserted into some air gaps included in the second portion.

Description

Electronic device comprising a housing assembly including a frame and a bracket, and a method for manufacturing the same

[0001] The present disclosure relates to an electronic device including a housing assembly including a frame and a bracket, and a method of manufacturing the same.

[0002] An electronic device may include a housing assembly defining an exterior appearance of the electronic device. The housing assembly may include a frame defining a side surface of the electronic device, a rear cover defining a rear surface of the electronic device, and a bracket wrapped around the frame. The bracket may support components located within the electronic device (e.g., a battery, a printed circuit board) and a display. The bracket may be coupled to the frame. To provide rigidity to the housing assembly, the frame and the bracket may include a metal material. For example, the metal material may include titanium, stainless steel, aluminum, and / or magnesium. The frame and the bracket may include different metal materials.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a housing assembly. The housing assembly may include a rear cover defining a rear surface of the electronic device. The housing assembly may include a frame attached to the rear cover and formed from a first metal material. The frame may include a first portion defining a side surface of the electronic device. The frame may include a second portion disposed on an inner surface of the first portion. The housing assembly may include a bracket including a support portion and formed from a second metal material different from the first metal material. The electronic device may include a display supported by the support portion. The second portion of the frame may be disposed between the first portion and the support portion. A portion of the second metal material of the bracket may be inserted into a portion of voids included in the second portion.

[0005] A method for manufacturing a housing assembly is provided. The method may include an operation of injecting a first mixture of first metal powders and a binder using a first mold for forming a first part. The method may include an operation of separating the first part from the first mold. The method may include an operation of seating the first part in a second mold. The method may include an operation of forming a second part on an inner surface of the first part by injecting a second mixture of the first metal powders and a binder using the second mold. The method may include a debinding operation for removing binder included in the first part and binder included in the second part such that the amount of binder remaining in the second part is greater than the amount of binder remaining in the first part. The method may include an operation of forming a frame by sintering the first part and the second part after the debinding operation is performed. The manufacturing method may include an operation of placing the frame in a third mold. The manufacturing method may include an operation of forming a bracket by die casting a second metal molten metal using the third mold. The second mixture may have a ratio of the binder to the first metal powders that is higher than the ratio of the binder to the first metal powders of the first mixture.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0008] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0009] FIG. 4A illustrates an example of a housing assembly of an electronic device including a frame and a bracket.

[0010] Figure 4b illustrates a frame according to an exemplary embodiment.

[0011] Figure 4c illustrates a bracket according to an exemplary embodiment.

[0012] FIG. 5 illustrates an example of a cross-sectional view taken along line A-A' of the housing assembly of FIG. 4a.

[0013] Figure 6 is a flow chart showing an example of a process for manufacturing a housing assembly including a frame and a bracket.

[0014] Figure 7a illustrates a first mold for forming a first part.

[0015] Figure 7b illustrates a first part formed by operation 601.

[0016] Figure 8a illustrates a second mold for forming a second part.

[0017] Figure 8b illustrates a frame formed by operation 603 of Figure 6.

[0018] Fig. 9a shows exemplary structures of the first part and the second part after metal injection molding.

[0019] Figure 9b shows exemplary structures of the first and second parts after the degreasing process.

[0020] Figure 9c shows exemplary structures of the first part and the second part after the sintering process.

[0021] Figure 10 illustrates an operation for forming a bracket.

[0022] Figure 11a illustrates a housing assembly in which a frame and bracket are formed.

[0023] Figure 11b illustrates a housing assembly in which resin is injected into a frame.

[0024] Figure 11c illustrates a housing assembly of a final product that has been machined into the shape of the housing assembly of Figure 11b.

[0025] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0026] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0027] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0028] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0029] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0030] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0031] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0032] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0033] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0034] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0035] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0037] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0039] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0040] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0041] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0043] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0044] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0045] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0046] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0047] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] Figure 2 illustrates an electronic device according to an exemplary embodiment.

[0049] Referring to FIG. 2, an electronic device (101) according to an exemplary embodiment may include a housing assembly (210) forming an exterior of the electronic device (101). For example, the housing assembly (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side side) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0050] An electronic device (101) according to an exemplary embodiment may include a substantially transparent front cover (202). According to an exemplary embodiment, the front cover (202) may form at least a portion of the first surface (200A). According to an exemplary embodiment, the front cover (202) may include, but is not limited to, a glass plate including various coating layers or a polymer plate.

[0051] An electronic device (101) according to an exemplary embodiment may include a substantially opaque rear cover (211). According to an exemplary embodiment, the rear cover (211) may form at least a portion of the second surface (200B). According to an exemplary embodiment, the rear cover (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0052] An electronic device (101) according to an exemplary embodiment may include a frame (218). According to an exemplary embodiment, the frame (218) may be combined with a front cover (202) and / or a rear cover (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the frame (218) may form the entire third side (200C) of the electronic device (101). For example, the frame (218) may form the third side (200C) of the electronic device (101) together with the front cover (202) and / or the rear cover (211).

[0053] An electronic device (101) according to an exemplary embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to an exemplary embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0054] According to an exemplary embodiment, at least a portion of the display (201) (e.g., the display module (160) of FIG. 1) may be visible through the front cover (202) forming the first surface (200A). According to an exemplary embodiment, the display (201) may be disposed on the back surface of the front cover (202).

[0055] According to an exemplary embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front cover (202) adjacent to the display (201). According to an exemplary embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front cover (202) may be formed to be substantially the same.

[0056] According to an exemplary embodiment, the display (201) (or the first surface (200A) of the electronic device (101)) may include a screen display area (201A). According to an exemplary embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. According to an exemplary embodiment, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front cover (202)).

[0057] According to an exemplary embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). According to an exemplary embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0058] According to an exemplary embodiment, the display (201) may include an area where a first camera module (205) (e.g., camera module (180) of FIG. 1) is positioned. According to an exemplary embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. According to an exemplary embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to the direction toward the first surface (200A) through the above area of ​​the display (201).

[0059] According to an exemplary embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0060] According to an exemplary embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0061] According to an exemplary embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be arranged inside the microphone holes (203, 204). The microphone may include a plurality of microphones so as to detect the direction of the sound.

[0062] According to an exemplary embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0063] According to an exemplary embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). According to an exemplary embodiment, the external speaker hole (207) may be implemented as a single hole together with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, the present invention is not limited thereto, and according to an exemplary embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the front cover (202) (or, the display (201)) and the frame (218).

[0064] According to an exemplary embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing assembly (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0065] According to an exemplary embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0066] According to an exemplary embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0067] According to an exemplary embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0068] According to an exemplary embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0069] According to an exemplary embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to an exemplary embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0070] According to an exemplary embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to an exemplary embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0071] According to an exemplary embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to an exemplary embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0072] According to an exemplary embodiment, the frame (218) may include a vent hole (206). For example, air outside the housing assembly (210) may be introduced into the housing assembly (210) through the vent hole (206). For example, air inside the housing assembly (210) may be discharged out of the housing assembly (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0073] According to an exemplary embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing assembly (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to an exemplary embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0074] Figure 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

[0075] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0076] Referring to FIG. 3, an electronic device (101) according to an exemplary embodiment may include a frame (218), a bracket (243), a printed circuit board (250), a cover plate (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0077] An electronic device (101) according to an exemplary embodiment may include a frame (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a bracket (243) extending inwardly from the frame (218). According to an exemplary embodiment, the frame (218) and the bracket (243) may be disposed between a display (201) and a rear cover (211). For example, the frame (218) may surround a space between the rear cover (211) and the front cover (202) (and / or the display (201)). For example, the bracket (243) may extend from the frame (218) within the space.

[0078] According to an exemplary embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion of the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the frame (218) and / or the bracket (243).

[0079] According to an exemplary embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly disposed on the bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed on the bracket (243) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0080] According to an exemplary embodiment, the cover plate (260) may be disposed between the first printed circuit board (251) and the rear cover (211). According to an exemplary embodiment, the cover plate (260) may be disposed on the first printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0081] According to an exemplary embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to an exemplary embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (251). Through this, the cover plate (260) may protect the first printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (251).

[0082] According to an exemplary embodiment, the cover plate (260) may be fixedly arranged to the first printed circuit board (251) via a joining member (e.g., a screw), or may be coupled to the bracket (243) together with the first printed circuit board (251) via the joining member.

[0083] According to an exemplary embodiment, the display (201) may be positioned between the bracket (243) and the front cover (202). For example, the front cover (202) may be positioned on one side (e.g., in the +z direction) of the display (201), and the bracket (243) may be positioned on the other side (e.g., in the -z direction).

[0084] According to an exemplary embodiment, the front cover (202) may be coupled with the display (201). For example, the front cover (202) and the display (201) may be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0085] According to an exemplary embodiment, the front cover (202) may be coupled with the frame (218). For example, the front cover (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the front cover (202) and the frame (218). However, the present invention is not limited to the above-described example.

[0086] According to an exemplary embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to an exemplary embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0087] According to an exemplary embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0088] An electronic device (101) according to an exemplary embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to an exemplary embodiment, the antenna module may be disposed between a rear cover (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0089] According to an exemplary embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of a bracket (243) such that the lens can receive external light through a portion (e.g., a camera area (237)) of the front cover (202) (e.g., the front (200A) of FIG. 2).

[0090] According to an exemplary embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the rear cover (211). According to an exemplary embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). According to an exemplary embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the rear cover (211) of the electronic device (101).

[0091] According to an exemplary embodiment, the camera area (284) may be formed on a surface of the rear cover (211) (e.g., the rear surface (200B) of FIG. 2). According to an exemplary embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to an exemplary embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear cover (211) by a predetermined height. However, the present invention is not limited thereto, and according to an exemplary embodiment, the camera area (284) may form a substantially same plane as the surface of the rear cover (211).

[0092] According to an exemplary embodiment, the housing assembly (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front cover (202), the frame (218), the bracket (243), and / or the rear cover (211) that form the exterior of the electronic device (101) may be referred to as the housing assembly (210) of the electronic device (101).

[0093] The electronic device (101) described below may include a housing assembly (210) comprising dissimilar metals. According to an exemplary embodiment, the frame (218) may include a first metal material, and the bracket (243) may include a second metal material. In the examples described below, the first metal material is described as titanium, and the second metal material is described as aluminum, but is not limited thereto.

[0094] FIG. 4A illustrates an example of a housing assembly of an electronic device including a frame and a bracket. FIG. 4B illustrates a frame according to an exemplary embodiment. FIG. 4C illustrates a bracket according to an exemplary embodiment.

[0095] Referring to FIG. 4A, an electronic device (101) according to an exemplary embodiment may include a housing assembly (210) forming an exterior. The housing assembly (210) may include a frame (218) that at least partially defines a side surface of the electronic device (101) and a bracket (243) that supports a display (e.g., display (201) of FIG. 3) and / or electronic components.

[0096] According to an exemplary embodiment, the frame (218) may form at least a portion of a side surface of the electronic device (101). For example, the frame (218) may be coupled with a front cover (e.g., front cover (202) of FIG. 3) that at least partially forms the front surface of the electronic device (101) and a rear cover (e.g., rear cover (211) of FIG. 3) that at least partially forms the rear surface of the electronic device (101). The frame (218) may form an internal space of the electronic device (101) by wrapping between the front cover and the rear cover. For example, the frame (218) may include a speaker hole (401) for providing an audio signal to the outside of the electronic device (101), a connector hole (402) for coupling a connector of an external electronic device, and / or a hole (403) that may accommodate an electronic pen (e.g., a stylus pen). The frame (218) may be referred to as a bezel structure or a side structure in terms of defining the side of the electronic device (101).

[0097] According to an exemplary embodiment, the bracket (243) may be configured to support components of the electronic device (101). For example, a display (e.g., display (201) of FIG. 3) may be supported by a support portion (243a) of the bracket (243). For example, the support portion (243a) of the bracket (243) may be a portion of the bracket (243) that is not coupled to the frame (218) but is spaced apart from the frame (218). For example, electronic components such as a printed circuit board (e.g., printed circuit board (250) of FIG. 3), a battery (e.g., battery (270) of FIG. 3), and a camera (e.g., second camera module (212) of FIG. 3) may be supported by being placed on the bracket (243). According to an exemplary embodiment, the bracket (243) may be at least partially surrounded by the frame (218). The bracket (243) may be coupled to the inner surface of the frame (218). The bracket (243) may be referred to as a support member or a support plate in terms of supporting components of the electronic device (101).

[0098] According to an exemplary embodiment, each of the frame (218) and the bracket (243) may be manufactured in a separate process. Referring to FIG. 4B, the frame (218) may have a substantially rectangular ring shape including a hollow space therein. At least a portion of the frame (218) may include one or more conductive portions (404) to operate as an antenna radiator used for communication with an external electronic device. When the one or more conductive portions (404) operate as an antenna radiator, a resonant frequency of a signal transmitted and / or received through the one or more conductive portions (404) may be determined based on an electrical length of the one or more conductive portions (404). For example, when a wavelength corresponding to a resonant frequency of a signal is λ, an electrical length of the one or more conductive portions (404) for transmitting and / or receiving a signal having the resonant frequency may be 1 / 4λ to 1 / 2λ. To adjust the electrical length of one or more conductive portions (404), the frame (218) may include a slot (405) (or slit). The slot (405) (or slit) may be filled with a non-conductive material to determine the electrical length of one or more conductive portions (404) that act as an antenna radiator and to electrically isolate one or more conductive portions (404) from other conductive portions.

[0099] According to an exemplary embodiment, the frame (218) may be exposed to the outside of the electronic device (101) because it forms at least a portion of a side surface of the electronic device (101). Since the frame (218) forms a portion of the outer surface of the electronic device (101), it may be required to have relatively high strength, hardness, and excellent surface properties in order to protect components of the electronic device (101) from external impact. If the strength of the frame (218) is low, the electronic device (101) may be easily damaged by external impact, thereby causing damage to electronic components inside. If the surface properties of the frame (218) are poor, the frame (218) may be easily corroded, thereby deteriorating the surface quality of the electronic device (101). For high strength and excellent surface properties, the frame (218) may include a first metal material having high strength and excellent surface properties. The frame (218) can be manufactured by injection molding (MIM) first metal powders and a binder into a mold including a cavity having the shape of the frame (218). For example, the first metal material may include titanium and / or stainless steel, which have high strength and excellent corrosion resistance. However, the present invention is not limited thereto.

[0100] Referring to FIG. 4c, the bracket (243) may be coupled to the inside of the frame (e.g., the frame (218) of FIG. 4b) by metal injection molding. Since the bracket (243) supports electronic components, the bracket (243) may be required to have relatively high strength. If the bracket (243) is made of the same first metal material as the frame (e.g., the frame (218) of FIG. 4b), the overall weight of the electronic device (101) may become too heavy. For example, if the bracket (243) is made of titanium, which is the same as the frame (218), the overall weight of the electronic device (101) may increase. The density of titanium (e.g., about 4.5 g / cm) 3 ) is lower than that of metal materials such as iron and stainless steel, but has a density similar to that of aluminum (e.g. about 2.7 g / cm 3 ), the relatively high specific gravity of titanium may cause an increase in the weight of the electronic device (101). If the weight of the electronic device (101) is too heavy, a problem of deterioration in the portability of the electronic device (101) may occur.

[0101] According to an exemplary embodiment, the bracket (243) may include a different metal material from the frame (218). For example, the bracket (243) may include a second metal material that is relatively lighter than the first metal material included in the frame (218). Unlike the frame (218), the bracket (243) wrapped by the frame (218) is not exposed to the outside of the electronic device (101), but is at least partially wrapped by the frame (218), thereby being disposed inside the electronic device (101). Since the bracket (243) is disposed inside the electronic device (101), even if the bracket (243) has a lower strength than the frame (218), the influence on the rigidity of the electronic device (101) may be small. According to an exemplary embodiment, the second metal material may include aluminum and / or magnesium that are relatively lighter than the first metal material (e.g., titanium). However, the present invention is not limited thereto. Since the specific gravity of aluminum is lower than that of titanium, an electronic device (101) including a bracket (243) including aluminum can be lighter than an electronic device (101) including a bracket (243) including titanium.

[0102] According to an exemplary embodiment, the frame (218) and the bracket (243) may be manufactured in separate processes. The bonding strength between the frame (218) and the bracket (243) may require a bonding strength that is not easily separated by external impact. For example, the bonding strength between the frame (218) and the bracket (243) may be required to be about 10 MPa or more.

[0103] The joining process of the frame (218) and the bracket (243) may vary. For example, a process may be possible in which the frame (218) and the bracket (243) are manufactured separately, and then the bracket (243) is welded to the frame (218). The process of welding dissimilar metals may include laser welding, electron-beam welding, and / or friction stir welding. In the process of joining the frame (218) and the bracket (243) by welding, bubbles may be generated within the frame (218) and / or the bracket (243) during the welding process. For example, when the melting point difference between the first metal material included in the frame (218) and the second metal material included in the bracket (243) is large, the welding process may be performed at a temperature higher than the higher melting point. In this case, the temperature at which the welding process is performed may cause vaporization of the metal having the lower melting point. As a metal with a relatively low melting point vaporizes, gas may be generated. This gas may cause bubbles to form inside the welding process. For example, if the first metal material is titanium and the second metal material is aluminum, the melting point of titanium is approximately 1,668°C and the melting point of aluminum is approximately 660°C. Since the welding process may be performed at a temperature higher than the melting point of titanium (e.g., approximately 1,668°C), the temperature at which the welding process is performed may be too high compared to the melting point of aluminum. The high temperature may cause the aluminum to vaporize, generating gas, and the gas may generate bubbles. The formation of bubbles may result in the formation of an irregular bonding surface. An irregular bonding surface may result in a weakening of the bonding strength. Furthermore, in the case of the welding process, an additional welding process is required after each of the frame (218) and the bracket (243) is manufactured, which may increase the manufacturing time and manufacturing cost.

[0104] A die casting process may be used as a joining process between the frame (218) and the bracket (243). In the case of the die casting process, the bracket (243) joined to the frame (218) may be formed by casting a second metal material that forms the bracket (243) on the inside of the frame (218). If the frame (218) and the bracket (243) include different metals, the bonding force between the frame (218) and the bracket (243) may be weak due to differences in physical and chemical properties between the dissimilar metals. In order to improve the bonding force between dissimilar metals (e.g., titanium and aluminum), a special treatment may be required for the joining surface. For example, by adjusting the roughness of the inner surface of the frame (218) using a method such as laser hatching or blasting, a concavo-convex portion is formed, and by permeating aluminum into the concavo-convex portion, the bracket (243) may be joined to the frame (218). In the case of the above process, since a process for forming a rough portion at a temperature higher than the melting point of titanium (e.g., about 1,668°C) may be required, there may be difficulty in controlling the temperature at which the process is performed.

[0105] According to an exemplary embodiment, a bracket (243) coupled to the frame (218) can be formed by die casting a second metal molten metal so as to form voids in the inner side of the frame (218) and allow the second metal material to penetrate into the voids. By this process, the problem of bubble generation caused by the welding process can be solved. When the bracket (243) is formed by die casting, even if the roughness of the frame (218) is adjusted so that an uneven portion is not formed, the bracket (243) coupled to the inner side of the frame (218) can be formed by naturally allowing the second metal material to penetrate into a portion of the frame (218) (e.g., the second portion (420) of FIG. 5).

[0106] FIG. 5 illustrates an example of a cross-sectional view taken along line A-A' of the housing assembly of FIG. 4a.

[0107] Referring to FIG. 5, the frame (218) may include a first portion (410) and a second portion (420). According to an exemplary embodiment, the first portion (410) and the second portion (420) may include a first metal material (510). As described above, since the frame (218) is exposed to the outside of the electronic device (e.g., the electronic device (101) of FIG. 4A), the first metal material (510) may include, but is not limited to, titanium having relatively high strength.

[0108] The surface (218a) of the frame (218) facing the outside of the electronic device (101) is the outer surface of the frame (218), and the surface (218b) of the frame (218) facing the inside of the electronic device (101) is the inner surface of the frame (218). According to an exemplary embodiment, the first portion (410) may at least partially form the outer surface of the frame (218). The second portion (420) may at least partially form the inner surface of the frame (218). The first portion (410) may be disposed on the second portion (420). The second portion (420) may be the portion of the frame (218) that is coupled to the bracket (243). As described below, the first portion (410) and the second portion (420) may be manufactured separately. For example, the thickness of the second portion (420) may be, but is not limited to, about 10% to about 70% of the total thickness of the frame (218).

[0109] According to an exemplary embodiment, the bracket (243) may be formed within the frame (218). For example, the frame (218) may have a substantially rectangular ring shape with an interior that is hollow. The bracket (243) may at least partially fill the hollow interior of the frame (218). The bracket (243) may be coupled to the second portion (420). For example, a portion of the bracket (243) may be coupled to the frame (218) by being included within the second portion (420).

[0110] According to an exemplary embodiment, the first portion (410) may substantially not include voids, and the second portion (420) may include voids (e.g., voids (901) of FIG. 9C). This difference may be due to a difference in the binder content during the manufacturing process of the frame (218). For example, when the binder content is relatively high, voids may be formed as the binder remains during the sintering process. In the case of the first portion (410), the first metal powders may be crystallized as the binder is completely vaporized during the sintering process. As the first metal powders are crystallized, the first portion (410), which at least partially forms the outer surface of the frame (218), may have a relatively uniform and smooth surface, and thus may have a relatively high strength.

[0111] According to an exemplary embodiment, the bracket (243) may be formed by die casting a second metal material (520) into a second portion (420) including voids. In the die casting process, the second metal material (520) may penetrate into the voids between crystals of the first metal material (510). The second metal material (520) may penetrate into the voids of the second portion (420), fill the voids, and then solidify through a cooling process. As the second metal material (520) solidifies while penetrating into the voids, a portion of the bracket (243) may be included within the second portion (420). The second metal material (520) that has penetrated into the voids may become a portion that joins the bracket (243) to the second portion (420). For the connection between the bracket (243) and the frame (218), even without forming a separate protruding portion on the frame (218), the bracket (243) can be firmly connected to the frame (218) by the second metal material (520) that has penetrated into the gaps. According to an exemplary embodiment, an electronic device (101) having a high connection strength between the frame (218) and the bracket (243) can be provided.

[0112] In an exemplary embodiment, the bracket (243) may not be substantially contained within the first portion (410). The second metal material (520) may penetrate into the pores formed within the second portion (420), but may not be contained within the first portion (410) because pores are not substantially formed within the crystallized first portion (410). In the final manufactured electronic device (101), the frame (218) may include the first portion (410) defining the outer surface and the second portion (420) including a portion of the bracket (243). Because the second portion (420) and the first portion (410) include the same first metal material (510), the physical and chemical properties of the interface between the second portion (420) and the first portion (410) may be substantially the same. Even if there is no separate processing step for bonding the second part (420) and the first part (410), the first part (410) and the second part (420) can be bonded by a high bonding strength. In the case of the first metal material (510) and the second metal material (520), which are dissimilar metals, it may be difficult to have a high bonding strength because they have different physical and chemical properties. According to an exemplary embodiment, the bracket (243) can be firmly bonded to the second part (420) by the second metal material (520) penetrating into the pores of the second part (420). Through the above structure, the bracket (243) and the frame (218) can have a high bonding strength, and thus the rigidity of the electronic device (101) can be improved. For example, the bonding strength between the frame (218) and the bracket (243) can be at least about 10 Mpa or more.

[0113] According to an exemplary embodiment, the density of the first metal material (510) included in the second portion (420) and the density of the first metal material (510) included in the first portion (410) may be different. For example, the density of the first metal material (510) included in the second portion (420) may be lower than the density of the first metal material (510) included in the first portion (410). As described above, the first metal material (510) included in the first portion (410) may be completely crystallized, and thus the density of the first metal material (510) included in the first portion (410) may exhibit a relatively high density. In the case of the second portion (420), pores may be formed by the binder, and thus the density of the first metal material (510) included in the second portion (420) may exhibit a relatively low density.

[0114] According to an exemplary embodiment, the sizes of the crystals of the first metal material (510) included in the second portion (420) and the sizes of the crystals of the first metal material (510) included in the first portion (410) may be different. For example, the sizes of the crystals of the first metal material (510) included in the second portion (420) may be smaller than the sizes of the crystals of the first metal material (510) included in the first portion (410). Since the binder included in the first portion (410) is completely vaporized during the debinding process, the first metal material (510) included in the first portion (410) may be substantially completely crystallized during the debinding process. Since the binder included in the second portion (420) is not completely vaporized during the sintering process and remains, a space occupied by the binder may exist within the second portion (420).

[0115] Below, the process of manufacturing the frame (218) and bracket (243) of the structure shown in FIG. 5 is described.

[0116] Figure 6 is a flow chart showing an example of a process for manufacturing a housing assembly including a frame and a bracket.

[0117] The operations described in FIG. 6 may be referred to as a manufacturing method for manufacturing a housing assembly (e.g., the housing assembly (210) of FIG. 4A) of the electronic device (e.g., the electronic device (101) of FIG. 4A) described above. Although the electronic device (101) described above has been described as an electronic device (101) including a bar-type housing assembly (210), it is not limited thereto. For example, the housing assembly (210) manufactured by the manufacturing method of FIG. 6 may be referred to as a manufacturing method for manufacturing not only a bar-type housing assembly (210), but also a foldable-type housing or a rollable-type housing. Each of the operations described below represents a process for manufacturing the housing assembly (210) of the electronic device (101), and may be referred to as a step or a process.

[0118] Referring to FIG. 6, in operation 601, a first part (e.g., the first part (410) of FIG. 7b) can be formed by injecting a first mixture of first metal powders and a binder using a first mold (e.g., the first mold (710) of FIG. 7a).

[0119] Figure 7a illustrates a first mold for forming a first part.

[0120] Referring to FIG. 7A, a first mold (710) may be used to form a first portion (e.g., a first portion (410) of FIG. 7B). The first mold (710) illustrated in FIG. 7A is merely a mold schematically illustrated to explain a manufacturing method, and the embodiment is not limited to the drawing illustrated in FIG. 7A. The first mold (710) is a mold including a cavity (711) corresponding to the shape of the first portion (410) of a frame (e.g., a frame (218) of FIG. 4B), and may have a shape corresponding to the outer shape of the frame (218). To form the first portion (410), first metal powders (e.g., the first metal powders (701) of FIG. 7B) and a first binder (e.g., the first binder (702) of FIG. 7B) may be mixed. By mixing the first metal powders and the first binder, a first mixture to be injected into the first mold (710) can be prepared. The ratio of the first binder to the first metal powders of the first mixture to be injected into the first mold (710) can be referred to as the first ratio. The first ratio can be referred to as a relatively low ratio compared to the second ratio described below. For example, the first ratio can be about 5 wt% to about 15 wt% with respect to the first metal powders of the first mixture to be injected into the first mold (710), but is not limited thereto. For example, the ratio of the binder to the first metal powders of the first mixture can be referred to as about 5 wt% to about 15 wt%. The first binder can include, but is not limited to, polyethylene (PE), polypropylene (PP), stearic acid, or a mixed resin. As described above, the first metal material may include titanium. The first portion (410) may be formed by injecting titanium powders and a first binder in a first ratio into a cavity (711) of a first mold (710).

[0121] Figure 7b illustrates a first part formed by operation 601.

[0122] Referring to FIG. 7B, the first portion (410) may at least partially form an outer surface of the frame (218). The shape of the first portion (410) may be formed by combining the first metal powders (701) with the first binder (702). The first portion (410) may include an outer edge defining the outer surface of the frame (218), and the interior of the first portion (410) may be empty. As illustrated in FIG. 7B, the first portion (410) may have a substantially rectangular ring shape with an empty interior.

[0123] Referring back to FIG. 6, in operation 602, the first part (410) may be separated from the first mold (710) and placed in a second mold (e.g., the second mold (810) of FIG. 8a) to form a second part (e.g., the second part (420) of FIG. 8b). For example, the shape of the first part (410) may be maintained by the first metal powders (701) bound by the first binder (702). The first part (410) may maintain its shape even when separated from the first mold (710). The separated first part (410) may be placed in the second mold (810). In order to additionally form a second part (420) in the first part (410) formed by operation 601, the first part (410) separated from the first mold (710) can be placed in the second mold (810).

[0124] In operation 603, a second part (420) can be formed by injecting a second mixture of first metal powders and a binder using a second mold (810).

[0125] Figure 8a illustrates a second mold for forming a second part.

[0126] Referring to FIG. 8A, a second mold (810) may be used to form the second portion (420). The second mold (810) illustrated in FIG. 8A is merely a schematic mold for explaining a manufacturing method, and the embodiment is not limited to the drawing illustrated in FIG. 8A. The second mold (810) is a mold including a cavity (811) corresponding to the shape of the second portion (420) of the frame (218), and the cavity (811) may have a shape corresponding to the inner shape of the frame (218). To form the second portion (420), first metal powders (e.g., first metal powders (801) of FIG. 8B) and a second binder (e.g., second binder (802) of FIG. 8B) may be mixed. As described above, the first metal material may include titanium. A second portion (420) may be formed by injecting titanium powders and a second binder (802) of a second ratio into a cavity (811) of a second mold (810). A second portion (420) may be additionally formed inside the first portion (410) that is seated in the second mold (810). In the present disclosure, the first binder (702) is used as a term to describe a binder that is injected into the first mold (710) to form the first portion (410), and the second binder (802) is used as a term to describe a binder that is injected into the second mold (810) to form the second portion (420). The first binder (702) and the second binder (802) may be the same material with different ratios, for example, may include a mixed resin.

[0127] Figure 8b illustrates a frame formed by operation 603 of Figure 6.

[0128] Referring to FIG. 8B, the second portion (420) may at least partially form the inner surface of the frame (218). The second portion (420) may be formed on the inner side of the first portion (410). The second portion (420) may include an inner edge that forms the inner surface of the frame (218), and the interior of the second portion (420) may be hollow.

[0129] According to an exemplary embodiment, a second mixture to be injected into a second mold (810) may be prepared by mixing first metal powders (801) and a second binder (802). The ratio of the second binder (802) injected into the second mold (810) may be referred to as a second ratio. The second ratio may be referred to as a relatively high ratio compared to the first ratio of the first binder (702) described above. For example, the second ratio may be, but is not limited to, about 16 wt% to about 40 wt% with respect to the second metal powders injected into the second mold (810). For example, the ratio of the binder to the first metal powders of the second mixture may be referred to as about 16 wt% to about 40 wt%. Except that the second ratio is in a numerical range greater than the first ratio, the first ratio and the second ratio are not limited to the numerical ranges described above. For example, a second portion (420) may be added to the inside of the first portion (410), and the interior of the second portion (420) may be hollow. The frame (218) formed by the first portion (410) and the second portion (420) may have a substantially rectangular ring shape with an interior that is hollow. According to an exemplary embodiment, by operation 603, the second portion (420) may be coupled onto the first portion (410).

[0130] According to an exemplary embodiment, since the second ratio is higher than the first ratio, the density of the first metal powders (701) included in the first portion (410) may be different from the density of the first metal powders (801) included in the second portion (420). For example, since the first portion (410) includes a first binder (702) at a relatively low ratio, and the second portion (420) includes a second binder (802) at a relatively high ratio, the density of the first metal powders (801) included in the second portion (420) may be lower than the density of the first metal powders (701) included in the first portion (410).

[0131] Referring again to FIG. 6, at operation 604, a degreasing process may be performed.

[0132] The debinding process is a process of vaporizing the binder by applying high temperature heat for about 5 to about 20 hours. According to an exemplary embodiment, the debinding process may include a first debinding process, a second debinding process, and a third debinding process. The first debinding process may be performed at about 400°C. The second debinding process may be performed at about 500°C. The third debinding process may be performed at about 800°C. The third debinding process may be referred to as pre-sintering. The above-described debinding processes are merely exemplary, and the embodiments are not limited thereto. For example, the temperature and time of the debinding process may be set based on the materials of the powders being input. For example, the temperature and time of the debinding process may vary depending on the components and ratio of the binder. For example, the degreasing process may include only a primary degreasing process and a secondary degreasing process. During the degreasing process, the binder may be removed by vaporization, and the first metal powders (e.g., the first metal powders (701) and the first metal powders (801) of FIG. 8B) may shrink. For example, during the degreasing process, the volume of the first metal powders may shrink by, for example, about 5% to about 20%. However, the present invention is not limited thereto, and the shrinkage may be less than about 5% or greater than about 20%.

[0133] According to an exemplary embodiment, the first binder (e.g., the first binder (702) of FIG. 8B) included in the first portion (410) may be substantially completely vaporized by the debinding process, but the second binder (e.g., the second binder (802) of FIG. 8B) included in the second portion (420) may remain. For example, the second binder included in the second portion (420) may remain in an amount of about 5% to about 20% after the debinding process is completed. However, the present invention is not limited thereto, and may remain in an amount less than about 5% or greater than about 20%. The difference in whether the binder remains may be due to a difference in the ratio of the injected binder. For example, the first binder at the first ratio, which is a relatively low ratio, may be substantially completely vaporized during the debinding process, thereby being removed. The second binder with a relatively high ratio may not be completely vaporized and may remain partially even after the degreasing process is completed.

[0134] In operation 605, a sintering process can be performed at the crystallization temperature of the first metal.

[0135] The sintering process is a process of combining metal powders by heating a semi-finished product (e.g., a green body). The sintering process can enhance mechanical strength, durability, and corrosion resistance. The sintering process can form first metal crystals by combining the first metal powders. The sintering process can be performed at a crystallization temperature of the first metal to crystallize the first metal. For example, when the first metal material includes titanium, the sintering process can be performed at approximately 1,668°C, which is the crystallization temperature of titanium. The crystallization temperature can vary depending on the grade of titanium and is not limited to the crystallization temperature described above.

[0136] According to an exemplary embodiment, the time for performing the sintering process may be set to a time required to crystallize the first metal powders included in the first portion (410). In a state where the above-described debinding process is completed, the binder is not substantially included in the first portion (410), but may remain in the second portion (420). While the sintering process is performed, the first metal powders included in the first portion (410) may be completely crystallized. Since the first metal powders included in the first portion (410) are completely crystallized, voids may not be formed in the first portion (410). While the sintering process is performed, the second binder included in the second portion (420) may be vaporized, and the first metal powders included in the second portion (420) may be crystallized.

[0137] According to an exemplary embodiment, the time for which the sintering process is performed may be set to a time required to crystallize the first metal powders included in the first portion (410). As a result of the sintering process, the second binder (802) included in the second portion (420) is vaporized, and as the first metal powders included in the second portion (420) are crystallized, pores (e.g., pores (901) of FIG. 9C) may be formed. During the sintering process, the volume of the first metal powders may be additionally shrunk by about 5% to about 15%. As a result of the debinding process and the sintering process, the volume of the first metal powders may ultimately be shrunk by about 10% to about 35%. The first metal powders included in the second portion (420) may shrink during the crystallization process, and as the second binder (802) is removed, voids (e.g., voids (901) of FIG. 9C) may be formed in the area where the second binder (802) existed. For example, the first metal powders may shrink during the crystallization process, and voids may be formed in the remaining space. According to an exemplary embodiment, voids may be formed within the second portion (420) as the sintering process is performed. As the sintering process is completed, a frame (218) including the first portion (410) and the second portion (420) may be provided.

[0138] Figure 9a illustrates exemplary structures of the first and second parts after metal injection molding. Figure 9b illustrates exemplary structures of the first and second parts after a degreasing process. Figure 9c illustrates exemplary structures of the first and second parts after a sintering process.

[0139] The structure illustrated in FIG. 9a may be referred to as the structure of the frame (218) after operation 603 of FIG. 6 is performed.

[0140] Referring to FIG. 9A, after the first part (410) and the second part (420) are injected, first metal powders (701) and a first binder (702) may be included in the first part (410), and first metal powders (801) and a second binder (802) may be included in the second part (420). A first ratio of the first binder (702) injected to form the first part (410) may be lower than a second ratio of the second binder (802) injected to form the second part (420). Due to the difference in the ratio of the binders, the density of the first metal powders (801) included in the second part (420) may be lower than the density of the first metal powders (701) included in the first part (410).

[0141] The structure illustrated in FIG. 9b may be referred to as the structure of the frame (218) after operation 604 of FIG. 6 is performed.

[0142] Referring to FIG. 9B, after the degreasing process is performed, the first binder (702) included in the first portion (410) may be substantially completely removed, but the second binder (802) included in the second portion (420) may remain. Since the second ratio is higher than the first ratio, during the degreasing process, the second binder (802) of the second ratio may not be completely vaporized and may remain partially. After the degreasing process is performed, a space may be formed between the first metal powders (801) included in the second portion (420) due to the second binder (802) remaining in the second portion (420).

[0143] The structure illustrated in FIG. 9c may be referred to as the structure of the frame (218) after operation 605 of FIG. 6 is performed.

[0144] Referring to FIG. 9c, after the sintering process is performed, all of the first metal powders (701) included in the first portion (410) can be crystallized. Since all of the first metal powders (701) included in the first portion (410) are crystallized, voids may not be formed in the first portion (410). The first portion (410) may have relatively high strength and excellent surface properties. After the sintering process is performed, the second binder (802) included in the second portion (420) can be removed. As described above, the time for performing the sintering process can be set to a time required for all of the first metal powders included in the first portion (410) to be crystallized. The binder included in the second portion (420) can be removed by being vaporized through the sintering process. As the binder (e.g., the second binder (802)) included in the second portion (420) is removed and the first metal powders (801) included in the second portion (420) are shrunk, voids (901) may be formed in the second portion (420). As the second metal material for forming the bracket (243) penetrates into the voids, the bracket (243) coupled to the frame (218) may be formed.

[0145] Referring again to FIG. 6, at operation 606, the frame (218) may be seated in a third mold (e.g., the third mold (1010) of FIG. 10) and a bracket (243) may be formed by die casting a second metal material into the second portion (420).

[0146] Figure 10 illustrates an operation for forming a bracket.

[0147] Referring to Fig. 10, a bracket (243) may be formed inside a frame (218) by die casting a second metal molten metal. For example, the frame (218) may be mounted on a third mold (1010) including a cavity (1011) corresponding to the shape of the bracket (243). The third mold (1010) illustrated in Fig. 10 is merely a mold schematically illustrated to explain a manufacturing method, and the embodiment is not limited to the drawing illustrated in Fig. 10. In order to die cast a second metal material, a molten metal may be prepared by melting the second metal material at a high temperature. For example, when the second metal material is aluminum, the molten metal may be prepared by melting aluminum in a melting furnace. The molten metal of the second metal material may be injected into a cavity (1011) of the third mold (1010) corresponding to the shape of the bracket (243). The molten metal of the second metal material can be included in the second part (420) by penetrating into the pores formed in the second part (420). Since the first part (410) in which the first metal powders are substantially completely crystallized does not include pores, the molten metal of the second metal material may not penetrate into the first part (410). After the pouring of the molten metal of the second metal material is completed, a cooling process may be performed so that the second metal material may be solidified. After the casing of the second metal solidified by the cooling process is separated from the third mold (1010), the residue may be removed, and the surface may be polished so that the bracket (243) may be formed. As the cooling process is performed in a state in which the molten metal of the second metal material has penetrated into the pores, the second metal material forming a part of the bracket (243) may be included in the second part (420). Since the molten metal of the second metal material does not penetrate into the first part (410), the second metal material forming the bracket (243) may not be included within the first part (410).By including the second metal material within the second portion (420), the bracket (243) can be coupled to the inner side of the frame (218). The bracket (243) can be manufactured in a form at least partially wrapped by the frame (218).

[0148] In operation 607, resin can be injected into the frame (218).

[0149] Figure 11a illustrates a housing assembly in which a frame and bracket are formed.

[0150] Referring to FIG. 11A, as described above, the frame (218) may include a slot (405) (or slit). If the frame (218) is entirely filled with a first metal material that is a conductive material, it may be difficult to use the one or more conductive portions (404) as an antenna radiator because the resonant frequency of a signal radiated or received through the one or more conductive portions (404) of the frame (218) cannot be adjusted. As the slot (405) (or slit) is formed within the frame (218), the electrical length of the one or more conductive portions (404) can be adjusted. Since the electrical length of the one or more conductive portions (404) can determine the frequency characteristics of a signal transmitted and / or received through the antenna radiator, the one or more conductive portions (404) can be used as an antenna radiator for transmitting and / or receiving a signal in a designated frequency band.

[0151] Figure 11b illustrates a housing assembly in which resin is injected into a frame.

[0152] Referring to FIG. 11B, a resin (1110) may be injected to fill the slot (405) (or slit) of the frame (218). By filling at least a portion of the slot (405) (or slit) with the resin (1110), which is a non-conductive material, a segmented structure including one or more conductive portions (404) and one or more non-conductive portions (e.g., one or more non-conductive portions (406) of FIG. 11C) may be formed on a side surface of the housing assembly (210). The segmented structure may function as an antenna radiator for communicating with an external electronic device. For example, a wireless communication module (e.g., the wireless communication module (192) of FIG. 1) may be configured to transmit or receive a signal on a designated band by using the one or more conductive portions (404) forming a portion of the side surface of the housing assembly (210).

[0153] Figure 11c illustrates a housing assembly of a final product that has been machined into the shape of the housing assembly of Figure 11b.

[0154] Referring to FIG. 11c, the resin (1110) can fill at least a portion of the empty space between the frame (218) and the bracket (243). After the resin is injected, processing (e.g., cutting processing) can be performed in the form of a final product, thereby providing a housing assembly (210). For example, the resin may include, but is not limited to, polybutyleneterephthalate (PBT) having excellent electrical properties and flame retardancy. For example, the resin may also include polycarbonate (PC) and / or polyphthalamide (PPA). A housing assembly (210) used in a final product can be formed by combining a front cover (e.g., the front cover (202) of FIG. 3) and a rear cover (e.g., the rear cover (211) of FIG. 3) with the housing assembly (210) illustrated in FIG. 11c. After processing is complete, the outer surface of the frame (218) may be partially rounded.

[0155] According to an exemplary embodiment, the housing assembly (210) may include a frame (218) and a bracket (243). The frame (218) may include a first portion (410) and a second portion (420). For example, the first portion (410) may at least partially form an outer surface of the frame (218). The first portion (410) may have relatively high strength and excellent surface properties by being formed by a substantially completely crystallized first metal material. Since the first portion (410) is less likely to be damaged by external impact, the strength of the electronic device (101) may be improved. The second portion (420) may be disposed on the first portion (410). Through a degreasing process and a sintering process, the second portion (420) may be coupled to the first portion (410). The second metal material that has penetrated into the pores is bonded to the second portion (420), so that the bracket (243) can be firmly bonded to the frame (218). The exemplary electronic device (101) can have a bonding structure of the frame (218) and the bracket (243) as the second metal material that has penetrated into the pores is solidified, without the need to form a separate uneven portion on the inside of the frame (218) or adjust the roughness for bonding through die casting. The above-described manufacturing method can improve the bonding strength between the frame (218) and the bracket (243) and reduce unnecessary processes, thereby reducing the manufacturing cost.

[0156] According to an exemplary embodiment, the frame (218) and the bracket (243) may include different metals. The frame (218) exposed to the outside of the electronic device (101) may include a first metal material (e.g., titanium) having a relatively high strength for the rigidity of the electronic device (101). The bracket (243), which is disposed inside the electronic device (101) and not exposed to the outside, may include a second metal material (e.g., aluminum) having a relatively low specific gravity for the weight lightening of the electronic device (101). The exemplary electronic device (101) may achieve a light weight while having high rigidity.

[0157] In the above description, the frame (218) and the bracket (243) are described as separate components, but may be a single component in that the bracket (243) is integrally coupled to the frame (218). For example, the electronic device (101) may include a bracket including a frame portion and a support portion. The frame portion of the bracket may correspond to the frame (218) described above. The support portion of the bracket may correspond to the bracket (243) described above.

[0158] An electronic device (101) is provided. The electronic device (101) may include a housing assembly (210). The housing assembly (210) may include a rear cover (211) defining a rear surface of the electronic device (101). The housing assembly (210) may include a frame (218) attached to the rear cover (211) and formed from a first metal material. The frame (218) may include a first portion (410) defining a side surface of the electronic device (101). The frame (218) may include a second portion (420) disposed on an inner surface of the first portion (410). The housing assembly (210) may include a bracket (243) including a support portion (243a) and formed from a second metal material different from the first metal material. The electronic device (101) may include a display (201) supported by the support portion. The second portion (420) of the frame (218) may be positioned between the first portion (410) and the support portion. A portion of the second metal material of the bracket may be inserted into a portion of the gaps (901) included in the second portion (420).

[0159] For example, the first metal material may include titanium. The second metal material may include aluminum.

[0160] For example, the second portion (420) of the frame (218) may comprise titanium including pores (901) filled with aluminum.

[0161] For example, the density of the first metal material included in the second portion (420) may be lower than the density of the first metal material included in the first portion (410).

[0162] For example, the bracket (243) may be configured to support one or more electronic components.

[0163] For example, a portion of the bracket (243) may be inserted into a portion of a gap between crystals of the first metal material included in the second portion (420), thereby joining the bracket (243) to the second portion (420).

[0164] For example, the thickness of the second portion (420) may be 10% to 70% of the thickness of the frame (218).

[0165] For example, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0166] For example, the second metal material may be included in the second portion (420) and not included in the first portion (410).

[0167] For example, the minimum bonding strength between the bracket (243) and the frame (218) may be 10 MPa or more.

[0168] A method for manufacturing a housing assembly (210) is provided. The method may include an operation of injecting a first mixture of first metal powders and a binder using a first mold (710) for forming a first part (410). The method may include an operation of separating the first part (410) from the first mold (710). The method may include an operation of seating the first part (410) in a second mold (810). The method may include an operation of forming a second part (420) on an inner surface of the first part (410) by injecting a second mixture of the first metal powders and a binder using the second mold (810). The manufacturing method may include a degreasing operation for removing binder included in the first portion (410) and binder included in the second portion (420) such that the amount of binder remaining in the second portion (420) is greater than the amount of binder remaining in the first portion (410). The manufacturing method may include an operation for forming a frame (218) by sintering the first portion (410) and the second portion (420) after the degreasing operation is performed. The manufacturing method may include an operation for seating the frame (218) in a third mold (1010). The manufacturing method may include an operation for forming a bracket (243) by die casting a second metal molten metal using the third mold (1010). The second mixture may have a ratio of the binder to the first metal powders that is higher than the ratio of the binder to the first metal powders of the first mixture.

[0169] For example, a portion of the binder contained within the second portion (420) may remain after the degreasing operation is performed. The binder contained within the first portion (410) may be removed while the degreasing operation is performed.

[0170] For example, the portion of the binder contained in the second portion (420) remaining after the degreasing operation is performed can be removed while the sintering operation is performed.

[0171] For example, by removing a portion of the binder included in the second portion (420), voids (901) may be formed within the second portion (420).

[0172] For example, by the sintering, voids (901) can be formed within the second portion (420). When die casting the second metal molten metal, the second metal material can be inserted into the voids (901), thereby forming the bracket (243) coupled to the second portion (420).

[0173] For example, the ratio of the binder to the first metal powders of the first mixture may be 5 wt% to 15 wt%. The ratio of the binder to the first metal powders of the second mixture may be 16 wt% to 40 wt%.

[0174] For example, the first metal material may include titanium. The second metal material may include aluminum.

[0175] For example, the minimum bonding strength between the bracket (243) and the frame (218) may be 10 MPa or more.

[0176] For example, the specific gravity of the second metal material may be lower than the specific gravity of the first metal material.

[0177] For example, the density of the first metal included in the second portion (420) may be lower than the density of the first metal included in the first portion (410).

[0178] An electronic device (101) is provided. The electronic device (101) may include a bracket including a frame portion (e.g., frame (218)) and a support portion (e.g., bracket (243)). The frame portion may be formed of a first metal material. The frame portion may include a first portion and a second portion. The first portion may define a side surface of the electronic device. The second portion may be disposed on an inner surface of the first portion. The support portion may be formed of a second metal material. The support portion may support a display (201) of the electronic device (101). A portion of the second metal material of the support portion may be inserted into a portion of voids (901) included in the second portion.

[0179] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0180] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0181] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0182] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0183] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or an intermediary server.

[0184] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, Housing assembly, said housing assembly, A rear cover defining the rear of the electronic device; A frame attached to the rear cover and formed from a first metal material, the frame including a first portion defining a side surface of the electronic device, and a second portion disposed on an inner surface of the first portion, and A bracket comprising a support portion and formed of a second metal material different from the first metal material; and including a display supported by the above support portion, The second part of the frame is disposed between the first part of the frame and the support part of the bracket, A portion of the second metal material of the bracket is inserted into a portion of the pores included in the second portion. Electronic devices.

2. In paragraph 1, The above first metal material is, Contains titanium, The above second metal material is, Containing aluminum, Electronic devices.

3. In paragraph 2, The second part of the above frame, Containing titanium with pores filled with aluminum, Electronic devices.

4. In any one of paragraphs 1 to 3, The density of the first metal material contained within the second portion of the frame is lower than the density of the first metal material contained within the first portion of the frame, Electronic devices.

5. In any one of paragraphs 1 to 4, The above brackets are, configured to support one or more electronic components, Electronic devices.

6. In any one of paragraphs 1 to 5, Some of the above brackets are, By inserting into a part of the gap between the crystals of the first metal material contained in the second part, thereby joining the bracket to the second part, Electronic devices.

7. In any one of paragraphs 1 to 6, The thickness of the above second part is 10% to 70% of the thickness of the above frame, Electronic devices.

8. In any one of paragraphs 1 to 7, The specific gravity of the above second metal material is Lower than the specific gravity of the first metal material, Electronic devices.

9. In any one of paragraphs 1 to 8, The above second metal material is, Included within the second part and not included within the first part, Electronic devices.

10. In any one of paragraphs 1 to 9, The minimum bonding strength between the above bracket and the above frame is: 10MPa or more, Electronic devices.

11. In a method for manufacturing a housing assembly, An operation of injecting a first mixture of first metal powders and a binder using a first mold for forming a first part; An action of separating the first part from the first mold; An action of placing the first part on the second mold; An operation of forming a second part on the inner surface of the first part by injecting a second mixture of the first metal powders and a binder using the second mold; A degreasing operation for removing the binder contained in the first portion and the binder contained in the second portion so that the amount of the binder remaining in the second portion is greater than the amount of the binder remaining in the first portion; After the above degreasing operation is performed, an operation of forming a frame by sintering the first part and the second part; The action of placing the above frame into the third mold; It includes an operation of forming a bracket by die casting a second metal molten metal using the third mold, The second mixture is, having a ratio of the binder to the first metal powders higher than the ratio of the binder to the first metal powders of the first mixture, Manufacturing method.

12. In paragraph 11, A portion of the binder contained within the second portion, After the above degreasing action is performed, the remaining, The binder contained within the first part, While the above degreasing action is being performed, the removed, Manufacturing method.

13. In paragraph 12, The part of the binder contained in the second portion remaining after the above degreasing operation is performed, While the sintering operation is being performed, the removed, Manufacturing method.

14. In any one of paragraphs 11 to 13, By the above sintering, pores are formed within the second part, When die casting the second metal melt, the second metal material is inserted into the pores, thereby forming the bracket that is joined to the second part. Manufacturing method.

15. In any one of paragraphs 11 to 14, The ratio of the binder to the first metal powders of the first mixture is: 5 wt% to 15 wt%, The ratio of the binder to the first metal powders of the second mixture is: 16 wt% to 40 wt%, Manufacturing method.

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